Display screen

Abstract

An embodiment of the present application discloses a display screen, which includes a backlight module, a liquid crystal display panel, a first conductive layer, a first conductive pad, and a first circuit board. The liquid crystal display panel is disposed on the backlight module. The first conductive layer is formed on the side surfaces of the liquid crystal display panel and the backlight module and extends to the surface of the backlight module facing away from the liquid crystal display panel. The first conductive layer is electrically connected to the liquid crystal display panel. The first conductive pad is disposed on the surface of the backlight module facing away from the liquid crystal display panel and is electrically connected to the first conductive layer. The first circuit board is bonded to the first conductive pad. The present application aims to solve the technical problem that the display effect is affected due to an excessively large seam when splicing display screens in the related art.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display screen. Background Art

[0002] Conventional display screens all need to input the signals required by the panel into the panel through the module process of COF (Chip On Film) / FPC (Flexible Printed Circuit) binding. Due to the limitations of the binding process, in the panel design, it is usually necessary to first converge the in-plane signal lines through the Fanout area, concentrate them in a binding area, and then bind the COF / FPC to this area to form an electrical connection between the PCB and the glass substrate. Fanout and COF / FPC mainly play the role of electrical connection, and are usually collectively referred to as the boarder area.

[0003] In the process of researching and practicing the prior art, the inventors of the present application found that the boarder area is usually located at the border outside the display area of the panel, and is then electrically connected to the PCB located on the back after being bent by the COF. Therefore, when conventional display screens are spliced, the thickness of the display splicing seam includes the boarder length, the COF bending thickness, the COF thickness, and the mechanism tolerance. And due to the good resilience of the COF / FPC substrate PI, it is not easy to bend, plus the PI thickness, which causes the splicing seam of the display screen to increase greatly when splicing, thereby affecting the splicing display effect. Summary of the Invention

[0004] An embodiment of the present application provides a display screen, aiming to solve the technical problem that the display effect is affected due to too large a splicing seam when splicing display screens in the related art.

[0005] An embodiment of the present application provides a display screen, including:

[0006] A backlight module;

[0007] A liquid crystal display panel, which is disposed on the backlight module;

[0008] A first conductive layer, which is formed on the side surfaces of the liquid crystal display panel and the backlight module, and extends to the surface of the backlight module facing away from the liquid crystal display panel, and the first conductive layer is electrically connected to the liquid crystal display panel;

[0009] A first conductive pad, which is disposed on the surface of the backlight module facing away from the liquid crystal display panel and is electrically connected to the first conductive layer; and

[0010] A first circuit board, which is bound to the first conductive pad.

[0011] Optionally, in some embodiments of the present application, the first conductive layer includes a fan-out segment and a lead-out segment. The fan-out segment is located on the side of the liquid crystal display panel and extends toward the side of the backlight module. The fan-out segment is electrically connected to the liquid crystal display panel. The lead-out segment is connected to the fan-out segment and extends to the surface of the backlight module facing away from the liquid crystal display panel. The lead-out segment is electrically connected to the first conductive pad.

[0012] Optionally, in some embodiments of the present application, the first conductive layer includes an introduction segment, a fan-out segment, and a lead-out segment that are connected in sequence. The introduction segment is located on the side of the liquid crystal display panel and the side of the backlight module and is electrically connected to the liquid crystal display panel;

[0013] Both the fan-out segment and the lead-out segment are located on the surface of the backlight module facing away from the liquid crystal display panel. The lead-out segment is electrically connected to the first conductive pad.

[0014] Optionally, in some embodiments of the present application, the first conductive layer includes an introduction segment, a fan-out segment, and a lead-out segment that are connected in sequence. The introduction segment is electrically connected to the liquid crystal display panel. The introduction segment and the fan-out segment are located on the side of the liquid crystal display panel and extend toward the side of the backlight module;

[0015] The lead-out segment is located on the surface of the backlight module facing away from the liquid crystal display panel. The lead-out segment is electrically connected to the first conductive pad.

[0016] Optionally, in some embodiments of the present application, the distance between the two ends on the side of the fan-out segment close to the lead-out segment is less than the distance between the two ends on the side of the fan-out segment far from the lead-out segment;

[0017] The fan-out segment includes a plurality of spaced conductive lines. The plurality of conductive lines extend from the end far from the lead-out segment toward the direction close to the lead-out segment and extend from the center in the width direction of the fan-out segment toward both sides. The inclination angles of the plurality of conductive lines gradually increase.

[0018] Optionally, in some embodiments of the present application, the display screen further includes a second conductive layer, a second conductive pad, and a second circuit board. The second conductive layer is formed on the side of the liquid crystal display panel and the side of the backlight module and extends to the surface of the backlight module facing away from the liquid crystal display panel and is spaced from the first conductive layer. The second conductive layer is electrically connected to the liquid crystal display panel;

[0019] The second conductive pad is disposed on the surface of the backlight module facing away from the liquid crystal display panel and is connected to the second conductive layer. The second conductive pad is spaced from the first conductive pad. The second circuit board is bonded to the second conductive pad.

[0020] Optionally, in some embodiments of the present application, the display screen includes a first frame glue layer, which is arranged and encapsulated between the liquid crystal display panel and the backlight module, and the edges of the liquid crystal display panel, the first frame glue layer and the backlight module are flush.

[0021] Optionally, in some embodiments of the present application, the liquid crystal display panel includes:

[0022] An array substrate, wherein the array substrate is disposed on the backlight module;

[0023] A color filter substrate, which is arranged opposite to the array substrate and is located on a side of the array substrate away from the backlight module;

[0024] A liquid crystal layer, wherein the liquid crystal layer is disposed between the array substrate and the color filter substrate;

[0025] A second sealant layer, the second sealant layer is disposed and encapsulated between the array substrate and the color filter substrate; and

[0026] An inner conductive pad is disposed between the array substrate and the second sealant layer and is electrically connected to the array substrate and the first conductive layer respectively.

[0027] Optionally, in some embodiments of the present application, the display screen further includes a third conductive layer, a third conductive pad and a third circuit board, the third conductive layer is formed on the side of the backlight module, extends to the surface of the backlight module away from the liquid crystal display panel, and is spaced apart from the first conductive layer, and the third conductive layer is electrically connected to the backlight module;

[0028] The third conductive pad is disposed on a surface of the backlight module away from the liquid crystal display panel and connected to the third conductive layer. The third conductive pad is spaced apart from the first conductive pad, and the third circuit board is bound to the third conductive pad.

[0029] Optionally, in some embodiments of the present application, the display screen further includes a protective layer, which forms and covers a surface of the first conductive layer that is away from a side of the backlight module and a side of the liquid crystal display panel.

[0030] In the display screen according to the embodiment of the present application, a first conductive layer is formed on the side surface of the liquid crystal display panel and the side surface of the backlight module, and extends to the surface of the backlight module facing away from the liquid crystal display panel, so as to facilitate setting a first conductive pad on the surface of the backlight module facing away from the liquid crystal display panel and bonding a first circuit board. In this way, the setting of the first conductive layer can reduce the occupation of the border area of the liquid crystal display panel, so that the size of the border area of the liquid crystal display panel can be reduced, and then the seam thickness can be reduced. At the same time, setting the first conductive pad on the surface of the backlight module facing away from the liquid crystal display panel effectively avoids the technical problem of excessive thickness caused by rebound after bending. Therefore, when the display screens of the present application are spliced, the thickness of the display splicing seam is only the thickness of the conductive layer, effectively reducing the splicing gap to improve the splicing display effect. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained according to these drawings.

[0032] Figure 1 It is a schematic structural diagram of a splicing display device provided by an embodiment of the present application;

[0033] Figure 2 It is a bottom view of the structure of a splicing display device provided by an embodiment of the present application;

[0034] Figure 3 It is a side view of the structure of a splicing display device provided by an embodiment of the present application;

[0035] Figure 4 It is a schematic structural diagram of the backlight module and the liquid crystal display panel of a splicing display device provided by an embodiment of the present application;

[0036] Figure 5 It is a schematic structural diagram of the bonded backlight module and liquid crystal display panel of a splicing display device provided by an embodiment of the present application;

[0037] Figure 6 It is a schematic structural diagram of the edge-ground backlight module and liquid crystal display panel of a splicing display device provided by an embodiment of the present application;

[0038] Figure 7 It is a schematic structural diagram of a splicing display device provided by another embodiment of the present application;

[0039] Figure 8 It is a side view of the structure of a splicing display device provided by another embodiment of the present application;

[0040] Figure 9It is a structural bottom view of a splicing display device provided by another embodiment of the present application;

[0041] Figure 10 It is a structural side view of a splicing display device provided by another embodiment of the present application. Detailed implementation manners

[0042] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the orientation terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings; and "inner" and "outer" refer to the outline of the device.

[0043] An embodiment of the present application provides a display screen. The following will be described in detail respectively. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0044] Referring to Figure 1 , an embodiment of the present application provides a display screen 100. The display screen 100 includes a backlight module 10, a liquid crystal display panel 20, a first conductive layer 30, a first conductive pad 40, and a first circuit board 50. The liquid crystal display panel 20 is disposed on the backlight module 10. The first conductive layer 30 is formed on the side surfaces of the liquid crystal display panel 20 and the backlight module 10, and extends to the surface of the backlight module 10 facing away from the liquid crystal display panel 20. The first conductive layer 30 is electrically connected to the liquid crystal display panel 20. The first conductive pad 40 is disposed on the surface of the backlight module 10 facing away from the liquid crystal display panel 20 and is electrically connected to the first conductive layer 30; the first circuit board 50 is bonded to the first conductive pad 40.

[0045] The display screen 100 according to the embodiment of the present application forms a first conductive layer 30 on the side surfaces of the liquid crystal display panel 20 and the backlight module 10, and extends to the surface of the backlight module 10 facing away from the liquid crystal display panel 20, so as to facilitate setting a first conductive pad 40 on the surface of the backlight module 10 facing away from the liquid crystal display panel 20 and bonding a first circuit board 50. In this way, the setting of the first conductive layer 30 can reduce the occupation of the border area of the liquid crystal display panel 20, so that the size of the border area of the liquid crystal display panel 20 can be reduced, and further the seam thickness can be reduced. At the same time, setting the first conductive pad 40 on the surface of the backlight module 10 facing away from the liquid crystal display panel 20 effectively avoids the technical problem of excessive thickness caused by the rebound after bending. Therefore, when the display screens 100 of the present application are spliced, the thickness of the display splicing seam is only the thickness of the conductive layer, effectively reducing the splicing gap to improve the splicing display effect.

[0046] Among them, the first conductive layer 30 and the first conductive pad 40 can be manufactured by means of PVD coating and engraving, so that the manufacturing method has a low cost. Of course, the first conductive layer 30 and the first conductive pad 40 located on the surface of the backlight module 10 facing away from the liquid crystal display panel 20 can also be completed by the Array process. And the first conductive layer 30 can be a copper layer or a silver layer, etc. It should be noted that the first conductive pad 40 can also be a solder pad, etc. And the first circuit board 50 can be a COF, an FPC, a PCB, etc.

[0047] Optionally, referring to Figure 1 , the display screen 100 further includes a protective layer 70, and the protective layer 70 is formed to cover the surfaces of the side of the first conductive layer 30 facing away from the backlight module 10 and the side of the liquid crystal display panel 20. Among them, the first conductive layer 30 is protected by forming the protective layer 70, so as to effectively ensure the service life of the first conductive layer 30. The protective layer 70 can be formed by a protective glue layer. In this way, the thickness formed by the superposition of the first conductive layer 30 and the protective layer 70 is 2um to 10um to avoid affecting the seam effect. It can be understood that when the second conductive layer 80a, the third conductive layer 90a and the fourth conductive layer 90d are provided, the corresponding protective layer 70 can also cover and protect them, and the specific selection can be made by those skilled in the art.

[0048] Referring to Figure 1, Optionally, the display screen 100 includes a first sealant layer 60, which is disposed and encapsulated between the liquid crystal display panel 20 and the backlight module 10, and the edges of the liquid crystal display panel 20, the first sealant layer 60, and the backlight module 10 are flush. It can be understood that the liquid crystal display panel 20 and the backlight module 10 are adhesively fixed through the first sealant layer 60. Since the first conductive layer 30 is formed on the side surfaces of the liquid crystal display panel 20 and the backlight module 10, in order to ensure the flatness after the formation of the first conductive layer 30, the edges of the liquid crystal display panel 20, the first sealant layer 60, and the backlight module 10 are flush. It should be noted that the first sealant layer 60 is doped with a hardening resin to increase the hardness of the first sealant, thereby improving the stability of the support of the first sealant layer 60. At the same time, during the preparation process, the liquid crystal display panel 20 and the backlight module need to be edge-ground to expose the corresponding conductive pads on the Source and Gate sides, and thus the first sealant layer 60 with high hardness is also convenient for edge-grinding in the later stage.

[0049] Further, the liquid crystal display panel 20 includes an array substrate 21, a color filter substrate 22, a liquid crystal layer 23, a second sealant layer 24, and an inner conductive pad 25. The array substrate 21 is disposed on the backlight module 10. The color filter substrate 22 is disposed opposite to the array substrate 21, and the color filter substrate 22 is located on a side of the array substrate 21 away from the backlight module 10. The liquid crystal layer 23 is disposed between the array substrate 21 and the color filter substrate 22. The second sealant layer 24 is disposed and encapsulated between the array substrate 21 and the color filter substrate 22. The inner conductive pad 25 is disposed between the array substrate 21 and the second sealant layer 24 and is electrically connected to the array substrate 21 and the first conductive layer 30 respectively. Wherein, the array substrate 21 and the color filter substrate 22 are adhesively fixed by the second sealant layer 24. The inner conductive pad 25 is disposed on the array substrate 21 and between the array substrate 21 and the second sealant layer 24 and is connected to the TFT circuit 28 of the array substrate 21. Thus, when forming the first conductive layer 30, the inner conductive pad 25 is exposed by edge grinding, so as to realize electrical connection between the first conductive layer 30 and the inner conductive pad 25. It can be understood that a plurality of inner conductive pads 25 are provided to respectively connect a plurality of driving circuits. In addition, the liquid crystal display panel 20 further includes an upper polarizer 26 and a lower polarizer 27. The upper polarizer 26 is disposed on a surface of the color filter substrate 22 away from the array substrate 21, and the lower polarizer 27 is disposed on a surface of the array substrate 21 away from the color filter substrate 22. The polarization functions of the upper polarizer 26 and the lower polarizer 27 are perpendicular to each other, and their functions are like fences, blocking light wave components according to requirements. For example, light wave components perpendicular to the polarizer fences are blocked, and only light wave components parallel to the fences are allowed to pass through. The backlight module 10 includes a driving substrate 11 and a plurality of LED light-emitting devices 12 disposed on the driving substrate 11. The driving substrate 11 is disposed opposite to the array substrate 21, and the plurality of LED light-emitting devices 12 are located on a surface of the driving substrate 11 close to the array substrate 21. In addition, the backlight module 10 further includes a quantum dot film 13 and a diffusion film. The quantum dot film 13 and the diffusion film layer 14 are stacked and cover the plurality of LED light-emitting devices 12, so as to further improve the light-emitting effect of the backlight module 10.

[0050] Optionally, referring to Figure 1 and Figure 2, the display screen 100 further includes a second conductive layer 80a, a second conductive pad, and a second circuit board. The second conductive layer 80a is formed on the side surfaces of the liquid crystal display panel 20 and the backlight module 10, and extends to the surface of the backlight module 10 facing away from the liquid crystal display panel 20, and is disposed at an interval from the first conductive layer 30. The second conductive layer 80a is electrically connected to the liquid crystal display panel 20. The second conductive pad is disposed on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, and is connected to the second conductive layer 80a, and the second conductive pad is disposed at an interval from the first conductive pad 40. The second circuit board is bonded to the second conductive pad. Wherein, one of the first conductive layer 30 and the second conductive layer 80a can be used to connect the gate driving circuit of the liquid crystal display panel 20, and the other of the first conductive layer 30 and the second conductive layer 80a can be used to connect the source driving circuit of the liquid crystal display panel 20, so as to more precisely control the gate driving circuit and the source driving circuit of the liquid crystal display panel 20. It can be understood that the second conductive layer 80a and the first conductive layer 30 can be located on the same side surface of the liquid crystal display panel 20 and the backlight module 10, so that the first conductive layer 30 and the second conductive layer 80a can be prepared simultaneously. Of course, the second conductive layer 80a and the first conductive layer 30 can be located on different side surfaces of the liquid crystal display panel 20 and the backlight module 10 to effectively avoid the mutual influence between the first conductive layer 30 and the second conductive layer 80a. The second conductive layer 80a can have the same material and the same preparation method as the first conductive layer 30, and the second conductive pad can be the same as the first conductive pad 40, and the second conductive pad and the first conductive pad 40 are simultaneously disposed on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, so as to facilitate the subsequent bonding of the first circuit board 50 and the second circuit board.

[0051] Optionally, referring to Figure 1 and Figure 2, the display screen 100 further includes a third conductive layer 90a, a third conductive pad 90b, and a third circuit board 90c. The third conductive layer 90a is formed on the side surface of the backlight module 10 and extends to the surface of the backlight module 10 facing away from the liquid crystal display panel 20, and is disposed at an interval from the first conductive layer 30. The third conductive layer 90a is electrically connected to the backlight module 10. The third conductive pad 90b is disposed on the surface of the backlight module 10 facing away from the liquid crystal display panel 20 and is connected to the third conductive layer 90a, and the third conductive pad 90b is disposed at an interval from the first conductive pad 40. The third circuit board 90c is bonded to the third conductive pad 90b. It can be understood that a driving circuit is also provided in the backlight module 10, so a circuit board also needs to be provided for control. Thus, by forming the third conductive layer 90a and the third conductive pad 90b, the third circuit board 90c can be bonded and located on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, so as to be disposed at an interval from the first circuit board 50. It should be noted that the third conductive layer 90a and the first conductive layer 30 can be located on the same side surface of the liquid crystal display panel 20 and the backlight module 10, so that the first conductive layer 30 and the third conductive layer 90a can be prepared simultaneously. Of course, the third conductive layer 90a and the first conductive layer 30 can be located on different side surfaces of the liquid crystal display panel 20 and the backlight module 10 to effectively avoid mutual influence between the first conductive layer 30 and the third conductive layer 90a. The third conductive layer 90a can have the same material and the same preparation method as the first conductive layer 30, and the third conductive pad 90b can be the same as the first conductive pad 40. The third conductive pad 90b and the first conductive pad 40 are simultaneously disposed on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, so as to facilitate the subsequent bonding of the first circuit board 50 and the third circuit board 90c. In addition, a fourth conductive layer 90d can be formed on the side surface of the backlight module 10 and extend to the surface of the backlight module 10 facing away from the liquid crystal display panel 20. At the same time, a fourth conductive pad connected to the fourth conductive layer 90d is provided on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, and a fourth circuit board is bonded to the fourth conductive pad. Among them, one of the third conductive layer 90a and the fourth conductive layer 90d can be used to connect the gate driving circuit of the backlight module 10, and the other of the third conductive layer 90a and the fourth conductive layer 90d can be used to connect the source driving circuit of the backlight module 10, so as to more precisely control the gate driving circuit and the source driving circuit of the backlight module 10.

[0052] Referring to Figure 1 and Figure 3, Optionally, the first conductive layer 30 includes a fan-out segment 31 and a lead-out segment 32. The fan-out segment 31 is located on the side of the liquid crystal display panel 20 and extends toward the side of the backlight module 10. The fan-out segment 31 is electrically connected to the liquid crystal display panel 20. The lead-out segment 32 is connected to the fan-out segment 31 and extends to the surface of the backlight module 10 facing away from the liquid crystal display panel 20. The lead-out segment 32 is electrically connected to the first conductive pad 40. It can be understood that the conductive wires 311 of the fan-out segment 31 are more concentrated after being bundled. After being bundled by the fan-out segment 31, the conductive wires 311 of the lead-out segment 32 occupy less space. Furthermore, by arranging the fan-out segment 31 on the side of the liquid crystal display panel 20 and extending it toward the side of the backlight module 10, the area of the first conductive layer 30 can be effectively reduced, and the seam thickness can be further reduced. It should be noted that the second conductive layer 80a similarly includes a second fan-out segment 31, which can also be arranged on the side of the liquid crystal display panel 20 and / or the side of the backlight module 10, or can also be arranged on the surface of the backlight module 10 facing away from the liquid crystal display panel 20. Similarly, the third conductive layer 90a includes a third fan-out segment 31, which can also be arranged on the side of the backlight module 10 or on the surface of the backlight module 10 facing away from the liquid crystal display panel 20.

[0053] Furthermore, the distance between the two ends on the side of the fan-out segment 31 close to the lead-out segment 32 is less than the distance between the two ends on the side of the fan-out segment 31 far from the lead-out segment 32. The fan-out segment 31 includes a plurality of conductive wires 311 arranged at intervals. The plurality of conductive wires 311 extend from one end far from the lead-out segment 32 toward the direction close to the lead-out segment 32 and extend from the center in the width direction of the fan-out segment 31 toward both sides. The inclination angles of the plurality of conductive wires 311 gradually increase. In this way, the plurality of conductive wires 311 are symmetrically arranged with respect to the center in the width direction of the fan-out segment 31, so as to be regularly arranged, which is convenient for connection and later detection and repair. In addition, when the fan-out segment 31 passes through and covers the first frame adhesive layer 60, a plurality of grooves are respectively arranged at the positions of the first frame adhesive corresponding to the plurality of conductive wires 311. The depth of the groove at the center in the width direction is greater than the depth of the grooves on both sides in the width direction. Among them, since the length of the conductive wire 311 at the center in the width direction of the fan-out segment 31 is less than the length of the conductive wires 311 on both sides in the width direction of the fan-out segment 31, this results in different impedances of the plurality of conductive wires 311 of the fan-out segment 31, leading to differences in control. Furthermore, by arranging grooves corresponding to the plurality of conductive wires 311 at the first frame adhesive layer 60, and the depth of the groove at the center in the width direction is greater than the depth of the grooves on both sides in the width direction, the length of the conductive wire 311 at the center of the fan-out segment 31 can be extended to ensure that the impedances of the plurality of conductive wires 311 of the fan-out segment 31 are the same.

[0054] Refer to Figures 4 to 6, the specific manufacturing process of the display screen 100 is as follows: complete the production of the liquid crystal display panel 20; complete the production of the backlight module; precisely bond the liquid crystal display panel 20 and the backlight module together with frame adhesive; grind the edges of the liquid crystal display panel 20 and the backlight module to expose the inner conductive pads 25 of the source drive circuit and the gate drive circuit of the liquid crystal display panel 20 and the backlight module; form the first conductive layer 30 and the first conductive pad 40 by means of PVD + engraving or silver paste transfer to lead the circuits of the source drive circuit and the gate drive circuit of the liquid crystal display panel 20 and the backlight module to the surface of the backlight module 10 facing away from the liquid crystal panel; bind the circuit board to the corresponding conductive pads to complete the connection between the device and the external TFT circuit 28.

[0055] Referring to Figures 7 to 9 , optionally, in another embodiment of the present application, the difference between this embodiment and the above embodiment is that: the first conductive layer 30 includes an introduction segment 33, a fan-out segment 31, and a lead-out segment 32 that are connected in sequence. The introduction segment 33 is located on the side surface of the liquid crystal display panel 20 and the side surface of the backlight module 10 and is electrically connected to the liquid crystal display panel 20. Both the fan-out segment 31 and the lead-out segment 32 are located on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, and the lead-out segment 32 is electrically connected to the first conductive pad 40. It can be understood that through the setting of the introduction segment 33, the fan-out segment 31 can be arranged on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, so as to facilitate the formation of the fan-out segment 31 and ensure the stability of the fan-out segment 31 after formation.

[0056] Referring to Figure 10 , optionally, in another embodiment of the present application, the difference between this embodiment and the above embodiment is that: the first conductive layer 30 includes an introduction segment 33, a fan-out segment 31, and a lead-out segment 32 that are connected in sequence. The introduction segment 33 is electrically connected to the liquid crystal display panel 20. The introduction segment 33 and the fan-out segment 31 are located on the side surface of the liquid crystal display panel 20 and extend towards the side surface of the backlight module 10. The lead-out segment 32 is located on the surface of the backlight module 10 facing away from the liquid crystal display panel 20, and the lead-out segment 32 is electrically connected to the first conductive pad 40. It can be understood that the introduction segment 33 can be arranged on the side surface of the liquid crystal display panel 20, the fan-out segment 31 can also be arranged on the side surface of the backlight module 10, and the lead-out segment 32 is arranged on the surface of the backlight module 10 facing away from the liquid crystal display panel 20. In this way, by arranging the introduction segment 33, the fan-out segment 31, and the lead-out segment 32 on different surfaces respectively, the stability of each segment can be ensured.

[0057] The above has introduced in detail a display screen provided by an embodiment of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A display screen, characterized in that, Comprising: A backlight module; A liquid crystal display panel, which is disposed on the backlight module; A first frame adhesive layer, which is provided and encapsulated between the liquid crystal display panel and the backlight module to bond and fix the liquid crystal display panel and the backlight module, and the edges of the liquid crystal display panel, the first frame adhesive layer, and the backlight module are flush; A first conductive layer, which is formed on the side surfaces of the liquid crystal display panel and the backlight module and extends to the surface of the backlight module facing away from the liquid crystal display panel. The first conductive layer is electrically connected to the liquid crystal display panel. Among them, the first conductive layer includes a fan-out section and a lead-out section. The fan-out section includes a plurality of spaced conductive wires. The plurality of conductive wires extend from the center in the width direction of the fan-out section toward both sides. The inclination angles of the conductive wires of the plurality of fan-out sections gradually increase. A part of the fan-out section passes through and covers the first frame adhesive layer. Among them, the first frame adhesive layer is provided with a plurality of grooves at the position overlapping the fan-out section, and the depth of the groove at the center in the width direction of the fan-out section is greater than the depth of the grooves on both sides in the width direction; A first conductive pad, which is disposed on the surface of the backlight module facing away from the liquid crystal display panel and is electrically connected to the first conductive layer; and A first circuit board, which is bonded to the first conductive pad; The fan-out section is located on the side surface of the liquid crystal display panel and extends toward the side surface of the backlight module. The fan-out section is electrically connected to the liquid crystal display panel. The lead-out section is connected to the fan-out section and extends to the surface of the backlight module facing away from the liquid crystal display panel. The lead-out section is electrically connected to the first conductive pad.

2. The display screen according to claim 1, characterized in that, The distance between the two ends on the side of the fan-out section close to the lead-out section is less than the distance between the two ends on the side of the fan-out section far from the lead-out section; The plurality of conductive wires extend from one end far from the lead-out section toward the direction close to the lead-out section.

3. The display screen according to claim 1, characterized in that, The display screen further includes a second conductive layer, a second conductive pad, and a second circuit board. The second conductive layer is formed on the side surfaces of the liquid crystal display panel and the backlight module and extends to the surface of the backlight module facing away from the liquid crystal display panel, and is spaced from the first conductive layer. The second conductive layer is electrically connected to the liquid crystal display panel; The second conductive pad is disposed on the surface of the backlight module facing away from the liquid crystal display panel and is connected to the second conductive layer, and the second conductive pad is spaced from the first conductive pad. The second circuit board is bonded to the second conductive pad.

4. The display screen according to claim 1, characterized in that, The liquid crystal display panel includes: An array substrate, which is disposed on the backlight module; A color filter substrate, which is disposed opposite to the array substrate, and the color filter substrate is located on the side of the array substrate facing away from the backlight module; A liquid crystal layer, which is disposed between the array substrate and the color filter substrate; A second frame adhesive layer, which is provided and encapsulated between the array substrate and the color filter substrate; and An inner conductive pad is disposed between the array substrate and the second encapsulation layer and is electrically connected to the array substrate and the first conductive layer respectively.

5. The display screen according to claim 1, characterized in that, The display screen further includes a third conductive layer, a third conductive pad, and a third circuit board. The third conductive layer is formed on a side surface of the backlight module and extends to a surface of the backlight module facing away from the liquid crystal display panel, and is disposed at an interval from the first conductive layer. The third conductive layer is electrically connected to the backlight module. The third conductive pad is disposed on a surface of the backlight module facing away from the liquid crystal display panel, is connected to the third conductive layer, and is disposed at an interval from the first conductive pad. The third circuit board is bonded to the third conductive pad.

6. The display screen according to claim 1, characterized in that, The display screen further includes a protective layer, and the protective layer is formed to cover surfaces of a side of the first conductive layer facing away from the backlight module and a side of the liquid crystal display panel.

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