An integrated CPU water-cooled radiator
The external water-cooled radiator adopts natural air-cooled and fan-accelerated air-cooled two-stage cooling, combined with automatic control and removable fin cover, solves the dust accumulation and noise problems of the chassis, and achieves efficient and low-noise CPU cooling effect.
Patent Information
- Application Number
- CN202210932485.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-08-04
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2042-08-04
AI Technical Summary
The existing integrated CPU water-cooled radiator has severe dust and high noise inside the chassis, affecting the operational safety of electronic components and user experience.
An external water-cooled radiator is designed, using two-stage cooling methods of natural air-cooling and fan-accelerated air-cooling, combining automatic control of fan speed and removable fin cover to achieve flexible cooling mode switching and easy cleaning.
Effectively reduce dust accumulation inside the chassis, reduce operating noise, provide multiple cooling modes to adapt to different loads, and facilitate maintenance and cleaning.
Smart Images

Figure CN115291700B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of CPU heat dissipation, and particularly relates to an integrated CPU water-cooled radiator. Background Art
[0002] A radiator is an important device to ensure the normal operation of the CPU. When the CPU is running, a large amount of heat will be generated. The accumulation of heat will cause the operating temperature of the CPU to rise significantly, affecting the normal operation of the CPU. Therefore, a radiator is needed to transfer the heat to the outside to achieve the purpose of reducing the operating temperature of the CPU. According to different heat dissipation media, radiators can be divided into air-cooled radiators and water-cooled radiators. Air-cooled radiators have a simple structure and have advantages such as low price and good reliability. Since the specific heat capacity of water is much larger than that of air, water-cooled radiators can transfer more heat faster. At the same time, the position of the radiator can generally be arranged flexibly, and it is mostly used in high-heat-generating hosts.
[0003] In recent years, with the improvement of the manufacturing process of computer CPUs, more transistors are integrated per unit area, resulting in more concentrated heat generation of the CPU, which puts higher requirements on the heat dissipation performance of the radiator. The progress of the manufacturing process of water-cooled radiators has greatly improved the reliability of water-cooled radiators. Therefore, users have a higher acceptance of CPU water-cooled radiators, and the retail share of integrated water-cooled radiators with highly integrated components has increased significantly.
[0004] Common integrated CPU water-cooled radiators are composed of a water block integrating a water pump, a connecting hose, and a water-cooling radiator integrating a fan. The water-cooling radiator is generally installed inside the chassis. To reduce the volume and increase the heat dissipation capacity, the water-cooling radiator is covered with dense heat dissipation fins. During operation, the fan needs to keep running, which drives a large amount of air into the chassis to participate in heat exchange, resulting in serious dust accumulation inside the chassis, affecting the operation safety of other electronic components inside the chassis, and the continuously running fan also brings noise problems. At the same time, the dense heat dissipation fins also make it difficult to clean the dust. Therefore, designing an integrated CPU water-cooled radiator that can reduce noise and alleviate the dust accumulation problem inside the chassis also has a real market demand. Summary of the Invention
[0005] To solve the problems in the background art, the present invention provides an integrated CPU water-cooled radiator.
[0006] The technical solution adopted by the present invention is as follows:
[0007] An integrated CPU water-cooled radiator includes a water block installed around the CPU on the motherboard inside the chassis, and also includes heat dissipation fins, a support bottom plate, a water pump motor, a circulation water pump, a water storage tank, a fan, a fan motor, and an air duct baffle installed outside the chassis;
[0008] The heat dissipation fins and the support base plate form a water cooling radiator. The water pump motor, the circulation water pump, and the water storage tank are all installed on the water cooling radiator. The water storage tank, the circulation water pump, and the interior of the heat dissipation fins are connected in sequence. A connecting hose is used to connect the heat dissipation fins and the water cooling head, and another connecting hose is used to connect the water cooling head and the water storage tank to form a closed loop of the entire water cooling liquid.
[0009] There is a cavity inside the water cooling radiator that communicates with the outside. The fan and the fan motor are installed on the water cooling radiator. There is an air duct baffle that can be automatically opened between the fan and the cavity. The air duct baffle is installed on the side wall between the fan and the cavity through an elastic element and can open and close towards the inside of the cavity. The air duct baffle is closely attached to the side wall under the action of the elastic element when the fan is not started.
[0010] Furthermore, it also includes a fin cover plate. The fin cover plate is installed on the support base plate and can be pulled out to facilitate cleaning the dust accumulated inside the fin air duct.
[0011] Furthermore, the heat dissipation fins are arranged in parallel, and the fin cover plate forms independent channels between adjacent heat dissipation fins.
[0012] Furthermore, it also includes a control circuit. The control circuit is connected to the CPU_FAN jack of the main board, and the rotation speed of the fan is automatically controlled by the BIOS program of the main board to match different usage scenarios.
[0013] Furthermore, the water cooling radiator maintains a vertical installation state.
[0014] Furthermore, the elastic element is a helical spring.
[0015] Furthermore, the fan is a cross-flow fan.
[0016] Compared with ordinary all-in-one water cooling radiators, the beneficial effects of the present invention are as follows:
[0017] 1. The present invention adopts an external water cooling radiator, which can effectively reduce the dust accumulation inside the chassis.
[0018] 2. The present invention adopts two-stage cooling. One stage is natural wind water cooling, and the other stage is accelerated air cooling by the fan. The fan only needs to be started when the CPU generates a large amount of heat. Therefore, the operating noise can be effectively reduced.
[0019] 3. It can automatically switch the heat dissipation method, has multiple heat dissipation modes to choose from, and can flexibly adapt to different usage scenarios.
[0020] 4. The fin cover plate is detachable, which is easy to maintain and clean. Description of the Drawings
[0021] Figure 1It is a schematic diagram of an all-in-one CPU water-cooled radiator of the present invention.
[0022] Figure 2 Schematic diagram of the installation position of the present invention in the chassis.
[0023] Figure 3 It is a schematic diagram of an all-in-one CPU water-cooled radiator of the present invention.
[0024] Figure 4 It is a partial cross-sectional view of the fan structure of the present invention under low load intensity.
[0025] Figure 5 It is a partial cross-sectional view of the fan structure of the present invention under medium load intensity.
[0026] Figure 6 It is a partial cross-sectional view of the fan structure of the present invention under high load intensity.
[0027] In the figure, the chassis 1, the water block 2, the connecting hose 3, the motherboard 4, the radiator 5, the fin cover 6, the water pump motor 7, the heat dissipation fins 8, the control circuit 9, the support base plate 10, the fan 11, the fan motor 12, the spring 13, the circulation water pump 14, the air duct baffle 15, the water storage tank 16. Detailed implementation manners
[0028] The present invention will be described in detail below according to the attached drawings and preferred embodiments. The purpose and effect of the present invention will become more apparent. The present invention will be further described in detail below in conjunction with the attached drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0029] As Figures 1-3 shown, the all-in-one CPU water-cooled radiator of the present invention includes a water block 2, a connecting hose 3, a fin cover 6, a water pump motor 7, heat dissipation fins 8, a control circuit 9, a support base plate 10, a fan 11, a fan motor 12, a spring 13, a circulation water pump 14, an air duct baffle 15, and a water storage tank 16.
[0030] The water block 2 is installed above the CPU of the motherboard 4 inside the chassis 1 and presses the upper surface of the CPU through fixing screws. The heat dissipation fins 8 and the support base plate 10 form the radiator 5. The radiator 5 is installed outside the chassis 1. The remaining components of the radiator are installed outside the chassis 1. The water block 2 is connected to the remaining components through two connecting hoses 3. The cooling air flow of the radiator 5 does not need to pass through the inside of the chassis 1. The control circuit 9 is connected to the CPU_FAN jack of the motherboard 4, and the rotation speed of the fan 11 can be automatically controlled by the BIOS program of the motherboard 4 to achieve the purpose of matching different usage scenarios.
[0031] This type of radiator mainly absorbs the heat of the CPU by the water coolant and carries it outside the chassis to achieve the purpose of reducing the CPU temperature. The fin cover 6 is installed in front of the water-cooled radiator 5, and the fin cover 6 is detachable, which is easy to maintain and clean; the water pump motor 7, the circulation water pump 14 and the water storage tank 16 are installed above the rear of the water-cooled radiator 5; the water storage tank 16, the circulation water pump 14 and the heat dissipation fins 8 are internally connected in sequence. A connecting hose 3 connects the heat dissipation fins 8 and the water block 2, and another connecting hose 3 connects the water block 2 and the water storage tank 16. The low-temperature water coolant increases in temperature after heat exchange through the water block 2, and is transported into the water storage tank 16 outside the chassis by a connecting hose 3. The circulation water pump 14 operates at a rated speed. The circulation water pump 14 can directly suck the water coolant in the water storage tank 16, and the pressurized water coolant then enters the heat dissipation fins 8. The water coolant passes through each heat dissipation fin 8 in sequence to reduce the temperature, and then enters the water block 2 through another connecting hose 3, forming a closed-loop circulation of the water coolant. At the same time, the high-pressure area of the entire circuit is mainly located in the heat dissipation fins 8. This design enables the water coolant to enter the water block 2 at a lower pressure, which can effectively reduce the probability of liquid leakage at the joints of the water block 2.
[0032] The fan motor 12 and the fan 11 are installed below the rear of the water-cooled radiator 5. As Figure 4 shown, when the CPU is in a low-load state, the fan 11 does not operate. At this time, the air duct baffle 15 keeps the fan air duct in a normally closed state under the action of the spring 13, while the air duct directly below the heat dissipation fins 8 is open, and the cooling air passes through the heat dissipation fins 8 from bottom to top. At this time, the entire water-cooled radiator 5 dissipates heat in the way of natural convection; in this embodiment, the fan 11 is a cross-flow fan.
[0033] As Figure 5 shown, when the CPU is in a medium-load state, the cross-flow fan 11 runs at a low speed, and the relatively small air pressure causes the air duct baffle 15 to rotate around the axis by a certain angle. At this time, the fan air duct is semi-open, while the air duct below the heat dissipation fins 8 is semi-blocked by the air duct baffle 15. The air blown out by the fan passes through the heat dissipation fins 8 at a higher speed to participate in heat dissipation. At the same time, the high-speed air will also drive the air in the semi-blocked air duct to move upward. At this time, the entire water-cooled radiator 5 dissipates heat in the way of low-intensity forced convection.
[0034] As Figure 6 shown, when the CPU is in a high-load state, the cross-flow fan 11 runs at a high speed, and the relatively large air pressure causes the air duct baffle 15 to rotate around the axis to the limit position. At this time, the fan air duct is completely open, while the air duct below the heat dissipation fins 8 is completely blocked by the air duct baffle 15. The air blown out by the fan passes through the heat dissipation fins 8 at a high speed to participate in heat dissipation. At this time, the entire water-cooled radiator 5 dissipates heat in the way of high-intensity forced convection.
[0035] Those of ordinary skill in the art can understand that the above are only preferred examples of the invention and are not used to limit the invention. Although the invention has been described in detail with reference to the foregoing examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent replacements for some of the technical features. Any modifications, equivalent replacements, etc. made within the spirit and principles of the invention shall be included within the protection scope of the invention.
Claims
1. An integrated CPU water-cooled radiator, characterized in that, It includes a water block (2) around the CPU installed on the main board (4) inside the chassis (1), and also includes a radiator fin (8), a support base plate (10), a water pump motor (7), a circulation water pump (14), a water storage tank (16), a fan (11), a fan motor (12) and an air duct baffle (15) installed outside the chassis (1); The radiator fin (8) and the support base plate (10) form a water cooling row (5). The water pump motor (7), the circulation water pump (14) and the water storage tank (16) are all installed at the upper rear of the water cooling row (5). The water storage tank (16), the circulation water pump (14) and the radiator fin (8) are internally connected in sequence. A connecting hose (3) is used to connect the radiator fin (8) and the water block (2), and another connecting hose (3) is used to connect the water block (2) and the water storage tank (16) to form a closed cycle of the entire water cooling liquid; There is a cavity communicating with the outside inside the water cooling row (5). The fan (11) and the fan motor (12) are installed at the lower rear of the water cooling row (5). There is an air duct baffle (15) that can be automatically opened between the fan (11) and the cavity. The air duct baffle (15) is installed on the side wall between the fan (11) and the cavity through an elastic element (13) and can open and close towards the inside of the cavity. The air duct baffle (15) is closely attached to the side wall under the action of the elastic element (13) when the fan (11) is not started; 2. The integrated CPU water-cooled radiator according to claim 1, characterized in that, It also includes a fin cover plate (6). The fin cover plate (6) is installed on the support base plate (10) and can be pulled out to facilitate cleaning of the dust accumulated inside the fin air duct.
3. The integrated CPU water-cooled radiator according to claim 2, characterized in that, The radiator fins (8) are arranged in parallel, and the fin cover plate (6) forms independent channels between adjacent radiator fins (8).
4. The integrated CPU water-cooled radiator according to claim 1, wherein, It also includes a control circuit (9). The control circuit (9) is connected to the CPU_FAN jack of the main board (4), and the rotation speed of the fan (11) is automatically controlled by the BIOS program of the main board (4) to match different usage scenarios.
5. The integrated CPU water-cooled radiator according to claim 1, wherein, The water cooling row (5) is kept in a vertical installation state.
6. The integrated CPU water-cooled radiator according to claim 1, characterized in that, The elastic element (13) is a spiral spring.
7. The integrated CPU water-cooled radiator according to claim 1, characterized in that The fan (11) is a cross-flow fan.
Citation Information
Patent Citations
Auxiliary external cooling device for CPU
CN108897408A
Dust removal water -cooled generator case
CN208580367U