Antistatic electronic device

Abstract

The application provides an anti-static electronic device, which comprises a shell, a display screen, an antenna and a plating layer, the shell comprises an insulating material and a grounding layer, the insulating material surrounds the outer periphery of the grounding layer as a frame of the electronic device, and the frame surrounds the outer periphery of the display screen; the antenna comprises a first slit and a second slit, the first slit and the second slit are located on the grounding layer, one end of the first slit is connected with a first side of the frame, the other end of the first slit is communicated with the second slit, and the second slit is parallel to the first side; the display screen comprises a conductive cloth, the conductive cloth covers the surface of the display screen facing the grounding layer; and the plating layer covers the surface of the insulating material facing the display screen, and the plating layer is electrically connected with the grounding layer. Based on the above structure, the static electricity on the screen can be effectively released, the static electricity can be drained, and the electronic device can be prevented from being damaged by static electricity.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic devices, and more particularly, to an anti-static electronic device. BACKGROUND

[0002] In the daily use of electronic devices, static electricity can cause serious damage to the electronic components of the electronic device, and even lead to functional failure of the electronic components, such as intermittent signals, noise, flashing screens, etc. Therefore, the static protection of electronic products has become an important issue. SUMMARY

[0003] The electronic device provided by the embodiments of the present application can effectively release static electricity and does not affect the radiation efficiency of the antenna.

[0004] In a first aspect, an anti-static electronic device is provided, the housing includes an insulating material and a grounding layer, the insulating material surrounds the outer periphery of the grounding layer as a frame of the electronic device, and the frame surrounds the outer periphery of the display screen.

[0005] The antenna includes a first slot and a second slot, the first slot and the second slot are located on the grounding layer, one end of the first slot is connected to a first side of the frame, the other end of the first slot is in communication with the second slot, and the second slot is parallel to the first side.

[0006] The display screen includes a conductive cloth, the conductive cloth covers the surface of the display screen facing the grounding layer; the plating layer covers the surface of the insulating material facing the display screen, and the plating layer is electrically connected to the grounding layer.

[0007] In the embodiments of the present application, the plating layer can cover the surface of the insulating material of the housing and can be electrically connected to the grounding layer, so that the static electricity on the screen and the frame can be drained along the plating layer to the grounded grounding layer, thereby solving the problem of static electricity accumulation in the electronic device to protect the display screen or other electronic components from being damaged by static electricity.

[0008] In combination with the first aspect, in a possible implementation manner of the first aspect, the plating layer and the first slot do not overlap in orthographic projection in a direction perpendicular to the display screen.

[0009] On the other hand, the plating layer and the first slot do not overlap in orthographic projection in a direction perpendicular to the display screen, that is, the plating layer can avoid the first slot of the antenna, so as to avoid affecting the consistency of the antenna and further avoid affecting the radiation efficiency of the antenna.

[0010] With reference to the first aspect, in a possible implementation form of the first aspect, the frame includes a step portion protruding from a surface of the frame towards the display screen, the display screen includes a cover plate and a display panel, the cover plate covers one side of the display panel away from the ground layer, and an edge of the cover plate is bonded to one side of the step portion towards the cover plate; the plating layer includes a first portion covering one side of the step portion towards the display panel.

[0011] In the embodiments of the present application, the plating layer can cover one side of the step portion on the frame towards the display panel and can be electrically connected to the ground layer, so that the static electricity on the screen or the frame can be drained along the plating layer to the ground layer, thereby solving the problem of static electricity release in the electronic device, preventing static electricity accumulation, and protecting the display panel or other electronic components from being damaged by static electricity.

[0012] With reference to the first aspect, in a possible implementation form of the first aspect, the insulating material also fills the first gap and the second gap, and covers a portion of the ground layer between the second gap and the frame, the plating layer further includes a second portion covering a surface of the insulating material filled in the second gap and a surface of the insulating material of the portion of the ground layer between the second gap and the frame, and the second portion is connected to the first portion.

[0013] In the embodiments of the present application, the plating layer can also cover the surface of the insulating material at the second gap and the surface of the insulating material between the second gap and the frame, thereby effectively draining static electricity and preventing static electricity accumulation, so as to ensure that the display screen or other electronic components are not damaged by static electricity.

[0014] With reference to the first aspect, in a possible implementation form of the first aspect, the plating layer further includes a third portion covering a surface of the step portion towards the cover plate, and the third portion is connected to the first portion.

[0015] In the embodiments of the present application, the plating layer is sprayed on the surface of the step portion, which can effectively improve the anti-static capability of the electronic device.

[0016] With reference to the first aspect, in a possible implementation form of the first aspect, the display panel includes a bending portion bent on one side of the display panel towards the ground layer, and the conductive cloth covers a surface of the display screen towards the ground layer, specifically, the conductive cloth covers a surface of the bending portion towards the ground layer.

[0017] In the embodiments of the present application, the bending part is a region where a driving integrated circuit chip of the display panel and a wire are located, and can be located on a side of the display panel facing the ground layer. The bending part is more sensitive to static electricity, and the conductive cloth can effectively improve the anti-static capability of the bending part.

[0018] With reference to the first aspect, in a possible implementation form of the first aspect, the plating layer is formed by cold spraying technology.

[0019] In the embodiments of the present application, the plating is performed by the cold spraying process. The plating operation can be performed in a small number of strokes to obtain a plating layer 150 meeting the requirements, for example, small thickness and small size deviation. The thickness of the plating layer 150 can be in the micron scale, thereby reserving sufficient gaps between the step part 1121 and the display panel 122. On the one hand, the black border width of the electronic device can not be affected, and the aesthetic degree of the electronic device can be ensured. On the other hand, the display panel 122 can be prevented from being damaged due to extrusion. In addition, the plating layer 150 formed by cold spraying has large surface roughness and strong adhesion, and will not fall off, thereby avoiding damage to the display panel caused by falling objects.

[0020] With reference to the first aspect, in a possible implementation form of the first aspect, the antenna is a mobile communication antenna, a Bluetooth antenna, a WIFI antenna or a GPS antenna.

[0021] With reference to the first aspect, in a possible implementation form of the first aspect, the material of the plating layer is phosphor bronze.

[0022] In the embodiments of the present application, the phosphor bronze has strong conductivity, and can effectively drain static electricity in the electronic device to prevent static electricity from gathering.

[0023] With reference to the first aspect, in a possible implementation form of the first aspect, the insulating material is plastic.

[0024] The second aspect provides an anti-static electronic device, the electronic device comprising a housing and a display screen,

[0025] The housing comprises a bezel and a middle frame, the bezel surrounds an outer periphery of the middle frame and surrounds an outer periphery of the display screen,

[0026] The middle frame comprises a ground layer and a gap, the gap penetrates the ground layer in a direction perpendicular to the display screen, the gap comprises a first gap and a second gap, one end of the first gap is connected to the bezel, the other end of the first gap is connected to the second gap, the second gap extends along the bezel connected to the first gap, and the first gap and the second gap are used to form an antenna of the electronic device.

[0027] The display screen comprises a conductive cloth, which is covered on a side of the display screen facing the middle frame, and the conductive cloth is used for preventing static electricity;

[0028] A plating layer is covered on a side of the frame facing the display screen, and the plating layer avoids the first gap, and the plating layer is electrically connected with the grounding layer.

[0029] With reference to the second aspect, in a possible implementation manner of the second aspect, the shell comprises an insulating material, the insulating material is filled in the first gap and the second gap, and the insulating material is also covered on a part of the grounding layer between the second gap and the frame,

[0030] The plating layer is also covered on a surface of the insulating material filled in the second gap and a surface of the insulating material on the part of the grounding layer between the second gap and the frame.

[0031] With reference to the second aspect, in a possible implementation manner of the second aspect, a material of the frame is the insulating material. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a structural schematic diagram of an electronic device provided by the embodiment.

[0033] Figure 2 is Figure 1 is an exploded schematic diagram of the electronic device in

[0034] Figure 3 is a structural schematic diagram of a grounding part of the electronic device provided by the embodiment.

[0035] Figure 4 is Figure 1 is a sectional schematic diagram of the electronic device in along a line A-A.

[0036] Figure 5 is a schematic diagram of positions of a non-conductive material and a plating layer in a shell.

[0037] Figure 6 shows a schematic diagram of positions of a plating layer in an electronic device.

[0038] Figure 7 is Figure 1 is a sectional schematic diagram of the electronic device in along a line B-B. DETAILED DESCRIPTION

[0039] The technical solutions in the present application will be described below with reference to the drawings.

[0040] In the embodiments of the present application, the terms "first", "second" and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more of the features.

[0041] In the description of the embodiments of the present application, the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship defined with respect to the orientation or position in which the components in the drawings are placed. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and do not indicate or imply that the device or component must have a specific orientation or be constructed and operated in a specific orientation, which can be changed accordingly according to the orientation of the components placed in the drawings, and therefore cannot be understood as a limitation on the present application.

[0042] Figure 1 A schematic structural diagram of an electronic device 100 is shown. Figure 2 An exploded schematic diagram of the electronic device 100 in Figure 1 is shown.

[0043] It should be understood that Figure 1 and Figure 2 Some components included in the electronic device 100 are only schematically shown, and the shape, size and structure of these components are not limited by Figure 1 and Figure 2 In other embodiments, the electronic device 100 can also include more or fewer components than shown in the diagram, and the embodiments of the present application are not limited. In other embodiments, the type of electronic device 100 is different, and the components included in the electronic device 100 are different, and the electronic device structure provided by the embodiments of the present application is only exemplary.

[0044] The electronic device 100 in the embodiments of the present application can be a handheld device, a vehicle-mounted device, a wearable device, a computing device or other processing device connected to a wireless modem. The electronic device 100 includes but is not limited to a cellular phone, a smart phone, a personal digital assistant (PDA) computer, a tablet computer, a portable computer, a laptop computer, a smart watch, a smart wristband, a vehicle-mounted computer and other electronic devices, etc. The specific form of the electronic device 100 is not specially limited in the embodiments of the present application, and the following is described and understood by taking the electronic device 100 as a terminal device such as a mobile phone as an example.

[0045] Referring toFigure 1 and Figure 2 The electronic device 100 can include a housing 110, a display panel (DP) 120.

[0046] The housing 110 is formed with an accommodation space for accommodating components of the electronic device 100. The housing 110 can also serve to protect the electronic device 100 and support the entire device. The display panel 120 is mounted on the housing 110, disposed in the accommodation space of the housing 110, and connected to the housing 110. The housing 110 can include a plastic portion and a metal portion, for example, the housing 110 can be a structure in which metal and plastic are cooperated with each other.

[0047] Specifically, referring to Figure 2 The housing 110 can include a middle frame 111, a bezel 112, and a back cover 113.

[0048] The middle frame 111 is a support frame located inside the electronic device 100, and can be used as a ground (GND) of the electronic device 100. The display panel 120 and the back cover 113 are disposed on both sides of the middle frame 111. The middle frame 111 can be provided with one or more positioning structures such as positioning columns, positioning holes, etc., for fixing components of the electronic device 100 mounted in the internal cavity of the entire device.

[0049] The bezel 112 is a structure surrounding the outer periphery of the electronic device 100. Referring to Figure 2 The bezel 112 can extend around the periphery of the electronic device 100 and the display panel 120, and specifically can surround four side edges of the display panel 120 to help fix the display panel 120. The bezel 112 can be a non-metallic bezel (i.e., an insulating bezel), which includes a plastic bezel, a glass bezel, a ceramic bezel, etc.

[0050] The back cover 113 is a structure disposed opposite to the display panel 120 on the electronic device 100, connected to the bezel 112, and used to seal components of the electronic device 100 inside the electronic device, while also being able to prevent dust, prevent collision, and prevent hardware scratches. The back cover 113 can be a back cover made of metal material (i.e., a metal back cover), or a back cover made of non-conductive material (i.e., a non-metal back cover), such as a glass back cover, a plastic back cover, a ceramic back cover, etc.

[0051] The middle frame 111 and the side frame 112 can be either separate or integrated; this embodiment does not limit the specific structure. When the middle frame 111 and the side frame 112 are separate, they are two distinct components of the housing 110, assembled together by snap-fit ​​or other means, and can be separated when disassembly is required. When the middle frame 111 and the side frame 112 are integrated, the connection between them cannot be separated. For example, the middle frame 111 and the side frame 112 can be manufactured using a single molding process or assembled using a permanent connection method such as welding. In the case of an integrated middle frame and side frame, the outer periphery of the middle frame can be considered as serving as the side frame of the electronic device 100.

[0052] The frame 112 and the back cover 113 can be either separate or integrated; this embodiment does not limit the specific components. When the frame 112 and the back cover 113 are separate, they are two distinct parts of the housing 110, assembled together by snap-fit ​​or other means, and can be separated when disassembly is required. When the frame 112 and the back cover 113 are integrated, the connection between them cannot be separated. For example, the frame 112 and the back cover 113 can be manufactured using a single molding process or assembled using a permanent connection method such as welding. In the case of an integrated frame and back cover, the outer periphery of the back cover 113 can be considered as the frame of the electronic device 100.

[0053] refer to Figure 2 The display screen 120 and the back cover 113 are respectively disposed on both sides of the middle frame 111 and are respectively connected to the middle frame 111. The display screen 120 can be a liquid crystal display (LCD) screen, an organic light emitting diode (OLED) screen, etc., where the OLED screen can be a flexible screen or a rigid screen. The display screen 120 can be a regular screen, or an irregularly shaped screen, a folding screen, etc. For example, the display screen 120 can rotate or fold freely to form an arc, a polygonal prism, etc.

[0054] The following is combined Figure 3 , Figure 4 and Figure 5 Describe the structure of electronic devices. Figure 3 A schematic diagram of the grounding portion provided in an embodiment of this application is shown. Figure 4 It shows Figure 1 A schematic cross-sectional view of the electronic device 100 along line AA. Figure 5 A schematic diagram showing the location of non-conductive materials and coatings in the housing is shown.

[0055] The middle frame 111 can include a ground part 1111, which is substantially plate-shaped, can be a metal material, and can be used for grounding of the electronic device. As shown in FIG. 1, a plurality of slits 130 can be present on the ground part 1111. The slits 130 pass through the ground part 1111 in a direction perpendicular to the display screen 120 (i.e., the thickness direction). In the embodiments of the present application, the ground part can also be referred to as a ground layer. Figure 3

[0056] The slits 130 can include a first slit 131 and a second slit 132. The first slit 131 can extend inward from a side of the ground part 1111, for example, the first slit 131 can extend in a direction perpendicular to the frame 112. The second slit 132 is in communication with the first slit 131, and the second slit 132 can extend in a direction perpendicular to the first slit 131.

[0057] It should be understood that one end of the first slit 131 can be connected to a first side of the frame 112. The other end of the first slit 131 is in communication with the second slit 132, wherein the second slit 132 is parallel to the first side of the frame 112.

[0058] In the embodiments of the present application, the antenna of the electronic device can be located on the longer side of the electronic device, or on the shorter side of the electronic device, i.e., the first side can be the longer side of the frame 112, or the shorter side of the frame 112. The present application does not limit this.

[0059] The first slit 131 and the second slit 132 can form a substantially L-shaped slit or a T-shaped slit.

[0060] In one possible case, when the first slit 131 and the second slit 132 form an L-shaped slit, the part of the ground part 1111 between the second slit 132 and the frame 112 can form a first metal part 11111.

[0061] In another possible case, when the first slit 131 and the second slit 132 form a T-shaped slit, the part of the ground part 1111 between the second slit 132 and the frame 112 can form a first metal part 11111 and a second metal part 11112, and the first slit 131 is located between the first metal part 11111 and the second metal part 11112, and the first metal part 11111 and the second metal part 11112 are disconnected at the first slit 131.

[0062] In some embodiments, the slits 130 can be used to form an antenna of the electronic device 100, such as a mobile communication antenna, a Bluetooth antenna, or a WIFI antenna, etc. Through the design of the slits 130, the slits 130 can divide the ground part 1111 and form one or more different antennas.

[0063] ​In some embodiments, the electronic device 100 can further include a feeding structure connected to the mainboard, which is used to feed the gap 130 to form an antenna of the electronic device 100.

[0064] In some embodiments, the first metal part 11111 and the second metal part 11112 can be used as radiators of different antennas respectively. The first metal part 11111 and the second metal part 11112 can be used to transmit and receive radio frequency signals, satellite positioning signals, WIFI signals, etc.

[0065] In the embodiments of the present application, the shell 110 can be divided into a ground part 1111 and a non-conductive material. Figure 4 and Figure 5 The position of the non-conductive material in the shell 110 is shown by shading. As Figure 5 shown, the non-conductive material can be used to form the frame 112 of the electronic device, that is, the frame 112 can be formed by the non-conductive material surrounding the outer periphery of the middle frame 111.

[0066] The non-conductive material can also be used to fill the gap 130, that is, the non-conductive material can be located in the gap 130.

[0067] Optionally, the gap 130 can also not be filled with non-conductive material, but filled with air.

[0068] In order to meet the design needs of the antenna, the first metal part 11111 or the second metal part 11112 can be difficult to expose metal, that is, the first metal part 11111 or the second metal part 11112 can be covered by the non-conductive material. In combination with Figure 3 , Figure 4 and Figure 5 , the non-conductive material can also cover one side of the first metal part 11111 or the second metal part 11112 facing the display screen 120, that is, the non-conductive material can also be located between the second gap 132 and the frame 112.

[0069] In the embodiments of the present application, the non-conductive material can be an insulator such as plastic, plastic, etc. The non-conductive material can also be referred to as an insulating material.

[0070] In combination with Figure 4 and Figure 5 , the non-conductive material in the shell 110 can be an integrally formed structure, for example, the ground part 1111 with the gap 130 can be formed by a die casting process, and then the non-conductive material is filled in the gap 130 and the frame 112 is formed by an injection molding process.

[0071] Reference is made to Figure 4The display screen 120 can include a cover plate 121 and a display panel 122. The cover plate 121 covers the display panel 122, and the display panel 122 is located on the side of the cover plate 121 facing the middle frame 111. The cover plate 121 can protect the display panel 122 and can be transparent. The cover plate 121 can be made of glass, plastic, polyimide, or the like. The display panel 122 can be used to display images and can also have a touch function.

[0072] As shown in Figure 4 The frame 112 can include a stepped portion 1121 protruding from the side of the frame 112 facing the display screen 120. The edge of the cover plate 121 near the frame 112 can cover the side of the stepped portion 1121 facing the cover plate 121. The cover plate 121 and the stepped portion 1121 can be bonded together by the adhesive 140 between the cover plate 121 and the stepped portion 1121. The side of the stepped portion 1121 facing the display panel 122 has a gap from the display panel 122.

[0073] The adhesive 140 can be a hot melt adhesive, a solid adhesive, or a mixed adhesive. For example, the adhesive 140 can be a polyurethane reactive (PUR) hot melt adhesive, a waterproof double-sided adhesive, or an epoxy AB adhesive. The present application is not limited thereto.

[0074] In the embodiments of the present application, the display screen 120 can have poor anti-static capability. For example, the display screen 120 can be an OLED screen with poor anti-static capability, or the display screen 120 and the shell can have a narrow dispensing width, or the display screen 120 and the shell can have no dispensing. Alternatively, the grounding portion cannot be exposed in the area covered by the antenna (for example, the first metal portion 11111 and the second metal portion 11112 are covered by a non-conductive material), so the area has poor anti-static capability.

[0075] In the above cases, the electronic device 100 can have static electricity problems, Figure 4 A possible static conduction path is shown. Static electricity can enter the inside of the mobile phone along the side of the frame 112 facing the display screen 120. Static electricity can cause serious damage to internal components of the mobile phone, such as frequent crashes, automatic shutdowns, poor image and sound quality, and fluctuating signals. Static electricity can also puncture the display screen and damage the display panel, causing problems such as flickering.

[0076] Figure 5 The area covered by the plating layer 150 is shown by the dashed box. Figure 4 The cross section shown by the dashed box can be Figure 5 The cross section shown by the dashed box can be

[0077] Reference Figure 4A plating layer 150 can be provided on the non-conductive material of the housing 110 facing the display screen 120, and the plating layer 150 can be electrically connected to the grounding part 1111, thereby diverting static electricity to the grounding part 1111 to achieve the effect of anti-static, so as to protect the internal components of the electronic device.

[0078] Antennas in electronic devices are generally omnidirectional antennas, similar to a spherical transmitter radiating outwards in all directions. This means that the signal radiation intensity is the same in all 360° directions across the antenna's cross-section to achieve optimal communication. For omnidirectional communication to be achieved, the area around the antenna inside the mobile phone needs to be sufficiently open, free from shielding or interference.

[0079] In some embodiments, since the antenna of the electronic device is more sensitive at the antenna slot (i.e., the first slot), the coating 150 is configured to avoid the first slot. Figure 5 The areas of the plating 150 shown by the two dashed boxes on either side of the first slot 131 are not connected at the first slot 131; that is, the plating 150 can be broken at the first slot 131. It can be understood that the orthographic projections of the plating 150 and the first slot 131 along a direction perpendicular to the display screen 120 do not overlap. This avoids affecting the consistency of the antenna, thereby avoiding affecting the radiation efficiency of the electronic device's antenna.

[0080] In some embodiments, the electronic device may include areas covered by multiple plating layers 150. The distance between any two adjacent areas covered by plating layers 150 may be less than or equal to 5 mm, or the distance between two adjacent areas covered by plating layers 150 at the first gap 131 may be less than or equal to 5 mm. In this way, even if the surface of the non-conductive material between two adjacent areas covered by plating layers 150 is not covered by plating layers 150, static electricity can still be diverted, preventing static electricity accumulation, thereby achieving the effect of anti-static properties for the entire device.

[0081] When the distance between the areas covered by two adjacent coatings 150 is less than or equal to 5 mm, an electrostatic discharge (ESD) gun can be used to test the anti-static capability of electronic equipment, detect the intrusion distance of static electricity in electronic equipment, and thus determine the anti-static capability of coating 150.

[0082] The plating layer 150 can be electrically connected to the grounding portion 1111, thereby conducting static electricity on the frame 112 along the plating layer 150 to the grounded portion 1111, thus solving the problem of electrostatic discharge in electronic devices. The plating layer 150 can be electrically connected to the grounding portion 1111 by also covering the side of the grounding portion 1111 facing the display screen 120. Alternatively, the plating layer 150 can be electrically connected to the grounding portion 1111 via a wire or metal strip.

[0083] The plating layer 150 can be a conductive material, and is usually selected from materials with strong conductivity, for example, a metal material. Preferably, the plating layer 150 is a phosphor bronze material.

[0084] The plating layer 150 can be sprayed onto the surface of the non-conductive material in the shell 110 by cold spraying (also known as metal arc spraying) or chemical plating. The cold spraying process can include masking-laser engraving-spraying-removing the masking material, that is, the shell is first covered with a masking material, then part of the masking material is removed by laser engraving to expose the area to be sprayed, then cold spraying is performed, and finally all the masking material is removed. In this way, the plating layer 150 can be accurately sprayed to the position to be sprayed.

[0085] By spraying through the cold spraying process, the spraying operation can be performed in fewer strokes to obtain a plating layer 150 that meets the requirements, for example, a smaller thickness and a smaller size deviation. The thickness of the plating layer 150 can be in the micron scale, thereby reserving sufficient clearance between the stepped portion 1121 and the display panel 122, which can not affect the black border width of the electronic device, ensure the aesthetic degree of the electronic device, and prevent the display panel 122 from being damaged due to extrusion.

[0086] In addition, the plating layer 150 sprayed by cold spraying has a large surface roughness and strong adhesion, and will not fall off. If it falls off, it will cause the screen to be damaged, resulting in display abnormalities such as blue spots, white spots, and bright spots.

[0087] Alternatively, the plating layer 150 can also be plated on the surface of the non-conductive material facing the display screen 120 by bonding, printing, spraying, or electroplating, which is not limited in the present application. It should be understood that the plating layer 150 is fixedly connected to the non-conductive material.

[0088] In the embodiments of the present application, the plating layer 150 covers the surface of the non-conductive material in the shell 110 facing the display screen 120.

[0089] In combination with Figure 4 and Figure 5 , the plating layer 150 can include a first portion 151 covering one side of the frame 112 facing the display screen 120. Specifically, the plating layer 150 can cover one side of the stepped portion 1121 facing the display panel 122.

[0090] In some embodiments, the first portion 151 is substantially annular and covers the surface of the stepped portion 1121 facing the display panel 122, and there is a breakpoint at the first gap 131. The number of first gaps 131 can be multiple, and the breakpoint of the annular plating layer 150 can correspond to each of the multiple first gaps 131.

[0091] In some embodiments, the interval at the breakpoint can be less than or equal to 5 mm. In this way, the overall anti-static effect of the electronic device can be achieved even if there is a breakpoint.

[0092] In some embodiments, the plating layer 150 can also only cover the non-conductive material facing the display panel 122. Figure 5 The stepped portion 1121 of the area shown by the dashed box is the side facing the display panel 122.

[0093] The plating layer 150 can also include a second portion 152 covering the side of the non-conductive material between the second gap 132 and the frame 112 facing the display panel 120, and covering the side of the non-conductive material filling the second gap 132 facing the display panel 120. The second portion 152 is connected to the first portion 151.

[0094] Figure 6 A schematic diagram showing the position of the plating layer in the electronic device is shown. As shown, the plating layer 150 can also include a third portion 153 covering the upper surface of the stepped portion 1121, i.e. the surface of the stepped portion 1121 facing the cover plate 121. The third portion 153 is connected to the first portion 151. Figure 6

[0095] In this embodiment, the third portion 153 of the plating layer 150 can be sprayed on the upper surface of the stepped portion 1121 first, and then the adhesive 140 can be arranged between the third portion 153 and the cover plate 121 to bond the stepped portion 1121 and the cover plate 121. In this way, the static electricity in the electronic device can be drained to the grounding portion 1111 through the plating layer 150, which can effectively increase the anti-static ability of the bonding between the display panel 120 and the shell 110. In addition, due to the characteristics of the sprayed plating layer not easy to fall off, the bonding firmness between the display panel 120 and the shell 110 can be ensured.

[0096] In some embodiments, the third portion 153 can partially cover the upper surface of the stepped portion 1121, so that the adhesive 140 can have partial direct contact with the stepped portion 1121 to increase the bonding firmness between the display panel 120 and the shell 110.

[0097] In some embodiments, the plating layer 150 can also extend to the surface of the grounding portion 1111, covering the edge of the surface of the grounding portion 1111 facing the display panel 120 to be electrically connected to the grounding portion 1111.

[0098] ​In this embodiment, the indium tin oxide (ITO) material of the capacitive touch screen absorbs antenna radiation, affecting the antenna's radiation efficiency. The coating can block some of the antenna radiation. With the coating 150 blocking some of the antenna radiation, the antenna radiation efficiency loss at the ITO material can be reduced, thereby reducing the impact of the coating 150 on the antenna radiation efficiency.

[0099] Figure 7 It shows Figure 1 A schematic cross-sectional view of electronic device 100 taken along line BB. (See diagram below.) Figure 7 As shown, the display screen 120 may also include a conductive cloth 123, which is located on the side of the display panel 122 facing the middle frame 111. The conductive cloth 123 is used to protect the display panel 122 from static electricity.

[0100] In some embodiments, the display panel 122 may further include a bent portion ( Figure 6 (Not shown in the image), the bending portion is the area where the driving integrated circuit chip and ribbon cable of the display panel 122 are located. It can be bent on the side of the display panel 122 facing the middle frame 111, and the bending portion is connected to the lower short side of the display panel 122. The conductive cloth 123 can cover the bending portion and is located between the bending portion and the middle frame 111.

[0101] Due to the presence of conductive cloth 123, electrostatic discharge can be conducted on the display screen at this location, meaning that the lower short side of the bezel 112 does not require the spray coating 150.

[0102] In this embodiment of the application, taking a mobile phone as an example, it can be agreed that the long side of the border 112 is the left and right sides, and the short side of the border 112 is the top and bottom sides.

[0103] In some embodiments, the adhesive dotting width on the upper short side of the frame 112 is relatively large, which can be greater than 0.7mm. Since the adhesive dotting is insulating, it has a great effect on blocking static charge, and static electricity cannot be transmitted to the display screen. Therefore, the upper short side of the frame 112 does not need to be coated with the plating layer 150.

[0104] In some scenarios, such as when the adhesive / application width between the display screen 120 and the housing is insufficient or there is no adhesive / application, the antistatic capability of electronic devices is weak. Spraying a coating onto the surface of the non-conductive material of the housing can effectively divert static electricity and prevent static accumulation.

[0105] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electrostatic prevention electronic device, characterized by, The electronic device comprises a housing, a display screen, an antenna and a plating layer, The housing comprises an insulating material and a ground layer, the insulating material surrounds the periphery of the ground layer as a frame of the electronic device, and the frame surrounds the periphery of the display screen; The antenna comprises a first slit and a second slit, the first slit and the second slit are located on the ground layer, one end of the first slit is connected with a first side of the frame, the other end of the first slit is communicated with the second slit, the second slit is parallel to the first side, and the first slit and the second slit penetrate the ground layer in a direction perpendicular to the display screen; The display screen comprises a conductive cloth, and the conductive cloth covers the surface of the display screen facing the ground layer; The plating layer covers the surface of the insulating material facing the display screen, the plating layer is electrically connected with the ground layer, the projection of the plating layer and the first slit along the direction perpendicular to the display screen does not overlap, and the projection of the plating layer and the second slit along the direction perpendicular to the display screen at least partially overlaps.

2. The electronic device of claim 1, wherein, The frame comprises a stepped portion, the stepped portion protrudes from the surface of the frame facing the display screen, The display screen comprises a cover plate and a display panel, the cover plate covers one side of the display panel away from the ground layer, and the edge of the cover plate is bonded to one side of the stepped portion facing the cover plate; The plating layer comprises a first part, and the first part covers one side of the stepped portion facing the display panel.

3. The electronic device according to claim 2, wherein The insulating material also fills the first slit and the second slit, and covers the part of the ground layer between the second slit and the frame, The plating layer further comprises a second part, the second part covers the surface of the insulating material filled in the second slit, and covers the surface of the insulating material covering the part of the ground layer between the second slit and the frame, and the second part is connected with the first part.

4. The electronic device of claim 3, wherein, The plating layer further comprises a third part, the third part covers the surface of the stepped portion facing the cover plate, and the third part is connected with the first part.

5. The electronic device of any of claims 2-4, wherein, The display panel comprises a bending portion, the bending portion is bent on one side of the display panel facing the ground layer, The conductive cloth covers the surface of the display screen facing the ground layer, in particular, The conductive cloth covers the surface of the bending portion facing the ground layer.

6. The electronic device of any of claims 1-5, wherein, The plating layer is formed by cold spraying or chemical plating spraying.

7. The electronic device of any of claims 1-6, wherein, The antenna is a mobile communication antenna, a Bluetooth antenna, a WIFI antenna or a GPS antenna.

8. The electronic device of any of claims 1-7, wherein, The material of the plating layer is phosphor bronze.

9. The electronic device of any of claims 1-8, wherein, The insulating material is plastic.

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