Chip removal component of internal cylindrical grinder and internal cylindrical grinder

Abstract

The present application relates to the field of internal cylindrical grinders, and specifically discloses a chip removal assembly of an internal cylindrical grinder, comprising: a transfer support seat, mounted on the internal cylindrical grinder, the transfer support seat is also used to mount a grinding wheel; a chip guide, comprising a connected mounting portion and a surrounding portion, the mounting portion is fixed to the transfer support seat, the surrounding portion surrounds part of the outer circumference of the grinding wheel, and the remaining outer circumference of the grinding wheel is arranged opposite to the notch of the surrounding portion, so that the grinding wheel passes through the notch and contacts the workpiece to be ground. The chip removal scheme provided by the present application is conducive to reducing the accumulation of residual grinding chips on the surface of the workpiece to be ground.

Description

Technical Field

[0001] The present application relates to the field of internal cylindrical grinders, in particular to a chip removal component of an internal cylindrical grinder and an internal cylindrical grinder. Background Art

[0002] In the inner hole grinding process, factors such as the clamping of the workpiece, the linear speed of the grinding wheel, the strength of the grinding wheel rod, the heat dissipation and chip removal of the processed parts directly affect the processing quality of the workpiece. In the traditional grinding process, the flushing of the grinding fluid can take away the heat generated by the grinding process and clean the grinding chips. However, in the grinding process of magnetic materials, due to the strong magnetism of the material, the grinding chips are easily adsorbed to the surface of the workpiece to be ground, so the grinding fluid cannot play a cleaning role, resulting in difficulties in dimensional measurement and continued grinding. Over and over again, thick grinding chips and impurities accumulate on the surface of the workpiece to be ground. On the one hand, the force on the grinding wheel increases, the grinding speed decreases, and the corners of the magnetic steel are prone to cracking; on the other hand, the grinding heat surges and is not easy to diffuse, causing heat, which affects the size and shape and position tolerance of the inner hole of the grinding.

[0003] In the traditional internal hole grinding process, real-time observation is required when grinding the inner hole of magnetic materials, and whether the processing needs to be suspended is determined based on the residual chips. The surface of the workpiece to be ground must be cleaned before continuing the processing, which wastes a lot of time and limits the processing efficiency. Summary of the invention

[0004] The present application provides a chip removal assembly of an internal cylindrical grinder and an internal cylindrical grinder, with the purpose of providing a new chip removal solution to reduce the accumulation of residual grinding chips on the surface of a workpiece to be ground.

[0005] In a first aspect, a chip removal assembly for an internal grinding machine is provided, comprising:

[0006] A transfer support seat, the transfer support seat is installed on the internal grinding machine, and the transfer support seat is also used to install a grinding wheel;

[0007] The chip guide comprises a mounting portion and a surrounding portion connected to each other, wherein the mounting portion is fixed to the adapter support seat, the surrounding portion surrounds a portion of the outer circumference of the grinding wheel, and the remaining outer circumference of the grinding wheel is arranged opposite to the notch of the surrounding portion so that the grinding wheel passes through the notch and contacts the workpiece to be ground.

[0008] Compared with the prior art, the solution provided by this application includes at least the following beneficial technical effects:

[0009] During the grinding process, the chip guide may not contact the workpiece to be ground. The grinding chips generated by the grinding wheel on the workpiece to be ground can flow out of the chip guide under the guidance of the chip guide and be discharged from the workpiece to be ground, reducing the accumulation of residual grinding chips on the surface of the workpiece to be ground.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the surrounding portion includes a first end and a second end, the first end and the second end are used to be arranged close to the workpiece to be ground, the first end is located above the grinding wheel, the second end is located below the grinding wheel, and the distance between the first end and the grinding wheel is greater than the distance between the second end and the grinding wheel.

[0011] When the grinding wheel is grinding the workpiece to be ground, most of the grinding chips are splashed upward under the action of centrifugal force. Since the distance between the first end and the grinding wheel is large, it is helpful to reduce the possibility of grinding chips rebounding to the grinding wheel surface, and it is helpful to reduce the possibility of grinding chips being mixed between the grinding wheel and the workpiece to be ground, thereby improving the grinding effect. In addition, since the amount of grinding chips splashing downward is small and the distance between the second end and the grinding wheel is small, it is helpful to reduce the possibility of the chip guide interfering with the inner hole grinding.

[0012] In combination with the first aspect, in certain implementations of the first aspect, a line connecting the first end and the second end is located between a position of the grinding wheel for contacting the workpiece to be ground and an axis of the grinding wheel.

[0013] During the grinding process, the first end and the second end of the surrounding portion can be as close as possible to the inner hole wall of the workpiece to be ground, which is beneficial to increase the amount of grinding chips captured by the chip guide.

[0014] In combination with the first aspect, in certain implementations of the first aspect, projected along the axial direction of the grinding wheel, the radius of the circle defined by the projection position of the first end, the projection position of the position of the grinding wheel for contacting the workpiece to be ground, and the projection position of the second end, is smaller than the inner hole radius of the workpiece to be ground.

[0015] This can prevent the chip guide from getting too close to the workpiece to be ground, and prevent the chip guide from interfering with the workpiece to be ground.

[0016] In combination with the first aspect, in certain implementations of the first aspect, the surrounding portion also includes a third end portion, the third end portion is located on a side of the second end portion away from the workpiece to be ground, and the third end portion is located below the axis of the grinding wheel, and the distance between the second end portion and the axis of the grinding wheel is smaller than the distance between the third end portion and the axis of the grinding wheel.

[0017] The second end is located at a higher position relative to the third end. Thus, grinding chips can flow out of the chip guide member from the side of the chip guide member away from the workpiece to be ground under the effect of gravity.

[0018] In combination with the first aspect, in certain implementations of the first aspect, the adapter support seat has a support rod, the support rod extends along the axis of the grinding wheel, the mounting portion has a first adjustment through hole, the mounting portion is fixed to the support rod by a first locking piece passing through the first adjustment through hole, and the adjustable direction of the first adjustment through hole is perpendicular to the axis of the grinding wheel.

[0019] By adjusting the locking position of the first locking member on the first adjusting through hole, the height of the chip guide member relative to the grinding wheel can be adjusted to adapt to grinding wheels of different sizes.

[0020] In combination with the first aspect, in some implementations of the first aspect, the mounting portion further has a second adjustment through hole, the mounting portion is fixed to the support rod by a second locking member passing through the second adjustment through hole, and the adjustable direction of the second adjustment through hole is perpendicular to the axis of the grinding wheel; wherein,

[0021] The first locking member locks the position of the first adjusting through hole, and the second locking member locks the position of the second adjusting through hole, and the relative positions of the two are used to adjust the inclination angle of the surrounding axis of the surrounding part relative to the axis of the grinding wheel.

[0022] The chip guiding direction of the chip guide can be adjusted by adjusting the inclination angle of the surrounding axis of the surrounding portion relative to the axis of the grinding wheel. When the chip guiding direction of the chip guide is relatively gentle, the first end of the surrounding portion can be closer to the inner hole wall of the workpiece to be ground, which is conducive to increasing the amount of grinding chips captured by the chip guide. The chip guiding direction of the chip guide is relatively steep, which is conducive to allowing the grinding chips to flow out of the chip guide quickly.

[0023] In combination with the first aspect, in certain implementations of the first aspect, the material of the workpiece to be ground is a magnetic material, and the material of the chip guide is a non-magnetic material.

[0024] When the grinding wheel is grinding the workpiece to be ground, magnetic grinding chips may be generated. Since the chip guide is made of non-magnetic material, the magnetic grinding chips may not be adsorbed on the chip guide, which is conducive to reducing the accumulation of residual grinding chips on the surface of the workpiece to be ground.

[0025] In combination with the first aspect, in certain implementations of the first aspect, the chip guide is made of titanium alloy.

[0026] In combination with the first aspect, in certain implementations of the first aspect, the adapter support seat is used to be fixed to the grinding wheel frame interface of the internal cylindrical grinder.

[0027] This enables the connection between the original grinding wheel frame interface of the internal cylindrical grinder and the grinding wheel to be adapted to the internal cylindrical grinder.

[0028] In a second aspect, an internal cylindrical grinder is provided, comprising a grinding wheel and a chip removal assembly as described in any one of the implementations of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A partial structural diagram of an internal cylindrical grinder provided in an embodiment of the present application.

[0030] Figure 2 An assembly diagram of a grinding assembly, a grinding wheel and a workpiece to be ground provided in an embodiment of the present application.

[0031] Figure 3 A schematic structural diagram of a chip guide provided in an embodiment of the present application.

[0032] Figure 4 for Figure 2 Projected view of the grinding assembly, grinding wheel and workpiece to be ground shown.

[0033] Figure 5 A partial view of the chip guide and the grinding wheel provided in an embodiment of the present application.

[0034] Figure 6 A partial view of the chip guide and the support rod provided in an embodiment of the present application.

[0035] Explanation of the accompanying drawings: 1. Adapter support seat; 2. Chip guide; 3. Grinding wheel; 4. Workpiece to be ground; 11. Support rod; 12. First locking member; 13. Second locking member; 21. Mounting portion; 22. Surrounding portion; 23. First end portion; 24. Second end portion; 25. Third end portion; 26. Line connecting the first end portion and the second end portion; 27. Position of the grinding wheel for contacting the workpiece to be ground; 28. First adjustment through hole; 29. ​​Second adjustment through hole. DETAILED DESCRIPTION

[0036] The present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] Figure 1 The figure shows a partial structural diagram of an internal cylindrical grinder provided in an embodiment of the present application. The internal cylindrical grinder can be equipped with a grinding wheel 3, so that the internal cylindrical grinder can grind the inner hole of the workpiece to be ground by the grinding wheel 3. Figure 1 In the embodiment shown, the internal grinder also has a chip removal assembly provided in the embodiment of the present application. The chip removal assembly may include a transfer support seat 1 and a chip guide 2. The transfer support seat 1 is installed on the internal grinder to install the grinding wheel 3 to achieve the transfer between the internal grinder interface (such as the original grinding wheel frame interface of the internal grinder) and the grinding wheel 3. The transfer support seat 1 is also used to support the chip guide 2.

[0038] In some embodiments, the transfer function and support function of the transfer support seat 1 can be completed by a single part, or can be split into two parts: transfer and support. The transfer part is responsible for the interface with the original grinding wheel frame of the internal grinder to ensure the effective transfer of the whole device; the support part is responsible for supporting the working part of the whole device to ensure its stable installation.

[0039] like Figure 1 As shown, the chip guide 2 includes a connected mounting portion 21 and a surrounding portion 22. The mounting portion 21 is fixed to the adapter support seat 1. The surrounding portion 22 surrounds part of the outer periphery of the grinding wheel 3, and the remaining outer periphery of the grinding wheel 3 is arranged opposite to the notch of the surrounding portion 22, so that the grinding wheel 3 passes through the notch and contacts the workpiece to be ground. During the grinding process, the chip guide 2 may not contact the workpiece to be ground. The grinding chips generated by the grinding wheel 3 grinding the workpiece to be ground can flow out of the chip guide 2 under the guiding action of the chip guide 2, and be discharged from the workpiece to be ground, thereby reducing the accumulation of residual grinding chips on the surface of the workpiece to be ground.

[0040] In one possible scenario, the material of the workpiece to be ground is a magnetic material, and the material of the chip guide 2 is a non-magnetic material. When the grinding wheel 3 grinds the workpiece to be ground, magnetic grinding chips may be generated. Since the material of the chip guide 2 is a non-magnetic material, the magnetic grinding chips may not be adsorbed on the chip guide 2, which is conducive to reducing the accumulation of residual grinding chips on the surface of the workpiece to be ground. In one possible case, the material of the chip guide 2 can be titanium alloy.

[0041] Figure 2 An assembly diagram of a grinding assembly, a grinding wheel 3 and a workpiece 4 to be ground provided in an embodiment of the present application is shown. Figure 3 A schematic structural diagram of a chip guide provided in an embodiment of the present application is shown.

[0042] In some embodiments provided in this application, Figure 1 and Figure 2 The surrounding portion 22 may include a first end portion 23 and a second end portion 24, and the first end portion 23 and the second end portion 24 are used to be arranged close to the workpiece 4 to be ground. When the grinding wheel 3 is grinding the workpiece 4 to be ground, the grinding wheel 3 can extend into the inner hole 41 of the workpiece 4 to be ground. The portion of the surrounding portion 22 close to the workpiece 4 to be ground can also extend into the inner hole 41 of the workpiece 4 to be ground. In other words, the first end portion 23 and the second end portion 24 of the surrounding portion 22 can both extend into the inner hole 41 of the workpiece 4 to be ground.

[0043] The first end 23 is located above the grinding wheel 3, and the second end 24 is located below the grinding wheel 3 (in a possible scenario, both the above and the below can be relative to the ground). The distance between the first end 23 and the grinding wheel 3 is greater than the distance between the second end 24 and the grinding wheel 3, so that the distance between the first end 23 and the grinding wheel 3 can form a chip guide groove. When the grinding wheel 3 grinds the workpiece 4 to be ground, most of the grinding chips splash upward under the action of centrifugal force and enter the chip guide groove, so that the grinding chips can flow out of the chip guide groove under the guidance of the chip guide groove and be discharged from the workpiece 4 to be ground, reducing the accumulation of residual grinding chips on the surface of the workpiece to be ground.

[0044] Since the distance between the first end 23 and the grinding wheel 3 is relatively large, it is helpful to reduce the possibility of grinding chips rebounding to the surface of the grinding wheel 3, and it is helpful to reduce the possibility of grinding chips being mixed between the grinding wheel 3 and the workpiece 4 to be ground, thereby improving the grinding effect. In addition, since the amount of grinding chips splashing downward is small, the distance between the second end 24 and the grinding wheel 3 is relatively small, which is helpful to reduce the possibility of the chip guide 2 interfering with the grinding of the inner hole 41. Figure 5 A partial view of the grinding wheel 3 with the second end 24 is shown.

[0045] Combine the following Figures 2 to 4 , further describing the chip removal assembly provided in the embodiment of the present application. Among them, Figure 4 is along Figure 2 The projection view obtained by observing the axis of the grinding wheel 3 shown, wherein Figure 4 Specifically, projection views of the inner hole 41 of the workpiece 4 to be ground, the grinding wheel 3 , the first end 23 of the surrounding portion 22 , and the second end 24 of the surrounding portion 22 are shown.

[0046] exist Figures 2 to 4 In some of the embodiments shown, a line 26 connecting the first end 23 and the second end 24 of the surrounding portion 22 is located between a position 27 of the grinding wheel 3 for contacting the workpiece 4 to be ground and the axis of the grinding wheel 3. That is, during the grinding process, the first end 23 and the second end 24 of the surrounding portion 22 can be as close as possible to the wall of the inner hole 41 of the workpiece 4 to be ground, which is conducive to increasing the amount of grinding chips captured by the chip guide 2.

[0047] During the grinding process, the workpiece 4 to be ground can always be in a rotating state. In order to avoid interference between the chip guide 2 and the workpiece 4 to be ground, the position of the chip guide 2 relative to the grinding wheel 3 should satisfy that, along the axial direction of the grinding wheel 3, the projection position of the first end 23, the projection position of the position 27 of the grinding wheel 3 for contacting the workpiece 4 to be ground, and the projection position of the second end 24, the radius r1 of the circle defined by the three is smaller than the radius r2 of the inner hole 41 of the workpiece 4 to be ground. For details, refer to Figure 4 This can prevent the chip guide 2 from getting too close to the workpiece 4 to be ground.

[0048] In some embodiments, the outer contour of the chip guide 2 on the side close to the workpiece 4 to be ground may be an arc, and the radius of the arc r3≤r1, see Figure 4 That is to say, in a possible case, the circle defined by the above three can be a virtual circle, and the outer contour of the side of the chip guide 2 close to the workpiece 4 to be ground is located in the virtual circle.

[0049] In another possible case, the outer contour of the chip guide 2 on the side close to the workpiece 4 to be ground can be an arc, the radius of the arc r3 = r1, and the center of the arc is the same as the center of the circle defined by the above three. In other words, the outer contour of the chip guide 2 on the side close to the workpiece 4 to be ground can be a part of the circle defined by the above three.

[0050] like Figure 2 As shown, the flow direction of the grinding chips in the chip guide 2 can correspond to the extension direction of the chip guide 2. The extension direction of the chip guide 2 can be inclined relative to the axis of the grinding wheel 3 and extend downward from the workpiece 4 to be ground, thereby allowing the grinding chips in the chip guide 2 to flow out of the chip guide 2 toward the ground.

[0051] Continue to refer Figure 2 and Figure 3 In some embodiments provided in the present application, the surrounding portion 22 further includes a third end portion 25, the third end portion 25 is located on a side of the second end portion 24 away from the workpiece 4 to be ground, and the third end portion 25 is located below the axis of the grinding wheel 3. The line connecting the second end portion 24 and the third end portion 25 can indicate the extension direction of the chip guide 2. The distance between the second end portion 24 and the axis of the grinding wheel 3 is smaller than the distance between the third end portion 25 and the axis of the grinding wheel 3. In other words, the second end portion 24 is located at a higher position relative to the third end portion 25. As a result, the grinding chips can flow out of the chip guide 2 from the side of the chip guide 2 away from the workpiece 4 to be ground under the action of gravity.

[0052] In some embodiments provided in this application, Figure 1 As shown, the adapter support seat 1 has a support rod 11, and the support rod 11 can extend along the axis of the grinding wheel 3. The support rod 11 can be parallel to the axis of the grinding wheel 3. Figure 2 , Figure 3 and Figure 6 As shown, the mounting portion 21 has a first adjustment through hole 28 , and the mounting portion 21 is fixed to the support rod 11 by a first locking member 12 passing through the first adjustment through hole 28 , and the adjustable direction of the first adjustment through hole 28 is perpendicular to the axis of the grinding wheel 3 .

[0053] By adjusting the locking position of the first locking member 12 on the first adjustment through hole 28, the height of the chip guide member 2 relative to the grinding wheel 3 can be adjusted. When the first locking member 12 locks the end of the first adjustment through hole 28 farthest from the grinding wheel 3, the axis from the second end of the chip guide member 2 to the grinding wheel 3 can be relatively large, thereby being suitable for a grinding wheel 3 of a larger size; when the first locking member 12 locks the end of the first adjustment through hole 28 closest to the grinding wheel 3, the axis from the second end of the chip guide member 2 to the grinding wheel 3 can be relatively small, thereby being suitable for a grinding wheel 3 of a smaller size.

[0054] In some embodiments, the mounting portion 21 also has a second adjustment through hole 29, and the mounting portion 21 is fixed to the support rod 11 by a second locking member 13 passing through the second adjustment through hole 29, and the adjustable direction of the second adjustment through hole 29 is perpendicular to the axis of the grinding wheel 3; wherein, the first locking member 12 locks the position of the first adjustment through hole 28, and the second locking member 13 locks the position of the second adjustment through hole 29, and the relative position of the two is used to adjust the inclination angle of the surrounding axis of the surrounding portion 22 relative to the axis of the grinding wheel 3.

[0055] That is, by adjusting the locking position of the first locking member 12 on the first adjustment through hole 28 and the locking position of the second locking member 13 on the second adjustment through hole 29, the inclination angle of the line 26 connecting the second end 24 and the third end 25 of the surrounding portion 22 relative to the axis of the grinding wheel 3 can be adjusted. Figure 2 and Figure 6 As shown, the first adjustment hole 28 can be located on the side of the second adjustment hole 29 close to the workpiece 4 to be ground, and the first adjustment hole 28 and the second adjustment hole 29 are aligned, that is, the distance from the first adjustment hole 28 to the axis of the grinding wheel 3 is the same as the distance from the second adjustment hole 29 to the axis of the grinding wheel 3.

[0056] When the position where the first locking member 12 locks the first adjustment through hole 28 is higher than the position where the second locking member 13 locks the first adjustment through hole 28, the distance from the position where the first locking member 12 locks the first adjustment through hole 28 to the axis of the grinding wheel 3 is greater than the distance from the position where the second locking member 13 locks the first adjustment through hole 28 to the axis of the grinding wheel 3, then the surrounding axis of the surrounding portion 22 can be offset toward the axis of the grinding wheel 3, so that the chip guiding direction of the chip guide 2 is relatively gentle. When the chip guiding direction of the chip guide 2 is relatively gentle, the first end 23 of the surrounding portion 22 can be closer to the hole wall of the inner hole 41 of the workpiece 4 to be ground, which is conducive to increasing the amount of grinding chips captured by the chip guide 2.

[0057] When the position at which the first locking member 12 locks the first adjusting through hole 28 is lower than the position at which the second locking member 13 locks the first adjusting through hole 28, the distance from the position at which the first locking member 12 locks the first adjusting through hole 28 to the axis of the grinding wheel 3 is smaller than the distance from the position at which the second locking member 13 locks the first adjusting through hole 28 to the axis of the grinding wheel 3. Then, the surrounding axis of the surrounding portion 22 can be offset away from the axis of the grinding wheel 3, so that the chip guiding direction of the chip guide 2 is relatively steep, which is conducive to the rapid flow of grinding chips out of the chip guide 2.

[0058] The present application can solve the problem of grinding chips remaining on the surface to be processed during inner hole grinding by adding a chip guide around the grinding wheel, which is particularly effective for magnetic material grinding chips. The solution provided by the present application is conducive to improving the accuracy of dimensional measurement during inner hole grinding and avoiding constant shutdown for cleaning.

[0059] Although the present invention is disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined by the claims of the present invention.

Claims

1. A chip removal assembly for an internal grinding machine, characterized in that: include: A transfer support seat (1), the transfer support seat (1) is installed on the internal grinding machine, and the transfer support seat (1) is also used to install a grinding wheel (3); A chip guide (2), the chip guide (2) comprising a connected mounting portion (21) and a surrounding portion (22), the mounting portion (21) being fixed to the transfer support seat (1), the surrounding portion (22) surrounding a portion of the outer circumference of the grinding wheel (3), the remaining outer circumference of the grinding wheel (3) being arranged opposite to the notch of the surrounding portion (22), so that the grinding wheel (3) passes through the notch to contact the workpiece (4) to be ground; The surrounding portion (22) comprises a first end portion (23) and a second end portion (24), the first end portion (23) and the second end portion (24) being arranged close to the workpiece (4) to be ground, the first end portion (23) being located above the grinding wheel (3), the second end portion (24) being located below the grinding wheel (3), and the distance between the first end portion (23) and the grinding wheel (3) being greater than the distance between the second end portion (24) and the grinding wheel (3); A line (26) connecting the first end (23) and the second end (24) is located between a position (27) of the grinding wheel (3) for contacting the workpiece (4) to be ground and the axis of the grinding wheel (3); when projected along the axis of the grinding wheel (3), a radius r1 of a circle defined by the projection position of the first end (23), the projection position of the position (27) of the grinding wheel (3) for contacting the workpiece (4) to be ground, and the projection position of the second end (24) is smaller than a radius r2 of an inner hole of the workpiece (4) to be ground; The surrounding portion (22) further comprises a third end portion (25), the third end portion (25) being located on a side of the second end portion (24) away from the workpiece (4) to be ground, and the third end portion (25) being located below the axis of the grinding wheel (3), and the distance between the second end portion (24) and the axis of the grinding wheel (3) being smaller than the distance between the third end portion (25) and the axis of the grinding wheel (3).

2. The chip removal assembly according to claim 1, characterized in that: The transfer support seat (1) has a support rod, which extends along the axis of the grinding wheel (3); the mounting portion (21) has a first adjustment through hole (28); the mounting portion (21) is fixed to the support rod by a first locking member (12) passing through the first adjustment through hole (28); and the adjustable direction of the first adjustment through hole (28) is perpendicular to the axis of the grinding wheel (3).

3. The chip removal assembly according to claim 2, characterized in that: The mounting portion (21) further has a second adjustment through hole (29), and the mounting portion (21) is fixed to the support rod via a second locking member (13) passing through the second adjustment through hole (29), and the adjustable direction of the second adjustment through hole (29) is perpendicular to the axis of the grinding wheel (3); wherein, The first locking member (12) locks the position of the first adjustment through hole (28), and the second locking member (13) locks the position of the second adjustment through hole (29), and the relative position of the two is used to adjust the inclination angle of the surrounding axis of the surrounding portion (22) relative to the axis of the grinding wheel (3).

4. The chip removal assembly according to claim 1, characterized in that: The material of the workpiece (4) to be ground is a magnetic material, and the material of the chip guide (2) is a non-magnetic material.

5. The chip removal assembly according to claim 1, characterized in that: The material of the chip guide (2) is titanium alloy.

6. The chip removal assembly according to claim 1, characterized in that: The transfer support seat (1) is used to be fixed to the grinding wheel frame interface of the internal grinding machine.

7. An internal grinding machine, characterized in that: The internal cylindrical grinding machine comprises a grinding wheel (3) and a chip removal assembly as claimed in any one of claims 1 to 6.

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