Display device

Abstract

A display device is disclosed, comprising: a substrate, comprising a display area and a peripheral area arranged outside the display area, the display area comprising a plurality of pixels and a plurality of data lines; a pad portion, arranged in the peripheral area; a bending area, arranged in the peripheral area and being bendable or in a bending state; a crack detection circuit portion, arranged between the display area and the pad portion and comprising a switch; a first crack detection line, comprising a first reciprocating bending portion arranged in the bending area, the first crack detection line being connected between the pad portion and the crack detection circuit portion and being configured to detect a crack generated in the bending area; a second crack detection line, comprising a second reciprocating bending portion arranged in the peripheral area except the bending area at the peripheral part of the display area, the second crack detection line being connected between the pad portion and the crack detection circuit portion and being configured to detect a crack generated in the peripheral area around the display area.

Description

[0001] This application is a divisional application of the invention patent application with application number 201711238053.7 and name “Display Device” filed on November 30, 2017. Technical Field

[0002] The present disclosure relates to a display device, and more particularly to a display device including a curved area. Background Art

[0003] Display devices such as liquid crystal displays (LCDs), light emitting diode displays, and self-emissive displays generally include a display panel including a plurality of pixels capable of displaying an image and a plurality of signal lines. Each pixel generally includes a pixel electrode for receiving a data signal, and the pixel electrode is connected to at least one transistor to receive the data signal. The display panel may include a plurality of stacked layers.

[0004] When manufacturing a display panel, cracks may occur in a substrate or a layer stacked on the substrate due to an impact applied to the display panel. The cracks may gradually increase or propagate to another layer or another area, causing defects in the display panel. For example, if a crack occurs in a signal line such as a data line or a scan line, a short circuit may occur or resistance may increase, and moisture or the like may penetrate into the display panel, thereby degrading the reliability of the light-emitting element. There may be several problems such as the pixels of the display panel not emitting light or emitting the wrong light. In addition, the flexible display may be intentionally twisted or bent during use, and once a tiny crack occurs in the substrate of the display panel or a layer stacked on the substrate, the crack may gradually increase as the display panel is further twisted or bent during use.

[0005] The above information disclosed in this section is only for enhancement of understanding of the background of the inventive concept and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Summary of the invention

[0006] One or more exemplary embodiments provide a display panel including a curved region and an edge region other than the curved region. When the display panel is bent, folded, twisted, etc., a defect such as a crack may occur in the curved region or the edge region. One or more exemplary embodiments enable detection of defects in the curved region or the edge region.

[0007] Additional aspects will be set forth in the detailed description which follows, and in part will be apparent from the disclosure, or may be learned by practice of the inventive concepts.

[0008] According to one or more exemplary embodiments, a display device includes a display area, a peripheral area, a pad portion, a bending area, a first crack detection circuit, and a first crack detection line. The display area includes pixels and data lines. The peripheral area is arranged outside the display area. The pad portion is arranged in the peripheral area. The bending area is arranged in the peripheral area. The bending area is bendable or in a bent state. The first crack detection circuit is arranged between the display area and the pad portion. The first crack detection circuit includes a switch. The first crack detection line includes a first bending portion arranged in the bending area. The first crack detection line is connected between the pad portion and the first crack detection circuit.

[0009] According to one or more exemplary embodiments, a display device includes a display area, a peripheral area, a bending area, a first crack detection line, and a second crack detection line. The display area includes pixels and data lines. The peripheral area is arranged outside the display area. The bending area is arranged in the peripheral area. The bending area is bendable or in a bent state. The first crack detection line is arranged in the bending area. The second crack detection line is arranged in the peripheral area, in an area at the periphery of at least one side of the display area.

[0010] According to one or more exemplary embodiments, a defect (eg, a crack) that may occur in a bending region of a display device or in an edge region of a display device other than the bending region may be detected.

[0011] The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept, wherein the accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification.

[0013] Figure 1 is a schematic plan view of a display device including a display panel according to one or more exemplary embodiments.

[0014] Figure 2 According to one or more exemplary embodiments Figure 1 Schematic side view of a display device in a bent state.

[0015] Figure 3 According to one or more exemplary embodiments Figure 1 A plan view of a display device.

[0016] Figure 4 According to one or more exemplary embodiments Figure 3A cross-sectional view of a display device taken along section line III-IIIa.

[0017] Figure 5 According to one or more exemplary embodiments Figure 1 Layout diagram of pixels of a display device.

[0018] Figure 6 According to one or more exemplary embodiments Figure 5 A cross-sectional view of a display device taken along section line V-Va.

[0019] Figure 7 and Figure 8 is a plan view of a display panel including a crack in a curved region of a display device in a light emitting state of a pixel according to one or more exemplary embodiments.

[0020] Fig. 9 and Fig.10 is a plan view of a display panel including a crack in a peripheral region excluding a bending region of a display device in a light emitting state of a pixel according to one or more exemplary embodiments.

[0021] Fig.11 and Fig.12 is a plan view of a display panel including cracks in a bending region and a peripheral region other than the bending region of a display device in a light emitting state of a pixel according to one or more exemplary embodiments.

[0022] Fig.13 is a plan view of a display device including a display panel according to one or more exemplary embodiments.

[0023] Fig.14 According to one or more exemplary embodiments Fig.13 A cross-sectional view of a display device taken along section line XIII-XIIIa.

[0024] Fig.15 is a plan view of a display device including a display panel according to one or more exemplary embodiments.

[0025] Fig.16 According to one or more exemplary embodiments Fig.15 An enlarged view of the curved area of ​​the display device.

[0026] Fig.17 is a plan view of a display device including a display panel according to one or more exemplary embodiments.

[0027] Fig.18 According to one or more exemplary embodiments Fig.17 An enlarged view of the curved area of ​​the display device.

[0028] Fig.19 , Fig. 20 , Fig.21 and Fig. 22 is a plan view of a display device including a display panel according to various exemplary embodiments. DETAILED DESCRIPTION

[0029] In the following description, for the purpose of illustration, many specific details are set forth to provide a deep understanding of various exemplary embodiments. However, it is apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring various exemplary embodiments.

[0030] Unless otherwise noted, the illustrated exemplary embodiments are to be understood as providing exemplary features of the details of the variations of various exemplary embodiments. Therefore, unless otherwise noted, the various illustrated features, components, modules, layers, films, panels, regions, aspects, etc. (hereinafter collectively referred to as "elements") may be additionally combined, separated, interchanged, and / or rearranged without departing from the disclosed exemplary embodiments.

[0031] Cross hatching and / or shading are usually provided in the drawings to illustrate the boundaries between adjacent elements. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the exemplary embodiments may be implemented differently, the specific process sequence may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0032] When an element is referred to as "on" another element, "connected to" or "coupled to" another element, the element may be directly on the other element, directly connected to or directly coupled to the other element, or there may be an intermediate element. However, when an element is referred to as "directly on" another element, "directly connected to" or "directly coupled to" another element, there is no intermediate element. In addition, the x-axis, y-axis and z-axis are not limited to the three axes of the rectangular coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis and z-axis can be perpendicular to each other, or different directions that are not perpendicular to each other can be represented. For the purpose of this disclosure, "at least one (kind) of X, Y and Z" and "at least one (kind) selected from the group consisting of X, Y and Z" can be interpreted as only X, only Y, only Z, or any combination of two (kinds) or more (kinds) of X, Y and Z, such as taking XYZ, XYY, YZ and ZZ as examples. As used herein, the term "and / or" includes any and all combinations of one or more related listed items.

[0033] Although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the disclosed teachings, the first element discussed below may be referred to as the second element.

[0034] Spatially relative terms such as "under," "below," "below," "above," "above," and the like may be used herein for descriptive purposes to describe the relationship of one element to another element as shown in the figures. In addition to the orientations depicted in the figures, spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, then elements described as "under" or "under" other elements or features will then be positioned as "above" other elements or features. Thus, the exemplary term "under" may include both above and below orientations. In addition, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and as such, the spatially relative descriptors used herein are interpreted accordingly.

[0035] The terms used here are for the purpose of describing specific embodiments, and are not intended to be limiting. As used here, unless the context clearly indicates otherwise, the singular forms "one", "a kind of" and "the (said)" are also intended to include plural forms. In addition, when the terms "include", "comprising" and their various variations are used in this specification, it is explained that there are the features, integral bodies, steps, operations, elements, components and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, elements, components and / or their groups. It is also worth noting that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms rather than degree terms, and as such, are used to explain the inherent deviations of the numerical values ​​that will be recognized by those of ordinary skill in the art in measuring, calculating and / or providing.

[0036] Various exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the figures due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments disclosed herein should not be interpreted as being limited to the shapes of the specifically illustrated regions, but rather include deviations in shapes due to, for example, manufacturing. In this manner, the regions illustrated in the figures are schematic in nature, and the shapes of these regions may not illustrate the actual shapes of the regions of the device and are therefore not intended to be limiting.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure is a part. Unless so explicitly defined herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.

[0038] Figure 1 is a schematic plan view of a display panel of a display device according to one or more exemplary embodiments. Figure 2 According to one or more exemplary embodiments Figure 1 Schematic side view of a display device in a bent state.

[0039] Reference Figure 1 and Figure 2 , the display device 1000 includes a display area DA and a peripheral area PA. The peripheral area PA is arranged outside the display area DA. It is worth noting that the display device 1000 may be or include a display panel. For convenience, the display device 1000 will be described as a display panel 1000 hereinafter. The display panel 1000 may be an independent device, incorporated as a part of another device, connected to another device, or otherwise associated with another device.

[0040] The display area DA includes a plurality of pixels PX and a plurality of signal lines. The display area DA can display an image on a plane parallel to the xy plane. For the convenience of description and explanation, a structure observed along a direction perpendicular to the x-axis direction and the y-axis direction (e.g., the z-axis direction) will be referred to as a plane structure, and a structure observed when cut along a direction perpendicular to the x-axis direction or the y-axis direction will be referred to as a cross-sectional structure.

[0041] The signal lines include a plurality of gate lines (not shown) transmitting gate signals and a plurality of data lines 171 transmitting data signals. Each data line 171 extends substantially in the y-axis direction in the display area DA and can be connected to the pad portion PDA in the peripheral area PA by extending to the peripheral area PA.

[0042] Each pixel PX may include at least one switch (not shown) and a pixel electrode (not shown) connected to the switch. The switch may be a three-terminal element such as a transistor integrated with the display panel 1000. The switch may selectively transmit a data signal to the pixel electrode by being turned on or off according to a gate signal transmitted by a gate line.

[0043] In order to realize color display, each pixel PX can display one of a plurality of given colors, and can identify an image of a desired color by the sum of the given colors that can be provided temporally and / or spatially. As an example of a given color that can be displayed by a plurality of pixels PX, the three primary colors of red, green and blue can be used, or the three primary colors of yellow, cyan and magenta can be used. For this reason, in addition to the three primary colors, at least one other color such as white can also be included. However, it is envisioned that any suitable color combination can be used in conjunction with the exemplary embodiments.

[0044] The display panel 1000 may further include a substrate 110 forming the pixels PX and the signal lines. The substrate 110 may include glass, plastic, etc., and may be flexible. For example, the substrate 110 may include various types of plastics such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyarylate (PAR), polyetherimide (PEI), polyethersulfone (PES), polyimide (PI), etc., metal thin films, ultra-thin glass, etc.

[0045] The peripheral area PA may include a pad portion PDA, a bending area BDA, main crack detection lines MCDa and MCDb, bending crack detection lines BCDa and BCDb, a main crack detection circuit MCDA, and a bending crack detection circuit BCDA.

[0046] The pad portion PDA may be disposed in one edge of the display panel 1000, and may include a plurality of pads (not shown) that can be electrically connected to a pad of a driver chip (not shown) or a circuit film (not shown). Although not shown, the display device may further include a driver chip or a circuit film electrically connected to the display panel 1000 through the pad portion PDA. The circuit film may be provided as a film, and may include a driver chip attached thereto. The driver chip provided on the display panel 1000 or provided on the circuit film may include a data driver (not shown) and a timing controller (not shown). The data driver generates a data signal for driving the pixel PX, and may transmit various driving voltages to the display panel 1000.

[0047] The bending area BDA may extend in the x-axis direction while crossing the display panel 1000, for example, extending longitudinally in the x-axis direction and having a width in the y-axis direction. It is also contemplated that the bending area BDA may extend longitudinally in both the x-axis direction and the y-axis direction, for example, the bending area BDA may cross the display panel 1000 in a diagonal manner. In addition, the bending area BDA may have a curved shape, for example, the bending area BDA may cross the display panel 1000 in an arc-shaped manner. Figure 1 The display panel 1000 is shown in an unfolded state instead of being bent in the bending area BDA. Figure 2 The display panel 1000 is shown in a bent state in the bending area BDA.

[0048] Reference Figure 2 , the display panel 1000 is bent in the bending area BDA so that a portion of the peripheral area PA disposed outside the bending area BDA is bent backward under the display panel 1000 and thus may not be visible from a front side view (e.g., a plan view in the z-axis direction). A plurality of wirings may be disposed in the bending area BDA, and the plurality of wirings may extend substantially in the y-axis direction in the bending area BDA. At least a portion of the substrate 110 may be removed in the bending area BDA.

[0049] The main crack detection lines MCDa and MCDb may be disposed at (or near) the periphery of the display area DA in the peripheral area PA. For example, the main crack detection lines MCDa and MCDb may extend along the edge of the display area DA and surround the peripheral portion of the display area DA, such as a portion of the top side, the left side, and the right side of the display area DA. It is also contemplated that the main crack detection lines MCDa and MCDb may surround a portion of the bottom side of the display area DA.

[0050] For example, the main crack detection line MCDa may include a first portion and a second portion, the first portion extending substantially in the y-axis direction along the left portion of the peripheral area PA, and the second portion extending substantially in the x-axis direction from the first portion of the main crack detection line MCDa from the top left portion of the peripheral area PA toward the top right portion of the peripheral area PA. The main crack detection line MCDa may also include a third portion extending substantially in the x-axis direction from the first portion of the main crack detection line MCDa from the bottom left portion of the peripheral area PA toward the bottom right portion of the peripheral area PA. The main crack detection line MCDb includes a first portion and a second portion, the first portion extending substantially in the y-axis direction along the right portion of the peripheral area PA, and the second portion extending substantially in the x-axis direction from the first portion of the main crack detection line MCDb from the top right portion of the peripheral area PA toward the top left portion of the peripheral area PA. The main crack detection line MCDb may also include a third portion extending substantially in the x-axis direction from the first portion of the main crack detection line MCDb from the bottom right portion of the peripheral area PA toward the bottom left portion of the peripheral area PA.

[0051] The main crack detection lines MCDa and MCDb extend along the periphery of the display area DA in the peripheral area PA after passing through the bending area BDA from the pad portion PDA, form a back-and-forth bending portion on the left and right sides of the display area DA and / or in the upper peripheral area PA from the pad portion PDA, and then can be connected to the main crack detection circuit MCDA after passing through the bending area BDA again. In this way, the first end of each of the main crack detection lines MCDa and MCDb is connected to the pad portion PDA, so that a test voltage can be received, and the second end of each of the main crack detection lines MCDa and MCDb can be connected to the main crack detection circuit MCDA. Different from what is shown, the left and right main crack detection lines MCDa and MCDb can be connected to each other in the upper side of the display area DA or the upper part of the peripheral area PA.

[0052] The main crack detection lines MCDa and MCDb may include at least one contact portion (not shown) disposed at the periphery of the upper side or the lower side of the bending area BDA, for example, at the periphery of the bending area BDA disposed near the display area DA or at the periphery of the bending area BDA disposed near the pad portion PDA. The main crack detection lines MCDa and MCDb may include portions disposed in different layers relative to the contact portions of the main crack detection lines MCDa and MCDb in the cross-sectional view. The contact portions of the main crack detection lines MCDa and MCDb may include at least one contact hole.

[0053] The bending crack detection lines BCDa and BCDb may include portions disposed in the left edge region and the right edge region of the bending area BDA and extending substantially in the y-axis direction, respectively. The bending crack detection lines BCDa and BCDb may be connected to the bending crack detection circuit BCDA after forming the front and rear bending portions of the bending in the bending area BDA from the pad portion PAD. A first end of each of the bending crack detection lines BCDa and BCDb is connected to the pad portion PDA so that a test voltage may be received, and a second end of each of the bending crack detection lines BCDa and BCDb may be connected to the bending crack detection circuit BCDA.

[0054] In the bending area BDA, the bending crack detection line BCDa may be disposed between the main crack detection line MCDa and a first edge (e.g., left edge) of the substrate 110. The first edge of the substrate 110 may be identical to a first outer edge (e.g., outer left edge) of the peripheral area PA. Similarly, in the bending area BDA, the bending crack detection line BCDb may be disposed between the main crack detection line MCDb and a second edge (e.g., right edge) of the substrate 110, and the second edge of the substrate 110 may be identical to a second outer edge (e.g., outer right edge) of the peripheral area PA.

[0055] The bending crack detection lines BCDa and BCDb may include at least one contact portion (not shown) disposed at the upper or lower periphery of the bending area BDA, and may include a portion disposed in a different layer relative to the contact portion of the bending crack detection lines BCDa and BCDb in a cross-sectional view. The contact portion of the bending crack detection lines BCDa and BCDb may include at least one contact hole.

[0056] The bending crack detection circuit BCDA may be disposed in a plane between the bending area BDA and the main crack detection circuit MCDA, but the exemplary embodiments are not limited thereto or thereby. Different from what is shown, at least one of the main crack detection circuit MCDA and the bending crack detection circuit BCDA may be disposed between the bending area BDA and the display area DA, or the main crack detection circuit MCDA may be disposed between the bending area BDA and the bending crack detection circuit BCDA. It is also contemplated that the main crack detection circuit MCDA and the bending crack detection circuit BCDA may form part of a larger circuit structure.

[0057] The main crack detection lines MCDa and MCDb and the main crack detection circuit MCDA can sense defects (or conditions causing defects) such as cracks, lifting, etc. that may occur in the substrate 110 or in the layers stacked on the substrate 110 through changes in the resistance of the main crack detection lines MCDa and MCDb in the peripheral area PA of the display panel 1000. The resistance changes of the main crack detection lines MCDa and MCDb can be determined by the main crack detection circuit MCDA by checking the light emitting state of one or more pixels PX in the display area DA. However, it is contemplated that any other suitable manner of detecting the resistance changes of the main crack detection lines MCDa and MCDb may be utilized.

[0058] The bending crack detection lines BCDa and BCDb and the bending crack detection circuit BCDA can sense defects (or conditions causing defects) such as cracks, peeling, etc. that may occur in the edge area of ​​the bending area BDA through the resistance change of the bending crack detection lines BCDa and BCDb. The resistance change of the bending crack detection lines BCDa and BCDb can be determined by the bending crack detection circuit BCDA by checking the light emitting state of one or more pixels PX in the display area DA. However, it is contemplated that any other suitable way of detecting the resistance change of the bending crack detection lines BCDa and BCDb can be used.

[0059] Will refer to Figures 3 to 6 as well as Figure 1 and Figure 2 1 and 2 will now describe further details of the display panel 1000. Hereinafter, the same constituent elements as those described above are given the same reference numerals, and repeated descriptions will be omitted.

[0060] Figure 3 According to one or more exemplary embodiments Figure 1 A plan view of a display device. Figure 4 According to one or more exemplary embodiments Figure 3 A cross-sectional view of a display device taken along section line III-IIIa. Figure 3 A planar structure of a display panel 1000 is provided. Figure 4 A cross-sectional structure of the display panel 1000 is provided.

[0061] Reference Figure 3, a plurality of pixels PX arranged in the display area DA can display specific colors, for example, red, green and blue. Four pixels adjacent to each other in a quadrilateral shape may include two green pixels G, one red pixel R and one blue pixel B. Pixel columns including only green pixels G and pixel columns including red pixels R and blue pixels B may be arranged alternately in the x-axis direction, and in each pixel column including red pixels R and blue pixels B, red pixels R and blue pixels B may be arranged alternately in the y-axis direction. However, the arrangement of the plurality of pixels PX is not limited to the above arrangement, and may have any suitable arrangement.

[0062] The plurality of signal lines disposed in the display area DA may further include a plurality of gate lines 121 transmitting gate signals. Each of the plurality of gate lines 121 may extend substantially in the x-axis direction and may cross the data line 171 in an insulated manner. Each of the pixels R, G, and B may be connected to one data line 171 and at least one gate line 121.

[0063] The display panel 1000 may further include gate drivers 400a and 400b disposed in the peripheral area PA and applying gate signals by connecting to the plurality of gate lines 121. The gate drivers 400a and 400b may be disposed on the substrate 110 together with the plurality of signal lines and the switching elements disposed in the display area DA. Figure 3 In the embodiment, the gate drivers 400a and 400b are disposed on the left and right sides relative to the display area DA, but the exemplary embodiments are not limited thereto or thereby. One of the gate drivers 400a and 400b disposed on one side relative to the display area DA may be omitted or may be disposed in another area of ​​the peripheral area PA.

[0064] Reference Figure 3 , the main crack detection lines MCDa and MCDb may respectively include zigzag curved portions formed in a reciprocating pattern in the peripheral area PA outside the display area DA (e.g., in the left and right portions of the peripheral area PA and / or in the upper portion of the peripheral area PA). For example, each of the main crack detection lines MCDa and MCDb may include one or more zigzag curved portions vertically formed in the left and right portions of the peripheral area PA in a reciprocating pattern, and may include one or more zigzag curved portions horizontally formed in the upper portion of the peripheral area PA in a reciprocating pattern.

[0065] A first end of each of the main crack detection lines MCDa and MCDb is connected to the pad portion PDA, and a second end of each of the main crack detection lines MCDa and MCDb is connected to the test data lines TDa2 and TDb2, respectively. The first end of the test data line TDa2 connected to the main crack detection line MCDa and the first end of the test data line TDb2 connected to the main crack detection line MCDb are arranged opposite to each other at a distance from each other so that they are not electrically connected to each other. Each of the test data lines TDa2 and TDb2 may extend substantially in the x-axis direction in the region between the bending region BDA and the pad portion PDA, and may cross the data line 171 in an insulated manner.

[0066] The main crack detection circuit MCDA may include a test data line TD1. The test data line TD1 may extend substantially in the x-axis direction in an area between the bending area BDA and the pad portion PDA, and may cross the data line 171 in an insulated manner. The test data line TD1 may be connected to the pad portion PDA. Figure 3 As shown in , the test data line TD1 may be connected to a first end portion of each of the main crack detection lines MCDa and MCDb, and the first ends of the main crack detection lines MCDa and MCDb are connected to the pad portion PDA. The main crack detection lines MCDa and MCDb and the test data line TD1 may receive substantially the same test voltage from the pad portion PDA.

[0067] The main crack detection circuit MCDA may further include a plurality of switches Q1 and Q2 and a test gate line TG1. The plurality of switches Q1 and Q2 may be arranged substantially in a row in the x-axis direction and may respectively correspond to a portion of the plurality of data lines 171. For example, switches Q1 and Q2 may be provided for every two data lines 171. The test gate line TG1 may extend substantially in the x-axis direction.

[0068] The gate terminals of the switches Q1 and Q2 are connected to the test gate line TG1, and the output terminals of the switches Q1 and Q2 are connected to corresponding ones of the data lines 171. The colors represented by the pixels in the display area DA connected to the data lines 171 to which the switches Q1 and Q2 are connected may include specific colors. Figure 3 As shown in FIG. 1 , the pixels in the display area DA connected to the data line 171 to which the switches Q1 and Q2 are connected may all be green pixels G, but the exemplary embodiments are not limited thereto or thereby. The input terminal of the switch Q1 is connected to the test data line TD1, and the input terminal of the switch Q2 is connected to the test data lines TDa2 and TDb2.

[0069] The switch Q2 may be disposed in a portion of the main crack detection circuit MCDA (e.g., the left and right regions of the display panel 1000), and the switch Q1 may be disposed in the remaining region of the main crack detection circuit MCDA. A plurality of switches Q2 may be disposed adjacent to each other in the x-axis direction in the region including the switch Q2. However, the arrangement of the switches Q1 and Q2 is not limited thereto or thereby.

[0070] Reference Figure 3 , matching resistors R1 and R2 may be connected between the pad portion PDA and the test data line TD1. After the test voltage applied through the pad portion PDA reduces the first voltage difference through the matching resistors R1 and R2, the reduced test voltage is applied to the test data line TD1 and then applied to the input terminal of the switch Q1. The test voltage applied through the pad portion PDA is also transmitted to the main crack detection lines MCDa and MCDb, and the voltage reduced by the second voltage difference due to the wiring resistance of the main crack detection lines MCDa and MCDb may be applied to the input terminal of the switch Q2 of the main crack detection circuit MCDA through the test data lines TDa2 and TDb2. The resistance values ​​of the matching resistors R1 and R2 may be equal to or similar to the wiring resistance of the main crack detection lines MCDa and MCDb. Alternatively, when the main crack detection lines MCDa and MCDb are in a normal state so that cracks or peeling do not occur therein, the first voltage difference and the second voltage difference may be set to be substantially equal to or correspond to each other. However, exemplary embodiments are not limited thereto or thereby. For example, the resistance values ​​of the matching resistors R1 and R2 may be set to appropriate values ​​based on, for example, crack detection sensitivity, etc. For example, the resistance values ​​of the matching resistors R1 and R2 may be set to about 1.5 times the wiring resistance of the main crack detection lines MCDa and MCDb.

[0071] Reference Figure 3 , the bending crack detection lines BCDa and BCDb may respectively include zigzag bending portions vertically formed back and forth in the left and right edge portions of the bending area BDA. The first end of each of the bending crack detection lines BCDa and BCDb is connected to the pad portion PDA, and the second end of each of the bending crack detection lines BCDa and BCDb is respectively connected to the test data lines TDa4 and TDb4. The first end of the test data line TDa4 connected to the bending crack detection line BCDa and the first end of the test data line TDb4 connected to the bending crack detection line BCDb may be arranged facing each other at a certain distance from each other, and therefore, are not electrically connected to each other. The test data lines TDa4 and TDb4 may extend substantially in the x-axis direction in the area between the bending area BDA and the pad portion PDA, and may cross the data line 171 in an insulated manner.

[0072] The bending crack detection circuit BCDA may include a test data line TD3. The test data line TD3 may extend substantially in the x-axis direction in an area between the bending area BDA and the pad portion PDA, and may cross the data line 171 in an insulated manner. The test data line TD3 may be connected to the pad portion PDA. Figure 3 As shown in , the test data line TD3 may be connected to a first end portion of each of the bending crack detection lines BCDa and BCDb, and the first ends of the bending crack detection lines BCDa and BCDb are connected to the pad portion PDA. The bending crack detection lines BCDa and BCDb and the test data line TD3 may receive substantially the same test voltage from the pad portion PDA.

[0073] The bending crack detection circuit BCDA may further include a plurality of switches Q3 and Q4 and a test gate line TG2. The plurality of switches Q3 and Q4 may be arranged substantially in a row in the x-axis direction, and each may correspond to a portion of the plurality of data lines 171. For example, switches Q3 and Q4 may be provided for every two data lines 171. The test gate line TG2 may extend substantially in the x-axis direction.

[0074] The gate terminals of the switches Q3 and Q4 are connected to the test gate line TG2, and the output terminals of the switches Q3 and Q4 are connected to the corresponding data line 171. The colors represented by the pixels in the display area DA connected to the data line 171 to which the switches Q3 and Q4 are connected may include one or two specific colors. Figure 3 As shown in FIG. 1 , the pixel column connected to the data line 171 to which the switches Q3 and Q4 are connected in the display area DA may be a pixel column in which red pixels R and blue pixels B are alternately arranged, but the exemplary embodiment is not limited thereto or thereby. The input terminal of the switch Q3 is connected to the test data line TD3, and the input terminal of the switch Q4 is connected to the test data lines TDa4 and TDb4.

[0075] The switch Q4 may be disposed in a portion of the bending crack detection circuit BCDA (e.g., a portion of the left region and a portion of the right region of the display panel 1000), and the switch Q3 may be disposed in the remaining region of the bending crack detection circuit BCDA. A plurality of switches Q4 may be disposed adjacent to each other in the x-axis direction in the region where the switches Q4 are disposed. However, the arrangement of the switches Q3 and Q4 is not limited thereto or thereby.

[0076] Continue to refer to Figure 3, switches Q1 and Q2 in the main crack detection circuit MCDA and switches Q3 and Q4 in the bending crack detection circuit BCDA may be sequentially connected to a plurality of data lines 171 arranged in the x-axis direction. That is, switches Q1 and Q2 in the main crack detection circuit MCDA and switches Q3 and Q4 in the bending crack detection circuit BCDA may be alternately arranged in the x-axis direction.

[0077] Although not shown, a matching resistor may be connected between the pad portion PDA and the test data line TD3. However, when the wiring resistance of the bending crack detection lines BCDa and BCDb is not high, such a matching resistor may be omitted.

[0078] Reference Figure 4 And continue to refer to Figures 1 to 3 , the barrier layer 120 may be disposed on the substrate 110. Figure 4 As shown in , the barrier layer 120 may include multiple layers. However, it is contemplated that the barrier layer 120 may be provided as a single layer.

[0079] The active pattern is disposed on the barrier layer 120. The active pattern may include an active pattern 130 disposed in the display area DA and an active pattern 130d disposed in the peripheral area PA. The active patterns 130 and 130d may include a source region and a drain region, respectively, and a channel region disposed between the source region and the drain region. The active patterns 130 and 130d may include amorphous silicon, polycrystalline silicon, or an oxide semiconductor; however, exemplary embodiments are not limited thereto or thereby.

[0080] The first insulating layer 141 is disposed on the active patterns 130 and 130d, and the first conductive layer may be disposed on the first insulating layer 141. The first conductive layer may include a conductor 155 overlapping the active pattern 130 disposed in the display area DA, a conductor 150d overlapping the active pattern 130d disposed in the peripheral area PA, the plurality of gate lines 121, and the test gate lines TG1 and TG2.

[0081] The active pattern 130 and the conductor 155 of the first conductive layer overlapping the active pattern 130 may form a transistor TRa. The active pattern 130d and the conductor 150d of the first conductive layer overlapping the active pattern 130d may form a transistor TRd. The transistor TRa may be used as a switch included in the pixel PX (e.g., R, G, and B pixels) provided in the display area DA, and the transistor TRd may be used as a switch (not shown) included in, for example, the gate drivers 400a and 400b or may be used as a plurality of switches Q1, Q2, Q3, and Q4 included in the main crack detection circuit MCDA or included in the bending crack detection circuit BCDA. After that, the transistor TRd may be used as a switch included in the pixel PX (e.g., R, G, and B pixels) provided in the display area DA, and the transistor TRd may be used as a switch (not shown) included in, for example, the gate drivers 400a and 400b or may be used as a plurality of switches Q1, Q2, Q3, and Q4 included in the main crack detection circuit MCDA or included in the bending crack detection circuit BCDA. Figure 5 and Figure 6An example of the structure of the pixel PX is described.

[0082] The second insulating layer 142 may be disposed on the first conductive layer and the first insulating layer 141. The second conductive layer may be disposed on the second insulating layer 142. The second conductive layer may include the above-mentioned main crack detection lines MCDa and MCDb. Alternatively, the main crack detection lines MCDa and MCDb may be disposed in the same layer as the first conductive layer, and may include the same material as the first conductive layer. The second conductive layer may also include the above-mentioned test data lines TD1, TDa2, TDb2, TD3, TDa4, and TDb4. Alternatively, at least one of the test data lines TD1, TDa2, TDb2, TD3, TDa4, and TDb4 may be disposed in the same layer as the first conductive layer. At least one of the first conductive layer and the second conductive layer may include a metal such as copper (Cu), aluminum (Al), molybdenum (Mo), or an alloy thereof.

[0083] The third insulating layer 160 may be disposed on the second conductive layer and the second insulating layer 142 .

[0084] At least one of the first insulating layer 141, the second insulating layer 142, and the third insulating layer 160 may include, for example, silicon nitride (SiN x ), silicon oxide (SiO x ) and / or an inorganic insulating material and / or an organic insulating material. At least one of the first insulating layer 141, the second insulating layer 142, and the third insulating layer 160 may be partially removed in the bending area BDA. The first insulating layer 141, the second insulating layer 142, and the third insulating layer 160 may include contact holes 165 and 165d formed on the source region and / or the drain region of the transistors TRa and TRd, respectively.

[0085] The third conductive layer may be disposed on the third insulating layer 160. The third conductive layer may include conductors 170 and 170d connected to source regions or drain regions of the transistors TRa and TRd through contact holes 165 and 165d, respectively, a voltage transmission line 177, and the above-mentioned data line 171. The voltage transmission line 177 may be disposed in the peripheral area PA, and may transmit a constant voltage such as a common voltage ELVSS.

[0086] The third conductive layer may include a metal such as copper (Cu), aluminum (Al), molybdenum (Mo), or an alloy thereof.

[0087] The passivation layer 180 is disposed on the third conductive layer and the third insulating layer 160. The passivation layer 180 may include an inorganic insulating material and / or an organic insulating material such as a polyacrylic resin. The upper surface of the passivation layer 180 may be substantially flat. In this way, the passivation layer 180 may also serve as a planarization layer. The passivation layer 180 may include a contact hole 177d disposed on the voltage transmission line 177, and the voltage transmission line 177 is disposed in the peripheral area PA.

[0088] The pixel electrode layer is disposed on the passivation layer 180. The pixel electrode layer may include a pixel electrode 191 corresponding to each pixel PX, and a voltage transmission electrode 197 disposed in the peripheral area PA. The voltage transmission electrode 197 is physically and electrically connected to the voltage transmission line 177 through the contact hole 177d of the passivation layer 180, thereby receiving the common voltage ELVSS. The pixel electrode layer may include a conductive transparent material and / or a reflective conductive material.

[0089] The pixel defining layer 350 is disposed on the passivation layer 180 and the pixel electrode layer. The pixel defining layer 350 includes an opening 351 disposed on the pixel electrode 191, and may further include at least one dam portion 350d disposed in the peripheral area PA. The dam portion 350d may extend parallel to the edge of the substrate 110 on a plane. A portion of the dam portion 350d may be disposed in the contact hole 177d. A spacer 360d may also be disposed on the dam portion 350d.

[0090] Reference Figure 3 and Figure 4 , the main crack detection lines MCDa and MCDb may be disposed in the outer area of ​​the peripheral area PA so that the dam portion 350d is disposed between the main crack detection lines MCDa and MCDb and the display area DA, but exemplary embodiments are not limited thereto or thereby. For example, the main crack detection lines MCDa and MCDb may be disposed in the inner area of ​​the peripheral area PA so that the main crack detection lines MCDa and MCDb are disposed between the dam portion 350d and the display area DA.

[0091] The voltage transmission electrode 197 includes a portion that is not covered by the pixel defining layer 350. That is, a portion of the voltage transmission electrode 197 may not be covered by the pixel defining layer 350. The pixel defining layer 350 may include a photosensitive material such as polyacrylate resin, polyimide resin, or the like.

[0092] The emission layer 370 is disposed on the pixel electrode 191. The emission layer 370 may include a portion disposed in the opening 351 of the pixel defining layer 350. The emission layer 370 may further include at least one dummy emission layer 370d disposed in the peripheral area PA and disposed on the pixel defining layer 350. The emission layer 370 may include an organic emission material or an inorganic emission material.

[0093] The common electrode 270 is disposed on the emission layer 370. The common electrode 270 is also disposed on the pixel defining layer 350, and thus, may be continuously formed throughout a plurality of pixels PX. The common electrode 270 is physically and electrically connected to the voltage transmission electrode 197 in the peripheral area PA, thereby receiving the common voltage ELVSS. The common electrode 270 may include a conductive transparent material.

[0094] The pixel electrode 191 , the emission layer 370 , and the common electrode 270 of each pixel PX form an emission diode ED, in which one of the pixel electrode 191 and the common electrode 270 serves as a cathode and the other serves as an anode.

[0095] The encapsulation part 380 protects the emission diode ED (or reduces damage to the emission diode ED) by encapsulating the emission diode ED. The encapsulation part 380 may be disposed on the common electrode 270. The encapsulation part 380 includes at least one of the inorganic layers 381 and 383 and at least one organic layer 382, ​​and at least one of the inorganic layers 381 and 383 and at least one organic layer 382 may be alternately stacked. The organic layer 382 includes an organic material and may have a planarization property. The inorganic layers 381 and 383 may include an organic material such as aluminum oxide (AlO x ), silicon oxide (SiO x ), silicon nitride (SiN x ) and other inorganic materials.

[0096] The planar area of ​​the inorganic layers 381 and 383 may be wider than the planar area of ​​the organic layer 382, ​​and thus the two inorganic layers 381 and 383 may contact each other in the peripheral area PA. The lowermost inorganic layer of the two inorganic layers 381 and 383 may contact the upper surface of the third insulating layer 160 in the peripheral area PA, but the exemplary embodiment is not limited thereto or thereby. The encapsulation portion 380 including the inorganic layers 381 and 383 may overlap the main crack detection lines MCDa and MCDb in the peripheral area PA on a plane.

[0097] The edge of the organic layer 382 included in the encapsulation part 380 may be disposed between the dam 350d and the display area DA. The dam 350d may be used to prevent the organic material from flowing to the outside when the organic layer 382 of the encapsulation part 380 is formed. As such, the edge of the organic layer 382 of the encapsulation part 380 may be substantially disposed further inside (e.g., closer to the display area DA) than the dam 350d.

[0098] A buffer layer 389 including an inorganic insulating material and / or an organic insulating material may be disposed on the encapsulation part 380. The buffer layer 389 may be omitted.

[0099] The fourth conductive layer is disposed on the buffer layer 389. The fourth conductive layer may include a first touch conductor TEa. The first touch insulating layer 391 is disposed on the fourth conductive layer, and the fifth conductive layer may be disposed on the first touch insulating layer 391. The fifth conductive layer may include a second touch conductor TEb. The second touch insulating layer 392 may be disposed on the fifth conductive layer. The first touch conductor TEa and the second touch conductor TEb form a capacitive touch sensor to sense touch information such as whether a touch is made, a touch position, etc. when a touch (or near touch) is made by an external object. The first touch conductor TEa and the second touch conductor TEb may be formed in a mesh shape.

[0100] Will refer to Figure 5 and Figure 6 With the above Figures 1 to 4 An example structure of the pixel PX included in the display panel 1000 is described in more detail together. The same constituent elements as those described above are given the same reference numerals, and repeated descriptions will be omitted.

[0101] Figure 5 According to one or more exemplary embodiments Figure 1 Layout diagram of pixels of a display device. Figure 6 According to one or more exemplary embodiments Figure 5 A cross-sectional view of a display device taken along section line V-Va.

[0102] Reference Figure 5 and Figure 6 , the pixel PX among the plurality of pixels PX of the display panel 1000 may be one of the red pixel R, the green pixel G, and the blue pixel B described above.

[0103] The display panel 1000 includes a first scan line 151 for transmitting a first scan signal, a second scan line 152 for transmitting a second scan signal, a third scan line 154 for transmitting a third scan signal, and a control line 153 for transmitting a light emitting control signal. In cross section, the first scan line 151, the second scan line 152, the third scan line 154, and the control line 153 may be included in the gate line 121 or may be included in the first conductive layer.

[0104] The display panel 1000 may further include a storage line 156 and an initialization voltage line 159. In cross section, the storage line 156 and the initialization voltage line 159 may be included in the second conductive layer. The storage line 156 may include an expansion portion 157 disposed in each pixel PX. The initialization voltage line 159 may transmit an initialization voltage.

[0105] The display panel 1000 may further include a data line 171 and a driving voltage line 172. In cross section, the data line 171 and the driving voltage line 172 may be included in the third conductive layer. In plane, the data line 171 and the driving voltage line 172 are substantially in the same direction (eg, Figure 5 The storage line 156 extends in the vertical (or y-axis) direction and may cross the first scan line 151, the second scan line 152, and the third scan line 154 in an insulated manner. The expansion portion 157 of the storage line 156 is connected to the driving voltage line 172 through the contact hole 68, thereby receiving the driving voltage ELVDD.

[0106] Each pixel PX may include a plurality of transistors T1, T2, T3_1, T3_2, T4_1, T4_2, T5, T6, and T7 connected to scan lines 151, 152, and 154, a control line 153, a data line 171, a driving voltage line 172, a capacitor Cst, and an emission diode ED. The plurality of transistors T1, T2, T3_1, T3_2, T4_1, T4_2, T5, T6, and T7 may be included in the above-mentioned transistor TRa. A channel of each of the plurality of transistors T1, T2, T3_1, T3_2, T4_1, T4_2, T5, T6, and T7 may be provided in the above-mentioned active pattern 130. The active pattern 130 includes channel regions 131a, 131b, 131c_1, 131c_2, 131d_1, 131d_2, 131e, 131f, and 131g, and a conductive region, which respectively form channels of the respective transistors T1, T2, T3_1, T3_2, T4_1, T4_2, T5, T6, and T7. The conductive region of the active pattern 130 is disposed at a side of each of the channel regions 131a, 131b, 131c_1, 131c_2, 131d_1, 131d_2, 131e, 131f, and 131g and has a higher carrier concentration than that of the channel regions 131a, 131b, 131c_1, 131c_2, 131d_1, 131d_2, 131e, 131f, and 131g. A pair of conductive regions disposed at the sides of each of the channel regions 131a, 131b, 131c_1, 131c_2, 131d_1, 131d_2, 131e, 131f and 131g of the transistors T1, T2, T3_1, T3_2, T4_1, T4_2, T5, T6 and T7 are source and drain regions of the corresponding transistors T1, T2, T3_1, T3_2, T4_1, T4_2, T5, T6 and T7, and may be used as source and drain electrodes, respectively.

[0107] The first transistor T1 includes a channel region 131a, a source region 136a, a drain region 137a, and a driving gate electrode 155a overlapping the channel region 131a in a plane. The driving gate electrode 155a may be included in the first conductive layer and may be connected to the connection member 174 through the contact hole 61. In cross section, the connection member 174 may be included in the third conductive layer. The contact hole 61 may be provided in the contact hole 51 included in the extension portion 157.

[0108] The second transistor T2 includes a channel region 131b, a source region 136b, a drain region 137b, and a gate electrode 155b overlapping the channel region 131b on a plane. The gate electrode 155b is a part of the first scan line 151. The source region 136b is connected to the data line 171 through the contact hole 62, and the drain region 137b is connected to the source region 136a of the first transistor T1.

[0109] The third transistors T3_1 and T3_2 may include an upper third transistor T3_1 and a lower third transistor T3_2 connected to each other. The upper third transistor T3_1 includes a channel region 131c_1, a source region 136c_1, a drain region 137c_1, and a gate electrode 155c_1 overlapping the channel region 131c_1. The gate electrode 155c_1 may be a portion of the first scan line 151. The drain region 137c_1 is connected to the connection member 174 through the contact hole 63. The lower third transistor T3_2 includes a channel region 131c_2, a source region 136c_2, a drain region 137c_2, and a gate electrode 155c_2 overlapping the channel region 131c_2. The gate electrode 155c_2 is a portion of the first scan line 151.

[0110] The fourth transistors T4_1 and T4_2 may include a left fourth transistor T4_1 and a right fourth transistor T4_2 connected to each other. The left fourth transistor T4_1 includes a channel region 131d_1, a source region 136d_1, a drain region 137d_1, and a gate electrode 155d_1 overlapping the channel region 131d_1. The gate electrode 155d_1 is a portion of the second scan line 152. The drain region 137d_1 is connected to the drain region 137c_1 of the upper third transistor T3_1 and is connected to the connection member 174 through the contact hole 63. The right fourth transistor T4_2 includes a channel region 131d_2, a source region 136d_2, a drain region 137d_2, and a gate electrode 155d_2 overlapping the channel region 131d_2. The gate electrode 155d_2 is a portion of the second scan line 152. The drain region 137 d_2 is connected to the source region 136 d_1 of the left fourth transistor T4_1 , and the source region 136 d_2 is connected to the connection member 175 through the contact hole 65 .

[0111] The connection member 175 may be included in the second conductive layer or the third conductive layer. When the connection member 175 is included in the third conductive layer, the connection member 175 may be electrically connected to the initialization voltage line 159 through the contact hole 64.

[0112] The fifth transistor T5 includes a channel region 131e, a source region 136e, a drain region 137e, and a gate electrode 155e overlapping the channel region 131e. The gate electrode 155e is a part of the control line 153. The source region 136e is connected to the driving voltage line 172 through the contact hole 67, and the drain region 137e is connected to the source region 136a of the first transistor T1.

[0113] The sixth transistor T6 includes a channel region 131f, a source region 136f, a drain region 137f, and a gate electrode 155f overlapping the channel region 131f. The gate electrode 155f is a part of the control line 153. The source region 136f is connected to the drain region 137a of the first transistor T1, and the drain region 137f is connected to the connection member 179 through the contact hole 69. In cross section, the connection member 179 may be included in the third conductive layer.

[0114] The seventh transistor T7 includes a channel region 131g, a source region 136g, a drain region 137g, and a gate electrode 155g overlapping the channel region 131g. The gate electrode 155g is a part of the third scan line 154. The source region 136g is connected to the drain region 137f of the sixth transistor T6, and the drain region 137g is connected to the connection member 175 through the contact hole 65, thereby receiving the initialization voltage.

[0115] The capacitor Cst may include a driving gate electrode 155a and an expansion portion 157 of a storage line 156, which overlap each other with a second insulating layer 142 disposed between the driving gate electrode 155a and the expansion portion 157 of the storage line 156. In this manner, the driving gate electrode 155a and the expansion portion 157 of the storage line 156 serve as two terminals of the capacitor Cst.

[0116] The pixel electrode layer may include a pixel electrode 191 and a pixel conductive pattern 192. The pixel electrode 191 is connected to the connection member 179 through the contact hole 89 and receives a data voltage. The pixel conductive pattern 192 may be bent along an edge of the pixel electrode 191 adjacent to the pixel conductive pattern 192. The pixel conductive pattern 192 may transmit an initialization voltage.

[0117] Will refer to Figures 7 to 12 A method for detecting a defect such as a crack in a display device according to one or more exemplary embodiments is described.

[0118] Figure 7 and Figure 8is a plan view of a display panel including a crack in a curved region of a display device in a light emitting state of a pixel according to one or more exemplary embodiments. Fig. 9 and Fig.10 is a plan view of a display panel including a crack in a peripheral region excluding a bending region of a display device in a light emitting state of a pixel according to one or more exemplary embodiments. Fig.11 and Fig.12 is a plan view of a display panel including cracks in a bending region and a peripheral region other than the bending region of a display device in a light emitting state of a pixel according to one or more exemplary embodiments.

[0119] A test voltage is applied to the test data lines TD1 and TD3 through the pad portion PDA. The test voltage may be applied to the test data lines TD1 and TD3 without passing through the main crack detection lines MCDa and MCDb and the bending crack detection lines BCDa and BCDb. When a gate signal of a gate-on voltage is also applied to the test gate lines TG1 and TG2, switches Q1, Q2, Q3, and Q4 of the main crack detection circuit MCDA and the bending crack detection circuit BCDA are turned on, respectively. Then, the test voltage applied to the test data lines TD1 and TD3 is applied to the data line 171 through the turned-on switches Q1 and Q3. The test voltage is a predetermined voltage and may be, for example, a voltage for displaying the lowest grayscale for pixels R, G, and B. For example, the test voltage may be about 7V. In this way, the pixels R, G, and B connected to the turned-on switches Q1 and Q3 may display a low grayscale such as black.

[0120] Assuming that no crack or peeling occurs in the peripheral area PA and the bending area BDA of the display panel 1000, and no damage-related influence is applied to the main crack detection lines MCDa and MCDb and the bending crack detection lines BCDa and BCDb (that is, the main crack detection lines MCDa and MCDb and the bending crack detection lines BCDa and BCDb are in a normal state), the voltages of the test data lines TDa2 and TDb2 applied to the main crack detection circuit MCDA through the main crack detection lines MCDa and MCDb and the voltages of the test data lines TDa4 and TDb4 applied to the bending crack detection circuit BCDA through the bending crack detection lines BCDa and BCDb are substantially equal to each other. To this end, the values ​​of the matching resistors R1 and R2 can be controlled. In this case, similar to the pixels R, G, and B connected to the switches Q1 and Q3, the pixels R, G, and B connected to the switches Q2 and Q4 can display a predetermined grayscale such as black.

[0121] However, when cracks or peeling occur in the peripheral area PA and / or the bending area BDA of the display panel 1000, the main crack detection lines MCDa and MCDb and / or the bending crack detection lines BCDa and BCDb are short-circuited or the wiring resistance increases due to damage, and the black data voltage may not be applied to the pixels R, G, and B connected to the switch Q2 and / or Q4 or a sufficient (or substantially equivalent) black data voltage may not be applied thereto. Therefore, a strong bright line or a weak bright line may be observed along the column of the pixels R, G, and B connected to the switch Q2 and / or the switch Q4. Defects such as cracks that may occur in the peripheral area PA and / or the bending area BDA of the display panel 1000 may be detected based on observing bright light.

[0122] For example, when the pixel column connected to the switch Q2 of the main crack detection lines MCDa and MCDb includes only green pixels G, bright green light can be observed when a defect such as a crack occurs in the peripheral area PA surrounding the display area DA. When the pixel column connected to the switch Q4 of the bending crack detection lines BCDa and BCDb includes red pixels R and blue pixels B, bright purple light can be seen when a defect such as a crack occurs at the edge area of ​​the bending area BDA. Therefore, whether a defect occurs in the peripheral area PA surrounding the display area DA or whether a defect occurs in the bending area BDA can be detected separately by the color of the bright light observed in the display area DA when a fault such as a crack is detected.

[0123] For example, refer to Figure 7 and Figure 8 When a defect such as a crack occurs in the left edge region of the bending area BDA, the resistance of the bending crack detection line BCDa is relatively increased, so that a bright purple line can be observed along the pixel column PPL1 connected to the switch Q4 of the bending crack detection circuit BCDA. Figure 7 The dark pixels R and B in the image are substantially brighter than the surrounding (or adjacent) pixels.

[0124] Reference Fig. 9 and Fig.10 , when a defect such as a crack occurs in the left portion of the peripheral area PA, the resistance of the main crack detection line MCDa is relatively increased, so that a bright green line can be observed along the pixel column GRL1 connected to the switch Q2 of the main crack detection line MCDa. It can be observed Fig. 9 The dark pixels G in the pixel column GRL1 are substantially brighter than the peripheral (or adjacent) pixels.

[0125] Reference Fig.11 and Fig.12, when a defect such as a crack occurs in the right part of the peripheral area PA and the right edge area of ​​the bending area BDA, the resistance of the main crack detection line MCDb and the resistance of the bending crack detection line BCDb are relatively increased, so that a bright green line can be observed along the pixel column GRL2 connected to the switch Q2 of the main crack detection circuit MCDA and a bright purple light can be observed along the pixel column PPL2 connected to the switch Q4 of the bending crack detection circuit BCDA. It can be observed Fig.11 The dark pixels R, G, and B in the image are substantially brighter than the surrounding (or adjacent) pixels.

[0126] According to one or more exemplary embodiments, defects such as cracks that may occur in the peripheral area PA and the bending area BDA can be detected, and it can be prevented that a defective display panel is discharged in a subsequent process, or that an unrepairable defective display panel is discharged without being further processed in a manufacturing process. For example, since defects such as cracks can also be detected at the periphery of the bending area BDA, it can be easily detected whether defects such as short circuits or increased resistance in several signal lines passing through the bending area BDA occur.

[0127] The steps of testing whether defects such as cracks occur in the peripheral area PA at the periphery of the display area DA by applying a gate-on voltage to the test gate line TG1 and the steps of testing whether defects such as cracks occur in the bending area BDA by applying a gate-on voltage to the test gate line TG2 may be performed simultaneously or may be performed at different times.

[0128] Fig.13 is a plan view of a display device including a display panel according to one or more exemplary embodiments. Fig.14 According to one or more exemplary embodiments Fig.13 A cross-sectional view of a display device taken along section line XIII-XIIIa. Fig.13 and Fig.14 The display device may be similar to at least Figure 3 and Figure 4 As such, repeated descriptions will be largely omitted to avoid obscuring the exemplary embodiments. Figure 1 The display device 1000 will be described below. Fig.13 and Fig.14 The display device 1000a is described as a display panel 1000a.

[0129] Reference Fig.13 and Fig.14The display panel 1000a is almost the same as the display panel 1000 except that the main crack detection lines MCDa and MCDb and the bending crack detection lines BCDa and BCDb may include contact portions CNT1 and CNT2 disposed at the periphery of the bending area BDA.

[0130] The main crack detection lines MCDa and MCDb may include a curved portion (which will be represented as MCDa and MCDb for ease of description) formed reciprocatingly in the left and right portions of the peripheral area PA, a connecting wiring CB passing through the curved area BDA, and a connecting wiring CW1 arranged under the curved area BDA and connected to the pad portion PDA.

[0131] The connection wiring CB may be connected to the bending portion MCDa, the connection wiring CW1, and the test data lines TDa2 and TDb2 through the contact portion CNT2 at the upper or lower periphery of the bending area BDA. The connection wiring CB may have a mesh shape and thus may be highly flexible.

[0132] like Fig.14 As shown in , the contact portion CNT2 may include at least one contact hole. The contact hole of the contact portion CNT2 may be disposed in an insulating layer disposed between the bending portions MCDa and MCDb, the connection wiring CW1 and / or the test data lines TDa2 and TDb2 and the connection wiring CB. For example, the connection wiring CB may be disposed in the third conductive layer, and the bending portions MCDa and MCDb, the connection wiring CW1 and the test data lines TDa2 and TDb2 may be disposed in the second conductive layer or the first conductive layer.

[0133] The bending crack detection lines BCDa and BCDb may include bending portions (which will be represented as BCDa and BCDb for convenience of description) reciprocally formed in the bending area BDA and a connection wiring CW2 disposed under the bending area BDA and connected to the pad portion PDA.

[0134] The bending portions BCDa and BCDb may be connected to the connection wiring CW2 and the test data lines TDa4 and TDb4 through the contact portion CNT1 at the periphery of the bottom of the bending area BDA. The contact portion CNT1 may include at least one contact hole. The contact hole of the contact portion CNT1 may be provided in an insulating layer provided between the bending portions BCDa and BCDb and the connection wiring CW2 or in an insulating layer provided between the bending portions BCDa and BCDb and the test data line TD3. For example, the bending portions BCDa and BCDb may be provided in the third conductive layer, and the connection wiring CW2 and the test data lines TDa4 and TDb4 may be provided in the second conductive layer or the first conductive layer.

[0135] Fig.15is a plan view of a display device including a display panel according to one or more exemplary embodiments. Fig.16 According to one or more exemplary embodiments Fig.15 An enlarged view of the curved area of ​​the display device. Fig.15 and Fig.16 The display device may be similar to at least Figure 3 and Figure 4 As such, repeated descriptions will be largely omitted to avoid obscuring the exemplary embodiments. Figure 1 The display device 1000 will be described below. Fig.15 and Fig.16 The display device 1000b is described as a display panel 1000b.

[0136] Reference Fig.15 and Fig.16 , the display panel 1000b is almost the same as the display panel 1000a, except that the display panel 1000b includes a plurality of signal lines passing through the bending area BDA.

[0137] Reference Fig.16 , the plurality of signal lines passing through the bending area BDA may include a first signal line group SL1, a second signal line group SL2, and a third signal line group SL3, and each of the signal line groups SL1, SL2, and SL3 may include at least one signal line. For example, the first signal line group SL1 may include a data line 171, the second signal line group SL2 may include a signal line transmitting various clock signals, a signal line transmitting various frame signals, and main crack detection lines MCDa and MCDb, and the third signal line group SL3 may include a common voltage transmission line ELS transmitting a common voltage ELVSS, a signal line transmitting a gate low voltage, and a signal line transmitting an initialization voltage.

[0138] According to one or more exemplary embodiments, the bending crack detection lines BCDa and BCDb may be disposed between the third signal line group SL3 and the edge of the substrate 110. In this case, Fig.15 As shown in , the bending crack detection lines BCDa and BCDb may be disposed between the common voltage transmission line ELS in the third signal line group SL3 included in the bending area BDA and the edge of the substrate 110. The common voltage transmission line ELS may extend along the outer periphery of the display area DA after passing through the bending area BDA from the pad portion PDA. The opposite ends of the common voltage transmission line ELS are connected to the pad portions PDA on the left and right sides of the display panel 1000b and receive the common voltage ELVSS, and may extend along the periphery of the display area DA.

[0139] Fig.17 is a plan view of a display device including a display panel according to one or more exemplary embodiments. Fig.18 According to one or more exemplary embodiments Fig.17 An enlarged view of the curved area of ​​the display device. Fig.17 and Fig.18 The display device may be similar to at least Fig.15 and Fig.16 As such, repeated descriptions will be largely omitted to avoid obscuring the exemplary embodiments. Figure 1 The display device 1000 will be described below. Fig.17 and 18 The display device 1000c is described as a display panel 1000c.

[0140] Reference Fig.17 and Fig.18 In addition to the bending crack detection lines BCDa and BCDb being disposed between the third signal line group SL3 and the second signal line group SL2 in the bending area BDA, the display panel 1000c and Fig.15 and Fig.16 In this case, the display panel 1000b is almost the same as Fig.17 As shown in FIG. 1 , the common voltage transmission line ELS included in the third signal line group SL3 in the bending area may be disposed between the edge of the substrate 110 and the bending crack detection lines BCDa and BCDb.

[0141] Fig.19 , Fig. 20 , Fig.21 and Fig. 22 is a plan view of a display device including a display panel according to various exemplary embodiments. Figures 19 to 22 The display device may be similar to at least Figure 3 , Fig.13 , Fig.15 and Fig.17 As such, repeated descriptions will be largely omitted to avoid obscuring the exemplary embodiments. Figure 1 The display device 1000 will be described below. Figures 19 to 22 The display device is described as a display panel.

[0142] First, refer to Fig.19, the display panel 1000d is almost the same as the display panel 1000, except that the length of the bending crack detection lines BCDa' and BCDb' provided in the bending area BDA in the display panel 1000d is increased, thereby causing an increase in wiring resistance. For example, the bending crack detection lines BCDa' and BCDb' may include additional reciprocating portions. In addition or in addition thereto, the wiring resistance may be increased by reducing the line width of the bending crack detection lines BCDa' and BCDb' provided in the bending area BDA. As described, the resistance change amount may be increased by increasing the resistance of the bending crack detection lines BCDa' and BCDb' in the bending area BDA, and therefore, the sensitivity for detecting defects such as cracks in the bending area BDA may be improved.

[0143] Alternatively, the wiring resistance may be controlled according to conditions by increasing or decreasing the length and / or line width of the bending crack detection lines BCDa′ and BCDb′ in the bending area BDA.

[0144] Next, refer to Fig. 20 , the display panel 1000e is almost the same as the display panel 1000, except that the display panel 1000e also includes strain gauges GAU1 and GAU2, wherein the strain gauges GAU1 and GAU2 include resistance wires arranged in the bending area BDA. The resistance wires of the strain gauges GAU1 and GAU2 may be arranged in the left edge area and / or the right edge area of ​​the bending area BDA. The resistance of the resistance wires of the strain gauges GAU1 and GAU2 may change according to the degree of bending of the bending area BDA, and the stress applied to the bending area BDA may be detected by sensing such resistance change. The resistance wires of the strain gauges GAU1 and GAU2 may include a bending portion formed in a reciprocating pattern in the bending area BDA, and may be connected to the pad portion PDA through a plurality of connection wirings CL1 and CL2. The connection wirings CL1 and CL2 may be connected to other portions of the resistance wires of the strain gauges GAU1 and GAU2, respectively.

[0145] The resistance wires of the strain gauges GAU1 and GAU2 may be disposed on the same layer as one of the first conductive layer, the second conductive layer, and the third conductive layer.

[0146] Next, refer to Fig.21 , the display device 1000f is almost the same as the display device 1000 except that at least one of the main crack detection circuit MCDA and the bending crack detection circuit BCDA is disposed between the bending area BDA and the display area DA. Fig.21 In the embodiment, the main crack detection circuit MCDA is disposed between the bending area BDA and the display area DA, and the bending crack detection circuit BCDA is disposed between the bending area BDA and the pad portion PDA.

[0147] In addition, matching resistors R3 and R4 may be connected to opposite ends of the pad portion PDA and the bending crack detection circuit BCDA, respectively. The matching resistors R3 and R4 may have a resistance equal to (or similar to) the entire wiring resistance of the bending crack detection lines BCDa'' and BCDb''. However, the exemplary embodiments are not limited thereto or thereby, and the resistance values ​​of the matching resistors R3 and R4 may be appropriately set so that the crack detection sensitivity, etc. may be appropriately set.

[0148] In addition, the bent portions of the main crack detection lines MCDa' and MCDb' disposed in the left and right portions of the peripheral area PA may increase wiring resistance by including several blocks UB. Each block UB of the main crack detection lines MCDa' and MCDb' may form a reciprocating portion in the y-axis direction.

[0149] In addition, in the display panel 1000f, the length of the bending crack detection lines BCDa" and BCDb" set in the bending area BDA can be increased, thereby causing an increase in wiring resistance. For example, the bending crack detection lines BCDa" and BCDb" may include additional reciprocating portions. In addition or in addition to this, the wiring resistance can be increased by reducing the line width of the bending crack detection lines BCDa" and BCDb" set in the bending area BDA. As described, the resistance change amount can be increased by increasing the resistance of the bending crack detection lines BCDa" and BCDb" in the bending area BDA, and therefore, the sensitivity for detecting defects such as cracks in the bending area BDA can be improved.

[0150] Alternatively, the wiring resistance may be controlled according to conditions by increasing or decreasing the length and / or line width of the bending crack detection lines BCDa" and BCDb" in the bending area BDA.

[0151] Reference Fig. 22 The display panel 1000g is almost the same as the display panel 1000 except that it includes one crack detection circuit CDA instead of including a main crack detection circuit MCDA and a bending crack detection circuit BCDA separated from each other. The crack detection circuit CDA may be disposed between the bending area BDA and the pad portion PDA.

[0152] One end of each of the main crack detection lines MCDa” and MCDb” is connected to the pad portion PDA through nodes JN1 and JN2, respectively, and the other end of each of the main crack detection lines MCDa” and MCDb” can be connected to test data lines TDb1 and TDb2 extending substantially in the x-axis direction between the bending area BDA and the crack detection circuit CDA. The first end of the test data line TDb1 connected to the main crack detection line MCDa” and the first end of the test data line TDb2 connected to the main crack detection line MCDb” can be arranged facing each other, but they can be separated from each other.

[0153] A first end of each of the bending crack detection lines BCDa"' and BCDb"' is connected to the pad portion PDA through nodes JN1 and JN2, respectively, and a second end of each of the bending crack detection lines BCDa"' and BCDb"' is connected to test data lines TDc1 and TDc2 extending substantially in the x-axis direction between the bending area BDA and the crack detection circuit CDA. A first end of the test data line TDc1 connected to the bending crack detection line BCDa"' and a first end of the test data line TDc2 connected to the bending crack detection line BCDb"' are arranged facing each other, but they can be separated from each other.

[0154] The crack detection circuit CDA may include a plurality of switches Qa, Qb, and Qc and a test data line TDa. The plurality of switches Qa, Qb, and Qc may be arranged substantially in a row in the x-axis direction, and the plurality of switches Qa, Qb, and Qc may be respectively provided corresponding to the plurality of data lines 171. The test data line TDa may extend substantially in the x-axis direction.

[0155] The gate terminals of the switches Qa, Qb, and Qc are connected to the test gate line TGa, and the output terminals of the switches Qa, Qb, and Qc are connected to the corresponding data lines 171. The pixels connected to the data lines 171 to which the switches Qb and Qc are connected may represent a portion of a specific color. For example, the pixel columns connected to the data lines 171 to which the switches Qb are connected may all be green pixels G, and the pixel columns connected to the data lines 171 to which the switches Qc are connected may be pixel columns in which red pixels R and blue pixels B are alternately arranged. However, exemplary embodiments are not limited thereto or thereby.

[0156] An input terminal of the switch Qa is connected to the test data line TDa, an input terminal of the switch Qb is connected to the test data line TDb1 or TDb2, and an input terminal of the switch Qc is connected to the test data line TDc1 or TDc2.

[0157] The switches Qb and Qc may be disposed in a portion of the crack detection circuit CDA (e.g., a portion of the left region and a portion of the right region of the display panel 1000g), and the switch Qa may be disposed in the remaining region of the display panel 1000g. The switches Qb and Qc may be alternately arranged adjacent to each other in the region where the switches Qb and Qc are disposed, but exemplary embodiments are not limited thereto or thereby.

[0158] Matching resistors R1 and R2 may be connected between nodes JN1 and JN2 and the test data line TDa.

[0159] According to one or more exemplary embodiments, a circuit for detecting defects such as cracks in the peripheral area PA and a circuit for detecting defects such as cracks in the bending area BD are shared, so that defects can be detected with the same sensitivity and the area of ​​the crack detection circuit can be minimized or at least reduced.

[0160] The display device according to various exemplary embodiments may be any suitable display device such as a liquid crystal display (LCD) device, an organic / inorganic light emitting display device, or the like.

[0161] While certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to these embodiments, but rather to the broader scope of the claims set forth and various obvious modifications and equivalent arrangements.

Claims

1. A display device, comprising: A substrate, comprising a display area and a peripheral area, wherein the display area comprises a plurality of pixels and a plurality of data lines, and the peripheral area is arranged outside the display area; A pad portion, disposed in the peripheral area; a bending area, arranged in the peripheral area, wherein the bending area is bendable or in a bent state; A crack detection circuit section is arranged between the display area and the pad portion, and the crack detection circuit section includes a switch; a first crack detection line, comprising a first reciprocating bending portion disposed in the bending region, the first crack detection line being connected between the pad portion and the crack detection circuit portion, the first crack detection line being configured to detect a crack generated in the bending region; a second crack detection line including a second reciprocating curved portion provided in the peripheral region other than the curved region at a peripheral portion of the display region, the second crack detection line being connected between the pad portion and the crack detection circuit portion, the second crack detection line being configured to detect a crack generated in the peripheral region around the display region, wherein the first reciprocating curved portion comprises a plurality of zigzag curved portions formed in a reciprocating pattern along a second direction; the second reciprocating curved portion comprises a plurality of zigzag curved portions formed in a reciprocating pattern along the second direction or a first direction intersecting the second direction, and Wherein, the first reciprocating bending portion is arranged between the second reciprocating bending portion and the pad portion.

2. The display device according to claim 1, wherein: A first end of the first crack detection line is connected to a first node connected to the pad portion, and a second end of the first crack detection line is connected to the crack detection circuit portion, and A third end of the second crack detection line is connected to the first node, and a fourth end of the second crack detection line is connected to the crack detection circuit portion.

3. The display device according to claim 2, further comprising: A first test data line extends in the first direction in an area of ​​the peripheral region, the first test data line being connected to the first node.

4. The display device according to claim 3, further comprising: a second test data line extending in the first direction in the area of ​​the peripheral region, the second test data line being spaced apart from the first test data line in the second direction, Wherein, the second end of the first crack detection line is connected to the second test data line.

5. The display device according to claim 4, further comprising: a third test data line extending in the first direction in the area of ​​the peripheral region, the third test data line being spaced apart from the first test data line and the second test data line in the second direction, Wherein, the fourth end of the second crack detection line is connected to the third test data line.

6. The display device according to claim 5, further comprising: A matching resistor is connected between the first node and the first test data line.

7. The display device according to claim 5, wherein: At least one of the first test data line, the second test data line, and the third test data line is disposed between the display area and the switch, and crosses at least one of the plurality of data lines in an insulated manner.

8. The display device according to claim 5, wherein: The switches of the crack detection circuit unit include a first switch, a second switch and a third switch, The first switch is connected between the first test data line and a first data line among the plurality of data lines. The second switch is connected between the second test data line and a second data line among the plurality of data lines, and The third switch is connected between the third test data line and a third data line among the plurality of data lines.

9. The display device according to claim 8, further comprising: A test gate line is connected to gate terminals of the first switch, the second switch, and the third switch.

10. The display device according to claim 9, wherein: The second data line is connected to a first pixel among the plurality of pixels, the first pixel being configured to display a first color, and The third data line is connected to a second pixel among the plurality of pixels, and the second pixel is configured to display a second color different from the first color.

11. The display device according to claim 8, wherein: The first switch, the second switch, and the third switch are arranged in the first direction.

12. The display device according to claim 1, wherein: The first reciprocating curved portion is adjacent to a first edge of the substrate extending in the second direction, and The first reciprocating curved portion extends in the second direction.

13. The display device according to claim 12, wherein: The first reciprocating curved portion is spaced apart from the second reciprocating curved portion in the second direction, and The second reciprocating curved portion extends in the first direction and the second direction.

14. The display device according to claim 1, wherein: The second crack detection line includes a portion passing through the bending area, and In the bending area, the first crack detection line is disposed between the second crack detection line and an outer edge of the peripheral area.

15. The display device according to claim 1, further comprising: A strain gauge includes a resistive wire disposed in the bending region.

16. The display device according to claim 15, wherein: The resistance line is disposed between the first crack detection line and an outer edge of the peripheral area.

17. The display device according to claim 1, wherein: The crack detection circuit section is disposed between the bending region and the pad portion.

18. The display device according to claim 1, further comprising: A common voltage transmission line passes through the bending area, Wherein, the first crack detection line is arranged in the bending area between the common voltage transmission line and the outer edge of the peripheral area.

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