Flexible circuit board with power transmission line

Abstract

The present invention provides a flexible circuit board, the flexible circuit board comprising: a first power line formed on one side of a first dielectric layer; and a second power line formed on one side of the second dielectric layer, the second dielectric layer being formed on the bottom surface of the first dielectric layer and separated from the first dielectric layer. There is an overlapping area where the first power line and the second power line overlap, the first power line and the second power line are connected through a via in a first end of the overlapping area, and the first power line and the second power line are connected through another via in a second end of the overlapping area.

Description

Technical Field

[0001] An embodiment of the present invention relates to a flexible circuit board having a power transmission line. Background Art

[0002] The base station system includes a digital signal processing unit (Digital Unit; DU) responsible for processing digital signals and an RF signal processing unit (Radio Unit; RU) that converts digital signals into RF signals or converts RF signals into digital signals for transmission and reception between the antenna and the digital signal processing unit.

[0003] Coaxial cables are used for transmission and reception of such digital signal processing units and RF signal processing units. However, in recent 5G environments, more than 100 coaxial cables are required, which has made it difficult to miniaturize signal transmission devices. Summary of the invention

[0004] The present invention is proposed to improve the above-mentioned problems and aims to use a single flexible printed circuit board (FPCB) to replace multiple coaxial cables to manufacture a signal transmission device, thereby providing a miniaturized signal transmission device.

[0005] Specifically, an object is to provide a flexible circuit board that minimizes the area of ​​a power transmission line connecting a digital signal processing section side and an RF signal processing section side in a signal transmission device.

[0006] However, such subjects are merely illustrative, and the scope of the present invention is not limited thereto.

[0007] According to an embodiment of the present invention, the flexible circuit board may include: a first power line formed on one side of a first dielectric layer; and a second power line formed on one side of the second dielectric layer, the second dielectric layer being formed on the bottom surface of the first dielectric layer and separated from the first dielectric layer, there being an overlapping area where the first power line and the second power line overlap, the first power line and the second power line are connected through a via at a first end of the overlapping area, and the first power line and the second power line are connected through another via at a second end of the overlapping area, the first power line and the second power line are connected in parallel, the length of the first power line is formed to be longer than the length of the overlapping area, and there is a non-overlapping area where the first power line does not overlap the second power line, and the width of the overlapping area is formed to be narrower than the width of the non-overlapping area.

[0008] According to an embodiment of the present invention, the flexible circuit board may include: a first power line formed on one side of a first dielectric layer; a second power line formed on one side of the second dielectric layer, the second dielectric layer being separated from the first dielectric layer on the bottom surface of the first dielectric layer; and a third power line formed on one side of the third dielectric layer, the third dielectric layer being separated from the second dielectric layer on the bottom surface of the second dielectric layer, the second power line being formed to correspond to the first power line, there being an overlapping area where the second power line and the third power line overlap, two or more power lines selected from the first power line, the second power line and the third power line are connected in parallel, the length of the second power line is formed to be longer than the length of the overlapping area, there being a non-overlapping area where the second power line does not overlap the third power line, and the width of the overlapping area is formed to be narrower than the width of the non-overlapping area.

[0009] According to one embodiment, the two ends of the second power line may include: a first via hole connecting the first power line and the second power line at the two ends of the second power line; and a second via hole connecting the first power line, the second power line and the third power line at the two ends of a part of the second power line.

[0010] According to one embodiment, the flexible circuit board may further include: a fourth power line formed on one side of a fourth dielectric layer, the fourth dielectric layer being formed on the bottom surface of the third dielectric layer and separated from the third dielectric layer, and two or more power lines selected from the first power line, the second power line, the third power line and the fourth power line are connected in parallel.

[0011] According to one embodiment, the fourth power line may be formed to correspond to the third power line, and the flexible circuit board also includes: a first via hole connecting the first power line and the second power line at both ends of the second power line; and a second via hole connecting the first power line, the second power line, the third power line and the fourth power line at both ends of a part of the second power line.

[0012] According to one embodiment, the flexible circuit board may further include: a first connector connected to one end of the first power line and connected to the first signal processing unit; and a second connector connected to the other end of the first power line and connected to the second signal processing unit.

[0013] According to an embodiment, the flexible circuit board may further include: a signal line connecting the first connector and the second connector, and the first power line is arranged on one side of the signal line.

[0014] A flexible circuit board according to an embodiment of the present invention may include: a first power line formed on one side of a first dielectric layer; and a plurality of slits formed in the first power line at intervals from each other, wherein the orientation of each of the plurality of slits is along the length direction of the first power line, so that current flows in one direction in the first power line, and the plurality of slits are formed to have a length in the one direction and a width shorter than the length, and the length direction of the plurality of slits is parallel to the direction of the current flowing in the first power line.

[0015] According to an embodiment, the plurality of slits may include: a long slit for increasing the amount of current allowed by the first power line; and a short slit for minimizing a shape change of the first power line caused by thermal expansion.

[0016] According to an embodiment, a through hole is formed to penetrate the first dielectric layer and the first power line, and at least a portion of the long slit is formed to surround a portion of the through hole at a periphery of the through hole.

[0017] According to one embodiment, the flexible circuit board may further include: a third power line formed on one side of a third dielectric layer, the third dielectric layer being formed on the bottom surface of the first dielectric layer and separated from the first dielectric layer, and the first power line and the third power line being connected in parallel to each other.

[0018] According to an embodiment, the width of the middle region of the first power line may be narrower than the width of the end regions of the first power line, and the third power line only faces the middle region of the first power line.

[0019] According to an embodiment, the two end regions of the first power line may be bent relative to a middle region of the first power line on one surface of the first dielectric layer.

[0020] Other aspects, features, and advantages besides the foregoing will become apparent from the following drawings, claims, and detailed description of the invention.

[0021] According to one embodiment of the present invention configured as described above, the area of ​​the flexible circuit board can be minimized by minimizing the area of ​​the power transmission line in the flexible circuit board.

[0022] In addition, the amount of current allowed by the power transmission line can be increased within a limited area.

[0023] In addition, thermal expansion of the power transmission line can be minimized during the process to prevent defects.

[0024] Of course, the scope of the present invention is not limited by such effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 having a power line according to an embodiment of the present invention.

[0026] Figure 2 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 a having a power line according to an embodiment of the present invention.

[0027] Figure 3 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 b having a power line according to an embodiment of the present invention.

[0028] Figure 4 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 c having a power line according to an embodiment of the present invention.

[0029] Figure 5 FIG. 2 is a perspective view of a multiple signal transmission device 200 according to an embodiment of the present invention.

[0030] Figure 6 yes Figure 5 FIG. 2 is an enlarged view of the interior of the region between A1 and A2 of the multiple signal transmission device 200 shown in FIG.

[0031] Figure 7 FIG. 1 is a top view of a first dielectric layer 150 and a first power line 110 formed on the first dielectric layer 150 included in a multiple signal transmission device 200 according to an embodiment of the present invention.

[0032] Figure 8 FIG. 1 is a top view of a second dielectric layer 160 and a second power line 120 formed on the second dielectric layer 160 that may be included in the multiple signal transmission device 200 according to an embodiment of the present invention.

[0033] Fig. 9 FIG. 1 is a top view of a third dielectric layer 170 that may be included in the multiple signal transmission device 200 and a third power line 130 formed on the third dielectric layer 170 according to an embodiment of the present invention.

[0034] Fig.10 FIG. 1 is a top view of a fourth dielectric layer 180 that may be included in the multiple signal transmission device 200 and a fourth power line 140 formed on the fourth dielectric layer 180 according to an embodiment of the present invention.

[0035] Fig.11 yes Figures 7 to 10 A cross-sectional view between B1 and B2 is shown in FIG. DETAILED DESCRIPTION

[0036] The present invention can be subjected to various modifications and can have various embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. Figure 1 This will become clear with reference to the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms.

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding components are denoted by the same reference numerals, and repeated description thereof will be omitted.

[0038] In the following embodiments, the terms "first" and "second" are used to distinguish one constituent element from another constituent element, rather than having a limiting meaning.

[0039] In the following embodiments, unless the context clearly indicates otherwise, an expression in the singular includes an expression in the plural.

[0040] In the following embodiments, terms such as including or having refer to the existence of the features or constituent elements recorded in the specification, and do not preclude the possibility of one or more other features or constituent elements being added.

[0041] For the sake of convenience, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of the various structures shown in the drawings are arbitrarily shown for the sake of convenience, and therefore the present invention is not necessarily limited to the drawings.

[0042] In the following embodiments, when expressing that a region, layer, constituent element, etc. is on or above another part, it includes not only the case where it is directly on other parts, but also the case where there are other regions, layers, constituent elements, etc. in between.

[0043] In the following embodiments, when components and the like are described as being connected, this includes not only a case where the components are directly connected but also a case where the components are indirectly connected with other components interposed therebetween.

[0044] The flexible circuit boards 100 , 100 a , 100 b , and 100 c according to the following embodiments may be applicable to flexible circuit boards for signal transmission, such as flexible circuit boards for multiple signal transmission, but are not limited thereto.

[0045] In the following drawings and embodiments, the y direction indicates the length direction of the power lines 110, 120, 130, 140, the z direction indicates the direction perpendicular to the flexible circuit boards 100, 100a, 100b, 100c, and the x direction indicates the width direction of the power lines 110, 120, 130, 140. However, such directional descriptions are used to help explain the positional relationship, and therefore should not be interpreted restrictively, and should be noted that they change according to the visual direction.

[0046] In addition, Figures 1 to 4 In order to simplify the description, the power lines 110, 120, 130, 140 are shown as straight lines, but the shape of the power lines in the present invention is not limited thereto. In various embodiments of the present invention, the power lines 110, 120, 130, 140 can be formed in various patterns. For example, Figure 7 as well as Figure 8 As shown, the power lines 110 and 120 can be formed into a "U" shape. According to other embodiments (not shown), the power lines can also be formed into an "L" shape.

[0047] Figure 1 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 having a power line according to an embodiment of the present invention.

[0048] Reference Figure 1 According to an embodiment of the present invention, the flexible circuit board 100 may include: a first dielectric layer 150; a first power line 110 formed on one side of the first dielectric layer 150; a second dielectric layer 160 formed on the bottom surface of the first dielectric layer 150 and separated from the first dielectric layer 150; and a second power line 120 formed on one side of the second dielectric layer 160. In addition, in the flexible circuit board 100, there may be a section where the first power line 110 and the second power line 120 overlap. According to an embodiment, the first power line 110 and the second power line 120 may be connected through a via hole VH1 at a first end of the overlapping section, and the first power line 110 and the second power line 120 may be connected through another via hole VH2 at a second end of the overlapping section.

[0049] Generally, when the width of the power transmission line is narrowed in order to form the power transmission line within the limited space of the flexible circuit board, a problem of a current greater than the current allowed by the power transmission line flows. When a current greater than the current allowed by the power transmission line flows, leakage and short circuit problems may occur. When the width of the power transmission line is widened in order to prevent this, there is a disadvantage that the area of ​​the flexible circuit board becomes wider.

[0050] In this regard, the flexible circuit board 100 according to an embodiment of the present invention includes a first power line 110 and a second power line 120 formed in different layers from each other. By making the current flow to the first power line 110 and the second power line 120 separately, the area occupied by the first and second power lines 110 and 120 can be minimized while a large amount of current flows. Specifically, the flexible circuit board 100 according to an embodiment of the present invention includes a section where the first power line 110 and the second power line 120 overlap, and the first power line 110 and the second power line 120 are connected at both ends of the overlapping section by vias VH1 and VH2 that are different from each other, so that the allowable current can be increased within a limited area. By this, short circuits and leakage can be prevented.

[0051] Figure 2 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 a having a power line according to an embodiment of the present invention.

[0052] Reference Figure 2 , the second power line 120 may be formed to overlap only a portion 101 of the first power line 110. Therefore, the length of the second power line 120 may be shorter than the length of the first power line 110. At this time, the width of the portion 101 of the first power line 110 overlapped by the second power line 120 may be narrower than the width of the remaining portion 102 of the first power line 110. For reference, the width direction is the x direction in the figure.

[0053] For example, in Figure 2 In the embodiment, the second power line 120 is formed to face (or overlap) only the middle area of ​​the first power line 110, so the width of the middle area of ​​the first power line 110 can be narrower than the width of the end areas of the first power line 110.

[0054] In this article, the width of the power line refers to the width perpendicular to the length of the power line. Figures 1 to 4 In the embodiment where the power line is a straight line, the width of the power line can represent the length of the power line in the x direction. Figure 7 as well as Figure 8 In the embodiment where the power line is in the shape of a "U", the width of the power line refers to the width perpendicular to the length direction of the corresponding part of the power line.

[0055] For example, refer to Figure 7 , the width of the middle region of the first power line 110 is narrower than the width of the two end regions of the first power line 110. In this case, at least one other power line (for example: Fig. 9 The third power line 130 may be formed to overlap with (or face) the middle region of the first power line 110 .

[0056] According to one embodiment, in order to connect the two end regions of the first power line 110 to the connectors 201 and 202 described later, the paths of the two end regions may be bent relative to the middle region of the first power line 110, and the widths of the two end regions may be formed to be wider than the width of the middle region. In addition, by narrowing the width of the middle region arranged along the length direction of the flexible circuit board, the width of the flexible circuit board may be reduced.

[0057] According to one embodiment, by forming the second power line 120 corresponding to the narrowed portion 101 of the first power line 110, the current can be separated and flowed to the second power line 120 without leakage or short circuit in the narrowed portion 101 of the first power line 110. In addition, the second power line 120 is formed in a manner corresponding to any section where the width of the first power line 110 is narrowed, so that the shape of the first power line 110 can be naturally formed in the shape of the flexible circuit board.

[0058] Figure 3 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 b having a power line according to an embodiment of the present invention.

[0059] Reference Figure 3 ,and Figure 1 Compared with the flexible circuit board 100 shown in FIG. 1 , the flexible circuit board 100b may further include: a third dielectric layer 170 formed on the bottom surface of the second dielectric layer 160 and separated from the second dielectric layer 160; and a third power line 130 formed on one side of the third dielectric layer 170. Here, two or more power lines selected from the first, second, and third power lines 110, 120, and 130 may be connected in parallel. By further including the third power line 130, the amount of current allowed by the power transmission line can be further increased for a limited area.

[0060] According to an embodiment, in the flexible circuit board 100b, the second power line 120 is formed to correspond to the first power line 110, and the third power line 130 is formed to correspond to a portion 101 of the second power line 120. At this time, the width of the portion 101 of the second power line 120 may be narrower than the width of the remaining portion 102 of the second power line 120.

[0061] By forming the third power line 130 corresponding only to the narrowed portion 101 of the first and second power lines 110 and 120 , current can flow to the third power line 130 without leakage or short circuit even in the narrowed portion 101 of the first and second power lines 110 and 120 .

[0062] According to one embodiment, the flexible circuit board 100b may include: a first via hole VH1, connecting the first power line 110 and the second power line 120 at both ends of the second power line 120; and a second via hole VH2, connecting the first, second, and third power lines 110, 120, and 130 at both ends of the portion 101 of the second power line 120.

[0063] The first via hole VH1 and the second via hole VH2 are disposed at different positions, so that at least a portion of the first, second, and third power lines 110 , 120 , and 130 can be formed with different lengths, thereby increasing the degree of freedom in designing the power line pattern.

[0064] Figure 4 FIG. 1 is a cross-sectional view of a flexible printed circuit board 100 c having a power line according to an embodiment of the present invention.

[0065] Reference Figure 4 ,and Figure 3 Compared with the flexible circuit board 100b shown in FIG. 1 , the flexible circuit board 100c may further include: a fourth dielectric layer 180 formed on the bottom surface of the third dielectric layer 170 and separated from the third dielectric layer 170; and a fourth power line 140 formed on one side of the fourth dielectric layer 180. Here, two or more power lines selected from the first, second, third, and fourth power lines 110, 120, 130, and 140 may be connected in parallel. By further including the fourth power line 140, the amount of current allowed by the power transmission line can be further increased for a limited area.

[0066] According to an embodiment, in the flexible circuit board 100c, the second power line 120 is formed to correspond to the first power line 110, the third power line 130 is formed to correspond to only a portion 101 of the second power line 120, and the fourth power line 140 is formed to correspond to the third power line 130. In this case, the flexible circuit board 100c may further include: a first via hole VH1, connecting the first power line 110 and the second power line 120 at both ends of the second power line 120; and a second via hole VH2, connecting the first, second, third, and fourth power lines 110, 120, 130, and 140 at both ends of the portion 101 of the second power line 120.

[0067] The first via hole VH1 and the second via hole VH2 are arranged at different positions, so that at least a portion of the first, second, third and fourth power lines 110, 120, 130 and 140 can be formed with different lengths, which can improve the design freedom of the power line pattern.

[0068] Figure 5 FIG. 2 is a perspective view of a multiple signal transmission device 200 according to an embodiment of the present invention. Figure 6 yes Figure 5 FIG. 2 is an enlarged view of the interior of the region between A1 and A2 of the multiple signal transmission device 200 shown in FIG.

[0069] Reference Figure 5 According to one embodiment, the multiple signal transmission device 200 may include a flexible portion 200F and flexible portions 200R at both ends of the flexible portion 200F. According to one embodiment, the flexible portion 200F may be formed in the middle of the flexible circuit boards 100, 100a, 100b, 100c according to the various embodiments described above, and the flexible portion 200R may be formed by bonding other layers with high strength to both ends of the flexible circuit boards 100, 100a, 100b, 100c.

[0070] The flexible portions 200R at both ends of the flexible portion 200F may form a first connector 201 and a second connector 202 , respectively.

[0071] Reference Figure 6 The flexible circuit board included in the multiple signal transmission device 200 may include a signal line SL connecting the first connector 201 and the second connector 202. For example, the signal line SL and the ground line GL between the signal lines SL may be formed on one side of the first dielectric layer 150, and the first power line 110 may be configured on one side of the signal line SL. As described above, the first power line 110 is formed on one side of the first dielectric layer 150. A side ground line GL1 may be formed between the first power line 110 and the signal line SL. Although Figure 6 Although not shown in the figure, the second power line 120 and the second dielectric layer 160 may be formed on the bottom surface of the first dielectric layer 150. The second power line 120 may be formed to overlap the first power line 110 in at least a portion.

[0072] On the other hand, the signal line SL connecting the first connector 201 and the second connector 202 is formed to have the shortest distance, and the first power line 110 is arranged on one side of the signal line SL, so that the signal transmission quality can be improved.

[0073] The first connector 201 can be connected to one end of the first power line 110 and connected to the first signal processing unit (not shown). The second connector 202 can be connected to the other end of the first power line 110 and connected to the second signal processing unit (not shown). It can be that one of the first signal processing unit and the second signal processing unit is a digital signal processing unit, and the other is an RF signal processing unit. Therefore, the signal line SL can perform signal transmission and reception between the digital signal processing unit and the RF signal processing unit. In addition, the first power line 110 can connect between the digital signal processing unit and the RF signal processing unit. At this time, since a coaxial cable is not used, the device 200 for multiple signal transmission can be miniaturized.

[0074] Figure 7 FIG. 1 is a top view of a first dielectric layer 150 and a first power line 110 formed on the first dielectric layer 150 included in a multiple signal transmission device 200 according to an embodiment of the present invention.

[0075] Figure 8 FIG. 1 is a top view of a second dielectric layer 160 and a second power line 120 formed on the second dielectric layer 160 that may be included in the multiple signal transmission device 200 according to an embodiment of the present invention.

[0076] Fig. 9 FIG. 1 is a top view of a third dielectric layer 170 that may be included in the multiple signal transmission device 200 and a third power line 130 formed on the third dielectric layer 170 according to an embodiment of the present invention.

[0077] Fig.10 FIG. 1 is a top view of a fourth dielectric layer 180 that may be included in the multiple signal transmission device 200 and a fourth power line 140 formed on the fourth dielectric layer 180 according to an embodiment of the present invention.

[0078] Fig.11 yes Figures 7 to 10 A cross-sectional view between B1 and B2 is shown in FIG.

[0079] The flexible circuit board included in the device 200 for multiple signal transmission according to an embodiment of the present invention may include: a first dielectric layer 150; a first power line 110 formed on one side of the first dielectric layer 150; and a plurality of slits formed spaced apart from each other in the first power line 110. The orientation of each of the plurality of slits may be along the length direction of the first power line 110. Here, the expression that the slits are along the length direction of the first power line 110 includes not only the case where the slits are parallel to the length direction, but also the case where the slits are substantially along the length direction.

[0080] The plurality of slits may include a long slit LS and a short slit SS. The long slit LS may increase the amount of current allowed by the first power line 110. The short slit SS may minimize the shape change caused by thermal expansion of the first power line 110. Since the first power line 110 is formed long, a plurality of slits may be arranged along the length direction of the first power line 110, thereby minimizing the influence of thermal expansion of the first power line 110.

[0081] The through hole TH for fixing the multiple signal transmission device 200 to the outside may be formed in the flexible circuit board included in the multiple signal transmission device 200. For example, the through hole TH may also be formed in the first power line 110. Due to such a through hole TH, a section where the width of the first power line 110 is temporarily narrowed is generated. In such a small area section where the width of the first power line 110 is only temporarily narrowed, it is not efficient to form other power lines in parallel on other layers in order to increase the allowable current.

[0082] Therefore, in a small area section of the first power line 110 where the width is only temporarily narrowed, the amount of current allowed in the small area section can be increased by forming a long slit LS in the first power line 110 .

[0083] For example, at least a portion of the long slit LS may be formed to surround a portion of the through hole TH at the periphery of the through hole TH. Therefore, even in a section where the first power line 110 is narrowed by the through hole TH, the allowable current amount may not be reduced due to the presence of the long slit LS.

[0084] The multiple signal transmission device 200 according to an embodiment of the present invention may further include other power lines that overlap at least a portion of the first power line 110 in a layer different from the first power line 110. Figure 7 The first power line 110 shown in FIG. 1 is also formed from different layers Figure 8 The second power line 120, Fig. 9 The third power line 130, Fig.10 One or more power lines selected from the fourth power line 140.

[0085] In addition, two or more power lines selected from the first, second, third, and fourth power lines 110, 120, 130, and 140 may be connected in parallel through vias. The vias may be formed in, for example, at least a portion of the first region R1 and the second region R2. A plurality of vias may be formed to increase the amount of current allowed. The second region R2 may be formed at a starting position where the width becomes narrower.

[0086] Reference Figure 7 , the width of the middle region of the first power line 110 may be narrower than the width of the two end regions of the first power line 110. Therefore, in order to increase the amount of current allowed in the middle region of the first power line 110, the flexible circuit board included in the multiple signal transmission device 200 according to an embodiment may further include: a third dielectric layer 170, which is formed on the bottom surface of the first dielectric layer 150 and is separated from the first dielectric layer 150; a third power line 130, which is formed on one side of the third dielectric layer 170 (refer to Fig. 9). For example, the third power line 130 may be formed to face only the middle region of the first power line 110. In one embodiment, the first power line 110 and the third power line 130 may be connected in parallel to each other through a via formed in the region R2. That is, the first power line 110 and the third power line 130 may be connected to each other through vias formed in the region R2 at both ends (i.e., the first end and the second end) of the overlapped section of the first power line 110 and the third power line 130.

[0087] According to an embodiment, the two end regions of the first power line 110 may be bent relative to the middle region of the first power line 110 on one surface of the first dielectric layer 150 .

[0088] In order to connect the two end regions of the first power line 110 to the connectors 201 and 202, the paths of the two end regions can be bent relative to the middle region of the first power line 110. In addition, by narrowing the width of the middle region arranged along the length direction of the flexible circuit board, the width of the flexible circuit board can be reduced. The two end regions of the first power line 110 can be bent and connected to the connector while freely adjusting the width of the first power line 110, thereby improving the degree of freedom in design.

[0089] On the other hand, refer to Figures 7 to 11 According to an embodiment of the present invention, the multiple signal transmission device 200 may also include the following components: a first dielectric layer 150; a first power line 110 formed on one side of the first dielectric layer 150; a second dielectric layer 160 formed on the bottom surface of the first dielectric layer 150 and separated from the first dielectric layer 150; a second power line 120 formed on one side of the second dielectric layer 160; a third dielectric layer 170 formed on the bottom surface of the second dielectric layer 160 and separated from the second dielectric layer 160; a third power line 130 formed on one side of the third dielectric layer 170; a fourth dielectric layer 180 formed on the bottom surface of the third dielectric layer 170 and separated from the third dielectric layer 170; and a fourth power line 140 formed on one side of the fourth dielectric layer 180.

[0090] According to one embodiment, the Figures 7 to 10 The dielectric layers 150, 160, 170, 180 shown are used to form a flexible circuit board included in the device 200 for multiple signal transmission. In this embodiment, Figures 7 to 10 The cross-sectional view between B1 and B2 shown in FIG. Fig.11 same.

[0091] Reference Figures 7 to 11, it can be that the first power line 110 and the second power line 120 correspond to each other, the third power line 130 corresponds to only a part of the second power line 120 , and the fourth power line 140 corresponds to the third power line 130 .

[0092] For example, the first power line 110 and the second power line 120 may be connected through the first via hole VH1 in the region R1 at both ends of the second power line 120. In addition, the first, second, third, and fourth power lines 110, 120, 130, and 140 may be connected through the second via hole VH2 in the region R2 at both ends of the portion of the second power line 120.

[0093] On the other hand, refer to Figures 7 to 10 Similar to the first power line 110 , a plurality of slits including a long slit LS and a short slit SS and a through hole TH may be formed in the second, third, and fourth power lines 120 , 130 , and 140 .

[0094] A slit in an oblique direction may be formed in the second region R2 where the current direction changes. The slit in an oblique direction may be, for example, a short slit SS. The slit in an oblique direction formed in the second region R2 where the current direction changes may allow the direction of the flowing current to change smoothly along the direction of the power line.

[0095] The present invention has been described with reference to an embodiment shown in the accompanying drawings, but it is only illustrative, and a person with ordinary knowledge in the art should understand that various modifications and variations of the embodiments are possible. Therefore, the true technical protection scope of the present invention should be determined by the attached claims.

[0096] [National research and development organization that supported this invention]

[0097] [Project number] 1711116794

[0098] [Project No.] 2020-0-00915-001

[0099] [Department Name] Ministry of Science, Technology, ICT and Communications

[0100] [Name of the project management (specialized) agency] Information and Communication Planning and Evaluation Institute

[0101] [Research Project Name] Development of 5G-based equipment terminal components and device technology

[0102] [Research Topic Name] Development of a multi-channel flexible transmission component based on PI for 10Gbps signal transmission between 5G RU-DU multi-wiring

[0103] [Contribution rate] 1 / 1

[0104] [Name of the project implementing agency] Jijialan Co., Ltd.

[0105] [Research period] 20200401~20201231

Claims

1. A flexible circuit board, include: A first power line is formed on one side of the first dielectric layer; as well as A second power line is formed on one side of a second dielectric layer, and the second dielectric layer is formed on the bottom side of the first dielectric layer and is separated from the first dielectric layer. There is an overlapping area where the first power line and the second power line overlap, The first power line and the second power line are connected through a via in a first end of the overlapping area, and the first power line and the second power line are connected through another via in a second end of the overlapping area, and the first power line and the second power line are connected in parallel, The length of the first power line is formed to be longer than the length of the overlapping area, and there is a non-overlapping area where the first power line does not overlap with the second power line. The width of the overlap region is formed to be narrower than the width of the non-overlap region.

2. A flexible circuit board, include: A first power line is formed on one side of the first dielectric layer; A second power line is formed on one side of a second dielectric layer, wherein the second dielectric layer is formed on the bottom side of the first dielectric layer and is separated from the first dielectric layer; as well as a third power supply line formed on one side of a third dielectric layer, wherein the third dielectric layer is formed on the bottom side of the second dielectric layer and is separated from the second dielectric layer; The second power line is formed to correspond to the first power line, There is an overlapping area where the second power line and the third power line overlap, Two or more power lines selected from the first power line, the second power line, and the third power line are connected in parallel, The length of the second power line is formed to be longer than the length of the overlapping area, and there is a non-overlapping area where the second power line does not overlap the third power line. The width of the overlap region is formed to be narrower than the width of the non-overlap region.

3. The flexible circuit board according to claim 2, in, The flexible circuit board comprises: a first via hole connecting the first power line and the second power line at both ends of the second power line; and The second via hole connects the first power line, the second power line, and the third power line at both ends of a portion of the second power line.

4. The flexible circuit board according to claim 2, in, The flexible circuit board also includes: a fourth power line formed on one side of a fourth dielectric layer, wherein the fourth dielectric layer is formed on the bottom surface of the third dielectric layer and is separated from the third dielectric layer; Two or more power lines selected from the first power line, the second power line, the third power line, and the fourth power line are connected in parallel.

5. The flexible circuit board according to claim 4, in, The fourth power line is formed to correspond to the third power line, The flexible circuit board also includes: a first via hole connecting the first power line and the second power line at both ends of the second power line; and The second via hole connects the first power line, the second power line, the third power line, and the fourth power line at both ends of a portion of the second power line.

6. The flexible circuit board according to claim 1 or 2, in, The flexible circuit board also includes: a first connector connected to one end of the first power line and connected to the first signal processing unit; and The second connector is connected to the other end of the first power line and is connected to the second signal processing unit.

7. The flexible circuit board according to claim 6, in, The flexible circuit board also includes: a signal line connecting the first connector and the second connector, The first power line is arranged at one side of the signal line.

8. A flexible circuit board, include: A first power line formed on one side of the first dielectric layer; as well as a plurality of slits are formed in the first power supply lines to separate them from each other, The orientation of each of the plurality of slits is along the length direction of the first power line, The current is formed to flow in one direction in the first power line, The plurality of slits are formed to have a length in the one direction and a width shorter than the length, The length direction of the plurality of slits is parallel to the direction of the current flowing in the first power line, The first power line is connected in parallel with the third power line and overlaps with the third power line, and the width of the middle area where the first power line overlaps with the third power line is formed to be narrower than the width of the two end areas of the first power line that do not overlap with the third power line.

9. The flexible circuit board according to claim 8, in, The plurality of gaps include: A long gap for increasing the amount of current allowed by the first power line; and The short gap minimizes the shape change of the first power line caused by thermal expansion.

10. The flexible circuit board according to claim 9, in, forming a through hole penetrating the first dielectric layer and the first power line, At least a portion of the long slit is formed to surround a portion of the through hole at the periphery of the through hole.

11. The flexible circuit board according to claim 8, in, The flexible circuit board also includes: The third power line is formed on one side of a third dielectric layer, and the third dielectric layer is formed on the bottom side of the first dielectric layer and is separated from the first dielectric layer.

12. The flexible circuit board according to claim 11, in, Both end regions of the first power line are bent relative to a middle region of the first power line on one surface of the first dielectric layer.

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