Loudspeaker vibration plate containing water-soluble phenolic resin and method for manufacturing the same

Abstract

A method for manufacturing a speaker vibration plate containing a water-soluble phenolic resin comprises the following steps: diluting the water-soluble phenolic resin with water to form a resin solution, wherein the composition of the water-soluble phenolic resin comprises a phenolic compound, an aldehyde compound and a catalyst, wherein the proportion of the phenolic compound to the total of the phenolic compound and the aldehyde compound is 40-80% (w / w), the proportion of the aldehyde compound to the total of the phenolic compound and the aldehyde compound is 20-60% (w / w), and the catalyst is 0.1-5% (w / w); a substrate is impregnated with the resin solution; the substrate is dried to form a resin solid layer on the substrate; a speaker vibration plate is formed on the substrate; and the speaker vibration plate is cut from the substrate. Thus, the present invention uses a water-soluble phenolic resin as a resin material, and thus water can be used as a solvent, so the speaker vibration plate does not contain an organic solvent.

Description

Technical Field

[0001] The present invention relates to a speaker vibration plate and a manufacturing method thereof, in particular to a speaker vibration plate containing water-soluble phenolic resin and a manufacturing method thereof. Background Art

[0002] A general dynamic speaker produces sound by using the principle that the reaction force of a fixed magnetic field causes another magnetic field to move in the opposite direction (i.e., opposites attract and likes repel). Specifically, the power alternating current generated by the power amplifier is transmitted to the voice coil through a wire to change the polarity of the magnetic field, causing the voice coil to produce a reaction force relative to the fixed sector generated by the magnetic return device. Positive pulses cause the diaphragm to move outward relative to the magnet, and negative pulses cause the diaphragm to move inward. When the voice coil pushes the diaphragm to reciprocate, the diaphragm pushes the air, and the air pressure changes to form sound waves. The elastic wave is responsible for maintaining the correct position of the voice coil in the gap between the magnet core, ensuring that the voice coil reciprocates along the axis when subjected to force. The suspension edge is set between the diaphragm and the outer frame to support the diaphragm.

[0003] Generally, many non-metal parts inside a speaker are made of substrates such as paper or cloth. The main reason is that the specially treated substrate has appropriate elasticity and strength, and can provide the required functional requirements when the speaker is in operation. For example, diaphragms, elastic waves, suspension edges, or drum paper in small speakers are all included. These non-metal parts are collectively called speaker vibration plates.

[0004] The manufacturing method of the speaker vibration plate includes the following steps: a substrate is impregnated with a resin solution; the substrate is dried to form a resin solid layer on the substrate; a speaker vibration plate shape is formed on the substrate by hot pressing; and the speaker vibration plate shape is cut from the substrate to obtain a speaker vibration plate. The speaker vibration plate includes a body and a resin solid layer, and the resin solid layer is formed on the surface of the body.

[0005] The resin solution commonly used in the industry currently contains oil-soluble phenolic resin, which needs to be dissolved in an organic solvent (e.g., alcohol) to form a resin solution. Therefore, substrate drying is only to remove the water in the resin solution, and the oil-soluble phenolic resin and organic solvent in the resin solution still exist on the surface of the substrate to form a resin solid layer. In other words, the resin solid layer contains oil-soluble phenolic resin and organic solvent. Therefore, the speaker vibration plate contains phenolic compounds, aldehyde compounds and organic solvents.

[0006] Generally speaking, phenolic compounds, aldehyde compounds and organic solvents are volatile and toxic, and are obviously harmful to the human body. When the concentration of phenolic compounds, aldehyde compounds and organic solvents exceeds a certain concentration, if people inhale too much phenolic compounds, aldehyde compounds and organic solvents in a short period of time, they will feel headaches, nausea, vomiting, and weakness in their limbs; in severe cases, they will have convulsions, coma, and memory loss. Phenolic compounds, aldehyde compounds and organic solvents can also damage the liver, kidneys, brain and nervous system of the human body, and they also contain many carcinogens. Summary of the invention

[0007] The main purpose of the present invention is to provide a speaker vibration plate containing water-soluble phenolic resin and a manufacturing method thereof, wherein the water-soluble phenolic resin replaces the oil-soluble phenolic resin so that the speaker vibration plate does not contain organic solvents.

[0008] Another object of the present invention is to provide a speaker vibration plate containing water-soluble phenolic resin and a method for manufacturing the same. Under the conditions of specific composition and proportion, the water-soluble phenolic resin can improve the sound quality output by the speaker vibration plate.

[0009] Another object of the present invention is to provide a speaker vibration plate containing water-soluble phenolic resin and a method for manufacturing the same. By properly controlling the preparation conditions of the resin solution, the content of phenolic compounds and aldehyde compounds in the speaker vibration plate can be reduced to a range that meets the safety standards of countries around the world.

[0010] Another object of the present invention is to provide a speaker vibration plate containing water-soluble phenolic resin and a method for manufacturing the same, by limiting the solid content, pH value and viscosity of the resin solution, the content of phenolic compounds and aldehyde compounds in the speaker vibration plate can be further reduced.

[0011] Another object of the present invention is to provide a speaker vibration plate containing water-soluble phenolic resin and a method for manufacturing the same. The drying step can also reduce the content of phenolic compounds and aldehyde compounds in the substrate, and the content of phenolic compounds and aldehyde compounds in the speaker vibration plate is further reduced.

[0012] In order to achieve the above-mentioned purpose, the present invention provides a method for manufacturing a speaker vibration plate containing a water-soluble phenolic resin, comprising the following steps: a preparation step, a water-soluble phenolic resin is diluted with water to form a resin solution, the composition of the water-soluble phenolic resin comprises a phenolic compound, an aldehyde compound and a catalyst, the ratio of the phenolic compound to the total of the phenolic compound and the aldehyde compound is 40-80% (w / w), the ratio of the aldehyde compound to the total of the phenolic compound and the aldehyde compound is 20-60% (w / w), and the catalyst is 0.1-5% (w / w); an impregnation step, a substrate is impregnated with the resin solution; a drying step, the substrate is dried to form a resin solid layer on the substrate; a molding step, a speaker vibration plate is molded on the substrate; and a cutting step, the speaker vibration plate is cut off from the substrate; wherein the speaker vibration plate comprises a body and a resin solid layer, the resin solid layer is formed on the surface of the body; and wherein the following formula is a water-soluble phenolic resin:

[0013] [C6H3OHCHR] n

[0014] In the formula, n is 50 to 70, and R is an alkyl group or a hydroxyl group.

[0015] In some embodiments, the preparation step includes the following steps: (a) adding a phenolic compound, an aldehyde compound and a catalyst into a reaction kettle; (b) reacting at a temperature of 60 to 70°C for 2 to 6 hours; (c) evacuating at an atmospheric pressure of 650 mmHg; (d) cooling to 35°C; (e) adjusting the solid content to 60 to 85 wt% and adjusting the pH to 7 to 11; (f) unloading; and, (g) diluting with water to adjust the viscosity to 500 to 2000 cps / 25°C and adding a hydrophilic additive to form a resin solution, the gel time of the resin is 10 to 15 minutes, and the proportion of the water-soluble phenolic resin in the resin solution is 40 to 100%.

[0016] Preferably, (e) the solid content is adjusted to 69.66 wt % and the pH is adjusted to 8.64; (g) water is added to dilute to adjust the viscosity to 700-800 cps / 25° C. and a hydrophilic additive is added to form a resin solution, and the gel time of the resin is 14 minutes.

[0017] In some embodiments, the phenolic compound is selected from the group consisting of phenol, cresol, phenol, bisphenol A, propofol and xylenol, the aldehyde compound is selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isopropionaldehyde and isobutyraldehyde, and the catalyst is selected from the group consisting of oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, ammonia water, sodium hydroxide, barium hydroxide, potassium hydroxide, magnesium hydroxide and calcium hydroxide.

[0018] In some embodiments, in the drying step, an extrusion device first squeezes out excess water-soluble phenolic resin from the substrate, and then bakes the substrate at a temperature of 100 to 120° C. for 10 to 30 minutes.

[0019] In some embodiments, in the molding step, the substrate is heat-pressed at a temperature of 130-180° C. for 30-90 minutes to heat-press and mold a speaker vibration plate on the substrate.

[0020] In order to achieve the above-mentioned purpose, the present invention provides a speaker vibration plate containing a water-soluble phenolic resin, comprising a body and a resin solid layer, wherein the resin solid layer is formed on the surface of the body by drying a resin solution. The resin solution is formed by diluting a water-soluble phenolic resin with water, and the composition of the water-soluble phenolic resin comprises a phenolic compound, an aldehyde compound and a catalyst, wherein the proportion of the phenolic compound to the total of the phenolic compound and the aldehyde compound is 40-80% (w / w), the proportion of the aldehyde compound to the total of the phenolic compound and the aldehyde compound is 20-60% (w / w), and the catalyst is 0.1-5% (w / w); and wherein the following formula is the water-soluble phenolic resin:

[0021] [C6H3OHCHR] n

[0022] In the formula, n is 50 to 70, and R is an alkyl group or a hydroxyl group.

[0023] In some embodiments, the solid content of the resin solution is 60-85 wt %, the pH of the resin solution is 7-11, and the viscosity of the resin solution is 500-2000 cps / 25° C.

[0024] Preferably, the solid content of the resin solution is 69.66 wt %, the pH of the resin solution is pH 8.64, and the viscosity of the resin solution is 700-800 cps / 25° C.

[0025] In some embodiments, the phenolic compound is selected from the group consisting of phenol, cresol, phenol, bisphenol A, propofol and xylenol, the aldehyde compound is selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isopropionaldehyde and isobutyraldehyde, and the catalyst is selected from the group consisting of oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, ammonia water, sodium hydroxide, barium hydroxide, potassium hydroxide, magnesium hydroxide and calcium hydroxide.

[0026] The effect of the present invention is that the present invention uses water-soluble phenolic resin as the resin material to replace the oil-soluble phenolic resin, so that water can be used as the solvent to replace the organic solvent. Therefore, the speaker vibration plate does not contain organic solvents, meets environmental protection requirements, and the user's body will not be harmed by the gas after the organic solvent evaporates.

[0027] Furthermore, under the conditions of specific composition and specific proportion, the water-soluble phenolic resin of the present invention can make the speaker vibration plate have uniform elastic recovery force, fatigue resistance, and resistance to deformation and brittle cracking, thereby improving the sound quality output by the speaker vibration plate.

[0028] In addition, under the condition that the preparation conditions of the resin solution are properly controlled, the water solubility of the resin solution in reverse osmosis water and tap water can be greatly improved, thereby achieving the effect of reducing the content of free phenolic compounds and free aldehyde compounds in the resin solution. The content of phenolic compounds and aldehyde compounds in the speaker vibration plate can be reduced to a range that meets the safety standards of countries around the world.

[0029] In addition, under all the preparation conditions, the hydrophilic additive can increase the hydrophilicity of the water-soluble phenolic resin, so that the water solubility of the water-soluble phenolic resin in reverse osmosis water and tap water can be significantly improved.

[0030] Moreover, after the present invention further limits the solid content, pH value and viscosity of the resin solution, the water solubility of the resin solution in reverse osmosis water and tap water can be further improved, thereby achieving the effect of further reducing the content of free phenolic compounds and free aldehyde compounds in the resin solution, and the content of phenolic compounds and aldehyde compounds in the speaker vibration plate can be further reduced.

[0031] It is worth mentioning that the drying step of the present invention can also reduce the content of phenolic compounds and aldehyde compounds in the substrate, and the content of phenolic compounds and aldehyde compounds in the speaker vibration plate is further reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a flow chart of a method for producing a speaker diaphragm containing a water-soluble phenolic resin according to the present invention.

[0033] Figure 2 The present invention is a flow chart showing the steps of manufacturing a speaker diaphragm containing a water-soluble phenolic resin.

[0034] Figure 3 The present invention is a schematic diagram of the method for producing a speaker diaphragm containing a water-soluble phenolic resin, from the impregnation step to the cutting step.

[0035] Figure 4 It is a schematic diagram of a speaker vibration plate containing a water-soluble phenolic resin according to the present invention.

[0036] Description of Reference Numerals

[0037] 10: Base material

[0038] 20: Resin tank

[0039] 21: Resin solution

[0040] 30: Extrusion device

[0041] 40: Drying device

[0042] 41: Place on baking sheet

[0043] 42: Lower baking sheet

[0044] 50:Hot pressing device

[0045] 51: Molding mold

[0046] 511: Upper mold

[0047] 512: Lower die

[0048] 60: Cutting device

[0049] 61: Upper cutting tool

[0050] 62: Lower cutting tool

[0051] 100: Speaker vibration plate

[0052] 110:Ontology

[0053] 111: Warp

[0054] 112: Weft

[0055] 120: resin solid layer

[0056] S100: Preparation steps

[0057] S101~S107: Steps

[0058] S200: Impregnation step

[0059] S300: Drying step

[0060] S400: Molding Steps

[0061] S500: Cutting step DETAILED DESCRIPTION

[0062] The following is a more detailed description of the embodiments of the present invention with the help of drawings and component symbols, so that those skilled in the art can implement the embodiments according to the embodiments after reading the description.

[0063] See also Figures 1 to 3 , are respectively a flow chart of the method for manufacturing a speaker vibration plate containing a water-soluble phenolic resin of the present invention, a flow chart of the preparation step S100, and a schematic diagram of the impregnation step S200 to the cutting step S500. Figures 1 to 3 As shown, the present invention provides a method for manufacturing a speaker vibration plate 100 containing a water-soluble phenolic resin, comprising the following steps:

[0064] In preparation step S100, a water-soluble phenolic resin is diluted with water to form a resin solution 21. Specifically, the composition of the water-soluble phenolic resin includes a phenolic compound, an aldehyde compound and a catalyst, wherein the proportion of the phenolic compound to the total of the phenolic compound and the aldehyde compound is 40-80% (w / w), the proportion of the aldehyde compound to the total of the phenolic compound and the aldehyde compound is 20-60% (w / w), and the catalyst is 0.1-5% (w / w). Among them, the following formula is a water-soluble phenolic resin:

[0065] [C6H3OHCHR] n

[0066] In the formula, n is 50 to 70, and R is an alkyl group or a hydroxyl group.

[0067] Specifically, the phenolic compound is selected from the group consisting of phenol, cresol, phenol, bisphenol A, propofol and xylenol, the aldehyde compound is selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isopropionaldehyde and isobutyraldehyde, and the catalyst is selected from the group consisting of oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, ammonia water, sodium hydroxide, barium hydroxide, potassium hydroxide, magnesium hydroxide and calcium hydroxide.

[0068] In a preferred embodiment, the preparation step S100 includes the following steps: step S101, adding a phenolic compound, an aldehyde compound and a catalyst into a reaction kettle (not shown); step S102, reacting at a temperature of 60 to 70° C. for 2 to 6 hours; step S103, evacuating at an atmospheric pressure of 650 mmHg; step S104, cooling to 35° C.; step S105, adjusting the solid content to 60 to 85 wt % and adjusting the pH to 7 to 11; step S106, unloading; and step S107, diluting with water to adjust the viscosity to 500 to 2000 cps (centipoise) / 25° C. and adding a hydrophilic additive to form a resin solution 21, the gel time of the resin solution 21 is 10 to 15 minutes, and the proportion of the water-soluble phenolic resin in the resin solution is 40 to 100%.

[0069] In the impregnation step S200, a substrate 10 is impregnated with a resin solution 21. More specifically, the substrate 10 is woven from a plurality of warp yarns 111 and a plurality of weft yarns 112, so that the substrate 10 is substantially a cloth material; a resin tank 20 is filled with the resin solution 21, and the substrate 10 is impregnated with the resin solution 21 in the resin tank 20, so that the plurality of warp yarns 111 and the plurality of weft yarns 112 of the substrate 10 absorb and adhere to the water-soluble phenolic resin.

[0070] In the drying step S300, the substrate 10 is dried to form a resin solid layer 120 on the substrate 10. More specifically, an extrusion device 30 first squeezes out the excess water-soluble phenolic resin in the substrate 10, and then bakes the substrate 10 at a temperature of 100 to 120° C. for 10 to 30 minutes. Preferably, the extrusion device 30 is a roller.

[0071] To be more specific, the amount of water-soluble phenolic resin that can be adsorbed by the substrate 10 is fixed, but because the water-soluble phenolic resin is sticky, there will be an excess of water-soluble phenolic resin adhering to the substrate 10. If the excess water-soluble phenolic resin on the substrate 10 is not squeezed out before drying the substrate 10, the following problems will occur: first, a longer baking time is required to dry the substrate 10; second, after drying the substrate 10, the excess water-soluble phenolic resin clumps together on the surface of the substrate 10; third, the content of phenolic compounds and aldehyde compounds in the substrate 10 is relatively high.

[0072] In the present invention, before drying the substrate 10, the extrusion device 30 first squeezes out the excess water-soluble phenolic resin in the substrate 10, which has the following advantages: first, shortening the baking time; second, preventing the excess water-soluble phenolic resin from agglomerating and clumping on the surface of the substrate 10 after drying the substrate 10; and third, reducing the content of phenolic compounds and aldehyde compounds in the substrate 10.

[0073] Preferably, a drying device 40 comprises an upper baking plate 41 and a lower baking plate 42, the temperature of the upper baking plate 41 and the lower baking plate 42 is increased to 100-120°C, and the substrate 10 is baked at this temperature for 10-30 minutes, so that the moisture, partially volatile phenolic compounds and aldehyde compounds in the water-soluble phenolic resin on the substrate 10 are removed together to dry the substrate 10. The water-soluble phenolic resin on the surface of the substrate 10 is able to penetrate into the interior of the substrate 10 and adhere to the warp yarns 111 and the weft yarns 112 to form a resin solid layer 120.

[0074] In the molding step S400, a speaker vibration plate 100 is molded on the substrate 10. Specifically, the substrate 10 is hot-pressed at a temperature of 130 to 180°C to hot-press the speaker vibration plate 100 on the substrate 10, and the molding time is 30 to 90 minutes. Preferably, a hot-pressing molding device 50 includes a molding mold 51 and a heating device (not shown), and the molding mold 51 includes an upper mold 511 and a lower mold 512. When the upper mold 511 and the lower mold 512 are closed and the substrate 10 is pressurized, the heating device is energized to increase the temperature of the upper mold 511 and the lower mold 512 to 130 to 180°C, and the substrate 10 is hot-pressed at this temperature, and the molding time is 30 to 90 minutes, so as to soften the water-soluble phenolic resin on the substrate 10. In addition to breaking the water-soluble phenolic resin, the water-soluble phenolic resin also fills the gaps and connects to form a final shape of a resin solid layer 120 to cover between the warp yarns 111 and the weft yarns 112 , thereby hot-pressing a speaker vibration plate 100 on the substrate 10 .

[0075] In the cutting step S500, the speaker vibration plate 100 is cut off from the substrate 10. More specifically, a cutting device 60 includes an upper cutter 61 and a lower cutter 62. The substrate 10 moves to the cutting device 60, and the upper cutter 61 and the lower cutter 62 cut the speaker vibration plate 100 from the substrate 10, so that the speaker vibration plate 100 is separated from the substrate 10.

[0076] See also Figure 4 , Figure 4 FIG. 1 is a schematic diagram of a speaker vibration plate 100 containing a water-soluble phenolic resin according to the present invention. Figure 4 As shown, the present invention provides a speaker vibration plate 100 containing a water-soluble phenolic resin, including a body 110 and a resin solid layer 120. The body 110 is woven by a plurality of warp yarns 111 and a plurality of weft yarns 112. The resin solid layer 120 is formed on the surface of the body 110 by drying a resin solution 21. The resin solution 21 is formed by diluting a water-soluble phenolic resin with water. The composition of the water-soluble phenolic resin is as described above. The solid content of the resin solution 21 is 60 to 85 wt%, the pH of the resin solution 21 is pH 7 to 11, and the viscosity of the resin solution 21 is 500 to 2000 cps (centipoise) / 25°C.

[0077] Thus, the present invention uses water-soluble phenolic resin as the resin material to replace oil-soluble phenolic resin, and thus can use water as the solvent to replace the organic solvent. Therefore, the speaker vibration plate 100 does not contain organic solvents, meets environmental protection requirements, and the user's body will not be harmed by the gas after the organic solvent evaporates.

[0078] Furthermore, under the conditions of specific composition and specific ratio, the water-soluble phenolic resin of the present invention can make the speaker vibration plate 100 have uniform elastic recovery force, fatigue resistance, and resistance to deformation and brittle cracking, thereby improving the sound quality output by the speaker vibration plate 100.

[0079] In addition, when the preparation conditions of the resin solution 21 are properly controlled, the water solubility of the resin solution 21 in reverse osmosis water and tap water can be greatly improved, thereby achieving the effect of reducing the content of free phenolic compounds and free aldehyde compounds in the resin solution 21. The content of phenolic compounds and aldehyde compounds in the speaker vibration plate 100 can be reduced to a range that meets the safety standards of countries around the world.

[0080] In addition, under all the preparation conditions, the hydrophilic additive can increase the hydrophilicity of the water-soluble phenolic resin, so that the water solubility of the water-soluble phenolic resin in reverse osmosis water and tap water can be significantly improved.

[0081] Preferably, in step S105, the solid content is adjusted to 69.66wt% and the pH is adjusted to 8.64; in step S107, water is added to dilute to adjust the viscosity to 700-800cps (centipoise) / 25°C and a hydrophilic additive is added to form a resin solution 21, and the gel time of the resin solution 21 is 14 minutes. Therefore, the solid content of the resin solution 21 is 69.66wt%, the pH of the resin solution 21 is pH 8.64, and the viscosity of the resin solution 21 is 700-800cps (centipoise) / 25°C. After experimental testing, it was found that the water solubility of the resin solution 21 in reverse osmosis water is greater than 1000% / 25°C, the water solubility of the resin solution 21 in tap water is 540% / 25°C, the free phenolic compounds in the resin solution 21 are 1.76%, and the free aldehyde compounds in the resin solution 21 are 0.35%. Therefore, after the present invention further limits the solid content, pH value, and viscosity of the resin solution 21, the water solubility of the resin solution 21 in reverse osmosis water and tap water can be further improved, thereby achieving the effect of further reducing the content of free phenolic compounds and free aldehyde compounds in the resin solution 21, and the content of phenolic compounds and aldehyde compounds in the speaker vibration plate 100 can be further reduced.

[0082] It is worth mentioning that the drying step S300 of the present invention can also reduce the content of phenolic compounds and aldehyde compounds in the substrate 10 , and the content of phenolic compounds and aldehyde compounds in the speaker vibration plate 100 is further reduced.

[0083] The above description is only used to explain the preferred embodiments of the present invention, and is not intended to limit the present invention in any form. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included in the scope of protection intended by the present invention.

Claims

1. A method for manufacturing a speaker vibration plate containing a water-soluble phenolic resin, characterized in that: The following steps are involved: Preparation step: a water-soluble phenolic resin is diluted with water to form a resin solution, wherein the composition of the water-soluble phenolic resin comprises a phenolic compound, an aldehyde compound and a catalyst, wherein the ratio of the phenolic compound to the total of the phenolic compound and the aldehyde compound is 40-80% (w / w), the ratio of the aldehyde compound to the total of the phenolic compound and the aldehyde compound is 20-60% (w / w), and the catalyst is 0.1-5% (w / w); An impregnation step, in which a substrate is impregnated with the resin solution; A drying step of drying the substrate to form a resin solid layer on the substrate; A molding step, molding a speaker vibration plate on the substrate; as well as A cutting step of cutting the speaker vibration plate from the substrate; The speaker vibration plate includes a body and the resin solid layer, and the resin solid layer is formed on the surface of the body; and Wherein, the following formula is the water-soluble phenolic resin: [C6H3OHCHR] n In the formula, n is 50 to 70, and R is an alkyl group or a hydroxyl group; The preparation step comprises the following steps: (a) adding the phenolic compound, the aldehyde compound and the catalyst into a reaction kettle; (b) reacting at a temperature of 60 to 70° C. for 2 to 6 hours; (c) evacuating at an atmospheric pressure of 650 mmHg; (d) cooling to 35° C.; (e) adjusting the solid content to 60 to 85 wt % and the pH to 7 to 11; (f) unloading; and (g) diluting with water to adjust the viscosity to 500 to 2000 cps / 25° C. and adding a hydrophilic additive to form the resin solution, the gel time of the resin solution is 10 to 15 minutes, and the proportion of the water-soluble phenolic resin in the resin solution is 40 to 100%.

2. The method for manufacturing a speaker diaphragm containing a water-soluble phenolic resin according to claim 1, wherein: (e) adjusting the solid content to 69.66 wt % and the pH to 8.64; (g) adding water to dilute to adjust the viscosity to 700-800 cps / 25° C. and adding the hydrophilic additive to form the resin solution, the gel time of the resin solution being 14 minutes.

3. The method for manufacturing a speaker diaphragm containing a water-soluble phenolic resin according to claim 1, wherein: The phenol compound is selected from the group consisting of phenol, cresol, phenol, bisphenol A, propofol and xylenol; the aldehyde compound is selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isopropionaldehyde and isobutyraldehyde; and the catalyst is selected from the group consisting of oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, ammonia water, sodium hydroxide, barium hydroxide, potassium hydroxide, magnesium hydroxide and calcium hydroxide.

4. The method for manufacturing a speaker diaphragm containing a water-soluble phenolic resin according to claim 1, wherein: In the drying step, an extrusion device first squeezes out the excess water-soluble phenolic resin from the substrate, and then bakes the substrate at a temperature of 100 to 120° C. for 10 to 30 minutes.

5. The method for manufacturing a speaker diaphragm containing a water-soluble phenolic resin according to claim 1, wherein: In the molding step, the substrate is heat-pressed at a temperature of 130 to 180° C. for 30 to 90 minutes to heat-press the speaker vibration plate on the substrate.

6. A speaker vibration plate containing a water-soluble phenolic resin, characterized in that: include: one body; as well as A resin solid layer is formed on the surface of the body by drying a resin solution; The resin solution is formed by diluting a water-soluble phenolic resin with water. The composition of the water-soluble phenolic resin includes a phenolic compound, an aldehyde compound and a catalyst. The ratio of the phenolic compound to the total of the phenolic compound and the aldehyde compound is 40-80% (w / w), the ratio of the aldehyde compound to the total of the phenolic compound and the aldehyde compound is 20-60% (w / w), and the catalyst is 0.1-5% (w / w); and Wherein, the following formula is the water-soluble phenolic resin: [C6H3OHCHR] n In the formula, n is 50 to 70, and R is an alkyl group or a hydroxyl group; The solid content of the resin solution is 60-85 wt %, the pH value of the resin solution is 7-11, and the viscosity of the resin solution is 500-2000 cps / 25° C.

7. The speaker diaphragm containing water-soluble phenolic resin according to claim 6, characterized in that: The solid content of the resin solution is 69.66 wt %, the pH value of the resin solution is 8.64, and the viscosity of the resin solution is 700-800 cps / 25° C.

8. The speaker diaphragm containing water-soluble phenolic resin according to claim 6, characterized in that: The phenol compound is selected from the group consisting of phenol, cresol, phenol, bisphenol A, propofol and xylenol; the aldehyde compound is selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isopropionaldehyde and isobutyraldehyde; and the catalyst is selected from the group consisting of oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, ammonia water, sodium hydroxide, barium hydroxide, potassium hydroxide, magnesium hydroxide and calcium hydroxide.

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