Display substrate, detection method thereof, and display device

Abstract

The present invention provides a display substrate, a detection method therefor, and a display device. The display substrate comprises: a base substrate; a display function layer located on one side of the base substrate; and a thin-film encapsulation layer located on the side of the display function layer facing away from the base substrate. The thin-film encapsulation layer comprises, in order, a first inorganic layer, an organic layer, and a second inorganic layer facing away from the base substrate; a first barrier dam located on the side of the organic layer facing away from the display function layer; and a first auxiliary encapsulation structure in contact with the first barrier dam. The first auxiliary encapsulation structure has an inverted trapezoidal cross-section along the thickness direction of the display function layer facing away from the display area. This structure is used to accurately determine the printing boundary of the organic layer during thin-film encapsulation, preventing overflow of organic material and resulting in poor encapsulation.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate, a detection method thereof, and a display device. Background Art

[0002] With the advancement of technology, special-shaped screens or full-screen displays have gradually come into everyone's view in recent years. Whether it is a special-shaped or full-screen display, the purpose is to increase the screen-to-body ratio of the display device. Therefore, in order to achieve a higher screen-to-body ratio, the solution of punching holes in the screen to reserve positions for cameras or some related sensors where needed has gradually become a direction considered by technicians. Accordingly, effective packaging is required at the punching position. Summary of the Invention

[0003] The present invention provides a display substrate, a detection method thereof and a display device, which are used to accurately determine the printing boundary of an organic layer in thin film packaging and avoid the problem of poor packaging effect caused by overflow of organic material.

[0004] In a first aspect, an embodiment of the present invention provides a display substrate, comprising:

[0005] A base substrate, a display function layer located on one side of the base substrate, and a thin film encapsulation layer located on a side of the display function layer facing away from the base substrate; wherein the thin film encapsulation layer comprises a first inorganic layer, an organic layer, and a second inorganic layer, which are sequentially located away from the base substrate;

[0006] a first blocking dam located on a side of the organic layer facing away from the display function layer;

[0007] A first auxiliary encapsulation structure is arranged in contact with the first barrier dam; wherein, along the direction in which the display function layer is away from the display area, the cross-section of the first auxiliary encapsulation structure along the thickness direction is in an inverted trapezoidal shape.

[0008] In one possible implementation, the first auxiliary packaging structure is located on the top surface of the first blocking dam facing away from the base substrate, and the orthographic projection of the first auxiliary packaging structure on the base substrate completely falls within the area of ​​the orthographic projection of the first blocking dam on the base substrate.

[0009] In one possible implementation manner, a thickness of the first auxiliary encapsulation structure is smaller than a thickness of the first barrier dam.

[0010] In one possible implementation, along the direction in which the display function layer is away from the display area, the length of the top edge of the cross-sectional shape of the first blocking dam along the thickness direction away from the substrate side is equal to the length of the bottom edge of the cross-sectional shape of the first auxiliary packaging structure along the thickness direction close to the substrate side.

[0011] In one possible implementation, along the direction of the display function layer away from the display area, the cross-sectional shape of the first blocking dam along the thickness direction includes an inner side edge and an outer side edge respectively connected to the top edge away from the side of the substrate, the first auxiliary packaging structure is in contact with the outer side edge, and the thickness of the first auxiliary packaging structure is greater than the thickness of the first blocking dam.

[0012] In one possible implementation, it further includes a second auxiliary packaging structure arranged on the side of the first blocking dam close to the display area, the second auxiliary packaging structure is in contact with the inner edge, and is arranged in a direction away from the display area along the display function layer, the cross-sectional shape of the second auxiliary packaging structure along the thickness direction is an inverted trapezoid, and the thickness of the second auxiliary packaging structure is equal to the thickness of the first auxiliary packaging structure.

[0013] In one possible implementation, a buffer groove is formed in the space between the first auxiliary packaging structure and the second auxiliary packaging structure along the direction in which the display function layer is away from the display area, and the buffer groove is located on the top surface of the first blocking dam away from the base substrate, and the orthographic projection of the buffer groove on the base substrate completely falls within the area of ​​the orthographic projection of the first blocking dam on the base substrate.

[0014] In one possible implementation, it also includes a second blocking dam on the side of the first blocking dam facing away from the display area, and a third auxiliary packaging structure arranged on the side of the second blocking dam facing away from the base substrate, wherein the second blocking dam is arranged around the edge of the display function layer, and the cross-sectional shape of the third auxiliary packaging structure along the thickness direction is an inverted trapezoidal arrangement.

[0015] In one possible implementation manner, the first auxiliary packaging structure is disposed around the display area.

[0016] In one possible implementation manner, at least a portion of the third auxiliary encapsulation structure is disposed around an edge of the display function layer.

[0017] In one possible implementation manner, there are multiple first auxiliary packaging structures, which are evenly spaced apart.

[0018] In one possible implementation manner, the first auxiliary packaging structure and the third auxiliary packaging structure are both made of negative photoresist.

[0019] In a second aspect, an embodiment of the present invention provides a method for detecting a display substrate, which is applied to a display substrate as described in any one of the above items, and the method includes:

[0020] Before forming the thin film encapsulation layer on the side of the display function layer facing away from the base substrate, detecting and obtaining a first optical image parameter of an edge of the first auxiliary encapsulation structure close to the display area at a preset position;

[0021] After manufacturing the thin film encapsulation layer, detecting and obtaining a second optical image parameter of an edge of the first auxiliary encapsulation structure at the preset position close to one side of the display area;

[0022] If the first optical image parameter is different from the second optical image parameter, it is determined that overflow occurs in the organic layer in the thin film encapsulation layer.

[0023] In one possible implementation, if the clarity of the edge of the first auxiliary packaging structure at the preset position close to the display area is less than the clarity of the edge of the first auxiliary packaging structure away from the display area, the detection method specifically includes:

[0024] It is determined that overflow occurs in the organic layer in the thin film encapsulation layer.

[0025] In a third aspect, an embodiment of the present invention provides a display device, including:

[0026] A display substrate as described in any one of the above items.

[0027] The beneficial effects of the present invention are as follows:

[0028] Embodiments of the present invention provide a display substrate, a detection method therefor, and a display device. The display substrate includes a base substrate, a display function layer located on one side of the base substrate, and a thin-film encapsulation layer located on a side of the display function layer facing away from the base substrate. The thin-film encapsulation layer includes, in order, a first inorganic layer, an organic layer, and a second inorganic layer facing away from the base substrate. The display substrate also includes a first barrier dam located on a side of the organic layer facing away from the display function layer, and a first auxiliary encapsulation structure disposed in contact with the first barrier dam. The first auxiliary encapsulation structure has an inverted trapezoidal cross-sectional shape along the thickness direction of the display function layer facing away from the display area. When subsequently inspecting the boundaries of the organic layer within the thin-film encapsulation layer, the clarity of the inner and outer boundaries of the first auxiliary encapsulation structure changes significantly before and after fabrication of the thin-film encapsulation layer. Based on these changes in the boundaries, it is possible to determine whether overflow has occurred within the organic layer within the thin-film encapsulation layer. This allows for accurate determination of the printed boundaries of the organic layer within the thin-film encapsulation, ensuring the effectiveness of the thin-film encapsulation and improving the performance of the display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of one of the structures of a conventional OLED display device after the border area is evaporated and packaged;

[0030] Figure 2 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0031] Figure 3 For the Figure 2 A schematic diagram of one of the cross-sectional structures in the direction indicated by MM;

[0032] Figure 4 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0033] Figure 5 For the Figure 4 A schematic diagram of one of the cross-sectional structures in the direction indicated by NN;

[0034] Figure 6 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0035] Figure 7 For the Figure 6 A schematic diagram of one of the cross-sectional structures in the direction indicated by MM;

[0036] Figure 8 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0037] Figure 9 For the Figure 8A schematic diagram of one of the cross-sectional structures in the direction shown in PP;

[0038] Figure 10 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0039] Figure 11 For the Figure 10 A schematic diagram of one of the cross-sectional structures in the direction indicated by QQ;

[0040] Figure 12 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0041] Figure 13 For the Figure 12 A schematic diagram of one of the cross-sectional structures in the direction indicated by RR;

[0042] Figure 14 A schematic top view of a display substrate provided in an embodiment of the present invention;

[0043] Figure 15 For the Figure 14 A schematic diagram of one of the cross-sectional structures in the direction shown in SS;

[0044] Figure 16 A flow chart of one method of a display substrate detection method provided by an embodiment of the present invention;

[0045] Figure 17 This is a schematic structural diagram of a display device provided by an embodiment of the present invention.

[0046] Description of reference numerals:

[0047] 01-organic encapsulation layer; 02-blocking dam; 10-base substrate; 20-display function layer; 30-thin film encapsulation layer; 301-first inorganic layer; 302-organic layer; 303-second inorganic layer; 40-first blocking dam; 401-top edge; 402-outer edge; 403-inner edge; 50-first auxiliary encapsulation structure; A-display area; B-peripheral area; C-binding area; D-fan-shaped area; 60-planarization layer; 70-pixel definition layer; 80-second auxiliary encapsulation structure; 90-buffer groove; 91-second blocking dam; 92-third auxiliary encapsulation structure; 93-third blocking dam; 94-drive wiring layer; 100-display substrate. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. And in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] Unless otherwise defined, technical or scientific terms used in this invention shall have the same general meaning as those generally understood by persons skilled in the art in the art to which this invention pertains. Words such as "include" or "comprise" used in this invention mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0050] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present invention. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0051] Currently, the encapsulation process for organic light-emitting diode (OLED) displays typically utilizes methods such as plasma-enhanced chemical vapor deposition (PECVD) and sputtering to deposit the desired inorganic film within a designated area. However, the organic layer in thin-film encapsulation typically exhibits a solution leveling region, also known as a ramping region. This ramping region is the distance occupied by the organic layer thickness at the edge, where it gradually increases from zero to the designed thickness within the display area. This ramping region is typically greater than 1 mm. Due to the edge shrinkage characteristics of organic solutions, uncontrollable discrepancies often exist between the actual printed position and the desired position of the organic layer in thin-film encapsulation during actual manufacturing. Products requiring precise control of the cutoff position require extensive and repeated experimentation. Ideally, the edge of the organic material in the thin-film encapsulation should coincide with the inner edge of the barrier dam. However, in reality, once these edges overlap, capillary action can cause the organic material to ramp up or even roll over the barrier dam, impacting thin-film encapsulation performance. Consequently, precisely determining the print boundary of the organic layer in thin-film encapsulation has become a pressing technical challenge.

[0052] In the related art, a schematic diagram of a conventional OLED display device after the frame area is evaporated and packaged is shown as follows: Figure 1As shown in the figure, 01 represents the organic encapsulation layer and 02 represents the barrier dam. Due to the high transmittance of organic materials in thin-film encapsulation, overflow or even overflow beyond the barrier dam cannot be effectively identified and detected. Furthermore, in actual manufacturing processes, the complex structure of the backplane makes it difficult to accurately determine the actual retention boundary of the organic layer without performing damaging operations such as cracking.

[0053] In view of this, embodiments of the present invention provide a display substrate, a detection method thereof, and a display device for accurately determining the printing boundary of an organic layer in thin film encapsulation, thereby avoiding the problem of poor encapsulation effect caused by overflow of organic materials.

[0054] Combine Figure 2 and Figure 3 As shown, Figure 2 This is a schematic diagram of a top view of a display substrate provided by an embodiment of the present invention. Figure 3 For the Figure 2 A schematic diagram of a cross-sectional structure in the direction indicated by MM in FIG. Specifically, the display substrate includes:

[0055] A base substrate 10, a display function layer 20 located on one side of the base substrate 10, and a thin film encapsulation layer 30 located on a side of the display function layer 20 facing away from the base substrate 10; wherein the thin film encapsulation layer 30 includes a first inorganic layer 301, an organic layer 302, and a second inorganic layer 303, which are sequentially facing away from the base substrate 10;

[0056] a first barrier dam 40 located on a side of the organic layer 302 away from the display function layer 20 ;

[0057] A first auxiliary encapsulation structure 50 is provided in contact with the first barrier dam 40 ; wherein, along the direction of the display function layer 20 away from the display area A, the cross-section shape of the first auxiliary encapsulation structure 50 along the thickness direction is an inverted trapezoid.

[0058] In a specific implementation process, the display substrate includes a base substrate 10, which can be a rigid substrate or a flexible substrate, which is not limited here. When the base substrate 10 is a flexible substrate, the material of the flexible substrate can be polyimide film (PI) or polyethylene terephthalate (PET), etc., which is not limited here. The flexible substrate can be a structure including a single-layer flexible base layer or a structure including multiple flexible base layers, such as a structure with two flexible base layers or a structure with three base layers, which is not limited here. In addition, a support layer (Barrier) can be provided between two adjacent flexible base layers. In addition, the display substrate also includes a display function layer 20 located on one side of the base substrate 10, which can include an anode layer, an organic light-emitting layer and a cathode layer that are sequentially away from the base substrate 10. The display function layer 20 can be prepared by using the technology in the related art, which is not limited here; when an appropriate voltage is applied to the anode layer and the cathode layer, the holes from the anode layer and the charges from the cathode layer will combine in the organic light-emitting layer to generate light, thereby ensuring the display function of the display substrate.

[0059] The display substrate also includes a thin film encapsulation layer 30 located on the side of the display functional layer 20 facing away from the base substrate 10. The thin film encapsulation layer 30 is used to encapsulate the display functional layer 20 to block water and oxygen corrosion, preventing water and oxygen from entering the display functional layer 20 and causing OLED device failure. In addition, the thin film encapsulation layer 30 may include a first inorganic layer 301, an organic layer 302, and a second inorganic layer 303, sequentially facing away from the base substrate 10. In a specific implementation, the material of the first inorganic layer 301 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride; the material of the second inorganic layer 303 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride; and the material of the organic layer 302 may be an organic material suitable for inkjet printing, without limitation. Of course, the thin film encapsulation layer 30 may also include more film layers in which inorganic and organic layers 302 are alternately arranged, without limitation. It should be noted that regardless of the structure of the thin film encapsulation layer 30, the top layer of the thin film encapsulation layer 30 is configured as an inorganic layer to effectively block water and oxygen.

[0060] The display substrate also includes a first blocking dam 40 located on the side of the organic layer 302 away from the display function layer 20. The first blocking dam 40 can be composed of a planarization layer 60 (PLN) and a pixel definition layer 70 (PDL). The extension length of the first blocking dam 40 from the display area A to the peripheral area B is in the range of 20 μm to 100 μm. The first blocking dam 40 can be arranged around the edge of the organic layer 302 in the thin film encapsulation layer 30. In addition, the display substrate also includes a first auxiliary encapsulation structure 50 that is arranged in contact with the first blocking dam 40. Along the direction of the display function layer 20 away from the display area A, the direction can be as follows: Figure 3 In the direction indicated by the middle arrow X, the cross-section of the first auxiliary encapsulation structure 50 along the thickness direction is an inverted trapezoid. This inverted trapezoidal shape of the first auxiliary encapsulation structure 50 provides a relatively clear boundary along the direction of the display functional layer 20 away from the display area A. When subsequently inspecting the boundary of the organic layer 302 in the thin-film encapsulation layer 30, the clarity of the inner and outer boundaries of the first auxiliary encapsulation structure 50 changes significantly before and after the thin-film encapsulation layer 30 is fabricated. Based on this change in the boundary, it can be determined whether the organic layer 302 in the thin-film encapsulation layer 30 has overflowed onto the first barrier dam 40. This allows for precise determination of the printed boundary of the organic layer 302 in the thin-film encapsulation process, ensuring the thin-film encapsulation effect and improving the performance of the display substrate.

[0061] It should be noted that, combined with Figure 2 As shown, the base substrate 10 is divided into a display area A, a peripheral area B surrounding the display area A, a binding area C located on the side of the peripheral area B away from the display area A, and a fan-shaped area D located between the binding area C and the display area A. The first barrier dam 40 and the first auxiliary encapsulation structure 50 are both provided in the peripheral area B. Of course, in addition to Figure 2 In addition to the area division shown, the display area A, the peripheral area B, the binding area C and the sector area D may also be divided according to actual application needs, which is not limited here.

[0062] In the embodiment of the present invention, combined with Figures 4 to 15 As shown, the first auxiliary packaging structure 50 can be arranged in the following ways, but is not limited to the following ways. In order to more clearly show the arrangement position of the first auxiliary packaging structure 50, the figure does not illustrate the packaging-related film layers and the film layers after packaging. The arrangement of the relevant film layers can refer to the specific implementation in the relevant technology and is not limited here.

[0063] In one exemplary embodiment, the Figure 4 and Figure 5 As shown, Figure 4 This is a schematic diagram showing a top view of a substrate. Figure 5 For the Figure 4 Specifically, the first auxiliary packaging structure 50 is located on the top surface of the first blocking dam 40 facing away from the base substrate 10, and the orthographic projection of the first auxiliary packaging structure 50 on the base substrate 10 completely falls within the area of ​​the orthographic projection of the first blocking dam 40 on the base substrate 10.

[0064] Still combined Figure 4 and Figure 5 As shown, the first auxiliary encapsulation structure 50 is located on the top surface of the first barrier dam 40 on the side away from the base substrate 10, and the orthographic projection of the first auxiliary encapsulation structure 50 on the base substrate 10 completely falls within the area of ​​the orthographic projection of the first barrier dam 40 on the base substrate 10. In this exemplary embodiment, the first auxiliary encapsulation structure 50 can be vertically arranged directly above the pixel definition layer 70 constituting the first barrier dam 40. In this way, combined with Figure 5 As shown, the first auxiliary encapsulation structure 50 can be combined with the pixel definition layer 70 that originally constitutes the first barrier dam 40 to form a steeper cross section on the side. Figure 1 For example, the relatively continuous and gentle slope shown in FIG 1 , on the one hand, more easily restricts the flow of organic material corresponding to the organic layer 302, effectively preventing overflow of the organic layer 302. On the other hand, because the inverted trapezoidal shape of the first auxiliary encapsulation structure 50 has a relatively clear boundary, the change in the clarity of the corresponding boundary of the first auxiliary encapsulation structure 50 before and after the thin film encapsulation layer 30 is formed can be used to determine whether the organic layer 302 in the thin film encapsulation layer 30 has overflowed onto the first barrier dam 40. In this way, the printing boundary of the organic layer 302 in the thin film encapsulation is accurately determined, ensuring the thin film encapsulation effect and improving the performance of the display substrate.

[0065] Still combined Figure 5 As shown, the thickness of the first auxiliary encapsulation structure 50 is less than that of the first barrier dam 40. In this exemplary embodiment, the first auxiliary encapsulation structure 50 can be reused as a columnar spacer (PS). In this way, while taking into account the support performance of the display substrate, the printing boundary of the organic layer 302 in the encapsulation structure can be accurately determined.

[0066] In one of the exemplary embodiments, along the direction of the display function layer 20 away from the display area A, the length of the top edge 401 of the cross-sectional shape of the first blocking dam 40 along the thickness direction away from the side of the base substrate 10 is equal to the length of the bottom edge of the cross-sectional shape of the first auxiliary packaging structure 50 along the thickness direction close to the side of the base substrate 10.

[0067] Still combined Figure 5As shown, along the direction of the display function layer 20 away from the display area A, the length of the top edge 401 of the first barrier dam 40, along the thickness direction of the cross-section, on the side facing away from the base substrate 10, is equal to the length of the bottom edge of the first auxiliary encapsulation structure 50, along the thickness direction of the cross-section, on the side facing the base substrate 10. "Equal" here can mean approximately equal or roughly equal, and this is not limited here. In this way, while maintaining the stability of the display substrate structure, the overflow effect of the first auxiliary encapsulation structure 50 on the corresponding organic material of the organic layer 302 is maximized.

[0068] In one exemplary embodiment, the Figure 6 and Figure 7 As shown, Figure 6 This is a schematic diagram showing a top view of a substrate. Figure 7 For the Figure 6 Schematic diagram of one of the cross-sectional structures in the direction indicated by OO in FIG. Specifically, along the direction of the display function layer 20 away from the display area A, the cross-sectional shape of the first barrier dam 40 along the thickness direction includes an inner side 403 and an outer side 402 respectively connected to the top edge 401 on the side away from the base substrate 10. The first auxiliary encapsulation structure 50 is in contact with the outer side 402, and the thickness of the first auxiliary encapsulation structure 50 is greater than the thickness of the first barrier dam 40.

[0069] Still combined Figure 6 and Figure 7 As shown, along the direction of the display function layer 20 away from the display area A, the cross-sectional shape of the first barrier dam 40 along the thickness direction includes an inner side edge 403 and an outer side edge 402, each connected to the top edge 401 on the side away from the base substrate 10. In this exemplary embodiment, the first auxiliary encapsulation structure 50 is in contact with the outer side edge 402. For example, the first auxiliary encapsulation structure 50 is arranged around the first barrier dam 40 and is in contact with the outer side edge 402. In addition, the thickness of the first auxiliary encapsulation structure 50 can be greater than the thickness of the first barrier dam 40. In this way, multiple steps can be formed between the first auxiliary encapsulation structure 50 and the first barrier dam 40, and the inner side edge 403 of the first auxiliary encapsulation structure 50 can effectively block the organic layer 302 in the thin film encapsulation structure, thereby avoiding the overflow problem of the organic layer 302.

[0070] In one exemplary embodiment, the Figure 8 and Figure 9 As shown, Figure 8 This is a schematic diagram showing a top view of a substrate. Figure 9 For the Figure 8Schematic diagram of one of the cross-sectional structures in the direction indicated by PP in FIG. Specifically, the display substrate further includes a second auxiliary encapsulation structure 80 disposed on the side of the first barrier dam 40 near the display area A. The second auxiliary encapsulation structure 80 contacts the inner side 403 and extends along the direction of the display function layer 20 away from the display area A. The cross-sectional shape of the second auxiliary encapsulation structure 80 along the thickness direction is an inverted trapezoid, and the thickness of the second auxiliary encapsulation structure 80 is equal to that of the first auxiliary encapsulation structure 50.

[0071] Still combined Figure 8 and Figure 9 As shown, the display substrate further includes a second auxiliary encapsulation structure 80 disposed on a side of the first barrier dam 40 close to the display area A. The second auxiliary encapsulation structure 80 contacts the inner side 403 of the first barrier dam 40. For example, the second auxiliary encapsulation structure 80 is disposed around the display area A and contacts the inner side 403 of the first barrier dam 40. Furthermore, along the direction in which the display function layer 20 is away from the display area A, the cross-sectional shape of the second auxiliary encapsulation structure 80 along the thickness direction is an inverted trapezoid. That is, in this exemplary embodiment, the first auxiliary encapsulation structure 50 is disposed at the outer edge of the first barrier dam 40 away from the display area A, and the second auxiliary encapsulation structure 80 is disposed at the inner edge of the first barrier dam 40 close to the display area A. Because the cross-sectional shapes of the first and second auxiliary encapsulation structures 50, 80 along the thickness direction are both inverted trapezoidal, the first and second auxiliary encapsulation structures 50, 80 have relatively clear boundaries. Moreover, the thickness of the second auxiliary encapsulation structure 80 is equal to the thickness of the first auxiliary encapsulation structure 50, and both are greater than the thickness of the first blocking dam 40. In this way, while ensuring structural stability, the large number of steps formed ensure that the first auxiliary encapsulation structure 50 and the second auxiliary encapsulation structure 80 effectively block the organic material corresponding to the organic layer 302 in the thin film encapsulation layer 30, avoiding the overflow problem of the organic material.

[0072] Still combined Figure 9 As shown, along the direction in which the display function layer 20 is away from the display area A, a buffer groove 90 is formed in the space between the first auxiliary packaging structure 50 and the second auxiliary packaging structure 80, and the buffer groove 90 is located on the top surface of the first blocking dam 40 away from the base substrate 10, and the positive projection of the buffer groove 90 on the base substrate 10 completely falls within the area of ​​the positive projection of the first blocking dam 40 on the base substrate 10.

[0073] During the specific implementation process, the buffer groove 90 formed by the space between the first auxiliary encapsulation structure 50 and the second auxiliary encapsulation structure 80 leaves a better staying space for edge leveling, thereby ensuring the encapsulation performance of the thin film encapsulation layer 30 .

[0074] In one exemplary embodiment, Figure 10 and Figure 11 As shown, Figure 10 This is a schematic diagram showing a top view of a substrate. Figure 11 For the Figure 10 Schematic diagram of one of the cross-sectional structures in the direction indicated by QQ. Specifically, the display substrate also includes a second barrier dam 91 on the side of the first barrier dam 40 facing away from the display area A. The second barrier dam 91 is arranged at the edge of the display functional layer 20. For example, the second barrier dam 91 is arranged around the edge of the anode layer. The side edges of the film layers related to the display functional layer 20 are effectively protected by the second barrier dam 91, thereby improving the encapsulation performance of the thin film encapsulation layer 30. In addition, the display substrate also includes a third auxiliary encapsulation structure 92 arranged on the side of the second barrier dam 91 facing away from the base substrate 10. The cross-sectional shape of the third auxiliary encapsulation structure 92 along the thickness direction is an inverted trapezoid. In this way, not only does the first auxiliary encapsulation structure 50 have a relatively clear boundary, but the third auxiliary encapsulation structure 92 also has a relatively clear boundary. In actual applications, the boundaries of the first auxiliary encapsulation structure 50 and the third auxiliary encapsulation structure 92 before and after the thin film encapsulation layer 30 is produced can be detected and compared, further improving the accuracy of determining the printing position of the organic layer 302 in the thin film encapsulation layer 30.

[0075] In one exemplary embodiment, the first auxiliary encapsulation structure 50 is disposed around the display area A. Accordingly, the first auxiliary encapsulation structure 50 may be disposed around the display area A.

[0076] In one exemplary embodiment, there are multiple first auxiliary packaging structures 50, which are evenly spaced. In a specific implementation, the first auxiliary packaging structures 50 can be multiple independent structures, each of which can be evenly spaced. Accordingly, two adjacent first auxiliary packaging structures 50 are evenly spaced.

[0077] In one exemplary embodiment, there are multiple first auxiliary packaging structures 50, each of which can be positioned at a location prone to overflow. For example, there are four first auxiliary packaging structures 50, each positioned at the four corners of the display substrate, thereby enabling overflow detection at the corresponding corners of the display substrate. Of course, the locations of the first auxiliary packaging structures 50 can also be determined based on actual application needs, and this is not limited here.

[0078] In one exemplary embodiment, at least a portion of the third auxiliary encapsulation structure 92 is disposed around the edge of the display function layer 20. For example, the third auxiliary encapsulation structure 92 is disposed around the edge of the display function layer 20. For another example, multiple third auxiliary encapsulation structures 92 are disposed independently of each other, and each third auxiliary encapsulation structure 92 is disposed at the edge of the display function layer 20.

[0079] In one exemplary embodiment, the first auxiliary packaging structure 50 and the third auxiliary packaging structure 92 may be arranged as follows: Figure 12 and Figure 13 As shown, Figure 12 This is a schematic diagram showing a top view of a substrate. Figure 13 For the Figure 12 Schematic diagram of one of the cross-sectional structures in the direction shown in RR.

[0080] In one exemplary embodiment, the first auxiliary packaging structure 50 and the third auxiliary packaging structure 92 may be arranged as follows: Figure 14 and Figure 15 As shown, Figure 14 This is a schematic diagram showing a top view of a substrate. Figure 15 For the Figure 14 Schematic diagram of one of the cross-sectional structures in the direction SS shown in FIG.

[0081] In the embodiment of the present invention, the first auxiliary packaging structure 50 and the third auxiliary packaging structure 92 are both made of negative photoresist.

[0082] In an embodiment of the present invention, the display substrate further includes a third barrier dam 93 disposed around the edges of the first inorganic layer 301 and the second inorganic layer 303. The third barrier dam 93 may be disposed on a side of the second barrier dam 91 that is closer to the cutting street. In this manner, during cutting of the display substrate along the cutting street, the third barrier dam 93 can prevent cutting cracks from extending from the display area A to the peripheral area B, or even to the peripheral area B, thereby improving the performance of the display substrate.

[0083] In an embodiment of the present invention, in addition to cutting the display substrate along the cutting lanes, the flexible substrate can also be etched along the cutting lanes. In a specific implementation, the upper and left and right sides of the display substrate can be cut along the cutting lanes. The lower side of the display substrate can also be etched along the cutting lanes due to the presence of related drive circuitry. The specific implementation of the cutting and etching processes can be referenced to the descriptions in the related art and will not be detailed here.

[0084] It should be noted that, in addition to the aforementioned film layer structures, the display substrate may also include a drive wiring layer 94, a touch function layer, and the like. The relevant film layer structures can be manufactured using existing manufacturing processes, and are not limited here. Of course, other film layer structures in the display substrate can also be configured according to actual application needs, which will not be detailed here.

[0085] Based on the same inventive concept, Figure 16 As shown, an embodiment of the present invention further provides a method for detecting a display substrate, which is applied to the display substrate as described above, and the detection method includes:

[0086] S101: Before forming the thin film encapsulation layer on the side of the display function layer facing away from the base substrate, detecting and obtaining first optical image parameters of an edge of the first auxiliary encapsulation structure close to the display area at a preset position;

[0087] S102: After forming the thin film encapsulation layer, detecting and obtaining a second optical image parameter of an edge of the first auxiliary encapsulation structure at the preset position close to one side of the display area;

[0088] S103: If the first optical image parameter is different from the second optical image parameter, it is determined that overflow occurs in the organic layer in the thin film encapsulation layer.

[0089] In the specific implementation process, the specific structure of the display substrate to which the detection method is applicable is described in the above-mentioned related parts. The specific implementation process of step S101 to step S103 is as follows:

[0090] First, before forming the thin-film encapsulation layer on the side of the display functional layer facing away from the base substrate 10, a first optical image parameter is detected at a predetermined position of the first auxiliary encapsulation structure near the edge of the display area; for example, the optical image parameter may include image clarity, image sharpness, etc. After forming the thin-film encapsulation layer, specifically, after printing the organic layer of the thin-film encapsulation layer, a second optical image parameter is detected at a predetermined position of the first auxiliary encapsulation structure near the edge of the display area. The first optical image parameter is then compared with the second optical image parameter. If the first and second optical image parameters differ, it is determined that the organic layer in the thin-film encapsulation layer has overflowed. For example, if the sharpness corresponding to the second optical image is lower than that of the first optical image, it indicates that the organic layer of the thin-film encapsulation layer has overflowed onto the first barrier dam.

[0091] In one exemplary embodiment, if the clarity of the first auxiliary encapsulation structure at the preset position, which is close to the edge of the display area, is less than the clarity of the first auxiliary encapsulation structure at the edge away from the display area, the detection method specifically includes:

[0092] It is determined that overflow occurs in the organic layer in the thin film encapsulation layer.

[0093] In the specific implementation process, Figure 5 Taking the display substrate and optical image parameters shown in the figure as an example, the process of determining whether the organic layer in the thin film encapsulation layer has overflowed is as follows:

[0094] First, the clarity of the inner edge of the first auxiliary encapsulation structure near the display area and the outer edge away from the display area before the thin-film encapsulation layer is formed is obtained, for example, the corresponding clarity is a1 and b1, respectively. After the thin-film encapsulation layer is formed, the clarity of the inner edge and outer edge of the first auxiliary encapsulation structure is a2 and b2, respectively. If a2 is less than a1, b2 is equal to b1, and b2 is greater than a2, then it indicates that the organic material corresponding to the organic layer in the thin-film encapsulation layer has exceeded the first barrier dam but has not crossed the first barrier dam. If a2 is less than a1 and b2 is less than b1, then it indicates that the organic material corresponding to the organic layer in the thin-film encapsulation layer has exceeded the first barrier dam and has exceeded the first barrier dam. Accordingly, it indicates that the organic layer has overflowed. If a2 is equal to a1 and b2 is equal to b1, then it indicates that the organic material corresponding to the organic layer in the thin-film encapsulation layer has not exceeded the first barrier dam.

[0095] In the specific implementation process, for display substrates of other structures, the process of determining whether the organic layer in the thin film encapsulation layer overflows can refer to Figure 5 The corresponding judgment process will not be described in detail here.

[0096] Based on the same inventive concept, Figure 17 As shown, an embodiment of the present invention further provides a display device, the principle of which is similar to that of the aforementioned display substrate 100, so the implementation of the display device can refer to the implementation of the aforementioned display substrate 100, and the repeated parts will not be repeated.

[0097] In specific implementations, the display device provided by the embodiments of the present invention can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigation system, or the like. Other essential components of the display device are well understood by those skilled in the art and are not described in detail here, nor should they be construed as limitations of the present invention.

[0098] It should be noted that the display substrate of the embodiment of the present invention can be used for a full screen, a folding screen, or a display screen with a four-sided curved display, which is not limited here.

[0099] Embodiments of the present invention provide a display substrate, a detection method therefor, and a display device. The display substrate includes a base substrate, a display function layer located on one side of the base substrate, and a thin-film encapsulation layer located on a side of the display function layer facing away from the base substrate. The thin-film encapsulation layer includes, in order, a first inorganic layer, an organic layer, and a second inorganic layer facing away from the base substrate. The display substrate also includes a first barrier dam located on a side of the organic layer facing away from the display function layer, and a first auxiliary encapsulation structure disposed in contact with the first barrier dam. The first auxiliary encapsulation structure has an inverted trapezoidal cross-sectional shape along the thickness direction of the display function layer facing away from the display area. When subsequently inspecting the boundaries of the organic layer within the thin-film encapsulation layer, the clarity of the inner and outer boundaries of the first auxiliary encapsulation structure changes significantly before and after fabrication of the thin-film encapsulation layer. Based on these changes in the boundaries, it is possible to determine whether overflow has occurred within the organic layer within the thin-film encapsulation layer. This allows for accurate determination of the printed boundaries of the organic layer within the thin-film encapsulation, ensuring the effectiveness of the thin-film encapsulation and improving the performance of the display substrate.

[0100] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0101] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A display substrate, characterized in that: include: A base substrate, a display function layer located on one side of the base substrate, and a thin film encapsulation layer located on a side of the display function layer facing away from the base substrate; wherein the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer, which are sequentially facing away from the base substrate; the base substrate is divided into a display area and a peripheral area surrounding the display area; a first barrier dam located on a side of the organic layer facing away from the display function layer, wherein the first barrier dam extends from the display area to the peripheral area for a length ranging from 20 μm to 100 μm; A first auxiliary encapsulation structure is arranged in contact with the first barrier dam; wherein the first auxiliary encapsulation structure is made of negative photoresist; along the direction in which the display functional layer departs from the display area, the cross-sectional shape of the first auxiliary encapsulation structure along the thickness direction is arranged in an inverted trapezoidal shape, and the inverted trapezoidal first auxiliary encapsulation structure has a clear boundary along the direction in which the display functional layer departs from the display area, and whether the organic layer in the thin film encapsulation layer overflows to the first barrier dam is determined based on the change in clarity of the corresponding boundary of the first auxiliary encapsulation structure before and after the thin film encapsulation layer is manufactured.

2. The display substrate according to claim 1, wherein The first auxiliary packaging structure is located on the top surface of the first blocking dam facing away from the base substrate, and the orthographic projection of the first auxiliary packaging structure on the base substrate completely falls within the area of ​​the orthographic projection of the first blocking dam on the base substrate.

3. The display substrate according to claim 2, wherein: The thickness of the first auxiliary encapsulation structure is smaller than the thickness of the first barrier dam.

4. The display substrate according to claim 3, wherein: Along the direction in which the display function layer is away from the display area, the length of the top edge of the cross-sectional shape of the first blocking dam along the thickness direction away from the substrate side is equal to the length of the bottom edge of the cross-sectional shape of the first auxiliary packaging structure along the thickness direction close to the substrate side.

5. The display substrate according to claim 1, wherein Along the direction of the display function layer away from the display area, the cross-sectional shape of the first blocking dam along the thickness direction includes an inner side edge and an outer side edge respectively connected to the top edge away from the side of the substrate, the first auxiliary packaging structure is in contact with the outer side edge, and the thickness of the first auxiliary packaging structure is greater than the thickness of the first blocking dam.

6. The display substrate according to claim 5, wherein: It also includes a second auxiliary packaging structure arranged on the side of the first blocking dam close to the display area, the second auxiliary packaging structure is in contact with the inner edge, and along the direction of the display function layer away from the display area, the cross-sectional shape of the second auxiliary packaging structure along the thickness direction is an inverted trapezoid, and the thickness of the second auxiliary packaging structure is equal to the thickness of the first auxiliary packaging structure.

7. The display substrate according to claim 6, wherein: Along the direction in which the display function layer is away from the display area, a buffer groove is formed in the space between the first auxiliary packaging structure and the second auxiliary packaging structure, and the buffer groove is located on the top surface of the first blocking dam away from the base substrate, and the orthographic projection of the buffer groove on the base substrate completely falls within the area of ​​the orthographic projection of the first blocking dam on the base substrate.

8. The display substrate according to any one of claims 1 to 7, wherein: It also includes a second blocking dam on the side of the first blocking dam away from the display area, and a third auxiliary packaging structure arranged on the side of the second blocking dam away from the base substrate, wherein the second blocking dam is arranged around the edge of the display function layer, and the cross-sectional shape of the third auxiliary packaging structure along the thickness direction is an inverted trapezoid.

9. The display substrate according to claim 8, wherein: The first auxiliary packaging structure is disposed around the display area.

10. The display substrate according to claim 8, wherein At least a portion of the third auxiliary encapsulation structure is disposed around an edge of the display function layer.

11. The display substrate according to claim 8, wherein There are multiple first auxiliary packaging structures, which are evenly spaced apart.

12. The display substrate according to claim 8, wherein The third auxiliary packaging structures are all made of negative photoresist.

13. A method for detecting a display substrate, characterized in that: Applied to the display substrate according to any one of claims 1 to 12, the detection method comprises: Before forming the thin film encapsulation layer on the side of the display function layer facing away from the base substrate, detecting and obtaining a first optical image parameter of an edge of the first auxiliary encapsulation structure close to the display area at a preset position; After manufacturing the thin film encapsulation layer, detecting and obtaining a second optical image parameter of an edge of the first auxiliary encapsulation structure at the preset position close to one side of the display area; If the first optical image parameter is different from the second optical image parameter, it is determined that overflow occurs in the organic layer in the thin film encapsulation layer.

14. The detection method according to claim 13, wherein If the clarity of the edge of the first auxiliary packaging structure at the preset position close to the display area is smaller than the clarity of the edge of the first auxiliary packaging structure away from the display area, the detection method specifically includes: It is determined that overflow occurs in the organic layer in the thin film encapsulation layer.

15. A display device, characterized in that: include: The display substrate according to any one of claims 1 to 12.

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