Organic light-emitting display panel, manufacturing method thereof, and organic light-emitting display device

Abstract

The present application provides an organic light-emitting display panel, a manufacturing method thereof, and an organic light-emitting display device, wherein the organic light-emitting display panel includes: an array substrate, a color filter substrate, and a sealing layer; a first hole and / or a second hole are opened in the organic light-emitting layer and the TFT array layer of the array substrate, the first hole penetrates the light-shielding film layer of the TFT array layer, and the second hole penetrates the TFT array layer; a third hole and / or a fourth hole are opened in the color filter layer of the color filter substrate, and the third hole and the fourth hole both penetrate the color filter layer; the first hole and the third hole together constitute a blind hole structure, and the second hole and the fourth hole together constitute a blind hole structure. In the organic light-emitting display panel, the manufacturing method thereof, and the organic light-emitting display device provided in the present application, holes are respectively dug on the array substrate and the color filter substrate, and are uniformly filled with fill glue, so that the blind hole structure obtained has not only good filling effect but also high transmittance.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an organic light-emitting display panel, a manufacturing method thereof, and an organic light-emitting display device. Background Art

[0002] Compared to other display devices, organic light emitting displays (OLEDs) offer numerous advantages, including solid-state, self-luminous properties, wide viewing angles, a wide color gamut, fast response times, high luminous efficiency, high brightness, high contrast, ultra-thinness and lightness, low power consumption, a wide operating temperature range, the ability to produce large and flexible panels, and a simple manufacturing process. These advantages enable truly flexible displays and best meet the demands of future displays.

[0003] To improve display contrast and achieve a black-out effect, organic light-emitting display devices typically use polarizers (POLs). POLs effectively reduce the intensity of ambient light reflected on the screen. However, the light transmittance of POLs is generally only around 44%, requiring increased power consumption to achieve higher light output. Furthermore, polarizers are thick and brittle, making them unsuitable for the development of dynamic bending products.

[0004] To this end, the industry generally uses PFS technology (POL Free Solution) equipped with a color filter (CF) to replace the polarizer. The CF structure generally includes red (R), green (G), and blue (B) color resistance units and a black matrix (BM). The red (R), green (G), and blue (B) color resistance units need to correspond to the red, green, and blue pixel units of the OLED device respectively. The use of PFS technology not only greatly reduces the thickness of the functional layer, but also can increase the light output rate from 44% to 80%, greatly increasing the light output brightness, thereby reducing the power consumption of the OLED device.

[0005] Currently, organic light-emitting diodes (OLEDs) are developing towards higher screen-to-body ratios, with notch screens, waterdrop screens, and even full-screen displays emerging. To achieve this, the industry typically creates blind holes in the display panel to accommodate under-display cameras.

[0006] However, in actual applications, it was found that the transmittance of the blind holes of OLED products manufactured using PFS technology was very low due to the obstruction of the color resist unit, black matrix and electrode layer, which could not meet the transmittance requirements of the under-screen camera. Summary of the Invention

[0007] In view of this, the present application provides an organic light-emitting display panel, a manufacturing method thereof, and an organic light-emitting display device to solve the problem of low light transmittance of blind holes in OLED display panels manufactured based on PFS technology in the prior art.

[0008] In order to solve the above technical problems, the present invention provides an organic light emitting display panel, which includes: an array substrate, a color filter substrate and a sealing layer;

[0009] The array substrate and the color filter substrate are arranged opposite to each other, the sealing layer is arranged between the array substrate and the color filter substrate, and the array substrate and the color filter substrate are bonded and fixed through the sealing layer;

[0010] The array substrate comprises a first substrate, a TFT array layer, an organic light-emitting layer, and a thin film encapsulation layer stacked in sequence, wherein a first hole and / or a second hole are opened in the organic light-emitting layer and the TFT array layer, the first hole passes through the organic light-emitting layer and the TFT array layer and exposes the first substrate, the second hole passes through the light-shielding film layer of the organic light-emitting layer and the TFT array layer, and the thin film encapsulation layer fills the first hole and / or the second hole;

[0011] The color filter substrate comprises a second substrate, a color filter layer, and an organic protective layer stacked in sequence, wherein a third hole and / or a fourth hole are formed in the color filter layer, and both the third hole and the fourth hole penetrate the color filter layer and expose the second substrate;

[0012] Among them, the first hole and the third hole are positioned opposite to each other and together constitute a blind hole structure, and the second hole and the fourth hole are positioned opposite to each other and together constitute another blind hole structure. The blind hole structure is used to transmit light to cooperate with the camera to realize under-screen photography.

[0013] Optionally, in the organic light-emitting display panel, the sealing layer is formed by curing a filling glue, and the thickness of the sealing layer ranges from 1 μm to 20 μm.

[0014] Optionally, in the organic light-emitting display panel, the sealing layer fills the third hole and / or the fourth hole.

[0015] Optionally, in the organic light-emitting display panel, the organic protective layer fills the third hole and / or the fourth hole.

[0016] Optionally, in the organic light-emitting display panel, the first substrate and the second substrate are both made of transparent glass or transparent plastic, and the thermal deformation temperature of the first substrate is higher than 350°.

[0017] Accordingly, the present invention further provides a method for manufacturing an organic light-emitting display panel, the method comprising:

[0018] Step 1: providing a first substrate and a second substrate respectively, sequentially forming a TFT array layer and an organic light-emitting layer on the first substrate to obtain an array substrate, and forming a color filter layer on the second substrate to obtain a color filter substrate, wherein the color filter layer has at least one through hole, and each of the at least one through hole penetrates the color filter layer and exposes the second substrate;

[0019] Step 2: Laser drilling the organic light-emitting layer and the TFT array layer of the array substrate to form a first hole and / or a second hole, wherein the first hole is aligned with one of the through holes of the color filter layer, and the second hole is aligned with another through hole of the color filter layer;

[0020] Step 3: forming a thin film encapsulation layer on the organic light-emitting layer of the array substrate, wherein the thin film encapsulation layer fills the first hole and / or the second hole;

[0021] Step 4: coating a filling glue on the array substrate or the color filter substrate, and aligning and laminating the color filter substrate and the array substrate;

[0022] Step 5: Curing the filling glue to form a sealing layer.

[0023] Optionally, in the method for manufacturing the organic light-emitting display panel, when laser drilling is performed on the TFT array layer of the array substrate, the TFT array layer in the first hole area is completely removed so that the bottom of the first hole exposes the first substrate; or

[0024] When laser drilling is performed on the TFT array layer of the array substrate, part of the TFT array layer in the second hole region is removed, so that part of the TFT array layer remains at the bottom of the second hole.

[0025] Optionally, in the manufacturing method of the organic light-emitting display panel, before coating the filling glue on the array substrate or the color filter substrate and aligning and bonding the color filter substrate to the array substrate, after forming the color filter layer on the second substrate, it also includes: forming an organic protective layer on the color filter layer, the organic protective layer having at least one through hole, the through hole of the organic protective layer and the through hole of the color filter layer together constituting a third hole and / or a fourth hole.

[0026] Optionally, in the manufacturing method of the organic light-emitting display panel, before coating the filling glue on the array substrate or the color filter substrate and aligning and bonding the color filter substrate to the array substrate, after forming the color filter layer on the second substrate, it also includes: forming an organic protective layer on the color filter layer, and the organic protective layer fills the through holes of the color filter layer.

[0027] Accordingly, the present invention further provides an organic light-emitting display device, which includes the organic light-emitting display panel as described above.

[0028] In the organic light-emitting display panel, its manufacturing method, and organic light-emitting display device provided by the present invention, holes are dug on the array substrate and the color filter substrate respectively, and are uniformly filled with fill glue. The blind hole structure thus obtained has not only good filling effect but also high transmittance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0030] Figure 1 is a schematic structural diagram of an organic light emitting display panel according to a first embodiment of the present invention;

[0031] Figure 2 1 is a schematic structural diagram of an array substrate before a thin film encapsulation layer is formed according to a first embodiment of the present invention;

[0032] Figure 3 is a schematic structural diagram of the array substrate after the thin film encapsulation layer is formed according to the first embodiment of the present invention;

[0033] Figure 4 2 is a schematic structural diagram of a color filter substrate according to a first embodiment of the present invention;

[0034] Figure 5 is a schematic structural diagram of an organic light emitting display panel according to a second embodiment of the present invention;

[0035] Figure 6 is a schematic structural diagram of an array substrate before a thin film encapsulation layer is formed according to a second embodiment of the present invention;

[0036] Figure 7 is a schematic structural diagram of the array substrate after the thin film encapsulation layer is formed according to the second embodiment of the present invention;

[0037] Figure 8This is a structural diagram of the color filter substrate of the second embodiment of the present invention.

[0038] Figure 9 is a schematic structural diagram of a color filter substrate according to another embodiment of the present invention;

[0039] Figure 10 and Figure 11 FIG. 4 is a schematic structural diagram of an organic light emitting display panel according to another embodiment of the present invention. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures represent identical or similar structures, and thus their repeated description will be omitted.

[0041] [Example 1]

[0042] Please refer to Figure 1 , which is a schematic structural diagram of an organic light emitting display panel according to a first embodiment of the present invention. Figure 1 As shown, the organic light-emitting display panel 100 includes: an array substrate 110, a color filter substrate 120 and a sealing layer 130; the array substrate 110 and the color filter substrate 120 are arranged opposite to each other, the sealing layer 130 is arranged between the array substrate 110 and the color filter substrate 120, and the array substrate 110 and the color filter substrate 120 are bonded and fixed through the sealing layer 130; the array substrate 110 includes a first substrate 1, a TFT array layer 3, an organic light-emitting layer 5 and a thin film encapsulation layer 7 stacked in sequence, and a first hole 10a is opened in the organic light-emitting layer 5 and the TFT array layer 3, and the first hole 10a passes through the organic light-emitting layer 5 and the TFT array layer 3. The FT array layer 3 exposes the first substrate 1, and the thin film encapsulation layer 7 fills the first hole 10a; the color filter substrate 120 includes a second substrate 2, a color filter layer 4 and an organic protective layer 6 stacked in sequence, and a third hole 120a is opened in the organic protective layer 6 and the color filter layer 4. The third hole 20a passes through the organic protective layer 6 and the color filter layer 4 and exposes the second substrate 2. The sealing layer 130 fills the third hole 20a; wherein, the first hole 10a and the third hole 20a are located opposite each other and together constitute a blind hole structure (not shown in the figure), which is used to transmit light to cooperate with the camera to realize under-screen photography.

[0043] Specifically, the array substrate 110 includes a first substrate 1, a thin film transistor (TFT) array layer 3, an organic light-emitting layer 5 and a thin film encapsulation layer (TFE) 7 stacked in sequence. The organic light-emitting layer 5 includes a plurality of OLED pixel units (not shown in the figure), and the plurality of OLED pixel units include a red pixel unit R, a green pixel unit G and a blue pixel unit B. The red pixel unit R, the green pixel unit G and the blue pixel unit B are all arranged in an array.

[0044] The color film substrate 120 includes a second substrate 2, a color filter layer 4 and an organic protective layer 6 stacked in sequence. The color filter layer 4 includes a plurality of color resist units (not shown in the figure) and a black matrix (not shown in the figure). The plurality of color resist units include a red color resist unit R, a green color resist unit G and a blue color resist unit B. The red color resist unit R, the green color resist unit G and the blue color resist unit B are arranged in an array. The black matrix is ​​also called a light-shielding layer or a BM layer. The black matrix is ​​arranged between adjacent color resist units. The organic protective layer (i.e., the OC layer) 6 covers the black matrix and the color resist units.

[0045] The array substrate 110 and the color filter substrate 120 are arranged opposite each other. The film layers on the first substrate 1 (including the TFT array layer 3, the organic light-emitting layer 5, and the thin-film encapsulation layer 7) and the film layers on the second substrate 2 (including the color filter layer 4 and the organic protective layer 6) are both located between the first substrate 1 and the second substrate 2. The multiple color resist units on the color filter substrate 120 correspond one-to-one with the multiple OLED pixel units on the array substrate. The light transmittance of the black matrix in the color filter substrate 120 is almost zero, and the light emitted by the OLED pixel units can only pass through the multiple color resist units.

[0046] The sealing layer 130 between the array substrate 110 and the color filter substrate 120 is formed by curing a filler. The filler can be acrylic or epoxy resin. Preferably, the filler is a high-transmittance material, such as optically clear resin (OCR). Preferably, the thickness of the sealing layer 130 ranges from 1 to 20 μm.

[0047] Please refer to Figures 1 to 4 The first hole 10a on the array substrate 110 is directly opposite to the third hole 20a on the color filter substrate 120. After the array substrate 110 and the color filter substrate 120 are pressed and packaged, the first hole 10a and the third hole 20a together form a blind hole structure. The blind hole structure is located at the position indicated by the oval dotted line in the figure, and is used to pass light incident on the under-screen camera.

[0048] Since the thin film encapsulation layer 7 and the sealing layer 130 in the blind hole structure are both light-transmitting, and the light-shielding film layers in the blind hole structure have been removed, it can project light and has a high transmittance, and can cooperate with the under-screen camera to realize under-screen photography.

[0049] Accordingly, the present invention also provides a method for manufacturing an organic light emitting display panel. Figures 1 to 4 , the manufacturing method of the organic light emitting display panel includes:

[0050] Step 1: Provide a first substrate 1 and a second substrate 2, respectively. Form a TFT array layer 3 and an organic light-emitting layer 5 on the first substrate 1 in sequence to obtain an array substrate 110. Form a color filter layer 4 and an organic protective layer 6 on the second substrate 2 in sequence to obtain a color filter substrate 120. A third hole 20 a is formed in the organic protective layer 6 and the color filter layer 4. The third hole 20 a penetrates the organic protective layer 6 and the color filter layer 4 and exposes the second substrate 2.

[0051] Step 2: Laser drilling is performed on the organic light emitting layer 5 and the TFT array layer 3 of the array substrate 110 to form a first hole 10 a , wherein the first hole 10 a is directly opposite to the third hole 20 a ;

[0052] Step 3: forming a thin film encapsulation layer 7 on the organic light-emitting layer 5 of the array substrate 110, wherein the thin film encapsulation layer 7 fills the first hole 10a;

[0053] Step 4: coating a filling glue on the array substrate 110 or the color filter substrate 120 , and aligning and laminating the color filter substrate 120 with the array substrate 110 ;

[0054] Step 5: Curing the filling glue to form a sealing layer 130 .

[0055] Specifically, when laser drilling is performed on the organic light-emitting layer 5 of the array substrate 110, the organic light-emitting layer 5 in the region of the first hole 10a is completely removed. When laser drilling is performed on the TFT array layer 3 of the array substrate 110, the TFT array layer 3 in the region of the first hole 10a is completely removed, so that the bottom of the first hole 10a is exposed to the first substrate 1. Figure 2 As shown, there is no organic light emitting layer 5 and TFT array layer 3 at the hole position of the array substrate 110 .

[0056] After the holes in the array substrate 110 are dug, a thin film encapsulation layer 7 is formed on the organic light emitting layer 5 . The thin film encapsulation layer 7 covers the organic light emitting layer 5 and fills the first hole 10 a .

[0057] The process of preparing the color filter substrate 120 includes: first, providing a second substrate 2; then, forming a color filter layer 4 on the second substrate 2 through a photolithography process, wherein the color filter layer 4 has a through hole, the through hole is located at the position of the blind hole and its bottom exposes the second substrate 2; then, forming an organic protective layer 6 on the color filter layer 4 and the exposed second substrate 2 through a photolithography process, wherein the organic protective layer 6 also forms a through hole at the position of the blind hole, and the through hole of the color filter layer 4 is connected to the through hole of the organic protective layer 6 to form a third hole 20a. Figure 4 As shown, there is no color filter layer 4 and organic protective layer 6 at the hole position of the color filter substrate 120.

[0058] In this embodiment, the through-holes in the color filter layer 4 and the organic protective layer 6 are directly patterned during a photolithography process. In other embodiments, the organic protective layer 6 may not have a through-hole. The through-hole in the color filter layer 4 is the third hole 20a, and the organic protective layer 6 fills the third hole 20a. In this manner, the color filter layer 4 is absent from the hole-forming location in the color filter substrate 120, but the organic protective layer 6 is present.

[0059] After the array substrate 110 and the color filter substrate 120 are manufactured, they are packaged and pressed (i.e., aligned and bonded). Before aligning and bonding the color filter substrate 120 to the array substrate 110, a sealant (i.e., Dam glue) and a filler (i.e., filler) need to be applied to the color filter substrate 120 or the array substrate 110. The application locations of the Dam glue and filler are selected based on the specific positions of the color filter substrate 120 and the array substrate 110 during the bonding process.

[0060] In this embodiment, since the color filter substrate 120 is located below the array substrate 110 during the lamination process, the DAM glue and fill glue are applied to the color filter substrate 120. If the color filter substrate 120 is located above the array substrate 110 during the lamination process, the DAM glue and fill glue should be applied to the array substrate 110.

[0061] In this embodiment, Dam glue is first applied to the edge of the color filter substrate 120, and then fill glue is applied to the color filter substrate 120. Then, the color filter substrate 120 and the array substrate 110 are aligned and bonded. After that, the fill glue is cured to form a sealing layer 130, and the Dam glue is also cured to form a sealing frame.

[0062] At this point, the organic light-emitting display panel 100 is formed. During the manufacturing process of the organic light-emitting display panel 100, since the gap between the array substrate 110 and the color filter substrate 120 and the third hole 20a are filled with filler, a uniform filling effect is achieved. In addition, the sealing layer 130 formed by curing the filler connects the array substrate 110 and the color filter substrate 120 of the organic light-emitting display panel 100, and the sealing frame formed by curing the Dam glue connects the edges of the array substrate 110 and the edges of the color filter substrate 120, thereby achieving effective packaging.

[0063] The manufacturing method of the organic light-emitting display panel provided in this embodiment is applicable not only to hard screens but also to flexible screens.

[0064] When the organic light emitting display panel 100 is a hard screen, the first substrate 1 and the second substrate 2 are both transparent hard substrates, such as glass substrates. That is, the first substrate 1 and the second substrate 2 are both made of transparent glass.

[0065] When the organic light-emitting display panel 100 is a flexible screen, both the first substrate 1 and the second substrate 2 are transparent flexible substrates, such as plastic substrates. Specifically, both the first substrate 1 and the second substrate 2 are made of transparent plastic, which can be made of materials such as PEN, PET, COP, and PI. Preferably, the thermal deformation temperature of the first substrate 1 is greater than 350°. This ensures that the plastic film substrate of the array substrate 110 can withstand high-temperature manufacturing processes.

[0066] Accordingly, the present invention further provides an organic light emitting display device, which includes the organic light emitting display panel 100 as described above. Please refer to the above for details, which will not be repeated here.

[0067] [Example 2]

[0068] Please refer to Figure 3 , which is a schematic structural diagram of an organic light emitting display panel according to the second embodiment of the present invention. Figure 3As shown, the organic light-emitting display panel 200 includes: an array substrate 210, a color filter substrate 220 and a sealing layer 230; the array substrate 210 and the color filter substrate 220 are arranged opposite to each other, the sealing layer 230 is arranged between the array substrate 210 and the color filter substrate 220, and the array substrate 210 and the color filter substrate 220 are bonded and fixed through the sealing layer 230; the array substrate 210 includes a first substrate 1, a TFT array layer 3, an organic light-emitting layer 5 and a thin film encapsulation layer 7 stacked in sequence, and a second hole 10b is opened in the organic light-emitting layer 5 and the TFT array layer 3, and the second hole 10b passes through the organic light-emitting layer 10b. The light-shielding film layer 5 and the TFT array layer 3, the thin film encapsulation layer 7 fills the second hole 10b; the color film substrate 220 includes a second substrate 2, a color filter layer 4 and an organic protective layer 6 stacked in sequence, and a fourth hole 20b is opened in the organic protective layer 6 and the color filter layer 4, the fourth hole 20b passes through the organic protective layer 6 and the color filter layer 4 and exposes the second substrate 2, and the sealing layer 230 fills the fourth hole 20b; wherein, the second hole 10b and the fourth hole 20b are opposite to each other and together constitute a blind hole structure (not shown in the figure), and the blind hole structure is used to cooperate with the camera to realize under-screen photography.

[0069] Specifically, since the light-shielding film layers in the blind hole structure have been removed, and the thin film encapsulation layer 7 and the sealing layer 230 in the blind hole structure are both light-transmitting, the blind hole structure has a high transmittance and can cooperate with the camera to realize under-screen photography.

[0070] Accordingly, the present invention also provides a method for manufacturing an organic light emitting display panel. Figures 5 to 8 , the manufacturing method of the organic light emitting display panel includes:

[0071] Step 1: Provide a first substrate 1 and a second substrate 2, respectively. Form a TFT array layer 3 and an organic light-emitting layer 5 on the first substrate 1 in sequence to obtain an array substrate 210. Form a color filter layer 4 and an organic protective layer 6 on the second substrate 2 in sequence to obtain a color filter substrate 220. A fourth hole 20 b is defined in the organic protective layer 6 and the color filter layer 4. The fourth hole 20 b penetrates the organic protective layer 6 and the color filter layer 4 and exposes the second substrate 2.

[0072] Step 2: Laser drilling is performed on the organic light emitting layer 5 and the TFT array layer 3 of the array substrate 210 to form a second hole 10 b , wherein the second hole 10 b is directly opposite to the fourth hole 20 b ;

[0073] Step 3: forming a thin film encapsulation layer 7 on the organic light-emitting layer 5 of the array substrate 210, wherein the thin film encapsulation layer 7 fills the second hole 10b;

[0074] Step 4: Apply filling glue on the array substrate 210 or the color filter substrate 220 , and align and bond the color filter substrate 220 to the array substrate 210 ;

[0075] Step 5: Curing the filling glue to form a sealing layer 230 .

[0076] Specifically, when laser drilling is performed on the organic light-emitting layer 5 of the array substrate 210 , the organic light-emitting layer 5 in the region of the second hole 10 b is completely removed.

[0077] When laser drilling is performed on the TFT array layer 3 of the array substrate 210, the TFT array layer in the second hole 10b area is partially removed (i.e., the light shielding film layer of the TFT array layer 3 is removed), so that a portion of the TFT array layer remains at the bottom of the second hole 10b. Figure 6 As shown, the hole positions of the array substrate 210 do not have the light shielding film layers of the organic light emitting layer 5 and the TFT array layer 3 .

[0078] The process of preparing the color filter substrate 220 includes: first, providing a second substrate 2; then, forming a color filter layer 4 on the second substrate 2 through a photolithography process, wherein the color filter layer 4 has a through hole, the through hole is located at the position of the blind hole and its bottom exposes the second substrate 2; then, forming an organic protective layer 6 on the color filter layer 4 and the exposed second substrate 2 through a photolithography process, wherein the organic protective layer 6 also forms a through hole at the position of the blind hole, and the through hole of the color filter layer 4 is connected to the through hole of the organic protective layer 6 to form a fourth hole 20b. Figure 8 As shown, there is no color filter layer 4 and organic protective layer 6 at the hole position of the color filter substrate 220.

[0079] In this embodiment, the through-holes in the color filter layer 4 and the organic protective layer 6 are directly patterned during a photolithography process. In other embodiments, the organic protective layer 6 may not have a through-hole. The through-hole in the color filter layer 4 is the fourth hole 20b, and the organic protective layer 6 fills the fourth hole 20b. In this manner, the color filter layer 4 is absent from the hole-digging position of the color filter substrate 220, but the organic protective layer 6 is present.

[0080] The difference between this embodiment and embodiment 1 is that part of the TFT array layer 3 is retained at the hole-drilling position of the array substrate 210, and only the light-shielding film layer of the TFT array layer 3 is removed during laser drilling, rather than completely removing the TFT array layer 3.

[0081] Accordingly, the present invention further provides an organic light emitting display device, which includes the organic light emitting display panel 200 described above. Please refer to the above for details, which will not be repeated here.

[0082] In the organic light emitting display panels provided in embodiment 1 and embodiment 2, only one blind hole structure is provided. In other embodiments, the organic light emitting display panel may also be provided with two different blind hole structures (ie, the blind hole structure of embodiment 1 and the blind hole structure of embodiment 2).

[0083] In the manufacturing methods of the organic light-emitting display panels provided in Embodiments 1 and 2, the frame-sealing adhesive (i.e., Dam glue) and the filling adhesive (i.e., fill glue) are both applied to the color filter substrate. In other embodiments, the frame-sealing adhesive (i.e., Dam glue) and the filling adhesive (i.e., fill glue) may also be applied to the array substrate. Depending on the specific position of the array substrate and the color filter substrate during lamination, the Dam glue and the fill glue may be applied to the organic protective layer of the color filter substrate or to the thin-film encapsulation layer of the array substrate.

[0084] In other embodiments, when preparing the color filter substrate, only through holes corresponding to the blind hole structure are provided in the color filter layer 4, and there is no need to provide corresponding through holes in the organic protective layer 6. Figure 9 As shown, in other embodiments, there is no color filter layer 4 at the hole position of the color filter substrate 320, and the through hole 20c corresponding to the hole position is filled with the organic protective layer 6.

[0085] like Figure 10 As shown, in other embodiments, the organic light-emitting display panel 300 using the color film substrate 320 includes: an array substrate 110, a color film substrate 320 and a sealing layer 130, and the first hole 10a of the array substrate 110 is positioned opposite to the through hole 20c of the color film substrate 320 and together constitutes a blind hole structure.

[0086] like Figure 11 As shown, in other embodiments, an organic light-emitting display panel 400 using the color filter substrate 320 includes an array substrate 210, a color filter substrate 320, and a sealing layer 230. The second hole 10b of the array substrate 210 is aligned with the through hole 20c of the color filter substrate 320 and together form a blind hole structure.

[0087] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0088] The above figures are merely schematic illustrations of the organic light-emitting display panel provided by the present invention. For the sake of clarity, the shapes and numbers of components in the above figures are simplified, and some components are omitted. Persons skilled in the art may make variations based on actual needs. Such variations are within the scope of the present invention and are not detailed here.

[0089] In summary, the organic light-emitting display panel, its manufacturing method, and organic light-emitting display device provided by the present invention respectively dig holes on the array substrate and the color filter substrate, and use fill glue to achieve uniform filling. The resulting blind hole structure not only has good filling effect but also high transmittance.

[0090] The above content is a further detailed description of the present application in conjunction with specific preferred embodiments, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, they can make several simple deductions or substitutions without departing from the concept of the present application, which should be considered to fall within the scope of protection of the present application.

Claims

1. An organic light emitting display panel, characterized in that: include: Array substrate, color filter substrate and sealing layer; The array substrate and the color filter substrate are arranged opposite to each other, the sealing layer is arranged between the array substrate and the color filter substrate, and the array substrate and the color filter substrate are bonded and fixed through the sealing layer; The array substrate comprises a first substrate, a TFT array layer, an organic light-emitting layer, and a thin film encapsulation layer stacked in sequence, wherein a first hole and / or a second hole are opened in the organic light-emitting layer and the TFT array layer, the first hole passes through the organic light-emitting layer and the TFT array layer and exposes the first substrate, the second hole passes through the light-shielding film layer of the organic light-emitting layer and the TFT array layer, and the thin film encapsulation layer fills the first hole and / or the second hole; The color filter substrate includes a second substrate, a color filter layer, and an organic protective layer stacked in sequence. The color filter layer is provided with a third hole and / or a fourth hole, both of which penetrate the color filter layer and expose the second substrate. The organic protective layer is provided on the color filter layer and completely fills the third hole and / or the fourth hole of the color filter layer. Among them, the first hole and the third hole are positioned opposite to each other and together constitute a blind hole structure, and the second hole and the fourth hole are positioned opposite to each other and together constitute another blind hole structure. The blind hole structure is used to transmit light to cooperate with the camera to realize under-screen photography.

2. The organic light emitting display panel according to claim 1, wherein: The sealing layer is formed by curing the filling glue, and the thickness of the sealing layer ranges from 1 μm to 20 μm.

3. The organic light emitting display panel according to claim 1, wherein: The sealing layer fills the third hole and / or the fourth hole.

4. The organic light emitting display panel according to claim 1, wherein: The organic protection layer fills the third hole and / or the fourth hole.

5. The organic light emitting display panel according to claim 1, wherein: The first substrate and the second substrate are both made of transparent glass or transparent plastic, and the thermal deformation temperature of the first substrate is higher than 350°.

6. A method for manufacturing an organic light emitting display panel, characterized in that: include: Step 1: providing a first substrate and a second substrate respectively, sequentially forming a TFT array layer and an organic light-emitting layer on the first substrate to obtain an array substrate, and forming a color filter layer on the second substrate to obtain a color filter substrate, wherein the color filter layer has at least one through hole, and each of the at least one through hole penetrates the color filter layer and exposes the second substrate; Step 2: Laser drilling the organic light-emitting layer and the TFT array layer of the array substrate to form a first hole and / or a second hole, wherein the first hole is aligned with one of the through holes of the color filter layer, and the second hole is aligned with another through hole of the color filter layer; Step 3: forming a thin film encapsulation layer on the organic light-emitting layer of the array substrate, wherein the thin film encapsulation layer fills the first hole and / or the second hole; forming an organic protective layer on the color filter layer, wherein the organic protective layer fills the through holes of the color filter layer; Step 4: coating a filling glue on the array substrate or the color filter substrate, and aligning and laminating the color filter substrate and the array substrate; Step 5: Curing the filling glue to form a sealing layer.

7. The method for manufacturing an organic light emitting display panel according to claim 6, wherein: When laser drilling is performed on the TFT array layer of the array substrate, the TFT array layer in the first hole region is completely removed so that the bottom of the first hole exposes the first substrate; or When laser drilling is performed on the TFT array layer of the array substrate, part of the TFT array layer in the second hole region is removed, so that part of the TFT array layer remains at the bottom of the second hole.

8. The method for manufacturing an organic light emitting display panel according to claim 6, wherein: Before applying filling glue on the array substrate or the color filter substrate and aligning and bonding the color filter substrate to the array substrate, and after forming a color filter layer on the second substrate, the method further includes: forming an organic protective layer on the color filter layer, the organic protective layer having at least one through hole, the through hole of the organic protective layer and the through hole of the color filter layer together constituting a third hole and / or a fourth hole.

9. An organic light emitting display device, characterized in that: include: The organic light emitting display panel according to any one of claims 1 to 5.

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