Method and system for obtaining test data

Abstract

The present invention provides a method and system for obtaining test data, wherein the method includes: uploading test data information of multiple wafers to a cloud storage space; sorting the wafers, defining a functional relationship between the wafer plane coordinate system and the coordinate system of the cloud storage space; assigning each test data information to the cloud storage space corresponding to the coordinate of the cloud storage space; comparing the serial number of the wafer to be tested with the serial number of the wafer to be called; matching the coordinates of the wafer to be called with the coordinates of the cloud storage space. This application uploads chip test data information to a cloud storage space, and then matches the serial number and coordinates of the wafer to be tested with the serial number and coordinates of the wafer in the cloud storage space. If the match is successful, the test data information of the corresponding test items of all dies of the chip are called from the cloud storage space, thereby solving the problem of how to safely store the test data generated in each stage of chip testing and efficiently obtain (call) the above test data.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a method and system for acquiring test data. Background Art

[0002] With the growing market demand for chips, chip manufacturing fab shipments are experiencing rapid growth. To ensure that shipped chips meet customer needs, it's crucial to quickly collect and analyze test data for each wafer. With the continued development of 5G technology, the Internet of Things, TFT-LCD, and other network platforms, customers can use various mobile devices, desktop computers, and web applications to store and analyze data. Reading trim value data is a crucial step in ANALOG IP (analog IP core) evaluation and testing. Accurate transmission of normal temperature trim value data determines the stability and reliability of test data from Analog IP evaluation in high and low temperature environments.

[0003] At present, chip test data storage solutions are mainly divided into the following situations:

[0004] 1. Chip test data is only stored on the equipment. This solution has the disadvantage of limited storage capacity, as it cannot continue to store data once the equipment memory is full. In addition, this solution also has the disadvantages of manually retrieving test data for each wafer, which is inefficient and has a high error rate in the integration process.

[0005] 2. Connect the test machine to the desktop computer and import the chip test data. However, the desktop computer is vulnerable to network attacks, and the test yield is also the company's core secret, which threatens the network security of the chip test data. Summary of the Invention

[0006] The present application provides a method and system for obtaining test data, which can solve at least one of the following problems: the limited capacity of existing test data storage devices, the need to manually retrieve test data resulting in low efficiency and high error rate in the integration process, and the threat to the network security of test data.

[0007] In one aspect, an embodiment of the present application provides a method for obtaining test data, comprising:

[0008] Step 1: Use an ATE test machine to upload all test data information of multiple wafers to a cloud storage space, where each wafer includes several dies, and each die contains test data information for multiple test items;

[0009] Step 2: Sort all wafers that have uploaded test data information and define the functional relationship between the wafer's plane coordinate system and the coordinate system of the cloud storage space;

[0010] Step 3: Assign the test data information of each test item of each die to the cloud storage space corresponding to the coordinates of the corresponding cloud storage space, so that the test data information of each test item of each die is independently stored in a separate cloud storage space;

[0011] Step 4: Select the serial number of a wafer to be called according to the serial number of the wafer to be tested;

[0012] Step 5: Compare the serial number of the wafer to be tested with the serial number of the wafer to be called. If the serial number of the wafer to be tested is the same as the serial number of the wafer to be called, obtain the coordinates of all dies of the wafer to be called;

[0013] Step 6: According to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space, the coordinates of the wafer to be called are matched with the coordinates of the cloud storage space. If the coordinates of the wafer to be called are successfully matched with the coordinates of the cloud storage space, the test data information of the corresponding test items of all dies of the wafer to be called in the cloud storage space corresponding to the coordinates successfully matched in the cloud storage space are output.

[0014] Optionally, in the method for obtaining test data, the fifth step further includes: if the serial number of the wafer to be tested is different from the serial number of the wafer to be called, returning to execute the fourth step.

[0015] Optionally, in the method for obtaining test data, the sixth step also includes: if the coordinates of the wafer to be called are not successfully matched with the coordinates of the cloud storage space, then according to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space, the coordinates of the wafer to be called are re-matched with the coordinates of the cloud storage space until the match is successful.

[0016] Optionally, in the method for obtaining test data, the coordinates of each cloud storage space correspond to multiple cloud storage spaces, wherein one cloud storage space is used to store test data information of a test item of a die corresponding to the coordinates of the wafer.

[0017] Optionally, in the method for obtaining test data, the method for obtaining test data further includes:

[0018] Step 7: Use the PC to receive the test data information of the corresponding test items of all dies of the wafer to be called, and import the test data information of the corresponding test items of all dies of the wafer to be called received by the PC into the ATE test machine.

[0019] On the other hand, an embodiment of the present application further provides a system for acquiring test data, including:

[0020] Cloud storage space;

[0021] The PC side is used to obtain the test data information of the corresponding test items of all dies of the wafer to be called outputted by the cloud storage space, and output the test data information of the corresponding test items of all dies of the wafer to be called to the subsequent test machine; and

[0022] An ATE test machine, configured to perform electrical performance testing on wafers in a back-end process, upload test data information of the wafers to the cloud storage space, and receive test data information of corresponding test items of all dies of the wafer to be called from the PC, and perform electrical performance testing on the wafers in the back-end process based on the test data information of corresponding test items of all dies of the wafer to be called;

[0023] The cloud storage space includes:

[0024] A data storage module, configured to store all test data information of a plurality of wafers, wherein each wafer comprises a plurality of dies, and each die comprises test data information of a plurality of test items;

[0025] The service management module is used to sort all wafers that have uploaded test data information;

[0026] An application module, for defining a functional relationship between a plane coordinate system of the wafer and a coordinate system of the cloud storage space; and

[0027] A service provision module, configured to implement information interaction between the service management module and the application module;

[0028] The service management module is further configured to assign the test data information of each test item of each die to the data storage module corresponding to the coordinates of the corresponding cloud storage space, so that the test data information of each test item of each die is independently stored in a separate data storage module;

[0029] The application module is further configured to select a serial number of a wafer to be called according to the serial number of the wafer to be tested;

[0030] The application module is further configured to compare the serial number of the wafer to be tested with the serial number of the wafer to be called, and if the serial number of the wafer to be tested is the same as the serial number of the wafer to be called, obtain the coordinates of all dies of the wafer to be called;

[0031] The application module is also used to match the coordinates of the wafer to be called with the coordinates of the cloud storage space based on the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space. If the coordinates of the wafer to be called are successfully matched with the coordinates of the cloud storage space, the test data information of the corresponding test items of all dies of the wafer to be called in the data storage module corresponding to the coordinates of the cloud storage space that are successfully matched is output.

[0032] Optionally, in the system for obtaining test data, the service management module is also used to compare the serial number of the wafer to be tested with the serial number of the wafer to be called. If the serial number of the wafer to be tested is different from the serial number of the wafer to be called, the serial number of a wafer to be called is reselected based on the serial number of the wafer to be tested.

[0033] Optionally, in the system for acquiring test data, the service management module is also used to match the coordinates of the wafer to be called with the coordinates of the cloud storage space based on the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space. If the coordinates of the wafer to be called and the coordinates of the cloud storage space are not successfully matched, the coordinates of the wafer to be called and the coordinates of the cloud storage space are re-matched based on the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space until the match is successful.

[0034] Optionally, in the system for acquiring test data, the coordinates of each cloud storage space correspond to multiple data storage modules, wherein one of the data storage modules is used to store test data information of a test item of a die corresponding to the coordinates of the wafer.

[0035] The technical solution of this application has at least the following advantages:

[0036] The present application uploads the test data information of the wafer in an orderly manner to the cloud storage space, and then matches the serial number and wafer coordinates of the wafer to be tested with the serial number and wafer coordinates of the wafer in the cloud storage space. If the match is successful, the test data information of the corresponding test items of all dies of the wafer can be called from the cloud storage space. This can solve the problem of how to store the test data information generated at each stage in chip testing when there is no fixed terminal and the hardware storage space is limited.

[0037] Furthermore, the test data information of the present application does not need to be retrieved manually, which enables fast and accurate detection of chip eligibility. It can be used for batch detection of chips in the production line, improving detection efficiency and reducing the error rate of the integration process.

[0038] In addition, during the testing process of any chip, the present application can directly use the PC to call the test data information of the corresponding test items of all dies of the chip from the cloud storage space, ensuring the network security of the test data. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 is a flowchart of a method for obtaining test data according to an embodiment of the present invention;

[0041] Figure 2 This is a schematic diagram of the process of calling test data according to an embodiment of the present invention;

[0042] Figure 3 is a schematic diagram of a system for acquiring test data according to an embodiment of the present invention;

[0043] The description of the accompanying drawings is as follows:

[0044] 10- cloud storage space, 11- data storage module, 12- service management module, 13- application module, 14- service provision module, 20- PC terminal, 30- ATE test machine. DETAILED DESCRIPTION

[0045] The following is a clear and complete description of the technical solutions in this application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0046] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components; they can refer to wireless connections or wired connections. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0048] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0049] This application embodiment provides a method for obtaining test data, referring to Figure 1 , Figure 1 1 is a flowchart of a method for obtaining test data according to an embodiment of the present invention, wherein the method for obtaining test data includes:

[0050] First step S1: using an ATE test machine to upload all test data information of multiple wafers to a cloud storage space, wherein each wafer includes a plurality of dies, and each die contains test data information of multiple test items. In this embodiment, the die can be a separate chip.

[0051] Next, steps S2 to S6 are the detailed algorithms for calling test data, refer to Figure 2 , Figure 2 It is a schematic diagram of the process of calling test data according to an embodiment of the present invention.

[0052] The second step S2: sorting all wafers that have uploaded test data information, and defining a functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space.

[0053] The third step S3: assign the test data information of each test item of each die to the cloud storage space corresponding to the coordinates of the corresponding cloud storage space, so that the test data information of each test item of each die is independently stored in the separate cloud storage space.

[0054] Preferably, each cloud storage space coordinate corresponds to multiple cloud storage spaces, where one cloud storage space is used to store test data information for a test item on the die corresponding to the wafer coordinates. In this embodiment, each wafer and each corresponding test item has a uniquely named cloud storage space, and the test data for the test item is stored in the uniquely named cloud storage space. The test data file for each test item can be in txt format.

[0055] It is worth noting that any file in the cloud storage space is created corresponding to a certain wafer, so once a file is created, it has a wafer serial number (wafer sequence / wafer ID), indicating which wafer the file belongs to. The embodiment of the present application matches the test data in two dimensions: test item and wafer serial number. The same test data file belongs to both a wafer and a test item. The test data information of each test item is independent and does not interfere with each other, ensuring the accuracy of the test data called.

[0056] The fourth step S4: selecting the serial number of a wafer to be called according to the serial number of the wafer to be tested.

[0057] The fifth step S5: SLOT judgment: compare the serial number of the wafer to be tested with the serial number of the wafer to be called. If the serial number of the wafer to be tested is the same as the serial number of the wafer to be called, obtain the coordinates of all dies of the wafer to be called.

[0058] Furthermore, in S5, if the serial number of the wafer to be tested is different from the serial number of the wafer to be called, the process returns to execute the fourth step.

[0059] The sixth step S6: According to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space, the coordinates of the wafer to be called are matched with the coordinates of the cloud storage space. If the coordinates of the wafer to be called are successfully matched with the coordinates of the cloud storage space, the test data information of the corresponding test items of all dies of the wafer to be called in the cloud storage space corresponding to the coordinates successfully matched in the cloud storage space are output.

[0060] Furthermore, in S6, if the coordinates of the wafer to be called are not successfully matched with the coordinates of the cloud storage space, the coordinates of the wafer to be called are re-matched with the coordinates of the cloud storage space according to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space until the match is successful.

[0061] The method for obtaining test data may further include:

[0062] Step S7: Use the PC to receive the test data information of the corresponding test items of all dies of the wafer to be called, and import the test data information of the corresponding test items of all dies of the wafer to be called received by the PC into the ATE test machine for testing the wafer to be tested.

[0063] In this embodiment, the upload and download functions of the test data file list are provided through the API, and each API interface call must clearly specify the user operated by this call.

[0064] The method for obtaining test data provided by the present application is relative to the storage and calling mode of traditional chip test data, and the greatest advantage is that the application is to the speed and accuracy of data calling, and each test item has an independent cloud storage space in the cloud storage space of the present invention, and the directory structure in the space can be written to the wafer sequence (sequence number) of corresponding classification. Secondly, because the test data of each wafer of each test item are stored in a separate cloud space, and the test data acquisition algorithm of step S2-step S6 is introduced, it is possible to solve the problem of how the test data information generated in each stage is stored in the absence of a fixed terminal and limited hardware storage space in chip testing, so as to provide efficient, highly reliable, big data storage services to users, and provide cloud data synchronization scheme for each wafer test;Further, the calling of the test data information of the present application does not need to be manually retrieved, and realizes the rapid and accurate detection of chip qualification, can be used for batch detection of chips in production line, improves detection efficiency, reduces the error rate of integration process;In addition, the present application can directly use PC end to call the test data information of the corresponding test items of all dies of the chip from cloud storage space in any chip detection process, ensures the network security of test data

[0065] Based on the same inventive concept, the present application also provides a system for obtaining test data, referring to Figure 3 , Figure 3 It is a schematic diagram of a system for obtaining test data according to an embodiment of the present invention, wherein the system for obtaining test data comprises: a cloud storage space 10, a PC terminal 20 and an ATE test machine 30, wherein the PC terminal 20 is used to obtain the test data information of the corresponding test items of all dies of the wafer to be called output by the cloud storage space 10, and output the test data information of the corresponding test items of all dies of the wafer to be called to the subsequent test machine; the ATE test machine 30 is used to perform electrical performance tests on wafers in the back-end process, and upload the test data information of the wafers to the cloud storage space, and receive the test data information of the corresponding test items of all dies of the wafer to be called from the PC terminal, and perform electrical performance tests on the wafers in the back-end process according to the test data information of the corresponding test items of all dies of the wafer to be called.

[0066] Furthermore, the cloud storage space includes: a data storage module 11, a service management module 12, an application module 13, and a service provision module 14. The data storage module 11 is used to store all test data information of multiple wafers, wherein each wafer includes several dies, and each die contains test data information of multiple test items; the service management module 12 is used to sort all wafers that have uploaded test data information; the application module 13 is used to define the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space; and the service provision module 14 is used to complete information exchange between the service management module and the application module.

[0067] The service management module 12 is further configured to assign the test data information of each test item of each die to the data storage module corresponding to the coordinates of the corresponding cloud storage space, so that the test data information of each test item of each die is independently stored in a separate data storage module;

[0068] The application module 13 is further configured to select a serial number of a wafer to be called according to the serial number of the wafer to be tested;

[0069] The application module 13 is also used to compare the serial number of the wafer to be tested with the serial number of the wafer to be called. If the serial number of the wafer to be tested is the same as the serial number of the wafer to be called, the coordinates of all dies of the wafer to be called are obtained; further, if the serial number of the wafer to be tested is different from the serial number of the wafer to be called, the serial number of the wafer to be called is reselected according to the serial number of the wafer to be tested.

[0070] The application module 13 is also used to match the coordinates of the wafer to be called with the coordinates of the cloud storage space according to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space. If the coordinates of the wafer to be called are successfully matched with the coordinates of the cloud storage space, the test data information of the corresponding test items of all dies of the wafer to be called in the data storage module corresponding to the coordinates successfully matched in the cloud storage space is output; further, if the coordinates of the wafer to be called are not successfully matched with the coordinates of the cloud storage space, the coordinates of the wafer to be called are re-matched with the coordinates of the cloud storage space according to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space until the match is successful.

[0071] Furthermore, each coordinate of the cloud storage space corresponds to a plurality of data storage modules, wherein one of the data storage modules is used to store test data information of a test item of a die corresponding to the coordinate of the wafer.

[0072] In this embodiment, the service management module 12 can allocate the data storage module 11 to each test item, and the data storage module 11 includes an application data directory for each wafer, and the application data directory stores the application program and related test data; the service provision module 14 is equivalent to a bridge between the service management module 12 and the application module 13, and the service provision module 14 provides services to the application module 13 and provides execution commands to the service management module 12; the service management module 12 manages the data in the data storage module 11 and provides service queries for the application module 13; the application module 13 provides the application program to the PC end 20, and obtains the test data information of all dies of the wafer to be called related to the application program in the data storage module 11 according to the identification information of the application program.

[0073] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of this application.

Claims

1. A method for obtaining test data, characterized in that: include: Step 1: Use an ATE test machine to upload all test data information of multiple wafers to a cloud storage space, where each wafer includes several dies, and each die contains test data information for multiple test items; Step 2: Sort all wafers that have uploaded test data information and define the functional relationship between the wafer's plane coordinate system and the coordinate system of the cloud storage space; Step 3: Assign the test data information of each test item of each die to the cloud storage space corresponding to the coordinates of the corresponding cloud storage space, so that the test data information of each test item of each die is independently stored in a separate cloud storage space; Step 4: Select the serial number of a wafer to be called according to the serial number of the wafer to be tested; Step 5: Compare the serial number of the wafer to be tested with the serial number of the wafer to be called. If the serial number of the wafer to be tested is the same as the serial number of the wafer to be called, obtain the coordinates of all dies of the wafer to be called; Step 6: According to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space, the coordinates of the wafer to be called are matched with the coordinates of the cloud storage space. If the coordinates of the wafer to be called are successfully matched with the coordinates of the cloud storage space, the test data information of the corresponding test items of all dies of the wafer to be called in the cloud storage space corresponding to the coordinates successfully matched in the cloud storage space are output.

2. The method for obtaining test data according to claim 1, wherein: The fifth step also includes: if the serial number of the wafer to be tested is different from the serial number of the wafer to be called, returning to execute the fourth step.

3. The method for obtaining test data according to claim 1, wherein: The sixth step also includes: if the coordinates of the wafer to be called are not successfully matched with the coordinates of the cloud storage space, the coordinates of the wafer to be called are re-matched with the coordinates of the cloud storage space according to the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space until the match is successful.

4. The method for obtaining test data according to claim 1, wherein: The coordinates of each cloud storage space correspond to multiple cloud storage spaces, wherein one cloud storage space is used to store test data information of a test item of a die corresponding to the coordinates of the wafer.

5. The method for obtaining test data according to claim 1, wherein: The method for obtaining test data further includes: Step 7: Use the PC to receive the test data information of the corresponding test items of all dies of the wafer to be called, and import the test data information of the corresponding test items of all dies of the wafer to be called received by the PC into the ATE test machine.

6. A system for acquiring test data, characterized in that: include: Cloud storage space; The PC side is used to obtain the test data information of the corresponding test items of all dies of the wafer to be called outputted by the cloud storage space, and output the test data information of the corresponding test items of all dies of the wafer to be called to the subsequent test machine; and An ATE test machine, configured to perform electrical performance testing on wafers in a back-end process, upload test data information of the wafers to the cloud storage space, and receive test data information of corresponding test items of all dies of the wafer to be called from the PC, and perform electrical performance testing on the wafers in the back-end process based on the test data information of corresponding test items of all dies of the wafer to be called; The cloud storage space includes: A data storage module, configured to store all test data information of a plurality of wafers, wherein each wafer comprises a plurality of dies, and each die comprises test data information of a plurality of test items; The service management module is used to sort all wafers that have uploaded test data information; An application module, for defining a functional relationship between a plane coordinate system of the wafer and a coordinate system of the cloud storage space; and A service provision module, configured to implement information interaction between the service management module and the application module; The service management module is further configured to assign the test data information of each test item of each die to the data storage module corresponding to the coordinates of the corresponding cloud storage space, so that the test data information of each test item of each die is independently stored in a separate data storage module; The application module is further configured to select a serial number of a wafer to be called according to the serial number of the wafer to be tested; The application module is further configured to compare the serial number of the wafer to be tested with the serial number of the wafer to be called, and if the serial number of the wafer to be tested is the same as the serial number of the wafer to be called, obtain the coordinates of all dies of the wafer to be called; The application module is also used to match the coordinates of the wafer to be called with the coordinates of the cloud storage space based on the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space. If the coordinates of the wafer to be called are successfully matched with the coordinates of the cloud storage space, the test data information of the corresponding test items of all dies of the wafer to be called in the data storage module corresponding to the coordinates of the cloud storage space that are successfully matched is output.

7. The system for acquiring test data according to claim 6, characterized in that: The service management module is also used to compare the serial number of the wafer to be tested with the serial number of the wafer to be called. If the serial number of the wafer to be tested is different from the serial number of the wafer to be called, a new serial number of the wafer to be called is selected based on the serial number of the wafer to be tested.

8. The system for acquiring test data according to claim 6, wherein: The service management module is also used to match the coordinates of the wafer to be called with the coordinates of the cloud storage space based on the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space. If the coordinates of the wafer to be called and the coordinates of the cloud storage space are not matched successfully, the coordinates of the wafer to be called and the coordinates of the cloud storage space are re-matched based on the functional relationship between the plane coordinate system of the wafer and the coordinate system of the cloud storage space until the match is successful.

9. The system for acquiring test data according to claim 6, wherein: The coordinates of each cloud storage space correspond to multiple data storage modules, wherein one of the data storage modules is used to store test data information of a test item of a die corresponding to the coordinates of the wafer.

Images