Array antenna module and preparation method thereof, phased array antenna system
By integrating the feeding structure, phase shifting structure and radiation structure on the glass substrate in the phased array antenna system, the problem of increasing the conversion connection structure when the substrate changes is solved, improving the routing flexibility and accuracy, and reducing the preparation cost.
Patent Information
- Application Number
- CN202180000209.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-02-09
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2041-02-09
AI Technical Summary
The existing phased array antenna system needs to add a conversion connection structure when the substrate changes, resulting in poor trace flexibility, low accuracy and high preparation cost.
By integrating the feeding structure, phase shifting structure and radiation structure on the glass substrate, a three-layer glass substrate architecture is adopted to achieve direct connection and integration of feeding, phase shifting and radiation functions.
Improves the routing flexibility and accuracy of the array antenna module, reduces the production cost, and supports direct connections between different structures.
Smart Images

Figure CN115428260B_ABST
Abstract
Description
Technical Field
[0001] This article relates to but is not limited to the field of communication technology, and in particular to an array antenna module and a preparation method thereof, and a phased array antenna system. Background Art
[0002] Phased array antennas are antennas that change the shape of their radiation patterns by controlling the feeding phase of the radiating elements in the array antenna. Controlling the phase can change the direction of the maximum value of the antenna pattern to achieve the purpose of beam scanning. Phased array antennas have many advantages, such as small size, low profile, fast response speed, wide scanning range, and high scanning accuracy. Phased array antennas have a very wide range of applications. For example, they can be used in communications between vehicles and satellites, array radars for unmanned driving, or array radars for security protection. Summary of the invention
[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
[0004] Embodiments of the present disclosure provide an array antenna module and a method for manufacturing the same, and a phased array antenna system.
[0005] On the one hand, an embodiment of the present disclosure provides an array antenna module, comprising: a feeding structure, a phase shifting structure and a radiating structure; the feeding structure is connected to the phase shifting structure, and the phase shifting structure is connected to the radiating structure; the feeding structure, the phase shifting structure and the radiating structure are all arranged on a glass substrate.
[0006] In some exemplary embodiments, the glass substrate includes: a first substrate, a second substrate located on one side of the first substrate, and a third substrate located on a side of the second substrate away from the first substrate. The feeding structure and the phase shifting structure are arranged between the first substrate and the second substrate; and the radiation structure is arranged at least on one side of the third substrate.
[0007] In some exemplary embodiments, the phase shift structure includes: a first dielectric layer located between the first substrate and the second substrate, a first conductive layer located on a side of the second substrate close to the first dielectric layer, and a second conductive layer located on a side of the first substrate close to the first dielectric layer. The orthographic projection of the second conductive layer on the second substrate partially overlaps with the orthographic projection of the first conductive layer on the second substrate.
[0008] In some exemplary embodiments, the first conductive layer includes: first signal lines, and the second conductive layer includes: periodically arranged first electrodes; and the orthographic projections of the first signal lines and the first electrodes on the second substrate overlap.
[0009] In some exemplary embodiments, the feeding structure includes: a second dielectric layer located between the first substrate and the second substrate, and a third conductive layer located on one side of the second dielectric layer; the third conductive layer and the first conductive layer or the second conductive layer are in the same layer structure. The orthographic projection of the second dielectric layer on the second substrate does not overlap with the orthographic projection of the first dielectric layer on the second substrate; the first dielectric layer and the second dielectric layer are isolated by a sealant.
[0010] In some exemplary embodiments, the first medium layer includes a liquid crystal material, and the second medium layer includes air.
[0011] In some exemplary embodiments, the radiation structure includes: a fourth conductive layer located on a side of the third substrate away from the second substrate, and a first ground layer located on a side of the third substrate close to the second substrate.
[0012] In some exemplary embodiments, the first ground layer has at least one opening; an orthographic projection of the opening on the second substrate overlaps with an orthographic projection of the fourth conductive layer on the second substrate, and overlaps with an orthographic projection of the first conductive layer on the second substrate.
[0013] In some exemplary embodiments, the third conductive layer includes: a second signal line, wherein the second signal line and the first ground layer form a parallel-fed microstrip structure or a series-fed microstrip structure.
[0014] In some exemplary embodiments, the feeding structure further includes: a second grounding layer located on a side of the first substrate away from the second dielectric layer.
[0015] In some exemplary embodiments, the phase shifting structure includes at least one phase shifter having a first phase shift output terminal and a second phase shift output terminal, the first phase shift output terminal and the second phase shift output terminal are arranged opposite to each other, and the phase difference between the first phase shift output terminal and the second phase shift output terminal is 180 degrees.
[0016] In some exemplary embodiments, the radiation structure includes at least one radiation element subarray, and the phase shifter corresponds to the radiation element subarray one by one. The radiation element subarray includes at least one first radiation element and at least one second radiation element, and the first phase shift output end of the phase shifter is configured to feed the first radiation element of the corresponding radiation element subarray, and the second phase shift output end of the phase shifter is configured to feed the second radiation element of the corresponding radiation element subarray.
[0017] On the other hand, an embodiment of the present disclosure provides a phased array antenna system, comprising: a feed network and the array antenna module as described above. The feed network is connected to the array antenna module, and the feed network and the array antenna module are arranged on different substrates.
[0018] In some exemplary embodiments, the feeding network is disposed on a printed circuit board, and a ground trace of the printed circuit board is connected to a first ground layer of the array antenna module via a conductive adhesive.
[0019] On the other hand, an embodiment of the present disclosure provides a method for preparing an array antenna module, which is used to prepare the array antenna module as described above, including: forming a feeding structure and a phase shifting structure between a first substrate and a second substrate; forming a radiation structure on at least one side of a third substrate; and arranging the third substrate on a side of the second substrate away from the first substrate.
[0020] Other aspects will be apparent upon reading and understanding the drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings are used to provide a further understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure. The shape and size of one or more components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the contents of the present disclosure.
[0022] Figure 1 A circuit diagram of an array antenna module according to at least one embodiment of the present disclosure;
[0023] Figure 2 A schematic diagram of the structure of an array antenna module according to at least one embodiment of the present disclosure;
[0024] Figure 3 A partial cross-sectional schematic diagram of an array antenna module according to at least one embodiment of the present disclosure;
[0025] Figure 4 A schematic plan view of a feeding structure according to at least one embodiment of the present disclosure;
[0026] Figure 5 is another plan view schematically showing a feeding structure according to at least one embodiment of the present disclosure;
[0027] Fig. 6A is a plan view of a radiation unit subarray according to at least one embodiment of the present disclosure;
[0028] Figure 6B for Fig. 6A A local plan schematic diagram of a first ground layer and a first conductive layer corresponding to a radiation element subarray;
[0029] Figure 7 A simulated radiation pattern of a radiation element subarray of at least one embodiment of the present disclosure;
[0030] Figure 8is another partial cross-sectional schematic diagram of the array antenna module of at least one embodiment of the present disclosure;
[0031] Fig. 9 A schematic diagram of a phased array antenna system according to at least one embodiment of the present disclosure;
[0032] Fig.10 An exemplary diagram of a phased array antenna system according to at least one embodiment of the present disclosure;
[0033] Fig.11 Another exemplary diagram of a phased array antenna system according to at least one embodiment of the present disclosure;
[0034] Fig.12 A partial cross-sectional schematic diagram of a phased array antenna system according to at least one embodiment of the present disclosure;
[0035] Fig.13 A simulation schematic diagram of a phased array antenna system according to at least one embodiment of the present disclosure;
[0036] Fig.14 is a schematic diagram of an electronic device according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION
[0037] The embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The embodiments can be implemented in a plurality of different forms. A person skilled in the art can easily understand the fact that the method and content can be transformed into one or more forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily.
[0038] In the drawings, the size of one or more components, the thickness of a layer, or an area is sometimes exaggerated for the sake of clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to the size, and the shapes and sizes of the components in the drawings do not reflect the true proportions. In addition, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.
[0039] The ordinal numbers such as "first", "second", and "third" in the present disclosure are provided to avoid confusion of constituent elements, and are not intended to limit the quantity. The "plurality" in the present disclosure means a quantity of two or more than two.
[0040] In the present disclosure, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing the present specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which the constituent elements are described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.
[0041] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the meanings of the above terms in the present disclosure can be understood according to the circumstances.
[0042] In the present disclosure, "electrical connection" includes the situation where components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having one or more functions.
[0043] In the present disclosure, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, a state where the angle is greater than -5° and less than 5° may be included. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, a state where the angle is greater than 85° and less than 95° may be included.
[0044] The terms “about” and “substantially” in the present disclosure do not strictly define the limits, but allow for a range of process and measurement errors.
[0045] At least one embodiment of the present disclosure provides an array antenna module, comprising: a feeding structure, a phase shifting structure and a radiating structure. The feeding structure is connected to the phase shifting structure, and the phase shifting structure is connected to the radiating structure. The feeding structure, the phase shifting structure and the radiating structure are all arranged on a glass substrate.
[0046] The array antenna module provided in this embodiment can improve routing flexibility, support direct connection between different structures, and avoid adding conversion connection structures due to substrate changes by integrating the feeding structure, phase shifting structure and radiation structure on the glass substrate. In addition, the accuracy of the array antenna module can be improved and the manufacturing cost can be reduced.
[0047] In some exemplary embodiments, the glass substrate includes: a first substrate, a second substrate located on one side of the first substrate, and a third substrate located on a side of the second substrate away from the first substrate. The feeding structure and the phase shifting structure are arranged between the first substrate and the second substrate; and the radiation structure is arranged on at least one side of the third substrate. In this exemplary embodiment, the feeding, phase shifting and radiation functions are realized by adopting a three-layer glass substrate architecture. However, this embodiment is not limited to this.
[0048] In some exemplary embodiments, the phase shift structure includes: a first dielectric layer located between a first substrate and a second substrate, a first conductive layer located on a side of the second substrate close to the first dielectric layer, and a second conductive layer located on a side of the first substrate close to the first dielectric layer. The orthographic projection of the second conductive layer on the second substrate partially overlaps with the orthographic projection of the first conductive layer on the second substrate. In some examples, the first dielectric layer includes a liquid crystal material. However, this embodiment is not limited to this. In some examples, the first dielectric layer may be made of other materials similar to liquid crystal materials that can change the dielectric constant based on changes in the electric field. For example, the first dielectric layer may include a ferroelectric material.
[0049] In some exemplary embodiments, the first conductive layer includes a first signal line, and the second conductive layer includes: a first electrode arranged periodically; the first signal line and the first electrode overlap in their orthographic projections on the second substrate. In this exemplary embodiment, by adjusting the voltage difference loaded on the first signal line and the first electrode, an electric field is formed between the first signal line and the first electrode, which can drive the liquid crystal molecules of the first dielectric layer to deflect, thereby changing the dielectric constant of the liquid crystal material and changing the capacitance value of the capacitor formed by the overlap of the first signal line and the first electrode. When the microwave signal is transmitted in the first dielectric layer, a corresponding relative phase change, i.e., a phase shift, will occur. In some examples, when the microwave signal that generates a phase shift is transmitted to the radiation structure, it can be radiated through the radiation structure.
[0050] In some exemplary embodiments, the feeding structure includes: a second dielectric layer located between the first substrate and the second substrate, and a third conductive layer located on one side of the second dielectric layer; the third conductive layer is a same-layer structure as the first conductive layer or the second conductive layer. The orthographic projection of the second dielectric layer on the second substrate does not overlap with the orthographic projection of the first dielectric layer on the second substrate, and the first dielectric layer and the second dielectric layer are isolated by a sealant. In some examples, the third conductive layer is located on a side of the second substrate close to the second dielectric layer, and the third conductive layer can be a same-layer structure as the first conductive layer. In some examples, the third conductive layer is located on a side of the first substrate close to the second dielectric layer, and the third conductive layer can be a same-layer structure as the second conductive layer. However, this embodiment is not limited to this.
[0051] In some exemplary embodiments, the second dielectric layer includes air. However, this embodiment is not limited to this. For example, the second dielectric layer may include an inert gas.
[0052] In this exemplary embodiment, the feeding structure and the phase shifting structure are arranged in parallel between the first substrate and the second substrate, which can realize direct connection between the feeding structure and the phase shifting structure and reduce costs. The first dielectric layer and the second dielectric layer are isolated by sealant, which can prevent the first dielectric layer from affecting the feeding structure and causing uneven power distribution.
[0053] In some exemplary embodiments, the radiating structure includes: a fourth conductive layer located on a side of the third substrate away from the second substrate, and a first ground layer located on a side of the third substrate close to the second substrate. In this exemplary embodiment, the radiating structure may be disposed on two opposite sides of the third substrate. The radiating structure, the feeding structure, and the phase shifting structure may share the first ground layer.
[0054] In some exemplary embodiments, the first ground layer has at least one opening. The orthographic projection of the opening on the second substrate overlaps with the orthographic projection of the fourth conductive layer on the second substrate, and overlaps with the orthographic projection of the first conductive layer on the second substrate. In this example, by providing an opening in the first ground layer, energy is transmitted between the phase shifting structure and the radiating structure, and coupled feeding is achieved. However, this embodiment is not limited to this. For example, the phase shifting structure can be directly connected to the radiating structure to achieve side feeding.
[0055] In some exemplary embodiments, the third conductive layer includes: a second signal line. The second signal line and the first ground layer form a parallel-fed microstrip structure or a series-fed microstrip structure. However, this embodiment is not limited to this. For example, the corresponding feeding formation can be selected according to design requirements and application scenarios. For example, in a scenario with low transmission loss and no size and weight requirements, the feeding structure can be implemented by a waveguide.
[0056] In some exemplary embodiments, the feeding structure includes: a second dielectric layer located between the first substrate and the second substrate, a third conductive layer located on one side of the second dielectric layer, and a second ground layer located on a side of the first substrate away from the second dielectric layer. In this exemplary embodiment, by providing the second ground layer, the loss of the feeding structure can be reduced and the anti-interference performance of the feeding structure can be improved.
[0057] In some exemplary embodiments, the phase shift structure may include at least one phase shifter, the phase shifter having a first phase shift output terminal and a second phase shift output terminal, the first phase shift output terminal and the second phase shift output terminal are arranged opposite to each other, and the phase difference between the first phase shift output terminal and the second phase shift output terminal is 180 degrees. In this exemplary embodiment, the phase shifter operates in a differential mode state, and the two phase shift output terminals can be directly led out to feed the radiation structure.
[0058] In some exemplary embodiments, the radiation structure includes at least one radiation element subarray, and the phase shifter corresponds to the radiation element subarray one by one. The radiation element subarray includes at least one first radiation element and at least one second radiation element. The first phase-shifted output end of the phase shifter is configured to feed the first radiation element of the corresponding radiation element subarray, and the second phase-shifted output end of the phase shifter is configured to feed the second radiation element of the corresponding radiation element subarray. In some examples, the first radiation element and the second radiation element are arranged in a direction perpendicular to the scanning direction, and the first phase-shifted output end and the second phase-shifted output end of the phase shifter are arranged relative to each other in a direction perpendicular to the scanning direction.
[0059] The array antenna module of this embodiment is described below by means of multiple examples.
[0060] Figure 1 The present invention is a circuit diagram of an array antenna module according to at least one embodiment of the present invention. Figure 2 FIG. 1 is a schematic diagram of the structure of an array antenna module according to at least one embodiment of the present disclosure. Figure 1 and Figure 2 As shown, the array antenna module of this exemplary embodiment includes: a feeding structure 11, a phase shifting structure 12 and a radiating structure 13. The feeding structure 11 is connected to the phase shifting structure 12, and the phase shifting structure 12 is connected to the radiating structure 13. The feeding structure 11 is configured to divide one input signal into multiple outputs. The feeding structure 11 includes a feeding input terminal 111 and a plurality of feeding output terminals 112. For example, the feeding structure 11 can divide one signal into eight equal energy outputs. However, this embodiment is not limited to this. In some examples, the feeding structure can divide one signal into multiple unequal energy outputs.
[0061] In some exemplary embodiments, the phase shifting structure 12 includes a plurality of phase shifters 120. The plurality of phase shifters 120 are connected to the plurality of feeding output terminals 112 of the feeding structure 11 in a one-to-one correspondence. The plurality of phase shifters 120 are arranged in sequence along the second direction Y. Figure 1 and Figure 2 In the figure, the feeding structure 11 includes eight feeding output terminals 112 and eight phase shifters 120. However, this embodiment is not limited to this.
[0062] In some exemplary embodiments, the radiation structure 13 includes a plurality of radiation element subarrays 130. The plurality of radiation element subarrays 130 are connected to the plurality of phase shifters 120 in a one-to-one correspondence. Each radiation element subarray 130 may include a first radiation element 131 and a second radiation element 132. The first radiation element 131 and the second radiation element 132 in the radiation element subarray 130 may be arranged in sequence along the first direction X, and the plurality of radiation element subarrays 130 may be arranged in sequence along the second direction Y. The radiation elements in the radiation structure 13 may be arranged in a 2*8 array. However, this embodiment is not limited thereto. For example, the number and arrangement of the radiation elements may be adjusted according to requirements such as beam width.
[0063] In some exemplary embodiments, Figure 2 As shown, each phase shifter 120 has a phase shift input terminal, a first phase shift output terminal 121 and a second phase shift output terminal 122. The phase shift input terminal is connected to the feed output terminal 112 of the feed structure 11. In this example, the phase shifter 120 operates in a differential mode state, and the phase difference between the first phase shift output terminal 121 and the second phase shift output terminal 122 is 180 degrees. The first phase shift output terminal 121 and the second phase shift output terminal 122 can be directly led out to feed the radiation structure. The first phase shift output terminal 121 is configured to provide energy to the first radiation unit 131, and the second phase shift output terminal 122 is configured to provide energy to the second radiation unit 132. The first phase shift output terminal 121 and the second phase shift output terminal 122 are arranged opposite to each other in the first direction X. By arranging the first phase shift output terminal 121 and the second phase shift output terminal 122 opposite to each other, the wiring arrangement between the phase shifter 120 and the radiation unit is facilitated.
[0064] In some exemplary embodiments, Figure 2 As shown, the first phase-shift output terminal 121 is located at a side of the second phase-shift output terminal 122 away from the feeding structure 11. The arrangement direction of the ends of the first phase-shift output terminal 121 and the second phase-shift output terminal 122 is parallel to the first direction X.
[0065] In some exemplary embodiments, Figure 2As shown, the first phase-shifted output terminal 121 has a first routing line and a first end. The phase-shifted input terminal and the first end of the phase shifter are connected by the first routing line. The first routing line may include a first straight line segment, a first curved line segment and a first transition segment connected in sequence. The first straight line segment is connected to the phase-shifted input terminal, the first curved line segment is connected between the first transition segment and the first straight line segment, and the first transition segment is connected to the first end. The width of the first transition segment may gradually increase along the direction approaching the first end. For example, the first end may have a rectangular shape. The orthographic projection of the first end of the first phase-shifted output terminal 121 on the second substrate overlaps with the orthographic projection of the first radiation unit 131 on the second substrate. However, this embodiment does not limit the form of the first routing line, as long as the impedance matching between the phase-shifted input terminal and the first end can be achieved, and the first end and the second end are arranged opposite to each other and the phase difference is 180 degrees. In some examples, the shape and wiring of the first phase-shifted output terminal may be adjusted according to the actual application scenario.
[0066] In some exemplary embodiments, Figure 2 As shown, the second phase-shifted output terminal 122 has a second routing line and a second end. The phase-shifted input terminal and the second end of the phase shifter are connected by a second routing line. The second routing line may include a second curved segment, a second straight segment, a third curved segment and a second transition segment connected in sequence. The second curved segment is connected to the phase-shifted input terminal, the second straight segment is connected between the second curved segment and the third curved segment, the third curved segment is connected between the second transition segment and the second straight segment, and the second transition segment is connected to the second end. The width of the second transition segment may gradually increase along the direction approaching the second end. For example, the second end may have a rectangular shape. The orthographic projection of the second end of the second phase-shifted output terminal 122 on the second substrate overlaps with the orthographic projection of the second radiation unit 132 on the second substrate. However, the present embodiment does not limit the form of the second routing line, as long as the impedance matching between the phase-shifted input terminal and the second end can be achieved, and the first end and the second end are arranged opposite to each other and the phase difference is 180 degrees. In some examples, the shape and wiring of the second phase-shifted output terminal may be adjusted according to the actual application scenario.
[0067] In the present disclosure, the width refers to a characteristic dimension in a direction perpendicular to the extension direction of a trace.
[0068] Figure 3 It is a partial cross-sectional schematic diagram of an array antenna module according to at least one embodiment of the present disclosure. Figure 3 for Figure 2Schematic cross-sectional view along the PP direction in . In some exemplary embodiments, in a plane perpendicular to the array antenna module, the array antenna module includes: a first substrate 21, a second substrate 22 located on one side of the first substrate 21, and a third substrate 23 located on a side of the second substrate 22 away from the first substrate 21. The feeding structure 11 and the phase shifting structure 12 are arranged between the first substrate 21 and the second substrate 22. The radiation structure is arranged on opposite sides of the third substrate 23. The radiation structure is arranged on a side of the third substrate 23 close to the second substrate 22 and a side away from the second substrate 22. In this example, the first substrate 21, the second substrate 22 and the third substrate 23 are all glass substrates. In some examples, the thickness of the first substrate 21, the second substrate 22, and the third substrate 23 can each be 100 to 1000 microns. However, this embodiment is not limited to this.
[0069] This exemplary embodiment adopts a three-layer glass substrate architecture to integrate the feeding structure, phase shifting structure and radiation structure on the glass substrate. By setting the array antenna module as a whole on the glass substrate, the routing flexibility is high, and different structures can be directly connected, avoiding the conversion connection structure required for setting the array antenna module on different substrates, thereby improving the accuracy of the array antenna module and reducing the preparation cost.
[0070] In some exemplary embodiments, Figure 3 As shown, the phase shift structure 12 includes: a first dielectric layer 211 disposed between a first substrate 21 and a second substrate 22, a first conductive layer 201 disposed on a side of the second substrate 22 close to the first dielectric layer 211, and a second conductive layer 202 disposed on a side of the first substrate 21 close to the first dielectric layer 211. The orthographic projection of the second conductive layer 202 on the second substrate 22 partially overlaps with the orthographic projection of the first conductive layer 201 on the second substrate 22. The feeding structure 11 includes: a second dielectric layer 212 disposed between the first substrate 21 and the second substrate 22, and a third conductive layer 203 disposed on a side of the second substrate 22 close to the second dielectric layer 212. The radiation structure includes: a fourth conductive layer 204 disposed on a side of the third substrate 23 away from the second substrate 22, and a first grounding layer 205 located on a side of the third substrate 23 close to the second substrate 22. The first grounding layer 205 may include a planar grounding electrode. However, this embodiment is not limited to this. In this exemplary embodiment, the feeding structure 11, the phase shift structure 12, and the radiation structure 13 share the first grounding layer 205 as a ground plane.
[0071] In some exemplary embodiments, the first dielectric layer 211 includes a liquid crystal material. The liquid crystal molecules in the first dielectric layer 211 may be positive liquid crystal molecules or negative liquid crystal molecules. However, this embodiment is not limited to this. In some examples, the first dielectric layer may be made of other materials similar to liquid crystal materials that can change the dielectric constant based on the change of the electric field. For example, the first dielectric layer may include a ferroelectric material.
[0072] In some exemplary embodiments, the second dielectric layer 211 includes air or an inert gas, but this embodiment is not limited thereto.
[0073] In some exemplary embodiments, a support column may be provided on the surface of the first substrate 21 facing the second substrate 22 to maintain the distance between the first substrate 21 and the second substrate 22 and ensure the surface uniformity of the box body formed by the first substrate 21 and the second substrate 22. The support column may be made of an organic material. However, this embodiment is not limited to this. For example, a protrusion may be provided on the surface of the second substrate 22 facing the first substrate 21.
[0074] In some exemplary embodiments, the first substrate 21 and the second substrate 22 are arranged in a box, and a first region and a second region are isolated between the first substrate 21 and the second substrate 22 by a sealant, and a first dielectric layer 211 is formed in the first region, and a second dielectric layer 212 is formed in the second region. A phase shifter is formed in the first region by using the first dielectric layer 211, the first conductive layer 201, and the second conductive layer 202, and a feeding structure is formed in the second region by using the second dielectric layer 212 and the third conductive layer 203. By isolating the first region and the second region by a sealant, the influence of the liquid crystal deflection in the first dielectric layer on the non-uniformity of power distribution can be avoided, and the amount of liquid crystal material used can be reduced, thereby reducing costs.
[0075] In some exemplary embodiments, the first conductive layer 201 may include: a first signal transmission line, and the second conductive layer 202 may include: a first electrode arranged periodically. The first signal transmission line and the first ground layer 205 form a microstrip transmission structure. However, this embodiment is not limited to this. For example, the phase shifter may adopt a transmission structure such as a stripline, a coplanar waveguide, or a substrate integrated waveguide.
[0076] In this exemplary embodiment, the first signal transmission line and the first electrode overlap to form a variable capacitor, and the voltage difference loaded on the first conductive layer and the second conductive layer can be adjusted to drive the liquid crystal molecules in the first dielectric layer 211 to deflect, thereby changing the dielectric constant of the first dielectric layer and the capacitance value, so that the microwave signal generates a corresponding phase shift when propagating in the first dielectric layer, and then transmits it to the radiation unit and radiates it through the radiation unit to achieve beam scanning. However, this embodiment is not limited to this.
[0077] Figure 4 FIG. 1 is a schematic plan view of a feeding structure of at least one embodiment of the present disclosure. In some exemplary embodiments, Figure 4 As shown, the third conductive layer 203 includes: a second signal line, which forms a parallel-fed microstrip structure with the first ground layer 205. In this example, the 50Ω impedance of the feeding input end and the feeding output end of the feeding structure is converted by a 1 / 4 wavelength transmission line.
[0078] Figure 5 FIG. 1 is another schematic plan view of a feeding structure of at least one embodiment of the present disclosure. In some exemplary embodiments, Figure 5 As shown, the third conductive layer 203 includes: a second signal line, and the second signal line and the first ground layer 205 form a series-fed microstrip structure. In this example, the output amplitude phase difference of each feeding output port can be measured separately for compensation.
[0079] Fig. 6A FIG. 1 is a plan view of a radiation unit subarray according to at least one embodiment of the present disclosure. Fig. 6A As shown, the first radiation unit 131 and the second radiation unit 132 are arranged in sequence along the first direction X. In some examples, the first direction X is a vertical direction of the scanning direction, and the second direction Y is a scanning direction, and the fundamental mode and the high-order mode can be excited respectively to achieve a scanning angle of ±45 degrees. In this example, the first radiation unit 131 and the second radiation unit 132 may include patch electrodes. The shape of the patch electrode may be a rectangle. However, this embodiment is not limited to this. For example, the shape of the patch electrode may be a triangle or other shapes.
[0080] In some exemplary embodiments, two openings are provided on the patch electrodes of the first radiation unit 131 and the second radiation unit 132, and the opening positions are the positions where the current of the radiation units is maximum. Fig. 6A As shown, the two openings on the patch electrode may be symmetrical along the center line of the patch electrode in the second direction Y, and the center line is parallel to the first direction X. The two openings may be rectangular. However, this embodiment is not limited to this. Figure 2As shown, the orthographic projections of the first phase-shifted output terminal 121 of the phase shifter and the two openings of the patch electrode of the first radiation unit 131 on the third substrate do not overlap, and the orthographic projection of the first phase-shifted output terminal 121 on the third substrate is located between the two openings of the patch electrode of the first radiation unit 131. The orthographic projections of the second phase-shifted output terminal 122 of the phase shifter and the two openings of the patch electrode of the second radiation unit 132 on the third substrate do not overlap, and the orthographic projection of the second phase-shifted output terminal 122 on the third substrate is located between the two openings of the patch electrode of the second radiation unit 132. In this exemplary embodiment, by providing openings on the radiation unit, the transmission path can be increased, the distance between the radiation units can be reduced, and the unit size can be reduced.
[0081] Figure 6B for Fig. 6A A partial plan view of the first ground layer and the first conductive layer corresponding to the radiation element subarray. Figure 6B As shown, the planar grounding electrode of the first grounding layer 205 has a plurality of openings. The plurality of openings include: a first opening 2501 corresponding to the first phase-shifted output terminal 121, and a second opening 2502 corresponding to the second phase-shifted output terminal 122. The first opening 2501 and the second opening 2502 are symmetrically distributed along a symmetry axis parallel to the second direction Y. The orthographic projection of the first opening 2051 on the second substrate overlaps with the orthographic projection of the patch electrode (located in the fourth conductive layer) of the first radiation unit on the second substrate, and overlaps with the orthographic projection of the first phase-shifted output terminal 121 (located in the first conductive layer) of the phase shifter on the second substrate. The orthographic projection of the second opening 2052 on the second substrate overlaps with the orthographic projection of the patch electrode (located in the fourth conductive layer) of the first radiation unit on the second substrate, and overlaps with the orthographic projection of the second phase-shifted output terminal 122 (located in the first conductive layer) of the phase shifter on the second substrate. The first opening 2501 and the second opening 2502 may both be rectangular. However, this embodiment is not limited thereto. For example, the opening may be in other shapes.
[0082] In this exemplary embodiment, the phase shifter can couple and feed the radiation unit through the opening on the ground electrode to transmit energy to the radiation unit.
[0083] Figure 7 The simulated radiation pattern of the radiation unit subarray of at least one embodiment of the present disclosure. Figure 7 The horizontal axis is the pitch angle θ, which represents the angle formed with the z-axis, and the vertical axis is the actual gain. Figure 7 The solid line in the figure represents the azimuth When θ is θ, the actual gain value curve of the radiation unit subarray corresponding to different values is the xoz plane radiation pattern. Figure 7 The dotted line in the figure represents the azimuth When θ is greater than 1, the actual gain value curve of the radiation unit subarray corresponding to different values of θ is the yoz plane radiation pattern. Figure 7 The radiation characteristics of the radiation unit subarray can be characterized, and it has a large 2db loss direction angle in the 0° direction.
[0084] In some exemplary embodiments, during the preparation of the array antenna module, a second conductive layer is formed on the first substrate, a first conductive layer and a third conductive layer are formed on the second substrate, and the first substrate and the second substrate are arranged in a box so that the second conductive layer is opposite to the first conductive layer and the third conductive layer. Then, a first region and a second region are formed between the first substrate and the second substrate by a sealant, and a liquid crystal material is injected into the first region to form a first dielectric layer, and the air in the second region is used as a second dielectric layer. A fourth conductive layer and a first grounding layer are formed on both sides of the third substrate, respectively. Then, a sheet-shaped bonding glue is used on one side of the first grounding layer to attach the third substrate to the side of the second substrate away from the first substrate, so that the third substrate is fixed to the box body formed by the second substrate and the first substrate. The bonding glue is not conductive. In some examples, alignment marks can be set on the second substrate and the third substrate for charge coupled device (CCD) positioning to ensure high bonding alignment accuracy. In some examples, the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer and the first grounding layer can be made of metal materials, such as aluminum, silver, nickel, molybdenum or iron. However, this embodiment is not limited to this.
[0085] Figure 8 FIG. 1 is another partial cross-sectional schematic diagram of an array antenna module according to at least one embodiment of the present disclosure. In some exemplary embodiments, Figure 8 As shown, the feeding structure 11 includes: a second dielectric layer 212 located between the first substrate 21 and the second substrate 22, a third conductive layer 203 located on one side of the second dielectric layer 212, and a second grounding layer 206 located on the side of the first substrate 21 away from the second dielectric layer 212. The third conductive layer 203 and the first conductive layer 201 are in the same layer structure. The orthographic projections of the third conductive layer 203 and the second grounding layer 206 on the second substrate 22 overlap. In some examples, the second grounding layer 206 can be a planar electrode. However, this embodiment is not limited to this.
[0086] In this exemplary embodiment, the feeding structure has two ground planes, one of which is a first ground layer 205 shared with the radiation structure, and the other ground plane is realized by forming a second ground layer 206 on a side of the first substrate 21 away from the second dielectric layer 212. In this exemplary embodiment, by providing a double-layer ground plane, the loss of the feeding structure can be reduced and the ability to resist external interference can be improved.
[0087] The remaining structures of the array antenna module in this exemplary embodiment can refer to the description of the above embodiment, so they are not repeated here.
[0088] At least one embodiment of the present disclosure further provides a method for preparing an array antenna module, which is used to prepare the array antenna module as described above. The method comprises: forming a feeding structure and a phase shifting structure between a first substrate and a second substrate; forming a radiation structure on at least one side of a third substrate; and arranging the third substrate on a side of the second substrate away from the first substrate.
[0089] The preparation method of this embodiment can refer to the description of the aforementioned embodiment, so it will not be described again here.
[0090] At least one embodiment of the present disclosure further provides a phased array antenna system, comprising: a feed network and at least one array antenna module as described in the above embodiment. The feed network is connected to the array antenna module, and the feed network and the array antenna module are arranged on different substrates.
[0091] In some exemplary embodiments, the feeding network is disposed on a printed circuit board, and a ground trace of the printed circuit board is connected to a first ground layer of the array antenna module via a conductive adhesive.
[0092] In some exemplary embodiments, the feeding network includes: a feeding unit and at least one signal conditioning unit, the feeding unit is connected to the signal conditioning unit; and the signal conditioning unit is connected to the array antenna modules in a one-to-one correspondence.
[0093] Fig. 9 is a schematic diagram of a phased array antenna system according to at least one embodiment of the present disclosure. In some exemplary embodiments, Fig. 9 As shown, the phased array antenna system includes: a plurality of array antenna modules 10 arranged on a glass substrate, and a feed network 30 and a plurality of signal adjustment units 40 arranged on a printed circuit board (PCB). The plurality of array antenna modules 10 and the plurality of signal adjustment units 40 are connected one-to-one. The feed network 30 is connected to the plurality of signal adjustment units 40. In some examples, the feed network 30 can divide one input signal into sixteen output signals, and the number of array antenna modules 10 and signal adjustment units 40 can be 16 each. However, this embodiment is not limited to this.
[0094] In this exemplary embodiment, by adding a signal adjustment unit 40 between the feed network 30 and the array antenna module 10, the amplitude of each output signal of the feed network 10 can be controlled by the signal adjustment unit 40, thereby reducing the impact of material loss on the performance of the phased array antenna system.
[0095] Fig.10is an example diagram of a phased array antenna system according to at least one embodiment of the present disclosure. In some exemplary embodiments, Fig.10 As shown, multiple array antenna modules 10 are connected to multiple signal conditioning units in a one-to-one correspondence. The array antenna module 10 is configured to receive a signal. The signal conditioning unit includes: an attenuation (ATT) 401 and a low noise amplifier (LNA) 402. The feed network 30 is connected to the attenuator 401, the attenuator 401 is connected to the low noise amplifier 402, and the low noise amplifier 402 is connected to the array antenna module 10.
[0096] Fig.11 FIG. 1 is another example diagram of a phased array antenna system according to at least one embodiment of the present disclosure. In some exemplary embodiments, Fig.11 As shown, multiple array antenna modules 10 are connected to multiple signal conditioning units in a one-to-one correspondence. The array antenna module 10 is configured to transmit a signal. The signal conditioning unit includes a power amplifier (PA, Power Amplifier) 403, which is connected between the feed network 30 and the array antenna module 10.
[0097] In some exemplary embodiments, the phased array antenna system may include an array antenna module configured to receive signals and an array antenna module configured to transmit signals. However, this embodiment is not limited thereto.
[0098] Fig.12 FIG. 1 is a partial cross-sectional schematic diagram of a phased array antenna system according to at least one embodiment of the present disclosure. In some exemplary embodiments, Fig.12 As shown, the feeding structure and phase shifting structure of the array antenna module are arranged between the first substrate 21 and the second substrate 22, and the radiation structure is arranged on opposite sides of the third substrate 23. A first grounding layer 205 is arranged on the side of the third substrate 23 close to the second substrate 22, and a fourth conductive layer 204 is arranged on the side of the third substrate 23 away from the second substrate 22. The third substrate 23 can be fixed on the side of the second substrate 22 away from the first dielectric layer 211 and the second dielectric layer 212 by a sheet-like non-conductive bonding glue 502. The feeding network and the signal conditioning unit can be arranged on a printed circuit board (PCB) 50. Among them, the signal routing layer of the printed circuit board 50 can be connected to the feeding structure of the array antenna module, for example, the signal routing layer and the feeding structure are connected by conductive glue. The grounding trace of the printed circuit board 50 can be connected to the first grounding layer 205 of the array antenna module by conductive glue 501 to achieve complete conductivity of the ground plane. The printed circuit board 50 is connected to the connection structure 60 to support the connection of the phased array antenna system with other components. In some examples, the connection structure 60 can be a radio frequency coaxial connector SMA. However, this embodiment is not limited to this.
[0099] The description of the cross-sectional structure of the array antenna module of this embodiment can refer to the description of the aforementioned embodiment, so it will not be repeated here.
[0100] The phased array antenna system provided by this exemplary embodiment can realize a beam scanning function in a certain dimension, has a lower profile, and can save costs.
[0101] Fig.13 The simulated radiation pattern of the phased array antenna system according to at least one embodiment of the present disclosure. Fig.13 The horizontal axis represents the pitch angle θ, which represents the angle formed with the z-axis, and the vertical axis represents the actual gain. Fig.13 The dotted line in the figure shows that the multi-channel output energy of the feeding network is consistent. The solid line shows the simulation result after adding a window function at the front end of the array antenna module so that the multi-channel energy is set according to a certain rule.
[0102] In this exemplary embodiment, by setting a signal adjustment unit, window function loading can be implemented to change the superposition state of radiation waves in space, thereby achieving the effect of reducing side lobes and widening beam width.
[0103] Fig.14 FIG. 1 is a schematic diagram of an electronic device according to at least one embodiment of the present disclosure. Fig.14 As shown, this embodiment provides an electronic device 91, including: a phased array antenna system 910. The phased array antenna system 910 is the phased array antenna system provided in the above embodiment. The electronic device 91 can be: a smart phone, a navigation device, a game console, a television (TV), a car audio, a tablet computer, a personal multimedia player (PMP), a personal digital assistant (PDA) and any other product or component with a communication function. However, this embodiment is not limited to this.
[0104] The drawings in this disclosure only relate to the structures involved in this disclosure, and other structures may refer to the general design. In the absence of conflict, the embodiments of this disclosure and the features in the embodiments may be combined with each other to obtain new embodiments.
[0105] Those skilled in the art should understand that the technical solutions of the present disclosure may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present disclosure, and all should be included in the scope of the claims of the present disclosure.
Claims
1. An array antenna module, comprising: Feed structure, phase shift structure and radiation structure; The feeding structure is connected to the phase-shifting structure, and the phase-shifting structure is connected to the radiating structure; The feeding structure, the phase shifting structure and the radiation structure are all arranged on a glass substrate; The glass substrate comprises: a first substrate, a second substrate located at one side of the first substrate, and a third substrate located at a side of the second substrate away from the first substrate; The feeding structure and the phase shifting structure are arranged between the first substrate and the second substrate; the radiating structure is arranged at least on one side of the third substrate; The phase shift structure includes: a first dielectric layer located between the first substrate and the second substrate, a first conductive layer located on a side of the second substrate close to the first dielectric layer, and a second conductive layer located on a side of the first substrate close to the first dielectric layer; the orthographic projection of the second conductive layer on the second substrate partially overlaps with the orthographic projection of the first conductive layer on the second substrate; The feeding structure includes: a second dielectric layer located between the first substrate and the second substrate, and a third conductive layer located on one side of the second dielectric layer; the third conductive layer and the first conductive layer or the second conductive layer are in the same layer structure; the orthographic projection of the second dielectric layer on the second substrate does not overlap with the orthographic projection of the first dielectric layer on the second substrate; the first dielectric layer and the second dielectric layer are isolated by a sealant.
2. The array antenna module according to claim 1, wherein: The first conductive layer includes: a first signal line, and the second conductive layer includes: a first electrode arranged periodically; the orthographic projections of the first signal line and the first electrode on the second substrate overlap.
3. The array antenna module according to claim 1, wherein: The first medium layer includes liquid crystal material, and the second medium layer includes air.
4. The array antenna module according to claim 1, wherein: The radiation structure includes: a fourth conductive layer located on a side of the third substrate away from the second substrate, and a first ground layer located on a side of the third substrate close to the second substrate.
5. The array antenna module according to claim 4, wherein: The first grounding layer has at least one opening; the orthographic projection of the opening on the second substrate overlaps with the orthographic projection of the fourth conductive layer on the second substrate, and overlaps with the orthographic projection of the first conductive layer on the second substrate.
6. The array antenna module according to claim 4, wherein: The third conductive layer includes: a second signal line, and the second signal line and the first ground layer form a parallel-fed microstrip structure or a series-fed microstrip structure.
7. The array antenna module according to claim 4, wherein: The feeding structure further includes: a second grounding layer located on a side of the first substrate away from the second dielectric layer.
8. The array antenna module according to claim 1, wherein: The phase shifting structure includes at least one phase shifter, which has a first phase shifting output terminal and a second phase shifting output terminal, the first phase shifting output terminal and the second phase shifting output terminal are arranged opposite to each other, and the phase difference between the first phase shifting output terminal and the second phase shifting output terminal is 180 degrees.
9. The array antenna module according to claim 8, wherein: The radiation structure comprises at least one radiation unit subarray, and the phase shifters correspond one-to-one to the radiation unit subarrays; The radiation element subarray includes at least one first radiation element and at least one second radiation element. The first phase-shifted output end of the phase shifter is configured to feed the first radiation element of the corresponding radiation element subarray, and the second phase-shifted output end of the phase shifter is configured to feed the second radiation element of the corresponding radiation element subarray.
10. A phased array antenna system, comprising: A feeding network and at least one array antenna module according to any one of claims 1 to 9; The feeding network is connected to the array antenna module, and the feeding network and the array antenna module are arranged on different substrates.
11. The phased array antenna system according to claim 10, wherein: The feeding network is arranged on a printed circuit board, and the grounding trace of the printed circuit board is connected to the first grounding layer of the array antenna module through a conductive adhesive.
12. A method for preparing an array antenna module, for preparing the array antenna module according to any one of claims 1 to 9, the method comprising: forming a feeding structure and a phase shifting structure between the first substrate and the second substrate; forming a radiation structure on at least one side of the third substrate; The third substrate is disposed on a side of the second substrate away from the first substrate.
Citation Information
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