Manufacturing apparatus of mask device, recording medium, manufacturing method of mask device, and mask device

Abstract

The present application provides a manufacturing device of a mask device, a recording medium, a manufacturing method of a mask device, and a mask device. The mask device can include a frame including a first edge and a second edge facing each other in a first direction with an opening therebetween, and a third edge and a fourth edge facing each other in a second direction intersecting the first direction with an opening therebetween; and a mask including end portions fixed to the first edge and the second edge. The manufacturing device can include a pressing mechanism that presses the first edge and the second edge in a direction toward the opening; a displacement measurement mechanism that measures a deformation amount of the first edge and the second edge in the first direction; and a fixing device that fixes the mask to the first edge and the second edge. The pressing mechanism can include five or more pressing devices that press the first edge, which are arranged at intervals of 500 mm or less along the second direction; and five or more pressing devices that press the second edge, which are arranged at intervals of 500 mm or less along the second direction.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a manufacturing apparatus of a mask device, a recording medium, a manufacturing method of a mask device, and a mask device. BACKGROUND

[0002] An organic device such as an organic EL display device is attracting attention. As a method of forming an element of an organic device, a method of attaching a material constituting the element to a substrate by evaporation is known. For example, first, a substrate in which a first electrode is formed in a pattern corresponding to the element is prepared. Next, an evaporation process is performed using a mask device. The mask device has a mask including a through-hole and a frame that supports the mask. An organic material that has passed through the through-hole of the mask is attached to the first electrode, and thus an organic layer is formed on the first electrode.

[0003] The frame includes a first edge and a second edge to which end portions of the mask are fixed. The first edge and the second edge face each other with the opening therebetween in the first direction. The frame supports the mask in a state in which tension is applied to the mask in the first direction. Thus, it is possible to suppress the mask from being deflected.

[0004] Patent Literature 1: International Publication No. 2019 / 049600

[0005] In a case where the mask is fixed to the first edge and the second edge in a state where the first edge and the second edge of the frame are deformed in a direction toward the opening, a force based on elastic restoration of the first edge and the second edge applies tension to the mask. In order to precisely adjust the tension applied to the mask, it is required to precisely adjust the amount of deformation of the first edge and the second edge.

[0006] As one of means of reducing the manufacturing cost of an organic device, it is possible to consider upsizing of a substrate. If the substrate is upsized, the mask is upsized, and the frame is upsized. If the frame is upsized, the difficulty of adjustment of the amount of deformation of the first edge and the second edge is increased. SUMMARY

[0007] In the manufacturing apparatus of the mask device according to one embodiment of the present disclosure, the mask device can include a frame including a first side and a second side facing each other in a first direction with an opening therebetween, and a third side and a fourth side facing each other in a second direction intersecting the first direction with the opening therebetween, and a mask including end portions fixed to the first side and the second side. The manufacturing apparatus can include a pressing mechanism that presses the first side and the second side in a direction toward the opening, a displacement measuring mechanism that measures a displacement amount of the first side and the second side in the first direction, and a fixing apparatus that fixes the mask to the first side and the second side. The pressing mechanism can include five or more pressing devices that press the first side and are arranged at intervals of 500 mm or less in the second direction, and five or more pressing devices that press the second side and are arranged at intervals of 500 mm or less in the second direction.

[0008] According to the embodiment of the present disclosure, the displacement amounts of the first side and the second side of the frame can be appropriately adjusted. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 is a cross-sectional view showing an example of an organic device.

[0010] Figure 2 is a plan view showing an example of a group of organic devices.

[0011] Figure 3 is a cross-sectional view showing an example of an evaporation apparatus.

[0012] Figure 4 is a plan view showing an example of a mask device.

[0013] Figure 5 is a plan view showing the first side of the frame in an enlarged scale.

[0014] Figure 6 is a plan view showing an example of a mask device.

[0015] Figure 7 is a plan view showing an example of a mask.

[0016] Figure 8 is a cross-sectional view showing an example of a mask.

[0017] Figure 9 is a block diagram showing an example of a manufacturing apparatus of a mask device.

[0018] Figure 10 is a plan view showing an example of a manufacturing apparatus.

[0019] Figure 11is a plan view showing one example of a pressing device and a displacement meter.

[0020] Figure 12 is a flowchart showing one example of a manufacturing method of a mask device.

[0021] Figure 13 is a flowchart showing one example of an adjustment process and a disposition process.

[0022] Figure 14 is a plan view showing one example of a first adjustment process.

[0023] Figure 15 is a plan view showing one example of a first disposition process.

[0024] Figure 16 is a plan view showing one example of a first disposition process.

[0025] Figure 17 is a plan view showing one example of a second mask mounting process.

[0026] Figure 18 is a plan view showing one example of a third mask mounting process to an eighth mask mounting process.

[0027] Figure 19 is a plan view showing one example of a ninth mask mounting process and a tenth mask mounting process.

[0028] Figure 20 is a plan view showing one example of a release process.

[0029] Figure 21 is a graph showing one example of a pressing force of an eleventh pressing device.

[0030] Figure 22 is a graph showing one example of a pressing force of a twelfth pressing device.

[0031] Figure 23 is a graph showing one example of a pressing force of a first central pressing device.

[0032] Figure 24 is a flowchart showing one example of a disassembly method of a mask device.

[0033] Figure 25 is a flowchart showing one example of a removal process and a reverse adjustment process.

[0034] Figure 26 is a plan view showing one example of a first removal process.

[0035] Figure 27 is a plan view showing one example of a second removal process.

[0036] Figure 28 is a plan view showing an example of the 3rd removal process to the 8th removal process.

[0037] Figure 29 is a plan view showing an example of the 9th removal process and the 10th removal process.

[0038] Figure 30 is a graph showing an example of the pressing force of the 11th pressing device.

[0039] Figure 31 is a graph showing an example of the pressing force of the 12th pressing device.

[0040] Figure 32 is a graph showing an example of the pressing force of the 1st central pressing device.

[0041] Figure 33 is a plan view showing an example of the mask device.

[0042] Figure 34 is a plan view showing an example of the manufacturing device.

[0043] Figure 35 is a plan view showing an example of the manufacturing device.

[0044] Figure 36 is a plan view showing an example of the manufacturing device.

[0045] Figure 37 is a graph showing the 11th pressing force, the 12th pressing force, the 21st pressing force, the 22nd pressing force, and the 1st central pressing force in Example 1.

[0046] Figure 38 is a graph showing the 11th pressing force, the 21st pressing force, and the 1st central pressing force in Example 2.

[0047] Figure 39 is a graph showing the difference between the amount of deformation of the frame and the target amount of deformation in Examples 1 to 3.

[0048] Figure 40 is a plan view showing an example of the 1st mask mounting process of the 5th embodiment.

[0049] Figure 41 is a plan view showing an example of the 1st mask mounting process of the 5th embodiment.

[0050] Figure 42 is a plan view showing an example of the 2nd mask mounting process of the 5th embodiment.

[0051] Figure 43 is a plan view showing an example of the 3rd mask mounting process to the 8th mask mounting process of the 5th embodiment.

[0052] Figure 44 FIG. 19 is a plan view showing an example of the 9th mask mounting step and the 10th mask mounting step of the 5th embodiment.

[0053] Figure 45 FIG. 21 is a graph showing an example of the pressing force of the 21st pressing device of the 5th embodiment.

[0054] Figure 46 FIG. 22 is a graph showing an example of the pressing force of the 22nd pressing device of the 5th embodiment.

[0055] Figure 47 FIG. 24 is a graph showing an example of the pressing force of the 2nd central pressing device of the 5th embodiment.

[0056] Figure 48 FIG. 17 is a plan view showing an example of the 1st removal step of the 5th embodiment.

[0057] Figure 49 FIG. 18 is a plan view showing an example of the 2nd removal step of the 5th embodiment.

[0058] Figure 50 FIG. 21 is a graph showing an example of the pressing force of the 21st pressing device of the 5th embodiment.

[0059] Figure 51 FIG. 22 is a graph showing an example of the pressing force of the 22nd pressing device of the 5th embodiment.

[0060] Figure 52 FIG. 24 is a graph showing an example of the pressing force of the 2nd central pressing device of the 5th embodiment.

[0061] Figure 53 FIG. 20 is a graph showing the 11th pressing force, the 12th pressing force, the 21st pressing force, the 22nd pressing force, and the 1st central pressing force in Example 4.

[0062] Figure 54 FIG. 21 is a graph showing the 11th pressing force, the 12th pressing force, the 21st pressing force, the 22nd pressing force, and the 1st central pressing force in Example 5.

[0063] Figure 55 FIG. 22 is a graph showing the difference between the target deformation amount and the deformation amount of the frame in Examples 4 to 5. DETAILED DESCRIPTION

[0064] In the present specification and the present drawings, unless specifically described, "substrate", "base material", "board", "sheet", "film", and the like represent terms of a substance that becomes the basis of a certain structure and are not terms that are distinguished from each other based on only the difference in the name.

[0065] In the present specification and the accompanying drawings, unless specifically stated otherwise, the terms such as "parallel", "orthogonal", and the like for determining a shape, a geometrical condition, and a degree thereof, or a value of a length, an angle, and the like are not limited to a strict meaning, and are to be interpreted to include a range of a degree in which the same function can be expected.

[0066] In the present specification and the accompanying drawings, unless specifically stated otherwise, the following cases are included: a case where a certain structure is "above", "below", "upper side", "lower side", or "upper", "lower" of another structure; and a case where a certain structure directly contacts another structure. Furthermore, a case where another structure is included between a certain structure and another structure, that is, a case where a certain structure indirectly contacts another structure is also included. In addition, unless specifically stated otherwise, the terms such as "above", "upper side", "upper", or "below", "lower side", "lower" can be reversed in the up-down direction.

[0067] In the present specification and the accompanying drawings, unless specifically stated otherwise, the same reference signs or similar reference signs are attached to the same parts or parts having the same function, and repetitive explanation thereof is omitted. In addition, the size ratio of the drawings is sometimes different from the actual ratio, and a part of the structure is sometimes omitted from the drawings for the convenience of explanation.

[0068] In the present specification and the accompanying drawings, unless specifically stated otherwise, one embodiment of the present specification can be combined with other embodiments within a range not causing a contradiction. In addition, the other embodiments can also be combined with each other within a range not causing a contradiction.

[0069] In the present specification and the accompanying drawings, unless specifically stated otherwise, in a case where a plurality of steps are disclosed with respect to a method such as a manufacturing method, other steps not disclosed can be implemented between the disclosed steps. In addition, the order of the disclosed steps is arbitrary within a range not causing a contradiction.

[0070] In the present specification and the accompanying drawings, unless specifically stated otherwise, a numerical range represented by a symbol such as "~" includes values placed before and after the symbol such as "~". For example, a numerical range defined by a representation such as "34 to 38 mass%" is the same as a numerical range defined by a representation such as "34 mass% or more and 38 mass% or less".

[0071] In one embodiment of the present specification, an example of a mask or a manufacturing method thereof for patterning an organic material or an electrode on a substrate in a desired pattern at the time of manufacturing an organic EL display device is described. However, the application is not limited to such use, and the present embodiment can be applied to a mask for various uses. For example, the mask of the present embodiment can also be used for forming an electrode of a device for displaying or projecting an image or a video for expressing virtual reality (so-called VR) or augmented reality (so-called AR). In addition, the mask of the present embodiment can also be used for forming an electrode of a liquid crystal display device or an electrode of a display device other than an organic EL display device. In addition, the mask of the present embodiment can also be used for forming an electrode of a pressure sensor or an electrode of an organic device other than a display device.

[0072] The first aspect of the present disclosure is a manufacturing device of a mask device,

[0073] The mask device includes a frame including a first side and a second side facing each other in a first direction across an opening, and a third side and a fourth side facing each other in a second direction intersecting the first direction across the opening, and a mask including end portions fixed to the first side and the second side,

[0074] The manufacturing device includes:

[0075] a pressing mechanism that presses the first side and the second side in a direction toward the opening;

[0076] a displacement measuring mechanism that measures a displacement amount of the first side and the second side in the first direction; and

[0077] a fixing device that fixes the mask to the first side and the second side,

[0078] The pressing mechanism includes: five or more pressing devices that press the first side, which are arranged at intervals of 500 mm or less along the second direction; and five or more pressing devices that press the second side, which are arranged at intervals of 500 mm or less along the second direction.

[0079] Regarding the second aspect of the present disclosure, in the manufacturing device of the above-described first aspect, the displacement measuring mechanism can include at least one displacement gauge that measures the displacement amount of the first side, and the displacement gauge can include a sensor head in contact with the first side.

[0080] Regarding the third aspect of the present disclosure, in the manufacturing device of the above-described second aspect, the displacement gauge measures the displacement amount of the first side at a position 100 mm or less from the pressing device in the second direction.

[0081] Regarding the 4th aspect of the present disclosure, in the manufacturing apparatus of the above-mentioned 2nd aspect or 3rd aspect, the displacement measuring mechanism can include: 5 or more displacement gauges that measure the deformation amount of the first edge at a position 100 mm or less from the pressing apparatus in the 2nd direction; a first auxiliary displacement gauge that measures the deformation amount of the first edge at a position 200 mm or less from the outer side of the third edge in the 2nd direction; and a second auxiliary displacement gauge that measures the deformation amount of the first edge at a position 200 mm or less from the outer side of the fourth edge in the 2nd direction.

[0082] Regarding the 5th aspect of the present disclosure, in the manufacturing apparatus of the above-mentioned 4th aspect, the distance between the first auxiliary displacement gauge and the second auxiliary displacement gauge in the 2nd direction can be 1300 mm or more.

[0083] Regarding the 6th aspect of the present disclosure, in the manufacturing apparatus of any one of the above-mentioned 1st aspect to 5th aspect, the distance between the pressing apparatus that presses the first edge and the pressing apparatus that presses the second edge in the 1st direction can be 1300 mm or more.

[0084] Regarding the 7th aspect of the present disclosure, in the manufacturing apparatus of any one of the above-mentioned 1st aspect to 5th aspect, the mask apparatus can include N masks arranged in the 2nd direction, where N is an integer of 2 or more, and the manufacturing apparatus can include a control apparatus that controls the pressing mechanism, and the pressing mechanism can press the first edge and the second edge in such a manner that the difference between the deformation amount when each mask is fixed to the first edge and a target deformation amount is below a first threshold value.

[0085] Regarding the 8th aspect of the present disclosure, in the manufacturing apparatus of the above-mentioned 7th aspect, the fixing device can fix the masks to the first edge and the second edge in order from far to near from the center of the frame in the second direction, the pressing mechanism that presses the first edge can include: a central group that includes one or two of the pressing devices; a first group that is located between the central group and the third edge in the second direction and includes two or more of the pressing devices; and a second group that is located between the central group and the fourth edge in the second direction and includes two or more of the pressing devices, the pressing device of the central group can apply a first pressing force (1) to the first edge when fixing the first mask to the frame, the pressing device of the central group can apply a first pressing force (U) to the first edge when fixing the Uth mask to the frame, where U is an integer greater than 1 and less than N, and the ratio of the first pressing force (U) to the first pressing force (1) can be 1.05 or more.

[0086] Regarding the 9th aspect of the present disclosure, in the manufacturing apparatus of the above-mentioned 7th aspect, the fixing device can fix the masks to the first edge and the second edge in order from near to far from the center of the frame in the second direction, the pressing mechanism that presses the first edge can include: a central group that includes one or two of the pressing devices; a first group that is located between the central group and the third edge in the second direction and includes two or more of the pressing devices; and a second group that is located between the central group and the fourth edge in the second direction and includes two or more of the pressing devices, the pressing device that belongs to the second group and is closest to the fourth edge can apply a first pressing force (1) to the first edge when fixing the first mask to the frame, the pressing device that belongs to the second group and is closest to the fourth edge can apply a first pressing force (U) to the first edge when fixing the Uth mask to the frame, where U is an integer greater than 1 and less than N, and the ratio of the first pressing force (U) to the first pressing force (1) can be 1.05 or more.

[0087] Regarding the 10th aspect of the present disclosure, in the manufacturing apparatus of the above-mentioned 8th aspect or 9th aspect, the control device can control the pressing mechanism so that the following formula is satisfied,

[0088] U≧N / 2.

[0089] The 11-1st aspect of the present disclosure is a program for causing a computer to function as the control device of the manufacturing apparatus of any one of the above-mentioned 7th aspect to 10th aspect.

[0090] A non-transitory computer-readable recording medium that records the program of the above-mentioned 11-1.

[0091] A manufacturing method of a mask device according to a twelfth aspect of the present disclosure includes:

[0092] A step of preparing a frame including a first side and a second side facing each other in a first direction across an opening, and a third side and a fourth side facing each other in a second direction intersecting the first direction across the opening;

[0093] A step of adjusting a first pressing force applied by a pressing mechanism to the first side and the second side in a direction toward the opening; and

[0094] A step of fixing an end portion of a mask to the first side and the second side,

[0095] The pressing mechanism includes: five or more pressing devices that press the first side, arranged at intervals of 500 mm or less in the second direction; and five or more pressing devices that press the second side, arranged at intervals of 500 mm or less in the second direction.

[0096] Regarding a thirteenth aspect of the present disclosure, in the manufacturing method of the above-mentioned twelfth aspect, in the step of adjusting, the first pressing force can be adjusted based on information from a displacement measuring mechanism that measures a deformation amount of the first side and the second side in the first direction, and the displacement measuring mechanism can include at least one displacement gauge that measures the deformation amount of the first side, and the displacement gauge can include a sensor head that contacts the first side.

[0097] Regarding a fourteenth aspect of the present disclosure, in the manufacturing method of the above-mentioned thirteenth aspect, the displacement gauge can measure the deformation amount of the first side at a position 100 mm or less from the pressing device in the second direction.

[0098] Regarding a fifteenth aspect of the present disclosure, in the manufacturing method of the above-mentioned thirteenth aspect or the fourteenth aspect, the displacement measuring mechanism can include: five or more displacement gauges that measure the deformation amount of the first side at a position 100 mm or less from the pressing device in the second direction; a first auxiliary displacement gauge that measures the deformation amount of the first side at a position 200 mm or less from an outer side surface of the third side in the second direction; and a second auxiliary displacement gauge that measures the deformation amount of the first side at a position 200 mm or less from an outer side surface of the fourth side in the second direction.

[0099] In the above-described 15th aspect, the distance between the first auxiliary displacement gauge and the second auxiliary displacement gauge in the second direction can be 1300 mm or more.

[0100] In the above-described 12th to 15th aspects, the distance between the pressing device that presses the first edge and the pressing device that presses the second edge in the first direction can be 1300 mm or more.

[0101] Regarding a 16th aspect of the present disclosure, in the manufacturing method of any one of the above-described 11th to 15th aspects, the mask device can include N masks arranged in the second direction, where N is an integer of 2 or more, and in the adjusting process, the first pressing force can be adjusted so that the difference between the target deformation amount and the deformation amount of the first edge when each mask is fixed to the first edge is below a first threshold value.

[0102] Regarding a 17th aspect of the present disclosure, in the manufacturing method of the above-described 16th aspect, in the fixing process, the masks can be fixed to the first edge and the second edge in order from far to near in the second direction from the center of the frame, and the pressing mechanism that presses the first edge can include: a central group including one or two pressing devices; a first group located between the central group and the third edge in the second direction and including two or more pressing devices; and a second group located between the central group and the fourth edge in the second direction and including two or more pressing devices, the pressing device of the central group can apply a first pressing force (1) to the first edge when the first mask is fixed to the frame, the pressing device of the central group can apply a first pressing force (U) to the first edge when the Uth mask is fixed to the frame, where U is an integer greater than 1 and less than N, and the ratio of the first pressing force (U) to the first pressing force (1) can be 1.05 or more.

[0103] Regarding the 18th aspect of the present disclosure, in the manufacturing method of the above-mentioned 16th aspect, in the fixing step, the mask can be fixed to the first edge and the second edge in order from near to far from the center of the frame in the second direction, the pressing mechanism that presses the first edge can include: a central group including one or two pressing devices; a first group located between the central group and the third edge in the second direction and including two or more pressing devices; and a second group located between the central group and the fourth edge in the second direction and including two or more pressing devices, the pressing device belonging to the second group and closest to the fourth edge can apply a first pressing force (1) to the first edge when fixing the first mask to the frame, the pressing device belonging to the second group and closest to the fourth edge can apply a first pressing force (U) to the first edge when fixing the Uth mask to the frame, where U is an integer greater than 1 and less than N, and the ratio of the first pressing force (U) to the first pressing force (1) can be 1.05 or more.

[0104] Regarding the 19th aspect of the present disclosure, in the manufacturing method of the above-mentioned 17th aspect or 18th aspect, the adjusting step adjusts the first pressing force in such a manner that the following equation is satisfied,

[0105] U≧N / 2.

[0106] The 20th aspect of the present disclosure is a mask device in which,

[0107] The mask device includes:

[0108] a frame including a first edge and a second edge facing each other in a first direction across an opening, and a third edge and a fourth edge facing each other in a second direction intersecting the first direction across the opening; and

[0109] N masks arranged in the second direction, including end portions fixed to the first edge and the second edge, where N is an integer of 2 or more,

[0110] The first edge and the second edge are deformed in the second direction by a final deformation amount in a manner of being deflected toward the opening,

[0111] In a case where a removal process and a reverse adjustment process are alternately performed, a ratio of the second pressing force (Q) to the second pressing force (N) is 1.05 or more, wherein the removal process is a process of unloading the mask from the frame in order from near to far in the second direction from the center of the frame, and the reverse adjustment process is a process of adjusting the second pressing force applied by the pressing mechanism to the first edge and the second edge in a direction toward the opening after the removal process in such a manner that the first edge and the second edge are deformed in the second direction by a final deformation amount,

[0112] The pressing mechanism that presses the first edge includes a central group including one or two pressing devices that press the first edge, a first group located between the central group and the third edge in the second direction and including two or more pressing devices, and a second group located between the central group and the fourth edge in the second direction and including two or more pressing devices,

[0113] The second pressing force (Q) is a pressing force applied by the pressing devices of the central group to the first edge after the Qth mask is unloaded from the frame, where Q is an integer greater than 1 and less than N,

[0114] The second pressing force (N) is a pressing force applied by the pressing devices of the central group to the first edge after the Nth mask is unloaded from the frame.

[0115] A 21st aspect of the present disclosure is a mask device in which,

[0116] The mask device includes:

[0117] a frame including a first edge and a second edge facing each other in a first direction across an opening, and a third edge and a fourth edge facing each other in a second direction intersecting the first direction across the opening; and

[0118] N masks arranged in the second direction, including end portions fixed to the first edge and the second edge, where N is an integer of 2 or more,

[0119] The first edge and the second edge are deformed in the second direction by a final deformation amount in a manner of flexing toward the opening,

[0120] In a case where the removing process and the reverse adjustment process are alternately performed, a ratio of the second pressing force (Q) to the second pressing force (N) is 1.05 or more, wherein the removing process is a process of unloading the mask from the frame in order from far to near in the second direction from the center of the frame, and the reverse adjustment process is a process of adjusting the second pressing force applied by the pressing mechanism to the first edge and the second edge in a direction toward the opening in such a manner that the first edge and the second edge are deformed in the second direction by a final deformation amount after the removing process,

[0121] The pressing mechanism that presses the first edge includes a central group including one or two pressing devices that press the first edge, a first group located between the central group and the third edge in the second direction and including two or more pressing devices, and a second group located between the central group and the fourth edge in the second direction and including two or more pressing devices,

[0122] The second pressing force (Q) is a pressing force applied by the pressing device belonging to the second group and closest to the fourth edge to the first edge after the Qth mask is unloaded from the frame, wherein Q is an integer greater than 1 and less than N,

[0123] The second pressing force (N) is a pressing force applied by the pressing device belonging to the second group and closest to the fourth edge to the first edge after the Nth mask is unloaded from the frame.

[0124] Regarding the 22nd aspect of the present disclosure, in the mask device of the above-mentioned 21st aspect or 22nd aspect, the following equation can also be satisfied,

[0125] Q≦N / 2.

[0126] A first embodiment of the present disclosure will be described in detail with reference to the drawings. Furthermore, the embodiments shown below are examples of embodiments of the present disclosure, and the present disclosure is not limited to these embodiments for explanation.

[0127] An organic device 100 including an element formed by using a mask will be described. Figure 1 is a cross-sectional view showing an example of the organic device 100.

[0128] The organic device 100 includes a substrate 110 including a first surface 111 and a second surface 112, and a plurality of elements 115 located on the first surface 111 of the substrate 110. The element 115 is, for example, a pixel. The elements 115 can also be arranged in the in-plane direction of the first surface 111. The substrate 110 can also include two or more kinds of elements 115. For example, the substrate 110 can include a first element 115A and a second element 115B. Although not illustrated, the substrate 110 can also include a third element. The first element 115A, the second element 115B, and the third element are, for example, a red pixel, a blue pixel, and a green pixel.

[0129] The element 115 can include a first electrode 120, an organic layer 130 located on the first electrode 120, and a second electrode 140 located on the organic layer 130. The element formed by using a mask can be the organic layer 130 or the second electrode 140. The element formed by using a mask is also referred to as an evaporation layer.

[0130] The organic device 100 can have an insulating layer 160 located between two adjacent first electrodes 120 in plan view. The insulating layer 160 includes, for example, polyimide. The insulating layer 160 can also overlap with the end portion of the first electrode 120 in plan view.

[0131] The organic device 100 can be of an active matrix type. For example, although not illustrated, the organic device 100 can have a switch electrically connected to each of the plurality of elements 115. The switch is, for example, a transistor. The switch can control the on / off of the voltage or current supplied to the corresponding element 115.

[0132] The substrate 110 can also be a plate-shaped member having insulating properties. The substrate 110 preferably has transparency that allows light to pass therethrough. As a material of the substrate 110, for example, a rigid material such as quartz glass, Pyrex (registered trademark) glass, synthetic quartz plate, or the like having no flexibility, or a flexible material such as a resin film, an optical resin plate, a thin glass, or the like having flexibility can be used. In addition, the substrate can also be a laminate having a barrier layer on one or both surfaces of a resin film.

[0133] The element 115 is configured to achieve a certain function by applying a voltage between the first electrode 120 and the second electrode 140 or by causing a current to flow between the first electrode 120 and the second electrode 140. For example, in the case where the element 115 is a pixel of an organic EL display device, the element 115 can emit light constituting an image.

[0134] The first electrode 120 comprises a conductive material. For example, the first electrode 120 comprises a metal, a conductive metal oxide, or other conductive inorganic materials. The first electrode 120 may also comprise a transparent and conductive metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0135] Organic layer 130 contains organic materials. When an electric current flows through organic layer 130, organic layer 130 can perform certain functions. As organic layer 130, a light-emitting layer that emits light when an electric current passes through it can be used. Organic layer 130 may contain organic semiconductor materials. The transmittance, refractive index, and other properties of organic layer 130 can be appropriately adjusted.

[0136] like Figure 1 As shown, organic layer 130 may include a first organic layer 130A and a second organic layer 130B. The first organic layer 130A is included in the first element 115A. The second organic layer 130B is included in the second element 115B. Although not shown, organic layer 130 may also include a third organic layer, which is included in the third element. The first organic layer 130A, the second organic layer 130B, and the third organic layer are, for example, a red light-emitting layer, a blue light-emitting layer, and a green light-emitting layer.

[0137] When a voltage is applied between the first electrode 120 and the second electrode 140, current flows in the organic layer 130. When the organic layer 130 is a light-emitting layer, light is emitted from the organic layer 130, and the light is extracted to the outside from either the second electrode 140 side or the first electrode 120 side.

[0138] The organic layer 130 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, a charge generation layer, etc.

[0139] The second electrode 140 comprises a conductive material such as a metal. The second electrode 140 is formed on the organic layer 130 using a mask vapor deposition method. Materials constituting the second electrode 140 can include platinum, gold, silver, copper, iron, tin, chromium, aluminum, indium, lithium, sodium, potassium, calcium, magnesium, indium tin oxide (ITO), indium zinc oxide (IZO), carbon, etc. These materials can be used individually or in combination of two or more. When using two or more materials, layers composed of each material can be stacked. Alternatively, alloys containing two or more materials can be used. For example, magnesium alloys such as MgAg, and aluminum alloys such as AlLi, AlCa, and AlMg can be used. MgAg is also known as magnesium silver. Magnesium silver is preferably used as the material for the second electrode 140. Alkali metal and alkaline earth metal alloys can also be used. For example, lithium fluoride, sodium fluoride, potassium fluoride, etc., can be used.

[0140] The second electrode 140 can also be a shared electrode. For example, the second electrode 140 of one element 115 can also be electrically connected to the second electrode 140 of other elements 115.

[0141] The second electrode 140 may also be composed of a single layer. For example, the second electrode 140 may also be a layer formed by a vapor deposition process using a single mask.

[0142] Or, such as Figure 1 As shown, the second electrode 140 may also comprise a first layer 140A and a second layer 140B. The first layer 140A may also be a layer formed by a vapor deposition process using a first mask. The second layer 140B may also be a layer formed by a vapor deposition process using a second mask. Thus, the second electrode 140 can be formed using two or more masks. This increases the degree of freedom in the pattern of the second electrode 140 when viewed from above. For example, the organic device 100 may include regions in the plan view where the second electrode 140 is not present. Regions where the second electrode 140 is not present can have higher transmittance than regions where the second electrode 140 is present.

[0143] like Figure 1 As shown, the ends of the first layer 140A and the second layer 140B can also partially overlap. This allows for electrical connection between the first layer 140A and the second layer 140B.

[0144] Although not shown, the second electrode 140 may also include other layers such as a third layer. The third layer and other layers may also be electrically connected to the first layer 140A and the second layer 140B.

[0145] In the following description, when describing the common structures of the second electrode 140, the first layer 140A, the second layer 140B, the third layer, etc., the term "second electrode 140" will be used.

[0146] In the manufacturing method of organic device 100, it is possible to fabricate Figure 2 The organic device group 102 is shown as described. The organic device group 102 includes two or more organic devices 100. For example, the organic device group 102 may include organic devices 100 arranged in a first direction D1 and a second direction D2. The second direction D2 is a direction intersecting the first direction D1. The second direction D2 may also be orthogonal to the first direction D1. A single common substrate 110 may be used for the two or more organic devices 100. For example, the organic device group 102 may be located on a single substrate 110 and include layers constituting the two or more organic devices 100, such as a first electrode 120, an organic layer 130, and a second electrode 140. Organic devices 100 are obtained by dividing the organic device group 102.

[0147] The first direction Dl can also be a direction in which a mask 50 used for manufacturing the organic device 100 extends, as described later.

[0148] The size Al of the organic device 100 in the first direction Dl can be, for example, 10 mm or more, 30 mm or more, or 100 mm or more. The size Al can be, for example, 200 mm or less, 500 mm or less, or 1000 mm or less. The range of the size Al can also be determined by a first group consisting of 10 mm, 30 mm, and 100 mm and / or a second group consisting of 200 mm, 500 mm, and 1000 mm. The range of the size Al can also be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the size Al can also be determined by a combination of any two of the values included in the first group. The range of the size Al can also be determined by a combination of any two of the values included in the second group. For example, the size Al can be 10 mm or more and 1000 mm or less, 10 mm or more and 500 mm or less, 10 mm or more and 200 mm or less, 10 mm or more and 100 mm or less, 10 mm or more and 30 mm or less, 30 mm or more and 1000 mm or less, 30 mm or more and 500 mm or less, 30 mm or more and 200 mm or less, 30 mm or more and 100 mm or less, 100 mm or more and 1000 mm or less, 100 mm or more and 500 mm or less, 100 mm or more and 200 mm or less, 200 mm or more and 1000 mm or less, 200 mm or more and 500 mm or less, or 500 mm or more and 1000 mm or less.

[0149] The size A2 of the organic device 100 in the second direction D2 can be, for example, 10 mm or more, 20 mm or more, or 50 mm or more. The size A2 can be, for example, 100 mm or less, 200 mm or less, or 500 mm or less. The range of the size A2 can be determined by a first group consisting of 10 mm, 20 mm, and 50 mm and / or a second group consisting of 100 mm, 200 mm, and 500 mm. The range of the size A2 can also be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the size A2 can also be determined by a combination of any two of the values included in the first group. The range of the size A2 can also be determined by a combination of any two of the values included in the second group. For example, the size A2 can be 10 mm or more and 500 mm or less, 10 mm or more and 200 mm or less, 10 mm or more and 100 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 500 mm or less, 20 mm or more and 200 mm or less, 20 mm or more and 100 mm or less, 20 mm or more and 50 mm or less, 50 mm or more and 500 mm or less, 50 mm or more and 200 mm or less, 50 mm or more and 100 mm or less, 100 mm or more and 500 mm or less, 100 mm or more and 200 mm or less, or 200 mm or more and 500 mm or less.

[0150] The organic device group 102 includes a device region 103 in which a plurality of the organic devices 100 are arranged. The device region 103 has a size G12 in the first direction D1 and a size G22 in the second direction D2.

[0151] By making the substrate 110 large, the sizes G12 and G22 of the device region 103 can be increased. Thus, the number of the organic devices 100 formed on one substrate 110 is increased. Thus, the manufacturing cost of the organic device 100 can be reduced.

[0152] The size G11 of the substrate 110 in the first direction D1 can be, for example, 1000 mm or more, 1200 mm or more, 1300 mm or more, or 2100 mm or more. The size G11 can be, for example, 1200 mm or less, 1300 mm or less, 1900 mm or less, 2100 mm or less, or 2300 mm or less. The range of the size G11 can be determined by a first group consisting of 1000 mm, 1200 mm, 1300 mm, and 2100 mm and / or a second group consisting of 1200 mm, 1300 mm, 1900 mm, 2100 mm, and 2300 mm. The range of the size G11 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the size G11 can also be determined by a combination of any two of the values included in the first group described above. The range of the size G11 can also be determined by a combination of any two of the values included in the second group described above. For example, the size G11 can be 1000 mm or more and 2300 mm or less, 1000 mm or more and 2100 mm or less, 1000 mm or more and 1900 mm or less, 1000 mm or more and 1300 mm or less, 1000 mm or more and 1200 mm or less, 1200 mm or more and 2300 mm or less, 1200 mm or more and 2100 mm or less, 1200 mm or more and 1900 mm or less, 1200 mm or more and 1300 mm or less, 1300 mm or more and 2300 mm or less, 1300 mm or more and 2100 mm or less, 1300 mm or more and 1900 mm or less, 1900 mm or more and 2300 mm or less, 1900 mm or more and 2100 mm or less, or 2100 mm or more and 2300 mm or less.

[0153] The size G21 of the substrate 110 in the second direction D2 can be, for example, 1200 mm or more, 1300 mm or more, 1500 mm or more, 2000 mm or more, or 2400 mm or more. The size G21 can be, for example, 1300 mm or less, 2300 mm or less, 2400 mm or less, or 2600 mm or less. The range of the size G21 can be determined by a first group consisting of 1200 mm, 1300 mm, 1500 mm, 2000 mm, and 2400 mm and / or a second group consisting of 1300 mm, 2300 mm, 2400 mm, and 2600 mm. The range of the size G21 can also be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the size G21 can also be determined by a combination of any two of the values included in the first group. The range of the size G21 can also be determined by a combination of any two of the values included in the second group. For example, the size G21 can be 1200 mm or more and 2600 mm or less, 1200 mm or more and 2400 mm or less, 1200 mm or more and 2300 mm or less, 1200 mm or more and 1500 mm or less, 1200 mm or more and 1300 mm or less, 1300 mm or more and 2600 mm or less, 1300 mm or more and 2400 mm or less, 1300 mm or more and 2300 mm or less, 1300 mm or more and 1500 mm or less, 1500 mm or more and 2600 mm or less, 1500 mm or more and 2400 mm or less, 1500 mm or more and 2300 mm or less, 2000 mm or more and 2300 mm or less, 2300 mm or more and 2600 mm or less, 2300 mm or more and 2400 mm or less, or 2400 mm or more and 2600 mm or less.

[0154] A specific numerical range of the size G11 and a specific numerical range of the size G21 can also be combined. For example, the size G11 can be 1000 mm or more and 1200 mm or less, and the size G21 can be 1200 mm or more and 1300 mm or less. For example, the size G11 can be 1200 mm or more and 1300 mm or less, and the size G21 can be 2000 mm or more and 2300 mm or less. For example, the size G11 can be 2100 mm or more and 2300 mm or less, and the size G21 can be 2400 mm or more and 2600 mm or less.

[0155] Next, a method of forming the organic layer 130, the second electrode 140, and the like by an evaporation method will be described.Figure 3 is a view showing an evaporation apparatus 10. The evaporation apparatus 10 performs an evaporation process of evaporating an evaporation material on a substrate 110.

[0156] As shown in Figure 3 , the evaporation apparatus 10 can have an evaporation source 6, a heater 8, and a mask apparatus 15 inside thereof. The evaporation apparatus 10 can also have an exhaust unit for making the inside of the evaporation apparatus 10 a vacuum atmosphere. The evaporation source 6 is, for example, a crucible. The evaporation source 6 houses an evaporation material 7 such as an organic material or a metallic material. The heater 8 evaporates the evaporation material 7 under a vacuum atmosphere by heating the evaporation source 6.

[0157] As shown in Figure 3 , the mask apparatus 15 has at least one mask 50. The mask apparatus 15 can also have a frame 40 that supports the mask 50. The frame 40 includes an opening 45. The mask 50 can also be fixed to the frame 40 in a manner that the mask 50 crosses the opening 45 when viewed from above. The frame 40 can also include a first frame surface 401 on which the mask 50 is fixed and a second frame surface 402 located on the opposite side of the first frame surface 401. The frame 40 can also support the mask 50 in a state that the mask 50 is stretched in the surface direction thereof, so as to suppress the mask 50 from being deflected.

[0158] As shown in Figure 3 , the mask apparatus 15 is arranged in the evaporation apparatus 10 in a manner that the mask 50 faces a first surface 111 of the substrate 110. The mask 50 includes a plurality of through-holes 56 through which the evaporation material 7 flying from the evaporation source 6 passes. In the following description, a surface of the mask 50 that faces the substrate 110 is referred to as a first surface 551. A surface of the mask 50 that is located on the opposite side of the first surface 551 is referred to as a second surface 552.

[0159] As shown in Figure 3 , the evaporation apparatus 10 can also have a substrate holder 2 that holds the substrate 110. The substrate holder 2 can be movable in the thickness direction of the substrate 110. The substrate holder 2 can also be movable in the surface direction of the substrate 110. The substrate holder 2 can also be configured to control the inclination of the substrate 110. For example, the substrate holder 2 can include a plurality of chucks that are mounted to the outer edge of the substrate 110. Each of the chucks can be independently movable in the thickness direction and the surface direction of the substrate 110.

[0160] As shown in Figure 3 , the evaporation apparatus 10 can also have a mask holder 3 that holds the mask apparatus 15. The mask holder 3 can also be movable.

[0161] By moving at least either of the substrate holder 2 or the mask holder 3, the position of the mask 50 with respect to the substrate 110 can be adjusted.

[0162] The evaporation device 10 can also have the cooling plate 4. As shown in Figure 3 The cooling plate 4 can be disposed on the second surface 112 side of the substrate 110. The cooling plate 4 can have a flow path for circulating a refrigerant inside the cooling plate 4. The cooling plate 4 can suppress an increase in the temperature of the substrate 110 during the evaporation process.

[0163] The evaporation device 10 can also have the magnet 5. As shown in Figure 3 The magnet 5 can be disposed on the second surface 112 side of the substrate 110. The magnet 5 can be disposed on a surface of the cooling plate 4 that is away from the substrate 110. The magnet 5 can attract the mask 50 toward the substrate 110 by magnetic force. Thus, a gap between the mask 50 and the substrate 110 can be reduced or eliminated. Thus, a shadow can be suppressed during the evaporation process. The shadow refers to a phenomenon in which the evaporation material 7 enters a gap between the mask 50 and the substrate 110, thereby making the shape of the evaporation layer uneven. The shape of the evaporation layer is the thickness of the evaporation layer, the size of the evaporation layer in plan view, or the like. The mask 50 can be attracted toward the substrate 110 by an electrostatic chuck using electrostatic force.

[0164] Figure 4 is a plan view showing a case where the mask device 15 is viewed from the first surface 551 side. The mask device 15 can have the frame 40 and the mask 50 fixed to the frame 40. The frame 40 can have a rectangular outline extending in the first direction D1 and the second direction D2. The frame 40 can support the mask 50 in a state where tension is applied to the mask 50 in the first direction D1.

[0165] The frame 40 includes the first edge 41, the second edge 42, the third edge 43, the fourth edge 44, and the opening 45. The first edge 41 and the second edge 42 face each other in the first direction D1 with the opening 45 therebetween. The first edge 41 and the second edge 42 can extend in the second direction D2. The third edge 43 and the fourth edge 44 face each other in the second direction D2 with the opening 45 therebetween. The third edge 43 and the fourth edge 44 can extend in the first direction D1. The first edge 41 and the fourth edge 44 can be longer than the third edge 43 and the fourth edge 44. The opening 45 is located between the first edge 41 and the second edge 42, and between the third edge 43 and the fourth edge 44.

[0166] The first edge 41 includes an outer side 41a and an inner side 41b. The second edge 42 includes an outer side 42a and an inner side 42b. The third edge 43 includes an outer side 43a and an inner side 43b. The fourth edge 44 includes an outer side 44a and an inner side 44b. The inner sides 41b, 42b, 43b, 44b face the opening 45. The outer sides 41a, 42a are located on the opposite side of the inner sides 41b, 42b in the first direction D1. The outer sides 43a, 44a are located on the opposite side of the inner sides 43b, 44b in the second direction D2. The frame 40 includes a corner 46 where the outer sides of two edges meet.

[0167] The frame 40 has a dimension E11 in the first direction D1. The dimension E11 can be, for example, 1000 mm or more, 1200 mm or more, 1300 mm or more, or 2100 mm or more. The dimension E11 can be, for example, 1200 mm or less, 1300 mm or less, 1900 mm or less, 2100 mm or less, or 2300 mm or less. The range of the dimension E11 can be determined by a first group consisting of 1000 mm, 1200 mm, 1300 mm, and 2100 mm and / or a second group consisting of 1200 mm, 1300 mm, 1900 mm, 2100 mm, and 2300 mm. The range of the dimension E11 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the dimension E11 can also be determined by a combination of any two of the values included in the first group described above. The range of the dimension E11 can also be determined by a combination of any two of the values included in the second group described above. For example, the dimension E11 can be 1000 mm or more and 2300 mm or less, 1000 mm or more and 2100 mm or less, 1000 mm or more and 1900 mm or less, 1000 mm or more and 1300 mm or less, 1000 mm or more and 1200 mm or less, 1200 mm or more and 2300 mm or less, 1200 mm or more and 2100 mm or less, 1200 mm or more and 1900 mm or less, 1200 mm or more and 1300 mm or less, 1300 mm or more and 2300 mm or less, 1300 mm or more and 2100 mm or less, 1300 mm or more and 1900 mm or less, 1900 mm or more and 2300 mm or less, 1900 mm or more and 2100 mm or less, or 2100 mm or more and 2300 mm or less.

[0168] The frame 40 has a dimension E21 in the second direction D2. The dimension E21 can also be larger than the dimension E11. The dimension E21 can be, for example, 1200 mm or more, can be 1300 mm or more, can be 1500 mm or more, can be 2000 mm or more, and can be 2400 mm or more. The dimension E21 can be, for example, 1300 mm or less, can be 2300 mm or less, can be 2400 mm or less, and can be 2600 mm or less. The range of the dimension E21 can be determined by a first group consisting of 1200 mm, 1300 mm, 1500 mm, 2000 mm, and 2400 mm and / or a second group consisting of 1300 mm, 2300 mm, 2400 mm, and 2600 mm. The range of the dimension E21 can also be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the dimension E21 can also be determined by a combination of any two of the values included in the first group. The range of the dimension E21 can also be determined by a combination of any two of the values included in the second group. For example, the dimension E21 can be 1200 mm or more and 2600 mm or less, can be 1200 mm or more and 2400 mm or less, can be 1200 mm or more and 2300 mm or less, can be 1200 mm or more and 1500 mm or less, can be 1200 mm or more and 1300 mm or less, can be 1300 mm or more and 2600 mm or less, can be 1300 mm or more and 2400 mm or less, can be 1300 mm or more and 2300 mm or less, can be 1300 mm or more and 1500 mm or less, can be 1500 mm or more and 2600 mm or less, can be 1500 mm or more and 2400 mm or less, can be 1500 mm or more and 2300 mm or less, can be 2000 mm or more and 2300 mm or less, can be 2300 mm or more and 2600 mm or less, can be 2300 mm or more and 2400 mm or less, and can be 2400 mm or more and 2600 mm or less.

[0169] The ratio of the size E21 to the size E11 may be 1.1 or more, 1.2 or more, or 1.3 or more, for example. The ratio of the size E21 to the size E11 may be 1.5 or less, 1.7 or less, or 2.0 or less, for example. The range of the ratio of the size E21 to the size E11 can be determined by a first group consisting of 1.1, 1.2, and 1.3 and / or a second group consisting of 1.5, 1.7, and 2.0. The range of the ratio of the size E21 to the size E11 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the ratio of the size E21 to the size E11 can also be determined by a combination of any two of the values included in the first group described above. The range of the ratio of the size E21 to the size E11 can also be determined by a combination of any two of the values included in the second group described above. For example, the ratio of the size E21 to the size E11 can be 1.1 or more and 2.0 or less, 1.1 or more and 1.7 or less, 1.1 or more and 1.5 or less, 1.1 or more and 1.3 or less, 1.1 or more and 1.2 or less, 1.2 or more and 2.0 or less, 1.2 or more and 1.7 or less, 1.2 or more and 1.5 or less, 1.2 or more and 1.3 or less, 1.3 or more and 2.0 or less, 1.3 or more and 1.7 or less, 1.3 or more and 1.5 or less, 1.5 or more and 2.0 or less, 1.5 or more and 1.7 or less, or 1.7 or more and 2.0 or less.

[0170] A specific numerical range of the size E11 and a specific numerical range of the size E21 can also be combined. For example, the size E11 can be 1000 mm or more and 1200 mm or less, and the size E21 can be 1200 mm or more and 1300 mm or less. For example, the size E11 can be 1200 mm or more and 1300 mm or less, and the size E21 can be 2000 mm or more and 2300 mm or less. For example, the size E11 can be 2100 mm or more and 2300 mm or less, and the size E21 can be 2400 mm or more and 2600 mm or less.

[0171] The opening 45 has a size E12 in the first direction D1 and a size E22 in the second direction D2. By increasing the size of the frame 40, the size of the opening 45 can be increased. By increasing the size of the opening 45, the area of the mask 50 overlapping with the opening 45 in plan view can be increased. Thus, the number of organic devices 100 formed on one substrate 110 is increased. Thus, the manufacturing cost of the organic device 100 can be reduced. “Plan view” means that an object is observed in the thickness direction of the mask 50.

[0172] The mask 50 is fixed to the first edge 41 and the second edge 42. The mask 50 includes, in plan view, a pair of end portions 51 fixed to the first edge 41 and the second edge 42, and an intermediate portion 52 located between the pair of end portions 51. The pair of end portions 51 oppose each other in the first direction D1. The intermediate portion 52 overlaps the opening 45 in plan view. The intermediate portion 52 includes a group of through holes 53.

[0173] The mask device 15 can also have N masks 50 arranged in the second direction. N is an integer of 2 or more. N can also be an even number. Figure 4 The illustrated mask device 15 has 10 masks 50. As described later, N can also be an odd number.

[0174] The mask 50 can also include a central mask group 50C, a first mask group 50A, and a second mask group 50B. The central mask group 50C, the first mask group 50A, and the second mask group 50B each include masks 50. As Figure 4 As illustrated, the first mask group 50A is located between the central mask group 50C and the third edge 43 in the second direction D2. As Figure 4 As illustrated, the second mask group 50B is located between the central mask group 50C and the fourth edge 44 in the second direction D2.

[0175] The central mask group 50C includes one or two masks 50. In the case where N is an even number, the central mask group 50C can also include two masks 50. In the case where N is an odd number, the central mask group 50C can also include one mask 50. Figure 4 The illustrated central mask group 50C includes an eleventh mask 50A1 and a twelfth mask 50A2. The eleventh mask 50A1 can also be located between the second center line Lc2 and the third edge 43. The twelfth mask 50A2 can also be located between the second center line Lc2 and the fourth edge 44. The second center line Lc2 is an imaginary straight line that passes through the center of the opening 45 in the second direction D2 and extends in the first direction D1. Although not illustrated, the eleventh mask 50A1 or the twelfth mask 50A2 can also overlap the second center line Lc2.

[0176] The first mask group 50A includes one or more masks 50. The first mask group 50A can also include two or more masks 50. Figure 4 The illustrated first mask group 50A includes the eleventh mask 50A1, the twelfth mask 50A2, the thirteenth mask 50A3, and the fourteenth mask 50A4 arranged in this order in a direction from the third edge 43 toward the second center line Lc2.

[0177] The second mask set 50B includes one or more masks 50. The second mask set 50B can also include two or more masks 50. The number of masks 50 included in the second mask set 50B can also be the same as the number of masks 50 included in the first mask set 50A. Figure 4 The illustrated second mask set 50B includes a 21st mask 50B1, a 22nd mask 50B2, a 23rd mask 50B3, and a 24th mask 50B4 arranged in this order in a direction from the fourth side 44 toward the second center line Lc2.

[0178] Although not illustrated, the mask device 15 can also have a member that partially overlaps the mask 50 in plan view. The member can be fixed to the sides of the frame 40 in a manner that crosses the opening 45. The member can be in contact with the second face 552 of the mask 50. One example of the member can include a pair of end portions fixed to the third side 43 and the fourth side 44. One example of the member can also be a member that includes a pair of end portions fixed to the first side 41 and the second side 42 and is positioned in a gap between two masks 50 adjacent in the second direction D2.

[0179] The frame 40 will be described in detail. The first side 41 and the second side 42 can also apply tension to the mask 50 in the first direction D1. For example, the first side 41 and the second side 42 can be elastically deformed in a direction toward the opening 45.

[0180] For example, the first side 41 can be positioned inside a line L11. The line L11 indicates the position of the outer side face 41a of the first side 41 before deformation. The reference sign d11 indicates the amount of deformation of the first side 41 in the first direction D1. The amount of deformation d11 can be larger as it is closer to the second center line Lc2. The line L11 can also be set as a straight line connecting the corners 46 positioned at both ends of the first side 41.

[0181] For example, the second side 42 can be positioned inside a line L12. The line L12 indicates the position of the outer side face 42a of the second side 42 before deformation. The reference sign d12 indicates the amount of deformation of the second side 42 in the first direction D1. The amount of deformation d12 can also be larger as it is closer to the second center line Lc2. The line L12 can also be set as a straight line connecting the corners 46 positioned at both ends of the second side 42.

[0182] The "inside" refers to the side toward the opening 45. The "outside" refers to the side away from the opening 45.

[0183] Figure 5is a plan view that enlarges a portion of the first edge 41. In a case where the first edge 41 is elastically deformed inward, a restoring force F toward the outside is generated in the first edge 41. Similarly, a restoring force toward the outside is also generated in the second edge 42. Therefore, the mask 50 is pulled outward in the first direction Dl by the first edge 41 and the second edge 42. Thus, it is possible to suppress generation of deformation and slack in the mask 50.

[0184] In the following description, the tension applied to the mask 50 is sometimes also indicated by a reference sign TXX. "XX" is an arbitrary letter or number. For example, the tension applied to the 14th mask 50A4 is indicated by TA4. For example, the tension applied to the central first mask 50C1 is indicated by TC1.

[0185] In the following description, the restoring force generated in the first edge 41 at the position of the mask 50XX is sometimes also indicated by a reference sign FXX. For example, the restoring force generated in the first edge 41 at the position of the 14th mask 50A4 is indicated by FA4. For example, the restoring force generated in the first edge 41 at the position of the central first mask 50C1 is indicated by FC1.

[0186] In the following description, the deformation amount of the first edge 41 at the position of the mask 50XX is sometimes also indicated by a reference sign dXX. For example, the deformation amount of the first edge 41 at the position of the 14th mask 50A4 is indicated by the reference sign dA4. For example, the deformation amount of the first edge 41 at the position of the central first mask 50C1 is indicated by the reference sign dC1.

[0187] The first edge 41 and the second edge 42 are subjected to a reaction force from the mask 50. In the following description, the reaction force to which the first edge 41 is subjected from the mask 50XX is sometimes also indicated by a reference sign RXX. For example, the reaction force to which the first edge 41 is subjected from the 14th mask 50A4 is indicated by the reference sign RA4. For example, the reaction force to which the first edge 41 is subjected from the central first mask 50C1 is indicated by the reference sign RC1.

[0188] In the following description, in a case where the common structure of each mask is described, the term "mask 50" and the reference sign are sometimes used. In addition, with respect to the tension, the restoring force, and the reaction force, in a case where the common feature of each mask 50 is described, the terms "tension T", "restoring force F", "reaction force R", and the like and the reference signs are sometimes used.

[0189] The mask 50 is fixed to the first edge 41 and the second edge 42 by the fixing portion 47. For example, as shown in FIG. 2, the mask 50 is fixed to the first edge 41 and the second edge 42 by the fixing portion 47. Figure 5As shown, the fixing part 47 includes a welding part 47a. The welding part 47a is formed by fusing a portion of the mask 50 with a portion of the frame 40. The welding part 47a is formed, for example, by irradiating the end 51 of the mask 50, which overlaps with the first frame surface 401 of the frame 40, with a laser. The fixing part 47 may also include multiple welding parts 47a. The welding parts 47a may also be arranged along the inner edge of the first side 41 when viewed from above.

[0190] Explain sides 3 (43) and 4 (44). Figure 4 As shown, the third side 43 and the fourth side 44 can also be inelastically deformed. Alternatively, the third side 43 and the fourth side 44 can also be elastically deformed. Figure 6 This is a top view showing an example of the mask device 15.

[0191] like Figure 6 As shown, the third side 43 and the fourth side 44 can also be elastically deformed outwards. Line L21 indicates the position of the outer surface 43a of the third side 43 before deformation. Line L22 indicates the position of the outer surface 44a of the fourth side 44 before deformation.

[0192] The dimensions of frame 40 are described. The dimensions of frame 40 are set to appropriately generate a restoring force F. The first side 41 has a width W1. Width W1 is the dimension of the first side 41 in the first direction D1. Width W1 can be, for example, 20 mm or more, 60 mm or more, or 100 mm or more. Width W1 can be, for example, less than 150 mm, less than 200 mm, or less than 250 mm. The range of width W1 can be determined by a first group consisting of 20 mm, 60 mm, and 100 mm and / or a second group consisting of 150 mm, 200 mm, and 250 mm. The range of width W1 can also be determined by a combination of any one value from the first group and any one value from the second group. The range of width W1 can also be determined by a combination of any two values ​​from the first group. The range of width W1 can also be determined by a combination of any two values ​​from the second group. For example, the width W1 can be 20mm or more and 250mm or less, 20mm or more and 200mm or less, 20mm or more and 150mm or less, 20mm or more and 100mm or less, 20mm or more and 60mm or less, 60mm or more and 250mm or less, 60mm or more and 200mm or less, 60mm or more and 150mm or less, 60mm or more and 100mm or less, 100mm or more and 250mm or less, 100mm or more and 200mm or less, 100mm or more and 150mm or less, 150mm or more and 250mm or less, 150mm or more and 200mm or less, 200mm or more and 250mm or less.

[0193] The first side 41 has a cross-sectional area B1. The cross-sectional area B1 is calculated when the first side 41 is cut by a plane orthogonal to the second direction D2. For example, the cross-sectional area B1 can be 600 mm². 2 The above can be 1800mm 2 The above can also be 3000mm 2 The cross-sectional area B1 can be, for example, 4500 mm². 2 Below, it can be 6000mm 2 The following can also be 7500mm 2 The following is a range for the cross-sectional area B1, which can be determined by a length of 600 mm. 2 1800mm 2 and 3000mm 2 The first group and / or composed of 4500mm 2 6000mm 2 and 7500mm2 The range of cross-sectional area B1 can be determined by combining any one value from the first group and any one value from the second group. The range of cross-sectional area B1 can also be determined by combining any two values ​​from the first group. For example, the cross-sectional area B1 can be 600 mm². 2 Above and 7500mm 2 The following can be 600mm 2 Above and 6000mm 2 Below, 600mm is acceptable. 2 Above and 4500mm 2 Below, 600mm is acceptable. 2 Above and 3000mm 2 Below, 600mm is acceptable. 2 Above and 1800mm 2 Below, it can be 1800mm 2 Above and 7500mm 2 Below, it can be 1800mm 2 Above and 6000mm 2 Below, it can be 1800mm 2 Above and 4500mm 2 Below, 1800mm is acceptable. 2 Above and 3000mm 2 Below, it can be 3000mm 2 Above and 7500mm 2 Below, it can be 3000mm 2 Above and 6000mm 2 Below, it can be 3000mm 2 Above and 4500mm 2 Below, it can be 4500mm 2 Above and 7500mm 2 Below, it can be 4500mm 2 Above and 6000mm 2 The following can also be 6000mm 2 Above and 7500mm 2 the following.

[0194] The range of widths for the second side 42, the third side 43, and the fourth side 44 can be the range of widths W1 described above. The range of cross-sectional areas B1 can be the range of cross-sectional areas B1 described above.

[0195] The mask 50 will be described in detail. Figure 7 FIG. 1 is a plan view showing an example of the mask 50. The mask 50 can also include a first side edge 501 and a second side edge 502 extending in the first direction Dl, and a first end 503 and a second end 504 when viewed in plan. The first end 503 and the second end 504 are end portions of the mask 50 in the first direction Dl.

[0196] The through-hole group 53 of the intermediate portion 52 includes a plurality of through-holes 56 regularly arranged when viewed in plan. The through-holes 56 can also be periodically arranged in two directions. For example, the through-holes 56 can also be periodically arranged in the first direction Dl and the second direction D2.

[0197] One through-hole group 53 corresponds to one organic device 100. For example, a plurality of first organic layers 130A included in one organic device 100 is composed of an evaporation material that has passed through a plurality of through-holes 56 of one through-hole group 53. The mask 50 includes at least one through-hole group 53. The mask 50 can also include two or more through-hole groups 53 arranged in the first direction Dl.

[0198] The mask 50 has a size Ml 1 in the first direction Dl. The size Ml 1 can be, for example, 600 mm or more, 800 mm or more, or 1000 mm or more. The size Ml 1 can be, for example, 1200 mm or less, 1500 mm or less, or 2000 mm or less. The range of the size Ml 1 can be determined by a first group consisting of 600 mm, 800 mm, and 1000 mm and / or a second group consisting of 1200 mm, 1500 mm, and 2000 mm. The range of the size Ml 1 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the size Ml 1 can also be determined by a combination of any two of the values included in the first group described above. The range of the size Ml 1 can also be determined by a combination of any two of the values included in the second group described above. For example, the size Ml 1 can be 600 mm or more and 2000 mm or less, 600 mm or more and 1500 mm or less, 600 mm or more and 1200 mm or less, 600 mm or more and 1000 mm or less, 600 mm or more and 800 mm or less, 800 mm or more and 2000 mm or less, 800 mm or more and 1500 mm or less, 800 mm or more and 1200 mm or less, 800 mm or more and 1000 mm or less, 1000 mm or more and 2000 mm or less, 1000 mm or more and 1500 mm or less, 1000 mm or more and 1200 mm or less, 1200 mm or more and 2000 mm or less, 1200 mm or more and 1500 mm or less, 1500 mm or more and 2000 mm or less.

[0199] The mask 50 has a size M21 in the second direction D2. The size M21 can be, for example, 50 mm or more, 100 mm or more, or 150 mm or more. The size M21 can be, for example, 200 mm or less, 300 mm or less, or 410 mm or less. The range of the size M21 can also be determined by the first group consisting of 50 mm, 100 mm, and 150 mm and / or the second group consisting of 200 mm, 300 mm, and 410 mm. The range of the size M21 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the size M21 can also be determined by a combination of any two of the values included in the first group described above. The range of the size M21 can also be determined by a combination of any two of the values included in the second group described above. For example, the size M21 can be 50 mm or more and 410 mm or less, 50 mm or more and 300 mm or less, 50 mm or more and 200 mm or less, 50 mm or more and 150 mm or less, 50 mm or more and 100 mm or less, 100 mm or more and 410 mm or less, 100 mm or more and 300 mm or less, 100 mm or more and 200 mm or less, 100 mm or more and 150 mm or less, 150 mm or more and 410 mm or less, 150 mm or more and 300 mm or less, 150 mm or more and 200 mm or less, 200 mm or more and 410 mm or less, 200 mm or more and 300 mm or less, or 300 mm or more and 410 mm or less.

[0200] Next, the cross-sectional configuration of the mask 50 will be described. Figure 8 is a cross-sectional view illustrating an example of the mask 50.

[0201] The mask 50 includes a base material 55 and a through-hole 56 that penetrates the base material 55. The base material 55 includes a first surface 551 and a second surface 552. The through-hole 56 penetrates the base material 55 from the first surface 551 to the second surface 552.

[0202] The through-hole 56 can include a first recessed portion 561, a second recessed portion 562, and a connecting portion 563 that connects the first recessed portion 561 and the second recessed portion 562. The first recessed portion 561 is a recessed portion located on the first surface 551 and recessed toward the second surface 552. The second recessed portion 562 is a recessed portion located on the second surface 552 and recessed toward the first surface 551. The through-hole 56 is configured by connecting the first recessed portion 561 and the second recessed portion 562. The first recessed portion 561 is formed by processing the base material 55 from the first surface 551 side using etching or a laser, or the like. The second recessed portion 562 is formed by processing the base material 55 from the second surface 552 side using etching or a laser, or the like.

[0203] The first recess 561 has a size r1 when viewed in plan view. The second recess 562 has a size r2 when viewed in plan view. The size r2 can also be larger than the size r1. For example, the outline of the second recess 562 can also enclose the outline of the first recess 561 when viewed in plan view.

[0204] The connecting portion 563 can also have a continuous outline throughout a circumference. The connecting portion 563 can also be located between the first surface 551 and the second surface 552. The connecting portion 563 can also divide a through-hole 56 whose opening area becomes the smallest when the mask 50 is viewed in plan view, into a through portion 564.

[0205] The size r of the through portion 564 can be, for example, 10 μm or more, 15 μm or more, 20 μm or more, or 25 μm or more. In addition, the size r of the through portion 564 can be, for example, 40 μm or less, 45 μm or less, 50 μm or less, or 55 μm or less. The range of the size r of the through portion 564 can be determined by the first group consisting of 10 μm, 15 μm, 20 μm, and 25 μm and / or the second group consisting of 40 μm, 45 μm, 50 μm, and 55 μm. The range of the size r of the through portion 564 can be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the size r of the through portion 564 can also be determined by a combination of any two of the values included in the first group. The range of the size r of the through portion 564 can also be determined by a combination of any two of the values included in the second group. For example, the size r of the through portion 564 can be 10 μm or more and 55 μm or less, 10 μm or more and 50 μm or less, 10 μm or more and 45 μm or less, 10 μm or more and 40 μm or less, 10 μm or more and 25 μm or less, 10 μm or more and 20 μm or less, 10 μm or more and 15 μm or less, 15 μm or more and 55 μm or less, 15 μm or more and 50 μm or less, 15 μm or more and 45 μm or less, 15 μm or more and 40 μm or less, 15 μm or more and 25 μm or less, 15 μm or more and 20 μm or less, 20 μm or more and 55 μm or less, 20 μm or more and 50 μm or less, 20 μm or more and 45 μm or less, 20 μm or more and 40 μm or less, 20 μm or more and 25 μm or less, 25 μm or more and 55 μm or less, 25 μm or more and 50 μm or less, 25 μm or more and 45 μm or less, 25 μm or more and 40 μm or less, 40 μm or more and 55 μm or less, 40 μm or more and 50 μm or less, 40 μm or more and 45 μm or less, 45 μm or more and 55 μm or less, 45 μm or more and 50 μm or less, or 50 μm or more and 55 μm or less.

[0206] The size r of the through portion 564 is demarcated by light that passes through the through hole 56. Specifically, parallel light is made to be incident on one of the first face 551 and the second face 552 of the mask 50 in the normal direction of the mask 50, and is made to pass through the through hole 56 and be emitted from the other of the first face 551 and the second face 552. The size of the region occupied by the emitted light in the face direction of the mask 50 is adopted as the size r of the through portion 564.

[0207] In Figure 8 In the above embodiment, an example in which the second surface 552 of the substrate 55 remains between the two adjacent second recesses 562 is shown, but the present embodiment is not limited to this. Although not shown, etching can also be performed in a manner in which the two adjacent second recesses 562 are connected. That is, there can be a portion in which the second surface 552 of the substrate 55 does not remain between the two adjacent second recesses 562.

[0208] The materials of the mask 50 and the frame 40 will be described. As the main material of the mask 50 and the frame 40, a nickel-containing iron alloy can be used. The iron alloy can contain cobalt in addition to nickel. For example, as the material of the substrate 55 of the mask 50, an iron alloy in which the total content of nickel and cobalt is 28% by mass or more and 54% by mass or less, and the content of cobalt is 0% by mass or more and 6% by mass or less can be used. Thereby, the difference between the coefficient of thermal expansion of the mask 50 and the frame 40 and the coefficient of thermal expansion of the substrate 110 including glass can be reduced. Thus, it is possible to suppress a decrease in the dimensional accuracy and the positional accuracy of the layer formed on the substrate 110 by the vapor deposition process due to thermal expansion of the mask 50, the frame 40, the substrate 110, and the like.

[0209] The total content of nickel and cobalt in the substrate 55 can be 28% by mass or more and 38% by mass or less. In this case, as a specific example of the nickel-containing or nickel- and cobalt-containing iron alloy, a Invar alloy material, a super Invar alloy material, a hyper Invar alloy material (ultra Invar material), or the like can be given. The Invar alloy material is an iron alloy containing 34% by mass or more and 38% by mass or less of nickel, and the balance of iron and inevitable impurities. The super Invar alloy material is an iron alloy containing 30% by mass or more and 34% by mass or less of nickel, cobalt, and the balance of iron and inevitable impurities. The hyper Invar alloy material is an iron alloy containing 28% by mass or more and 34% by mass or less of nickel, 2% by mass or more and 7% by mass or less of cobalt, 0.1% by mass or more and 1.0% by mass or less of manganese, 0.10% by mass or less of silicon, 0.01% by mass or less of carbon, the balance of iron, and inevitable impurities.

[0210] The total content of nickel and cobalt in the mask 50 can be 38% by mass or more and 54% by mass or less. For example, the mask 50 can also be composed of an iron alloy containing 38% by mass or more and 54% by mass or less of nickel, and the balance of iron and inevitable impurities. Such a mask 50 can also be manufactured by a plating method.

[0211] In the case where the temperature of the mask 50, the frame 40, and the substrate 110 does not reach a high temperature at the time of the evaporation treatment, it is not necessary to set the coefficient of thermal expansion of the mask 50 and the frame 40 to a value equivalent to the coefficient of thermal expansion of the substrate 110. In this case, as the material constituting the mask 50, a material other than the above-described iron alloy can also be used. For example, an iron alloy other than the above-described iron alloy containing nickel, such as an iron alloy containing chromium, can also be used. As the iron alloy containing chromium, for example, an iron alloy known as so-called stainless steel can be used. In addition, an alloy other than the iron alloy, such as nickel or a nickel-cobalt alloy, can also be used.

[0212] The thickness TO of the mask 50 can be, for example, 8 μm or more, 10 μm or more, 13 μm or more, or 15 μm or more. In addition, the thickness TO can be, for example, 20 μm or less, 30 μm or less, 40 μm or less, or 50 μm or less. The range of the thickness TO can be determined by a first group consisting of 8 μm, 10 μm, 13 μm, and 15 μm and / or a second group consisting of 20 μm, 30 μm, 40 μm, and 50 μm. The range of the thickness TO can be determined by a combination of any one of the values included in the above-described first group and any one of the values included in the above-described second group. The range of the thickness TO can be determined by a combination of any two of the values included in the above-described first group. The range of the thickness TO can also be determined by a combination of any two of the values included in the above-described second group. For example, the thickness TO can be 8 μm or more and 50 μm or less, 8 μm or more and 40 μm or less, 8 μm or more and 30 μm or less, 8 μm or more and 20 μm or less, 8 μm or more and 15 μm or less, 8 μm or more and 13 μm or less, 8 μm or more and 10 μm or less, 10 μm or more and 50 μm or less, 10 μm or more and 40 μm or less, 10 μm or more and 30 μm or less, 10 μm or more and 20 μm or less, 10 μm or more and 15 μm or less, 10 μm or more and 13 μm or less, 13 μm or more and 50 μm or less, 13 μm or more and 40 μm or less, 13 μm or more and 30 μm or less, 13 μm or more and 20 μm or less, 13 μm or more and 15 μm or less, 15 μm or more and 50 μm or less, 15 μm or more and 40 μm or less, 15 μm or more and 30 μm or less, 15 μm or more and 20 μm or less, 20 μm or more and 50 μm or less, 20 μm or more and 40 μm or less, 20 μm or more and 30 μm or less, 30 μm or more and 50 μm or less, 30 μm or more and 40 μm or less, or 40 μm or more and 50 μm or less.

[0213] By setting the thickness T0 to 50 μm or less, the deposition material 7 can be inhibited from adhering to the wall surface of the through-hole 56 before passing through the through-hole 56. Thus, the utilization efficiency of the deposition material 7 can be improved. Further, by setting the thickness T0 to 8 μm or more, the strength of the mask 50 can be ensured, and thus the mask 50 can be inhibited from being damaged or deformed.

[0214] As a method of measuring the thickness T0, a contact type measurement method is employed. As the contact type measurement method, "MT1271" of a long ruler HEIDENHAIM-METRO manufactured by Hidenhain Co. is used, which has a plunger of a ball bushing guide type.

[0215] Next, a manufacturing device for manufacturing the above-described mask device 15 will be described. Figure 9 is a block diagram showing an example of the manufacturing device 60. Figure 10 is a plan view showing an example of the manufacturing device 60. The manufacturing device 60 can also be provided with a pressing mechanism 62, a displacement measurement mechanism 61, and a control device 63. The manufacturing device 60 can also be provided with an observation device 73, a fixing device 74, a stretching device 76, and the like.

[0216] The pressing mechanism 62 presses the first edge 41 and the second edge 42 of the frame 40 in a direction toward the opening 45. For example, the pressing mechanism 62 presses the first edge 41 and the second edge 42 inward in the first direction Dl. The displacement measurement mechanism 61 measures the deformation amounts of the first edge 41 and the second edge 42 in the first direction Dl.

[0217] The control device 63 controls the pressing mechanism 62 based on information related to the deformation amounts of the first edge 41 and the second edge 42. If the first edge 41 and the second edge 42 are elastically deformed inward, a restoring force toward the outside is generated on the first edge 41 and the second edge 42. Thus, the mask 50 is pulled outward in the first direction Dl by the first edge 41 and the second edge 42. By adjusting the deformation amounts of the first edge 41 and the second edge 42, the tension applied to the mask 50 can be adjusted. By controlling the pressing mechanism 62 in such a manner that the deformation amounts of the first edge 41 and the second edge 42 become target deformation amounts, the tension applied to the mask 50 can be appropriately adjusted.

[0218] The functions of the control device 63 can also be implemented by software that works in a computer such as a personal computer, for example. For example, it can be that, by installing a program in a computer, the computer functions as the control device 63.

[0219] The program can be pre-installed in the computer at the time of shipment of the computer, or can be installed in the computer after the shipment of the computer by using a non-transitory recording medium on which the program is recorded and which is readable by the computer. The type of the recording medium is not particularly limited, and various recording media such as a portable recording medium such as a disk, an optical disk, or the like, or a fixed-type recording medium such as a hard disk device, a memory, or the like can be considered. In addition, the program can be distributed via a communication line such as the Internet. Further, in the case where the program is distributed via the communication line, in a server for distribution, at least temporarily, a recording medium in which the program of the present embodiment is stored is present.

[0220] The observation device 73 observes the mask 50. The observation device 73 includes, for example, a camera. The observation device 73 detects the through-hole 56, the contour, or the like of the mask 50. The observation device 73 can also detect a mark formed in the mask 50.

[0221] The observation device 73 can also be supported by the moving mechanism 71. The moving mechanism 71 moves the observation device 73 in the first direction Dl, the second direction D2, or the like. For example, the moving mechanism 71 can include a first moving device 72 that moves the observation device 73 in the first direction Dl. The moving mechanism 71 can also include a second moving device that moves the first moving device 72 in the second direction D2. The observation device 73 observes the mask 50 at a plurality of positions, and thus can obtain information about the position of the mask 50 with respect to the frame 40.

[0222] The stretching device 76 applies tension to the mask 50 in the first direction Dl in a state in which the mask 50 is not fixed to the frame 40. As described later, the stretching device 76 includes, for example, a jig. The stretching device 76 can also carry the mask 50 in the in-plane direction of the first frame surface 401 of the frame 40.

[0223] The fixing device 74 fixes the mask 50 to the first edge 41 and the second edge 42. The fixing device 74, for example, irradiates laser light toward the mask 50. The above-described welding portion 47a is formed between the mask 50 and the frame 40, and thus the mask 50 is fixed to the frame 40. The fixing device 74 can also fix the mask 50 to the frame 40 in a state in which the stretching device 76 applies tension to the mask 50.

[0224] The fixing device 74 can also be supported by the moving mechanism 71. The moving mechanism 71 that moves the fixing device 74 can be the same as or different from the moving mechanism 71 that moves the observation device 73.

[0225] The control device 63 can also control the stretching device 76 and the fixing device 74 based on information from the observation device 73. For example, the control device 63 controls the stretching device 76 so that the position of the through-hole 56, the contour, the mark, or the like of the mask 50 is directed toward the target position. For example, the control device 63 controls the position of the stretching device 76, the tension applied to the mask 50 by the stretching device 76, or the like. The control device 63 can also fix the mask 50 to the frame 40 by controlling the fixing device 74 in a case where the difference between the actual position of the mask 50 and the target position is below a threshold value.

[0226] The control device 63 that controls the stretching device 76 and the fixing device 74 can be the same as or different from the control device 63 that controls the pressing mechanism 62.

[0227] The pressing mechanism 62 that presses the first edge 41 will be described in detail. The pressing mechanism 62 that presses the first edge 41 can include a plurality of pressing devices. Preferably, the pressing mechanism 62 includes five or more pressing devices that press the first edge 41. For example, the pressing mechanism 62 can include six pressing devices that press the first edge 41. Each of the pressing devices can press the outer side surface 41a of the first edge 41 inward.

[0228] The pressing devices that press the first edge 41 can be classified into a central group 62C, a first group 62A, and a second group 62B. As shown in FIG. 2, the first group 62A is located between the central group 62C and the third edge 43 in the second direction D2. The second group 62B is located between the central group 62C and the fourth edge 44 in the second direction D2. Figure 10

[0229] The central group 62C includes one or two pressing devices. In a case where the above-described N, which represents the number of masks 50, is even, the central group 62C can include two pressing devices. In a case where N is odd, the central group 62C can include one pressing device. In the present embodiment, the central group 62C includes a first central pressing device 62C1 and a second central pressing device 62C2. As shown in FIG. 2, the first central pressing device 62C1 can be located between the second center line Lc2 and the third edge 43. The second central pressing device 62C2 can be located between the second center line Lc2 and the fourth edge 44. Although not shown, the first central pressing device 62C1 or the second central pressing device 62C2 can overlap the second center line Lc2. Figure 10

[0230] The first group 62A includes two or more pressing devices. In the present embodiment, the first group 62A includes a 11th pressing device 62A1 and a 12th pressing device 62A2 that are arranged in order in a direction from the third edge 43 toward the second center line Lc2.

[0231] ​​The second group 62B includes two or more pressing devices. The number of pressing devices included in the second group 62B can also be the same as the number of pressing devices included in the first group 62A. In the present embodiment, the second group 62B includes a 21st pressing device 62B1 and a 22nd pressing device 62B2 arranged in order in a direction from the fourth side 44 toward the second center line Lc2.

[0232] The pressing devices can also be arranged at intervals along the second direction D2. In the example shown, the 11th pressing device 62A1, the 12th pressing device 62A2, the first central pressing device 62C1, the second central pressing device 62C2, the 22nd pressing device 62B2, and the 21st pressing device 62B1 are arranged in order in a direction from the third side 43 toward the fourth side 44. Figure 10

[0233] It is preferable that the interval between two pressing devices adjacent in the second direction D2 be 500 mm or less. By reducing the interval, the amount of deformation of the first side 41 at each position of the first side 41 can be finely adjusted. As a result, the tension applied by the first side 41 to each mask 50 can be inhibited from deviating from the target tension. The interval is calculated based on the position of the center of the portion of the pressing device that contacts the first side 41. Reference numerals 65A1, 65A2, 65C1, 65C2, 65B2, and 65B1 indicate the portions of the 11th pressing device 62A1, the 12th pressing device 62A2, the first central pressing device 62C1, the second central pressing device 62C2, the 22nd pressing device 62B2, and the 21st pressing device 62B1 that contact the first side 41.

[0234] ​The interval between the two adjacent pressing devices can be, for example, 50 mm or more, 100 mm or more, or 200 mm or more. The interval between the two adjacent pressing devices can be, for example, 300 mm or less, 400 mm or less, or 500 mm or less. The interval between the two adjacent pressing devices can be in a range determined by the first group consisting of 50 mm, 100 mm, and 200 mm and / or the second group consisting of 300 mm, 400 mm, and 500 mm. The interval between the two adjacent pressing devices can be in a range determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The interval between the two adjacent pressing devices can be in a range determined by a combination of any two of the values included in the first group. The interval between the two adjacent pressing devices can be in a range determined by a combination of any two of the values included in the second group. For example, the interval between the two adjacent pressing devices can be 50 mm or more and 500 mm or less, 50 mm or more and 400 mm or less, 50 mm or more and 300 mm or less, 50 mm or more and 200 mm or less, 50 mm or more and 100 mm or less, 100 mm or more and 500 mm or less, 100 mm or more and 400 mm or less, 100 mm or more and 300 mm or less, 100 mm or more and 200 mm or less, 200 mm or more and 500 mm or less, 200 mm or more and 400 mm or less, 200 mm or more and 300 mm or less, 300 mm or more and 500 mm or less, 300 mm or more and 400 mm or less, or 400 mm or more and 500 mm or less.

[0235] The reference sign S2_AA denotes an interval between two pressing devices belonging to the first group 62A. The reference sign S2_AC denotes an interval between a pressing device belonging to the first group 62A and a pressing device belonging to the central group 62C. The reference sign S2_CC denotes an interval between two pressing devices belonging to the central group 62C. The reference sign S2_BC denotes an interval between a pressing device belonging to the second group 62B and a pressing device belonging to the central group 62C. The reference sign S2_BB denotes an interval between two pressing devices belonging to the second group 62B. The interval S2_AA, the interval S2_AC, the interval S2_CC, the interval S2_BC, and the interval S2_BB can be the same or different.

[0236] The pressing mechanism 62 that presses the second edge 42 can also include a plurality of pressing devices. It is preferable that the pressing mechanism 62 include five or more pressing devices that press the second edge 42. In the case where the pressing mechanism 62 includes five or more pressing devices that press the second edge 42, the pressing devices can be arranged in a row in the direction in which the second edge 42 extends. Figure 10In the illustrated example, the pressing mechanism 62 includes six pressing devices that press the second edge 42. Each pressing device can also press the outer side 42a of the second edge 42 inward.

[0237] The structure of the pressing devices that press the second edge 42 can also be the same as the structure of the pressing devices that press the first edge 41. For example, as illustrated in FIG. 6, the pressing mechanism 62 can include the eleventh pressing device 62A1, the twelfth pressing device 62A2, the first central pressing device 62C1, the second central pressing device 62C2, the twenty-second pressing device 62B2, and the twenty-first pressing device 62B1 that press the second edge 42 in the direction from the third edge 43 toward the fourth edge 44. Figure 10

[0238] Preferably, the interval between two pressing devices located on the second edge 42 and adjacent in the second direction D2 is also 500 mm or less. As a range of values for the interval between two pressing devices located on the second edge 42 and adjacent in the second direction D2, the range of values for the interval between two pressing devices located on the first edge 41 and adjacent in the second direction D2 can be used. The pressing devices located on the first edge 41 and the pressing devices located on the second edge 42 can also be arranged in the first direction D1. For example, the first central pressing device 62C1 located on the first edge 41 and the first central pressing device 62C1 located on the second edge 42 can be located at the same coordinate in the second direction D2.

[0239] Figure 10 ​The illustrated reference sign S_11 represents a distance in the first direction D1 between the pressing device that presses the first edge 41 and the pressing device that presses the second edge 42. The distance S_11 can be, for example, 1300 mm or more, 1500 mm or more, or 1700 mm or more. The distance S_11 can be, for example, 1900 mm or less, 2100 mm or less, or 2400 mm or less. The range of the distance S_11 can be determined by the first group consisting of 1300 mm, 1500 mm, and 1700 mm and / or the second group consisting of 1900 mm, 2100 mm, and 2400 mm. The range of the distance S_11 can also be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the distance S_11 can also be determined by a combination of any two of the values included in the first group. The range of the distance S_11 can also be determined by a combination of any two of the values included in the second group. For example, the distance S_11 can be 1300 mm or more and 2400 mm or less, 1300 mm or more and 2100 mm or less, 1300 mm or more and 1900 mm or less, 1300 mm or more and 1700 mm or less, 1300 mm or more and 1500 mm or less, 1500 mm or more and 2400 mm or less, 1500 mm or more and 2100 mm or less, 1500 mm or more and 1900 mm or less, 1500 mm or more and 1700 mm or less, 1700 mm or more and 2400 mm or less, 1700 mm or more and 2100 mm or less, 1700 mm or more and 1900 mm or less, 1900 mm or more and 2400 mm or less, 1900 mm or more and 2100 mm or less, 2100 mm or more and 2400 mm or less.

[0240] In the case of describing the structure common to each pressing device, the expression and reference sign such as "pressing device 62x" are sometimes used.

[0241] The displacement measurement mechanism 61 will be described in detail. The displacement measurement mechanism 61 that measures the deformation amount of the first edge 41 can also include a plurality of displacement gauges. Preferably, the displacement measurement mechanism 61 includes a displacement gauge that measures the deformation amount of the first edge 41 in the vicinity of each pressing device. It is preferable that the number of displacement gauges that measure the deformation amount of the first edge 41 is equal to or more than the number of pressing devices that press the first edge 41. For example, in the case where the number of pressing devices that press the first edge 41 is five, it is preferable that the displacement measurement mechanism 61 includes five or more displacement gauges. Thereby, the displacement gauges can be arranged in the vicinity of all the pressing devices.

[0242] AsFigure 9 The displacement meters that measure the amount of deformation of the first side 41 in the vicinity of the pressing devices can also be classified into a central measurement group 61C, a first measurement group 61A, and a second measurement group 61B, as shown. The first measurement group 61A is located between the central measurement group 61C and the third side 43 in the second direction D2. The second measurement group 61B is located between the central measurement group 61C and the fourth side 44 in the second direction D2.

[0243] The central measurement group 61C includes one or two displacement meters. In the case where the central group 62C of the pressing mechanism 62 includes one pressing device as described above, the central measurement group 61C can also include one displacement meter. In the case where the central group 62C includes two pressing devices, the central measurement group 61C can also include two displacement meters. In the present embodiment, the central measurement group 61C includes a first central displacement meter 61C1 and a second central displacement meter 61C2. The first central displacement meter 61C1 is located in the vicinity of the first central pressing device 62C1. The second central displacement meter 61C2 is located in the vicinity of the second central pressing device 62C2.

[0244] The first measurement group 61A includes two or more displacement meters. In the present embodiment, the first measurement group 61A includes a 11th displacement meter 61A1 and a 12th displacement meter 61A2 arranged in this order in a direction from the third side 43 toward the second center line Lc2. The 11th displacement meter 61A1 is located in the vicinity of the 11th pressing device 62A1. The 12th displacement meter 61A2 is located in the vicinity of the 12th pressing device 62A2.

[0245] The second measurement group 61B includes two or more displacement meters. In the present embodiment, the second measurement group 61B includes a 21st displacement meter 61B1 and a 22nd displacement meter 61B2 arranged in this order in a direction from the fourth side 44 toward the second center line Lc2. The 21st displacement meter 61B1 is located in the vicinity of the 21st pressing device 62B1. The 22nd displacement meter 61B2 is located in the vicinity of the 22nd pressing device 62B2.

[0246] In the case of describing the structures common to the displacement meters, the term and reference numeral "displacement meter 61x" are sometimes used.

[0247] Figure 11is a drawing illustrating an example of the pressing device 62x and the displacement meter 61x. The displacement meter 61x is located in the vicinity of the pressing device 62x. The interval S_F between the pressing device 62x and the displacement meter 61x in the second direction D2 is preferably 100 mm or less. By reducing the interval S_F, the pressing device 62x can be controlled more precisely on the basis of the measurement result of the displacement meter 61x. Thus, the amount of deformation of the first edge 41 at each position can be adjusted precisely. As a result, the tension applied by the first edge 41 to each mask 50 can be suppressed from deviating from the target tension. The interval S_F is calculated on the basis of the position of the center of the portion 65 of the pressing device 62x that contacts the first edge 41 and the position of the first edge 41 measured by the displacement meter 61x. In the case where the displacement meter 61x contacts the first edge 41, the position of the first edge 41 measured by the displacement meter 61x is the position of the center of the portion 64 of the displacement meter 61x that contacts the first edge 41. During the period in which the mask device 15 is manufactured using the manufacturing device 60, the interval S_F is preferably maintained constant. That is, the displacement meter 61x is preferably stationary with respect to the pressing device 62x in the second direction D2. The displacement meter 61x that is stationary with respect to the pressing device 62x in the second direction D2 during the period in which the mask device 15 is manufactured using the manufacturing device 60 is also referred to as a stationary-type displacement meter 61x.

[0248] The interval S_F may, for example, be 1 mm or more, 5 mm or more, or 10 mm or more. The interval S_F may, for example, be 20 mm or less, 50 mm or less, or 100 mm or less. The range of the interval S_F can be determined by a first group consisting of 1 mm, 5 mm, and 10 mm and / or a second group consisting of 20 mm, 50 mm, and 100 mm. The range of the interval S_F can also be determined by a combination of any one of the values included in the above first group and any one of the values included in the above second group. The range of the interval S_F can also be determined by a combination of any two of the values included in the above first group. The range of the interval S_F can also be determined by a combination of any two of the values included in the above second group. For example, the interval S_F can be 1 mm or more and 100 mm or less, 1 mm or more and 50 mm or less, 1 mm or more and 20 mm or less, 1 mm or more and 10 mm or less, 1 mm or more and 5 mm or less, 5 mm or more and 100 mm or less, 5 mm or more and 50 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 100 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 100 mm or less, 20 mm or more and 50 mm or less, or 50 mm or more and 100 mm or less.

[0249] The displacement gauge 61x may also include a sensor head 611 and a support 612. The support 612 supports the sensor head 611 in a manner that allows the sensor head 611 to move in the first direction D1. The sensor head 611 includes an end that contacts the outer surface 41a of the first side 41. The displacement gauge 61x detects the amount of deformation of the first side 41 based on the position of the end of the sensor head 611.

[0250] The pressing device 62x may also include a rod 621 and a drive unit 622. The drive unit 622 drives the rod 621 in the first direction D1. The drive unit 622 may include, for example, a motor. The rod 621 includes an end that contacts the outer surface 41a of the first side 41. The pressing device 62x may also include a load cell such as a force sensor. The load cell detects the pressing force applied to the frame 40 by the rod 621.

[0251] like Figure 10 As shown, the displacement measuring mechanism 61 may also include a first auxiliary displacement gauge 61D and a second auxiliary displacement gauge 61E. The first auxiliary displacement gauge 61D measures the deformation of the first side 41 at a distance S_D from the outer surface 43a of the third side 43 along the second direction D2. The second auxiliary displacement gauge 61E measures the deformation of the first side 41 at a distance S_E from the outer surface 44a of the fourth side 44 along the second direction D2. The structures of the first auxiliary displacement gauge 61D and the second auxiliary displacement gauge 61E may be the same as or different from the structures of the displacement gauges in the central measuring group 61C, the first measuring group 61A, and the second measuring group 61B.

[0252] The distance S_D and the distance S_E can be, for example, 1 mm or more, 5 mm or more, or 20 mm or more. The distance S_D and the distance S_E can be, for example, 50 mm or less, 100 mm or less, or 200 mm or less. The range of the distance S_D and the distance S_E can be determined by the first group consisting of 1 mm, 5 mm, and 20 mm and / or the second group consisting of 50 mm, 100 mm, and 200 mm. The range of the distance S_D and the distance S_E can be determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The range of the distance S_D and the distance S_E can be determined by a combination of any two of the values included in the first group. The range of the distance S_D and the distance S_E can be determined by a combination of any two of the values included in the second group. For example, the distance S_D and the distance S_E can be 1 mm or more and 200 mm or less, 1 mm or more and 100 mm or less, 1 mm or more and 50 mm or less, 1 mm or more and 20 mm or less, 1 mm or more and 5 mm or less, 5 mm or more and 200 mm or less, 5 mm or more and 100 mm or less, 5 mm or more and 50 mm or less, 5 mm or more and 20 mm or less, 20 mm or more and 200 mm or less, 20 mm or more and 100 mm or less, 20 mm or more and 50 mm or less, 50 mm or more and 200 mm or less, 50 mm or more and 100 mm or less, or 100 mm or more and 200 mm or less.

[0253] It is preferable that the interval between the two displacement gauges adjacent in the second direction D2 be 500 mm or less. By reducing the interval, the amount of deformation at each position of the first edge 41 can be accurately measured. Therefore, the amount of deformation at each position of the first edge 41 can be precisely adjusted using the pressing device. As a result, the tension applied by the first edge 41 to each mask 50 can be suppressed from deviating from the target tension.

[0254] The interval between the two adjacent displacement gauges can be, for example, 50 mm or more, 100 mm or more, or 200 mm or more. The interval between the two adjacent displacement gauges can be, for example, 300 mm or less, 400 mm or less, or 500 mm or less. The interval between the two adjacent displacement gauges can be in a range determined by the first group consisting of 50 mm, 100 mm, and 200 mm and / or the second group consisting of 300 mm, 400 mm, and 500 mm. The interval between the two adjacent displacement gauges can be in a range determined by a combination of any one of the values included in the first group and any one of the values included in the second group. The interval between the two adjacent displacement gauges can also be in a range determined by a combination of any two of the values included in the first group. The interval between the two adjacent displacement gauges can also be in a range determined by a combination of any two of the values included in the second group. For example, the interval between the two adjacent displacement gauges can be 50 mm or more and 500 mm or less, 50 mm or more and 400 mm or less, 50 mm or more and 300 mm or less, 50 mm or more and 200 mm or less, 50 mm or more and 100 mm or less, 100 mm or more and 500 mm or less, 100 mm or more and 400 mm or less, 100 mm or more and 300 mm or less, 100 mm or more and 200 mm or less, 200 mm or more and 500 mm or less, 200 mm or more and 400 mm or less, 200 mm or more and 300 mm or less, 300 mm or more and 500 mm or less, 300 mm or more and 400 mm or less, or 400 mm or more and 500 mm or less.

[0255] The reference sign S1_AA denotes an interval between two displacement gauges belonging to the first measurement group 61A. The reference sign S1_AC denotes an interval between a displacement gauge belonging to the first measurement group 61A and a displacement gauge belonging to the central measurement group 61C. The reference sign S1_CC denotes an interval between two displacement gauges belonging to the central measurement group 61C. The reference sign S1_BC denotes an interval between a displacement gauge belonging to the second measurement group 61B and a displacement gauge belonging to the central measurement group 61C. The reference sign S1_BB denotes an interval between two displacement gauges belonging to the second measurement group 61B. The interval S1_AA, the interval S1_AC, the interval S1_CC, the interval S1_BC, and the interval S1_BB can be the same or different.

[0256] Preferably, the interval between the adjacent displacement gauge and the auxiliary displacement gauge in the second direction D2 is 500 mm or less. As a range of values of the interval between the displacement gauge and the auxiliary displacement gauge, the range of values of the "interval between two displacement gauges" described above can be adopted.

[0257] The displacement measuring mechanism 61 that measures the amount of deformation of the second edge 42 can also include a plurality of displacement meters. Preferably, the displacement measuring mechanism 61 includes a displacement meter that measures the amount of deformation of the second edge 42 in the vicinity of each pressing device. Preferably, the number of displacement meters that measure the amount of deformation of the second edge 42 is equal to or greater than the number of pressing devices that press the second edge 42. For example, in the case where the number of pressing devices that press the second edge 42 is five, it is preferable that the displacement measuring mechanism 61 include five or more displacement meters. The displacement measuring mechanism 61 that measures the amount of deformation of the second edge 42 can also include a first auxiliary displacement meter 61D and a second auxiliary displacement meter 61E.

[0258] The interval between the pressing device and the displacement meter in the second direction D2 on the second edge 42 is also preferably 100 mm or less. As the range of values of the interval between the pressing device and the displacement meter in the second direction D2 on the second edge 42, the range of values of the interval between the pressing device and the displacement meter in the second direction D2 on the first edge 41 can be used.

[0259] The range of the interval between two adjacent displacement meters in the second direction D2 on the second edge 42 is also 500 mm or less. As the range of the interval between two adjacent displacement meters in the second direction D2 along the second edge 42, the range of values of the interval between two adjacent displacement meters along the first edge 41 can be used.

[0260] The displacement meter located on the first edge 41 and the displacement meter located on the second edge 42 can be arranged in the first direction D1. For example, the first central displacement meter 61C1 located on the first edge 41 and the first central displacement meter 61C1 located on the second edge 42 can be located at the same coordinates in the second direction D2.

[0261] The displacement measuring mechanism 61 that measures the amount of deformation of the second edge 42 can also include a first auxiliary displacement meter 61D and a second auxiliary displacement meter 61E.

[0262] Next, a method of manufacturing the mask device 15 using the manufacturing device 60 will be described. Figure 12 is a flowchart showing an example of the manufacturing method. First, the frame 40 is prepared (step S1). The frame 40 can also be placed on a not-shown worktable of the manufacturing device 60. Next, the reference position of the frame 40 is determined (step S2). For example, in a state where the pressing mechanism 62 does not press the frame 40, the position of the frame 40 is measured using the displacement measuring mechanism 61. For example, in a state where the rod 621 of the pressing device 62x is separated from the frame 40, the sensor head 611 of the displacement meter 61x is brought into contact with the frame 40. Thereby, the position of the frame 40 when the frame 40 is not deformed, i.e., the reference position, is determined.

[0263] Next, a mask mounting process S3 of mounting the N masks 50 to the frame 40 in order is performed. The process of mounting the kth (k is an integer of 1 or more and N or less) mask 50 to the frame 40 is also referred to as the kth mask mounting process S3(k). The mask mounting process S3 includes the first mask mounting process S3(l) to the Nth mask mounting process S3(N) which are performed N times.

[0264] In the mask mounting process S3, as shown in Figure 12 the adjustment process S4 and the arrangement process S5 are repeated N times. The adjustment process and the arrangement process in the kth mask mounting process S3(k) are also referred to as the kth adjustment process S4(k) and the kth arrangement process S5(k).

[0265] In the adjustment process S4, the pressing force applied to the first edge 41 and the second edge 42 in the direction toward the opening 45 by the pressing mechanism 62 is adjusted. Specifically, the adjustment process S4 adjusts the pressing force so that the deformation amount of the first edge 41 and the second edge 42 when each mask 50 is fixed to the first edge 41 and the second edge 42 becomes a target deformation amount. In the manufacturing method of the mask device 15, the pressing force applied to the first edge 41 and the second edge 42 by the pressing mechanism 62 is also referred to as a first pressing force.

[0266] The target deformation amount is determined in advance at each position of the first edge 41 and each position of the second edge 42. The first edge 41 and the second edge 42 deformed by the target deformation amount can apply a target tension to each mask 50 based on the elastic restoring force in a state where the N masks 50 are mounted to the frame 40. The target deformation amount can also be calculated based on the shape, the physical properties, and the like of the frame 40. For example, the relationship between the restoring force and the deformation amount can be calculated using the finite element method based on the three-dimensional shape of the frame 40 created by CAD or the like. The target deformation amount can also be calculated based on this relationship.

[0267] In the following description, the first pressing force applied to the first edge 41 in the kth adjustment process S4(k) is sometimes also denoted by a reference sign P(k). In addition, in the kth adjustment process S4(k), the first pressing force applied to the first edge 41 by the first pressing device 62A1, the second pressing device 62A2, the first pressing device 62B1, the second pressing device 62B2, the first central pressing device 62C1, and the second central pressing device 62C2 are sometimes also denoted by reference signs P(k)_A1, P(k)_A2, P(k)_B1, P(k)_B2, P(k)_C1, P(k)_C2.

[0268] The average value of the first pressing force applied to the first edge 41 by the pressing devices of the first group 62A in the kth adjustment process S4(k) is sometimes also indicated by the reference sign P(k)_A. The average value of the first pressing force applied to the first edge 41 by the pressing devices of the second group 62B in the kth adjustment process S4(k) is sometimes also indicated by the reference sign P(k)_B. The average value of the first pressing force applied to the first edge 41 by the pressing devices of the central group 62C in the kth adjustment process S4(k) is sometimes also indicated by the reference sign P(k)_C.

[0269] In the following description, the amount of deformation generated on the first edge 41 in the kth adjustment process S4(k) is sometimes also indicated by the reference sign d(k). In addition, the amounts of deformation measured by the 11th displacement gauge 61 Al, the 12th displacement gauge 61A2, the 21st displacement gauge 61B1, the 22nd displacement gauge 61B2, the first central displacement gauge 61C1, the second central displacement gauge 61C2, the first auxiliary displacement gauge 61D, and the second auxiliary displacement gauge 61E in the kth adjustment process S4(k) are sometimes also indicated by the reference signs d(k)_Al, d(k)_A2, d(k)_Bl, d(k)_B2, d(k)_Cl, d(k)_C2, d(k)_D, and d(k)_E.

[0270] In the following description, the target amount of deformation at the position at which the 11th displacement gauge 61 Al measures the first edge 41 is sometimes also indicated by the reference sign T_A1. Similarly, the target amounts of deformation corresponding to the 12th displacement gauge 61A2, the 21st displacement gauge 61B1, the 22nd displacement gauge 61B2, the first central displacement gauge 61C1, the second central displacement gauge 61C2, the first auxiliary displacement gauge 61D, and the second auxiliary displacement gauge 61E are sometimes also indicated by the reference signs T_A2, T_B1, T_B2, T_C1, T_C2, T_D, and T_E.

[0271] Figure 13is a flowchart showing an example of the adjustment process S4 and the configuration process S5. The kth adjustment process S4(k) can also include a pressing process S41(k) and a determination process S42(k). The pressing process S41(k) adjusts the 1st pressing force P(k) against the frame 40. The determination process S42(k) determines whether or not Ad(k) is equal to or less than the 1st threshold value TH1. Ad(k) is an absolute value of a difference between the deformation amount d(k) and a target deformation amount. Ad(k) is, for example, an absolute value of a difference between the deformation amount d(k)_C1 measured by the 1st central displacement gauge 61C1 and the target deformation amount T_C1. The determination process S42(k) can also determine whether or not Ad(k) is equal to or less than the 1st threshold value TH1 with respect to a plurality of measured values of the deformation amount. For example, the determination process S42(k) can also determine whether or not a difference between the deformation amount d(k)_C1 and the target deformation amount T_C1, a difference between the deformation amount d(k)_A1 and the target deformation amount T_A1, and a difference between the deformation amount d(k)_A2 and the target deformation amount T_A2 are equal to or less than the 1st threshold value TH1. The determination process S42(k) can also determine whether or not Ad(k) is equal to or less than the 1st threshold value TH1 with respect to the above-described deformation amounts d(k)_A1, d(k)_A2, d(k)_B1, d(k)_B2, d(k)_C1, d(k)_C2, d(k)_D, d(k)_E, respectively.

[0272] The first threshold value TH1 can also be determined based on the accuracy of the required tension. The first threshold value TH1 can be, for example, 0.01 μm or more, 0.02 μm or more, or 0.05 μm or more. The first threshold value TH1 can be, for example, 0.10 μm or less, 0.15 μm or less, or 0.20 μm or less. The range of the first threshold value TH1 can also be determined by a first group consisting of 0.01 μm, 0.02 μm, and 0.05 μm and / or a second group consisting of 0.10 μm, 0.15 μm, and 0.20 μm. The range of the first threshold value TH1 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the first threshold value TH1 can also be determined by a combination of any two of the values included in the first group described above. The range of the first threshold value TH1 can also be determined by a combination of any two of the values included in the second group described above. For example, the first threshold value TH1 can be 0.01 μm or more and 0.20 μm or less, 0.01 μm or more and 0.15 μm or less, 0.01 μm or more and 0.10 μm or less, 0.01 μm or more and 0.05 μm or less, 0.01 μm or more and 0.02 μm or less, 0.02 μm or more and 0.20 μm or less, 0.02 μm or more and 0.15 μm or less, 0.02 μm or more and 0.10 μm or less, 0.02 μm or more and 0.05 μm or less, 0.05 μm or more and 0.20 μm or less, 0.05 μm or more and 0.15 μm or less, 0.05 μm or more and 0.10 μm or less, 0.10 μm or more and 0.20 μm or less, 0.10 μm or more and 0.15 μm or less, or 0.15 μm or more and 0.20 μm or less.

[0273] In the configuration process S5, the end portion 51 of the mask 50 is fixed to the first edge 41 and the second edge 42. The kth fixing process S5(k) can include a position adjustment process S51(k) of adjusting the position of the kth mask 50, a determination process S52(k), and a fixing process S53(k).

[0274] The position adjustment process S51(k) can also adjust the position of the mask 50 in a state where the tension is applied to the mask 50. By using the movement mechanism 71 and the stretching device 76 described above, it is possible to adjust the position of the mask 50 in a state where the tension is applied to the mask 50. The position adjustment process S51(k) can also control the movement mechanism 71 and the stretching device 76 in such a manner that the position of the mask 50 with respect to the frame 40 becomes a target position. For example, the position adjustment process S51(k) can also control the stretching device 76 and the fixing device 74 based on information from the observation device 73 described above.

[0275] The determination process S52(k) determines whether the mask error is below the second threshold value TH2. The mask error is, for example, an absolute value of a difference between the actual position and the target position of the mark of the mask 50. The determination process S52(k) can also determine whether the mask error is below the second threshold value TH2 with respect to one mark. The determination process S52(k) can also determine whether the mask error is below the second threshold value TH2 with respect to two or more marks. The determination process S52(k) can also determine whether the mask error is below the second threshold value TH2 based on the position of an element other than the mark. For example, the determination process S52(k) can also determine whether the mask error is below the second threshold value TH2 based on the position of the outline of the mask 50, the through-hole 56, or the like. The mask error is also referred to as PPA. The "PPA" refers to Pixel Position Accuracy.

[0276] The second threshold value TH2 can be, for example, 0.1 μm or more, 0.2 μm or more, or 0.5 μm or more. The second threshold value TH2 can be, for example, 1.0 μm or less, 2.0 μm or less, or 3.0 μm or less. The range of the second threshold value TH2 can be determined by the first group consisting of 0.1 μm, 0.2 μm, and 0.5 μm and / or the second group consisting of 1.0 μm, 2.0 μm, and 3.0 μm. The range of the second threshold value TH2 can be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the second threshold value TH2 can be determined by a combination of any two of the values included in the first group described above. The range of the second threshold value TH2 can be determined by a combination of any two of the values included in the second group described above. For example, the second threshold value TH2 can be 0.1 μm or more and 3.0 μm or less, 0.1 μm or more and 2.0 μm or less, 0.1 μm or more and 1.0 μm or less, 0.1 μm or more and 0.5 μm or less, 0.1 μm or more and 0.2 μm or less, 0.2 μm or more and 3.0 μm or less, 0.2 μm or more and 2.0 μm or less, 0.2 μm or more and 1.0 μm or less, 0.2 μm or more and 0.5 μm or less, 0.5 μm or more and 3.0 μm or less, 0.5 μm or more and 2.0 μm or less, 0.5 μm or more and 1.0 μm or less, 1.0 μm or more and 3.0 μm or less, 1.0 μm or more and 2.0 μm or less, or 2.0 μm or more and 3.0 μm or less.

[0277] In the fixing process S53(k), the k-th mask 50 is fixed to the first edge 41 and the second edge 42. By using the fixing device 74 described above, the mask 50 can be fixed to the first edge 41 and the second edge 42.

[0278] The releasing process S6 can also be performed after the mask mounting process S3. The releasing process S6 makes the first pressing force against the frame 40 zero. For example, the rods 621 of the respective pressing devices of the pressing mechanism 62 are made to retreat from the frame 40. Then, the final confirmation process S7 can also be performed. The final confirmation process S7 measures the amount of deformation finally generated on the first edge 41 and the second edge 42. The amount of deformation finally generated on the first edge 41 and the second edge 42 is also referred to as the final deformation amount.

[0279] The final confirmation process S7 can also determine whether the difference between the final deformation amount and the target deformation amount is the above-described first threshold value TH1 or less. The final confirmation process S7 can also determine a plurality of final deformation amounts at each position of the first edge 41 and the second edge 42. The final confirmation process S7 can also determine the final deformation amount measured by all of the displacement meters included in the manufacturing device 60.

[0280] Referring to Figure 10 and Figure 14 to Figure 20 , the manufacturing method of the mask device 15 will be specifically described.

[0281] As shown in Figure 10 , the position of the frame 40 is measured using the displacement measurement mechanism 61 in a state where the frame 40 is not deformed. Next, the mask mounting process S3 of mounting N masks 50 to the frame 40 is performed. In the present embodiment, an example in which the masks 50 are mounted to the first edge 41 and the second edge 42 in the second direction D2 in order from far to near from the center of the frame 40 is described. In a case where the distance from the center of the frame 40 in the second direction D2 is the same, the mask 50 located between the third edge 43 and the second center line Lc2 is mounted to the first edge 41 and the second edge 42 before the mask 50 located between the fourth edge 44 and the second center line Lc2. Therefore, the 11th mask 50A1, the 21st mask 50B1, the 12th mask 50A2, the 22nd mask 50B2, the 13th mask 50A3, the 23rd mask 50B3, the 14th mask 50A4, the 24th mask 50B4, the central first mask 50C1, and the central second mask 50C2 are mounted to the first edge 41 and the second edge 42 in this order.

[0282] The first mask mounting process S3(1) of mounting the first mask 50 to the frame 40 is performed. The first mask 50 is the 11th mask 50A1. The first mask mounting process S3(1) includes the first adjustment process S4(1) and the first arrangement process S5(1).

[0283] Figure 14 is a view showing the first adjustment process S4(1). The first adjustment process S4(1) includes a pressing process S41(1) and a determination process S42(1). As shown in Figure 14 , in the pressing process S41(1), the first edge 41 and the second edge 42 are pressed in a state where the mask 50 is not mounted to the frame 40. The control device 63 controls the pressing mechanism 62 so that the deformation amounts d(1)_A1, d(1)_A2, d(1)_C(1), and the like become the target deformation amounts.

[0284] The determination step S42(1) determines whether or not Δd(1) is equal to or less than the first threshold value TH1. In a case where Δd(1) exceeds the first threshold value TH1, the pressing step S41(1) is performed again. In a case where Δd(1) is equal to or less than the first threshold value TH1, the first arrangement step S5(1) is entered. In a case where Δd(1) is equal to or less than the first threshold value TH1, the first pressing force applied to the first edge 41 and the second edge 42 by the pressing means of the pressing mechanism 62 can also be recorded.

[0285] The control device 63 can also control the pressing mechanism 62 in such a manner that the difference between the first pressing forces applied to the first edge 41 by the respective pressing means of the pressing mechanism 62 in the first adjustment step S4(1) is within a prescribed range. For example, the control device 63 can also control the pressing mechanism 62 in such a manner that the first ratio RA1 and the second ratio RA2 become equal to or less than prescribed values. The first ratio RA1 is the ratio of the average first pressing force P(1)_A of the first group 62A to the average first pressing force P(1)_C of the central group 62C in the first adjustment step S4(1). The second ratio RA2 is the ratio of the average first pressing force P(1)_B of the second group 62B to the average first pressing force P(1)_C of the central group 62C in the first adjustment step S4(1). The average first pressing force P(1)_A is the average value of the first pressing forces applied to the first edge 41 by the pressing means of the first group 62A in the first adjustment step S4(1). The average first pressing force P(1)_B is the average value of the first pressing forces applied to the first edge 41 by the pressing means of the second group 62B in the first adjustment step S4(1). The average first pressing force P(1)_C is the average value of the first pressing forces applied to the first edge 41 by the pressing means of the central group 62C in the first adjustment step S4(1).

[0286] The first ratio RA1 and the second ratio RA2 may be, for example, 0.6 or more, 0.7 or more, 0.8 or more, or 0.9 or more. The first ratio RA1 and the second ratio RA2 may be, for example, 1.1 or less, 1.2 or less, 1.3 or less, or 1.4 or less. The range of the first ratio RA1 and the second ratio RA2 can also be determined by a first group consisting of 0.6, 0.7, 0.8, and 0.9, and / or a second group consisting of 1.1, 1.2, 1.3, and 1.4. The range of the first ratio RA1 and the second ratio RA2 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the first ratio RA1 and the second ratio RA2 can also be determined by a combination of any two of the values included in the first group described above. The range of the first ratio RA1 and the second ratio RA2 can also be determined by a combination of any two of the values included in the second group described above. For example, the first ratio RA1 and the second ratio RA2 can be 0.6 or more and 1.4 or less, 0.6 or more and 1.3 or less, 0.6 or more and 1.2 or less, 0.6 or more and 1.1 or less, 0.6 or more and 0.9 or less, 0.6 or more and 0.8 or less, 0.6 or more and 0.7 or less, 0.7 or more and 1.4 or less, 0.7 or more and 1.3 or less, 0.7 or more and 1.2 or less, 0.7 or more and 1.1 or less, 0.7 or more and 0.9 or less, 0.7 or more and 0.8 or less, 0.8 or more and 1.4 or less, 0.8 or more and 1.3 or less, 0.8 or more and 1.2 or less, 0.8 or more and 1.1 or less, 0.8 or more and 0.9 or less, 0.9 or more and 1.4 or less, 0.9 or more and 1.3 or less, 0.9 or more and 1.2 or less, 0.9 or more and 1.1 or less, 1.1 or more and 1.4 or less, 1.1 or more and 1.3 or less, 1.1 or more and 1.2 or less, 1.2 or more and 1.4 or less, 1.2 or more and 1.3 or less, or 1.3 or more and 1.4 or less.

[0287] The first configuration step S5(1) includes a position adjustment step S51(1), a determination step S52(1), and a fixing step S53(1). Figure 15 FIG. 5 is a view showing the position adjustment step S51(1) and the determination step S52(1).

[0288] In the position adjustment step S51(1), as shown in FIG. 5, the position of the first electrode 2 is adjusted to the position of the second electrode 3. Figure 15As shown, the position of the 11th mask 50A1 is adjusted while tension is applied to it. In the position adjustment step S51(1), the position of the 11th mask 50A1 is adjusted using the tensioning device 76. The tensioning device 76 may also use clamps to apply tension to the 11th mask 50A1. The tensioning device 76 may, for example, include two clamps 761 mounted on the first end 51 and two clamps 761 mounted on the second end 51. By adjusting the position of each clamp 761, the position and tension of the 11th mask 50A1 can be adjusted.

[0289] In the determination process S52(1), the position of the 11th mask 50A1 is observed using the observation device 73. The determination process S52(1) determines whether the mask error of the 11th mask 50A1 is below the second threshold TH2. If the mask error exceeds the second threshold TH2, the position adjustment process S51(1) is performed again. If the mask error is below the second threshold TH2, the process proceeds to the fixing process S53(1).

[0290] Figure 16 This diagram illustrates the fixing process S53(1). In the fixing process S53(1), for example, a laser is irradiated onto the end 51 of the 11th mask 50A1. As a result, a welding portion 47a is formed at the end 51. The 11th mask 50A1 is fixed to the first side 41 and the second side 42 via the welding portion 47a. Figure 16 As shown, the portion of end 51 located outside the weld portion 47a can also be removed. Alternatively, after mounting N masks 50 onto the frame 40, the portion of end 51 located outside the weld portion 47a can be removed.

[0291] Next, as Figure 17 As shown, the second mask installation process S3(2) is performed to install the second mask 50 onto the frame 40. The second mask 50 is the 21st mask 50B1. The second mask installation process S3(2) includes a second adjustment process S4(2) and a second configuration process S5(2).

[0292] Next, as Figure 18 As shown, the third mask installation process S3(3) to the eighth mask installation process S3(8) are performed sequentially. Thus, each mask 50 of the first mask group 50A and each mask 50 of the second mask group 50B are installed on the frame 40. The third mask installation process S3(3) to the eighth mask installation process S3(8) includes the third adjustment process S4(3) to the eighth adjustment process S4(8) and the third configuration process S5(3) to the eighth configuration process S5(8).

[0293] Next, as Figure 19As shown, the 9th mask mounting step S3(9) to the 10th mask mounting step S3(10) are sequentially performed. Thereby, each mask 50 of the central mask set 50C is mounted to the frame 40. The 9th mask mounting step S3(9) to the 10th mask mounting step S3(10) include the 9th adjustment step S4(9) to the 10th adjustment step S4(10) and the 9th arrangement step S5(9) to the 10th arrangement step S5(10).

[0294] Next, the releasing step S6 is performed. For example, as shown in Figure 20 , the rod 621 of each pressing device of the pressing mechanism 62 is caused to be separated from the frame 40. Next, the final confirmation step S7 is performed. In the final confirmation step S7, it is determined whether or not the difference between the final deformation amount of the 1st side 41 and the target deformation amount is equal to or less than the 1st threshold value TH1. In the case where the difference is equal to or less than the 1st threshold value TH1, the mask device 15 is recognized as a good product.

[0295] Figure 21 is a view showing an example of the progress of the 1st pressing force P_A1 applied by the 11th pressing device 62A1 to the 1st side 41 in the 1st adjustment step S4(1) to the 10th adjustment step S4(10). As shown in Figure 21 , the 1st pressing force P_A1 can be reduced during 2 or more adjustment steps S4. In Figure 21 the example shown, the 1st pressing force P_A1 is reduced during the 2nd adjustment step S4(2) to the 7th adjustment step S4(7).

[0296] As shown in Figure 21 , the 1st pressing force P_A1 can also become zero before the final adjustment step S4, that is, before the 10th adjustment step S4(10). In Figure 21 the example shown, the 1st pressing force P_A1 becomes zero in the 7th adjustment step S4(7).

[0297] Reference sign P(11)_A1 refers to the 1st pressing force P_A1 at the releasing step S6. The 1st pressing force P(11)_A1 is zero.

[0298] Figure 22 is a view showing an example of the progress of the 1st pressing force P_A2 applied by the 12th pressing device 62A2 to the 1st side 41 in the 1st adjustment step S4(1) to the 10th adjustment step S4(10). As shown in Figure 22 , the 1st pressing force P_A2 can be reduced during 2 or more adjustment steps S4. In Figure 22 the example shown, the 1st pressing force P_A2 is reduced during the 4th adjustment step S4(4) to the 9th adjustment step S4(9). The period during which the 1st pressing force P_A2 is reduced can also occur after the period during which the 1st pressing force P_A1 is reduced.

[0299] like Figure 22 As shown, the first pressing force P_A2 can also become zero before the final adjustment step S4, that is, before the 10th adjustment step S4(10). Figure 22 In the example shown, in the 9th adjustment step S4(9), the 1st pressing force P_A2 becomes zero. The 1st pressing force P_A2 can also become zero after the 1st pressing force P_A1 becomes zero.

[0300] The label P(11)_A2 refers to the first pressing pressure P_A2 during the release process S6. The first pressing pressure P(11)_A2 is zero.

[0301] Figure 23 This diagram illustrates an example of the displacement of the first pressing force P_C1 applied by the first central pressing device 62C1 to the first side 41 in the first adjustment steps S4(1) to the tenth adjustment steps S4(10). Figure 23 As shown, the first pressing force P_C1 can be reduced during two or more adjustment steps S4. In Figure 23 In the example shown, the first pressing force P_C1 decreases during the period from the sixth adjustment step S4(6) to the tenth adjustment step S4(10). The period during which the first pressing force P_C1 decreases may also occur after the period during which the first pressing force of the pressing device in the first group 62A decreases.

[0302] like Figure 23 As shown, the first pressing force P_C1 can also be greater than zero during the final adjustment process S4, that is, during the Nth adjustment process S4(N).

[0303] The label P(11)_C1 refers to the first pressing pressure P_C1 during the release process S6. The first pressing pressure P(11)_C1 is zero.

[0304] The first pressing force P_C1 can also display its maximum value during the U-th adjustment step S4(U) (U is an integer greater than 1 and less than N). This allows the difference between the deformation amount in the central measuring group 61C and the target deformation amount to be suppressed. Figure 23 In the example shown, the first pressing force P_C1 exhibits its maximum value during the sixth adjustment step S4(6). In the Uth adjustment step S4(U), the first central pressing device 62C1 applies the first pressing force P(U)_C1 to the first side 41.

[0305] The equation U≥N / 2 can also hold. That is, it can also mean that in the latter half of the adjustment process S4, the first pressing pressure P_C1 shows its maximum value.

[0306] The ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 may be, for example, 1.05 or more, 1.10 or more, or 1.15 or more. The ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 may be, for example, 1.20 or less, 1.30 or less, or 1.50 or less. The first pressing force P(1)_C1 is the first pressing force applied by the first central pressing device 62C1 to the first edge 41 in the first adjustment process S4(1).

[0307] The range of the ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 can also be determined by a first group consisting of 1.05, 1.10, and 1.15 and / or a second group consisting of 1.20, 1.30, and 1.50. The range of the ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 can be determined by a combination of any one of the values included in the above first group and any one of the values included in the above second group. The range of the ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 can also be determined by a combination of any two of the values included in the above first group. The range of the ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 can also be determined by a combination of any two of the values included in the above second group. For example, the ratio of the first pressing force P(U)_C1 to the first pressing force P(1)_C1 can be 1.05 or more and 1.50 or less, 1.05 or more and 1.30 or less, 1.05 or more and 1.20 or less, 1.05 or more and 1.15 or less, 1.05 or more and 1.10 or less, 1.10 or more and 1.50 or less, 1.10 or more and 1.30 or less, 1.10 or more and 1.20 or less, 1.10 or more and 1.15 or less, 1.15 or more and 1.50 or less, 1.15 or more and 1.30 or less, 1.15 or more and 1.20 or less, 1.20 or more and 1.50 or less, 1.20 or more and 1.30 or less, or 1.30 or more and 1.50 or less.

[0308] may be, Figure 21 The transition of the first pressing force P_A1 illustrated is also implemented in the 21st pressing device 62B1. Figure 22 The transition of the first pressing force P_A2 illustrated can also be implemented in the 22nd pressing device 62B2. Figure 23 The transition of the first pressing force P_C1 illustrated can also be implemented in the second central pressing device 62C2.

[0309] As described above, the pressing mechanism 62 of the manufacturing apparatus 60 is provided with 5 or more pressing devices that press the first edge 41 at intervals of 500 mm or less in the second direction D2. Therefore, the amount of deformation of the first edge 41 at each position of the first edge 41 can be precisely adjusted. Thus, even if the frame 40 is upsized, the tension of the first edge 41 applied to each mask 50 can be suppressed from deviating from the target tension.

[0310] As described above, the displacement measuring mechanism 61 of the manufacturing apparatus 60 is provided with 5 or more displacement gauges that measure the amount of deformation of the first edge 41 at positions 100 mm or less from the pressing devices in the second direction. Therefore, the amount of deformation of the first edge 41 at each position of the first edge 41 can be precisely adjusted. Thus, even if the frame 40 is upsized, the tension of the first edge 41 applied to each mask 50 can be suppressed from deviating from the target tension.

[0311] A disassembly method of detaching the masks 50 from the mask apparatus 15 can also be implemented. In the disassembly method, the masks 50 can be detached from the frame 40 while pressing forces are applied to the first edge 41 and the second edge 42. Thus, the masks 50 can be detached from the frame 40 while the deformation of the frame 40 is maintained. In addition, the first pressing force applied to the frame 40 in the manufacturing method of the mask apparatus 15 can be estimated. For the disassembly method, the displacement measuring mechanism 61, the pressing mechanism 62, and the control device 63 of the manufacturing apparatus 60 described above can also be used. In the disassembly method of the mask apparatus 15, the pressing forces applied to the first edge 41 and the second edge 42 by the pressing mechanism 62 are referred to as second pressing forces.

[0312] Figure 24 is a flowchart illustrating an example of the disassembly method. First, the mask apparatus 15 is prepared (step RS1). The mask apparatus 15 can be placed on a not-illustrated stage. Next, a reference position of the frame 40 is determined (step RS2). Specifically, the final amounts of deformation of the first edge 41 and the second edge 42 of the frame 40 are measured using the displacement measuring mechanism 61. The final amounts of deformation of the first edge 41 and the second edge 42 are calculated with respect to the straight line L11 and the straight line L12 that connect the corners 46 as reference.

[0313] Next, a mask detachment step RS3 of sequentially detaching N masks 50 from the frame 40 is implemented. A step of detaching the m-th (m is an integer of 1 or more and N or less) mask 50 from the frame 40 is also referred to as the m-th mask detachment step RS3(m). The mask detachment step RS3 includes N steps of the first mask detachment step RS3(1) to the N-th mask detachment step RS3(N).

[0314] In the mask detachment step RS3, as described above, the first edge 41 and the second edge 42 of the frame 40 are pressed by the pressing mechanism 62. The pressing forces applied to the first edge 41 and the second edge 42 by the pressing mechanism 62 are the second pressing forces. Figure 24The removal step RS4 and the reverse adjustment step RS5 are repeated N times as shown. The removal step and the reverse adjustment step in the mth mask detaching step RS3(k) are also referred to as the mth removal step RS4(m) and the mth reverse adjustment step RS5(m).

[0315] In the removal step RS4, the mask 50 is detached from the frame 40. For example, the mask 50 is cut. Thus, the reaction force received by the first edge 41 and the second edge 42 from the mask 50 is substantially zero.

[0316] In the reverse adjustment step RS5, the second pressing force applied by the pressing mechanism 62 to the first edge 41 and the second edge 42 in the direction toward the opening 45 is adjusted after the removal step RS5. Specifically, the second pressing force is adjusted in the reverse adjustment step RS5 so that the deformation amount of the first edge 41 and the second edge 42 after the detachment of the mask 50 from the first edge 41 and the second edge 42 becomes the final deformation amount.

[0317] In the following description, the second pressing force applied to the first edge 41 in the mth reverse adjustment step RS5(m) is sometimes also indicated by the reference sign RP(m). In addition, in the mth reverse adjustment step RS5(m), the second pressing force applied by the 11th pressing device 62A1, the 12th pressing device 62A2, the 21st pressing device 62B1, the 22nd pressing device 62B2, the 1st central pressing device 62C1, and the 2nd central pressing device 62C2 to the first edge 41 is sometimes also indicated by the reference signs RP(m)_A1, RP(m)_A2, RP(m)_B1, RP(m)_B2, RP(m)_C1, and RP(m)_C2.

[0318] The average value of the second pressing force applied by the pressing devices of the first group 62A to the first edge 41 in the mth reverse adjustment step RS5(m) is sometimes also indicated by the reference sign RP(m)_A. The average value of the second pressing force applied by the pressing devices of the second group 62B to the first edge 41 in the mth reverse adjustment step RS5(m) is sometimes also indicated by the reference sign RP(m)_B. The average value of the second pressing force applied by the pressing devices of the central group 62C to the first edge 41 in the mth reverse adjustment step RS5(m) is sometimes also indicated by the reference sign RP(m)_C.

[0319] Figure 25 is a flowchart showing an example of the removal step RS4 and the reverse adjustment step RS5. The mth removal step RS4(m) can include a cutting step RS41(m). In the cutting step RS41(m), the mth mask 50 is cut.

[0320] The reverse adjustment process RS5 may also include a pressing process RS51(m), a judgment process RS52(m), and a recording process RS53(m). In the pressing process RS51(m), after the cutting process RS41(m), the second pressing force RP(m) against the frame 40 is adjusted. The judgment process RS52(m) determines whether ΔRd(m) is below the third threshold TH3. ΔRd(m) is the absolute value of the difference between the deformation amount Rd(m) of the first side 41 during the pressing process RS51(m) and the final deformation amount. Similar to the judgment process S42(k) described above, the judgment process RS52(m) may also determine whether ΔRd(m) is below the third threshold TH3 based on the deformation amount measured by the first central displacement gauge 61C1. The judgment process RS52(m) may also determine whether ΔRd(m) is below the third threshold TH3 based on the measured values ​​of multiple deformation amounts. Similar to the determination process S42(k) described above, the determination process RS52(m) can also determine whether ΔRd(m) is below the third threshold TH3 based on each of the deformation measurements measured by the displacement gauges of the displacement measuring mechanism 61. The range of values ​​for the third threshold TH3 can be the range of values ​​for the first threshold TH1 described above.

[0321] Record process RS53(m) records ΔRd(m) as the second pressing pressure RP(m) when the third threshold TH3 is below.

[0322] like Figure 24 As shown, the release step RS6 can also be performed after the mask removal step RS3. The release step RS6 reduces the second pressing force against the frame 40 to zero. For example, it causes the levers 621 of each pressing device of the pressing mechanism 62 to disengage from the frame 40.

[0323] Reference Figure 20 as well as Figure 26 to Figure 29 The method for disassembling the mask device 15 is explained in detail.

[0324] like Figure 20 As shown, with N masks 50 fixed to the frame 40, the final deformation of the first side 41 and the second side 42 is measured using the displacement measuring mechanism 61. Next, a mask removal process RS3 is performed to remove the N masks 50 from the frame 40. In this embodiment, an example of removing the masks 50 from the frame 40 in the second direction D2 from the center of the frame 40 in order from near to far is described. Specifically, they are removed from the first side 41 and the second side 42 in the following order: central first mask 50C1, central second mask 50C2, 14th mask 50A4, 24th mask 50B4, 13th mask 50A3, 23rd mask 50B3, 12th mask 50A2, 22nd mask 50B2, 11th mask 50A1, and 21st mask 50B1.

[0325] The first mask mounting step RS3(1) of removing the first mask 50 from the frame 40 is executed. The first mask 50 is the central first mask 50C1. The first mask removal step RS3(1) includes a first removal step RS4(1) and a first reverse adjustment step RS5(1).

[0326] Figure 26 Fig. 6 is a view showing the first removal step RS4(1) and the first reverse adjustment step RS5(1). The first removal step RS4(1) includes a cutting step RS41(1). As shown in Fig. 6, the central first mask 50C1 is cut in the cutting step RS41(1). The end portion 51 of the central first mask 50C1 can remain in the frame 40. Figure 26

[0327] The first reverse adjustment step RS5(1) includes a pressing step RS51(1), a determination step RS52(1), and a recording step RS53(1).

[0328] As shown in Fig. 6, in the pressing step RS51(1), the first edge 41 and the second edge 42 are pressed after the central first mask 50C1 is removed. The control device 63 controls the pressing mechanism 62 so that the deformation amounts of the first edge 41 and the second edge 42 become final deformation amounts. Figure 26

[0329] The determination step RS52(1) determines whether or not the ΔRd(1) is equal to or less than the third threshold value TH3. In the case where the ΔRd(1) exceeds the third threshold value TH3, the pressing step RS51(1) is executed again. In the case where the ΔRd(1) is equal to or less than the third threshold value TH3, the recording step RS53(1) is entered. In the recording step RS53(1), the second pressing force applied to the first edge 41 and the second edge 42 by the pressing device of the pressing mechanism 62 is recorded as the second pressing force RP(1).

[0330] Next, as shown in Fig. 7, the second mask removal step RS3(2) of removing the second mask 50 from the frame 40 is executed. The second mask 50 is the central second mask 50C2. The second mask removal step RS3(2) includes a second removal step RS4(2) and a second reverse adjustment step RS5(2). Thus, each mask 50 of the central mask group 50C is removed from the frame 40. Figure 27

[0331] Next, as shown in Fig. 7, the second mask removal step RS3(2) of removing the second mask 50 from the frame 40 is executed. The second mask 50 is the central second mask 50C2. The second mask removal step RS3(2) includes a second removal step RS4(2) and a second reverse adjustment step RS5(2). Thus, each mask 50 of the central mask group 50C is removed from the frame 40. Figure 28 ​​​As shown, the 3rd mask removal process RS3(3) to the 8th mask removal process RS3(8) are sequentially performed. The 3rd mask removal process RS3(3) to the 8th mask removal process RS3(8) include the 3rd removal process RS4(3) to the 8th removal process RS4(8) and the 3rd reverse adjustment process RS5(3) to the 8th reverse adjustment process RS5(8).

[0332] Next, as shown in FIG. 6, the 9th mask removal process RS3(9) to the 10th mask removal process RS3(10) are sequentially performed. The 9th mask removal process RS3(9) to the 10th mask removal process RS3(10) include the 9th removal process RS4(9) to the 10th removal process RS4(10) and the 9th reverse adjustment process RS5(9) to the 10th reverse adjustment process RS5(10). Figure 29 Next, the release process RS6 is performed. For example, the rods 621 of the pressing mechanisms 62 of the respective pressing devices are caused to move away from the frame 40.

[0333]

[0334] FIG. 7 is a diagram showing an example of the progress of the 2nd pressing force RP_A1 applied by the 11th pressing device 62A1 to the 1st side 41 in the 1st reverse adjustment process RS5(1) to the 10th reverse adjustment process RS5(10). As shown in FIG. 7, the 2nd pressing force RP_A1 can increase during the reverse adjustment processes RS5 twice or more. In the example shown in FIG. 7, the 2nd pressing force RP_A1 increases during the 4th reverse adjustment process RS5(4) to the 9th reverse adjustment process RS5(9). Figure 30 Figure 30 Figure 30

[0335] As shown in FIG. 6, the 2nd pressing force RP_A1 can also be greater than zero from the reverse adjustment process RS5 after the 2nd time. In the example shown in FIG. 6, the 2nd pressing force RP_A1 is greater than zero in the 5th adjustment process RS5(5). Figure 30 Figure 30

[0336] Figure 31 FIG. 8 is a diagram showing an example of the progress of the 2nd pressing force RP_A2 applied by the 12th pressing device 62A2 to the 1st side 41 in the 1st reverse adjustment process RS5(1) to the 10th reverse adjustment process RS5(10). As shown in FIG. 8, the 2nd pressing force RP_A2 can also increase during the reverse adjustment processes RS5 twice or more. In the example shown in FIG. 8, the 2nd pressing force RP_A2 increases during the 2nd reverse adjustment process RS5(2) to the 7th reverse adjustment process RS5(7). Figure 31 Figure 31

[0337] As shown in FIG. 6, the 2nd pressing force RP_A1 can also be greater than zero from the reverse adjustment process RS5 after the 2nd time. In the example shown in FIG. 6, the 2nd pressing force RP_A1 is greater than zero in the 5th adjustment process RS5(5). Figure 31 ​​​​​​​As shown, the second pressing force RP_A2 can also be greater than zero from the second reverse adjustment step RS5 onwards. Figure 31 In the example shown, in the third adjustment step RS5(3), the second pressing pressure RP_A2 is greater than zero. The second pressing pressure RP_A2 can also be greater than zero before the second pressing pressure RP_A1 is greater than zero.

[0338] Figure 32 This diagram illustrates an example of the movement of the second pressing force RP_C1 applied to the first side 41 by the first central pressing device 62C1 during the first to tenth reverse adjustment steps RS5(10). Figure 32 As shown, the second pressing pressure RP_C1 can be increased during more than two reverse adjustment steps RS5. Figure 32 In the example shown, the second pressing force RP_C1 increases during the period from the first reverse adjustment step RS5(1) to the fifth reverse adjustment step RS5(5). The period during which the second pressing force RP_C1 increases may also occur before the period during which the second pressing force of the pressing device of the first group 62A increases.

[0339] like Figure 32 As shown, the second pressing pressure RP_C1 can also be greater than zero during the first reverse adjustment process RS5(1).

[0340] The second pressing force RP_C1 can also display its maximum value during the Q-th reverse adjustment process RS5(Q) (where Q is an integer greater than 1 and less than N). Figure 32 In the example shown, the second pressing force RP_C1 shows its maximum value during the fifth reverse adjustment step RS5(5).

[0341] The equation Q≤N / 2 can also hold. That is, it can also be that in the first half of the reverse adjustment process RS5, the second pressing pressure RP_C1 shows its maximum value.

[0342] During the final reverse adjustment step RS5, that is, during the Nth reverse adjustment step RS5(N), the first central pressing device 62C1 applies the second pressing force RP(N)_C1 to the first side 41.

[0343] The ratio of the second pressing force RP(Q)_C1 to the second pressing force RP(N)_C1 can be, for example, 1.05 or more, 1.10 or more, or 1.15 or more. The ratio of the second pressing force RP(Q)_C1 to the second pressing force RP(N)_C1 can be, for example, 1.20 or less, 1.30 or less, or 1.50 or less. The second pressing force RP(Q)_C1 is the second pressing force applied to the first side 41 by the first central pressing device 62C1 during the Q reverse adjustment process RS5(Q).

[0344] The range of the ratio of the 2nd pressing force RP(Q)_C1 to the 2nd pressing force RP(N)_C1 can also be determined by a 1st group consisting of 1.05, 1.10, and 1.15 and / or a 2nd group consisting of 1.20, 1.30, and 1.50. The ratio of the 2nd pressing force RP(Q)_C1 to the 2nd pressing force RP(N)_C1 can also be determined by a combination of any one of the values included in the 1st group described above and any one of the values included in the 2nd group described above. The ratio of the 2nd pressing force RP(Q)_C1 to the 2nd pressing force RP(N)_C1 can also be determined by a combination of any two of the values included in the 1st group described above. The ratio of the 2nd pressing force RP(Q)_C1 to the 2nd pressing force RP(N)_C1 can also be determined by a combination of any two of the values included in the 2nd group described above. For example, the ratio of the 2nd pressing force RP(Q)_C1 to the 2nd pressing force RP(N)_C1 can be 1.05 or more and 1.50 or less, can be 1.05 or more and 1.30 or less, can be 1.05 or more and 1.20 or less, can be 1.05 or more and 1.15 or less, can be 1.05 or more and 1.10 or less, can be 1.10 or more and 1.50 or less, can be 1.10 or more and 1.30 or less, can be 1.10 or more and 1.20 or less, can be 1.10 or more and 1.15 or less, can be 1.15 or more and 1.50 or less, can be 1.15 or more and 1.30 or less, can be 1.15 or more and 1.20 or less, can be 1.20 or more and 1.50 or less, can be 1.20 or more and 1.30 or less, or can be 1.30 or more and 1.50 or less.

[0345] Figure 30 The transition of the 2nd pressing force RP_A1 illustrated can also be implemented in the 21st pressing device 62B1. Figure 31 The transition of the 2nd pressing force RP_A2 illustrated can also be implemented in the 22nd pressing device 62B2. Figure 32 The transition of the 2nd pressing force RP_C1 illustrated can also be implemented in the 2nd central pressing device 62C2.

[0346] The control device 63 can also control the pressing mechanism 62 in such a manner that the difference between the second pressing forces applied by the pressing devices of the pressing mechanism 62 to the first edge 41 in the Nth reverse adjustment process RS5(N) is within a prescribed range. For example, the control device 63 can also control the pressing mechanism 62 in such a manner that the third ratio RA3 and the fourth ratio RA4 become prescribed values or less. The third ratio RA3 is the ratio of the average second pressing force RP(N)_A of the first group 62A to the average second pressing force RP(N)_C of the central group 62C in the Nth reverse adjustment process RS5(N). The fourth ratio RA4 is the ratio of the average second pressing force RP(N)_B of the second group 62B to the average second pressing force RP(N)_C of the central group 62C in the Nth reverse adjustment process RS5(N). The average second pressing force RP(N)_A is the average value of the second pressing forces applied by the pressing devices of the first group 62A to the first edge 41 in the Nth reverse adjustment process RS5(N). The average second pressing force RP(N)_B is the average value of the second pressing forces applied by the pressing devices of the second group 62B to the first edge 41 in the Nth reverse adjustment process RS5(N). The average second pressing force RP(N)_C is the average value of the second pressing forces applied by the pressing devices of the central group 62C to the first edge 41 in the Nth reverse adjustment process RS5(N).

[0347] The third ratio RA3 and the fourth ratio RA4 can be, for example, 0.6 or more, can be 0.7 or more, can be 0.8 or more, or can be 0.9 or more. The third ratio RA3 and the fourth ratio RA4 can be, for example, 1.1 or less, can be 1.2 or less, can be 1.3 or less, or can be 1.4 or less. The range of the third ratio RA3 and the fourth ratio RA4 can also be determined by a first group consisting of 0.6, 0.7, 0.8, and 0.9 and / or a second group consisting of 1.1, 1.2, 1.3, and 1.4. The range of the third ratio RA3 and the fourth ratio RA4 can also be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the third ratio RA3 and the fourth ratio RA4 can also be determined by a combination of any two of the values included in the first group described above. The range of the third ratio RA3 and the fourth ratio RA4 can also be determined by a combination of any two of the values included in the second group described above. For example, the third ratio RA3 and the fourth ratio RA4 can be 0.6 or more and 1.4 or less, can be 0.6 or more and 1.3 or less, can be 0.6 or more and 1.2 or less, can be 0.6 or more and 1.1 or less, can be 0.6 or more and 0.9 or less, can be 0.6 or more and 0.8 or less, can be 0.6 or more and 0.7 or less, can be 0.7 or more and 1.4 or less, can be 0.7 or more and 1.3 or less, can be 0.7 or more and 1.2 or less, can be 0.7 or more and 1.1 or less, can be 0.7 or more and 0.9 or less, can be 0.7 or more and 0.8 or less, can be 0.8 or more and 1.4 or less, can be 0.8 or more and 1.3 or less, can be 0.8 or more and 1.2 or less, can be 0.8 or more and 1.1 or less, can be 0.8 or more and 0.9 or less, can be 0.9 or more and 1.4 or less, can be 0.9 or more and 1.3 or less, can be 0.9 or more and 1.2 or less, can be 0.9 or more and 1.1 or less, can be 1.1 or more and 1.4 or less, can be 1.1 or more and 1.3 or less, can be 1.1 or more and 1.2 or less, can be 1.2 or more and 1.4 or less, can be 1.2 or more and 1.3 or less, or can be 1.3 or more and 1.4 or less.

[0348] Various modifications can be made to the above-described one embodiment. Other embodiments will be described below, as necessary, with reference to the drawings. In the following description and drawings, for portions that can be similarly constituted as in the above-described one embodiment, the same reference numerals are used for the portions. Redundant description will be omitted. In addition, in cases where it is clear that an effect obtained in the above-described one embodiment is also obtainable in other embodiments, the description thereof will be omitted.

[0349] Figure 33 is a plan view showing the mask device 15 of the second embodiment. The mask device 15 has N masks 50 arranged along the second direction. N is an odd number. Figure 33 The mask device 15 shown has nine masks 50.

[0350] The central mask group 50C includes one mask 50. Specifically, the central mask group 50C includes the 11th mask 50A1. The 11th mask 50A1 can also overlap the second center line Lc2.

[0351] The first mask group 50A includes one or more masks 50. The first mask group 50A can also include two or more masks 50. Figure 33 The first mask group 50A shown includes the 11th mask 50A1, the 12th mask 50A2, the 13th mask 50A3, and the 14th mask 50A4 arranged in this order in a direction from the third edge 43 toward the second center line Lc2.

[0352] The second mask group 50B includes one or more masks 50. The second mask group 50B can also include two or more masks 50. The number of masks 50 included in the second mask group 50B can also be the same as the number of masks 50 included in the first mask group 50A. Figure 33 The second mask group 50B shown includes the 21st mask 50B1, the 22nd mask 50B2, the 23rd mask 50B3, and the 24th mask 50B4 arranged in this order in a direction from the fourth edge 44 toward the second center line Lc2.

[0353] Figure 34 is a plan view showing the manufacturing device 60 of the second embodiment.

[0354] The pressing mechanism 62 that presses the first edge 41 includes a central group 62C, a first group 62A, and a second group 62B. The central group 62C can also include one pressing device. Specifically, the central group 62C includes the first central pressing device 62C1. The first central pressing device 62C1 can also overlap the second center line Lc2.

[0355] The first group 62A includes two or more pressing devices. In the present embodiment, the first group 62A includes the 11th pressing device 62A1 and the 12th pressing device 62A2 arranged in this order in a direction from the third edge 43 toward the second center line Lc2.

[0356] The second group 62B includes two or more pressing devices. The number of pressing devices included in the second group 62B can also be the same as the number of pressing devices included in the first group 62A. In the present embodiment, the second group 62B includes a twenty-first pressing device 62B1 and a twenty-second pressing device 62B2 arranged in order in a direction from the fourth side 44 toward the second center line Lc2.

[0357] The displacement measuring mechanism 61 that measures the amount of deformation of the first side 41 includes a central measuring group 61C, a first measuring group 61A, and a second measuring group 61B. The central measuring group 61C can also include one displacement meter. Specifically, the central measuring group 61C can include a first central displacement meter 61C1. The first central displacement meter 61C1 is located in the vicinity of the first central pressing device 62C1. The displacement measuring mechanism 61 can also include a first auxiliary displacement meter 61D and a second auxiliary displacement meter 61E.

[0358] The first measuring group 61A includes two or more displacement meters. In the present embodiment, the first measuring group 61A includes an eleventh displacement meter 61A1 and a twelfth displacement meter 61A2 arranged in order in a direction from the third side 43 toward the second center line Lc2. The eleventh displacement meter 61A1 is located in the vicinity of the eleventh pressing device 62A1. The twelfth displacement meter 61A2 is located in the vicinity of the twelfth pressing device 62A2.

[0359] The second measuring group 61B includes two or more displacement meters. In the present embodiment, the second measuring group 61B includes a twenty-first displacement meter 61B1 and a twenty-second displacement meter 61B2 arranged in order in a direction from the fourth side 44 toward the second center line Lc2. The twenty-first displacement meter 61B1 is located in the vicinity of the twenty-first pressing device 62B1. The twenty-second displacement meter 61B2 is located in the vicinity of the twenty-second pressing device 62B2.

[0360] The pressing devices of the pressing mechanism 62 are arranged at intervals of 500 mm or less along the second direction D2, as in the case of the above-described embodiments. Therefore, the amount of deformation of the first side 41 at each position of the first side 41 can be precisely adjusted. As a result, even in the case where the frame 40 is large-sized, the tension of the first side 41 applied to each mask 50 can be suppressed from deviating from the target tension.

[0361] The displacement meters of the displacement measuring mechanism 61 measure the amount of deformation of the first side 41 at positions 100 mm or less from the pressing devices in the second direction, as in the case of the above-described embodiments. Therefore, the amount of deformation of the first side 41 at each position of the first side 41 can be precisely adjusted. As a result, even in the case where the frame 40 is large-sized, the tension of the first side 41 applied to each mask 50 can be suppressed from deviating from the target tension.

[0362] Figure 35is a plan view showing the manufacturing apparatus 60 of the third embodiment. The displacement measuring mechanism 61 can also measure the deformation amounts of the first edge 41 and the second edge 42 without contacting the frame 40. The type of the displacement meter is optical, eddy current, ultrasonic, laser focusing, electrostatic capacitance, or the like.

[0363] The displacement meter of the laser focusing type irradiates laser light to the frame 40 and detects the laser light reflected by the frame.

[0364] The displacement meter of the electrostatic capacitance type measures the electrostatic capacitance between the displacement meter and the frame 40 and calculates the distance between the displacement meter and the frame 40 from the electrostatic capacitance.

[0365] Figure 36 is a plan view showing the manufacturing apparatus 60 of the fourth embodiment. The displacement measuring mechanism 61 can also be supported by the moving mechanism 66. In this case, the displacement measuring mechanism 61 measures the deformation amounts of the first edge 41 and the second edge 42 without contacting the frame 40. The moving mechanism 66 moves the displacement measuring mechanism 61 in the first direction Dl, the second direction D2, or the like. For example, the moving mechanism 66 can include a first moving device 67 that moves the displacement measuring mechanism 61 in the first direction Dl. The moving mechanism 66 can also include a second moving device that moves the first moving device 67 in the second direction D2. The displacement measuring mechanism 61 observes the frame 40 at a plurality of positions, whereby the deformation amounts of the first edge 41 and the second edge 42 can be measured.

[0366] In the above-described embodiments, examples in which the masks 50 are installed on the first edge 41 and the second edge 42 in order from far to near from the center of the frame 40 in the second direction D2 are described. In the fifth embodiment, examples in which the masks 50 are installed on the first edge 41 and the second edge 42 in order from near to far from the center of the frame 40 in the second direction D2 are described. That is, in the present embodiment, the masks 50 of the central mask group 50C are installed on the first edge 41 and the second edge 42 before the masks 50 of the first mask group 50A and the masks 50 of the second mask group 50B. In the case where the distance from the center of the frame 40 in the second direction D2 is the same, the masks 50 located between the third edge 43 and the second center line Lc2 are installed on the first edge 41 and the second edge 42 before the masks 50 located between the fourth edge 44 and the second center line Lc2. Therefore, the central first mask 50C1, the central second mask 50C2, the 14th mask 50A4, the 24th mask 50B4, the 13th mask 50A3, the 23rd mask 50B3, the 12th mask 50A2, the 22nd mask 50B2, the 11th mask 50Al, and the 21st mask 50Bl are installed on the first edge 41 and the second edge 42 in this order.

[0367] First, the first mask mounting process S3(1) is performed, in which the first mask 50 is mounted on the frame 40. The first mask 50 is the central first mask 50C1. The first mask mounting process S3(1) includes the first adjustment process S4(1) and the first configuration process S5(1).

[0368] The first adjustment step S4(1) includes, in the same manner as the first embodiment described above, a pressing step S41(1) and a judging step S42(1). The first configuration step S5(1) includes, in the same manner as the first embodiment described above, a position adjustment step S51(1), a judging step S52(1), and a fixing step S53(1).

[0369] In the position adjustment process S51(1), as Figure 40 As shown, the position of the central first mask 50C1 is adjusted while tension is applied to the central first mask 50C1. In the determination step S52(1), the position of the central first mask 50C1 is observed using the observation device 73. The determination step S52(1) determines whether the mask error of the central first mask 50C1 is below the second threshold TH2. If the mask error exceeds the second threshold TH2, the position adjustment step S51(1) is performed again. If the mask error is below the second threshold TH2, the process proceeds to the fixing step S53(1). Figure 41 This is a diagram showing the fixed process S53(1).

[0370] Next, as Figure 42 As shown, the second mask installation process S3(2) is performed to install the second mask 50 onto the frame 40. The second mask 50 is the central second mask 50C2. The second mask installation process S3(2) includes a second adjustment process S4(2) and a second configuration process S5(2).

[0371] Next, as Figure 43 As shown, mask installation steps S3(3) to S3(8) are performed sequentially. Thus, mask 14 50A4, mask 24 50B4, mask 13 50A3, mask 23 50B3, mask 12 50A2, and mask 22 50B2 are sequentially installed on frame 40. Mask installation steps S3(3) to S3(8) include adjustment steps S4(3) to S4(8) and configuration steps S5(3) to S5(8).

[0372] Next, as Figure 44As shown, mask installation steps S3(9) to S3(10) are performed sequentially. Thus, mask 50A1 and mask 50B1 are sequentially installed on frame 40. Mask installation steps S3(9) to S3(10) include adjustment steps S4(9) to S4(10) and configuration steps S5(9) to S5(10).

[0373] Next, the release step S6 is performed. For example, the levers 621 of each pressing device of the pressing mechanism 62 are disengaged from the frame 40. Next, the final confirmation step S7 is performed. In the final confirmation step S7, it is determined whether the difference between the final deformation amount of the first side 41 and the second side 42 and the target deformation amount is less than or equal to the first threshold TH1 mentioned above. If the difference is less than or equal to the first threshold TH1, the mask device 15 is deemed a qualified product.

[0374] Figure 45 This diagram illustrates an example of the displacement of the first pressing force P_B1 applied to the first side 41 by the 21st pressing device 62B1 in the first adjustment steps S4(1) to the 10th adjustment steps S4(10). The 21st pressing device 62B1 is the pressing device closest to the fourth side 44 among the pressing devices belonging to the second group 62B. Figure 45 As shown, the first pressing force P_B1 can be reduced during two or more adjustment steps S4. In Figure 45 In the example shown, the first pressing force P_B1 decreases during the period from the 8th adjustment step S4(8) to the 10th adjustment step S4(10). The period during which the first pressing force P_B1 decreases may also occur after the period during which the first pressing force of the pressing device in the central group 62C decreases.

[0375] like Figure 45 As shown, the first pressing force P_B1 can also be greater than zero during the final adjustment step S4, i.e., the Nth adjustment step S4(N). Figure 45 In the example shown, the final adjustment step S4 is the 10th adjustment step S4(10).

[0376] The label P(11)_B1 indicates the first pressing pressure P_B1 during the release process S6. The first pressing pressure P(11)_B1 is zero.

[0377] The first pressing force P_B1 can also display its maximum value during the U-th adjustment step S4(U) (U is an integer greater than 1 and less than N). This allows the difference between the deformation amount and the target deformation amount in the second measurement group 61B to be suppressed. Figure 45In the example shown, the first pressing force P_B1 shows a maximum value at the eighth adjustment step S4(8). In the Uth adjustment step S4(U), the first pressing device 62B1 applies the first pressing force P(U)_B1 to the first edge 41.

[0378] The formula U ≥ N / 2 can also be satisfied. That is, it can also be that the first pressing force P_B1 shows a maximum value in the adjustment steps S4 in the latter half.

[0379] The ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can be, for example, 1.05 or more, 1.10 or more, or 1.15 or more. The ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can be, for example, 1.20 or less, 1.30 or less, or 1.50 or less. The first pressing force P(1)_B1 is the first pressing force applied by the first pressing device 62B1 to the first edge 41 in the first adjustment step S4(1).

[0380] The range of the ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can also be determined by a first group consisting of 1.05, 1.10, and 1.15 and / or a second group consisting of 1.20, 1.30, and 1.50. The range of the ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of the ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can also be determined by a combination of any two of the values included in the first group described above. The range of the ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can also be determined by a combination of any two of the values included in the second group described above. For example, the ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 can be 1.05 or more and 1.50 or less, 1.05 or more and 1.30 or less, 1.05 or more and 1.20 or less, 1.05 or more and 1.15 or less, 1.05 or more and 1.10 or less, 1.10 or more and 1.50 or less, 1.10 or more and 1.30 or less, 1.10 or more and 1.20 or less, 1.10 or more and 1.15 or less, 1.15 or more and 1.50 or less, 1.15 or more and 1.30 or less, 1.15 or more and 1.20 or less, 1.20 or more and 1.50 or less, 1.20 or more and 1.30 or less, or 1.30 or more and 1.50 or less.

[0381] Figure 46This diagram illustrates an example of the pushing action of the first pressing force P_B2 applied to the first side 41 by the 22nd pressing device 62B2 in the first adjustment steps S4(1) to the 10th adjustment steps S4(10). Figure 46 As shown, the first pressing force P_B2 can be reduced during two or more adjustment steps S4. In Figure 46 In the example shown, the first pressing force P_B2 decreases during the period from the sixth adjustment step S4(6) to the eighth adjustment step S4(8). The period during which the first pressing force P_B2 decreases may also occur after the period during which the first pressing force of the pressing device in the central group 62C decreases. The period during which the first pressing force P_B2 decreases may also occur before the period during which the first pressing force P_B1 decreases.

[0382] like Figure 46 As shown, the first pressing force P_B2 can also become zero before the final adjustment step S4, that is, before the 10th adjustment step S4(10). Figure 46 In the example shown, in the 9th adjustment step S4(9), the 1st pressing force P_B2 becomes zero. The 1st pressing force P_B2 can also become zero before the 1st pressing force P_B1 becomes zero.

[0383] The label P(11)_B2 indicates the first pressing pressure P_B2 during the release process S6. The first pressing pressure P(11)_B2 is zero.

[0384] The first pressing force P_B2 can also show its maximum value outside of the first adjustment step S4(1). Therefore, the difference between the deformation amount and the target deformation amount in the second measurement group 61B can be suppressed. Figure 46 In the example shown, the first pressing force P_B2 reaches its maximum value during the second adjustment step S4(2). In the second adjustment step S4(2), the 22nd pressing device 62B2 applies the first pressing force P(2)_B2 to the first side 41. Although not shown, the first pressing force P_B2 may also reach its maximum value during the third adjustment step S4(3) or the fourth adjustment step S4(4).

[0385] The range of values ​​for the ratio of the maximum value of the first pressing force P_B2 to the first pressing force P(1)_B2 can be the range of values ​​for the ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1 mentioned above.

[0386] Figure 47 This diagram illustrates an example of the pushing action of the first pressing force P_C2 applied to the first side 41 by the second central pressing device 62C2 in the first adjustment steps S4(1) to the tenth adjustment steps S4(10). Figure 47 As shown, the first pressing force P_C2 can be reduced during two or more adjustment steps S4. InFigure 47 In the example shown, the first pressing force P_C2 decreases during the period from the first adjustment step S4(1) to the seventh adjustment step S4(7). Thus, the first pressing force P_C2 can also decrease monotonically starting from the first adjustment step S4(1).

[0387] like Figure 47 As shown, the first pressing force P_C2 can also become zero before the final adjustment step S4, that is, before the 10th adjustment step S4(10). Figure 47 In the example shown, in the 7th adjustment step S4(7), the 1st pressing force P_C2 becomes zero.

[0388] The label P(11)_C2 indicates the first pressing pressure P_C2 during the release process S6. The first pressing pressure P(11)_C2 is zero.

[0389] Figure 45 The pushing of the first pressing force P_B1 shown can also be achieved in the 11th pressing device 62A1. Figure 46 The pushing of the first pressing force P_B2 shown can also be achieved in the 12th pressing device 62A2. Figure 47 The pushing of the first pressing force P_C2 shown can also be achieved in the first central pressing device 62C1.

[0390] The control device 63 can also control the pressing mechanism 62 in such a way that the difference in the first pressing force applied to the first side 41 by each pressing device of the pressing mechanism 62 in the first adjustment step S4(1) is within a predetermined range. For example, similar to the case of the first embodiment described above, the control device 63 can control the pressing mechanism 62 in such a way that the first ratio RA1 and the second ratio RA2 are below a predetermined value.

[0391] Alternatively, a disassembly method can be implemented to remove the mask 50 from the mask assembly 15. (Refer to...) Figure 44 as well as Figure 48 to Figure 49 The method for disassembling the mask device 15 is explained in detail.

[0392] like Figure 44As shown, with N masks 50 fixed to the frame 40, the final deformation of the first side 41 and the second side 42 is measured using the displacement measuring mechanism 61. Next, a mask removal process RS3 is performed to remove the N masks 50 from the frame 40. In this embodiment, an example is described where the masks 50 are removed from the frame 40 in order from farthest to near the center of the frame 40 along the second direction D2. That is, in this embodiment, the masks 50 of the first mask group 50A and the masks 50 of the second mask group 50B are removed from the frame 40 before the masks 50 of the central mask group 50C. When the distance from the center of the frame 40 along the second direction D2 is the same, the mask 50 located between the fourth side 44 and the second center line Lc2 is removed from the frame 40 before the mask 50 located between the third side 43 and the second center line Lc2. Therefore, the 21st mask 50B1, the 11th mask 50A1, the 22nd mask 50B2, the 12th mask 50A2, the 23rd mask 50B3, the 13th mask 50A3, the 24th mask 50B4, the 14th mask 50A4, the central 2nd mask 50C2, and the central 1st mask 50C1 are removed from the frame 40 in this order.

[0393] The first mask installation process RS3(1) is performed to remove the first mask 50 from the frame 40. The first mask 50 is the 21st mask 50B1. The first mask removal process RS3(1) includes, in the same manner as the above embodiment, the first removal process RS4(1) and the first reverse adjustment process RS5(1).

[0394] Figure 48 This diagram illustrates the first removal step RS4(1) and the first reverse adjustment step RS5(1). The first removal step RS4(1) includes the cutting step RS41(1). Figure 48 As shown, the 21st mask 50B1 is cut off in the cutting process RS41(1). The end 51 of the 21st mask 50B1 may also remain in the frame 40.

[0395] The first reverse adjustment process RS5(1) includes a pressing process RS51(1), a judgment process RS52(1), and a recording process RS53(1).

[0396] like Figure 48 As shown, in the pressing process RS51(1), after the 21st mask 50B1 is removed, the first side 41 and the second side 42 are pressed. The control device 63 controls the pressing mechanism 62 so that the deformation of the first side 41 and the second side 42 becomes the final deformation.

[0397] In the determination step RS52(1), it is determined whether ΔRd(1) is below the third threshold value TH3. In the case where ΔRd(1) exceeds the third threshold value TH3, the pressing step RS51(1) is implemented again. In the case where ΔRd(1) is below the third threshold value TH3, the recording step RS53(1) is entered. In the recording step RS53(1), the second pressing force applied by the pressing device of the pressing mechanism 62 to the first edge 41 and the second edge 42 is recorded as the second pressing force RP(1).

[0398] Next, as shown in Fig. 6, the second mask removal step RS3(2) of removing the second mask 50 from the frame 40 is implemented. The second mask 50 is the eleventh mask 50A1. The second mask removal step RS3(2) includes the second removal step RS4(2) and the second reverse adjustment step RS5(2). Figure 49 Next, the third mask removal step RS3(3) to the tenth mask removal step RS3(10) are implemented in this order. The third mask removal step RS3(3) to the tenth mask removal step RS3(10) include the third removal step RS4(3) to the tenth removal step RS4(10) and the third reverse adjustment step RS5(3) to the tenth reverse adjustment step RS5(10).

[0399] Next, the releasing step RS6 is implemented. For example, the rod 621 of each pressing device of the pressing mechanism 62 is caused to move away from the frame 40.

[0400]

[0401] Fig. 7 is a diagram showing an example of the progress of the second pressing force RP_B1 applied by the twenty-first pressing device 62B1 to the first edge 41 in the first reverse adjustment step RS5(1) to the tenth reverse adjustment step RS5(10). The twenty-first pressing device 62B1 is the pressing device closest to the fourth edge 44 among the pressing devices belonging to the second group 62B. As shown in Fig. 7, the second pressing force RP_B1 can increase during the reverse adjustment steps RS5 twice or more. In the example shown in Fig. 7, the second pressing force RP_B1 increases during the first reverse adjustment step RS5(1) to the third reverse adjustment step RS5(3). The period during which the first pressing force P_B1 increases can also be generated earlier than the period during which the first pressing force of the pressing devices of the central group 62C increases. Figure 50 Figure 50 As shown in Fig. 7, the second pressing force RP_B1 can be greater than zero at the first reverse adjustment step RS5(1). Figure 50

[0402] As shown in Fig. 7, the second pressing force RP_B1 can be greater than zero at the first reverse adjustment step RS5(1). Figure 50

[0403] ​​​The second pressing force RP_B1 can also show a maximum value at the Qth reverse adjustment step RS5 (Q) (Q is an integer larger than 1 and smaller than N). In Figure 50 In the example shown, the second pressing force RP_B1 shows a maximum value at the 3rd reverse adjustment step RS5 (3).

[0404] The formula Q ≤ N / 2 can also be satisfied. That is, it can also be that the second pressing force RP_B1 shows a maximum value in the reverse adjustment steps RS5 of the first half.

[0405] At the last reverse adjustment step RS5, that is, at the Nth reverse adjustment step RS5 (N), the 21st pressing device 62B1 applies the second pressing force RP(N)_B1 to the first edge 41.

[0406] The ratio of the second pressing force RP(Q)_B1 to the second pressing force RP(N)_B1 can be, for example, 1.05 or more, can be 1.10 or more, and can be 1.15 or more. The ratio of the second pressing force RP(Q)_B1 to the second pressing force RP(N)_B1 can be, for example, 1.20 or less, can be 1.30 or less, and can be 1.50 or less. The second pressing force RP(Q)_B1 is the second pressing force applied by the 21st pressing device 62B1 to the first edge 41 in the Qth reverse adjustment step RS5 (Q). As the range of values of the ratio of the second pressing force RP(Q)_B1 to the second pressing force RP(N)_B1, the range of values of the "ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1" described above can be adopted.

[0407] Figure 51 is a graph showing an example of the progress of the second pressing force RP_B2 applied by the 22nd pressing device 62B2 to the first edge 41 in the 1st reverse adjustment step RS5 (1) to the 10th reverse adjustment step RS5 (10). As shown in Figure 51 The second pressing force RP_B2 can increase during 2 or more reverse adjustment steps RS5. In Figure 51 In the example shown, the second pressing force RP_B2 increases during the 2nd reverse adjustment step RS5 (2) to the 7th reverse adjustment step RS5 (5).

[0408] As shown in Figure 51 The second pressing force RP_B2 can also be greater than zero from the 2nd reverse adjustment step RS5 onward. In Figure 51 In the 2nd adjustment step RS5 (2), the second pressing force RP_B2 is greater than zero. The second pressing force RP_B2 can also be greater than zero after the second pressing force RP_B1 is greater than zero. The second pressing force RP_B2 can also be greater than zero before the second pressing force RP_C2 described later is greater than zero.

[0409] The second pressing force RP_B2 can also show a maximum value at the Nth reverse adjustment step RS5(N) or later. Figure 51 In the example shown, the second pressing force RP_B2 shows a maximum value at the 9th reverse adjustment step RS5(9). That is, the second pressing force RP_B2 shows a maximum value at the (N-l)th reverse adjustment step RS5(N-l). At the 9th reverse adjustment step RS5(9), the 22nd pressing device 62B2 applies the second pressing force P(9)_B2 to the first edge 41. Although not shown, the second pressing force P_B2 can also show a maximum value at the (N-2)th reverse adjustment step RS5(N-2) or the (N-3)th reverse adjustment step RS5(N-3).

[0410] As the range of the ratio of the maximum value of the second pressing force P_B2 to the second pressing force P(N)_B2, the range of the numerical value of the "ratio of the first pressing force P(U)_B1 to the first pressing force P(1)_B1" described above can be adopted.

[0411] Figure 52 is a graph showing an example of the progress of the second pressing force RP_C2 applied by the second central pressing device 62C2 to the first edge 41 at the first reverse adjustment step RS5(1) to the tenth reverse adjustment step RS5(10). As shown in Figure 52 The second pressing force RP_C2 can increase during two or more reverse adjustment steps RS5. In Figure 52 In the example shown, the second pressing force RP_C2 increases during the sixth reverse adjustment step RS5(6) to the tenth adjustment step RS5(10).

[0412] Figure 50 The progress of the second pressing force RP_B1 shown can also be achieved in the 11th pressing device 62A1. Figure 51 The progress of the second pressing force RP_B2 shown can also be achieved in the 12th pressing device 62A2. Figure 52 The progress of the second pressing force RP_C2 shown can also be achieved in the first central pressing device 62C1.

[0413] The control device 63 can also control the pressing mechanism 62 in such a manner that the difference between the second pressing forces applied by the respective pressing devices of the pressing mechanism 62 to the first edge 41 at the Nth reverse adjustment step RS5(N) is within a prescribed range. For example, the control device 63 can control the pressing mechanism 62 so that the third ratio RA3 and the fourth ratio RA4 become a prescribed value or less, as in the case of the first embodiment described above.

[0414] Next, the embodiments of the present disclosure will be described more specifically by Examples, but the embodiments of the present disclosure are not limited to the following Examples as long as they do not depart from the gist thereof.

[0415] (Example 1)

[0416] The mask device 15 was manufactured using the manufacturing device 60. The main structures of the mask device 15 and the manufacturing device 60 are described below.

[0417] • Size G11 of the frame 40: 1493.2 mm

[0418] • Size G21 of the frame 40: 2491.9 mm

[0419] • Number N of the masks 50: 9

[0420] • Number of the pressing devices that press the first edge 41: 5

[0421] • Interval between two adjacent pressing devices in the second direction D2: 415 mm

[0422] • Number of the displacement gauges that measure the first edge 41: 7

[0423] • Type of the displacement gauges: Contact digital sensor GT2-A12K manufactured by KEYENCE

[0424] • Interval between two adjacent displacement gauges in the second direction D2: 415 mm

[0425] In Example 1, the masks 50 were installed on the frame 40 in the order from far to near from the center of the frame 40 in the second direction D2, as in the case of the first embodiment. Figure 37 is a graph showing the progress of the first pressing force applied to the first edge 41 by each of the pressing devices of the pressing mechanism 62 in the first adjustment process S4(1) to the ninth adjustment process S4(9). k = 1 means the first adjustment process S4(1). k = 9 means the ninth adjustment process S4(9). P_A1 is the first pressing force applied to the first edge 41 by the 11th pressing device 62A1. P_A2 is the first pressing force applied to the first edge 41 by the 12th pressing device 62A2. P_B1 is the first pressing force applied to the first edge 41 by the 21st pressing device 62B1. P_B2 is the first pressing force applied to the first edge 41 by the 22nd pressing device 62B2. P_C1 is the first pressing force applied to the first edge 41 by the first central pressing device 62C1.

[0426] As Figure 37As shown, the first pressing force P_C1 of the first central pressing device 62C1 shows a maximum value at the sixth adjustment step S4(6). The ratio of the first pressing force P_C1 of the sixth adjustment step S4(6) to the first pressing force P_C1 of the first adjustment step S4(1) is 1.17.

[0427] After the kth fixing step (k), the deformation amount d(k) of the first edge 41 was measured using the first central displacement gauge 61C1. The absolute value of the difference between the deformation amount d(k) and the target deformation amount is shown in FIG. 6. Figure 39

[0428] (Example 2)

[0429] The mask device 15 was manufactured using the manufacturing device 60. The main structures of the mask device 15 and the manufacturing device 60 are described below.

[0430] • The size G11 of the frame 40: 1493.2 mm

[0431] • The size G21 of the frame 40: 2491.9 mm

[0432] • The number N of the masks 50: 9

[0433] • The number of pressing devices that press the first edge 41: 3

[0434] • The interval between two adjacent pressing devices in the second direction D2: 695 mm

[0435] • The number of displacement gauges that measure the first edge 41: 5

[0436] • The type of the displacement gauge: a contact type digital sensor GT2-A12K manufactured by KEYENCE

[0437] • The interval between two adjacent displacement gauges in the second direction D2: 695 mm

[0438] In Example 2, the masks 50 were also installed on the frame 40 in order from far to near from the center of the frame 40 in the second direction D2. Figure 38 is a graph showing the change in the first pressing force applied to the first edge 41 by each pressing device of the pressing mechanism 62 in the first adjustment step S4(1) to the ninth adjustment step S4(9). P_A1 is the first pressing force applied to the first edge 41 by the 11th pressing device 62A1. P_B1 is the first pressing force applied to the first edge 41 by the 21st pressing device 62B1. P_C1 is the first pressing force applied to the first edge 41 by the first central pressing device 62C1.

[0439] ​After the k-th fixing process (k), the deformation amount d(k) of the first edge 41 was measured using the first central displacement gauge 61C1. The absolute value of the difference between the deformation amount d(k) and the target deformation amount is shown as Figure 39

[0440] (Example 3)

[0441] The mask device 15 was manufactured using the manufacturing device 60. The main structures of the mask device 15 and the manufacturing device 60 are described below.

[0442] • The size G11 of the frame 40: 1105 mm

[0443] • The size G21 of the frame 40: 1701 mm

[0444] • The number N of the masks 50: 6

[0445] • The number of the pressing devices that press the first edge 41: 3

[0446] • The interval between the two pressing devices adjacent in the second direction D2: 475 mm

[0447] • The number of the displacement gauges that measure the first edge 41: 5

[0448] • The type of the displacement gauge: a contact type digital sensor GT2-A12K manufactured by KEYENCE

[0449] • The interval between the two displacement gauges adjacent in the second direction D2: 475 mm

[0450] In Example 3, the masks 50 were also installed on the frame 40 in the order from far to near from the center of the frame 40 in the second direction D2. After the k-th fixing process (k), the deformation amount d(k) of the first edge 41 was measured using the first central displacement gauge 61C1. The absolute value of the difference between the deformation amount d(k) and the target deformation amount is shown as Figure 39

[0451] (Example 4)

[0452] The mask device 15 was manufactured using the manufacturing device 60. The main structures of the mask device 15 and the manufacturing device 60 are described below.

[0453] • The size G11 of the frame 40: 1493.2 mm

[0454] • The size G21 of the frame 40: 2491.9 mm

[0455] • The number N of the masks 50: 8

[0456] • The number of the pressing devices that press the first edge 41: 5

[0457] ​​• Interval between 2 pressing devices adjacent in the 2nd direction D2: 415 mm

[0458] • Number of displacement gauges measuring the 1st edge 41: 7

[0459] • Type of displacement gauge: Contact type digital sensor GT2-A12K by KEYENCE

[0460] • Interval between 2 displacement gauges adjacent in the 2nd direction D2: 415 mm

[0461] In Example 4, the mask 50 was installed on the frame 40 in the order from far to near to the center of the frame 40 in the 2nd direction D2, as in the case of Example 1. Figure 53 is a graph showing the progress of the 1st pressing force P_C1 exerted by each pressing device of the pressing mechanism 62 on the 1st edge 41 in the 1st adjustment process S4(1) to the 8th adjustment process S4(8).

[0462] As shown in Figure 53 , the 1st pressing force P_C1 of the 1st central pressing device 62C1 showed a maximum value at the 6th adjustment process S4(6). The ratio of the 1st pressing force P_C1 of the 6th adjustment process S4(6) to the 1st pressing force P_C1 of the 1st adjustment process S4(1) was 1.17.

[0463] After the kth fixing process (k), the deformation amount d(k) of the 1st edge 41 was measured using the 1st central displacement gauge 61C1. The absolute value of the difference between the deformation amount d(k) and the target deformation amount is shown in Figure 55 .

[0464] (Example 5)

[0465] The mask device 15 was manufactured using the manufacturing device 60. The main structures of the mask device 15 and the manufacturing device 60 were the same as in the case of Example 4.

[0466] In Example 5, the mask 50 was installed on the frame 40 in the order from near to far to the center of the frame 40 in the 2nd direction D2, as in the case of the 5th embodiment. Figure 54 is a graph showing the progress of the 1st pressing force P_B1 exerted by each pressing device of the pressing mechanism 62 on the 1st edge 41 in the 1st adjustment process S4(1) to the 8th adjustment process S4(8).

[0467] As shown in Figure 54 , the 1st pressing force P_B1 of the 21st pressing device 62B1 showed a maximum value at the 6th adjustment process S4(6). The ratio of the 1st pressing force P_B1 of the 6th adjustment process S4(6) to the 1st pressing force P_B1 of the 1st adjustment process S4(1) was 1.23.

[0468] After the k-th fixing process (k), the deformation amount d(k) of the first edge 41 is measured using the first central displacement meter 61C1. The absolute value of the difference between the deformation amount d(k) and the target deformation amount is shown as Figure 55 shown.

Claims

1. A manufacturing apparatus of a mask apparatus, characterized by comprising: the mask apparatus including a frame including a first side and a second side facing each other in a first direction with an opening therebetween, and a third side and a fourth side facing each other in a second direction intersecting the first direction with the opening therebetween, and a mask including end portions fixed to the first side and the second side, the manufacturing apparatus including: a pressing mechanism that presses the first side and the second side in a direction toward the opening; a displacement measuring mechanism that measures a displacement amount of the first side and the second side in the first direction; a fixing apparatus that fixes the mask to the first side and the second side; and a control apparatus that controls the pressing mechanism and the fixing apparatus, the pressing mechanism including: five or more pressing apparatuses that press the first side and are arranged at intervals of 500 mm or less along the second direction, and five or more pressing apparatuses that press the second side and are arranged at intervals of 500 mm or less along the second direction, the mask apparatus including N masks arranged along the second direction, where N is an integer of two or more, the pressing mechanism that presses the first side including: a central group including one or two of the pressing apparatuses; a first group located between the central group and the third side in the second direction and including two or more of the pressing apparatuses; and a second group located between the central group and the fourth side in the second direction and including two or more of the pressing apparatuses, the control apparatus being configured to control in such a manner that: the fixing apparatus fixes the mask to the first side and the second side in order from far to near from the center of the frame in the second direction, the pressing mechanism presses the first side and the second side in such a manner that a difference between the displacement amount when each mask is fixed to the first side and a target displacement amount is equal to or less than a first threshold value, the pressing apparatus of the central group exerts a first pressing force 1 on the first side when a first mask is fixed to the frame, the pressing apparatus of the central group exerts a first pressing force U on the first side when an Uth mask is fixed to the frame, where U is an integer greater than 1 and less than N, a ratio of the first pressing force U to the first pressing force 1 is 1.05 or more, and the first pressing force U is greater than a first pressing force N.

2. A manufacturing apparatus of a mask apparatus, characterized by comprising: the mask apparatus including a frame including a first side and a second side facing each other in a first direction with an opening therebetween, and a third side and a fourth side facing each other in a second direction intersecting the first direction with the opening therebetween, and a mask including end portions fixed to the first side and the second side, the manufacturing apparatus including: a pressing mechanism that presses the first side and the second side in a direction toward the opening; a displacement measuring mechanism that measures a displacement amount of the first side and the second side in the first direction; a fixing apparatus that fixes the mask to the first side and the second side; and a control apparatus that controls the pressing mechanism and the fixing apparatus, ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a control device that controls the pressing mechanism and the fixing device, the pressing mechanism includes: 5 or more pressing devices that press the first edge and are arranged at intervals of 500 mm or less in the second direction; and 5 or more pressing devices that press the second edge and are arranged at intervals of 500 mm or less in the second direction, the mask device includes N masks arranged in the second direction, where N is an integer of 2 or more, the pressing mechanism that presses the first edge includes: a central group that includes one or two pressing devices; a first group that is located between the central group and the third edge in the second direction and includes two or more pressing devices; and a second group that is located between the central group and the fourth edge in the second direction and includes two or more pressing devices, the control device is configured to control in such a manner that: the fixing device fixes the masks to the first edge and the second edge in order from the center of the frame in the second direction, the pressing mechanism presses the first edge and the second edge in such a manner that a difference between the target deformation amount and the deformation amount of each mask when fixed to the first edge is equal to or less than a first threshold value, the pressing device that belongs to the second group and is closest to the fourth edge applies a first pressing force 1 to the first edge when the first mask is fixed to the frame, the pressing device that belongs to the second group and is closest to the fourth edge applies a first pressing force U to the first edge when the Uth mask is fixed to the frame, where U is an integer greater than 1 and less than N, a ratio of the first pressing force U to the first pressing force 1 is 1.05 or more, the first pressing force U is greater than a first pressing force N.

3. The manufacturing device for a mask device according to claim 1 or 2, wherein the displacement measuring mechanism includes at least one displacement gauge that measures the deformation amount of the first edge, the displacement gauge includes a sensor head that contacts the first edge.

4. The manufacturing device for a mask device according to claim 3, wherein the displacement gauge measures the deformation amount of the first edge at a position 100 mm or less from the pressing device in the second direction.

5. The manufacturing device for a mask device according to claim 3, wherein the displacement measuring mechanism includes: 5 or more displacement gauges that measure the deformation amount of the first edge at a position 100 mm or less from the pressing device in the second direction; a first auxiliary displacement gauge that measures the deformation amount of the first edge at a position 200 mm or less from an outer side surface of the third edge in the second direction; and a second auxiliary displacement gauge that measures the deformation amount of the first edge at a position 200 mm or less from an outer side surface of the fourth edge in the second direction.

6. The manufacturing device for a mask device according to claim 5, wherein A distance between the first auxiliary displacement gauge and the second auxiliary displacement gauge in the second direction is 1300 mm or more.

7. The manufacturing apparatus of a mask device according to claim 1 or 2, wherein A distance between the pressing means that presses the first edge and the pressing means that presses the second edge in the first direction is 1300 mm or more.

8. The manufacturing apparatus of a mask device according to claim 1 or 2, wherein The control means controls the pressing mechanism so that the following equation is satisfied, U ≥ N / 2.

9. A recording medium, wherein The recording medium is a non-transitory recording medium that is readable by a computer, and records a program for causing the computer to function as the control means of the manufacturing apparatus according to claim 1 or 2.

10. A manufacturing method of a mask device, wherein The manufacturing method of a mask device includes: a step of preparing a frame including a first edge and a second edge that oppose each other in a first direction across an opening, and a third edge and a fourth edge that oppose each other in a second direction that intersects the first direction across the opening; a step of adjusting a first pressing force that a pressing mechanism applies to the first edge and the second edge in a direction toward the opening; and a step of fixing an end portion of a mask to the first edge and the second edge, the pressing mechanism includes: five or more pressing means that press the first edge, which are arranged at intervals of 500 mm or less along the second direction; and five or more pressing means that press the second edge, which are arranged at intervals of 500 mm or less along the second direction, the mask device includes N masks arranged along the second direction, where N is an integer of 2 or more, in the adjusting step, the first pressing force is adjusted so that a difference between a target deformation amount and a deformation amount of the first edge when each mask is fixed to the first edge is equal to or less than a first threshold value, in the fixing step, the masks are fixed to the first edge and the second edge in order from far to near from a center of the frame in the second direction, the pressing mechanism that presses the first edge includes: a central group that includes one or two of the pressing means; a first group that is located between the central group and the third edge in the second direction and includes two or more of the pressing means; and a second group that is located between the central group and the fourth edge in the second direction and includes two or more of the pressing means, the pressing means of the central group applies a first pressing force 1 to the first edge when a first mask is fixed to the frame, the pressing means of the central group applies a first pressing force U to the first edge when an Uth mask is fixed to the frame, where U is an integer that is greater than 1 and less than N, a ratio of the first pressing force U to the first pressing force 1 is 1.05 or more, the first pressing force U is greater than a first pressing force N.

11. A manufacturing method of a mask device, wherein the manufacturing method of a mask device includes: a preparation step of preparing a frame including a first side and a second side facing each other in a first direction across an opening, and a third side and a fourth side facing each other in a second direction intersecting the first direction across the opening; an adjustment step of adjusting a first pressing force applied by a pressing mechanism to the first side and the second side in a direction toward the opening; and a fixing step of fixing an end portion of a mask to the first side and the second side, the pressing mechanism includes: five or more pressing devices that press the first side, arranged at intervals of 500 mm or less in the second direction; and five or more pressing devices that press the second side, arranged at intervals of 500 mm or less in the second direction, the mask device has N masks arranged in the second direction, where N is an integer of 2 or more, in the adjustment step, the first pressing force is adjusted so that a difference between a target amount of deformation of the first side and an amount of deformation of the first side when each mask is fixed to the first side is equal to or less than a first threshold value, in the fixing step, the masks are fixed to the first side and the second side in order from near to far from the center of the frame in the second direction, the pressing mechanism that presses the first side includes: a central group including one or two of the pressing devices; a first group including two or more of the pressing devices between the central group and the third side in the second direction; and a second group including two or more of the pressing devices between the central group and the fourth side in the second direction, the pressing device belonging to the second group and closest to the fourth side applies a first pressing force 1 to the first side when the first mask is fixed to the frame, the pressing device belonging to the second group and closest to the fourth side applies a first pressing force U to the first side when the Uth mask is fixed to the frame, where U is an integer greater than 1 and less than N, a ratio of the first pressing force U to the first pressing force 1 is 1.05 or more, the first pressing force U is greater than a first pressing force N.

12. The mask device manufacturing method according to claim 10 or 11, wherein in the adjustment step, the first pressing force is adjusted based on information from a displacement measuring mechanism that measures an amount of deformation of the first side and the second side in the first direction, the displacement measuring mechanism includes at least one displacement gauge that measures the amount of deformation of the first side, the displacement gauge includes a sensor head in contact with the first side.

13. The mask device manufacturing method according to claim 12, wherein the displacement gauge measures the amount of deformation of the first side at a position 100 mm or less from the pressing device in the second direction.

14. The mask device manufacturing method according to claim 12, wherein The displacement measuring mechanism includes: five or more displacement gauges that measure the deformation amount of the first side at a position 100 mm or less from the pressing device in the second direction; a first auxiliary displacement gauge that measures the deformation amount of the first side at a position 200 mm or less from the outer side of the third side in the second direction; and a second auxiliary displacement gauge that measures the deformation amount of the first side at a position 200 mm or less from the outer side of the fourth side in the second direction.

15. The method of manufacturing a mask device according to claim 10 or 11, wherein In the adjusting process, the first pressing force is adjusted so that the following equation is satisfied, U≧N / 2.

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