An ice maker

Abstract

The application provides an ice maker, comprising a machine body shell, a fan, a radiator, a semiconductor refrigerator, a refrigeration body, an ice box and a control circuit board, the radiator is located at the upper end of the semiconductor refrigerator and is combined with the hot end surface of the semiconductor refrigerator, the refrigeration body is located at the lower end of the semiconductor refrigerator and is combined with the cold end surface of the semiconductor refrigerator, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan.In the application, the radiator is arranged at the hot end of the semiconductor refrigerator, and the refrigeration body is arranged at the cold end of the semiconductor refrigerator; since the hot end is located above the cold end, when the ice maker works, heat is transmitted upward and cold is transmitted downward under the action of the semiconductor refrigerator, which conforms to the natural conduction law of cold and heat, is beneficial to the conduction of cold and heat, reduces the conduction thermal resistance of the cold end cold and the hot end heat of the semiconductor refrigerator, improves the conduction efficiency, and thus improves the ice making effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of ice making equipment, in particular to an ice maker. BACKGROUND

[0002] The ice maker is a common ice making equipment. Because the ice making process needs low-temperature freezing, the required refrigeration capacity is large and the refrigeration temperature is low, so at present the ice maker mostly adopts mechanical compression refrigeration mode, and its advantages are fast ice making speed and large ice making capacity, but its disadvantages are large size and high cost.

[0003] With the continuous improvement of people's living standards in today's society, individualized demand is emerging, and the same is true for ice makers. Small, fast, small, easy to use, and low cost are special requirements for ice makers. The existing technology has appeared a semiconductor ice maker (referred to as a semiconductor ice maker) that uses semiconductor materials to achieve temperature difference refrigeration using the Peltier effect. Because the refrigeration capacity of the semiconductor ice maker is small, and the structure of the refrigeration body has defects, the existing semiconductor ice maker has the problems of long ice making time and poor ice making effect.

[0004] Therefore, the prior art has defects and needs to be improved and developed. SUMMARY

[0005] In view of the above shortcomings of the prior art, the purpose of the present application is to provide an ice maker to solve the problems of long ice making time and poor ice making effect of the semiconductor ice maker in the prior art.

[0006] The technical scheme adopted by the present application to solve the technical problem is as follows:

[0007] An ice maker, comprising: a machine body shell, a fan, a heat sink, a semiconductor refrigerator, a refrigeration body, an ice box and a control circuit board, characterized in that the heat sink is located at the upper end of the semiconductor refrigerator and is combined with the hot end face of the semiconductor refrigerator, the refrigeration body is located at the lower end of the semiconductor refrigerator and is combined with the cold end face of the semiconductor refrigerator, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan.

[0008] Further, the refrigeration body is composed of a base plate and a first protruding part.

[0009] Further, the side wall surface of the first protruding part forms a groove, and the ice box is located below the refrigeration body and tightly closes the groove to form a hollow space after being combined with the refrigeration body.

[0010] Further, the average transverse width of the groove is 10-25 mm.

[0011] Further, a second protruding part is arranged in the groove.

[0012] Further, the height ratio of the second protruding part to the first protruding part is 0.3-0.95.

[0013] Further, a protrusion is arranged on the ice box.

[0014] Further, an exhaust groove is arranged on the first protruding part.

[0015] Further, the ice maker further comprises a temperature sensor arranged on the refrigerating body and electrically connected with the control circuit board.

[0016] Further, the refrigerating body is detachably connected with the semiconductor refrigerator.

[0017] From the above technical solution, the present application has at least the following advantages and positive effects:

[0018] In the present application, there are multiple invention points:

[0019] Invention point one, the heat sink is arranged on the hot end of the semiconductor refrigerator, and the refrigerating body is arranged on the cold end of the semiconductor refrigerator. Since the hot end is above the cold end, when the ice maker works, heat is transmitted upward and cold is transmitted downward under the action of the semiconductor refrigerator, which conforms to the natural conduction law of cold and heat, is beneficial to the conduction of cold and heat, reduces the conduction thermal resistance of the cold end cold and the hot end heat of the semiconductor refrigerator, and improves the conduction efficiency, thereby improving the ice making effect.

[0020] Invention point two, by arranging the second protruding part in the groove of the refrigerating body, not only the cold exchange area between the refrigerating body and water is increased, but also the cold conduction distance is shortened, thereby finally shortening the ice making time and accelerating the ice making speed. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a perspective view of the ice maker in an embodiment of the present application.

[0022] Figure 2 is a sectional view of the ice maker in an embodiment of the present application.

[0023] Figure 3 is a partial structure schematic view of the ice maker in an embodiment of the present application.

[0024] Figure 4 is a structure schematic view of the refrigerating body and the ice box of the ice maker in an embodiment of the present application.

[0025] Figure 5 is a structure schematic view of the refrigerating body and the ice box of the ice maker in an embodiment of the present application.

[0026] Figure 6is a structural schematic view of a refrigeration body of an ice maker in an embodiment of the present application.

[0027] Figure 7 is a structural schematic view of an ice box of an ice maker in an embodiment of the present application.

[0028] Legend of reference signs:

[0029] 100, ice maker; 1, semiconductor refrigerator; 11, cold end; 12, hot end; 2, heat sink; 21, heat dissipation fin; 3, fan; 4, refrigeration body; 41, base plate; 42, first protruding part; 43, second protruding part; 44, groove; 45, exhaust groove; 5, ice box; 51, protrusion; 6, machine body shell; 61, perforation; 62, ice taking hatch; 63, mounting cavity; 64, heat insulation layer. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described in detail below with reference to examples of embodiments shown in the attached drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are only used to explain the present application and cannot be understood as a limitation of the present application.

[0031] Please refer to Figures 1 to 3 , an ice maker 100 is provided, which comprises a semiconductor refrigerator 1, a heat sink 2, a fan 3, a refrigeration body 4, an ice box 5, and a control circuit board (not shown in the figure), which is electrically connected with the fan 3 and the semiconductor refrigerator 1. For the convenience of description, the width direction in the present text is the direction of the X axis in Figure 2 , the vertical direction or the height direction is the direction of the Y axis.

[0032] Specifically, the semiconductor refrigerator 1 (also called TEC, Thermo Electric Cooler) is a heat pump made of semiconductor materials using the Peltier effect. The semiconductor refrigerator 1 comprises a hot end 12 and a cold end 11, and the cold end 11 is located above the hot end 12. When the semiconductor refrigerator 1 is powered on, the temperature of the cold end 11 will decrease, and the temperature of the hot end 12 will increase.

[0033] The heat sink 2 is used to dissipate heat from the hot end 12. The heat sink 2 is arranged on the hot end 12, i.e. the heat sink 2 is located above the semiconductor refrigerator 1, so that the heat of the hot end 12 is transmitted upward through the heat sink 2, and the heat is continuously transmitted from the cold end 11 to the hot end 12 in the positive direction. Therefore, the heat sink 2 is arranged to dissipate heat from the hot end 12, which can further reduce the temperature of the cold end 11, and is beneficial to speed up the ice making of the ice maker 100.

[0034] The heat sink 2 is arranged at the hot end 12, including but not limited to that the heat sink 2 is directly in contact with the hot end 12, the heat sink 2 and the hot end 12 are arranged at intervals, and the heat sink 2 and the hot end 12 are indirectly in contact through heat dissipation silica gel, heat dissipation silicone grease, etc.

[0035] The refrigeration body 4 is arranged at the cold end 11 of the semiconductor refrigerator 1, that is, the refrigeration body 4 is located below the semiconductor refrigerator 1, so that the cold quantity generated by the cold end 11 of the semiconductor refrigerator 1 is transmitted downward to the refrigeration body 4, thereby reducing the temperature of the refrigeration body 4.

[0036] The refrigeration body 4 is arranged at the cold end 11, including but not limited to that the refrigeration body 4 is directly in contact with the cold end 11, and the refrigeration body 4 and the cold end 11 are arranged at intervals.

[0037] In another embodiment, the refrigeration body 4 is detachably connected with the semiconductor refrigerator 1, and the refrigeration body can be taken out of the semiconductor refrigerator 1, so that users can replace refrigeration bodies 4 of different shapes according to their own preferences, thereby optimizing user experience.

[0038] In the present application, when the ice maker 100 is working, heat is transmitted upward and cold is transmitted downward under the action of the semiconductor refrigerator 1, which conforms to the natural conduction law of cold and heat, is beneficial to the conduction of cold and heat, reduces the conduction thermal resistance of the cold end 11 and the hot end 12 of the semiconductor refrigerator 1, and improves the conduction efficiency, thereby improving the ice making effect. Moreover, the semiconductor refrigerator 1 is smaller in size than the compressor, so that the ice maker 100 can be miniaturized and can be conveniently used by families or individuals.

[0039] Referring to Figures 4 to 7 , the refrigeration body 4 includes a base plate 41 and a first protruding portion 42.

[0040] Specifically, the side wall surface of the first protruding portion 42 forms a groove 44, and the ice box 5 is arranged below the refrigeration body 4. After being buckled with the refrigeration body 4, the groove 44 forms a closed hollow space for storing water. The refrigeration body 4 is cooled under the action of the semiconductor refrigerator 1, and the water stored in the groove 44 becomes ice, thereby realizing ice making.

[0041] Referring to Figure 6 , the number of grooves 44 is multiple.

[0042] Specifically, each groove 44 is arranged side by side and at intervals along the direction of the refrigeration body 4 towards the ice box 5, so that multiple ice blocks can be made at the same time.

[0043] The shapes of each groove 44 are completely the same, or the shapes of each groove 44 are not completely the same, that is, there are at least two grooves 44 with different shapes.

[0044] The shape of the recess 44 is the shape of the ice block, and the shape of the recess 44 can be circular, cylindrical, conical, square, trapezoidal or irregular, and the number of recesses 44 corresponds to the number of ice blocks, and each recess 44 can be independent or connected to each other.

[0045] The complete ice block making process is divided into two processes according to the conduction of cold energy, specifically, the first process: the cold energy is conducted from the refrigeration body 4 to the water in contact with it in the recess 44 (i.e. the water located at the outermost side of the recess 44). The second process: the cold energy is conducted in the water in the recess 44. In order to quickly make ice, the semiconductor refrigerator 1 needs to generate sufficient cold energy on the refrigeration body 4, and conduct the cold energy to the water in contact with it as soon as possible, and use the water as a cold conduction medium to conduct the cold energy to the three-dimensional water body, so that the entire water body is quickly lowered to below the freezing point temperature, thereby completing the rapid freezing. According to the above process, the water in the recess 44 is gradually frozen inward by the side wall of the first protruding part 42.

[0046] For the first process, according to the cold energy conduction formula Q = hSΔT, where Q, h, S, ΔT are the conduction cold energy, the surface heat transfer coefficient, the heat transfer area and the temperature difference, respectively, in order to improve the conduction cold energy and make the water in contact with the refrigeration body 4 freeze quickly (i.e. reduce the temperature difference between the refrigeration body 4 and the water), according to the formula, increasing the contact area between the refrigeration body 4 and the water can quickly reduce the temperature difference between the refrigeration body 4 and the water, thereby making the water in contact with the refrigeration body 4 freeze.

[0047] For the second process, the time of the second process can be reduced by reducing the thermal resistance of the cold energy in the water. According to the formula for calculating the thermal resistance of the cold energy Where L, S, κ are the cold energy conduction distance, the cold energy conduction cross-sectional area, and the ratio of the thermal conductivity of water to ice, respectively, therefore, by increasing the cold energy conduction cross section S and reducing the cold energy conduction distance L, the thermal resistance of the cold energy in the water can be reduced, thereby shortening the time of the second process, and achieving rapid ice making.

[0048] Please refer to Figure 5 and Figure 6 , the recess 44 is provided with a second protruding part 43.

[0049] Specifically, along the direction perpendicular to the refrigeration body 4 towards the ice box 5 (the direction of the X axis), the average size of the recess 44 is 10-25 mm, i.e. along the width direction, the average size of the recess 44 is 10-25 mm. Since the larger the ice block volume, the longer the ice making time, when the average size of the recess 44 along the width direction is 10-25 mm, the ice block can have a suitable volume and a relatively fast ice making speed can be obtained.

[0050] The second protrusion 43 is arranged in the groove 44, which can increase the contact area between the water in the groove 44 and the refrigeration body 4, reduce the time required for the first process, and thus accelerate the ice-making speed. In addition, the second protrusion 43 is arranged in the groove 44, and the cold energy is transmitted to the three-dimensional water body from the side wall surface of the second protrusion 43 and the side wall surface of the first protrusion 42 at the same time, which can shorten the cold conduction distance, reduce the thermal resistance of the cold conduction in the water, reduce the time required for the second process, and thus accelerate the ice-making speed. Since the second protrusion 43 arranged in the groove 44 has a positive promoting effect on the first process and the second process, compared with only shortening the time required for the first process or only shortening the time required for the second process, the second protrusion 43 arranged in the groove 44 can significantly accelerate the ice-making speed, improve the ice-making efficiency, and has the advantages of simple structure.

[0051] The shape of the second protrusion 43 includes but is not limited to a cylindrical shape, a conical shape, a square shape, a trapezoidal shape, or an irregular shape.

[0052] The height of the second protrusion 43 is less than the height of the first protrusion 42, and the height ratio of the second protrusion 42 to the first protrusion 42 is 0.3-0.95, that is, the size ratio of the second protrusion 43 to the first protrusion 42 in the height direction is 0.3-0.95, so as to obtain better ice-making effect.

[0053] The ice block separation process from the refrigeration body 4 is ice separation. The ice separation can directly cut off the power supply of the semiconductor refrigerator 1. At this time, the heat of the hot end 12 is reversely transmitted to the cold end 11, and then to the refrigeration body 4. The contact surface between the ice block and the refrigeration body 4 is melted, so as to separate the ice block from the refrigeration body 4. The ice block separated from the refrigeration body 4 is supported by the ice box 5.

[0054] The ice separation can also adopt the method of inverting the positive and negative polarities of the direct current input of the semiconductor refrigerator 1. The semiconductor refrigerator 1 changes from refrigeration to heating state. The heat is transmitted from the semiconductor refrigerator 1 to the refrigeration body 4. The surface of the ice block in contact with the refrigeration body 4 is melted, so as to separate the ice block from the refrigeration body 4. The ice block separated from the refrigeration body 4 is supported by the ice box 5.

[0055] Based on the above two ice separation methods, after the ice block is separated from the refrigeration body, it is supported by the ice box 5. The user can take the ice box 5 from the refrigeration body 4 to realize ice taking.

[0056] Please refer to Figure 6 and Figure 7 The ice box 5 is provided with a protrusion 51.

[0057] Specifically, to accelerate the ice block from the refrigeration body 4, the ice box 5 can be provided with protrusions 51 corresponding to the grooves 44, that is, one ice block corresponds to one protrusion 51. The protrusions 51 are preferably arranged at the center of the ice block. The arrangement of the protrusions 51 makes the ice block and the ice box 5 better integrated, and the ice box 5 is easier to separate the ice block from the refrigeration body 4 after the ice making is completed.

[0058] The ice box 5 is made of rubber or plastic material, which is easier to deform and make the ice block quickly separate from the ice box 5.

[0059] Please refer to Figure 6 , the first protrusion 42 is further provided with an exhaust groove 45.

[0060] Specifically, because the ice block has a large bonding area with the refrigeration body 4 (mainly considering the ice making speed), although the bonding surface of the ice block with the refrigeration body 4 is melted, the ice block still cannot be separated from the refrigeration body 4 due to the closed tension formed between the ice block and the peripheral wall of the refrigeration body 4. To balance the requirements of ice making speed and ice separation, the first protrusion 42 is provided with an exhaust groove 45, so that the first protrusion 42 forms a non-fully closed structure, which destroys the closed tension formed between the ice block and the peripheral wall of the refrigeration body 4, and finally makes the ice block more easily separated.

[0061] Please refer to Figure 2 and Figure 3 , the fan 3 is arranged at the end of the heat dissipation fin 21 of the heat sink 2.

[0062] Specifically, the direction of the fan 2 is consistent with the direction of the semiconductor ice maker 1 towards the heat sink 2, so that most of the heat near the heat sink 2 is taken away by the fan 3 to increase the heat dissipation of the heat sink 2.

[0063] The semiconductor ice maker 100 further comprises a temperature sensor (not shown in the figure) arranged on the refrigeration body 4. The temperature sensor is used to sense the temperature of the refrigeration body 4, the ice block or the ice box 5. When the temperature sensor measures that the temperature of the refrigeration body 4, the ice block or the ice box 5 reaches a set temperature threshold, it can prompt the ice making to be completed. The temperature sensor is electrically connected with the control circuit board. Through program control, the made ice block can be selected to separate from the refrigeration body 4 or enter a cold preservation state to keep the ice block in a frozen state.

[0064] Please refer to Figure 1 and Figure 2 , the ice maker 100 further comprises a machine body shell 6.

[0065] Specifically, the machine body shell 6 encloses to form an installation cavity 63, the semiconductor refrigerator 1, the radiator 2, the fan 3, the refrigeration body 4, the ice box 5 and the control circuit board (not shown in the figure) are all arranged in the installation cavity 63. The top of the machine body shell 6 is provided with a perforation 61 corresponding to the fan 3, so that the hot air output by the fan 3 can be discharged to the outside of the machine body shell 6 through the perforation 61.

[0066] The machine body shell 6 further comprises an ice taking cabin door 62, after the ice making is completed, the cabin door is unscrewed, then the ice box 5 is separated from the refrigeration body 4, and the ice block can be taken out.

[0067] In summary, the application provides an ice maker 100, in the application, the radiator 2 is arranged at the hot end 12 of the semiconductor refrigerator 1, and the refrigeration body 3 is arranged at the cold end 11 of the semiconductor refrigerator 1. Since the hot end 12 is located above the cold end 11, when the ice maker 100 works, under the action of the semiconductor refrigerator 1, the heat is transmitted upwards, and the cold is transmitted downwards, which conforms to the natural conduction law of cold and heat, is beneficial to the conduction of cold and heat, reduces the conduction thermal resistance of the cold end 11 cold and the hot end 12 heat of the semiconductor refrigerator 1, improves the conduction efficiency, and thus improves the ice making effect.

[0068] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the application.

[0069] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0070] In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", "fixing", and the like are to be construed in a broad sense, for example, they can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection via an intermediate medium; can be internal connection of two elements, or interaction between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0071] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0072] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.

[0073] Of course, the above description of the embodiments of the present application is more detailed, but it cannot be understood as a limitation on the protection scope of the present application. The present application can have other various implementations. Based on the present implementation, other implementations obtained by those skilled in the art without any creative labor are within the scope of protection of the present application. The protection scope of the present application is subject to the appended claims.

Claims

1. An ice maker comprising: The body shell, fan, radiator, semiconductor refrigerator, refrigeration body, ice box and control circuit board are characterized in that the radiator is located at the upper end of the semiconductor refrigerator and is combined with the hot end surface of the semiconductor refrigerator, the refrigeration body is located at the lower end of the semiconductor refrigerator and is combined with the cold end surface of the semiconductor refrigerator, the cold end surface is located below the hot end surface, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan. The refrigeration body is composed of a base plate and a first protruding part; the side wall surface of the first protruding part forms a groove, and the first protruding part is provided with an exhaust groove; the ice box is located below the refrigeration body, the ice box is provided with a protrusion, and the ice box and the refrigeration body are buckled to seal the groove and form a hollow space.

2. The ice maker of claim 1, wherein, The average transverse width of the groove is 10-25 mm.

3. The ice maker of claim 1, wherein, The groove is provided with a second protruding part.

4. The ice maker of claim 3, wherein, The height ratio of the second protruding part to the first protruding part is 0.3-0.

95.

5. The ice maker of claim 1, wherein, The ice maker further comprises: A temperature sensor is arranged on the refrigeration body and is electrically connected with the control circuit board.

6. The ice maker of claim 1, wherein, The refrigeration body is detachably connected with the semiconductor refrigerator.

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