Method and apparatus for aiding in the processing of plastic films

Abstract

A system includes an elliptical support rail (106), a power source (108a), a controller (110a), and a film processing module (102). The power source (108a) and the controller (110a) are electrically connected to the support rail (106). The film processing module (102) is movably engaged with the support rail (106). The film processing module (102) includes a base (148) and an upper multifunctional assembly (152). The upper multifunctional assembly (152) includes a clamping plate (188) and a cutting mechanism (182). The cutting mechanism (182) is electrically connected to the power source (108a) and the controller (110a) to cut and seal a film.

Description

[0001] This case is a divisional application, and its parent case is an application filed on January 20, 2020, with the invention name "Method and device for assisting in plastic film processing" and application number 201980003687.5.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to U.S. application No. 16 / 230,551, filed on December 21, 2018, the entire contents of which are incorporated herein by reference. Technical Field

[0004] The present invention relates generally to film processing and, more particularly, to methods and apparatus that facilitate the processing of plastic film into finished plastic film products. Background Art

[0005] Products made from plastic film, as well as the machinery used to continuously produce them, have experienced significant development in recent years. These plastic film products often feature reclosable sealed seams and zippers. In some cases, they also feature pre-printed graphics. Plastic film processing machinery typically includes tools for cutting bag components from plastic film sheets or tubes, placing zippers, and fusing the bag components and zippers together.

[0006] Certain conventional film product manufacturing methods utilize multiple processing stations equipped with various machines and conveyors to move the film product through various stages of production between these processing stations. Consequently, conventional film product manufacturing facilities occupy a significant amount of space to produce the plastic film product. Furthermore, when utilizing certain conventional film product manufacturing methods, the entire film product manufacturing line may need to be shut down to perform maintenance on various components of the various machines.

[0007] Furthermore, while pre-printed patterns within a single film roll are generally relatively uniform, there are often spatial differences between the first and second pre-printed film rolls, even when the pattern is identical. In other words, the pattern on the second roll can deform relative to the first roll (sometimes referred to as "creep"). Consequently, if the pre-printed film roll is misaligned with the film processing machinery, the pre-printed pattern will be periodically cut. Consequently, certain existing film product manufacturing methods require stopping and re-adjusting all film processing machinery within a film processing station each time a new sheet of pre-printed film is introduced to the station.

[0008] Therefore, there is a need to develop thin film product manufacturing methods and related machinery that occupy less space, compensate for differences between pre-printed film rolls, and can be more easily and quickly maintained, repaired, and aligned. Summary of the Invention

[0009] In one aspect, a system is disclosed that includes a thin film processing module, a processor, and a memory. The processor and the memory are coupled to the thin film processing module. The processor is configured to dynamically coordinate movement of the thin film processing module relative to a moving thin film sheet and to perform a function on the thin film sheet via the thin film processing module.

[0010] In another aspect, a thin film processing module is disclosed, comprising a carriage assembly, a linear drive, and an upper multifunctional assembly. The carriage assembly is configured to move along a support track. The linear drive engages the carriage assembly. The upper multifunctional assembly engages the linear drive to perform a function on a thin film adjacent to the support track.

[0011] In yet another aspect, a method for producing a thin film product is disclosed that utilizes a processor to dynamically coordinate the movement of a thin film processing module relative to a moving thin film sheet and instruct the thin film processing module to perform a function on the thin film sheet.

[0012] In a further aspect, a film processing module is disclosed, comprising a carriage assembly, a linear drive, a base, and an upper multifunctional assembly. The carriage assembly is configured to move along a support rail. The linear drive engages the carriage assembly. The base engages the linear drive. The upper multifunctional assembly is drivably engaged with the linear drive for movement relative to the base. The upper multifunctional assembly includes a clamping plate for selectively clamping a portion of the film to the base, and a cutting mechanism for cutting and sealing the portion of the film.

[0013] In a different aspect, a method for producing a sealed film product is disclosed. The method utilizes a processor to perform the following steps: moving an upper multifunctional assembly of a film processing module to a ready position relative to a base of the film processing module; moving the film processing module to an aligned position on an elliptical support track such that a portion of a film moving parallel to the elliptical support track is located between the upper multifunctional assembly and the base; moving the upper multifunctional assembly toward the base to a clamping position to clamp the film; energizing a cutting mechanism of the upper multifunctional assembly to heat the cutting mechanism; moving the upper multifunctional assembly toward the base to a cutting position to cut the film; moving the upper multifunctional assembly away from the base to an open position; and moving the film processing module to a conveying position on the elliptical support track such that a conveyor is located between the upper multifunctional assembly and the base.

[0014] In yet another aspect, a system is disclosed that includes an elliptical support track, a power supply and a controller electrically connected to the support track, and a film processing module movably engaged with the support track. The film processing module includes a base and an upper multifunctional assembly. The upper multifunctional assembly includes a clamping plate and a cutting mechanism electrically connected to the power supply and controller for cutting and sealing the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a perspective view of an exemplary thin film processing station according to an exemplary embodiment;

[0016] Figure 2 yes Figure 1 A schematic top view of a film processing station;

[0017] Figure 3 is in the open position Figure 1 A perspective view of a film processing module of a film processing station;

[0018] Figure 4 is in the ready position Figure 1-3 A schematic cross-sectional side view of a thin film processing module;

[0019] Figure 5 In the clamped position Figure 4 A schematic cross-sectional side view of a thin film processing module;

[0020] Figure 6 is in cutting position Figure 4 and 5 A schematic cross-sectional side view of a thin film processing module;

[0021] Figure 7 is in the ready position Figure 4 A cross-sectional view of a thin film processing module;

[0022] Figure 8 In the clamped position Figure 5 A schematic cross-sectional end view of a thin film processing module;

[0023] Figure 9 is in cutting position Figure 6 A cross-sectional view of a thin film processing module;

[0024] Figure 10 is a schematic cross-sectional view of a film processing module in an open position carrying cut and sealed film;

[0025] Figure 11 yes Figure 1 and 2 A block diagram of the electronic components of a thin film processing station;

[0026] Figure 12 yes Figure 1 and 2 A more detailed block diagram of a module analyzer of a thin film processing station; and

[0027] Figure 13 is a flow chart showing an example method by which plastic film may be processed into bags. DETAILED DESCRIPTION

[0028] As explained herein, the present invention provides an example of a film processing station, such as for producing plastic film bags, having multiple film processing modules capable of improving film cutting, forming, and sealing. The film processing station occupies a relatively small footprint during the production of plastic film products. Furthermore, each film processing module independently clamps, cuts, and seals the plastic film into finished products, and delivers the finished products to a waiting conveyor (e.g., for packaging).

[0029] like Figures 1 to 10 As shown, the film processing station 100 includes one or more film processing modules 102, a conveyor 104, a support rail 106, a bus power supply 108a, a rail power supply 108b, a bus air source 108c, a main controller 110a, a rail controller 110b, a power and air bus 112, a first transceiver 114, a registration sensor 116a, and a plurality of rail sensors 116b. It should be understood that each film processing module 102 is substantially identical in structure to the other film processing modules 102. Thus, multiple film processing modules 102 can be used on the support rail 106 at a given time, and film processing modules 102 can be interchanged with one another without requiring modifications to the conveyor 104, the support rail 106, the bus power supply 108a, the rail power supply 108b, the bus air source 108c, the main controller 110a, the rail controller 110b, the power and air bus 112, the first transceiver 114, the registration sensor 116a, and / or the plurality of rail sensors 116b. It is also contemplated that alternative film-processing modules may be used in conjunction with the support rails 106 and the film-processing module 102 that are structurally different than the film-processing module 102 shown.

[0030] refer to Figure 2, the main controller 110a is connected to the track controller 110b, the transceiver 114, the registration sensor 116a and the track sensor 116b. The main controller 110a controls the movement of the film processing module 102 along the support track 106 through the track controller 110b. In some embodiments, the main controller 110a and / or the track controller 110b are remote from the film processing module 102. The main controller 110a controls the film processing functions (such as cutting and sealing, etc.) of the film processing module 102 through the transceiver 114 and / or the bus 112. The bus 112 supplies power to the film processing modules 102, and in some embodiments, also supplies compressed air, so that they can perform their respective film processing functions. Figures 11 to 13 The interaction between the main controller 110a, the track controller 110b, the transceiver 114, the registration sensor 116a, and the track sensor 116b is described in detail.

[0031] Again, special reference Figure 2 The support track 106 forms an elliptical loop with opposing, generally straight, parallel first and second sides 118, 120 and opposing first and second rounded ends 122, 124. It is further contemplated that the elliptical loop can be substantially in the shape of a racetrack, or that other track shapes can be formed by straight and curved segments. Track sensors 116b are provided at regular intervals along the length of the support track 106. It should be understood that the support track 106 is constructed from modular panels and can therefore be of any desired size. The support track 106 is electrically connected to and powered by a track power supply 108b. A track controller 110b controls the track power supply 108b. Each thin film processing module 102 is movably coupled to the support track 106.

[0032] It should be understood that each film-processing module 102 is independent of the others. The number of film-processing modules 102 on the support rail 106 is determined based on the length and / or shape of the support rail 106. During operation, the track controller 110b selectively controls all or a subset of the film-processing modules 102. Furthermore, during operation, the main controller 110a, via the track controller 110b, independently controls the movement of each film-processing module 102 around the support rail 106. Furthermore, during operation, the controllers 110a and 110b can control the film-processing modules 102 to move around the support rail 106 at different speeds. Thus, as the film-processing modules 102 move around the support rail 106, they can move closer to or further away from each other. In other words, during operation, the controllers 110a and 110b dynamically coordinate the independent movement of the film-processing modules 102 relative to the support rail 106. Furthermore, when alternative film-processing modules are used in conjunction with or in place of the illustrated film-processing modules 102, the controllers 110a and 110b can also dynamically coordinate the independent movement of these alternative film-processing modules.

[0033] Reference again Figure 2 In the example shown, bus 112 is co-centrically disposed outside of support rail 106 to provide power and / or compressed air to film-processing modules 102. It should be understood that bus 112 can be positioned in any arrangement relative to support rail 106 and provide power and / or compressed air to film-processing modules 102 as they move about support rail 106. For example, film-processing modules 102 can be arranged to receive power and / or compressed air with bus 112 co-centrically disposed within, below, or above support rail 106.

[0034] Reference Figure 1 , the sheet of film 126 can be arranged near or along the first side 118. When the film 126 is provided to the film processing station 100, the film 126 is in a tubular or folded shape. Figure 5 、 6 As shown in Figures 8 to 10 , film 126 has a top layer 128 and a bottom layer 130. In some embodiments, film 126 is supplied as a starting material from an unwinder to film processing station 100. In other embodiments, film 126 is flattened, printed, and folded before being supplied as a starting material to film processing station 100. In another embodiment, a zipper is positioned and attached to film 126 before film 126 is supplied as a starting material to film processing station 100, film 126 is folded, and the zipper is closed.

[0035] refer to Figures 1 to 3In the illustrated embodiment, film processing module 102 is adapted to clamp, cut, and seal film 126. It should be understood that alternative film processing modules mounted on support rail 106 and used with or in place of film processing module 102 can perform other functions on film 126. For example, alternative film processing modules can emboss decorative patterns and / or manufacturing information onto film 126, print decorative patterns and / or manufacturing information onto film 126, perforate film 126, place zippers on film 126, ultrasonically form film 126, abrade film 126 with sand and / or a water jet, melt patterns onto film 126, laser ablate film 126, remove lips from film 126, add individual components to film 126, cut film 126 into different shapes, score film 126, perform sheet-type sealing on film 126, and the like. Thus, multiple types of film processing modules can be used together to perform continuous, sequentially connected functions on film 126. For example, the film 126 can have a pattern printed thereon by a printer film processing module, then be embossed by an embossing press film processing module, and then be cut into bags by the illustrated cutting film processing module 102. Alternatively, it is contemplated that multiple types of film processing modules can be used in other ways, for example, certain modules can remain idle during a first stage of processing and can be activated individually or in combination with other modules during a second stage of processing. In fact, any combination or arrangement of similar or different film processing modules can be used.

[0036] Special reference Figure 2 , the film 126 has a plurality of demarcations 132. In some embodiments, the demarcations 132 are printed on the film 126. In some embodiments, the demarcations 132 are embossed on the film 126. In some embodiments, the demarcations 132 are raised features on the film 126. It is contemplated that the demarcations 132 can be of any form that provides positional reference points on the generally uniform film 126. A registration sensor 116a is positioned near the film 126 to detect the demarcations 132. In the illustrated example, the registration sensor 116a spans the film 126.

[0037] Look again Figure 1More specifically, each thin film processing module 102 includes a carriage assembly 134 and a forming assembly 136. The carriage assembly 134 is connected to the support rail 106. Each carriage assembly 134 includes a support frame 140. The support frame 140 is movably engaged with the support rail 106. Each carriage assembly 134 also includes a positioning magnet (not shown) engaged with the support frame 140. The positioning magnet drives the track sensor 116b on the support rail 106. The forming assembly 136 is engaged with the support frame 140. It should be understood that the support rail 106, the track power supply 108b, the track sensor 116b and the carriage assembly 134 can be provided as a complete motion control package (such as provided by Rockwell Automation). system).

[0038] refer to Figure 1 and 2 In addition to selectively operating the film processing modules 102 by controllers 110a, b, it is contemplated that, in some embodiments, the forming assembly 136 may be selectively not attached to the carriage assembly 134. Thus, one of the film processing modules 102 may be reduced to a basic carriage assembly 134 without performing film processing functions. In other words, depending on the film processing to be performed, the film processing station 100 may have an "empty" film processing module 102.

[0039] In one embodiment, each carriage assembly 134 further includes one or more rollers and a motor. The rollers and motor are engaged with the support frame 140. The rollers are in rolling contact with the support rail 106. As a result, the support frame 140 is supported by the support rail 106 and is movably engaged with the support rail 106. In addition, one or more rollers are driven by a motor. Therefore, the motor of the carriage assembly 134 is powered by the track power supply 108b and controlled by the main controller 110a through the track controller 110b and the support rail 106. In other words, the motor drives the one or more rollers to move the film processing module 102 along the support rail 106. Based on the signal from the track sensor 116b of the support rail 106, the controllers 110a, b control the movement of the film processing module 102 along the support rail 106.

[0040] Alternatively, or in conjunction with the previous disclosure, the processing modules 102 are electromagnetically moved by magnets disposed about the support rails 106. Each carriage assembly 134 includes a magnetic drive mechanism for movement about the support rails 106. Similar to the above discussion, the controllers 110a, b control the movement of the thin film processing modules 102 along the support rails 106 based on signals from the track sensors 116b of the support rails 106.

[0041] like Figure 1 and Figure 2 As shown, since support track 106 is a closed loop, film processing module 102 moves around support track 106. As film processing module 102 moves along first side 118, film processing module 102 performs functions on film 126 and deposits the cut and sealed film product 142 onto conveyor 104. In addition, film processing module 102 moves along first circular end 122, second side 120, and second circular end 124 to return to film 126.

[0042] Go to Figure 3 The forming assembly 136 of each film processing module 102 includes a frame 144, a base 148, a linear drive 150, and an upper multi-function assembly 152. In some embodiments, the forming assembly 136 also includes a second transceiver 154 and a battery 156. In some embodiments, the forming assembly 136 also includes an air controller 158 (see Figures 7 to 10 ).

[0043] More specifically, and again with reference to Figure 3 , linear drive 150 supports frame 144. Frame 144 supports base 148. Thus, base 148 is cantilevered relative to linear drive 150. In the illustrated example, frame 144 is a triangular bracket. Upper multi-function assembly 152 is moved toward and away from base 148 by linear drive 150. Frame 144, base 148, and upper multi-function assembly 152 extend generally perpendicularly outward from linear drive 150 relative to support rail 106. Thus, base 148 and upper multi-function assembly 152 are generally parallel to one another. Additionally, base 148 defines an outwardly extending inlay 160. In some examples, inlay 160 is lined with an elastomer 162.

[0044] More specifically, the linear drive 150 includes a motor (not shown) in a motor housing 164, a guide rail 166, and a slide 168. The second transceiver 154 and the battery 156 are supported by the motor housing 164. Figure 1 As shown in FIG3 , guide rail 166 is coupled to motor housing 164 and support frame 140. Guide rail 166 extends upward relative to motor housing 164. Slide plate 168 is movably (e.g., slidably) coupled to guide rail 166 via bearings or the like. Frame 144 is coupled to motor housing 164 and guide rail 166. Upper multi-function assembly 152 is coupled to slide plate 168.

[0045] In some embodiments, the linear drive 150 is electrically connected to the bus 112, for example, via brushes. In some embodiments, the linear drive 150 is electrically connected to the battery 156. Thus, the motor of the linear drive 150 is powered by the bus power 108a and / or the battery 156. In some embodiments, the linear drive 150 is controlled by the main controller 110a via the bus 112. In various embodiments, the linear drive 150 is electrically connected to the second transceiver 154 and controlled by the main controller 110a via the first transceiver 114 and the second transceiver 154. In other words, the motor receives commands from the main controller 110a and drives the slide 168 to move the upper multi-function assembly 152 along the guide rail 166. Thus, the movement of the upper multi-function assembly 152 along the guide rail 166 is controlled by the main controller 110a.

[0046] Now refer to Figure 4 The upper multi-function assembly 152 includes a support arm 170 , a first upper biasing member 172 a , a second upper biasing member 172 b , a first lower biasing member 174 a , a second lower biasing member 174 b , a hot wire assembly 176 , and a clamping assembly 178 .

[0047] The hot wire assembly 176 includes a carrier plate 180, a cutting mechanism 182, a first support wire 184a, and a second support wire 184b. The first support wire 184a and the second support wire 184b are connected to opposite ends of the cutting mechanism 182. Alternatively, the first support wire 184a and the second support wire 184b can be configured as other connector structures and can be positioned at other locations along the length of the cutting mechanism 182. Returning to the present embodiment, the first support wire 184a and the second support wire 184b are connected to the carrier plate 180. Therefore, the cutting mechanism 182 is suspended from the carrier plate 180.

[0048] The cutting mechanism 182 is generally straight so as to cut and seal the film 126 in a straight line. Furthermore, it is contemplated that the cutting mechanism 182 may be curved. Thus, the cutting mechanism 182 may cut and seal the film 126 in a corresponding curved decorative and / or functional manner, such as a scalloped, interlocking, zigzag, curved, wavy, undulating, or similar shape. Furthermore, while the cutting mechanism 182 is linear, it is contemplated that the cutting mechanism 182 may be any other type of cutting mechanism, such as a knife, blade, punch, saw, or the like.

[0049] In some embodiments, the hot wire assembly 176 is electrically connected to the bus 112. In other embodiments, the hot wire assembly 176 is electrically connected to the battery 156. Thus, the hot wire assembly 176 is powered by the bus power 108a and / or the battery 156. In some embodiments, the hot wire assembly 176 is controlled by the main controller 110a via the bus 112. In various embodiments, the hot wire assembly 176 is electrically connected to the second transceiver 154 and controlled by the main controller 110a via the first transceiver 114 and the second transceiver 154. In other words, the hot wire assembly 176 receives instructions from the main controller 110a to supply and cut off power.

[0050] In some embodiments, the hot wire assembly 176 is continuously powered by the main controller 110a. As will be explained in greater detail below, when the hot wire assembly 176 is energized, the cutting mechanism 182 heats up to cut and seal the film 126. In other words, when current is applied to the cutting mechanism 182, the cutting mechanism 182 is heated to a temperature greater than or equal to the melting temperature of the film 126. Thus, the cutting mechanism 182 is heatable. Furthermore, in some embodiments, the cutting mechanism 182 is compatible with a commercially available heater (not shown) mounted on the forming assembly 136 and controlled by a controller.

[0051] Film 126 can comprise a variety of materials including, for example, thermoplastics, metal foils, layered composites, fabrics, paper, etc. Illustrative thermoplastic materials that can be used include, for example, polypropylene (PP), polyethylene (PE), metallocene polyethylene (mPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ultra low density polyethylene (ULDPE), biaxially oriented polyethylene terephthalate (BPET), high density polyethylene (HDPE), and polyethylene terephthalate (PET), as well as other polyolefin plastomers and combinations and blends thereof. Other materials that can be used include styrene block copolymers, polyolefin blends, elastomeric alloys, thermoplastic polyurethanes, thermoplastic copolyesters, thermoplastic polyamides, polymers and copolymers of polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), saran polymers, styrene acryloacrylonitrile, cellulose acetate, polyethylene terephthalate (PET), ionomers, polystyrene, polycarbonate, styrene-acrylonitrile, aromatic polyesters, linear polyesters, nonwoven materials (such as ) and thermoplastic polyvinyl alcohol. Those skilled in the art will recognize that a variety of other materials can also be used to form film 126. Illustrative sustainable film materials that can be used include, for example, bio-based polyethylene (e.g., LDPE, LLPDE, etc.), renewable resins and / or bio-based raw materials, post-consumer recycled plastics, compostable resins (e.g., PHA, PBAT, PCL, PLA, etc.).

[0052] refer to Figure 3 and 4 The clamping assembly 178 includes a first column 186a, a second column 186b, and a clamping plate 188 defining a cutting opening 190. The cutting opening 190 is sized to allow the cutting mechanism 182 to pass through the cutting opening 190. The first column 186a and the second column 186b are slidably engaged with the support arm 170. The clamping plate 188 is engaged with the first column 186a and the second column 186b. The first upper biasing member 172a and the first lower biasing member 174a are disposed between the clamping plate 188 and the support arm 170, surrounding the first column 186a. The second upper biasing member 172b and the second lower biasing member 174b are disposed between the clamping plate 188 and the support arm 170, surrounding the second column 186b. Thus, the clamping plate 188 is suspended from the support arm 170 and is movable relative to the support arm 170. The first and second upper biasing members 172 a , 172 b and the first and second lower biasing members 174 a , 174 b bias the clamping plate 188 away from the support arm 170 .

[0053] Continue to refer to Figure 3 and 4 The carrier plate 180 is slidably engaged with the first and second posts 186a, 186b. The carrier plate 180 is disposed between the first upper biasing member 172a and the first lower biasing member 174a. The carrier plate is disposed between the second upper biasing member 172b and the second lower biasing member 174b. Thus, the carrier plate 180 is sandwiched between the first and second upper biasing members 172a, 172b and the first and second lower biasing members 174a, 174b. In other words, the carrier plate 180 is slidably positioned on the first and second posts 186a, 186b. The first and second upper biasing members 172a, 172b bias the carrier plate 180 away from the support arm 170. The first and second lower biasing members 174a, 174b bias the carrier plate 180 away from the clamping plate 188. Thus, the hot wire assembly 176 is suspended from and moves relative to the support arm 170 and the clamping assembly 178 .

[0054] exist Figure 3 and 4In the illustrated example, the first and second upper biasing members 172a, 172b and the first and second lower biasing members 174a, 174b are coil springs. In some embodiments, the first and second upper biasing members 172a, 172b have a greater spring constant than the first and second lower biasing members 174a, 174b. In a preferred embodiment, the first and second lower biasing members 174a, 174b provide a clamping force of approximately 50 to 60 pounds (222.4 to 266.9 Newtons). Thus, the first and second upper biasing members 172a, 172b urge the first and second lower biasing members 174a, 174b during the cutting cycle, as will be explained in more detail below.

[0055] In embodiments including the air controller 158, the clamping assembly 178 also includes one or more air flow lines 192 (e.g., see Figure 7 ). In these embodiments, the clamping plate 188 further defines one or more air flow openings 194. The air flow openings 194 are defined at the rear end of the clamping plate 188 relative to the direction of movement of the thin film processing module 102 along the support rail 106. The air flow line 192 is connected to the clamping plate 188 through the air flow openings 194. In other words, the air flow line 192 corresponds to the air flow openings 194 and is in fluid communication with the air flow openings 194. The air flow line 192 is also in fluid communication with the air controller 158. The air flow line 192 is flexible to accommodate the movement of the clamping plate 188 relative to the support arm 170. In this embodiment, it is contemplated that compressed air is used in combination with a venturi device to generate a vacuum source.

[0056] The air controller 158 is an air flow directing device. In some embodiments, the air controller 158 is an electric air pump. In other embodiments, the air controller 158 is a pneumatic venturi device associated with an electrically or mechanically actuated valve. In these embodiments, the air controller 158 is in fluid communication with the bus 112 and is pneumatically powered by the bus air source 108c. In some embodiments, the air controller 158 is electrically connected to the bus 112. In other embodiments, the air controller 158 is electrically connected to the battery 156. Thus, the air controller 158 is powered by the bus power source 108a and / or the battery 156. In some embodiments, the air controller 158 is controlled by the main controller 110a via the bus 112. In various embodiments, the air controller 158 is electrically connected to the second transceiver 154 and is controlled by the main controller 110a via the first transceiver 114 and the second transceiver 154. In other words, the air controller 158 receives instructions from the main controller 110a to draw air through the air flow opening 194 and the air flow line 192, thereby forming a vacuum between the membrane 126 and the clamping plate 188, which will be explained in more detail below.

[0057] refer to Figures 7 to 10 In some embodiments, the hot wire assembly 176 further includes an onboard heater controller 196. The heater controller 196 is electrically connected to the cutting mechanism 182. In these embodiments, the cutting mechanism 182 includes one or more cartridge heaters.

[0058] The support arm 170 engages the slide plate 168 to extend outwardly from the rail 166. The support arm 170 is hollow to reduce weight and serves as a housing for the air controller 158, air flow line 192, heater controller 196, and / or wiring for powering the hot wire assembly 176.

[0059] Special reference Figure 4 In some embodiments, the forming assembly 136 further includes one or more module sensors 198. The operation of the module sensors 198 will be described in more detail below.

[0060] Now refer to Figure 11 The main controller 110a, the track controller 110b, the bus 112, the first transceiver 114, the alignment sensor 116a, the track sensor 116b, the bracket assembly 134, the linear drive 150, the second transceiver 154, the air controller 158, the hot wire assembly 178 and the module sensor 198 are collectively referred to as the electronic components 200 of the film processing station 100.

[0061] In some embodiments, the bus 112 couples the main controller 110a, the linear actuator 150, the air controller 158, the hot wire assembly 176, and the module sensor 198. In some embodiments, the linear actuator 150, the air controller 158, the hot wire assembly 176, and the module sensor 198 are coupled to the second transceiver 154, which is wirelessly connected to the first transceiver 114. The bus 112 can be implemented in accordance with the Controller Area Network (CAN) bus protocol defined by the International Organization for Standardization (ISO) 11898-1, the Media Oriented Systems Transport (MOST) bus protocol, the CAN Flexible Data (CAN-FD) bus protocol (ISO 11898-7), the K-line bus protocol (ISO 9141 and ISO 14230-1), and / or the Ethernet bus protocol IEEE 802.3 (2002 edition and above).

[0062] The first transceiver 114 and the second transceiver 154 include a wired or wireless network interface to connect to each other and to an external network. The first transceiver 114 and the second transceiver 154 also include hardware (such as a processor, memory, storage device, antenna, etc.) and software to control the wired or wireless network interface. In some embodiments, the first transceiver 114 and the second transceiver 154 include a wired or wireless interface (such as an auxiliary port, a universal serial bus (USB) port, The thin film processing station 100 can be connected to an external network via a mobile device (e.g., a wireless node, etc.). The external network can be a public network such as the Internet, a private network such as an intranet, or a combination thereof, and can utilize various network protocols currently available or to be developed, including but not limited to TCP / IP-based network protocols.

[0063] Track sensor 116b is a position sensor (e.g., an eddy current sensor, an ultrasonic sensor, a Hall effect sensor, an inductive sensor, etc.) used to detect the position of film processing module 102 along support rail 106. Registration sensor 116a and module sensor 198 are feature detection sensors (e.g., a camera, an optical sensor, an ultrasonic sensor, an RF sensor, etc.) used to detect and locate boundaries 132 on film 126 and / or provide discrete input to linear actuator 150 to execute a specific motion or motion profile.

[0064] The main controller 110a includes a main processor 202a and a main memory 204a. The track controller 110b includes a track processor 202b and a track memory 204b. The processors 202a and 202b can be any suitable processing device or set of processing devices, including but not limited to a microprocessor, a microcontroller-based platform, an integrated circuit, one or more field programmable gate arrays (FPGAs), and / or one or more application-specific integrated circuits (ASICs). The memory 204a and 204b can be volatile memory (e.g., non-volatile RAM, magnetic RAM, ferroelectric RAM, etc.), non-volatile memory (e.g., disk storage, flash memory, EPROM, EEPROM, memory-based non-volatile solid-state memory, etc.), unchangeable memory (e.g., EPROM), read-only memory, and / or mass storage devices (e.g., hard disk drives, solid-state drives, etc.). In some examples, the memory 204a and 204b include multiple types of memory, particularly volatile memory and non-volatile memory.

[0065] The memory 204a, b is a computer-readable medium that can embed one or more sets of instructions, such as software for executing the methods of the present disclosure. The instructions can embody one or more methods or logic described herein. For example, during execution of the instructions, the instructions may reside completely or at least partially within any one or more of the memory 204a, b, the computer-readable medium, and / or the processor 202a, b.

[0066] The terms "non-transitory computer-readable medium" and "computer-readable medium" include a single medium or multiple media, such as a centralized or distributed database, and / or associated caches and servers that store one or more sets of instructions. Furthermore, the terms "non-transitory computer-readable medium" and "computer-readable medium" include any tangible medium that can store, encode, or carry a set of instructions for execution by a processor, or any tangible medium that causes a system to perform any one or more of the methods or operations disclosed herein. For example, the term "computer-readable medium" as used herein is expressly defined to include any type of computer-readable storage device and / or storage disk, and to exclude propagating signals.

[0067] The main processor 202a is configured to include a module analyzer 206 (see Figure 12 The module analyzer 206 includes a module positioner 208 , a film boundary detector 210 , an offset determiner 212 , a module position regulator 214 , a hot wire activator 216 , a vacuum determiner 218 , and a clamping regulator 220 .

[0068] In operation, the module positioner 208 receives signals from the track sensor 116b corresponding to the position of each film-processing module 102 along the support track 106. The module positioner 208 monitors the position of each film-processing module 102 as the film-processing modules 102 move about the support track 106. As the module positioner 208 monitors the position of the film-processing modules 102, the module position adjuster 214, via the track controller 110b, adjusts the position of each film-processing module 102 along the support track 106 and relative to each other, for example, to move the film-processing modules 102 to prevent collisions during film operations.

[0069] In further operations, such as Figure 2 As shown, Figure 12 The module position adjuster 214 moves each film processing module 102 to the starting position 230 along the support rail 106. When the film processing module 102 is moved to the starting position 230, as shown in FIG. Figure 4 and 7 As shown, the gripping adjusters 220 move their respective upper multi-function assemblies 152 to a ready position 232 relative to the base 148. Figure 2 As shown, the start position 230 is distal to the film 126. Thus, the film processing module 102 does not interfere with the film 126 until the upper multi-function assembly 152 is in the ready position 232. When the upper multi-function assembly 152 is in the ready position 232, the film processing module 102 is ready to receive the film 126 between the upper multi-function assembly 152 and the base 148. In some embodiments, the distance between the clamping plate 188 and the base 148 is approximately 1 to 3 inches (2.54 to 7.62 centimeters) when the upper multi-function assembly 152 is in the ready position 232. In a preferred embodiment, the distance between the clamping plate 188 and the base 148 is approximately 2.1 inches (5.3 centimeters) when the upper multi-function assembly 152 is in the ready position 232. Furthermore, when the upper multi-function assembly 152 is in the ready position 232, the hot wire assembly 176 is positioned between the support arm 170 and the clamping plate 188.

[0070] In further operation, in some embodiments, the hot wire activator 216 energizes the hot wire assembly 176 in preparation for cutting the film 126. More specifically, the hot wire activator 216 accesses the position of the film processing module 102 along the support rail 106 as determined by the module positioner 208. The hot wire activator 216 then turns on the hot wire assembly 176 so that the cutting mechanism 182 is heated in time to further cut the film 126 along the support rail 106. Thus, the hot wire activator 216 uses information provided by the rail sensor 116 to coordinate and synchronize the energization of the hot wire assembly 176 relative to the support rail 106. In other words, the hot wire activator 216 determines the heating time for the cutting mechanism 182 so that the cutting mechanism 182 is ready to cut the film 126 along the first side 118.

[0071] In other embodiments, during operation, when the cutting mechanism 182 includes a cartridge heater, the hot wire assembly 176 is continuously heated by the on-board heater controller 196 .

[0072] Return to the operation, such as Figure 11 The module position adjuster 214 is shown to continuously move each film processing module 102 along the second circular end 124 toward the first side 118 to intercept the film 126. When the film processing module 102 meets the film 126, the upper multi-function assembly 152 is located above the film and the base 148 is located below the film 126. When the film processing module 102 reaches the alignment position 234 along the first side 118 of the support rail 106, as shown in FIG. Figure 1 and Figure 2 As shown, the film processing module 102 spans the axis A along which the film 126 is formed. Figure 1 As shown, when the film processing module 102 reaches the aligned position 234, its respective upper multi-function assembly 152 and base 148 extend the film 126 relative to the support rail 106. In other words, once the film processing module 102 is in the aligned position 234, the film 126 is positioned between the upper multi-function assembly 152 and base 148 and is generally perpendicular to the upper multi-function assembly 152 and base 148. Furthermore, once the film processing module 102 reaches the aligned position 234, the film processing module 102 is generally perpendicular to the first side 118. Thus, after reaching the aligned position 234, the film processing module 102 moves along the support rail 106 parallel to the first side 118 and the axis A.

[0073] Further operations, in some embodiments, such as Figure 2 As shown, Figure 12 The thin film boundary detector 210 is Figure 11The module sensor 198 receives a signal to detect the boundary 132 on the film 126. In other words, the film boundary detector 210 uses the module sensor 198 to look down at the film 126 to search for the boundary 132. It should be understood that when the film 126 is provided to the film processing station 100 and meets the film processing module 102 at the alignment position 234, the boundary 132 may not be directly below the upper multi-function assembly 152.

[0074] Furthermore, in further operation, in these embodiments, once the film boundary detector 210 detects a boundary 132 on the film 126, such as Figure 2 As shown, Figure 12 The offset determiner 212 of the embodiment of the present invention determines an offset 236 of the demarcation 132 with respect to the cutting mechanism 182. More specifically, the offset determiner 212 accesses the position of the film processing module 102 along the support rail 106 as determined by the module positioner 208 to determine the distance between the demarcation 132 and the cutting mechanism 182. In other words, in such an embodiment, the offset determiner 212 utilizes information provided by the module sensor 198 and the rail sensor 116 to determine the degree to which the film processing module 102 is out of sync with the detected demarcation 132 along the axis A.

[0075] Continuing, in various embodiments, such as Figure 2 As shown, Figure 12 The thin film boundary detector 210 is Figure 2 and Figure 11 The registration sensor 116a receives a signal to detect the boundary 132 on the film 126. In other words, the film boundary detector 210 looks down at the film 126 to search for the boundary 132 using the registration sensor 116a.

[0076] In further operation, in such an embodiment, when the film boundary detector 210 detects two or more boundaries 132 on the film 126, as Figure 2 As shown, Figure 12 The offset determiner 212 determines the frequency ("pitch") at which the boundaries 132 pass through the registration sensor 116a. Figure 2 As shown, based on the frequency, the offset determiner 212 determines the offset 236 of each boundary 132 relative to each other. In other words, in such an embodiment, the offset determiner 212 uses information provided by the registration sensor 116a and the track sensor 116b to determine the degree to which the film processing module 102 is out of sync with the detected boundary 132 along the axis A.

[0077] Continue to operate, such as Figure 2As shown, the module position adjuster 214 continuously moves the film processing module 102 along the first side 118 from the alignment position 234 to the first pressing position 238. As the film processing module 102 transitions from the alignment position 234 to the first pressing position 238, the module position adjuster 214 adjusts the position of the film processing module 102 to mitigate and / or synchronize with the offset 236. More specifically, as shown in FIG8 , in some embodiments, as the film processing module 102 moves from the alignment position 234 to the first pressing position 238, the module position adjuster 214 adjusts the speed at which the film processing module 102 moves relative to the film 126 along the axis A to introduce the boundary 132 between the inlay 160 and the cutting mechanism 182. In some embodiments, the module position adjuster 214 adjusts the speed at which the film processing module 102 moves along the axis A to cause the boundary 132 to coincide with a predetermined reference point of the film processing module 102. In other words, the module position adjuster 214 uses information provided by the track sensor 116b, the registration sensor 116a, and / or the module sensor 198 to coordinate and synchronize the position of the thin film processing modules 102 relative to the demarcation 132.

[0078] Also in operation, when the film processing module 102 transitions from the alignment position 234 to the first pressurization position 238, as shown in FIG. Figure 5 and 8 As shown, the gripping adjusters 220 move their respective upper multi-function assemblies 152 to a gripping position 242 relative to the base 148 .

[0079] As the upper multi-function assembly 152 moves downwardly toward the base 148, the clamping plates 188 contact the membrane 126 to compress the first lower biasing member 174a and the second lower biasing member 174b. Figure 5 and 8 In the illustrated clamped position 242 , the first and second lower biasing members 174 a , 174 b are compressed, and a portion of the membrane 126 is clamped between the clamping plate 188 and the base 148 .

[0080] When the film processing modules 102 reach the first pressing position 238 along the first side 118, their respective upper multi-function assemblies 152 reach a clamping position 242 relative to the base 148. In a preferred embodiment, when the upper multi-function assemblies 152 are in the clamping position 242, the cutting mechanism 182 is approximately 0.1 inches (2.54 mm) away from the base 148.

[0081] In addition, in further operations, such as Figure 2As shown, the module position adjuster 214 continuously moves the film processing module 102 along the first side 118 from the first pressing position 238 to the second pressing position 244. As a result, the clamped film 126 is brought from the first pressing position 238 to the second pressing position 244. In some embodiments, the length of the linear first side 118 is formed to correspond to the time required to perform the cutting and sealing operations on a given film material.

[0082] Continuing with the operation, in the process of transporting the film processing module 102 from the first pressurizing position 238 to the second pressurizing position 244, as shown in FIG. Figure 6 and 9 As shown, the gripper adjusters 220 move their respective upper multi-function assemblies 152 to a cutting position 246 relative to the base 148 .

[0083] As the upper multi-function assembly 152 moves from the clamping position 242 to the cutting position 246, the clamping plate 188 remains stationary relative to the base 148, and the first lower biasing member 174a and the second lower biasing member 174b are compressed between the clamping plate 188 and the carrier plate 180. Therefore, when the heating wire assembly 176 is moved toward the base 148, the film 126 is tightly clamped between the clamping plate 188 and the base 148.

[0084] As the film processing module 102 continues to be transported from the first pressurizing position 238 to the second pressurizing position 244, the upper multi-function assembly 152 moves further toward the cutting position 246 relative to the base 148 while the first lower biasing member 174a and the second lower biasing member 174b are compressed. As a result, the cutting mechanism 182 presses the film 126 toward the inlay 160 through the cutting opening 190, cutting and sealing the film 126 and contacting the inlay 160. In other words, when the film processing module 102 is located between the first pressurizing position 238 and the second pressurizing position 244, the cutting mechanism 182 cuts and seals the film 126.

[0085] More specifically, the gripper adjuster 220 accesses the position of the film processing module 102 along the support rail 106, as determined by the module positioner 208. The gripper adjuster 220 then moves the upper multifunctional assembly 152 from the clamping position 242 to the cutting position 246 and positions the cut film 126 relative to the support rail 106 so that the hot wire assembly 176 remains at the cutting position 246 for a predetermined period of time. Thus, the gripper adjuster 220 uses information provided by the module sensor 198 and the rail sensor 116b to coordinate and synchronize the cutting of the film 126 relative to the support rail 106. In other words, the gripper adjuster 220 dynamically calculates the time it takes for the upper multifunctional assembly 152 to descend from the clamping position 242 to the cutting position 246 so that the cutting mechanism 182 maintains contact with the film 126 for a period of time after the cut is completed. Consequently, a secure seal is achieved when the film product 142 is placed on the conveyor 104 at the delivery position 248, as will be explained in greater detail below. In some embodiments, the time it takes for the hot wire assembly 176 to move from the clamping position 242 to the cutting position 246 is between about 0.1 and about 2.0 seconds. Figure 9 and Figure 10 As shown, the compression of the film 126 between the cutting mechanism 182 and the insert 160 and the dwell time of the hot wire assembly 176 in the cutting position 246 act to apply the necessary heat and pressure to the predetermined location of the film 126 to cut the top layer 128 and the bottom layer 130 of the film 126, respectively, and fuse the top layer 128 and the bottom layer 130 into the leading seal 250 and the trailing seal 252. Figure 1 and Figure 2 As shown, the hot wire assembly 176 cuts the film 126 into individual sealed film products 142, such as bags, of predetermined lengths. Figure 6 and Figure 9 As shown, the inlay 160 acts as a positive stop for the cutting mechanism 182 and, based thereon, the upper multifunctional assembly 152 at the cutting location 246 .

[0086] In further operations, such as Figure 2As shown, the module position adjuster 214 continuously moves the film processing module 102 along the first side 118 from the second pressing position 244 to the conveying position 248. When the film processing module 102 is moved from the second pressing position 244 to the conveying position 248, the gripper adjuster 220 moves its respective upper multi-functional assembly 152 to an open position 254 relative to the base 148, as shown in FIG10 . In some embodiments, when the upper multi-functional assembly 152 is in the open position 254, the distance between the clamping plate 188 and the base 148 is approximately 3 to 7 inches (7.62 to 17.78 cm). In a preferred embodiment, when the upper multi-functional assembly 152 is in the open position 254, the clamping plate 188 is approximately 5.1 inches (12.95 cm) away from the base 148. Furthermore, the multi-functional assembly 152 and the film product 142 being conveyed are positioned on the conveyor 104. Furthermore, in the conveying position 248, the base 148 is positioned below the conveyor 104. When each film processing module 102 reaches the conveying position 248, the sealed film product 142 is placed on the conveyor 104. Figure 1 and 2 As shown, a series of individual sealed film products 142 are positioned along the conveyor 104 .

[0087] In some embodiments, the sealed film product 142 is temporarily held to the clamping plate 188 by adhesion and / or by electrostatic means.

[0088] In embodiments that include the air controller 158, during operation, when the upper multi-function assembly 152 is raised from the cutting position 246 to the open position 254, the vacuum actuator 218 energizes the air controller 158 to draw air from the airflow line 192 and the airflow opening 194. Consequently, the air controller 158 creates a vacuum between the cut film 126 and the clamping plate 188, and the cut film 126 is held on the clamping plate 188 by atmospheric pressure. In these embodiments, the vacuum actuator 218 de-energizes the air controller 158 at the delivery position 248 to release the cut film 126 from the clamping plate 188 onto the conveyor 104. Alternatively, in such embodiments, the vacuum actuator 218 reverses the air controller 158 at the delivery position 248 to blow the cut film 126 from the clamping plate 188 onto the conveyor 104. In these embodiments, the vacuum actuator 218 de-energizes the air controller 158 after the film product 142 is blown onto the conveyor 104.

[0089] While the above description describes how the upper multi-function assembly 152 is moved toward and away from the base 148, it is contemplated that in some embodiments, the thin film processing module 102 can be arranged such that the upper multi-function assembly 152 remains stationary relative to the linear actuator 150, and the base 148, engaged with the linear actuator 150, can be moved toward and away from the upper multi-function assembly 152. It is further contemplated that in some embodiments, the thin film processing module 102 can be arranged such that the upper multi-function assembly 152 and the base 148 are movably engaged with the linear actuator 150, thereby moving relative to each other. In other words, any arrangement in which the base 148 and the upper multi-function assembly 152 are moved relative to each other by the linear actuator 150 can be used.

[0090] Continuing with operation, in some embodiments, once the film product 142 is deposited on the conveyor 104, the hot wire activator 216 de-energizes the hot wire assembly 176. More specifically, the hot wire activator 216 accesses the position of the film processing module 102 along the support rail 106 as determined by the module positioner 208. When the film processing module 102 passes the conveyor position 248, the hot wire activator 216 subsequently de-energizes the hot wire assembly 176. Thus, the hot wire activator 216 uses information provided by the track sensor 116 to coordinate and synchronize the de-energization of the hot wire assembly 176 relative to the support rail 106. In other words, when the cutting mechanism 182 is not in use, the hot wire activator 216 calculates the de-energization time of the cutting mechanism 182 to conserve power.

[0091] Continuing operation, the module position adjuster 214 continuously moves the film processing module 102 to the starting position 230 along the first circular end 122 and the second side 120 (eg, the back stretch direction) of the support rail 106. Figure 3 and 7 As shown, the gripper adjuster 220 moves the upper multi-function assembly 152 to a ready position 232 relative to the base 148. Thus, the controller 110 prepares the film processing module 102 to receive a new continuous film 126 at the aligned position 234.

[0092] It is contemplated that, in addition to the coordination of film processing module 102 operations by master controller 110a using module analyzer 206, master controller 110a may additionally or alternatively dynamically coordinate functions performed by alternative film processing modules mounted on support rail 106. Thus, master controller 110a may coordinate and synchronize the clamping and cutting functions performed by film processing module 102 with additional functions performed by other types of modules. For example, master controller 110a may coordinate film processing module 102 performing clamping and cutting functions on a film with an imprinting module that imprints a decorative pattern and / or manufacturing information onto film 126, a printing module that prints a decorative pattern and / or manufacturing information onto film 126, a perforation module that punches holes into film 126, and the like.

[0093] Figure 13 is a flow chart illustrating an example method by which plastic film may be processed into bags. Figure 13 The flowchart represents the data stored in the memory (eg Figure 11 204a) in the memory 204a), and the machine-readable instructions include one or more instructions that when executed by a processor (e.g. Figure 11 When the processor 202a) executes, the main controller 110a is as follows Figure 1 and Figure 2 The support rail 106 is operated as Figures 1 to 10 The thin film processing module 102 is described in detail. Figure 13 The flowchart shown is used to describe an example process, but many other methods of operating the thin film processing module 102 on the support rail 106 may be used instead. For example, the order of execution of the blocks may be rearranged, changed, deleted, and / or combined to perform the method 300. In addition, because the method 300 is combined with the Figures 1 to 10 The components disclose the method 300 , and in the following description, some functions of the components will not be described in detail.

[0094] First, at block 302 , the main controller 110 a moves the film processing module 102 to the starting position 230 . Thus, the main controller 110 a positions the film processing module 102 along the support rail 106 at the starting position away from the film 126 .

[0095] At block 304, the main controller 110a moves the upper multi-function assembly 152 to the ready position 232. When the upper multi-function assembly 152 is in the ready position 232, the film processing module 102 is ready to receive the film 126 between the upper multi-function assembly 152 and the base 138. Figure 4As shown, when the upper multi-function assembly 152 is in the ready position 232, the first and second upper biasing members 172a, 172b and the first and second lower biasing members 174a, 174b are not compressed.

[0096] At block 306 , the main controller 110 a moves the film processing module 102 to the alignment position 234 . When the film processing module 102 is moved to the alignment position 234 , the film 126 is positioned between the upper multi-function assembly 152 and the base 148 .

[0097] At block 308, the main controller 110a adjusts the position of the film processing modules 102 along the support rails 106 to synchronize with one or more demarcations 132 on the film 126. The film processing modules 102 align with the demarcations 132 to produce film products 142 having regular dimensions.

[0098] At block 310, the main controller 110a moves the upper multi-function assembly 152 to the clamped position 242. When the upper multi-function assembly 152 is moved to the clamped position 242, the lower biasing members 174a, b are compressed, and the clamping plates 188 press the membrane 126 toward the base 148. Additionally, when the upper multi-function assembly 152 is in the clamped position 242, as shown in FIG. Figure 5 As shown, the first and second upper biasing members 172a, 172b are not compressed.

[0099] At block 312, the main controller 110a moves the film processing module 102 to the first pressing position 238. Thus, as the film processing module 102 reaches the first pressing position 238, the film processing module 102 delivers the clamped film 126.

[0100] In some embodiments, at block 314, the main controller 110a energizes the hot wire assembly 176. As a result, the cutting mechanism 182 of the hot wire assembly 176 is heated in preparation for cutting and sealing the film 126. It should be understood that in some embodiments, the hot wire assembly 176 is continuously heated by the onboard heater controller 196.

[0101] At block 316, the main controller 110a moves the upper multi-function assembly 152 to the cutting position 246. When the upper multi-function assembly 152 is lowered to the cutting position 246, the first lower biasing member 174a and the second lower biasing member 174b are further compressed, and the cutting mechanism 182 passes through the cutting opening 190 to cut and seal the film 126. The cutting mechanism 182 is forced to stop at the inlay 160.

[0102] At block 318, the main controller 110a moves the film processing module 102 to the second pressing position 244. Thus, the film processing module 102 transports the clamped film 126 as it moves toward the second pressing position 244. It should be appreciated that the time between the first pressing position 238 and the second pressing position 244 allows the cutting mechanism 182 to form the front and rear seals 250, 252.

[0103] In embodiments including the air controller 158 , the main controller 110a creates a vacuum in block 320 . More specifically, the main controller 110a energizes the air controller 158 to draw air through the air flow line 192 and the air flow opening 194 to force the membrane 126 against the clamping plate 188 .

[0104] At block 322, the main controller 110a moves the upper multi-function assembly 152 to the open position 254. In doing so, the main controller 110a raises the multi-function assembly 152 along with the film 126 from the base 148. When the multi-function assembly 152 moves to the open position 254, the cutting mechanism 182 is retracted from the film 126 through the cutting opening 190.

[0105] At block 324, the main controller 110a de-energizes the hot wire assembly 176. As a result, the cutting mechanism 182 is turned off. It should be understood that turning off the cutting mechanism 182 after the film 126 is cut and sealed can save power during the production of the film product 142.

[0106] At block 326 , the main controller 110 a moves the film processing module 102 to the delivery position 248 . As a result, the upper multi-function assembly 152 and the delivered film product 142 are placed on the conveyor 104 .

[0107] In embodiments that include the air controller 158, the main controller 110a releases the vacuum at block 328. In some embodiments, the main controller 110a de-energizes the air controller 158, and the film product 142 passively falls onto the conveyor 104. In some embodiments, the main controller 110a reverses the air controller 158 to actively blow the film product 142 onto the conveyor 104, and then de-energizes the air controller 158. It will be appreciated that de-energizing the air controller 158 after depositing the film product 142 on the conveyor 104 can conserve electrical energy during the production of the film product 142. The method 300 then returns to block 302.

[0108] In summary, it should be appreciated that the film processing station 100 disclosed in the disclosed systems and methods reduces the number of machines and associated floor space required to produce film products, thereby facilitating lower manufacturing costs and energy consumption. Furthermore, because the film processing modules 102 are interchangeable, individual film processing modules 102 can be easily removed from the film processing station 100 (e.g., for maintenance), thereby reducing unproductive downtime and associated costs of the film processing station 100. Furthermore, because the cutting mechanism 182 retracts above the clamping plate 188 after resting on the film 126, the film processing modules 102 can produce film products 142 with robust seals while reducing production defects, associated scrap, and disposal costs.

[0109] Furthermore, because the disclosed film processing station 100 dynamically aligns the film processing module 102 with the sheet of film 102, asynchronous processing and cutting of patterns on pre-printed film rolls (sometimes referred to as "creep") is avoided. An advantage of the film processing station 100 system and associated methods is that the relative positions of the film processing module 102 and the sheet of film 126 provided to the film processing station 100 can be adjusted in real time. Thus, the film processing station 100 system and associated methods can compensate for variations between supplied sheets of film 126 without stopping production. These advantages are also applicable to any process involving sheets from the same or different sources and / or achieving uniform cutting between film products.

[0110] Although various spatial and directional terms such as top, bottom, lower, middle, side, horizontal, vertical, front, etc. may be used to describe examples of the present invention, it is understood that these terms are specific to the orientation shown in the drawings and may be inverted, rotated, or otherwise changed in orientation so that top becomes bottom, horizontal becomes vertical, etc., and vice versa.

[0111] Variations and modifications to the foregoing are within the scope of this disclosure. It should be understood that the examples disclosed and defined herein extend to all optional combinations of two or more independent features mentioned and demonstrated by the specification and / or drawings. All of these different combinations constitute various alternative aspects of the present invention. The examples described herein explain the best known modes for practicing the present invention and enable those skilled in the art to utilize the present invention. To the extent permitted by the prior art, the claims are interpreted to include alternative examples.

Claims

1. A thin film processing system, characterized in that: include: Thin film processing modules; and A processor and a memory connected to the thin film processing module, the processor and the memory being configured to: dynamically coordinating the movement of the thin film processing modules relative to the moving thin film sheet, instructing the film processing module to clamp the film sheet, instructing the film processing module to transport the clamped film sheet from a first position to a second position, and The thin film processing module is instructed to perform a function on the clamped thin film sheet using the thin film processing module.

2. The thin film processing system according to claim 1, characterized in that: The film processing module is adapted to cut and seal the film.

3. The thin film processing system according to claim 2, characterized in that: The processor is configured to maintain contact between the cutting mechanism of the thin film processing module and the thin film sheet for a predetermined period of time.

4. The thin film processing system according to claim 1, characterized in that Also included is a support track, wherein the thin film processing module is movably mounted on the support track.

5. The thin film processing system according to claim 4, characterized in that: The thin film processing module is powered by a bus arranged concentrically with the support rail.

6. The thin film processing system according to claim 4, characterized in that: The support track includes a plurality of track sensors coupled to the processor, and the processor is further configured to monitor a position of the thin film processing module along the support track.

7. The thin film processing system according to claim 4, characterized in that: The support rail forms a curved loop.

8. The thin film processing system according to claim 7, characterized in that: The support rail is elliptical.

9. The thin film processing system according to claim 8, characterized in that: The film sheet moves along an axis adjacent to and parallel to the support track.

10. The thin film processing system according to claim 1, characterized in that: The thin film processing module includes a module sensor coupled to the processor, and the processor is further configured to determine an offset of the thin film processing module relative to a boundary of the thin film sheet based on information from the module sensor.

11. The thin film processing system according to claim 10, characterized in that: The processor is further configured to move the thin film processing module relative to the thin film sheet to reduce the offset.

12. The thin film processing system according to claim 11, characterized in that: The processor is further configured to cut the film sheet by the film processing module when the offset is reduced.

13. The thin film processing system according to claim 1, characterized in that The thin film processing module is one of a plurality of thin film processing modules, and the processor is further configured to dynamically coordinate movement of the thin film processing modules with each other.

14. The thin film processing system according to claim 13, characterized in that: a first set of a plurality of thin film processing modules adapted to perform a first function on the thin film sheet; and A second set of the plurality of thin film processing modules is adapted to perform a second function on the thin film sheet.

15. The thin film processing system according to claim 1, characterized in that: The processor is further configured to control an air controller of the film processing module to draw a vacuum to hold a film product formed from the film sheet.

16. The thin film processing system according to claim 1, characterized in that The processor and the thin film processing module are wirelessly connected to each other.

17. The thin film processing system according to claim 1, characterized in that The thin film processing module includes a battery and is powered by the battery.

18. The thin film processing system according to claim 1, wherein: The film processing module includes one or more cutting wires and a heatable knife.

19. The thin film processing system according to claim 1, wherein: Also included is a registration sensor adjacent to the film sheet, the registration sensor configured to detect a boundary on the film sheet.

20. The thin film processing system according to claim 19, wherein: The processor and memory further determine a frequency of the boundaries as they pass the registration sensor, and an offset between the boundaries.

21. The thin film processing system according to claim 20, characterized in that: The processor and memory dynamically coordinate movement of the thin film processing modules relative to a moving thin film sheet based on the offset.

22. A thin film processing module, characterized in that: include: a carriage assembly configured to move along a support track, the support track forming a curved loop; a linear actuator engaged with the carriage assembly; an upper multi-function assembly engaged with the linear actuator to perform a function on the membrane adjacent the support rail; and a modular sensor for detecting the boundary of said film, wherein the upper multifunctional component is adapted to clamp the film, and The upper multifunctional assembly further comprises an air controller of the film processing module, wherein the air controller is used to draw a vacuum to maintain the film product formed from the film sheet.

23. The thin film processing module according to claim 22, characterized in that The module sensor is an optical sensor.

24. The thin film processing module according to claim 22, characterized in that The upper multifunctional component is adapted to cut and seal the film.

25. The thin film processing module according to claim 22, characterized in that One or more of the carriage assembly, the linear drive, and the upper multi-function assembly are powered by a bus disposed concentrically with the support rail.

26. The thin film processing module according to claim 22, characterized in that Also included is a battery, wherein one or more of the carriage assembly, the linear drive, and the upper multi-function assembly are powered by the battery.

27. The thin film processing module according to claim 22, characterized in that Also included is a transceiver for wirelessly receiving commands from a remote controller.

28. A method for producing a thin film product, characterized in that: The method comprises the following steps: dynamically coordinating movement of the film processing module relative to the moving film sheet using a processor; instructing the film processing module to perform a function on the film sheet using the processor; instructing the film processing module to transport film products cut from the film sheet using the processor; and The processor is used to instruct the film processing module to maintain contact between a cutting mechanism of the film processing module and the film sheet for a predetermined time.

29. The method according to claim 28, characterized in that The cutting mechanism includes one or more cutting wires and a heatable knife.

30. The method according to claim 28, wherein The following steps are also included: The processor is used to determine an offset of the thin film processing module relative to a boundary on the thin film sheet based on information from a module sensor installed in the thin film processing module.

31. The method according to claim 30, wherein The following steps are also included: The processor is used to instruct the thin film processing module to move relative to the thin film sheet to reduce the offset.

32. The method according to claim 31, characterized in that The following steps are also included: When the offset is reduced, the processor is used to instruct the thin film processing module to cut the thin film sheet using the thin film processing module.

33. The method according to claim 28, wherein The thin film processing module is one of a plurality of thin film processing modules, and further comprising dynamically coordinating movement of the thin film processing modules with each other using the processor.

34. The method according to claim 28, wherein The step of instructing the film processing module to deliver the film product comprises the following steps: The processor is used to control an air controller of the film processing module to draw a vacuum to hold the film product.

35. A thin film processing module, characterized in that include: a carriage assembly movable along a support track, the support track forming a curved loop; a linear actuator engaged with the carriage assembly; a base engaged with the linear actuator; and an upper multi-function assembly drivably engaged with the linear actuator for movement relative to the base, the upper multi-function assembly comprising: a clamping plate for selectively clamping a portion of the film relative to the base; and a cutting mechanism for cutting and sealing said portion of the film, wherein, when current is applied to the cutting mechanism, the cutting mechanism is heated, Wherein, the upper multifunctional assembly further comprises an air controller of the film processing module, the air controller being used to draw a vacuum to hold the film product relative to the clamping plate.

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