Microphones and electronic equipment

Abstract

The present invention provides a microphone and an electronic device. The microphone includes a substrate and a shell covering the substrate. The shell cooperates with the substrate to form a receiving cavity. The substrate includes a flat portion and a recessed groove. The recessed groove is formed by the substrate portion being recessed toward a side away from the receiving cavity. The flat portion is located on one side of the receiving cavity and is connected to an integrated chip. A MEMS chip is arranged in the recessed groove, and the integrated chip is at least partially located above the MEMS chip. The invention is achieved by arranging a recessed groove on the substrate. Specifically, the recessed groove is formed by the substrate portion being recessed inwardly. The recessed groove is connected to the receiving cavity. The opening of the recessed groove faces the receiving cavity. The MEMS chip is arranged in the recessed groove. The integrated chip is also arranged at the position of the substrate that is not recessed, that is, the flat portion. The microphone increases the vertical accommodation space of the microphone for accommodating the MEMS chip by arranging the recessed groove, so that the MEMS chip and the integrated chip are at least partially stacked in the vertical direction, thereby reducing the lateral size of the microphone.

Description

Technical Field

[0001] The present invention relates to the technical field of microphones, and in particular to a microphone and an electronic device. Background Art

[0002] As voice interaction technology matures, the demand for voice detection, voice wake-up, voice commands, etc. is becoming more and more widespread. The market is in urgent need of products with higher integration, better performance, smaller size, and lower power consumption. The increase in functional requirements has led to more integrated chips and larger chip sizes. Traditional packaging generally adopts a side-by-side approach, with the voice processing chip and the MEMS chip side by side, resulting in a larger lateral size of the microphone, which cannot meet market demand.

[0003] In view of this, it is necessary to provide a new microphone and electronic device to solve or at least alleviate the above technical defects. Summary of the invention

[0004] The main purpose of the present invention is to provide a microphone and an electronic device, aiming to solve the technical problem of the microphone having a large lateral size in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present invention, there is provided a microphone, comprising a substrate and a shell covering the substrate, the shell and the substrate cooperating to form a accommodating cavity, the substrate comprising a flat portion and a recessed groove, the recessed groove being formed by the substrate portion being recessed toward a side away from the accommodating cavity, the flat portion being located on one side of the accommodating cavity and connected to an integrated chip, a MEMS chip being arranged in the recessed groove, and the integrated chip being at least partially located above the MEMS chip.

[0006] In one embodiment, the depth of the recessed groove is greater than the height of the MEMS chip.

[0007] In one embodiment, a gap is formed between the upper surface of the MEMS chip and the lower surface of the integrated chip.

[0008] In one embodiment, a shielding layer is formed on the sidewall of the recessed groove.

[0009] In one embodiment, a sealing layer is filled between the MEMS chip and the sidewall of the recessed groove.

[0010] In one embodiment, the MEMS chip is connected to the substrate via a gold wire, and the integrated chip is connected to the substrate via a gold wire.

[0011] In one embodiment, the MEMS chip is connected to the integrated chip via a gold wire, and the integrated chip is connected to the substrate via a gold wire.

[0012] In one embodiment, the integrated chip includes a voice processing chip and an ASIC chip, the voice processing chip is connected to the substrate, the ASIC chip is arranged on a side of the voice processing chip away from the substrate, and the voice processing chip is at least partially located above the MEMS chip.

[0013] In one embodiment, a sound hole is disposed on the bottom surface of the recessed groove, and the sound hole is disposed facing the MEMS chip.

[0014] In one embodiment, a sound hole is provided on the housing.

[0015] According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises the microphone described above.

[0016] In the above scheme, the microphone includes a substrate and a shell covering the substrate, the shell and the substrate cooperate to form a receiving cavity, the substrate includes a flat portion and a recessed groove, the recessed groove is formed by the substrate portion being recessed toward the side away from the receiving cavity, the flat portion is located on one side of the receiving cavity and is connected to an integrated chip, a MEMS chip is arranged in the recessed groove, and the integrated chip is at least partially located above the MEMS chip. The invention is achieved by arranging a recessed groove on the substrate, specifically, the recessed groove is formed by the substrate portion being recessed inwardly, the recessed groove is connected to the receiving cavity, the opening of the recessed groove faces the receiving cavity, and the MEMS chip is arranged in the recessed groove, and the integrated chip is still arranged at the position of the substrate that is not recessed, that is, the flat portion. It should be noted that the above mentioned here refers to the position directly above at least part of the MEMS chip of the integrated chip, that is, from a top-down perspective, the integrated chip and the MEMS chip at least partially overlap. The invention replaces the technical solution of the prior art that the MEMS chip and the integrated chip are designed side by side. By providing a recessed groove, the vertical accommodation space of the microphone is increased for accommodating the MEMS chip, so that the MEMS chip and the integrated chip are at least partially stacked in the vertical direction, reducing the lateral size of the microphone. The invention has the advantage of being able to reduce the lateral size of the microphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0018] Figure 1 is a schematic cross-sectional structure diagram of a microphone according to an embodiment of the present invention;

[0019] Figure 2 is another cross-sectional structural schematic diagram of a microphone according to an embodiment of the present invention;

[0020] Figure 3 It is a partial structural schematic diagram of a microphone according to an embodiment of the present invention;

[0021] Figure 4 An exploded view of a microphone according to an embodiment of the present invention;

[0022] Figure 5 is another exploded view of the microphone according to an embodiment of the present invention;

[0023] Figure 6 is another cross-sectional structural schematic diagram of a microphone according to an embodiment of the present invention;

[0024] Figure 7 It is a schematic diagram of a part of the structure of a microphone according to an embodiment of the present invention.

[0025] Description of Figure Numbers:

[0026] 1. Shell; 2. Base plate; 21. Flat portion; 22. Concave groove; 221. Side wall; 222. Bottom surface; 3. Accommodating cavity; 4. Integrated chip; 41. Voice processing chip; 42. ASIC chip; 5. MEMS chip; 6. Shielding layer; 7. Acoustic hole; 8. Gold wire; 9. Connecting pad.

[0027] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, in the present invention, the descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0031] Furthermore, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0032] See also Figure 1 to Figure 6 According to one aspect of the present invention, the present invention provides a microphone, including a substrate 2 and a shell 1 covering the substrate 2, the shell 1 and the substrate 2 cooperate to form a accommodating cavity 3, the substrate 2 includes a flat portion 21 and a recessed groove 22, the recessed groove 22 is formed by a portion of the substrate 21 being recessed toward a side away from the accommodating cavity 3, the flat portion 21 is located on one side of the accommodating cavity 3 and is connected to an integrated chip 4, a MEMS chip 5 is arranged in the recessed groove 22, and the integrated chip 4 is at least partially located above the MEMS chip 5.

[0033] In the prior art, the substrate 2 cooperates with the housing 1 to form a receiving cavity 3, and the side of the substrate 2 located in the receiving cavity 3 is a whole flat surface, the integrated chip 4 and the MEMS chip 5 are both connected to the substrate 2, and the microphone has a large lateral dimension. This embodiment is achieved by providing a recessed groove 22 on the substrate 2, specifically, the recessed groove 22 is formed by a portion of the substrate 2 being recessed inward, the recessed groove 22 is connected to the receiving cavity 3, the opening of the recessed groove 22 faces the receiving cavity 3, and the MEMS chip 5 is arranged in the recessed groove 22, and the integrated chip 4 is still arranged at the position of the substrate 2 that is not recessed, that is, the flat portion 21. It should be noted that the above mentioned here refers to the position directly above at least part of the MEMS chip 5 of the integrated chip 4, that is, from a top view, the integrated chip 4 and the MEMS chip 5 at least partially overlap. This embodiment replaces the technical solution of the prior art in which the MEMS chip 5 and the integrated chip 4 are designed side by side. By providing the recessed groove 22, the vertical accommodation space of the microphone is increased for accommodating the MEMS chip 5, so that the MEMS chip 5 and the integrated chip 4 are at least partially stacked in the vertical direction, thereby reducing the lateral size of the microphone. This invention has the advantage of being able to reduce the lateral size of the microphone. Of course, the integrated chip 4 can also be completely arranged above the MEMS chip 5.

[0034] In one embodiment, referring to Figure 7 , Figure 7 A also indicates the height of the MEMS chip 5. Figure 7 B represents the depth of the concave groove 22, that is, the height of the side wall 221 of the concave groove 22. Figure 7C in the middle represents the length of the gap formed between the upper surface of the MEMS chip 5 and the lower surface of the integrated chip 4. The depth of the recessed groove 22 is greater than the height of the MEMS chip 5. Because the integrated chip 4 is arranged on the surface of the flat portion 21, the depth of the recessed groove 22 can be set to be greater than the height of the MEMS chip 5, so that it can be ensured that the integrated chip 4 is at least partially arranged above the MEMS chip 5, and the two chips will not interfere with each other. Of course, if the depth of the recessed groove 22 cannot be greater than the height of the MEMS chip 5 due to the thickness limitation of the substrate 2, such as the MEMS chip 5 is thicker or the substrate 2 is thinner, it is also necessary to ensure that a gap is formed between the upper surface of the MEMS chip 5 and the lower surface of the integrated chip 4 to avoid the two chips from bumping against each other or causing signal interference due to being too close. For example, a support member can be set on the flat portion 21 of the substrate 2, and the integrated chip 4 is connected to the support member to increase the height of the integrated chip 4.

[0035] Reference Figure 2 and Figure 3 In one embodiment, a shielding layer 6 is formed on the sidewall 221 of the recessed groove 22. The shielding layer 6 can play a shielding role and reduce signal interference. Specifically, the shielding layer 6 can be made of copper, which is a metal shielding layer. Of course, those skilled in the art can understand that the shielding layer 6 made of other metals or non-metals is also within the protection scope of the present invention as long as it can play a shielding role.

[0036] In one embodiment, a sealant layer is filled between the MEMS chip 5 and the sidewall 221 of the recessed groove 22. In order to further improve the sealing performance of the MEMS chip 5, a sealant layer can be filled between the MEMS and the sidewall 221 of the recessed groove 22. Specifically, the MEMS chip 5 includes a support column and a sensing film mounted on the support column, and a sealant layer can be filled between the support column and the sidewall 221 of the recessed groove 22, and the sealant layer can be epoxy resin glue.

[0037] Reference Figure 1 In one embodiment, the MEMS chip 5 is connected to the substrate 2 through the gold wire 8, and the integrated chip 4 is connected to the substrate 2 through the gold wire 8. A connection pad 9 and a line for electrical signal transmission can be set on the surface of the substrate 2 on one side of the accommodating cavity 3, and the gold wires 8 of the MEMS chip 5 and the integrated chip 4 are both connected to the connection pad 9, and a metallized via can also be set inside the substrate 2 for electrically connecting the connection pad 9 or the transmission line, so that the MEMS chip 5 and the integrated chip 4 can be electrically connected to realize signal transmission. Of course, a user pad can also be set on the outward side of the substrate 2 for connecting to the user end.

[0038] In one embodiment, the MEMS chip 5 is connected to the integrated chip 4 via a gold wire 8, and the integrated chip 4 is connected to the substrate 2 via the gold wire 8. The gold wire 8 can also be used to directly connect the pads of the MEMS chip 5 and the pads of the integrated chip 4 to achieve transmission of electrical signals.

[0039] Reference Figure 2 In one embodiment, the integrated chip 4 includes a voice processing chip 41 and an ASIC chip 42. The voice processing chip 41 is connected to the substrate 2, and the ASIC chip 42 is arranged on the side of the voice processing chip 41 away from the substrate 2. The voice processing chip 41 is at least partially located above the MEMS chip 5. The integrated chip 4 here can be a chip including the two functions of the voice processing chip 41 and the ASIC chip 42, or it can include two chips, the voice processing chip 41 and the ASIC chip 42. Since the voice processing chip 41 is relatively large in size, locating the voice processing chip 41 at least partially above the MEMS chip 5 can reduce the lateral size of the microphone.

[0040] Reference Figure 1 to Figure 3 In one embodiment, a sound hole 7 is provided on the bottom surface 222 of the recessed groove 22, and the sound hole 7 is arranged opposite to the MEMS chip 5. This embodiment corresponds to a microphone with bottom sound intake. By providing a recessed groove 22 on the substrate 2, the MEMS chip 5 is arranged in the recessed groove 22. Compared with the prior art, this example opens a recessed groove 22 on the substrate 2, so that the MEMS chip 5 does not occupy the space of the accommodating cavity 3, and the acoustic front cavity corresponding to the MEMS chip 5 occupies the volume occupied by the original substrate 2, thereby increasing the volume of the back cavity and improving the acoustic performance and anti-interference performance of the microphone. The above-mentioned substrate 2 can be a printed circuit board.

[0041] Reference Figure 6 In one embodiment, a sound hole 7 is provided on the housing 1. This embodiment corresponds to a microphone with top sound intake, that is, the sound hole 7 is provided on the housing 1 at the top of the microphone.

[0042] According to another aspect of the present invention, the present invention further provides an electronic device, the electronic device including the above-mentioned microphone. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned microphone, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which are not described one by one here. The above-mentioned electronic device can be a smart phone, a smart bracelet or an IPAD, etc.

[0043] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A microphone, characterized in that: The invention comprises a substrate and a shell covering the substrate, wherein the shell cooperates with the substrate to form a receiving cavity, the substrate comprises a flat portion and a concave groove, the concave groove is formed by the substrate portion being concave toward a side away from the receiving cavity, the flat portion is located on one side of the receiving cavity and is connected with an integrated chip, a MEMS chip is arranged in the concave groove, a sound hole is arranged on the bottom surface of the concave groove, and the sound hole is arranged facing the MEMS chip; the integrated chip is at least partially located above the MEMS chip; The depth of the recessed groove is greater than the height of the MEMS chip, and a gap is formed between the upper surface of the MEMS chip and the lower surface of the integrated chip; a support member is provided on the flat portion, and the integrated chip is connected to the support member to increase the height of the integrated chip.

2. The microphone according to claim 1, characterized in that A shielding layer is formed on the sidewall of the concave groove.

3. The microphone according to claim 1, characterized in that A sealing glue layer is filled between the MEMS chip and the sidewall of the recessed groove.

4. The microphone according to claim 1, characterized in that The MEMS chip is connected to the substrate via a gold wire, and the integrated chip is connected to the substrate via a gold wire.

5. The microphone according to claim 1, characterized in that The MEMS chip is connected to the integrated chip via a gold wire, and the integrated chip is connected to the substrate via a gold wire.

6. The microphone according to any one of claims 1 to 5, characterized in that: The integrated chip comprises a voice processing chip and an ASIC chip. The voice processing chip is connected to the substrate. The ASIC chip is arranged on a side of the voice processing chip away from the substrate. The voice processing chip is at least partially located above the MEMS chip.

7. An electronic device, characterized in that: The electronic device includes the microphone according to any one of claims 1 to 6.

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