A flexible metal conductor pin and a method for preparing the same

Abstract

The present invention discloses a flexible metal conductor pin, wherein the flexible metal conductor is a composite of a conductive polymer material and a porous metal. The flexible metal conductor also includes a plating layer, wherein the plating layer is chemically plated, wherein the conductive polymer material is polyaniline, the porous metal is a porous metal Cu substrate, and the plating layer is a Ni plating layer. Since the flexible metal conductor pin has a nickel coating layer and is modified with nickel nanoparticles, the oxygen index performance is relatively high, which is close to 40 at the highest. The hardness at room temperature can also be close to 90 at the highest. In terms of heat resistance, the hardness changes less, and the flexible metal conductor pin has a full application prospect.

Description

Technical Field

[0001] The invention belongs to the field of pin preparation, and in particular relates to a flexible metal conductor pin and a preparation method thereof. Background Art

[0002] With the development of electronic information, plug pins are a very important part of life. The present invention team has also applied for a series of inventions related to plug pins. For example, in CN112701513A, a graphene copper alloy chemical nickel-plated plug pin is disclosed. The alloy of the plug pin is a graphene copper alloy, and the nickel plating layer is formed by chemical nickel plating. The thickness of the nickel plating layer is 1.6μm to 3.2μm, the hardness is ≥970Hv, and it does not contain phosphorus. In CN112701552A, a solid plug pin and a preparation method thereof are disclosed, wherein the preparation method of the solid plug pin includes the following steps: a. Preparation of a solid plug pin preform: providing a solid plug pin preform, one end of the solid plug pin preform is pressed to form a conductive plug part, and the other end is punched to form a riveted wiring part, wherein a wiring hole is opened in the riveted wiring part; b. Variable diameter expansion treatment: the edge of the opening of the wiring hole on the riveted wiring part is expanded and flanging, so that the opening of the wiring hole on the riveted wiring part is turned outward into a trumpet-shaped structure. The trumpet-shaped opening on the riveted connection part of the solid pin of the present invention has a larger aperture, so that the subsequent power supply wire can be inserted into the connection hole of the riveted connection part, which has the effect of preventing the wire from being cut; on the other hand, the material required for preparing the solid pin is reduced, and the hardness of the part where the trumpet-shaped opening on the riveted connection part is located is reduced, which is convenient for the subsequent riveting and wiring operation of the riveted connection part.

[0003] However, with the rapid development of mobile Internet, traditional alloy pins are particularly bulky and not flexible enough. Now innovative entities have begun to develop flexible metal materials for use in electronic appliances. For example, Northwestern Polytechnical University disclosed a method for preparing a conductor, a flexible metal conductor, an application and a conductive material in CN114023512A, which relates to the field of conductor production technology; the method comprises the following steps: mixing a polydimethylsiloxane prepolymer and a curing agent to obtain a mixed solution; adding a first solvent and silver benzoate nanoparticles to the mixed solution, mixing the mixture, and performing ultrasonic dispersion treatment after mixing to obtain a metal particle suspension; immersing the flexible substrate in the metal particle suspension for 0.5-30 hours, taking out and drying and curing; immersing the cured substrate in a second solvent that is miscible with water and can swell PDMS for swelling treatment or oxygen plasma treatment, and then transferring it to a metal salt solution to achieve metallization of the substrate by chemical plating, and then drying to obtain the flexible metal conductor.

[0004] It can be seen that the existing research on flexible pins is still relatively small. How to obtain highly flexible pins by optimizing the composition and preparation process has significant significance in future development. Summary of the invention

[0005] The purpose of the present invention is to develop a flexible metal conductor pin and a preparation method thereof in view of the above problems;

[0006] The utility model relates to a flexible metal conductor plug pin. The flexible metal conductor is a composite of a conductive polymer material and a porous metal.

[0007] Preferably, the conductive polymer material is one or more of polypyrrole, polyparaphenylene, polyphenylene sulfide and polyaniline.

[0008] Preferably, the porous metal is one or more of Cu, Ni, Au and Ag.

[0009] Preferably, the pin further includes a plating layer, the plating layer is formed by chemical plating, the conductive polymer material is polyaniline, the porous metal is a porous metal Cu substrate, and the plating layer is a Ni plating layer.

[0010] A method for preparing the flexible metal conductor pin comprises the following steps:

[0011] (1) Preparation of flexible metal conductor: A porous metal substrate is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and an activator, ammonium persulfate, ferrous sulfate and camphorsulfonic acid, is added to react under low temperature conditions to obtain a flexible metal conductor;

[0012] (2) Modification of the flexible metal conductor: adding the flexible metal conductor obtained in step (1) to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm;

[0013] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: a nickel salt, a reducing agent, a complexing agent, a brightener, and a stabilizer, potassium iodide, and the pH value of the plating solution is 4-4.8;

[0014] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating to obtain a flexible metal conductor pin.

[0015] Preferably, the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol.

[0016] Preferably, the reducing agent is dimethylamine borane.

[0017] Preferably, the complexing agent is glycolic acid.

[0018] A flexible metal conductor pin is prepared by adopting the above method.

[0019] The beneficial effects of this application are as follows:

[0020] The present invention introduces a flexible conductive high polymer into the pin for the first time, thereby obtaining a flexible pin, which broadens the usage of the pin. In particular, the flexible pin has a positive significance for future mobile and convenient usage scenarios.

[0021] In the selection of materials for the flexible pins, a porous metal substrate is selected to be compounded with a conductive polymer material. In order to improve the flexibility of the pins, it is preferred to select an ultra-thin porous metal substrate. In order to improve the service life of the pins, the present invention selects to perform chemical plating on the flexible pins. Due to the particularity of the flexible metal conductor, it is very important to modify it before chemical plating. In the present invention, the flexible metal conductor is selected to be added to the alcohol solution of Ni nanoparticles for chemical modification, which improves the compatibility between the flexible metal conductor and the plating film on the one hand, and can also improve the conductivity of the pins on the other hand.

[0022] In terms of performance testing, the flexible metal conductor pin has a high oxygen index performance of nearly 40 due to the modification of the nickel coating and nickel nanoparticles; the hardness at room temperature can be as high as nearly 90. In terms of heat resistance, its hardness changes little, and it has great application prospects. DETAILED DESCRIPTION

[0023] The present invention will be further described in detail below in conjunction with specific examples and with reference to data. It should be understood that these examples are only intended to illustrate the present invention and are not intended to limit the scope of the present invention in any way.

[0024] Detection method:

[0025] (1) Oxygen index: measured according to GB / T 2406-93 "Plastics combustion performance test method oxygen index method";

[0026] (2) Heat resistance: The molded product was placed in a graphite crucible and placed in a tube furnace. It was heated at 80°C for 24 h and the hardness before and after heating was measured.

[0027] (3) Hardness: The test was conducted using a LX-D Shore hardness tester.

[0028] Embodiment 1:

[0029] A method for preparing the flexible metal conductor pin comprises the following steps:

[0030] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0031] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0032] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0033] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0034] Embodiment 2:

[0035] A method for preparing the flexible metal conductor pin comprises the following steps:

[0036] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 2 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0037] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0038] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0039] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0040] Embodiment 3:

[0041] A method for preparing the flexible metal conductor pin comprises the following steps:

[0042] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; in the solution at the beginning of the reaction, the concentration of aniline hydrochloride is 0.5 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0043] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0044] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0045] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0046] Embodiment 4:

[0047] A method for preparing the flexible metal conductor pin comprises the following steps:

[0048] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0049] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.01 mol / L.

[0050] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0051] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0052] Embodiment 5:

[0053] A method for preparing the flexible metal conductor pin comprises the following steps:

[0054] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0055] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.1 mol / L.

[0056] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0057] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0058] Embodiment 6:

[0059] A method for preparing the flexible metal conductor pin comprises the following steps:

[0060] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0061] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0062] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 20:1:2:2:1:200;

[0063] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0064] Embodiment 7:

[0065] A method for preparing the flexible metal conductor pin comprises the following steps:

[0066] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0067] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0068] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0069] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 50°C for 3 hours to obtain a flexible metal conductor pin.

[0070] Embodiment 8:

[0071] A method for preparing the flexible metal conductor pin comprises the following steps:

[0072] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Ni substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0073] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0074] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0075] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0076] Embodiment 9:

[0077] A method for preparing the flexible metal conductor pin comprises the following steps:

[0078] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Au substrate; in the solution at the beginning of the reaction, the concentration of aniline hydrochloride is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0079] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0080] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0081] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0082] Embodiment 10:

[0083] A method for preparing the flexible metal conductor pin comprises the following steps:

[0084] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Ag substrate; in the solution at the beginning of the reaction, the concentration of aniline hydrochloride is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0085] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0086] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0087] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0088] Comparative Example 1:

[0089] A method for preparing the flexible metal conductor pin comprises the following steps:

[0090] (1) Preparation of flexible metal conductors: Graphene was selected as a substrate and immersed in an aqueous solution containing aniline hydrochloride. Exciters such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid were added. The reaction was carried out at 5°C for 20 hours to obtain a flexible metal conductor. At the beginning of the reaction, the concentration of aniline hydrochloride in the solution was 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid were all 0.4 mol / L.

[0091] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0092] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0093] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0094] Comparative Example 2:

[0095] A method for preparing the flexible metal conductor pin comprises the following steps:

[0096] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0097] (2) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0098] (3) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0099] Comparative Example 3:

[0100] A method for preparing the flexible metal conductor pin comprises the following steps:

[0101] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0102] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to a solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the solution is water; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0103] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0104] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0105] Comparative Example 4:

[0106] A method for preparing the flexible metal conductor pin comprises the following steps:

[0107] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate, ferrous sulfate and camphorsulfonic acid are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; at the beginning of the reaction, the concentration of aniline hydrochloride in the solution is 1 mol / L, and the concentrations of ammonium persulfate, ferrous sulfate and camphorsulfonic acid are all 0.4 mol / L.

[0108] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is ethanol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0109] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0110] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0111] Comparative Example 5:

[0112] A method for preparing the flexible metal conductor pin comprises the following steps:

[0113] (1) Preparation of flexible metal conductor: A porous metal is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and activators such as ammonium persulfate and ferrous sulfate are added, and reacted at 5°C for 20 hours to obtain a flexible metal conductor; the porous metal is a porous metal Cu substrate; in the solution at the beginning of the reaction, the concentration of aniline hydrochloride is 1 mol / L, and the concentrations of ammonium persulfate and ferrous sulfate are both 0.4 mol / L.

[0114] (2) Modification of the flexible metal conductor: The flexible metal conductor obtained in step (1) is added to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; the dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol; the concentration of the Ni nanoparticles is 0.05 mol / L.

[0115] (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: nickel salt, reducing agent, complexing agent, brightener, stabilizer potassium iodide and water, the pH value of the plating solution is 4.2; the reducing agent is dimethylamine borane, the complexing agent is glycolic acid, the nickel salt is nickel chloride, the brightener is cobalt chloride, and the weight ratio of the nickel salt, reducing agent, complexing agent, brightener, stabilizer and water is 10:1:2:2:1:200;

[0116] (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating at a nickel plating temperature of 80°C for 3 hours to obtain a flexible metal conductor pin.

[0117] The test results are shown in the following table:

[0118]

[0119] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0120] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for preparing a flexible metal conductor pin, characterized in that: The method comprises the following preparation steps: (1) Preparation of flexible metal conductor: A porous metal substrate is selected as a substrate, immersed in an aqueous solution containing aniline hydrochloride, and an activator, ammonium persulfate, ferrous sulfate and camphorsulfonic acid, is added to react under low temperature conditions to obtain a flexible metal conductor; (2) Modification of the flexible metal conductor: adding the flexible metal conductor obtained in step (1) to an alcohol solution of Ni nanoparticles, wherein the Ni nanoparticles are nanoparticles modified with a dibasic acid or a polybasic acid and have a particle size of 5-50 nm; (3) preparing a chemical nickel plating solution, the plating solution comprising the following components: a nickel salt, a reducing agent, a complexing agent, a brightener, and a stabilizer, potassium iodide, and the pH value of the plating solution is 4-4.8; (4) Chemical nickel plating: The modified flexible metal conductor is placed in a plating solution for immersion nickel plating to obtain a flexible metal conductor pin.

2. A method for preparing the flexible metal conductor pin according to claim 1, characterized in that: The dibasic acid is oxalic acid, and the alcohol solution is benzyl alcohol.

3. A method for preparing a flexible metal conductor pin as claimed in claim 1 or 2, characterized in that: The reducing agent is dimethylamine borane.

4. A method for preparing a flexible metal conductor pin as claimed in claim 1 or 2, characterized in that: The complexing agent is glycolic acid.

5. A flexible metal conductor pin, characterized in that: The method is prepared by any one of claims 1 to 4.

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