Circuit board assembly, preparation method thereof, stencil and electronic equipment

Abstract

The present application provides a circuit board assembly, a preparation method thereof, a mesh board and an electronic device. The circuit board assembly includes: a first circuit board, the surface of the first circuit board has a first solder pad; a shielding member, the shielding member is arranged on the surface of the first circuit board having the first solder pad, and is arranged around the outer periphery of the first solder pad; and a second circuit board, the second circuit board is arranged on the side of the shielding member away from the first circuit board, the second circuit board has a second solder pad, and the second solder pad is electrically connected to the first solder pad. The circuit board assembly of the present application can better shield interference signals radiated when signals are transmitted between circuit boards.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a circuit board assembly, a preparation method thereof, a stencil and an electronic device. Background Art

[0002] With the development of 5G technology, the designs of many electronic devices are becoming more and more complex, and more and more modules are added. In order to make full use of the space in the thickness direction of the electronic device, multiple circuit boards (PCB boards) are stacked, and then the pads between the multiple circuit boards are welded to enable communication between the multiple circuit boards. However, when welding between adjacent circuit boards, the welding parts have a certain height, so that there is a certain gap between adjacent circuit boards. If certain shielding measures are not taken, interference may escape from this gap and affect some performance of the electronic device. Summary of the invention

[0003] In response to the above problems, an embodiment of the present application provides a circuit board assembly, which can better shield interference signals radiated when signals are transmitted between circuit boards.

[0004] A first aspect of the present application provides a circuit board assembly, which includes:

[0005] A first circuit board, wherein a surface of the first circuit board has a first solder pad;

[0006] a shielding member, the shielding member being disposed on a surface of the first circuit board having the first solder pad and surrounding an outer periphery of the first solder pad; and

[0007] The second circuit board is arranged on a side of the shielding component away from the first circuit board, and the second circuit board has a second soldering pad, and the second soldering pad is electrically connected to the first soldering pad.

[0008] A second aspect of the present application provides a method for preparing a circuit board assembly, which includes:

[0009] Providing a first circuit board, wherein the surface of the first circuit board has a first solder pad, and forming a first conductive layer on the surface of the first circuit board having the first solder pad, wherein the first conductive layer is disposed around the periphery of the first solder pad;

[0010] Providing a second circuit board, wherein a second pad is provided on a surface of the second circuit board, and forming a second conductive layer on the surface of the second circuit board provided with the second pad, wherein the second conductive layer is provided around the periphery of the second pad, wherein a line width of the second conductive layer is smaller than a line width of the first conductive layer;

[0011] A plurality of welding portions are formed on a side of the first conductive layer facing away from the first circuit board and are arranged at intervals around the outer periphery of the first welding pad;

[0012] stacking the second circuit board on the surface of the first circuit board provided with the soldering portion, with the second conductive layer facing the soldering portion; and

[0013] The soldering portion is melted to form a soldering layer to connect the first conductive layer with the second conductive layer, and to electrically connect the first pad with the second pad.

[0014] The third aspect of the present application provides a mesh plate, which includes a plurality of mesh holes arranged at intervals, each of the mesh holes includes a first hole position, a second hole position and a third hole position, the first hole position and the second hole position are arranged at intervals, the third hole position is arranged between the first hole position and the second hole position, and respectively connects the first hole position and the second hole position; the first hole position and the second hole position both protrude from opposite sides of the third hole position, and the plurality of mesh holes are arranged at intervals along the arrangement direction of the first hole position and the second hole position.

[0015] A fourth aspect of the present application provides an electronic device, comprising:

[0016] Display screen;

[0017] In the circuit board assembly described in the embodiment of the present application, at least one of the first circuit board or the second circuit board of the circuit board assembly includes a processor, and the processor is electrically connected to the display screen for controlling the display screen to display.

[0018] The circuit board assembly of the embodiment of the present application includes a first circuit board and a second circuit board, the first circuit board has a first solder pad, the second circuit board has a second solder pad, and a shielding member arranged around the periphery of the first solder pad and the second solder pad is arranged between the first circuit board and the second circuit board, and the shielding member can shield the signal transmitted between the first circuit board and the second circuit board, and the interference signal radiated when passing through the first solder pad and the second solder pad. In addition, the shielding member can be formed in the original process of the circuit board assembly, without introducing new processes or new materials, and will not increase costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the top view of the circuit board assembly according to an embodiment of the present application.

[0021] Figure 2 The circuit board assembly of one embodiment of the present application is Figure 1Schematic diagram of the cross-sectional structure in the AA direction.

[0022] Figure 3 A circuit board assembly according to another embodiment of the present invention is provided along Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0023] Figure 4 A circuit board assembly according to another embodiment of the present invention is provided along Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0024] Figure 5 This is a structural schematic diagram of a circuit board assembly according to another embodiment of the present application, in which the shielding layer is broken when the line widths of the first conductive layer and the second conductive layer are equal.

[0025] Figure 6 yes Figure 4 Enlarged view of the dashed box I in the middle.

[0026] Figure 7 It is a schematic diagram of a process of preparing a circuit board assembly according to an embodiment of the present application.

[0027] Figure 8 It is a schematic diagram of the structure of the first circuit board after step S203.

[0028] Fig. 9 It is a structural schematic diagram of a welding portion of an embodiment of the present application.

[0029] Fig.10 yes Figure 8 Enlarged view of dashed box II.

[0030] Fig.11 It is a structural schematic diagram of a mesh plate according to an embodiment of the present application.

[0031] Fig.12 It is a schematic structural diagram of the mesh of the mesh plate according to an embodiment of the present application.

[0032] Fig.13 yes Fig.11 Enlarged view of dashed box III.

[0033] Fig.14 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0034] Fig.15 It is a schematic diagram of a partial exploded structure of an electronic device according to an embodiment of the present application.

[0035] Fig.16 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0036] Description of reference numerals:

[0037] 100-circuit board assembly, 10-first circuit board, 11-first solder pad, 20-shielding member, 21-first conductive layer, 23-soldering layer, 25-second conductive layer, 30-second circuit board, 31-second solder pad, 101-processor, 103-memory, 210-soldering portion, 210a-first soldering portion, 210b-second soldering portion, 211-first portion, 2111-first protruding portion, 2113-second protruding portion, 213-second portion, 2131-third protruding portion, 213 3-fourth protruding portion, 215-connecting portion, 300-mesh plate, 310-mesh, 310a-first mesh, 310b-second mesh, 311-first hole position, 3111-first protruding hole position, 3113-second protruding hole position, 313-second hole position, 3131-third protruding hole position, 3133-fourth protruding hole position, 315-third hole position, 400-electronic device, 410-display screen, 430-housing, 431-light-transmitting portion, 450-middle frame, 470-camera module. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0040] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings. It should be noted that, for ease of description, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0041] With the development of 5G technology, the designs of many electronic devices are becoming more and more complex, and more and more modules are added. In order to make full use of the space in the thickness direction of the electronic device or reduce the cost of the circuit board, different modules of the electronic device can be set on different circuit boards, corresponding pads are set on the circuit boards, and then multiple circuit boards are stacked and welded to form a whole (similar to the PCB "sandwich structure") to achieve communication between multiple circuit boards.

[0042] However, signals are transmitted between multiple circuit boards through pads, and adjacent circuit boards are soldered with tin. The soldering part has a certain thickness, so that there is a gap of about 0.06mm to 0.08mm between adjacent circuit boards. If certain shielding measures are not taken, interference may escape from this gap and affect some performance of the entire electronic equipment.

[0043] In order to reduce the radiation interference problem caused by the signal of the circuit board escaping from the gap between the circuit boards. The signal pad (pin foot) that is prone to interference can be set in a relatively middle position, and the ground pad (ground PIN foot) is set on the periphery surrounding the signal pad that is prone to interference, thereby reducing the radiation of the signal. However, the outermost circle of the PIN pins in this scheme must be the ground PIN pin, which occupies the number of pin pins. The area of ​​the circuit board is limited, and the number of pins that can be arranged is limited. If a part of it is occupied by the ground PIN pin, it means that the area available for other signals is reduced. Secondly, since the ground PIN pins are also arranged in an array, there are gaps between adjacent ground PIN pins, so this design has certain limitations in blocking radiation interference. For the arrangement of ground PIN pins at a certain distance, a certain amount of interference will leak out from the gap and cause interference.

[0044] In addition, a large shielding cover can be made to cover the smaller circuit board, and the shielding cover can be welded to the larger circuit board. In this way, even if a signal radiates from the welding gap, it will be shielded by the shielding cover and will not affect the outside of the shielding cover. However, making a shielding cover increases the material cost. Secondly, if the area of ​​the circuit board is large, the area of ​​the shielding cover will also be large. If the shielding cover is too large, the difficulty of making it will be submitted, and it is difficult to ensure the flatness of the shielding cover. Once the flatness of the shielding cover is not good, phenomena such as warping and cold soldering will occur during welding. Cold soldering means there is a gap, so the original purpose of complete shielding cannot be achieved, and radiation leakage may still occur. Furthermore, the welding of the shielding cover requires a large area on the circuit board. When the area of ​​the circuit board itself is relatively tight, this design undoubtedly increases the design difficulty.

[0045] See also Figure 1 and Figure 2The embodiment of the present application provides a circuit board assembly 100, which includes a first circuit board 10, a shielding component 20 and a second circuit board 30. The surface of the first circuit board 10 has a first solder pad 11; the shielding component 20 is arranged on the surface of the first circuit board 10 having the first solder pad 11, and is arranged around the outer periphery of the first solder pad 11; the second circuit board 30 is arranged on the side of the shielding component 20 away from the first circuit board 10 (it can be understood that the second circuit board 30 is arranged in contact with the shielding component 20 and is connected to the shielding component 20), and the second circuit board 30 has a second solder pad 31, and the second solder pad 31 is electrically connected to the first solder pad 11.

[0046] Optionally, the first circuit board 10 may be, but is not limited to, at least one of a printed circuit board and a flexible printed circuit board (FPC for short).

[0047] Optionally, the second circuit board 30 may be, but is not limited to, at least one of a printed circuit board and a flexible printed circuit board (FPC for short).

[0048] Optionally, the number of the first pads 11 may be one or more. When there are multiple first pads 11, the shielding member 20 is disposed around the outer periphery of the multiple first pads 11. “Multiple” means greater than or equal to two.

[0049] Optionally, the number of the second solder pads 31 may be one or more. When there are multiple second solder pads 31 , the shielding member 20 is disposed around the outer periphery of the multiple second solder pads 31 .

[0050] It can be understood that the first pads 11 correspond to the second pads 31 one by one, one first pad 11 corresponds to one second pad 31 and is arranged overlappingly, and different first pads 11 correspond to different second pads 31. The first pads 11 and the second pads 31 can be electrically connected by welding.

[0051] Optionally, the first pad 11 may be, but is not limited to, a pin for a high frequency signal such as a radio frequency signal pin (radio frequency signal PIN pin), a pin for a universal serial bus 3.0 signal (USB3.0 signal PIN pin), etc. Optionally, the second pad 31 may be, but is not limited to, a pin for a high frequency signal such as a radio frequency signal pin (radio frequency signal PIN pin), a pin for a universal serial bus 3.0 signal (USB3.0 signal PIN pin), etc. The present application does not specifically limit the type of signal transmitted by the first pad 11 and the second pad 31.

[0052] It can be understood that the first circuit board 10, the shielding member 20 and the second circuit board 30 are stacked in sequence, and the shielding member 20 is respectively connected to the first circuit board 10 and the second circuit board 30 to shield the interference signal radiated through the gap between the first circuit board 10 and the second circuit board 30.

[0053] It can be understood that the shielding member 20 extends around the periphery of the first solder pad 11 and the second solder pad 31 to form an annular structure to enclose the first solder pad 11 and the second solder pad 31 in a closed space surrounded by the first circuit board 10, the shielding member 20 and the second circuit board 30.

[0054] Optionally, the size of the first circuit board 10 may be equal to or different from the size of the second circuit board 30. The size of the first circuit board 10 may be larger than the size of the second circuit board 30, or the size of the second circuit board 30 may be larger than the size of the first circuit board 10.

[0055] The circuit board assembly 100 of the embodiment of the present application includes a first circuit board 10 and a second circuit board 30, the first circuit board 10 has a first solder pad 11, the second circuit board 30 has a second solder pad 31, and a shielding member 20 arranged around the periphery of the first solder pad 11 and the second solder pad 31 is arranged between the first circuit board 10 and the second circuit board 30. The shielding member 20 can shield the signal transmitted between the first circuit board 10 and the second circuit board 30 from the interference signal radiated when passing through the first solder pad 11 and the second solder pad 31. In addition, the shielding member 20 can be formed in the original process of the circuit board assembly 100, without introducing new processes or new materials, and will not increase costs.

[0056] See also Figure 3 and Figure 4 In some embodiments, the shielding component 20 includes a first conductive layer 21, a welding layer 23, and a second conductive layer 25 which are stacked in sequence in a direction from the first circuit board 10 to the second circuit board 30; the first conductive layer 21 is arranged on the surface of the first circuit board 10 facing the second circuit board 30, and the second conductive layer 25 is arranged on the surface of the second circuit board 30 facing the first circuit board 10, and at least one of the first conductive layer 21 and the second conductive layer 25 is grounded to ground the shielding component 20, and the line width of the first conductive layer 21 is greater than the line width of the second conductive layer 25.

[0057] like Figure 5As shown, when the line width of the first conductive layer 21 is equal to the line width of the second conductive layer 25, the raw material of the welding layer 23 will be evenly distributed on the first conductive layer 21 and the second conductive layer 25 after melting. Since the first conductive layer 21 and the second conductive layer 25 are at a certain distance, the molten raw material of the welding layer 23 is pulled into a shape that is wide at the top and bottom and narrow in the middle along the stacking direction of the first conductive layer 21 and the second conductive layer 25 under the action of the surface tension of the first conductive layer 21 and the second conductive layer 25. When the distance is pulled to a certain extent, the narrowest part in the middle is easy to break under the action of the surface tension, and the raw material of the welding layer 23 is redistributed to the surface of the first conductive layer 21 and the second conductive layer 25. Because the first circuit board 10 and the second circuit board 30 will deform at high temperatures, and the shielding component 20 is at the outermost part of the first circuit board 10 and the second circuit board 30, that is, the position with the largest deformation, if the shielding component 20 is pulled off in some areas, gaps will appear, which is prone to radiation leakage. However, as Figure 4 As shown, when the line width of the second conductive layer 25 is smaller than the line width of the first conductive layer 21, when the raw materials for welding are sufficient, the shielding member 20 will present a trapezoidal shape. When the distance between the first conductive layer 21 and the second conductive layer 25 is increased, the middle side will begin to narrow. Only when the distance between the first conductive layer 21 and the second conductive layer 25 reaches a very large distance, the shielding member 20 will be broken. This super large deformation can be controlled, thus ensuring that the shielding member 20 will not be broken, thereby having a better effect of shielding radiation signals.

[0058] It can be understood that along the stacking direction of the first circuit board 10 and the second circuit board 30 , at least one of the two opposite ends of the shielding member 20 is grounded.

[0059] It can be understood that at least one of the first conductive layer 21 and the second conductive layer 25 is grounded, and the first conductive layer 21 can be grounded (such as the first conductive layer 21 is electrically connected to the ground pin of the first circuit board 10); or the second conductive layer 25 is grounded (such as the second conductive layer 25 is electrically connected to the ground pin of the second circuit board 30); or both the first conductive layer 21 and the second conductive layer 25 are grounded. Compared with one of the first conductive layer 21 and the second conductive layer 25 being grounded, when both the first conductive layer 21 and the second conductive layer 25 are grounded, the shielding member 20 has a better effect of shielding signal radiation.

[0060] See also Figure 6In some embodiments, the line width d1 of the first conductive layer 21 and the line width d2 of the second conductive layer 25 satisfy: 0.4≤d2 / d1≤0.7. In other words, the line width d2 of the second conductive layer 25 is 0.4 to 0.7 times the line width d1 of the first conductive layer 21. Further, the line width d1 of the first conductive layer 21 and the line width d2 of the second conductive layer 25 satisfy: 0.5≤d2 / d1≤0.6. Specifically, the ratio d2 / d1 of the line width d2 of the second conductive layer 25 to the line width d1 of the first conductive layer 21 may be, but is not limited to, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, etc. When the line width d1 of the first conductive layer 21 and the line width d2 of the second conductive layer 25 satisfy the above relationship, the second conductive layer 25 will not absorb too much material of the soldering layer 23 when forming the soldering layer 23, and the soldering layer 23 is not easily broken when at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed. When d2 / d1 is too large, the second conductive layer 25 is likely to absorb too much material of the soldering layer 23 during the formation of the soldering layer 23, and the line width of the formed soldering layer 23 in the middle position along the stacking direction of the first conductive layer 21 and the second conductive layer 25 is too small, and the soldering layer 23 is likely to be broken when at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed; when d2 / d1 is too small, the second conductive layer 25 absorbs too little material of the soldering layer 23 when forming the soldering layer 23, and the line width of the formed soldering layer 23 near the second conductive layer 25 is also too small, and the soldering layer 23 is likely to be broken when at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed.

[0061] In the embodiments of the present application, when a numerical range from a to b is involved, unless otherwise specified, it means that the numerical value can be any numerical value between a and b, including the endpoint numerical value a, and including the endpoint numerical value b.

[0062] In some embodiments, the line width d1 of the first conductive layer 21 is in the range of 0.5 mm ≤ d1 ≤ 0.8 mm. Specifically, the line width d1 of the first conductive layer 21 may be, but is not limited to, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm, 0.8 mm, etc. If the line width of the first conductive layer 21 is too wide, the line width of the formed welding layer 23 is too wide, and finally the line width of the entire shielding component 20 is too wide, which is not conducive to the thinness of the circuit board assembly 100. The line width of the first conductive layer 21 should not be too narrow. When the line width of the first conductive layer 21 is too narrow, the line width of the formed welding layer 23 is too small, and finally the line width of the entire shielding component 20 is too small. When at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed, the welding layer 23 is easily broken.

[0063] In some embodiments, the line width d2 of the second conductive layer 25 is in the range of 0.2 mm ≤ d2 ≤ 0.56 mm. Further, the line width d2 of the second conductive layer 25 is in the range of 0.25 mm ≤ d2 ≤ 0.48 mm. Specifically, the line width d2 of the second conductive layer 25 may be, but is not limited to, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.56 mm, etc. If the line width of the second conductive layer 25 is too wide, the line width of the formed welding layer 23 is too wide, and finally the line width of the entire shielding member 20 is too wide, which is not conducive to the thinness of the circuit board assembly 100. The line width of the second conductive layer 25 should not be too narrow. When the line width of the second conductive layer 25 is too narrow, the line width of the formed welding layer 23 is too small, and finally the line width of the entire shielding member 20 is too small. When at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed, the welding layer 23 is easily broken.

[0064] In some embodiments, from the first conductive layer 21 toward the second conductive layer 25, the line width of the welding layer 23 gradually decreases from the line width of the first conductive layer 21, and then gradually increases to the line width of the second conductive layer 25. The welding layer 23 is formed by welding the first conductive layer 21 and the second conductive layer 25 after the material of the welding layer 23 is melted. Due to the surface tension between the first conductive layer 21 and the second conductive layer 25, the welding layer 23 forms a structure that is narrow in the middle and wide on both sides. By welding to form the welding layer 23, it is only necessary to increase the welding points during the welding process of the circuit board assembly 100, without introducing new processes or new materials, and without increasing costs.

[0065] Optionally, the material of the first conductive layer 21 may include but is not limited to at least one of conductive metals or alloys such as copper and silver. The first conductive layer 21 may be formed by a metal layer in the first circuit board 10 during the manufacturing process of the first circuit board 10 through conventional PCB process steps such as exposure, development, etching, and film stripping.

[0066] Optionally, the material of the second conductive layer 25 may include but is not limited to at least one of conductive metals or alloys such as copper and silver. The second conductive layer 25 may be formed by a metal layer in the second circuit board 30 during the manufacturing process of the second circuit board 30 through conventional PCB process steps such as exposure, development, etching, and film stripping.

[0067] Optionally, the material of the welding layer 23 may include but is not limited to tin. Optionally, the raw material of the welding layer 23 may be but is not limited to tin-lead alloy solder, antimony-added solder, cadmium-added solder, silver-added solder, copper-added solder, rosin core solder wire or solder wire, etc.

[0068] The circuit board assembly 100 of the embodiment of the present application can be prepared by the method of the following embodiment of the present application. In addition, it can also be prepared by other methods. The preparation method of the embodiment of the present application is only one or more preparation methods of the circuit board assembly 100 of the present application, and should not be understood as a limitation on the circuit board assembly 100 provided by the embodiment of the present application.

[0069] See also Figure 7 The present application also provides a method for preparing a circuit board assembly 100, the method comprising:

[0070] S201, providing a first circuit board 10, wherein the surface of the first circuit board 10 has a first solder pad 11, and forming a first conductive layer 21 on the surface of the first circuit board 10 having the first solder pad 11, wherein the first conductive layer 21 is disposed around the periphery of the first solder pad 11;

[0071] Optionally, according to the functions to be realized by the first circuit board 10, the signal lines to be electrically connected to the second circuit board 30 are led out, and the first pads 11 are formed on the surface of the first circuit board 10. At the same time, when preparing the first circuit board 10, the original metal layer such as the copper layer in the first circuit board 10 is exposed, developed, etched, stripped, etc., to form a first conductive layer 21 in an annular shape (e.g., a circular ring, a rectangular ring, etc.) on the periphery of the first pad 11 through processes such as exposure, development, etching, and film stripping.

[0072] For detailed descriptions of the first circuit board 10 , the first solder pad 11 , and the first conductive layer 21 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0073] S202, providing a second circuit board 30, wherein the surface of the second circuit board 30 has a second solder pad 31, and forming a second conductive layer 25 on the surface of the second circuit board 30 having the second solder pad 31, wherein the second conductive layer 25 is disposed around the periphery of the second solder pad 31;

[0074] Optionally, the line width of the second conductive layer 25 is smaller than the line width of the first conductive layer 21 .

[0075] Optionally, according to the function to be realized by the second circuit board 30, the signal line to be electrically connected to the second circuit board 30 is led out, and the second pad 31 is formed on the surface of the second circuit board 30. At the same time, when preparing the second circuit board 30, the original metal layer such as the copper layer in the second circuit board 30 is exposed, developed, etched, stripped, etc., to form a second conductive layer 25 in an annular shape (e.g., a circular ring, a rectangular ring, etc.) on the periphery of the second pad 31 through processes such as exposure, development, etching, and film stripping.

[0076] When the first conductive layer 21 and the second conductive layer 25 are formed, at least one of the first conductive layer 21 and the second conductive layer 25 is grounded.

[0077] There is no particular order for S201 and S202. S201 may be performed first, and then S202; S202 may be performed first, and then S201; S201 and S202 may also be performed simultaneously, which is not specifically limited in the present application.

[0078] For detailed descriptions of the second circuit board 30 , the second solder pad 31 , and the second conductive layer 25 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0079] S203, forming a plurality of soldering portions 210 spaced apart around the outer periphery of the first soldering pad 11 on a side of the first conductive layer 21 away from the first circuit board 10;

[0080] See also Figure 8 Optionally, a mesh (such as a steel mesh) is used to brush solder (i.e., the raw material of the welding layer 23, such as tin) on the surface of the first conductive layer 21 away from the first circuit board 10, so as to form a plurality of welding portions 210 arranged at intervals around the periphery of the first solder pad 11 on the surface of the first conductive layer 21 away from the first circuit board 10.

[0081] Optionally, solder is printed on the surface of the first pad 11 while printing the welding portion 210 , so that when the solder melts in a subsequent step, the first pad 11 and the second pad 31 are welded together through the solder to achieve electrical connection between the first pad 11 and the second pad 31 .

[0082] Please also see Fig. 9 Optionally, the welding portion 210 includes a first portion 211, a second portion 213 and a connecting portion 215, wherein the first portion 211 and the second portion 213 are arranged at intervals, the connecting portion 215 is arranged between the first portion 211 and the second portion 213, and respectively connects the first portion 211 and the second portion 213, and the first portion 211 and the second portion 213 both protrude from opposite sides of the connecting portion 215; a plurality of welding portions 210 are arranged at intervals along the arrangement direction of the first portion 211 and the second portion 213, and the first portion 211 and the second portion 213 both protrude from opposite sides of the first conductive layer 21. It can be understood that along the arrangement direction perpendicular to the first portion 211 and the second portion 213, the first portion 211 and the second portion 213 both protrude from opposite sides of the connecting portion 215, and the first portion 211 and the second portion 213 both protrude from opposite sides of the first conductive layer 21. It can be understood that, along the extension direction of the first conductive layer 21 , the plurality of welding portions 210 are arranged at intervals.

[0083] Since the multiple welding parts 210 formed by screen printing are arranged at intervals, the first part 211 and the second part 213 are respectively provided at both ends of the connecting part 215, and the first part 211 and the second part 213 both protrude from the opposite sides of the connecting part 215. In this way, when the welding part 210 is melted, the molten solder will be pulled back to the first conductive layer 21 under the action of its own surface tension. If there is too much molten solder (tin) in a single welding part 210 on the first conductive layer 21, it will spread to the place where there is no solder between adjacent welding parts 210, and finally fill the entire gap between adjacent welding parts 210, so that the obtained shielding part 20 has no gap and has a better signal shielding effect. If the first portion 211 and the second portion 213 do not protrude from the opposite sides of the connecting portion 215, in other words, there is only the connecting portion 215. When the welding portion 210 melts, due to the insufficient amount of molten solder (molten tin), the distance that the molten solder spreads is limited and it is impossible to completely fill the gap between adjacent welding portions 210, so that the finally formed welding layer 23 is prone to interruption (tin wall terminal), resulting in gaps, which affects the shielding effect of the shielding component 20.

[0084] See also Fig.10 In some embodiments, the plurality of welding portions 210 include a first welding portion 210a and a second welding portion 210b that are adjacent and spaced apart, the first portion 211 of the first welding portion 210a and the second portion 213 of the second welding portion 210b are disposed opposite to each other, the first portion 211 of the first welding portion 210a includes a first protruding portion 2111 and a second protruding portion 2113 that are disposed opposite to each other, and the second portion 213 of the second welding portion 210b includes a third protruding portion 2131 and a fourth protruding portion 2133 that are disposed opposite to each other. 2133, the sum of the area of ​​the first protrusion 2111, the area of ​​the second protrusion 2113, the area of ​​the third protrusion 2131 and the area of ​​the fourth protrusion 2133 is S1, the gap between the first portion 211 of the first welding portion 210a and the second portion 213 of the second welding portion 210b is w1, and the width w2 of the connecting portion 215 along the arrangement direction perpendicular to the first portion 211 and the second portion 213, let S2 = w1 × w2; then the range of S1 / S2 is 1 to 1.2. Specifically, S1 / S2 can be, but is not limited to, 1.0, 1.03, 1.05, 1.08, 1.1, 1.12, 1.15, 1.17, 1.2, etc. If the ratio of S1 / S2 is too small, when the welding part 210 melts, the molten solder cannot completely fill the gap between the adjacent welding parts 210, so that the finally formed welding layer 23 is prone to interruption (tin wall interruption), resulting in gaps, affecting the shielding effect of the shielding part 20; if the ratio of S1 / S2 is too large, when the welding part 210 melts, the molten solder is prone to overflow the first conductive layer 21 and the second conductive layer 25, causing the first circuit board 10 or the second circuit board 30 to short-circuit, thereby affecting the performance of the circuit board assembly 100.

[0085] The "protruding portion" refers to the portion of the first portion 211 and the second portion 213 that protrudes from the connecting portion 215 along the direction perpendicular to the arrangement of the first portion 211 and the second portion 213. The area of ​​the "protruding portion" refers to the area covered by the protruding portion on the surface parallel to the extension plane of the first conductive layer 21 (or the surface parallel to the arrangement and extension plane of the welding portion 210).

[0086] Optionally, along the arrangement direction perpendicular to the first portion 211 and the second portion 213, the width w2 of the connection portion 215 is in the range of 0.5 mm ≤ w2 ≤ 0.8 mm; the width w2 of the connection portion 215 may be, but is not limited to, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm, 0.8 mm, etc. If the width of the connection portion 215 is too wide, when the welding portion 210 melts, the molten solder easily overflows the first conductive layer 21 and the second conductive layer 25, causing the first circuit board 10 or the second circuit board 30 to short-circuit, thereby affecting the performance of the circuit board assembly 100; the width of the connection portion 215 should not be too narrow. When the width of the connection portion 215 is too narrow, the line width of the formed welding layer 23 is too small, and finally the line width of the entire shielding member 20 is too small. When at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed, the welding layer 23 is easily broken.

[0087] Optionally, the width of the connecting portion 215 is equal to the width of the first conductive layer 21 .

[0088] Optionally, the range of the gap w1 between any two adjacent welding parts 210 is 0.1mm≤w1≤0.3mm. Specifically, the gap between any two adjacent welding parts 210 can be, but is not limited to, 0.1mm, 0.13mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm. If the gap between two adjacent welding parts 210 is too small, it means that the mesh wire on the screen of the printed welding part 210 is too thin, and the screen is easily broken. If the gap between two adjacent welding parts 210 is too large, when the welding part 210 melts, there is not enough molten solder to fill the gap between the adjacent welding parts 210, and the formed welding layer 23 is prone to have gaps, which affects the shielding effect of the shielding part 20.

[0089] S204 , stacking the second circuit board 30 on the surface of the first circuit board 10 where the soldering portion 210 is provided, and making the second conductive layer 25 face the soldering portion 210 ; and

[0090] Optionally, the second circuit board 30 is stacked on the first circuit board 10 so that the surface of the second circuit board 30 having the second solder pad 31 and the second conductive layer 25 faces the surface of the first circuit board 10 having the soldering portion 210 .

[0091] It can be understood that the second conductive layer 25 at least partially overlaps with the welding portion 210 .

[0092] S205 , melting the soldering portion 210 to form a soldering layer 23 to connect the first conductive layer 21 and the second conductive layer 25 , and to electrically connect the first pad 11 and the second pad 31 .

[0093] Optionally, at a preset temperature, the welding portion 210 is melted so that the molten welding portion 210 fills the gap between adjacent welding portions 210, and multiple welding portions 210 are melted, and after cooling, a closed ring welding layer 23 is formed, and the first conductive layer 21 and the second conductive layer 25 are welded through the welding layer 23. At the same time, the solder on the first pad 11 is also melted, and the first pad 11 and the second pad 31 are welded to electrically connect the first pad 11 and the second pad 31. The stacked first conductive layer 21, welding layer 23 and second conductive layer 25 form a shielding member 20.

[0094] Optionally, when the solder is tin, the preset temperature may range from 240°C to 280°C. Specifically, the preset temperature may be, but is not limited to, 240°C, 245°C, 250°C, 255°C, 260°C, 265°C, 270°C, 275°C, 280°C, etc. The preset temperature should not be too low or too high. If the preset temperature is too low, the soldering portion 210 is difficult to completely melt, and the fluidity is poor, which may cause a gap in the middle of the formed shielding member 20, affecting the shielding effect. If the preset temperature is too high, part of the material on the first circuit board 10 or the second circuit board 30 may soften or melt, thereby causing deformation, affecting the performance of the formed circuit board assembly 100.

[0095] In the method for preparing the circuit board assembly 100 of the embodiment of the present application, during the welding process of the first solder pad 11 of the first circuit board 10 and the second solder pad 31 of the second circuit board 30, a shielding member 20 is simultaneously formed on the periphery of the first solder pad 11 and the second solder pad 31, so that the signal transmitted between the first circuit board 10 and the second circuit board 30 can be shielded from the interference signal radiated when passing through the first solder pad 11 and the second solder pad 31. In addition, the first conductive layer 21 is formed in the process of the first circuit board 10, the second conductive layer 25 is formed in the process of the second circuit board 30, and the shielding member 20 and the welding between the first solder pad 11 and the second solder pad 31 are formed in the same process, without introducing new processes or new materials, and the preparation cost of the circuit board assembly 100 will not be increased.

[0096] For detailed description of the features that are the same between this embodiment and the above embodiment, please refer to the above embodiment, which will not be repeated here.

[0097] See also Fig.11 and Fig.12The embodiment of the present application also provides a mesh plate 300, which can be used in the preparation of the circuit board assembly 100 of the embodiment of the present application, and includes a plurality of mesh holes 310 arranged at intervals, each mesh hole 310 includes a first hole position 311, a second hole position 313 and a third hole position 315, the first hole position 311 and the second hole position 313 are arranged at intervals, the third hole position 315 is arranged between the first hole position 311 and the second hole position 313, and respectively connects the first hole position 311 and the second hole position 313; the first hole position 311 and the second hole position 313 both protrude from opposite sides of the third hole position 315, and the plurality of mesh holes 310 are arranged at intervals along the arrangement direction of the first hole position 311 and the second hole position 313.

[0098] The mesh plate 300 of the present embodiment can be used for printing the soldering parts 210 in the circuit board assembly 100 of the above-mentioned embodiment, so that when the multiple soldering parts 210 arranged at intervals are melted, the molten solder will be pulled back to the first conductive layer 21 under the action of its own surface tension. If there is too much molten solder (tin) in a single soldering part 210 on the first conductive layer 21, it will spread to the places where there is no solder between adjacent soldering parts 210, and finally fill the entire gap between adjacent soldering parts 210, so that the obtained shielding part 20 has no gap and has a better signal shielding effect.

[0099] In some embodiments, the plurality of mesh holes 310 are arranged at intervals along the arrangement direction of the first hole positions 311 and the second hole positions 313. In this way, when the stencil 300 of this embodiment is used to print the welding portion 210, during the melting process of the welding portion 210, the molten solder can better fill the gap between adjacent welding portions 210, so that the formed shielding member 20 has a better signal shielding effect.

[0100] See also Fig.13 In some embodiments, the distance w1' between any two adjacent meshes 310 is in the range of 0.1mm≤w1'≤0.3mm. Specifically, the distance w1' between any two adjacent meshes 310 can be, but is not limited to, 0.1mm, 0.13mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm. If the distance between two adjacent meshes 310 is too small, the mesh wire on the mesh plate 300 is too thin, and the mesh plate 300 is easily broken. If the distance between two adjacent meshes 310 is too large, when the welding part 210 formed by brushing the solder on the mesh plate 300 melts, there is not enough molten solder to fill the gap between the adjacent welding parts 210, and the formed welding layer 23 is prone to have gaps, which affects the shielding effect of the shielding component 20.

[0101] In some embodiments, along the arrangement direction perpendicular to the first hole 311 and the second hole 313, the width w2' of the third hole 315 is in the range of 0.5mm≤w2'≤0.8mm. The width w2' of the third hole 315 can be, but is not limited to, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, etc. If the width of the third hole 315 is too wide, the line width of the formed welding layer 23 is too wide, and finally the line width of the entire shielding member 20 is too wide, which is not conducive to the thinness of the circuit board assembly 100. The width of the third hole 315 should not be too narrow. When the width of the third hole 315 is too narrow, the line width of the formed welding layer 23 is too small, and finally the line width of the entire shielding member 20 is too small. When at least one of the first circuit board 10 and the second circuit board 30 is slightly deformed, the welding layer 23 is easily broken.

[0102] In some embodiments, the plurality of meshes 310 include a first mesh 310a and a second mesh 310b that are adjacent and spaced apart, the first hole position 311 of the first mesh 310a and the second hole position 313 of the second mesh 310b are arranged opposite to each other, the first hole position 311 of the first mesh 310a includes a first protruding hole position 3111 and a second protruding hole position 3113 that are arranged opposite to each other, and the second hole position 313 of the second mesh 310b includes a third protruding hole position 3131 and a fourth protruding hole position 3131 that are arranged opposite to each other. 3, the sum of the areas of the first protruding hole position 3111, the second protruding hole position 3113, the third protruding hole position 3131 and the fourth protruding hole position 3133 is S1', the distance between the first hole position 311 of the first mesh 310a and the second hole position 313 of the second mesh 310b is w1', the width of the third hole position 315 along the direction perpendicular to the arrangement of the first hole position 311 and the second hole position 313 is w2', let S2' be w1'×w2', then the range of S1' / S2' is 1 to 1.2.

[0103] Specifically, S1' / S2' may be, but is not limited to, 1.0, 1.03, 1.05, 1.08, 1.1, 1.12, 1.15, 1.17, 1.2, etc. When the ratio of S1' / S2' is too small, when the soldering portion 210 formed by brush printing with the stencil 300 melts, the molten solder cannot completely fill the gap between adjacent soldering portions 210, so that the soldering layer 23 formed finally is easily interrupted (tin wall interruption), resulting in gaps, which affects the shielding effect of the shielding member 20; when the ratio of S1 / S2 is too large, when the soldering portion 210 formed by brush printing with the stencil 300 melts, the molten solder easily overflows the first conductive layer 21 and the second conductive layer 25, causing the first circuit board 10 or the second circuit board 30 to short-circuit, thereby affecting the performance of the circuit board assembly 100.

[0104] The "protruding hole" refers to the portion of the first hole 311 and the second hole 313 protruding from the third hole 315 in the direction perpendicular to the arrangement of the first hole 311 and the second hole 313. The area of ​​the "protruding hole" refers to the area covered by the protruding hole along the surface parallel to the extension plane of the mesh plate 300.

[0105] See also Figures 14 to 16 The embodiment of the present application also provides an electronic device 400, which includes a display screen 410 and a circuit board assembly 100 of the embodiment of the present application, at least one of the first circuit board 10 or the second circuit board 30 of the circuit board assembly 100 includes a processor 101, and the processor 101 is electrically connected to the display screen 410 for controlling the display screen 410 to display.

[0106] The electronic device 400 of the embodiment of the present application may be, but is not limited to, a portable electronic device 400 such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a smart bracelet, a smart watch, an electronic reader, a game console, etc. For a detailed description of the circuit board assembly 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0107] Optionally, the display screen 410 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0108] Optionally, the processor 101 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 101 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory 103, which enables the computing device to provide a wide variety of services.

[0109] For detailed description of the features that are the same between this embodiment and the above embodiment, please refer to the above embodiment, which will not be repeated here.

[0110] Optionally, at least one of the first circuit board 10 or the second circuit board 30 of the circuit board assembly 100 of the present application further includes a memory 103. The memory 103 is electrically connected to the processor 101 and is used to store program codes required for the processor 101 to run, program codes required for controlling the display screen 410, display contents of the display screen 410, etc.

[0111] Optionally, the memory 103 may include a volatile memory (Volatile Memory), such as a random access memory (Random Access Memory, RAM); the memory 103 may also include a non-volatile memory (NVM), such as a read-only memory (Read-Only Memory, ROM), a flash memory (Flash Memory, FM), a hard disk drive (Hard Disk Drive, HDD) or a solid-state drive (SSD). The memory 103 may also include a combination of the above-mentioned types of memory.

[0112] In some embodiments, the electronic device 400 of the embodiment of the present application further includes a housing 430, a middle frame 450 and a camera module 470, the housing 430 is spaced apart from and opposite to the display screen 410, the middle frame 450 is disposed between the display screen 410 and the housing 430, and the side of the middle frame 450 is exposed to the housing 430 and the display screen 410. The middle frame 450 and the housing 430 enclose a housing space (not shown), and the housing space is used to accommodate the processor 101, the memory 103 and the camera module 470. The camera module 470 is electrically connected to the processor 101, and is used to shoot under the control of the processor 101.

[0113] Optionally, the housing 430 has a light-transmitting portion 431, and the camera module 470 can shoot through the light-transmitting portion 431 on the housing 430, that is, the camera module 470 in this embodiment is a rear camera module 470. It can be understood that in other embodiments, the light-transmitting portion 431 can be set on the display screen 410, that is, the camera module 470 is a front camera module 470. In the schematic diagram of this embodiment, the light-transmitting portion 431 is illustrated as an opening. In other embodiments, the light-transmitting portion 431 may not be an opening, but a light-transmitting material, such as plastic, glass, etc.

[0114] It can be understood that the electronic device 400 in this embodiment is merely a form of electronic device 400 used by the circuit board assembly 100, and should not be understood as a limitation on the electronic device 400 provided in this application, nor should it be understood as a limitation on the circuit board assembly 100 provided in each embodiment of this application.

[0115] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, if there is no contradiction between them.

[0116] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A circuit board assembly, It is characterized in that include: A first circuit board, wherein a surface of the first circuit board has a first solder pad; A shielding member, the shielding member is disposed on the surface of the first circuit board having the first solder pad and is disposed around the outer periphery of the first solder pad; as well as a second circuit board, the second circuit board being arranged on a side of the shielding member away from the first circuit board, the second circuit board having a second solder pad, and the second solder pad being electrically connected to the first solder pad; The shielding component includes a first conductive layer, a welding layer and a second conductive layer which are stacked in sequence; the first conductive layer is arranged on the surface of the first circuit board facing the second circuit board, the second conductive layer is arranged on the surface of the second circuit board facing the first circuit board, and the line width of the first conductive layer is greater than the line width of the second conductive layer; the line width d1 of the first conductive layer and the line width d2 of the second conductive layer satisfy: 0.4≤d2 / d1≤0.

7.

2. The circuit board assembly according to claim 1, It is characterized in that At least one of the first conductive layer and the second conductive layer is grounded.

3. The circuit board assembly according to claim 1, It is characterized in that The range of the line width d1 of the first conductive layer is: 0.5 mm ≤ d1 ≤ 0.8 mm; the range of the line width d2 of the second conductive layer is: 0.2 mm ≤ d2 ≤ 0.56 mm.

4. The circuit board assembly according to any one of claims 2 to 3, It is characterized in that From the first conductive layer toward the second conductive layer, the line width of the welding layer gradually decreases from the line width of the first conductive layer, and then gradually increases to the line width of the second conductive layer.

5. A method for preparing a circuit board assembly, It is characterized in that include: Providing a first circuit board, wherein the surface of the first circuit board has a first solder pad, and forming a first conductive layer on the surface of the first circuit board having the first solder pad, wherein the first conductive layer is disposed around the periphery of the first solder pad; Providing a second circuit board, wherein a second pad is provided on a surface of the second circuit board, and forming a second conductive layer on the surface of the second circuit board provided with the second pad, wherein the second conductive layer is provided around the periphery of the second pad, wherein a line width of the second conductive layer is smaller than a line width of the first conductive layer; A plurality of welding portions are formed on a side of the first conductive layer facing away from the first circuit board and are arranged at intervals around the outer periphery of the first welding pad; stacking the second circuit board on the surface of the first circuit board provided with the soldering portion, with the second conductive layer facing the soldering portion; and The welding portion is melted to form a welding layer to connect the first conductive layer with the second conductive layer, and the first pad is electrically connected with the second pad, wherein the first conductive layer, the welding layer and the second conductive layer constitute a shielding member; the line width d1 of the first conductive layer and the line width d2 of the second conductive layer satisfy: 0.4≤d2 / d1≤0.

7.

6. The method for preparing a circuit board assembly according to claim 5, It is characterized in that The method of stacking the second circuit board on the surface of the first circuit board provided with the soldering portion, and making the second conductive layer face the soldering portion, comprises: A mesh plate is used to brush solder on the surface of the first conductive layer away from the first circuit board to form a plurality of welding parts arranged at intervals; the welding parts include a first part, a second part and a connecting part, the first part and the second part are arranged at intervals, the connecting part is arranged between the first part and the second part, and respectively connects the first part and the second part, and the first part and the second part both protrude from the opposite sides of the connecting part; the plurality of welding parts are arranged at intervals along the arrangement direction of the first part and the second part, and the first part and the second part both protrude from the opposite sides of the first conductive layer.

7. The method for preparing a circuit board assembly according to claim 6, It is characterized in that The multiple welding parts include a first welding part and a second welding part that are adjacent and spaced apart, the first part of the first welding part is opposite to the second part of the second welding part, the first part of the first welding part includes a first protrusion and a second protrusion that are arranged opposite to each other, the second part of the second welding part includes a third protrusion and a fourth protrusion that are arranged opposite to each other, the sum of the area of ​​the first protrusion, the area of ​​the second protrusion, the area of ​​the third protrusion and the area of ​​the fourth protrusion is S1, the gap between the first part of the first welding part and the second part of the second welding part is w1, the width of the connecting part is w2, let S2=w1×w2, then the range of S1 / S2 is 1 to 1.

2.

8. The method for preparing a circuit board assembly according to claim 6 or 7, It is characterized in that The width w2 of the connection portion is in the range of 0.5 mm ≤ w2 ≤ 0.8 mm; the gap w1 between any two adjacent welding portions is in the range of 0.1 mm ≤ w1 ≤ 0.3 mm.

9. The method for preparing a circuit board assembly according to claim 6, It is characterized in that It includes a plurality of mesh holes arranged at intervals, each of the mesh holes includes a first hole position, a second hole position and a third hole position, the first hole position and the second hole position are arranged at intervals, the third hole position is arranged between the first hole position and the second hole position, and respectively connects the first hole position and the second hole position; the first hole position and the second hole position both protrude from opposite sides of the third hole position, and the plurality of mesh holes are arranged at intervals along the arrangement direction of the first hole position and the second hole position.

10. The method for preparing a circuit board assembly according to claim 9, It is characterized in that The distance w1' between any two adjacent mesh holes is in the range of 0.1 mm ≤ w1' ≤ 0.3 mm; the width w2' of the third hole position is in the range of 0.5 mm ≤ w2' ≤ 0.8 mm.

11. The method for preparing a circuit board assembly according to any one of claims 9 to 10, It is characterized in that The multiple meshes include a first mesh and a second mesh that are adjacently and spaced apart, the first hole position of the first mesh is arranged opposite to the second hole position of the second mesh, the first hole position of the first mesh includes a first protruding hole position and a second protruding hole position that are arranged opposite to each other, the second hole position of the second mesh includes a third protruding hole position and a fourth protruding hole position that are arranged opposite to each other, the sum of the areas of the first protruding hole position, the second protruding hole position, the third protruding hole position and the fourth protruding hole position is S1', the distance between the first hole position of the first mesh and the second hole position of the second mesh is w1', the width of the third hole position is w2', let S2'=w1'×w2', then the range of S1' / S2' is 1 to 1.

2.

12. An electronic device, It is characterized in that include: Display screen; The circuit board assembly according to any one of claims 1 to 4, wherein at least one of the first circuit board or the second circuit board of the circuit board assembly comprises a processor, and the processor is electrically connected to the display screen for controlling the display screen to display.

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