Electromagnetic field composite probe

Abstract

The application relates to an electromagnetic field composite probe. The probe comprises a first grounding layer, a first signal layer, a second signal layer and a second grounding layer which are sequentially stacked; the first signal layer comprises a first electromagnetic field coil; the second signal layer comprises a second electromagnetic field coil; the probe further comprises a first metal through hole and a second metal through hole which are respectively connected with a second side of the first electromagnetic field coil along a first direction and a second side of the second electromagnetic field coil along the first direction; the first metal through hole and the second metal through hole are used for jointly surrounding a third side of the first electromagnetic field coil along a second direction and a third side of the second electromagnetic field coil along the second direction to form an electric field induction area; and the electric field induction area is used for inducing a first electric signal generated by an external electric field along the first direction. Therefore, the probe in the application can accurately detect the electric field in the space because the area of the electric field induction area is larger than that of a traditional electric field probe.

Description

Technical Field

[0001] This application relates to the field of electromagnetic detection technology, and in particular to an electromagnetic field composite probe. Background Technology

[0002] With the rapid development of integrated circuit technology, the integration density of chips is becoming increasingly higher. This increased integration density leads to a greater number of components per unit area within the chip, resulting in a more complex electromagnetic environment around the chip. Furthermore, electromagnetic interference can occur between the various components within the chip. Therefore, to assess the electromagnetic reliability of a chip, it is necessary to capture the electric and magnetic field signals radiated by the chip for reliability analysis. Thus, how to detect the electric and magnetic field signals radiated by a chip is a problem that needs to be solved.

[0003] In traditional techniques, an electric field probe is placed at the very tip of the probe to detect the electric field in space.

[0004] However, with traditional techniques, the electric field probe needs to be placed outside the shielding layer to detect the electric field, and the electric field sensing area of ​​the probe is too small, so it is affected by the magnetic field in space, resulting in inaccurate electric field detection. Summary of the Invention

[0005] Therefore, it is necessary to provide an electromagnetic field composite probe that can accurately detect the electric and magnetic field signals radiated by the chip, in order to address the above-mentioned technical problems.

[0006] An electromagnetic field composite probe includes a first ground layer, a first signal layer, a second signal layer, and a second ground layer stacked sequentially. The first signal layer includes a first electromagnetic field coil; the second signal layer includes a second electromagnetic field coil. The probe further includes: a first metal through-hole connected to a first side of the first electromagnetic field coil along a first direction and a first side of the second electromagnetic field coil along a first direction, respectively; and a second metal through-hole connected to a second side of the first electromagnetic field coil along a first direction and a second side of the second electromagnetic field coil along a first direction, respectively, wherein the first and second sides of the first electromagnetic field coil are opposite to each other, and the first and second sides of the second electromagnetic field coil are opposite to each other. The first and second metal through-holes, together with a third side of the first and second electromagnetic field coils along a second direction, form an electric field sensing region, which is used to sense a first electrical signal generated by an external electric field along a first direction, wherein the first and second directions are perpendicular.

[0007] In one embodiment, the first electromagnetic field coil forms a first magnetic field sensing region, which is used to sense a second electrical signal generated by an external magnetic field along a third direction; the second electromagnetic field coil forms a second magnetic field sensing region, which is used to sense a third electrical signal generated by an external magnetic field along a third direction, wherein the third direction is perpendicular to both the first and second directions; both the first and second grounding layers have opening regions, and the orthographic projections of the first and second magnetic field sensing regions onto the first and second grounding layers are within the range of the opening regions.

[0008] In one embodiment, the first metal through-hole is used to form a third magnetic field sensing region together with the first side of the first electromagnetic field coil and the first side of the second electromagnetic field coil, the third magnetic field sensing region being used to sense a fourth electrical signal generated by an external magnetic field along a second direction; the second metal through-hole is used to form a fourth magnetic field sensing region together with the second side of the first electromagnetic field coil and the second side of the second electromagnetic field coil, the fourth magnetic field sensing region being used to sense a fifth electrical signal generated by an external magnetic field along a second direction.

[0009] In one embodiment, the first signal layer further includes a first stripline and a second stripline, and the second signal layer further includes a third stripline and a fourth stripline. The probe further includes: a first conversion via, a first coaxial connector, a second conversion via, a second coaxial connector, a third conversion via, a third coaxial connector, a fourth conversion via, and a fourth coaxial connector. The first conversion via is used to connect the first signal layer and the first ground layer or the second ground layer. A first end of the first stripline is connected to a first side of the first electromagnetic field coil, and a second end of the first stripline is connected to a first end of the first coaxial connector through the first conversion via. The second conversion via is used to connect the first signal layer and the first ground layer or the second ground layer. The second stripline... The first end of the line is connected to the second side of the first electromagnetic field coil, and the second end of the second strip line is connected to the first end of the second coaxial connector through the second conversion through hole; the third conversion through hole is used to connect the second signal layer and the first ground layer or the second ground layer, the first end of the third strip line is connected to the first side of the second electromagnetic field coil, and the second end of the third strip line is connected to the first end of the third coaxial connector through the third conversion through hole; the fourth conversion through hole is used to connect the second signal layer and the first ground layer or the second ground layer, the first end of the fourth strip line is connected to the second side of the second electromagnetic field coil, and the second end of the fourth strip line is connected to the first end of the fourth coaxial connector through the fourth conversion through hole.

[0010] In one embodiment, the probe further includes: a measuring device, connected to the second end of the first coaxial connector, the second end of the second coaxial connector, the second end of the third coaxial connector, and the second end of the fourth coaxial connector, respectively, for determining the strength of the external magnetic field along a third direction, the strength of the external magnetic field along a second direction, and the strength of the external electric field along a first direction based on the first electrical signal, the second electrical signal, the third electrical signal, the fourth electrical signal, and the fifth electrical signal.

[0011] In one embodiment, the first conversion via includes a first signal via and a plurality of first surrounding ground vias at a preset distance around the first signal via, and the second end of the first stripline is connected to the first end of the first coaxial connector through the conductive wall of the first signal via; the second conversion via includes a second signal via and a plurality of second surrounding ground vias at the preset distance around the second signal via, and the second end of the second stripline is connected to the first end of the second coaxial connector through the conductive wall of the second signal via; the third conversion via includes a third signal via and a plurality of third surrounding ground vias at a preset distance around the third signal via, and the second end of the third stripline is connected to the first end of the third coaxial connector through the conductive wall of the third signal via; the fourth conversion via includes a fourth signal via and a plurality of fourth surrounding ground vias at the preset distance around the fourth signal via, and the second end of the fourth stripline is connected to the first end of the fourth coaxial connector through the conductive wall of the fourth signal via.

[0012] In one embodiment, the total transmission characteristic impedance of the first stripline, the first conversion via, the first coaxial connector, the second stripline, the second conversion via, the second coaxial connector, the third stripline, the third conversion via, the third coaxial connector, the fourth stripline, the fourth conversion via, and the fourth coaxial connector is all 50 ohms.

[0013] In one embodiment, the first magnetic field sensing region and the second magnetic field sensing region have the same shape and area, and their central axes are collinear.

[0014] In one embodiment, the third magnetic field sensing region and the fourth magnetic field sensing region have the same shape and area, and their central axes are collinear.

[0015] In one embodiment, the probe further includes: a plurality of coaxial through holes, each of the coaxial through holes penetrating each of the ground layer and the signal layer, for fixing the first ground layer, the first signal layer, the second signal layer, and the second ground layer.

[0016] The aforementioned electromagnetic field composite probe, by setting a first ground layer, a first signal layer, a second signal layer, and a second ground layer stacked sequentially, obtains the basic structure of a magnetic field probe. The first signal layer includes a first electromagnetic field coil, the second signal layer includes a second electromagnetic field coil, and the probe also includes a first metal through-hole and a second metal through-hole. The first metal through-hole is connected to a first side of the first electromagnetic field coil along a first direction and the first side of the second electromagnetic field coil along a first direction, respectively. The second metal through-hole is connected to a second side of the first electromagnetic field coil along a first direction and the second side of the second electromagnetic field coil along a first direction, respectively. Thus, the first metal through-hole, the second metal through-hole, the first electromagnetic field coil, and the second electromagnetic field coil together form an electric field induction region. This electric field induction region is perpendicular to a first direction in space, thereby enabling the induction of a first electrical signal generated by an external electric field along the first direction. Therefore, the probe in this application, because the area of ​​its electric field induction region is larger than that of a traditional electric field probe, can accurately detect the electric field in space. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the electromagnetic field composite probe in one embodiment;

[0019] Figure 2 This is a partial structural schematic diagram of the top view of an electromagnetic field composite probe in one embodiment;

[0020] Figure 3 This is a partial structural schematic diagram of the front view of an electromagnetic field composite probe in one embodiment;

[0021] Figure 4 This is a partial structural schematic diagram of the right side view of an electromagnetic field composite probe in one embodiment;

[0022] Figure 5 This is a partial structural schematic diagram of the left side view of an electromagnetic field composite probe in one embodiment;

[0023] Figure 6This is a partial structural schematic diagram of the conversion via in one embodiment;

[0024] Figure 7 This is a schematic diagram of the connection between the measuring device and the probe in one embodiment;

[0025] Figure 8 This is a schematic diagram of the equivalent structure of a magnetic field detection coil in one embodiment.

[0026] Explanation of reference numerals in the attached figures: 10-First ground layer, 20-First signal layer, 30-Second signal layer, 40-Second ground layer, 21-First electromagnetic field coil, 210-First side of the first electromagnetic field coil, 211-Second side of the first electromagnetic field coil, 31-Second electromagnetic field coil, 310-First side of the second electromagnetic field coil, 311-Second side of the second electromagnetic field coil, 50-First metal via, 51-Second metal via, 100-Electric field sensing area, 200-First magnetic field sensing area, 300 - Second magnetic field sensing area, 400 - Opening area, 500 - Third magnetic field sensing area, 600 - Fourth magnetic field sensing area, 61 - First stripline, 62 - First conversion through hole, 63 - Second stripline, 64 - Second conversion through hole, 65 - Third stripline, 66 - Third conversion through hole, 67 - Fourth stripline, 68 - Fourth conversion through hole, 70 - Measuring device, 80 - Coaxial through hole, 71 - First coaxial connector, 72 - Second coaxial connector, 73 - Third coaxial connector, 74 - Fourth coaxial connector. Detailed Implementation

[0027] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0030] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0031] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is transmission of electrical signals or data between the connected objects.

[0032] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0033] In one embodiment, such as Figure 1 As shown, an electromagnetic field composite probe is provided, comprising a first ground layer 10, a first signal layer 20, a second signal layer 30, and a second ground layer 40 stacked sequentially. The first signal layer 20 includes a first electromagnetic field coil 21, and the second signal layer 30 includes a second electromagnetic field coil 31. The probe also includes a first metal through-hole 50 and a second metal through-hole 51. Wherein:

[0034] The first metal through hole 50 is connected to the first side of the first electromagnetic field coil 21 along the first direction and the first side of the second electromagnetic field coil 31 along the first direction, respectively.

[0035] The second metal through hole 51 is connected to the second side of the first electromagnetic field coil 21 along the first direction and the second side of the second electromagnetic field coil 31 along the first direction, respectively. The first side 210 and the second side of the first electromagnetic field coil 21 are opposite to each other, and the first side 310 and the second side of the second electromagnetic field coil 31 are opposite to each other.

[0036] Specifically, such as Figure 2 As shown, the first metal through hole 50 is connected to the first side of the first electromagnetic field coil 21 along the first direction and the first side of the second electromagnetic field coil 31 along the first direction, respectively. The second metal through hole 51 is connected to the second side of the first electromagnetic field coil 21 along the first direction and the second side of the second electromagnetic field coil 31 along the first direction, respectively. The first side 210 and the second side of the first electromagnetic field coil 21 are opposite to each other, and the first side 310 and the second side of the second electromagnetic field coil 31 are opposite to each other.

[0037] Specifically, the first metal through hole 50 and the second metal through hole 51 are both hollow metal pillars. The first metal through hole 50 and the second metal through hole 51 both penetrate the first electromagnetic field coil 21 and the second electromagnetic field coil 31, and play a conductive role through their own conductive sidewalls.

[0038] The first metal through hole 50 and the second metal through hole 51 are used together with the third side of the first electromagnetic field coil 21 along the second direction and the third side of the second electromagnetic field coil 31 along the second direction to form an electric field sensing region 100. The electric field sensing region 100 is used to sense a first electrical signal generated by an external electric field along the first direction, wherein the first direction and the second direction are perpendicular.

[0039] Specifically, the first electrical signal generated by the external electric field is determined by the following formula:

[0040]

[0041] Wherein, I1 is the first electrical signal generated by the external electric field along the first direction, E1 is the intensity of the external electric field along the first direction, d1 is the length of the part of the electric field induction region 100 perpendicular to the direction of the external electric field intensity, and R1 is the resistance value of the first metal through hole 50, the second metal through hole 51, the first electromagnetic field coil 21, and the second electromagnetic field coil 31.

[0042] Specifically, such as Figure 3 The diagram shows an electromagnetic field coincidence probe along the first direction, in which the electric field induction region 100 is formed by the first electromagnetic field coil 21, the second electromagnetic field coil 31, the first metal through hole 50, and the second metal through hole 51.

[0043] Specifically, the through-holes mentioned in this application are holes that pass through the entire printed circuit board and can be used to realize internal interconnection or as mounting and positioning holes for components. A layer of metal can be plated on the cylindrical surface of the hole wall by chemical deposition to connect the copper foils of the intermediate layers that need to be connected, which can serve the functions of electrical connection, fixing or positioning devices.

[0044] In this embodiment, the basic structure of the magnetic field probe is obtained by setting a first ground layer 10, a first signal layer 20, a second signal layer 30, and a second ground layer 40 stacked sequentially. The first signal layer 20 includes a first electromagnetic field coil 21, the second signal layer 30 includes a second electromagnetic field coil 31, and the probe also includes a first metal through-hole 50 and a second metal through-hole 51. The first metal through-hole 50 is connected to a first side of the first electromagnetic field coil 21 along a first direction and to a first side of the second electromagnetic field coil 31 along a first direction, respectively. The second metal through-hole 51 is connected to the first... Electromagnetic field coil 21 and second electromagnetic field coil 31 are connected along the second side of the first direction, thereby forming an electric field sensing region 100 through the first metal through hole 50, the second metal through hole 51, the first electromagnetic field coil 21, and the second electromagnetic field coil 31. The electric field sensing region 100 is perpendicular to the first direction in space, thereby being able to sense the first electrical signal generated by the electric field in the outside along the first direction. Therefore, the probe in this application can accurately detect the electric field in space because the area of ​​the electric field sensing region 100 is larger than that of a traditional electric field probe.

[0045] In one embodiment, please refer to... Figure 1 and Figure 2 The first electromagnetic field coil 21 forms a first magnetic field sensing region 200, which is used to sense the second electrical signal generated by the external magnetic field along a third direction.

[0046] Specifically, the first electromagnetic field coil 21 forms a first magnetic field induction region 200, which can convert the magnetic field passing through the first magnetic field induction region 200 into an electrical signal.

[0047] Specifically, the second electrical signal is determined using the following formula:

[0048]

[0049] Wherein, I2 is the second electrical signal, B2 is the strength of the external magnetic field along the first direction, S2 is the area of ​​the first magnetic field induction region 200, and R2 is the resistance value of the first electromagnetic field coil 21.

[0050] The second electromagnetic field coil 31 forms a second magnetic field sensing region 300. The second magnetic field sensing region 300 is used to sense a third electrical signal generated by an external magnetic field along a third direction, wherein the third direction is perpendicular to both the first and second directions.

[0051] Specifically, the second electromagnetic field coil 31 forms a second magnetic field induction region 300, which can convert the magnetic field passing through the second magnetic field induction region 300 into an electrical signal.

[0052] Specifically, the third electrical signal is determined using the following formula:

[0053]

[0054] Wherein, I3 is the third electrical signal, B3 is the strength of the external magnetic field along the third direction, S3 is the area of ​​the second magnetic field induction region 300, and R3 is the resistance value of the second electromagnetic field coil 31.

[0055] Both the first grounding layer 10 and the second grounding layer 40 have an opening region 400. The orthographic projections of the first magnetic field induction region 200 and the second magnetic field induction region 300 on the first grounding layer 10 and the second grounding layer 40 are within the range of the opening region 400.

[0056] Specifically, the first grounding layer 10 and the second grounding layer 40 are shielding layers used to shield the influence of external interference signals on the transmitted electrical signals, that is, to shield the influence of external interference signals on the signals on the transmission line. The opening area 400 ensures that the first grounding layer 10 and the second grounding layer 40 do not block the magnetic field sensing area, thus not blocking the external magnetic field from passing through the magnetic field sensing area, allowing the magnetic field sensing area to successfully detect the magnetic field.

[0057] For example, the first magnetic field sensing region 200 and the second magnetic field sensing region 300 have the same shape and area, and their central axes are collinear, so that the first magnetic field sensing region 200 and the second magnetic field sensing region 300 can be completely superimposed to obtain the maximum magnetic field gain.

[0058] In this embodiment, the first electromagnetic field coil 21 and the second electromagnetic field coil 31 respectively form a first magnetic field sensing region 200 and a second magnetic field sensing region 300, thereby enabling the sensing of a magnetic field in space along a third direction. Furthermore, the first magnetic field sensing region 200 and the second magnetic field sensing region 300 are superimposed to jointly sense the magnetic field in the third direction, thereby providing greater gain for the electrical signal generated by the external magnetic field along the third direction and enabling the detection of weaker magnetic field signals.

[0059] In one embodiment, such as Figure 4 As shown, the first metal through hole 50 is used to form a third magnetic field sensing region 500 together with the first side 210 of the first electromagnetic field coil 21 and the first side 310 of the second electromagnetic field coil 31. The third magnetic field sensing region 500 is used to sense the fourth electrical signal generated by the external magnetic field along the second direction.

[0060] Specifically, the first metal through hole 50, together with the first side 210 of the first electromagnetic field coil 21 and the first side 310 of the second electromagnetic field coil 31, form a third magnetic field sensing region 500. The third magnetic field sensing region 500 is perpendicular to the magnetic field in the second direction, thereby enabling the sensing of a fourth electrical signal generated by the external magnetic field along the second direction.

[0061] like Figure 5 As shown, the second metal through hole 51 is used to form a fourth magnetic field sensing region 600 together with the second side 211 of the first electromagnetic field coil 21 and the second side 311 of the second electromagnetic field coil 31. The fourth magnetic field sensing region 600 is used to sense the fifth electrical signal generated by the external magnetic field along the second direction.

[0062] Specifically, the second metal through hole 51, together with the second side 211 of the first electromagnetic field coil 21 and the second side 311 of the second electromagnetic field coil 31, form a fourth magnetic field sensing region 600. The fourth magnetic field sensing region 600 is perpendicular to the magnetic field in the second direction, thereby enabling the sensing of a fifth electrical signal generated by the external magnetic field along the second direction.

[0063] Specifically, the second direction is perpendicular to the third direction, so that the probe in this application can simultaneously detect magnetic fields in two orthogonally perpendicular directions.

[0064] For example, the third magnetic field sensing region 500 and the fourth magnetic field sensing region 600 have the same shape and area, and their central axes are collinear, so that the third magnetic field sensing region 500 and the fourth magnetic field sensing region 600 can be completely superimposed to obtain the maximum magnetic field gain.

[0065] In this embodiment, the third magnetic field sensing region 500 and the fourth magnetic field sensing region 600 are superimposed to jointly sense the magnetic field in the second direction, thereby having a greater gain for the electrical signal generated by the external magnetic field along the second direction and being able to detect weaker magnetic field signals.

[0066] In one embodiment, please see [link to previous article]. Figure 1 The first signal layer 20 also includes a first stripline 61 and a second stripline 63, and the second signal layer 30 also includes a third stripline 65 and a fourth stripline 67. The probe also includes a first conversion through-hole 62, a first coaxial connector, a second conversion through-hole 64, a second coaxial connector, a third conversion through-hole 66, a third coaxial connector, a fourth conversion through-hole 68, and a fourth coaxial connector.

[0067] The first conversion via 62 is used to connect the first signal layer 20 and the first ground layer 10 or the second ground layer 40. The first end of the first stripline 61 is connected to the first side 210 of the first electromagnetic field coil 21. The second end of the first stripline 61 is connected to the first end of the first coaxial connector through the first conversion via 62.

[0068] Specifically, the first conversion through-hole 62 passes through the first stripline 61 and the first ground layer 10 or the second ground layer 40, and the first coaxial connector is connected to the second end of the first stripline 61 through the first conversion through-hole 62, thereby enabling the electrical signal on the first stripline 61 to be exported.

[0069] For example, the first coaxial connector is a microwave high-frequency connector (Small A Type, or SMA) coaxial connector.

[0070] Specifically, the first conversion via 62 enables conduction between the stripline and the SAM coaxial connector through the conductive hole wall, which can transmit characteristic impedance matching, suppress signal attenuation, and reduce transmission resonance.

[0071] Specifically, such as Figure 6 As shown, the first conversion through-hole 62 includes a signal through-hole and a plurality of surrounding grounding through-holes that surround the signal through-hole at a preset distance. The second end of the first stripline 61 is connected to the first end of the first coaxial connector through the conductive hole wall of the signal through-hole.

[0072] Specifically, the total transmission characteristic impedance of the first stripline 61, the first conversion via 62, and the first coaxial connector is 50 ohms. Six surrounding ground vias are arranged in an array to compensate for impedance mismatch caused by the central signal via, ensuring a transmission characteristic impedance of 50 ohms and improving the probe's transmission efficiency. The impedance of the conductors is determined by factors such as the spacing between layers and the size and material of the conductors. This impedance can be calculated using commercially available software to determine the required design for the layer spacing, conductor size, and materials under a preset impedance. Through proper design, the characteristic impedance of the signal transmission section is made 50 ohms. Since the characteristic impedance of peripheral analysis devices is typically 50 ohms, this embodiment selects a characteristic impedance of 50 ohms to facilitate impedance matching with peripheral analysis devices and ensure low signal loss and low signal reflection during transmission.

[0073] The second conversion via 64 is used to connect the first signal layer 20 and the first ground layer 10 or the second ground layer 40. The first end of the second stripline 63 is connected to the second side 211 of the first electromagnetic field coil 21. The second end of the second stripline 63 is connected to the first end of the second coaxial connector through the second conversion via 64.

[0074] Specifically, the second conversion through-hole 64 passes through the second stripline 63 and the first ground layer 10 or the second ground layer 40, and the second coaxial connector is connected to the second end of the second stripline 63 through the second conversion through-hole 64, thereby enabling the electrical signal on the second stripline 63 to be exported.

[0075] For example, the structure of the second conversion via 64 is also as follows Figure 6 As shown, the second conversion via 64 includes a signal via and a plurality of surrounding ground vias that surround the signal via at a preset distance.

[0076] The third conversion via 66 is used to connect the second signal layer 30 and the first ground layer 10 or the second ground layer 40. The first end of the third stripline 65 is connected to the first side 310 of the second electromagnetic field coil 31. The second end of the third stripline 65 is connected to the first end of the third coaxial connector through the third conversion via 66.

[0077] Specifically, the third conversion through-hole 66 passes through the third stripline 65 and the first ground layer 10 or the second ground layer 40, and the third coaxial connector is connected to the second end of the third stripline 65 through the third conversion through-hole 66, thereby enabling the electrical signal on the third stripline 65 to be exported.

[0078] For example, the structure of the third conversion via 66 is also as follows. Figure 6 As shown, the third conversion via 66 includes a signal via and a plurality of surrounding ground vias that surround the signal via at a preset distance.

[0079] The fourth conversion via 68 is used to connect the second signal layer 30 and the first ground layer 10 or the second ground layer 40. The first end of the fourth stripline 67 is connected to the second side 311 of the second electromagnetic field coil 31. The second end of the fourth stripline 67 is connected to the first end of the fourth coaxial connector through the fourth conversion via 68.

[0080] Specifically, the fourth conversion through-hole 68 passes through the fourth stripline 67 and the first ground layer 10 or the second ground layer 40, and the fourth coaxial connector is connected to the second end of the fourth stripline 67 through the fourth conversion through-hole 68, thereby enabling the electrical signal on the fourth stripline 67 to be exported.

[0081] For example, the structure of the fourth transition via 68 is also as follows. Figure 6 As shown, the fourth conversion via 68 includes a signal via and a plurality of surrounding ground vias that surround the signal via at a preset distance.

[0082] In this embodiment, by setting up a signal transmission component, the electrical signals captured by the detection units of each magnetic field sensing area are transmitted out, and during the transmission process, the electrical signals are kept as free from interference as possible, and the transmission quality is improved.

[0083] In one embodiment, such as Figure 7 As shown, the electromagnetic field composite probe also includes: measuring device 70.

[0084] The measuring device 70 is connected to the second end of the first coaxial connector, the second end of the second coaxial connector, the second end of the third coaxial connector, and the second end of the fourth coaxial connector, respectively, and is used to determine the strength of the external magnetic field along the third direction, the strength of the external magnetic field along the second direction, and the strength of the external electric field along the first direction based on the first electrical signal, the second electrical signal, the third electrical signal, the fourth electrical signal, and the fifth electrical signal.

[0085] Specifically, the first conversion through-hole 62, the second conversion through-hole 64, the third conversion through-hole 66, and the fourth conversion through-hole 68 penetrate the grounding layer. The measuring device 70 is connected to the first conversion through-hole 62, the second conversion through-hole 64, the third conversion through-hole 66, and the fourth conversion through-hole 68 through the first coaxial connector 71, the second coaxial connector 72, the third coaxial connector 73, and the fourth coaxial connector 74, respectively, so as to obtain the electrical signals on the first stripline 61 (not shown in the figure), the second stripline 63 (not shown in the figure), the third stripline 65, and the fourth stripline 67.

[0086] For example, the measuring device 70 is a spectrum analyzer or a network analyzer. The measuring device 70 may be soldered with a microwave high-frequency connector (Small A Type, or SMA) coaxial connector, one end of which is connected to the stripline and the other end of which is connected to the measuring device 70.

[0087] Specifically, a calibration system for a magnetic field probe can be built using a network analyzer and a microstrip line. The microstrip line used for calibration can be considered an external standard that can be used to emit a standard field. This microstrip line can generate a certain quasi-TEM (Transverse Electric and Magnetic Field) radio frequency electric field. By scanning this standard in the Y direction (perpendicular to the microstrip line's routing direction) using a magnetic field probe, the spatial resolution of the magnetic field probe can be obtained. Specific scanning methods include: probing at different locations with the probe, detecting the field strength, and using a network analyzer to plot the field strength versus location, thus obtaining the spatial resolution. Furthermore, the probe's detection sensitivity can be calibrated by gradually decreasing the standard source magnetic signal. Using this calibration system and scanning method, the measurement results of the magnetic field probe can be calibrated.

[0088] Specifically, such as Figure 8 The diagram shows an equivalent schematic of the detection coil of the electromagnetic field composite probe in this application. The external electric field along the first direction is detected through the electric field sensing region 100; the external magnetic field along the third direction is detected through the first magnetic field sensing region 200 and the second magnetic field sensing region 300; and the external magnetic field along the second direction is detected through the third magnetic field sensing region 500 and the fourth magnetic field sensing region 600. Points A, B, C, and D in the diagram represent the four connection points between the measuring device 70 and the first electromagnetic field coil 21 and the second electromagnetic field coil 31, respectively.

[0089] When an external magnetic field in the second direction passes through the coil, according to the right-hand rule, a magnetic field will be induced in the coil as follows: Figure 8The electrical signal is directed in the direction indicated by the middle arrow, so that point A will generate an electrical signal in the negative first direction, point B will generate an electrical signal in the negative first direction, point C will generate an electrical signal in the positive first direction, and point D will generate an electrical signal in the positive first direction.

[0090] When an external magnetic field in a third direction passes through the coil, according to the right-hand rule, a magnetic field will be induced in the coil as shown in the figure. Figure 8 The electrical signal is directed in the direction indicated by the middle arrow, so that point A will generate an electrical signal in the positive first direction, point B will generate an electrical signal in the negative first direction, point C will generate an electrical signal in the positive first direction, and point D will generate an electrical signal in the negative first direction.

[0091] When an external electric field along the first direction passes through the coil, it will induce an electric field on the coil such as... Figure 8 The electrical signal is directed in the direction indicated by the middle arrow, so that point A will generate an electrical signal in the positive first direction, point B will generate an electrical signal in the positive first direction, point C will generate an electrical signal in the positive first direction, and point D will generate an electrical signal in the positive first direction.

[0092] Since the electric field induction area 100 is relatively large and not grounded, the electrical signal obtained due to external electric field induction cannot be ignored.

[0093] Therefore, the following relationship can be obtained:

[0094] V X =-V a -V b +V c +V d

[0095] V Y =V a -V b +V c -V d

[0096] V Z =V a +V b +V c +V d

[0097] Among them, V X V is the electrical signal generated by an external magnetic field in a second direction in space. Y V is the electrical signal generated by a third-direction external magnetic field in space. Z V is the electrical signal generated by the external electric field along the first direction in space. a V is the electrical signal obtained by measuring device 70 from point A. b V is the electrical signal obtained by measuring device 70 from point B.c V is the electrical signal obtained by measuring device 70 from point C. d The electrical signal obtained by measuring device 70 from point D.

[0098] In summary, the electrical signal at point A is the superposition of the electrical signal generated when the external magnetic field in the second direction in negative space passes through the coil, the electrical signal generated when the external magnetic field in the third positive direction passes through the coil, and the electrical signal generated when the external electric field in the first positive direction passes through the coil.

[0099] The electrical signal at point B is the superposition of the electrical signal generated when the external magnetic field in the second negative direction passes through the coil, the electrical signal generated when the external magnetic field in the third negative direction passes through the coil, and the electrical signal generated when the external electric field in the first positive direction passes through the coil.

[0100] The electrical signal at point C is the superposition of the electrical signal generated when the external magnetic field in the second positive direction passes through the coil, the electrical signal generated when the external magnetic field in the third positive direction passes through the coil, and the electrical signal generated when the external electric field in the first positive direction passes through the coil.

[0101] The electrical signal at point D is the superposition of the electrical signal generated when the external magnetic field in the second positive direction passes through the coil, the electrical signal generated when the external magnetic field in the third negative direction passes through the coil, and the electrical signal generated when the external electric field in the first positive direction passes through the coil.

[0102] By adding the electrical signals at point C and point D, and then subtracting the electrical signals at points A and B, the electrical signals generated by the external magnetic field in the second direction can be filtered out.

[0103] By adding the electrical signals at point A and point C, and then subtracting the electrical signals at points B and D, the electrical signals generated by the external magnetic field in the third direction can be filtered out.

[0104] Thus, the electrical signals at points A, B, C, and D are all superimposed to form the electrical signal generated by the external electric field in the first direction.

[0105] Then, by using the measuring device 70, the magnitudes of the corresponding magnetic and electric fields can be calculated based on the electrical signals.

[0106] In this embodiment, by setting up the measuring device 70, the strength of the external magnetic field along the third direction, the strength of the external magnetic field along the second direction, and the strength of the external electric field along the first direction can be determined based on the first electrical signal, the second electrical signal, the third electrical signal, the fourth electrical signal, and the fifth electrical signal.

[0107] In one embodiment, please continue to participate Figure 7The magnetic field probe also includes: multiple coaxial through holes 80.

[0108] Each coaxial through-hole 80 penetrates each ground layer and signal layer, and is used to fix the first ground layer 10, the first signal layer 20, the second signal layer 30, and the second ground layer 40.

[0109] In this embodiment, each coaxial through-hole 80 penetrates each layer of the probe and is used to fix the probe or to fix the probe to an external measuring device 70, thereby making the probe structure more stable.

[0110] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0111] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electromagnetic field composite probe, characterized by, It includes a first ground layer, a first signal layer, a second signal layer, and a second ground layer that are stacked sequentially. The first signal layer includes a first electromagnetic field coil, a first stripline, and a second stripline; The second signal layer includes a second electromagnetic field coil, a third stripline, and a fourth stripline; The probe also includes: The first metal through hole is connected to the first side of the first electromagnetic field coil along the first direction and the first side of the second electromagnetic field coil along the first direction, respectively; The second metal through hole is connected to the second side of the first electromagnetic field coil along the first direction and the second side of the second electromagnetic field coil along the first direction, respectively, wherein the first side and the second side of the first electromagnetic field coil are opposite to each other, and the first side and the second side of the second electromagnetic field coil are opposite to each other. The first metal through hole and the second metal through hole are used together with the third side of the first electromagnetic field coil along the second direction and the third side of the second electromagnetic field coil along the second direction to form an electric field sensing region. The electric field sensing region is used to sense a first electrical signal generated by an external electric field along the first direction, wherein the first direction and the second direction are perpendicular. The probe further includes: a first conversion through hole, a first coaxial connector, a second conversion through hole, a second coaxial connector, a third conversion through hole, a third coaxial connector, a fourth conversion through hole, and a fourth coaxial connector; The first conversion via is used to connect the first signal layer and the first ground layer or the second ground layer. The first end of the first stripline is connected to the first side of the first electromagnetic field coil, and the second end of the first stripline is connected to the first end of the first coaxial connector through the first conversion via. The second conversion via is used to connect the first signal layer and the first ground layer or the second ground layer. The first end of the second stripline is connected to the second side of the first electromagnetic field coil, and the second end of the second stripline is connected to the first end of the second coaxial connector through the second conversion via. The third conversion via is used to connect the second signal layer and the first ground layer or the second ground layer. The first end of the third stripline is connected to the first side of the second electromagnetic field coil, and the second end of the third stripline is connected to the first end of the third coaxial connector through the third conversion via. The fourth conversion via is used to connect the second signal layer and the first ground layer or the second ground layer. The first end of the fourth stripline is connected to the second side of the second electromagnetic field coil, and the second end of the fourth stripline is connected to the first end of the fourth coaxial connector through the fourth conversion via.

2. The probe of claim 1, wherein The first electromagnetic field coil forms a first magnetic field sensing region, which is used to sense a second electrical signal generated by an external magnetic field along a third direction. The second electromagnetic field coil forms a second magnetic field sensing region, which is used to sense a third electrical signal generated by an external magnetic field along a third direction, wherein the third direction is perpendicular to both the first direction and the second direction. Both the first grounding layer and the second grounding layer have open areas, and the orthographic projections of the first magnetic field induction area and the second magnetic field induction area onto the first grounding layer and the second grounding layer are both within the range of the open areas.

3. The probe of claim 2, wherein, The first metal through hole is used to form a third magnetic field sensing area together with the first side of the first electromagnetic field coil and the first side of the second electromagnetic field coil. The third magnetic field sensing area is used to sense a fourth electrical signal generated by an external magnetic field along the second direction. The second metal through-hole is used to form a fourth magnetic field sensing region together with the second side of the first electromagnetic field coil and the second side of the second electromagnetic field coil. The fourth magnetic field sensing region is used to sense a fifth electrical signal generated by an external magnetic field along the second direction.

4. The probe of claim 3, wherein, Also includes: The measuring device is connected to the second end of the first coaxial connector, the second end of the second coaxial connector, the second end of the third coaxial connector, and the second end of the fourth coaxial connector, respectively, and is used to determine the strength of the external magnetic field along the third direction, the strength of the external magnetic field along the second direction, and the strength of the external electric field along the first direction based on the first electrical signal, the second electrical signal, the third electrical signal, the fourth electrical signal, and the fifth electrical signal.

5. The probe according to claim 1, characterized in that, The first conversion via includes a first signal via and a plurality of first surrounding ground vias that surround the first signal via at a preset distance. The second end of the first stripline is connected to the first end of the first coaxial connector through the conductive hole wall of the first signal via. The second conversion via includes a second signal via and a plurality of second surrounding ground vias that surround the second signal via at the preset distance. The second end of the second stripline is connected to the first end of the second coaxial connector through the conductive hole wall of the second signal via. The third conversion via includes a third signal via and a plurality of third surrounding ground vias that surround the third signal via at a preset distance. The second end of the third stripline is connected to the first end of the third coaxial connector through the conductive hole wall of the third signal via. The fourth conversion via includes a fourth signal via and a plurality of fourth surrounding ground vias that surround the fourth signal via at the preset distance. The second end of the fourth stripline is connected to the first end of the fourth coaxial connector through the conductive hole wall of the fourth signal via.

6. The probe of claim 1, wherein, The total transmission characteristic impedance of the first stripline, the first conversion via, and the first coaxial connector, the total transmission characteristic impedance of the second stripline, the second conversion via, and the second coaxial connector, the total transmission characteristic impedance of the third stripline, the third conversion via, and the third coaxial connector, and the total transmission characteristic impedance of the fourth stripline, the fourth conversion via, and the fourth coaxial connector are all 50 ohms.

7. The probe of claim 2, wherein, The first magnetic field sensing region and the second magnetic field sensing region have the same shape and area, and their central axes are collinear.

8. The probe according to claim 3, characterized in that, The third magnetic field sensing region and the fourth magnetic field sensing region have the same shape and area, and their central axes are collinear.

9. The probe of any one of claims 1-8, wherein, Also includes: Multiple coaxial vias, each of which penetrates each of the ground layers and the signal layers, are used to fix the first ground layer, the first signal layer, the second signal layer, and the second ground layer.

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