A magnetic component and its packaging method

Abstract

This application discloses a magnetic component including a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and a shielding component. The circuit board has distributed lines and solder joints located at both ends of the lines. The chip and the substrate pins are connected to the lines via the solder joints. The shielding component provides a magnetic shielding structure for the chip. As can be seen, in this application, the chip and substrate pins of the magnetic component are connected via solder joints and lines, that is, the chip and substrate pins are connected via a circuit board. Due to the thinness of the circuit board, the packaging height of the magnetic component can be reduced. Furthermore, using a circuit board instead of gold wires effectively avoids contact between the gold wires and the shielding component, preventing short circuits and improving the reliability of the magnetic component. In addition, the shielding component can be attached to the circuit board, ensuring the reliability of subsequent molding. Furthermore, this application also provides a packaging method for a magnetic component with the above advantages.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a magnetic component and its packaging method. Background Technology

[0002] Magnetic materials and magnetoresistive elements are widely used in memory and sensor fields. For example, magnetic random access memory (MRAM) achieves writing through the magnetization reversal of free layers in a magnetic tunnel junction. To avoid adverse effects of external magnetic fields on the performance of magnetic components, magnetic shielding encapsulation is crucial.

[0003] Currently, the structural diagram of the magnetic component after magnetic shielding encapsulation is as follows: Figure 1 As shown, chip 2 is fixed on substrate 1, and chip 2 is connected to substrate pin 3 by gold wire 6. Since magnetic shielding layer 5 is conductive, contact between gold wire 6 and magnetic shielding layer 5 will cause chip 2 to short circuit. Therefore, it is necessary to ensure that there is a sufficient distance between magnetic shielding layer 5 and substrate 1, resulting in a large height of magnetic component. The structural design of gold wire 6 and magnetic shielding layer 5 will cause the encapsulation material to not fill the package 4 completely during plastic encapsulation, resulting in reduced reliability of magnetic component.

[0004] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a magnetic component and its packaging method, so as to reduce the packaging height of the magnetic component and improve the reliability of the magnetic component.

[0006] To address the aforementioned technical problems, this application provides a magnetic component, including a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and a shielding component;

[0007] The circuit board has circuits and solder joints at both ends of the circuits. The chip and the substrate pins are connected to the circuits through the solder joints. The shielding component provides a magnetic shielding structure for the chip.

[0008] Optionally, the shielding component is a shielding frame disposed above the chip and connected to the substrate;

[0009] The circuit includes non-directly connected circuits; the circuit board is provided with a magnetic shielding loop slot that penetrates the thickness, and the sidewall of the shielding frame is connected to the substrate through the magnetic shielding loop slot to form the magnetic shielding structure for the chip.

[0010] Optionally, the shielding frame and the substrate are packaged in an SOP (Surface Opening) form.

[0011] Optionally, the shielding frame is in the shape of an inverted U, and the sidewalls of the inverted U-shaped shielding frame are connected to the substrate.

[0012] Optionally, the substrate is provided with positioning marks for aligning the shielding frame.

[0013] Optionally, the circuit board is a flexible circuit film.

[0014] Optionally, the substrate includes a non-magnetically shielded substrate body and a magnetic shielding pad located on the upper surface of the non-magnetically shielded substrate body.

[0015] Optionally, the material of the shielding frame is a soft magnetic material with high saturation magnetization.

[0016] This application also provides a method for encapsulating a magnetic component, including:

[0017] The chip is fixed to the upper surface of the substrate;

[0018] To lay out circuits and solder joints on a circuit board;

[0019] The two ends of the circuit on the circuit board are soldered to the chip and the substrate pins respectively through the solder joints;

[0020] A shielding component is provided to provide a magnetic shielding structure for the chip, resulting in a magnetic component.

[0021] Optionally, when the shielding component is a shielding frame disposed above the chip and connected to the substrate, the provision of a magnetic shielding structure for the chip by the shielding component includes:

[0022] The shielding frame is connected to the substrate through a magnetic shielding loop slot located on the circuit board to form a magnetic shielding structure for the chip;

[0023] Accordingly, the routing of circuits and solder joints on the circuit board includes:

[0024] A through-thickness magnetic shielding circuit slot is provided on the circuit board, and the circuit and solder joint are laid on the circuit board, the circuit including non-direct connection circuits.

[0025] Optionally, when the substrate includes a non-magnetically shielded substrate body and a magnetic shielding pad located on the upper surface of the non-magnetically shielded substrate body, fixing the chip to the upper surface of the substrate includes:

[0026] The magnetic shielding pad is placed on the upper surface of the non-magnetic shielding substrate body;

[0027] The chip is fixed to the upper surface of the magnetic shielding pad.

[0028] Optionally, the step of setting a through-thickness magnetic shielding loop slot on the circuit board includes:

[0029] A slot for the magnetic shielding circuit, extending through the thickness, is formed on the flexible circuit film.

[0030] Optionally, before connecting the shielding frame to the substrate via a magnetic shielding loop slot located on the circuit board, the method further includes:

[0031] Positioning marks are made on the substrate;

[0032] Accordingly, connecting the shielding frame to the substrate via a magnetic shielding loop slot located on the circuit board includes:

[0033] The shielding frame is aligned with the substrate using the positioning marks, and the shielding frame is connected to the substrate through a magnetic shielding loop slot located on the circuit board.

[0034] The magnetic component provided in this application includes a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and a shielding component; the circuit board has distributed lines and solder joints located at both ends of the lines, the chip and the substrate pins are connected to the lines through the solder joints, and the shielding component provides a magnetic shielding structure for the chip.

[0035] As can be seen, the magnetic component in this application includes a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and a shielding component. The chip and substrate pins are connected by solder joints and circuits, that is, the chip and substrate pins are connected by the circuit board. Since the circuit board is thin, the packaging height of the magnetic component can be reduced. Furthermore, by using the circuit board instead of gold wire, the contact between the gold wire and the shielding component can be effectively avoided, thus preventing short circuits and improving the reliability of the magnetic component. In addition, the shielding component can be attached to the circuit board, which can also ensure the reliability of subsequent plastic encapsulation.

[0036] In addition, this application also provides a method for packaging a magnetic component with the above advantages. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the structure of a magnetic component after magnetic shielding encapsulation in the prior art;

[0039] Figure 2 This is a top view of the existing technology where gold wires connect the chip to the substrate pins.

[0040] Figure 3 A cross-sectional schematic diagram of a magnetic component provided in an embodiment of this application;

[0041] Figure 4 This is a schematic diagram of another magnetic component provided in an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of the structure of a substrate provided in an embodiment of this application;

[0043] Figure 6 A schematic diagram of a shielding frame provided in an embodiment of this application;

[0044] Figure 7 This is a top view of the substrate and substrate pins in this application;

[0045] Figure 8 A top view of a circuit board provided in an embodiment of this application;

[0046] Figure 9 This is another top view of the substrate and substrate pins in this application;

[0047] Figure 10 A top view of another circuit board provided in an embodiment of this application;

[0048] Figure 11 A flowchart illustrating a method for packaging a magnetic component according to an embodiment of this application;

[0049] Figure 12 This is a flowchart illustrating another method for packaging a magnetic component according to an embodiment of this application. Detailed Implementation

[0050] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0052] As described in the background section, in current magnetic components, the chip and substrate pins are connected by gold wires. Since the magnetic shielding layer is conductive, contact between the gold wire and the magnetic shielding layer will cause a short circuit in the chip. Therefore, it is necessary to ensure that there is a sufficient distance between the magnetic shielding layer and the substrate, resulting in a relatively large height of the magnetic component. The structural design of the gold wire and the magnetic shielding layer will result in incomplete filling of the molding material during molding, which will reduce the reliability of the magnetic component. In order to avoid short circuits, the gold wire between the chip and the pins greatly limits the design of the sidewall shielding structure of the magnetic component.

[0053] In view of this, this application provides a magnetic component, please refer to... Figure 3 , Figure 3 This is a cross-sectional schematic diagram of a magnetic component provided in an embodiment of this application, including a substrate 1, substrate pins 3, a chip 2 located on the upper surface of the substrate 1, a circuit board 8, and a shielding component; the circuit board 8 has lines distributed thereon and solder joints 9 located at both ends of the lines, the chip 2 and the substrate pins 3 are connected to the lines through the solder joints 9, and the shielding component 7 provides a magnetic shielding structure for the chip 2.

[0054] The shielding component 7 is not specifically limited in this application and can be determined as needed. For example, when it is necessary to shield magnetic fields in directions parallel and perpendicular to the chip 2, the shielding component 7 is a shielding frame disposed above the chip 2 and connected to the substrate 1; wherein, the circuit includes non-direct connection circuits; the circuit board 8 is provided with a magnetic shielding loop slot that penetrates the thickness, and the sidewall of the shielding frame is connected to the substrate 1 through the magnetic shielding loop slot to form the magnetic shielding structure for the chip 2. Figure 3 The shielding component 7 is a shielding frame. The reason for the non-direct connection circuit is that a magnetic shielding loop slot needs to be set on the circuit board 8, and the circuit must avoid the magnetic shielding loop slot; at the same time, the non-direct connection circuit also increases the sidewall width of the shielding frame 7, reducing the difference between the sidewall width and the width of the shielding frame 7, thus improving shielding efficiency. The purpose of the magnetic shielding loop slot is to connect the shielding frame 7 to the substrate 1, forming a magnetic shielding structure for the chip 2. The shielding frame 7 must not contact the substrate pins 3 to avoid short circuits. Figure 2 As can be seen, the gold wire 6 between the chip 2 and the pin in the existing magnetic components (shown in the dashed box) greatly limits the design of the sidewall shielding structure of the magnetic components. However, the magnetic shielding loop slot 13 is set on the circuit board 8, and the circuit on the circuit board 8 is designable, which can effectively avoid short circuits and improve the reliability of the magnetic components. In addition, the circuit includes non-direct connection circuits, which can increase the sidewall width of the shielding frame 7, reduce the difference between the sidewall width and the width of the shielding frame 7, and improve the shielding efficiency.

[0055] When it is necessary to shield the magnetic field in the direction parallel to chip 2, the shielding component consists of two shielding layers disposed opposite each other on both sides of chip 2, one located above chip 2 at a certain distance and the other located below substrate 1, as shown below. Figure 4 As shown.

[0056] Chip 2 is fixedly connected to the upper surface of substrate 1. Circuits can be laid out on circuit board 8 as needed. Each circuit has solder joints 9 at both ends. After solder joints 9 are soldered to chip 2 and substrate pins 3, chip 2 and substrate pins 3 are connected together. That is, in this embodiment, chip 2 and substrate pins 3 are connected by circuit board 8.

[0057] The function of shielding components is to provide a magnetic shielding structure for the chip, thereby enabling the magnetic components to shield against external magnetic fields.

[0058] The magnetic component also includes a package 4, which is made of resin. The commonly used package material is epoxy resin, which is inexpensive, has good heat resistance, and high mechanical strength. Of course, other types of resin can also be used, but this application does not make any specific restrictions.

[0059] This application does not specifically limit the type of circuit board 8; it can be set arbitrarily. For example, the circuit board 8 can be a flexible circuit film or a printed circuit board. A printed circuit board is a PCB (Printed Circuit Board). A flexible circuit film, also known as a flexible circuit board, has a thinner thickness than a printed circuit board, and the magnetic components using flexible circuit films are even thinner. The thickness of the circuit board is preferably below 100µm.

[0060] It should be noted that this application does not specifically limit the type of chip 2, but rather depends on the circumstances. For example, chip 2 can be a memory chip or a sensor chip.

[0061] This application does not specifically limit the substrate 1, and it can be set arbitrarily. For example, the substrate 1 is an integral magnetic shielding substrate, that is, the entire material of the substrate 1 is a magnetic shielding material, wherein the material of the substrate includes, but is not limited to, any one of silicon steel, pure iron, iron-nickel alloy, and permalloy. Alternatively, the substrate 1 includes a non-magnetic shielding substrate body 11 and a magnetic shielding pad 12 located on the upper surface of the non-magnetic shielding substrate body 11, such as... Figure 5 As shown. The non-magnetic shielding substrate body 11 is formed of a material that does not have magnetic shielding function. The material of the non-magnetic shielding substrate body can be copper, aluminum, etc. The magnetic shielding pad 12 is formed of a material that has magnetic shielding function. The material of the magnetic shielding pad includes, but is not limited to, any one of silicon steel, pure iron, iron-nickel alloy, and permalloy.

[0062] The magnetic component in this application includes a substrate 1, substrate pins 3, a chip 2 located on the upper surface of the substrate 1, a circuit board 8, and a shielding component 7. The chip 2 and substrate pins 3 are connected by solder joints 9 and circuits, that is, the chip 2 and substrate pins 3 are connected by the circuit board 8. Since the circuit board 8 is thin, the packaging height of the magnetic component can be reduced. In addition, by using the circuit board 8 instead of gold wire, the contact between the gold wire and the shielding component can be effectively avoided, thus preventing short circuits and improving the reliability of the magnetic component. Furthermore, the shielding component can be attached to the circuit board, which can also ensure the reliability of subsequent plastic encapsulation.

[0063] Based on the above embodiments, when the shielding component is a shielding frame, in order to simplify the manufacturing process of the shielding component, preferably, the shape of the shielding frame is inverted U-shaped, and the sidewalls of the inverted U-shaped shielding frame are connected to the substrate. Please refer to the schematic diagram of the shielding frame. Figure 6 It includes a cover plate and sidewalls extending downwards from the sides of the cover plate. In other embodiments, the shielding frame may also be a cuboid with openings, in which case magnetic shielding loop slots are provided around the perimeter of the circuit board.

[0064] Furthermore, to facilitate the connection between the shielding frame and the substrate, the substrate is provided with positioning marks for aligning the shielding frame. These positioning marks can be grooves, small protrusions, etc., and are not specifically limited in this application.

[0065] Based on the above embodiments, in one embodiment of this application, when the shielding component is a shielding frame, in order to improve the flexibility of the packaging between the shielding component and the substrate, the shielding frame and the substrate are packaged in an SOP (Small Out-Line Package) form.

[0066] When using SOP packaging, the substrate pins 3 are distributed on both sides of substrate 1, as follows: Figure 7 As shown, the number of substrate pins 3 can be set as needed, and this application does not limit it. At this time, the schematic diagram of circuit board 8 is as follows: Figure 8 As shown, non-directly connected lines 10 are distributed on circuit board 8, extending towards the substrate pins. The position of the magnetic shielding loop slot 13 depends on the shape of the shielding frame. Figure 8 The diagram shows the shielding frame in the shape of an inverted U. The sidewalls of the shielding frame are connected to the substrate through the magnetic shielding loop slot.

[0067] Based on the above embodiments, in another embodiment of this application, when the shielding component is a shielding frame, the shielding frame and the substrate can also be packaged in a QFP (Quad Flat Package) form.

[0068] When using QFP packaging, the substrate pins 3 are distributed around the perimeter of substrate 1, such as... Figure 9 As shown, the number of substrate pins 3 can be set as needed, and this application does not limit it. At this time, the schematic diagram of circuit board 8 is as follows: Figure 10 As shown, non-directly connected lines 10 are distributed on circuit board 8, extending in four directions towards the substrate pins. The position of the magnetic shielding loop slot 13 is determined according to the shape of the shielding frame. Figure 10 The diagram shows the shielding frame in the shape of an inverted U. The sidewalls of the shielding frame are connected to the substrate through the magnetic shielding loop slot.

[0069] When the external magnetic field is large (magnetic induction intensity above 1000 Gauss), in order to improve the shielding efficiency of the magnetic components, the material of the shielding component is a soft magnetic material with high saturation magnetization.

[0070] High saturation magnetization soft magnetic materials can be silicon steel, pure iron, iron-nickel alloys, permalloy, etc., which can improve the shielding efficiency of magnetic components by more than 70%. High saturation magnetization refers to a saturation magnetization greater than 1.6T.

[0071] When the magnetic component shields a small external magnetic field or a magnetic field generated by electromagnetic waves, the material of the shielding frame 77 can be other types of soft magnetic materials with a saturation magnetization of no more than 1.6T to produce a shielding effect, such as low carbon steel, iron-aluminum alloy, etc.

[0072] Please refer to Figure 11 This application also provides a method for encapsulating a magnetic component, comprising:

[0073] Step S101: Fix the chip on the upper surface of the substrate.

[0074] As one possible implementation, when the substrate includes a non-magnetically shielded substrate body and a magnetic shielding pad located on the upper surface of the non-magnetically shielded substrate body, fixing the chip to the upper surface of the substrate includes:

[0075] The magnetic shielding pad is placed on the upper surface of the non-magnetic shielding substrate body;

[0076] The chip is fixed to the upper surface of the magnetic shielding pad.

[0077] It is understandable that when the substrate is an integrated magnetic shielding substrate, the chip can be directly fixed to the upper surface of the substrate when connecting the chip to the substrate.

[0078] Step S102: Lay out the circuits and solder joints on the circuit board.

[0079] Step S103: Solder the two ends of the circuit on the circuit board to the chip and the substrate pin respectively through the solder joint.

[0080] One end of each line is connected to the chip via solder joints, and the other end is connected to the substrate pins via solder joints.

[0081] Step S104: Set up a shielding component to provide a magnetic shielding structure for the chip, thereby obtaining a magnetic component.

[0082] It should be noted that after the shielding components are installed, they also need to be encapsulated and ribbed to form the final magnetic assembly. The specific encapsulation and rib-cutting processes are well known to those skilled in the art, and will not be described in detail here.

[0083] To improve the packaging efficiency of magnetic components, multiple magnetic components can be packaged in batches simultaneously.

[0084] The magnetic component obtained by the packaging method of the magnetic component in this application includes a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and a shielding component. The chip and substrate pins are connected by solder joints and circuits, that is, the chip and substrate pins are connected by the circuit board. Since the circuit board is thin, the packaging height of the magnetic component can be reduced. Furthermore, by using the circuit board instead of gold wires, the influence of gold wires on the molding of the molding material is eliminated, thereby improving the reliability of the magnetic component.

[0085] When the shielding component is a shielding frame disposed above the chip and connected to the substrate, please refer to [link to relevant documentation]. Figure 12 The encapsulation methods for magnetic components include:

[0086] Step S201: Fix the chip on the upper surface of the substrate.

[0087] Step S202: A magnetic shielding circuit slot with a through-thickness is provided on the circuit board, and the circuit and the solder joint are laid out on the circuit board, the circuit including non-direct connection circuits.

[0088] It should be noted that this application does not specify the location of the magnetic shielding circuit slot, as long as it does not affect the wiring and solder joints connected to the chip.

[0089] Wherein, when the circuit board is a flexible circuit film, the step of setting the magnetic shielding loop slot with a penetrating thickness on the circuit board includes: setting the magnetic shielding loop slot with a penetrating thickness on the flexible circuit film. When the circuit board is a printed circuit board, the step of setting the magnetic shielding loop slot with a penetrating thickness on the circuit board includes: setting the magnetic shielding loop slot with a penetrating thickness on the printed circuit board.

[0090] Step S203: Solder the two ends of the circuit on the circuit board to the chip and the substrate pin respectively through the solder joint.

[0091] Step S204: Connect the shielding frame to the substrate through the magnetic shielding loop slot on the circuit board to form a magnetic shielding structure for the chip, thereby obtaining a magnetic component.

[0092] The shielding frame is fixed to the substrate, and the two can be connected by adhesive or other means.

[0093] This application does not specify a particular packaging form for the magnetic components; it depends on the circumstances. For example, SOP (Surface Mount Technology) or QFP (Quick Flat Package) packaging can be used.

[0094] To facilitate the connection between the shielding frame and the substrate, based on the above embodiments, in one embodiment of this application, before connecting the shielding frame to the substrate through the magnetic shielding loop slot located on the circuit board, the method further includes:

[0095] Positioning marks are made on the substrate;

[0096] Accordingly, connecting the shielding frame to the substrate via a magnetic shielding loop slot located on the circuit board includes:

[0097] The shielding frame is aligned with the substrate using the positioning marks, and the shielding frame is connected to the substrate through a magnetic shielding loop slot located on the circuit board.

[0098] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0099] The magnetic components and their packaging methods provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the methods and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A magnetic component, characterized in that, Includes a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and shielding components; The circuit board has circuits and solder joints at both ends of the circuits. The chip and the substrate pins are connected to the circuits through the solder joints. The shielding component provides a magnetic shielding structure for the chip. The shielding component is a shielding frame disposed above the chip and connected to the substrate; The circuit includes non-directly connected circuits; the circuit board is provided with a magnetic shielding loop slot that penetrates the thickness, and the sidewall of the shielding frame is connected to the substrate through the magnetic shielding loop slot to form the magnetic shielding structure for the chip; The substrate includes a non-magnetically shielded substrate body and a magnetically shielded pad located on the upper surface of the non-magnetically shielded substrate body.

2. The magnetic component as described in claim 1, characterized in that, The shielding frame and the substrate are packaged in SOP (Surface Opening) form.

3. The magnetic component as described in claim 1, characterized in that, The shielding frame is in the shape of an inverted U, and the sidewalls of the inverted U-shaped shielding frame are connected to the substrate.

4. The magnetic component as described in claim 1, characterized in that, The substrate is provided with positioning marks for aligning the shielding frame.

5. The magnetic component as claimed in claim 1, characterized in that, The circuit board is a flexible circuit film.

6. The magnetic component according to any one of claims 1 to 5, characterized in that, The shielding component is made of a soft magnetic material with high saturation magnetization.

7. A method for packaging a magnetic component, characterized in that, include: The chip is fixed to the upper surface of the substrate; To lay out circuits and solder joints on a circuit board; The two ends of the circuit on the circuit board are soldered to the chip and the substrate pins respectively through the solder joints; A shielding component is provided to offer a magnetic shielding structure for the chip, thereby obtaining a magnetic component; When the shielding component is a shielding frame disposed above the chip and connected to the substrate, the provision of a magnetic shielding structure for the chip by the shielding component includes: The shielding frame is connected to the substrate through a magnetic shielding loop slot located on the circuit board to form a magnetic shielding structure for the chip; Accordingly, the routing of circuits and solder joints on the circuit board includes: A magnetic shielding circuit slot with a thickness extending through the circuit board is provided on the circuit board, and the circuit and the solder joint are arranged on the circuit board, the circuit including non-direct connection circuits; When the substrate includes a non-magnetically shielded substrate body and a magnetically shielded pad located on the upper surface of the non-magnetically shielded substrate body, fixing the chip to the upper surface of the substrate includes: The magnetic shielding pad is placed on the upper surface of the non-magnetic shielding substrate body; The chip is fixed to the upper surface of the magnetic shielding pad.

8. The magnetic component encapsulation method as described in claim 7, characterized in that, The method of setting the magnetic shielding circuit slot through the thickness on the circuit board includes: A slot for the magnetic shielding circuit, extending through the thickness, is formed on the flexible circuit film.

9. The magnetic component encapsulation method as described in claim 7, characterized in that, Before connecting the shielding frame to the substrate via a magnetic shielding loop slot located on the circuit board, the method further includes: Positioning marks are made on the substrate; Accordingly, connecting the shielding frame to the substrate via a magnetic shielding loop slot located on the circuit board includes: The shielding frame is aligned with the substrate using the positioning marks, and the shielding frame is connected to the substrate through a magnetic shielding loop slot located on the circuit board.

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