Board-to-board connector

Abstract

The present invention relates to a board-to-board connector. A high-voltage side presser includes a flat plate-shaped reinforcing plate portion, a solder tail projecting downward from the reinforcing plate portion, and a presser spring sheet supported by the reinforcing plate portion in a cantilever beam manner. The presser spring sheet includes, in order from a base portion to a tip portion thereof, a spring sheet body, a contact portion projecting upward beyond a CPU substrate opposing surface, and a displacement restricting portion for restricting upward displacement of the contact portion. The housing is formed such that the contact portion does not contact the housing when the contact portion is displaced downward and no longer projects upward beyond the CPU substrate opposing surface.

Description

TECHNICAL FIELD

[0001] The present application relates to a board-to-board connector. BACKGROUND

[0002] As shown in the Figure 20 Patent Document 1 (Japanese Patent Laid-Open No. 2006-156023) discloses a receptacle 103 including a receptacle contactor 100, an insulating housing 101 that houses the receptacle contactor 100, and a receptacle fixing plate 102 that fixes the insulating housing 101 to a substrate.

[0003] The receptacle fixing plate 102 includes a fixing leg 104 and a receptacle contact portion 105. The contact piece pieces 106A and 106B are formed by cutting and bending the receptacle contact portion 105. SUMMARY

[0004] In the case where the pressure piece is provided with an elastic piece and the elastic piece has a contact portion, the elastic displacement of the contact portion can be hindered by the housing. Also, it is necessary to avoid the curling deformation of the elastic piece.

[0005] An object of the present application is to provide a technique to achieve a structure in which a contact portion of an elastic piece is provided to a pressure piece and the contact portion of the elastic piece can be easily elastically displaced and the curling deformation of the elastic piece is avoided.

[0006] According to an aspect of the present application, there is provided a board-to-board connector that is mounted on a first substrate and built in between the first substrate and a second substrate to electrically connect a plurality of pads of the first substrate to a plurality of pads of the second substrate, the board-to-board connector including: a housing in a flat plate shape; a plurality of contact pieces held on the housing; and a pressure piece made of metal, wherein the housing includes a housing lower surface that faces the first substrate when the board-to-board connector is mounted on the first substrate, and a housing upper surface that is the opposite surface of the housing lower surface, a pressure piece housing recess is formed on the housing upper surface, the pressure piece includes a reinforcing plate portion in a flat plate shape that is housed in the pressure piece housing recess and covers an inner bottom surface of the pressure piece housing recess, a solder leg that protrudes downward from the reinforcing plate portion, and a pressure piece elastic piece that is supported by the reinforcing plate portion in a cantilever beam manner, the pressure piece elastic piece includes, in order from a base portion to a tip portion thereof, an elastic piece body, a contact portion that protrudes upward beyond the housing upper surface, and a displacement restricting portion that restricts upward displacement of the contact portion, and the housing is formed such that the contact portion does not contact the housing when the contact portion is displaced downward and no longer protrudes upward beyond the housing upper surface.

[0007] The present invention achieves the following structure: the contact portion of the elastic sheet is disposed on the pressure member, and the contact portion of the elastic sheet can be easily elastically displaced and the curling deformation of the elastic sheet is avoided.

[0008] The above and other objects, features and advantages of the present invention will be more fully understood from the following detailed description and the accompanying drawings, which are for illustrative purposes only and are not intended to limit the scope of the invention. Attached Figure Description

[0009] Figure 1 An exploded perspective view of an information processing device (first embodiment);

[0010] Figure 2 A perspective view of the CPU substrate from another angle (first embodiment);

[0011] Figure 3 A perspective view of the connector (first embodiment);

[0012] Figure 4 An exploded perspective view of the connector (first embodiment);

[0013] Figure 5 A perspective view of the housing (first embodiment);

[0014] Figure 6 A top view of the connector (first embodiment);

[0015] Figure 7 for Figure 6 Enlarged view of part P in the first embodiment;

[0016] Figure 8 for Figure 6 Enlarged view of the Q portion (first embodiment);

[0017] Figure 9 A perspective view of the pressure member (first embodiment);

[0018] Figure 10 This is a side view of the pressure piece before deformation (first embodiment);

[0019] Figure 11 This is a top view of the pressure member (first embodiment);

[0020] Figure 12 This is a side view of the pressed part after deformation (first embodiment);

[0021] Figure 13 A partial cross-sectional perspective view of the housing equipped with the contact element (first embodiment);

[0022] Figure 14 This is a partial cross-sectional perspective view of the shell (first embodiment);

[0023] Figure 15 Partial cross-sectional view of the housing with the contact member (first embodiment);

[0024] Figure 16 Oblique view of the contact member (first embodiment);

[0025] Figure 17 Partial cross-sectional oblique view of the housing with the pressure member (second embodiment);

[0026] Figure 18 Oblique view of the pressure member (third embodiment);

[0027] Figure 19 Side view of the pressure member (fourth embodiment); and

[0028] Figure 20 Schematic view of the information processing device 1 according to the first embodiment. Figure 1 DETAILED DESCRIPTION

[0029] First Embodiment

[0030] The first embodiment will be described below with reference to Figures 1 to 16 The first embodiment. Figure 1 is an exploded oblique view of an information processing device 1. As shown in Figure 1 , the information processing device 1 includes a CPU board 2 (second board), a connector 3 (board-to-board connector), an input / output board 4 (first board), and a support board 5. The CPU board 2, the connector 3, the input / output board 4, and the support board 5 are sequentially overlaid. Specifically, the connector 3 is disposed between the CPU board 2 and the input / output board 4.

[0031] The CPU board 2 and the input / output board 4 are rigid boards, for example, a paper phenolic board or a glass epoxy board.

[0032] Figure 2 is an oblique view of the CPU board 2 from another angle. As shown in Figure 1 and Figure 2 , the CPU board 2 includes a connector facing surface 2A facing the connector 3. As shown in Figure 2 , a plurality of signal pad columns 6 and a plurality of power supply pad 7 are formed on the connector facing surface 2A. Also, the CPU board 2 has a plurality of bolt fastening holes 8 and a plurality of positioning holes 9.

[0033] ​The plurality of signal pad columns 6 extend parallel to each other. Each signal pad column 6 includes a plurality of signal pads 10. The length direction of each signal pad column 6 is referred to as a pitch direction. Also, a direction orthogonal to the pitch direction is defined as a width direction. The plurality of signal pad columns 6 are arranged in the width direction. The thickness direction of the CPU substrate 2 is orthogonal to the pitch direction and the width direction, and is hereinafter referred to as a vertical direction. The vertical direction includes a downward direction in which the connector opposing surface 2A faces, and an upward direction opposite to the downward direction. Note that the vertical direction, the upward direction, and the downward direction are merely directions for explanation, and should not be interpreted as limiting the posture of the information processing apparatus 1 and the connector 3 when actually used.

[0034] The plurality of bolt fastening holes 8 are provided so as to be separated from each other in the pitch direction. The plurality of bolt fastening holes 8 include a first bolt fastening hole 8A, a second bolt fastening hole 8B, and a third bolt fastening hole 8C. These are arranged in the order of the first bolt fastening hole 8A, the second bolt fastening hole 8B, and the third bolt fastening hole 8C.

[0035] The plurality of positioning holes 9 include a first positioning hole 9P and a second positioning hole 9Q. The first positioning hole 9P and the second positioning hole 9Q are provided so as to be separated from each other in the width direction. The first bolt fastening hole 8A is provided so as to be built in between the first positioning hole 9P and the second positioning hole 9Q in the width direction.

[0036] The plurality of power supply pads 7 include a high-voltage-side electrode pad 7P, a high-voltage-side electrode pad 7Q, a low-voltage-side electrode pad 7R, and a low-voltage-side electrode pad 7S. Any one of the plurality of power supply pads 7 can be both a high-voltage side or a low-voltage side.

[0037] The high-voltage-side electrode pad 7P and the high-voltage-side electrode pad 7Q are provided so as to be separated from each other in the width direction. The first bolt fastening hole 8A is provided so as to be built in between the high-voltage-side electrode pad 7P and the high-voltage-side electrode pad 7Q in the width direction. The high-voltage-side electrode pad 7P is provided between the first bolt fastening hole 8A and the first positioning hole 9P in the width direction. The high-voltage-side electrode pad 7Q is provided between the first bolt fastening hole 8A and the second positioning hole 9Q in the width direction. Note, however, that the pattern shape and the position of the high-voltage-side electrode pad 7P and the high-voltage-side electrode pad 7Q are arbitrary, and the high-voltage-side electrode pad 7P and the high-voltage-side electrode pad 7Q can be formed in a ring shape so as to surround the first positioning hole 9P and the second positioning hole 9Q, respectively.

[0038] The low-voltage-side electrode pad 7R and the low-voltage-side electrode pad 7S are arranged so as to be separated from each other in the width direction. The low-voltage-side electrode pad 7R and the low-voltage-side electrode pad 7S are arranged so as to be interposed therebetween in the width direction by the third bolt fastening hole 8C. Note, however, that the pattern shape and position of the low-voltage-side electrode pad 7R and the low-voltage-side electrode pad 7S are arbitrary.

[0039] Referring back to Figure 1 The input / output substrate 4 includes a connector-opposing surface 4A that opposes the connector 3. The plurality of signal pad columns 11 and the plurality of power supply pads 12 are formed on the connector-opposing surface 4A. Also, the input / output substrate 4 has the plurality of bolt fastening holes 13 and the plurality of positioning holes 14.

[0040] The plurality of signal pad columns 11 extend in parallel with each other. The plurality of signal pad columns 11 are arranged in the width direction. Each signal pad column 11 includes a plurality of signal pads 15.

[0041] The plurality of bolt fastening holes 13 are arranged so as to be separated from each other in the pitch direction. The plurality of bolt fastening holes 13 include a first bolt fastening hole 13A, a second bolt fastening hole 13B, and a third bolt fastening hole 13C. The first bolt fastening hole 13A, the second bolt fastening hole 13B, and the third bolt fastening hole 13C are arranged in this order.

[0042] The plurality of positioning holes 14 include a first positioning hole 14P and a second positioning hole 14Q. The first positioning hole 14P and the second positioning hole 14Q are arranged so as to be separated from each other in the width direction. The first positioning hole 14P and the second positioning hole 14Q are arranged so as to be interposed therebetween in the width direction by the first bolt fastening hole 13A.

[0043] The plurality of power supply pads 12 include a pair of high-voltage-side electrode pads 12P, a pair of high-voltage-side electrode pads 12Q, a pair of low-voltage-side electrode pads 12R, and a pair of low-voltage-side electrode pads 12S.

[0044] The pair of high-voltage-side electrode pads 12P are arranged in such a manner that one of the high-voltage-side electrode pads 12P is adjacent to the first positioning hole 14P in the pitch direction and the other high-voltage-side electrode pad 12P is adjacent to the first positioning hole 14P in the width direction. The pair of high-voltage-side electrode pads 12Q are arranged in such a manner that one of the high-voltage-side electrode pads 12Q is adjacent to the second positioning hole 14Q in the pitch direction and the other high-voltage-side electrode pad 12Q is adjacent to the second positioning hole 14Q in the width direction. The pair of low-voltage-side electrode pads 12R and the pair of low-voltage-side electrode pads 12S are arranged in such a manner that the third bolt fastening hole 13C is interposed therebetween in the width direction. Thus, the pair of low-voltage-side electrode pads 12R, the third bolt fastening hole 13C, and the pair of low-voltage-side electrode pads 12S are arranged in this order in the width direction.

[0045] The support substrate 5 is generally a part of a housing that accommodates the CPU substrate 2, the connector 3, and the input / output substrate 4, and is made of, for example, aluminum or an aluminum alloy. The support substrate 5 includes a flat plate-shaped substrate body 20, a plurality of nuts 21, and a plurality of columnar positioning pins 22. The plurality of nuts 21 and the plurality of positioning pins 22 protrude upward from the substrate body 20.

[0046] The plurality of nuts 21 includes a first nut 21A, a second nut 21B, and a third nut 21C. The first nut 21A, the second nut 21B, and the third nut 21C are arranged so as to correspond to the first bolt fastening hole 13A, the second bolt fastening hole 13B, and the third bolt fastening hole 13C of the input / output substrate 4, respectively.

[0047] The plurality of positioning pins 22 includes a first positioning pin 22P and a second positioning pin 22Q. The first positioning pin 22P and the second positioning pin 22Q are arranged so as to correspond to the first positioning hole 14P and the second positioning hole 14Q of the input / output substrate 4, respectively.

[0048] The connector 3 can be mounted on a connector-opposing surface 4A of the input / output substrate 4. Figure 3 is a perspective view of the connector 3. Figure 4 is an exploded perspective view of the connector 3. As Figure 3 and Figure 4 shown, the connector 3 includes a rectangular flat plate-shaped housing 30 made of an insulating resin, a plurality of contact piece rows 31, and a plurality of press pieces 32 made of metal. The plurality of contact piece rows 31 and the plurality of press pieces 32 are held on the housing 30.

[0049] The plurality of contact piece rows 31 extend in parallel to each other. The plurality of contact piece rows 31 are arranged in the width direction. The plurality of contact piece rows 31 extend in the pitch direction. Each contact piece row 31 includes a plurality of contact pieces 33 made of metal. Each contact piece 33 is formed by punching and bending a metal plate, for example, the metal plate is formed of copper-plated or copper alloy.

[0050] The plurality of pressure pieces 32 includes a high voltage side pressure piece 32P, a high voltage side pressure piece 32Q, a low voltage side pressure piece 32R, and a low voltage side pressure piece 32S. As shown in Figure 1 , the high voltage side pressure piece 32P, the high voltage side pressure piece 32Q, the low voltage side pressure piece 32R, and the low voltage side pressure piece 32S are provided to correspond to the high voltage side electrode pad 12P, the high voltage side electrode pad 12Q, the low voltage side electrode pad 12R, and the low voltage side electrode pad 12S of the input / output substrate 4, respectively. Each pressure piece 32 is formed by punching and bending a metal plate, for example, the metal plate is a stainless steel plate.

[0051] Figure 5 is a perspective view of the housing 30. As shown in Figure 5 , the housing 30 includes a CPU substrate facing surface 30A as an upper surface of the housing facing upwardly to be able to face the CPU substrate 2, and an input / output substrate facing surface 30B as a lower surface of the housing facing downwardly to be able to face the input / output substrate 4. The CPU substrate facing surface 30A is the uppermost surface of the housing 30. The input / output substrate facing surface 30B is the lowermost surface of the housing 30. The housing 30 has a plurality of positioning holes 34. The plurality of positioning holes 34 includes a first positioning hole 34P and a second positioning hole 34Q. The first positioning hole 34P and the second positioning hole 34Q are formed to penetrate the housing 30 in the vertical direction.

[0052] Referring back to Figure 1 , a general assembly process of the information processing device 1 is described.

[0053] First, the connector 3 is mounted on the input / output substrate 4. Specifically, the plurality of contact piece rows 31 are respectively soldered to the corresponding plurality of signal pad rows 11, and further the plurality of pressure pieces 32 are respectively soldered to the corresponding plurality of power supply pads 12.

[0054] Next, the input / output substrate 4 with the connector 3 mounted thereon is installed on the support substrate 5. At this time, the first nut 21A, the second nut 21B, and the third nut 21C of the support substrate 5 are respectively inserted through the first bolt fastening hole 13A, the second bolt fastening hole 13B, and the third bolt fastening hole 13C of the input / output substrate 4. Similarly, the first positioning pin 22P is sequentially inserted through the first positioning hole 14P of the input / output substrate 4 and the first positioning hole 34P of the connector 3, and the second positioning pin 22Q is sequentially inserted through the second positioning hole 14Q of the input / output substrate 4 and the second positioning hole 34Q of the connector 3.

[0055] Next, the CPU substrate 2 is installed on the support substrate 5 by overlapping the CPU substrate 2 on the connector 3. At this time, the first positioning pin 22P and the second positioning pin 22Q are respectively inserted through the first positioning hole 9P and the second positioning hole 9Q of the CPU substrate 2. In this state, the first bolt 40A is fastened to the first nut 21A through the first bolt fastening hole 8A and the first bolt fastening hole 13A, the second bolt 40B is fastened to the second nut 21B through the second bolt fastening hole 8B and the second bolt fastening hole 13B, and the third bolt 40C is fastened to the third nut 21C through the third bolt fastening hole 8C and the third bolt fastening hole 13C. In this way, the connector 3 is built between the CPU substrate 2 and the input / output substrate 4, and accordingly the plurality of signal pads 15 of the input / output substrate 4 and the plurality of signal pads 10 of the CPU substrate 2 as shown in FIG. 2 are respectively electrically connected through the plurality of contact pieces 33 of the connector 3. Similarly, the plurality of power supply pads 12 of the input / output substrate 4 and the plurality of power supply pads 7 of the CPU substrate 2 as shown in FIG. 2 are respectively electrically connected through the plurality of pressure pieces 32. Figure 2 Figure 2 In this way, in the present embodiment, the plurality of pressure pieces 32 of the connector 3 are used to supply power from the input / output substrate 4 to the CPU substrate 2.

[0056] Furthermore, the first positioning pin 22P is inserted into the first positioning hole 34P of the connector 3 and the first positioning hole 9P of the CPU substrate 2, and the second positioning pin 22Q is inserted into the second positioning hole 34Q of the connector 3 and the second positioning hole 9Q of the CPU substrate 2, thereby achieving high-precision positioning of the CPU substrate 2 relative to the connector 3.

[0057] The connector 3 will be described in more detail below.

[0058] As shown in FIG. 3, the connector 3 includes a plurality of contact pieces 33 and a plurality of pressure pieces 32. The plurality of contact pieces 33 are used to electrically connect the plurality of signal pads 15 of the input / output substrate 4 and the plurality of signal pads 10 of the CPU substrate 2. The plurality of pressure pieces 32 are used to electrically connect the plurality of power supply pads 12 of the input / output substrate 4 and the plurality of power supply pads 7 of the CPU substrate 2. Figure 5 ​As shown, the housing 30 is formed in a rectangular flat plate shape. Specifically, the housing 30 includes a first pitch side surface 50, a second pitch side surface 51, a first width side surface 52, and a second width side surface 53. The first pitch side surface 50 and the second pitch side surface 51 are side surfaces orthogonal to the pitch direction. The first pitch side surface 50 and the second pitch side surface 51 are surfaces facing each other. The first width side surface 52 and the second width side surface 53 are side surfaces orthogonal to the width direction. The first width side surface 52 and the second width side surface 53 are surfaces facing each other.

[0059] The housing 30 also includes a first corner portion 60P, a second corner portion 60Q, a third corner portion 60R, and a fourth corner portion 60S. The first corner portion 60P is a corner where the first pitch side surface 50 and the first width side surface 52 intersect. The second corner portion 60Q is a corner where the first pitch side surface 50 and the second width side surface 53 intersect. The third corner portion 60R is a corner where the second pitch side surface 51 and the first width side surface 52 intersect. The fourth corner portion 60S is a corner where the second pitch side surface 51 and the second width side surface 53 intersect. Thus, the first corner portion 60P and the fourth corner portion 60S are located at opposite corners of the rectangular housing 30 when viewed from above. Likewise, the second corner portion 60Q and the third corner portion 60R are located at opposite corners of the rectangular housing 30 when viewed from above. The first positioning hole 34P is formed in the first corner portion 60P. The second positioning hole 34Q is formed in the second corner portion 60Q. The housing 30 has only two positioning holes (i.e., the first positioning hole 34P and the second positioning hole 34Q) as the positioning holes for positioning the CPU board 2 relative to the connector 3.

[0060] On the first pitch side surface 50, in order from the first width side surface 52 to the second width side surface 53, a press-fit groove 61P, a nut cutout 50V, and a press-fit groove 61Q are formed.

[0061] On the second pitch side surface 51, in order from the first width side surface 52 to the second width side surface 53, a press-fit groove 61R, a nut cutout 51V, and a press-fit groove 61S are formed.

[0062] On the CPU board facing surface 30A, a press piece housing recess 62P, a press piece housing recess 62Q, a press piece housing recess 62R, and a press piece housing recess 62S are formed.

[0063] On the housing 30, a plurality of contact piece housing portions 63 and nut through holes 64 are also formed.

[0064] As shown in Figs. 1 and 2, the high voltage side press piece 32P, the high voltage side press piece 32Q, the low voltage side press piece 32R, and the low voltage side press piece 32S are press-fitted into the press-fit groove 61P, the press-fit groove 61Q, the press-fit groove 61R, and the press-fit groove 61S, respectively, and thereby are held to the housing 30. Figure 4 and Figure 5 As shown in Figs. 1 and 2, the high voltage side press piece 32P, the high voltage side press piece 32Q, the low voltage side press piece 32R, and the low voltage side press piece 32S are press-fitted into the press-fit groove 61P, the press-fit groove 61Q, the press-fit groove 61R, and the press-fit groove 61S, respectively, and thereby are held to the housing 30.

[0065] The nut notch 50V is a notch for avoiding physical interference between the first nut 21A and the housing 30 as shown in Figure 1 The nut through-hole 64 is a notch for avoiding physical interference between the second nut 21B and the housing 30 as shown in Figure 1 The nut notch 51V is a notch for avoiding physical interference between the third nut 21C and the housing 30 as shown in Figure 1 The nut notch 51V is a notch for avoiding physical interference between the third nut 21C and the housing 30 as shown in

[0066] Referring back to Figure 5 , the press piece housing recesses 62P, 62Q, 62R, and 62S are formed in the first, second, third, and fourth corners 60P, 60Q, 60R, and 60S, respectively.

[0067] The press piece housing recess 62P includes an inner bottom surface 62P1. The press piece housing recess 62P is formed so as to surround the first positioning hole 34P. Thus, the first positioning hole 34P is formed in the inner bottom surface 62P1 of the press piece housing recess 62P. The inner bottom surface 62P1 of the press piece housing recess 62P also has an insertion hole 62P2 that penetrates the inner bottom surface 62P1 in the vertical direction. The insertion hole 62P2 is formed so as to be away from the first positioning hole 34P in the width direction.

[0068] The press piece housing recess 62Q includes an inner bottom surface 62Q1. The press piece housing recess 62Q is formed so as to surround the second positioning hole 34Q. Thus, the second positioning hole 34Q is formed in the inner bottom surface 62Q1 of the press piece housing recess 62Q. The inner bottom surface 62Q1 of the press piece housing recess 62Q also has an insertion hole 62Q2 that penetrates the inner bottom surface 62Q1 in the vertical direction. The insertion hole 62Q2 is formed so as to be away from the second positioning hole 34Q in the width direction.

[0069] The inner bottom surface 62P1 of the press piece housing recess 62P and the inner bottom surface 62Q1 of the press piece housing recess 62Q are planes that are parallel to the CPU substrate facing surface 30A, and are disposed lower than the CPU substrate facing surface 30A.

[0070] Each contact piece housing portion 63 is a portion that houses each contact piece 33. Each contact piece housing portion 63 is formed so as to penetrate the housing 30 in the vertical direction.

[0071] Figure 6 is a diagram that views the connector 3 from above. As Figure 6As shown, the pressing groove 61P and the like are formed on the first pitch side 50. Therefore, the first pitch side 50 exists discontinuously in the width direction. For the purpose of explanation later, the portion of the first pitch side 50 missing due to the formation of the pressing groove 61P and the like is indicated by a double-dot chain line, and the first pitch side 50 is indicated by a guide line drawn from this double-dot chain line.

[0072] Similarly, the pressing groove 61R and the like are formed on the second spacing side 51. Therefore, the second spacing side 51 exists discontinuously in the width direction. For the purpose of explanation later, the part of the second spacing side 51 missing due to the formation of the pressing groove 61R and the like is indicated by a double-dot chain line, and the second spacing side 51 is indicated by a guide line drawn from this double-dot chain line.

[0073] like Figure 6 As shown, a plurality of contact elements 31 extend from the first pitch side 50 to the second pitch side 51.

[0074] The following is for reference Figures 7 to 12 The first positioning hole 34P, the second positioning hole 34Q, the high voltage side pressure member 32P, the high voltage side pressure member 32Q, the low voltage side pressure member 32R, and the low voltage side pressure member 32S are described in more detail. Figure 7 for Figure 6 Enlarged view of section P in the middle. Figure 8 for Figure 6 A magnified view of the Q section.

[0075] like Figure 7 As shown, the first positioning hole 34P is a circular hole that penetrates the housing 30 in the vertical direction and has an inner edge 34PE.

[0076] The high-voltage side pressure member 32P includes: a reinforcing plate portion 70, two welding feet 71, and a pressure member elastic sheet 72.

[0077] The reinforcing plate portion 70 is flat and is housed within the pressure member receiving recess 62P, covering the inner bottom surface 62P1 of the pressure member receiving recess 62P. The reinforcing plate portion 70 has a positioning through hole 73 and an elastic sheet insertion hole 74.

[0078] The reinforcing plate portion 70 covers the inner bottom surface 62P1 of the pressure member receiving recess 62P around the first positioning hole 34P. Specifically, the reinforcing plate portion 70 is formed not to cover the inner edge 34PE of the first positioning hole 34P. Specifically, when viewed from above, the inner edge 34PE of the first positioning hole 34P is located within the inner edge 73A of the positioning through hole 73 of the reinforcing plate portion 70. Accordingly, the reinforcing plate portion 70, made of metal, does not obstruct the positioning function of the inner edge 34PE of the first positioning hole 34P and the first positioning pin 22P. Furthermore, the reinforcing plate portion 70, made of metal, reduces the amount of deformation when deforming outward in the radial direction due to contact between the first positioning hole 34P and the first positioning pin 22P, thereby preventing a significant decrease in the positioning accuracy achieved through the positioning function.

[0079] Each of the two solder feet 71 protrudes downward from the reinforcing plate portion 70 toward the input / output substrate 4 and is soldered to, for example, Figure 1 The corresponding power supply pad 12 of the input / output substrate 4 is shown. Therefore, the two solder feet 71 are formed to protrude downward beyond the input / output substrate opposing surface 30B of the housing 30. One of the two solder feet 71 is press-fitted into the press-fit groove 61P, thereby holding the high-voltage side clamp 32P by the housing 30.

[0080] The pressure member elastic plate 72 is supported by the reinforcing plate portion 70 in a cantilever beam manner. The pressure member elastic plate 72 is received in the insertion hole 62P2 of the pressure member receiving recess 62P. The pressure member elastic plate 72 is positioned below the reinforcing plate portion 70. Details of the pressure member elastic plate 72 will be described later.

[0081] like Figure 8 As shown, the second positioning hole 34Q is a slot that penetrates the housing 30 in the vertical direction and has an inner edge 34QE.

[0082] Like the high-voltage side pressure member 32P, the high-voltage side pressure member 32Q includes: a reinforcing plate portion 70, two welding feet 71, and a pressure member elastic sheet 72.

[0083] The reinforcing plate portion 70 is flat and is housed within the pressure member receiving recess 62Q, covering the inner bottom surface 62Q1 of the pressure member receiving recess 62Q. The reinforcing plate portion 70 has a positioning through hole 73 and an elastic sheet insertion hole 74.

[0084] The reinforcing plate portion 70 is configured to cover the inner bottom surface 62Q1 of the pressure member receiving recess 62Q around the second positioning hole 34Q. Specifically, the reinforcing plate portion 70 is formed not to cover the inner edge 34QE of the second positioning hole 34Q. Specifically, when viewed from above, the inner edge 34QE of the second positioning hole 34Q is located within the inner edge 73A of the positioning through hole 73 of the reinforcing plate portion 70. Accordingly, the reinforcing plate portion 70, made of metal, does not obstruct the positioning function of the inner edge 34QE of the second positioning hole 34Q and the second positioning pin 22Q. Furthermore, the reinforcing plate portion 70, made of metal, reduces the amount of deformation when the second positioning hole 34Q deforms outward in the radial direction due to contact with the second positioning pin 22Q, thereby preventing a significant decrease in the positioning accuracy achieved through the positioning function.

[0085] Each of the two solder feet 71 protrudes downward from the reinforcing plate portion 70 toward the input / output substrate 4 and is soldered to, for example, Figure 1 The corresponding power supply pad 12 of the input / output substrate 4 is shown. Therefore, the two solder feet 71 are formed to protrude downward beyond the input / output substrate opposing surface 30B of the housing 30. One of the two solder feet 71 is press-fitted into the press-fit groove 61Q, thereby holding the high-voltage side clamp 32Q in place by the housing 30.

[0086] The pressure member elastic plate 72 is supported by the reinforcing plate portion 70 in a cantilever beam manner. The pressure member elastic plate 72 is received in the insertion hole 62Q2 of the pressure member receiving recess 62Q. The pressure member elastic plate 72 is positioned below the reinforcing plate portion 70. Details of the pressure member elastic plate 72 will be described later.

[0087] like Figure 6 The low-voltage side voltage element 32R and low-voltage side voltage element 32S shown are formed to be almost symmetrical with the high-voltage side voltage element 32P and high-voltage side voltage element 32Q respectively in the spacing direction. However, it should be noted that elements such as... are omitted in the low-voltage side voltage element 32R and low-voltage side voltage element 32S. Figure 7 and Figure 8 The positioning through hole 73 is shown.

[0088] The following is for reference Figure 9 and Figure 10 The pressure elastic sheet 72 will be described in more detail. Since the pressure elastic sheets 72 of the high-voltage side pressure members 32P and 32Q have the same shape, the pressure elastic sheet 72 of the high-voltage side pressure member 32Q will be described as a representative example, and the description of the pressure elastic sheet 72 of the high-voltage side pressure member 32P will be omitted.

[0089] Figure 9 This is a perspective view of the pressure piece 32. Figure 10 This is a side view of the pressure piece 32. Figure 11 This is a top view of the pressure piece 32.

[0090] like Figure 10 As shown, the pressure member elastic sheet 72 includes: a spring body 80, a contact portion 81, and a displacement limiting portion 82. The spring body 80, the contact portion 81, and the displacement limiting portion 82 are formed continuously and sequentially from the base to the end of the pressure member elastic sheet 72.

[0091] The spring piece 80 couples the contact portion 81 to the reinforcing plate portion 70, thereby allowing elastic displacement of the contact portion 81 in the vertical direction. The spring piece 80 extends from the end portion 70A of the reinforcing plate portion 70 in the spacing direction. The spring piece 80 extends downward into the lower space 70B of the reinforcing plate portion 70 in the spacing direction. The spring piece 80 includes, sequentially from the end portion 70A of the reinforcing plate portion 70 to the contact portion 81, a bent portion 80A and an extension portion 80B. The bent portion 80A extends downward from the end portion 70A of the reinforcing plate portion 70 and is also bent into a semi-circular arc convex in the spacing direction. The extension portion 80B extends linearly from the bent portion 80A in the spacing direction. The extension portion 80B may extend parallel to the spacing direction or may be slightly inclined in the spacing direction. The extension portion 80B extends in the lower space 70B of the reinforcing plate portion 70, indicated by a double-dot chain line.

[0092] Contact 81 is used when the CPU substrate 2 is pressed toward the connector 3, such as... Figure 2 The portion of the CPU substrate 2 shown that contacts the power supply pad 7 on the connector facing surface 2A is shown. The contact portion 81 is configured to be higher than the spring body 80. Specifically, the contact portion 81 is formed to face the spring body 80 in the vertical direction. The contact portion 81 is formed to approach the bent portion 80A from the end of the extension portion 80B. The contact portion 81 is bent into an upwardly convex V-shape and inserted into the elastic insert hole 74 of the reinforcing plate portion 70. Before assembling the information processing device 1 (that is, when no load is applied to the pressure elastic sheet 72), the contact portion 81 protrudes upward beyond the... Figure 10 The CPU substrate facing surface 30A of the housing 30 shown is indicated by a double-dot chain line.

[0093] The displacement limiting part 82 restricts the upward elastic displacement of the contact part 81. In this embodiment, the displacement limiting part 82 restricts the upward displacement of the contact part 81 beyond a preset displacement value. Figure 11 As shown, the displacement limiting portion 82 includes a pair of protrusions 83. The pair of protrusions 83 protrude from one end 81A of the contact portion 81 in the width direction in opposite directions. Therefore, before assembling the information processing device 1 (i.e., when no load is applied to the pressure elastic sheet 72), the pair of protrusions 83 are perpendicular to each other in the vertical direction. Figure 10 The lower surfaces 70C of the reinforcing plate 70 shown face each other. For example... Figure 11As shown, the dimension 82W of the displacement limiting part 82 in the width direction is larger than the dimension 74W of the elastic sheet insertion hole 74 in the width direction. In this state, when the contact part 81 is pulled upward due to some reason (e.g., the assembly operator's hand, fingers, or clothing around the contact part 81), the pair of protrusions 83 also move upward, and thus... Figure 10 The lower surface 70C of the reinforcing plate portion 70 is in contact with the contact portion 81. This limits further upward displacement of the contact portion 81, thereby preventing curling deformation of the pressure elastic sheet 72. When the pair of protrusions 83 contact the lower surface 70C of the reinforcing plate portion 70, the displacement of the pressure elastic sheet 72 is within the elastic range of the pressure elastic sheet 72, minimizing damage to the pressure elastic sheet 72 caused by pulling the contact portion 81 upward.

[0094] When the CPU substrate 2 is pressed toward the connector 3, the contact portion 81 and... Figure 2 The corresponding power supply pad 7 of the connector facing surface 2A of the CPU substrate 2 shown makes contact, and the contact portion 81 is as follows: Figure 12 The downward elastic displacement is shown. At this time, the spring body 80 mainly bends downward.

[0095] As a result of the downward elastic displacement of the contact portion 81, the contact portion 81 no longer protrudes upward beyond the CPU substrate opposing surface 30A, and therefore the contact portion 81 no longer contacts the housing 30. This is because... Figure 5 As shown, the pressing member receiving recess 62Q has an insertion hole 62Q2, and the pressing member elastic piece 72 is received in the insertion hole 62Q2. Specifically, because there is an insertion hole 62Q2 that penetrates the housing 30 in the vertical direction, the pressing member elastic piece 72 and the housing 30 will not physically interfere with each other when the pressing member elastic piece 72 elastically deforms. It should be noted that a notch for receiving the pressing member elastic piece 72 can be formed in the pressing member receiving recess 62Q instead of forming the insertion hole 62Q2 in the pressing member receiving recess 62Q.

[0096] Although the displacement limiting part 82 includes a pair of protrusions 83, one of the protrusions 83 may be omitted. Furthermore, although the pair of protrusions 83 protrude from the contact part 81 in the width direction, the pair of protrusions 83 may also protrude from the contact part 81 in the spacing direction.

[0097] Furthermore, when no load is applied to the pressure elastic sheet 72, the pair of protrusions 83 constituting the displacement limiting portion 82 may not face the lower surface 70C of the reinforcing plate portion 70 in the vertical direction. Specifically, the displacement limiting portion 82 may only face the lower surface 70C of the reinforcing plate portion 70 in the vertical direction after the contact portion 81 is pulled upward.

[0098] Also, the pair of protrusions 83 that constitute the displacement restriction portion 82 can be in contact with the lower surface 70C of the reinforcing plate portion 70 before the information processing apparatus 1 is assembled.

[0099] The following description is made with reference to Figure 13 Each contact 33 and each contact housing portion 63 are described.

[0100] As Figure 13 shown, each contact housing portion 63 is formed to house each contact 33 in the housing 30. As Figure 14 shown, each contact housing portion 63 is composed of a press-fit space 301, a solder joint inspection hole 302, and a separation wall 303. The press-fit space 301 and the solder joint inspection hole 302 are formed to be apart from each other in the width direction. The separation wall 303 is a wall that separates the press-fit space 301 and the solder joint inspection hole 302 in the width direction.

[0101] The press-fit space 301 is formed as a through-hole that penetrates the housing 30 in the vertical direction. Specifically, the press-fit space 301 is open toward the CPU substrate opposing face 30A and the input / output substrate opposing face 30B. With each press-fit space 301, the housing 30 includes two pitch separation surfaces 304 that separate the press-fit space 301 in the pitch direction. Figure 14 Only one of the two pitch separation surfaces 304 is depicted. In Figure 15 , the cross-sectional shape of the press-fit space 301 and the solder joint inspection hole 302 is designated by a double-dot chain line. As Figure 15 shown, on each pitch separation surface 304, a press-fit groove 305 is formed that extends in the vertical direction. Each pitch separation surface 304 includes a press-fit surface 305A that separates the press-fit groove 305 in the pitch direction.

[0102] Referring back to Figure 14 , the solder joint inspection hole 302 is a through-hole that penetrates the housing 30 in the vertical direction. Specifically, the solder joint inspection hole 302 is open toward the CPU substrate opposing face 30A and the input / output substrate opposing face 30B.

[0103] As described above, the separation wall 303 is a wall that spatially separates the press-fit space 301 and the solder joint inspection hole 302, and is formed between the press-fit space 301 and the solder joint inspection hole 302. As Figure 15 shown, the separation wall 303 includes a first separation surface 306 that separates the press-fit space 301 in the width direction, and a second separation surface 307 that separates the solder joint inspection hole 302 in the width direction. The first separation surface 306 and the second separation surface 307 are surfaces that are orthogonal to the width direction. As Figure 14 and Figure 15As shown, the separation wall 303 has a notch 308 that opens toward the press-fit space 301 and the weld connection inspection hole 302 and also toward the input / output substrate opposing surface 30B. The notch 308 is formed at the lower end of the separation wall 303.

[0104] Figure 16 These are oblique views of each contact element 33. Figure 16 As shown, each contact element 33 includes: a press-fit part 320, a welding part 321, and an electrical contact spring piece 322.

[0105] The pressing section 320 is for pressing into such... Figure 15 The portion shown is the press-fit space 301. Specifically, the press-fit part 320 presses into the press-fit space 301, thereby securing each contact member 33 to the housing 30. Refer back to... Figure 16 The press-fit section 320 is a plate orthogonal to the width direction and includes a press-fit section body 323 and two press-fit lances 324. The two press-fit lances 324 are formed to protrude from both ends of the press-fit section body 323 in the spacing direction.

[0106] Welding part 321 is welded to such Figure 1 The corresponding signal pads 15 of the input / output board 4 shown. For example... Figure 16 As shown, the welding portion 321 includes: a horizontal extension portion 321A extending from the lower end of the press-fit portion 320 in the width direction, and a curved portion 321B bending upward from the horizontal extension portion 321A.

[0107] Electrical contact spring 322 is used as such Figure 2 The portion showing the electrical contact point between the CPU substrate 2 and the corresponding signal pad 10. For example... Figure 16 As shown, the electrical contact spring sheet 322 includes: a spring sheet connecting portion 325, an easily elastically deformable portion 326, and a contact portion 327. The spring sheet connecting portion 325, the easily elastically deformable portion 326, and the contact portion 327 are formed sequentially and continuously.

[0108] The spring sheet connecting part 325 extends downward from the upper end of the press-fit part 320.

[0109] The easily deformable portion 326 extends from the lower end of the spring sheet connecting portion 325 and is formed in a U-shape that is convex in the width direction. Specifically, the easily deformable portion 326 includes a lower straight portion 326A, a curved portion 326B, and an upper straight portion 326C. The lower straight portion 326A, the curved portion 326B, and the upper straight portion 326C are formed sequentially and continuously. The lower straight portion 326A and the upper straight portion 326C face each other in the vertical direction. The lower straight portion 326A and the upper straight portion 326C are connected by the curved portion 326B.

[0110] The contact portion 327 is a portion that can be in electrical contact with the corresponding signal pad 10 of the CPU substrate 2 as shown. Figure 2 As shown, the contact portion 327 is provided at the end of the upper straight portion 326C of the easily elastically deformable portion 326, and is bent to be convex upward. Figure 16

[0111] Figure 15 The state in which each contact piece 33 is fitted to each contact piece housing portion 63 is depicted. In order to fit each contact piece 33 to each contact piece housing portion 63, each contact piece 33 is press-fitted into the press-fitting space 301 of each contact piece housing portion 63 from below. At this time, as shown, the two press-fitting spears 324 of the press-fitting portion 320 engage the two pitch separation surfaces 304, respectively. Figure 16 In other words, as shown, each press-fitting spear 324 of the two press-fitting spears 324 of the press-fitting portion 320 engages the press-fitting surface 305A of the press-fitting groove 305 formed on the two pitch separation surfaces 304. Figure 16

[0112] Referring back to Figure 15 When each contact piece 33 is fitted to each contact piece housing portion 63, the easily elastically deformable portion 326 is housed in the press-fitting space 301, and the contact portion 327 protrudes upward from the CPU substrate opposing surface 30A accordingly. Also, the solder portion 321 passes through the gap 308 and reaches the solder connection inspection hole 302. In more detail, the horizontally extending portion 321A of the solder portion 321 extends in the width direction within the gap 308, and the bent portion 321B is located within the solder connection inspection hole 302. In this state, when the press-fitting portion 320 comes into contact with the separation wall 303 of the housing 30, the solder portion 321 and the electrical contact spring piece 322 do not come into contact with the housing 30.

[0113] Figure 15 The state in which the solder portion 321 is soldered to the corresponding signal pad 15 of the input / output substrate 4 is depicted. As shown, when the solder portion 321 is connected to the signal pad 15 by soldering, the solder fillet 330 is formed between the bent portion 321B of the solder portion 321 and the signal pad 15. In general, once the solder fillet 330 is formed, the solder portion 321 is considered to be normally soldered to the signal pad 15. Therefore, in the present embodiment, the housing 30 is provided with the solder connection inspection hole 302, by which the presence of the solder fillet 330 can be inspected from above through the solder connection inspection hole 302. This can be used to determine whether soldering of each contact piece 33 has been successfully completed after the connector 3 is mounted on the input / output substrate 4. Figure 15

[0114] ​​​In the present embodiment, a separation wall 303 separating the press-fit space 301 and the solder joint inspection hole 302 is formed as described above. The presence of the separation wall 303 prevents the occurrence of the chipping of the housing 30 when the press-fit portion 320 is press-fitted into the press-fit space 301, which can move into the solder joint inspection hole 302. Accordingly, the solder fillet 330 is easily confirmed from above through the solder joint inspection hole 302.

[0115] The first embodiment described above has the following features.

[0116] As shown in Figure 1 and Figure 2 , the connector 3 (board-to-board connector) is mounted on the input / output substrate 4 (first substrate) and is interposed between the input / output substrate 4 and the CPU substrate 2 (second substrate), whereby the plurality of signal pads 15 (pads) of the input / output substrate 4 and the plurality of signal pads 10 (pads) of the CPU substrate 2 are electrically connected, respectively. As shown in Figure 3 and Figure 4 , the connector 3 includes a flat plate-shaped housing 30, a plurality of contact pieces 33 held to the housing 30, and a high-voltage-side press piece 32Q (press piece) made of metal. As shown in Figure 1 and Figure 5 , the housing 30 includes an input / output substrate-opposing surface 30B (lower surface of the housing) facing the input / output substrate 4 when the connector 3 is mounted on the input / output substrate 4, and a CPU substrate-opposing surface 30A (upper surface of the housing), which is the opposite surface of the input / output substrate-opposing surface 30B. As shown in Figure 5 , a press piece housing recess 62Q is formed on the CPU substrate-opposing surface 30A. As shown in Figure 8 , the high-voltage-side press piece 32Q includes a flat plate-shaped reinforcing plate portion 70, which is housed in the press piece housing recess 62Q and covers the inner bottom surface 62Q1 of the press piece housing recess 62Q, a solder leg 71 protruding downward from the reinforcing plate portion 70, and a press piece elastic piece 72 supported by the reinforcing plate portion 70 in a cantilever beam manner. As shown in Figure 10 , the press piece elastic piece 72 includes, in order from the base portion to the end portion of the press piece elastic piece 72, an elastic piece body 80, a contact portion 81 protruding upward beyond the CPU substrate-opposing surface 30A, and a displacement restricting portion 82 restricting upward displacement of the contact portion 81. The housing 30 is formed such that the contact portion 81 does not contact the housing 30 when the contact portion 81 no longer protrudes upward beyond the CPU substrate-opposing surface 30A, and thus, as shown in Figure 12 , the contact portion 81 is displaced downward. This structure achieves that the contact portion 81 of the press piece elastic piece 72 provided to the press piece 32 can be easily elastically displaced and the curling deformation of the press piece elastic piece 72 is prevented by the displacement restricting portion 82.

[0117] The displacement limiting part 82 restricts the upward displacement of the contact part 81 beyond a preset displacement value. In this structure, no load is applied to the pressure member elastic sheet 72 before using the connector 3.

[0118] The displacement limiting part 82 restricts the upward displacement of the contact part 81 by contacting the reinforcing plate part 70. In this structure, compared with the case where the upward displacement of the contact part 81 is restricted by contacting the housing 30, the displacement limiting part 82 more reliably restricts the upward displacement of the contact part 81.

[0119] Displacement limiting part 82 via, as Figure 10 The lower surface 70C of the reinforcing plate 70 shown contacts and restricts the upward displacement of the contact portion 81. In this structure, there is no need for a special structure to make the high-voltage side pressure member 32Q contact the displacement restriction portion 82, and the high-voltage side pressure member 32Q can be achieved with this simple structure.

[0120] The displacement limiting part 82 faces the lower surface 70C of the reinforcing plate part 70 in the vertical direction. In this structure, when the contact part 81 is displaced upward, the displacement limiting part 82 can reliably contact the lower surface 70C of the reinforcing plate part 70.

[0121] The displacement limiting part 82 includes a protrusion 83 that protrudes in the width direction, which is orthogonal to the length direction of the contact part 81. The protrusion 83 faces the lower surface 70C of the reinforcing plate part 70 in the vertical direction. In this structure, when the contact part 81 is displaced upward, the displacement limiting part 82 can reliably contact the lower surface 70C of the reinforcing plate part 70.

[0122] like Figures 8 to 11 As shown, the reinforcing plate portion 70 has an elastic sheet insertion hole 74 into which the contact portion 81 is inserted. The displacement limiting portion 82 includes a pair of protrusions 83 that project in opposite directions in the width direction, the width direction being orthogonal to the length direction of the contact portion 81. The pair of protrusions 83 face the lower surface 70C of the reinforcing plate portion 70 in the vertical direction. In this structure, when the contact portion 81 is displaced upward, the displacement limiting portion 82 contacts the lower surface 70C of the reinforcing plate portion 70 more reliably.

[0123] like Figure 10 As shown, the contact portion 81 is bent into an upward convex shape. In this structure, the contact portion 81 effectively functions as... Figure 2 Wiping effect on the corresponding signal pad 10 of the CPU substrate 2 shown.

[0124] like Figure 10As shown, at least a portion of the spring body 80 extends within the lower space 70B of the reinforcing plate portion 70. In this embodiment, the extension 80B of the spring body 80 extends within the lower space 70B of the reinforcing plate portion 70. Specifically, even if the cross-sectional area of ​​the spring body 80 is large, as long as the spring body 80 has sufficient length, it will not hinder the ease of elastic displacement of the contact portion 81. If the cross-sectional area of ​​the spring body 80 is larger, the allowable current of the spring body 80 can be set higher. However, if the length of the spring body 80 is larger, the size of the connector 3 will increase when viewed from above. Therefore, this structure can simultaneously achieve: miniaturization of the connector 3 when viewed from above, and high allowable current of the spring body 80.

[0125] like Figure 8 As shown, the inner bottom surface 62Q1 of the pressure member receiving recess 62Q has a second positioning hole 34Q (positioning hole). The reinforcing plate portion 70 is formed to cover the inner bottom surface 62Q1 of the pressure member receiving recess 62Q around the second positioning hole 34Q. This structure reduces the amount of deformation when the second positioning hole 34Q deforms outward in the radial direction, thereby avoiding a significant decrease in positioning accuracy due to the second positioning hole 34Q.

[0126] like Figure 8 As shown, the reinforcing plate portion 70 is formed so as not to cover the inner edge 34QE of the second positioning hole 34Q. In this structure, the positioning function of the inner edge 34QE of the second positioning hole 34Q is not obstructed.

[0127] Although the first embodiment has been described above, the first embodiment can be modified as follows.

[0128] Although connector 3 includes four clamping members 32, connector 3 may also include only two clamping members 32 or only one clamping member 32.

[0129] Although connector 3 includes a plurality of contacts 33, connector 3 may include only one contact 33.

[0130] Second Embodiment

[0131] The following is for reference Figure 17 The second embodiment will be described below. The main focus here is on the differences between this embodiment and the first embodiment described above, and repeated descriptions will be omitted. Figure 17 This is a partial cross-sectional oblique view of connector 3.

[0132] In the first embodiment described above, as Figure 9 As shown, the reinforcing plate portion 70 has an elastic sheet insertion hole 74, and the contact portion 81 of the pressure member elastic sheet 72 is inserted into the elastic sheet insertion hole 74.

[0133] In this embodiment, as Figure 17As shown, the reinforcing plate portion 70 has an elastic sheet insertion notch 90, and the contact portion 81 of the pressure member elastic sheet 72 is inserted into the elastic sheet insertion notch 90. This structure serves to reduce the weight of the pressure member 32.

[0134] Third Embodiment

[0135] The following describes Figure 18 the third embodiment. Hereinafter, differences between the present embodiment and the above-described first embodiment will mainly be described, and repeated descriptions will be omitted. Figure 18 is a side view of the pressure member 32.

[0136] In the above-described embodiments, as shown in Figure 9 the reinforcing plate portion 70 has an elastic sheet insertion hole 74, and the contact portion 81 of the pressure member elastic sheet 72 is inserted into the elastic sheet insertion hole 74.

[0137] In the present embodiment, as shown in Figure 18 the elastic sheet insertion hole 74 of the reinforcing plate portion 70 is omitted. When viewed from above, the extension portion 80B of the elastic sheet body 80 of the pressure member elastic sheet 72 is formed in an L shape, and includes a first extension portion 91 extending from the lower end of the curved portion 80A in the width direction, and a second extension portion 92 extending from the end portion of the first extension portion 91 in the pitch direction. The second extension portion 92 and the contact portion 81 do not face the reinforcing plate portion 70 in the vertical direction, and are provided at positions different from the reinforcing plate portion 70 in the width direction. In this structure, the working space when the contact portion 81 is bent is sufficiently large, whereby the manufacturing cost of the pressure member elastic sheet 72 is reduced.

[0138] Fourth Embodiment

[0139] The following describes Figure 19 the fourth embodiment. Hereinafter, differences between the present embodiment and the above-described first embodiment will mainly be described, and repeated descriptions will be omitted. Figure 19 is a side view of the pressure member 32.

[0140] In the above-described first embodiment, as shown in Figure 10 the contact portion 81 faces the elastic sheet body 80 in the vertical direction.

[0141] In the present embodiment, as shown in Figure 19 the contact portion 81 does not face the elastic sheet body 80 in the vertical direction, and is provided at a position different from the elastic sheet body 80 in the pitch direction. Specifically, when viewed from the side, the elastic sheet body 80 and the contact portion 81 are formed in an S shape. In this structure, since the contact portion 81 is away from the curved portion 80A, and serves as a substantial support point of the elastic deformation of the pressure member elastic sheet 72 in the pitch direction, the pressure member elastic sheet 72 can be easily elastically deformed when the pressing force acting downward on the contact portion 81 is increased.

[0142] The first to fourth embodiments can be combined as desired by a person skilled in the art.

[0143] In light of the foregoing, it will be apparent to those of ordinary skill in the art that the embodiments of the present application can be modified in various ways. Such modifications should not be considered as a departure from the spirit and scope of the present application, and it is intended that all such modifications be considered as included within the scope of the following claims.

Claims

1. A board-to-board connector characterized by comprising: The board-to-board connector is mounted on a first substrate and built in between the first substrate and a second substrate to electrically connect a plurality of pads of the first substrate to a plurality of pads of the second substrate, and includes: a housing in a flat plate shape; a plurality of contact pieces held on the housing; and a press piece made of metal, the housing includes a lower surface of the housing facing the first substrate when the board-to-board connector is mounted on the first substrate, and an upper surface of the housing opposite to the lower surface of the housing, a press piece housing recess is formed on the upper surface of the housing, and the press piece housing recess has an insertion hole or a notch, the press piece includes: a reinforcing plate portion in a flat plate shape housed in the press piece housing recess and covering an inner bottom surface of the press piece housing recess; a solder tail protruding downward from the reinforcing plate portion; and a press piece elastic piece supported by the reinforcing plate portion in a cantilever beam manner, the press piece elastic piece includes, in order from a base portion to a tip portion thereof: a spring body; a contact portion protruding upward beyond the upper surface of the housing to electrically connect; and a displacement restriction portion to restrict upward displacement of the contact portion, wherein the press piece elastic piece is housed in the insertion hole or the notch of the press piece housing recess, the housing is formed such that the contact portion does not contact the housing when the contact portion is displaced downward and no longer protrudes upward beyond the upper surface of the housing, and the spring body of the press piece elastic piece extends to downwardly enter a lower space of the reinforcing plate portion. The displacement restriction portion restricts upward displacement of the contact portion beyond a predetermined value.

2. The board-to-board connector according to claim 1, wherein The displacement restriction portion restricts upward displacement of the contact portion by contacting the reinforcing plate portion.

3. The board-to-board connector according to claim 1 or 2, wherein The displacement restriction portion restricts upward displacement of the contact portion by contacting a lower surface of the reinforcing plate portion.

4. The board-to-board connector according to claim 1 or 2, wherein The displacement restriction portion faces the lower surface of the reinforcing plate portion in a vertical direction.

5. The board-to-board connector according to claim 4, wherein 6. The board-to-board connector according to claim 5, wherein the displacement restriction portion includes a protruding portion protruding in a direction orthogonal to a length direction of the contact portion, and the protruding portion faces the lower surface of the reinforcing plate portion in the vertical direction.

7. The board-to-board connector according to claim 5, wherein the reinforcing plate portion has an elastic piece insertion hole into which the contact portion is inserted, the displacement restriction portion includes a pair of protruding portions protruding in opposite directions to each other in a direction orthogonal to a length direction of the contact portion, and the pair of protruding portions face the lower surface of the reinforcing plate portion in the vertical direction. The contact portion is curved to be convex upward.

8. The board-to-board connector according to claim 1 or 2, wherein At least a portion of the spring body extends in a lower space of the reinforcing plate portion.

9. The board-to-board connector according to claim 1 or 2, wherein 10. The board-to-board connector according to claim 1 or 2, wherein the inner bottom surface of the press piece housing recess has a positioning hole, and the reinforcing plate portion is formed to cover the inner bottom surface of the press piece housing recess around the positioning hole. The reinforcing plate portion is formed not to cover an inner edge of the positioning hole.

11. The board-to-board connector of claim 10, wherein, ​

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