Composite fork device, method and system using the same

Abstract

This application discloses a composite fork device comprising a first finger and a second finger spaced apart from the first finger, each of the first and second fingers having an upper surface and a lower surface recessed relative to the upper surface. The upper surfaces of the first and second fingers are configured to cooperatively support a first type of container. The lower surfaces of the first and second fingers are configured to cooperatively support a second type of container having a configuration different from that of the first type of container. This application also discloses a method and system for using the composite fork device.

Description

Technical Field

[0001] Embodiments of the present invention relate to a composite fork device and a method and system for using the composite fork device. Background Art

[0002] The semiconductor integrated circuit (IC) industry has experienced tremendous progress over the past decades and continues to thrive. With dramatic technological advancements, IC manufacturing is often machine-driven, improving workplace safety, productivity, and efficiency. However, as IC manufacturing processes become increasingly complex, often involving multiple materials and devices, process efficiency can decline and production costs can surge. Consequently, the industry is focusing on developing machines that are better at handling multi-tasking tasks. Summary of the Invention

[0003] According to some embodiments of the present disclosure, a composite fork device is provided, comprising a first finger and a second finger separated from the first finger, each of the first finger and the second finger having an upper surface and a lower surface recessed relative to the upper surface, the upper surfaces of the first finger and the second finger being configured to cooperatively support a first type of container, and the lower surfaces of the first finger and the second finger being configured to cooperatively support a second type of container, the second type of container having a configuration different from a configuration of the first type of container.

[0004] According to some embodiments of the present disclosure, a system is provided, comprising: a composite load port workstation configured to allow loading of a first type of container or a second type of container, the second type of container having a configuration different from a configuration of the first type of container; a processing tool; a robot positioned between the composite load port workstation and the processing tool; and a composite fork device coupled to be driven by the robot and configured to selectively support the first type of container or the second type of container, thereby allowing the robot to selectively The first type of container or the second type of container is transported from the composite loading port workbench to an entrance loading port of the processing tool, the composite fork device includes a first fork finger and a second fork finger separated from the first fork finger, each of the first fork finger and the second fork finger has an upper surface and a lower surface that is recessed relative to the upper surface, the upper surfaces of the first fork finger and the second fork finger are configured to cooperatively support the first type of container, and the lower surfaces of the first fork finger and the second fork finger are configured to cooperatively support the second type of container.

[0005] According to some embodiments of the present disclosure, a method is provided, comprising: placing a container on a compound loading port workbench; supporting the container using a compound fork device, the compound fork device comprising a first fork finger and a second fork finger, each of the first fork finger and the second fork finger having an upper surface and a lower surface that is recessed relative to the upper surface, so that the container is supported by the upper surface or the lower surface of the first fork finger and the second fork finger; transporting the container to a processing tool using the compound fork device so that a bottom portion of the container is placed at an inlet loading port of the processing tool; and detaching the container from the compound fork device. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Various aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It is important to note that, in accordance with standard industry practice, various features are not drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or decreased for clarity of discussion.

[0007] Figure 1A is an illustrative perspective view illustrating a container according to some embodiments.

[0008] Figure 1B is a method comprising Figure 1A An illustrative perspective view of a stack of containers is shown.

[0009] Figure 2 is an illustrative perspective view illustrating another container according to some embodiments.

[0010] Figure 3A is an exemplary perspective view illustrating yet another container according to some embodiments.

[0011] Figure 3B is an illustrative perspective view of a cuvette according to some embodiments.

[0012] Figure 4 is an illustrative perspective view illustrating a composite fork device according to some embodiments.

[0013] Figure 5 is a fragmentary perspective front view of a composite fork device according to some embodiments.

[0014] Figure 6 is a top view of a composite fork device according to some embodiments.

[0015] Figure 7 is an illustrative perspective view of a composite fork device supported by a composite fork device according to some embodiments. Figure 1B Container shown.

[0016] Figure 8Ais an illustrative perspective view of a composite fork device supported by a composite fork device according to some embodiments. Figure 2 Container shown.

[0017] Figure 8B is an illustrative perspective view of a composite fork device supported by a composite fork device according to some embodiments. Figure 3A Container shown.

[0018] Figure 9 is a fragmentary perspective top view illustrating a top flange supported by a first finger of a composite fork device according to some embodiments.

[0019] Figure 10 is an illustrative perspective side view illustrating a second finger of a composite fork device according to some embodiments.

[0020] Figure 11 is one Figure 7 An exemplary top view of .

[0021] Figure 12 is an illustrative top view illustrating a top flange supported by a composite fork assembly according to some embodiments.

[0022] Figure 13 An illustrative perspective view of one of the upper guide blocks of a compound fork device is shown, according to some embodiments.

[0023] Figure 14 An illustrative perspective view of one of the lower guide blocks of a compound fork device is shown, according to some embodiments.

[0024] Figure 15 is a perspective view illustrating a method for transporting a vehicle according to some embodiments. Figure 1B The composite fork arrangement in the system of containers is shown.

[0025] Figure 16 is a flow chart illustrating a method for performing a process according to some embodiments of the present invention. Figure 15 Method of transport of the system shown.

[0026] Figure 17 is a perspective view illustrating a method for transporting a vehicle according to some embodiments. Figure 2 The composite fork arrangement in the system of containers is shown.

[0027] Figure 18 is a flow chart illustrating a method for performing a process according to some embodiments of the present invention. Figure 17 Method of transport of the system shown. Implementation Method

[0028] The following disclosure provides many different embodiments or examples for implementing different features of the present disclosure. In order to simplify the present disclosure, specific examples of various components and configurations will be described below. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, a first feature is formed above or on a second feature, which means that it may include an embodiment in which the first feature and the second feature are in direct contact, and may also include an embodiment in which additional features are formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact. In addition, the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for simplicity and clarity and does not itself represent a relationship between the various embodiments and / or configurations discussed.

[0029] Furthermore, spatially relative terms, such as "on," "above," "above," "below," "upper," "lower," "top," "bottom," "front," "rear," "outwardly," "forwardly," "rearwardly," "interior," "exterior," etc., may be used herein to describe the relationship of one component or feature to another component or feature(s) depicted in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0030] In semiconductor manufacturing, containers carrying at least one semiconductor device (such as a chip or die) are transported to and from various processing locations manually or, more commonly, by various automated carriers or automated material handling systems (AMHS) to ensure efficiency and safety. An automated material handling system may be, but is not limited to, a system comprising at least one of a rail-guided vehicle (RGV), an overhead shuttle (OHS), an overhead crane (OHT), an automated guided vehicle (AGV), a personnel-guided vehicle (PGV), or a track and carrier, or other suitable devices. A carrier may be, but is not limited to, a mobile robot or robotic arm programmed for the transport process.

[0031] Figure 1A FIG1 is an exemplary perspective view illustrating a container 61 according to some embodiments. The container 61 is mainly used for (but not limited to) carrying at least one completed semiconductor product, such as a dynamic access memory (DRAM) or other suitable products, and is generally referred to as a tray. Figure 1B A container according to some embodiments is shown. Figure 1A The stack of containers 61 is shown and is also indicated by reference numeral 61). In order to support or transport Figure 1A Or the container 61 shown in 1B, two support arms of a robot (not shown) can be used to lift and support the container 61, thereby allowing the robot to transport the container 61 to a predetermined location.

[0032] Figure 2 FIG. 1 is an exemplary perspective view illustrating another container 62 according to some embodiments. The container 62 is mainly used for (but not limited to) carrying Figure 1A The container 62 may include a container body 621 and a top flange 601, and the container body 621 is configured to allow Figure 1A 1B is accommodated therein, and a top flange 601 is mounted on the top surface of the container body 621. The top flange 601 is configured to allow the container 62 to be gripped and transported to an overhead handling (OHT) such as (but not limited to) an AMHS. In order to support or transport the container 62, a robot assembled with a gripper (not shown) can be utilized to grasp or grip the top flange of the container 62, thereby allowing the robot to transport the container 62 to a predetermined location.

[0033] Figure 3A is an illustrative perspective view illustrating yet another container 63 according to some embodiments. Figure 3B is an illustrative perspective view of a container 64 according to some embodiments. Figure 2 The illustrated container 62 differs in that the container 63 is primarily used (but not limited to) to carry receptacles 64, commonly referred to as boats. Receptacles 64 are configured to support a plurality of semiconductor devices (not shown) thereon awaiting further processing. Container 63 may include a container body 631 and a top flange 601 formed on the top surface of container body 631. Top flange 601 has a configuration similar to top flange 601 of container 62, but may have a different thickness than top flange 601 of container 62. Container body 631 may have a plurality of guide grooves 632 on two opposing inner walls thereof to guide insertion and removal of receptacles 64 into and from container body 631 and thereby prevent receptacles 64 from contacting each other within container body 631. Container 63 is commonly referred to as a magazine-type container. To support or transport the container 63, a robot assembled with two guide rails (not shown) can be utilized to allow the two opposite sides of the top flange 601 of the container 63 to slide to and be supported between the guide rails, thereby allowing the robot to transport the container 63 to a predetermined location.

[0034] Therefore, in order to support or transport different types of containers (such as container 61, container 62, container 63), a carrier with a corresponding interface is used, which not only complicates the semiconductor process, but also brings additional costs (such as maintenance costs) and may adversely affect the efficiency of the semiconductor process.

[0035] To improve the efficiency of integrated circuit (IC) manufacturing processes, the present disclosure provides a composite fork device that does not require changes to its interface when supporting or transporting different types of containers.

[0036] Figure 4 An illustrative perspective view of a composite fork device 10 is shown, according to some embodiments. Figure 5 is a fragmentary perspective front view of a composite fork device 10 according to some embodiments. Figure 6 is a top view of a composite fork device 10 according to some embodiments.

[0037] The composite fork device 10 includes a first fork finger 11 and a second fork finger 12 separated from the first fork finger 11. The composite fork device 10 can be applied to (but not limited to) a robot 50 (shown in FIG. Figure 15 and Figure 17 ), such as a 6-axis robot, a mobile robot, etc. Other machines or robots suitable for applying the composite fork device 10 thereon are within the intended scope of the present disclosure. Each of the first finger 11 and the second finger 12 may extend in a direction away from the machine or robot to which the composite fork device 10 is connected. In some other embodiments, the first finger 11 and the second finger 12 may be separated from each other by a fixed distance and may extend parallel to each other. In certain embodiments, the first finger 11 and the second finger 12 may be separated from each other by a distance ranging from about 90 mm to about 140 mm. In some embodiments, the first finger 11 and the second finger 12 may be made of a metal (such as aluminum). In certain embodiments, the metal may be anodized to increase the durability of the first finger 11 and the second finger 12. Other materials suitable for the first finger 11 and the second finger 12 are within the intended scope of the present disclosure. Each of the first and second fingers 11 and 12 has an upper surface 13 and a lower surface 14 that is recessed relative to the upper surface 13 .

[0038] Figure 7 is an exemplary perspective view showing a composite fork device 10 supported by a composite fork device according to some embodiments. Figure 1B Container 61 is shown. Figure 8A is an illustrative perspective view illustrating a container 62 supported by a composite fork device 10 according to some embodiments. Figure 8Bis an exemplary perspective view illustrating a container 63 supported by the composite fork device 10 according to some embodiments. The upper surfaces 13 of the first and second fingers 11, 12 are configured to cooperatively support a first type of container (e.g., Figure 1A 、 Figure 1B and Figure 7 The lower surfaces 14 of the first and second fingers 11, 12 are configured to cooperatively support a second type of container (e.g., Figure 2 and Figure 8A The container 62 shown, Figure 3A and Figure 8B 63 or other suitable container having a top flange 601). The second type of container 62, 63 has a different configuration than the first type of container 61. In some embodiments, the first and second fingers 11, 12 may be oriented relative to a centerline (CL, shown in FIG. 1 ) between the first and second fingers 11, 12. Figure 5 ) are symmetrical to each other.

[0039] Figure 9 is a fragmentary perspective top view illustrating the top flange 601 being supported by the first fingers 11 according to some embodiments. Figure 10 1 is an exemplary perspective side view illustrating the second interdigit 12 according to some embodiments. In some embodiments, the height difference (H) between the upper surface 13 and the lower surface 14 of each of the first interdigit 11 and the second interdigit 12 may be in the range of about 1 mm to about 5 cm, so that the top flange 601 of the second type container 62, 63 can be supported on the lower surface 14 and located on the upper surface 13 (as shown in FIG. Figure 8A 、 Figure 8B and Figure 9 ). In some embodiments, the height difference (H) is greater than the thickness of the top flange 601. In some embodiments, the length (L) of each of the first and second fingers 11, 12 may be substantially the same as the length of the first type of container 61. In alternative embodiments, the length (L) may be less than or greater than the length of the first type of container 61, as long as the first type of container 61 can be supported by the upper surface 13 of the first and second fingers 11, 12. In some embodiments, considering the effects of, for example Figure 15 and Figure 17 In order to reduce the torque on the robot 50 shown (which affects the stability of the composite fork device 10 in supporting and transporting containers), the length (L) of each of the first and second fingers 11, 12 is no more than about 110% of the length of the first type of container 61. The lower surface 14 and the sidewall 15 connected between the upper surface 13 and the lower surface 14 form a recessed area 16. In some embodiments, the length (L1) of the recessed area 16 is greater than the length of the top flange 601 (see Figure 9 and Figure 10 In some embodiments, the length (L1) of the recessed area 16 is about 40% to about 60% of the length (L) of each of the first and second fingers 11, 12, such that the top flange 601 of the second type container 62, 63 can be supported in the recessed area 16. In some embodiments, the lower surface 14 can be recessed to reduce the weight of the composite fork device 10.

[0040] Figure 11 FIG. 1 is an exemplary top view illustrating a first type of container 61 supported by a composite fork device 10 according to some embodiments. Figure 5 、 Figure 6 、 Figure 10 and Figure 11 As shown, in some embodiments, the upper surface 13 of each of the first and second fingers 11, 12 includes a front support area 131 and a rear support area 132 located behind the front support area 131. In some embodiments, the front support area 131 is located in front of the lower surface 14 (i.e., the recessed area 16), and the rear support area 132 is located behind the lower surface 14 (i.e., the recessed area 16), thereby allowing four parts of the first type of container 61 to be supported by the front support area 131 and the rear support area 132 of the upper surface 13 of the first and second fingers 11, 12, respectively. The four parts of the first type of container 61 may be (but are not limited to) the four edge parts of the first type of container 61. In some embodiments, the upper surface 13 of each of the first and second fingers 11, 12 has a front mounting area 133 located outside the front support area 131, and a rear mounting area 134 located outside the rear support area 132. In certain embodiments, the reinforcement 29 (shown in Figure 9 and Figure 10 ) can be installed to partially cover at least one of the front mounting area 133 and the rear mounting area 134 of the upper surface 13 of the first interdigital finger 11 and the second interdigital finger 12, thereby mechanically strengthening the first interdigital finger 11 and / or the second interdigital finger 12.

[0041] In some embodiments, as Figure 5 and Figure 10 As shown, two upper guide units 21 are formed on the upper surfaces 13 of the first and second fingers 11, 12, respectively, to guide both sides of the first type container 61, thereby allowing the four parts of the first type container 61 to be moved to the front support area 131 and the rear support area 132 of the upper surfaces 13 of the first and second fingers 11, 12, respectively. In some embodiments, as Figure 5As shown, the upper guide units 21 disposed on the first and second fingers 11, 12, respectively, may be symmetrical with respect to the centerline (CL). In some embodiments, each of the upper guide units 21 includes at least two upper guide blocks 211, which are disposed on the front mounting area 133 and the rear mounting area 134 of the first and second fingers 11, 12, respectively. In alternative embodiments, each of the upper guide units 21 may include more than two upper guide blocks 211.

[0042] In some embodiments, as Figure 5 and Figure 11 As shown, the compound fork device 10 of the present disclosure may further include at least two sensors 23. The sensors 23 are used to verify and ensure that the first type of container 61 is placed on the compound fork device 10. By providing the sensors 23 on the compound fork device 10, the first type of container 61 can be prevented from being tilted or incorrectly positioned when supported by the compound fork device 10. In some embodiments, one of the sensors 23 is provided in front of the upper guide block 211 of one of the upper guide units 21, and the other of the sensors 23 is provided behind the upper guide block 211 of the other of the upper guide units 21. In some embodiments, the sensors 23 may be provided in, but are not limited to, recesses 130 formed in the first and second fingers 11, 12 (see Figure 10 and Figure 11 ), thereby preventing the sensor 23 from contacting the first type container 61. In an alternative embodiment, two sensors 23 are provided on each of the first and second fingers 11, 12, and are located in front of and behind the upper guide block 211 of the corresponding upper guide unit 21. Each of the sensors 23 can independently be a pressure sensor, a proximity sensor, an infrared sensor, an optical sensor, an ultrasonic sensor, a fiber sensor, or the like, or a combination thereof. Other suitable sensors are within the contemplated scope of the present disclosure.

[0043] In some embodiments, the sensors 23 are optical or infrared sensors that emit waves to sense whether an object (i.e., a container) is within a predetermined position / distance. The sensors 23 may be made of plastic. In some embodiments, the sensors 23 are configured to trigger a response for the composite fork device 10 to operate when the container 61 is approximately 1 mm from each of the sensors 23.

[0044] Figure 12 is an exemplary top view illustrating a top flange 601 supported by a composite fork device 10 according to some embodiments.

[0045] like Figure 5 and Figure 12As shown, in some embodiments, the lower surface 14 of each of the first interdigital finger 11 and the second interdigital finger 12 has an inner support area 141 and an outer mounting area 142 located outside the inner support area 141. The inner support areas 141 of the first interdigital finger 11 and the second interdigital finger 12 are positioned to cooperatively support the top flange 601 of the second type container 62, 63. In some embodiments, two lower guide units 22 are respectively formed on the outer mounting areas 142 of the first interdigital finger 11 and the second interdigital finger 12 to guide both sides of the top flange 601 of the second type container 62, 63 (see also Figure 8A and Figure 8B ) to move to the inner support area 141 of the first interdigital finger 11 and the second interdigital finger 12 respectively. In some embodiments, as Figure 5 As shown, the lower guide units 22 respectively arranged on the first interdigital finger 11 and the second interdigital finger 12 may be symmetrical with each other relative to the center line (CL). In some embodiments, each of the lower guide units 22 includes at least two lower guide blocks 221, which are separated from each other and are arranged on the outer mounting area 142 of the corresponding one of the first interdigital finger 11 and the second interdigital finger 12. In alternative embodiments, each of the lower guide units 22 may include more than two lower guide blocks 221. In some embodiments, the lower guide blocks 221 and the corresponding one of the first interdigital finger 11 and the second interdigital finger 12 are formed as a whole. In alternative embodiments, the lower guide blocks 221 may be partially and separately inserted into the recesses (not shown) of the lower surfaces 14 of the corresponding one of the first interdigital finger 11 and the second interdigital finger 12. In some embodiments, as Figure 9 and Figure 10 As shown, each of the lower guide blocks 221 is configured to be offset from the midpoint of the length (L1) of the recessed area 16 on the corresponding one of the first finger 11 and the second finger 12, or is configured to avoid matching the midpoint of the corresponding side of the top flange 601.

[0046] Figure 13 An illustrative perspective view of one of the upper guide blocks 211 is shown in accordance with some embodiments. Figure 14 An illustrative perspective view of one of the lower guide blocks 221 is shown in accordance with some embodiments.

[0047] like Figure 5 、 Figure 6 and Figure 13As shown, in some embodiments, each of the two upper guide blocks 211 has a first top surface 212, a bottom surface 215, and an upper guide surface 213. The upper guide surface 213 of the upper guide block 211 of one of the upper guide units 21 is disposed to face the upper guide surface 213 of the upper guide block 211 of the other upper guide unit 21. The upper guide surface 213 may extend obliquely and downwardly from the first top surface 212. In some embodiments, at least about two-thirds of the bottom surface 215 of each of the upper guide blocks 211 contacts the upper surface 13 of the respective first and second fingers 11, 12. In some embodiments, the angle (θ1) between the first top surface 212 and the upper guide surface 213 may fall within a range of about 90° to about 135°. In some embodiments, the angle (θ2) between the upper guide surface 213 and the upper surface 13 of a corresponding one of the first and second fingers 11, 12 may be no less than approximately 45° and less than approximately 90°. By configuring the angle (θ2) within the aforementioned range (and optionally configuring the angle (θ1) within the aforementioned range), the first type container 61 can be smoothly guided by the upper guide block 211. When the angle (θ2) is less than approximately 45°, the first type container 61 may not be guided by the upper guide block 211 and may move onto the front and rear support areas 131, 132. When the angle (θ2) is greater than or equal to approximately 90°, the first type container 61 may not be guided by the upper guide block 211 and may fall directly onto the front and rear support areas 131, 132, potentially damaging the product (e.g., a semiconductor device) contained in the first type container 61. In some embodiments, each of the upper guide blocks 211 further has an upper flat surface 214 that extends downward from the upper guide surface 213 to the upper surface 13 of the corresponding one of the first and second fingers 11, 12, such that the upper flat surface 214 is configured to be substantially perpendicular to the upper surface 13 of the corresponding one of the first and second fingers 11, 12. The upper flat surface 214 is configured so that when the first type container 61 is supported, the first type container 61 does not tilt and is evenly placed on the front support area 131 and the rear support area 132 of the upper surface 13 of the first and second fingers 11, 12. In some embodiments, each of the upper guide blocks 211 has a block height (H) in a direction perpendicular to the corresponding upper surface 13. Gu ) and flat surface dimensions (D fu ) (ie, the dimension of the upper flat surface 214 in a direction perpendicular to the corresponding upper surface 13). Flat surface dimension (D fu ) is not less than about 1 mm and not greater than the block height (H Gu). In some embodiments, the upper guide block 211 may be made of a metal such as aluminum. The metal may be anodized to increase durability. Other materials suitable for the upper guide block 211 are within the contemplation of the present disclosure.

[0048] like Figure 5 and Figure 14 As shown, each of the lower guide blocks 221 has a second top surface 222 and a lower guide surface 223. The lower guide surface 223 of the lower guide block 221 of one of the lower guide units 22 is disposed to face the lower guide surface 223 of the lower guide block 221 of the other lower guide unit 22. The lower guide surface 223 may extend obliquely and downwardly from the second top surface 222. In some embodiments, the angle (θ3) between the second top surface 222 and the lower guide surface 223 may fall within a range of about 90° to about 135°, and may be the same as or different from Figure 13 The angle (θ1) of each of the upper guide blocks 211 is shown. In some embodiments, the angle (θ4) between the lower guide surface 223 and the lower surface 14 of the corresponding one of the first interdigital finger 11 and the second interdigital finger 12 may be not less than about 45° and less than about 90°, and may be the same as or different from Figure 13 The upper guide blocks 211 are shown with an included angle (θ2). By configuring the included angle (θ4) within the aforementioned range (and optionally configuring the included angle (θ3) within the aforementioned range), the second type containers 62 and 63 can be smoothly guided by the lower guide blocks 221. When the included angle (θ4) is less than approximately 45°, the second type containers 62 and 63 may not be guided by the lower guide blocks 221 to move onto the inner support areas 141 of the first and second fingers 11 and 12. When the included angle (θ4) is not less than approximately 90°, the second type containers 62 and 63 may not be guided by the lower guide blocks 221 and may fall directly onto the inner support areas 141, which may damage the products (e.g., semiconductor devices) contained in the second type containers 62 and 63. In some embodiments, each of the lower guide blocks 221 further has a lower flat surface 224 that extends downward from the lower guide surface 223 to the lower surface 14 of the corresponding one of the first and second fingers 11, 12, such that the lower flat surface 224 is configured to be substantially perpendicular to the lower surface 14 of the corresponding one of the first and second fingers 11, 12. The lower flat surface 224 is configured so that when the second type containers 62, 63 are supported, the top flanges 601 of the second type containers 62, 63 will not be tilted and will be evenly placed on the inner support area 141 of the lower surface 14. In some embodiments, each of the lower guide blocks 221 has a block height (H) in a direction perpendicular to the corresponding lower surface 14. Gl) and the flat surface size (D fl ) (ie, the dimension of the lower flat surface 224 in a direction perpendicular to the corresponding lower surface 14). Block height (H Gl ) is not greater than the height difference (H) between the upper surface 13 and the lower surface 14 of each of the first and second fingers 11, 12, so as to avoid the lower guide block 221 and the first type container 61 (see also Figure 7 and 10 ) contact. Flat surface size (D fl ) is not less than about 1 mm and not greater than the block height (H Gl ). In some embodiments, the lower guide block 221 may be made of a metal such as aluminum. The metal may be anodized to increase durability. Other materials suitable for the lower guide block 221 are within the contemplation of the present disclosure.

[0049] In some embodiments, sensors (not shown) may be provided to detect whether the top flange 601 is evenly positioned on the inner support area 141 of the lower surface 14. Each of the sensors may independently be a pressure sensor, a proximity sensor, an infrared sensor, a light sensor, an ultrasonic sensor, a fiber sensor, or the like, or a combination thereof. Other suitable sensors are within the contemplated scope of the present disclosure.

[0050] like Figure 13 and Figure 14 As shown, in some embodiments, the thickness (T G ) may fall within a range of about 5 mm to about 15 mm, and the thickness (T G ) may be the same as or different from the thickness (T G In some embodiments, the width (W Gu ) may fall within the range of about 15 mm to about 30 mm. In some embodiments, the width (W) of each of the lower guide blocks 221 may be about 15 mm to about 30 mm. Gl ) is not greater than the width (W Gu In some other embodiments, the width (W Gl ) may be the width (W Gu ) of about 30% to about 70%.

[0051] like Figure 5 、 Figure 10 and Figure 12As shown, in some embodiments, two positioning units 24 are respectively mounted on the lower surface 14 of the first and second fingers 11, 12. The two positioning units 24 are configured to position the top flange 601 when the top flange 601 is supported by the lower surfaces 14 of the first and second fingers 11, 12. In some embodiments, each of the positioning units 24 includes two main positioning pins 241, one of which is located in front of the lower guide block 221 of the corresponding one of the two sides of the lower guide unit 22, and the other is located behind the lower guide block 221 of the corresponding one of the lower guide unit 22, so that when the two sides of the top flange 601 are moved to the inner support area 141 of the first and second fingers 11, 12, respectively, each side of the top flange 601 can be respectively located between the two main positioning pins 241 of the corresponding one of the positioning units 24. The main positioning pins 241 of the positioning unit 24 can be respectively located outside the four edges of the top flange 601, thereby positioning the top flange 601. In some embodiments, the four edges of the top flange 601 are inclined edges. When the top flange 601 is supported between the first interdigital finger 11 and the second interdigital finger 12, the main positioning pins 241 can be respectively brought into abutment with the inclined edges. The main positioning pins 241 can be cylindrical, but are not limited to this. The main positioning pins 241 can be made of metal (such as aluminum). The metal can be anodized to increase the durability of the main positioning pins 241. Other materials and / or configurations suitable for the main positioning pins 241 are within the intended scope of the present disclosure.

[0052] In some embodiments, each of the positioning units 24 may further include an auxiliary positioning pin 242, which is located between the two main positioning pins 241 and between the lower guide blocks 221 of the corresponding ones of the lower guide units 22, and is configured to fit with the corresponding ones on both sides of the top flange 601 when they are moved to the internal support areas 141 of the first interdigital finger 11 and the second interdigital finger 12 on both sides of the top flange 601 respectively. The auxiliary positioning pin 242 may be cylindrical, but is not limited to this. The auxiliary positioning pin 242 may be made of metal (such as aluminum). The metal may be anodized to increase the durability of the auxiliary positioning pin 242. Other materials and / or configurations suitable for the auxiliary positioning pin 242 are within the intended scope of the present disclosure. In some embodiments, the auxiliary positioning pin 242 has a size that is smaller than the size of the main positioning pin 241. In some embodiments, the height of each of the primary positioning pin 241 and the auxiliary positioning pin 242 relative to the lower surface 14 is no greater than the thickness of the top flange 601, so that each of the primary positioning pin 241 and the auxiliary positioning pin 242 can avoid contact with the lower surface 14. Figure 7 A first type of container 61 is shown in contact.

[0053] In some embodiments, as Figure 5As shown, the upper surface 13 and the lower surface 14 are cooperatively assembled so that the center of gravity of the top flange 601 (G2, see Figure 12 ) in the Z direction along an axis with the center of gravity (G1, see Figure 11 The Z direction extends perpendicular to both the upper surface 13 and the lower surface 14 of each of the first and second interdigits 11 and 12 .

[0054] In some embodiments, as Figure 4 and Figure 5 As shown, the composite fork device 10 may further include a rear frame 25. The rear end of each of the first and second fingers 11, 12 is mounted to the rear frame 25. In some embodiments, the rear end of each of the first and second fingers 11, 12 may be mounted to the lower portion of the rear frame 25 via screws (not shown). Other suitable tools and / or methods may be used to mount the first and second fingers 11, 12 to the rear frame 25. In certain embodiments, the rear frame 25 may be perforated and / or recessed to reduce the weight of the composite fork device 10. In some embodiments, two connectors 26 may be further included in the composite fork device 10. The two connectors 26 are configured to stabilize the structure of the composite fork device 10. Each of the two connectors 26 interconnects the upper portion of the rear frame 25 with a corresponding one of the first and second fingers 11, 12, thereby forming a triangular structure with the rear frame 25 and the corresponding one of the first and second fingers 11, 12. Fastening the connector 26 to the first and second fingers 11, 12 and the rear frame 25 can be performed using, for example, screws (not shown). Other suitable tools and / or methods can be used for fastening. In some embodiments, the composite fork device 10 can further include a mounting member 27 mounted on the rear side of the rear frame 25. The mounting member 27 can be configured to allow the robot 50 (shown in FIG. 1 ) to move the connector 26 to the rear frame 25. Figure 15 and Figure 17 ) is coupled to the compound fork device 10. The mounting member 27 may include a flange 271 disposed thereon that is configured to attach the robot 50. In some embodiments, the mounting member 27 may be perforated and / or recessed to reduce its weight.

[0055] like Figure 4 、 Figure 5 and Figure 7As shown, in some embodiments, the composite fork device 10 may further include an auxiliary support unit 28, which is configured to ensure that the first type of container 61 is correctly and stably supported on the first fork finger 11 and the second fork finger 12. The auxiliary support unit 28 may include a fluid-actuated cylinder 281, two actuating plates 282, a plurality of actuating rods 283 disposed between the fluid-actuated cylinder 281 and each of the actuating plates 282, and two side frames 284 respectively connected to the actuating plates 282. In some embodiments, the fluid-actuated cylinder 281 may be fastened to the upper portion of the rear frame 25 via, for example (but not limited to), screws (not shown). Other suitable methods and / or tools may be used to fasten the fluid-actuated cylinder 281. In some embodiments, each of the side frames 284 may be located behind the recessed area 16 of the corresponding one of the first fork finger 11 and the second fork finger 12 (see also). Figure 10 ). In some embodiments, each of the side frames 284 is located above a corresponding one of the upper guide units 21. The fluid-actuated cylinder 281 may be a double-acting pneumatic cylinder, a double-stroke pneumatic cylinder, or the like. Other devices suitable for use as the fluid-actuated cylinder 281 are within the contemplated scope of the present disclosure. In some embodiments, when the first type of container 61 is well supported to allow the sensor 23 to transmit a signal to the auxiliary support unit 28, the fluid-actuated cylinder 281 is triggered to reduce the distance between the fluid-actuated cylinder 281 and each of the actuating plates 282. As a result, the side frames 284 move toward each other to support the rear portion of the first type of container 61 therebetween. In some embodiments, each of the side frames 284 may be perforated and / or recessed to reduce the weight of the compound fork device 10.

[0056] In alternative embodiments, additional features may be added to the compound fork device 10. In further alternative embodiments, some features of the compound fork device 10 may be modified, replaced, or eliminated without departing from the spirit and scope of the present disclosure.

[0057] Figure 15FIG2 is a perspective view of a system for integrated circuit manufacturing according to some embodiments. The system includes a composite load port station 30, a processing tool 41, a robot 50, and a composite fork device 10. The composite load port station 30 is configured to allow loading of a first type container 61 or a second type container 62, 63. The robot 50 is positioned between the composite load port station 30 and the processing tool 41. The composite fork device 10 is coupled to be driven by the robot 50 and is configured to selectively support the first type container 61 or the second type container 62, 63, thereby allowing the robot 50 to selectively transport the first type container 61 or the second type container 62, 63 from the composite load port station 30 to the inlet loading port 411 of the processing tool 41. In some embodiments, the composite loading port station 30 may include at least one of external loading port positions 311, 312, 313, 314, 315, and 316 and at least one of internal loading port positions 301, 302, 303, 304, 305, and 306, and the composite loading port station 30 may be configured to receive the second type containers 62, 63 from an automated material handling system (AMHS) or allow the second type containers 62, 63 to be moved back to the AMHS. Since an example of an AMHS has been described above, its details are omitted for brevity.

[0058] In some embodiments, the processing tool 41 is a heating tool and the second type of container received from the AMHS is a tray box type container 62 (see Figure 2 ), which accommodates the first type of container 61. Figure 16 is a flow chart illustrating a method of transporting according to some embodiments. Figure 1A When the semiconductor device in the first type container 61 shown in FIG1B is transported to be processed by the processing tool 41, the semiconductor device can be transported to the processing tool 41 using the first type container 61 shown in FIG1B. Figure 16 A method of transport 100 is shown.

[0059] Reference Figure 15 and Figure 16 The transport method 100 may include steps 101 to 108. In step 101, the second type of container (such as but not limited to Figure 2 The tray-type container 62 shown in the figure is loaded on a selected one of the external loading port positions 311, 312, 313, 314, 315, 316. In step 102, an actuator (not shown) is used to separate the first type container 61 (for example, but not limited to, the second type container 62) from the selected one of the external loading port positions 311, 312, 313, 314, 315, 316. Figure 1A1B) to a corresponding one of the internal loading port positions 301, 302, 303, 304, 305, and 306. In step 103, the robot 50 is actuated to support the first type container 61 using the composite fork device 10 until the first type container 61 is securely supported by the composite fork device 10. In step 104, the robot 50 is actuated to transport the first type container 61 to the processing tool 41 until the bottom portion of the first type container 61 is placed on the inlet loading port 411 of the processing tool 41. In step 105, the first type container 61 is removed from the composite fork device. In step 106, after the semiconductor devices in the first type container 61 have been processed for a predetermined period of time, the robot 50 is further actuated to use the composite fork device 10 to move the first type container 61 back to a corresponding one of the internal loading port positions 301, 302, 303, 304, 305, and 306. In step 107, the first type container 61 is further moved back to the second type container 62 on a selected one of the external loading port positions 311, 312, 313, 314, 315, 316 using an actuator. In step 108, the second type container 62 is loaded back into the AMHS.

[0060] In alternative embodiments, some steps in the transport method 100 may be modified, replaced, or eliminated without departing from the spirit and scope of the present disclosure. In further alternative embodiments, additional steps may be added to the transport method 100.

[0061] In some embodiments, the actuation of the robot 50 can be controlled by a computer device (not shown). Specifically, when the sensor (not shown) detects that the first type container 61 is moved to a corresponding one of the internal loading port positions 301, 302, 303, 304, 305, and 306, the robot 50 is actuated to allow the first type container 61 to be supported by the composite fork device 10. When the sensor 23 (see Figure 5 ) detects that the first type container 61 is well supported, the robot 50 is activated to transport the first type container 61 to the processing tool 41. After a predetermined time period, the robot 50 is further activated to use the compound fork device 10 to move the first type container 61 back to a corresponding one of the internal loading port positions 301, 302, 303, 304, 305, and 306. The computer device can be a programmable logic controller (PLC) or other suitable device.

[0062] In some embodiments, the internal load port locations 301, 302, 303, 304, 305, 306 and the external load port locations 311, 312, 313, 314, 315, 316 are all within the work envelope of the robot 50. In other embodiments, the external load port locations 311, 312, 313, 314, 315, 316 may not be within the work envelope of the robot 50. In alternative embodiments, the first type container 61 may be manually removed from the second type container 62 and manually moved back into the second type container 62. The robot 50 may be an articulated robot. In some embodiments, the processing tool 41 may heat the first type container 61 to a temperature ranging from approximately 100°C to 300°C, or from approximately 120°C to approximately 180°C, to enable processing of the semiconductor devices contained in the first type container 61. In some embodiments, the inlet load port 411 may be a mobile launch platform.

[0063] Figure 17 is a perspective view of a system for integrated circuit fabrication according to some embodiments. Figure 17 In the embodiment, the processing tool 42 is a non-heating tool and the system is used to transport the second type of container 62 (see Figure 2 ) Figure 17 The system shown is similar to Figure 15 In some embodiments, Figure 17 The system shown can also be used to transport Figure 3A The second type of container 63 is shown. In some embodiments, the processing tool 42 can be, for example, but not limited to, an inspection tool, and can be other suitable processing tools. In some embodiments, the entry loading port 421 of the processing tool 42 can be a movable starting platform.

[0064] Figure 18 is a flow chart illustrating a method of transport according to some embodiments. Figure 2 and Figure 3A ) is transported to be processed by the processing tool 42, the semiconductor device can be used Figure 18 Transport method 200 is shown.

[0065] Reference Figure 17 and Figure 18 The transport method 200 may include steps 201 to 208. In step 201, the second type of container (such as but not limited to Figure 2 The tray box type container 62 shown, Figure 3AA second type container 62 or 63 (e.g., a magazine-type container 63 shown in FIG. 1 , or any other container having a top flange) is loaded onto a selected one of the external loading port positions 311, 312, 313, 314, 315, and 316. In step 202, an actuator (not shown) is used to move the second type container 62 or 63 from the selected one of the external loading port positions 311, 312, 313, 314, 315, and 316 to a corresponding one of the internal loading port positions 301, 302, 303, 304, 305, and 306. In step 203, the robot 50 is actuated to support the second type container 62 or 63 using the composite fork device 10 until the second type container 62 or 63 is well supported by the composite fork device 10. In step 204, the robot 50 is actuated to transport the second type of containers 62, 63 to the processing tool 42 until the bottom portion of the second type of containers 62, 63 is placed on the inlet loading port 421 of the processing tool 42. Figure 17 The container shown is container 62, but Figure 3A The illustrated container 63 or any other container having a top flange can be used in method 200. In step 205, the second type containers 62, 63 are removed from the composite fork assembly. In step 206, after processing and / or inspecting the semiconductor devices in the second type containers 62, 63 using the processing tool 42, the robot 50 is further actuated to use the composite fork assembly 10 to move the second type containers 62, 63 back to a corresponding one of the internal loading port positions 301, 302, 303, 304, 305, 306. In step 207, the second type containers 62, 63 are further moved back to a selected one of the external loading port positions 311, 312, 313, 314, 315, 316 using the actuation device. In step 208, the second type containers 62, 63 are loaded back into the AMHS.

[0066] In alternative embodiments, some steps in the transport method 200 may be modified, replaced, or eliminated without departing from the spirit and scope of the present disclosure. In further alternative embodiments, additional steps may be added to the transport method 200.

[0067] The composite fork device 10 of the present disclosure may be used in processes for manufacturing various products, such as but not limited to InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate), SOIC (System on Chip), future bump / package products, or other suitable products.

[0068] Embodiments of the present disclosure have the following advantageous features. By forming an upper surface and a lower surface on each of the first and second fingers of a composite fork device, the composite fork device can carry and deliver a plurality of different containers, which can increase the efficiency of the transport process during semiconductor manufacturing without utilizing various carriers corresponding to different containers. Furthermore, by incorporating upper and lower guide units, sensors, and positioning units into the composite fork device, the positioning of the container supported on the first and second fingers can be ensured to be balanced and stable, thereby preventing the container from tilting, which could damage the product or semiconductor device contained within the container. Furthermore, by including an auxiliary support unit in the composite fork device, the stability of the transport process can be further enhanced.

[0069] According to some embodiments of the present disclosure, a composite fork device is provided, comprising a first finger and a second finger spaced apart from the first finger. Each of the first finger and the second finger has an upper surface and a lower surface that is recessed relative to the upper surface. The upper surfaces of the first finger and the second finger are configured to cooperatively support a first type of container. The lower surfaces of the first finger and the second finger are configured to cooperatively support a second type of container having a configuration different from that of the first type of container.

[0070] According to some embodiments of the present disclosure, a height difference between the upper surface and the lower surface of each of the first and second fingers is within a range of 1 mm to 5 cm.

[0071] According to some embodiments of the present disclosure, the upper surface of each of the first finger and the second finger includes a front support area in front of the lower surface and a rear support area behind the lower surface, thereby allowing four parts of the first type of container to be supported by the front support area and the rear support area of ​​the upper surface of the first finger and the second finger, respectively.

[0072] According to some embodiments of the present disclosure, the upper surface of each of the first and second fingers has a front mounting area outside the front support area and a rear mounting area outside the rear support area. The lower surface of each of the first and second fingers has an inner support area and an outer mounting area outside the inner support area. The inner support areas of the first and second fingers are positioned to cooperatively support a top flange of the second type of container.

[0073] According to some embodiments of the present disclosure, the composite fork device further includes two upper guide units and two lower guide units. The two upper guide units are respectively formed on the upper surfaces of the first and second fingers to guide the two sides of the first type of container, thereby allowing the four parts of the first type of container to be moved to the front support area and the rear support area on the upper surfaces of the first and second fingers, respectively. The two lower guide units are respectively formed on the outer mounting areas of the first and second fingers, thereby guiding the two sides of the top flange of the second type of container to move to the inner support areas of the first and second fingers, respectively.

[0074] According to some embodiments of the present disclosure, the first interdigital finger and the second interdigital finger are symmetrical to each other. The upper guide units respectively disposed on the first interdigital finger and the second interdigital finger are symmetrical to each other. The lower guide units respectively disposed on the first interdigital finger and the second interdigital finger are symmetrical to each other.

[0075] According to some embodiments of the present disclosure, each of the upper guide units includes two upper guide blocks, which are respectively arranged on the front mounting area and the rear mounting area of ​​the corresponding one of the first interdigital finger and the second interdigital finger. Each of the upper guide blocks has an upper guide surface. The upper guide surface of the upper guide block of one of the upper guide units is arranged to face the upper guide surface of the upper guide block of the other of the upper guide units. Each of the lower guide units includes two lower guide blocks, which are separated from each other and are arranged on the outer mounting area of ​​the corresponding one of the first interdigital finger and the second interdigital finger. Each of the lower guide blocks has a lower guide surface. The lower guide surface of the lower guide block of one of the lower guide units is arranged to face the lower guide surface of the lower guide block of the other of the lower guide units.

[0076] According to some embodiments of the present disclosure, the angle between the upper guide surface and the upper surface of the corresponding one of the first finger and the second finger is not less than 45° and less than 90°, and the angle between the lower guide surface and the lower surface of the corresponding one of the first finger and the second finger is not less than 45° and less than 90°.

[0077] According to some embodiments of the present disclosure, each of the upper guide blocks further has an upper flat surface extending downward from the upper guide surface to the upper surface of a corresponding one of the first and second fingers, such that the upper flat surface is arranged perpendicular to the upper surface of the corresponding one of the first and second fingers. Each of the lower guide blocks further has a lower flat surface extending downward from the lower guide surface to the lower surface of a corresponding one of the first and second fingers, such that the lower flat surface is arranged perpendicular to the lower surface of the corresponding one of the first and second fingers.

[0078] According to some embodiments of the present disclosure, the compound fork device further includes two sensors, one of the two sensors being disposed in front of the upper guide block of one of the upper guide units, and the other of the two sensors being disposed behind the upper guide block of the other upper guide unit.

[0079] According to some embodiments of the present disclosure, the composite fork device further includes two positioning units, which are respectively mounted on the lower surfaces of the first fork and the second fork, and are configured to position the top flange when the top flange is supported by the lower surfaces of the first fork and the second fork.

[0080] According to some embodiments of the present disclosure, each of the positioning units includes two main positioning pins, one of which is located in front of the lower guide block of the corresponding lower guide unit, and the other of which is located behind the lower guide block of the corresponding lower guide unit, so that when both sides of the top flange move to the inner support areas of the first and second interdigitated fingers, the main positioning pins of the positioning unit are respectively located outside the four edges of the top flange, thereby positioning the top flange.

[0081] According to some embodiments of the present disclosure, each of the positioning units further includes an auxiliary positioning pin, which is located between the lower guide blocks of the corresponding ones of the lower guide units and is configured to fit with the corresponding ones on both sides of the top flange when it moves to the internal support areas of the first fork and the second fork on both sides of the top flange respectively.

[0082] According to some embodiments of the present disclosure, a system is provided, which includes a composite loading port workbench, a processing tool, a robot and a composite fork device. The composite loading port workbench is configured to allow loading of a first type container or a second type container having a configuration different from that of the first type container. The robot is positioned between the composite loading port workbench and the processing tool. The composite fork device is coupled so as to be driven by the robot and is configured to selectively support the first type container or the second type container, thereby allowing the robot to selectively transport the first type container or the second type container from the composite loading port workbench to an inlet loading port of the processing tool. The composite fork device includes a first fork and a second fork separated from the first fork. Each of the first fork and the second fork has an upper surface and a lower surface that is recessed relative to the upper surface. The upper surfaces of the first fork and the second fork are configured to collaboratively support the first type container. The lower surfaces of the first and second fingers are configured to cooperatively support the second type of container.

[0083] According to some embodiments of the present disclosure, the composite fork device further includes a rear frame, wherein a rear end of each of the first and second fingers is mounted to a lower portion of the rear frame.

[0084] According to some embodiments of the present disclosure, the composite fork device further includes two connecting members, each of which interconnects an upper portion of the rear frame and a corresponding one of the first and second fingers.

[0085] According to some embodiments of the present disclosure, the compound fork device further includes a mounting member mounted on a rear side of the rear frame and configured to allow the robot to be coupled to the compound fork device via the mounting.

[0086] According to some embodiments of the present disclosure, a method is provided, which includes: placing a container on a compound loading port workbench; supporting the container using a compound fork device, the compound fork device including a first fork finger and a second fork finger, each of the first fork finger and the second fork finger having an upper surface and a lower surface that is recessed relative to the upper surface, so that the container is supported by the upper surface or the lower surface of the first fork finger and the second fork finger; using the compound fork device to transport the container to a processing tool so that a bottom portion of the container is placed at an inlet loading port of the processing tool; and detaching the container from the compound fork device.

[0087] According to some embodiments of the present disclosure, both sides of the container are supported by the upper surfaces of the first and second fingers.

[0088] According to some embodiments of the present disclosure, both sides of a top flange of the container are supported by the lower surfaces of the first and second fingers.

[0089] The above summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art should understand that they can easily use this disclosure as a basis to design or modify other processes or structures that have the same purpose and / or achieve the same advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various modifications, substitutions, and replacements without violating the spirit and scope of the present disclosure.

Claims

1. A composite fork-shaped device comprising: a first finger and a second finger spaced apart from the first finger, each of the first finger and the second finger having an upper surface and a lower surface that is recessed relative to the upper surface, the upper surfaces of the first finger and the second finger being configured to cooperatively support a first type of container, the lower surfaces of the first finger and the second finger being configured to cooperatively support a second type of container, the second type of container having a configuration different from a configuration of the first type of container, in: The upper surface of each of the first and second fingers includes a front support area in front of the lower surface and a rear support area behind the lower surface, thereby allowing four parts of the first type of container to be supported by the front support area and the rear support area of ​​the upper surfaces of the first and second fingers, respectively. The upper surface of each of the first interdigital finger and the second interdigital finger has a front mounting area outside the front support area and a rear mounting area outside the rear support area, The lower surface of each of the first and second fingers has an inner support area and an outer mounting area outside the inner support area, and the inner support areas of the first and second fingers are positioned to cooperatively support a top flange of the second type of container, The composite fork-shaped device further comprises: Two upper guide units, respectively formed on the upper surfaces of the first and second fingers to guide both sides of the first type of container, thereby allowing the four parts of the first type of container to be moved to the front support area and the rear support area on the upper surfaces of the first and second fingers, respectively; and Two lower guide units are respectively formed on the outer mounting areas of the first and second fingers, thereby guiding both sides of the top flange of the second type container to move to the inner supporting areas of the first and second fingers respectively. 2 . The composite fork device according to claim 1 , wherein a height difference between the upper surface and the lower surface of each of the first and second fingers falls within a range of 1 mm to 5 cm.

3. The composite fork device according to claim 1, wherein the first finger and the second finger are symmetrical to each other, the upper guide units respectively arranged on the first finger and the second finger are symmetrical to each other, and the lower guide units respectively arranged on the first finger and the second finger are symmetrical to each other.

4. The composite fork device of claim 1 , wherein: Each of the upper guide units includes two upper guide blocks, the upper guide blocks are respectively arranged on the front mounting area and the rear mounting area of ​​the corresponding one of the first interdigital finger and the second interdigital finger, each of the upper guide blocks has an upper guide surface, the upper guide surface of the upper guide block of one of the upper guide units is arranged to face the upper guide surface of the upper guide block of the other upper guide unit, and Each of the lower guide units includes two lower guide blocks, which are separated from each other and arranged on the outer mounting area of ​​the corresponding first finger and the second finger, and each of the lower guide blocks has a lower guide surface, and the lower guide surface of the lower guide block of one of the lower guide units is arranged to face the lower guide surface of the lower guide block of the other lower guide unit.

5. A composite fork device according to claim 4, wherein an angle between the upper guide surface and the upper surface of a corresponding one of the first finger and the second finger is not less than 45° and less than 90°, and an angle between the lower guide surface and the lower surface of a corresponding one of the first finger and the second finger is not less than 45° and less than 90°.

6. The composite fork device according to claim 1, further comprising a rear frame, a rear end of each of the first and second fingers being fixedly mounted to a lower portion of the rear frame.

7. The composite fork device of claim 6, further comprising two links, each interconnecting an upper portion of the rear frame and a corresponding one of the first and second fingers.

8. The composite fork device of claim 7, wherein each of the two connecting members forms a triangular structure with the rear frame and the corresponding one of the first and second fingers.

9. A system comprising: a composite load port stage configured to allow loading of a first type of container or a second type of container having a configuration different from a configuration of the first type of container; a processing tool; a robot positioned between the composite load port stage and the processing tool; and A compound fork device, which is coupled to be driven by the robot and is configured to selectively support the first type of container or the second type of container, thereby allowing the robot to selectively transport the first type of container or the second type of container from the compound loading port workbench to an inlet loading port of the processing tool, the compound fork device comprising a first fork finger and a second fork finger separated from the first fork finger, each of the first fork finger and the second fork finger having an upper surface and a lower surface that is recessed relative to the upper surface, the upper surfaces of the first fork finger and the second fork finger being configured to cooperatively support the first type of container, and the lower surfaces of the first fork finger and the second fork finger being configured to cooperatively support the second type of container, in: The upper surface of each of the first and second fingers includes a front support area in front of the lower surface and a rear support area behind the lower surface, thereby allowing four parts of the first type of container to be supported by the front support area and the rear support area of ​​the upper surfaces of the first and second fingers, respectively. The upper surface of each of the first interdigital finger and the second interdigital finger has a front mounting area outside the front support area and a rear mounting area outside the rear support area, The lower surface of each of the first and second fingers has an inner support area and an outer mounting area outside the inner support area, and the inner support areas of the first and second fingers are positioned to cooperatively support a top flange of the second type of container, The composite fork-shaped device further comprises: Two upper guide units, respectively formed on the upper surfaces of the first and second fingers to guide both sides of the first type of container, thereby allowing the four parts of the first type of container to be moved to the front support area and the rear support area on the upper surfaces of the first and second fingers, respectively; and Two lower guide units are respectively formed on the outer mounting areas of the first and second fingers, thereby guiding both sides of the top flange of the second type container to move to the inner supporting areas of the first and second fingers respectively.

10. A method comprising: placing a container on a composite load port station, the container being a first type container or a second type container having a configuration different from a configuration of the first type container; Supporting the container using a composite fork device, the composite fork device comprising a first finger and a second finger, each of the first finger and the second finger having an upper surface and a lower surface that is recessed relative to the upper surface, such that the container is supported by the upper surface or the lower surface of the first finger and the second finger; transporting the container to a processing tool using the compound fork assembly such that a bottom portion of the container is positioned at an inlet loading port of the processing tool; and disengaging the container from the composite fork device; in: The upper surface of each of the first and second fingers includes a front support area in front of the lower surface and a rear support area behind the lower surface, thereby allowing four parts of the first type of container to be supported by the front support area and the rear support area of ​​the upper surfaces of the first and second fingers, respectively. The upper surface of each of the first interdigital finger and the second interdigital finger has a front mounting area outside the front support area and a rear mounting area outside the rear support area, The lower surface of each of the first and second fingers has an inner support area and an outer mounting area outside the inner support area, and the inner support areas of the first and second fingers are positioned to cooperatively support a top flange of the second type of container, The composite fork-shaped device further comprises: Two upper guide units, respectively formed on the upper surfaces of the first and second fingers to guide both sides of the first type of container, thereby allowing the four parts of the first type of container to be moved to the front support area and the rear support area on the upper surfaces of the first and second fingers, respectively; and Two lower guide units are respectively formed on the outer mounting areas of the first and second fingers, thereby guiding both sides of the top flange of the second type container to move to the inner supporting areas of the first and second fingers respectively.

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