Substrate processing apparatus

Abstract

The present invention provides a substrate processing apparatus comprising: a housing including a first body and a second body, the first body and the second body being coupled to each other to provide a processing space for processing a substrate; an actuator that moves the second body in a vertical direction relative to the first body to seal or open the processing space; and a tube coupled to the second body and in which fluid flows, wherein the tube is a telescopic tube that is stretchable and retractable according to the vertical movement of the second body.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0070010, filed with the Korean Patent Office on May 31, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus for processing a substrate, and more specifically, to a substrate processing apparatus for performing a drying process on a substrate. Background Technology

[0004] Typically, various processes, such as photolithography, etching, ion implantation, and deposition, are performed to manufacture semiconductor devices. Furthermore, these processes generate various foreign matter, such as particles, organic contaminants, and metallic impurities. These foreign matter can lead to defects in the substrate and directly affect the performance and yield of semiconductor devices. Cleaning processes to remove these foreign matter are essential in the manufacturing process of semiconductor devices.

[0005] In a typical cleaning process, the substrate is treated with chemicals and a rinsing solution, and then dried. One example of this drying process is a rotary drying process where the substrate is rotated at high speed to remove any residual rinsing solution. However, because rotary drying uses centrifugal force, this can cause the pattern formed on the substrate to become tilted.

[0006] Therefore, recently, a supercritical drying process has been used, in which an organic solvent (such as isopropanol (IPA)) is supplied onto the substrate to replace the rinsing solution remaining on the substrate with an organic solvent having low surface tension, and then the organic solvent remaining on the substrate is removed by supplying a processing fluid in a supercritical state onto the substrate.

[0007] Figure 1 This is a schematic cross-sectional view of a typical substrate processing apparatus for drying substrates using supercritical fluid. (Reference) Figure 1 The substrate processing apparatus 5000 includes a first body 5100 and a second body 5200, which are combined with each other to provide a processing space in which supercritical drying is performed. The second body 5200 is connected to a pipe 5400 in which supercritical fluid flows.

[0008] The supercritical drying process includes a substrate loading process for loading substrate W into a processing space, a pressurization process for pressurizing the atmosphere in the processing space, a depressurization process for restoring the atmosphere in the processing space to normal pressure, and a substrate unloading process for unloading substrate W from the processing space. In the substrate loading process, the second body 5200 moves upward toward the first body 5100 via an actuator 5300 to load substrate W into the processing space. In the substrate unloading process, the second body 5200 moves downward via an actuator 5300 to unload substrate W from the processing space.

[0009] In the supercritical drying process, the second body 5200 moves vertically. Typically, the pipe 5400 in the supercritical drying process is connected to various devices (e.g., valves, heaters, pressure sensors, and tanks), and the position of the pipe 5400 is fixed. When the second body 5200 moves vertically, the pipe 5400 connected to the second body 5200 is left in a fixed position, which can lead to damage to the pipe 5400 or deformation of the pipe 5400. Summary of the Invention

[0010] The present invention aims to provide a substrate processing apparatus in which, when a supercritical drying process is performed on a substrate, a tube in which a supercritical fluid flows is stretched and contracted according to the vertical movement of the housing.

[0011] The present invention also aims to provide a substrate processing apparatus that, when performing supercritical drying on a substrate, prevents damage to the tube in which supercritical fluid flows.

[0012] The present invention also aims to provide a substrate processing apparatus that, when performing supercritical drying processing on a substrate, can prevent backflow caused by condensation of supercritical fluid inside a tube (which discharges supercritical fluid from the processing space).

[0013] The purpose of this invention is not limited thereto, and other purposes not mentioned will be clearly understood by those skilled in the art from the following description.

[0014] An exemplary embodiment of the present invention provides a substrate processing apparatus, the substrate processing apparatus comprising: a housing including a first body and a second body, the first body and the second body being coupled to each other to provide a processing space for processing a substrate; an actuator that moves the second body in a vertical direction relative to the first body to seal or open the processing space; and a tube coupled to the second body and in which fluid flows, wherein the tube is a stretchable pipe that is stretchable and retractable according to the vertical movement of the second body.

[0015] According to an exemplary embodiment, the retractable tube can be configured as a coil.

[0016] According to an exemplary embodiment, the pipe may include a discharge pipe that discharges fluid from the processing space, and the upper end of the coil may be upstream of the discharge pipe than the lower end of the coil.

[0017] According to an exemplary embodiment, the coil can be configured to be compressed when the second body moves in a downward direction.

[0018] According to an exemplary embodiment, the discharge pipe may further include: a first discharge pipe connected to the downstream side of the coil; and a second discharge pipe connected to the coil and the second body at the upstream side of the coil, wherein the height of the first discharge pipe may be fixed when the second body moves vertically, and the second discharge pipe may be configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

[0019] According to an exemplary embodiment, the pipe may include a supply pipe that supplies fluid to the processing space, and the upper end of the coil may be upstream of the supply pipe than the lower end of the coil.

[0020] According to an exemplary implementation, the coil can be configured to be tensioned when the second body moves in a downward direction.

[0021] According to an exemplary embodiment, the supply pipe may further include: a first supply pipe connected to the upstream side of the coil; and a second supply pipe connected to the coil and the second body at the downstream side of the coil, wherein the height of the first supply pipe may be fixed when the second body moves vertically, and the second supply pipe may be configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

[0022] According to an exemplary embodiment, the cross-sectional area of ​​the passage through which the fluid flows in the coil can be formed to be smaller than the cross-sectional area of ​​the pipe connected to the upper end and the lower end of the coil.

[0023] According to an exemplary embodiment, the tube may be configured as a tube in which a supercritical fluid flows.

[0024] According to an exemplary embodiment, the second body may be located below the first body, and the pipe may include: a first supply pipe connected to the first body to supply fluid to the processing space; a second supply pipe connected to the second body to supply fluid to the processing space; and a discharge pipe that discharges fluid to the processing space, and a coil may be provided to each of the second supply pipe and the discharge pipe.

[0025] Another exemplary embodiment of the present invention provides a substrate processing apparatus comprising: a housing having a first body and a second body disposed thereon, the first body and the second body being coupled together to form a processing space in which organic solvent remaining on the substrate is dried by a supercritical drying fluid; an actuator configured to move the second body vertically relative to the first body to seal or open the processing space; a support unit configured to support the substrate within the processing space; and a discharge pipe coupled to the second body to discharge the supercritical drying fluid from the processing space, wherein the discharge pipe includes a coil that is stretchable and retractable according to the vertical movement of the second body, and when the second body moves upward and seals the processing space, the upper end of the coil is upstream of the discharge pipe than the lower end of the coil.

[0026] According to an exemplary implementation, the coil can be configured to be compressed when the second body moves downward.

[0027] According to an exemplary embodiment, the discharge pipe may further include: a first discharge pipe connected to the downstream side of the coil; and a second discharge pipe connected to the coil and the second body at the upstream side of the coil, wherein the height of the first discharge pipe may be fixed when the second body moves vertically, and the second discharge pipe may be configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

[0028] According to an exemplary embodiment, the second discharge pipe may include a first part, a second part, a third part, and a fourth part arranged sequentially from the upstream side to the downstream side of the discharge pipe. The first part extends from the point coupled to the second body in a downward direction relative to the ground, the second part extends from the first part in a direction parallel to the ground, the third part extends vertically upward from the second part relative to the ground, and the fourth part extends horizontally from the third part relative to the ground. When the second body moves downward, the first part and the third part can move in a downward direction and the coil is compressed.

[0029] According to an exemplary embodiment, the cross-sectional area of ​​the passage through which the supercritical, drying fluid flows in the coil can be formed to be smaller than the cross-sectional area of ​​the pipe connected to the upper end and the lower end of the coil.

[0030] Another exemplary embodiment of the present invention provides a substrate processing apparatus comprising: a housing having a first body and a second body disposed thereon, the first body and the second body being coupled together to form a processing space in which organic solvent remaining on the substrate is dried by a supercritical drying fluid; an actuator configured to move the second body vertically relative to the first body to seal or open the processing space; a support unit configured to support the substrate within the processing space; and a discharge pipe coupled to the second body to discharge the supercritical drying fluid from the processing space, wherein the discharge pipe includes a coil that is stretchable and retractable according to the vertical movement of the second body, and when the second body moves upward and seals the processing space, the upper end of the coil is upstream of the discharge pipe than the lower end of the coil.

[0031] According to an exemplary embodiment, the supply pipe may further include: a first supply pipe connected to the upstream side of the coil; and a second supply pipe connected to the coil and the second body at the downstream side of the coil, wherein the height of the first supply pipe may be fixed when the second body moves vertically, and the second supply pipe may be configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

[0032] According to an exemplary embodiment, the second supply tube may include a fifth portion and a sixth portion arranged sequentially from the coil to the downstream side of the supply tube, and the fifth portion may extend from the point coupled to the second body in a downward direction relative to the ground, and the sixth portion may extend from the fifth portion in a direction parallel to the ground, and when the second body moves downward, the fifth portion may move in a downward direction and the coil is tensioned.

[0033] According to an exemplary embodiment, the cross-sectional area of ​​the passage through which the supercritical, drying fluid flows in the coil can be formed to be smaller than the cross-sectional area of ​​the pipe connected to the upper end and the lower end of the coil.

[0034] According to the present invention, when a supercritical drying process is performed on a substrate, a tube in which a supercritical fluid moves can be stretched or contracted according to the vertical movement of the shell.

[0035] According to the present invention, when supercritical drying is performed on a substrate, damage to the tube in which the supercritical fluid moves can be prevented.

[0036] According to the present invention, when supercritical drying is performed on a substrate, backflow due to condensation of the supercritical fluid inside the tube (which discharges supercritical fluid from the processing space) can be prevented.

[0037] The effects of the present invention are not limited to those described above, and those skilled in the art will clearly understand from the specification and drawings any effects not mentioned. Attached Figure Description

[0038] Figure 1 This is a schematic cross-sectional view of a typical substrate processing apparatus.

[0039] Figure 2 This is a schematic diagram illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0040] Figure 3 It is shown schematically. Figure 2 A diagram of an exemplary embodiment of the liquid processing chamber of a substrate processing apparatus.

[0041] Figure 4 It is a graph showing the phase transition of carbon dioxide.

[0042] Figure 5 It is shown schematically. Figure 2 A diagram of an exemplary embodiment of the drying chamber of a substrate processing apparatus.

[0043] Figure 6 It is schematically shown in Figure 2 The diagram shows the drying chamber when the second body moves downwards.

[0044] Figure 7 It is shown schematically. Figure 5 A diagram of another exemplary embodiment of the drying chamber.

[0045] Figure 8 It is schematically shown in Figure 7 The diagram shows the drying chamber when the second body moves downwards.

[0046] Figure 9 It is shown schematically. Figure 5 A diagram of another exemplary embodiment of the drying chamber.

[0047] Figure 10 It is schematically shown in Figure 9 The diagram shows the drying chamber when the second body moves downwards. Detailed Implementation

[0048] In the following description, exemplary embodiments of the invention will be described in more detail with reference to the accompanying drawings. The exemplary embodiments of the invention may be modified in various ways, and the scope of the invention should not be construed as limited to the exemplary embodiments described below. These exemplary embodiments are provided to explain the invention more fully to those skilled in the art. Therefore, the shapes of the components in the drawings are exaggerated for clearer description.

[0049] In this exemplary embodiment, a process for treating a substrate by supplying a liquid (such as a cleaning solution) onto the substrate is described as an example. However, this exemplary embodiment is not limited to a cleaning process and can be applied to various processes that treat a substrate using a treatment solution, such as etching, ashing, and developing processes.

[0050] In the following text, reference will be made to Figures 2 to 10 A substrate processing apparatus 1 according to an exemplary embodiment of the present invention is described. The substrate processing apparatus 1 according to an exemplary embodiment of the present invention can perform a cleaning process including a supercritical drying process.

[0051] Figure 2 This is a schematic diagram illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention. (Reference) Figure 2 The substrate processing apparatus 1 includes an indexing module 10 and a processing module 20. According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as a first direction 2, the direction perpendicular to the first direction 2 when viewed from above is referred to as a second direction 4, and the direction perpendicular to the plane including both the first direction 2 and the second direction 4 is referred to as a third direction 6.

[0052] Index module 10 transfers substrate W from container F, which holds substrate W, to processing module 020, which processes substrate W. Index module 10 holds substrate W, which has already been fully processed in processing module 20, into container F. The longitudinal direction of index module 10 is second direction 4. Index module 10 includes loading port 120 and index frame 140.

[0053] A container F containing the substrate W is placed in the loading port 120. Based on the index frame 140, the loading port 120 is positioned on the opposite side of the processing module 20. Multiple loading ports 120 can be provided, and these ports can be arranged along the second direction 4. The number of loading ports 120 can be increased or decreased depending on factors such as the process efficiency and floor space requirements of the processing module 20.

[0054] Multiple slots (not shown) can be formed in container F to accommodate multiple substrates W in a horizontally arranged state relative to the ground. Container F can be a front-opening unified pod (FOUP). Container F can be transported by conveying equipment (not shown) such as overhead transfer, overhead conveyor, or automated guided vehicle, or placed on loading port 120 by an operator.

[0055] Index track 142 and indexing robot 144 are disposed inside index frame 140. Index track 142 is disposed inside index frame 140 such that the longitudinal direction is the second direction 4. Indexing robot 144 can transport substrate W. Indexing robot 144 can transport substrate W between index module 10 and buffer unit 220. Indexing robot 144 may include index hand portion 1440. Substrate W can be placed on index hand portion 1440. Index hand portion 1440 may include index base portion 1442 having an annular shape, wherein a portion of the circumference is symmetrically curved; and index support portion 1444 that moves index base portion 1442. The configuration of index hand portion 1440 is the same as or similar to the configuration of the transfer hand to be described below. Index hand portion 1440 may be configured to be movable along the second direction 4 on index track 142. Therefore, index hand portion 1440 may be movable back and forth along index track 142. Furthermore, the index hand 1440 can be configured to be rotatable about a third direction 6 and movable along the third direction 6.

[0056] Processing module 20 includes a buffer unit 220, a transfer chamber 240, a liquid processing chamber 260, and a drying chamber 280. The buffer unit 220 provides space for loading and unloading the substrate W into and from the processing module 20. The transfer chamber 240 provides space between the buffer unit 220 and the process chamber 260, and between the liquid processing chamber 260 and the drying chamber 280, for transferring the substrate W. The liquid processing chamber 260 performs a liquid processing process by supplying liquid to the substrate W. For example, the liquid processing process can be a cleaning process using a cleaning solution to clean the substrate. Both chemical treatment and rinsing treatments can be performed without a substrate in the process chamber. The drying chamber 280 performs a drying process to remove residual liquid from the substrate W.

[0057] A buffer unit 220 may be disposed between the index frame 140 and the transfer chamber 240. The buffer unit 220 may be located at one end of the transfer chamber 240. A slot (not shown) in which the substrate W is placed is disposed inside the buffer unit 220. A plurality of slots (not shown) may be disposed to be spaced apart from each other along a third direction 6. The front and back sides of the buffer unit 220 are open. The front side is the side facing the index module 10, and the back side is the side facing the transfer chamber 240. The indexing robot 144 can access the buffer unit 220 through the front side, and the transfer robot 244 (described below) can access the buffer unit 220 through the back side.

[0058] The transfer chamber 240 can be configured such that the longitudinal direction is a first direction 2. The liquid processing chamber 260 and the drying chamber 280 can be disposed in the side of the transfer chamber 240. The liquid processing chamber 260 and the transfer chamber 240 can be disposed in a second direction 4. The drying chamber 280 and the transfer chamber 240 can be disposed in a second direction 4.

[0059] According to an embodiment, the liquid processing chamber 260 can be disposed on both sides of the transfer chamber 240, and the drying chamber 280 can be disposed on both sides of the transfer chamber 240, with the liquid processing chamber 260 disposed closer to the buffer unit 220 than the drying chamber 280. On one side of the transfer chamber 240, the liquid processing chamber 260 can be arranged in an A×B pattern (where each of A and B is a natural number of 1 or greater than 1) along the first direction 2 and the third direction 6. On one side of the transfer chamber 240, the drying chambers 280 can be arranged in a C×D pattern (where each of C and D is a natural number of 1 or greater than 1) along the first direction 2 and the third direction 6. Contrary to the description, the liquid processing chamber 260 can be disposed on only one side of the transfer chamber 240, and the drying chamber 280 can be disposed on only the other side.

[0060] The transfer chamber 240 includes a guide rail 242 and a transfer robot 244. The guide rail 242 is disposed inside the transfer chamber 240 such that its longitudinal direction is a first direction 2. The transfer robot 244 can be configured to move linearly along the guide rail 242 in a second direction 2. The transfer robot 244 transfers the substrate W between the buffer unit 220, the liquid handling chamber 260, and the drying chamber 280.

[0061] The transfer robot 2440 includes a base 2442, a body 2444, and an arm 2446. The base 2442 is mounted and movable along a second direction 2 on a guide rail 242. The body 2444 is coupled to the base 2442. The body 2444 is configured to be movable along a third direction 6 on the base 2442. Furthermore, the body 2444 is configured to be rotatable on the base 2442. The arm 2446 is coupled to the body 2444 and is configured to be movable forward and backward relative to the body 2444. Multiple arms 2446 are configured to be individually driven. The arms 2446 are configured to be stacked in a state of being spaced apart from each other in the third direction 6.

[0062] Liquid processing chamber 260 performs liquid processing processes on substrate W. For example, liquid processing chamber 260 may be a chamber that performs a cleaning process by supplying a cleaning solution to substrate W. In contrast, liquid processing chamber 260 may be a chamber that performs a wet etching process by supplying liquid plasma to remove thin films from the substrate. Liquid processing chamber 260 may have different structures depending on the type of process used to process substrate W. In contrast, each of liquid processing chambers 260 may have the same structure. Optionally, liquid processing chambers 260 may be divided into multiple groups, and liquid processing chambers 260 belonging to any one of these groups may be liquid processing chambers 260 that perform either a cleaning process or a wet etching process, and liquid processing chambers 260 belonging to another group may be liquid processing chambers 260 that perform the other one of a cleaning process or a wet etching process.

[0063] In the following, in an exemplary embodiment of the invention, as an example, a liquid processing process for liquid processing of substrate W will be described by supplying liquid to substrate W in liquid processing chamber 260.

[0064] Figure 3 It is shown schematically. Figure 2 A diagram illustrating an exemplary embodiment of the liquid processing chamber of a substrate processing apparatus. (Refer to...) Figure 3 The liquid processing chamber 260 includes a housing 2610, a processing dish 2620, a support unit 2630, a lifting unit, a liquid supply unit 2640, a discharge unit 2650, and an airflow supply unit 2660.

[0065] The housing 2610 has an internal space. The housing 2610 is configured in a generally rectangular parallelepiped shape. The processor 2620, the support unit 2630, and the liquid supply unit 2640 are disposed within the housing 2610.

[0066] The processor dish 2620 has a processing space with an open upper portion. Liquid-treated substrate W is performed within the processing space. A support unit 2630 supports substrate W within the processing space and rotates substrate W. A liquid supply unit 2640 supplies liquid to substrate W supported by support unit 2630. Liquid can be provided in various types and can be supplied to substrate W sequentially.

[0067] According to an embodiment, the processor dish 2620 has a guide wall 2621 and a plurality of collection containers 2623, 2625, and 2627. Each of the collection containers 2623, 2625, and 2627 separates and collects different liquids from the liquid used for substrate processing. Each of the collection containers 2623, 2625, and 2627 has a collection space for recovering the liquid used for substrate processing. The guide wall 2621 and each of the collection containers 2623, 2625, and 2627 are arranged in an annular shape around the support unit 2630. During the liquid processing process, liquid that is scattered due to the rotation of the substrate W flows into the collection space from the inlets 2623a, 2625a, and 2627a (described later) of the collection containers 2623, 2625, and 2627. Different types of processing liquids can be introduced into the collection containers separately.

[0068] According to an embodiment, the processor dish 2620 has a guide wall 2621, a first collection container 2623, a second collection container 2625, and a third collection container 2627. The guide wall 2621 is arranged in an annular shape around the support unit 2630, and the first collection container 2623 is arranged in an annular shape around the guide wall 2621. The second collection container 2625 is arranged in an annular shape around the first collection container 2623, and the third collection container 2627 is arranged in an annular shape around the second collection container 2625. The space between the first collection container 2623 and the guide wall 2621 serves as a first inlet 2623a through which liquid is introduced. The space between the first collection container 2623 and the second collection container 2625 serves as a second inlet 2625a through which liquid is introduced. The space between the second collection container 2625 and the third collection container 2627 serves as a third inlet 2627a through which liquid is introduced. The second entrance 2625a may be located above the first entrance 2623a, and the third entrance 2627a may be located above the second entrance 2625a.

[0069] The space between the lower end of the guide wall 2621 and the first collection container 2623 serves as a first outlet 2623b, through which fumes and airflow generated from the liquid are discharged. The space between the lower end of the first collection container 2623 and the second collection container 2625 serves as a second outlet 2625b, through which fumes and airflow generated from the liquid are discharged. The space between the lower end of the second collection container 2625 and the third collection container box 2627 serves as a third outlet 2627b, through which fumes and airflow generated from the liquid are discharged. The fumes and airflow discharged from the first outlet 2623b, the second outlet 2625b, and the third outlet 2627b are discharged through the discharge unit 2650, which is described later.

[0070] Collection lines 2623c, 2625c, and 2627c, extending vertically downwards from the bottom surfaces of collection containers 2623, 2625, and 2627, are connected to collection containers 2623, 2625, and 2627, respectively. Collection lines 2623c, 2625c, and 2627c discharge the treated liquid introduced through collection containers 2623, 2625, and 2627, respectively. The discharged treated liquid can be reused using an external treated liquid regeneration system (not shown).

[0071] The support unit 2630 includes a spin chuck 2631, a support pin 2633, a chuck pin 2635, a rotating shaft 2637, and a drive unit 2639. Viewed from above, the spin chuck 2631 has an upper surface configured in a generally circular shape. The upper surface of the spin chuck 2631 can be configured to have a diameter larger than that of the substrate W.

[0072] Multiple support pins 2633 are provided. The support pins 2633 are spaced apart from each other on the edge of the upper surface of the rotary chuck 2631 and protrude upward from the rotary chuck 2631. The support pins 2633 are arranged to have an annular shape when combined with each other as a whole. The support pins 2633 can support the edge of the back side of the substrate W, such that the substrate W is spaced apart from the upper surface of the rotary chuck 2631 by a predetermined distance.

[0073] Multiple chuck pins 2635 are provided. The chuck pins 2635 are positioned further away from the center of the rotary chuck 2631 than the support pins 2633. The chuck pins 2635 are configured to protrude from the upper surface of the rotary chuck 2631. The chuck pins 2635 support the sides of the substrate W such that the substrate W does not laterally separate from its original position when the substrate W rotates. The chuck pins 2635 are configured to be linearly movable along the radial direction of the rotary chuck 2631 between a standby position and a supported position. The standby position is a position further away from the center of the rotary chuck 2631 than the supported position. When the substrate W is loaded onto or unloaded from the support unit 2630, the chuck pins 2635 are positioned in the standby position, and when a process is performed on the substrate W, the chuck pins 2635 are positioned in the supported position. In this supported position, the chuck pins 2635 are in contact with the sides of the substrate W.

[0074] Rotating shaft 2638 is coupled to rotating chuck 2631. Rotating shaft 2637 can be coupled to the lower surface of rotating chuck 2631. Rotating shaft 2637 can be configured such that the longitudinal direction faces the vertical direction. Rotating shaft 2637 is configured to be rotatable by receiving power from drive unit 2639. Rotation of rotating shaft 2637 via drive unit 2639 causes rotating chuck 2631 to rotate. Drive unit 2639 can change the rotational speed of rotating shaft 2637. Drive unit 2639 can be a motor providing driving force. However, the invention is not limited thereto, and drive unit 2639 can be modified in various ways to provide driving force from known devices.

[0075] Liquid supply unit 2640 supplies liquid to substrate W supported by support unit 2630. Multiple liquid supply units 2640 are provided, and each liquid supply unit 2640 supplies a different type of liquid. According to an embodiment, liquid supply unit 2640 includes a first liquid supply member 2642 and a second liquid supply member.

[0076] The first liquid supply component 2642 includes a support shaft 2642a, a support arm 2642b, an arm actuator 2642c, and a nozzle 2642d. The support shaft 2642a is located on one side of the processor dish 2620. The support shaft 2642a has a rod-like shape, with its longitudinal direction facing a third direction 6. The support shaft 2642a is rotatable via the arm actuator 2642c. The support arm 2642b is coupled to the upper end of the support shaft 2642a. The support arm 2642b extends perpendicular to the support shaft 2642a. The nozzle 2642d is fixedly coupled to the distal end of the support arm 2642b. When the support shaft 2642a rotates, the nozzle 2642d is oscillating with the support arm 2642b. The nozzle 2642d can oscillate to a process position and a standby position. In this article, the process position is the position where the nozzle 2642d faces the substrate W supported by the support unit 2630, and the standby position is the position where the nozzle 2642d leaves the process position.

[0077] Optionally, the support arm 2642b can be configured to move back and forth in its longitudinal direction. When viewed from above, the nozzle 2642d can swing and move to coincide with the central axis of the substrate W.

[0078] The second liquid supply member supplies the second liquid to the substrate W supported by the support unit 2630. The second liquid supply member is configured to have the same shape as the first liquid supply member 2642. Therefore, a detailed description of the second liquid supply member will be omitted.

[0079] The first and second treatment liquids can be any of chemicals, rinsing liquids, and organic solvents. For example, chemicals may include dilute sulfuric acid (H2SO4), phosphoric acid (P2O5), hydrofluoric acid (HF), and ammonium hydroxide (NH4OH). For example, rinsing solutions may include water or deionized water (DIW). For example, organic solvents may include alcohols, such as isopropyl alcohol (IPA).

[0080] The discharge unit 2650 discharges fumes and gases generated in the processing space. The discharge unit 2650 discharges fumes and gases generated during liquid treatment of the substrate W. The discharge unit 2650 can be coupled to the bottom surface of the processing dish 2620. In an exemplary embodiment, the discharge unit 2650 can be disposed in the space between the rotation axis 2637 of the support unit 2630 and the inner sidewall of the processing dish 2620. The discharge unit 2650 is provided with a pressure reduction unit (not shown). The pressure reduction unit discharges fumes and gases generated during liquid treatment of the substrate W from the processing space to the outside of the processing space.

[0081] Airflow supply unit 2660 supplies airflow to the interior space of housing 2610. Airflow supply unit 2660 can supply downward airflow to the interior space. Airflow supply unit 2660 can be installed inside housing 2610. Airflow supply unit 2660 can be installed above processing dish 2620 and support unit 2630. The gas supplied to the interior space of housing 2610 via airflow supply unit 2660 forms a downward airflow within the interior space. Gaseous byproducts generated by the processing in the processing space are discharged to the outside of housing 2610 via the downward airflow and discharge unit 2650. Airflow supply unit 2660 can be configured as a fan filter unit.

[0082] The substrate processing apparatus 1 can perform a supercritical process for processing the substrate W by using a supercritical fluid as the process fluid. The supercritical process is performed utilizing the properties of the supercritical fluid. Representative embodiments of supercritical processes include supercritical drying and supercritical etching. In the following description, the supercritical process will be based on the supercritical drying process. However, since this is only for illustrative purposes, the substrate processing apparatus 1 can perform supercritical processes other than the supercritical drying process.

[0083] Supercritical drying is performed to dry the substrate W by dissolving the organic solvent remaining in the circuit pattern on the substrate W using a supercritical fluid. Supercritical drying offers excellent drying efficiency and prevents pattern collapse. As the supercritical fluid used in the supercritical drying process, a substance miscible with organic solvents can be used. For example, supercritical carbon dioxide (scCO2) can be used as the supercritical fluid.

[0084] Figure 4 This is a graph showing the phase transition of carbon dioxide. Carbon dioxide has a critical temperature of 31.1 °C and a relatively low critical pressure of 7.38 MPa, making it easy to reach a supercritical state. The phase transition of carbon dioxide can be easily controlled by adjusting temperature and pressure, and carbon dioxide is inexpensive. Furthermore, carbon dioxide is non-toxic and harmless to humans, and is non-flammable and inert. Compared to water or other organic solvents, supercritical carbon dioxide has a diffusion coefficient approximately 10 to 100 times higher, resulting in rapid permeation and rapid replacement of organic solvents. In addition, because supercritical carbon dioxide has almost no surface tension, it has advantageous properties for drying substrates, including those with fine circuit patterns. Moreover, the byproducts of various chemical reactions of supercritical carbon dioxide can be recycled, and supercritical carbon dioxide can be converted into gas after supercritical drying processes, while organic solvents can be separated and reused, thus reducing the environmental burden.

[0085] Figure 5 It is shown schematically. Figure 2 A diagram of an exemplary embodiment of the drying chamber. (Refer to...) Figure 5 According to an exemplary embodiment of the present invention, the drying chamber 280 can remove the processing liquid remaining on the substrate W by using a drying fluid in a supercritical state. For example, the drying chamber 280 can perform a drying process to remove organic solvents remaining on the substrate W by using carbon dioxide (CO2) in a supercritical state.

[0086] The drying chamber 280 may include a housing 2810, a heating element 2820, a support element 2830, a fluid supply unit 2840, a fluid discharge unit 2850, and an actuator 2860.

[0087] The housing 2810 provides a processing space for processing the substrate W therein. The housing 2810 is made of a material capable of withstanding high pressure greater than or equal to a critical pressure. The housing 2810 may include a first body 2812 and a second body 2814, which are coupled to each other to provide the processing space therein. The first body 2812 may be positioned above the second body 2814. Either the first body 2812 or the second body 2814 may be coupled to an actuator 2860 for vertical mobility. For example, the second body 2814 may be coupled to and moved vertically by the actuator 2860. Therefore, the internal processing space of the housing 281 can be selectively sealed. In the above embodiment, the case where the second body 2814 is coupled to the actuator 2860 and moves vertically is described as an example, but the invention is not limited thereto. For example, the first body 2812 may be coupled to the actuator 2860 for vertical mobility. In the following text, for ease of description, as an example, the second body 2814 will be described as being coupled to the actuator 2860 and moving in the vertical direction.

[0088] The heating element 2820 can heat the processing fluid supplied to the processing space. The heating element 2820 can increase the temperature within the processing space. As the heating element 2820 increases the temperature of the processing space, the processing fluid supplied to the processing space can transition to a supercritical state or can be maintained in a supercritical state.

[0089] Furthermore, the heating element 2820 can be embedded in the housing 2810. For example, the heating element 2820 can be embedded in either the first body 2812 or the second body 2814. For example, the heating element 2820 can be disposed in the second body 2814. The invention is not limited thereto, and the heating element 2820 can be disposed at various locations capable of increasing the temperature of the processing space. The heating element 2820 can be a heater. However, the invention is not limited thereto, and the heating element 2820 can be modified in various ways to be a known device capable of increasing the temperature of the processing space.

[0090] The support member 2830 can support the substrate W in the processing space. The support member 2830 can be configured to support the edge region of the substrate W in the processing space. For example, the support member 2830 can be configured to support the lower surface of the edge region of the substrate W in the processing space.

[0091] The fluid supply unit 2840 can supply processing fluid to the processing space. The processing fluid supplied by the fluid supply unit 2840 may include carbon dioxide. The processing fluid supplied by the fluid supply unit 2840 may be supplied to the processing space in a supercritical state, or may be converted to a supercritical state in the processing space. The fluid supply unit 2840 may include a supply pipe 2841, a heater 2845, a filter 2846, a pressure sensor 2847, a valve 2848, and a fluid supply source 2849.

[0092] Supply pipe 2841 supplies processing fluid to the processing space. Supply pipe 2841 can be connected to housing 2810. Supply pipe 2841 may include main supply pipe 2842, upper supply pipe 2843, and lower supply pipe 2844. Main supply pipe 2842 can be connected to fluid supply source 2849, which will be described later. Upper supply pipe 2843 can branch from main supply pipe 2842 and can be connected to first body 2812. Therefore, upper supply pipe 2843 can supply processing fluid to the upper region of the processing space. Lower supply pipe 2844 can branch from main supply pipe 2842 and can be connected to second body 2814. Therefore, lower supply pipe 2844 can supply processing fluid to the lower region of the processing space.

[0093] In the above embodiments, the case where the main supply pipe 2842 is connected to the fluid supply source 2849 is described as an example, but it is not limited thereto. For example, if multiple fluid supply sources 2849 are provided, the upper supply pipe 2843 can be connected to any one of the multiple fluid supply sources 2849, and the lower supply pipe 2844 can be connected to another of the multiple fluid supply sources 2849.

[0094] Heater 2845 can be installed in supply pipe 2841. Heater 2845 can be installed upstream of supply pipe 2841. Heater 2845 can be installed in main supply pipe 2842. Heater 2845 heats supply pipe 2841 to control the temperature of the process fluid flowing (or remaining) in supply pipe 2841. Optionally, heater 2845 can be installed in each of upper supply pipe 2842 and lower supply pipe 2843.

[0095] Filter 2846 can filter the process fluid supplied from fluid supply source 2849 (described below) to the processing space. For example, filter 2846 can filter out impurities that may be contained in the process fluid supplied to the processing space. Filter 2846 can be installed in supply pipe 2841. Filter 2846 can be installed upstream of supply pipe 2841. Filter 2846 can be installed in main supply pipe 2842. Alternatively, filter 2846 can be installed in each of upper supply pipe 2842 and lower supply pipe 2843.

[0096] Pressure sensor 2847 can measure the pressure in the processing space and / or supply pipe 2841. Pressure sensor 2847 can be installed in supply pipe 2841. Pressure sensor 2847 can be installed upstream of supply pipe 2841. Pressure sensor 2847 can be installed in main supply pipe 2842. Optionally, pressure sensor 2847 can be installed in each of upper supply pipe 2842 and lower supply pipe 2843.

[0097] Valve 2848 can be installed in supply pipe 2841. Valve 2848 can be installed upstream of supply pipe 2841. Valve 2848 can be installed in main supply pipe 2842. Optionally, valve 2848 can be installed in each of upper supply pipe 2842 and lower supply pipe 2843. Valve 2848 can be a flow control valve. Optionally, valve 2848 can be an on / off valve. Whether to supply process fluid to the processing space can be determined based on the opening and closing of valve 2848.

[0098] Fluid supply source 2849 can store and / or supply process fluid. Fluid supply source 2849 can be a storage device. Fluid supply source 2849 can deliver process fluid to supply line 2841.

[0099] The fluid discharge unit 2850 can discharge processed fluid from the processing space of the housing 2810. The fluid discharge unit 2850 may include a discharge pipe 2851, a pressure reducing valve 2855, a pressure regulating member 2856, and a collection tank 2857.

[0100] Discharge pipe 2851 can discharge processed fluid from the processing space. Discharge pipe 2851 can discharge processed fluid supplied to the processing space to the outside of housing 2810. Discharge pipe 2851 can be connected to housing 2810. Discharge pipe 2851 can be connected to second body 2814. Discharge pipe 2851 may include telescopic pipe 2852, first discharge pipe 2853 and second discharge pipe 2854.

[0101] In the following text, upstream and downstream are defined based on the direction of flow of the processing fluid within the discharge pipe 2851. Specifically, since the processing fluid flows from the housing 2810 within the discharge pipe 2851, the point relatively close to the point connected to the second body 2814 within the discharge pipe 2851 is defined as upstream, while the point in the direction of the processing fluid flow, away from the second body 2814 within the discharge pipe 2851, is defined as downstream.

[0102] The telescopic tube 2852 can be stretched and contracted according to the vertical movement of the housing 2810. The telescopic tube 2852 can also be stretched and contracted according to the vertical movement of the second body 2814. The telescopic tube 2852 can be configured as a coil (spiral pipe). Optionally, the telescopic tube 2852 can be configured as a flexible tube. The upper end of the telescopic tube 2852 can be located upstream of the discharge pipe 2851 compared to its lower end. That is, the telescopic tube 2852 can be located at a point where the relative height with respect to the ground increases from the downstream side to the upstream side. In the following description, as an embodiment, the case where the telescopic tube 2852 is configured as a coil will be described.

[0103] In coil 2852, the cross-sectional area of ​​the flow passage through which the processed fluid flows can be set smaller than the cross-sectional area of ​​the flow passages of the first discharge pipe 2853 and the second discharge pipe 2854 through which the processed fluid flows. This is because when the cross-sectional area of ​​the passage in coil 2852 is formed to be large, the magnitude of the compressive force and / or tension required for expansion and contraction increases. Therefore, by providing a small cross-sectional area of ​​the flow passage through which the processed fluid flows in coil 2852, coil 2852 can be easily tensioned and / or compressed according to the vertical movement of the second body 2814. The first discharge pipe 2853 can be connected to the downstream side of coil 2852. One end of the first discharge pipe 2853 can be connected to the lower end of coil 2852 and extends downstream of discharge pipe 2851. The pressure reducing valve 2855, pressure regulating member 2856, and collection tank 2857, which will be described later, can be installed in the first discharge pipe 2853.

[0104] The second discharge pipe 2854 can connect the coil 2852 and the second body 2814 to each other. The second discharge pipe 2854 can be connected to the upstream side of the coil 2852. One end of the second discharge pipe 2854 can be connected to the upper end of the coil 2852 and extends upstream of the discharge pipe 2851 connected to the second body 2814.

[0105] The second discharge pipe 2854 can be configured as a first part 2854a, a second part 2854b, a third part 2854c, and a fourth part 2854d. The first part 2854a, the second part 2854b, the third part 2854c, and the fourth part 2854d can be sequentially arranged from upstream to downstream of the discharge pipe 2851. One end of the first part 2854a can be connected to the second body 2814. The longitudinal direction of the first part 2854a can extend downwards from one end to the other relative to the ground. One end of the second part 2854b can be connected to the other end of the first part 2854a. The longitudinal direction of the second part 2854b can extend from one end to the other parallel to the ground. One end of the third part 2854c can be connected to the other end of the second part 2854b. The longitudinal direction of the third part 2854c can extend vertically from one end to the other in an upward direction relative to the ground. One end of the fourth part 2854d can be connected to the other end of the third part 2854c. The longitudinal direction of the fourth section 2854d can extend horizontally from one end to the other relative to the ground. The other end of the fourth section 2854d can be connected to the upper end of the coil 2852. The second discharge pipe 2854 is not limited to this and can be provided in various shapes.

[0106] Pressure reducing valve 2855 allows selective discharge of the processed fluid from the processing space. Pressure reducing valve 2855 can selectively allow the processed fluid to flow to discharge pipe 2851. Pressure reducing valve 2855 can be an on / off valve. Pressure reducing valve 2855 can be installed in the first discharge pipe 2853.

[0107] The pressure regulating member 2856 can maintain the pressure in the processing space at a constant set pressure. For example, the pressure regulating member 2856 can measure the pressure of the processing fluid flowing in the discharge pipe 2851. Furthermore, the pressure regulating member 2856 can measure the pressure of the processing space based on the pressure of the processing fluid flowing in the discharge pipe 2851. Moreover, the pressure regulating member 2856 can adjust the discharge flow rate of the processing fluid discharged through the discharge pipe 2851 per unit time to maintain the pressure of the processing space at the set pressure. For example, the pressure regulating member 2856 can be a back pressure regulator (BPR). The pressure regulating member 2856 can be installed in the first discharge pipe 2853.

[0108] Collection tank 2857 provides space for storing processed fluids discharged from the processing space. The processed fluids used in the supercritical drying process, stored in collection tank 2857, can be converted into gas to separate organic solvents and reused. Collection tank 2857 can be installed in the first discharge pipe 2853. As an example, collection tank 2857 can be installed downstream of the first discharge pipe 2853, before pressure reducing valve 2855 and pressure regulating member 2856.

[0109] Figure 6 It is shown schematically. Figure 2 A diagram of the drying chamber when the second body moves downwards. Referring below... Figure 6 A detailed description of the discharge pipe according to an exemplary embodiment is provided.

[0110] The drying chamber 280 can remove residual processing liquid from the substrate W by using a supercritical drying fluid. For example, the drying chamber 280 can perform a drying process to remove residual organic solvents from the substrate W by using supercritical carbon dioxide (CO2). The supercritical drying process includes a substrate loading process S100 of loading the substrate W into the processing space, a pressurization process S200 of pressurizing the atmosphere in the processing space, a depressurization process S300 of restoring the atmosphere in the processing space to normal pressure, and a substrate unloading process S400 of unloading the substrate W from the processing space.

[0111] In the substrate loading process S100, the second body 2814 moves up and down toward the first body 2814 via the actuator 2860 to load the substrate W into the processing space. In the substrate unloading process S400, the second body 2814 moves downward in a direction away from the first body 2812 via the actuator 2860 to unload the substrate W from the processing space.

[0112] refer to Figure 6After the drying process is completed by the processing fluid in the processing space, the second body 2814 is moved downward by the actuator 2860. As an example, it is assumed that based on the sealed state of the first body 2812 and the second body 2814, the second body 2814 moves a distance H in the downward direction. The pressure reducing valve 2855, pressure regulating member 2856, collection tank 2857, etc. are installed in the first discharge pipe 2853 downstream of the connecting coil 2852, so that when the second body 2814 moves up and down, the first discharge pipe 2853 is set to a fixed height. Since the first discharge pipe 2853 serves as a fixed part, the coil 2852 can be stretched and contracted when the second body 2814 moves downward. The coil 2852 can be compressed when the second body 2814 moves downward. As the coil 2852 expands and contracts by displacement (i.e., distance) H, the second discharge pipe 2854 moves downward together with the second body 2814 by the distance H of movement of the second body 2814. When the second body 2814 moves downward, the first part 2854a and the third part 2854c can move downward a distance H.

[0113] When supercritical drying is performed on the substrate, the discharge pipe 2851 through which the supercritical fluid flows can also move according to the movement of the second body 2814. Therefore, when the second body 2814 moves, the technical disadvantages of pipe damage or plastic deformation caused by the pipe's inability to move are minimized. When supercritical drying is performed on the substrate, pipe impact applied to the discharge pipe 2851 through which the supercritical fluid flows is minimized. Damage to various equipment installed in the discharge pipe 2851 is minimized. Leakage of supercritical fluid from the pipe due to pipe damage and contamination of facilities are prevented.

[0114] In coil 2852, the cross-sectional area of ​​the flow passage through which the processed fluid flows can be set smaller than the cross-sectional area of ​​the flow passages of the first discharge pipe 2853 and the second discharge pipe 2854 through which the processed fluid flows. This is because when the cross-sectional area of ​​the passage in coil 2852 is formed to be large, the magnitude of the compressive force and / or tension required for expansion and contraction increases. Therefore, by providing a small cross-sectional area of ​​the flow passage through which the processed fluid flows in coil 2852, coil 2852 can be easily tensioned and / or compressed according to the vertical movement of the second body 2814. Typically, when the fluid flow cross-sectional area of ​​the pipe becomes smaller, liquefaction due to condensation of the fluid flowing in the pipe may occur due to the decrease in temperature. Therefore, in this exemplary embodiment, the upper end of coil 2852 is positioned upstream of discharge pipe 2851 than the lower end of coil 2852 to prevent backflow caused by condensation of the processed fluid flowing in discharge pipe 2851. Therefore, backflow contamination entering the processing space due to the backflow of the processing fluid in the discharge pipe 2851 can be prevented.

[0115] In the above exemplary embodiment, although it has been described that when the second body 2814 moves downward a distance H, the coil 2852 expands and contracts by displacement H, and the first portion 2854a and the third portion 2854c move downward a distance H, this has been described as an example to illustrate this exemplary embodiment. Depending on the distance H that the second body 2814 moves, the coil 2852, the first portion 2854a, and the third portion 2854c can move downwards close to the value of displacement H.

[0116] In the exemplary embodiments described above, as an example, the case where the retractable tube 2852 is disposed between the first discharge tube 2853 and the second discharge tube 2854 has been described. However, the invention is not limited thereto, and the second portion 2854b may be provided with a tube that can be stretched and contracted according to the vertical movement of the second body 2814. For example, the second portion 2854b may be provided as a flexible tube. Therefore, the tube impact applied to the second portion 2854b, which is easily damaged by the vertical movement of the second body 2814, can be mitigated.

[0117] Figure 7 It is shown schematically. Figure 5 A diagram of another exemplary embodiment of the drying chamber. The drying chamber 280 may include a housing 2810, a heating element 2820, a support element 2830, a fluid supply unit 2840, a fluid discharge unit 2850, and an actuator 2860. In this exemplary embodiment, similarly arranged components include... Figure 5 The drying chamber 280 contains a housing 2810, a heating element 2820, a support element 2830, and an actuator 2860. Therefore, the description of the housing 2810, heating element 2820, support element 2830, and actuator 2860 of the drying chamber 280 will be omitted below.

[0118] refer to Figure 7 The fluid supply unit 2840 can supply processing fluid to the processing space. The processing fluid supplied by the fluid supply unit 2840 may include carbon dioxide. The processing fluid supplied by the fluid supply unit 2840 may be supplied to the processing space in a supercritical state, or may be converted to a supercritical state in the processing space. The fluid supply unit 2840 may include a supply pipe 2841, a heater 2845, a filter 2846, a pressure sensor 2847, a valve 2848, and a fluid supply source 2849.

[0119] Supply pipe 2841 supplies processing fluid to the processing space. Supply pipe 2841 can be connected to housing 2810. Supply pipe 2841 may include main supply pipe 2842, upper supply pipe 2843, and lower supply pipe 2844. Main supply pipe 2842 can be connected to fluid supply source 2849, which will be described later. Upper supply pipe 2843 can branch from main supply pipe 2842 and can be connected to first body 2812. Therefore, upper supply pipe 2843 can supply processing fluid to the upper region of the processing space. Lower supply pipe 2844 can branch from main supply pipe 2842 and can be connected to second body 2814. Therefore, lower supply pipe 2844 can supply processing fluid to the lower region of the processing space.

[0120] In the above embodiments, the case where the main supply pipe 2842 is connected to the fluid supply source 2849 has been described as an example, but it is not limited thereto. For example, if multiple fluid supply sources 2849 are provided, the upper supply pipe 2843 can be connected to any one of the multiple fluid supply sources 2849, and the lower supply pipe 2844 can be connected to another of the multiple fluid supply sources 2849.

[0121] The lower supply pipe 2844 may include a telescopic pipe 2844a, a first supply pipe 2844b, and a second supply pipe 2844c. In the following text, upstream and downstream are defined based on the direction of flow of the processing fluid within the lower supply pipe 2844. Specifically, in the lower supply pipe 2844, the processing fluid flows from the fluid supply source 2849 to the housing 2810; therefore, a point relatively close to the point in the lower supply pipe 2844 connected to the fluid supply source 2849 is defined as upstream, and a point relatively close to the point in the lower supply pipe 2844 connected to the second body 2814 is defined as downstream.

[0122] The telescopic tube 2844a can be stretched and contracted according to the vertical movement of the housing 2810. The telescopic tube 2844a can also be stretched and contracted according to the vertical movement of the second body 2814. The telescopic tube 2844a can be configured as a coil. Optionally, the telescopic tube 2844a can be configured as a flexible tube. The upper end of the telescopic tube 2844a can be located upstream of the lower supply tube 2844 compared to its lower end. That is, the telescopic tube 2844a (e.g., an expansion and contraction tube) can be located at a point where its height relative to the ground decreases from the upstream side to the downstream side. In the following description, as an embodiment, the case where the telescopic tube 2844a is configured as a coil will be described.

[0123] The cross-sectional area of ​​the flow passage through the coil 2844a through which the processing fluid flows can be set to be smaller than the cross-sectional area of ​​the flow passage through the first supply pipe 2844b and the second supply pipe 2844c through which the processing fluid flows. This is because when the cross-sectional area of ​​the passage in the coil 2844a is formed to be large, the magnitude of the compressive force and / or tension required for expansion and contraction increases. Therefore, by setting a small cross-sectional area of ​​the flow passage through which the processing fluid flows in the coil 2844a, the coil 2844a can be easily tensioned and / or compressed according to the vertical movement of the second body 2814.

[0124] The first supply pipe 2844b can be connected to the upstream side of the coil 2844a. One end of the first supply pipe 2844b can be connected to the upper end of the coil 2844a, and the other end of the first supply pipe 2844b can be connected to the upper supply pipe 2843. Optionally, one end of the first supply pipe 2844b can be connected to the upper end of the coil 2844a, and the other end of the first supply pipe 2844b can be connected to the main supply pipe 2842.

[0125] The second supply pipe 2844c can connect the coil 2844a and the second body 2814 to each other. The second supply pipe 2844c can be connected to the downstream side of the coil 2844a. One end of the second supply pipe 2844c can be connected to the lower end of the coil 2844a and extends downstream of the lower supply pipe 2844 connected to the second body 2814.

[0126] The second supply pipe 2844c can be configured as a fifth part 2844d and a sixth part 2844e. The fifth part 2844d and the sixth part 2844e can be sequentially arranged from downstream to upstream of the lower supply pipe 2844. One end of the fifth part 2844d can be connected to the second body 2814. The longitudinal direction of the fifth part 2844d can extend downwards from one end to the other relative to the ground. One end of the sixth part 2844e can be connected to the other end of the fifth part 2844d. The longitudinal direction of the sixth part 2844e can extend downwards from one end to the other relative to the ground. The shape of the second supply pipe 2844c is not limited to this and can be provided by modification to various shapes.

[0127] Heater 2845 can be installed in supply pipe 2841. Heater 2845 can be installed upstream of supply pipe 2841. Heater 2845 can be installed in main supply pipe 2842. Heater 2845 can heat supply pipe 2841 to control the temperature of the process fluid flowing (or remaining) in supply pipe 2841.

[0128] Filter 2846 can filter the process fluid supplied from fluid supply source 2849 (described below) to the processing space. For example, filter 2846 can filter out impurities that may be contained in the process fluid supplied to the processing space. Filter 2846 can be installed in supply pipe 2841. Filter 2846 can be installed upstream of supply pipe 2841. For example, filter 2846 can be installed in main supply pipe 2842.

[0129] Pressure sensor 2847 can measure the pressure in the processing space and / or supply line 2841. Pressure sensor 2847 can be installed in supply line 2841. Pressure sensor 2847 can be installed upstream of supply line 2841. For example, pressure sensor 2847 can be installed in main supply line 2842.

[0130] Valve 2848 can be installed in supply line 2841. Valve 2848 can be installed upstream of supply line 2841. Valve 2848 can be installed in main supply line 2842. Valve 2848 can be a flow control valve. Optionally, valve 2848 can be an on / off valve. Whether to supply process fluid to the processing space can be determined based on the opening and closing of valve 2848.

[0131] Fluid supply source 2849 can store and / or supply process fluid. Fluid supply source 2849 can be a storage device. Fluid supply source 2849 can deliver process fluid to supply line 2841.

[0132] The fluid discharge unit 2850 can discharge processed fluid from the processing space of the housing 2810. The fluid discharge unit 2850 may include a discharge pipe 2851, a pressure reducing valve 2855, a pressure regulating member 2856, and a collection tank 2857.

[0133] Discharge pipe 2851 can discharge the processed fluid from the processing space. Discharge pipe 2851 can discharge the processed fluid supplied to the processing space to the outside of housing 2810. Discharge pipe 2851 can be connected to housing 2810. Discharge pipe 2851 can be connected to second body 2814.

[0134] Pressure reducing valve 2855 allows the processed fluid to be selectively discharged from the processing space. Pressure reducing valve 2855 can selectively allow the processed fluid to flow to discharge pipe 2851. Pressure reducing valve 2855 can be an on / off valve.

[0135] The pressure regulating member 2856 can maintain the pressure in the processing space at a constant set pressure. For example, the pressure regulating member 2856 can measure the pressure of the processing fluid flowing in the discharge pipe 2851. Furthermore, the pressure regulating member 2856 can measure the pressure of the processing space based on the pressure of the processing fluid flowing in the discharge pipe 2851. Additionally, the pressure regulating member 2856 can adjust the discharge flow rate of the processing fluid discharged through the discharge pipe 2851 per unit time to maintain the pressure of the processing space at the set pressure. For example, the pressure regulating member 2856 can be a back pressure regulator (BPR).

[0136] Collection tank 2857 provides space for storing processed fluids discharged from the processing space. The processed fluids used in the supercritical drying process, stored in collection tank 2857, can be converted into gas to separate organic solvents and reused. For example, collection tank 2857 can be installed downstream of discharge pipe 2851, beyond pressure reducing valve 2855 and pressure regulating member 2856.

[0137] Figure 8 It is shown schematically. Figure 7 A diagram of the drying chamber when the second body moves downwards. Referring below... Figure 8 A supply pipe according to an exemplary embodiment is described in detail.

[0138] The drying chamber 280 can remove residual processing liquid from the substrate W by using a supercritical drying fluid. For example, the drying chamber 280 can perform a drying process to remove residual organic solvents from the substrate W by using supercritical carbon dioxide (CO2). The supercritical drying process includes a substrate loading process S100 of loading the substrate W into the processing space, a pressurization process S200 of pressurizing the atmosphere in the processing space, a depressurization process S300 of restoring the atmosphere in the processing space to normal pressure, and a substrate unloading process S400 of unloading the substrate W from the processing space.

[0139] In the substrate loading process S100, the second body 2814 moves vertically toward the first body 2814 via the actuator 2860 to load the substrate W into the processing space. In the substrate unloading process S400, the second body 2814 moves downward in a direction away from the first body 2812 via the actuator 2860 to unload the substrate W from the processing space.

[0140] refer to Figure 8After the drying process is completed by the processing fluid in the processing space, the second body 2814 is moved downward by the actuator 2860. As an example, it is assumed that based on the sealed state of the first body 2812 and the second body 2814, the distance the second body 2814 moves downward is H. Since the first supply pipe 2844b connected upstream of the coil 2844a is connected to the main supply pipe 2842 or the upper supply pipe 2843, the height of the first supply pipe 2844b is fixed when the second body 2814 moves up and down. Since the first supply pipe 2844b acts as a fixing part, the coil 2844a can be stretched and contracted when the second body 2814 moves downward. The coil 2844a can be compressed when the second body 2814 moves downward. As the coil 2844a expands and contracts by displacement H, the second supply pipe 2844c moves downward together with the second body 2814 by a distance H. When the second body 2814 moves in the downward direction, the sixth part 2844e can move downward a distance H.

[0141] When supercritical drying is performed on the substrate, the lower supply pipe 2844 through which the supercritical fluid flows can also move according to the movement of the second body 2814. Therefore, when the second body 2814 moves, the technical disadvantages of pipe damage or plastic deformation caused by the pipe's inability to move are minimized. When supercritical drying is performed on the substrate, pipe impact applied to the lower supply pipe 2844 through which the supercritical fluid flows is minimized. Damage to various devices installed in the lower supply pipe 2844 can be minimized. Leakage of supercritical fluid from the pipe due to pipe damage and contamination of facilities can be prevented.

[0142] In the exemplary embodiments described above, although it has been described that when the second body 2814 moves downward a distance H, the coil 2844a expands and contracts by displacement H, and the sixth part 2844e moves downward a distance H, this has been described as an example to illustrate this exemplary embodiment. Depending on the distance H that the second body 2814 moves, the coil 2844a and the sixth part 2844e can move downward close to the value of displacement H.

[0143] In the exemplary embodiments described above, as an example, a telescopic tube 2844a has been described as being disposed between the first supply tube 2844b and the second supply tube 2844c. However, the invention is not limited thereto, and the sixth portion 2844e may be configured as a tube that can be stretched according to the vertical movement of the second body 2814. For example, the sixth portion 2844e may be configured as a flexible tube. Therefore, the tube impact applied to the sixth portion 2844e, which is easily damaged by the vertical movement of the second body 2814, can be mitigated.

[0144] Figure 9 It is shown schematically. Figure 5 The diagram illustrates an exemplary embodiment of a drying chamber 280. The drying chamber 280 may include a housing 2810, a heating element 2820, a support element 2830, a fluid supply unit 2840, a fluid discharge unit 2850, and an actuator 2860. In this exemplary embodiment, similarly, components including... Figure 5 The drying chamber 280 contains a housing 2810, a heating element 2820, a support element 2830, and an actuator 2860. Therefore, the description of the housing 2810, heating element 2820, support element 2830, and actuator 2860 of the drying chamber 280 will be omitted below.

[0145] refer to Figure 9 The fluid supply unit 2840 can supply processing fluid to the processing space. The processing fluid supplied by the fluid supply unit 2840 may include carbon dioxide. The processing fluid supplied by the fluid supply unit 2840 may be supplied to the processing space in a supercritical state, or may be converted to a supercritical state in the processing space. The fluid supply unit 2840 may include a supply pipe 2841, a heater 2845, a filter 2846, a pressure sensor 2847, a valve 2848, and a fluid supply source 2849.

[0146] Supply pipe 2841 supplies processing fluid to the processing space. Supply pipe 2841 can be connected to housing 2810. Supply pipe 2841 may include main supply pipe 2842, upper supply pipe 2843, and lower supply pipe 2844. Main supply pipe 2842 can be connected to fluid supply source 2849, which will be described later. Upper supply pipe 2843 can branch from main supply pipe 2842 and can be connected to first body 2812. Therefore, upper supply pipe 2843 can supply processing fluid to the upper region of the processing space. Lower supply pipe 2844 can branch from main supply pipe 2842 and can be connected to second body 2814. Therefore, lower supply pipe 2844 can supply processing fluid to the lower region of the processing space.

[0147] In the above embodiments, the case where the main supply pipe 2842 is connected to the fluid supply source 2849 has been described as an example, but it is not limited thereto. For example, if multiple fluid supply sources 2849 are provided, the upper supply pipe 2843 can be connected to any one of the multiple fluid supply sources 2849, and the lower supply pipe 2844 can be connected to another of the multiple fluid supply sources 2849.

[0148] The lower supply pipe 2844 may include a telescopic pipe 2844a, a first supply pipe 2844b, and a second supply pipe 2844c. In the following text, upstream and downstream are defined based on the direction of flow of the processing fluid within the lower supply pipe 2844. Specifically, in the lower supply pipe 2844, the processing fluid flows from the fluid supply source 2849 to the housing 2810; therefore, a point relatively close to the point in the lower supply pipe 2844 connected to the fluid supply source 2849 is defined as upstream, and a point relatively close to the point in the lower supply pipe 2844 connected to the second body 2814 is defined as downstream.

[0149] The telescopic tube 2844a can be stretched and contracted according to the vertical movement of the housing 2810. The telescopic tube 2844a can also be stretched and contracted according to the vertical movement of the second body 2814. The telescopic tube 2844a can be configured as a coil. Optionally, the telescopic tube 2844a can be configured as a flexible tube. The upper end of the telescopic tube 2844a can be located upstream of the lower supply tube 2844 compared to its lower end. That is, the telescopic tube 2844a can be located at a point where its height relative to the ground decreases from the upstream side to the downstream side. In the following description, as an embodiment, the case where the telescopic tube 2844a is configured as a coil will be described.

[0150] The cross-sectional area of ​​the flow passage through the coil 2844a through which the processing fluid flows can be set to be smaller than the cross-sectional area of ​​the flow passage through the first supply pipe 2844b and the second supply pipe 2844c through which the processing fluid flows. This is because when the cross-sectional area of ​​the passage in the coil 2844a is formed to be large, the magnitude of the compressive force and / or tension required for expansion and contraction increases. Therefore, by setting a small cross-sectional area of ​​the flow passage through which the processing fluid flows in the coil 2844a, the coil 2844a can be easily tensioned and / or compressed according to the vertical movement of the second body 2814.

[0151] The first supply pipe 2844b can be connected to the upstream side of the coil 2844a. One end of the first supply pipe 2844b can be connected to the upper end of the coil 2844a, and the other end of the first supply pipe 2844b can be connected to the upper supply pipe 2843. Optionally, one end of the first supply pipe 2844b can be connected to the upper end of the coil 2844a, and the other end of the first supply pipe 2844b can be connected to the main supply pipe 2842.

[0152] The second supply pipe 2844c can connect the coil 2844a and the second body 2814 to each other. The second supply pipe 2844c can be connected to the downstream side of the coil 2844a. One end of the second supply pipe 2844c can be connected to the lower end of the coil 2844a and extends downstream of the lower supply pipe 2844 to be connected to the second body 2814.

[0153] The second supply pipe 2844c can be configured as a fifth part 2844d and a sixth part 2844e. The fifth part 2844d and the sixth part 2844e can be sequentially arranged from downstream to upstream of the lower supply pipe 2844. One end of the fifth part 2844d can be connected to the second body 2814. The longitudinal direction of the fifth part 2844d can extend downwards from one end to the other relative to the ground. One end of the sixth part 2844e can be connected to the other end of the fifth part 2844d. The longitudinal direction of the sixth part 2844e can extend downwards from one end to the other relative to the ground. The shape of the second supply pipe 2844c is not limited to this and can be provided by modification to various shapes.

[0154] Heater 2845 can be installed in supply pipe 2841. Heater 2845 can be installed upstream of supply pipe 2841. Heater 2845 can be installed in main supply pipe 2842. Heater 2845 can heat supply pipe 2841 to control the temperature of the process fluid flowing (or remaining) in supply pipe 2841.

[0155] Filter 2846 can filter the process fluid supplied from fluid supply source 2849 (described below) to the processing space. For example, filter 2846 can filter out impurities that may be contained in the process fluid supplied to the processing space. Filter 2846 can be installed in supply pipe 2841. Filter 2846 can be installed upstream of supply pipe 2841. For example, filter 2846 can be installed in main supply pipe 2842.

[0156] Pressure sensor 2847 can measure the pressure in the processing space and / or supply line 2841. Pressure sensor 2847 can be installed in supply line 2841. Pressure sensor 2847 can be installed upstream of supply line 2841. For example, pressure sensor 2847 can be installed in main supply line 2842.

[0157] Valve 2848 can be installed in supply line 2841. Valve 2848 can be installed upstream of supply line 2841. Valve 2848 can be installed in main supply line 2842. Valve 2848 can be a flow control valve. Optionally, valve 2848 can be an on / off valve. Whether to supply process fluid to the processing space can be determined based on the opening and closing of valve 2848.

[0158] Fluid supply source 2849 can store and / or supply process fluid. Fluid supply source 2849 can be a storage device. Fluid supply source 2849 can deliver process fluid to supply line 2841.

[0159] The fluid discharge unit 2850 can discharge processed fluid from the processing space of the housing 2810. The fluid discharge unit 2850 may include a discharge pipe 2851, a pressure reducing valve 2855, a pressure regulating member 2856, and a collection tank 2857.

[0160] Discharge pipe 2851 can discharge the processed fluid from the processing space. Discharge pipe 2851 can discharge the processed fluid supplied to the processing space to the outside of housing 2810. Discharge pipe 2851 can be connected to housing 2810. Discharge pipe 2851 can be connected to second body 2814.

[0161] The discharge pipe 2851 may include a telescopic pipe 2852, a first discharge pipe 2853, and a second discharge pipe 2854. In the following text, upstream and downstream are defined based on the direction of flow of the processed fluid within the discharge pipe 2851. Specifically, since the processed fluid flows from the housing 2810 within the discharge pipe 2851, points relatively close to the point connected to the second body 2814 within the discharge pipe 2851 are defined as upstream, while points in the direction of the processed fluid flow that are away from the second body 2814 within the discharge pipe 2851 are defined as downstream.

[0162] The telescopic tube 2852 can be stretched and contracted according to the vertical movement of the housing 2810. The telescopic tube 2852 can be stretched and contracted according to the vertical movement of the second body 2814. The telescopic tube 2852 can be configured as a coil. Optionally, the telescopic tube 2852 can be configured as a flexible tube. The upper end of the telescopic tube 2852 can be located upstream of the discharge pipe 2851 than the lower end of the telescopic tube 2852. That is, the telescopic tube 2852 can be located at a point where the relative height with respect to the ground increases from the downstream side to the upstream side. In the following, as an embodiment, the case where the telescopic tube 2852 is configured as a coil will be described.

[0163] In coil 2852, the cross-sectional area of ​​the flow passage through which the processed fluid flows can be set smaller than the cross-sectional area of ​​the flow passages of the first discharge pipe 2853 and the second discharge pipe 2854 through which the processed fluid flows. This is because when the cross-sectional area of ​​the passage in coil 2852 is formed to be large, the magnitude of the compressive force and / or tension required for expansion and contraction increases. Therefore, by providing a small cross-sectional area of ​​the flow passage through which the processed fluid flows in coil 2852, coil 2852 can be easily tensioned and / or compressed according to the vertical movement of the second body 2814.

[0164] The first discharge pipe 2853 can be connected to the downstream side of the coil 2852. One end of the first discharge pipe 2853 can be connected to the lower end of the coil 2852 and extend downstream of the discharge pipe 2851. The pressure reducing valve 2855, the pressure regulating member 2856, and the collection tank 2857, which will be described later, can be installed in the first discharge pipe 2853.

[0165] The second discharge pipe 2854 can connect the coil 2852 and the second body 2814 to each other. The second discharge pipe 2854 can be connected to the upstream side of the coil 2852. One end of the second discharge pipe 2854 can be connected to the upper end of the coil 2852 and extends upstream of the discharge pipe 2851 to be connected to the second body 2814.

[0166] The second discharge pipe 2854 can be configured as a first part 2854a, a second part 2854b, a third part 2854c, and a fourth part 2854d. The first part 2854a, the second part 2854b, the third part 2854c, and the fourth part 2854d can be sequentially arranged from upstream to downstream of the discharge pipe 2851. One end of the first part 2854a can be connected to the second body 2814. The longitudinal direction of the first part 2854a can extend downwards from one end to the other relative to the ground. One end of the second part 2854b can be connected to the other end of the first part 2854a. The longitudinal direction of the second part 2854b can extend from one end to the other parallel to the ground. One end of the third part 2854c can be connected to the other end of the second part 2854b. The longitudinal direction of the third part 2854c can extend vertically from one end to the other in an upward direction relative to the ground. One end of the fourth part 2854d can be connected to the other end of the third part 2854c. The longitudinal direction of the fourth section 2854d can extend horizontally from one end to the other relative to the ground. The other end of the fourth section 2854d can be connected to the upper end of the coil 2852. The second discharge pipe 2854 is not limited to this and can be provided in various shapes.

[0167] Pressure reducing valve 2855 allows selective discharge of the processed fluid from the processing space. Pressure reducing valve 2855 can selectively allow the processed fluid to flow to discharge pipe 2851. Pressure reducing valve 2855 can be an on / off valve. Pressure reducing valve 2855 can be installed in the first discharge pipe 2853.

[0168] The pressure regulating member 2856 can maintain the pressure in the processing space at a constant set pressure. For example, the pressure regulating member 2856 can measure the pressure of the processing fluid flowing in the discharge pipe 2851. Furthermore, the pressure regulating member 2856 can measure the pressure of the processing space based on the pressure of the processing fluid flowing in the discharge pipe 2851. Moreover, the pressure regulating member 2856 can adjust the discharge flow rate of the processing fluid discharged through the discharge pipe 2851 per unit time to maintain the pressure of the processing space at the set pressure. For example, the pressure regulating member 2856 can be a back pressure regulator (BPR). The pressure regulating member 2856 can be installed in the first discharge pipe 2853.

[0169] Collection tank 2857 provides space for storing processed fluids discharged from the processing space. The processed fluids used in the supercritical drying process, stored in collection tank 2857, can be converted into gas to separate organic solvents and reused. Collection tank 2857 can be installed in the first discharge pipe 2853. As an example, collection tank 2857 can be installed downstream of the first discharge pipe 2853, along with pressure reducing valve 2855 and pressure regulating member 2856.

[0170] Figure 10 It is shown schematically. Figure 9 A diagram of the drying chamber when the second body moves downwards. (Reference) Figure 10 After the drying process is completed by the processing fluid in the processing space, the second body 2814 is moved downward by the actuator 2860. As an example, it is assumed that based on the sealed state of the first body 2812 and the second body 2814, the distance the second body 2814 moves downward is H.

[0171] Since the first supply pipe 2844b, which is connected upstream of the coil 2844a installed in the lower supply pipe 2844, is connected to the main supply pipe 2842 or the upper supply pipe 2843, the height of the first supply pipe 2844b is fixed when the second body 2814 moves up and down. Because the first supply pipe 2844b acts as a fixing part, the coil 2844a installed in the lower supply pipe 2844 can be stretched and contracted when the second body 2814 moves downward. When the second body 2814 moves downward, the coil 2844a installed in the lower supply pipe 2844 can be compressed. As the coil 2844a installed in the lower supply pipe 2844 expands and contracts by displacement H, the second supply pipe 2844c moves downward along with the second body 2814 by a distance H. When the second body 2814 moves downward, the sixth part 2844e can move downward a distance H. Pressure reducing valve 2855, pressure regulating component 2856, collection tank 2857, etc., are installed in a first discharge pipe 2853 downstream of the coil 2852 installed in the discharge pipe 2851, such that when the second body 2814 moves up and down, the first discharge pipe 2853 is set to a fixed height. Since the first discharge pipe 2853 serves as a fixed part, the coil 2852 installed in the discharge pipe 2851 can be stretched and contracted when the second body 2814 moves downward. When the second body 2814 moves downward, the coil 2852 installed in the discharge pipe 2851 can be compressed. As the coil 2852 installed in the discharge pipe 2851 expands and contracts by displacement H, when the second body 2814 moves downward, the second discharge pipe 2854 moves downward together with the second body 2814 by a distance H. When the second body 2814 moves downward, the first part 2854a and the third part 2854c can move downward by a distance H.

[0172] When supercritical drying is performed on the substrate, the lower supply pipe 2844 and the discharge pipe 2851 through which the supercritical fluid flows can also move with the movement of the second body 2814. Therefore, when the second body 2814 moves, the technical disadvantages of pipe damage or plastic deformation caused by the pipe's inability to move are minimized. When supercritical drying is performed on the substrate, pipe impact applied to the lower supply pipe 2844 and the discharge pipe 2851 through which the supercritical fluid flows is minimized. Damage to various devices installed in the lower supply pipe 2844 and the discharge pipe 2851 is minimized. Leakage of supercritical fluid from the pipes due to pipe damage and contamination of the facility are prevented.

[0173] The upper end of the coil 2852 installed in the discharge pipe 2851 is positioned upstream of the discharge pipe 2851 compared to the lower end of the coil 2852 installed in the discharge pipe 2851, to prevent backflow caused by condensation of the processing fluid flowing in the discharge pipe 2851. Therefore, backflow contamination entering the processing space due to backflow of the processing fluid in the discharge pipe 2851 can be prevented.

[0174] The foregoing detailed description illustrates the present invention. Furthermore, the foregoing has shown and described exemplary embodiments of the invention, and the invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, within the scope of its equivalents in the written disclosure, and / or within the scope of the skill or knowledge in the art. The foregoing exemplary embodiments describe the optimal state for carrying out the technical spirit of the invention, and various changes are possible in specific fields and uses of the invention. Therefore, the foregoing detailed description of the invention is not intended to limit the invention to the disclosed exemplary embodiments. Furthermore, the appended claims should be interpreted to equally include other exemplary embodiments.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: The housing includes a first body and a second body, the first body and the second body being combined with each other to provide a processing space for processing a substrate; An actuator that moves the second body relative to the first body in a vertical direction to seal or open the processing space; as well as A tube, which is coupled to the second body and in which fluid flows, The tube includes a telescopic tube, which is stretchable and retractable according to the vertical movement of the second body; The expandable tube is configured as a flexible coil; The cross-sectional area of ​​the passage through which the fluid flows in the coil is formed to be smaller than the cross-sectional area of ​​the pipe connected to the upper end and the lower end of the coil. The tube is configured to allow supercritical fluid to flow through it.

2. The substrate processing apparatus according to claim 1, wherein, The pipe includes a discharge pipe that discharges the fluid from the processing space. The coil is located at the discharge pipe, and The upper end of the coil is located upstream of the discharge pipe compared to the lower end of the coil.

3. The substrate processing apparatus according to claim 2, wherein, The coil is configured to be compressed when the second body moves in a downward direction.

4. The substrate processing apparatus according to claim 3, wherein, The discharge pipe also includes: A first discharge pipe is connected to the downstream side of the coil; and A second discharge pipe connects the coil and the second body at the upstream side of the coil, and When the second body moves vertically, the height of the first discharge pipe is fixed, and The second discharge pipe is configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

5. The substrate processing apparatus according to claim 1, wherein, The pipe includes a supply pipe that supplies the fluid to the processing space. The coil is located at the supply pipe, and The upper end of the coil is located upstream of the supply pipe compared to the lower end of the coil.

6. The substrate processing apparatus according to claim 5, wherein, The coil is configured to be tensioned when the second body moves in the downward direction.

7. The substrate processing apparatus according to claim 6, wherein, The supply pipe also includes: A first supply pipe, the first supply pipe being connected to the upstream side of the coil; and A second supply pipe connects the coil and the second body at the downstream side of the coil, and When the second body moves vertically, the height of the first supply pipe is fixed, and The second supply pipe is configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

8. The substrate processing apparatus according to claim 1, wherein, The second body is located below the first body, and The tube includes: A first supply pipe is connected to the first body to supply the fluid to the processing space; A second supply pipe, connected to the second body, is used to supply the fluid to the processing space; and A discharge pipe that discharges the fluid into the processing space, and The coil is located at each of the second supply pipe and the discharge pipe.

9. A substrate processing apparatus, the substrate processing apparatus comprising: The housing is provided with a first body and a second body, which are combined with each other to form a processing space in which organic solvents remaining on the substrate are dried by a supercritical drying fluid. An actuator configured to move the second body up and down relative to the first body to seal or open the processing space; A support unit configured to support the substrate within the processing space; as well as A discharge pipe, coupled to the second body, is provided to discharge the supercritical, drying fluid from the processing space. The discharge pipe includes a flexible coil, which is stretchable and retractable according to the up-and-down movement of the second body. When the second body moves upward and seals the processing space, the upper end of the coil is upstream of the discharge pipe than the lower end of the coil. Wherein, the cross-sectional area of ​​the passage through which the supercritical, drying fluid flows in the coil is formed to be smaller than the cross-sectional area of ​​the pipe connected to the upper end and the lower end of the coil. The tube is configured to allow supercritical fluid to flow through it.

10. The substrate processing apparatus according to claim 9, wherein, The coil is configured to be compressed when the second body moves downward.

11. The substrate processing apparatus according to claim 10, wherein, The discharge pipe also includes: A first discharge pipe is connected to the downstream side of the coil; and A second discharge pipe connects the coil and the second body at the upstream side of the coil, and When the second body moves vertically, the height of the first discharge pipe is fixed, and The second discharge pipe is configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

12. The substrate processing apparatus according to claim 11, wherein, The second discharge pipe includes a first part, a second part, a third part, and a fourth part arranged sequentially from the upstream side to the downstream side of the discharge pipe, and The first portion extends downward relative to the ground from the point where it is coupled to the second body. The second part extends from the first part in a direction parallel to the ground. The third portion extends vertically upward from the second portion relative to the ground, and The fourth portion extends horizontally from the third portion relative to the ground, and When the second body moves downward, the first part and the third part move in the downward direction, and the coil is compressed.

13. A substrate processing apparatus, the substrate processing apparatus comprising: The housing is provided with a first body and a second body, which are combined with each other to form a processing space in which organic solvents remaining on the substrate are dried by a supercritical drying fluid. An actuator configured to move the second body up and down relative to the first body to seal or open the processing space; A support unit configured to support the substrate within the processing space; and A supply pipe, coupled to the second body, supplies the supercritical, drying fluid to the processing space. The supply pipe includes a flexible coil, which is stretchable and retractable according to the up-and-down movement of the second body. When the second body moves upward to seal the processing space, the upper end of the coil is upstream of the supply pipe than the lower end of the coil. Wherein, the cross-sectional area of ​​the passage through which the supercritical, drying fluid flows in the coil is formed to be smaller than the cross-sectional area of ​​the pipe connected to the upper end and the lower end of the coil. The tube is configured to allow supercritical fluid to flow through it.

14. The substrate processing apparatus according to claim 13, wherein, The supply pipe also includes: A first supply pipe, the first supply pipe being connected to the upstream side of the coil; and A second supply pipe connects the coil and the second body at the downstream side of the coil, and When the second body moves vertically, the height of the first supply pipe is fixed, and The second supply pipe is configured to move vertically along with the vertical movement of the second body when the second body moves vertically.

15. The substrate processing apparatus according to claim 14, wherein, The second supply pipe includes a fifth section and a sixth section sequentially arranged from the coil to the downstream side of the supply pipe, and The fifth part extends from the point coupled to the second body in a downward direction relative to the ground. The sixth portion extends from the fifth portion in a direction parallel to the ground, and When the second body moves downward, the fifth part moves in the downward direction, and the coil is tensioned.

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