A semiconductor wafer baking apparatus

Abstract

The application discloses a semiconductor wafer baking device, which comprises a box body, a plurality of first heating elements arranged in the box body, two vertical plates and two conductive blocks arranged in the box body, and a conductive plate arranged on the vertical plate, and further comprises a placing device which comprises a plurality of support plates, support rods, rollers and placing discs, the support rods are arranged between the support plates, the rollers are arranged on one of the support plates, a plurality of metal discs are arranged on the placing disc, and a second heating element is arranged in the support plate; a plurality of unloading conductive devices which comprise a toothed belt, a conductive rod, a vertical rod, a push rod, two rotating rods, two gears and two tail plates, the rotating rods are rotatably arranged on the box body, the gears are arranged on the rotating rods, the toothed belt is connected with the two gears, the conductive rod and the vertical rod are arranged on the toothed belt, and the two tail plates are arranged on one of the rotating rods. In the application, the baking efficiency can be improved, and the phenomenon of not being baked after the wafer is placed into the box body can be avoided.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, and in particular to a semiconductor wafer baking apparatus. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. Wafer production involves a series of processes to manufacture semiconductor devices on and within the wafer surface. During this process, multiple stages require heat treatment of the wafer. Existing baking equipment is inefficient, and operators often forget to turn on the power switch, resulting in unbaked wafers, which is a drawback. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned technical problems and to provide a semiconductor wafer baking apparatus.

[0004] The technical solution of the present invention: A semiconductor wafer baking apparatus includes a housing, a cover door rotatably disposed on one side of the housing, a plurality of first heating elements disposed inside the housing, two vertical plates and two conductive blocks disposed inside the housing, and a conductive plate disposed on the vertical plates, and further includes:

[0005] A placement device includes a plurality of support plates, support rods, rollers, and placement trays. The support rods are disposed between the support plates, the rollers are disposed on one of the support plates, the placement trays are detachably disposed on the support plates, and the placement trays are provided with a plurality of metal discs. A second heating element is disposed inside the support plates.

[0006] Several unloading guide devices include a toothed belt, a conductive rod, a vertical rod, a push rod, two rotating rods, two gears, and two tail plates. The rotating rods are rotatably mounted on the box body, the gears are mounted on the rotating rods, the toothed belt connects the two gears, the conductive rods and vertical rods are respectively mounted on the toothed belt, the push rods are mounted on one of the support plates, and the two tail plates are mounted on one of the rotating rods.

[0007] Preferably, one side of the vertical plate is inclined; two guide plates are provided on the tail plate.

[0008] Preferably, the bottom of the support plate is provided with a plurality of through holes.

[0009] Preferably, handles are provided on both ends of the placement tray.

[0010] Preferably, it also includes a prompting device that sounds an alarm when the wafer is baked.

[0011] Preferably, the prompting device includes a time relay, a controller, and a sound alarm. When the time relay is energized and reaches its preset value, it sends a signal to the controller, which then controls the sound alarm to emit an alarm sound.

[0012] The beneficial effects of this invention are: it can improve baking efficiency and avoid the phenomenon of unbaked wafers after they are placed in the chamber. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0014] Figure 2 This is a schematic diagram of the box body in a preferred embodiment of the present invention;

[0015] Figure 3 This is a schematic diagram of the connection between the rotating rod and the tail plate in a preferred embodiment of the present invention;

[0016] Figure 4 This is a schematic diagram of the vertical plate in a preferred embodiment of the present invention;

[0017] Figure 5 This is a top view of the connection between the support plate and the placement plate in a preferred embodiment of the present invention;

[0018] Figure 6 This is a cross-sectional view of the connection between the support plate and the placement plate in a preferred embodiment of the present invention;

[0019] Figure 7 yes Figure 6 Enlarged view of a portion of point A in the middle;

[0020] Figure 8 This is a schematic diagram of the unloading guide device in a preferred embodiment of the present invention.

[0021] Reference numerals in the attached drawings: box body 10, vertical plate 101, conductive plate 1011, conductive block 102, cover door 2, first heating element 3, support plate 4, second heating element 41, through hole 42, support rod 5, roller 6, placement tray 7, metal tray 71, handle 72, toothed belt 8, conductive rod 9, vertical rod 11, push rod 12, rotating rod 13, gear 14, tail plate 15, guide plate 151. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Reference Figures 1 to 8 A semiconductor wafer baking apparatus includes a housing 10, a cover 2 rotatably disposed on one side of the housing 10, a plurality of first heating elements 3 disposed inside the housing 10, two vertical plates 101 and two conductive blocks 102 disposed inside the housing 10, and a conductive plate 1011 disposed on the vertical plates 101, and further includes:

[0024] The placement device includes a number of support plates 4, support rods 5, rollers 6 and placement trays 7. The support rods 5 are arranged between the support plates 4, the rollers 6 are arranged on one of the support plates 4, the placement trays 7 are detachably arranged on the support plates 4, and a number of metal trays 71 are arranged on the placement trays 7. A second heating element 41 is arranged inside the support plates 4.

[0025] Several unloading guide devices include a toothed belt 8, a conductive rod 9, a vertical rod 11, a push rod 12, two rotating rods 13, two gears 14, and two tail plates 15. The rotating rods 13 are rotatably mounted on the housing 10, the gears 14 are mounted on the rotating rods 13, the toothed belt 8 connects the two gears 14, the conductive rods 9 and the vertical rods 11 are respectively mounted on the toothed belt 8, the push rods 12 are mounted on one of the support plates 4, and the two tail plates 15 are mounted on one of the rotating rods 13. In this invention, during wafer baking, the wafer is first placed in a metal tray 71. After the metal tray 71 is full of wafers, several support plates 4, support rods 5, and rollers 6 form a trolley. Pushing the support plates 4 moves the trolley, and the tail plate 15 facilitates the movement of the rollers 6 into the housing 10. When the push rod 12 contacts the vertical rod 11, it pushes the vertical rod 11 to move, causing the toothed belt 8 to rotate, which in turn drives the rotating rod 13 to rotate, causing the tail plate 15 to rotate vertically and retract into the housing 10. Simultaneously, the conductive rod 9 contacts two conductive blocks 102, and the second heating element 41 contacts the conductive plate 1011. The entire electrical equipment is then connected, and several first heating elements 3 and several second heating elements 41 are energized and heat up, baking the wafer. After baking, open the cover door 2 and pull the support rod 5 to move the trolley outward. When one side of the support plate 4 contacts the tail plate 15, a force is applied to the tail plate 15 to make the rotating rod 13 rotate in the opposite direction. The tail plate 15 is horizontal. When the roller 6 moves onto the tail plate 15, the tail plate 15 is subjected to gravity and swings downward until one end contacts the ground. The toothed belt 8 drives the conductive rod 9 back to its original position, the entire circuit is disconnected, and several first heating elements 3 and several second heating elements 41 are de-energized. Take out the placement tray 7 on the support plate 4 and put in a new placement tray 7 filled with wafers. Push the trolley back into the box 10 for baking. Alternatively, the trolley filled with wafers to be baked can be directly pushed into the box 10 for baking. In this device, the second heating element 41 heats the metal disk 71, which then transfers heat to the wafer, heating its bottom and improving baking efficiency. A trolley is formed by several support plates 4, support rods 5, and rollers 6, replacing the traditional method of placing wafers one by one into the housing 10, baking them, and then removing them. This reduces the time spent placing and removing wafers, thereby improving efficiency. The toothed belt 8 drives the tail plate 15 to swing, facilitating the movement of the rollers 6 into the housing 10 without requiring manual retraction of the tail plate 15. Furthermore, the toothed belt 8 drives the conductive rod 9 to move back and forth, automatically switching the power on and off of several first heating elements 3 and several second heating elements 41, preventing the phenomenon of wafers being placed into the housing 10 without being baked. Specifically, a square groove is provided on the bottom wall of the box 10, and the rotating rod 13 is rotatably mounted on the two side walls of the square groove. The conductive block 102 and the toothed strip 8 are mounted in the square groove. A placement groove is provided on the bottom wall of the box 10, and the tail plate 15 can rotate in the placement groove. The placement groove is connected to the square groove. A sliding groove is provided on the bottom wall of the box 10, and the vertical rod 11 slides in the sliding groove.

[0026] As a preferred embodiment of the present invention, it may also have the following additional technical features:

[0027] In this embodiment, one side of the vertical plate 101 is inclined; two guide plates 151 are provided on the tail plate 15 to facilitate the two ends of the support plate 4 to abut against the side of the vertical plate 101.

[0028] In this embodiment, the bottom of the support plate 4 is provided with several through holes 42 to facilitate the heat transfer.

[0029] In this embodiment, handles 72 are provided on both ends of the placement tray 7 to facilitate the removal of the placement tray 7 from the support plate 4.

[0030] This embodiment also includes a prompting device that emits an alarm sound after the wafer baking is complete.

[0031] In this embodiment, the alerting device includes a time relay, a controller, and a sound alarm. When the time relay is energized and reaches its preset value, it sends a signal to the controller, which then controls the sound alarm to sound. When the conductive rod 9 contacts the two conductive blocks 102, the time relay is energized and operates. When the time relay reaches its preset value, it sends a signal to the controller, which then controls the sound alarm to sound. Specifically, the time relay, controller, and sound alarm are mounted on the wall.

[0032] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0033] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer baking apparatus, comprising a housing (10), wherein a cover (2) is rotatably provided on one side of the housing (10), and a plurality of first heating elements (3) are provided inside the housing (10), characterized in that, The housing (10) is provided with two vertical plates (101) and two conductive blocks (102). The vertical plates (101) are provided with conductive plates (1011). The housing also includes: The placement device includes a number of support plates (4), support rods (5), rollers (6), and placement trays (7). The support rods (5) are arranged between the support plates (4), the rollers (6) are arranged on one of the support plates (4), the placement trays (7) are detachably arranged on the support plates (4), and a number of metal discs (71) are arranged on the placement trays (7). A second heating element (41) is arranged inside the support plates (4). Several unloading guide devices include a toothed belt (8), a conductive rod (9), a vertical rod (11), a push rod (12), two rotating rods (13), two gears (14), and two tail plates (15). The rotating rod (13) is rotatably mounted on the box (10), the gear (14) is mounted on the rotating rod (13), the toothed belt (8) connects the two gears (14), the conductive rod (9) and the vertical rod (11) are respectively mounted on the toothed belt (8), the push rod (12) is mounted on one of the support plates (4), and the two tail plates (15) are mounted on one of the rotating rods (13). During wafer baking, the wafer is first placed in the metal tray (71). After the metal tray (71) is full of wafers, several support plates (4), support rods (5), and rollers (6) form a trolley. The support plates (4) are pushed to move. The tail plate (15) facilitates the movement of the rollers (6) into the housing (10). When the push rod (12) contacts the vertical rod (11), it pushes the vertical rod (11) to move, causing the toothed belt (8) to rotate, which in turn drives the rotating rod (13) to rotate, causing the tail plate (15) to rotate vertically and retract into the housing (10). At the same time, the conductive rod (9) contacts the two conductive blocks (102), and the second heating element (41) contacts the conductive plate (1011). When the device is touched, the entire electrical equipment is connected, and several first heating elements (3) and several second heating elements (41) are powered on and heated to bake the wafer. After baking, the cover door (2) is opened and the support rod (5) is pulled to move the trolley outward. When one side of the support plate (4) contacts the tail plate (15), a force is applied to the tail plate (15) to make the rotating rod (13) rotate in the opposite direction. The tail plate (15) is horizontal. When the roller (6) moves onto the tail plate (15), the tail plate (15) is subjected to gravity and swings downward until one end of it contacts the ground. The toothed belt (8) drives the conductive rod (9) back to its original position, the entire circuit is disconnected, and several first heating elements (3) and several second heating elements (41) are de-energized.

2. The semiconductor wafer baking apparatus according to claim 1, characterized in that: One side of the vertical plate (101) is inclined; two guide plates (151) are provided on the tail plate (15).

3. The semiconductor wafer baking apparatus according to claim 1, characterized in that: The bottom of the support plate (4) is provided with several through holes (42).

4. The semiconductor wafer baking apparatus according to claim 1, characterized in that: The placement tray (7) has handles (72) on both ends.

5. The semiconductor wafer baking apparatus according to claim 1, characterized in that: It also includes a notification device that sounds an alarm when the wafer is baked.

6. The semiconductor wafer baking apparatus according to claim 5, characterized in that: The prompting device includes a time relay, a controller, and a sound alarm. When the time relay is energized and reaches its preset value, it sends a signal to the controller, which then controls the sound alarm to emit an alarm sound.

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