Optical substrate and method for manufacturing the same

Abstract

The present disclosure provides an optical substrate and a method for manufacturing the same. The optical substrate includes a base layer, a spacer layer, a wavelength conversion unit, and a first packaging layer. The spacer layer is disposed on the base layer and includes a first spacer portion separated from an edge of the base layer. The wavelength conversion unit is disposed on the base layer and is adjacent to a side of the first spacer portion away from the edge. The first packaging layer is disposed on the spacer layer, the wavelength conversion unit, and a portion of the base layer not covered by the spacer layer and the wavelength conversion unit. The optical substrate and the method for manufacturing the same according to the embodiments of the present disclosure can reduce water vapor infiltration or improve reliability.

Description

Technical Field

[0001] The present disclosure relates to an optical substrate and a method for manufacturing the same, and more particularly to an optical substrate and a method for manufacturing the same that can reduce moisture infiltration or improve reliability. Background Art

[0002] Display panels are widely used in electronic devices such as mobile phones, televisions, monitors, tablet computers, automotive displays, wearable devices, and desktop computers. With the rapid development of electronic products, the demand for display quality on these products is becoming increasingly higher, driving the continuous improvement of electronic devices used for display to achieve more reliable display effects. Summary of the Invention

[0003] The present disclosure provides an optical substrate and a manufacturing method thereof, which can reduce moisture infiltration or improve reliability.

[0004] According to an embodiment of the present disclosure, an optical substrate includes a base layer, a spacer layer, a wavelength conversion unit, and a first encapsulation layer. The spacer layer is disposed on the base layer and includes a first spacer portion separated from an edge of the base layer. The wavelength conversion unit is disposed on the base layer and adjacent to a side of the first spacer portion that is away from the edge. The first encapsulation layer is disposed on the spacer layer, the wavelength conversion unit, and a portion of the base layer not covered by the spacer layer and the wavelength conversion unit.

[0005] According to an embodiment of the present disclosure, a method for manufacturing an optical substrate includes the following steps: providing a base layer; forming a spacer layer on the base layer; wherein the spacer layer has a first opening and a second opening; forming a wavelength conversion unit within the first opening; and forming a first encapsulation layer on the spacer layer, the wavelength conversion unit, and a portion of the base layer corresponding to the second opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure.

[0007] Figures 1A to 1E A partial cross-sectional schematic diagram of a method for manufacturing an optical substrate according to the first embodiment of the present disclosure;

[0008] Figures 2A to 2C A partial cross-sectional schematic diagram of a method for manufacturing an optical substrate according to a second embodiment of the present disclosure;

[0009] Figures 3A to 3C is a partial cross-sectional schematic diagram of a method for manufacturing an optical substrate according to a third embodiment of the present disclosure;

[0010] Figures 4A to 4C It is a partial cross-sectional schematic diagram of the manufacturing method of the optical substrate according to the fourth embodiment of the present disclosure.

[0011] Explanation of Figure Numbers

[0012] 100, 100a, 100b, 100c: optical substrate;

[0013] 110: basal layer;

[0014] 111, 1223, 143, 153, 191: edge;

[0015] 112: active zone;

[0016] 113: border area;

[0017] 114: cutting line;

[0018] 115, 115c, 152: part;

[0019] 120, 120b: separation layer;

[0020] 121, 121b: first partition

[0021] 1211, 125a: side

[0022] 1212, 1221, 131: top surface;

[0023] 1213: lateral surface;

[0024] 122: second partition;

[0025] 1222, 150a1, 150b1: lateral surface;

[0026] 123: third partition;

[0027] 124: First opening;

[0028] 125, 125b: second opening;

[0029] 130: wavelength conversion unit;

[0030] 140, 140b: first encapsulation layer;

[0031] 142: second encapsulation layer;

[0032] 150: black matrix layer;

[0033] 150a: first black matrix layer;

[0034] 150b: second black matrix layer;

[0035] 154, 154c: third opening;

[0036] 151: Opening;

[0037] 160: color filter layer;

[0038] 170: adhesive layer;

[0039] 180: driving substrate;

[0040] 190, 190c: light absorption unit;

[0041] T1, T2, T3, T4: thickness

[0042] W1, W2, W3: width. DETAILED DESCRIPTION

[0043] The present disclosure will be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of simplicity, many of the drawings in this disclosure depict only portions of electronic devices, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0044] In the following description and claims, the words “including” and “comprising” are open-ended words, and thus should be interpreted as meaning “including but not limited to…”.

[0045] It should be understood that when a component or film layer is referred to as being “on” or “connected to” another component or film layer, it may be directly on or directly connected to the other component or layer, or there may be intervening components or film layers between the two (indirect case). Conversely, when a component is referred to as being “directly on” or “directly connected to” another component or film layer, there may be no intervening components or film layers between the two.

[0046] While the terms "first," "second," "third," etc. may be used to describe various components, these terms are not intended to be limiting. These terms are used solely to distinguish a single component from other components within the specification. Claims may not use the same terms, but may be replaced with "first," "second," "third," etc., according to the order in which the components are declared in the claims. Thus, in the following description, the first component may be referred to as the second component in a claim.

[0047] In this document, the terms "about," "approximately," "substantially," and "roughly" generally mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The quantities given here are approximate quantities, that is, in the absence of specific descriptions of "about," "approximately," "substantially," or "roughly," the meanings of "about," "approximately," "substantially," or "roughly" may still be implied. In addition, the terms "range from a first value to a second value" and "range between a first value and a second value" mean that the range includes the first value, the second value, and other values ​​therebetween.

[0048] In some embodiments of the present disclosure, terms related to bonding and connection, such as "connect," "interconnect," and the like, unless otherwise specified, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, with another structure positioned between them. Furthermore, such terms related to bonding and connection may include situations where both structures are movable or both structures are fixed. Furthermore, the term "coupled" encompasses any direct and indirect electrical connection means.

[0049] In the present disclosure, the length, width, thickness, height, or area, or the distance or spacing between components, can be measured using an optical microscope (OM), a scanning electron microscope (SEM), an α-step thin film thickness profilometer, an ellipsometer, or other suitable methods. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional structural image of the component to be measured, and the width, thickness, height, or area of ​​each component, or the distance or spacing between components, can be measured, but the present invention is not limited to this. In addition, any two values ​​or directions used for comparison may have a certain error.

[0050] The optical substrate disclosed herein can be applied to electronic devices such as display devices, antenna devices (such as liquid crystal antennas), sensing devices, light-emitting devices, touch devices or splicing devices, but is not limited thereto. The electronic device may include a bendable or flexible electronic device. The appearance of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The display device may, for example, include a light emitting diode (LED), liquid crystal, fluorescence, phosphor, quantum dot (QD), other suitable materials or combinations thereof, but is not limited thereto. The light-emitting diode may, for example, include an organic light emitting diode (OLED), an inorganic light-emitting diode (inorganic light-emitting diode), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot (QD) light-emitting diode (QDLED), other suitable materials or any combination thereof, but is not limited thereto. The display device may also, for example, include a spliced ​​display device, but is not limited thereto. The antenna device may, for example, be a liquid crystal antenna, but is not limited thereto. The antenna device may, for example, include an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any of the aforementioned arrangements or combinations, but is not limited thereto. Furthermore, the electronic device may have a rectangular, circular, polygonal shape, a shape with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support the display device, antenna device, or splicing device. The following description of the present disclosure will use an optical substrate to illustrate the present disclosure, but the present disclosure is not limited thereto.

[0051] It should be noted that the following embodiments may be implemented by replacing, recombining, or combining features from several different embodiments to create other embodiments without departing from the spirit of the present disclosure. Features from various embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0052] Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0053] Figures 1A to 1E This is a partial cross-sectional diagram of the method for manufacturing the optical substrate of the first embodiment of the present disclosure. Figure 1E, the optical substrate 100 of this embodiment may include a base layer 110, a spacer layer (bank) 120, a wavelength conversion unit (wavelength conversion unit) 130 and a first packaging layer 140. The spacer layer 120 is disposed on the base layer 110, and the spacer layer 120 includes a first partition 121 separated from the edge 111 of the base layer 110. The wavelength conversion unit 130 is disposed on the base layer 110, and the wavelength conversion unit 130 is adjacent to a side 1211 of the first partition 121 away from the edge 111. The first packaging layer 140 is disposed on the spacer layer 120, the wavelength conversion unit 130 and a portion 115 of the base layer 110 that is not covered by the spacer layer 120 and the wavelength conversion unit 130. In the present disclosure, one component covering another component means that the two components overlap each other in the normal direction of the base layer 110.

[0054] The following describes a method for manufacturing the optical substrate 100 of this embodiment.

[0055] Please refer to Figure 1A First, a base layer 110 is provided. The base layer 110 may include an active area 112, a border area 113 and a cutting line 114. The cutting line 114 is arranged at the junction between the active area 112 and the border area 113. In this embodiment, the border area 113 is cut off in a subsequent cutting step, and the active area 112 is retained as part of the electronic device. In this embodiment, the base layer 110 may be, for example, a hard substrate, a soft substrate or a combination thereof. For example, the material of the base layer 110 may include glass, quartz, sapphire (sapphire), ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or a combination thereof, but is not limited thereto.

[0056] Next, before forming the separation layer 120 on the base layer 110, a black matrix layer 150 may be formed on the base layer 110. The black matrix layer 150 may have an opening 151 disposed in the active region 112. The opening 151 may expose a portion of the base layer 110. In some embodiments, the material of the black matrix layer 150 may include a light-absorbing material, such as black matrix (BM) or other suitable light-absorbing material, but is not limited thereto.

[0057] Next, a spacer layer 120 is formed on the base layer 110. In this embodiment, the spacer layer 120 is disposed on the black matrix layer 150 so that the black matrix layer 150 can be disposed between the base layer 110 and the spacer layer 120, and the spacer layer 120 can substantially overlap the black matrix layer 150 in the normal direction of the base layer 110. The spacer layer 120 can have a first spacer 121, a second spacer 122, a third spacer 123, a first opening 124, and a second opening 125. The first spacer 121, the second spacer 122, the first opening 124, and the second opening 125 are disposed in the active area 112, and the third spacer 123 is disposed in the border area 113. The cutting line 114 can also be disposed at the junction of the second spacer 122 and the third spacer 123.

[0058] Specifically, the first opening 124 may be connected to and overlap the opening 151 of the black matrix layer 150 so that the first opening 124 and the opening 151 may expose a portion of the base layer 110. The second opening 125 is disposed between the first partition 121 and the second partition 122. The second opening 125 may expose a portion 152 of the black matrix layer 150 so that the portion 152 of the black matrix layer 150 is not covered by the partition layer 120. The second opening 125 may be closer to the cutting line 114 of the base layer 110 than the first opening 124. In addition, the width W1 of the second opening 125 may be, for example, greater than or equal to 3 nanometers (nm) (i.e., W1≧3nm), but is not limited thereto. The width W1 is, for example, the maximum width of the second opening 125 measured along the extension direction of the partial cross-sectional schematic diagram, and the extension direction of the partial cross-sectional schematic diagram is perpendicular to the normal direction of the base layer 110.

[0059] The second partition 122 can be separated from the first partition 121 by a second opening 125. The second partition 122 can be closer to the cutting line 114 of the base layer 110 than the first partition 121. The width W2 of the second partition 122 can be, for example, greater than 0 nanometers (nm) (i.e., W2>0nm), but is not limited thereto. The width W2 is, for example, the maximum width of the second partition 122 measured along the extension direction of the partial cross-sectional schematic diagram. In addition, in this embodiment, the material of the partition layer 120 may include a light-absorbing material and / or a reflective material, such as a photoresist material (such as acrylic resin or siloxane), a black resin, a metal material, other suitable materials or a combination thereof, but is not limited thereto.

[0060] Next, please refer to Figure 1B, forming a color filter layer 160 within the opening 151, and forming a wavelength conversion unit 130 within the first opening 124. In this embodiment, the color filter layer 160 may cover the portion of the base layer 110 exposed by the opening 151. The color filter layer 160 may be disposed between the wavelength conversion unit 130 and the base layer 110. The color filter layer 160 may include, but is not limited to, a red filter layer, a green filter layer, a blue filter layer, or other suitable color filter layers. The color filter layer 160 may be formed within the opening 151 by, for example, a yellow photolithography process or an inkjet printing process (IJP), but is not limited to these.

[0061] In addition, in this embodiment, the wavelength conversion unit 130 may cover the color filter layer 160. The wavelength conversion unit 130 may be adjacent to a side 1211 of the first partition 121 away from the edge 111. The wavelength conversion unit 130 may include quantum dots, fluorescence, phosphorescence, other suitable materials or a combination of the foregoing, but is not limited thereto. The wavelength conversion unit 130 may be used to convert a first light provided by a light emitting unit (not shown) into a second light, the first light having a first peak wavelength, and the second light having a second peak wavelength, wherein the first peak wavelength is smaller than the second peak wavelength. The wavelength conversion unit 130 may be formed in the first opening 124 by a method such as a photolithography process or an inkjet printing process, but is not limited thereto.

[0062] Next, please refer to Figure 1C In a single process, a first encapsulation layer 140 is simultaneously formed on the spacer layer 120, the wavelength conversion unit 130, and the portion 115 of the base layer 110 corresponding to the second opening 125. Specifically, in this embodiment, the first encapsulation layer 140 may contact and cover the top surface 131 of the wavelength conversion unit 130, the first encapsulation layer 140 may contact and cover the top surface 1212 and side surfaces 1213 of the first spacer 121, and the first encapsulation layer 140 may contact and cover the top surface 1221 and side surfaces 1222 of the second spacer 122. The top surface 131 of the wavelength conversion unit 130 is the surface of the wavelength conversion unit 130 away from the base layer 110, the top surface 1212 of the first spacer 121 is the surface of the first spacer 121 away from the base layer 110, and the top surface 1221 of the second spacer 122 is the surface of the second spacer 122 away from the base layer 110. The side surface 1213 of the first partition 121 is a surface of the first partition 121 adjacent to the second opening 125 , and the side surface 1222 of the second partition 122 is a surface of the second partition 122 adjacent to the second opening 125 .

[0063] In this embodiment, the first packaging layer 140 with a water vapor barrier effect can simultaneously contact and cover the top surface 1212 and the side surface 1213 of the first partition 121 of the partition layer 120 through a one-time processing method, thereby reducing the infiltration problem caused by water vapor passing through the first partition 121, and further improving the reliability of the optical substrate 100 of this embodiment, especially for the optical substrate 100 containing the wavelength conversion unit 130 that is easily affected by external water vapor and fails, or for the splicing display (Zero Border Tiling Display) containing the optical substrate 100, but not limited to this.

[0064] In this embodiment, the second opening 125 of the partition layer 120, the portion 152 of the black matrix layer 150, and the portion 115 of the base layer 110 may overlap each other in the normal direction of the base layer 110, so that the first encapsulation layer 140 can contact and cover the portion 152 of the black matrix layer 150 through the second opening 125. In this embodiment, the material of the first encapsulation layer 140 may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ) and aluminum oxide (Al2O3), other transparent inorganic compounds with water vapor barrier properties, or combinations thereof, but not limited thereto. The first encapsulation layer 140 may be fabricated by, but not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), spin coating, spray coating, physical vapor deposition (PVD), inkjet printing, or other suitable coating processes.

[0065] Next, please refer to Figure 1D and Figure 1EAfter forming an adhesive layer 170 on the first encapsulation layer 140 and disposing a driving substrate 180 on the adhesive layer 170, the base layer 110, the black matrix layer 150, the separation layer 120, the first encapsulation layer 140, the adhesive layer 170, and the driving substrate 180 are cut along the cutting line 114. The cutting line 114 is adjacent to a side 125a of the second opening 125 away from the first opening 124, and the cutting line 114 does not overlap the second opening 125. In addition, in this embodiment, the material of the adhesive layer 170 may include optically clear adhesive (OCA), transparent optical clear resin (OCR), other suitable transparent materials, or a combination thereof, but is not limited thereto. In this embodiment, the driving substrate 180 may include driving circuits (not shown) such as transistors (TFTs), scan lines, and data lines, and a light-emitting unit (not shown), but is not limited thereto. Furthermore, in other embodiments, the base layer 110, the black matrix layer 150, the separation layer 120, and the first encapsulation layer 140 may be cut along the cutting lines 114 before forming the adhesive layer 170 on the first encapsulation layer 140 and disposing the driving substrate 180 on the adhesive layer 170. In the present disclosure, the cutting may be performed by a laser, a wheel knife, or an etching process, but is not limited thereto.

[0066] Next, please refer to Figure 1E After the base layer 110, the black matrix layer 150, the partition layer 120, the first encapsulation layer 140, the adhesive layer 170, and the driving substrate 180 are cut along the cutting lines 114, a second encapsulation layer 142 may be additionally formed on the edge 111 of the base layer 110 exposed after the cutting, the edge 153 of the black matrix layer 150 exposed after the cutting, the edge 1223 of the second partition 122 exposed after the cutting, and the edge 143 of the first encapsulation layer 140 exposed after the cutting, so that the second encapsulation layer 142 can cover the edge 111 of the base layer 110, the edge 153 of the black matrix layer 150, the edge 1223 of the second partition 122, and the edge 143 of the first encapsulation layer 140. In this way, the second packaging layer 142 with a water vapor barrier effect can also contact and cover the edge 153 of the black matrix layer 150 exposed after cutting, thereby reducing the infiltration problem caused by water vapor passing through the black matrix layer 150, and further improving the reliability of the optical substrate 100 of this embodiment.

[0067] However, because the thickness of the black matrix layer 150 (e.g., approximately 1 micron) is much smaller than the thickness of the second partition 122 (e.g., approximately 8 microns), the probability of moisture penetrating through the black matrix layer 150 is lower than that of the second partition 122. Therefore, in some embodiments, it is not necessary to additionally provide a second encapsulation layer to cover the edges of the black matrix layer exposed after cutting (not shown). The thickness of the black matrix layer 150 is, for example, the maximum thickness of the black matrix layer 150 measured along the normal direction of the base layer 110, and the thickness of the second partition 122 is, for example, the maximum thickness of the second partition 122 measured along the normal direction of the base layer 110.

[0068] In this embodiment, the first encapsulation layer 140 may contact the second encapsulation layer 142. The second partition 122 of the partition layer 120 may be closer to the edge 111 of the base layer 110 than the first partition 121. Thus, the optical substrate 100 of this embodiment has been completed.

[0069] The following examples are provided for illustration purposes only. It should be noted that the following examples share the same component numbers and some of the details as the previous examples, with the same numbers used to represent the same or similar components, and descriptions of the same technical details omitted. For the omitted details, please refer to the previous examples, and the following examples will not be repeated.

[0070] Figures 2A to 2C It is a partial cross-sectional schematic diagram of a method for manufacturing an optical substrate according to the second embodiment of the present disclosure. Figures 2A to 2C The second embodiment shown is Figures 1A to 1E The first embodiment shown is similar, therefore, the same components are denoted by the same reference numerals and their details will not be repeated. Figures 2A to 2C The second embodiment shown is Figures 1A to 1E The difference from the first embodiment shown is that in the optical substrate 100 a of this embodiment, the first encapsulation layer 140 may further contact and cover the side surface 150 a 1 of the first black matrix layer 150 a .

[0071] Specifically, please refer to Figure 2A , using a method similar to the above Figure 1A However, the manufacturing method of this embodiment is different from Figure 1AThe difference between the manufacturing method of the embodiment is that the manufacturing method of the present embodiment further includes: after forming the black matrix layer 150 on the base layer 110, patterning the black matrix layer 150 to form a third opening 154, a first black matrix layer 150a and a second black matrix layer 150b. Among them, the second opening 125 can be connected to and overlap with the third opening 154, so that the second opening 125 and the third opening 154 can expose a portion 115 of the base layer 110. In other words, the portion 115 of the base layer 110 is not covered by the partition layer 120 and the black matrix layer 150. The first black matrix layer 150a can be separated from the second black matrix layer 150b by the third opening 154. The second black matrix layer 150b can be closer to the cutting line 114 of the base layer 110 than the first black matrix layer 150a. In the present disclosure, patterning the black matrix layer 150 can be performed by a yellow light lithography process or a printing process, but is not limited thereto.

[0072] Next, please refer to Figure 2B , using a method similar to the above Figures 1B to 1C However, the manufacturing method of this embodiment is different from Figures 1B to 1C The difference between the manufacturing methods of the present embodiment and the present embodiment lies in that the first encapsulation layer 140 of this embodiment can also contact and cover the side surface 150a1 of the first black matrix layer 150a, the first encapsulation layer 140 can also contact and cover the side surface 150b1 of the second black matrix layer 150b, and the first encapsulation layer 140 can also contact the third opening 154 through the second opening 125 and cover the portion 115 of the base layer 110. The side surface 150a1 of the first black matrix layer 150a is the surface of the first black matrix layer 150a adjacent to the third opening 154, and the side surface 150b1 of the second black matrix layer 150b is the surface of the second black matrix layer 150b adjacent to the third opening 154.

[0073] In this embodiment, since the first encapsulation layer 140 with a water vapor barrier effect can also contact and cover the side surface 150a1 of the first black matrix layer 150a, it can also reduce the infiltration problem caused by water vapor passing through the first black matrix layer 150a, thereby further improving the reliability of the optical substrate 100a of this embodiment.

[0074] Furthermore, the fabrication method of this embodiment further includes forming a light absorbing unit 190 within the third opening 154 of the black matrix layer 150 after forming the first encapsulation layer 140 on the spacer layer 120, the wavelength conversion unit 130, and the portion 115 of the base layer 110. The light absorbing unit 190 can be formed within the third opening 154 by methods such as photolithography or inkjet printing (IJP). The light absorbing unit 190c can be disposed on the portion 115 of the base layer 110. The light absorbing unit 190 can be disposed between the first spacer 121 and the second spacer 122 of the spacer layer 120, and the first spacer 121 can be disposed between the light absorbing unit 190 and the wavelength conversion unit 130. In this embodiment, the thickness T1 of the light absorbing unit 190 can be, for example, greater than or equal to the thickness T2 of the black matrix layer 150 (i.e., T1 ≧ T2), but is not limited thereto. The thickness T1 is, for example, the maximum thickness of the light absorbing unit 190 measured along the normal direction of the base layer 110, and the thickness T2 is, for example, the maximum thickness of the black matrix layer 150 measured along the normal direction of the base layer 110. The material of the light absorbing unit 190 may include a light absorbing material, such as black resin, black ink, black glue, other suitable light absorbing materials, or combinations thereof, but is not limited thereto.

[0075] Next, please refer to Figure 2C , similar to the above Figures 1D to 1E The manufacturing method forms an adhesive layer 170 on the first packaging layer 140, arranges the driving substrate 180 on the adhesive layer 170, cuts the base layer 110, the black matrix layer 150, the partition layer 120, the first packaging layer 140, the adhesive layer 170 and the driving substrate 180 along the cutting line 114, and additionally forms a second packaging layer 142 as needed, so that the second packaging layer 142 can contact and cover the edge 111 of the base layer 110 exposed after cutting, the edge 153 of the second black matrix layer 150b exposed after cutting, the edge 1223 of the second partition 122 exposed after cutting, and the edge 143 of the first packaging layer 140 exposed after cutting. However, in some embodiments, it is not necessary to additionally set the second packaging layer 142. At this point, the optical substrate 100a of this embodiment has been completed. Furthermore, in other embodiments, the base layer 110 , the black matrix layer 150 , the separation layer 120 and the first encapsulation layer 140 may be cut along the cutting lines 114 before forming the adhesive layer 170 on the first encapsulation layer 140 and disposing the driving substrate 180 on the adhesive layer 170 .

[0076] Figures 3A to 3C It is a partial cross-sectional schematic diagram of a method for manufacturing an optical substrate according to the third embodiment of the present disclosure. Figures 3A to 3C The third embodiment shown is Figures 1A to 1E The first embodiment shown is similar, therefore, like components are denoted by like reference numerals and their details will not be repeated. Figures 3A to 3C The third embodiment shown is Figures 1A to 1E The difference from the first embodiment is that, in the manufacturing method of the optical substrate 100b of this embodiment, the partition layer 120b does not include the second partition portion, and the position of the second opening 125b of the partition layer 120b is different.

[0077] Specifically, please refer to Figure 3A , using a method similar to the above Figure 1A However, the manufacturing method of this embodiment is different from Figure 1A The difference in the manufacturing method is that when forming the separation layer 120b on the black matrix layer 150, the second opening 125b of the separation layer 120b is set at the junction between the active area 112 and the border area 113. That is, the second opening 125b is set between the first separation portion 121b and the third separation portion 123, and the third separation portion 123 can be separated from the first separation portion 121b by the second opening 125b. In this embodiment, the width W3 of the second opening 125b may be, for example, greater than or equal to 3 nanometers (i.e., W3≧3nm), but is not limited to this. Among them, the width W3 is, for example, the maximum width of the second opening 125b measured along the extension direction of the local cross-sectional schematic diagram. In addition, in this embodiment, in the normal direction of the base layer 110, the cutting line 114 may overlap with the second opening 125b.

[0078] Next, please refer to Figure 3B , similar to the above Figures 1B to 1C According to the manufacturing method, the color filter layer 160 is formed in the opening 151, the wavelength conversion unit 130 is formed in the first opening 124, and the first encapsulation layer 140b is formed on the partition layer 120b, the wavelength conversion unit 130, and the portion 152 of the black matrix layer 150. In this way, the first encapsulation layer 140b, which has a moisture barrier effect, can simultaneously contact and cover the top surface 1212 and the side surface 1213 of the first partition portion 121b of the partition layer 120, thereby reducing the problem of moisture infiltration caused by passing through the first partition portion 121b, thereby improving the reliability of the optical substrate 100b of this embodiment.

[0079] Next, please refer to Figure 3C , similar to the above Figures 1D to 1EAccording to the manufacturing method, an adhesive layer 170 is formed on the first packaging layer 140b, a driving substrate 180 is arranged on the adhesive layer 170, and after the base layer 110, the black matrix layer 150, the first packaging layer 140b, the adhesive layer 170 and the driving substrate 180 are cut along the cutting line 114, a second packaging layer 142 can be additionally formed on the edge 111 of the base layer 110 exposed after cutting, the edge 153 of the black matrix layer 150 exposed after cutting, and the edge 143 of the first packaging layer 140b exposed after cutting, as needed. Since the second packaging layer 142 can also contact and cover the edge 153 of the black matrix layer 150, it can also reduce the infiltration problem caused by water vapor passing through the black matrix layer 150, thereby further improving the reliability of the optical substrate 100b of this embodiment. At this point, the optical substrate 100b of this embodiment has been completed. Furthermore, in other embodiments, before forming the adhesive layer 170 on the first encapsulation layer 140 and disposing the driving substrate 180 on the adhesive layer 170 , the base layer 110 , the black matrix layer 150 and the first encapsulation layer 140 b may be cut along the cutting lines 114 .

[0080] Figures 4A to 4C It is a partial cross-sectional schematic diagram of the manufacturing method of the optical substrate according to the fourth embodiment of the present disclosure. Figures 4A to 4C The fourth embodiment shown is Figures 3A to 3C The third embodiment shown is similar, therefore, like components are denoted by like reference numerals and their details will not be repeated. Figures 4A to 4C The fourth embodiment shown is Figures 3A to 3C The difference of the third embodiment shown is that in the optical substrate 100 c of this embodiment, the first encapsulation layer 140 c may further contact and cover the side surface 150 a 1 of the first black matrix layer 150 a .

[0081] Specifically, please refer to Figure 4A , using a method similar to the above Figure 3A However, the manufacturing method of this embodiment is different from Figure 3A The difference between the manufacturing method of the embodiment is that the manufacturing method of the present embodiment further includes: after forming the black matrix layer 150 on the base layer 110, patterning the black matrix layer 150 to form a third opening 154c, a first black matrix layer 150a and a second black matrix layer 150b. Among them, the second opening 125b can be connected to and overlap with the third opening 154c, so that the second opening 125b and the third opening 154c can expose a portion 115c of the base layer 110 and the portion 115c of the base layer 110 is not covered by the black matrix layer 150. The first black matrix layer 150a can be separated from the second black matrix layer 150b by the third opening 154c. The first black matrix layer 150a is arranged in the active area 112, and the second black matrix layer 150b is arranged in the border area 113.

[0082] Next, please refer to Figure 4B , using a method similar to the above Figure 3B However, the manufacturing method of this embodiment is different from Figure 3B The difference between the manufacturing methods of the present embodiment and the present embodiment lies in that the first encapsulation layer 140 of this embodiment can also contact and cover the side surface 150a1 of the first black matrix layer 150a, the first encapsulation layer 140 can also contact and cover the side surface 150b1 of the second black matrix layer 150b, and the first encapsulation layer 140c can also contact the third opening 154c through the second opening 125b and cover the portion 115c of the base layer 110. The side surface 150a1 of the first black matrix layer 150a is the surface of the first black matrix layer 150a adjacent to the third opening 154c, and the side surface 150b1 of the second black matrix layer 150b is the surface of the second black matrix layer 150b adjacent to the third opening 154c.

[0083] In this embodiment, since the first encapsulation layer 140 with a water vapor barrier effect can also contact and cover the side surface 150a1 of the first black matrix layer 150a, it can also reduce the infiltration problem caused by water vapor passing through the first black matrix layer 150a, thereby further improving the reliability of the optical substrate 100c of this embodiment.

[0084] Furthermore, the fabrication method of this embodiment further includes: after forming the first encapsulation layer 140c on the spacer layer 120b, the wavelength conversion unit 130, and the portion 115c of the base layer 110, forming a light absorbing unit 190c within the third opening 154c of the black matrix layer 150. The light absorbing unit 190c may be disposed on the portion 115c of the base layer 110, between the first spacer 121b and the third spacer 123 of the spacer layer 120, on a side of the first spacer 121b adjacent to the edge 111, and between the first spacer 121b and the wavelength conversion unit 130. In this embodiment, the thickness T3 of the light absorbing unit 190c may be, for example, greater than or equal to the thickness T4 of the black matrix layer 150 (i.e., T3≧T4), but is not limited thereto. The thickness T3 is, for example, the maximum thickness of the light absorbing unit 190 c measured along the normal direction of the base layer 110 , and the thickness T4 is, for example, the maximum thickness of the black matrix layer 150 measured along the normal direction of the base layer 110 .

[0085] Next, please refer to Figure 4C , similar to the above Figure 3CThe manufacturing method is to form an adhesive layer 170 on the first packaging layer 140c, set the driving substrate 180 on the adhesive layer 170, cut the base layer 110, the first packaging layer 140c, the light absorption unit 190c, the adhesive layer 170 and the driving substrate 180 along the cutting line 114, and additionally form a second packaging layer 142 as needed, so that the second packaging layer 142 can contact and cover the edge 111 of the base layer 110 exposed after cutting, the edge 143 of the first packaging layer 140c exposed after cutting, and the edge 191 of the light absorption unit 190c exposed after cutting. However, in some embodiments, it is not necessary to additionally set the second packaging layer 142. In this embodiment, the second packaging layer 142 can contact the first packaging layer 140c. At this point, the optical substrate 100c of this embodiment has been completed. Furthermore, in other embodiments, before forming the adhesive layer 170 on the first packaging layer 140 c and disposing the driving substrate 180 on the adhesive layer 170 , the base layer 110 , the first packaging layer 140 c and the light absorbing unit 190 c may be cut along the cutting lines 114 .

[0086] In summary, in the optical substrate and its manufacturing method of the presently disclosed embodiment, the first packaging layer can simultaneously contact and cover the top surface and the side surface of the first partition of the partition layer through a one-time processing method, thereby reducing the infiltration problem caused by water vapor passing through the first partition, thereby improving the reliability of the optical substrate of the presently disclosed embodiment, especially for an optical substrate containing a wavelength conversion unit that is easily affected by external water vapor and fails, or for a spliced ​​display (Zero Border Tiling Display) containing an optical substrate, but not limited to this. In addition, in the presently disclosed embodiment, a second packaging layer can be additionally provided as needed, so that the second packaging layer can contact and cover the edge of the black matrix layer, thereby reducing the infiltration problem caused by water vapor passing through the black matrix layer, thereby further improving the reliability of the optical substrate. In addition, in some embodiments of the presently disclosed embodiment, since the first packaging layer can also contact and cover the side surface of the first black matrix layer, the infiltration problem caused by water vapor passing through the first black matrix layer can also be reduced, thereby further improving the reliability of the optical substrate.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical substrate, characterized in that: include: Basal layer; a partition layer, disposed on the base layer, and comprising a first opening, a second opening, a first partition separated from an edge of the base layer, and a second partition, wherein the first opening is on a side of the first partition away from the edge, and the second opening is on a side of the first partition adjacent to the edge and disposed between the first partition and the second partition; A wavelength conversion unit is disposed on the base layer and in the first opening, and is adjacent to a side of the first partition away from the edge; A first encapsulation layer is disposed on the partition layer, the wavelength conversion unit, and a portion of the base layer not covered by the partition layer and the wavelength conversion unit, wherein the first encapsulation layer contacts and covers a top surface and a side surface of the first partition; as well as a light absorbing unit, disposed on one side of the first partition adjacent to the edge, in the second opening, and on the first encapsulation layer, and the light absorbing unit does not overlap the wavelength conversion unit in the normal direction of the substrate layer, The edge is formed by cutting the base layer, the separation layer and the first packaging layer along a cutting line to expose the edge, wherein the cutting line is adjacent to a side of the second opening away from the first opening.

2. The optical substrate according to claim 1, characterized in that: Also includes: The black matrix layer is arranged between the base layer and the separation layer.

3. The optical substrate according to claim 2, characterized in that: A portion of the black matrix layer is not covered by the separation layer, and the first encapsulation layer contacts the portion of the black matrix layer.

4. The optical substrate according to claim 2, characterized in that: A portion of the base layer is not covered by the black matrix layer, and the first encapsulation layer contacts the portion of the base layer.

5. The optical substrate according to claim 1, characterized in that: Also includes: The second packaging layer covers the edge of the base layer and contacts the first packaging layer.

6. A method for manufacturing an optical substrate, characterized in that: include: Provides a base layer; forming a partition layer on the base layer, wherein the partition layer has a first opening, a second opening, a first partition portion, and a second partition portion, wherein the first partition portion separates the first opening from the second opening, and the second opening separates the first partition portion from the second partition portion; forming a wavelength conversion unit in the first opening; forming a first packaging layer on the partition layer, the wavelength conversion unit, and a portion of the base layer corresponding to the second opening, wherein the first packaging layer contacts and covers a top surface and a side surface of the first partition; forming a light absorbing unit in the second opening, wherein the light absorbing unit does not overlap the wavelength converting unit in a normal direction of the base layer; as well as The base layer, the separation layer, and the first encapsulation layer are cut along a cutting line, wherein the cutting line is adjacent to a side of the second opening away from the first opening.

7. The manufacturing method according to claim 6, characterized in that: The wavelength conversion unit is formed in the first opening by an inkjet printing process.

8. The manufacturing method according to claim 6, characterized in that: Before forming the separation layer on the base layer, the method further comprises: A black matrix layer is formed on the base layer.

9. The manufacturing method according to claim 8, characterized in that: The first encapsulation layer contacts the black matrix layer through the second opening.

10. The manufacturing method according to claim 8, characterized in that: Also includes: The black matrix layer is patterned to form a third opening, wherein the second opening overlaps the third opening, and the first encapsulation layer contacts the base layer through the second opening and the third opening.

11. The manufacturing method according to claim 10, characterized in that: Also includes: The light absorbing unit is formed in the third opening.

12. The manufacturing method according to claim 6, characterized in that: After cutting the base layer, the separation layer and the first packaging layer along the cutting line, the method further includes: A second packaging layer is formed on the edge of the base layer exposed after being cut, wherein the first packaging layer contacts the second packaging layer.

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