Display panel and spliced panel

Abstract

The embodiment of the application discloses a display panel and a spliced panel, a driving substrate comprises a second surface, the second surface is a side surface of the driving substrate; a second packaging structure comprises at least one plating layer and at least one glue layer, one of the plating layer and the glue layer directly covers the second surface of the driving substrate; in the vertical direction of the second surface of the driving substrate, the plating layer and the glue layer are arranged alternately; the plating layer and the glue layer are both organic layers. The plating layer and the glue layer of the organic material used in the application can flatten the roughness of the second surface on the one hand, improve the integrity of the plating layer and the glue layer, and further improve the packaging effect; on the other hand, the two are arranged alternately and closely connected, which can further improve the packaging effect; in addition, the setting of the plating layer can also thin the thickness of the second packaging structure, and the glue layer also has the function of absorbing external stress and is used for protecting the plating layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel. BACKGROUND

[0002] In the mini and micro light emitting diode (LED) panel, a thin film transistor is needed to conduct current and display the panel. The semiconductor layer of the thin film transistor is sensitive to oxygen and water vapor environment, which will make the electrical property of the thin film transistor unstable and cause panel abnormalities; therefore, the panel needs to be packaged.

[0003] The conventional packaging in the prior art includes front packaging and side packaging. The front packaging refers to packaging the front of the driving backboard, which can adopt a glass packaging method. The side packaging refers to packaging the side of the driving backboard, which usually adopts glue packaging. However, the water vapor transmission rate (WVTR) of the glue is relatively large, and the glue needs to be made thicker. The side packaging also adopts inorganic film layer packaging, but the packaging effect is not very stable, and after a long time of research and a large number of experiments, it is finally found that because the panel is cut, the roughness of the side is large (Ra≥1.6 microns), and when the inorganic film layer is plated, the inorganic film layer is prone to cracks and voids and other defects, which affects the packaging effect. SUMMARY

[0004] The display panel and the spliced panel provided by the embodiments of the present application can solve the technical problem that the side packaging thickness of the display panel is large and the packaging effect is not ideal when the inorganic film layer is used for packaging.

[0005] The display panel provided by the embodiments of the present application comprises:

[0006] A driving substrate, the driving substrate comprises a first surface and a second surface, the extension direction of the first surface and the extension direction of the second surface intersect, the first surface is the front surface of the driving substrate, and the second surface is the side surface of the driving substrate;

[0007] A light emitting device, the light emitting device is arranged on the first surface of the driving substrate;

[0008] A first packaging structure, the first packaging structure is arranged on the first surface and encapsulates the light emitting device;

[0009] A second packaging structure, the second packaging structure comprises at least one plating layer and at least one glue layer, one of the plating layer and the glue layer directly covers the second surface of the driving substrate; in the vertical direction of the second surface of the driving substrate, the plating layer and the glue layer are arranged alternately; and the plating layer and the glue layer are both organic layers.

[0010] Optionally, in some embodiments of the present application, the outermost layer of the second encapsulation structure is the glue layer.

[0011] Optionally, in some embodiments of the present application, the thickness of the plating layer is less than or equal to 50 microns.

[0012] Optionally, in some embodiments of the present application, the first encapsulation structure comprises a first positive encapsulation layer and a second positive encapsulation layer, the elastic modulus of the first positive encapsulation layer is less than the elastic modulus of the second positive encapsulation layer; the first positive encapsulation layer is an organic layer, covering the first surface of the driving substrate and encapsulating the light emitting device;

[0013] The plating layer comprises a first plating layer, and the glue layer comprises a first glue layer, the first plating layer directly covers the second surface of the driving substrate and the side surface of the first positive encapsulation layer, and the first plating layer covers the surface of the first positive encapsulation layer away from the driving substrate;

[0014] The second positive encapsulation layer is arranged on the surface of the first plating layer away from the driving substrate, and the first glue layer covers the side surface of the first plating layer and the side surface of the second positive encapsulation layer.

[0015] Optionally, in some embodiments of the present application, the plating layer further comprises a second plating layer, and the second plating layer covers at least the side surface of the first glue layer and the surface of the second positive encapsulation layer away from the driving substrate.

[0016] Optionally, in some embodiments of the present application, the glue layer further comprises a second glue layer, and the second glue layer covers the side surface of the second plating layer.

[0017] Optionally, in some embodiments of the present application, the first encapsulation structure comprises a first positive encapsulation layer and a second positive encapsulation layer, the elastic modulus of the first positive encapsulation layer is less than the elastic modulus of the second positive encapsulation layer; the first positive encapsulation layer is an organic layer, covering the first surface of the driving substrate and encapsulating the light emitting device;

[0018] The plating layer comprises a first plating layer, and the glue layer comprises a first glue layer, the first glue layer directly covers the second surface of the driving substrate and the side surface of the first positive encapsulation layer, and the first plating layer at least covers the side surface of the first glue layer and the surface of the first positive encapsulation layer away from the driving substrate;

[0019] The second positive encapsulation layer is arranged on the surface of the first plating layer away from the driving substrate.

[0020] Optionally, in some embodiments of the present application, the plating layer further comprises a second plating layer, and the glue layer further comprises a second glue layer;

[0021] The second glue layer covers the side surface of the first plating layer and the side surface of the second positive packaging layer, and the second plating layer covers at least the side surface of the second glue layer and the side surface of the second positive packaging layer away from the driving substrate.

[0022] Optionally, in some embodiments of the present application, the first packaging structure comprises a first positive packaging layer and a second positive packaging layer, the elastic modulus of the first positive packaging layer is less than the elastic modulus of the second positive packaging layer; the first positive packaging layer is an organic layer, and covers the first surface of the driving substrate and encapsulates the light-emitting device; the second positive packaging layer covers the side surface of the first positive packaging layer away from the driving substrate.

[0023] The plating layer comprises a first plating layer, and the glue layer comprises a first glue layer, the first plating layer directly covers the second surface of the driving substrate and the side surface of the first positive packaging layer, and the first glue layer covers the side surface of the first plating layer.

[0024] Optionally, in some embodiments of the present application, the surface roughness of the plating layer and the surface roughness of the glue layer are respectively less than the surface roughness of the second surface.

[0025] Correspondingly, the present application also provides a spliced panel comprising at least two display panels of any of the above embodiments, and the display panels are spliced.

[0026] The display panel of the present application comprises a driving substrate, a light-emitting device, a first packaging structure and a second packaging structure; the driving substrate comprises a first surface and a second surface, the first surface and the second surface intersect, the first surface is the front surface of the driving substrate, and the second surface is the side surface of the driving substrate; the light-emitting device is arranged on the first surface of the driving substrate; the first packaging structure covers the first surface and encapsulates the light-emitting device; the second packaging structure comprises at least one plating layer and at least one glue layer, one of the plating layer and the glue layer directly covers the second surface of the driving substrate; in the vertical direction of the second surface of the driving substrate, the plating layer and the glue layer are arranged alternately; the plating layer and the glue layer are both organic layers.

[0027] In the display panel of the present application, the cutting process of the panel makes the roughness of the second surface (side surface) of the driving substrate larger, so that the plating layer and the glue layer of organic material can on the one hand flatten the roughness of the second surface, improve the integrity of the plating layer and the glue layer, and further improve the packaging effect; on the other hand, the close connection of the alternately arranged plating layer and glue layer can further improve the packaging effect; in addition, the arrangement of the plating layer can also thin the thickness of the second packaging structure, and the glue layer also has the function of absorbing external stress to protect the plating layer. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0029] Figure 1 is a structural schematic diagram of a display panel provided by the first embodiment of the present application;

[0030] Figure 2 is a schematic diagram of preparation step B1 of the display panel provided by the first embodiment of the present application;

[0031] Figure 3 is a schematic diagram of preparation step B2 of the display panel provided by the first embodiment of the present application;

[0032] Figure 4 is a schematic diagram of preparation step B3 of the display panel provided by the first embodiment of the present application;

[0033] Figure 5 is a schematic diagram of preparation step B4 of the display panel provided by the first embodiment of the present application;

[0034] Figure 6 is a schematic diagram of preparation step B5 of the display panel provided by the first embodiment of the present application;

[0035] Figure 7 is a schematic diagram of preparation step B6 of the display panel provided by the first embodiment of the present application;

[0036] Figure 8 is a schematic diagram of preparation step B7 of the display panel provided by the first embodiment of the present application;

[0037] Figure 9 is a structural schematic diagram of a display panel provided by the second embodiment of the present application;

[0038] Figure 10 is a structural schematic diagram of a display panel provided by the third embodiment of the present application;

[0039] Figure 11 is a structural schematic diagram of a display panel provided by the third embodiment of the present application; DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application. In addition, it should be understood that the specific implementation described herein is only used to illustrate and explain the present application, and is not used to limit the present application. In the present application, the orientation words such as "upper" and "lower" generally refer to the upper and lower directions of the device in the actual use or working state, and the specific direction is the direction of the drawing surface in the drawings; and "inner" and "outer" refer to the contour of the device.

[0041] The present application provides a display panel and a spliced panel, which are described in detail below. It should be noted that the description order of the following embodiments is not limited as the preferred order of the embodiments.

[0042] Please refer to Figure 1 The first embodiment of the present application provides a display panel 100, which includes a driving substrate 10, a light emitting device 20, a first encapsulation structure 30 and a second encapsulation structure 40. The driving substrate 10 includes a first surface 1a and a second surface 1b, and the extension direction of the first surface 1a and the extension direction of the second surface 1b intersect. The first surface 1a is the front surface of the driving substrate 10. The second surface 1b is the side surface of the driving substrate 10. The light emitting device 20 is arranged on the first surface of the driving substrate 10. The first encapsulation structure 30 is covered on the first surface 1a and encapsulates the light emitting device 20. The second encapsulation structure 40 includes at least one plating layer 41 and at least one glue layer 42, and one of the plating layer 41 and the glue layer 42 directly covers the second surface 1b of the driving substrate 10.

[0043] In the vertical direction of the second surface 1b of the driving substrate 10, the plating layer 41 and the glue layer 42 are arranged alternately. The plating layer 41 and the glue layer 42 are both organic layers.

[0044] In the display panel 100 of the first embodiment of the present application, because the cutting process in the process of the panel makes the roughness of the second surface 1b (side surface) of the driving substrate 10 larger, the plating layer 41 and the glue layer 42 made of organic material are used, which can on the one hand flatten the roughness of the second surface 1b, improve the integrity of the plating layer 41 and the glue layer 42, and further improve the encapsulation effect; on the other hand, the close connection of the alternately arranged plating layer 41 and glue layer 42 can further improve the encapsulation effect; in addition, the arrangement of the plating layer 41 can also thin the thickness of the second encapsulation structure 40, and the glue layer 42 also has the function of absorbing external stress to protect the plating layer 41.

[0045] Optionally, the number of the plating layer 41 can be one, two or more than three. The number of the glue layer 42 can also be one, two or more than three.

[0046] Optionally, the surface roughness of the plating layer 41 and the surface roughness of the glue layer 42 are less than the surface roughness of the second surface 1b respectively.

[0047] The second surface 1b has a large surface roughness because it is formed in a cutting process. For example, the surface roughness Ra of the second surface 1b is greater than or equal to 1.6 microns. The organic material is formed on the second surface 1b in the first embodiment, so that the organic material can fill the uneven places of the second surface 1b well without cracks, achieving the purpose of improving the packaging effect. In addition, due to the flatness of the organic material, the surface roughness of the plating layer 41 and the glue layer 42 can be reduced.

[0048] Optionally, the plating layer 41 can be formed by a physical vapor deposition process, a chemical vapor deposition process or an atomic layer deposition process. The glue layer 42 is generally formed by point coating, spin coating, spraying or transfer printing.

[0049] Therefore, under the condition of the same thickness of the plating layer 41 and the glue layer 42, the packaging effect of the plating layer 41 is stronger than that of the glue layer 42. Therefore, compared with the prior art of packaging the side surface of the driving substrate 10 by using only the glue layer, the second packaging structure 40 can be thinned by using the plating layer 41.

[0050] Optionally, the thickness of the plating layer 41 is less than or equal to 50 microns. The thickness of the plating layer 41 can be 1 micron, 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns or 50 microns.

[0051] It should be noted that during the deposition process of the plating layer, there is internal stress in the plating layer. The internal stress increases as the thickness of the plating layer increases. When the internal stress is greater than the bonding force of the plating layer itself, cracks will appear, affecting the packaging performance of the plating layer.

[0052] According to experimental tests, when the thickness of the plating layer 41 is greater than 30 microns, the plating layer 41 cracks. When the thickness of the plating layer 41 is between 30 microns and 50 microns, the packaging effect of the plating layer 41 increases with the increase of the thickness, but the increasing effect shows a downward trend. When the thickness of the plating layer 41 is greater than 50 microns, the packaging effect of the plating layer 41 decreases.

[0053] In addition, as the thickness of the plating layer 41 increases, the time for forming the plating layer 41 is longer and the cost is higher.

[0054] Therefore, the thickness of the plating layer 41 is less than or equal to 50 microns, which can improve the packaging effect while avoiding too long film forming time.

[0055] Optionally, the thickness of the plating layer 41 is greater than 1 micron and less than or equal to 30 microns. Such a setting can form a plating layer 41 with good encapsulation effect in a shorter time, and thin the second encapsulation structure layer 40.

[0056] Optionally, the thickness of the plating layer 41 is greater than 1 micron and less than or equal to 10 microns. Such a setting further saves film formation time and thins the thickness.

[0057] Optionally, the water vapor transmission rate (WVTR) of the plating layer 41 is less than 5 g·25um / g. Specifically, the WVTR is a value measured at 40 degrees Celsius and 90% humidity for 24 hours.

[0058] Optionally, the organic material of the plating layer 41 can be Parlin and the like.

[0059] Optionally, the outermost layer of the second encapsulation structure 40 is a glue layer 42. Using the glue layer 42 as the outermost layer of the second encapsulation structure 40 plays a role in buffering external stress, such as when the periphery of the display panel 100 encounters a collision and scratches, the glue layer 42 plays a role in absorbing stress and protection.

[0060] Optionally, the organic polymer material of the glue layer 42 can be silicone, an epoxy resin system, an acrylic resin system, or a polyurethane system, etc. The glue layer 42 can be formed by ultraviolet curing or thermal curing process.

[0061] Optionally, the thickness of the glue layer 42 is between 50 microns and 500 microns, such as 50 microns, 100 microns, 200 microns, 300 microns, 400 microns, or 500 microns.

[0062] Optionally, the thickness of the glue layer 42 is less than or equal to 200 microns. This plays a role in reducing the curing time and thinning the film layer.

[0063] Optionally, in the first embodiment, the first encapsulation structure 30 includes a first positive encapsulation layer 31 and a second positive encapsulation layer 32. The elastic modulus of the first positive encapsulation layer 31 is less than the elastic modulus of the second positive encapsulation layer 32. The first positive encapsulation layer 31 is an organic layer. The first positive encapsulation layer 31 covers the first surface 1a of the driving substrate 10 and encapsulates the light emitting device 20.

[0064] The plating layer 41 includes a first plating layer 41a. The glue layer 42 includes a first glue layer 42a. The first plating layer 41a directly covers the second surface 1b of the driving substrate 10 and the side surface of the first positive encapsulation layer 31. The first plating layer 41a covers the surface of the first positive encapsulation layer 31 away from the driving substrate 10.

[0065] The second positive packaging layer 32 is arranged on the side of the first plating layer 41a away from the driving substrate 10. The first adhesive layer 42a covers the side of the first plating layer 41a and the side of the second positive packaging layer 32.

[0066] In the first embodiment, the first plating layer 41a directly covers the second side 1b of the driving substrate 10 and the side of the first positive packaging layer 31; that is, the first plating layer 41a is used to package the side (the second side 1b) of the driving substrate 10, thereby playing a role of blocking water vapor. Since the first plating layer 41a is a plating layer, the first plating layer 41a can fill the uneven area of the side of the driving substrate 10, maintain the integrity of the film, and make the first plating layer 41a have flatness. In this embodiment, the surface roughness Ra of the first plating layer 41a is less than or equal to 0.05 microns.

[0067] In the first embodiment, the first positive packaging layer 31 made of an organic material is used to package the light emitting device 20, which can fix the light emitting device 20 and package the front side (the first side 1a) of the light emitting device 20 and the driving substrate 10.

[0068] Optionally, the material of the first positive packaging layer 31 is an organic resin material, such as silicone, epoxy, acrylic, or polyurethane, etc. Optionally, the thickness of the first positive packaging layer 31 is between 200 microns and 300 microns, for example, it can be 200 microns, 250 microns, or 300 microns.

[0069] Further, the thickness of the first positive packaging layer 31 is between 1.2 times and 2 times the height of the light emitting device 20, for example, it can be 1.2 times, 1.3 times, 1.5 times, 1.7 times, 1.8 times, or 2 times.

[0070] It can be understood that the greater the thickness of the first positive packaging layer 31, the better the packaging effect of the light emitting device 20 and the driving substrate 10, but the weaker the light transmittance. Therefore, the value range of the thickness of the first positive packaging layer 31 needs to meet the packaging effect and the light transmittance. When the thickness of the first positive packaging layer 31 is 1.5 times the height of the light emitting device 20, the packaging effect and the light transmittance are optimized.

[0071] Optionally, the light transmittance of the first positive packaging layer 31 is greater than 90%, for example, it can be 91%, 95%, or 98%.

[0072] In the first embodiment, since the first plating layer 41a partially covers the first positive packaging layer 31, the light transmittance of the first plating layer 41a needs to be greater than 95%, such as 96%, 98% or 99%. In addition, since the first plating layer 41a is a plating layer and the first positive packaging layer 31 is a glue material, the adhesion between the first plating layer 41a and the first positive packaging layer 31 is more closely, and the packaging effect is better; wherein the adhesion between the first plating layer 41a and the first positive packaging layer 31 can reach 5B according to the standard of the hundred grid knife test.

[0073] In the first embodiment, the second positive packaging layer 32 with greater hardness is used as the peripheral layer to protect the display panel 100. In addition, since the elastic modulus of the second positive packaging layer 32 is greater than that of the first positive packaging layer, the second positive packaging layer 32 has better water vapor barrier ability.

[0074] Optionally, the material of the second positive packaging layer 32 can be glass or a barrier film layer, etc. The light transmittance of the second positive packaging layer 32 is greater than 90%, such as 91%, 95% or 98%.

[0075] In the first embodiment, the first glue layer 42a covers the side surface of the first plating layer 41a and the side surface of the second positive packaging layer 32. The first glue layer 42a is used to encapsulate the side surface (second surface 1b) of the driving substrate 10, thereby improving the packaging effect. In addition, the side surface of the second positive packaging layer 32 is covered by the first glue layer 42a, which improves the stability of the second positive packaging layer 32 and improves the overall packaging effect of the display panel 100.

[0076] Optionally, compared with the above structure, the display panel 100 of the first embodiment can further include a second plating layer 41b, which covers at least the side surface of the first glue layer 42a and the side surface of the second positive packaging layer 32 away from the driving substrate 10.

[0077] That is, the number of plating layers 41 is at least two. In the vertical direction of the second surface 1b, the first plating layer 41a and the second plating layer 41b are bonded by the first glue layer 42a. It should be noted that since the first plating layer 41a and the second plating layer 41b are plating layers 41, their thickness is not the thicker the better, so the first glue layer 42a is used as an intermediate bonding layer, which greatly improves the packaging effect and the adhesion.

[0078] For example, the total thickness of the plating layer 41 is 60 microns, and the thickness of the glue layer 42 is 200 microns. In the case that the total thickness of the plating layer 41 and the total thickness of the glue layer 42 remain unchanged, the single-layer 60-micron plating layer 41 is used to stack the glue layer 42, which has a better packaging effect than the two single-layer 30-micron plating layers 41 with the glue layer 42 arranged therebetween.

[0079] Optionally, the bonding strength between the second plating layer 41b and the second positive packaging layer 32 can reach 5B according to the crosshatch adhesion test standard.

[0080] In some embodiments, the second plating layer 41b can also not cover the side of the second positive packaging layer 32 away from the driving substrate 10.

[0081] Optionally, compared with the above structure, the adhesive layer 42 of the display panel 100 of the first embodiment further comprises a second adhesive layer 42b, and the second adhesive layer 42b covers the side surface of the second plating layer 41b.

[0082] That is, the number of the adhesive layer 42 is at least two. The fourth encapsulation of the side of the driving substrate 10 by the second adhesive layer 42b improves the encapsulation effect and further protects the side of the display panel 100.

[0083] The preparation process of the display panel 100 of the first embodiment is as follows:

[0084] Please refer to Figure 2 Step B1, binding a plurality of light emitting devices 20 on the driving substrate 10.

[0085] The driving substrate 10 comprises a substrate 11 and a thin film transistor array layer 12 arranged on the substrate 11. The material of the active layer in the thin film transistor can be a-Si, IGZO, IGTO, LTPS, etc. Optionally, the thin film transistor can be a top gate, a bottom gate or a double gate structure.

[0086] Optionally, the material of the substrate 11 can be a rigid substrate or a flexible substrate. The material of the substrate 11 includes one of glass, sapphire, silicon, silicon dioxide, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyether sulfone, aromatic fluorine toluene containing polyarylate, polycyclic olefin, polyimide or polyurethane.

[0087] Optionally, the light emitting device 20 can be a mini light emitting diode (Mini-LED), a micro light emitting diode (Micro-LED), a quantum dot light emitting diode or an organic light emitting diode, etc.

[0088] In the first embodiment, the light emitting device 20 can be transferred to the driving substrate 10 by SMT (Surface Mounting Technology) or massive transfer process.

[0089] Then go to step B2.

[0090] Please refer to Figure 3 Step B2, forming a first positive packaging layer 31 on the driving substrate 10.

[0091] The first positive encapsulation layer 31 can be formed by spraying, spin coating, slot coating or molding, etc. The first positive encapsulation layer 31 encapsulates the light emitting device 20.

[0092] Then, step B3 is entered.

[0093] Please refer to Figure 4 , step B3, the part of the driving substrate 10 located in the frame area NA is cut off, and then the first plating layer 41a is formed on the driving substrate 10. The first plating layer 41a covers the side surface of the driving substrate 10 and the exposed surface of the first positive encapsulation layer 31.

[0094] In some embodiments, the first plating layer 41a can also cover only the side surface of the driving substrate 10 and the side surface of the first positive encapsulation layer 31.

[0095] In which, the part of the frame area NA is cut off to reduce the frame width. Then, the first plating layer 41 (the first plating layer 41a) is formed by physical vapor deposition, chemical vapor deposition or atomic layer deposition, etc.

[0096] In which, the first positive encapsulation layer 31 also covers the frame area NA; when cutting, part of the first positive encapsulation layer 31 is also cut off, so that the side surface of the driving substrate 10 and the side surface of the first positive encapsulation layer 31 are both formed into rough surfaces.

[0097] Optionally, the organic material of the first plating layer 41a can be parylene.

[0098] The bonding strength level of the first plating layer 41a and the first positive encapsulation layer 31 is 5B.

[0099] Then, step B4 is entered.

[0100] Please refer to Figure 5 , step B4, the second positive encapsulation layer 32 is arranged on the side of the first positive encapsulation layer 31 away from the driving substrate 10. The second positive encapsulation layer 32 is attached to the first plating layer 41a.

[0101] The material of the second positive encapsulation layer 32 can be glass or barrier film, etc.; and is attached to the first plating layer 41a in an attaching manner. Then, step B5 is entered.

[0102] Please refer to Figure 6 , step B5, the first adhesive layer 42a is formed on the side surface of the first plating layer 41a and the second positive encapsulation layer 32.

[0103] The first adhesive layer 42 (the first adhesive layer 42a) can be formed by dot coating, spraying, spin coating or transfer printing, etc., and then the first adhesive layer 42a is cured by ultraviolet curing or thermal curing.

[0104] The thickness of the first glue layer 42a is greater than the thickness of the first plating layer 41a, so as to better protect the first plating layer 41a. Then, go to step B6.

[0105] Please refer to Figure 7 , step B6, forming a second plating layer 41b on the second positive packaging layer 32 and the first glue layer 42a. The second plating layer 41b covers the side of the first glue layer 42a and the side of the second positive packaging layer 32 away from the driving substrate 10.

[0106] The second plating layer 41 (the second plating layer 41b) can be formed by physical vapor deposition, chemical vapor deposition, atomic layer deposition or the like. Then, go to step B7.

[0107] Please refer to Figure 8 , step B7, forming a second glue layer 42b on the side of the second plating layer 41b.

[0108] The second glue layer 42 (the second glue layer 42b) can be formed by dot coating, spraying, spin coating or transfer printing, and then the second glue layer 42b is cured by ultraviolet light curing or thermal curing.

[0109] In this way, the preparation process of the display panel 100 of the first embodiment is completed.

[0110] Please refer to Figure 9 , the display panel 100 of the second embodiment includes a driving substrate 10, a light emitting device 20, a first packaging structure 30 and a second packaging structure 40. The driving substrate 10 includes a first surface 1a and a second surface 1b, and the extension direction of the first surface 1a and the extension direction of the second surface 1b intersect. The first surface 1a is the front surface of the driving substrate 10. The second surface 1b is the side surface of the driving substrate 10. The light emitting device 20 is arranged on the first surface of the driving substrate 10. The first packaging structure 30 covers the first surface 1a and encapsulates the light emitting device 20. The second packaging structure 40 includes at least one plating layer 41 and at least one glue layer 42, and one of the plating layer 41 and the glue layer 42 directly covers the second surface 1b of the driving substrate 10.

[0111] In the vertical direction of the second surface 1b of the driving substrate 10, the plating layer 41 and the glue layer 42 are arranged alternately. The plating layer 41 and the glue layer 42 are both organic layers.

[0112] In the second embodiment, the first packaging structure 30 includes a first positive packaging layer 31 and a second positive packaging layer 32. The elastic modulus of the first positive packaging layer 31 is less than the elastic modulus of the second positive packaging layer 32. The first positive packaging layer 31 is an organic layer. The first positive packaging layer 31 covers the first surface 1a of the driving substrate 10 and encapsulates the light emitting device 20.

[0113] The plating layer 41 includes a first plating layer 41a. The glue layer 42 includes a first glue layer 42a.

[0114] The difference between this second embodiment and the first embodiment is that the first adhesive layer 42a directly covers the second surface 1b of the driving substrate 10 and the side surface of the first positive encapsulation layer 31. The first plating layer 41a at least covers the side surface of the first adhesive layer 42a and the side of the first positive encapsulation layer 31 away from the driving substrate 10.

[0115] The second positive encapsulation layer 32 is disposed on the side of the first plating layer 41a away from the driving substrate 10.

[0116] In this second embodiment, the display panel 100 first uses an adhesive layer 42 to directly encapsulate the side surfaces of the driving substrate 10 and the first positive encapsulation layer 31, and then uses a plating layer 41 to at least cover the side surfaces of the adhesive layer 42 to encapsulate the side surfaces of the driving substrate 10 a second time.

[0117] Since the adhesive layer 42 has certain fluidity and leveling properties, the first adhesive layer 42a is used to encapsulate the side of the driving substrate 10, which can quickly fill the unevenness on the side of the driving substrate 10 and provide a better flat surface for the first plating layer 41a, which is more conducive to the integrity of the first plating layer 41a.

[0118] Optionally, coating 41 may further include a second coating 41b. Adhesive layer 42 may further include a second adhesive layer 42b.

[0119] The second adhesive layer 42b covers the side of the first plating layer 41a and the side of the second positive encapsulation layer 32. The second plating layer 41b at least covers the side of the second adhesive layer 42b and the side of the second positive encapsulation layer 32 away from the driving substrate 10.

[0120] Please refer to Figure 10 The display panel 100 of this third embodiment includes a driving substrate 10, a light-emitting device 20, a first encapsulation structure 30, and a second encapsulation structure 40. The driving substrate 10 includes a first surface 1a and a second surface 1b, the extending directions of the first surface 1a and the second surface 1b intersecting. The first surface 1a is the front side of the driving substrate 10. The second surface 1b is the side surface of the driving substrate 10. The light-emitting device 20 is disposed on the first surface of the driving substrate 10. The first encapsulation structure layer 30 covers the first surface 1a and encapsulates the light-emitting device 20. The second encapsulation structure 40 includes at least one plating layer 41 and at least one adhesive layer 42, one of which directly covers the second surface 1b of the driving substrate 10.

[0121] In the vertical direction of the second surface 1b of the driving substrate 10, a plating layer 41 and an adhesive layer 42 are alternately disposed. Both the plating layer 41 and the adhesive layer 42 are organic layers.

[0122] In the third embodiment, the first encapsulation structure 30 includes a first positive encapsulation layer 31 and a second positive encapsulation layer 32. The elastic modulus of the first positive encapsulation layer 31 is less than the elastic modulus of the second positive encapsulation layer 32. The first positive encapsulation layer 31 is an organic layer. The first positive encapsulation layer 31 covers the first surface la of the driving substrate 10 and encapsulates the light emitting device 20.

[0123] The plating layer 41 includes a first plating layer 41a. The adhesive layer 42 includes a first adhesive layer 42a.

[0124] The display panel 100 of the third embodiment is different from the first embodiment in that the second positive encapsulation layer 32 directly covers the side surface of the first positive encapsulation layer 31 away from the driving substrate 10.

[0125] The first plating layer 41a directly covers the second surface lb of the driving substrate 10 and the side surface of the first positive encapsulation layer 31. The first adhesive layer 42a covers the side surface of the first plating layer 41a.

[0126] Optionally, the plating layer 41 can further include a second plating layer 41b. The adhesive layer 42 can further include a second adhesive layer 42b. The second plating layer 41b covers the side surface of the first adhesive layer 42a. The second adhesive layer 42b covers the side surface of the second plating layer 41b.

[0127] Compared with the first embodiment, the second encapsulation structure 40 of the third embodiment only encapsulates the side surface of the driving substrate, so as to improve the light transmittance of the display panel 100.

[0128] Please refer to Figure 11 Therefore, the embodiment of the present application further provides a spliced panel 1000 including at least two display panels 100 of any of the above embodiments.

[0129] It should be noted that the structure of the display panel 100 of the spliced panel 1000 of the embodiment is similar or identical to the structure of the display panel 100 of any of the above embodiments. For details, please refer to the description of the above embodiments, which will not be repeated here.

[0130] In addition, Figure 11 The display panel 100 of the first embodiment is taken as an example, but is not limited thereto. For example, the display panel can be the display panel of the second embodiment or the display panel of the third embodiment.

[0131] In the spliced panel 1000 provided by the embodiment of the present application, the display panel 100 comprises a driving substrate 10, a light emitting device 20, a first encapsulation structure 30 and a second encapsulation structure 40. The driving substrate 10 comprises a first surface 1a and a second surface 1b, and the extending direction of the first surface 1a intersects with the extending direction of the second surface 1b. The first surface 1a is the front surface of the driving substrate 10. The second surface 1b is the side surface of the driving substrate 10. The light emitting device 20 is arranged on the first surface of the driving substrate 10. The first encapsulation structure 30 is arranged on the first surface 1a and encapsulates the light emitting device 20. The second encapsulation structure 40 comprises at least one plating layer 41 and at least one glue layer 42, and one of the plating layer 41 and the glue layer 42 directly covers the second surface 1b of the driving substrate 10.

[0132] In the vertical direction of the second surface 1b of the driving substrate 10, the plating layer 41 and the glue layer 42 are arranged alternately. The plating layer 41 and the glue layer 42 are both organic layers.

[0133] In the display panel 100 provided by the embodiment of the present application, because the cutting process in the process of the panel makes the roughness of the second surface 1b (side surface) of the driving substrate 10 larger, the plating layer 41 and the glue layer 42 made of organic material are adopted, which can, on the one hand, flatten the roughness of the second surface 1b, improve the integrity of the plating layer 41 and the glue layer 42, and further improve the encapsulation effect; on the other hand, the plating layer 41 and the glue layer 42 are arranged alternately and closely connected, which can further improve the encapsulation effect; in addition, the arrangement of the plating layer 41 can also thin the thickness of the second encapsulation structure 40, and the glue layer 42 also has the function of absorbing external stress and is used for protecting the plating layer 41.

[0134] The display panel and the spliced panel provided by the embodiment of the present application are described in detail above, and the principle and the implementation manner of the present application are described by applying specific examples in the present article. The above description of the embodiments is only used for helping to understand the method of the present application and the core idea thereof; meanwhile, for the person skilled in the art, according to the idea of the present application, the specific implementation manner and the application range can be changed, and the above description should not be understood as the limitation of the present application.

Claims

1. A display panel, characterized in that, include: A driving substrate, the driving substrate including a first surface and a second surface, the extending direction of the first surface and the extending direction of the second surface intersect, the first surface is the front surface of the driving substrate, and the second surface is the side surface of the driving substrate. A light-emitting device, wherein the light-emitting device is disposed on a first surface of the driving substrate; A first packaging structure, wherein the first packaging structure layer covers the first surface and encapsulates the light-emitting device; The second packaging structure includes at least one plating layer and at least one adhesive layer, one of which directly covers the second surface of the driving substrate; the plating layer and the adhesive layer are alternately arranged in the vertical direction of the second surface of the driving substrate; both the plating layer and the adhesive layer are organic layers; the adhesive layer is a UV-curable adhesive or a thermosetting adhesive; the plating layer is configured to be formed using a physical vapor deposition process, a chemical vapor deposition process, or an atomic layer deposition process; the adhesive layer is configured to be formed using a dot coating, spin coating, spray coating, or transfer printing method; the surface roughness of the plating layer and the surface roughness of the adhesive layer are respectively less than the surface roughness of the second surface.

2. The display panel according to claim 1, characterized in that, The outermost layer of the second encapsulation structure is the adhesive layer.

3. The display panel according to claim 1, characterized in that, The first encapsulation structure includes a first positive encapsulation layer and a second positive encapsulation layer. The elastic modulus of the first positive encapsulation layer is less than that of the second positive encapsulation layer. The first positive encapsulation layer is an organic layer that covers a first surface of the driving substrate and encapsulates the light-emitting device. The plating layer includes a first plating layer, the adhesive layer includes a first adhesive layer, the first plating layer directly covers the second side of the driving substrate and the side of the first positive encapsulation layer, and the first plating layer covers the side of the first positive encapsulation layer away from the driving substrate; The second positive encapsulation layer is disposed on the side of the first plating layer away from the driving substrate; the first adhesive layer covers the side of the first plating layer and the side of the second positive encapsulation layer.

4. The display panel according to claim 3, characterized in that, The coating further includes a second coating that covers at least the side of the first adhesive layer and the side of the second positive encapsulation layer away from the driving substrate.

5. The display panel according to claim 4, characterized in that, The adhesive layer further includes a second adhesive layer that covers the side of the second coating.

6. The display panel according to claim 1, characterized in that, The first encapsulation structure includes a first positive encapsulation layer and a second positive encapsulation layer. The elastic modulus of the first positive encapsulation layer is less than that of the second positive encapsulation layer. The first positive encapsulation layer is an organic layer that covers a first surface of the driving substrate and encapsulates the light-emitting device. The plating layer includes a first plating layer, the adhesive layer includes a first adhesive layer, the first adhesive layer directly covers the second side of the driving substrate and the side of the first positive encapsulation layer, and the first plating layer at least covers the side of the first adhesive layer and the side of the first positive encapsulation layer away from the driving substrate; The second positive encapsulation layer is disposed on the side of the first plating layer away from the driving substrate.

7. The display panel according to claim 6, characterized in that, The coating further includes a second coating, and the adhesive layer further includes a second adhesive layer; The second adhesive layer covers the side of the first plating layer and the side of the second positive encapsulation layer, and the second plating layer at least covers the side of the second adhesive layer and the side of the second positive encapsulation layer away from the driving substrate.

8. The display panel according to claim 1, characterized in that, The first encapsulation structure includes a first positive encapsulation layer and a second positive encapsulation layer. The elastic modulus of the first positive encapsulation layer is less than that of the second positive encapsulation layer. The first positive encapsulation layer is an organic layer. The first positive encapsulation layer covers a first side of the driving substrate and encapsulates the light-emitting device. The second positive encapsulation layer covers the side of the first positive encapsulation layer away from the driving substrate. The plating layer includes a first plating layer, and the adhesive layer includes a first adhesive layer. The first plating layer directly covers the second side of the driving substrate and the side of the first positive encapsulation layer, and the first adhesive layer covers the side of the first plating layer.

9. The display panel according to claim 1, characterized in that, The thickness of the coating is less than or equal to 50 micrometers.

10. A splicing panel, characterized in that, It includes at least two display panels as described in any one of claims 1-9, wherein the display panels are spliced ​​together.

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