Heat dissipation methods for components and related components

Abstract

The present invention discloses a component heat dissipation method and related components, applicable to the heat dissipation field. The method comprises determining the temperature of a component running on a server while the component is in place, determining the temperature of the server, and controlling the rotation of a fan to dissipate heat from the component based on the component and server temperatures. The component and server temperatures are determined, and heat dissipation calculations are performed based on the component's own temperature and the server's temperature. This calculation result can be optimized to meet the component's heat dissipation requirements, thereby controlling fan rotation. This improves the fan's heat dissipation, reduces component failures due to overheating, and improves server operational stability.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation, and in particular to a heat dissipation method for a component and related components. Background Art

[0002] The Baseboard Management Controller (BMC) is a server-specific management controller that automatically monitors the server's operating status and makes timely adjustments based on the current state. For example, it controls fan rotation to dissipate heat for other components. Failure to dissipate heat in a timely manner can cause components to overheat, impacting server operation. Therefore, the BMC plays a crucial role in controlling fan cooling. Existing technologies often use the same fan speed to dissipate heat for each component. However, this can lead to poor cooling performance due to the varying temperature thresholds and cooling requirements of each component. Summary of the Invention

[0003] The present invention aims to provide a component heat dissipation method and related components. This method calculates heat dissipation based on the component's own temperature and the server's temperature, ensuring that the calculated result better meets the component's heat dissipation requirements and, in turn, controls fan rotation. This method improves the fan's heat dissipation, reduces component failures due to overheating, and improves server operational stability.

[0004] In order to solve the above technical problems, the present invention provides a heat dissipation method for a component, comprising:

[0005] determining a temperature of a component while the component is in place while operating on a server;

[0006] determining a temperature of the server;

[0007] The fan is controlled to rotate according to the temperature of the component and the temperature of the server to dissipate heat for the component.

[0008] Preferably, determining the temperature of a component when the component is in place while running on the server includes:

[0009] Obtaining the in-place status of the component through the IPMI interface, wherein the in-place status includes in-place and out-of-place;

[0010] When the in-place state of the component is in-place, determining a working state of the component, the working state including normal operation and failure;

[0011] determining a temperature of the component;

[0012] The working status of the component and the temperature of the component are stored in the storage space.

[0013] Preferably, before saving the working status of the component and the temperature of the component in a preset storage space, the method further includes:

[0014] Get the key from the keystore;

[0015] The storage space is created by encrypting with the key.

[0016] Preferably, determining the temperature of a component when the component is in place while running on the server includes:

[0017] When a component running on the server is in place, obtaining the temperature of the component at a preset frequency and saving the temperature in the storage space;

[0018] Determine the temperature of the server, including:

[0019] The temperature of the server is obtained at a preset frequency and saved in a storage space.

[0020] Preferably, controlling the rotation of a fan to dissipate heat for the component according to the temperature of the component and the temperature of the server includes:

[0021] Calculating a plurality of PWM values ​​based on the temperature of the component and the temperature of the server according to the preset values ​​stored in the storage space;

[0022] The fan is controlled to rotate at a maximum speed among the speeds corresponding to the plurality of PWM values.

[0023] Preferably, before controlling the fan to rotate according to the temperature of the component and the temperature of the server to dissipate heat for the component, the method further includes:

[0024] When the working state of the component is a fault, the fan is controlled to rotate according to a rotation speed corresponding to the fault, the temperature of the component and the temperature of the server to dissipate heat for the component.

[0025] Preferably, controlling the fan to rotate to dissipate heat for the component according to the rotation speed corresponding to the fault, the temperature of the component, and the temperature of the server includes:

[0026] Calculating a plurality of PWM values ​​based on the temperature of the component and the temperature of the server according to the preset values ​​stored in the storage space;

[0027] Determining the maximum speed among the speeds corresponding to the plurality of PWM values;

[0028] The fan is controlled to rotate at a speed obtained by adding the speed to a speed corresponding to the fault.

[0029] In order to solve the above technical problems, the present invention further provides a heat dissipation system for a component, comprising:

[0030] a first determining unit, configured to determine a temperature of a component running on a server when the component is in place;

[0031] a second determining unit, configured to determine a temperature of the server;

[0032] The control unit is used to control the rotation of the fan to dissipate heat for the component according to the temperature of the component and the temperature of the server.

[0033] To solve the above technical problems, the present invention further provides a BMC, comprising:

[0034] memory for storing computer programs;

[0035] The processor is used to implement the steps of the heat dissipation method of the above components when executing the computer program.

[0036] To solve the above technical problems, the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the heat dissipation method of the above components are implemented.

[0037] This application provides a component heat dissipation method and related components for use in the heat dissipation field. The method comprises determining the temperature of a component running on a server while the component is in place, determining the temperature of the server, and controlling the rotation of a fan to dissipate heat from the component based on the component and server temperatures. By determining the component and server temperatures and performing heat dissipation calculations based on the component's own and server temperatures, the calculation results can be optimized to better meet the component's heat dissipation requirements, thereby controlling fan rotation. This improves the fan's heat dissipation, reduces component failures due to overheating, and improves server stability during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the prior art and the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 A flow chart of a component heat dissipation method provided by the present invention;

[0040] Figure 2 A schematic structural diagram of a heat dissipation system for a component provided by the present invention;

[0041] Figure 3 This is a structural diagram of a BMC provided by the present invention. DETAILED DESCRIPTION

[0042] The core of this invention is to provide a component heat dissipation method and related components. This method calculates heat dissipation based on the component's own temperature and the server's temperature, ensuring that the calculated result better meets the component's heat dissipation requirements and, in turn, controls fan rotation. This improves the fan's heat dissipation, reduces component failures due to overheating, and improves server operational stability.

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0044] Figure 1 A flow chart of a component heat dissipation method provided by the present invention, the method comprising:

[0045] S11: determining a temperature of a component while the component is in place while running on the server;

[0046] Considering that the BMC (Baseboard Management Controller) is a server-specific management controller, it automatically monitors the server's operating status and makes timely adjustments based on the current state. For example, it controls fan rotation to dissipate heat for other components. Failure to dissipate heat in a timely manner can cause components to overheat, impacting server operation. Therefore, the BMC plays a crucial role in controlling fan cooling. Existing technologies often use the same fan speed to dissipate heat for each component. However, due to the different temperature thresholds and cooling requirements of each component, this can lead to poor cooling performance.

[0047] This application obtains the temperature of the component in advance. Since the temperature thresholds and heat dissipation requirements of the components are different, subsequent heat dissipation methods need to be performed according to the temperature of the component.

[0048] S12: Determine the temperature of the server;

[0049] Since the components are running on the server, when cooling the components, it is also necessary to obtain the temperature of the server and then cool the components.

[0050] S13: Control the fan to rotate according to the temperature of the component and the temperature of the server to dissipate heat from the component.

[0051] The fan is controlled to rotate according to the temperature of each component and the temperature of the server to dissipate heat for the components. The speed of the fan for each component is determined by the temperature of the component, avoiding poor heat dissipation caused by different temperature thresholds and heat dissipation requirements of different components.

[0052] This application provides a component heat dissipation method for use in the heat dissipation field. The method involves determining the component's temperature while the component is in place on a server; determining the server's temperature; and controlling fan rotation based on the component and server temperatures to dissipate heat for the component. By determining the component and server temperatures, heat dissipation calculations are performed based on the component's own and server temperatures, ensuring that the calculated results better meet the component's heat dissipation requirements, thereby controlling fan rotation. This improves fan heat dissipation, reduces component failures due to overheating, and improves server operational stability.

[0053] Based on the above embodiment:

[0054] As a preferred embodiment, determining the temperature of a component when the component is in place while running on a server includes:

[0055] Obtain the component's in-place status through the IPMI interface, including in-place and out-of-place status;

[0056] When the component is in-place, the working state of the component is determined, where the working state includes normal operation and failure.

[0057] Determine the temperature of the component;

[0058] The working status and temperature of the components are stored in the storage space.

[0059] The BMC checks the presence of components running on the server and only determines component temperature when they are confirmed to be in place. Because component operating conditions affect component temperature and, in turn, heat dissipation, the BMC also determines whether the component is operating normally or faulty. A faulty component may generate higher temperatures than normal operation, so component temperature significantly affects heat dissipation.

[0060] After obtaining the temperature of the component and the working status of the component, the working status of the component and the temperature of the component are saved in the storage space so that the BMC can obtain the temperature and working status from the storage space, thereby facilitating heat dissipation management.

[0061] In addition, the components are scanned through the IPMI interface, and the working status and in-place status of the components are updated in real time to the storage space, so as to dissipate heat for the components more accurately.

[0062] As a preferred embodiment, before saving the working status and temperature of the component into the preset storage space, the method further includes:

[0063] Get the key from the keystore;

[0064] Create a storage space using key encryption.

[0065] Before saving the component's operating status and temperature to a storage space, you need to request a storage space. Specifically, if a storage space already exists, it can be used directly. If a storage space does not exist, you need to obtain a key through the key, initialize the memory, and then return a usable storage space.

[0066] Before using the storage space, encrypting it with a key can improve security during the heat dissipation process.

[0067] As a preferred embodiment, determining the temperature of a component when the component is in place while running on a server includes:

[0068] When a component running on a server is in place, the temperature of the component is obtained at a preset frequency and saved in a storage space;

[0069] Determine the temperature of the server, including:

[0070] Obtain the server temperature at a preset frequency and save it to the storage space.

[0071] The component and server temperatures are acquired at a preset frequency. This frequency can be set based on specific needs. For example, for components with rapidly changing temperatures, the preset frequency can be adjusted to a higher frequency to prevent overheating caused by untimely fan speed adjustments, which can affect server performance. For components with slowly changing temperatures, the preset frequency can be adjusted to a lower frequency to save energy.

[0072] Adjusting the acquisition frequency according to the component's own characteristics can better manage heat dissipation.

[0073] As a preferred embodiment, controlling the rotation of the fan to dissipate heat from the component according to the temperature of the component and the temperature of the server includes:

[0074] Calculate multiple PWM values ​​based on the preset component temperature and server temperature stored in the storage space;

[0075] The fan is controlled to rotate at the maximum speed among the speeds corresponding to multiple PWM values.

[0076] Considering that different components have different heat dissipation requirements, their own temperature thresholds, and fan speed control points, we pre-calculate the PWM value required for each component to control the fan speed and determine the multiple speed values ​​corresponding to the multiple PWM values. The fan is controlled to rotate at the maximum speed value.

[0077] Controlling the fan to rotate at the maximum speed can ensure that each component is adequately cooled, and prevent some components from being cooled normally while others are not cooled sufficiently, resulting in overheating, due to the fan speed being too low.

[0078] As a preferred embodiment, before controlling the fan to rotate to dissipate heat for the component according to the temperature of the component and the temperature of the server, the method further includes:

[0079] When the working state of a component is a fault, the fan is controlled to rotate according to the speed corresponding to the fault, the temperature of the component and the temperature of the server to dissipate heat for the component.

[0080] As a preferred embodiment, controlling the fan rotation to dissipate heat for the component according to the speed corresponding to the fault, the temperature of the component, and the temperature of the server includes:

[0081] Calculate multiple PWM values ​​based on the preset component temperature and server temperature stored in the storage space;

[0082] Determine the maximum speed among the speeds corresponding to the multiple PWM values;

[0083] The fan is controlled to rotate at a speed obtained by adding the speed corresponding to the fault.

[0084] Considering that components may overheat when they fail, this application incorporates failure factors into the calculation of component heat dissipation. Specifically, a failure has a corresponding required speed. When a fan fails, after calculating the fan speed, the speed corresponding to the failure is added to the calculated speed, and the fan is controlled to rotate at the added speed.

[0085] Adding the rotation speed corresponding to the fault to the calculated rotation speed can better dissipate heat from the components to ensure better operation of the server.

[0086] Figure 2 A schematic structural diagram of a heat dissipation system for a component provided by the present invention, the system comprising:

[0087] A first determining unit 21 is configured to determine a temperature of a component when the component running on the server is in place;

[0088] A second determining unit 22 is configured to determine the temperature of the server;

[0089] The control unit 23 is used to control the rotation of the fan to dissipate heat for the component according to the temperature of the component and the temperature of the server.

[0090] The specific implementation method of the heat dissipation system of a component provided in this application is as follows:

[0091] The first determining unit 21 provided in the present application is specifically configured to obtain the in-place status of a component through an IPMI interface, where the in-place status includes in-place and out-of-place;

[0092] When the component is in-place, the working state of the component is determined, where the working state includes normal operation and failure.

[0093] Determine the temperature of the component;

[0094] The working status and temperature of the components are stored in the storage space.

[0095] The heat dissipation system of the component provided in this application also includes an encryption unit for obtaining a key from a key library; and creating a storage space through key encryption.

[0096] The first determining unit 21 is specifically configured to obtain the temperature of the component at a preset frequency when the component running on the server is in place, and save the temperature to the storage space;

[0097] The second determining unit 22 is specifically configured to obtain the temperature of the server at a preset frequency and save the temperature in the storage space.

[0098] The control unit 23 is specifically configured to calculate a plurality of PWM values ​​according to the preset component temperatures and the server temperature stored in the storage space;

[0099] The fan is controlled to rotate at the maximum speed among the speeds corresponding to multiple PWM values.

[0100] The heat dissipation system of the component provided in the present application also includes a second control unit, which is used to control the rotation of the fan to dissipate heat for the component according to the rotation speed corresponding to the fault, the temperature of the component and the temperature of the server when the working state of the component is faulty.

[0101] The control unit 23 is specifically configured to calculate a plurality of PWM values ​​according to the preset component temperatures and the server temperature stored in the storage space;

[0102] Determine the maximum speed among the speeds corresponding to the multiple PWM values;

[0103] The fan is controlled to rotate at a speed obtained by adding the speed corresponding to the fault.

[0104] Considering that the BMC (Baseboard Management Controller) is a server-specific management controller, it automatically monitors the server's operating status and makes timely adjustments based on the current state. For example, it controls fan rotation to dissipate heat for other components. Failure to dissipate heat in a timely manner can cause components to overheat, impacting server operation. Therefore, the BMC plays a crucial role in controlling fan cooling. Existing technologies often use the same fan speed to dissipate heat for each component. However, due to the different temperature thresholds and cooling requirements of each component, this can lead to poor cooling performance.

[0105] This application obtains the temperature of the component in advance. Due to the different temperature thresholds and heat dissipation requirements of the components, subsequent heat dissipation methods need to be based on the temperature of the component. Since the component runs on the server, when cooling the component, it is also necessary to obtain the temperature of the server and then cool the component.

[0106] The fan is controlled to rotate according to the temperature of each component and the temperature of the server to dissipate heat for the components. The speed of the fan for each component is determined by the temperature of the component, avoiding poor heat dissipation caused by different temperature thresholds and heat dissipation requirements of different components.

[0107] This application provides a component heat dissipation system for use in the heat dissipation field. The system determines the temperature of a component running on a server, determines the temperature of the component, and controls the rotation of a fan based on the component and server temperatures to dissipate heat for the component. By determining the component and server temperatures, heat dissipation calculations are performed based on the component's own and server temperatures, ensuring that the calculated results better meet the component's heat dissipation requirements, thereby controlling fan rotation. This improves the fan's heat dissipation, reduces component failures due to overheating, and improves server operational stability.

[0108] For an introduction to the heat dissipation system of the components provided in this application, please refer to the above embodiments and will not be repeated here.

[0109] Figure 3 This is a structural diagram of a BMC provided by the present invention, which includes:

[0110] Memory 31, for storing computer programs;

[0111] The processor 32 is configured to implement the steps of the above-mentioned component heat dissipation method when executing a computer program.

[0112] Specifically, the steps implemented by the computer program stored in the processor of the BMC provided in this application include:

[0113] Determining the temperature of components while they are in place while running on a server;

[0114] Determine the temperature of the server;

[0115] The fan rotation is controlled according to the temperature of the component and the server to dissipate heat for the component.

[0116] Determine the temperature of components while they are in place while running on the server, including:

[0117] Obtain the component's in-place status through the IPMI interface, including in-place and out-of-place status;

[0118] When the component is in-place, the working state of the component is determined, where the working state includes normal operation and failure.

[0119] Determine the temperature of the component;

[0120] The working status and temperature of the components are stored in the storage space.

[0121] Before saving the working status and temperature of the component into the preset storage space, the following steps are also included:

[0122] Get the key from the keystore;

[0123] Create a storage space using key encryption.

[0124] Determine the temperature of components while they are in place while running on the server, including:

[0125] When a component running on a server is in place, the temperature of the component is obtained at a preset frequency and saved in a storage space;

[0126] Determine the temperature of the server, including:

[0127] Obtain the server temperature at a preset frequency and save it to the storage space.

[0128] Control fan rotation based on component and server temperatures to dissipate heat, including:

[0129] Calculate multiple PWM values ​​based on the preset component temperature and server temperature stored in the storage space;

[0130] The fan is controlled to rotate at the maximum speed among the speeds corresponding to multiple PWM values.

[0131] Before controlling the fan rotation to dissipate heat based on the component and server temperatures, the following steps are also performed:

[0132] When the working state of a component is a fault, the fan is controlled to rotate according to the speed corresponding to the fault, the temperature of the component and the temperature of the server to dissipate heat for the component.

[0133] Control fan rotation to dissipate heat based on the speed corresponding to the fault, component temperature, and server temperature, including:

[0134] Calculate multiple PWM values ​​based on the preset component temperature and server temperature stored in the storage space;

[0135] Determine the maximum speed among the speeds corresponding to the multiple PWM values;

[0136] The fan is controlled to rotate at a speed obtained by adding the speed corresponding to the fault.

[0137] Considering that the BMC (Baseboard Management Controller) is a server-specific management controller, it automatically monitors the server's operating status and makes timely adjustments based on the current state. For example, it controls fan rotation to dissipate heat for other components. Failure to dissipate heat in a timely manner can cause components to overheat, impacting server operation. Therefore, the BMC plays a crucial role in controlling fan cooling. Existing technologies often use the same fan speed to dissipate heat for each component. However, due to the different temperature thresholds and cooling requirements of each component, this can lead to poor cooling performance.

[0138] This application obtains the temperature of the component in advance. Due to the different temperature thresholds and heat dissipation requirements of the components, subsequent heat dissipation methods need to be based on the temperature of the component. Since the component runs on the server, when cooling the component, it is also necessary to obtain the temperature of the server and then cool the component.

[0139] The fan is controlled to rotate according to the temperature of each component and the temperature of the server to dissipate heat for the components. The speed of the fan for each component is determined by the temperature of the component, avoiding poor heat dissipation caused by different temperature thresholds and heat dissipation requirements of different components.

[0140] This application provides a BMC for use in the heat dissipation field. It determines the temperature of a component running on a server when it is in place; determines the temperature of the server; and controls fan rotation based on the component and server temperatures to dissipate heat for the component. By determining the component and server temperatures and performing heat dissipation calculations based on the component's own temperature and the server's temperature, the calculated results can better meet the component's heat dissipation requirements, thereby controlling fan rotation. This improves fan heat dissipation, reduces component failures due to overheating, and improves server operational stability.

[0141] For the introduction of the BMC provided in this application, please refer to the above embodiments and will not be repeated here.

[0142] The present application also provides a host, including the above-mentioned BMC. For an introduction to the host, please refer to the above-mentioned embodiment and will not be repeated here.

[0143] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the heat dissipation method of the above-mentioned components are implemented.

[0144] Specifically, the steps implemented by the computer program include:

[0145] Determining the temperature of components while they are in place while running on a server;

[0146] Determine the temperature of the server;

[0147] The fan rotation is controlled according to the temperature of the component and the server to dissipate heat for the component.

[0148] Determine the temperature of components while they are in place while running on the server, including:

[0149] Obtain the component's in-place status through the IPMI interface, including in-place and out-of-place status;

[0150] When the component is in-place, the working state of the component is determined, where the working state includes normal operation and failure.

[0151] Determine the temperature of the component;

[0152] The working status and temperature of the components are stored in the storage space.

[0153] Before saving the working status and temperature of the component into the preset storage space, the following steps are also included:

[0154] Get the key from the keystore;

[0155] Create a storage space using key encryption.

[0156] Determine the temperature of components while they are in place while running on the server, including:

[0157] When a component running on a server is in place, the temperature of the component is obtained at a preset frequency and saved in a storage space;

[0158] Determine the temperature of the server, including:

[0159] Obtain the server temperature at a preset frequency and save it to the storage space.

[0160] Control fan rotation based on component and server temperatures to dissipate heat, including:

[0161] Calculate multiple PWM values ​​based on the preset component temperature and server temperature stored in the storage space;

[0162] The fan is controlled to rotate at the maximum speed among the speeds corresponding to multiple PWM values.

[0163] Before controlling the fan rotation to dissipate heat based on the component and server temperatures, the following steps are also performed:

[0164] When the working state of a component is a fault, the fan is controlled to rotate according to the speed corresponding to the fault, the temperature of the component and the temperature of the server to dissipate heat for the component.

[0165] Control fan rotation to dissipate heat based on the speed corresponding to the fault, component temperature, and server temperature, including:

[0166] Calculate multiple PWM values ​​based on the preset component temperature and server temperature stored in the storage space;

[0167] Determine the maximum speed among the speeds corresponding to the multiple PWM values;

[0168] The fan is controlled to rotate at a speed obtained by adding the speed corresponding to the fault.

[0169] Considering that the BMC (Baseboard Management Controller) is a server-specific management controller, it automatically monitors the server's operating status and makes timely adjustments based on the current state. For example, it controls fan rotation to dissipate heat for other components. Failure to dissipate heat in a timely manner can cause components to overheat, impacting server operation. Therefore, the BMC plays a crucial role in controlling fan cooling. Existing technologies often use the same fan speed to dissipate heat for each component. However, due to the different temperature thresholds and cooling requirements of each component, this can lead to poor cooling performance.

[0170] This application obtains the temperature of the component in advance. Due to the different temperature thresholds and heat dissipation requirements of the components, subsequent heat dissipation methods need to be based on the temperature of the component. Since the component runs on the server, when cooling the component, it is also necessary to obtain the temperature of the server and then cool the component.

[0171] The fan is controlled to rotate according to the temperature of each component and the temperature of the server to dissipate heat for the components. The speed of the fan for each component is determined by the temperature of the component, avoiding poor heat dissipation caused by different temperature thresholds and heat dissipation requirements of different components.

[0172] This application provides a computer-readable storage medium for use in the field of heat dissipation. The medium determines the temperature of a component running on a server, determines the temperature of the component, and controls fan rotation based on the component and server temperatures to dissipate heat for the component. By determining the component and server temperatures and performing heat dissipation calculations based on the component's own and server temperatures, the calculated results can better meet the component's heat dissipation requirements, thereby controlling fan rotation. This improves fan heat dissipation, reduces component failures due to overheating, and improves server operational stability.

[0173] For an introduction to the computer-readable storage medium provided in this application, please refer to the above embodiments and will not be repeated here.

[0174] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0175] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0176] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for heat dissipation of a component, characterized in that: include: determining a temperature of a component while the component is in place while operating on a server; determining a temperature of the server; controlling the fan to rotate according to the temperature of the component and the temperature of the server to dissipate heat from the component; Determining the temperature of a component operating on a server while the component is in place includes: Obtaining the in-place status of the component through the IPMI interface, wherein the in-place status includes in-place and out-of-place; When the in-place state of the component is in-place, determining a working state of the component, the working state including normal operation and failure; determining a temperature of the component; saving the working status of the component and the temperature of the component in a storage space; Before storing the working state of the component and the temperature of the component in the storage space, the method further includes: Get the key from the keystore; Creating the storage space by encrypting with the key; Before controlling the fan to rotate according to the temperature of the component and the temperature of the server to dissipate heat for the component, the method further includes: When the working state of the component is a fault, controlling the fan to rotate according to the speed corresponding to the fault, the temperature of the component and the temperature of the server to dissipate heat for the component; Controlling the fan to rotate to dissipate heat for the component according to the rotation speed corresponding to the fault, the temperature of the component, and the temperature of the server includes: Calculating a PWM value required to control a fan of each component according to the preset temperature of the component and the temperature of the server stored in the storage space to obtain a plurality of PWM values; Determining the maximum speed among the speeds corresponding to the plurality of PWM values; The fan is controlled to rotate at a speed obtained by adding the maximum speed to a speed corresponding to the fault.

2. The heat dissipation method of a component according to claim 1, wherein: Determining the temperature of a component operating on a server while the component is in place includes: When a component running on the server is in place, obtaining the temperature of the component at a preset frequency and saving the temperature in the storage space; Determine the temperature of the server, including: The temperature of the server is obtained at a preset frequency and saved in a storage space.

3. The heat dissipation method of a component according to claim 2, wherein: Controlling the fan to rotate according to the temperature of the component and the temperature of the server to dissipate heat for the component includes: Calculating a plurality of PWM values ​​based on the temperature of the component and the temperature of the server according to the preset values ​​stored in the storage space; The fan is controlled to rotate at a maximum speed among the speeds corresponding to the plurality of PWM values.

4. A heat dissipation system for a component, characterized in that: include: a first determining unit, configured to determine a temperature of a component running on a server when the component is in place; a second determining unit, configured to determine a temperature of the server; a control unit, configured to control the rotation of a fan to dissipate heat for the component according to the temperature of the component and the temperature of the server; The first determining unit is specifically configured to: Obtaining the in-place status of the component through the IPMI interface, wherein the in-place status includes in-place and out-of-place; When the in-place state of the component is in-place, determining a working state of the component, the working state including normal operation and failure; determining a temperature of the component; saving the working status of the component and the temperature of the component in a storage space; Cryptographic unit, used for: Get the key from the keystore; Creating the storage space by encrypting with the key; The second control unit is configured to: when the working state of the component is a fault, control the rotation of the fan to dissipate heat for the component according to the rotation speed corresponding to the fault, the temperature of the component, and the temperature of the server; The control unit is specifically configured to calculate a PWM value required to control a fan of each component according to the preset temperature of the component and the temperature of the server stored in the storage space, thereby obtaining a plurality of PWM values; Determine a maximum speed among the speeds corresponding to the multiple PWM values; and control the fan to rotate at a speed obtained by adding the maximum speed to the speed corresponding to the fault.

5. A BMC, characterized in that: include: memory for storing computer programs; A processor, configured to implement the steps of the heat dissipation method for a component according to any one of claims 1 to 3 when executing the computer program.

6. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the heat dissipation method of the component according to any one of claims 1 to 3 are implemented.

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