Alignment method and inspection device

Abstract

The present invention provides an alignment method and inspection device capable of aligning electrode pads and probes with high precision. One embodiment of the alignment method of the present invention is a method for aligning a probe card including multiple probe groups arranged corresponding to multiple chips, characterized by including a first mode in which, for each of the multiple chips, the inclination and center of gravity of the probe group are calculated based on positional information of two or more probes included in the probe group arranged corresponding to the chip, and the inclination and center of gravity of the probe card are calculated based on the calculated inclinations and centers of gravity of the multiple probe groups.

Description

Technical Field

[0001] The present invention relates to an alignment method and an inspection device. Background Art

[0002] The following technology is known: when a substrate is brought into contact with probes of a probe card for inspection, the inclination of the probe card is adjusted so that the distances between the probe tips at the four corners of the probe card and the four electrode pads facing them are equal (for example, see Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2009-231765 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a technology capable of aligning an electrode pad and a probe with high precision.

[0008] Means for solving technical problems

[0009] An alignment method according to one embodiment of the present invention is an alignment method for a probe card comprising a plurality of probe groups arranged corresponding to a plurality of chips, and is characterized in that it includes a first mode, wherein for each chip among the plurality of chips, the inclination and center of gravity of the probe group are calculated based on position information of two or more probes included in the probe group arranged corresponding to the chip, and the inclination and center of gravity of the probe card are calculated based on the calculated inclination and center of gravity of the plurality of probe groups.

[0010] Effects of the Invention

[0011] According to the present invention, the electrode pad and the probe can be aligned with high precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a diagram showing an example of an inspection device according to an embodiment.

[0013] Figure 2 yes Figure 1 A plan view of the inspection device.

[0014] Figure 3 This is a diagram showing an example of the hardware configuration of the controller.

[0015] Figure 4 This is a diagram showing an example of a method for calculating the inclination of a probe card in the chip unit mode.

[0016] Figure 5This is a diagram showing an example of a method for calculating the center of gravity of a probe card in the chip unit mode.

[0017] Figure 6 This is a diagram showing an example of a method for calculating the inclination of the probe card in the card unit mode.

[0018] Figure 7 This is a diagram showing an example of a method for calculating the center of gravity of a probe card in the card unit mode.

[0019] Figure 8 This is a diagram for explaining the positional relationship between the probe group and the chip in the chip unit mode.

[0020] Figure 9 This is a diagram for explaining the positional relationship between the probe group and the chip in the card unit mode.

[0021] Description of Reference Numerals

[0022] 24-probe card, 24a probe, CA, CB chip, PA, PB probe set. DETAILED DESCRIPTION

[0023] Hereinafter, non-limiting exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, the same or corresponding components or parts are denoted by the same or corresponding reference numerals, and repeated descriptions are omitted.

[0024] [Inspection device]

[0025] Reference Figures 1 to 3 An example of an inspection device according to an embodiment will be described. The inspection device according to the embodiment is capable of supplying electrical signals to each of multiple devices under test (DUTs) formed on a substrate to inspect various electrical characteristics. The following description uses as an example a case where the substrate is a semiconductor wafer (hereinafter referred to as a "wafer") and the device under test is a semiconductor chip (hereinafter referred to as a "chip"). A semiconductor chip includes electrode pads.

[0026] The inspection device 1 includes a loading unit 10 , an inspection unit 20 , a controller 30 , and the like.

[0027] The loading unit 10 includes a load port 11, an aligner 12, a substrate transport mechanism 13, and the like. The load port 11 can load a cassette C containing wafers W. The aligner 12 can align the wafers W. The substrate transport mechanism 13 can transport the wafers W between the cassette C loaded on the load port 11, the aligner 12, and a loading table 21 (described later).

[0028] In the loader unit 10, the substrate transport mechanism 13 first transports the wafer W stored in the cassette C to the aligner 12. The aligner 12 then aligns the wafer W. The substrate transport mechanism 13 then transports the wafer W, aligned by the aligner 12, to the mounting table 21 provided in the inspection unit 20.

[0029] The inspection unit 20 is disposed adjacent to the loading unit 10. The inspection unit 20 includes a mounting table 21, an elevating and rotating mechanism 22, an XY stage 23, a probe card 24, an alignment mechanism 25, and the like.

[0030] The mounting table 21 has a mounting surface 21a for mounting the wafer W. The mounting table 21 is provided so as to be movable in the horizontal directions (X and Y directions) and the vertical direction (Z direction) relative to the bottom of the inspection unit 20, and rotatable about a vertical axis (in the θ direction). The mounting table 21 includes a vacuum chuck that can suction and hold the wafer W mounted on the mounting surface 21a.

[0031] The lifting and rotating mechanism 22 can support the mounting table 21 so that it can move (lift and lower) in the vertical direction (Z direction) and can rotate around the vertical axis (in the θ direction). The lifting and rotating mechanism 22 includes, for example, a stepping motor.

[0032] The XY table 23 can support the lifting and rotating mechanism 22 so that it can move in the horizontal direction (X direction and Y direction). The XY table 23 can move the mounting table 21 supported by the lifting and rotating mechanism 22 in the horizontal direction via the lifting and rotating mechanism 22. The XY table 23 includes, for example, a stepping motor.

[0033] The probe card 24 is placed above the mounting table 21. A plurality of probes 24a are formed on the mounting table 21 side of the probe card 24. The probe card 24 is detachably mounted on a top plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0034] The alignment mechanism 25 includes an upper camera 25a, a guide rail 25b, an alignment bridge 25c, a lower camera 25d, and the like.

[0035] The upper camera 25a is mounted facing downward at the center of the alignment bridge 25c. The upper camera 25a is integrally mounted with the alignment bridge 25c and is movable in the horizontal direction (Y direction). The upper camera 25a is provided for aligning the wafer W on the mounting table 21 and is capable of capturing an image including the wafer W on the mounting table 21. The upper camera 25a is, for example, a CCD camera or a CMOS camera.

[0036] The guide rail 25b can support the alignment bridge 25c so as to be movable in the horizontal direction (Y direction).

[0037] The alignment bridge 25c is supported by a pair of left and right guide rails 25b and is movable in the horizontal direction (Y direction) along the guide rails 25b.

[0038] The lower camera 25d is mounted on the side of the mounting table 21, facing upward. It is integral with the mounting table 21 and can move horizontally (in the X and Y directions). The lower camera 25d is provided to detect the positions of the plurality of probes 24a formed on the probe card 24 and can capture an image including the plurality of probes 24a. The lower camera 25d is, for example, a CCD camera or a CMOS camera.

[0039] In the above-mentioned alignment mechanism 25, the upper camera 25a can be moved between the standby position and the position directly below the center of the probe card 24 (hereinafter referred to as the "probe center") with the help of the alignment bridge 25c. The upper camera 25a located at the probe center can capture an image of the electrode pads of each chip on the wafer W placed on the stage 21 while the stage 21 moves in the horizontal direction (X direction and Y direction) during alignment, and output the captured image to the controller 30. In addition, the lower camera 25d can be moved toward the probe center with the help of the stage 21. The lower camera 25d located at the probe center can capture an image of the plurality of probes 24a formed on the probe card 24 during alignment, and output the captured image to the controller 30.

[0040] The controller 30 is provided below the mounting table 21 and is used to control the overall operation of the inspection device 1. In addition, the controller 30 can implement the alignment method described below. Figure 3 As shown, the controller 30 is a computer having a drive device 31 , an auxiliary storage device 32 , a storage device 33 , a CPU 34 , an interface device 35 , a display device 36 , and the like, each of which is connected to one another via a bus 38 .

[0041] The program for implementing the processing in the controller 30 can be provided on a recording medium 37 such as a CD-ROM. When the recording medium 37 storing the program is set in the drive device 31, the program can be installed from the recording medium 37 to the auxiliary storage device 32 via the drive device 31. However, the program does not necessarily need to be installed using the recording medium 37, and can also be downloaded from another computer via a network.

[0042] The auxiliary storage device 32 can store various information. This information includes, for example, alignment information calculated in the chip-by-chip and card-by-card modes in the alignment method described below. This alignment information includes the designed inclination and center of gravity of the probe set, the measured inclination and center of gravity of the probe set, the inclination and center of gravity of the probe card 24, inclination offset, and center of gravity offset.

[0043] The storage device 33 can read the program from the auxiliary storage device 32 and store the program when there is an instruction to start the program.

[0044] The CPU 34 can execute functions related to the inspection apparatus 1 according to the program stored in the storage device 33 .

[0045] The interface device 35 can be used as an interface for connecting to a network.

[0046] The display device 36 can display various information and can also function as an operation unit that accepts operations by an operator or the like.

[0047] In the inspection apparatus 1 described above, the alignment mechanism 25 aligns the wafer W with the probe card 24 so that the probes 24a of the probe card 24 accurately contact the electrode pads of each chip on the wafer W, which is placed on the mounting table 21. The lifting and rotating mechanism 22 then raises the mounting table 21 so that the probes 24a of the probe card 24 contact the corresponding electrode pads. The controller 30 then applies inspection signals from the tester to each chip on the wafer W via the test head T and the probes 24a, thereby inspecting the electrical characteristics of each chip.

[0048] [Alignment method]

[0049] Reference Figures 4 to 7 As an example of the alignment method of the embodiment, an alignment method of the above-mentioned inspection apparatus 1 including the probe card 24 including a plurality of probe groups provided corresponding to a plurality of chips will be described.

[0050] The alignment method of the embodiment includes the step of selecting either the chip-based mode or the card-based mode. However, the alignment method of the probe card 24 of the embodiment may include the chip-based mode instead of the card-based mode.

[0051] The chip unit mode is a mode in which the inclination and center of gravity of a probe group are calculated in units of chips, and the inclination and center of gravity of the probe card 24 are calculated based on the calculated inclinations and centers of gravity of the plurality of probe groups.

[0052] The card-based mode is a mode in which the inclination and center of gravity of the probe card 24 are calculated using the probe card as a unit. In other words, the card-based mode is a mode in which the inclination and center of gravity of the probe card 24 are calculated by regarding the probe card as a single object.

[0053] The following description uses the example of a probe card 24 having two probe sets PA and PB. Probe sets PA and PB are provided for different chips CA. Furthermore, each chip includes multiple electrode pads, and each probe set PA and PB includes multiple probes corresponding to the multiple electrode pads on each chip.

[0054] Furthermore, the number of probe groups provided in the probe card 24 is not limited to two, and may be three or more, for example.

[0055] (Chip unit mode)

[0056] Reference Figure 4 , an example of a method for calculating the inclination of the probe card 24 in the chip unit mode will be described. Figure 4 1 is a diagram showing an example of a method for calculating the inclination of the probe card 24 in the chip unit mode. Figure 4 (a) is a diagram for explaining the position information of the probe set design. Figure 4 (b) is a diagram for explaining positional information of the probe group during measurement.

[0057] First, if Figure 4 As shown in (a), the controller 30 calculates the designed inclination of the probe group PA (vector V A The two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1 to PA4 located at the four corners of the probe group PA. In addition, the controller 30 calculates the designed inclination (vector V) of the probe group PB based on the designed position information of the two or more probes included in the probe group PB. B The two or more probes included in the probe group PB include, for example, two or more probes from among probes PB1 to PB4 located at the four corners of the probe group PB. The design position information of the two or more probes included in the probe group PA and the design position information of the two or more probes included in the probe group PB may be, for example, needle position information obtained from the design values ​​of the probe card 24. Alternatively, this position information may be needle position information obtained through teaching of the probe card 24, for example.

[0058] The controller 30 is based on the designed inclination of the probe group PA (vector V A ) and the designed slope of probe set PB (vector V B ), to calculate the designed inclination of the probe card 24 (vector V A+B The designed inclination of the probe card 24 (vector V A+B ) can be, for example, the designed inclination of the probe group PA (vector V A ) and the designed slope of the probe set PB (vector V B ) is the mean or median value of the

[0059] Then, if Figure 4As shown in (b), the controller 30 calculates the measured inclination (vector V) of the probe group PA based on the measured position information of two or more probes included in the probe group PA. A '). The two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1' to PA4' located at the four corners of the probe group PA. In addition, the controller 30 calculates the measured inclination (vector V) of the probe group PB based on the measured position information of the two or more probes included in the probe group PB. B '). The two or more probes included in the probe group PB include, for example, two or more probes from among the probes PB1' to PB4' located at the four corners of the probe group PB. The measured position information of the two or more probes included in the probe group PA and the measured position information of the two or more probes included in the probe group PB can be, for example, needle position information obtained by photographing the probe card 24 using the lower camera 25d.

[0060] The controller 30 measures the tilt of the probe set PA based on the measured tilt (vector V A ') and the tilt of the probe group PB (vector V B '), to calculate the measured tilt of the probe card 24 (vector V A+B '). The measured tilt of the probe card 24 (vector V A+B ') can be, for example, the measured inclination of the probe set PA (vector V A ') and the tilt measured by the probe group PB (vector V B ') of the mean or median value.

[0061] Next, the controller 30 calculates the measured inclination of the probe set PA (vector V A+B ') relative to the designed slope of the probe set PA (vector V A+B ) is the offset of the inclination offset (vector V A+B ′-vector V A+B The calculated tilt offset can be used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the plurality of probes 24 a formed on the probe card 24 .

[0062] Reference Figure 5 , an example of a method for calculating the center of gravity of the probe card 24 in the chip unit mode will be described. Figure 5 1 is a diagram showing an example of a method for calculating the center of gravity of the probe card 24 in the chip unit mode. Figure 5 (a) is a diagram for explaining the position information of the probe set design. Figure 5 (b) is a diagram for explaining positional information of the probe group during measurement.

[0063] First, if Figure 5 As shown in (a), the controller 30 calculates the center of gravity G of the probe group PA based on the design position information of two or more probes included in the probe group PA. A The two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1 to PA4 located at the four corners of the probe group PA. In addition, the controller 30 calculates the design center of gravity G of the probe group PB based on the design position information of the two or more probes included in the probe group PB. B The two or more probes included in the probe group PB include, for example, two or more probes among the probes PB1 to PB4 located at the four corners of the probe group PB. The controller 30 controls the probe group PA based on the center of gravity G in the design. A and the center of gravity G of the probe set PB design B , to calculate the center of gravity G of the probe card 24 A+B The center of gravity G of the probe card 24 is designed A+B For example, it can be the center of gravity G of the probe group PA. A The center of gravity G of the probe set PB B The mean or median value.

[0064] Then, if Figure 5 As shown in (b), the controller 30 calculates the center of gravity G of the probe group PA based on the position information of two or more probes included in the probe group PA. A '. The two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1' to PA4' located at the four corners of the probe group PA. In addition, the controller 30 calculates the center of gravity G of the probe group PB based on the measured position information of the two or more probes included in the probe group PB. B The two or more probes included in the probe group PB include, for example, two or more probes among the probes PB1′ to PB4′ located at the four corners of the probe group PB. The controller 30 is based on the center of gravity G of the probe group PA. A ' and the center of gravity G of the probe group PB B ', to calculate the center of gravity G of the probe card 24 on the measurement A+B The center of gravity G of the probe card 24 is measured A+B For example, it can be the center of gravity G of the probe group PA. A 'Measurement of the center of gravity G on the probe group PB B 'The mean or median value.

[0065] Next, the controller 30 calculates the center of gravity G of the probe card 24 during measurement.A+B 'Relative to the center of gravity G of the probe card 24 A+B The offset is the center of gravity offset G A+B '-G A+B The calculated center-of-gravity offset amount can be used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the plurality of probes 24 a formed on the probe card 24 .

[0066] In addition, the controller 30 may store the alignment information calculated in the chip unit mode in the auxiliary storage device 32. The alignment information includes the designed inclination and center of gravity of the probe groups PA and PB, the measured inclination and center of gravity of the probe groups PA and PB, the inclination and center of gravity of the probe card 24, the inclination offset, the center of gravity offset, etc.

[0067] (Card Unit Mode)

[0068] Reference Figure 6 , an example of a method for calculating the inclination of the probe card 24 in the card unit mode will be described. Figure 6 1 is a diagram showing an example of a method for calculating the inclination of the probe card 24 in the card unit mode. Figure 6 (a) is a diagram for explaining the position information of the probe set design. Figure 6 (b) is a diagram for explaining positional information of the probe group during measurement.

[0069] First, if Figure 6 As shown in (a), the controller 30 calculates the designed inclination (vector V) of the probe card 24 based on the designed position information of two or more probes included in the probe groups PA and PB. AB ). The two or more probes contained in the probe groups PA and PB include, for example, the entire probes located in the probe groups PA and PB. AB The design position information of the two or more probes included in the probe groups PA and PB may be, for example, needle position information obtained from the design values ​​of the probe card 24. Alternatively, this position information may be needle position information obtained through teaching of the probe card 24.

[0070] Then, if Figure 6 As shown in (b), the controller 30 calculates the measured tilt (vector V) of the probe card 24 based on the measured position information of two or more probes included in the probe groups PA and PB. AB '). The two or more probes contained in the probe groups PA and PB include, for example, the entire probe group PA and PB. ABThe position information of the two or more probes included in the probe groups PA and PB in terms of measurement may be, for example, needle position information obtained by imaging the probe card 24 with the lower camera 25d.

[0071] Next, the controller 30 calculates the measured tilt of the probe card 24 (vector V AB ') relative to the designed inclination of the probe card 24 (vector V AB ) is the offset of the inclination offset (vector V AB '-Vector V AB The calculated tilt offset can be used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the plurality of probes 24 a formed on the probe card 24 .

[0072] Reference Figure 7 , an example of a method for calculating the center of gravity of the probe card 24 in the card unit mode will be described. Figure 7 1 is a diagram showing an example of a method for calculating the center of gravity of the probe card 24 in the card unit mode. Figure 7 (a) is a diagram for explaining the position information of the probe set design. Figure 7 (b) is a diagram for explaining positional information of the probe group during measurement.

[0073] First, if Figure 7 As shown in (a), the controller 30 calculates the design center of gravity G of the probe card 24 based on the design position information of two or more probes included in the probe groups PA and PB. AB The two or more probes included in the probe groups PA and PB include, for example, two or more probes among the probes P1 to P4 located at the four corners of the entire probe groups PA and PB.

[0074] Then, if Figure 7 As shown in (b), the controller 30 calculates the center of gravity G of the probe card 24 based on the position information of two or more probes included in the probe groups PA and PB. AB The two or more probes included in the probe groups PA and PB include, for example, two or more probes among the probes P1 ′ to P4 ′ located at the four corners of the entire probe groups PA and PB.

[0075] Next, the controller 30 calculates the center of gravity G of the probe card 24 during measurement. AB 'Relative to the center of gravity G of the probe card 24 AB The offset is the center of gravity offset G AB '-G ABThe calculated center-of-gravity offset amount can be used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the plurality of probes 24 a formed on the probe card 24 .

[0076] In addition, the controller 30 may store the alignment information calculated in the card unit mode in the auxiliary storage device 32. The alignment information includes the inclination and center of gravity of the probe card 24, the inclination offset, the center of gravity offset, and the like.

[0077] [Alignment of probe card and wafer]

[0078] Reference Figure 8 , an example of the positional relationship between the probe group and the chip when the chip unit mode is selected in the alignment method of the embodiment is described. Figure 8 This is a diagram for explaining the positional relationship between the probe group and the chip in the chip unit mode.

[0079] First, if Figure 8 As shown in (a), the controller 30 is based on the designed inclination of the probe group PA (vector V A ) and the designed slope of probe set PB (vector V B ), to calculate the designed inclination of the probe card 24 (vector V A+B ). In addition, Figure 8 As shown in (a), the controller 30 is based on the center of gravity G of the probe group PA. A and the center of gravity G of the probe set PB design B , to calculate the center of gravity G of the probe card 24 A+B The designed inclination of the probe card 24 (vector V A+B ) and the center of gravity G of the probe card 24 A+B The calculation methods can be compared with reference Figure 4 (a) and Figure 5 The method described in (a) is the same.

[0080] Then, if Figure 8 As shown in (b), the controller 30 measures the inclination (vector V A ') and the tilt of the probe group PB (vector V B '), to calculate the measured tilt of the probe card 24 (vector V A+B '). In addition, Figure 8 As shown in (b), the controller 30 measures the center of gravity G based on the probe group PA. A ' and the center of gravity G of the probe group PB B ', to calculate the center of gravity G of the probe card 24 on the measurement A+B'. Among them, the measured inclination of the probe card 24 (vector V A+B ') and the center of gravity G on the measurement of the probe card 24 A+B The calculation method of ' can be compared with reference Figure 4 (b) and Figure 5 The method described in (b) is the same.

[0081] Next, the controller 30 calculates the measured tilt of the probe card 24 (vector V A+B ') relative to the designed inclination of the probe card 24 (vector V A+B ) is the offset of the inclination offset (vector V A+B '-Vector V A+B ).exist Figure 8 (a) and Figure 8 In the example (b), the designed inclination of the probe card 24 (vector V A+B ) and the measured inclination of the probe card 24 (vector V A+B ') are the same, so the tilt offset of the probe card 24 is 0. In addition, the controller 30 calculates the center of gravity G of the probe card 24 on the measurement A+B 'Relative to the center of gravity G of the probe card 24 A+B The offset is the center of gravity offset G A+B '-G A+B .

[0082] Then, if Figure 8 As shown in (c), the controller 30 aligns the electrode pads of the chips CA and CB on the wafer W with the probe groups PA and PB of the probe card 24 based on the calculated tilt offset and center of gravity offset of the probe card 24. At this time, as described above, the tilt offset of the probe card 24 is 0, so the wafer W is aligned with the probe card 24 by horizontally moving the wafer W by the amount of the center of gravity offset of the probe card 24.

[0083] Reference Figure 9 , an example of the positional relationship between the probe group and the chip in the card unit mode in the alignment method of the embodiment is described. Figure 9 This is a diagram for explaining the positional relationship between the probe group and the chip when the card unit mode is selected.

[0084] First, if Figure 9 As shown in (a), the controller 30 calculates the designed inclination of the probe card 24 (vector V AB ) and the center of gravity G of the probe card 24 AB The designed inclination of the probe card 24 (vector V AB ) and the center of gravity G of the probe card 24 ABThe calculation methods can be compared with reference Figure 6 (a) and Figure 7 The method described in (a) is the same.

[0085] Then, if Figure 9 As shown in (b), the controller 30 calculates the tilt of the probe card 24 during measurement (vector V AB ') and the center of gravity G on the measurement of the probe card 24 AB '. Among them, the measured inclination of the probe card 24 (vector V AB ') and the center of gravity G on the measurement of the probe card 24 AB The calculation method of ' can be compared with reference Figure 6 (b) and Figure 7 The method described in (b) is the same.

[0086] Next, the controller 30 calculates the measured tilt of the probe card 24 (vector V AB ') relative to the designed inclination of the probe card 24 (vector V AB ) is the offset of the inclination offset (vector V AB '-Vector V AB ). In addition, the controller 30 calculates the center of gravity G of the probe card 24 during measurement. AB 'Relative to the center of gravity G of the probe card 24 AB The offset is the center of gravity offset G AB '-G AB .

[0087] Then, if Figure 9 As shown in (c), the controller 30 aligns the electrode pads of the chips CA and CB on the wafer W with the probe groups PA and PB of the probe card 24 based on the tilt offset and the center of gravity offset of the probe card 24. At this time, the wafer W is aligned with the probe card 24 by rotating the wafer W by the tilt offset of the probe card 24 and by horizontally moving the wafer W by the center of gravity offset of the probe card 24.

[0088] As described above, the alignment method according to the embodiment includes a chip-by-chip mode, in which the inclination and center of gravity of a probe group are calculated for each chip, and the inclination and center of gravity of the probe card 24 are calculated based on the calculated inclinations and centers of gravity of multiple probe groups. This allows the electrode pads and probes to be aligned with high precision even when there is positional misalignment between chips.

[0089] Furthermore, the alignment method according to the embodiment includes the step of selecting either the chip-based mode or the card-based mode. This allows the user to select either the chip-based mode or the card-based mode according to the type of probe card to perform probe card alignment.

[0090] Furthermore, in the above embodiment, the user selects either the chip-based mode or the card-based mode to implement the alignment method for the probe card 24. However, the present invention is not limited thereto. For example, the user may select the chip-based mode to calculate the inclination of the probe card 24 and the card-based mode to calculate the center of gravity of the probe card 24. Alternatively, for example, the user may select the card-based mode to calculate the inclination of the probe card 24 and the chip-based mode to calculate the center of gravity of the probe card 24.

[0091] Furthermore, in the above-described embodiment, the controller 30 is an example of a control unit.

[0092] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and the spirit thereof.

Claims

1. An alignment method for a probe card including a plurality of probe groups arranged corresponding to a plurality of chips, characterized in that: The first mode includes the following: Based on the design position information of more than two probes included in each probe group, the design inclination of each probe group and the design center of gravity of each probe group are calculated respectively, and based on the calculated design inclination of each probe group and the design center of gravity of each probe group, the design inclination of the probe card and the design center of gravity of the probe card are calculated. Based on the measurement position information of more than two probes included in each probe group, the measurement inclination of each probe group and the measurement center of gravity of each probe group are calculated respectively, and based on the calculated measurement inclination of each probe group and the measurement center of gravity of each probe group, the measurement inclination of the probe card and the measurement center of gravity of the probe card are calculated. The tilt offset, which is the offset of the measured tilt of the probe card relative to the designed tilt of the probe card, and the center of gravity offset, which is the offset of the measured center of gravity of the probe card relative to the designed center of gravity of the probe card, are calculated.

2. The alignment method according to claim 1, wherein: The two or more probes include two or more probes located at four corners of the probe group.

3. The alignment method according to claim 1 or 2, wherein: The second mode includes the following: Calculating a designed inclination of the probe card and a designed center of gravity of the probe card based on designed position information of two or more probes included in the plurality of probe groups, calculating the measurement tilt of the probe card and the measurement center of gravity of the probe card based on measurement position information of two or more probes included in the plurality of probe groups, The tilt offset, which is the offset of the measured tilt of the probe card relative to the designed tilt of the probe card, and the center of gravity offset, which is the offset of the measured center of gravity of the probe card relative to the designed center of gravity of the probe card, are calculated.

4. The alignment method according to claim 3, wherein: The two or more probes include two or more probes among the probes located at four corners of the plurality of probe groups.

5. The alignment method according to claim 3, wherein: The method includes selecting either the first mode or the second mode.

6. An inspection device, characterized in that: include: a mounting table for mounting a substrate; a probe card including a plurality of probe groups provided corresponding to respective chips among a plurality of chips formed on the substrate; and Control Department, The control unit can execute the following first mode: Based on the design position information of more than two probes included in each probe group, the design inclination of each probe group and the design center of gravity of each probe group are calculated respectively, and based on the calculated design inclination of each probe group and the design center of gravity of each probe group, the design inclination of the probe card and the design center of gravity of the probe card are calculated. Based on the measurement position information of more than two probes included in each probe group, the measurement inclination of each probe group and the measurement center of gravity of each probe group are calculated respectively, and based on the calculated measurement inclination of each probe group and the measurement center of gravity of each probe group, the measurement inclination of the probe card and the measurement center of gravity of the probe card are calculated. The tilt offset, which is the offset of the measured tilt of the probe card relative to the designed tilt of the probe card, and the center of gravity offset, which is the offset of the measured center of gravity of the probe card relative to the designed center of gravity of the probe card, are calculated.

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