A high-temperature and pressure test method and test equipment for an aging substrate

Abstract

The present invention discloses a high-temperature and pressure test method for an aging substrate, including: Step A: Producing a plurality of partition plates with a flatness within ±0.1 mm - ±1 mm by means of one-time molding; Step B: Conducting a pressure uniformity test on the plurality of partition plates, and selecting a plurality of partition plates with appropriate flatness according to the uniformity test results; Step C: Disposing the plurality of partition plates selected in Step B one by one on one side of a plurality of clamping plate assemblies, and then arranging the clamping plate assemblies parallelly on a test device for performing a high-temperature and pressure test on the aging substrate to be tested; Step D: Clamping the aging substrate with two adjacent clamping plate assemblies. The clamping plate assembly further includes a heating plate, and the heating plate is disposed on one side of the partition plate. The aging substrate is heated through the heating plate, and at the same time, pressure is applied to the aging substrate through the partition plate, so as to perform a high-temperature and pressure test on the aging substrate. It also discloses a high-temperature and pressure test device for an aging substrate. It can quickly perform a high-temperature and pressure test on the aging substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a high-temperature and pressure test method and test equipment for aging substrates. Background Art

[0002] Chips are components that are prone to heat generation in a circuit, and are also prone to functional failure after heating. Therefore, it is necessary to conduct aging tests on chips. In chip aging tests, aging boards are generally used. An aging board is generally formed by laying some necessary components and circuits on an aging substrate.

[0003] When testing aging chips, the aging substrate on the aging board also has to withstand high temperatures (0 - 150 degrees). Therefore, it is also necessary to test the temperature resistance performance of the aging substrate. In order to make the aging board heat evenly and carry more chips under test, the aging substrate on the aging board should also be flatter.

[0004] In this field, there is no method and equipment for high-temperature and pressure testing of aging substrates. Even if there is, the test efficiency is not high. Summary of the Invention

[0005] In order to overcome the deficiencies of the prior art, one of the purposes of the present invention is to provide a high-temperature and pressure test method for aging substrates, which can quickly perform high-temperature and pressure tests on aging substrates.

[0006] Another purpose of the present invention is to provide a high-temperature and pressure test equipment for aging substrates.

[0007] One of the purposes of the present invention is achieved by adopting the following technical solutions:

[0008] A high-temperature and pressure test method for aging substrates, characterized by comprising:

[0009] Step A: Produce a plurality of partitions with a flatness within ±0.1 mm - ±1 mm by a one-time molding method.

[0010] Step B: Conduct a pressure uniformity test on the plurality of partitions, and select a plurality of partitions with appropriate flatness according to the uniformity test results.

[0011] Step C: Set the plurality of partitions selected in Step B one by one on one side of a plurality of clamping plate assemblies for clamping the aging substrate, and then set the clamping plate assembly parallelly on a test equipment for performing high-temperature and pressure tests on the aging substrate to be tested.

[0012] Step D: Use two adjacent clamping plate assemblies to clamp the aging substrate. The clamping plate assembly further includes a heating plate. The heating plate is arranged on one side of the partition. Heat the aging substrate through the heating plate, and at the same time apply pressure to the aging substrate through the partition, so as to perform a high-temperature and pressure test on the aging substrate.

[0013] Step E: Control the temperature of the heating plate through the PID temperature control module, and ensure that the temperature difference between adjacent heating plates is within ±3°C.

[0014] Furthermore, in step B, the pressure uniformity test is to attach a layer of induction paper and white copy paper provided with a dye on the surface of multiple partitions, and then squeeze the partitions separately with uniform pressure, and then observe the copy paper after squeezing. If the dye adhered to the copy paper is uniform, it indicates that the flatness of the partition attached to the copy paper is appropriate, otherwise the flatness is inappropriate.

[0015] Furthermore, in the step C, the heating plate includes a silicone plate and a heating wire arranged on the silicone plate, and the pressure uniformity test is also performed on the heating plate.

[0016] Further, in the step D, the power P=K|T-20|c / t applied to the heating plate is determined according to the mass of the heating plate, the heating time t, and the maximum heating temperature T, wherein c is the specific heat capacity of the heating plate and K is a set coefficient.

[0017] Furthermore, the suitable flatness is within ±0.5 mm, and the test pressure is 60-120 KPa.

[0018] The second object of the present invention is achieved by adopting the following technical solution:

[0019] A test device for a high-temperature pressurized test method using the aging substrate, comprising a clamping plate assembly, a motor, a screw driving assembly, a gear box assembly and an end plate, the motor being transmission-connected to the gear box assembly, one end of the screw driving assembly being arranged on the gear box assembly, and the other end of the screw driving assembly being arranged on the end plate, two guide rods being arranged between the gear box assembly and the end plate, a plurality of clamping plate assemblies being arranged in parallel between the two guide rods, the screw driving assembly comprising two screws and a pressure plate arranged on a nut pair of the two screws, the two screws being arranged between the gear box assembly and the end plate, the pressure plate being slidably connected to the guide rods, and when the motor rotates, the motor drives the pressure plate to reciprocate on the guide rods through the gear box assembly and the screw to squeeze the clamping plate assembly, thereby causing the clamping plate assembly to squeeze the aging substrate to be tested.

[0020] Preferably, the gear box assembly is also provided with a leveling structure for leveling the aging substrate to be tested, the leveling structure includes a ruler fixed on the gear box assembly, a first movable frame slidably connected to the gear box assembly, and a second movable frame slidably connected to the end plate, a leveling rod is provided between the first movable frame and the second movable frame, and the first movable frame is also provided with an identification block corresponding to the ruler.

[0021] Preferably, the clamping plate assembly further includes an aluminum alloy part, a kit, and two first silicone clips. The aluminum alloy part is fixed on the surface of the heating plate. The kit is sleeved on the aluminum alloy part. The partition plate is fixed on the kit. A plurality of first perforations are provided on the aluminum alloy part. A plurality of second perforations corresponding to the first perforations are provided on the kit. A pin cooperating with the first perforations and the second perforations is provided at one end of the first silicone clip. The two first silicone clips are respectively arranged at both ends of the kit through the pins.

[0022] Preferably, the clamping plate assembly further includes an insulating cloth for loading the substrate to be aged. The insulating cloth includes an insulating layer and a fiber layer attached to the insulating layer. A V-shaped clip for clamping the insulating cloth is provided at the other end of the first silicone clip. The insulating cloth is clamped on the first silicone clips of two adjacent clamping plate assemblies through the V-shaped clip, thereby forming a V-shaped insulating cloth for loading the aged substrate. The second object of the present invention is achieved by the following technical solutions:

[0023] Preferably, a first end block and a second end block are provided at both ends of the heating plate. A connecting block slidably connected to the guide rod is provided on the guide rod. A socket cooperating with the first end block and the second end block is provided on the connecting block. A pin shaft and a lock pin detachably connected to the pin shaft are provided on the second end block. When the lock pin is removed and the first end block and the second end block are inserted into the socket, the cross section of the guide rod is sleeved between the first end block and the second end block.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] The test equipment of the present application includes a heating plate for heating the aged substrate and a partition plate for applying pressure. The heating plate and the partition plate can operate on the aged substrate simultaneously, so that high-temperature and pressure tests can be performed on multiple aged substrates at the same time, thereby enabling rapid high-temperature and pressure tests on the aged substrates.

[0026] In addition, due to the use of a partition plate with high flatness on the test equipment of the present application, when testing the aged substrate, damage to the aged substrate during the test can be prevented, which is more conducive to testing the aged substrate. Description of the Drawings

[0027] Figure 1 It is a flowchart of the high-temperature and pressure test method of the present invention.

[0028] Figure 2 It is a schematic structural diagram of the high-temperature and pressure test equipment of the present invention.

[0029] Figure 3 is Figure 2Schematic diagram of the enlarged structure at position A in [the figure].

[0030] Figure 4 Schematic diagram of the structure of the splint assembly of the present invention.

[0031] Figure 5 is Figure 4 Schematic diagram of the enlarged structure at position B in [the figure].

[0032] In the figure: 1. High-temperature and pressure testing equipment. 10. Splint assembly. 11. Partition board. 12. Heating plate. 121. First end block. 122. Second end block. 123. Pin shaft. 124. Curved block. 125. Locking pin. 126. Threaded hole. 13. Kit. 131. First silica gel clip. 132. Second perforation. 133. Temperature sensor. 14. Aluminum alloy part. 141. Second silica gel clip. 142. First perforation. 20. Lead screw pushing assembly. 21. Pressing plate. 22. Support rod. 23. Lead screw. 24. Scale. 25. Identification block. 26. First moving frame. 27. Flush rod. 30. Gearbox assembly. 31. Guide rod. 32. Pushing plate. 33. Base plate. 311. Connecting block. 40. Motor. 50. End plate. 51. Fixed plate. 52. Second moving frame. Detailed implementation manners

[0033] In order to more clearly understand the specific technical solutions, features and advantages of the present invention, the present invention will be further described in detail below in conjunction with the drawings and specific implementation manners.

[0034] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "horizontal", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the invention product is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0035] As Figure 1 shown, the present application discloses a high-temperature and pressure testing method for aging substrates, including:

[0036] Step A: Produce a plurality of partition boards with a flatness within ±0.1 mm - ±1 mm by means of one-time molding.

[0037] In the above step A, the one-time formed partition 11 can avoid the unevenness of the partition 11 caused by multiple formations, and there is no need to process the surface of the partition 11 multiple times, making the partition 11 flatter. In addition, during the production, handling, and transportation processes, the partition 11 is fixed by special tooling fixtures to prevent the partition 11 from being squeezed or collided, which affects the flatness. Among them, the most suitable flatness is within ±0.5 mm.

[0038] Step B: Perform a pressure uniformity test on multiple partitions, and select multiple partitions with appropriate flatness based on the uniformity test results.

[0039] In the above step B, the pressure uniformity test is to attach a layer of induction paper with dye and white copy paper on the surfaces of multiple partitions 11, then squeeze the partitions 11 with uniform pressure respectively, and then observe the copy paper after squeezing. If the dye adhered to the copy paper is uniform, it indicates that the flatness of the partition 11 to which the copy paper is attached is appropriate, otherwise the flatness is inappropriate. Performing a pressure uniformity test on the partitions can well select partitions with appropriate flatness, thereby improving the flatness of the partitions 11.

[0040] Step C: Arrange one by one the multiple partitions selected in step B on one side of multiple clamping plate assemblies for clamping the aging substrate, and then arrange the clamping plate assemblies parallelly on a test device for performing a high-temperature pressure test on the aging substrate to be tested.

[0041] In the above step C, the heating plate 12 includes a silica gel plate and heating wires arranged on the silica gel plate. A pressure uniformity test is also performed on the heating plate, improving the flatness of the heating plate 12. To further improve the flatness of the heating plate 12, the heating wires are uniformly arranged on the silica gel plate, and the silica gel plate is also a silica gel plate with high flatness.

[0042] Step D: Use two adjacent clamping plate assemblies to clamp the aging substrate. The clamping plate assembly further includes a heating plate. The heating plate is arranged on one side of the partition. The aging substrate is heated through the heating plate, and at the same time, the aging substrate is pressured through the partition, thereby performing a high-temperature pressure test on the aging substrate.

[0043] In the above step D, according to the quality of the heating plate, the heating time t, and the maximum heating temperature T, the power P of the power supply applied to the heating plate is determined as P = K|T - 20|c / t, where c is the specific heat capacity of the heating plate, K is a set coefficient, K can be deduced through experiments and is generally close to 1, T is about 90 degrees, c is 1000 j / (kg·degree), assuming t = 100 minutes, then the power P = 1·|90 - 20|·1000 / (60·100) = 11.3 W. The power required to heat a single aging substrate can be easily calculated through this formula. In the test, the optimal pressure is 60 - 120 KPa.

[0044] Step E: Control the temperature of the heating plate through the PID temperature control module, and ensure that the temperature difference between adjacent heating plates is within ±3°C.

[0045] In the step E, the temperature control module includes a temperature sensor, the test probe of the temperature sensor can be set in the heating plate, the temperature control module is electrically connected to the input power of the heating plate, and the temperature control module controls the temperature of the heating plate 12 by controlling the power of the input power. In order to prevent the aging substrate from being deformed due to the excessive temperature difference of the partitions 11 on both sides, the temperature difference of adjacent heating plates 12 is within ±3°C, and the smaller the temperature difference, the better.

[0046] like Figure 1-2 As shown, the present application also discloses a test device 1 for a high temperature pressurization test method using the aging substrate, which includes a clamping plate assembly 10, a motor 40, a screw driving assembly 20, a gear box assembly 30 and an end plate 50, wherein the motor 40 is transmission-connected to the gear box assembly 30, one end of the screw driving assembly 20 is arranged on the gear box assembly 30, and the other end of the screw driving assembly 20 is arranged on the end plate 50, two guide rods 31 are arranged between the gear box assembly 30 and the end plate 50, and a plurality of clamping plate assemblies 10 are arranged in parallel. It is arranged between two guide rods 31, and the screw driving assembly 20 includes two screw rods 23 and a pressure plate 21 arranged on the nut pair of the two screw rods 23. The two screw rods 23 are arranged between the gear box assembly 30 and the end plate 50. The pressure plate 21 is slidably connected with the guide rod 31. When the motor 40 rotates, the motor 40 drives the pressure plate 21 to reciprocate on the guide rod 31 through the gear box assembly 30 and the screw rod 23 to squeeze the clamping plate assembly 10, so that the clamping plate assembly 10 squeezes the aging substrate to be tested.

[0047] In the above-described embodiment, a main gear and a plurality of driven gears meshing with the main gear are provided inside the gearbox assembly 30. The rotating shaft of the motor 40 is connected to the main gear inside the gearbox assembly 30. The lead screw 23 is connected to the driven gear inside the gearbox assembly 30. The pressing plate 21 is disposed on the nut pair of the lead screw 23. When the motor 40 rotates, the rotating shaft of the motor 40 drives the lead screw 23 to rotate, and the lead screw 23 drives the pressing plate 21 to reciprocate to squeeze the clamping plate assembly 10, so that the partition plate 11 on the clamping plate assembly 10 squeezes the substrate to be aged, thereby realizing the function of pressurizing and testing the aged substrate. Due to the use of the partition plate 11 with high flatness on the testing device 1 of the present application, when testing the aged substrate, it is possible to prevent the aged substrate from being damaged due to excessive pressure at individual parts during the test, and the accuracy of the pressurizing test can also be improved. Moreover, the heating plate 12 and the partition plate 11 can operate on the aged substrate simultaneously, so that high-temperature and pressurizing tests can be performed on multiple aged substrates simultaneously, thereby enabling rapid high-temperature and pressurizing tests on the aged substrate.

[0048] Wherein, the lead screw pushing assembly 20 further includes a support rod 22 for supporting the pressing plate 21. The pressing plate 21 is slidably connected to the support rod 22. The gearbox assembly 30 further includes a bottom plate 33, and the bottom plate 33 can prevent jitter and can also be connected to external equipment. A fixing plate 51 and a pressure sensor are further provided on the end plate 50. The fixing plate 51 is fixed to the inner side of the end plate 50, the pressure sensor is disposed on the fixing plate 51, and the pressure sensor is connected to the clamping plate assembly 10 at the end.

[0049] As Figure 3-4 shown, in a preferred embodiment, the clamping plate assembly 10 further includes an aluminum alloy member 14, a sleeve 13, and two first silicone clips 131. The aluminum alloy member 14 is fixed on the surface of the heating plate 12. The sleeve 13 is sleeved on the aluminum alloy member 14. The partition plate 11 is fixed on the sleeve 13. A plurality of first through holes 142 are provided on the aluminum alloy member 14. A plurality of second through holes 132 corresponding to the first through holes 142 are provided on the sleeve 13. One end of the first silicone clip 131 is provided with a pin (not shown) that cooperates with the first through hole 142 and the second through hole 132, and the two first silicone clips 131 are respectively disposed at both ends of the sleeve 13 through the pins.

[0050] In the above-described embodiment, the first silicone clip 131 can arbitrarily select any one of the second through-holes 132 to be inserted into the kit 13 and the aluminum alloy part 14, so as to change the distance between the two first silicone clips 131. The clamping plate assembly 10 further includes a temperature sensor and a spare second silicone clip 141. The second silicone clip 141 is disposed on the first through-hole 142 for standby. The probe of the temperature sensor 133 is connected to the clamping plate assembly 10, and thus the temperature of the clamping plate assembly 10 can be detected. The position of the first silicone clip 131 can also be moved through the kit 13.

[0051] Wherein, the clamping plate assembly 10 further includes an insulating cloth (not shown) for loading the aging substrate to be tested. The insulating cloth includes an insulating layer and a fiber layer attached to the insulating layer. A V-shaped clip for clamping the insulating cloth is disposed at the other end of the first silicone clip 131. The insulating cloth is clamped on the first silicone clips of adjacent two clamping plate assemblies through the V-shaped clip, thereby forming a V-shaped insulating cloth.

[0052] As Figure 1-3 shown, the four first silicone clips 131 on adjacent two clamping plate assemblies 10 respectively clamp the four corners of the insulating cloth, so that the insulating cloth forms a V-shaped insulating cloth with the opening upward and the bottom downward. The aging substrate to be tested is placed in the V-shaped insulating cloth for testing, which is convenient for loading the aging substrate.

[0053] Since during the test, in order to keep the aging substrates between the clamping plate assemblies 10 flush and make the pressure on the partition plate 11 more uniform, the insulating cloth must be kept flush. Therefore, the first silicone clips 131 on the same side of each clamping plate assembly 10 must be kept flush. A leveling structure is provided on the gearbox assembly 30. The leveling structure includes a scale fixed on the gearbox assembly 30, a first moving frame 26 slidably connected to the gearbox assembly 30, and a second moving frame 52 slidably connected to the end plate 50. A leveling rod 27 is disposed between the first moving frame 26 and the second moving frame 52. An identification block 25 corresponding to the scale 24 is further disposed on the first moving frame 26. The leveling rod 27 can be used as a reference line for the longitudinal position of the first silicone clip 131. The first silicone clips 131 on the same side of the clamping plate assembly 10 can all be inserted into the kit 13 relying on this reference line. At the same time, the position of the leveling rod 27 can be moved by sliding the first moving frame 26, and the specific position of the leveling rod 27 can also be determined by the identification block 25 pointing to the scale of the scale 24.

[0054] As Figure 4As shown, in a preferred embodiment, first end block 121 and second end block 122 are provided at two ends of the heating plate 12. A connection block 311 slidably connected to the guide rod 31 is provided on the guide rod 31. An insertion socket for cooperating with the first end block 121 and the second end block 122 is provided on the connection block 311. A pin shaft 123 and a lock pin 125 detachably connected to the pin shaft 123 are provided on the second end block 122. When the lock pin 125 is removed and the first end block 121 and the second end block 122 are inserted into the insertion socket, the cross-section of the guide rod 31 is sleeved between the first end block 121 and the second end block 122.

[0055] In the above embodiment, the splint assembly 10 can be installed simply by pushing the splint assembly 10 upward so that the first end block 121 and the second end block 122 are inserted into the insertion socket, which facilitates the installation of the splint assembly 10. The pin shaft 123 can prevent the splint assembly 10 from falling off. In order to facilitate the sliding of the splint assembly 10 on the guide rod 31, a curved block 124 is provided between the first end block 121 and the second end block 122. In order to prevent the splint assembly 10 from loosening, the first end block 121 can be fixedly connected to the connection block 311 by screws. Preferably, the pin shaft 123 is an elastic pin shaft.

[0056] In summary, the present application can simultaneously and automatically perform high-temperature and pressure tests on aging substrates through the high-temperature and pressure test equipment 1, and can test multiple aging substrates at one time, thus enabling rapid testing of aging substrates. Since a partition plate with high flatness is used in the test equipment of the present application, damage to the aging substrates during testing can be prevented, which is more conducive to testing aging substrates.

[0057] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The descriptions in the above embodiments and the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and all these changes and improvements fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-temperature and high-pressure testing method for an aging substrate, characterized in that, include: Step A: Producing a plurality of partitions with a flatness within ±0.1 mm to ±1 mm by one-time molding; Step B: Performing a pressure uniformity test on multiple baffles, and selecting multiple baffles with appropriate flatness according to the uniformity test results; Step C: arranging the plurality of partitions selected in step B one by one on one side of a plurality of clamping plate assemblies for clamping the aged substrate, and then arranging the clamping plate assemblies in parallel on a test device for performing a high temperature pressure test on the aged substrate to be tested; Step D: clamping the aged substrate with two adjacent clamping plate assemblies, wherein the clamping plate assemblies further include a heating plate, which is disposed on one side of the partition, and the aged substrate is heated by the heating plate, and the aged substrate is pressurized by the partition, so as to perform a high temperature pressure test on the aged substrate; Step E: Control the temperature of the heating plate through the PID temperature control module, and ensure that the temperature difference between adjacent heating plates is within ±3°C.

2. The high-temperature and high-pressure test method according to claim 1, wherein In step B, the pressure uniformity test is to attach a layer of induction paper and white copy paper provided with a dye to the surface of multiple partitions, and then squeeze the partitions respectively with uniform pressure, and then observe the copy paper after squeezing. If the dye adhered to the copy paper is uniform, it indicates that the flatness of the partition attached to the copy paper is appropriate, otherwise the flatness is inappropriate.

3. The high-temperature and high-pressure test method according to claim 2, characterized in that In the step C, the heating plate includes a silicone plate and a heating wire arranged on the silicone plate, and the pressure uniformity test is also performed on the heating plate.

4. The high-temperature and high-pressure test method according to claim 1, wherein In step D, the power P=K|T-20|c / t applied to the heating plate is determined according to the mass of the heating plate, the heating time t, and the maximum heating temperature T, wherein c is the specific heat capacity of the heating plate and K is a set coefficient.

5. The high-temperature and high-pressure test method according to claim 2, characterized in that The suitable flatness is within ±0.5 mm.

6. A test device for a high-temperature and high-pressure test method using the aged substrate according to any one of claims 1-5, characterized in that: The gearbox is a gearbox assembly having two guide rods, one end of which is mounted on the gearbox and the other end of which is mounted on the end plate. The gearbox is a gearbox assembly having two guide rods, the other end of which is mounted on the end plate. The gearbox is a gearbox assembly having two guide rods, the other end of which is mounted on the end plate. The gearbox is a gearbox assembly having two guide rods, the other end of which is mounted on the end plate.

7. The test device according to claim 6, characterized in that: The gear box assembly is also provided with a leveling structure for leveling the aging substrate to be tested, and the leveling structure includes a ruler fixed on the gear box assembly, a first movable frame slidably connected to the gear box assembly, and a second movable frame slidably connected to the end plate, a leveling rod is provided between the first movable frame and the second movable frame, and the first movable frame is also provided with an identification block corresponding to the ruler.

8. The testing device according to claim 7, characterized in that: The splint assembly further includes an aluminum alloy member, a kit, and two first silicone clips. The aluminum alloy member is fixed on the surface of the heating plate. The kit is sleeved on the aluminum alloy member. The partition is fixed on the kit. A plurality of first through holes are provided on the aluminum alloy member. A plurality of second through holes corresponding to the first through holes are provided on the kit. A plug that cooperates with the first through holes and the second through holes is provided at one end of the first silicone clip. The two first silicone clips are respectively arranged at both ends of the kit through the plugs.

9. The testing device according to claim 8, characterized in that: The splint assembly further includes an insulating cloth for loading an aging substrate to be tested. The insulating cloth includes an insulating layer and a fiber layer attached to the insulating layer. A V-shaped clip for clamping the insulating cloth is provided at the other end of the first silicone clip. The insulating cloth is clamped on the first silicone clips of two adjacent splint assemblies through the V-shaped clip, thereby forming a V-shaped insulating cloth for loading the aging substrate.

10. The test device according to claim 8, characterized in that: First end blocks and second end blocks are provided at both ends of the heating plate. A connection block slidably connected to the guide rod is provided on the guide rod. Sockets for cooperating with the first end blocks and the second end blocks are provided on the connection block. A pin shaft and a lock pin detachably connected to the pin shaft are provided on the second end block. When the lock pin is removed and the first end blocks and the second end blocks are inserted into the sockets, the cross-section of the guide rod is sleeved between the first end blocks and the second end blocks.

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