A high-frequency universal electronic tag antenna assembly and an electronic tag
CN115360500BActive Publication Date: 2026-07-24XIAMEN XINDECO IOT TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAMEN XINDECO IOT TECH
- Filing Date
- 2022-09-22
- Publication Date
- 2026-07-24
AI Technical Summary
Technical Problem
The poor compatibility of antenna components in existing high-frequency electronic tags means that redesign is required when replacing tag chips, which is costly and inconvenient for production and management.
Method used
Design a high-frequency universal electronic tag antenna assembly, which adopts a substrate, a planar spiral antenna body, multiple chip pad assemblies and interconnection units. Electrical connection between the chip pad assemblies and the antenna body is achieved through through-holes, and it is compatible with a variety of tag chips.
Benefits of technology
It achieves compatibility with various high-frequency tag chips, is easy to use, has a high degree of integration, reduces production and management costs, and has a simple structure.
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Figure CN115360500B_ABST
Abstract
The present application relates to the field of electronic tags, in particular to a high-frequency universal electronic tag antenna assembly and an electronic tag. The present application discloses a high-frequency universal electronic tag antenna assembly and an electronic tag, wherein the electronic tag antenna assembly comprises a substrate, a planar spiral antenna body, a plurality of chip pad assemblies and a plurality of communication units, the planar spiral antenna body and the plurality of chip pad assemblies are arranged on the front surface of the substrate, the plurality of communication units are arranged on the back surface of the substrate, the plurality of communication units correspond to the plurality of chip pad assemblies one by one, and are used for connecting the plurality of chip pad assemblies to different positions of the antenna body respectively, the communication units and the chip pad assemblies are insulated by the substrate and can be connected to each other through the perforations. The electronic tag antenna assembly of the present application can be compatible with a plurality of high-frequency tag chips, is simple to use, is convenient for production and management, has low cost, and has a simple structure and is easy to implement.
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Citation Information
Patent Citations
CN101828209A
CN105740938A
JP2006189961A