A sliding table inspection path planning method for appearance inspection of multiple chips in a box

Abstract

The present application relates to a slide detection path planning method for appearance detection of multiple chips in a box. The method includes: two-dimensional modeling of multiple chip data and tray data to obtain multiple chip tray two-dimensional models; constructing a tray two-dimensional coordinate system, performing coordinate calculation based on the chip tray model and the tray two-dimensional coordinate system, and obtaining the center coordinates of the tray detection position; using the center of the camera field of view as the camera coordinates, using the camera coordinates to switch the detection position of the center coordinates of the tray detection position, using the origin of the tray two-dimensional coordinate system and the camera's detection position coordinates to determine the starting row of the slide detection, starting from the starting row, preferentially performing the detection position scanning of the long side of the X-axis in the same detection surface, and completing the detection by matching the appearance images and detection results of different detection surfaces with the detection order. The use of this method can improve the efficiency and accuracy of chip appearance detection.

Description

Technical Field

[0001] The present application relates to the technical field of chip packaging appearance inspection, and in particular to a slide inspection path planning method, device, computer equipment and storage medium for appearance inspection of multiple chips in a box. Background Art

[0002] BGA / PGA and other packaging technologies have become the mainstream technology for high-density packaging of microelectronics due to their small I / O pin spacing, good chip electrical and thermal performance, and small assembly thickness and weight. They are widely used in the packaging of multi-pin, high-performance chips such as CPUs and DSPs. At present, many production lines still use traditional manual visual inspection. After defects are found, unqualified products are manually removed. The existing quality inspection situation has the following problems: (1) Due to the large production volume of chips, operators work on continuous production lines, and long-term use of eyes causes visual fatigue, which makes quality assurance subject to human subjective interference; (2) The standard formed by human vision is a non-quantitative and non-constant scale, which causes fluctuations in quality standards and directly leads to unstable product quality control; (3) The judgment speed of the human eye is not as fast as the processing speed of the computer on the image, which makes the inspection efficiency low and thus increases the production cost of the product. The use of computer image processing technology can eliminate the accidental errors caused by manual measurement and can achieve high-precision inspection of the inspection object. The incomparable advantages of traditional measurement technology will make it one of the main means of current industrial inspection technology.

[0003] At present, in the chip defect detection system using computer image processing technology, the general implementation method of placing the chip to be detected into the detection system and switching to another chip to be detected after the current chip to be detected is: the robot arm grabs and places the boxed chip and the slide switches to the detection position of the boxed chip. The robot arm grabs and places with high sensitivity and high degree of freedom, but the cost and R&D cycle are long. The slide has low cost and mature technology, but the control accuracy is relatively low and it is easy to cause errors due to mechanical wear. Compared with the robot arm, the slide method has the advantages of low cost and easy design, and is widely used in the detection system, but there are problems of low detection accuracy and high detection time. Summary of the invention

[0004] Based on this, it is necessary to provide a slide detection path planning method, device, computer equipment and storage medium for appearance detection of multiple chips in a box, which can improve the efficiency and accuracy of chip appearance detection in order to solve the above technical problems.

[0005] A slide detection path planning method for appearance detection of multiple chips in a box, the method comprising:

[0006] Acquire multiple chip data and tray data to be tested; the tray data includes tray specification parameters; the chip data includes chip name, width and height;

[0007] Performing two-dimensional modeling on multiple chip data and tray data to obtain multiple chip tray two-dimensional models;

[0008] The chip tray model is stored in the database of the detection system to construct a two-dimensional coordinate system of the tray, and coordinates are calculated according to the chip tray model and the two-dimensional coordinate system of the tray to obtain the coordinates of the center of the tray detection position;

[0009] The center of the camera field of view is used as the camera coordinates, and the detection position is switched to the center coordinates of the pallet detection position using the camera coordinates to obtain the camera detection position coordinates; the camera detection position coordinates are always consistent with the pallet detection position center coordinates;

[0010] The slides are set as X-axis slides and Y-axis slides according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position scanning of the long side of the X-axis is preferentially performed in the same detection surface. The appearance images and detection results of different detection surfaces are matched with the detection order to complete the detection.

[0011] In one embodiment, the slide camera support is moved to the detection position, and the camera is used to collect the chip image and camera imaging data at the detection position;

[0012] The position of the chip image is determined according to the machine vision algorithm. If the chip is not in the center of the camera's field of view, the camera imaging data is calculated to obtain the center offset; the center offset is the distance from the center point of the chip to the center point of the camera's field of view;

[0013] The center offset is compared with the expected offset threshold. If the center offset is greater than the offset threshold, the slide position is calibrated according to the center offset and the camera coordinates in the two-dimensional coordinate system of the pallet.

[0014] In one embodiment, two-dimensional modeling is performed on a plurality of chip data and tray data to obtain a plurality of chip tray two-dimensional models, including:

[0015] Two data items are set for the chip, and four data items are set for the tray; the two data items include length and width; the four data items include X-axis tray offset, Y-axis tray offset, X-axis tray sheet spacing, and Y-axis tray sheet spacing; the tray offset is the distance between the edge of the tray and the first column and the first row in the tray, and the tray sheet spacing is the distance between the boundaries of the detection positions of two adjacent rows and columns of the tray; the length, width, and offset of the chip and the sheet spacing of the tray are obtained by querying the specifications of the chip and tray or by measurement;

[0016] Two-dimensional modeling is performed based on the two data items and the four data items to obtain a two-dimensional model of the chip tray.

[0017] In one embodiment, coordinate calculation is performed based on the chip tray model and the tray two-dimensional coordinate system to obtain the center coordinates of the detection position, including:

[0018] According to the chip tray model and the tray two-dimensional coordinate system, coordinate calculation is performed to obtain the detection position center:

[0019]

[0020]

[0021] Where X represents the X-axis coordinate value of the detection position, T Xoffset Indicates the pallet X offset, C lenght Indicates the chip length, X infex Indicates the position number of the detection position on the X-axis, starting from 0 and accumulating from left to right, T Xspacing Indicates the X-spacing of the pallet, Y indicates the Y-axis coordinate value of the detection position, T Yoffset Indicates the Y offset of the pallet, C width Indicates chip width, Y index Indicates the position number of the detection position on the Y axis, T Yspacing Indicates the Y spacing of the tray.

[0022] In one embodiment, the center of the camera field of view is used as the camera coordinates, and the detection position coordinates of the center of the pallet detection position are switched using the camera coordinates to obtain the camera detection position coordinates, including:

[0023] The movement of the pallet platform is two-dimensionalized into the movement of the camera in the pallet two-dimensional coordinate system. The center of the camera field of view is selected as the camera coordinate. The camera position is calibrated by the camera coordinate in the pallet two-dimensional coordinate system. The coincidence of the camera coordinate and the center coordinate of the pallet detection position in the pallet two-dimensional coordinate axis indicates that the detection position chip is in the center of the camera field of view.

[0024] In the two-dimensional coordinate system of the pallet, the camera coordinates are switched to the center coordinates of any detection position. The detection position coordinates are subtracted from the camera coordinates to obtain the moving direction and distance in the X-axis and Y-axis. The pallet platform is moved according to the moving direction and distance in the X-axis and Y-axis to obtain the detection position coordinates of the camera.

[0025] In one of the embodiments, the slide is set as an X-axis slide and a Y-axis slide according to the two-dimensional coordinate system of the pallet, the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera are used to determine the starting row of the slide detection, and the detection position scanning of the long side of the X-axis is preferentially performed in the same detection surface starting from the starting row, and the appearance images and detection results of different detection surfaces are matched with the detection order to complete the detection, including:

[0026] The slide is set as an X-axis slide and a Y-axis slide according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position of the long side of the X-axis is scanned preferentially in the same detection surface. After the detection of the starting row is completed, the last detection position of the current row is switched from bottom to top to the second row. The second row is then detected from right to left. After the detection of this row is completed, it is switched from bottom to top to the third row. This path is followed until all detection positions of the current detection surface of the pallet are detected.

[0027] After the current detection surface completes the detection, the pallet detection surface is switched, the pallet is manually flipped over and placed back in the bracket, and after flipping, the detection position of the long side of the X-axis is scanned preferentially in the same detection surface starting from the starting row. The detection order of the same detection position in the pallet is consistent in the motion path when it is detected on different detection surfaces.

[0028] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0029] Acquire multiple chip data and tray data to be tested; the tray data includes tray specification parameters; the chip data includes chip name, width and height;

[0030] Performing two-dimensional modeling on multiple chip data and tray data to obtain multiple chip tray two-dimensional models;

[0031] The chip tray model is stored in the database of the detection system to construct a two-dimensional coordinate system of the tray, and coordinates are calculated according to the chip tray model and the two-dimensional coordinate system of the tray to obtain the coordinates of the center of the tray detection position;

[0032] The center of the camera field of view is used as the camera coordinates, and the detection position is switched to the center coordinates of the pallet detection position using the camera coordinates to obtain the camera detection position coordinates; the camera detection position coordinates are always consistent with the pallet detection position center coordinates;

[0033] The slides are set as X-axis slides and Y-axis slides according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position scanning of the long side of the X-axis is preferentially performed in the same detection surface. The appearance images and detection results of different detection surfaces are matched with the detection order to complete the detection.

[0034] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0035] Acquire multiple chip data and tray data to be tested; the tray data includes tray specification parameters; the chip data includes chip name, width and height;

[0036] Performing two-dimensional modeling on multiple chip data and tray data to obtain multiple chip tray two-dimensional models;

[0037] The chip tray model is stored in the database of the detection system to construct a two-dimensional coordinate system of the tray, and coordinates are calculated according to the chip tray model and the two-dimensional coordinate system of the tray to obtain the coordinates of the center of the tray detection position;

[0038] The center of the camera field of view is used as the camera coordinates, and the detection position is switched to the center coordinates of the pallet detection position using the camera coordinates to obtain the camera detection position coordinates; the camera detection position coordinates are always consistent with the pallet detection position center coordinates;

[0039] The slides are set as X-axis slides and Y-axis slides according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position scanning of the long side of the X-axis is preferentially performed in the same detection surface. The appearance images and detection results of different detection surfaces are matched with the detection order to complete the detection.

[0040] The above-mentioned slide detection path planning method, computer equipment and storage medium for appearance inspection of multiple boxed chips first perform two-dimensional modeling on multiple chip data and tray data to obtain multiple chip tray two-dimensional models, store the chip tray model in the database of the detection system, and record information such as the length and width of the tray and chip in the form of data items and store it in the computer host file, so that the detection system has the ability to detect chips and trays of various specifications. When the inspection system performs appearance inspection on multiple chips in a box, coordinate calculation is performed based on the chip tray model and the tray two-dimensional coordinate system to obtain the coordinates of the center of the tray inspection position, the center of the camera field of view is used as the camera coordinates, and the camera coordinates are used to switch the inspection position of the center of the tray inspection position to obtain the camera inspection position coordinates, and the slide is set as the X-axis slide and the Y-axis slide according to the tray two-dimensional coordinate system. The origin of the tray two-dimensional coordinate system and the camera's inspection position coordinates are used to determine the starting row of the slide inspection, and starting from the starting row, the inspection position scanning of the long side of the X-axis is preferentially performed in the same inspection surface, and the appearance images and inspection results of different inspection surfaces are matched with the inspection sequence to complete the inspection. During the inspection process, the motion path is planned according to the characteristics of the chip inspection surface switching and the boxed tray flipping, the long side of the X-axis is scanned preferentially, and the number of Y-axis movements is reduced, which can effectively reduce the inspection time of multiple chips in the box, thereby improving the inspection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1It is a flow chart of a method for planning a slide detection path for appearance detection of multiple chips in a box in one embodiment;

[0042] Figure 2 is a schematic diagram of a detection system in one embodiment;

[0043] Figure 3 A schematic diagram of a two-dimensional model of a chip tray in another embodiment;

[0044] Figure 4 A schematic diagram of a rectangular coordinate system of a pallet in an embodiment;

[0045] Figure 5 A schematic diagram of the flipping of the detection surface of the tray in one embodiment;

[0046] Figure 6 A schematic diagram of motion path planning for front and back appearance inspection of a plurality of chips packed in a box in one embodiment; Figure 6 (a) is a schematic diagram of the motion path planning for the front of multiple chips in a box; Figure 6 (b) is a schematic diagram of the motion path planning for the back side of multiple chips in a box;

[0047] Figure 7 A schematic diagram of the calibration logic of the detection position slide in one embodiment. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0049] In one embodiment, Figure 1 As shown, a slide detection path planning method for appearance detection of multiple chips in a box is provided, comprising the following steps:

[0050] Step 102, obtaining multiple chip data and tray data to be tested; the tray data includes tray specification parameters; the chip data includes chip name, width and height; two-dimensional modeling is performed on the multiple chip data and tray data to obtain multiple chip tray two-dimensional models.

[0051] The inspection system for appearance inspection of multiple chips in a box based on a slide table includes an optical imaging system, a slide table, an LED light source, and a main control computer. Figure 2 As shown, the optical imaging system obtains the appearance image data of the chip to be inspected, and the LED light source provides illumination for the inspection chip. The slide table refers to an X / Y two-axis or X / Y / Z three-axis mechanical motion platform, which can provide a tray platform for placing a tray and a movable camera or tray platform, and the inspection position can be switched by moving the camera or tray platform.

[0052] Set two data items, length and width, for the chip, and four data items, (X / Y) offset and (X / Y chip spacing), for the tray. The tray (X / Y) offset is the distance between the edge of the tray and the first column and the first row in the tray, and the tray chip spacing (X / Y) is the distance between the boundaries of the detection positions of two adjacent rows and columns of the tray. Figure 3 As shown. By querying the chip and tray specifications or by measuring the length, width, (X / Y) offset and (X / Y) chip spacing of the chip, the two-dimensional model data of different chips and trays are stored in the computer host of the detection system. After the chip and tray type are selected at the beginning of the detection system, the selected chip tray two-dimensional model data is obtained locally, so that the detection system can adapt to a variety of chips and trays. Two-dimensional modeling is performed on multiple chip data and tray data to obtain multiple chip tray two-dimensional models, such as Figure 3 shown.

[0053] Step 104 , the chip tray model is stored in the database of the detection system to construct a two-dimensional coordinate system of the tray, and coordinate calculation is performed based on the chip tray model and the two-dimensional coordinate system of the tray to obtain the coordinates of the center of the tray detection position.

[0054] The two-dimensional model data storage of chips and trays is implemented in a database, and the database uses the SQLite3 database engine. The chip and tray data are stored in different data tables in the database. The chip data table includes three fields: chip name, width, and height. The tray data table includes five fields: tray name, X offset, Y offset, X-chip spacing, and Y-chip spacing.

[0055] The method of constructing the two-dimensional coordinate system of the pallet and the two-dimensional coordinates of the center of the pallet chip detection position is to confirm the chip and pallet specifications and parameters, take the lower left corner edge of the pallet in the top view of the pallet as the origin of the coordinate system, take the origin as the starting point and the right side as the positive direction of the rectangular coordinate system X axis, take the origin as the starting point and the vertical top as the positive direction of the Y axis, and construct the pallet rectangular coordinate system as follows: Figure 4 As shown, the X / Y position numbers of the detection positions in the coordinate system all start from 0 and are accumulated in the positive direction of the X / Y axis. The X / Y axis coordinates of the center of each detection position of the tray relative to the origin in the rectangular coordinate system can be obtained by combining the known chip and tray specification data with the tray's lower left corner edge as the origin.

[0056] Step 106, using the center of the camera field of view as the camera coordinates, and using the camera coordinates to switch the detection position of the pallet detection position center coordinates to obtain the camera detection position coordinates; the camera detection position coordinates and the pallet detection position center coordinates are always consistent.

[0057] Step 108, set the slide as an X-axis slide and a Y-axis slide according to the two-dimensional coordinate system of the pallet, determine the starting row of the slide detection using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera, and start scanning the detection position of the long side of the X-axis in the same detection surface from the starting row, and complete the detection by matching the appearance images and detection results of different detection surfaces with the detection order.

[0058] During the detection process, the motion path is planned according to the characteristics of chip detection surface switching and box tray flipping, and the long side of the X-axis is scanned first, reducing the number of Y-axis movements. This can effectively reduce the detection time of multiple chips in the box, thereby improving the detection efficiency.

[0059] In the above-mentioned slide inspection path planning method for appearance inspection of multiple boxed chips, firstly, two-dimensional modeling is performed on multiple chip data and tray data to obtain two-dimensional models of multiple chip trays. The chip tray models are stored in the database of the inspection system, and information such as the length and width of the tray and chip are recorded in the form of data items and stored in the computer host file, so that the inspection system has the ability to inspect chips and trays of various specifications. When the inspection system performs appearance inspection on multiple chips in a box, coordinate calculation is performed based on the chip tray model and the tray two-dimensional coordinate system to obtain the coordinates of the center of the tray inspection position, the center of the camera field of view is used as the camera coordinates, and the camera coordinates are used to switch the inspection position of the center of the tray inspection position to obtain the camera inspection position coordinates, and the slide is set as the X-axis slide and the Y-axis slide according to the tray two-dimensional coordinate system. The origin of the tray two-dimensional coordinate system and the camera's inspection position coordinates are used to determine the starting row of the slide inspection, and starting from the starting row, the inspection position scanning of the long side of the X-axis is preferentially performed in the same inspection surface, and the appearance images and inspection results of different inspection surfaces are matched with the inspection sequence to complete the inspection. During the inspection process, the motion path is planned according to the characteristics of the chip inspection surface switching and the boxed tray flipping, the long side of the X-axis is scanned preferentially, and the number of Y-axis movements is reduced, which can effectively reduce the inspection time of multiple chips in the box, thereby improving the inspection efficiency.

[0060] In one embodiment, the slide camera support is moved to the detection position, and the camera is used to collect the chip image and camera imaging data at the detection position;

[0061] The position of the chip image is determined according to the machine vision algorithm. If the chip is not in the center of the camera's field of view, the camera imaging data is calculated to obtain the center offset; the center offset is the distance from the center point of the chip to the center point of the camera's field of view;

[0062] The center offset is compared with the expected offset threshold. If the center offset is greater than the offset threshold, the slide position is calibrated according to the center offset and the camera coordinates in the two-dimensional coordinate system of the pallet.

[0063] In a specific embodiment, Figure 7As shown, when performing appearance inspection of multiple chips in a box, the present application also provides a method for calibrating the position of a slide table during appearance inspection, including the following steps:

[0064] Step 1: The slide camera bracket moves to the detection position, stops and stabilizes;

[0065] Step 2: The camera collects images to obtain the image of the chip at the detection position, and determines whether the chip is in the center of the camera's field of view image through machine vision algorithm logic: Analyze the camera imaging data to obtain the center offset, that is, the distance from the center point of the chip to the center point of the camera's field of view. When the center offset exceeds the set threshold, enter step 3 for calibration. If the center offset does not exceed the threshold, the calibration logic ends;

[0066] Step 3: The center offset obtained in step 2 and the camera coordinates in the rectangular coordinate system of the tray can be used to control the slide to move the camera so that the chip is located in the center of the camera's field of view;

[0067] Calibration is complete.

[0068] The threshold judgment distance value of "center offset" in the detection step is 1mm. The chip clarity and the position of the current chip in the camera's field of view are judged by computer image processing of the image captured by the camera, and then the camera position and the tray position are adjusted by the slide to obtain the best chip appearance imaging. The above method can adapt to chip trays of various specifications and reduce the influence of mechanical motion errors on camera imaging during detection. The offset data between the chip center and the camera field of view center is analyzed by the detection image to calibrate the slide to improve the detection accuracy.

[0069] In one embodiment, two-dimensional modeling is performed on a plurality of chip data and tray data to obtain a plurality of chip tray two-dimensional models, including:

[0070] Two data items are set for the chip, and four data items are set for the tray; the two data items include length and width; the four data items include X-axis tray offset, Y-axis tray offset, X-axis tray sheet spacing, and Y-axis tray sheet spacing; the tray offset is the distance between the edge of the tray and the first column and the first row in the tray, and the tray sheet spacing is the distance between the boundaries of the detection positions of two adjacent rows and columns of the tray; the length, width, and offset of the chip and the sheet spacing of the tray are obtained by querying the specifications of the chip and tray or by measurement;

[0071] Two-dimensional modeling is performed based on the two data items and the four data items to obtain a two-dimensional model of the chip tray.

[0072] In one embodiment, coordinate calculation is performed based on the chip tray model and the tray two-dimensional coordinate system to obtain the center coordinates of the detection position, including:

[0073] According to the chip tray model and the tray two-dimensional coordinate system, coordinate calculation is performed to obtain the detection position center:

[0074]

[0075]

[0076] Where X represents the X-axis coordinate value of the detection position, T Xoffset Indicates the pallet X offset, C lenght Indicates the chip length, X index Indicates the position number of the detection position on the X-axis, starting from 0 and accumulating from left to right, T Xspacing Indicates the X-spacing of the pallet, Y indicates the Y-axis coordinate value of the detection position, T Yoffset Indicates the Y offset of the pallet, C width Indicates chip width, Y index Indicates the position number of the detection position on the Y axis, T Yspacing Indicates the Y spacing of the tray.

[0077] In one embodiment, the center of the camera field of view is used as the camera coordinates, and the detection position coordinates of the center of the pallet detection position are switched using the camera coordinates to obtain the camera detection position coordinates, including:

[0078] The movement of the pallet platform is two-dimensionalized into the movement of the camera in the pallet two-dimensional coordinate system. The center of the camera field of view is selected as the camera coordinate. The camera position is calibrated by the camera coordinate in the pallet two-dimensional coordinate system. The coincidence of the camera coordinate and the center coordinate of the pallet detection position in the pallet two-dimensional coordinate axis indicates that the detection position chip is in the center of the camera field of view.

[0079] In the two-dimensional coordinate system of the pallet, the camera coordinates are switched to the center coordinates of any detection position. The detection position coordinates are subtracted from the camera coordinates to obtain the moving direction and distance in the X-axis and Y-axis. The pallet platform is moved according to the moving direction and distance in the X-axis and Y-axis to obtain the detection position coordinates of the camera.

[0080] In a specific embodiment, a rectangular coordinate system of the pallet is constructed with the lower left corner edge of the pallet as the origin, and the coordinate values ​​of the center of each detection position of the pallet in the rectangular coordinate system of the pallet are obtained through the chip and pallet two-dimensional model data and the X / Y coordinate calculation formula of the detection position center. The detection system also includes a camera and a pallet. The camera is fixed above the pallet. The detection system sets the movement of the pallet platform through a motion controller to change the camera field of view. When the camera height (Z axis) movement is not involved, the movement of the pallet platform can be two-dimensionalized as the movement of the camera in the rectangular coordinate system of the pallet. The camera position can be calibrated by the camera coordinates in the rectangular coordinate system of the pallet by selecting the center of the camera field of view as the camera coordinates. In the two-dimensional coordinate axis of the pallet, the camera coordinates coincide with the coordinates of the center point of the detection position and can represent that the detection position chip is in the center of the camera field of view. Moving the camera field of view to any detection position on the pallet means that the camera coordinates in the rectangular coordinate system of the pallet are switched to the center coordinates of any detection position. Subtracting the detection position coordinates from the camera coordinates can obtain the moving direction and distance in the X-axis and Y-axis. The detection system transmits the moving direction and distance to the motion controller to control the movement of the pallet platform so that the specified detection position enters the camera field of view and the chip center coincides with the camera field of view center (without considering the mechanical motion error of the slide), thereby realizing the camera field of view switching the detection position in the pallet and obtaining the camera's detection position coordinates.

[0081] In one of the embodiments, the slide is set as an X-axis slide and a Y-axis slide according to the two-dimensional coordinate system of the pallet, the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera are used to determine the starting row of the slide detection, and the detection position scanning of the long side of the X-axis is preferentially performed in the same detection surface starting from the starting row, and the appearance images and detection results of different detection surfaces are matched with the detection order to complete the detection, including:

[0082] The slide is set as an X-axis slide and a Y-axis slide according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position of the long side of the X-axis is scanned preferentially in the same detection surface. After the detection of the starting row is completed, the last detection position of the current row is switched from bottom to top to the second row. The second row is then detected from right to left. After the detection of this row is completed, it is switched from bottom to top to the third row. This path is followed until all detection positions of the current detection surface of the pallet are detected.

[0083] After the current detection surface completes the detection, the pallet detection surface is switched, the pallet is manually flipped over and placed back in the bracket, and after flipping, the detection position of the long side of the X-axis is scanned preferentially in the same detection surface starting from the starting row. The detection order of the same detection position in the pallet is consistent in the motion path when it is detected on different detection surfaces.

[0084] In a specific embodiment, the appearance inspection needs to inspect both the front side (logo side) and the back side (pin / pad side) of the chip. In the inspection system based on the slide table, the inspection of the front and back sides of the chip requires the inspection surface to be switched. The most common way to switch the inspection surface of the boxed tray is to rotate the tray 180° with the long side as the rotation axis and then place it on the bracket, such as Figure 5 After the detection surface is switched, the serial number of the detection position in the rectangular coordinate system of the tray will change accordingly. How to determine the motion path of the slide according to the different detection positions of the same chip after the detection surface is switched is an important factor affecting the appearance inspection time of multiple chips in a box.

[0085] Taking a tray with 4 rows and 8 columns as an example, the motion path planning used in this application is as follows: Figure 6 As shown, it is divided into the logo surface and the pin surface. Figure 6 (a) is a schematic diagram of the motion path planning for the front of multiple chips in a box; Figure 6 (b) is a schematic diagram of the motion path planning for the back of multiple chips in a box; the front side is the marking side, and the back side is the pin side; when the detection starts, the chip placed in the tray is the marking side, and the motion path planning of the slide is that the starting row starts from the detection position closest to the origin of the rectangular coordinate system of the tray, and the first row is detected from left to right. After the first row is detected, it switches from bottom to top to the second row at the last detection position of the current row. The second row is then detected from right to left. After the row is detected, it switches from bottom to top to the third row. This path is followed until the detection position of the current detection surface of the tray is completed. In the detection system, the X-axis slide is set above the Y-axis slide. The Y-axis slide carries a larger load, that is, the motor resistance in the Y-axis direction is large. When the Y-axis moves, there is a greater probability of mechanical motion errors affecting the detection accuracy. The scanning of the detection position of the long side of the X-axis is prioritized, reducing the number of Y-axis movements. After the current detection surface is detected, the detection surface of the tray is switched, and the tray is manually flipped over and placed back in the bracket, such as Figure 5 The chip serial numbers of the pin surface detection positions shown will be flipped and arranged, and after flipping, they will be detected according to the planned motion path. The detection order of the same detection position in the tray in the motion path will be consistent when it is detected on different detection surfaces, which is convenient for the detection system to classify and store data on different detection surfaces of the same detection position.

[0086] It should be understood that although Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 1At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0087] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0088] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A slide detection path planning method for appearance detection of multiple chips in a box, characterized in that: The method comprises: Acquire multiple chip data and tray data to be detected; the tray data includes tray specification parameters; the chip data includes chip name, width and height; Performing two-dimensional modeling on the plurality of chip data and tray data to obtain a plurality of chip tray two-dimensional models; The chip tray two-dimensional model is stored in a database of a detection system to construct a tray two-dimensional coordinate system, and coordinates are calculated based on the chip tray two-dimensional model and the tray two-dimensional coordinate system to obtain the center coordinates of the tray detection position; The center of the camera field of view is used as the camera coordinate, and the detection position is switched to the center coordinate of the pallet detection position by using the camera coordinate to obtain the camera detection position coordinate; the camera detection position coordinate is always consistent with the pallet detection position center coordinate; The slides are set as the X-axis slide and the Y-axis slide according to the two-dimensional coordinate system of the pallet, with the X-axis slide being above the Y-axis slide. The starting row of the slide detection is determined using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. From the starting row, the detection position scan of the long side of the X-axis is preferentially performed in the same detection surface, and the appearance images and detection results of different detection surfaces are matched with the detection sequence to complete the detection; Performing two-dimensional modeling on the plurality of chip data and tray data to obtain a plurality of chip tray two-dimensional models includes: Two data items are set for the chip, and four data items are set for the tray; the two data items include length and width; the four data items include X-axis tray offset, Y-axis tray offset, X-axis tray sheet spacing, and Y-axis tray sheet spacing; the tray offset is the distance between the edge of the tray and the first column and the first row in the tray, and the tray sheet spacing is the distance between the boundaries of the detection positions of two adjacent rows and columns of the tray; the length, width, and offset of the chip and the sheet spacing of the tray are obtained by querying the specifications of the chip and tray or by measurement; Two-dimensional modeling is performed according to the two data items and the four data items to obtain a two-dimensional model of the chip tray.

2. The method according to claim 1, characterized in that The method further comprises: Move the slide camera bracket to the detection position, and use the camera to collect the chip image and camera imaging data at the detection position; The position of the chip image is determined according to a machine vision algorithm. If the chip is not in the center of the camera field of view, the camera imaging data is calculated to obtain a center offset; the center offset is the distance from the center point of the chip to the center point of the camera field of view; The center offset is compared with a pre-set offset threshold. If the center offset is greater than the offset threshold, the slide position is calibrated according to the center offset and the camera coordinates in the two-dimensional coordinate system of the pallet.

3. The method according to claim 2, characterized in that Coordinate calculation is performed according to the chip tray two-dimensional model and the tray two-dimensional coordinate system to obtain the center coordinates of the detection position, including: Coordinate calculation is performed based on the chip tray two-dimensional model and the tray two-dimensional coordinate system to obtain the detection position center as Where X represents the X-axis coordinate value of the detection position, T Xoffset Indicates the pallet X offset, C lenght Indicates the chip length, X index Indicates the position number of the detection position on the X-axis, starting from 0 and accumulating from left to right, T Xspacing Indicates the X-spacing of the pallet, Y indicates the Y-axis coordinate value of the detection position, T Yoffset Indicates the Y offset of the pallet, C width Indicates chip width, Y index Indicates the position number of the detection position on the Y axis, T Yspacing Indicates the Y spacing of the pallet.

4. The method according to claim 1, characterized in that: The center of the camera field of view is used as the camera coordinates, and the detection position coordinates of the center of the pallet detection position are switched by using the camera coordinates to obtain the detection position coordinates of the camera, including: The movement of the pallet platform is two-dimensionalized into the movement of the camera in the pallet two-dimensional coordinate system. The center of the camera field of view is selected as the camera coordinate. The camera position is calibrated by the camera coordinate in the pallet two-dimensional coordinate system. The coincidence of the camera coordinate and the center coordinate of the pallet detection position in the pallet two-dimensional coordinate axis indicates that the detection position chip is in the center of the camera field of view. In the two-dimensional coordinate system of the pallet, the camera coordinates are switched to the center coordinates of any detection position. The detection position coordinates are subtracted from the camera coordinates to obtain the moving direction and distance in the X-axis and Y-axis. The pallet platform is moved according to the moving direction and distance in the X-axis and Y-axis to obtain the detection position coordinates of the camera.

5. The method according to claim 1, characterized in that The slides are set as X-axis slides and Y-axis slides according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position scan of the long side of the X-axis is preferentially performed in the same detection surface. The appearance images and detection results of different detection surfaces are matched with the detection sequence to complete the detection, including: The slide is set as an X-axis slide and a Y-axis slide according to the two-dimensional coordinate system of the pallet. The starting row of the slide detection is determined by using the origin of the two-dimensional coordinate system of the pallet and the detection position coordinates of the camera. Starting from the starting row, the detection position of the long side of the X-axis is scanned preferentially in the same detection surface. After the detection of the starting row is completed, the last detection position of the current row is switched from bottom to top to the second row. The second row is then detected from right to left. After the detection of this row is completed, it is switched from bottom to top to the third row. This path is followed until all detection positions of the current detection surface of the pallet are detected. After the current detection surface completes the detection, the pallet detection surface is switched, the pallet is manually flipped over and placed back in the bracket, and after flipping, the detection position of the long side of the X-axis is scanned preferentially in the same detection surface starting from the starting row. The detection order of the same detection position in the pallet is consistent in the motion path when it is detected on different detection surfaces.

6. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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