Microphones and electronic equipment

Abstract

The present invention provides a microphone and an electronic device. The microphone includes a substrate and a shell covering the substrate. The shell cooperates with the substrate to form a housing cavity. A voice processing chip and a support member are arranged in the housing cavity. The voice processing chip is installed on the substrate. The support member includes a supporting part and a connecting part connected to each other. The supporting part is connected to the substrate. The connecting part is connected to a side of the voice processing chip away from the substrate. A MEMS chip is arranged on the connecting part. The MEMS chip is at least partially located above the voice processing chip. The microphone replaces the technical solution of the prior art in which the MEMS chip and the voice processing chip are designed side by side, and the lateral size of the microphone is reduced. The microphone has the advantage of a small lateral size.

Description

Technical Field

[0001] The present invention relates to the technical field of microphones, and in particular to a microphone and an electronic device. Background Art

[0002] As voice interaction technology matures, the demand for voice detection, voice wake-up, voice commands, etc. is becoming more and more widespread. The market is in urgent need of products with higher integration, better performance, smaller size, and lower power consumption. The increase in functional requirements has led to more integrated chips and larger chip sizes. Traditional packaging generally adopts a side-by-side approach, with the voice processing chip and the MEMS chip side by side, resulting in a larger lateral size of the microphone, which cannot meet market demand.

[0003] In view of this, it is necessary to provide a new microphone and electronic device to solve or at least alleviate the above technical defects. Summary of the invention

[0004] The main purpose of the present invention is to provide a microphone and an electronic device, aiming to solve the technical problem of the microphone having a large lateral size in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present invention, the present invention provides a microphone, comprising a substrate and a shell covering the substrate, the shell and the substrate cooperate to form a accommodating cavity, a voice processing chip and a supporting member are arranged in the accommodating cavity, the voice processing chip is installed on the substrate, the supporting member comprises a supporting part and a connecting part connected to each other, the supporting part is connected to the substrate, the connecting part is connected to a side of the voice processing chip away from the substrate, a MEMS chip is arranged on the connecting part, and the MEMS chip is at least partially located above the voice processing chip.

[0006] In one embodiment, the support portion and the connection portion cooperate to form an extension cavity, an acoustic hole connecting the extension cavity and the outside is formed on the substrate, and an inner acoustic hole is formed at a position of the connection portion facing the MEMS chip.

[0007] In one embodiment, the supporting portion includes a rectangular side enclosure with a notch, the rectangular side enclosure is arranged on one side of the voice processing chip, the notch is arranged toward the voice processing chip, and the connecting portion is a connecting plate, the connecting plate cover is arranged above the rectangular side enclosure and partially extends above the voice processing chip.

[0008] In one embodiment, the supporting portion and the substrate, and the connecting portion and the voice processing chip are all connected by a sealant.

[0009] In one embodiment, the microphone further includes an ASIC chip disposed on a side of the voice processing chip away from the substrate.

[0010] In one embodiment, the microphone further includes an encapsulation layer that encapsulates the voice processing chip and the ASIC chip.

[0011] In one embodiment, the MEMS chip and the ASIC chip are connected via gold wires, the ASIC chip and the voice processing chip are connected via gold wires, and the voice processing chip and the substrate are connected via gold wires.

[0012] In one embodiment, the support portion and the connection portion cooperate to form an extension cavity, the voice processing chip is disposed in the extension cavity, the support portion is disposed around the periphery of the voice processing chip, and the connection portion is covered on top of the support portion.

[0013] In one embodiment, the microphone further comprises an ASIC chip disposed on the top surface of the connecting portion, and the ASIC chip and the MEMS chip are disposed side by side.

[0014] In one embodiment, the MEMS chip and the ASIC chip are connected via gold wires, the ASIC chip and the substrate are connected via gold wires, and the voice processing chip and the substrate are connected via gold wires.

[0015] In one embodiment, the support portion is connected to the substrate via a sealant.

[0016] In one embodiment, a sound hole connecting the accommodating cavity and the outside is formed on the shell.

[0017] According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises the microphone described above.

[0018] In the above scheme, the microphone includes a substrate and a shell covered on the substrate, the shell cooperates with the substrate to form a housing cavity, a voice processing chip and a support member are arranged in the housing cavity, the voice processing chip is installed on the substrate, the support member includes a supporting part and a connecting part connected to each other, the supporting part is connected to the substrate, the connecting part is connected to the side of the voice processing chip away from the substrate, a MEMS chip is arranged on the connecting part, and the MEMS chip is at least partially located above the voice processing chip. By adding a support member, the support member includes a connecting part and a supporting part, the supporting part is connected to the substrate to support the connecting part, the connecting part is connected to the top surface of the voice processing chip, and then the MEMS chip is arranged on the connecting part, so that at least part of the MEMS chip is located above the voice processing chip, and the above here means that at least part of the MEMS chip is located directly above the voice processing chip, that is, from a top view, the voice processing chip and the MEMS chip at least partially overlap, the invention replaces the technical solution of the MEMS chip and the voice processing chip being designed side by side in the prior art, makes full use of the vertical space of the microphone, and reduces the lateral size of the microphone. The invention has the advantage of being able to reduce the lateral size of the microphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 An exploded view of a microphone according to an embodiment of the present invention;

[0021] Figure 2 is a schematic cross-sectional structure diagram of a microphone according to an embodiment of the present invention;

[0022] Figure 3 Schematic diagram of another cross-sectional structure of a microphone according to an embodiment of the present invention (including the encapsulating rubber layer);

[0023] Figure 4 It is a schematic diagram of a three-dimensional structure of a support member according to an embodiment of the present invention;

[0024] Figure 5 is another cross-sectional structural schematic diagram of a microphone according to an embodiment of the present invention;

[0025] Figure 6 FIG. 4 is another schematic cross-sectional structure diagram of the microphone according to the embodiment of the present invention.

[0026] Description of Figure Numbers:

[0027] 1. Substrate; 2. Shell; 3. Accommodating cavity; 4. Support member; 41. Support part; 411. Rectangular side enclosure; 42. Connecting part; 421. Connecting plate; 5. Voice processing chip; 6. MEMS chip; 7. ASIC chip; 8. Extension cavity; 9. Acoustic hole; 10. Inner acoustic hole; 11. Sealant; 12. Encapsulating adhesive layer; 13. Gold wire.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in the present invention, the descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0032] Furthermore, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] See also Figure 1 to Figure 6 According to one aspect of the present invention, the present invention provides a microphone, including a substrate 1 and a shell 2 covering the substrate 1, the shell 2 cooperates with the substrate 1 to form a accommodating cavity 3, a voice processing chip 5 and a support member 4 are arranged in the accommodating cavity 3, the voice processing chip 5 is installed on the substrate 1, the support member 4 includes a supporting portion 41 and a connecting portion 42 connected to each other, the supporting portion 41 is connected to the substrate 1, the connecting portion 42 is connected to a side of the voice processing chip 5 away from the substrate 1, a MEMS chip 6 is arranged on the connecting portion 42, and the MEMS chip 6 is at least partially located above the voice processing chip 5.

[0034] It should be noted that, due to the large size of the voice processing chip 5, especially the large lateral size, the voice processing chip 5 and the MEMS chip 6 are installed side by side on the substrate 1 in the prior art, resulting in a large lateral size of the microphone in the horizontal direction, which increases the lateral size of the microphone. In the above embodiment, by adding a support member 4, the support member 4 includes a connecting portion 42 and a supporting portion 41, the supporting portion 41 is connected to the substrate 1 for supporting the connecting portion 42, and the connecting portion 42 is connected to the top surface of the voice processing chip 5, and then the MEMS chip 6 is arranged on the connecting portion 42, so that at least part of the MEMS chip 6 is located above the voice processing chip 5, and the above here means that at least part of the MEMS chip 6 is located directly above the voice processing chip 5, and the two are not on the same horizontal plane, and from a top view, the voice processing chip 5 and the MEMS chip 6 at least partially overlap, and this embodiment replaces the technical solution of the prior art in which the MEMS chip 6 and the voice processing chip 5 are designed side by side, and fully utilizes the vertical space of the microphone, reducing the lateral size of the microphone. This embodiment has the advantage of being able to reduce the lateral size of the microphone.

[0035] Reference Figure 2 to Figure 5 In one embodiment, the support portion 41 and the connecting portion 42 cooperate to form an extension cavity 8, a sound hole 9 connecting the extension cavity 8 and the outside is formed on the substrate 1, and an inner sound hole 10 is formed at the position of the connecting portion 42 facing the MEMS chip 6. When the microphone is a bottom-input microphone, that is, the sound hole 9 is arranged on the substrate 1. The support member 4 blocks the sound from reaching the MEMS chip 6. In order to ensure that the sound signal entering from the sound hole 9 can be transmitted to the MEMS chip 6, a hollow extension cavity 8 can be formed on the support member 4, and an inner sound hole 10 is arranged between the extension cavity 8 and the MEMS chip 6. The sound enters from the sound hole 9, and then passes through the extension cavity 8 and the inner sound hole 10 to reach the MEMS chip 6 and is received by the MEMS chip 6.

[0036] The specific structure of the support member 4 can mainly include the following two forms:

[0037] Please refer to Figure 2 to Figure 4, the first structural form is: the support part 41 includes a rectangular side 411 with a notch, the rectangular side 411 is arranged on one side of the voice processing chip 5, and the notch is arranged toward the voice processing chip 5, and the connecting part 42 is a connecting plate 421, and the connecting plate 421 is covered on the rectangular side 411 and partially extends above the voice processing chip 5. The microphone also includes an ASIC chip 7 arranged on the side of the voice processing chip 5 away from the substrate 1. In this embodiment, the support member 4 is only arranged on one side of the voice processing chip 5, and the support member 4 only plays the role of supporting and transmitting the sound signal. In order to ensure that the sound signal does not leak, the support part 41 and the substrate 1, and the connecting part 42 and the voice processing chip 5 can be connected by a sealant 11. It should be noted that the voice processing chip 5 can integrate the functions of the original ASIC chip 7, or a separate ASIC chip 7 can be set. When a separate ASIC chip 7 is set, the ASIC chip 7 can be set on the top surface of the voice processing chip 5.

[0038] Reference Figure 3 Furthermore, the microphone also includes an encapsulation layer 12 that encapsulates the voice processing chip 5 and the ASIC chip 7. The encapsulation layer 12 can be used to encapsulate the integrated circuit part, play a certain shielding role, and reduce interference such as light noise and circuit radiation noise. The encapsulation layer 12 here can be epoxy resin glue. At the same time, in order to ensure the effective transmission of the signal, the MEMS chip 6 and the ASIC chip 7 are connected by gold wires 13, the ASIC chip 7 and the voice processing chip 5 are connected by gold wires 13, and the voice processing chip 5 and the substrate 1 are connected by gold wires 13.

[0039] Reference Figure 5 The second structural form is: the support part 41 and the connecting part 42 cooperate to form an extension cavity 8, the voice processing chip 5 is arranged in the extension cavity 8, the support part 41 is arranged around the voice processing chip 5, and the connecting part 42 is covered on the support part 41. This design can not only reduce the lateral size of the microphone, but also completely cover the voice processing chip 5 with the support part 4, or isolate the voice processing chip 5 in the extension cavity 8 between the support part 4 and the substrate 1, which can play a role in isolating the voice processing chip 5 separately, thereby reducing interference such as light noise and circuit radiation noise.

[0040] Reference Figure 5 Further, the microphone further includes an ASIC chip 7 disposed on the top surface of the connecting portion 42, and the ASIC chip 7 is disposed side by side with the MEMS chip 6. The ASIC chip 7 can be disposed outside the extension cavity 8, that is, disposed on the top surface of the connecting portion 42, and disposed side by side with the MEMS chip 6. Compared with disposing the ASIC chip 7 in the extension cavity 8, this embodiment makes full use of the vertical space of the microphone, and can reduce the lateral size of the microphone without increasing the vertical size of the microphone.

[0041] Reference Figure 5 Furthermore, the MEMS chip 6 and the ASIC chip 7 are connected by the gold wire 13, the ASIC chip 7 and the substrate 1 are connected by the gold wire 13, and the voice processing chip 5 and the substrate 1 are connected by the gold wire 13. Because the support 4 physically isolates the voice processing chip 5 and the ASIC chip 7, the ASIC chip 7 and the voice processing chip 5 cannot be directly connected by the gold wire 13, and the signal transmission cannot be realized. Therefore, the ASIC chip 7 and the substrate 1, the voice processing chip 5 and the substrate 1 are connected by the gold wire 13 respectively, and the signal connection between the ASIC chip 7 and the voice processing chip 5 is realized by the wiring inside the substrate 1. Similarly, in order to ensure the sealing of the extension cavity 8, prevent sound leakage and improve the shielding performance, the connecting part 42 can be connected to the substrate 1 by the sealant 11, and the side of the voice processing chip 5 close to the sound hole 9 is connected to the connecting part 42 by the sealant 11.

[0042] Reference Figure 6 In one embodiment, a sound hole 9 is formed on the housing 2 to connect the accommodating cavity 3 with the outside. The present invention can be applied to a microphone with top sound output, that is, the sound hole 9 is arranged on the housing 2.

[0043] According to another aspect of the present invention, the present invention further provides an electronic device, the electronic device including the above-mentioned microphone. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned microphone, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which are not described one by one here. The above-mentioned electronic device can be a smart phone, a smart watch, a smart bracelet or an IPAD, etc.

[0044] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A microphone, characterized in that: The invention comprises a substrate and a shell covering the substrate, wherein the shell cooperates with the substrate to form a receiving cavity, wherein a voice processing chip and a supporting member are arranged in the receiving cavity, wherein the voice processing chip is mounted on the substrate, wherein the supporting member comprises a supporting portion and a connecting portion connected to each other, wherein the supporting portion is connected to the substrate, wherein the connecting portion is connected to a side of the voice processing chip away from the substrate, wherein a MEMS chip is arranged on the connecting portion, and wherein the MEMS chip is at least partially located above the voice processing chip; The support part and the connecting part cooperate to form an extension cavity, a sound hole connecting the extension cavity and the outside is formed on the substrate, and an inner sound hole is formed at a position of the connecting part facing the MEMS chip; The supporting portion includes a rectangular side enclosure with a notch, the rectangular side enclosure is arranged on one side of the voice processing chip, the notch is arranged toward the voice processing chip, and the connecting portion is a connecting plate, the connecting plate cover is arranged above the rectangular side enclosure and partially extends above the voice processing chip.

2. The microphone according to claim 1, characterized in that The supporting part and the substrate, as well as the connecting part and the voice processing chip are all connected by sealant.

3. The microphone according to claim 2, characterized in that The microphone further comprises an ASIC chip which is arranged on a side of the voice processing chip away from the substrate.

4. The microphone according to claim 3, characterized in that The microphone also includes an encapsulation layer that wraps the voice processing chip and the ASIC chip.

5. The microphone according to claim 3, characterized in that The MEMS chip and the ASIC chip are connected via gold wires, the ASIC chip and the voice processing chip are connected via gold wires, and the voice processing chip and the substrate are connected via gold wires.

6. The microphone according to claim 1, characterized in that The support portion is connected to the substrate via a sealant.

7. The microphone according to claim 1, characterized in that The shell is provided with a sound hole communicating with the accommodating cavity and the outside.

8. An electronic device, characterized in that: The electronic device comprises the microphone according to any one of claims 1 to 7.

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