A method for automatic drilling in a chip package design

Abstract

The application belongs to the technical field of integrated circuits, and discloses a method for automatic punching in chip packaging design. The method comprises the following steps: selecting an arbitrary Bump or an arbitrary Ball to perform a punching operation, recording the process of performing the punching operation, and generating a first script file; adding the coordinates of the Bump to be punched or the coordinates of the Ball to be punched to the first script file, and generating a second script file; and calling the second script file, which is used for automatically performing the punching operation on the Bump to be punched or the Ball to be punched. The method provided by the application realizes batch automatic punching of Bumps or Balls through script files, greatly improves the work efficiency of packaging design, and can save more than 95% of the punching time for chips with a large number of Bumps or Balls and unclear arrangement rules. The method provided by the application can complete the work in only a few seconds, which used to take several hours of manual work.

Description

Technical Field

[0001] This application belongs to the field of integrated circuit technology and relates to a method for automatic hole drilling in chip packaging design. Background Technology

[0002] Chip packaging design involves a significant amount of repetitive work, such as drilling numerous vias at the bump and ball ends. Traditionally, this is done manually, either by drilling each bump and ball individually in Cadence Allegro software or by copying the vias. Manual drilling suffers from low efficiency, is prone to omissions or errors, and produces irregular patterns that negatively impact subsequent chip packaging design. It also fails to guarantee consistency in signal routing and power / ground uniformity across modules. Copying vias has the drawbacks of requiring fixed standards for bump pitch and pattern, limiting backend and package interaction and bump optimization. Furthermore, both manual and copying methods cannot be performed simultaneously in batches automatically. Summary of the Invention

[0003] The purpose of this application is to provide a method for automatic hole punching in chip packaging design, so as to solve the technical problem that batch automatic hole punching cannot be achieved at the bump and ball ends.

[0004] To solve the above-mentioned technical problems, the technical solution of this application is as follows:

[0005] This application provides a method for automatic hole drilling in chip packaging design, including:

[0006] Select any Bump or any Ball to perform a punching operation, and record the punching operation process to generate a first script file;

[0007] Add the coordinates of the bump or ball to be punched to the first script file to generate the second script file;

[0008] The second script file is invoked, which is used to automatically perform a punching operation on the Bump or Ball to be punched.

[0009] Further, the step of selecting any bump or any ball to perform a punching operation, while recording the punching operation process, and generating a first script file includes:

[0010] Create an initial script file;

[0011] The script recording function records the process of selecting any Bump or selecting any Ball to perform a punching operation. The script recording function is used to record the process of selecting any Bump or selecting any Ball to perform a punching operation in the initial script file.

[0012] Generate a first script file; the first script file is an initial script file that records the process of selecting any one of the Bumps or selecting any one of the Balls to perform a punching operation.

[0013] Further, the step of selecting any one of the bumps to perform the punching operation includes:

[0014] Select the first Bump to perform the punching operation; the first Bump is any arbitrarily selected Bump.

[0015] The second Bump performs a copy operation on the first Bump; the second Bump is any Bump other than the first Bump.

[0016] Further, the step of selecting any one of the Balls to perform the punching operation includes:

[0017] Select the first Ball to perform the punching operation; the first Ball can be any selected Ball.

[0018] The second ball performs a copy operation on the first ball; the second ball is any ball selected other than the first ball.

[0019] Further, the step of adding the coordinates of the bump to be punched to the first script file to generate the second script file includes:

[0020] The coordinates of the bumps to be drilled are selected from the bump coordinate file;

[0021] The coordinates of the bump to be punched are input into the first script file to generate a second script file, which is the first script file with the coordinates of the bump to be punched added.

[0022] Further, the step of adding the coordinates of the ball to be punched to the first script file to generate the second script file includes:

[0023] The coordinates of the balls to be punched are selected from the ball coordinate file;

[0024] The coordinates of the ball to be punched are input into the first script file, and the first script file is converted into a second script file, which is the first script file with the coordinates of the ball to be punched added.

[0025] Further, the step of calling the second script file includes:

[0026] Select the second script file in the directory path of the second script file to call it.

[0027] Further, the step of calling the second script file includes:

[0028] Create a shortcut to call the second script file;

[0029] The second script file is invoked via the shortcut.

[0030] The beneficial effects of this application are:

[0031] The automatic punching method in chip packaging design provided in this application first selects any bump or ball to perform a punching operation, and records the punching operation to generate a first script file; then, the coordinates of the bump or ball to be punched are added to the first script file to generate a second script file; finally, the second script file is called, which is used to automatically perform punching operations on the bump or ball to be punched. The embodiments of this application realize batch punching through script files, which greatly improves the work efficiency of packaging design. Especially for chips with a large number of bumps or balls and an unclear arrangement pattern, it can save more than 95% of the punching time. What used to take several hours can be completed in just a few seconds using the script calling method. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A flowchart illustrating an automatic hole-punching method in chip packaging design provided in this application embodiment.

[0034] Figure 2 A script window diagram of the packaging design software provided in this application embodiment.

[0035] Figure 3A partial command menu interface diagram of the packaging design software provided in this application embodiment.

[0036] Figure 4 This is a diagram showing the coordinate positions of some bumps in the bump coordinate file provided in this application embodiment. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0038] It should be clarified that in this embodiment, packaging design software is used to perform chip packaging design operations. That is, in this embodiment, packaging design software is used to issue operation commands, and the packaging design software drives the device to perform specific operations on the chip and substrate. In this embodiment, manual drilling and duplicate drilling both refer to the packaging design software issuing drilling operation commands to only one bump or one ball. Furthermore, in this embodiment, the packaging design software used is not limited to a single packaging design software. The method provided in this embodiment is applicable to any packaging design software that can be remotely connected to the device.

[0039] This application provides a method for automatic hole drilling in chip packaging design. Figure 1 The flowchart of the automatic hole drilling method in chip packaging design provided in the embodiments of this application is as follows: Figure 1 As shown, the method includes:

[0040] Step S1: Select any Bump or any Ball to perform a punching operation, and record the punching operation process to generate a first script file; In this embodiment of the application, the punching operation process is recorded and a first script file is generated by the recording function of the packaging design software. The first script file is a script file in .scr format, and the punching operation process is stored in .scr format.

[0041] In some possible implementations, step S1: Select any bump or any ball to perform a punching operation, and record the punching process to generate a first script file; specifically including:

[0042] Step S11: Create an initial script file by using the script commands of the encapsulation design software to create a .scr format script file;

[0043] In some embodiments, the specific operations for creating script files using packaging design software include:

[0044] Figure 2 A script window diagram of the packaging design software provided in the embodiments of this application, such as... Figure 2 As shown, execute the File command in the menu bar of the packaging design software, and then execute the Script command in the submenu of the File command to bring up the script window. Use the Browse or Library command in the script window to create a script file in the system, which is the initial script file. The initial script file is a file with the .scr extension and can be created in any directory path of the system.

[0045] In some preferred embodiments, the initial script file is created in the default directory path of the packaging design software.

[0046] Step S12: Record the process of selecting any Bump or selecting any Ball to perform a punching operation according to the script recording function; the script recording function will record all operations performed in the packaging design software in the initial script file. After being enabled, all commands executed by the user using the mouse or shortcuts will be recorded in the initial script file. In this embodiment of the application, the script recording function is used to record the punching operation process performed on any Bump or any Ball.

[0047] In some embodiments, the specific operations for enabling script recording using packaging design software include:

[0048] like Figure 2 As shown, execute the Record command in the script window to enable the script recording function; after enabling the script recording function, all operations performed in the packaging design software will be recorded in the screen saver. Do not perform unnecessary mouse operations or other operations unrelated to the punching operation.

[0049] The specific steps to end the script recording function using the packaging design software include:

[0050] like Figure 2 As shown, execute the Stop command in the script window to stop the script recording function.

[0051] After the script recording function is completed, the first script file is generated; the first script file is the initial script file that records the process of the packaging design software selecting any Bump or selecting any Ball to perform a hole punching operation. The specific steps of selecting any Bump to perform a hole punching operation in step S12 include:

[0052] Step S120: Select the first Bump to perform the punching operation. The first Bump is any selected Bump.

[0053] Step S121: The second Bump performs a copy operation on the first Bump; the second Bump is any Bump other than the first Bump.

[0054] It should be clarified that the drilling and copying operations described in steps S120 and S121 refer to the operation commands issued to the device using the packaging design software.

[0055] In some embodiments, the specific operations of performing steps S120 and S121 using packaging design software include:

[0056] For step S120, use the packaging design software to select any bump, i.e., the first bump, and perform the drilling operation. For step S121, Figure 3 A partial command menu interface diagram of the packaging design software provided in the embodiments of this application is shown below. Figure 3 As shown, find and execute the copy command in the packaging design software, select the first Bump that has been punched, and execute the Snap pick to command and the Pin command on the first Bump in sequence. Then select the second Bump and execute the Snap pick to command, the Pin command and the Done command in sequence. The second Bump can be any Bump other than the first Bump.

[0057] The specific steps in step S12, which involve selecting any one of the balls to perform the punching operation, include:

[0058] Step S122: Select the first Ball to perform the punching operation. The first Ball is any selected Ball.

[0059] Step S123: The second ball performs a copy operation on the first ball; the second ball is any ball other than the first ball.

[0060] It should be clarified that the drilling and copying operations described in steps S122 and S123 refer to commands issued to the device using packaging design software.

[0061] In some embodiments, the specific operations of performing steps S122 and S123 using packaging design software include:

[0062] For step S122, use the packaging design software to select any one ball, i.e., the first ball, and perform the punching operation. For step S123... Figure 3 A partial command menu interface diagram of the packaging design software provided in the embodiments of this application is shown below. Figure 3As shown, in the packaging design software, find and execute the copy command, select the first ball that has been punched, and execute the Snap pick to command and the Snap pick to command in sequence. Then select the second ball and execute the Snap pick to command, the Pin command and the Done command in sequence. The second ball can be any ball other than the first ball.

[0063] It should be clarified that the specific commands executed in steps S120-S121 or S122-S123 may differ for different packaging design software. In this embodiment, for any packaging design software, as long as the command executed in step S12 means "perform a punching operation on any Bump or any Ball, and copy or move the punching operation to another Bump or another Ball", the above command is intended to record a .scr script text in the initial script file that means "punch a hole on a Bump or Ball, copy or move to another Bump or Ball for punching".

[0064] In this embodiment of the application, the process of drilling holes for Bump and Ball using packaging design software is the same. The difference is that in the packaging design, Bump is located on the chip and close to the front side of the substrate, while Ball is located on the back side of the substrate.

[0065] Step S2: Add the coordinates of the bump or ball to be punched to the first script file to generate the second script file. The second script file is the first script file with the added bump or ball coordinates.

[0066] In some possible implementations, step S2: adding the coordinates of the bump to be punched to the first script file and generating the second script file specifically includes:

[0067] Step S20: Filter the coordinates of the bumps to be drilled using the bump coordinate file, which includes the coordinates of all bumps;

[0068] Step S21: Input the coordinates of the bump to be punched into the first script file to generate the second script file. The second script file is the first script file with the coordinates of the bump to be punched added.

[0069] In some embodiments, the specific operation of performing step S20 using the packaging design software includes: as described in step S12 above, the packaging design software executes the Snap pick to command and the Pin command on the first Bump, and executes the Snap pick to command and the Pin command on the second Bump. Correspondingly, two "pod dyn option select 'Snap pick to @:@Pin'" texts are generated in the script file. In this embodiment, the coordinates of the Bump to be punched are inserted after the second occurrence of the "pod dyn option select 'Snap pick to @:@Pin'" text, indicating that the operation of step S12 recorded is repeated for all the selected Bumps. The first script file, which is in .scr format, is not editable. Therefore, before inputting the coordinates of the Bump to be punched into the first script file, the file extension of the first script file needs to be changed to the editable .txt format. After inputting the coordinates of the Bump to be punched into the first script file, the editable .txt format is changed back to .scr format. At this time, the script file is the second script file.

[0070] In some possible implementations, step S2: adding the coordinates of the ball to be punched to the first script file and generating the second script file specifically includes:

[0071] Step S20: Filter the coordinates of the balls to be punched using the ball coordinate file, which includes the coordinates of all balls;

[0072] Step S21: Input the coordinates of the ball to be punched into the first script file to generate the second script file. The second script file is the first script file with the coordinates of the ball to be punched added.

[0073] In some embodiments, the specific operation of performing step S20 using the packaging design software includes: as described in step S12 above, the packaging design software executes the Snap pick to command and the Pin command on the first Ball, and executes the Snap pick to command and the Pin command on the second Ball. Correspondingly, two "pod dyn option select 'Snap pick to @:@Pin'" texts are generated in the script file. In this embodiment, the coordinates of the Ball that needs to be punched are inserted after the second occurrence of the "pod dyn option select 'Snap pick to @:@Pin'" text, indicating that the operation of step S12 recorded is repeated for all the selected Balls. The first script file, which is in .scr format, is not editable. Therefore, before inputting the coordinates of the Ball to be punched into the first script file, the file extension of the first script file needs to be changed to the editable .txt format. After inputting the coordinates of the Ball to be punched into the first script file, the editable .txt format is changed back to .scr format. At this time, the script file is the second script file.

[0074] It should be clarified that in the embodiments of this application, different packaging design software is used, and the text in the corresponding script files will also be different depending on the specific command executed. However, as long as the text recorded in the script file means "punch a hole in one Bump or Ball, move to another Bump or Ball to punch a hole", it is acceptable.

[0075] Step S3: Call the second script file, which is used to automatically perform the punching operation on the Bump or Ball to be punched.

[0076] In some possible implementations, step S3: the step of calling the second script file, specifically includes:

[0077] Select the second script file in the directory path where the second script file is located to invoke it.

[0078] Specifically, the second script file is located and selected in the directory path of the encapsulation design software and then called; for example... Figure 2 As shown, the script window is brought up by executing the Script command in the packaging design software. In the script window, the directory path of the second script file can be entered. The directory path of the script file can be found by using the Browse command or the Library command, and then the directory path can be selected. Alternatively, the directory path of the script file can be entered manually. The script file call command, i.e., the Replay command, is executed in the script window.

[0079] In some embodiments, step S3: calling the second script file may also involve creating a shortcut for the second script file and calling the second script file through the shortcut.

[0080] Specifically, a shortcut is created for the second script file in the shortcut file of the packaging design software;

[0081] Use the specified shortcut to directly call the second script file in the packaging design software. For example, create the shortcut as any shortcut such as "ctrl L" or "ctrl K". Be careful not to let it conflict with other shortcuts in the packaging design software.

[0082] The automatic drilling method for chip packaging design provided in this application embodiment realizes the batch automatic drilling of bumps or balls through a script file, which greatly improves the work efficiency of packaging design. Especially for chips with a large number of bumps or balls and an unclear arrangement pattern, it can save more than 95% of the drilling time. What used to take several hours can be completed in just a few seconds using the script calling method. In this application embodiment, the role of the script file is to record the entire process of commands and operations, and it can be reused.

[0083] It should be clarified that, in the embodiments of this application, the difference between the initial script file, the first script file, and the second script file lies only in their content. The initial script file is a newly created script file using the packaging design software, the first script file is an initial script file that records the punching operation process, and the second script file is a first script file that contains the coordinates of the bump to be punched or the ball to be punched; that is, in the embodiments of this application, the initial script file, the first script file, and the second script file are the same file with different content.

[0084] Furthermore, this application provides a method for automatic hole punching in chip packaging design. The specific operation commands may not be the same in different packaging design software, but as long as the command can accurately implement the operation described in this application, it is acceptable. For example, the command for setting the script recording function may be different for different packaging design software, but as long as the packaging design software can implement the script recording function, it is acceptable. The same applies to the specific commands for hole punching operation and the specific commands for calling the script.

[0085] The following describes the method provided in the embodiments of this application for performing a drilling operation on the first layer (L1) to the second layer (L2) of the substrate on all VCC Bumps, wherein the substrate layer closest to the chip Bump is the first layer, and the substrate layer furthest from the chip Bump is the last layer of the substrate.

[0086] like Figure 2As shown, in the packaging design software, the File command and Script command are executed in sequence to bring up the script window and create a script file in .scr format. In this embodiment of the application, the L1 layer to L2 layer of the substrate is drilled for VCC Bumps. The script file is named "copy via12". After creating the script file, the Record command is executed in the script window to enable the script recording function. At this time, all operations performed on the packaging design software will be recorded in the screen saver, that is, recorded in the script file in .scr format.

[0087] Using the packaging design software, execute the Add connect command, select any Bump, and perform a hole punching operation from layer L1 to layer L2 on that Bump. Name this Bump via12. Then, execute the Done command, the copy command, select via12, execute the snappickto command, and the Pin command in sequence. Next, select any Bump that has not been punched, select that Bump, and execute the snappickto command, the Pin command, and the Done command in sequence. This completes the script recording.

[0088] After the script recording is complete, execute the Stop command through the script window to stop the recording.

[0089] After recording the script file, you need to call it. Locate the script file in the directory where it is stored, and change its extension from .scr to .txt for editable text. The complete text recording the single Bump target punching operation in the script file is as follows:

[0090] symboledit

[0091] Add Connect

[0092] set win ext-4947.0052 4989.6013-3002.9020 5998.8505

[0093] pick grid-4030.3991 5653.5441

[0094] pick grid dbl-4030.39915653.5441

[0095] prepopup-4030.39915653.5441

[0096] done

[0097] symboledit

[0098] copy

[0099] pick grid-4045.83975654.9478

[0100] prepopup-4045.8397 5654.9478

[0101] pop dyn_option_select'Snap pick to@:@Pin'

[0102] prepopup-3814.2317 5650.7368

[0103] pop dyn_option_select'Snap pick to@:@Pin'

[0104] prepopup-3911.0859 5697.0583

[0105] done

[0106] Figure 4 This application provides a Bump coordinate location diagram for a portion of the Bumps in the Bump coordinate file, as shown in the embodiments of this application. Figure 4 As shown, the Bump coordinate file is located, and the coordinates of the Bumps that need to be drilled are filtered out. In this embodiment, the first layer (L1) to the second layer (L2) of the substrate are drilled for VCC Bumps. The coordinates of all VCC Bumps are filtered out and inserted into the specified position in the script file, indicating that the previous drilling operation is repeated for all the filtered bumps. As shown in the text in the script file above, the coordinates filtered out from the Bump coordinate file are inserted after the second occurrence of the text "pop dyn_option_select'Snap pickto@:@Pin'" and before the text "prepopup-3911.0859 5697.0583". After insertion, the script file is saved, and the script file extension is changed back to .scr.

[0107] Call the script file with inserted coordinates. Use the packaging design software to execute the File command and then the script command in sequence to bring up the script window; enter the correct path and file name of the script file. You can enter it manually or search using the Browse command and the Library command. Browse can search for custom folders, while Library can only search in the system's default configuration file path. In this embodiment, the directory path and file name of the script file are set as follows: "D: / Home / project / PG2L200H-FBB484 / substrate design / via12.scr".

[0108] like Figure 2 As shown, execute the Replay command in the script window to call the script file, and wait a few seconds to complete the drilling operation of all VCC bumps on the die (chip).

[0109] Once the script is created, you can directly call the prepared script file by setting a shortcut. The specific steps in the packaging design software are as follows:

[0110] First, place the recorded script file in the default configuration folder of the packaging design software. The path is as follows in this embodiment: "C:\Cadence\Cadence_SPB_17.2-2016\share\local\pcb\scripts";

[0111] By adding a calling statement through the shortcut command file of the encapsulation design software, the calling statement in this application example is "Alias ​​a Replay copy via12", which specifies the shortcut key to call the script file;

[0112] After restarting the packaging design software, you can use the shortcut to directly call the script file.

[0113] The automatic drilling method for chip packaging design provided in this application embodiment realizes the batch automatic drilling of bumps or balls through a script file, which greatly improves the work efficiency of packaging design. Especially for chips with a large number of bumps or balls and an unclear arrangement pattern, it can save more than 95% of the drilling time. What used to take several hours can be completed in just a few seconds using the script calling method. In this application embodiment, the role of the script file is to record the entire process of commands and operations, and it can be reused.

[0114] It should be clarified that the automatic hole punching method in chip packaging design provided in this application embodiment can not only complete the automatic hole punching of the Bump and Ball ends in the packaging design, but also record the commands and operations of a task in a script file for a large number of repetitive tasks in chip packaging design. The corresponding coordinates or corresponding regions are inserted into the script file, and then the script file is called to complete the repetitive tasks. For example, this application embodiment is also applicable to adding traces (substrate traces) on the Bump pad, setting keepout regions at the bump or ball end, and reusing module designs, which include a large number of repetitive tasks. In this case, it is only necessary to record the complete operation of a single object, filter out the coordinates of the target object, and refer to the above operation method description to complete the script recording and calling.

[0115] The above description, in conjunction with specific embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications and substitutions should be considered within the scope of protection of this application.

Claims

1. A method for automatic hole drilling in chip packaging design, characterized in that, include: Select any Bump or any Ball to perform a punching operation, and record the punching operation process to generate a first script file; Add the coordinates of the bump or ball to be punched to the first script file to generate the second script file; The second script file is invoked, which is used to automatically perform a punching operation on the Bump or Ball to be punched. The step of selecting any bump or any ball to perform a punching operation, recording the punching operation process, and generating a first script file includes: Create an initial script file; The script recording function records the process of selecting any Bump or selecting any Ball to perform a punching operation. The script recording function is used to record the process of selecting any Bump or selecting any Ball to perform a punching operation in the initial script file. Generate a first script file; the first script file is an initial script file that records the process of selecting any one of the Bumps or selecting any one of the Balls to perform a punching operation.

2. The method for automatic hole drilling in chip packaging design as described in claim 1, characterized in that, The step of selecting any one of the bumps to perform the punching operation includes: Select the first Bump to perform the punching operation; the first Bump is any arbitrarily selected Bump. The second Bump performs a copy operation on the first Bump; the second Bump is any Bump other than the first Bump.

3. The method for automatic hole drilling in chip packaging design as described in claim 1, characterized in that, The step of selecting any one of the Balls to perform the punching operation includes: Select the first Ball to perform the punching operation; the first Ball can be any selected Ball. The second ball performs a copy operation on the first ball; the second ball is any ball selected other than the first ball.

4. The method for automatic hole drilling in chip packaging design as described in claim 1, characterized in that, The step of adding the coordinates of the bump to be punched to the first script file to generate the second script file includes: The coordinates of the bumps to be drilled are selected from the bump coordinate file; The coordinates of the bump to be punched are input into the first script file to generate a second script file, which is the first script file with the coordinates of the bump to be punched added.

5. The method for automatic hole drilling in chip packaging design as described in claim 1, characterized in that, The step of adding the coordinates of the ball to be punched to the first script file and generating the second script file includes: The coordinates of the balls to be punched are selected from the ball coordinate file; The coordinates of the ball to be punched are input into the first script file, and the first script file is converted into a second script file, which is the first script file with the coordinates of the ball to be punched added.

6. The method for automatic hole drilling in chip packaging design as described in claim 1, characterized in that, The step of calling the second script file includes: Select the second script file in the directory path of the second script file to call it.

7. The method for automatic hole drilling in chip packaging design as described in claim 1, characterized in that, The step of calling the second script file includes: Create a shortcut to call the second script file; The second script file is invoked via the shortcut.

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