Direct writing exposure device and control method thereof

Abstract

The present invention discloses a direct writing exposure device and a control method of the direct writing exposure device, wherein a first guide rail and a second guide rail extending in a length direction and arranged in a width direction are provided on a base, a first upper and lower plate station, a first alignment station, a first exposure station, a second alignment station and a second upper and lower plate station are defined in sequence along the direction of the first guide rail, and a third upper and lower plate station, a third alignment station, a second exposure station, a fourth alignment station and a fourth upper and lower plate station are defined in sequence along the direction of the second guide rail; the first workpiece table and the second workpiece table are both provided on the first guide rail, the third workpiece table and the fourth workpiece table are both provided on the second guide rail, the four workpiece tables are reciprocated by a driving device to switch between the respective corresponding stations, and a conveying and flipping system is used to flip the substrate to obtain the surface to be exposed of the substrate. The direct writing exposure device integrates four workpiece tables, and realizes the completion of the front and back exposure of the substrate in the same exposure process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a direct-write exposure device and a control method of the direct-write exposure device. Background Art

[0002] Compared with traditional exposure equipment, direct writing exposure equipment saves the process of making film negatives or masks, has a simpler exposure production process flow, and higher alignment accuracy. The laser direct writing exposure equipment currently on the market can be divided into single worktable and double worktable structures according to the number of worktables.

[0003] The typical workflow of direct writing exposure equipment includes: S1, placing the film on the workpiece stage, S2, grabbing the alignment mark target information of the substrate, S3, preparing exposure data, S4, exposing by the exposure system, and S5, taking the film from the workpiece stage.

[0004] The time required for a single-stage direct-write exposure device to complete a complete exposure cycle is the serial superposition of the time required for each of S1 to S5. The dual-stage direct-write exposure device can realize that when one stage is performing exposure operations, the other stage is simultaneously performing tasks such as loading and unloading substrates, marking target information, and preparing exposure data, which greatly reduces the work cycle and improves the production efficiency of single-chip production. However, whether it is a single-stage exposure device or a dual-stage exposure device, it is impossible to expose the front and back sides of the substrate in the same exposure process.

[0005] In order to realize the automated exposure of the front and back sides of the substrate, the common solution in the industry is to match two direct-write exposure devices with an automated production conveying device. The upstream exposure device exposes the front side of the substrate, and the substrate with the exposed front side is transported to the downstream exposure device through the conveying device, and then the back side of the substrate is exposed. Therefore, the entire automated production line will occupy a large area and have low production efficiency. In addition, since the direct-write exposure equipment and the automated production conveying equipment are combined and used later, the sealing of the entire line cannot be well guaranteed, and lines with high cleanliness requirements may cause pollution and affect product quality. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present invention is to provide a direct writing exposure device, which can realize the exposure of the front and back surfaces of the substrate in the same exposure process, improve the production efficiency, and can save a lot of floor space. The production line has good sealing performance and ensures the cleanliness of production.

[0007] Another object of the present invention is to provide a control method for a direct-write exposure device.

[0008] In order to achieve the above-mentioned purpose, the direct-write exposure equipment of the first aspect of the present invention comprises: a base, on which a first guide rail and a second guide rail extending in the length direction and arranged in the width direction are provided, and a first upper and lower plate station, a first alignment station, a first exposure station, a second alignment station and a second upper and lower plate station are sequentially defined along the direction of the first guide rail, and a third upper and lower plate station, a third alignment station, a second exposure station, a fourth alignment station and a fourth upper and lower plate station are sequentially defined along the direction of the second guide rail; a first workpiece table and a second workpiece table, the first workpiece table and the second workpiece table are both arranged on the first guide rail, and the first workpiece table is provided on the second workpiece table. The workpiece stage is suitable for reciprocating along the first guide rail to switch between the first upper and lower plate station, the first alignment station and the first exposure station, and the second workpiece stage is suitable for reciprocating along the first guide rail to switch between the second upper and lower plates, the second alignment station and the first exposure station; a third workpiece stage and a fourth workpiece stage, the third workpiece stage and the fourth workpiece stage are both arranged on the second guide rail, the third workpiece stage is suitable for reciprocating along the second guide rail to switch between the third upper and lower plate station, the third alignment station and the second exposure station, and the fourth workpiece stage is suitable for reciprocating along the first guide rail The second guide rail reciprocates to switch between the fourth upper and lower plate station, the fourth alignment station and the second exposure station; a driving device, the driving device is used to drive the first workpiece stage and the second workpiece stage to move along the first guide rail, and is used to drive the third workpiece stage and the fourth workpiece stage to move along the second guide rail; a first alignment system, a second alignment system and an exposure system, the first alignment system is set corresponding to the first alignment station and the third alignment station, and is used to perform target alignment on the substrates on the first alignment station and the third alignment station, and the second alignment system corresponds to the second alignment station and the fourth alignment station. The fourth alignment station is configured to perform target alignment on the substrates on the second alignment station and the fourth alignment station, and the exposure system is configured corresponding to the first exposure station and the second exposure station, and is configured to perform exposure processing on the substrates on the first exposure station and the second exposure station; a conveying and flipping system, which is connected to the base and is located on one side of the base along the width direction, is configured to flip the exposed substrate on the first worktable or the third worktable to the unexposed side, and transfer the flipped substrate to the second conveying device on the side where the second worktable or the fourth worktable is located.

[0009] According to the direct writing exposure equipment of the embodiment of the present invention, four worktables are used. The driving device enables the four worktables to move back and forth between the corresponding different workstations. The four worktables can work synchronously and in parallel, and through the integrated conveying and flipping system, the substrate that has been exposed on the first worktable or the third worktable is flipped to the unexposed side, and the flipped substrate is transferred to the second worktable or the side of the fourth worktable, so that the front and back exposure of the substrate can be automated, which improves the production efficiency. Compared with the use of two exposure devices, it occupies a small area, and the same exposure system is used to produce on the same device, which is more conducive to ensuring accuracy and stability. In addition, the equipment integrates a conveying and flipping system, and does not need to be combined with other automated production and conveying equipment at a later stage, which can improve the sealing and cleanliness of the production line and ensure product quality.

[0010] In some embodiments, the conveying and flipping system includes: a first conveying device, a flipping device, and a second conveying device arranged along the length direction of the base, the first conveying device is used to convey the substrate on the first worktable or the third worktable that has been exposed on the front side to the flipping device, the flipping device flips the substrate to obtain a substrate to be exposed on the back side, and conveys the substrate to be exposed on the back side to the second conveying device, and the second conveying device outputs the substrate to be exposed on the back side to the conveying station on the side where the second worktable or the fourth worktable is located. Thus, support can be provided for the front exposure and the back exposure of the substrate, without the need for two exposure systems, and without the need for the subsequent combination of additional automated production and conveying equipment, which can not only save a great deal of floor space, but also improve the sealing and cleanliness of the production line to ensure product quality.

[0011] In some embodiments, the exposure system includes: a first gantry mechanism and a second gantry mechanism, the first gantry mechanism and the second gantry mechanism are arranged in parallel on the base and straddle the first guide rail and the second guide rail, and the first gantry mechanism and the second gantry mechanism are both provided with a third guide rail along the width direction of the base; a mounting seat, both ends of the mounting seat are mounted on the first gantry mechanism and the second gantry mechanism; an exposure light source, the exposure light source is arranged on the mounting seat, and the exposure light source emits light toward the first exposure station and the second exposure station; a driving member, the driving member is arranged on the first gantry mechanism or the second gantry mechanism, and is used to drive the mounting seat to reciprocate along the third guide rail, and the movement range of the exposure light source can cover the size range of the exposure pattern of the substrate.

[0012] By setting two gantry mechanisms and a third guide rail, the exposure system can be moved in the width direction through the third guide rail, which can ensure the exposure system motion positioning accuracy and mechanical mechanism rigidity, and improve the actual exposure accuracy and working stability and reliability of the whole equipment. In addition, the use of guide rails to move the exposure system has a simple structure and is easier to maintain.

[0013] In some embodiments, the exposure light source includes a plurality of exposure units, and the plurality of exposure units are arranged in a plurality of rows along the length direction of the base. Providing a plurality of exposure units in the length direction can improve exposure accuracy.

[0014] In some embodiments, the first alignment system includes: a first camera unit, which is disposed on the first gantry mechanism and is used to obtain a picture of the substrate at the first alignment station or the third alignment station, and obtain front target position information based on the picture; a first driving unit, which is used to drive the first camera unit to move along the width direction of the base; and a first lighting unit, which is disposed on the first gantry mechanism.

[0015] In some embodiments, the second alignment system includes: a second camera unit, which is disposed on the second gantry mechanism and is used to obtain a picture of the substrate at the second alignment station or the fourth alignment station, and obtain reverse target position information based on the picture; a second driving unit, which is used to drive the second camera unit to move along the width direction of the base; and a second lighting unit, which is disposed on the second gantry mechanism.

[0016] By setting up two groups of alignment systems, each group of alignment systems includes one or more groups of camera units and lighting units. By acquiring images of the front and back sides of the substrate, the relative position of the target on the substrate can be obtained, so that the target can be captured quickly and accurately, the versatility and alignment accuracy are improved, the failure rate is reduced, and it is beneficial to improve the stability of equipment operation and improve production efficiency at the same time.

[0017] In some embodiments, the first workpiece stage, the second workpiece stage, the third workpiece stage, and the fourth workpiece stage all include a first adsorption structure, and the first adsorption structure is used to adsorb a substrate placed on the workpiece stage.

[0018] In some embodiments, the first conveying device, the flipping device and the second conveying device are all located on one side of the base and are arranged end to end along the length direction of the base. The conveying flipping system integrated on one side of the base can flip the substrate on the first worktable or the third worktable that has completed one side of the exposure to the unexposed side, and transfer the flipped substrate to one side of the second worktable or the fourth worktable, effectively improving the production efficiency of substrate exposure.

[0019] In some embodiments, a second adsorption structure is disposed on both the first conveying device and the second conveying device.

[0020] In some embodiments, the flipping device includes: a flip shaft, one end of which is rotatably connected to the base; a flip plate, which is arranged on the flip shaft; and a flip driving member, which is used to drive the flip shaft to rotate, so as to drive the flip plate to flip 180°, so as to flip the substrate to the back side and flip it onto the second conveying device, so that the substrate can be exposed on the front and back sides in the same set of direct writing exposure equipment.

[0021] In some embodiments, the direct writing exposure equipment further includes: a first grasping device, the first grasping device is used to grasp the substrate to be exposed and place it on the first worktable or the third worktable when the first worktable is located at the first upper and lower plate station or the third worktable is located at the third upper and lower plate station, or grasp the substrate on one side of the first worktable or the third worktable that has been exposed to the first conveying device; a second grasping device, the second grasping device is used to grasp the other side of the substrate to be exposed on the second conveying device and place it on the second worktable or the fourth worktable when the second worktable is located at the second upper and lower plate station or the fourth worktable is located at the fourth upper and lower plate station, or grasp the other side of the substrate on the second worktable or the fourth worktable that has been exposed. Thereby realizing the automated loading and unloading operation of the four worktables.

[0022] In some embodiments, the first grabbing device includes: a third gantry mechanism, the third gantry mechanism is straddled on the base and the first conveying device, and the third gantry mechanism is arranged corresponding to the first upper and lower plate station and the third upper and lower plate station; a first grabbing mechanism and a second grabbing mechanism, the first grabbing mechanism and the second grabbing mechanism are both arranged on the third gantry mechanism; a first left and right driving member, the first left and right driving member is arranged on the third gantry mechanism, and is used to drive the first grabbing mechanism and the second grabbing mechanism to move along the width direction of the base; a first up and down driving member, the first up and down driving member is arranged on the third gantry mechanism, and is used to drive the first grabbing mechanism and the second grabbing mechanism to move along the height direction of the third gantry mechanism.

[0023] In some embodiments, the second grabbing device includes: a fourth gantry mechanism, the fourth gantry mechanism is straddled on the base and the second conveying device, and the fourth gantry mechanism is arranged corresponding to the second upper and lower plate station and the fourth upper and lower plate station; a third grabbing mechanism and a fourth grabbing mechanism, and the third grabbing mechanism and the fourth grabbing mechanism are both arranged on the fourth gantry mechanism; a second left and right driving member, the second left and right driving member is arranged on the fourth gantry mechanism, and is used to drive the third grabbing mechanism and the fourth grabbing mechanism to move along the width direction of the base; a second up and down driving member, the second up and down driving member is arranged on the fourth gantry mechanism, and is used to drive the third grabbing mechanism and the fourth grabbing mechanism to move along the height direction of the fourth gantry mechanism.

[0024] By setting up a grabbing device, it is possible to replace manual labor in monotonous, repetitive or heavy physical labor, realize mechanization and automation of production, organize production with high intensity and efficiency, reduce labor costs, eliminate safety hazards of manual operation, and avoid unnecessary production safety accidents.

[0025] In some embodiments, the direct-writing exposure equipment also includes: a plate-in conveying device, which is arranged near the first upper and lower plate station of the base, and is used to convey the substrate to be exposed on the front side so that the first grasping device can grasp it to the first workpiece table or the third workpiece table; a plate-out conveying device, which is arranged near the second upper and lower plate station of the base, and the second grasping device grasps the substrate whose back side has been exposed on the second workpiece table or the fourth workpiece table to the plate-out conveying device.

[0026] The control method of the direct writing exposure equipment of the second aspect of the present invention comprises: controlling the first work stage and the second work stage to move along the first guide rail, wherein when the first work stage is in the first exposure station for exposure, the second work stage is controlled to be in the second alignment station or the second upper and lower plate station, or when the second work stage is in the first exposure station for exposure, the first work stage is controlled to be in the first alignment station or the first upper and lower plate station; controlling the third work stage and the fourth work stage to move along the second guide rail, wherein when the third work stage is in the second exposure station for exposure, the fourth work stage is controlled to be in the fourth alignment station or the fourth upper and lower plate station, or when the fourth work stage is in the second exposure station for exposure, the third work stage is controlled to be in the third alignment station or the third upper and lower plate station. The conveying and flipping system of the direct writing exposure equipment is controlled to flip the substrate exposed on one side on the first work stage or the third work stage and output it to the other side of the conveying and flipping system, so as to provide the flipped substrate to the second work stage or the fourth work stage for exposure on the other side of the substrate.

[0027] According to the control method of the direct writing exposure equipment of the embodiment of the present invention, the direct writing exposure equipment is based on four worktables, and the four worktables can work synchronously and in parallel, and by controlling the conveying and flipping system of the direct writing exposure equipment, the substrate on the first worktable or the third worktable that has completed one side of the exposure is flipped to the unexposed side, and the flipped substrate is transferred to the second worktable or the side of the fourth worktable, so that the front and back exposure of the substrate can be automated, which improves the production efficiency. Compared with the use of two exposure devices, the same exposure system is used to produce on the same device, which is more conducive to ensuring accuracy and stability. In addition, the front and back sides of the substrate can be flipped through the conveying and flipping system of the device itself, without the need to be combined with other automated production and conveying equipment at a later stage, which can improve the sealing and cleanliness of the production line and ensure product quality.

[0028] In some embodiments, in the same exposure process, the first work stage is controlled to move to the first exposure station to perform front-side exposure of the substrate and the fourth work stage is controlled to move to the second exposure station to perform back-side exposure of the substrate, or the second work stage is controlled to move to the first exposure station to perform back-side exposure of the substrate and the third work stage is controlled to move to the second exposure station to perform front-side exposure of the substrate.

[0029] Therefore, in each exposure process, the front and back exposure of the substrate can be completed simultaneously, which reduces the non-exposure time of the exposure system, saves a lot of waiting idle time, and greatly improves the production efficiency of the equipment.

[0030] In some embodiments, the first worktable and the second worktable are combined into a first combined worktable, and the third worktable and the fourth worktable are combined into a second combined worktable; the first combined worktable is controlled to move along the first guide rail, wherein the first combined worktable is moved to the first upper and lower plate stations to transfer the substrate on the first combined worktable that has completed front exposure to the conveying and flipping system, and at the same time, the substrate to be exposed on the front is placed on the first combined worktable, the first combined worktable is moved to the first alignment station, the first alignment system is controlled to perform front target alignment on the substrate on the first combined worktable, the first combined worktable is moved to the exposure station, the exposure system is controlled to perform front exposure on the substrate, and after the front exposure is completed, the first combined worktable is controlled to move to the first upper and lower plate stations. The second combined worktable is controlled to move along the second guide rail, wherein the second combined worktable moves to the fourth upper and lower plate station to take away the substrate on the second combined worktable that has completed reverse exposure, and at the same time, the substrate on the conveying station is placed on the second combined worktable, the second combined worktable moves to the fourth alignment station, the second alignment system is controlled to perform reverse target alignment on the substrate on the second combined worktable, the second combined worktable moves to the exposure station, the exposure system is controlled to perform reverse exposure on the substrate, and after the reverse exposure is completed, the second combined worktable is controlled to move to the fourth upper and lower plate station.

[0031] According to the control method of the direct-writing exposure equipment of the embodiment of the present invention, based on the dual-combination worktable, it can be applicable to the exposure processing of larger-sized substrates. Combined with the equipment's own conveying and flipping system, it can also realize the automated operation of front and back exposure of large-sized substrates, thereby improving production efficiency. In addition, compared with the use of two exposure devices, it occupies a smaller area, has higher precision and stability, and, using this control method, the equipment does not need to be combined with other automated production and conveying equipment at a later stage, which can improve the sealing and cleanliness of the production line and ensure product quality.

[0032] In some embodiments, the control method of the direct writing exposure device includes controlling the first grabbing device to move along the width direction of the base of the direct writing exposure device to grab the substrate on the first worktable or the third worktable that has completed front exposure to the first conveying device, and at the same time grab the substrate on the front side to be exposed on the infeed conveying device to the first worktable or the third worktable; controlling the second grabbing device to move along the width direction of the base of the direct writing exposure device to grab the substrate on the second worktable or the fourth worktable that has completed back exposure to the outfeed conveying device, and at the same time grab the substrate on the back side to be exposed on the second conveying device to the second worktable or the fourth worktable. Thus, the automated operation of loading on the worktable is realized.

[0033] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0035] Figure 1 Schematic diagram of the structure of a direct-write exposure device according to an embodiment of the present invention.

[0036] Figure 2 Schematic diagram of a working station of a direct-write exposure device according to an embodiment of the present invention.

[0037] Figure 3 It is a schematic diagram of the exposure operation performed by the second workpiece stage and the third workpiece stage of the direct writing exposure device according to one embodiment of the present invention.

[0038] Figure 4 It is a schematic diagram of a first workpiece stage and a fourth workpiece stage of a direct writing exposure device performing an exposure operation according to an embodiment of the present invention.

[0039] Figure 5 is a flow chart of a control method of a direct-write exposure device according to an embodiment of the present invention.

[0040] Reference numerals:

[0041] 1. Board infeed conveyor; 2. First gripping device; 3. Third gantry mechanism; 4. First alignment system; 5. First gantry mechanism; 6. Mounting seat; 7. Exposure light source; 8. Driving member; 9. Second gantry mechanism; 10. Second gripping device; 11. Fourth gantry mechanism; 12. Board outfeed conveyor; 13. Fourth workpiece table; 14. Second alignment system; 15. Second conveyor; 16. Turning device; 17. First conveyor; 18. Second workpiece table; 19. Third workpiece table; 20. Second guide rail; 21. First workpiece table; 22. First guide rail; 23. Base; 2 4. The third guide rail; 25. The first upper and lower plate station; 26. The first alignment station; 27. The first exposure station; 28. The second alignment station; 29. ​​The second upper and lower plate station; 30. The third upper and lower plate station; 31. The third alignment station; 32. The second exposure station; 33. The fourth alignment station; 34. The fourth upper and lower plate station; 35. The board infeed conveying station; 36. The board outfeed conveying station; 37. The first conveying station; 38. The flipping station; 39. The second conveying station; 100. The direct-write exposure device; 121. The exposure unit; 111. The exposure system; 112. The conveying and flipping system. DETAILED DESCRIPTION

[0042] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0043] Reference below Figure 1-Figure 5 A direct writing exposure device 100 and a control method thereof according to an embodiment of the present invention are described.

[0044] Figure 1 is a schematic structural diagram of a direct-write exposure device 100 according to an embodiment of the present invention. Figure 1 As shown, the direct writing exposure device 100 includes: a base 23, a first workpiece stage 21, a second workpiece stage 18, a third workpiece stage 19, a fourth workpiece stage 13, a driving device (not shown in the figure), a first alignment system 4, a second alignment system 14, an exposure system 111 and a conveying and flipping system 112.

[0045] The base 23 is provided with a first guide rail 22 and a second guide rail 20 extending in the length direction and arranged in the width direction. Figure 2 FIG. 1 is a schematic diagram of a working station of a direct writing exposure device 100 according to an embodiment of the present invention. Figure 2 As shown, the first upper and lower plate station 25, the first alignment station 26, the first exposure station 27, the second alignment station 28 and the second upper and lower plate station 29 are defined in sequence along the direction of the first guide rail 22, and the third upper and lower plate station 30, the third alignment station 31, the second exposure station 32, the fourth alignment station 33 and the fourth upper and lower plate station 34 are defined in sequence along the direction of the second guide rail 20.

[0046] The first workpiece table 21 and the second workpiece table 18 are both arranged on the first guide rail 22, and the driving device is used to drive the first workpiece table 21 to reciprocate along the first guide rail 22 to switch between the first upper and lower plate station 25, the first alignment station 26 and the first exposure station 27, and the driving device is also used to drive the second workpiece table 18 to reciprocate along the first guide rail 22 to switch between the second upper and lower plate station 29, the second alignment station 28 and the first exposure station 27.

[0047] The third workpiece stage 19 and the fourth workpiece stage 13 are both arranged on the second guide rail 20, and the driving device is used to drive the third workpiece stage 19 to reciprocate along the second guide rail 20 to switch between the third upper and lower plate station 30, the third alignment station 31 and the second exposure station 32, and the driving device is also used to drive the fourth workpiece stage 13 to reciprocate along the second guide rail 20 to switch between the fourth upper and lower plate station 34, the fourth alignment station 33 and the second exposure station 32.

[0048] Among them, the four worktables are in independent motion mode and can work synchronously and in parallel. For example, when the substrate on the first worktable 21 is exposed at the first exposure station 27, the substrate on the second worktable 18 can be aligned at its corresponding second alignment station 28 at the same time. Similarly, when the substrate on the second worktable 18 is exposed at the first exposure station 27, the substrate on the first worktable 21 can be aligned at its corresponding first alignment station 26 at the same time. When the substrate on the third worktable 19 is exposed at the second exposure station 32, the substrate on the fourth worktable 13 can be aligned at its corresponding fourth alignment station 33 at the same time. Similarly, when the substrate on the fourth worktable 13 is exposed at the second exposure station 32, the substrate on the third worktable 19 can be aligned at its corresponding third alignment station 31 at the same time. Therefore, when one worktable is exposed, the other worktable can load and unload materials, grab the alignment mark target information of the substrate, prepare exposure data, etc., which greatly reduces the working cycle and improves the production efficiency of the equipment.

[0049] The first alignment system 4 is provided corresponding to the first alignment station 26 and the third alignment station 31, and is used for performing target alignment on the substrates on the first alignment station 26 and the third alignment station 31. The second alignment system 14 is provided corresponding to the second alignment station 28 and the fourth alignment station 33, and is used for performing target alignment on the substrates on the second alignment station 28 and the fourth alignment station 33. The exposure system 111 is provided corresponding to the first exposure station 27 and the second exposure station 32, and is used for performing exposure processing on the substrates on the first exposure station 27 and the second exposure station 32. The relative position of the target on the substrate can be obtained through the alignment system, and the exposure system 111 exposes the required pattern of the substrate to the corresponding position on the substrate according to the position information of the target on the substrate.

[0050] In addition, if Figure 1 As shown, the direct writing exposure device 100 of the embodiment of the present invention is also provided with a conveying and flipping system 112, which is connected to the base 23 and is located on one side of the base 23 along the width direction, and is used to flip the exposed substrate on the first worktable 21 or the third worktable 19 to the unexposed side, and transfer the flipped substrate to the second conveying device on the side where the second worktable 18 or the fourth worktable 13 is located.

[0051] In the embodiment of the present invention, the first work stage 21 and the third work stage 19 may be defined as corresponding to the front exposure production operation of the substrate, and the second work stage 18 and the fourth work stage 13 may be defined as corresponding to the back exposure production operation of the substrate. Of course, the second work stage 18 and the fourth work stage 13 may also be defined as corresponding to the front exposure production operation of the substrate, and the first work stage 21 and the third work stage 19 may be defined as corresponding to the back exposure production operation of the substrate, and the implementation process is similar.

[0052] Specifically, taking the front exposure production operation of the substrate corresponding to the first workpiece stage 21 and the third workpiece stage 19 as an example, the substrate to be exposed on the front is placed on the first workpiece stage 21, and the driving device drives the first workpiece stage 21 to move along the first guide rail 22 to the first alignment station 26, and the first alignment system 4 performs target alignment on the front of the substrate on the first alignment station 26, and then the driving device drives the first workpiece stage 21 to move from the first alignment station 26 to the first exposure station 27, and the exposure system 111 performs exposure operation on the front of the substrate on the first exposure station 27. After the exposure operation of the front side of the substrate on the first work stage 21 is completed, the driving device drives the first work stage 21 to move from the first exposure station 27 to the first alignment station 26, and then from the first alignment station 26 to the first upper and lower plate station 25, and then the substrate is transferred to the conveying and flipping system 112, and the unexposed reverse side of the substrate is flipped upward by the conveying and flipping system 112, and the flipped substrate is transferred to the other side of the conveying and flipping system 112, i.e., the side where the second work stage 18 is located, so as to realize the automatic flipping and conveying of the front and back sides of the substrate on the first work stage 21. The first work stage 21 is controlled to operate repeatedly in this way.

[0053] Similarly, the third worktable 19 is placed with the substrate to be exposed on the front side, and the driving device drives the third worktable 19 to move along the second guide rail 20 to the third alignment station 31, and the first alignment system 4 performs target alignment on the front side of the substrate on the third alignment station 31, and then the driving device drives the third worktable 19 to move from the third alignment station 31 to the second exposure station 32, and the exposure system 111 performs exposure operation on the front side of the substrate on the second exposure station 32. After the front exposure operation of the substrate on the third worktable 19 is completed, the driving device drives the third worktable 19 to move from the second exposure station 32 to the third alignment station 31, and then moves from the third alignment station 31 to the third upper and lower plate station 30. Then, the substrate is transferred to the conveying and flipping system 112, and the unexposed reverse side of the substrate is flipped upward by the conveying and flipping system 112, and the flipped substrate is transferred to the other side of the conveying and flipping system 112, that is, the side where the fourth worktable 13 is located. Thereby, the front and back sides of the substrate on the third worktable 19 are automatically flipped and conveyed. The third workpiece platform 19 is controlled to perform the operation repeatedly.

[0054] It can be understood that whether it is the substrate after front-side exposure on the first workpiece stage 21 or the substrate after front-side exposure on the third workpiece stage 19, it can be flipped to the back side by the conveying and flipping system 112 and conveyed to the other side of the conveying and flipping system 112, and then, according to the process status of the second workpiece stage 18 and the fourth workpiece stage 13, the flipped and conveyed substrate to be exposed on the back side can be placed on the second workpiece stage 18 or the fourth workpiece stage 13.

[0055] For example, the substrate is loaded onto the second work stage 18 at the second upper and lower plate station 29, and then the driving device moves the second work stage 18 from the second upper and lower plate station 29 to the second alignment station 28, and the second alignment system 14 performs target alignment on the reverse side of the substrate at the second alignment station 28, and then the driving device moves the second work stage 18 from the second alignment station 28 to the first exposure station 27, and the exposure system 111 performs exposure operation on the reverse side of the substrate at the first exposure station 27. After the exposure operation of the substrate on the second work stage 18 is completed, the driving device drives the second work stage 18 to move from the first exposure station 27 to the second alignment station 28, and then from the second alignment station 28 to the second upper and lower plate station 29. The second work stage 18 is controlled to repeat this cycle.

[0056] For example, the substrate is loaded onto the fourth work stage 13 at the fourth upper and lower plate station 34, and then the driving device moves the fourth work stage 13 from the fourth upper and lower plate station 34 to the fourth alignment station 33, and the second alignment system 14 performs target alignment on the reverse side of the substrate at the fourth alignment station 33, and then the driving device moves the fourth work stage 13 from the fourth alignment station 33 to the second exposure station 32, and the exposure system 111 performs exposure operation on the reverse side of the substrate at the second exposure station 32. After the exposure operation is completed, the driving device drives the fourth work stage 13 to move from the second exposure station 32 to the fourth alignment station 33, and then from the fourth alignment station 33 to the fourth upper and lower plate station 34. The fourth work stage 13 is controlled to cycle repeatedly in this way.

[0057] According to the direct writing exposure device 100 of the embodiment of the present invention, four worktables are used, and the driving device enables the four worktables to move back and forth between the corresponding different workstations, and then the front and back sides of the substrate are automatically flipped through the integrated conveying and flipping system 112, and the flipped substrate is transmitted to the second worktable 18 or the side of the fourth worktable 13, so that the front and back exposure of the substrate can be automatically exposed, and the four worktables can work synchronously, which improves production efficiency. Compared with the use of two exposure devices, it occupies a small area, and the same exposure system 111 is used to produce on the same device, which is more conducive to ensuring accuracy and stability. In addition, the device integrates a conveying and flipping system 112, and does not need to be combined with other automated production and conveying equipment at a later stage, which can improve the sealing and cleanliness of the production line and ensure product quality.

[0058] In some embodiments, Figure 1As shown, the conveying and flipping system 112 includes a first conveying device 17, a flipping device 16, and a second conveying device 15 arranged along the length direction of the base 23. The first conveying device 17 is used to convey the substrate on the first worktable 21 or the third worktable 19 that has been exposed on the front side to the flipping device 16. The flipping device 16 flips the substrate to obtain a substrate to be exposed on the back side, and conveys the substrate to be exposed on the back side to the second conveying device 15. The second conveying device 15 outputs the substrate to be exposed on the back side to the conveying station on the side where the second worktable 18 or the fourth worktable 13 is located. Among them, the first conveying device 17 is located at the first conveying station 37, the flipping device 16 is located at the flipping station 38, and the second conveying device 15 is located at the second conveying station 39.

[0059] Specifically, the substrate on the first worktable 21 that has completed front exposure is placed on the first conveying station 37, and the first conveying device 17 transfers the substrate to the flipping station 38, and the flipping device 16 is used to flip the unexposed reverse side of the substrate upward, and the substrate to be exposed on the reverse side is transferred to the second conveying station 39, and then the second conveying device 15 transfers the substrate to be exposed on the reverse side to one side of the second upper and lower plate station 29. Similarly, the substrate on the third worktable 19 that has completed front exposure is placed on the first conveying station 37, and the first conveying device 17 transfers the substrate to the flipping station 38, and the flipping device 16 is used to flip the unexposed reverse side of the substrate upward, and the substrate to be exposed on the reverse side is transferred to the second conveying station 39, and then the second conveying device 15 transfers the substrate to be exposed on the reverse side to one side of the fourth upper and lower plate station 34, and then the substrate flipped to the reverse side can be loaded onto the second worktable 18 or the fourth worktable 13 for subsequent reverse exposure processing.

[0060] As described above, setting up the conveying and flipping system 112 can realize the exposure of the front and back sides of the substrate by a direct writing exposure device 100, thereby greatly reducing the footprint of the automated production line, saving economic integration costs, and eliminating the need for subsequent combination of additional automated production and conveying equipment. The sealing and cleanliness of the production line can be improved to ensure product quality.

[0061] like Figure 1 As shown, the exposure system 111 of the direct-write exposure device 100 includes a first gantry mechanism 5 , a second gantry mechanism 9 , a mounting seat 6 , an exposure light source 7 , and a driving member 8 .

[0062] The first gantry mechanism 5 and the second gantry mechanism 9 are arranged in parallel on the base 23 and straddle the first guide rail 22 and the second guide rail 20. The first gantry mechanism 5 and the second gantry mechanism 9 are both provided with a third guide rail 24 along the width direction of the base 23. Both ends of the mounting seat 6 are mounted on the first gantry mechanism 5 and the second gantry mechanism 9. The exposure light source 7 is arranged on the mounting seat 6, and the exposure light source 7 emits light toward the first exposure station 27 and the second exposure station 32. The driving member 8 is arranged on the first gantry mechanism 5 or the second gantry mechanism 9, and is used to drive the mounting seat 6 to reciprocate along the third guide rail 24, and the movement range of the exposure light source 7 can cover the size range of the exposure pattern of the substrate.

[0063] By setting two gantry mechanisms and the third guide rail 24, the third guide rail 24 is used to realize the movement of the exposure system 111 in the width direction, which can ensure the positioning accuracy of the exposure system 111 and the rigidity of the mechanical mechanism, and improve the actual exposure accuracy and working stability and reliability of the whole equipment. In addition, the use of the guide rail form to realize the movement of the exposure system 111 has a simple structure and is easier to maintain. In addition, in the present invention, in order to improve the operating efficiency of the exposure system 111, that is, to shorten the non-exposure time of the exposure system 111 as much as possible, first, the exposure system 111 moves from the positive limit position to the negative limit position along the width direction of the base 23, and the exposure operation can be performed. Similarly, when moving from the negative limit position to the positive limit position, the exposure system 111 can also perform the exposure operation. In addition, during the exposure operation, when the exposure projection area of ​​the exposure system 111 has completely covered the substrate area on a certain station, the workpiece stage can withdraw to perform the upper and lower plate operation, and at the same time, the workpiece stage on the same motion axis can be synchronously moved to the exposure station to wait for the next exposure process.

[0064] Furthermore, in some embodiments, the exposure light source 7 may include a plurality of exposure units 121 , and the plurality of exposure units 121 are arranged in a plurality of rows along the length direction of the base 23 .

[0065] For example, the number of exposure units 121 is set to 12, which are arranged in 2 rows in the length direction, and each row has 6 exposure units 121. The motion range of the exposure system 111 can cover the size range of the substrate on the first workpiece stage 21 plus the substrate processing pattern on the third workpiece stage 19 or the size range of the substrate on the second workpiece stage 18 plus the substrate processing pattern on the fourth workpiece stage 13.

[0066] When the first work stage 21 and the fourth work stage 13 are in their corresponding exposure positions (or the second work stage 18 and the third work stage 19 are in their corresponding exposure positions), the driving member 8 of the exposure system 111 drives the mounting seat 6 to reciprocate along the third guide rail 24 to perform exposure operation.

[0067] In addition, the first alignment system 4 of the direct writing exposure device 100 includes a first camera unit, a first driving unit, and a first lighting unit. The second alignment system 14 includes a second camera unit, a second driving unit, and a second lighting unit.

[0068] The first camera unit is arranged on the first gantry mechanism 5, and is used to obtain a picture of the substrate at the first alignment station 26 or the third alignment station 31, and obtain the front target position information according to the picture. The first driving unit is used to drive the first camera unit to move along the width direction of the base 23. The first lighting unit is arranged on the first gantry mechanism 5. The second camera unit is arranged on the second gantry mechanism 9, and is used to obtain a picture of the substrate at the second alignment station 28 or the fourth alignment station 33, and obtain the back target position information according to the picture. The second driving unit is used to drive the second camera unit to move along the width direction of the base 23. The second lighting unit is arranged on the second gantry mechanism 9.

[0069] Specifically, the alignment targets on the substrate are captured by the camera units in the alignment system at the same time. Since each group of camera units is at a different spatial position of the motion axis, in order to unify the position information of the alignment targets captured by all camera units, the position coordinates of the camera units need to be unified into the same coordinate system. Therefore, the relative spatial position relationship of the camera units in each alignment system must be confirmed. The relative position of the camera units can be calibrated by a calibration plate of known accuracy, so that before grabbing the substrate target on the workpiece table, the relative position between the camera units of each group of alignment systems is determined.

[0070] Then, the target on the substrate is obtained by taking pictures, and then the target image captured by each camera unit is analyzed to obtain the relative position of the target on the substrate. After the alignment position information of the above substrate is obtained, the exposure system 111 exposes the required pattern of the substrate to the corresponding position on the substrate according to the above position information. By setting up the alignment system, the target can be captured quickly and accurately, the versatility and alignment accuracy are improved, the failure rate is reduced, and it is beneficial to improve the stability of equipment operation and improve production efficiency.

[0071] In addition, in the direct writing exposure device 100, the first work stage 21, the second work stage 18, the third work stage 19 and the fourth work stage 13 all include a first adsorption structure, which is used to adsorb the substrate placed on the work stage to prevent the substrate on the work stage from shifting or falling during movement. The first conveying device 17 and the second conveying device 15 are both provided with a second adsorption structure, which is used to adsorb the substrate placed on the conveying device to prevent the substrate from falling during conveyance.

[0072] In some embodiments, the first conveying device 17, the flipping device 16 and the second conveying device 15 are all located on one side of the base 23 and are sequentially arranged end to end along the length direction of the base 23. Thus, automatic conveying and flipping of the substrate can be achieved.

[0073] The turning device 16 includes a turning shaft, a turning plate, and a turning driving member.

[0074] One end of the flip shaft is rotatably connected to the base 23, the flip plate is arranged on the flip shaft, and the flip driving member is used to drive the flip shaft to rotate, so as to drive the flip plate to flip 180 degrees, so as to flip the substrate to the reverse side and convey it to the second conveying device 15. Thus, the automatic flipping and conveying device is organically combined with the base 23, and the automatic conveying and flipping of the substrate is realized automatically, without the need for another overlapping conveying production line, thereby improving the cleanliness of the substrate exposure production line and reducing the pollution to the substrate.

[0075] like Figure 1 As shown, the direct writing exposure equipment 100 also includes a first grabbing device 2 and a second grabbing device 10. The first grabbing device 2 is used to grab the substrate to be exposed and place it on the first worktable 21 when the first worktable 21 is located at the first upper and lower plate station 25 or the third worktable 19 is located at the third upper and lower plate station 30, or to grab the substrate on one side of the first worktable 21 or the third worktable 19 to the first conveying device 17. The second grabbing device 10 is used to grab the substrate on the other side of the conveying station to be exposed and place it on the second worktable 18 or the fourth worktable 13 when the second worktable 18 is located at the second upper and lower plate station 29 or the fourth worktable 13 is located at the fourth upper and lower plate station 34, or to grab the substrate on the other side of the second worktable 18 or the fourth worktable 13. Thereby, the automated operation of loading and unloading and substrate transfer is realized, saving manpower.

[0076] Among them, Figure 1 As shown, the first grabbing device 2 includes a third gantry mechanism 3, a first grabbing mechanism (not shown in the figure), a second grabbing mechanism (not shown in the figure), a first left and right driving member (not shown in the figure) and a first up and down driving member (not shown in the figure). The third gantry mechanism 3 is arranged across the base 23 and the first conveying device 17, and the third gantry mechanism 3 is arranged corresponding to the first upper and lower plate station 25 and the third upper and lower plate station 30. The first grabbing mechanism and the second grabbing mechanism are both arranged on the third gantry mechanism 3. The first left and right driving member is arranged on the third gantry mechanism 3, and is used to drive the first grabbing mechanism and the second grabbing mechanism to move along the width direction of the base 23. The first up and down driving member is arranged on the third gantry mechanism 3, and is used to drive the first grabbing mechanism and the second grabbing mechanism to move along the height direction of the third gantry mechanism 3.

[0077] And, if Figure 1As shown, the second grabbing device 10 includes a fourth gantry mechanism 11, a third grabbing mechanism (not shown in the figure), a fourth grabbing mechanism (not shown in the figure), a second left-right driving member (not shown in the figure) and a second up-down driving member (not shown in the figure). The fourth gantry mechanism 11 is arranged across the base 23 and the second conveying device 15, and the fourth gantry mechanism 11 is arranged corresponding to the second up-down plate station 29 and the fourth up-down plate station 34. The third grabbing mechanism and the fourth grabbing mechanism are both arranged on the fourth gantry mechanism 11. The second left-right driving member is arranged on the fourth gantry mechanism 11, and is used to drive the third grabbing mechanism and the fourth grabbing mechanism to move along the width direction of the base 23. The second up-down driving member is arranged on the fourth gantry mechanism 11, and is used to drive the third grabbing mechanism and the fourth grabbing mechanism to move along the height direction of the fourth gantry mechanism 11.

[0078] By setting up the first gripping device 2 and the second gripping device 10, monotonous, repetitive or heavy physical labor can be replaced by manual labor, thereby realizing the automated loading and unloading operations of the four workbenches, reducing labor costs, eliminating the safety hazards of manual operation, and avoiding unnecessary production safety accidents.

[0079] like Figure 1 As shown, the direct writing exposure device 100 also includes a plate inlet conveying device 1 and a plate outlet conveying device 12. The plate inlet conveying device 1 is arranged near the first upper and lower plate station 25 of the base 23, and is used to convey the substrate to be exposed on the front side so that the first gripping device 2 can grip it to the first workpiece stage 21 or the third workpiece stage 19. The plate outlet conveying device 12 is arranged near the second upper and lower plate station 29 of the base 23, the plate inlet conveying device 1 is located at the plate inlet conveying station 35, and the plate outlet conveying device 12 is located at the plate outlet conveying station 36. The second gripping device 10 grips the substrate on the second workpiece stage 18 or the fourth workpiece stage 13 that has been exposed on the reverse side to the plate outlet conveying device 12. The combination of the gripping device and the conveying device is used to realize the automatic transfer and transportation of the substrate.

[0080] This embodiment realizes the automated operation of the equipment. For the convenience of explaining the technical solution, it is defined that the first worktable 21 and the third worktable 19 correspond to the front exposure production operation of the substrate, and the second worktable 18 and the fourth worktable 13 correspond to the back exposure production operation of the substrate. After the front exposure of the substrate on the first worktable 21 and the third worktable 19 is completed, the first gripping device 2 can transfer the substrate to the first conveying device 17, and then the flipping device can flip the substrate 180° to flip the substrate to the back and convey it to the second conveying device 15, and then the second gripping device 10 transfers the substrate to the second worktable 18 and the fourth worktable 13, and then the back exposure operation of the substrate is performed.

[0081] Specifically, for the first workpiece stage 21, when it is in the first upper and lower plate station 25, the substrate adsorbed by the first adsorption structure on the first workpiece stage 21 has completed the exposure operation in the previous exposure process, and the substrate will be taken away by the first grasping device 2 and placed on the first conveying device 17, and then the conveying flipping system 112 will be used to flip the unexposed back side of the substrate upward and transfer it to the second workpiece stage 18 or the fourth workpiece stage 13, preparing for the back side exposure operation of the substrate. At the same time, another gripping mechanism of the first gripping device 2 places a substrate that has not been exposed from the board feeding conveyor 1 to the first adsorption structure of the first workpiece stage 21, and then the first workpiece stage 21 is driven by the driving device to move along the first guide rail 22 to the first alignment station 26, and the first alignment system 4 performs target alignment on the front side of the substrate on the first alignment station 26, and then the driving device drives the first workpiece stage 21 to move from the first alignment station 26 to the first exposure station 27, and the exposure system 111 performs front exposure operation on the substrate. After the exposure operation is completed, the driving device drives the first workpiece stage 21 to move from the first exposure station 27 to the first alignment station 26, and then from the first alignment station 26 to the first upper and lower plate station 25.

[0082] For the second workpiece stage 18, when it is at the second upper and lower plate station 29, the substrate adsorbed by the first adsorption structure on the second workpiece stage 18 has completed the exposure operation in the previous exposure process, and the substrate will be placed on the plate output conveying device 12 by the second grasping device 10. At this point, the substrate has completed the front and back exposure operations in the direct writing exposure equipment 100, and then the substrate will flow out of the direct writing exposure equipment 100 and flow to the next process. At the same time, a substrate that has completed the front exposure operation and is transported from the first worktable 21 or the third worktable 19 to the first adsorption structure of the second worktable 18 by the second grasping device 10 from the second conveying device 15, and then the second worktable 18 is driven by the driving device to move from the second upper and lower plate station 29 to the second alignment station 28, and the second alignment system 14 performs target alignment on the back side of the substrate on the second alignment station 28, and then the driving device drives the second worktable 18 to move from the second alignment station 28 to the first exposure station 27, and the exposure system 111 performs the back side exposure operation on the substrate on the exposure station. After the exposure operation is completed, the driving device drives the second worktable 18 to move from the exposure station to the second alignment station 28, and then from the second alignment station 28 to the second upper and lower plate station 29.

[0083] Similarly, the exposure action logic of the third workpiece stage 19 and the fourth workpiece stage 13 is consistent with the exposure action logic of the first workpiece stage 21 and the second workpiece stage 18 .

[0084] In summary, the direct writing exposure device 100 of the embodiment of the present invention, based on four workpiece tables and two guide rails extending along the length of the base 23, can complete the front and back exposure of the substrate in the same exposure process. In addition, the equipment structure is simple, and the maintenance in actual use is relatively easy, and the maintenance cost will also be reduced accordingly. In addition, the four workpiece tables can work synchronously, and the non-exposure time of the exposure system 111 is less, which greatly improves the production efficiency of the single equipment and effectively improves the cost performance of the single equipment. In addition, the front and back graphics of the substrate are produced by the same set of exposure system 111 on the same single-machine equipment, which is more conducive to ensuring accuracy and stability. When the exposure system 111 is performing the exposure operation, the alignment system and the loading and unloading of the substrate work in parallel, which effectively improves the production efficiency of the substrate exposure. In addition, the exposure system 111 of the substrate is fully integrated with the automatic conveying and flipping system 112, which can save a lot of floor space, more economical integration cost, and can provide better and better cleanliness.

[0085] Based on the direct-writing exposure device in the above embodiment, a control method of the direct-writing exposure device according to an embodiment of the second aspect of the present invention is described below.

[0086] The control method of the direct writing exposure equipment of the embodiment of the present invention at least includes: controlling the first work stage and the second work stage to move along the first guide rail, wherein when the first work stage is in the first exposure station for exposure, the second work stage is controlled to be in the second alignment station or the second upper and lower plate station, or, when the second work stage is in the first exposure station for exposure, the first work stage is controlled to be in the first alignment station or the first upper and lower plate station. Controlling the third work stage and the fourth work stage to move along the second guide rail, wherein when the third work stage is in the second exposure station for exposure, the fourth work stage is controlled to be in the fourth alignment station or the fourth upper and lower plate station, or, when the fourth work stage is in the second exposure station for exposure, the third work stage is controlled to be in the third alignment station or the third upper and lower plate station.

[0087] Among them, the conveying flipping of the direct writing exposure equipment is controlled to flip the substrate exposed on one side on the first worktable or the third worktable and output it to the other side of the exposure system, so as to provide the flipped substrate to the second worktable or the fourth worktable to expose the other side of the substrate.

[0088] According to the control method of the direct-writing exposure equipment of the embodiment of the present invention, the direct-writing exposure equipment is based on four worktables, and the four worktables can operate synchronously and in parallel, and by controlling the conveying and flipping system of the direct-writing exposure equipment, the substrate with one side exposed on the first worktable or the third worktable is flipped to the unexposed side, and the flipped substrate is transferred to one side of the second worktable or the fourth worktable, thereby realizing the automated operation of front and back exposure of the substrate, and when the exposure system is controlled to perform the exposure operation, the alignment system and the loading and unloading of the substrate work in parallel, thereby reducing the idle time of each device of the exposure equipment, and at the same time, the double worktables are at the exposure station for exposure at the same time, which also reduces the non-exposure time of the exposure system and improves the utilization rate of the equipment.

[0089] In some embodiments, in the same exposure process, the first work stage is controlled to move to the first exposure station to expose the front side of the substrate and the fourth work stage is controlled to move to the second exposure station to expose the back side of the substrate, or the second work stage is controlled to move to the first exposure station to expose the back side of the substrate and the third work stage is controlled to move to the second exposure station to expose the front side of the substrate.

[0090] Specifically, Figure 3 As shown, when the second worktable is in the first exposure station, the exposure system performs exposure operations on the front side of the substrate on the second worktable, and the third worktable is in the second exposure station, the exposure system performs exposure operations on the back side of the substrate on the third worktable, the first worktable is in the first loading and unloading plate station to perform loading and unloading operations on the substrate, and the fourth worktable is in the fourth loading and unloading plate station to perform loading and unloading operations on the substrate.

[0091] like Figure 4 As shown, when the first worktable is in the first exposure station, the exposure system performs an exposure operation on the front side of the substrate on the first worktable, and the fourth worktable is in the second exposure station, and the exposure system performs an exposure operation on the back side of the substrate on the fourth worktable, the second worktable is in the second upper and lower plate station to perform the loading and unloading operation of the substrate, and the third worktable is in the third upper and lower plate station to perform the loading and unloading operation of the substrate. It can be concluded that the substrates on the first worktable and the fourth worktable will be in the same exposure process, and the second worktable and the third worktable will be in the same exposure process. The first worktable and the third worktable are responsible for exposing the front side graphics of the substrate, and the second worktable and the fourth worktable are responsible for exposing the back side graphics of the substrate. Therefore, each exposure process in the present invention can simultaneously complete the front and back exposure of the substrate. When the exposure system is performing the exposure operation, the alignment system and the loading and unloading of the substrate work in parallel, which reduces the idle time of each device of the exposure equipment. At the same time, the double worktables are in the exposure station for exposure at the same time, which also reduces the non-exposure time of the exposure system and improves the utilization rate of the equipment.

[0092] In an embodiment, four workpieces of the direct-write exposure device can be controlled to operate synchronously and in parallel, or the workpiece stages on the same track can be combined to operate, which can be better suitable for substrates of comparative size.

[0093] For example, the first workpiece stage and the second workpiece stage are combined into a first combined workpiece stage, and the third workpiece stage and the fourth workpiece stage are combined into a second combined workpiece stage.

[0094] Specifically, the first combined worktable is controlled to move along the first guide rail, wherein the first combined worktable moves to the first upper and lower plate stations to transfer the substrate on the first combined worktable that has completed front exposure to the conveying and flipping system, and at the same time, the substrate to be exposed on the front is placed on the first combined worktable, the first combined worktable moves to the first alignment station, the first alignment system is controlled to perform front target alignment on the substrate on the first combined worktable, the first combined worktable moves to the exposure station, and the exposure system is controlled to perform front exposure on the substrate.

[0095] After the front exposure is completed, the first combined worktable is controlled to move to the first upper and lower plate station. The conveying and flipping system is controlled to flip the substrate that has completed the front exposure to the unexposed side facing up, and the flipped substrate is transported to the second conveying device on one side of the second combined worktable.

[0096] The second combined worktable is controlled to move along the second guide rail, wherein the second combined worktable is moved to the fourth upper and lower plate station to take away the substrate on the second combined worktable that has completed the back exposure, and at the same time, the substrate on the second conveying device is placed on the second combined worktable, the second combined worktable is moved to the fourth alignment station, the second alignment system is controlled to perform back target alignment on the substrate on the second combined worktable, the second combined worktable is moved to the exposure station, and the exposure system is controlled to perform back exposure on the substrate. After the back exposure is completed, the second combined worktable is controlled to move to the fourth upper and lower plate station.

[0097] The control method of the embodiment of the present invention is based on the dual-combination worktable of the equipment and can be suitable for exposure processing of substrates of larger sizes. Combined with the equipment's own conveying and flipping system, it can also realize the automated operation of front and back exposure of the substrate, thereby improving production efficiency. Compared with the use of two exposure devices, it occupies a smaller area and has higher precision and stability. In addition, by using this control method, the equipment does not need to be combined with other automated production and conveying equipment at a later stage, which can improve the sealing and cleanliness of the production line and ensure product quality.

[0098] In addition, the direct writing exposure equipment can also be provided with a first gripping device and a second gripping device to realize the automated operation of loading and unloading and transferring the substrate. Specifically, in terms of transferring the substrate, the first gripping device is controlled to move along the width direction of the base of the direct writing exposure equipment to grip the substrate that has completed the front exposure on the first worktable or the third worktable to the first conveying device, and at the same time, the substrate to be exposed on the front side on the in-board conveying device is gripped to the first worktable or the third worktable. The second gripping device is controlled to move along the width direction of the base of the direct writing exposure equipment to grip the substrate that has completed the back exposure on the second worktable or the fourth worktable to the out-board conveying device, and at the same time, the substrate to be exposed on the back side on the second conveying device is gripped to the second worktable or the fourth worktable.

[0099] In the embodiment of the present invention, when performing an exposure operation, the first workpiece stage and the fourth workpiece stage, or the second workpiece stage and the third workpiece stage are at the exposure station at the same time. Therefore, at the same time, only one workpiece stage needs to perform the loading and unloading operation at the first loading and unloading station and the third loading and unloading station. Similarly, at the second loading and unloading station and the fourth loading and unloading station, at the same time, only one workpiece stage needs to perform the loading and unloading operation. Therefore, at the same time, there will not be two workpiece stages waiting for the first gripping device or the second gripping device to perform the loading and unloading operation, so there will be no conflict in the action logic of the loading and unloading operation.

[0100] It should be noted that, in the embodiment of the present invention, in order to clearly describe the entire workflow and steps of the direct writing exposure device, it is necessary to clearly describe the entire process of the device from "a certain moment" to the cycle to the next "that moment", so the "starting moment" is defined as: the substrates on the first adsorption structure of the first worktable and the fourth worktable have completed the exposure operation, and at the same time, the first worktable and the fourth worktable are respectively in the first upper and lower plate station and the fourth upper and lower plate station. On the board feeding conveying device at the board feeding conveying station, there are substrates to be exposed that have been transferred from the previous process to it, and on the second conveying device at the second conveying station, there are substrates with exposed front faces that have been transferred from the flipping station to it. The second worktable and the third worktable are now completely in the first exposure station and the second exposure station.

[0101] Specifically, Figure 5 is a flow chart of a control method of a direct-write exposure device according to an embodiment of the present invention. Figure 5 As shown, the following steps are included:

[0102] S1: A gripping mechanism of the first gripping device grabs and transfers the exposed front substrate on the first worktable to the first conveying device at the first conveying station. At the same time, another gripping mechanism grabs the substrate to be exposed from the previous process from the board-in conveying device at the board-in conveying station and transfers it to the suction cup of the first worktable. At the same time, a gripping mechanism of the second gripping device grabs and transfers the exposed reverse substrate on the fourth worktable to the board-out conveying device at the board-out conveying station to transport the exposure device out. Another gripping mechanism of the second gripping device grabs the exposed front substrate from the second conveying device at the second conveying station and transfers it to the first adsorption structure of the fourth worktable. At the same time, the exposure system starts scanning and moving under the action of its driving device, and starts to expose the substrate on the second worktable at the first exposure station and the substrate on the third worktable at the second exposure station. For the convenience of description, the sequence in this exposure process is defined as follows: the substrate on the second worktable is exposed first.

[0103] S2: The first worktable starts to move from the first upper and lower plate station to the first alignment station. When the substrate on the first worktable enters the working range of the first alignment system above the worktable, the first camera unit in the first alignment system grabs the reserved positioning target information on the substrate and calculates the specific position information of the positioning target on the substrate. At the same time, the fourth worktable starts to move from the fourth upper and lower plate station to the fourth alignment station. When the substrate on the fourth worktable enters the working range of the second alignment system above the worktable, the second camera unit in the second alignment system grabs the reserved positioning target information on the substrate and calculates the specific position information of the positioning target on the substrate. From S1 to S2, the second worktable and the third worktable perform exposure operations at their respective exposure stations. At this time, after the fourth worktable completes the alignment calculation, it waits at the fourth alignment station for the substrate on the third worktable to be exposed. At the same time, the substrate that has completed the front exposure and is moved from the first worktable to the first conveying station in S1 is conveyed to the flipping device at the flipping station. After the flipping work is completed (the exposed front side of the substrate is facing down and the back side is facing up), it continues to be conveyed to the second conveying station.

[0104] S3: After the exposure operation on the second workpiece stage is completed, the second workpiece stage starts to move from the first exposure station to the second loading and unloading station. At the same time, the first workpiece stage starts to move from the first alignment station to the first exposure station. After completely entering the exposure station area, it stops and waits for the next exposure process. When the second workpiece stage completely reaches the second loading and unloading station, the second gripping device starts to prepare for the loading and unloading operation. At this time, the substrate on the third workpiece stage is still in the exposure process until the exposure is completed.

[0105] S4: The substrate on the third worktable is completely exposed, and the third worktable moves from the second exposure station to the third upper and lower plate station. At the same time, the fourth worktable, which has completed alignment at the fourth alignment station, begins to move to the second exposure station. After the second worktable completely reaches the second upper and lower plate station, the upper and lower plate operation begins. A gripping mechanism of the second gripping device will grab the substrate that has completed the front and back exposure from the second worktable and transfer it to the plate out conveying device of the plate out conveying station. At the same time, another gripping mechanism grabs a substrate that has been exposed on the front side from the second conveying device at the second conveying station and places it on the first adsorption structure of the second worktable. After completion, the second worktable will move to the second alignment station and start the alignment operation.

[0106] S5: At this time, the first worktable is already in the first exposure station, and the fourth worktable is already in the second exposure station. The exposure system starts the exposure operation according to the substrate (front) alignment target information on the first worktable and the substrate (back) alignment target information on the fourth worktable. In this exposure operation, the movement direction of the exposure system is from the fourth worktable to the first worktable.

[0107] S6: After the third workpiece stage moves from the second exposure station to the third loading and unloading station, the loading and unloading operation begins. A gripping mechanism of the first gripping device grabs the substrate on the third workpiece stage that has completed front exposure, and transfers it to the first conveying device of the first conveying station to transfer it to the flipping device. At the same time, another gripping mechanism grabs an unexposed substrate from the board feeding conveying device at the board feeding conveying station and places it on the first adsorption structure of the third workpiece stage. After completion, the third workpiece stage moves to the third alignment station and starts the alignment operation. After completing the alignment operation, wait at the third alignment station.

[0108] S7: When the substrate on the fourth work stage at the second exposure station completes the exposure operation, the fourth work stage moves to the fourth loading and unloading station. At the same time, the third work stage at the third alignment station moves to the second exposure station.

[0109] S8: After the first workpiece stage at the first exposure station completes the exposure operation, the first workpiece stage starts to move toward the first upper and lower plate station. At the same time, the second workpiece stage that has completed the alignment operation at the second alignment station starts to move toward the first exposure station.

[0110] At this point, the above steps S1 to S8 are repeated until the device stops the exposure operation.

[0111] The control method of the embodiment of the present invention is based on four workpiece tables of a direct-write exposure device, each of which can move independently and work in parallel, and the workpiece table, drive device, alignment system, exposure system and conveying and flipping system are fully integrated into one, which can save a lot of floor space, improve the sealing and cleanliness of the production line, ensure product quality, and use a single exposure system to achieve front and back exposure of the substrate in the same exposure process. The overall structure is evenly and symmetrically arranged, which is more conducive to ensuring accuracy and stability.

[0112] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0113] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A direct writing exposure device, characterized in that: include: A base, wherein the base is provided with a first guide rail and a second guide rail extending in the length direction and arranged in the width direction, wherein a first upper and lower plate station, a first alignment station, a first exposure station, a second alignment station, and a second upper and lower plate station are sequentially defined along the direction of the first guide rail, and a third upper and lower plate station, a third alignment station, a second exposure station, a fourth alignment station, and a fourth upper and lower plate station are sequentially defined along the direction of the second guide rail; A first workpiece stage and a second workpiece stage, wherein the first workpiece stage and the second workpiece stage are both arranged on the first guide rail, the first workpiece stage is adapted to reciprocate along the first guide rail to switch between the first upper and lower plate station, the first alignment station and the first exposure station, and the second workpiece stage is adapted to reciprocate along the first guide rail to switch between the second upper and lower plate, the second alignment station and the first exposure station; a third workpiece stage and a fourth workpiece stage, wherein the third workpiece stage and the fourth workpiece stage are both arranged on the second guide rail, the third workpiece stage is adapted to reciprocate along the second guide rail to switch between the third upper and lower plate station, the third alignment station and the second exposure station, and the fourth workpiece stage is adapted to reciprocate along the second guide rail to switch between the fourth upper and lower plate station, the fourth alignment station and the second exposure station; A driving device, the driving device is used to drive the first workpiece stage and the second workpiece stage to move along the first guide rail, and is used to drive the third workpiece stage and the fourth workpiece stage to move along the second guide rail; A first alignment system, a second alignment system and an exposure system, wherein the first alignment system is arranged corresponding to the first alignment station and the third alignment station, and is used for performing target alignment on the substrates at the first alignment station and the third alignment station, the second alignment system is arranged corresponding to the second alignment station and the fourth alignment station, and is used for performing target alignment on the substrates at the second alignment station and the fourth alignment station, and the exposure system is arranged corresponding to the first exposure station and the second exposure station, and is used for performing exposure processing on the substrates at the first exposure station and the second exposure station; A conveying and flipping system is connected to the base and is located on one side of the base along the width direction, and is used to flip the exposed substrate on the first worktable or the third worktable to the unexposed side, and transfer the flipped substrate to the conveying station on the side where the second worktable or the fourth worktable is located.

2. The direct writing exposure device according to claim 1, characterized in that: The conveying and turning system comprises: A first conveying device, a flipping device and a second conveying device are arranged along the length direction of the base, the first conveying device is used to convey the substrate on the first worktable or the third worktable whose front side has been exposed to the flipping device, the flipping device flips the substrate to obtain a substrate on the back side to be exposed, and conveys the substrate on the back side to be exposed to the second conveying device, and the second conveying device outputs the substrate on the back side to be exposed to the conveying station on the side where the second worktable or the fourth worktable is located.

3. The direct writing exposure device according to claim 1, characterized in that: The exposure system comprises: A first gantry mechanism and a second gantry mechanism, wherein the first gantry mechanism and the second gantry mechanism are arranged in parallel on the base and straddle the first guide rail and the second guide rail, and the first gantry mechanism and the second gantry mechanism are both provided with a third guide rail along the width direction of the base; A mounting seat, two ends of which are mounted on the first gantry mechanism and the second gantry mechanism; An exposure light source, the exposure light source is disposed on the mounting seat, and the exposure light source emits light toward the first exposure station and the second exposure station; A driving member, which is arranged on the first gantry mechanism or the second gantry mechanism, is used to drive the mounting seat to move back and forth along the third guide rail, and the movement range of the exposure light source can cover the size range of the exposure pattern of the substrate.

4. The direct writing exposure device according to claim 3, characterized in that: The exposure light source includes a plurality of exposure units, and the plurality of exposure units are arranged in a plurality of rows along the length direction of the base.

5. The direct writing exposure device according to claim 3, characterized in that: The first alignment system comprises: a first camera unit, the first camera unit being disposed on the first gantry mechanism and being used to obtain a picture of the substrate at the first alignment station or the third alignment station, and to obtain front target position information according to the picture; a first driving unit, the first driving unit being used to drive the first camera unit to move along a width direction of the base; A first lighting unit is provided on the first gantry mechanism.

6. The direct writing exposure device according to claim 3, characterized in that: The second alignment system comprises: a second camera unit, the second camera unit being disposed on the second gantry mechanism and being used for acquiring a picture of the substrate at the second alignment station or the fourth alignment station, and obtaining reverse target position information according to the picture; a second driving unit, the second driving unit being used to drive the second camera unit to move along a width direction of the base; A second lighting unit, wherein the second lighting unit is arranged on the second gantry mechanism.

7. The direct writing exposure device according to claim 1, characterized in that: The first workpiece stage, the second workpiece stage, the third workpiece stage and the fourth workpiece stage all include a first adsorption structure, and the first adsorption structure is used to adsorb a substrate placed on the workpiece stage.

8. The direct writing exposure device according to claim 2, characterized in that: The first conveying device, the flipping device and the second conveying device are all located at one side of the base and are sequentially arranged end to end along the length direction of the base.

9. The direct writing exposure device according to claim 8, characterized in that: The first conveying device and the second conveying device are both provided with a second adsorption structure.

10. The direct writing exposure device according to claim 2, characterized in that: The turning device comprises: A turning shaft, one end of which is rotatably connected to the base; A flip plate, wherein the flip plate is arranged on the flip shaft; The flip driving member is used to drive the flip shaft to rotate, so as to drive the flip plate to flip 180 degrees, so as to flip the substrate to the reverse side and transport it to the second transport device.

11. The direct writing exposure device according to claim 2, characterized in that: The direct-write exposure device also includes: A first gripping device, the first gripping device is used to grip the substrate to be exposed and place it on the first worktable or the third worktable when the first worktable is located at the first upper and lower plate station or the third worktable is located at the third upper and lower plate station, or to grip the substrate on one side of the first worktable or the third worktable that has been exposed to the first conveying device; The second gripping device is used to grip the other side of the substrate to be exposed on the second conveying device and place it on the second worktable or the fourth worktable when the second worktable is located at the second upper and lower plate station or the fourth worktable is located at the fourth upper and lower plate station, or to grip the other side of the substrate on the second worktable or the fourth worktable that has been exposed.

12. The direct writing exposure device according to claim 11, characterized in that: The first grasping device comprises: A third gantry mechanism, the third gantry mechanism being arranged across the base and the first conveying device, and the third gantry mechanism being arranged corresponding to the first upper and lower plate station and the third upper and lower plate station; A first grasping mechanism and a second grasping mechanism, wherein the first grasping mechanism and the second grasping mechanism are both arranged on the third gantry mechanism; A first left-right driving member, which is disposed on the third gantry mechanism and is used to drive the first grabbing mechanism and the second grabbing mechanism to move along the width direction of the base; A first up-and-down driving member is provided on the third gantry mechanism and is used for driving the first grasping mechanism and the second grasping mechanism to move along the height direction of the third gantry mechanism.

13. The direct writing exposure device according to claim 11, characterized in that: The second gripping device comprises: A fourth gantry mechanism, the fourth gantry mechanism being straddled on the base and the second conveying device, and the fourth gantry mechanism being arranged corresponding to the second upper and lower plate station and the fourth upper and lower plate station; A third grabbing mechanism and a fourth grabbing mechanism, wherein the third grabbing mechanism and the fourth grabbing mechanism are both arranged on the fourth gantry mechanism; a second left-right driving member, which is disposed on the fourth gantry mechanism and is used to drive the third grabbing mechanism and the fourth grabbing mechanism to move along the width direction of the base; A second up-and-down driving member is provided on the fourth gantry mechanism and is used for driving the third grasping mechanism and the fourth grasping mechanism to move along the height direction of the fourth gantry mechanism.

14. The direct writing exposure device according to claim 11, characterized in that: The direct-write exposure device also includes: A plate feeding conveying device, which is arranged near the first upper and lower plate stations of the base and is used to convey the substrate to be exposed on the front side so that the first grasping device can grasp it to the first workpiece stage or the third workpiece stage; The plate-out conveying device is arranged near the second upper and lower plate stations of the base, and the second grabbing device grabs the substrate whose back side has been exposed on the second worktable or the fourth worktable to the plate-out conveying device.

15. A control method for a direct writing exposure device, characterized in that: For the direct writing exposure device according to any one of claims 1 to 14, the control method comprises: Control the first workpiece stage and the second workpiece stage to move along the first guide rail, wherein when the first workpiece stage is at the first exposure station for exposure, the second workpiece stage is controlled to be at the second alignment station or the second upper and lower plate station, or when the second workpiece stage is at the first exposure station for exposure, the first workpiece stage is controlled to be at the first alignment station or the first upper and lower plate station; Control the third work stage and the fourth work stage to move along the second guide rail, wherein when the third work stage is exposed at the second exposure station, the fourth work stage is controlled to be at the fourth alignment station or the fourth upper and lower plate station, or when the fourth work stage is exposed at the second exposure station, the third work stage is controlled to be at the third alignment station or the third upper and lower plate station; Among them, the conveying and flipping system of the direct-writing exposure equipment is controlled to flip the substrate exposed on one side on the first worktable or the third worktable and output it to the other side of the conveying and flipping system, so as to provide the flipped substrate to the second worktable or the fourth worktable to expose the other side of the substrate.

16. The control method of the direct writing exposure device according to claim 15, characterized in that: In the same exposure process, the first worktable is controlled to move to the first exposure station to expose the front side of the substrate and the fourth worktable is controlled to move to the second exposure station to expose the back side of the substrate, or the second worktable is controlled to move to the first exposure station to expose the back side of the substrate and the third worktable is controlled to move to the second exposure station to expose the front side of the substrate.

17. The control method of the direct writing exposure device according to claim 15, characterized in that: Combining the first workpiece stage and the second workpiece stage into a first combined workpiece stage, and combining the third workpiece stage and the fourth workpiece stage into a second combined workpiece stage; Control the first combined worktable to move along the first guide rail, wherein the first combined worktable moves to the first upper and lower plate station to transfer the substrate on the first combined worktable that has completed front exposure to the conveying and flipping system, and at the same time place the substrate to be exposed on the front side on the first combined worktable, the first combined worktable moves to the first alignment station, and the first alignment system is controlled to perform front target alignment on the substrate on the first combined worktable, the first combined worktable moves to the exposure station, and the exposure system is controlled to perform front exposure on the substrate, and after the front exposure is completed, the first combined worktable is controlled to move to the first upper and lower plate station; Controlling the conveying and flipping system to flip the substrate that has completed front exposure to a position where the unexposed side faces upward, and conveying the flipped substrate to a second conveying device on one side of the second combined workpiece table; The second combined worktable is controlled to move along the second guide rail, wherein the second combined worktable moves to the fourth upper and lower plate station to take away the substrate on the second combined worktable that has completed reverse exposure, and at the same time, the substrate on the conveying station is placed on the second combined worktable, the second combined worktable moves to the fourth alignment station, and the second alignment system is controlled to perform reverse target alignment on the substrate on the second combined worktable, the second combined worktable moves to the exposure station, and the exposure system is controlled to perform reverse exposure on the substrate, and after the reverse exposure is completed, the second combined worktable is controlled to move to the fourth upper and lower plate station.

18. The control method of the direct writing exposure device according to claim 15, characterized in that: The conveying and flipping system comprises a first conveying device, a flipping device and a second conveying device arranged along the length direction of the base, and the control method further comprises: Controlling the first grabbing device to move along the width direction of the base of the direct writing exposure device to grab the substrate on the first worktable or the third worktable that has completed the front exposure to the first conveying device, and at the same time grabbing the substrate on the front side to be exposed on the plate feeding conveying device to the first worktable or the third worktable; The second grabbing device is controlled to move along the width direction of the base of the direct-writing exposure equipment to grab the substrate whose back side has been exposed on the second worktable or the fourth worktable to the plate output conveying device, and at the same time, the substrate whose back side is to be exposed on the second conveying device is grabbed to the second worktable or the fourth worktable.

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