Heater cover plate for uniformity improvement

Abstract

Embodiments of the present disclosure are generally directed to an apparatus for improving film thickness substrates when using a heated substrate support. A cover plate is disclosed to be placed over the top surface of a heated substrate support. The cover plate includes a cavity formed in the middle of the cover plate for placing a substrate. The cover plate can include various features including a plurality of dimples, a plurality of radially disposed grooves, a plurality of annular grooves, lift pin holes, pin slots, and gas exhaust holes.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to the manufacture of integrated circuits and apparatus for use in a substrate processing chamber to improve film thickness uniformity. For example, the embodiments of this application generally relate to substrate supports and substrate support covers. Background Technology

[0002] The primary objective of substrate processing is to obtain the maximum usable surface area from each substrate, and thus the maximum number of chips. Some factors to consider include processing variables that affect the uniformity and thickness of layers deposited on the substrate, as well as contaminants that may adhere to the substrate and render it wholly or partially useless. Controlling these factors maximizes the usable surface area of ​​each processed substrate.

[0003] Traditionally, heated substrate supports have been used to improve film thickness uniformity by enhancing temperature uniformity across the entire substrate receiving surface. However, depending on the distribution of heating elements, typical heated substrate supports exhibit varying temperature uniformity. Many heated substrate supports are susceptible to localized hot and cold spots. Some heated substrate supports include a substrate receiving surface smaller than the diameter of the substrate on which it is disposed. Smaller heated substrate supports encounter the problem of regulating the edge temperature of the substrate, where the substrate diameter is larger than the diameter of the heated substrate support.

[0004] Some heated substrate supports include pockets. However, for processes where it is difficult to remove deposited products from heated substrate supports, pockets lead to more frequent replacement of heated substrate supports, increase maintenance costs, and negatively impact reliability.

[0005] Therefore, there is a need in this field for devices to improve temperature uniformity. Summary of the Invention

[0006] The embodiments of this disclosure are generally related to an apparatus for improving the film thickness of a substrate when using a heated substrate support.

[0007] In one embodiment, a cover plate for substrate processing includes an annular body. The annular body further includes: a planar substrate receiving surface; a heater interface surface parallel to a planar support surface; a plurality of lifting pin holes formed through the annular body; an outer top surface disposed radially outward from the planar support surface; a bottom surface disposed radially outward from the heater interface surface; and an annular stepped region between the heater interface surface and the bottom surface. The annular stepped region further includes a first annular step, a second annular step, and an intermediate surface, wherein the first annular step is disposed radially outward from the outer edge of the heater interface surface, the second annular step is disposed radially outward from the first annular step, and the intermediate surface connects the first annular step and the second annular step.

[0008] In another embodiment, a cover plate for substrate processing includes an annular body. The annular body further includes: a substrate receiving surface; a heater interface surface parallel to the substrate receiving surface; a plurality of lifting pin holes formed through the annular body; a top surface disposed radially outward from the substrate receiving surface; a bottom surface disposed radially outward from the heater interface surface; and a plurality of pin grooves extending from the bottom surface into the cover plate.

[0009] In another embodiment, an assembly for supporting a substrate includes: a heated substrate support; a plurality of lifting pins; a plurality of fixing pins disposed along the outer edge of a substrate support base; and an annular cover plate disposed on top of and covering the upper surface of the heated substrate support. The annular cover plate further includes: a substrate receiving surface; a heater interface surface parallel to the substrate receiving surface; a plurality of lifting pin holes formed through the annular cover plate; a top surface disposed radially outward from the substrate receiving surface; a bottom surface radially outward from the heater interface surface; and a plurality of pin grooves extending from the bottom surface into the annular cover plate. Attached Figure Description

[0010] To provide a more detailed understanding of the above-described features of this disclosure, reference embodiments are provided to obtain a more detailed description of the disclosure briefly outlined above, some of which are shown in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and should therefore not be construed as limiting the scope, as other equivalent embodiments are permissible.

[0011] Figure 1 This is a schematic cross-sectional view of a processing chamber according to an embodiment of the present disclosure.

[0012] Figure 2 This is a schematic cross-sectional view of a substrate support assembly according to an embodiment of the present disclosure.

[0013] Figure 3A This is an enlarged cross-sectional view of a first embodiment of a cover plate assembly according to the present disclosure.

[0014] Figure 3B This is a front isometric top view of a first embodiment of a cover plate assembly according to the present disclosure.

[0015] Figure 3C This is an enlarged cross-sectional view of a second embodiment of the cover plate assembly according to the embodiments of this disclosure.

[0016] Figure 3D This is a front isometric top view of a second embodiment of the cover plate assembly according to the present disclosure.

[0017] Figure 3E This is an enlarged cross-sectional view of a third embodiment of the cover plate assembly according to the embodiments of this disclosure.

[0018] Figure 3F This is a front isometric top view of a third embodiment of the cover plate assembly according to the present disclosure.

[0019] Figure 3G This is an enlarged cross-sectional view of a fourth embodiment of the cover plate assembly according to the embodiments of this disclosure.

[0020] Figure 3H This is a front isometric top view of a fourth embodiment of the cover plate assembly according to the present disclosure.

[0021] Figure 3I This is an enlarged cross-sectional view of a fifth embodiment of the cover plate assembly according to the embodiments of this disclosure.

[0022] Figure 3J This is a front isometric top view of a fifth embodiment of the cover plate assembly according to the present disclosure.

[0023] Figure 3K This is an enlarged cross-sectional view of a sixth embodiment of the cover plate assembly according to the embodiments of this disclosure.

[0024] Figure 3L This is a front isometric top view of a sixth embodiment of a cover plate assembly according to the present disclosure.

[0025] Figure 4 This is an enlarged cross-sectional view of the lifting pin hole formed through the cover plate assembly and the pin groove formed through the cover plate assembly according to an embodiment of the present disclosure.

[0026] Figure 5A This is a front isometric top view of a seventh embodiment of a cover plate assembly according to the present disclosure.

[0027] Figure 5BThis is a cross-sectional view of a seventh embodiment of a cover plate assembly according to the present disclosure.

[0028] Figure 5C This is an enlarged plan view of a protrusion formed on a seventh embodiment of the cover plate assembly according to an embodiment of the present disclosure.

[0029] Figure 5D This is an enlarged cross-sectional view of a protrusion formed on a seventh embodiment of the cover plate assembly according to an embodiment of the present disclosure.

[0030] For ease of understanding, the same reference numerals are used where possible to denote common elements in the figures. It is contemplated that elements and features of one embodiment can be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0031] Figure 1 This is a schematic cross-sectional view of the processing chamber 100. The processing chamber 100 includes a chamber wall 102, a cover 108, a nozzle assembly 106, and a substrate support assembly 104. The chamber wall 102, cover 108, and nozzle assembly 106 form a processing volume 120. The processing volume 120 is the volume in which substrate processing is performed. The nozzle assembly 106 is coupled to or formed through the cover 108. The nozzle assembly 106 can be any suitable nozzle assembly and can be configured to disperse processing gas or plasma into the processing volume 120.

[0032] A cover 108 is disposed on top of the chamber wall 102. In some embodiments, the chamber wall 102 is a side wall of the processing chamber 100. The chamber wall 102 includes the bottom of the processing chamber 100. The cover 108 is disposed above the substrate support assembly 104. The cover 108 and the chamber wall 102 form a processing volume 120.

[0033] In some embodiments, the nozzle assembly 106 may include multiple plates or diffusers and / or be connectable to a remote plasma source. Figure 1 The nozzle assembly 106 shown is not limited to using other equivalent nozzle assemblies. In some embodiments, the nozzle assembly 106 is a stack of plates that includes various other diffusers, plates, or orifices.

[0034] The substrate support assembly 104 includes a heated substrate support 116 and a cover assembly 112. The substrate 110 is disposed on top of the cover assembly 112. The heated substrate support 116 is a resistance-heated substrate support, such that the temperature of the heated substrate support 116 is controlled using a resistance heating element 135 disposed within the heated substrate support 116. The resistance heating element 135 can be disposed within the heated substrate support 116 in any suitable pattern. The heated substrate support 116 is disposed on top of a support shaft 122. The cover assembly 112 is disposed on top of the heated substrate support 116 and at least partially covers the sides of the heated substrate support 116. The cover assembly 112 is a ceramic material (such as alumina (e.g., Al2O3) or aluminum nitride (AlN)) and is formed by a sintering process. The substrate 110 can be any suitable substrate and is disposed on top of the cover assembly 112. The substrate 110 can be in any developmental state. In some embodiments, substrate 110 is a silicon substrate. In other embodiments, substrate 110 is a doped silicon substrate, such that substrate 110 is doped with boron, germanium, aluminum, gallium, carbon, nitrogen, or phosphorus.

[0035] Power cable 118 and controller 114 are connected to support shaft 122 of substrate support assembly 104. Power cable 118 passes through support shaft 122 (see...). Figure 2 The controller 114 is configured to be connected to the heated substrate support 116. The controller 114 includes a power source and is configured to control a resistance heating element 135 disposed within the heated substrate support 116. The controller 114 may additionally be configured to use mechanical actuation to control the movement of the substrate support assembly 104 to adjust the vertical position of the substrate support 116.

[0036] Figure 2 This is a schematic cross-sectional view of the substrate support assembly 104. Figure 2 The substrate support assembly 104 includes a heated substrate support 116, a cover plate assembly 112, a plurality of lifting pins 202, a gas supply line 230, and a power line 118. The plurality of lifting pins 202 are disposed through the cover plate assembly 112 and the heated substrate support 116, such that the tops of the plurality of lifting pins 202 are below the substrate. Figure 1 As shown. In some embodiments, there are three lifting pins 202.

[0037] Gas supply line 230 and power line 118 are disposed through support shaft 122 of substrate support assembly 104. Gas supply line 230 extends through support shaft 122 into heated substrate support 116 and terminates at the back side of cover assembly 112, such that back-side gas is supplied to the back side of cover assembly 112 via gas supply line 230. Gas supply line 230 is connected to a purified gas supplier (not shown).

[0038] The central axis 240 is the central axis of the substrate support assembly 104, such that the central axis 240 is arranged to pass through the center of the support shaft 122, the heated substrate support 116 and the cover assembly 112.

[0039] Figure 3A This is an enlarged cross-sectional view of a first embodiment of the cover plate assembly 112a. The cover plate assembly 112a includes a substrate receiving surface 310, a heater interface surface 304, an outer surface 316, a top surface 314, and a bottom surface 340. The substrate receiving surface 310 is disposed in a cavity 305 within the top surface 314.

[0040] Cavity 305 is vertically offset from and below the top surface 314 of cover assembly 112a. Substrate receiving surface 310 is the inner surface of cavity 305, such that substrate receiving surface 310 is vertically offset from the top surface 314. Cavity 305 is sized to receive substrates, such as 200 mm, 300 mm, 450 mm, or other suitable substrates. Cavity 305 is a circular cavity disposed in the top surface 314 of cover assembly 112a. In some embodiments that can be combined with other embodiments, the diameter of cavity 305 is about 250 mm to about 350 mm, such as about 280 mm to about 330 mm, such as about 285 mm to about 325 mm, such as about 295 mm to about 315 mm, such as about 295 mm to about 310 mm, such as about 300 mm to about 305 mm. Substrate receiving surface 310 is connected to top surface 314 via an inclined top surface 312. The inclined top surface 312 is an inclined ring that connects the outer edge of the substrate receiving surface 310 and the inner edge of the top surface 314. The inclined top surface 312 slopes downward from the top surface 314 to the substrate receiving surface 310. In some embodiments, the angle of the inclined top surface 312 relative to the substrate receiving surface 310 is about 25 degrees to about 85 degrees, such as about 35 degrees to about 80 degrees, such as about 45 degrees to about 75 degrees. In some embodiments, the angle of the inclined top surface 312 relative to the substrate receiving surface 310 is about 35 degrees to about 55 degrees, such as about 40 degrees to about 50 degrees, such as about 45 degrees. In other embodiments, the angle of the inclined top surface 312 relative to the substrate receiving surface 310 is about 60 degrees to about 85 degrees, such as about 65 degrees to about 80 degrees, such as about 70 degrees to about 80 degrees, such as about 75 degrees.

[0041] The cavity 305 is vertically offset from the top surface 314 of the cover assembly 112a by about 0 mm to about 6 mm, such as about 0 mm to about 4 mm, such as about 0 mm to about 2.5 mm, such as about 0.5 mm to about 2.5 mm, such as about 0.5 mm to about 1.5 mm. In other embodiments described herein, the cavity 305 may have a similar offset from the top surface 314.

[0042] Top surface 314 is an annular outer surface. Top surface 314 surrounds cavity 305. Top surface 314 is a horizontal surface and extends between the inclined top surface 312 of cavity 305 and the outer surface 316 of cover assembly 112a. The outer surface 316 of cover assembly 112a is a vertical surface and is the most radially outward surface of cover assembly 112a. Outer surface 316 is connected to the outer surface of top surface 314 by a curved edge. In one example, top surface 314 is parallel to substrate receiving surface 310.

[0043] The bottom surface 340 of the cover assembly 112a is connected to the farthest end of the outer surface 316 from the top surface 314. The bottom surface 340 extends radially inward from the outer surface 316. The bottom surface 340 is disposed adjacent to the outer top surface 322 of the heated substrate support 116. The bottom surface 340 is a horizontal surface, parallel to the top surface 314 and the substrate receiving surface 310. The bottom surface 340 extends from the outer surface 316 to a first stepped surface 328. The first stepped surface 328 is a vertical surface extending upward from the bottom surface 340, such that the cover assembly 112a has a reduced inner diameter at the first stepped surface 328. The first stepped surface 328 is disposed on the farthest end of the bottom surface 340 from the outer surface 316.

[0044] The first stepped surface 328 connects to the second stepped surface 327. The second stepped surface 327 is a horizontal surface disposed radially inside the first stepped surface 328. The second stepped surface 327 connects to the first stepped surface 328 via a curved corner. The second stepped surface 327 connects to the third stepped surface 326. The third stepped surface 326 is an inclined surface or another set of stepped surfaces, such as... Figure 3E , Figure 3G , Figure 3I and Figure 3K As shown. As the surface of the third step approaches the central axis 240 ( Figure 2 The third stepped surface 326 has a positive slope and narrows as the cover assembly 112a extends radially inward and upward. The third stepped surface 326 connects to the radially inward distal end of the second stepped surface 327. The third stepped surface 326 is disposed between the second stepped surface 327 and the heater interface surface 304.

[0045] The heater interface surface 304 is a horizontal surface, positioned parallel to the top surface 314 and the substrate receiving surface 310. The heater interface surface 304 extends radially inward from the third stepped surface 326, such that it is located radially inside the first stepped surface 328, the second stepped surface 327, and the bottom surface 340. The heater interface surface 304 is located below the substrate receiving surface 310 of the cavity 305, such that it has a smaller outer radius than the substrate receiving surface 310. The heater interface surface 304 is sized to interact with the top heater surface 302 of the heated substrate support 116. In some embodiments, the heater interface surface 304 is parallel to and adjacent to the top heater surface 302 of the heated substrate support 116. The heater interface surface 304 described herein is a circular surface and forms a disk.

[0046] A cavity 320 is formed between the cover plate assembly 112a and the heated substrate support 116 by a first stepped surface 328, a second stepped surface 327, and a third stepped surface 326, an outer top surface 322, a first heater step 323, a second heater step 324, and a third heater step 325. The outer top surface 322 is the horizontal outer surface of the heated substrate support 116. The first heater step 323 is a vertical surface connected to the radially inward end of the outer top surface 322. The second heater step 324 is a horizontal surface connected to the top edge of the first heater step 322 (such as the edge of the first heater step 323 radially away from the outer top surface 322). The third heater step 325 is a vertical step connected to the radially inward end of the second heater step 324. The top edge of the third heater step 325 is connected to the top heater surface 302. The cavity 320 forms a gap between the cover plate assembly 112a and the heated substrate support 116, and helps to prevent damage caused by the difference in thermal expansion between the cover plate assembly 112a and the heated substrate support 116.

[0047] The first heater step 323 and the third heater step 325 are parallel to the first stepped surface 328 of the cover plate assembly 112a. The second heater step 324 is parallel to the second stepped surface 327 of the cover plate assembly 112a. The heated substrate support 116 further includes an outer surface 332. The outer surface 332 of the heated substrate support 116 is disposed radially inside the outer surface 316 of the cover plate assembly 112a. The outer surface 332 of the heated substrate support 116 is connected to the outer edge of the outer top surface 322. The outer surface 332 is a vertical surface.

[0048] Figure 3BThis is a front isometric top view of a first embodiment of the cover plate assembly 112a. The first embodiment of the cover plate assembly 112a includes a lifting pin hole 308, a cavity 305, a substrate receiving surface 310, a top surface 314, and an outer surface 316. Figure 3B The cover plate assembly 112a shown is Figure 3A The cover assembly 112a shown.

[0049] Cavity 305, substrate receiving surface 310, top surface 314, outer surface 316, and inclined top surface 312 are related to the above. Figure 3A The description is identical. Top surface 314 is an annular surface surrounding cavity 305. Substrate receiving surface 310 is a circular surface. Substrate receiving surface 310 is a planar surface. Lifting pin holes 308 are configured to pass through substrate receiving surface 310. In some embodiments, there are three lifting pin holes 308 provided through substrate receiving surface 310. Lifting pin holes 308 are evenly spaced around the center of substrate receiving surface. Outer surface 316 is an annular surface provided around the outermost edge of cover assembly 112a. Inclined top surface 312 is an annular surface that connects top surface 314 and substrate receiving surface 310.

[0050] The cover plate assembly 112a improves the temperature uniformity of the substrate by dispersing the heat load from localized hot and cold spots on the heated substrate support 116. The cover plate assembly 112a is easy to recycle and easy to remove for maintenance.

[0051] Figure 3C This is an enlarged cross-sectional view of a second embodiment of the cover plate assembly 112b. The cover plate assembly 112b includes a substrate receiving surface 310, a heater interface surface 304, an outer surface 316, a top surface 314, and a bottom surface 340. The substrate receiving surface 310 is disposed in the cavity 305. Figure 3C The heated substrate support 116 shown is related to Figure 3A The heating substrate support 116 described is the same.

[0052] Cavity 305 is vertically offset from the top surface 314 of cover assembly 112b. Substrate receiving surface 310 is the inner surface of cavity 305, such that substrate receiving surface 310 is vertically offset from the top surface 314. Cavity 305 is sized to receive a substrate, such as a 200 mm, 300 mm, 450 mm, or other suitable substrate. Cavity 305 is a circular cavity disposed in the top surface 314 of cover assembly 112b. In some embodiments, the diameter of cavity 305 is about 250 mm to about 350 mm, such as about 280 mm to about 330 mm, such as about 285 mm to about 325 mm, such as about 295 mm to about 315 mm, such as about 295 mm to about 310 mm, such as about 300 mm to about 305 mm. Substrate receiving surface 310 is connected to top surface 314 via external cavity recess 334.

[0053] The external cavity recess 334 includes an inclined top surface 312, a bottom recess surface 350, and an inclined recess surface 351. The inclined top surface 312 is an annular ring with an angled inner surface, connecting the outer edge of the bottom recess surface 350 and the inner edge of the top surface 314. The inclined top surface 312 slopes downward from the top surface 314 to the bottom recess surface 350. The bottom recess surface 350 is a horizontal surface disposed between the inclined top surface 312 and the inclined recess surface 351. The bottom recess surface 350 is an annular surface connecting the inclined top surface 312 and the inclined recess surface 351. The bottom recess surface 350 is perpendicularly offset from both the substrate receiving surface 310 and the top surface 314. In some embodiments, the external cavity recess 334 may be a recess formed in the substrate receiving surface 310, such that the bottom recess surface 350 is vertically disposed below the substrate receiving surface 310. The inclined recess surface 351 connects the bottom recess surface 350 and the substrate receiving surface 310. The inclined groove surface 351 slopes upward from the bottom groove surface 350 to the substrate receiving surface 310.

[0054] The substrate receiving surface 310 and the external cavity recess 334 are sized such that when the substrate 110 is disposed on the substrate receiving surface 310, at least a portion of the substrate 110 is disposed above the external cavity recess 334 (e.g., the periphery of the substrate 110 is vertically positioned above the bottom recess surface 350). In some embodiments, the edge of the substrate 110 is disposed above at least a portion of the external cavity recess 334.

[0055] One or more radially arranged grooves 352 are also provided in the cavity 305. The radially arranged grooves 352 are arranged radially inward from the outer cavity groove 334. The radially arranged grooves 352 have a bottom surface coplanar with the bottom groove surface 350. In some embodiments, the radially arranged grooves 352 are not coplanar with the bottom groove surface 350 and may be configured such that the radially arranged grooves 352 are deeper than the bottom groove surface 350. In some embodiments, the radially arranged grooves 352 are shallower than the bottom groove surface 350. In some embodiments, the inner radius of the bottom groove surface 350 from the center of the cover assembly 112b is about 300 mm to about 310 mm, such as about 300 mm to about 305 mm, such as about 301 mm to about 304 mm. In some embodiments, the outer radius of the bottom groove surface 350 from the center of the cover assembly 112b is about 300 mm to about 310 mm, such as about 303 mm to about 308 mm, such as about 305 mm to about 306 mm. One or more radially arranged grooves 352 have a depth of less than about 3 mm, such as less than about 2.5 mm. In some embodiments, the depth of one or more radially arranged grooves 352 is between about 0.25 mm and about 3 mm, such as about 0.5 mm to about 2.5 mm, such as about 0.7 mm to about 2.3 mm.

[0056] Top surface 314 is an annular outer surface. Top surface 314 and... Figure 3A and Figure 3B The top surface 314 is the same as that of the cavity 305. The top surface 314 extends between the inclined top surface 312 of the cavity 305 and the outer surface 316 of the cover assembly 112b. The outer surface 316 of the cover assembly 112b is the same as that of the cavity 305. Figure 3A and Figure 3B The outer surface 316 is the same, but the outer surface 316 extends radially downward beyond the bottom surface 340 of the cover plate assembly 112b, so that the overhang portion 348 is formed around the outer surface 332 of the heated substrate support 116.

[0057] The overhang portion 348 includes a portion of the outer surface 316 of the cover assembly 112b, a bottom overhang surface 342, and an inner overhang surface 344. The bottom overhang surface 342 is connected to and disposed radially inward from the outer surface 316. The bottom overhang surface 342 is a horizontal surface and connects the outer surface 316 to the inner overhang surface 344. The inner overhang surface 344 is a vertical surface disposed adjacent to the outer surface 332 of the heated substrate support 116. The inner overhang surface 344 extends vertically upward from the bottom overhang surface 342, such that the inner overhang surface 344 connects the bottom overhang surface 342 and the bottom surface 340 of the cover assembly 112b. The inner overhang surface 344 is parallel to the outer surface 316.

[0058] The bottom surface 340 extends radially inward from the inner overhanging surface 344. The bottom surface 340 is disposed adjacent to the outer top surface 322 of the heated substrate support 116. The bottom surface 340, the first stepped surface 328, the second stepped surface 327, and the third stepped surface 326 are all related to a reference surface. Figure 3A and Figure 3B The descriptions are the same.

[0059] Figure 3D This is a front isometric top view of a second embodiment of the cover plate assembly. The second embodiment of the cover plate assembly 112b includes a lifting pin hole 308, a cavity 305, a substrate receiving surface 310, a top surface 314, an external cavity groove 334, and a hanging portion 348 (in...). Figure 3C (as shown in the middle) and outer surface 316. Figure 3D The cover assembly 112b shown is Figure 3C The cover assembly 112b shown is shown.

[0060] Cavity 305, substrate receiving surface 310, top surface 314, outer surface 316, inclined top surface 312, external cavity groove 334, and one or more radially arranged grooves 352 are related to the above. Figure 3A The same applies as described herein. The cover assembly 112b is further shown to include an annular internal groove 346. The depth of the annular internal groove 346 is similar to that of one or more radially arranged grooves 352. The annular internal groove 346 is formed in the substrate receiving surface 310 and is located radially inside the external cavity groove 334. The one or more radially arranged grooves 352 may be a plurality of grooves, such as 3 to 20 radially arranged grooves 352, such as 4 to 18 radially arranged grooves 352, such as 6 to 18 radially arranged grooves 352. In embodiments such as those shown herein, six radially arranged grooves 352 are formed through the substrate receiving surface 310.

[0061] The lift pin holes 308 are disposed through the substrate receiving surface 310. In some embodiments, three lift pin holes 308 are disposed through the substrate receiving surface 310. The lift pin holes 308 are evenly spaced around the center of the substrate receiving surface.

[0062] The radially arranged groove 352, the annular inner groove 346, and the outer cavity groove 334 allow gas to escape from under the substrate (such as substrate 110) during processing. Each of the radially arranged groove 352, the annular inner groove 346, and the outer cavity groove 334 is in fluid communication with each other. The connection between the radially arranged groove 352, the annular inner groove 346, and the outer cavity groove 334 allows gas to flow from the annular inner groove 346 to the radially arranged groove 352 and out from under the substrate via the outer cavity groove 334. Removing gas from under the substrate stabilizes the substrate so that it does not slide within the cavity 305 of the cover assembly 112b.

[0063] The overhang portion 348 also helps improve the temperature uniformity of the substrate. The overhang portion 348 absorbs the heat released by the outer surface 332 of the heated substrate support 116. The overhang portion 348 helps to distribute heat evenly to all parts of the cover assembly 112b.

[0064] Figure 3E This is an enlarged cross-sectional view of a third embodiment of the cover plate assembly 112c. The cover plate assembly 112c includes a substrate receiving surface 310, a heater interface surface 304, an outer surface 316, a top surface 314, and a bottom surface 340. The substrate receiving surface 310 is disposed in a cavity 305. The cover plate assembly 112c is similar to the cover plate assembly 112a, but the cover plate assembly 112c includes a plurality of recesses 355, overhangs 348, and a vertical third stepped surface 326.

[0065] Figure 3E The cavity 305 of the cover plate assembly 112c in the middle and Figure 3A The cavity 305 of the cover plate assembly 112a is similar to that in the middle. Figure 3E The cavity 305 of the cover plate assembly 112c in the middle and Figure 3A The difference in cavity 305 of cover assembly 112a is that, Figure 3E The cavity 305 of the cover plate assembly 112c includes a plurality of recesses 355 disposed on the substrate receiving surface 310 within the cavity 305 (shown in the diagram). Figure 3F middle).

[0066] Top surface 314 is an annular outer surface. Top surface 314 and... Figure 3A and Figure 3B The top surface 314 is the same. The top surface 314 extends between the inclined top surface 312 of the cavity 305 and the outer surface 316 of the cover assembly 112b.

[0067] The outer surface 316 of the cover assembly 112c is with Figure 3A and Figure 3BThe outer surface 316 is the same, but the outer surface 316 extends radially downward beyond the bottom surface 340 of the cover plate assembly 112b, such that the overhang portion 348 is formed around the outer surface 332 of the heated substrate support 116. The overhang portion 348 is related to... Figure 3C The described overhang portion 348 is the same.

[0068] The bottom surface 340 extends radially inward from the inner overhanging surface 344. The bottom surface 340 is configured to be adjacent to the outer top surface 322 of the heated substrate support 116. The bottom surface 340 extends from the outer surface 316 to the first stepped surface 328. The first stepped surface 328 and the second stepped surface 327 are related to... Figure 3A and Figure 3C The description is the same. In Figure 3E and Figure 3F In this embodiment, the third stepped surface 326 is a vertical surface. The cover assembly 112c narrows as it extends radially inward. The third stepped surface 326 connects to the radially inward distal end of the second stepped surface 327. The third stepped surface 326 is disposed between the second stepped surface 327 and the heater interface surface 304. The third stepped surface 326 is parallel to the third heater step 325.

[0069] Heater interface surface 304 and about Figure 3A and Figure 3C The same as described herein. In the third embodiment of the cover plate assembly 112c described herein, a cavity 320 is formed between the cover plate assembly 112c and the heated substrate support 116.

[0070] Figure 3F This is a front isometric top view of a third embodiment of the cover plate assembly. The third embodiment of the cover plate assembly 112c includes a lifting pin hole 308, a cavity 305, a substrate receiving surface 310, a top surface 314, and a hanging portion 348 (in...). Figure 3E (shown in the middle), outer surface 316 and multiple pits 355. Figure 3F The cover assembly 112c shown is Figure 3E The cover assembly 112c shown.

[0071] Cavity 305, substrate receiving surface 310, top surface 314, outer surface 316, inclined top surface 312 and the above-mentioned Figure 3EThe description is the same. Multiple recesses 355 are depressions in the substrate receiving surface 310. The recesses 355 may be randomly distributed across the entire substrate receiving surface 310, or the recesses 355 may be patterned on the substrate receiving surface 310. In some embodiments that can be combined with other embodiments, the recesses 355 are circularly grouped, such that the recesses are distributed concentrically across the entire substrate receiving surface 310. In still other embodiments, the recesses 355 are uniformly spaced across the entire substrate receiving surface 310, such that each recess 355 is uniformly spaced from each other. In some embodiments, there are more recesses 355 towards the center of the substrate receiving surface 310 than towards the edges of the substrate receiving surface. Conversely, there are more recesses 355 towards the edges of the substrate receiving surface than towards the center of the substrate receiving surface 310.

[0072] In some embodiments that can be combined with other embodiments, there may be 15 or more pits 355, such as about 25 or more pits 355, such as about 50 or more pits 355. The depth of the pits 355 is about 0.0025 mm to about 0.25 mm, such as about 0.01 mm to about 0.1 mm, such as about 0.02 mm to about 0.06 mm.

[0073] The lift pin holes 308 are disposed through the substrate receiving surface 310. In some embodiments, three lift pin holes 308 are disposed through the substrate receiving surface 310. The lift pin holes 308 are evenly spaced around the center of the substrate receiving surface.

[0074] The recess 355 reduces slippage of the substrate (such as substrate 110) disposed on the substrate receiving surface 310 during substrate processing. The recess 355 also helps to improve the temperature distribution across the entire cover assembly 112c.

[0075] Figure 3G This is an enlarged cross-sectional view of the fourth embodiment of the cover plate assembly 112d. The cover plate assembly 112d includes a substrate receiving surface 310, a heater interface surface 304, an outer surface 316, a top surface 314, a bottom surface 340, a radially disposed groove 352, a gas exhaust hole 358, a hanging portion 348, and a recess 355. Figure 3H The substrate receiving surface 310 is disposed in the cavity 305.

[0076] Figure 3E The cavity 305 of the cover plate assembly 112c in the middle and Figure 3A and Figure 3E The cavity 305 of the cover plate assembly 112a is similar to that in the middle. Figure 3G The cavity 305 of the cover plate assembly 112d in the middle and Figure 3A The difference in cavity 305 of cover assembly 112a is that, Figure 3G The cavity 305 of the cover plate assembly 112d includes a plurality of recesses 355 disposed on the substrate receiving surface 310 within the cavity 305 (shown in the diagram). Figure 3G (in the middle), one or more radially arranged grooves 352 and gas discharge holes 358.

[0077] The radially arranged groove 352 and about Figure 3C and Figure 3D The radially arranged groove 352 is similar to the one described. Figure 3G and Figure 3H The radially arranged groove 352 does not interact with the external cavity groove (such as...) Figure 3C and Figure 3D The external cavity groove 334 is in fluid communication. A radially arranged groove 352 is disposed on the substrate receiving surface 310. When the substrate (such as substrate 110) is disposed on the substrate receiving surface 310, the radially arranged groove 352 is completely disposed below the substrate 110. The radially outward portion of the radially arranged groove 352 includes a gas vent hole 358 disposed therethrough. The gas vent hole 358 is formed through the bottom surface of the radially arranged groove 352 and extends to the heater interface surface 304 of the cover assembly 112d. The gas vent hole 358 may be formed at the end of each radially arranged groove 352 through the cover assembly 112d. A pit 355 is similar to... Figure 3E and Figure 3F The pit described in the text.

[0078] Top surface 314 is an annular outer surface. Top surface 314 and... Figures 3A-3F The top surface 314 of the cavity 305 is identical. The top surface 314 extends between the inclined top surface 312 of the cavity 305 and the outer surface 316 of the cover assembly 112b. The outer surface 316 of the cover assembly 112c is identical to... Figure 3C-3F The outer surface 316 is the same, so that a hanging portion 348 is formed around the outer surface 332 of the heated substrate support 116.

[0079] The bottom surface 340 extends radially inward from the inner overhanging surface 344. The bottom surface 340 is adjacent to the outer top surface 322 of the heated substrate support 116. The bottom surface 340 extends from the outer surface 316 to the first stepped surface 328. The first stepped surface 328 and the second stepped surface 327 are related to... Figure 3A and Figure 3C The description is the same. In Figure 3G and Figure 3HIn this embodiment, the third stepped surface 326 is a vertical surface. The cover assembly 112d narrows as it extends radially inward. The third stepped surface 326 connects to the radially inward distal end of the second stepped surface 327. The third stepped surface 326 is parallel to the third heater step 325. The third stepped surface 326 is disposed between the second stepped surface 327 and the bottom vent surface 357.

[0080] A bottom vent surface 357 is formed between the bottom of the gas outlet 358 and the third stepped surface 326. The bottom vent surface 357 is vertically offset from the heater interface surface 304, such that it is positioned above the heater interface surface 304. The bottom vent surface 357 may form a vent line spanning the outer portion of the heater interface surface 304, thereby spaced from the top heater surface 302. The bottom vent surface 357 is formed from the bottom of the gas outlet 358 to the third stepped surface 326, such that in the radial position without the gas outlet 358, the heater interface surface 304 interacts with the third stepped surface 326, similar to... Figure 3E The bottom vent surface 357 is radially positioned between the gas outlet 358 and the third stepped surface 326.

[0081] exist Figure 3G In the fourth embodiment, the radially arranged groove 352, gas vent 358, bottom vent surface 357, first stepped surface 328, second stepped surface 327, third stepped surface 326, bottom surface 340 and internal overhang surface are in fluid communication with each other and spaced apart from the heated substrate support 116 in order to provide a path for gas to exit from under the substrate (such as substrate 110) disposed on the cover assembly 112d.

[0082] This component reduces the gas present beneath the substrate 110 during processing, and thus reduces the movement of the substrate 110. Twenty additional gas flow paths provided by the radially arranged groove 352, gas vent 358, bottom vent surface 357, first stepped surface 328, second stepped surface 327, third stepped surface 326, bottom surface 340, and internal overhang surface further improve the temperature distribution across the entire cover assembly 112d.

[0083] In the fourth embodiment of the cover plate assembly 112d described herein, a cavity 320 is formed between the cover plate assembly 112d and the heated substrate support 116. The cavity 320 is part of a flow path for gas to flow out from below the substrate 110.

[0084] Figure 3HThis is a front isometric top view of the fourth embodiment of the cover plate assembly. The fourth embodiment of the cover plate assembly 112d includes a lifting pin hole 308, a cavity 305, a substrate receiving surface 310, a top surface 314, and a hanging portion 348 (in...). Figure 3E (as shown in the middle), outer surface 316, multiple pits 355, radially arranged grooves 352, gas discharge hole 358, gas supply hole 360, annular inner groove 346, annular middle groove 362, annular outer groove 363 and outer receiving surface 361. Figure 3H The cover plate assembly 112d shown is Figure 3G The cover plate assembly 112d shown is shown.

[0085] Cavity 305, substrate receiving surface 310, top surface 314, outer surface 316, inclined top surface 312, and one or more radially arranged grooves 352 are related to the above. Figure 3E The same as described above. Multiple pits 355 are similar to those mentioned above. Figure 3E and Figure 3F The described pit is 355.

[0086] A gas supply hole 360 ​​is disposed in the center of the substrate receiving surface 310. The gas supply hole 360 ​​is formed through the cover plate assembly 112d, such that the gas supply hole 360 ​​passes through the entire thickness of the cover plate assembly 112d at the center of the substrate receiving surface 310. The gas supply hole 360 ​​is located at the intersection of a plurality of radially arranged grooves 352. The gas supply hole 360 ​​allows back-side gas to be pumped to the back side of a substrate (such as substrate 110) disposed on the substrate receiving surface 310. The back-side gas is delivered via... Figure 2 A gas supply line 230 provides gas to the gas supply port 360. Providing backside gas reduces contamination of the substrate bottom during processing. The gas supplied by the gas supply port 360 is distributed via an annular inner groove 346, an annular middle groove 362, an annular outer groove 363, and a radially arranged groove 352. The gas can be discharged through the gas discharge port 358.

[0087] exist Figure 3D An annular internal groove 346 is described. The annular internal groove 346 intersects with each radially arranged groove 352. The annular internal groove 346 is centered on the cover plate assembly 112d such that it surrounds the gas supply hole 360. The annular internal groove 346 is a circular groove provided in the substrate receiving surface 310. The depth of the annular internal groove 346 is less than about 3 mm, such as less than about 2.5 mm. In some embodiments, the depth of one or more radially arranged grooves is between about 0.25 mm and about 3 mm, such as about 0.5 mm to about 2.5 mm, or about 0.7 mm to about 2.3 mm.

[0088] An annular intermediate groove 362 is disposed radially outside the annular inner groove 346. The annular intermediate groove 362 intersects each of the radially disposed grooves 352. The annular intermediate groove 362 is centered on the cover plate assembly 112d, such that the annular intermediate groove 362 is disposed around the gas supply hole 360. The annular intermediate groove is a circular groove disposed in the substrate receiving surface 310. The annular intermediate groove 362 may have the same depth as the annular inner groove 346. Alternatively, the depth of the annular intermediate groove 362 may differ from the depth of the annular inner groove 346, such as a depth of about 0.025 mm to about 0.1 mm, a depth of about 0.03 mm to about 0.075 mm, or a depth of about 0.04 mm to about 0.06 mm.

[0089] An annular outer groove 363 is disposed radially outside the annular inner groove 346 and the annular intermediate groove 362. The annular outer groove 363 intersects each of the radially disposed grooves 352. The annular outer groove 363 is centered on the cover assembly 112d such that the annular outer groove 363 is disposed around the gas supply hole 360. The annular outer groove is a circular groove disposed in the substrate receiving surface 310. The depth of the annular outer groove 363 may be the same as that of either the annular inner groove 346 or the annular intermediate groove 362. Alternatively, the depth of the annular outer groove 363 is from about 0.1 mm to about 0.5 mm, such as from about 0.2 mm to about 0.4 mm, or such as from about 0.2 mm to about 0.3 mm.

[0090] In some embodiments, each of the annular inner groove 346, the annular intermediate groove 362, and the annular outer groove 363 has the same depth, such as less than about 3 mm or less than about 2.5 mm. In some embodiments, the depths of the annular inner groove 346, the annular intermediate groove 362, and the annular outer groove 363 are between about 0.25 mm and about 3 mm, such as about 0.5 mm to about 2.5 mm or about 0.7 mm to about 2.3 mm. In some embodiments, only the annular inner groove 346 and the annular outer groove 363 may exist. In other embodiments, additional annular grooves may be formed in the substrate receiving surface 310, resulting in more than three annular grooves.

[0091] The outer receiving surface 361 is a planar surface extending from the substrate receiving surface 310. The outer receiving surface 361 is coplanar with the substrate receiving surface 310. The outer receiving surface 361 does not have a recess 355, an annular groove, or a radially disposed groove 352. The outer receiving surface 361 is an external extension of the substrate receiving surface 310. The outer receiving surface 361 is disposed radially outside the annular external groove 363 and the gas supply hole 360.

[0092] A recess 355 is located radially outside the annular inner groove 346 and radially inside the outer receiving surface 361. Multiple recesses 355 are formed between the annular inner groove 346 and the annular intermediate groove 362. Multiple recesses 355 are formed between the annular intermediate groove 362 and the annular outer groove 363. Multiple recesses 355 are formed between the annular outer groove 363 and the outer receiving surface 361. The number of recesses 355 formed between the annular inner groove 346 and the annular intermediate groove 362 may be less than the number of recesses 355 formed between the annular intermediate groove 362 and the annular outer groove 363. The number of recesses 355 formed between the annular intermediate groove 362 and the annular outer groove 363 is less than the number of recesses 355 formed between the annular outer groove 363 and the outer receiving surface 361.

[0093] In other embodiments, the number of pits 355 between the annular inner groove 346 and the annular intermediate groove 362 may be greater than the number of pits 355 formed between the annular intermediate groove 362 and the annular outer groove 363. The number of pits 355 formed between the annular intermediate groove 362 and the annular outer groove 363 is greater than the number of pits 355 formed between the annular outer groove 363 and the outer receiving surface 361.

[0094] In yet another embodiment, the number of recesses 355 between the inner annular groove 346 and the intermediate annular groove 362 is equal to the number of recesses 355 formed between the intermediate annular groove 362 and the outer annular groove 363. The number of recesses 355 formed between the intermediate annular groove 362 and the outer annular groove 363 is equal to the number of recesses 355 formed between the outer annular groove 363 and the outer receiving surface 361.

[0095] In an embodiment where the recesses 355 are formed in concentric rings, the number of recesses 355 in each ring increases as the ring expands radially outward, such that the first ring has 2 to 8 recesses, the second ring has 8 to 16 recesses, the third ring has 16 to 22 recesses, the fourth ring has 10 to 30 recesses, and the fifth ring has 20 to 50 recesses.

[0096] In one embodiment, the first ring has four pits 355, the second ring has twelve pits, the third ring has 18 pits, the fourth ring has 24 pits, and the fifth ring has 27 pits.

[0097] In some embodiments, the number of recesses 355 between the inner annular groove 346 and the intermediate annular groove 362 may be 18. The number of recesses 355 formed between the intermediate annular groove 362 and the outer annular groove 363 is 18. The number of recesses 355 formed between the outer annular groove 363 and the outer receiving surface 361 is 24.

[0098] In some embodiments, there are a total of 15 or more pits 355, such as about 25 or more pits 355, such as about 50 or more pits 355. The depth of the pits can be about 0.0025 mm to about 0.25 mm, such as about 0.01 mm to about 0.1 mm, such as about 0.02 mm to about 0.06 mm.

[0099] A lifting pin hole 308 is disposed through the substrate receiving surface 310. In some embodiments, three lifting pin holes 308 are disposed through the substrate receiving surface 310. The lifting pin holes 308 are evenly spaced around the center of the substrate receiving surface. The lifting pin holes 308 are disposed between the annular outer groove 363 and the outer receiving surface 361.

[0100] The recess 355 reduces slippage of the substrate (such as substrate 110) disposed on the substrate receiving surface 310 during substrate processing. The recess 355 also helps to improve the temperature distribution across the entire cover assembly 112d.

[0101] Figure 3I This is an enlarged cross-sectional view of the fifth embodiment of the cover assembly 112e. The cover assembly 112e is similar to... Figure 3E and Figure 3F The cover plate assembly 112c is used, but the recess 355 is replaced by a plurality of protrusions 370. Each of the plurality of protrusions 370 is a small platform disposed on the substrate receiving surface 310. Each of the protrusions 370 is cylindrical and has a flat top surface. Alternatively, the protrusions 370 may be dome-shaped. Each of the plurality of protrusions 370 extends vertically upward from the substrate receiving surface 310. The flat top surface of each of the protrusions 370 is configured to support the substrate 110.

[0102] Multiple protrusions 370 are sized to uniformly support the substrate 110. The protrusions 370 separate the substrate 110 from the substrate receiving surface 310 and allow gas to escape from below the substrate 110 between the substrate receiving surface 310 and the substrate 110. The height of the protrusions 370, as described herein, is from about 0.0025 mm to about 0.25 mm, such as from about 0.01 mm to about 0.1 mm, or such as from about 0.02 mm to about 0.06 mm. The height of the protrusions 370 allows the substrate 110 to contact the protrusions 370 while also forming openings for gas to escape between the substrate 110 and the substrate receiving surface 310.

[0103] Figure 3J This is a front isometric top view of the fifth embodiment of the cover plate assembly. The fifth embodiment of the cover plate assembly 112d includes a lifting pin hole 308, a cavity 305, a substrate receiving surface 310, a top surface 314, and a hanging portion 348 (in...). Figure 3E (shown in the middle), outer surface 316 and multiple protrusions 370. Figure 3J The cover assembly 112e shown is similar to Figure 3F The cover plate assembly 112c, but the recess 355 is replaced by the protrusion 370.

[0104] The protrusions 370 may be randomly distributed across the entire substrate receiving surface 310, or the protrusions 370 may be patterned on the substrate receiving surface 310. In some embodiments that can be combined with other embodiments, the protrusions 370 are circularly grouped, such that the protrusions 370 are distributed in concentric circles across the entire substrate receiving surface 310. In yet another embodiment, the protrusions 370 are uniformly spaced across the entire substrate receiving surface 310, such that each of the protrusions 370 is uniformly spaced from each other. In some embodiments, there are more protrusions 370 toward the center of the substrate receiving surface 310 than there are protrusions 370 toward the edges of the substrate receiving surface 310. Conversely, there may be more protrusions 370 toward the edges of the substrate receiving surface than there are protrusions 370 toward the center of the substrate receiving surface 310. Figure 3J As shown, the concentration of the protrusions 370 is greater at the center of the substrate receiving surface 310 than at the outer edge of the substrate receiving surface 310.

[0105] In some embodiments that can be combined with other embodiments, there may be 15 or more protrusions 370, such as about 25 or more protrusions 370, such as about 50 or more protrusions 370.

[0106] Figure 3K This is an enlarged cross-sectional view of the sixth embodiment of the cover plate assembly 112f. The cover plate assembly 112e is similar to... Figure 3C and Figure 3DThe cover assembly 112b, but including as per the above. Figure 3I and Figure 3J The protrusion 370 is described. The cover assembly 112e further includes additional radially disposed grooves 352 and gas vent 374. The gas vent 374 is similar to... Figure 3G and Figure 3H The gas vent 358 is connected to the outer surface 316 of the cover assembly 112f, but not to the heater interface surface 304.

[0107] Gas vent 374 is located at the farthest end of a radially arranged groove 352, furthest from the annular inner groove 346. A single gas vent 374 extends through the bottom of each radially arranged groove 352. Each gas vent 374 is fluidly connected to a first exhaust passage 376. The first exhaust passage 376 is an angled passage extending from the gas vent 374 toward the bottom surface 340 of the cover assembly 112f. The first exhaust passage 376 is angled to extend downward and outward toward the outer surface 316. The first exhaust passage 376 is fluidly connected to a second exhaust passage 378. The second exhaust passage 378 connects to the first exhaust passage 376 at the farthest end of the first exhaust passage 376, furthest from the gas vent 374.

[0108] The second exhaust passage 378 extends horizontally outward from the second exhaust passage 378 toward the outer surface 316 of the cover assembly 112f. The second exhaust passage 378 extends through the cover assembly 112f before widening at the expansion exhaust passage 380. The expansion exhaust passage 380 extends between the outer surface 316 and the second exhaust passage 378. The expansion exhaust passage 380 widens as it extends further from the second exhaust passage 378 toward the outer surface 316. The expansion exhaust passage 380 intersects the outer surface 316 and forms an exhaust opening 372. The exhaust opening 372 allows gas trapped below the substrate 150 to flow out from below the substrate 150 through the radially provided groove 352, the gas discharge hole 374, and out of the exhaust opening 372. The exhaust opening 372 is wider near the outer surface 316 to reduce the back pressure within the first exhaust passage 376 and the second exhaust passage 378.

[0109] Figure 3L This is a front isometric top view of the sixth embodiment of the cover assembly 112f. Multiple vent openings 372 are provided through the outer surface 316 of the cover assembly 112f, resulting in multiple radially arranged grooves 352 and multiple gas vent holes 374.

[0110] At least some additional radially arranged grooves 352 intersect with the lift pin hole 308, such that the radially arranged grooves 352 and the lift pin hole 308 are in fluid communication. Each of the radially arranged grooves 352 intersects with an annular inner groove 346, such that the annular inner groove 346 connects all the radially arranged grooves 352. In the embodiments described herein, there are 3 to 20 radially arranged grooves 352, such as 6 to 18 radially arranged grooves 352, such as 12 to 18 radially arranged grooves 352. The radially arranged grooves 352 intersect with the lift pin hole 308 and allow backside gas located below the cover plate assembly 112f to flow through the radially arranged grooves 352 and flow on the rear side of the substrate 110.

[0111] As shown in this document, one to five protrusions 370, such as two to three protrusions 370, are provided between each group of adjacent radially arranged grooves 352. The number and distribution of the protrusions 370 enable the substrate 110 to be uniformly heated through the contact portion of the substrate receiving surface 310.

[0112] Figure 4 This is an enlarged cross-sectional view of a lift pin hole 308 formed through the cover plate assembly and a pin groove 330 formed through the cover plate assembly. The lift pin hole 308 includes a lift pin 202 disposed therein. The pin groove 330 includes a retaining pin 400 disposed therein.

[0113] Figure 4 represent Figure 3G and Figure 3H The implementation methods described herein. Figure 4 It also indicates elements that can be combined with other embodiments disclosed herein, such as Figures 3A-3F , Figure 3I-3C and Figures 5A-5D Disclosed embodiments. The lift pin hole 308 and the pin groove 330 may be provided in any of the embodiments described herein. In some embodiments, either the lift pin hole 308 or the pin groove 330 is utilized.

[0114] The lift pin hole 308 includes an inclined upper drill hole 420. The inclined upper drill hole 420 is a hole formed on the surface of the substrate receiving surface 310. The inclined upper drill hole 420 is inclined such that it narrows as it moves away from the substrate receiving surface 310. The bottom end of the inclined upper drill hole 420 connects to a lower hole surface 412. The lower hole surface 412 is a vertical surface, forming a cylindrical shape. The lower hole surface 412 extends from the bottom of the inclined upper drill hole 420 to the heater interface surface 304, such that the lower hole surface 412 and the inclined upper drill hole 420 form a channel through the cover plate assemblies 112a-112d. The lift pin hole 308 is disposed above and aligned with the heater lift pin hole 414 of the heated substrate support 116. The upper portion of the inclined upper drilled hole 420 adjacent to the substrate receiving surface 310 has an inner diameter of approximately 3 mm to approximately 6 mm, such as approximately 4 mm to approximately 5 mm, or such as approximately 4.25 mm to approximately 4.75 mm. The lower hole surface 412 includes an inner diameter of approximately 2 mm to approximately 5 mm, such as approximately 3 mm to approximately 4 mm, or such as approximately 3.25 mm to approximately 3.75 mm. The inner diameter of the lower hole surface 412 is the same as the inner diameter of the bottom of the inclined upper drilled hole 420.

[0115] The lifting pin 202 includes an upper head 408 and a cylindrical shaft 422. The upper head 408 includes an inclined head surface 410. The inclined head surface 410 is parallel to an inclined upper drilled hole 420 of the lifting pin hole 308. The cylindrical shaft 422 is attached to the bottom of the upper head 408 and extends downward through the cover plate assemblies 112a-112d and the heated substrate support 116.

[0116] A pin groove 330 is formed on the bottom surface 340 of the cover plate assemblies 112a-112d. The pin groove 330 includes a sidewall 318 and a top wall 424. The sidewalls are disposed inwardly from the bottom surface 340 such that the sidewalls 318 extend upward. The sidewalls 318 are vertical sidewalls and may have a cylindrical shape, such that there is a single sidewall 318. The sidewalls 318 extend inside the cover plate assemblies 112a-112d and terminate at the top wall 424. The top wall 424 is the top surface of the pin groove 330 and may be a horizontal surface.

[0117] The pin groove 330 is shaped to engage a pre-existing component of the heated substrate support 116, such as a retaining pin 400. The retaining pin 400 includes a pin head 404 and a pin body 406. The pin head 404 is the portion of the retaining pin 400 disposed above the outer top surface 322 of the heated substrate support 116. The pin head 404 may have a cylindrical shape, but other shapes are also contemplated. The pin body 406 is the portion of the retaining pin 400 that extends into the heated substrate support 116 and secures components of the heated substrate support 116 to each other. The pin body 406 may have a cylindrical shape, but other suitable shapes are also possible. The pin body 406 may have a smaller outer diameter than the pin head 404. In some embodiments, the inner diameter of the pin groove 330 is from about 3 mm to about 7 mm, such as from about 4 mm to about 6 mm, or from about 4.5 mm to about 5.5 mm.

[0118] In embodiments where the retaining pin 400 has a non-cylindrical pin head 404, the sidewall 318 of the pin groove 330 may also have a non-cylindrical shape, such that if the retaining pin 400 is shaped into an octagonal prism, the sidewall 318 can also be shaped into an octagonal prism. If the retaining pin 400 is shaped into a hexagonal prism, the sidewall 318 can also be shaped into a hexagonal prism. If the retaining pin 400 is shaped into a rectangular prism, the sidewall 318 can also be shaped into a rectangular prism.

[0119] Multiple lift pin holes 308 and pin slots 330 may be present within the cover plate assemblies 112a-112d. In some embodiments, the number of lift pin holes 308 is equal to the number of pin slots 330. The number of lift pin holes 308 may be three. In some embodiments, other numbers of lift pin holes may be used. In some embodiments, the number of pin slots 330 formed in the cover plate assemblies 112a-112d is 2-10, such as three to six pin slots 330. In some embodiments, three pin slots 330 are present. The lift pin holes 308 and pin slots 330 may be radially aligned along the cover plate assemblies 112a-112d. Each pin slot 330 is uniformly distributed around the center of the heater interface surface.

[0120] Figure 5A This is a front isometric top view of the seventh embodiment of the cover plate assembly 112g. The cover plate assembly 112g of the seventh embodiment includes a lifting pin hole 308, a substrate receiving surface 310, a top surface 314, and a hanging portion 348 (e.g., Figure 3C , Figure 3E , Figure 3G and Figure 5B(As shown), outer surface 316, multiple recesses 355, radially arranged grooves 352, gas discharge hole 358, gas supply hole 360, annular inner groove 346, annular middle groove 362 and annular outer groove 363. Lifting pin hole 308, overhang portion 348 (in...) Figure 3C , Figure 3E , Figure 3G and Figure 5B (Displayed in the middle), outer surface 316, multiple pits 355, radially arranged grooves 352, gas discharge hole 358, gas supply hole 360, annular inner groove 346, annular middle groove 362 and annular outer groove 363 and Figure 3G and Figure 3H The same as those described in [the text].

[0121] exist Figure 5A In the seventh embodiment of the cover plate assembly 112g shown, the substrate receiving surface 310 and the top surface 314 are coplanar. The coplanarity of the substrate receiving surface 310 and the top surface 314 eliminates... Figure 3G and Figure 3H The cover assembly 112g has an inclined top surface 312 and an outer receiving surface 361. The cover assembly 112g further includes a plurality of protrusions 502 on the top surface 314. A cavity 305 of the cover assembly 112g is defined in the region radially inward of the protrusions 502, as the protrusions facilitate substrate fixation. The cavity 305 includes all substrate receiving surfaces 310 and the inner portion of the top surface 314.

[0122] The substrate receiving surface 310 and the top surface 314 are coplanar in the cover assembly 112g. In the seventh embodiment, the radially disposed groove 352 extends completely to the edge of the substrate receiving surface 310. The inner edge of the top surface 314 is connected to the outer edge of the substrate receiving surface 310 of the cover assembly 112g, such that the top surface 314 extends outward from the substrate receiving surface 310. The top surface 314 and the substrate receiving surface 310 have similar dimensions, shapes, and features as disclosed in the previous embodiments.

[0123] Protrusions 502 are provided on the top surface 314 of the cover assembly 112g. Each protrusion 502 is positioned at an equal distance from the center of the cover assembly 112g. Each protrusion 502 is spaced apart from each other by an equal angular distance. Three to ten protrusions 502 may be provided on the top surface 314. In some embodiments, there are three to six protrusions 502, such as three to five protrusions. Figure 5A In the illustrated embodiment, three protrusions 502 are provided on the top surface 314 of the cover plate assembly 112g. The protrusions 502 are radially aligned with the lifting pin hole 308, such that the protrusions 502 can also align with the pin groove 330. Figure 5B )alignment.

[0124] The protrusion is positioned at a distance of approximately 150 mm to approximately 160 mm from the center of the cover assembly 112g, such as approximately 151 mm to approximately 155 mm, or approximately 152 mm to approximately 153 mm from the center of the cover assembly 112g.

[0125] Figure 5B This is a cross-sectional view of the seventh embodiment of the cover plate assembly 112g. The cross-sectional view of the cover plate assembly 112g shows the positions of the substrate receiving surface 310, the protrusion 502, the gas supply hole 360, the lifting pin hole 308, the heater interface surface 304, the protrusion 502, the top surface 314, the overhang portion 348, and the pin groove 330. The substrate receiving surface 310, the gas supply hole 360, the lifting pin hole 308, the heater interface surface 304, the protrusion 502, the top surface 314, the overhang portion 348, and the pin groove 330 are similar to elements with similar designations disclosed in previous embodiments. The protrusion 502 is provided radially outward from the heater interface surface 304.

[0126] The protrusion includes an outer protruding surface 506, a top protruding surface 507, and an inner protruding surface 508. The outer protruding surface 506 is an inclined surface such that the slope of the outer protruding surface 506 is positive as the radius of the cover assembly 112g decreases. The outer protruding surface 506 is disposed between the top surface 314 and the top protruding surface 507 of the cover assembly 112g, such that the outer protruding surface 506 connects the top surface 314 to the top protruding surface 507.

[0127] The top protruding surface 507 is a surface disposed between the outer protruding surface 506 and the inner protruding surface 508. The top protruding surface 507 is shown as a horizontal surface, such that the top protruding surface 507 is parallel to the substrate receiving surface 310 and the top surface 314. The top protruding surface 507 connects the outer protruding surface 506 and the inner protruding surface 508.

[0128] An inner protruding surface 508 is disposed between the top protruding surface 507 and the top surface 314 of the cover assembly 112g. The inner protruding surface 508 is an inclined surface such that the slope of the inner protruding surface 508 becomes negative as the radius of the cover assembly 112g decreases. The slope of the inner protruding surface 508 is less than the slope of the outer protruding surface 506. In some embodiments, the inner protruding surface 508 is inclined at an angle of about 30 degrees to about 60 degrees, such as about 35 degrees to about 55 degrees, such as about 40 degrees to about 50 degrees, such as about 45 degrees. The inner protruding surface 508 facilitates the placement of the substrate by acting as a guide.

[0129] In some embodiments, either the inner protruding surface 508 or the outer protruding surface 506 may be a vertical surface. Alternatively, the top protruding surface 507 may be an inclined surface, such that the top protruding surface 507 has either a positive or negative slope.

[0130] Figure 5C This is an enlarged plan view of the protrusion 502 formed on the cover assembly 112g in a seventh embodiment. The protrusion 502 includes a length 510 and a width 504. The length 510 of the protrusion 502 is greater than the width 504 of the protrusion 502. The length 510 is the distance from the radially inward portion of the protrusion 502 to the radially outward portion of the protrusion 502, such that the length 510 is from the point where the inner protrusion surface 508 intersects with the top surface 314 of the cover assembly 112g to the point where the outer protrusion surface 506 intersects with the top surface 314 of the cover assembly 112g. In some embodiments, the length 510 of the protrusion 502 is about 6 mm to about 10 mm, such as about 7 mm to about 9 mm, such as about 7.5 mm to about 8.5 mm. The width 504 of the protrusion 502 is the circumferential length of the protrusion 502. In some embodiments, the width 504 of the protrusion 502 is about 2 mm to about 4 mm, such as about 2.5 mm to about 3.5 mm, such as about 2.75 mm to about 3.25 mm.

[0131] Figure 5D This is an enlarged cross-sectional view of the protrusion 502 formed on the cover assembly 112g in a seventh embodiment. The protrusion 502 further includes a height 512. The height 512 is the distance from the top surface 314 of the cover assembly 112g to the point on the top protruding surface 507 furthest from the top surface 314 of the cover assembly 112g. In some embodiments, the height 512 of the protrusion 502 is from about 0.5 mm to about 2.5 mm, such as from about 1 mm to about 2 mm, such as from about 1.25 mm to about 1.75 mm.

[0132] The cover plate assembly 112g enables the substrate to be deposited within the cavity 305 with minimal outer surface area. The protrusion 502 serves to center the substrate within the cavity 305, but reduces interaction with the edges of the substrate. The reduced interaction between the protrusion 502 and the inclined top surface 312 of the cover plate assemblies 112a-112d in previous embodiments reduces heat loss and wear on the substrate edges.

[0133] The embodiments of the cover plate assemblies 112a-112e disclosed herein improve the thermal uniformity distributed to the substrate. Previously, substrates (such as substrate 110) were placed directly on a heated substrate support 116. Placing the substrate on the heated substrate support 116 during substrate processing results in low temperature uniformity across the entire heated substrate support 116 and frequent maintenance and repair of the heated substrate support 116 due to particle deposition. The cover plate assemblies 112a-112e improve temperature uniformity by dispersing heat loads from localized hot and cold spots. The cover plate assemblies 112a-112e are easy to recycle and replace, and reduce substrate slippage during processing. Features such as recesses 355, radially arranged grooves 352, gas vents 358, gas supply holes 360, annular inner grooves 346, annular intermediate grooves 362, and annular outer grooves 363 further improve temperature uniformity and reduce substrate slippage over the cover plate assemblies 112a-112e.

[0134] Although the foregoing relates to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is defined by the appended claims.

Claims

1. A cover plate for substrate processing, comprising: The annular body further comprises: Planar substrate receiving surface; The heater interface surface is parallel to the receiving surface of the planar substrate; Multiple lifting pin holes are formed by passing through the annular body; An outer top surface, the outer top surface being disposed radially outside the receiving surface of the planar substrate; The outer surface extends vertically from the outer top surface; A bottom surface, the bottom surface being disposed radially outward from the heater interface surface; An internal overhanging surface that extends vertically downward from the outer surface of the bottom surface; A bottom overhanging surface disposed between the outer surface and the inner overhanging surface; and an annular stepped region between the heater interface surface and the bottom surface, the annular stepped region further comprising: A first annular step is provided radially outward from the outer surface of the heater interface surface; A second annular staircase, the second annular staircase being arranged radially outward from the first annular staircase; and An intermediate surface, which connects the first annular step and the second annular step.

2. The cover plate according to claim 1, wherein the cover plate comprises a ceramic material.

3. The cover plate according to claim 2, further comprising a plurality of pin slots extending from the bottom surface into the cover plate.

4. The cover plate according to claim 3, wherein the diameter of the pin groove is 3 mm to 7 mm.

5. The cover plate according to claim 3, wherein the plurality of pin slots are radially aligned with the plurality of lifting pin holes relative to the center of the cover plate.

6. The cover plate according to claim 1, wherein the outer top surface is perpendicularly offset from the receiving surface of the planar substrate by a distance of 0 mm to 6 mm.

7. The cover plate according to claim 1, further comprising a plurality of radially disposed grooves within the receiving surface of the planar substrate.

8. The cover plate according to claim 7, further comprising at least one annular groove, the at least one annular groove being disposed around the central axis of the cover plate and connected to the plurality of radially disposed grooves.

9. The cover plate according to claim 1, further comprising a plurality of protrusions disposed on the receiving surface of the substrate.

10. The cover plate according to claim 9, wherein the protrusion has a height of 0.0025 mm to 0.25 mm.

11. The cover plate according to claim 1, wherein the outer top surface is disposed above the substrate receiving surface, and the inclined surface connects the substrate receiving surface and the outer top surface.

12. A cover plate for substrate processing, the cover plate being disposed on a heated substrate support, the cover plate comprising: The annular body further comprises: Substrate receiving surface; The heater interface surface is parallel to the substrate receiving surface; Multiple lifting pin holes are formed by passing through the annular body; A top surface, the top surface being disposed radially outside the receiving surface of the substrate; A bottom surface, the bottom surface being disposed radially outward from the heater interface surface; The first stepped surface is a vertical surface extending upward from the radially inner side of the bottom surface; The second stepped surface is a horizontal surface disposed radially inside the first stepped surface and connected to the first stepped surface; A third stepped surface is connected to the second stepped surface, wherein the heater interface surface extends radially inward from the third stepped surface, and the first stepped surface, the second stepped surface, and the third stepped surface form a cavity between the cover plate and the heated substrate support. and Multiple pin slots extend from the bottom surface into the cover plate.

13. The cover plate according to claim 12, further comprising: An outer surface that extends perpendicularly from the top surface; An internal overhanging surface, the internal overhanging surface extending vertically downward from the outer surface of the bottom surface; and A bottom overhanging surface is disposed between the outer surface and the inner overhanging surface.

14. The cover plate according to claim 12, further comprising a plurality of radially disposed grooves within the receiving surface of the substrate.

15. The cover plate according to claim 14, further comprising a plurality of gas vent holes formed through the cover plate at the outermost radial position of each of the plurality of radially arranged grooves.

16. The cover plate according to claim 15, further comprising a plurality of exhaust channels extending radially outward from the plurality of gas exhaust holes.

17. The cover plate of claim 12, wherein the substrate receiving surface is offset vertically from the top surface by 0.0025 mm to 0.25 mm.

18. An assembly for supporting a substrate, comprising: Heated substrate support; Multiple booster sales; Multiple retaining pins are disposed along the outer surface of the heated substrate support; and An annular cover plate, the annular cover plate being disposed on top of and covering the upper surface of the heated substrate support, the annular cover plate further comprising: Substrate receiving surface; The heater interface surface is parallel to the substrate receiving surface; Multiple lifting pin holes are formed by passing through the annular cover plate; A top surface, the top surface being disposed radially outside the receiving surface of the substrate; A bottom surface, the bottom surface being disposed radially outward from the heater interface surface; The first stepped surface is a vertical surface extending upward from the radially inner side of the bottom surface; The second stepped surface is a horizontal surface disposed radially inside the first stepped surface and connected to the first stepped surface; A third stepped surface is connected to the second stepped surface, wherein the heater interface surface extends radially inward from the third stepped surface, and the first stepped surface, the second stepped surface, and the third stepped surface form a cavity between the cover plate and the heated substrate support. and Multiple pin slots extend from the bottom surface into the annular cover plate.

19. The component of claim 18, wherein the annular cover further comprises: An outer surface that extends perpendicularly from the top surface; An internal overhanging surface, the internal overhanging surface extending vertically downward from the outer surface of the bottom surface; and A bottom overhanging surface is disposed between the outer surface and the inner overhanging surface.

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