Substrate cleaning apparatus and substrate cleaning method

Abstract

This invention relates to a substrate cleaning apparatus and a substrate cleaning method. The invention holds the substrate in a horizontal position using a substrate holding part. In the processing position, the lower surface of the substrate held by the substrate holding part is cleaned using a lower surface brush. In the standby position, which overlaps vertically with the substrate held by the substrate holding part and is located below the processing position, the lower surface brush is cleaned using a brush cleaning part. The lower surface brush moves up and down between the processing position and the standby position via a lower surface brush lifting drive part.

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning the lower surface of a substrate. Background Technology

[0002] A substrate processing apparatus is used to perform various treatments on various substrates used in liquid crystal display devices or organic EL (Electroluminescence) display devices, such as substrates for FPD (Flat Panel Display), semiconductor substrates, optical disc substrates, magnetic disk substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, or solar cell substrates. A substrate cleaning apparatus is used to clean the substrates.

[0003] For example, the substrate cleaning apparatus described in Patent No. 5904169 includes two adsorption pads holding the peripheral portion of the back side of a wafer, a rotating chuck holding the central portion of the back side of the wafer, and a brush for cleaning the back side of the wafer. The two adsorption pads hold the wafer and move laterally. In this state, the central portion of the back side of the wafer is cleaned with the brush. Afterward, the rotating chuck receives the wafer from the adsorption pads, holds the central portion of the back side of the wafer, and rotates. In this state, the peripheral portion of the back side of the wafer is cleaned with the brush. Summary of the Invention

[0004] In substrate cleaning equipment, the cleanliness of the brushes gradually decreases with repeated substrate cleaning. If the cleanliness of the brushes decreases, the substrate cannot be cleaned efficiently. Therefore, it is desirable to maintain the cleanliness of the brushes at a constant level or higher. However, maintaining the cleanliness of the brushes without reducing productivity is not easy.

[0005] The purpose of this invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can maintain the cleanliness of brushes without reducing productivity.

[0006] (1) A substrate cleaning apparatus according to one aspect of the present invention comprises: a substrate holding part for holding a substrate in a horizontal position; a lower surface brush for cleaning the lower surface of the substrate held by the substrate holding part in a processing position; a brush cleaning part for cleaning the lower surface brush in a standby position that overlaps with the substrate held by the substrate holding part in the vertical direction and is located below the processing position; and a lower surface brush lifting drive part for lifting the lower surface brush between the processing position and the standby position.

[0007] In the substrate cleaning apparatus, since the standby position of the lower surface brush overlaps vertically with the substrate held by the substrate holding section, the area occupied by the lower surface brush is almost not increased even when the lower surface brush is relatively large. Therefore, the lower surface of the substrate can be cleaned in a short time by using a larger lower surface brush. Therefore, even if a step of cleaning the lower surface brush is included, the production capacity remains almost unchanged. Thus, the cleanliness of the lower surface brush can be maintained without reducing production capacity.

[0008] (2) Alternatively, the substrate cleaning apparatus may further include an upper surface cleaning section for cleaning the upper surface of the substrate held by the substrate holding section, and a lower surface brush lifting drive section for performing cleaning of the lower surface of the substrate and the lower surface brush during the cleaning of the upper surface of the substrate by the upper surface cleaning section, thereby moving the lower surface brush between a processing position and a standby position. In this case, since the cleaning of the lower surface of the substrate and the lower surface brush are performed during the cleaning of the upper surface of the substrate by the upper surface cleaning section, the cleanliness of the lower surface brush can be maintained without reducing productivity.

[0009] (3) Alternatively, the lower surface brush lifting drive unit can perform multiple cleanings of the lower surface of the substrate and the lower surface brush, causing the lower surface brush to repeatedly rise and fall between the processing position and the standby position. In this case, the lower surface brush can be cleaned in a short time.

[0010] (4) Alternatively, the brush cleaning section may include a first liquid nozzle that sprays cleaning liquid onto the central part of the lower surface brush and a second liquid nozzle that sprays cleaning liquid onto the ends of the lower surface brush. With this configuration, even if the lower surface brush is relatively large, the entire lower surface brush can be easily cleaned.

[0011] (5) Alternatively, the brush cleaning section may include a cleaning tank for storing cleaning solution that has been used to soak the lower surface brushes. With this configuration, even when the lower surface brushes are relatively large, the entire lower surface brush can be easily cleaned. Furthermore, the lower surface brushes can be cleaned in a short time.

[0012] (6) Alternatively, the substrate holding portion and the lower surface brush may each have a circular shape, and the diameter of the lower surface brush is larger than the diameter of the substrate holding portion. In this case, the lower surface brush can be made relatively large.

[0013] (7) Alternatively, the substrate and the lower surface brush may each have a circular shape, and the diameter of the lower surface brush may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface brush can be made relatively large.

[0014] (8) A substrate cleaning method according to another aspect of the present invention includes: holding a substrate in a horizontal position by a substrate holding portion; cleaning the lower surface of the substrate held by the substrate holding portion by a lower surface brush in a processing position; cleaning the lower surface brush by a brush cleaning portion in a standby position that overlaps with the substrate held by the substrate holding portion in the vertical direction and is located below the processing position; and moving the lower surface brush up and down between the processing position and the standby position.

[0015] According to the substrate cleaning method, since the standby position of the lower surface brush overlaps vertically with the substrate held by the substrate holding part, the area occupied by the lower surface brush is hardly increased even when the lower surface brush is relatively large. Therefore, the lower surface of the substrate can be cleaned in a short time by using a relatively large lower surface brush. Therefore, even if a step of cleaning the lower surface brush is included, the production capacity remains almost unchanged. Thus, the cleanliness of the lower surface brush can be maintained without reducing production capacity.

[0016] (9) Alternatively, the substrate cleaning method may further include cleaning the upper surface of the substrate held by the substrate holding section through the upper surface cleaning section, and cleaning the lower surface of the substrate and the lower surface brush are performed during the cleaning of the upper surface of the substrate through the upper surface cleaning section. In this case, since the cleaning of the lower surface of the substrate and the cleaning of the lower surface brush are performed during the cleaning of the upper surface of the substrate through the upper surface cleaning section, the cleanliness of the lower surface brush can be maintained without reducing productivity.

[0017] (10) Alternatively, the lower surface brush can be repeatedly moved up and down between the processing position and the standby position in a manner that performs multiple cleaning operations on the lower surface of the substrate and the lower surface brush. In this case, the lower surface brush can be cleaned in a short time.

[0018] (11) Alternatively, cleaning the lower surface brush by the brush cleaning section may include spraying cleaning liquid onto the center of the lower surface brush through the first liquid nozzle and spraying cleaning liquid onto the ends of the lower surface brush through the second liquid nozzle. According to the above configuration, even when the lower surface brush is relatively large, the entire lower surface brush can be easily cleaned.

[0019] (12) Alternatively, cleaning the lower surface brush via the brush cleaning section may involve immersing the lower surface brush in a cleaning solution stored in a cleaning tank. According to this configuration, even when the lower surface brush is relatively large, the entire lower surface brush can be easily cleaned. Furthermore, the lower surface brush can be cleaned in a short time.

[0020] (13) Alternatively, the substrate holding portion and the lower surface brush may each have a circular shape, and the diameter of the lower surface brush is larger than the diameter of the substrate holding portion. In this case, the lower surface brush can be made relatively large.

[0021] (14) Alternatively, the substrate and the lower surface brush may each have a circular shape, and the diameter of the lower surface brush may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface brush can be made relatively large. Attached Figure Description

[0022] Figure 1 This is a schematic top view of the substrate cleaning apparatus according to the first embodiment of the present invention.

[0023] Figure 2 To indicate Figure 1 A three-dimensional view of the internal structure of the substrate cleaning device.

[0024] Figure 3 This is a block diagram illustrating the configuration of the control system for the substrate cleaning apparatus.

[0025] Figure 4 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0026] Figure 5 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0027] Figure 6 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0028] Figure 7 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0029] Figure 8 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0030] Figure 9 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0031] Figure 10 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0032] Figure 11 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0033] Figure 12 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0034] Figure 13For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0035] Figure 14 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0036] Figure 15 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0037] Figure 16 For the purpose of explanation Figure 12 A schematic diagram of the general operation of the substrate cleaning device.

[0038] Figure 17 For the purpose of explanation Figure 12 A schematic diagram of the general operation of the substrate cleaning device.

[0039] Figure 18 For the purpose of explanation Figure 12 A schematic diagram of the general operation of the substrate cleaning device.

[0040] Figure 19 For the purpose of explanation Figure 12 A schematic diagram of the general operation of the substrate cleaning device.

[0041] Figure 20 For the purpose of explanation Figure 12 A schematic diagram of the general operation of the substrate cleaning device.

[0042] Figure 21 For the purpose of explanation Figure 12 A schematic diagram of the general operation of the substrate cleaning device.

[0043] Figure 22 To indicate Figure 3 The flowchart of the substrate cleaning process for the control device.

[0044] Figure 23 To indicate Figure 3 The flowchart of the substrate cleaning process for the control device.

[0045] Figure 24 This is an enlarged cross-sectional view showing the area near the brush on the lower surface of the substrate cleaning apparatus of the second embodiment.

[0046] Figure 25 For the purpose of explanation Figure 24 A diagram illustrating the cleaning action of the brush on the lower surface.

[0047] Figure 26 For the purpose of explanation Figure 24 A diagram illustrating the cleaning action of the brush on the lower surface.

[0048] Figure 27 For the purpose of explanation Figure 24 A diagram illustrating the cleaning action of the brush on the lower surface.

[0049] Figure 28 For the purpose of explanation Figure 24 A diagram illustrating the cleaning action of the brush on the lower surface.

[0050] Figure 29 For the purpose of explanation Figure 24 A diagram illustrating the cleaning action of the brush on the lower surface.

[0051] Figure 30 An enlarged cross-sectional view showing the area near the lower surface brush of the substrate cleaning apparatus in the first variation example.

[0052] Figure 31 An enlarged cross-sectional view showing the area near the brush on the lower surface of the substrate cleaning apparatus in the second variation example.

[0053] Figure 32 An enlarged cross-sectional view showing the area near the brush on the lower surface of the substrate cleaning apparatus in the second variation example.

[0054] Figure 33 An enlarged cross-sectional view showing the area near the brush on the lower surface of the substrate cleaning apparatus in the second variation example.

[0055] Figure 34 An enlarged cross-sectional view showing the area near the lower surface brush of the substrate cleaning apparatus in the third variation example. Detailed Implementation

[0056] Hereinafter, the substrate cleaning apparatus and substrate cleaning method according to embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, "substrate" refers to a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, at least a portion of the substrate used in this embodiment has a circular outer periphery. For example, the outer periphery is circular except for the positioning notch.

[0057] [1] First Embodiment

[0058] (1) Composition of substrate processing device

[0059] Figure 1 This is a schematic top view of the substrate cleaning apparatus according to the first embodiment of the present invention. Figure 2 To indicate Figure 1A perspective view of the internal structure of the substrate cleaning apparatus. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions are defined as mutually orthogonal to clarify their positional relationships. Figure 1 and Figure 2 In subsequent specific diagrams, the X, Y, and Z directions will be appropriately represented by arrows. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction is equivalent to the vertical direction.

[0060] like Figure 1 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a platform device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening and closing device 90. These components are housed within the unit housing 2. Figure 2 In the middle, the unit shell 2 is represented by a dashed line.

[0061] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upwards from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of the sidewall portion 2b. This opening serves as a loading / unloading outlet 2x for the substrate W, used for loading and unloading the substrate W into and out of the unit housing 2. Figure 2 In the diagram, the loading / unloading outlet 2x is represented by a thicker dashed line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading outlet 2x toward the outside of the unit housing 2 (from side wall 2c toward side wall 2b) is referred to as the front, and the opposite direction (from side wall 2b toward side wall 2c) is referred to as the rear.

[0062] An opening and closing device 90 is provided in the area forming the inlet / outlet 2x in the side wall portion 2b and in the vicinity thereof. The opening and closing device 90 includes a baffle 91 configured to open and close the inlet / outlet 2x, and a baffle drive unit 92 for driving the baffle 91. Figure 2 In the diagram, baffle 91 is represented by a thicker dashed line. The baffle drive unit 92 drives the baffle 91 to open the inlet / outlet 2x when the substrate W is being moved into and out of the substrate cleaning apparatus 1. In addition, the baffle drive unit 92 drives the baffle 91 to close the inlet / outlet 2x when the substrate W is being cleaned in the substrate cleaning apparatus 1.

[0063] A platform assembly 30 is provided at the center of the bottom surface 2a. The platform assembly 30 includes a linear guide rail 31, a movable platform 32, and a platform drive unit 33. The linear guide rail 31 includes two tracks and is configured to extend in the Y direction from near the side wall 2b to near the side wall 2c when viewed from above. The movable platform 32 is configured to move in the Y direction on the two tracks of the linear guide rail 31. The platform drive unit 33 includes, for example, a pulse motor, to move the movable platform 32 in the Y direction on the linear guide rail 31.

[0064] On the movable platform 32, the lower holding device 20 and the lower surface cleaning device 50 are arranged in the Y direction. The lower holding device 20 includes an adsorption holding part 21 and an adsorption holding drive part 22. The adsorption holding part 21 is a so-called rotating chuck, which has a circular adsorption surface that can adsorb and hold the lower surface of the substrate W, and is configured to rotate about an axis extending in the vertical direction (the axis in the Z direction). In the following description, when the substrate W is adsorbed and held by the adsorption holding part 21, the area on the lower surface of the substrate W that should be adsorbed by the adsorption surface of the adsorption holding part 21 is called the central region of the lower surface. On the other hand, the area on the lower surface of the substrate W that surrounds the central region of the lower surface is called the outer region of the lower surface.

[0065] The adsorption-holding drive unit 22 includes a motor. The motor of the adsorption-holding drive unit 22 is mounted on a movable platform 32 with its rotation axis projecting upwards. The adsorption-holding unit 21 is mounted on the upper end of the rotation axis of the adsorption-holding drive unit 22. Furthermore, an attraction path for adsorbing and holding the substrate W in the adsorption-holding unit 21 is formed on the rotation axis of the adsorption-holding drive unit 22. This attraction path is connected to a suction device (not shown). The adsorption-holding drive unit 22 rotates the adsorption-holding unit 21 about the rotation axis.

[0066] On the movable base 32, near the lower holding device 20, a connecting device 40 is also provided. The connecting device 40 includes multiple (three in this example) support pins 41, pin connecting members 42, and a pin lifting drive 43. The pin connecting members 42 are formed to surround the adsorption holding part 21 in plan view and connect the multiple support pins 41. The multiple support pins 41 are interconnected by the pin connecting members 42 and extend upward from the pin connecting members 42 by a certain length. The pin lifting drive 43 raises and lowers the pin connecting members 42 on the movable base 32. As a result, the multiple support pins 41 rise and fall relative to the adsorption holding part 21.

[0067] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, liquid nozzles 52a and 52b, a gas ejection section 53, a lifting support section 54, a movable support section 55, a lower surface brush rotation drive section 55a, a lower surface brush lifting drive section 55b, and a lower surface brush movement drive section 55c. The movable support section 55 is configured to move relative to the lower holding device 20 in the Y direction within a certain area on the movable base 32. Figure 2 As shown, a lifting support 54 is provided on the movable support 55 in a way that allows it to be raised and lowered. The lifting support 54 has an upper surface 54u that is inclined downward in a direction away from the adsorption and holding part 21 (rearward in this example).

[0068] like Figure 1 As shown, the lower surface brush 51 has a circular shape when viewed from above, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the adsorption surface of the adsorption holding portion 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding portion 21. In addition, the diameter of the lower surface brush 51 is larger than 1 / 3 and smaller than 1 / 2 of the diameter of the substrate W. In addition, the diameter of the substrate W is, for example, 300 mm.

[0069] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. In addition, the lower surface brush 51 is mounted on the upper surface 54u of the lifting support 54 with the cleaning surface facing upward and the cleaning surface being rotatable about an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0070] Two liquid nozzles 52 are each mounted on the upper surface 54u of the lifting support 54, positioned near the lower surface brush 51 with the liquid outlet facing upwards. The liquid nozzles 52 are connected to the lower surface cleaning liquid supply unit 56. Figure 3 The lower surface cleaning solution supply unit 56 supplies cleaning solution to the liquid nozzle 52. When the lower surface brush 51 needs to clean the substrate W, the liquid nozzle 52 sprays the cleaning solution supplied from the lower surface cleaning solution supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning solution supplied to the liquid nozzle 52.

[0071] Two liquid nozzles 52a and 52b are each mounted on the upper surface 54u of the lifting support 54, positioned near the lower surface brush 51 with the liquid outlet facing obliquely upwards. The liquid nozzles 52a and 52b are connected to the brush cleaning liquid supply unit 57. Figure 3The brush cleaning solution supply unit 57 supplies cleaning solution to the liquid nozzles 52a and 52b. When cleaning the lower surface brush 51, the liquid nozzles 52a and 52b spray the cleaning solution supplied by the brush cleaning solution supply unit 57 onto the center and end of the cleaning surface of the lower surface brush 51, respectively. In this embodiment, pure water is used as the cleaning solution supplied to the liquid nozzles 52a and 52b.

[0072] The gas ejection section 53 is a slit-shaped gas injection nozzle with a gas outlet extending in one direction. The gas ejection section 53 is mounted on the upper surface 54u of the lifting support section 54, positioned between the lower surface brush 51 and the adsorption holding section 21 in a top view, with the gas outlet facing upwards. The gas ejection section 53 is connected to the ejected gas supply section 58. Figure 3 The ejector gas supply unit 58 supplies gas to the gas ejector unit 53. In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejector unit 53. The gas ejector unit 53 ejects the gas supplied from the ejector gas supply unit 58 onto the lower surface of the substrate W during cleaning of the substrate W of the lower surface brush 51 and during drying of the lower surface of the substrate W (described later). In this case, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21.

[0073] The lower surface brush rotation drive unit 55a includes a motor that rotates the lower surface brush 51 during cleaning of the substrate W of the lower surface brush 51. The lower surface brush lifting drive unit 55b includes a stepper motor or cylinder that raises and lowers the lifting support unit 54 relative to the movable support unit 55. The lower surface brush moving drive unit 55c includes a motor that moves the movable support unit 55 in the Y direction on the movable platform 32. Here, the position of the lower holding device 20 in the movable platform 32 is fixed. Therefore, when the lower surface brush moving drive unit 55c moves the movable support unit 55 in the Y direction, the movable support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable platform 32 when it is closest to the lower holding device 20 is referred to as the approach position, and the position of the lower surface cleaning device 50 on the movable platform 32 when it is farthest from the lower holding device 20 is referred to as the departure position.

[0074] A cup device 60 is also provided at the center of the bottom surface 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is configured to surround the lower holding device 20 and the base device 30 when viewed from above and can be raised and lowered. Figure 2In the diagram, cup 61 is indicated by a dashed line. The cup driving unit 62 moves cup 61 between a lower cup position and an upper cup position depending on which portion of the lower surface of the substrate W needs to be cleaned by the lower surface brush 51. The lower cup position is when the upper end of cup 61 is located at a height lower than the substrate W held by the adsorption and holding unit 21. Conversely, the upper cup position is when the upper end of cup 61 is located at a height higher than the adsorption and holding unit 21.

[0075] At a height above the cup 61, a pair of upper holding devices 10A and 10B are arranged opposite each other across the base device 30 when viewed from above. The upper holding device 10A includes a lower clamping plate 11A, an upper clamping plate 12A, a lower clamping plate drive unit 13A, and an upper clamping plate drive unit 14A. The upper holding device 10B includes a lower clamping plate 11B, an upper clamping plate 12B, a lower clamping plate drive unit 13B, and an upper clamping plate drive unit 14B.

[0076] The lower clamps 11A and 11B are symmetrically arranged in the Y direction (front-back direction) with respect to the vertical plane extending through the center of the adsorption holding part 21 when viewed from above, and are configured to move in the X direction within a common horizontal plane. Each of the lower clamps 11A and 11B has two support plates that can support the lower periphery of the substrate W from below. The lower clamp drive parts 13A and 13B move the lower clamps 11A and 11B by either bringing them closer together or by moving them further apart.

[0077] Like the lower clamps 11A and 11B, the upper clamps 12A and 12B are symmetrically arranged in a vertical plane extending in the Y direction (front-back direction) relative to the center of the adsorption holding portion 21 when viewed from above, and are configured to move in the X direction within a common horizontal plane. Each of the upper clamps 12A and 12B has two holding tabs configured to abut against the outer peripheral end of the substrate W and hold the outer peripheral end of the substrate W. The upper clamp drive portions 14A and 14B move the upper clamps 12A and 12B by either bringing them closer together or by moving them further apart.

[0078] like Figure 1 As shown, a top surface cleaning device 70 is provided on one side of the cup 61, near the upper holding device 10B in a top view. The top surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and a top surface cleaning drive unit 74.

[0079] The rotating support shaft 71 is located on the bottom part 2a and is supported by the upper surface cleaning drive part 74 in a vertically extending manner, allowing it to be raised, lowered, and rotated. Arm 72, as... Figure 2As shown, it is positioned above the upper holding device 10B, extending horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is mounted at the front end of the arm 72.

[0080] The upper surface cleaning fluid supply unit 75 is connected to the spray nozzle 73. Figure 3 The upper surface cleaning fluid supply unit 75 supplies cleaning fluid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning fluid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning fluid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downwards.

[0081] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 71 and rotate the rotating support shaft 71. According to the above configuration, the upper surface of the substrate W, which is adsorbed, held and rotated by the adsorption and holding unit 21, is cleaned by moving the spray nozzle 73 in an arc shape.

[0082] like Figure 1 As shown, on the other side of the cup 61, in a top view near the upper holding device 10A, an end cleaning device 80 is provided. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, an inclined brush 83, and an inclined brush drive unit 84.

[0083] The rotating support shaft 81 is located on the bottom part 2a and is supported by the inclined brush drive part 84, extending vertically and capable of both lifting and rotation. Arm 82, as... Figure 2 As shown, the arm 82 is positioned above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. At the front end of the arm 82, a beveled brush 83 is provided, protruding downwards and rotatable about an axis in the vertical direction.

[0084] The upper half of the beveled brush 83 has an inverted conical trapezoidal shape, and the lower half has a conical trapezoidal shape. According to the beveled brush 83, the outer peripheral end of the substrate W can be cleaned at the central portion in the vertical direction of the outer peripheral surface.

[0085] The inclined brush drive unit 84 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 81 and rotate the rotating support shaft 81. According to the above configuration, by contacting the central portion of the outer peripheral surface of the inclined brush 83 with the outer peripheral end of the substrate W which is adsorbed, held and rotated by the adsorption and holding unit 21, the entire outer peripheral end of the substrate W can be cleaned.

[0086] Here, the inclined brush drive unit 84 also includes a motor built into the arm 82. The motor causes the inclined brush 83, which is located at the front end of the arm 82, to rotate about an axis in the vertical direction. Therefore, during cleaning of the outer peripheral end of the substrate W, the cleaning force of the inclined brush 83 at the outer peripheral end of the substrate W is increased by rotating the inclined brush 83.

[0087] Figure 3 This is a block diagram illustrating the configuration of the control system of the substrate cleaning apparatus 1. Figure 3 The control unit 9 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and storage devices. RAM is used as the CPU's operating area. ROM stores the system program. The storage devices store the control program.

[0088] like Figure 3 As shown, the control device 9, as a functional unit, includes a clamp control unit 9A, an adsorption control unit 9B, a platform control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, an inclined surface cleaning control unit 9H, and a loading / unloading control unit 9I. The functional units of the control device 9 are implemented by the CPU executing a substrate cleaning program stored in a storage device on RAM. Some or all of the functional units of the control device 9 can be implemented using hardware such as electronic circuits.

[0089] The clamp control unit 9A controls the lower clamp drive units 13A and 13B and the upper clamp drive units 14A and 14B to receive the substrate W into the substrate cleaning apparatus 1 and hold it above the adsorption holding unit 21. The adsorption control unit 9B controls the adsorption holding drive unit 22 to adsorb and hold the substrate W by the adsorption holding unit 21 and to rotate the adsorbed and held substrate W.

[0090] The stage control unit 9C controls the stage drive unit 33 to move the movable stage 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0091] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 58 to clean the lower surface of the substrate W. Additionally, the lower surface cleaning control unit 9E controls the brush cleaning liquid supply unit 57 to clean the lower surface brush 51. The cup control unit 9F controls the cup drive unit 62 to catch the cleaning liquid that spills from the substrate W when it is held by the adsorption and holding unit 21 during cleaning.

[0092] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the adsorption and holding unit 21. The inclined surface cleaning control unit 9H controls the inclined surface brush drive unit 84 to clean the outer peripheral end of the substrate W held by the adsorption and holding unit 21. The loading and unloading control unit 9I controls the baffle drive unit 92 to open and close the loading and unloading outlet 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0093] (2) General Operation of Substrate Cleaning Equipment

[0094] Figures 4 to 15 For the purpose of explanation Figure 1 A schematic diagram of the general operation of the substrate cleaning apparatus 1. Figures 4 to 15 In each figure, the top section shows a top view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its surrounding portion viewed along the Y direction, and the bottom section shows a side view of the lower holding device 20 and its surrounding portion viewed along the X direction. The side view in the middle section is similar to... Figure 1 The side view of line AA corresponds to the side view of the lower segment. Figure 1 The BB line side view corresponds to this. Furthermore, to facilitate understanding of the shape and operational state of each component in the substrate cleaning apparatus 1, the scaling factor of some components differs between the top view of the upper section and the side views of the middle and lower sections. Additionally, in... Figures 4 to 15 In the diagram, cup 61 is represented by a two-dot dash, and the shape of substrate W is represented by a thicker one-dot dash.

[0095] In the initial state before the substrate W is transferred into the substrate cleaning device 1, the baffle 91 of the opening and closing device 90 closes the transfer outlet 2x. Additionally, as... Figure 1 As shown, the lower clamps 11A and 11B maintain a distance between each other that is sufficiently greater than the diameter of the substrate W. Similarly, the upper clamps 12A and 12B also maintain a distance between each other that is sufficiently greater than the diameter of the substrate W.

[0096] Furthermore, the movable platform 32 of the platform device 30 is configured such that, when viewed from above, the center of the adsorption holding portion 21 is located at the center of the cup 61. The lower surface cleaning device 50 is positioned close to the movable platform 32. In the lifting support portion 54 of the lower surface cleaning device 50, the cleaning surface (upper end) of the lower surface brush 51 is located below the adsorption holding portion 21. The position of the lower surface brush 51 in this initial state is referred to as the standby position. With the substrate W held in the adsorption holding portion 21, the standby position is located below the substrate W.

[0097] Furthermore, in the transfer device 40, the multiple support pins 41 are positioned below the adsorption and holding portion 21. Additionally, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 viewed from above will be referred to as the planar reference position rp. Furthermore, the position of the movable platform 32 on the bottom surface 2a when the center of the adsorption and holding portion 21 is located at the planar reference position rp viewed from above will be referred to as the first horizontal position.

[0098] The substrate W is moved into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, before the substrate W is moved in, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 4 As indicated by the thick solid arrow a1, the substrate handling robot's hand (substrate holding part) RH (not shown) moves the substrate W into the approximate central position within the unit housing 2 via the loading / unloading port 2x. At this time, the substrate W held by the hand RH is as follows... Figure 4 As shown, it is located between the lower clamping plate 11A and the upper clamping plate 12A, and between the lower clamping plate 11B and the upper clamping plate 12B.

[0099] Next, as Figure 5 As indicated by the thick solid arrow a2, the lower clamps 11A and 11B have multiple support plates positioned below the lower peripheral edge of the substrate W. In this state, the hand RH descends and exits from the loading / unloading outlet 2x. Thus, multiple portions of the lower peripheral edge of the substrate W held by the hand RH are supported by the multiple support plates of the lower clamps 11A and 11B. After the hand RH exits, the baffle 91 closes the loading / unloading outlet 2x.

[0100] Next, as Figure 6 As indicated by the thick solid arrow a3, the upper clamps 12A and 12B, with their multiple retaining tabs abutting against the outer periphery of the substrate W, approach each other. The substrate W, supported by the lower clamps 11A and 11B, is also held by the upper clamps 12A and 12B, through the multiple retaining tabs of the upper clamps 12A and 12B abutting against multiple portions of the outer periphery of the substrate W. Furthermore, as... Figure 6As indicated by the thick solid arrow a4, the movable base 32 moves forward from the first horizontal position with the adsorption and holding part 21 offset from the planar reference position rp by a specific distance and the center of the lower surface brush 51 located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom part 2a is referred to as the second horizontal position.

[0101] Next, as Figure 7 As indicated by the thick solid arrow a5, the lifting support 54 rises such that the cleaning surface of the lower surface brush 51 in the standby position contacts the central region of the lower surface of the substrate W. The position of the lower surface brush 51 at this time is referred to as the processing position. Furthermore, as... Figure 7 As indicated by the thick solid arrow a6, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically removed by the lower surface brush 51.

[0102] At Figure 7 The following section shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W, within a dialog box. As shown in the dialog box, with the lower surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection section 53 are held close to the lower surface of the substrate W. At this time, the liquid nozzle 52, as indicated by the colored arrow a51, sprays cleaning fluid onto the lower surface of the substrate W near the lower surface brush 51. This guides the cleaning fluid supplied from the liquid nozzle 52 to the lower surface of the substrate W to the contact portion between the lower surface brush 51 and the substrate W, thereby rinsing away contaminants removed from the back side of the substrate W by the lower surface brush 51. Thus, in the lower surface cleaning apparatus 50, the liquid nozzle 52 and the lower surface brush 51 are mounted together on the lifting support section 54. This efficiently supplies cleaning fluid to the cleaning portion of the lower surface of the substrate W where the lower surface brush 51 is located. Therefore, the consumption of cleaning fluid is reduced and excessive dispersion of cleaning fluid is suppressed.

[0103] Here, the upper surface 54u of the lifting support 54 is inclined downwards in a direction away from the adsorption and holding part 21. In this case, when the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lifting support 54, the cleaning liquid caught by the upper surface 54u will be guided away from the adsorption and holding part 21.

[0104] Additionally, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection part 53, as shown... Figure 7As indicated by the white arrow a52 in the dialog box, gas is sprayed onto the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21. In this embodiment, the gas ejection portion 53 is mounted on the lifting support portion 54 with the gas ejection port extending in the X direction. In this case, when gas is sprayed onto the lower surface of the substrate W from the gas ejection portion 53, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. This prevents the cleaning liquid containing contaminants from scattering onto the adsorption holding portion 21 when the lower surface brush 51 cleans the lower surface of the substrate W. Therefore, it prevents the cleaning liquid containing contaminants from adhering to the adsorption holding portion 21 when the lower surface brush 51 cleans the lower surface of the substrate W, and keeps the adsorption surface of the adsorption holding portion 21 clean.

[0105] In addition, Figure 7 In the example, as shown by the white arrow a52, gas is ejected from the gas ejection section 53 towards the lower surface brush 51 at an oblique upward direction, but the present invention is not limited to this. The gas ejection section 53 may also eject gas towards the lower surface of the substrate W in the Z direction.

[0106] Next, Yu Figure 7 In this state, after the central region of the lower surface of the substrate W is cleaned, the rotation of the lower surface brush 51 is stopped, and the lifting support 54 descends such that the cleaning surface of the lower surface brush 51 is a specific distance away from the substrate W. Additionally, the spraying of cleaning liquid from the liquid nozzle 52 onto the substrate W stops. At this time, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0107] After that, as Figure 8 As indicated by the thick solid arrow a7, the movable stage 32 moves rearward with the adsorption holding part 21 positioned at the planar reference position rp. That is, the movable stage 32 moves from the second horizontal position to the first horizontal position. At this time, by continuing to spray gas onto the substrate W from the gas ejection part 53, the central region of the lower surface of the substrate W is dried sequentially by the gas curtain.

[0108] Next, as Figure 9 As indicated by the thick solid arrow a8, the lifting support 54 lowers such that the cleaning surface of the lower surface brush 51 is located below the adsorption surface (upper end) of the adsorption holding part 21. This moves the lower surface brush 51 to the standby position. Furthermore, as... Figure 9 As indicated by the thick solid arrow a9, the multiple retaining plates of the upper clamps 12A and 12B are moved away from each other from the outer periphery of the substrate W. At this time, the substrate W is supported by the lower clamps 11A and 11B.

[0109] After that, as Figure 9As indicated by the thick solid arrow a10, the pin connecting component 42 rises with the upper ends of the multiple support pins 41 positioned slightly above the lower clamps 11A and 11B. Thus, the substrate W, supported by the lower clamps 11A and 11B, is received by the multiple support pins 41.

[0110] Next, as Figure 10 As indicated by the thick solid arrow a11, the lower clamps 11A and 11B are moving away from each other. At this time, the lower clamps 11A and 11B have moved to a position where, from a top view, they do not overlap with the substrate W supported by multiple support pins 41. As a result, the upper holding devices 10A and 10B return to their initial state.

[0111] Next, as Figure 11 As indicated by the thick solid arrow a12, the pin-connecting member 42 descends with the upper ends of the multiple support pins 41 positioned below the adsorption-holding portion 21. Consequently, the substrate W, supported on the multiple support pins 41, is received by the adsorption-holding portion 21. In this state, the adsorption-holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Simultaneously with or after the descent of the pin-connecting member 42, as... Figure 11 As indicated by the thick solid line arrow a13, cup 61 rises from the lower cup position to the upper cup position.

[0112] Next, as Figure 12 As indicated by the thick solid arrow a14, the adsorption holding part 21 rotates about an axis in the vertical direction (the axis of rotation of the adsorption holding drive part 22). As a result, the substrate W adsorbed and held in the adsorption holding part 21 rotates in a horizontal position.

[0113] Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. Thus, as... Figure 12 As indicated by the thick solid arrow a15, the spray nozzle 73 moves to a position above the substrate W and descends at a predetermined distance between the spray nozzle 73 and the substrate W. In this state, the spray nozzle 73 sprays a mixture of cleaning liquid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Thus, as... Figure 12 As indicated by the thick solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto it.

[0114] Furthermore, while the spray nozzle 73 cleans the upper surface of the substrate W, the rotating support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 12As indicated by the thick solid arrow a17, the beveled brush 83 moves to a position above the outer peripheral end of the substrate W. It then descends such that the central portion of the outer peripheral surface of the beveled brush 83 contacts the outer peripheral end of the substrate W. In this state, the beveled brush 83 rotates (spins) about an axis in the vertical direction. As a result, contaminants adhering to the outer peripheral end of the substrate W are physically removed by the beveled brush 83. The contaminants removed from the outer peripheral end of the substrate W are then rinsed by a cleaning solution sprayed from the spray nozzle 73 onto the substrate W.

[0115] Furthermore, while the spray nozzle 73 cleans the upper surface of the substrate W, the lifting support 54 rises such that the cleaning surface of the lower surface brush 51 in the standby position contacts the outer region of the lower surface of the substrate W. As a result, the lower surface brush 51 moves to the processing position. Additionally, as... Figure 12 As indicated by the thick solid arrow a18, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. Furthermore, the liquid nozzle 52 sprays cleaning liquid onto the lower surface of the substrate W, and the gas ejection section 53 sprays gas onto the lower surface of the substrate W. Thus, the lower surface brush 51 can thoroughly clean the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption and holding section 21.

[0116] The rotation direction of the lower surface brush 51 can also be opposite to the rotation direction of the adsorption and holding portion 21. In this case, the outer region of the lower surface of the substrate W can be cleaned efficiently. Furthermore, when the lower surface brush 51 is not relatively large, such as... Figure 12 As indicated by the thick solid arrow a19, the movable support 55 can also move forward and backward on the movable base 32 between the approach position and the departure position. Even in this case, the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption and holding part 21, can be cleaned by the lower surface brush 51.

[0117] Furthermore, in this embodiment, cleaning the upper surface of the substrate W using the spray nozzle 73 requires a relatively long time. In contrast, cleaning the outer region of the lower surface of the substrate W using the relatively large lower surface brush 51 can be performed in a relatively short time. Therefore, during the cleaning of the upper surface of the substrate W, the cleaning of the outer region of the lower surface of the substrate W using the lower surface brush 51 and the cleaning using the spray nozzle 73 are performed alternately. Figure 1 The lower surface of the liquid nozzles 52a and 52b is cleaned by brush 51. Regarding... Figure 12 The details of the cleaning action of the lower surface brush 51 will be described later.

[0118] Next, after the upper surface, outer peripheral end, and outer area of ​​the lower surface of the substrate W have been cleaned, the spraying of the mixing fluid from the spray nozzle 73 to the substrate W is stopped. Additionally, as... Figure 13As indicated by the thick solid arrow a20, the spray nozzle 73 has moved to a position to one side of the cup 61 (the initial position). Additionally, as... Figure 13 As indicated by the thick solid arrow a21, the inclined brush 83 moves to the other side of the cup 61 (the initial position). Furthermore, the rotation of the lower surface brush 51 stops, and the lifting support 54 lowers the lower surface brush 51 a specific distance away from the substrate W. Thus, the lower surface brush 51 moves to the standby position. Additionally, the spraying of cleaning solution from the liquid nozzle 52 onto the substrate W and the spraying of gas from the gas ejection section 53 onto the substrate W are stopped. In this state, the adsorption and holding section 21 rotates at high speed, thereby shaking off the cleaning solution adhering to the substrate W and drying the entire substrate W.

[0119] Next, as Figure 14 As indicated by the thick solid arrow a22, cup 61 descends from the upper cup position to the lower cup position. Additionally, to move the new substrate W into the unit housing 2, as shown... Figure 14 As indicated by the thick solid arrow a23, the lower clamps 11A and 11B approach each other until they can support the new substrate W.

[0120] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, before the substrate W is removed, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 15 As indicated by the thick solid arrow a24, the hand (substrate holding part) RH of the substrate transfer robot (not shown) enters the unit housing 2 through the transfer inlet / outlet 2x. Then, the hand RH receives the substrate W on the adsorption holding part 21 and exits through the transfer inlet / outlet 2x. After the hand RH exits, the baffle 91 closes the transfer inlet / outlet 2x.

[0121] (3) Cleaning action of the brush on the lower surface

[0122] Figures 16-21 For the purpose of explanation Figure 12 A schematic diagram of the approximate operation of the substrate cleaning device 1. (See diagram below.) Figure 16 As shown, after washing Figure 12 When the substrate W is held in place by the adsorption and holding part 21, the nozzle 73 is rotated about an axis in the vertical direction and moved to a position approximately above the center of the substrate W. In this state, a mixture of cleaning liquid and gas is sprayed from the nozzle 73 onto the upper surface of the substrate W.

[0123] In addition, start Figure 12 The inclined brush 83 cleans the outer peripheral end of the substrate W. At this time, it is assumed that the contamination degree of the outer region of the lower surface of the substrate W is 100%, and the contamination degree of the lower surface brush 51 is 0%. Here, the contamination degree is an indicator of the degree of cleanliness, and a high contamination degree means a low degree of cleanliness.

[0124] Next, as Figure 17 As shown, the spray nozzle 73 moves outward from above the rotating substrate W. The movement of the spray nozzle 73 continues until it reaches above the outer periphery of the substrate W. Furthermore, the lower surface brush 51 is rotated and raised from the standby position to the upper processing position by contacting the cleaning surface of the lower surface of the substrate W with the outer region of the lower surface. Additionally, from... Figure 12 The liquid nozzle 52 sprays cleaning fluid onto the lower surface of the substrate W. This cleans the outer region of the lower surface of the substrate W. During the cleaning of the outer region of the lower surface of the substrate W, from... Figure 12 The gas ejection section 53 ejects gas onto the lower surface of the substrate W.

[0125] At Figure 17 During the cleaning operation of the outer region of the lower surface of substrate W, it is assumed that contaminants equivalent to, for example, 60% of the contaminants are transferred to the lower surface brush 51. Alternatively, it is assumed that contaminants equivalent to, for example, 20% of the contaminants adhering to substrate W are rinsed off with a cleaning solution. In this case, the contamination level of the outer region of the lower surface of substrate W decreases to 20%, while the contamination level of the lower surface brush 51 increases to 60%.

[0126] Next, as Figure 18 As shown, the lower surface brush 51 is rotated and lowered from the processing position to the standby position by moving its cleaning surface away from the outer region of the lower surface of the substrate W. In the standby position, cleaning fluid is sprayed from the liquid nozzle 52a to the center of the cleaning surface of the lower surface brush 51, and from the liquid nozzle 52b to the end of the cleaning surface of the lower surface brush 51. This cleans the lower surface brush 51. In this example, the cleaning fluid sprayed from the liquid nozzle 52a is supplied parabolically from an upward angle to the center of the cleaning surface of the lower surface brush 51. The lower surface brush 51 can be cleaned using ultrasonic cleaning.

[0127] At Figure 18 During the cleaning operation of the lower surface brush 51, it is assumed that contaminants, for example, equivalent to 20% contamination, adhering to the lower surface brush 51 are rinsed off with a cleaning solution. In this case, the contamination level of the outer region of the lower surface of the substrate W remains unchanged at 20%, while the contamination level of the lower surface brush 51 decreases to 40%.

[0128] Next, as Figure 19 As shown, the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W, causing the lower surface brush 51 to rotate and rise from the standby position to the upper processing position, thereby cleaning the outer region of the lower surface of the substrate W again. Figure 19 The cleaning action of the outer region of the lower surface of substrate W in the middle and Figure 17The same cleaning action is performed on the outer region of the lower surface of the substrate W.

[0129] At Figure 19 During the cleaning process on the outer region of the lower surface of substrate W, contaminants are transferred between the outer region of the lower surface of substrate W and the lower surface brush 51. However, at any given time, the contamination level of the lower surface brush 51 is greater than that of the outer region of the lower surface of substrate W. Therefore, the amount of contaminants transferred from the lower surface brush 51 to the outer region of the lower surface of substrate W is greater than the amount of contaminants transferred from the outer region of the lower surface of substrate W to the lower surface brush 51. Therefore, essentially, the contaminants adhering to the lower surface brush 51 are transferred to the outer region of the lower surface of substrate W.

[0130] Suppose that contaminants, for example, equivalent to 20% of the contaminant concentration, adhering to the lower surface brush 51 are transferred to the outer region of the lower surface of the substrate W. Alternatively, suppose that the contaminant concentration, for example, equivalent to 20%, is rinsed off with a cleaning solution. In this case, the contaminant concentration in the outer region of the lower surface of the substrate W remains unchanged at 20%, while the contaminant concentration in the lower surface brush 51 decreases to 20%.

[0131] After that, as Figure 20 As shown, the lower surface brush 51 is rotated and lowered from the processing position to the standby position below in such a way that the cleaning surface of the lower surface brush 51 leaves the outer region of the lower surface of the substrate W, thereby cleaning the lower surface brush 51 again. Figure 20 The cleaning action of the lower surface brush 51 and Figure 18 The cleaning action of the brush 51 on the lower surface is the same.

[0132] At Figure 20 During the cleaning operation of the lower surface brush 51, it is assumed that the contaminant adhering to the lower surface brush 51 is rinsed with a cleaning solution, for example, a contaminant with a contamination level equivalent to 20%. In this case, the contamination level of the outer region of the lower surface of the substrate W remains unchanged at 20%, and the contamination level of the lower surface brush 51 decreases to 0%.

[0133] repeat Figure 19 The cleaning action of the outer region of the lower surface of substrate W, and Figure 20 The cleaning action of the lower surface brush 51. In this case, during the cleaning action on the outer region of the lower surface of the substrate W, contaminants are transferred between the outer region of the lower surface of the substrate W and the lower surface brush 51. Here, at the current point in time, it is assumed that the contamination degree of the outer region of the lower surface of the substrate W is greater than that of the lower surface brush 51. Therefore, in effect, the contaminants adhering to the outer region of the lower surface of the substrate W are transferred to the lower surface brush 51. As a result, the contamination degree of the outer region of the lower surface of the substrate W is reduced.

[0134] Furthermore, during the cleaning process on the outer region of the lower surface of substrate W, even if the contamination level of the lower surface brush 51 increases, the contamination level of the lower surface brush 51 is reduced through subsequent cleaning operations. Therefore, by repeating the cleaning process on the outer region of the lower surface of substrate W and the cleaning process on the lower surface brush 51, the contamination level of both the outer region of the lower surface of substrate W and the contamination level of the lower surface brush 51 can be set to 0%. Additionally, since the cleaning process on the outer region of the lower surface of substrate W and the cleaning process on the lower surface brush 51 are repeated during the cleaning of the upper surface of substrate W, the production capacity is not reduced.

[0135] Finally, as Figure 21 As shown, the spray nozzle 73 reaches above the outer periphery of the substrate W. By stopping the spraying of the mixed fluid from the spray nozzle 73 onto the substrate W, the cleaning of the upper surface of the substrate W is completed. In addition, by stopping the rotation of the lower surface brush 51 and moving the lower surface brush 51 to the standby position, the cleaning of the outer region of the lower surface of the substrate W and the cleaning of the lower surface brush 51 are completed.

[0136] In this embodiment, the cleaning solution used to clean the lower surface brush 51 is pure water, but the embodiment is not limited to this. The cleaning solution used to clean the lower surface brush 51 may also be warm water, functional water, dilute alkaline water, or a chemical solution. When the cleaning solution is a chemical solution, the type of chemical solution may be appropriately changed according to the type of contaminant to be removed.

[0137] Additionally, the liquid nozzles 52a and 52b stop spraying the cleaning solution when the lower surface brush 51 is in the processing position, but the implementation is not limited to this. The liquid nozzles 52a and 52b may also spray the cleaning solution when the lower surface brush 51 is in the processing position, that is, during the cleaning of the outer region of the lower surface of the substrate W. Furthermore, the liquid nozzles 52a and 52b may also spray the cleaning solution while the lower surface brush 51 is moving up and down between the standby position and the processing position.

[0138] (4) Substrate cleaning treatment

[0139] Figure 22 and Figure 23 To indicate Figure 3 The flowchart of the substrate cleaning process of the control device 9. Figure 22 and Figure 23 The substrate cleaning process is performed by the CPU of the control device 9 executing the substrate cleaning program stored in the storage device on the RAM. The following is related to... Figure 22 and Figure 23 process Figure 1 Start using Figure 3 Control device 9 and Figures 4 to 21 The substrate cleaning apparatus 1 describes the substrate cleaning process.

[0140] First, the substrate W is moved into the unit housing 2 by controlling the baffle drive unit 92 through the infeed / outfeed control unit 9I. Figure 4 , Figure 5 And step S1). Next, the lower clamping drive units 13A and 13B and the upper clamping drive units 14A and 14B are controlled by the clamping control unit 9A, and the substrate W is held by the upper holding devices 10A and 10B. Figure 5 , Figure 6 And step S2).

[0141] Next, the movable platform 32 is moved from the first horizontal position to the second horizontal position by controlling the platform control unit 9C via the platform drive unit 33. Figure 6 And step S3). Then, the lower surface brush rotation drive unit 55a, lower surface brush lifting drive unit 55b, lower surface brush moving drive unit 55c, lower surface cleaning liquid supply unit 56, and ejected gas supply unit 58 are controlled by the lower surface cleaning control unit 9E to clean the central region of the lower surface of the substrate W. Figure 7 and step S4).

[0142] Next, the substrate W is dried by controlling the ejected gas supply unit 58 through the lower surface cleaning control unit 9E. Figure 8 And step S5). Furthermore, by controlling the base drive unit 33 via the base control unit 9C, the movable base 32 is moved from the second horizontal position to the first horizontal position (and step S5). Figure 8 (and step S6). In this example, steps S5 and S6 are performed approximately simultaneously. Thus, the central region of the lower surface of the substrate W is dried sequentially.

[0143] Next, the clamp control unit 9A controls the lower clamp drive units 13A and 13B and the upper clamp drive units 14A and 14B, and the handover control unit 9D controls the pin lifting drive unit 43, thereby transferring the substrate W from the upper holding devices 10A and 10B to the lower holding device 20. Figures 8-11 And step S7). In the aforementioned state, the adsorption control unit 9B controls the adsorption holding drive unit 22 to adsorb the central region of the lower surface of the substrate W, while the lower holding device 20 holds the substrate W. Figure 11 and step S8).

[0144] Then, steps S9, S10, and S11-S13 are executed in parallel. During the execution of steps S9-S13, the adsorption holding drive unit 22 is controlled by the adsorption control unit 9B, causing the substrate W to rotate around the axis of rotation of the adsorption holding drive unit 22. In addition, the cup drive unit 62 is controlled by the cup control unit 9F, causing the cup 61 to rise from the lower cup position to the upper cup position.

[0145] In step S9, the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 are controlled by the upper surface cleaning control unit 9G to clean the entire upper surface of the substrate W. Figure 12 , Figures 16-21 And step S9). In step S10, the inclined brush drive unit 84 is controlled by the inclined cleaning control unit 9H to clean the outer peripheral end of the substrate W. Figure 12 and step S10).

[0146] In step S11, the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 58 are controlled by the lower surface cleaning control unit 9E to clean the outer region of the lower surface of the substrate W. Figure 12 , Figure 17 (and step S11). In addition, when the lower surface brush 51 is not relatively large, the lower surface brush movement drive unit 55c can also be controlled by the lower surface cleaning control unit 9E to move the lower surface brush 51 and the movable stage 32 together in the Y direction in a way that the outer area of ​​the lower surface of the substrate W is cleaned.

[0147] Next, in step S12, the lower surface brush 51 is cleaned by controlling the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the brush cleaning liquid supply unit 57, and the sprayed gas supply unit 58 through the lower surface cleaning control unit 9E. Figure 18 (and step S12). Next, in step S13, the lower surface cleaning control unit 9E determines whether the lower surface brush 51 has been cleaned a specific number of times (step S13).

[0148] The number of times the lower surface brush 51 is washed is preset. The number of times the lower surface brush 51 is washed can be any number of times, but it is preferred to be 2 times or more. In addition, it is preferable that the number of times the lower surface brush 51 is washed is the number of times that can be performed during the execution of step S9.

[0149] If the cleaning of the lower surface brush 51 is not performed a specific number of times, the lower surface cleaning control unit 9E returns to step S11. In this case, in step S11, the outer region of the lower surface of the substrate W is cleaned again. Figure 19 Additionally, in step S12, the lower surface brush 51 is washed again. Figure 20 Repeat steps S11 to S13 until the cleaning of the lower surface brush 51 is performed a specific number of times. Thus, the contamination level of both the outer region of the lower surface of the substrate W and the lower surface brush 51 can be set to 0%.

[0150] After the cleaning of the lower surface brush 51 is performed a specific number of times, and steps S9 to S13 are completed, the adsorption holding drive unit 22 is controlled by the adsorption control unit 9B to rotate the adsorption holding unit 21 at high speed, thereby drying the entire substrate W. Figure 13 (and step S14). After drying is complete, the upper holding devices 10A, 10B and cup 61 return to their initial state. Figure 14 Finally, the substrate W is moved out of the unit housing 2 by controlling the baffle drive unit 92 through the infeed / outfeed control unit 9I. Figure 15 (and step S15), to end the substrate cleaning process.

[0151] (5) Effect

[0152] In the substrate cleaning apparatus 1 of this embodiment, since the standby position of the lower surface brush 51 overlaps with the substrate W held by the lower holding device 20 in the vertical direction, the area occupied by the lower surface brush 51 is hardly increased even when it is larger. Therefore, the lower surface of the substrate W can be cleaned in a short time by using a larger lower surface brush 51.

[0153] Furthermore, since the cleaning of the lower surface of the substrate W and the cleaning of the lower surface brush 51 are performed during the cleaning of the upper surface of the substrate W by the upper surface cleaning device 70, the production capacity will not change even if the step of cleaning the lower surface brush 51 is included. Thus, the cleanliness of the lower surface brush 51 can be maintained without reducing the production capacity.

[0154] Furthermore, the lower surface brush 51 repeatedly moves up and down between the processing position and the standby position via the lower surface brush lifting drive unit 55b, performing multiple cleaning operations on the lower surface of the substrate W and the lower surface brush 51 itself. According to this configuration, compared to the case where the cleaning surface of the lower surface brush 51 is in contact with the lower surface of the substrate W for a prolonged period, the lower surface brush 51 can be cleaned in a shorter time. In addition, since it is not necessary to have the cleaning surface of the lower surface brush 51 in contact with the lower surface of the substrate W for a prolonged period, the consumption of the lower surface brush 51 can be minimized.

[0155] When cleaning the lower surface brush 51, cleaning liquid is sprayed onto the center of the lower surface brush 51 through the liquid nozzle 52a, and onto the ends of the lower surface brush 51 through the liquid nozzle 52b. According to this configuration, even if the lower surface brush 51 is relatively large, the entire lower surface brush 51 can be easily cleaned.

[0156] [2] Second Embodiment

[0157] (1) Composition of the substrate cleaning device

[0158] Regarding the substrate cleaning apparatus 1 of the second embodiment, the differences from the substrate cleaning apparatus 1 of the first embodiment will be explained. Figure 24 This is an enlarged cross-sectional view showing the area around the lower surface brush 51 of the substrate cleaning apparatus 1 in the second embodiment. Figure 24 As shown, the substrate cleaning apparatus 1 of this embodiment also includes a cleaning tank 100 disposed in a standby position. The cleaning tank 100 has a cup shape and stores cleaning liquid. In addition, the cleaning tank 100 houses a lower surface brush 51 located in the standby position.

[0159] The lower surface cleaning device 50 does not include the lifting support 54, and the lower surface brush 51 is mounted on the upper end of the rotation shaft of the lower surface brush rotation drive 55a. Furthermore, the lower surface cleaning device 50 replaces... Figure 16 Liquid nozzles 52a and 52b are included, while liquid nozzle 52c is included. Liquid nozzle 52c is supported by a support member (not shown) and connected to... Figure 3 The brush cleaning solution supply unit 57 supplies cleaning solution to the liquid nozzle 52c. The liquid nozzle 52c sprays the cleaning solution supplied by the brush cleaning solution supply unit 57 into the cleaning tank 100.

[0160] Furthermore, in this embodiment, Figure 12 The liquid nozzle 52 and the gas ejection section 53 are supported by a support member (not shown). The operation of the liquid nozzle 52 and the gas ejection section 53 in this embodiment is the same as that in the first embodiment.

[0161] Below the lower surface brush 51, on the rotation shaft of the lower surface brush rotation drive unit 55a, a flat closing part 110 is mounted. Additionally, an opening 101 is formed on the bottom surface of the cleaning tank 100 for inserting the rotation shaft of the lower surface brush rotation drive unit 55a. Cleaning liquid stored in the cleaning tank 100 is gradually discharged from the opening 101. The area of ​​the opening 101 is smaller than the bottom area of ​​the lower surface brush 51 and smaller than the area of ​​the closing part 110.

[0162] When the lower surface brush 51 descends to the standby position, the closing portion 110 leaves the bottom of the washing tank 100, and on the other hand, the bottom of the lower surface brush 51 contacts the upper part of the bottom surface of the washing tank 100 in such a way that it overlaps with the opening portion 101. This closes the opening portion 101. When the lower surface brush 51 rises to the processing position, the lower surface brush 51 leaves the bottom of the washing tank 100, and on the other hand, the closing portion 110 contacts the lower part of the bottom surface of the washing tank 100 in such a way that it overlaps with the opening portion 101. This closes the opening portion 101.

[0163] When the opening 101 is closed, the flow rate of the cleaning liquid discharged from the opening 101 is smaller than the flow rate of the cleaning liquid discharged from the opening 101 when it is not closed. In other words, the opening 101 may not be completely closed. Therefore, when the lower surface brush 51 is in the standby position, the bottom of the lower surface brush 51 may not be in firm contact with the upper part of the bottom surface of the cleaning tank 100. Furthermore, when the lower surface brush 51 is in the processing position, the closing part 110 may not be in firm contact with the lower part of the bottom surface of the cleaning tank 100.

[0164] (2) Operation of the substrate cleaning device

[0165] Figures 25-29 For the purpose of explanation Figure 24 A schematic diagram of the cleaning action of the lower surface brush 51. The substrate cleaning apparatus 1 of this embodiment and... Figures 4 to 15 The substrate cleaning apparatus 1 of the first embodiment shown operates substantially the same. Therefore, in Figures 25-29 in, omit Figure 12 The operation of the substrate cleaning device 1 is explained in addition to the cleaning action of the lower surface brush 51, but the cleaning of the upper surface of the substrate W is also performed in parallel.

[0166] like Figure 25 As shown, before cleaning the outer region of the lower surface of the substrate W, the lower surface brush 51 is stored in the cleaning tank 100 in a standby position. At this time, a portion of the cleaning solution used in the previous cleaning step of the lower surface brush 51 may remain in the cleaning tank 100. In this case, the cleaning solution stored in the cleaning tank 100 is gradually discharged from the opening 101.

[0167] Next, as Figure 26 As shown, the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W, causing the lower surface brush 51 to rise from the standby position to the upper processing position. Additionally, cleaning fluid is sprayed into the cleaning tank 100 from the liquid nozzle 52c. In this case, since the opening 101 is closed by the closing portion 110, the amount of cleaning fluid supplied to the cleaning tank 100 per unit time is greater than the amount of cleaning fluid discharged from the cleaning tank 100.

[0168] Next, as Figure 27 As shown, the lower surface brush 51 is rotated by the lower surface brush rotation drive unit 55a. At this time, from Figure 12 The liquid nozzle 52 sprays cleaning solution onto the lower surface of the substrate W, and from... Figure 12Gas is ejected from the gas ejection section 53 onto the lower surface of the substrate W. This cleans the outer region of the lower surface of the substrate W. Furthermore, during the cleaning of the outer region of the lower surface of the substrate W, cleaning liquid continues to be ejected from the liquid nozzle 52c and the opening 101 is closed by the closing section 110, causing the level of the cleaning liquid in the cleaning tank 100 to rise.

[0169] After cleaning the outer region of the lower surface of substrate W, as follows: Figure 28 As shown, the rotation of the lower surface brush 51 and the spraying of cleaning liquid from the liquid nozzle 52c are stopped. Furthermore, the lower surface brush 51 is lowered from the processing position to the lower standby position by moving its cleaning surface away from the outer region of the lower surface of the substrate W. In this case, the cleaning liquid is gradually discharged from the opening 101, but because the opening 101 is closed by the lower surface brush 51, a sufficient amount of cleaning liquid remains in the cleaning tank 100. Therefore, the lower surface brush 51 is immersed in the cleaning liquid stored in the cleaning tank 100.

[0170] Finally, as Figure 29 As shown, the lower surface brush 51 is rotated by the lower surface brush rotation drive unit 55a. In this case, a flow of cleaning liquid towards the outside is generated in the cleaning tank 100. As a result, the contaminants adhering to the lower surface brush 51 are efficiently removed, and the removed contaminants are discharged from the opening 101 together with the cleaning liquid. As a result, the lower surface brush 51 is cleaned. In this embodiment, the lower surface brush 51 can also be cleaned using ultrasonic cleaning.

[0171] Alternatively, a small amount of cleaning solution can be added to the cleaning solution. In this case, since the cleaning solution with added cleaning solution is stirred in the cleaning tank 100, the lower surface brush 51 can be cleaned efficiently with a small amount of cleaning solution. This reduces the consumption of cleaning solution. If the contaminant is particulate matter such as corrosion inhibitor, the added cleaning solution can be an alkaline aqueous solution. If the contaminant contains metallic components, the added cleaning solution can be an acidic aqueous solution.

[0172] Additionally, the liquid nozzle 52c stops spraying cleaning fluid when the lower surface brush 51 is in the standby position, but the implementation is not limited to this. The liquid nozzle 52c can also spray cleaning fluid when the lower surface brush 51 is in the standby position. Furthermore, the liquid nozzle 52c can also spray cleaning fluid during the period when the lower surface brush 51 moves up and down between the standby position and the processing position.

[0173] At Figure 26 In the middle, the rotation of the lower surface brush 51 can begin before the lower surface brush 51 moves to the processing position. Similarly, in Figure 29In this configuration, the rotation of the lower surface brush 51 can begin before the lower surface brush 51 moves to the standby position. That is, the lower surface brush 51 can also rotate during the movement between the standby position and the processing position. On the other hand, regarding... Figure 29 During the cleaning action of the lower surface brush 51, the lower surface brush 51 rotates in the standby position. However, if the lower surface brush 51 is thoroughly cleaned in the cleaning tank 100, the lower surface brush 51 may not rotate in the standby position.

[0174] (3) Effect

[0175] In the substrate cleaning apparatus 1 of this embodiment, since the standby position of the lower surface brush 51 overlaps vertically with the substrate W held by the lower holding device 20, the area occupied by the lower surface brush 51 is hardly increased even when it is larger. Therefore, the lower surface of the substrate W can be cleaned in a short time by using a larger lower surface brush 51. Therefore, even if a step of cleaning the lower surface brush 51 is provided, the production capacity will not change. Thus, the cleanliness of the lower surface brush 51 can be maintained without reducing the production capacity.

[0176] When cleaning the lower surface brush 51, the lower surface brush 51 is immersed in the cleaning solution stored in the cleaning tank 100. According to this configuration, even if the lower surface brush 51 is relatively large, the entire lower surface brush 51 can be easily cleaned. Furthermore, since it is not necessary to keep the cleaning surface of the lower surface brush 51 in contact with the lower surface of the substrate W for an extended period, the consumption of the lower surface brush 51 can be minimized.

[0177] (4) Variation Example

[0178] In this embodiment, the substrate cleaning apparatus 1 includes a closing portion 110, but the embodiment is not limited to this. Figure 30 This is an enlarged cross-sectional view showing the area near the lower surface brush 51 of the substrate cleaning apparatus 1 in the first variation example. Figure 30 As shown, in this variation, the area of ​​the opening 101 of the cleaning tank 100 is relatively small and slightly larger than the cross-sectional area of ​​the rotation axis of the lower surface brush rotation drive unit 55a. In this case, since the amount of cleaning liquid discharged from the cleaning tank 100 per unit time is small, the substrate cleaning apparatus 1 does not include a closing part 110.

[0179] Figures 31-33 This is an enlarged cross-sectional view showing the area near the lower surface brush 51 of the substrate cleaning apparatus 1 in the second variation example. Figure 31 As shown, the substrate cleaning apparatus 1 of this variation further includes a cleaning tank lifting drive unit 55d and an outer tank 120. The cleaning tank lifting drive unit 55d includes a stepper motor or a cylinder, based on... Figure 3 The control of the lower surface cleaning control unit 9E causes the cleaning tank 100 to be relative to... Figure 1 The movable support unit 55 is raised and lowered.

[0180] The washing tank lifting drive unit 55d has a hollow drive shaft. The drive shaft of the washing tank lifting drive unit 55d is mounted on the lower part of the bottom surface of the washing tank 100 in a manner that surrounds the opening 101 and the rotation shaft of the lower surface brush rotation drive unit 55a. The outer tank 120 has a cup shape and is arranged in the standby position to surround the washing tank 100. An opening 121 is formed on the bottom surface of the outer tank 120 for inserting the rotation shaft of the lower surface brush rotation drive unit 55a and the drive shaft of the washing tank lifting drive unit 55d.

[0181] During cleaning of the outer region of the lower surface of substrate W, such as Figure 32 As shown, the lower surface brush 51 passes through Figure 3 The lower surface brush lifting drive unit 55b rises from the standby position to the processing position. Meanwhile, the cleaning tank 100 rises from the standby position via the cleaning tank lifting drive unit 55d in a manner close to the substrate W. By rotating the lower surface brush 51 in this state, the outer region of the lower surface of the substrate W is cleaned. Furthermore, any cleaning liquid splashed from the lower surface brush 51 is caught by the outer tank 120. This prevents contamination of the periphery of the cleaning tank 100.

[0182] Additionally, after cleaning the outer region of the lower surface of substrate W, as follows: Figure 33 As shown, the lower surface brush 51 can be lowered from the processing position by the lower surface brush lifting drive unit 55b until the cleaning surface of the lower surface brush 51 is below the height of the upper end of the cleaning tank 100. In this state, the liquid nozzle 52c can spray a larger amount of cleaning liquid than the amount of cleaning liquid discharged from the cleaning tank 100 per unit time into the cleaning tank 100. In this case, the cleaning liquid overflows from the cleaning tank 100 and forms a column of cleaning liquid between the substrate W and the cleaning surface of the lower surface brush 51. The lower surface brush 51 is cleaned by the column of cleaning liquid. As a result, the amount of cleaning liquid used for cleaning the lower surface brush 51 can be reduced.

[0183] Figure 34 This is an enlarged cross-sectional view showing the area near the lower surface brush 51 of the substrate cleaning apparatus 1 in the third variation. Figure 34 As shown, the substrate cleaning apparatus 1 of this variation further includes a cleaning tank rotation drive unit 55e. The cleaning tank rotation drive unit 55e includes, for example, a motor, and is based on... Figure 9 The washing tank 100 is rotated by the lower surface cleaning control unit 9E, which is controlled by power transmission components such as belts and pulleys.

[0184] Furthermore, multiple drain holes 102 are formed on the side wall of the washing tank 100. When washing the lower surface brush 51, the washing tank 100 is rotated by the washing tank rotation drive unit 55e. In this case, the washing liquid in the washing tank 100 is discharged from the multiple drain holes 102, creating an outward flow of washing liquid within the washing tank 100. As a result, contaminants adhering to the lower surface brush 51 are efficiently removed, and the removed contaminants are discharged from the drain holes 102 together with the washing liquid. Consequently, the lower surface brush 51 is cleaned.

[0185] In this variation, when cleaning the lower surface brush 51, the lower surface brush 51 can be rotated in the opposite direction to the rotation direction of the cleaning tank 100. In this case, it is easier to generate an outward flow of cleaning liquid within the cleaning tank 100. Therefore, contaminants adhering to the lower surface brush 51 can be removed more efficiently. Furthermore, in this variation, since an outward flow of cleaning liquid can be easily generated within the cleaning tank 100, a drain hole 102 may not be necessary in the cleaning tank 100.

[0186] [3] Other implementation methods

[0187] (1) In the above embodiment, after cleaning the central region of the lower surface of the substrate W in the upper holding devices 10A and 10B, cleaning the outer region of the lower surface of the substrate W and cleaning the lower surface brush 51 are performed in the lower holding device 20. However, the embodiment is not limited to this. It is also possible to clean the outer region of the lower surface of the substrate W and the lower surface brush 51 in the lower holding device 20, and then clean the central region of the lower surface of the substrate W in the upper holding devices 10A and 10B. Alternatively, cleaning the central region of the lower surface of the substrate W may not be performed. In this case, the substrate cleaning apparatus 1 does not include the upper holding devices 10A and 10B and the transfer device 40.

[0188] (2) In the described embodiment, the upper surface of the substrate W is cleaned using a spray nozzle 73, but the embodiment is not limited to this. The upper surface of the substrate W may also be cleaned using a brush or a cleaning fluid nozzle that sprays cleaning fluid. Alternatively, the upper surface of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include an upper surface cleaning device 70. Similarly, the outer peripheral end of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include an end cleaning device 80.

[0189] (3) In the above embodiment, the substrate cleaning apparatus 1 includes a control device 9, but the embodiment is not limited thereto. If the substrate cleaning apparatus 1 is configured to be controlled by an external information processing device, the substrate cleaning apparatus 1 may not include a control device 9.

[0190] (4) In the first embodiment, the lower surface brush 51 is cleaned by cleaning fluid sprayed from liquid nozzles 52a and 52b, but the embodiment is not limited to this. The substrate cleaning apparatus 1 may be the same as in the second embodiment, but instead of liquid nozzles 52a and 52b, it may include a liquid nozzle 52c and a cleaning tank 100. In this case, the lower surface brush 51 may be cleaned in the cleaning tank 100 by cleaning fluid sprayed from liquid nozzle 52c. In addition, the cleaning of the outer region of the lower surface of the substrate W in the processing position and the cleaning of the lower surface brush 51 in the standby position may be repeated, but they may not be repeated.

[0191] [4] Correspondence between the constituent elements of the claims and the parts of the embodiments

[0192] Hereinafter, examples of the correspondence between the constituent elements of the claims and the constituent elements of the embodiments will be described; however, the present invention is not limited to the following examples. Various other constituent elements having the structure or function described in the claims may also be used as constituent elements of the claims.

[0193] In the described embodiment, substrate W is an example of a substrate, adsorption and holding part 21 is an example of a substrate holding part, lower surface brush 51 is an example of a lower surface brush, liquid nozzles 52a, 52b or cleaning tank 100 is an example of a brush cleaning part, and lower surface brush lifting drive part 55b is an example of a lower surface brush lifting drive part. Substrate cleaning device 1 is an example of a substrate cleaning device, upper surface cleaning device 70 is an example of an upper surface cleaning part, liquid nozzles 52a and 52b are examples of a first liquid nozzle and a second liquid nozzle, respectively, and cleaning tank 100 is an example of a cleaning tank.

Claims

1. A substrate cleaning apparatus comprising: a substrate holding section that holds a substrate in a horizontal posture; a lower surface brush that cleans a lower surface of the substrate held by the substrate holding section at a processing position; a brush cleaning section that cleans the lower surface brush at a standby position that overlaps the substrate held by the substrate holding section in a vertical direction and is located below the processing position; a lifting support section on which the lower surface brush and the brush cleaning section are installed; and a lower surface brush lifting drive section that lifts the lower surface brush between the processing position and the standby position by lifting the lifting support section; and the brush cleaning section is lifted together with the lower surface brush by lifting of the lifting support section, and the lower surface brush is cleaned by spraying cleaning liquid to the lower surface brush at least during a period in which the lower surface brush is away from the substrate.

2. The substrate cleaning apparatus according to claim 1, further comprising: an upper surface cleaning section that cleans an upper surface of the substrate held by the substrate holding section; and the lower surface brush lifting drive section lifts the lower surface brush between the processing position and the standby position in a manner that performs cleaning of the lower surface of the substrate and cleaning of the lower surface brush during a period in which the upper surface of the substrate is cleaned by the upper surface cleaning section.

3. The substrate cleaning apparatus according to claim 1 or 2, wherein the lower surface brush lifting drive section repeatedly lifts the lower surface brush between the processing position and the standby position in a manner that performs cleaning of the lower surface of the substrate and cleaning of the lower surface brush a plurality of times.

4. The substrate cleaning apparatus according to claim 1 or 2, wherein the brush cleaning section includes a first liquid nozzle that sprays cleaning liquid to a central portion of the lower surface brush, and a second liquid nozzle that sprays cleaning liquid to an end portion of the lower surface brush.

5. A substrate cleaning apparatus comprising: a substrate holding section that holds a substrate in a horizontal posture; a lower surface brush that cleans a lower surface of the substrate held by the substrate holding section at a processing position; a brush cleaning section that cleans the lower surface brush at a standby position that overlaps the substrate held by the substrate holding section in a vertical direction and is located below the processing position; and a lower surface brush lifting drive section that lifts the lower surface brush between the processing position and the standby position; and the brush cleaning section includes a cleaning tank that stores cleaning liquid with which the lower surface brush is dipped.

6. The substrate cleaning apparatus according to claim 1, 2 or 5, wherein the substrate holding section and the lower surface brush each have a circular outer shape; and a diameter of the lower surface brush is larger than a diameter of the substrate holding section.

7. The substrate cleaning apparatus according to claim 1, 2 or 5, wherein the substrate and the lower surface brush each have a circular outer shape; and a diameter of the lower surface brush is larger than 1 / 3 of a diameter of the substrate.

8. A substrate cleaning method comprising: holding a substrate in a horizontal posture by a substrate holding section; ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ In a processing position, a lower surface of a substrate held by a substrate holding section is cleaned by a lower surface brush attached to a lower surface of a lifting support section; In a standby position in which the substrate held by the substrate holding section overlaps in a vertical direction and is positioned below the processing position, the lower surface brush is cleaned by a brush cleaning section attached to the lifting support section; and The lower surface brush is caused to be lifted between the processing position and the standby position by lifting the lifting support section; The brush cleaning section is lifted together with the lower surface brush by lifting the lifting support section; The cleaning of the lower surface brush includes ejecting a cleaning liquid to the lower surface brush by the brush cleaning section at least during a period in which the lower surface brush is separated from the substrate.

9. The substrate cleaning method according to claim 8, further comprising: an upper surface of the substrate held by the substrate holding section is cleaned by an upper surface cleaning section; and The cleaning of the lower surface of the substrate and the cleaning of the lower surface brush are performed during the cleaning of the upper surface of the substrate by the upper surface cleaning section.

10. The substrate cleaning method according to claim 8 or 9, wherein The lower surface brush is repeatedly caused to be lifted between the processing position and the standby position in a manner in which the cleaning of the lower surface of the substrate and the cleaning of the lower surface brush are performed a plurality of times.

11. The substrate cleaning method according to claim 8 or 9, wherein The cleaning of the lower surface brush by the brush cleaning section includes ejecting a cleaning liquid to a central portion of the lower surface brush by a first liquid nozzle and ejecting a cleaning liquid to an end portion of the lower surface brush by a second liquid nozzle.

12. A substrate cleaning method comprising: a substrate is held in a horizontal posture by a substrate holding section; a lower surface of the substrate held by the substrate holding section is cleaned by a lower surface brush in a processing position; the lower surface brush is cleaned by a brush cleaning section in a standby position in which the substrate held by the substrate holding section overlaps in a vertical direction and is positioned below the processing position; and the lower surface brush is caused to be lifted between the processing position and the standby position; The cleaning of the lower surface brush by the brush cleaning section includes immersing the lower surface brush in a cleaning liquid stored in a cleaning tank.

13. The substrate cleaning method according to claim 8, 9 or 12, wherein The substrate holding section and the lower surface brush each have a circular outer shape; A diameter of the lower surface brush is larger than a diameter of the substrate holding section.

14. The substrate cleaning method according to claim 8, 9 or 12, wherein The substrate and the lower surface brush each have a circular outer shape; A diameter of the lower surface brush is larger than 1 / 3 of a diameter of the substrate.

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