A CPU wind deflector module, motherboard and server

By designing a split CPU windshield module, the problem of difficulty in adapting to the spacing of different DIMM slots in the prior art is solved, and wider application and lower cost are achieved, and structural strength and installation convenience are enhanced.

CN115390635BActive Publication Date: 2025-07-04INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202211025854.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-08-25
Publication Date
2025-07-04
Estimated Expiration
2042-08-25

AI Technical Summary

Technical Problem

The existing CPU windshield can only be used for the same spacing between the DIMM slots on both sides, making it difficult to adapt to the inconsistent needs on different motherboards, resulting in increased development and use costs.

Method used

A split CPU windshield module is designed, including a first plate body and a second plate body, each with an inner vertical plate and an inner extension plate, which can be plugged into the DIMM slots on both sides of the CPU. The spacing of the inner extension plates is adjusted as the spacing of the DIMM slots changes to adapt to different spacings.

Benefits of technology

It improves the scope of application of CPU windshield modules, reduces development and use costs, enhances structural strength, extends service life, and improves installation convenience.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present application discloses a CPU wind deflector module, including: a first plate body and a second plate body. A first inner vertical plate is provided on one side of the first plate body, and a first inner extension plate is provided at the end of the first inner vertical plate and is disposed at a preset angle therewith. The first plate body is used for being inserted into the DIMM slot on one side of the CPU; a second inner vertical plate is provided on one side of the second plate body, and a second inner extension plate is provided at the end of the second inner vertical plate and is disposed at a preset angle therewith. The second plate body is used for being inserted into the DIMM slot on the other side of the CPU; the first inner extension plate is located between the second inner extension plate and the first plate body, and the second inner extension plate is located between the first inner extension plate and the second plate body. The opposite sides of the first plate body and the second plate body of the present application are in a separated structure, and the distance between the first inner extension plate and the second inner extension plate will decrease as the distance between the DIMM slots on both sides of the CPU increases. Therefore, it can be adapted to DIMM slots with different distances.
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Description

Technical Field

[0001] The present application relates to the field of servers, and in particular, to a CPU wind deflector module, a motherboard including the above CPU wind deflector module, and a server including the above motherboard. Background Art

[0002] At present, when the motherboard on the market does not need to install a CPU (Central Processing Unit in English, Central Processing Unit in Chinese) and DIMM (Dual Inline Memory Module in English, Dual Inline Memory Module in Chinese), a general CPU wind deflector is used as a substitute. The CPU wind deflector is inserted into the DIMM slots on both sides of the CPU, and then fixed by DIMM buckles.

[0003] However, the existing CPU wind deflector can only be applied to the case where the DIMM slots on both sides have the same spacing, so it is difficult to be applied to the case where the DIMM slots on both sides of different motherboards are inconsistent. If the needs of different motherboards are to be met, CPU wind deflectors of different sizes need to be developed, thus increasing the development cost and usage cost. Summary of the Invention

[0004] The first object of the present application is to provide a CPU wind deflector module, which can be applied to the case where the DIMM slots are at different distances, improving the application range of the CPU wind deflector module. The second object is to provide a motherboard including the above CPU wind deflector module, and the third object is to provide a server including the above motherboard.

[0005] To solve the above technical problems, the present application provides the following technical solutions:

[0006] A CPU wind deflector module includes:

[0007] A first plate body, on one side of which there is a first inner vertical plate, and at the end of the first inner vertical plate there is a first inner extension plate arranged at a preset angle with it. The first plate body is used for being inserted into the DIMM slot on one side of the CPU;

[0008] A second plate body, on one side of which there is a second inner vertical plate, and at the end of the second inner vertical plate there is a second inner extension plate arranged at a preset angle with it. The second plate body is used for being inserted into the DIMM slot on the other side of the CPU;

[0009] The first inner extension plate is located between the second inner extension plate and the first plate body, and the second inner extension plate is located between the first inner extension plate and the second plate body.

[0010] Preferably, a first outer vertical plate is provided on a side of the first plate body away from the first inner vertical plate, and a first outer extension plate is provided at an end of the first outer vertical plate and is disposed at a preset angle thereto.

[0011] Preferably, the structure formed by the first inner vertical plate and the first inner extension plate is centrosymmetric with the structure formed by the first outer vertical plate and the first outer extension plate.

[0012] Preferably, a second outer vertical plate is provided on a side of the second plate body away from the second inner vertical plate, and a second outer extension plate is provided at an end of the second outer vertical plate and is disposed at a preset angle thereto.

[0013] Preferably, the structure formed by the second inner vertical plate and the second inner extension plate is centrosymmetric with the structure formed by the second outer vertical plate and the second outer extension plate.

[0014] Preferably, the first inner vertical plate is perpendicular to the first plate body, and the first inner extension plate is perpendicular to the first inner vertical plate; the first outer vertical plate is perpendicular to the first plate body, and the first outer extension plate is perpendicular to the first outer vertical plate.

[0015] Preferably, the second inner vertical plate is perpendicular to the second plate body, and the second inner extension plate is perpendicular to the second inner vertical plate; the second outer vertical plate is perpendicular to the second plate body, and the second outer extension plate is perpendicular to the second outer vertical plate.

[0016] Preferably, reinforcing ribs are provided on the first plate body and the second plate body.

[0017] A main board includes the CPU windshield module according to any one of the above.

[0018] A server includes a chassis and further includes the above main board, and the main board is located inside the chassis.

[0019] Compared with the prior art, the above technical solution has the following advantages:

[0020] A CPU wind deflector module provided by the present application includes: a first plate body and a second plate body. One side of the first plate body is provided with a first inner vertical plate, and the end of the first inner vertical plate is provided with a first inner extension plate disposed at a preset angle therewith. The first plate body is used for being inserted into a DIMM slot on one side of the CPU; one side of the second plate body is provided with a second inner vertical plate, and the end of the second inner vertical plate is provided with a second inner extension plate disposed at a preset angle therewith. The second plate body is used for being inserted into a DIMM slot on the other side of the CPU; the first inner extension plate is located between the second inner extension plate and the first plate body, and the second inner extension plate is located between the first inner extension plate and the second plate body. Compared with the existing integrated CPU wind deflector, the present application designs the wind deflector as a split structure, that is, the opposite sides of the first plate body and the second plate body are separated structures. The distance between the first inner extension plate and the second inner extension plate will decrease as the distance between the DIMM slots on both sides of the CPU increases. Therefore, it can adapt to DIMM slots with different distances. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a schematic structural diagram of a CPU wind deflector module provided by a specific embodiment of the present application;

[0023] Figure 2 It is a schematic structural diagram of the first plate body;

[0024] Figure 3 It is a top view structural diagram of the CPU wind deflector module inserted into a DIMM slot with a distance of 70 mm;

[0025] Figure 4 It is a three-dimensional structural diagram of the CPU wind deflector module inserted into a DIMM slot with a distance of 70 mm;

[0026] Figure 5 It is a top view structural diagram of the CPU wind deflector module inserted into a DIMM slot with a distance of 90 mm;

[0027] Figure 6 It is a three-dimensional structural diagram of the CPU wind deflector module inserted into a DIMM slot with a distance of 90 mm;

[0028] Figure 7 It is a top view structural diagram of the CPU wind deflector module inserted into a DIMM slot with a distance of 100 mm;

[0029] Figure 8 Schematic three - dimensional structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 100 mm.

[0030] The reference numerals are as follows:

[0031] 1 is the first plate body, 11 is the first inner vertical plate, 12 is the first inner extension plate, 13 is the first outer vertical plate, and 14 is the first outer extension plate;

[0032] 2 is the second plate body, 21 is the second inner vertical plate, 22 is the second inner extension plate, 23 is the second outer vertical plate, and 24 is the second outer extension plate;

[0033] 3 is the reinforcing rib. Detailed implementation manners

[0034] In order to make the above - mentioned objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings.

[0035] In the following description, specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the connotation of the present application. Therefore, the present application is not limited by the specific implementation manners disclosed below.

[0036] Please refer to Figures 1 to 8 , Figure 1 which is a schematic structure diagram of a CPU wind deflector module provided by a specific implementation manner of the present application; Figure 2 is a schematic structure diagram of the first plate body; Figure 3 is a top - view structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 70 mm; Figure 4 is a three - dimensional structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 70 mm; Figure 5 is a top - view structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 90 mm; Figure 6 is a three - dimensional structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 90 mm; Figure 7 is a top - view structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 100 mm; Figure 8 is a three - dimensional structure diagram of the CPU wind deflector module plugged into the DIMM slot with a pitch of 100 mm.

[0037] A specific implementation of the present application provides a CPU wind deflector module, including: a first plate body 1 and a second plate body 2. One side of the first plate body 1 is provided with a first inner vertical plate 11, and the end of the first inner vertical plate 11 is provided with a first inner extension plate 12 disposed at a preset angle therewith. The first plate body 1 is used to be inserted into the DIMM slot on one side of the CPU; one side of the second plate body 2 is provided with a second inner vertical plate 21, and the end of the second inner vertical plate 21 is provided with a second inner extension plate 22 disposed at a preset angle therewith. The second plate body 2 is used to be inserted into the DIMM slot on the other side of the CPU; the first inner extension plate 12 is located between the second inner extension plate 22 and the first plate body 1, and the second inner extension plate 22 is located between the first inner extension plate 12 and the second plate body 2. Compared with the existing integrated CPU wind deflector, the wind deflector in the present application is designed as a split structure, that is, the opposite sides of the first plate body 1 and the second plate body 2 are separated structures. The distance between the first inner extension plate 12 and the second inner extension plate 22 will decrease as the distance between the DIMM slots on both sides of the CPU increases. Therefore, it can adapt to DIMM slots with different distances.

[0038] There is a gap between the end of the first inner extension plate 12 and the second inner vertical plate 21, and between the end of the second inner extension plate 22 and the first inner vertical plate 11. The size of the gap should be as small as possible, as long as it ensures that the end of the first inner extension plate 12 does not contact the second inner vertical plate 21, and the end of the second inner extension plate 22 does not contact the first inner vertical plate 11. Based on this, buffer pads, such as rubber pads, can be provided at the ends of the first inner extension plate 12 and the second inner extension plate 21 to prevent the end of the first inner extension plate 12 from hitting the second inner vertical plate 21 or the end of the second inner extension plate 22 from hitting the first inner vertical plate 11 under the influence of air flow, thereby achieving the purpose of increasing the service life of the first inner vertical plate 11 and the second inner vertical plate 21.

[0039] In addition, the first inner extension plate 12 and the second inner extension plate 22 can strengthen the first inner vertical plate 11 and the second inner vertical plate 21 mutually. For example, when the wind blows in the direction perpendicular to the first inner vertical plate 11 in front of the first inner vertical plate 11, a backward force will be generated on the first inner vertical plate 11. Due to the existence of the first inner extension plate 12 and the second inner extension plate 22, part of the wind will also enter the space between the first inner extension plate 12 and the second inner extension plate 22 from the gap between the end of the first inner extension plate 12 and the second inner vertical plate 21. Thus, the wind entering this space will blow towards the back of the first inner vertical plate 11, that is, part of the wind can change its direction through the gap between the first inner extension plate 12 and the second inner vertical plate 21, so that part of the wind generates a pressing force on the first inner vertical plate 11, playing a certain supporting role for the first inner vertical plate 11 to prevent the end of the first inner vertical plate 11 from swinging excessively. Therefore, the above layout can weaken the influence of the wind pressure on the first inner vertical plate 11, so as to avoid the problem of damage caused by excessive swinging of the first inner vertical plate 11. Moreover, the bending amplitude of the first inner vertical plate 11 decreases, which will reduce its influence on the second inner vertical plate 21. Similarly, when the wind blows in the direction perpendicular to the second inner vertical plate 21 on the back of the second inner vertical plate 21, a forward force will be generated on the second inner vertical plate 21. Part of the wind will enter the space between the first inner extension plate 12 and the second inner extension plate 22 from the gap between the second inner extension plate 22 and the first inner vertical plate 11. Thus, the wind entering this space will blow towards the front of the second inner vertical plate 21, that is, part of the wind can change its direction through the gap between the second inner extension plate 22 and the first inner vertical plate 11, so that part of the wind generates a pressing force on the second inner vertical plate 21, playing a certain supporting role for the second inner vertical plate 21 to prevent the end of the second inner vertical plate 21 from swinging excessively. Therefore, the above layout can weaken the influence of the wind pressure on the second inner vertical plate 21, so as to avoid the problem of damage caused by excessive swinging of the second inner vertical plate 21. Moreover, the bending amplitude of the second inner vertical plate 21 decreases, which will reduce its influence on the first inner vertical plate 11. Therefore, no matter whether the wind blows from the front or the back, the ability of the wind to cause the first inner vertical plate 11 and the second inner vertical plate 21 to bend will be weakened. So, the structural strength can be effectively improved, and further the service life can be guaranteed.

[0040] If only the first inner vertical plate 11 and the second inner vertical plate 21 are provided without the first inner extension plate 12 and the second inner extension plate 22, when the wind blows towards the first inner vertical plate 11 and the second inner vertical plate 21 respectively, the first inner vertical plate 11 and the second inner vertical plate 21 will bend in the same direction, and the ends of the two will produce a friction phenomenon of surface-to-surface contact with each other, thus aggravating the wear of the two or generating problems such as relatively large noise.

[0041] Regarding the insertion method of the first board body and the second board body into the DIMM slot, they can be snap-fitted through the snaps on both sides of the DIMM slot. Therefore, card slots that cooperate with the snaps are provided at the side bottoms of both ends of the first board body and the second board body. The snap structures on both sides of the DIMM slot can refer to the prior art. Correspondingly, the card slots provided at both ends of the first board body and the second board body are consistent with the card slots of the DIMM in the prior art to ensure the adaptability of the card slots provided on the first board body and the second board body. In addition, card slots that cooperate with the DIMM snaps can also be provided at the upper sides of both ends of the first board body and the second board body. That is, when the first board body and the second board body are upside down, they can still be snap-fitted into the DIMM slot and fixed by the snaps. Therefore, through this structure, the versatility and installation convenience of the first board body and the second board body can be further improved.

[0042] In some embodiments, a first outer vertical board 13 is provided on one side of the first board body 1 away from the first inner vertical board 11. The end of the first outer vertical board 13 is provided with a first outer extension board 14 disposed at a preset angle thereto. The first outer vertical board 13 and the first outer extension board 14 are located above the DIMM slot on one side. The first outer vertical board 13 and the first inner vertical board 11 are arranged parallel to each other, and the vertical midline between the two is the vertical midline of the first board body 1. The structure formed by the first inner vertical board 11 and the first inner extension board 12 is centrosymmetric with the structure formed by the first outer vertical board 13 and the first outer extension board 14. That is, the structure formed by the first inner vertical board 11 and the first inner extension board 12 will coincide with the structure formed by the first outer vertical board 13 and the first outer extension board 14 after rotating 180° around the vertical midline in the horizontal plane. Therefore, the inner and outer sides of the first board body 1 can be interchanged, and when inserting, there is no need to distinguish between the inner and outer sides of the first board body 1. Therefore, the convenience of inserting the first board body 1 into the DIMM slot can be improved.

[0043] In some embodiments, on one side of the second plate body 2 away from the second inner vertical plate 21, a second outer vertical plate 23 is provided. At the end of the second outer vertical plate 23, a second outer extension plate 24 is provided, which is disposed at a preset angle with respect to the second outer vertical plate 23. The second outer vertical plate 23 and the second outer extension plate 24 are located above the DIMM slot on the other side. The second outer vertical plate 23 and the second inner vertical plate 21 are arranged in parallel, and the vertical midline between the two is the vertical midline of the second plate body 2. The structure formed by the second inner vertical plate 21 and the second inner extension plate 22 is centrosymmetric with the structure formed by the second outer vertical plate 23 and the second outer extension plate 24. That is, the structure formed by the second inner vertical plate 21 and the second inner extension plate 22 will coincide with the structure formed by the second outer vertical plate 23 and the second outer extension plate 24 after rotating 180° around the vertical midline in the horizontal plane. That is, the inner and outer surfaces of the second plate body 2 can be interchanged. When inserting, there is no need to distinguish between the inner and outer surfaces of the second plate body 2. Therefore, the convenience of inserting the second plate body 2 into the DIMM slot can be improved. It can be understood that the first plate body 1 and the structure extending thereon are exactly the same as the second plate body 2 and the mechanism extending thereon. Therefore, during manufacturing, only one of the structures needs to be manufactured. Therefore, its versatility is high, the manufacturing cost can be effectively reduced, and there is no need to distinguish between the first plate body 1 and the second plate body 2 during use, which can effectively reduce the installation difficulty.

[0044] In some embodiments, as Figure 1 shown, the first inner vertical plate 11 is perpendicular to the first plate body 1, and the first inner extension plate 12 is perpendicular to the first inner vertical plate 11; the first outer vertical plate 13 is perpendicular to the first plate body 1, and the first outer extension plate 14 is perpendicular to the first outer vertical plate 13. The second inner vertical plate 21 is perpendicular to the second plate body 2, and the second inner extension plate 22 is perpendicular to the second inner vertical plate 21; the second outer vertical plate 23 is perpendicular to the second plate body 2, and the second outer extension plate 24 is perpendicular to the second outer vertical plate 23. That is, the first inner vertical plate 11 and the first inner extension plate 12, the first outer vertical plate 13 and the first outer extension plate 14, the second inner vertical plate 21 and the second inner extension plate 22, and the second outer vertical plate 23 and the second outer extension plate 24 respectively form a right-angled L-shaped plate structure. In addition, an acute angle or an obtuse angle can also be selected, which can be specifically selected according to actual needs, as long as there is an overlapping part between the first inner vertical plate 11 and the second inner vertical plate 21 in the front view direction after the first plate body 1 and the second plate body 2 are inserted into the corresponding DIMM slots, and the first inner extension plate 12 and the second inner extension plate 22 are arranged corresponding to each other. In addition, the widths of the first plate body 1, the first inner vertical plate 11, the first inner extension plate 12, the first outer vertical plate 13, and the first outer extension plate 14 are the same, and the widths of the second plate body 2, the second inner vertical plate 21, the second inner extension plate 22, the second outer vertical plate 23, and the second outer extension plate 24 are the same. That is, as Figure 1 and Figure 2 shown, the dimensions of each plate member in the height direction are the same.

[0045] In some embodiments, reinforcing ribs 3 are provided on the first plate body 1 and the second plate body 2. For example, a lattice-shaped reinforcing rib 3 structure with horizontal bars and vertical bars intersecting each other can be respectively provided on the inner and outer surfaces of the first plate body 1 and the second plate body 2. In addition to improving the structural strength of the first plate body 1 and the second plate body 2, the reinforcing ribs 3 can also increase friction to facilitate the user to hold the first plate body 1 and the second plate body 2, and further facilitate the first plate body 1 and the second plate body 2 to be snapped into the DIMM slot. As Figure 2 shown, on the inner and outer surfaces of the first plate body 1, there are respectively provided a peripheral reinforcing rib distributed along the side of the first plate body 1, a horizontal reinforcing rib located inside the peripheral reinforcing rib, and five vertically reinforcing ribs evenly distributed. The first inner vertical plate 11 is connected to the second vertically reinforcing rib counted from left to right on the inner surface of the first plate body 1, or can be integrally formed on this vertically reinforcing rib. The second outer vertical plate 13 is connected to the second vertically reinforcing rib counted from right to left on the outer surface of the first plate body 1, or can be integrally formed on this vertically reinforcing rib. The number of the reinforcing ribs can be selected according to the sizes of the first plate body 1 and the second plate body 2. The larger the size, the more reinforcing ribs 3 can be selected. In addition, a reinforcing rib 3 structure in the shape of a rhombus or a triangle can also be provided. The reinforcing ribs 3 are preferably formed on the inner and outer surfaces of the first plate body 1 and the second plate body 2 by an integral molding method. In addition, the first plate body 1, the first inner vertical plate 11, the first inner extension plate 12, the first outer vertical plate 13, and the first outer extension plate 14 are preferably processed by an integral molding method, and the second plate body 2, the second inner vertical plate 21, the second inner extension plate 22, the second outer vertical plate 23, and the second outer extension plate 24 are also preferably processed by an integral molding method, such as by injection molding.

[0046] In addition, an assembled structure can also be selected. For example, the first plate body 1, the first inner vertical plate 11, the first inner extension plate 12, the first outer vertical plate 13, and the first outer extension plate 14 are respectively manufactured and then formed into a first set of plate components by an assembling method; the second plate body 2, the second inner vertical plate 21, the second inner extension plate 22, the second outer vertical plate 23, and the second outer extension plate 24 are respectively manufactured and then formed into a second set of plate components by an assembling method. The assembling structure of the first set of plate components and the second set of plate components can be assembled by the same principle. The assembling structure of the first set of plate components will be taken as an example for illustration below:

[0047] The connection method between the first inner vertical plate 11 and the first plate body 1 is as follows: a vertical connection groove is provided on the inner side of the first plate body 1, and one end of the first inner vertical plate 11 is snapped into the connection groove, or a vertical convex strip is provided on the inner side of the first plate body 1, and a groove cooperating with the convex strip for fixing is provided at one end of the first inner vertical plate 11.

[0048] The connection method between the first inner extension plate 12 and the first inner vertical plate 11 is as follows: On the side of the first inner vertical plate 11 facing the second inner vertical plate 21, there is a vertical connection groove. One end of the first inner extension plate 12 is clamped in this connection groove, or a connection groove extending downward from top to bottom is provided at one end of the first inner extension plate 12 close to the first inner vertical plate 11, and the end of the first inner vertical plate 11 far from the first plate body 1 is clamped with the connection groove on the first inner extension plate 12. Among them, a vertically extending connection groove can be respectively provided on both sides of the end of the first inner vertical plate 11 far from the first plate body 1, and vertically extending connection grooves can also be respectively provided on both sides of the end of the first inner extension plate 12 connected to the first inner vertical plate 11. When assembling, the front and back sides of the first inner vertical plate 11 and the first inner extension plate 12 do not need to be considered, so as to improve the usability of the first inner extension plate 12 and the first inner vertical plate 11.

[0049] The specific clamping method between the first inner extension plate 12 and the first inner vertical plate 11 is as follows: A dovetail groove or a T-shaped groove extending downward from top to bottom can be provided at the end of the first inner vertical plate 11 and on the side facing the second inner vertical plate 21. Of course, dovetail grooves or T-shaped grooves extending downward from top to bottom can also be respectively provided on both sides of the end of the first inner vertical plate 11. The upper end of the dovetail groove is open and the lower end is sealed. One end of the first inner extension plate 12 can be provided with a dovetail block or a T-shaped block. After the end of the first inner extension plate 12 is clamped into the dovetail groove or T-shaped groove at the end of the first inner vertical plate 11 from top to bottom, the upper opening is sealed. For example, it can be fixed by a pressing plate, and the pressing plate can be fixed on the first inner vertical plate 11 through fasteners to limit the upward movement of the first inner extension plate 12 relative to the first inner vertical plate 11, or a horizontal groove is provided at the upper end of the dovetail groove. After the first inner extension plate 12 is inserted into the first inner vertical plate 11, a baffle is horizontally inserted into the horizontal groove, which can also limit the upward movement of the first inner extension plate 12. In addition to the clamping method to realize the connection between the first inner extension plate 12 and the first inner vertical plate 11, fasteners such as screws can also be used to replace the clamping method or reinforce the clamping. Moreover, the connection method between the first inner vertical plate 11 and the first plate body 1, the connection method between the first outer vertical plate 13 and the first plate body 1, and the connection method between the first outer vertical plate 13 and the first outer extension plate 14 can also be assembled by using the connection method between the first inner extension plate 12 and the first inner vertical plate 11.

[0050] In addition to the above, the connection method between the first inner vertical plate 11 and the first plate body 1 can also adopt the following method: for example, a connecting plate parallel to the first plate body 1 is arranged at one end of the first inner vertical plate 11 close to the first plate body 1. One connecting plate can be arranged on each side of the end of the first inner vertical plate 11 close to the first plate body 1. The connecting plate is in surface contact with the first plate body 1, and then the first vertical plate is fastened to the first plate body 1 by pasting or screws. Multiple groups of hole positions can be arranged on the first plate body 1, and the multiple groups of hole positions are distributed along the length direction of the first plate body 1. The connecting plate on the first vertical plate can be connected to the first plate body 1 by selecting one group or multiple groups of the hole positions. The relative position of the first vertical plate relative to the first plate body 1 can be adjusted through the multiple groups of hole positions, so that the assembly structure of the first plate body 1 and the first inner vertical plate 11 is more flexible to meet different usage requirements. Similarly, the connection method between the first outer vertical plate 13 and the first plate body 1 can also adopt this connection method between the first inner vertical plate 11 and the first plate body 1.

[0051] It should be noted that the provided assembled structure in the above embodiments is only for facilitating the disassembly, assembly and maintenance of the first group of plate components and the second group of plate components. For example, when one of the plate components is damaged or there are manufacturing defects, it can be replaced to reduce the usage cost and improve the yield of the product. Although the separate manufacturing of each plate component is more cumbersome during assembly compared to the integrally formed structure, its flexibility is also improved, which is convenient for users to selectively use according to their own needs.

[0052] Generally, the sizes of the first plate body 1 and the second plate body 2 usually need to match the DIMM slots. Therefore, the first plate body 1 and its attached plate components, and the second plate body 2 and its attached plate components can be made into kits, that is, one first plate body 1 corresponds to multiple groups of first inner vertical plates 11, first inner extension plates 12, first outer vertical plates 13 and first outer extension plates 14 with different sizes; one second plate body 2 corresponds to multiple groups of second inner vertical plates 21, second inner extension plates 22, second outer vertical plates 23 and second outer extension plates 24, and it is mainly ensured that the first inner vertical plate 11, the first outer vertical plate 13, the second inner vertical plate 21 and the second outer vertical plate 23 are structures with multiple different lengths. When the distance between the DIMM slots on both sides is too small or too large, resulting in the length of the original first inner vertical plate 11 or second inner vertical plate 21 being greater than the distance between the DIMM slots on both sides or the total length of the first inner vertical plate 11 and the second inner vertical plate 21 being less than the distance between the DIMM slots on both sides, that is, when the actual distance between the DIMM slots on both sides exceeds the range, it can be solved by the above kits. Therefore, the above kits can effectively increase the usage range of the windshield module.

[0053] It should be noted that, for the first inner vertical plate 11 and the first inner extension plate 12, the first outer vertical plate 13 and the first outer extension plate 14, the second inner vertical plate 21 and the second inner extension plate 22, and the second outer vertical plate 23 and the second outer extension plate 24, in addition to being formed by integral molding or assembly, they can also be formed by bending a flat plate, and the bending angle can be selected as needed. For example, the first inner vertical plate 11 and the first inner extension plate 12 are first made into a flat plate, and then the flat plate is bent at a preset angle at a suitable position according to the need. Preferably, it is bent at a right angle, and then the first inner vertical plate 11 and the first inner extension plate 12 formed after bending are installed on the first plate body. Compared with the integral molding structure of the first plate body 1, the first inner vertical plate 11 and the first inner extension plate 12, the complexity of the mold can be effectively reduced, thereby reducing the manufacturing cost. Moreover, the flat plate structure is more convenient to obtain materials and process. In addition, by bending the flat plate to form the first inner vertical plate 11 and the first inner extension plate 12, the length of the first inner vertical plate 11 can be effectively controlled, so its use flexibility is relatively high. For example, the flat plate can be selected as a metal sheet that can generate deformation and will not naturally rebound after deformation, such as an iron sheet, an aluminum sheet or an alloy sheet, etc. The first plate body can be selected as a plastic material structure to reduce its manufacturing cost. The advantage of using a metal sheet to bend and form the first inner vertical plate 11 and the second inner extension plate 12 is that it can be bent according to actual needs. For example, when the distance between the DIMM slots on both sides is relatively large, the user can re-bend the metal sheet to increase the length of the first inner vertical plate 11 and at the same time reduce the length of the first inner extension plate 12. The bending structure and material selection of the first inner vertical plate 11 and the first inner extension plate 12 can be analogized to the first outer vertical plate 13 and the first outer extension plate 14, as well as the second inner vertical plate 21 and the second inner extension plate 22, and the second outer vertical plate 23 and the second outer extension plate 24.

[0054] In some embodiments of the present application, reinforcing plates are respectively provided at the corners between the first inner vertical plate 11 and the first plate body 1, between the first inner vertical plate 11 and the first inner extension plate 12, between the first outer vertical plate 13 and the first plate body 1, and between the first outer vertical plate 13 and the first outer extension plate 14 to enhance their structures. For example, a reinforcing plate is provided inside the corner between the first inner vertical plate 11 and the first inner extension plate 12 to form a triangular reinforcing structure, thereby improving its structural strength. Similarly, reinforcing plates can also be respectively provided at the corners between the second inner vertical plate 21 and the second plate body 2, between the second inner vertical plate 21 and the second inner extension plate 22, between the second outer vertical plate 23 and the second plate body 2, and between the second outer vertical plate 23 and the second outer extension plate 24. The reinforcing plates can be formed between the first plate body 1 and the first inner vertical plate 11, between the first inner vertical plate 11 and the first inner extension plate 12, between the first plate body 1 and the first outer vertical plate 13, between the first outer vertical plate 13 and the first outer extension plate 14, and between the second plate body 2 and the second inner vertical plate 21, between the second inner vertical plate 21 and the second inner extension plate 22, between the second plate body 2 and the second outer vertical plate 23, and between the second outer vertical plate 23 and the second outer extension plate 24 by an integral molding method. The reinforcing plates are preferably structures with a right-angled isosceles triangle cross-section, or an inclined plate is integrally formed at the corner between two connected plate members, and a triangular structure is formed between the inclined plate and the two plate members. It should be noted that the reinforcing plates can also be connected by an assembly method. For example, a support groove extending up and down is respectively provided on two mutually perpendicular side surfaces of the first plate body 1 and the first inner vertical plate 11, and both sides of the reinforcing plate are respectively clamped in the support grooves. Similarly, the reinforcing plates between the first inner vertical plate 11 and the first inner extension plate 12, between the first plate body 1 and the first outer vertical plate 13, and between the first outer vertical plate 13 and the first outer extension plate 14 can also be connected by the above support groove method. Correspondingly, the reinforcing plates between the second plate body 2 and its attached plate members can also be connected by the above support groove method.

[0055] To more clearly understand the adaptability of a CPU wind deflector module provided in the above embodiments of the present application to different DIMM slot spacings, the following takes DIMM slots with three different spacings as examples for illustration:

[0056] As Figure 3 and Figure 4 shown, the spacing between the DIMM slots on both sides is 70 mm;

[0057] As Figure 5 and Figure 6 shown, the spacing between the DIMM slots on both sides is 90 mm;

[0058] As Figure 7 and Figure 8 shown, the spacing between the DIMM slots on both sides is 100 mm.

[0059] As can be seen from the comparison of the above drawings, the first inner vertical plate 11 and the second inner vertical plate 21 with a finite length can adapt to the situation where the DIMM slot pitch varies within a certain range. The adaptation range depends on the pitch between the first inner extension plate 12 and the second inner extension plate 22. When the pitch between the DIMM slots on both sides is larger, the pitch between the first inner extension plate 12 and the second inner extension plate 22 is smaller.

[0060] An embodiment of the present application further provides a main board, including the CPU wind deflector module provided in any one of the above embodiments. The beneficial effects can be referred to the beneficial effects of the above CPU wind deflector module. Other components on the main board are prior art and will not be elaborated here.

[0061] An embodiment of the present application further provides a server, including a chassis and further including the above main board. The main board is located inside the chassis and can be fixed in the chassis by fasteners. The beneficial effects of the server can be referred to the above CPU wind deflector module and will not be elaborated here either.

[0062] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0063] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A CPU wind deflector module, characterized in that, Comprising: A first plate body (1), with a first inner vertical plate (11) provided on one side, and a first inner extension plate (12) provided at the end of the first inner vertical plate (11) and arranged at a preset angle therewith. The first plate body (1) is used for being inserted into the DIMM slot on one side of the CPU. A second plate body (2), with a second inner vertical plate (21) provided on one side, and a second inner extension plate (22) provided at the end of the second inner vertical plate (21) and arranged at a preset angle therewith. The second plate body (2) is used for being inserted into the DIMM slot on the other side of the CPU. The first inner extension plate (12) is located between the second inner extension plate (22) and the second plate body (2), and the second inner extension plate (22) is located between the first inner extension plate (12) and the first plate body (1). On the side of the first plate body (1) away from the first inner vertical plate (11), a first outer vertical plate (13) is provided, and a first outer extension plate (14) is provided at the end of the first outer vertical plate (13) and arranged at a preset angle therewith. The structure formed by the first inner vertical plate (11) and the first inner extension plate (12) is centrosymmetric with the structure formed by the first outer vertical plate (13) and the first outer extension plate (14). On the side of the second plate body (2) away from the second inner vertical plate (21), a second outer vertical plate (23) is provided, and a second outer extension plate (24) is provided at the end of the second outer vertical plate (23) and arranged at a preset angle therewith. The structure formed by the second inner vertical plate (21) and the second inner extension plate (22) is centrosymmetric with the structure formed by the second outer vertical plate (23) and the second outer extension plate (24).

2. The CPU wind deflector module according to claim 1, wherein The first inner vertical plate (11) is perpendicular to the first plate body (1), and the first inner extension plate (12) is perpendicular to the first inner vertical plate (11); the first outer vertical plate (13) is perpendicular to the first plate body (1), and the first outer extension plate (14) is perpendicular to the first outer vertical plate (13).

3. The CPU wind deflector module according to claim 1, wherein The second inner vertical plate (21) is perpendicular to the second plate body (2), and the second inner extension plate (22) is perpendicular to the second inner vertical plate (21); the second outer vertical plate (23) is perpendicular to the second plate body (2), and the second outer extension plate (24) is perpendicular to the second outer vertical plate (23).

4. The CPU wind deflector module according to any one of claims 1 to 3, characterized in that, Reinforcing ribs (3) are provided on the first plate body (1) and the second plate body (2).

5. A main board, characterized in that, Including the CPU wind shield module according to any one of claims 1 to 4.

6. A server, comprising a chassis, characterized in that, Further including the main board according to claim 5, and the main board is located inside the chassis.

Citation Information

Patent Citations

  • 1U node split type wind guiding cover

    CN203133722U

  • Heat dissipation wind scooper for double-layer mainboard server

    CN210270745U