Display device and manufacturing method thereof

Abstract

The present application relates to a display device and a manufacturing method thereof, wherein the display device comprises: a display panel; a COF film and a first binding gasket, which are arranged on one side of the display panel; a second binding gasket, which is arranged on the side of the COF film away from the display panel; a connection structure, which connects the first binding gasket and the second binding gasket; a planarization layer, which is arranged on the side of the first binding gasket and the second binding gasket away from the display panel and covers the connection structure and at least part of the COF film; and a support plate, which is arranged on the side of the planarization layer away from the display panel. Thus, the connection structure used to bind the first binding gasket and the second binding gasket can be covered by the support plate, thereby improving the reliability and water and oxygen resistance of the binding between the display panel and the COF film in the display device.

Description

[Technical field]

[0001] The present application relates to the field of display technology, and in particular to a display device and a manufacturing method thereof. [Background technology]

[0002] Currently, in order to achieve narrow-border display, the backplane and chip on film (COF) are generally attached to the back of the display panel, and then the binding pad on the display panel is connected to the binding pad on the COF by laser drilling to reduce the border of the display device.

[0003] However, the reliability and water and oxygen resistance of the binding between the display panel and the COF in the existing display device still need to be improved. [Summary of the invention]

[0004] The purpose of the present application is to provide a display device and a manufacturing method thereof, so as to improve the reliability and water and oxygen resistance of the binding between the display panel and the COF in the display device.

[0005] In order to solve the above problems, an embodiment of the present application provides a display device, which includes: a display panel; a chip-on-cover film and a first binding gasket, which are arranged on one side of the display panel; a second binding gasket, which is arranged on the side of the chip-on-cover film away from the display panel; a connecting structure, which connects the first binding gasket and the second binding gasket; a planarization layer, which is arranged on the side of the first binding gasket and the second binding gasket away from the display panel, and covers the connecting structure and at least part of the chip-on-cover film; and a support plate, which is arranged on the side of the planarization layer away from the display panel.

[0006] The display device further includes: a back plate located between the support plate and the planarization layer.

[0007] The display device further includes: a flexible circuit board and an integrated circuit chip, which are electrically connected to the chip-on-film.

[0008] The flip chip film includes a back bending area, the flexible circuit board and the integrated circuit chip are connected to the back bending area, and the flexible circuit board and the integrated circuit chip are arranged on the side of the support plate away from the planarization layer through the back bending area.

[0009] The flexible circuit board and the integrated circuit chip are arranged on a side of the chip-on-cover film away from the display panel, and an opening is arranged on the support plate, and the opening is used to expose the integrated circuit chip.

[0010] The display device further includes: a heat dissipation layer, which is arranged on a side of the support plate away from the planarization layer and is connected to the integrated circuit chip through the opening.

[0011] The display device further includes: a polarizer, which is arranged on a side of the display panel away from the chip-on-cover film; and a cover plate, which is arranged on a side of the polarizer away from the display panel.

[0012] In order to solve the above problems, an embodiment of the present application also provides a method for manufacturing a display device, which includes: providing a display panel and a chip-on-chip film, wherein a first binding gasket is provided on one side of the display panel, and a second binding gasket is provided on one side of the chip-on-chip film; fixing the chip-on-chip film on the side of the display panel where the first binding gasket is provided, and making the second binding gasket located on the side of the chip-on-chip film away from the display panel; forming a connecting structure, which connects the first binding gasket and the second binding gasket; forming a planarizing layer on the side of the first binding gasket and the second binding gasket away from the display panel, wherein the planarizing layer covers the connecting structure and at least part of the chip-on-chip film; and forming a support plate on the side of the planarizing layer away from the display panel.

[0013] Before forming the support plate on the side of the planarization layer away from the display panel, the method further includes: forming a backplane on the side of the planarization layer away from the display panel, and the support plate is formed on the side of the backplane away from the planarization layer.

[0014] The display device further comprises: providing a flexible circuit board and an integrated circuit chip; and electrically connecting the flexible circuit board and the integrated circuit chip to the chip-on-chip film.

[0015] The beneficial effect of the present application is that, different from the prior art, the display device and the manufacturing method thereof provided by the present application connect the first binding gasket on the display panel with the second binding structure on the chip-on-chip film by utilizing a connecting structure, and enable the connecting structure to be covered by a supporting plate, thereby improving the reliability and water and oxygen resistance of the binding between the display panel and the chip-on-chip film in the display device.

Brief Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 is a schematic cross-sectional structural diagram of a display device provided in an embodiment of the present application;

[0018] Figure 2 is another schematic cross-sectional structure diagram of a display device provided in an embodiment of the present application;

[0019] Figure 3 is another schematic cross-sectional structure diagram of a display device provided in an embodiment of the present application;

[0020] Figure 4 is a schematic cross-sectional structural diagram of a display device provided by another embodiment;

[0021] Figure 5 is a flow chart of a method for manufacturing a display device provided in an embodiment of the present application;

[0022] Figure 6 is a schematic diagram of the cross-sectional structure after S12 is completed provided in an embodiment of the present application;

[0023] Figure 7 is a schematic diagram of the cross-sectional structure after S13 is completed provided in an embodiment of the present application;

[0024] Figure 8 is a schematic diagram of the cross-sectional structure after S14 is completed provided in an embodiment of the present application;

[0025] Fig. 9 It is a schematic diagram of the cross-sectional structure after S15 provided in the embodiment of the present application is completed. [Specific implementation method]

[0026] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present application.

[0027] See also Figure 1 , Figure 1 is a schematic diagram of the cross-sectional structure of a display device provided in an embodiment of the present application. Figure 1 As shown, the display device 100 includes a display panel 101, a first binding gasket 102, a chip-on-cover film 103, a second binding gasket 104, a connecting structure 105, a planarizing layer 106 and a supporting plate 107, wherein the chip-on-cover film 103 and the first binding gasket 102 are arranged on one side of the display panel 101, the second binding gasket 104 is arranged on the side of the chip-on-cover film 103 away from the display panel 101, the connecting structure 105 connects the first binding gasket 102 and the second binding gasket 104, the planarizing layer 106 is arranged on the side of the first binding gasket 102 and the second binding gasket 104 away from the display panel 101 and covers the connecting structure 105 and at least part of the chip-on-cover film 103, and the supporting plate 107 is arranged on the side of the planarizing layer 106 away from the display panel 101.

[0028] Specifically, the first binding gasket 102 and the chip-on-film 103 may be disposed on the back of the display panel 101, and the orthographic projection of the first binding gasket 102 on the display panel 101 may not overlap with the orthographic projection of the chip-on-film 103 on the display panel 101. In addition, it can be understood that the back of the display panel 101 is opposite to the front of the display panel 101, and the front of the display panel 101 is the light emitting surface of the display panel 101 for display.

[0029] In a specific example, if Figure 1 As shown, the first binding pad 102 can be disposed at the edge region of the back of the display panel 101, and the COF 103 can be disposed at other regions of the back of the display panel 101 except the edge region. Furthermore, in a specific implementation, the second binding pad 104 can be disposed at the edge of one side of the COF 103 close to the first binding pad 102, and can correspond to the position of the first binding pad 102, so as to reduce the distance between the first binding pad 102 and the second binding pad 104 in the direction parallel to the display panel 101, which is beneficial to shorten the wiring length required to connect the first binding pad 102 and the second binding pad 104.

[0030] In a specific embodiment, Figure 1 As shown, the display device 100 may further include a first adhesive layer 108, which is located between the COF 103 and the display panel 101 and can connect the COF 103 and the display panel 101. In one example, the first adhesive layer 108 may be a double-sided adhesive.

[0031] In a specific embodiment, Figure 1 As shown, the display device 100 may further include a filling portion 109, which is filled between the edge region of the display panel 101 and the planarization layer 106 to fill the height of the step region formed by the step difference between the display panel 101 and the COF 103. In addition, during implementation, the filling portion 109 may also fill the region between the connection structure 105 and the display panel 101 to provide support for the connection structure 105, thereby improving the stability of the binding between the display panel 101 and the COF 103 in the display device 100.

[0032] In a specific embodiment, the material of the first binding pad 102 , the material of the second binding pad 104 , and the material of the connection structure 105 may be a conductive material such as metal, for example, aluminum.

[0033] In a specific embodiment, Figure 1As shown, the orthographic projection of the planarization layer 106 on the display panel 101 may include the orthographic projection of the first binding gasket 102 on the display panel 101, the orthographic projection of the filling portion 109 on the display panel 101, the orthographic projection of the connection structure 105 on the display panel 101, the orthographic projection of the second binding gasket 104 on the display panel 101, and the orthographic projection of the COF 103 on the display panel 101. Specifically, the surface of the planarization layer 106 facing away from the display panel 101 may be a flat surface, and its material may be a double-sided adhesive film. In a specific example, the planarization layer 106 may be a double-sided adhesive.

[0034] Accordingly, the orthographic projection of the support plate 107 on the display panel 101 may also include the orthographic projection of the first binding gasket 102 on the display panel 101, the orthographic projection of the filling portion 109 on the display panel 101, the orthographic projection of the connection structure 105 on the display panel 101, the orthographic projection of the second binding gasket 104 on the display panel 101, and the orthographic projection of the chip-on-film 103 on the display panel 101. In addition, in a specific implementation, the orthographic projection of the support plate 107 on the display panel 101 may completely overlap with the orthographic projection of the planarization layer 106 on the display panel 101. Thereby, it is ensured that the first binding gasket 102, the second binding gasket 104 and the connecting structure 105 in the above-mentioned display device 100 used for binding the display panel 101 and the chip-on-chip film 103 can be at least covered by the above-mentioned planarization layer 106 and / or the above-mentioned support plate 107, thereby avoiding the problem of uneven display of the above-mentioned display device 100, and also improving the reliability, mechanical strength, water and oxygen resistance, shielding and anti-interference capabilities of the above-mentioned display device 100 at the binding position between the display panel 101 and the chip-on-chip film 103.

[0035] In some embodiments, Figure 2 and Figure 3 As shown, the display device 100 may further include a flexible printed circuit board (FPC) 110 and an integrated circuit chip (IC) 111 electrically connected to the chip-on-film 103. The integrated circuit chip 111 is used to provide a display driving signal to the display panel 101 through the chip-on-film 103, and the flexible printed circuit board 110 and the display panel 101 may transmit signals through the chip-on-film 103.

[0036] In a specific embodiment, Figure 2As shown, the flexible circuit board 110 and the integrated circuit chip 111 can be arranged on the side of the chip-on-chip film 103 away from the display panel 101, so that the display device 100 can have a narrow frame without bending the chip-on-chip film 103 and the display panel 101.

[0037] Specifically, in order to ensure that the integrated circuit chip 111 can have a good heat dissipation effect, as Figure 2 As shown, the planarization layer 106 and the support plate 107 may be provided with a first opening at a position corresponding to the integrated circuit chip 111, so that the integrated circuit chip 111 can be exposed from the side of the support plate 107 away from the display panel 101. In addition, in order to ensure a good heat dissipation effect on the flexible circuit board 110, the planarization layer 106 and the support plate 107 may be provided with a second opening at a position corresponding to the flexible circuit board 110, so that the flexible circuit board 110 can be exposed from the side of the support plate 107 away from the display panel 101.

[0038] Furthermore, in a specific implementation, the display device 100 may further include a heat dissipation layer (not shown in the figure), which may be provided on the side of the support plate 107 away from the planarization layer 106, and may be connected to the integrated circuit chip 111 through the first opening to further improve the heat dissipation effect of the integrated circuit chip 111. In addition, the heat dissipation layer may also be connected to the flexible circuit board 110 through the second opening to further improve the heat dissipation effect of the flexible circuit board 110. The material of the heat dissipation layer may include thermally conductive materials such as copper and stainless steel, and in a specific example, the heat dissipation layer may be copper foil.

[0039] In another specific embodiment, Figure 3 As shown, the COF 103 may include a backbend region 103A, and the flexible circuit board 110 and the integrated circuit chip 111 may be disposed on the side of the support plate 107 away from the planarization layer 106 through the backbend region 103A of the COF 103. Specifically, the backbend region 103A of the COF 103 may be bent in a direction away from the display panel 101 to the side of the support plate 107 away from the planarization layer 106, so as to fix the flexible circuit board 110 and the integrated circuit chip 111 on the side of the support plate 107 away from the planarization layer 106, so that the narrow frame of the display device 100 can be achieved by only bending the COF 103.

[0040] And, in specific implementation, Figure 3As shown, the display device 100 may further include a wiring layer 113, and the wiring layer 113 may connect the edge 103B of the COF 103 located on the side of the support plate 107 away from the planarization layer 106 and the integrated circuit chip 111, and the wiring layer 113 may also be connected to the edge of the flexible circuit board 110. Specifically, the wiring layer 113 may be located between the edge 103B of the COF 103 and the support plate 107, and the integrated circuit chip 111 may be located on the side of the wiring layer 113 away from the support plate 107.

[0041] Specifically, Figure 3 As shown, the display device 100 may further include a binding protection glue layer 114 , and the binding protection glue layer 114 may cover the connection between the edge 103B of the COF 103 and the wiring layer 113 to protect it.

[0042] Specifically, Figure 3 As shown, the display device 100 may further include a second adhesive layer 112 , and the second adhesive layer 112 may bond and fix the flexible circuit board 110 and the wiring layer 113 to a side of the support plate 107 away from the planarization layer 106 .

[0043] In some embodiments, Figure 3 As shown, the display device 100 may further include a back plate 115 , and the back plate 115 is located between the support plate 107 and the planarization layer 106 to improve the strength of the display device 100 .

[0044] In the above embodiment, if Figure 2 and Figure 3 As shown, the display device 100 may further include a polarizer 116 and a cover plate 117 , wherein the polarizer 116 may be disposed on a side of the display panel 101 away from the COF 103 , and the cover plate 117 may be disposed on a side of the polarizer 116 away from the display panel 101 .

[0045] In some specific embodiments, Figure 2 and Figure 3 As shown, the display device 100 may further include a light shielding layer 118, and the orthographic projection of the light shielding layer 118 on the display panel 101 may be arranged around the edge of the display panel 101 to define the boundary of the display area of ​​the display device 100. The light shielding layer 118 may be made of a light shielding material such as black ink.

[0046] In some specific embodiments, Figure 2 and Figure 3As shown, the display device 100 may further include a third adhesive layer 119, which may be disposed between the polarizer 116 and the cover plate 117 to bond and fix the polarizer 116 and the cover plate 117 together. The third adhesive layer 119 may be specifically an optical adhesive.

[0047] In the above embodiment, the display panel 101 may be but is not limited to an OLED (Organic Light-Emitting Display) display panel, and the display device 100 may be but is not limited to a television, a laptop computer, a tablet computer, a wearable display device (such as a smart bracelet, a smart watch, etc.), a mobile phone, a virtual reality device, an augmented reality device, a car display, an advertising light box, and any other product or component with a display function.

[0048] It should be noted that if Figure 4 As shown, in the display device 200 provided in other embodiments, since the back plate 215 and the support plate 207 are attached to the back of the display panel 201, and the chip-on-chip film 203 is attached to the side of the support plate 207 away from the display panel 201 by the double-sided tape 206, this will cause the height of the step area formed by the step difference between the display panel 201 and the chip-on-chip film 203 to be too large after the display panel 201 and the chip-on-chip film 203 are bound by using the first binding gasket 202, the second binding gasket 204 and the connecting structure 205, which will further cause the step difference that needs to be filled when forming the filling portion 209 by the glue dispensing process to be too large, which will increase the difficulty of glue dispensing and the difficulty of making binding wiring. Furthermore, it can be understood that in the display device 100 provided in the present embodiment, by arranging the planarizing layer 106 and the supporting plate 107 on the side of the chip-on-chip film 103 away from the display panel 101, and making the planarizing layer 106 and the supporting plate 107 cover the entire surface of one side of the display panel 101, it is possible to reduce not only the difficulty of glue dispensing and the difficulty of making binding wiring, but also the glue dispensing area and the glue dispensing amount are greatly reduced, thereby reducing the cost. At the same time, the volume change caused during curing is small, which can avoid taste problems or display abnormalities. In addition, it can also avoid the problem of uneven display of the above-mentioned display device 100, and can also improve the reliability, mechanical strength, water and oxygen resistance, shielding and anti-interference capabilities of the above-mentioned display device 100 at the binding position between the display panel 101 and the chip-on-chip film 103.

[0049] From the above, it can be seen that the display device provided in this embodiment connects the first binding gasket on the display panel with the second binding structure on the chip-on-film by utilizing a connecting structure, and enables the connecting structure to be covered by the support plate, thereby improving the reliability and water and oxygen resistance of the binding between the display panel and the chip-on-film in the display device.

[0050] See also Figure 5 , Figure 5 This is a flow chart of the method for manufacturing a display device provided in an embodiment of the present application. Please also refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 , Figure 2 and Figure 3 1 is a schematic diagram of the structure of a display device 100 manufactured by the method for manufacturing a display device provided in an embodiment of the present application. Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the specific process of the manufacturing method of the display device 100 provided in this embodiment can be as follows:

[0051] S 11 : providing a display panel 101 and a COF 103 , wherein a first binding gasket 102 is disposed on one side of the display panel 101 , and a second binding gasket 104 is disposed on one side of the COF 103 .

[0052] S 12 : The chip-on-film 103 is fixedly disposed on the side of the display panel 101 where the first binding pad 102 is disposed, and the second binding pad 104 is located on the side of the chip-on-film 103 away from the display panel 101 .

[0053] The cross-sectional structure diagram after the completion of S12 can be as follows: Figure 6 shown.

[0054] Specifically, the first binding pad can be disposed on one side of the display panel 101, and the second binding pad 104 and the protective film 120 can be disposed on one side of the chip-on-film 103, and then the chip-on-film 103 is fixedly disposed on the side of the display panel 101 where the first binding pad 102 is disposed, and the second binding pad 104 is located on the side of the chip-on-film 103 away from the display panel 101. In a specific example, the chip-on-film 103 can be attached to the side of the display panel 101 where the first binding pad 102 is disposed through the first adhesive layer 108.

[0055] In some embodiments, the manufacturing method of the display device 100 may further include: providing a flexible circuit board 110 and an integrated circuit chip 111 , and the flexible circuit board 110 and the integrated circuit chip 111 are connected to the COF 103 .

[0056] S 13 : forming a connection structure 105 , wherein the connection structure 105 connects the first binding gasket 102 and the second binding gasket 104 .

[0057] The cross-sectional structure diagram after the completion of S13 can be as follows: Figure 7 shown.

[0058] Specifically, the connection structure 105 may be formed by a binding process, and the filling portion 109 may be formed by a glue dispensing process.

[0059] S 14 : forming a planarization layer 106 on the side of the first binding pad 102 and the second binding pad 104 away from the display panel 101 , wherein the planarization layer 106 covers the connection structure 105 and at least a portion of the COF 103 .

[0060] The cross-sectional structure diagram after the completion of S14 can be as follows: Figure 8 shown.

[0061] Specifically, after forming the connection structure 105 and the filling portion 109 , the protection film 120 may be removed from the COF 103 , and the planarization layer 106 may be formed on the side of the first binding pad 102 and the second binding pad 104 away from the display panel 101 .

[0062] S 15 : forming a support plate 107 on a side of the planarization layer 106 facing away from the display panel 101 .

[0063] The schematic diagram of the cross-sectional structure after the completion of S15 can be as follows: Fig. 9 shown.

[0064] Specifically, before forming the support plate 107 , the method for manufacturing the display device may further include: forming a back plate 115 on the side of the planarization layer 106 away from the display panel 101 , and accordingly, the support plate 107 may be formed on the side of the back plate 115 away from the planarization layer 106 .

[0065] In some specific embodiments, Figure 3 As shown, the above-mentioned flip chip film 103 may include a back bending area 103A, and, after the above-mentioned S14, the manufacturing method of the above-mentioned display device 100 may further include: setting the above-mentioned flexible circuit board 110 and the above-mentioned integrated circuit chip 111 on the side of the above-mentioned support plate 107 away from the above-mentioned planarization layer 106 through the back bending area 103A of the above-mentioned flip chip film 103.

[0066] In other specific embodiments, Figure 2 As shown, the flexible circuit board 110 and the integrated circuit chip 111 may be disposed on a side of the COF 103 away from the display panel 101. Furthermore, after S14, the manufacturing method of the display device 100 may further include: forming a first opening on the support plate 107, the first opening being used to expose the integrated circuit chip 111.

[0067] Specifically, after forming the first opening, the manufacturing method of the display device 100 may further include: forming a heat dissipation layer on a side of the support plate 107 away from the planarization layer, the heat dissipation layer being connected to the integrated circuit chip 111 through the first opening.

[0068] It should be noted that the specific structure of the display device in this embodiment can refer to the specific implementation in the above-mentioned embodiment of the display device, so it will not be repeated here.

[0069] As can be seen from the above, the manufacturing method of the display device provided in the present embodiment provides a display panel and a chip-on-cover film, a first binding gasket is provided on one side of the display panel, and a second binding gasket is provided on one side of the chip-on-cover film, and then the chip-on-cover film is fixedly arranged on the side of the display panel provided with the first binding gasket, and the second binding gasket is located on the side of the chip-on-cover film away from the display panel, and then a connecting structure is formed, the connecting structure connects the first binding gasket and the second binding gasket, and a planarizing layer is formed on the side of the first binding gasket and the second binding gasket away from the display panel, the planarizing layer covers the connecting structure and at least part of the chip-on-cover film, and then a support plate is formed on the side of the planarizing layer away from the display panel, so that the connecting structure used to bind the first binding gasket and the second binding gasket can be covered by the support plate, thereby improving the reliability and water and oxygen resistance of the binding between the display panel and the chip-on-cover film in the display device.

[0070] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0071] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display device, characterized in that: include: Display panel; A chip-on-chip film and a first binding gasket are provided on one side of the display panel; A second binding gasket is provided on a side of the chip-on-film away from the display panel; A connecting structure connecting the first binding pad and the second binding pad; a planarization layer, disposed on a side of the first binding pad and the second binding pad away from the display panel, and covering the connection structure and at least a portion of the chip-on-film; The support plate is arranged on a side of the planarization layer away from the display panel.

2. The display device according to claim 1, characterized in that The display device further includes: A back plate is located between the support plate and the planarization layer.

3. The display device according to claim 1, characterized in that The display device further includes: The flexible circuit board and the integrated circuit chip are electrically connected to the chip-on-film.

4. The display device according to claim 3, characterized in that: The chip-on-film comprises a back-bending region, and the flexible circuit board and the integrated circuit chip are arranged on a side of the support plate away from the planarization layer through the back-bending region.

5. The display device according to claim 3, characterized in that: The flexible circuit board and the integrated circuit chip are arranged on a side of the chip-on-film away from the display panel, and an opening is arranged on the support plate, and the opening is used to expose the integrated circuit chip.

6. The display device according to claim 5, characterized in that: The display device further includes: The heat dissipation layer is arranged on a side of the support plate away from the planarization layer and is connected to the integrated circuit chip through the opening.

7. The display device according to claim 1, characterized in that The display device further includes: A polarizer, disposed on a side of the display panel away from the chip-on-film; The cover plate is arranged on a side of the polarizer away from the display panel.

8. A method for manufacturing a display device, characterized in that: include: A display panel and a chip-on-chip film are provided, wherein a first binding gasket is provided on one side of the display panel, and a second binding gasket is provided on one side of the chip-on-chip film; The chip-on-film is fixedly mounted on a side of the display panel where the first binding pad is mounted, and the second binding pad is located on a side of the chip-on-film away from the display panel; forming a connection structure, the connection structure connecting the first binding pad and the second binding pad; forming a planarization layer on a side of the first binding pad and the second binding pad facing away from the display panel, wherein the planarization layer covers the connection structure and at least a portion of the chip-on-film; A support plate is formed on a side of the planarization layer away from the display panel.

9. The method for manufacturing a display device according to claim 8, characterized in that: Before forming a support plate on a side of the planarization layer away from the display panel, the method further includes: A back plate is formed on a side of the planarization layer away from the display panel, and the support plate is formed on a side of the back plate away from the planarization layer.

10. The method for manufacturing a display device according to claim 8, characterized in that: The display device further includes: Provide flexible circuit boards and integrated circuit chips; The flexible circuit board and the integrated circuit chip are electrically connected to the chip on film.

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