Substrate cleaning apparatus and substrate cleaning method

Abstract

This invention relates to a substrate cleaning apparatus and a substrate cleaning method. The central region of the lower surface of a substrate held by a first holding part is cleaned by rotating the cleaning apparatus around a central axis while contacting the cleaning apparatus with the central region of the lower surface. The outer region of the lower surface is cleaned by contacting the cleaning apparatus with the outer region of the lower surface of the substrate, which is rotated by a second holding part. A movable base, on which the second holding part and the cleaning apparatus are disposed, is moved in a horizontal plane such that, when the substrate is transferred between the first and second holding parts, the reference position of the first holding part coincides with the central axis of the second holding part in plan view; and when cleaning the central region of the lower surface, the cleaning apparatus overlaps with the central region of the lower surface of the substrate held by the first holding part in plan view, and the central axis of the cleaning apparatus coincides with a first portion of the substrate that is not at the center.

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning the lower surface of a substrate. Background Technology

[0002] Substrate processing apparatus is used to perform various processing on various substrates used in liquid crystal display devices or organic EL (Electroluminescence) display devices, such as substrates for FPD (Flat Panel Display), semiconductor substrates, optical disc substrates, magnetic disk substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, or solar cell substrates. Substrate cleaning apparatus is used to clean the substrates.

[0003] The substrate cleaning apparatus disclosed in Japanese Patent No. 5904169 includes: two adsorption pads for holding the peripheral portion of the back side of a wafer; a rotating chuck for holding the central portion of the back side of the wafer; and a brush for cleaning the back side of the wafer. The two adsorption pads hold the wafer and move it laterally. In this state, the central portion of the back side of the wafer is brushed clean. Then, the rotating chuck receives the wafer from the adsorption pads, rotating the central portion of the back side of the wafer. In this state, the peripheral portion of the back side of the wafer is brushed clean. Summary of the Invention

[0004] To reduce the floor space occupied by the substrate cleaning unit in the cleanroom, miniaturization of the substrate cleaning unit is required. However, it is difficult to miniaturize the substrate cleaning unit in the horizontal direction.

[0005] The purpose of this invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can reduce the increase in occupied area and clean the lower surface of the substrate.

[0006] (1) One embodiment of the substrate cleaning apparatus of the present invention comprises: a first holding portion having a reference position for holding the substrate with its center located at the reference position; a second holding portion having a first central axis extending in a vertical direction for holding the central region of the lower surface of the substrate while rotating the substrate about the first central axis; and a cleaning appliance having a second central axis extending in a vertical direction for cleaning the central region of the lower surface of the substrate by contacting the central region of the lower surface of the substrate held by the first holding portion while rotating about the second central axis, and contacting the substrate rotating through the second holding portion. The lower surface outer region surrounds the central region of the lower surface, thereby cleaning the outer region of the lower surface; and a movable base is provided with a second holding part and a cleaning device, and moves in the horizontal plane in such a way that when the substrate is handed over between the first holding part and the second holding part, the reference position of the first holding part is aligned with the first central axis of the second holding part when viewed from above, and when cleaning the central region of the lower surface, the cleaning device overlaps with the central region of the lower surface of the substrate held by the first holding part when viewed from above, and the second central axis of the cleaning device is aligned with the first part of the substrate that is different from the center.

[0007] In this substrate cleaning apparatus, the substrate is held with its center at a reference position using a first holding part. The substrate is rotated about a first central axis extending vertically while holding the central region of its lower surface using a second holding part. The central region of the lower surface is cleaned by rotating the cleaning apparatus about a second central axis while bringing it into contact with the central region of the substrate held by the first holding part. The outer region of the lower surface surrounding the central region of the substrate, which is being rotated by the second holding part, is then cleaned by bringing the cleaning apparatus into contact with the outer region of the lower surface of the substrate, which is being rotated by the second holding part.

[0008] The second holding part and the cleaning device are mounted on the movable base. When the substrate is transferred between the first holding part and the second holding part, the movable base moves in the horizontal plane such that the reference position of the first holding part is aligned with the first central axis of the second holding part when viewed from above. When cleaning the central area of ​​the lower surface, the movable base moves in the horizontal plane such that the cleaning device overlaps with the central area of ​​the lower surface of the substrate held by the first holding part when viewed from above, and the second central axis of the cleaning device is aligned with the first part of the substrate that is not at the center.

[0009] According to this substrate cleaning apparatus, it is not necessary to move the substrate in a horizontal plane to clean the lower surface of the substrate. Here, when cleaning the central region of the lower surface, a small amount of contaminant may sometimes remain on the first portion of the substrate that is in contact with the second central axis of the cleaning device. However, since the center of the substrate is not in contact with the second central axis of the cleaning device, no contaminant remains in the center of the substrate. Therefore, contaminant from the center of the substrate is essentially not adhering to the second holding portion. Therefore, even when multiple substrates are cleaned sequentially, cross-contamination between multiple substrates via the second holding portion is essentially avoided. This reduces the increase in occupied area and effectively cleans the lower surface of the substrate.

[0010] (2) When cleaning the central area of ​​the lower surface, the movable base can also move further in the horizontal plane in a manner that aligns with the second part of the substrate held by the first holding part, which is different from the first part, when viewed from above. In this case, trace amounts of contaminants remaining in the first part of the substrate are removed. As a result, the lower surface of the substrate can be thoroughly cleaned.

[0011] (3) The second part of the substrate can also be the center of the substrate. According to this configuration, even if the cleaning appliance is not relatively large, the central area of ​​the lower surface of the substrate can be thoroughly cleaned.

[0012] (4) The substrate cleaning apparatus may also include a gas ejection section, which is provided on a movable base. By ejecting gas onto the lower surface of the substrate, the central area or the outer area of ​​the lower surface after cleaning is dried. In this case, the entire lower surface of the substrate dries in a short time as the movable base moves. This improves the cleaning efficiency of the lower surface of the substrate.

[0013] (5) The substrate cleaning apparatus may also include a linear guide rail extending in one direction in the horizontal plane, and the movable base moves linearly along the linear guide rail. In this case, the movable base can be moved in the horizontal plane with a simple configuration.

[0014] (6) The second holding part and the cleaning device may each have a circular shape, and the diameter of the cleaning device is larger than the diameter of the second holding part. In this case, the lower surface of the substrate can be cleaned efficiently using a relatively large cleaning device.

[0015] (7) The substrate and the cleaning device may each have a circular shape, and the diameter of the cleaning device is greater than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be cleaned efficiently using a relatively large cleaning device.

[0016] (8) Another embodiment of the substrate cleaning method of the present invention includes the following steps: holding the substrate with its center at a reference position using a first holding part; rotating the substrate about a first central axis extending in the vertical direction while holding the central region of the lower surface of the substrate using a second holding part; cleaning the central region of the lower surface by rotating the cleaning apparatus about a second central axis extending in the vertical direction while contacting the central region of the lower surface of the substrate held by the first holding part; and contacting the cleaning apparatus with the central region of the lower surface of the substrate that is rotated by the second holding part. The outer region of the lower surface of the domain is cleaned; when the substrate is transferred between the first holding part and the second holding part, the movable base on which the second holding part and the cleaning device are disposed is moved in the horizontal plane in such a way that the reference position of the first holding part is aligned with the first central axis of the second holding part when viewed from above; and when the central region of the lower surface is cleaned, the movable base is moved in the horizontal plane in such a way that the cleaning device overlaps with the central region of the lower surface of the substrate held by the first holding part when viewed from above, and the second central axis of the cleaning device is aligned with the first part of the substrate that is different from the center.

[0017] According to this substrate cleaning method, it is not necessary to move the substrate in a horizontal plane to clean the lower surface of the substrate. Furthermore, when cleaning the central region of the lower surface, the center of the substrate does not contact the second central axis of the cleaning apparatus, and virtually no contaminants from the center of the substrate adhere to the second holding portion. Therefore, even when multiple substrates are cleaned sequentially, cross-contamination between the substrates via the second holding portion is virtually prevented. This reduces the increase in occupied area and effectively cleans the lower surface of the substrate.

[0018] (9) The substrate cleaning method may also include the following step: when cleaning the central region of the lower surface, the movable base is moved in a horizontal plane so that the cleaning apparatus and the second part of the substrate held by the first holding part are aligned with the first part when viewed from above. In this case, trace amounts of contaminants remaining in the first part of the substrate are removed. As a result, the lower surface of the substrate can be thoroughly cleaned.

[0019] (10) The second part of the substrate can also be the center of the substrate. According to this configuration, even if the cleaning appliance is not relatively large, the central area of ​​the lower surface of the substrate can be thoroughly cleaned.

[0020] (11) The substrate cleaning method may also include the following step: drying the central region or outer region of the cleaned lower surface by spraying gas from a gas ejection section provided on a movable base onto the lower surface of the substrate. In this case, the entire lower surface of the substrate dries in a short time as the movable base moves. This improves the cleaning efficiency of the lower surface of the substrate.

[0021] (12) Moving the movable base in the horizontal plane may also include moving the movable base in a straight line along a linear guide rail extending in one direction in the horizontal plane. In this case, the movable base can be moved in the horizontal plane with a simple configuration.

[0022] (13) The second holding part and the cleaning device may each have a circular shape, and the diameter of the cleaning device is larger than the diameter of the second holding part. In this case, the lower surface of the substrate can be cleaned efficiently using a relatively large cleaning device.

[0023] (14) The substrate and the cleaning device may each have a circular shape, and the diameter of the cleaning device is greater than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be cleaned efficiently using a relatively large cleaning device. Attached Figure Description

[0024] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to one embodiment of the present invention.

[0025] Figure 2 It means Figure 1 A three-dimensional view of the internal structure of the substrate cleaning device.

[0026] Figure 3 This is a block diagram showing the configuration of the control system of the substrate cleaning device.

[0027] Figure 4 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0028] Figure 5 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0029] Figure 6 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0030] Figure 7 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0031] Figure 8 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0032] Figure 9 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0033] Figure 10 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0034] Figure 11 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0035] Figure 12 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0036] Figure 13 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0037] Figure 14 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0038] Figure 15 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device.

[0039] Figure 16 It is used to explain Figure 7 A schematic diagram of the cleaning of the central region of the lower surface of the substrate.

[0040] Figure 17 It is used to explain Figure 12 A schematic diagram of the cleaning of the outer region of the lower surface of the substrate.

[0041] Figure 18 This is a top view showing the substrate after the lower surface has been cleaned.

[0042] Figure 19 This is a schematic diagram illustrating the cleaning of the central region of the lower surface of the substrate in the first variation example.

[0043] Figure 20 This is a schematic diagram illustrating the cleaning of the central region of the lower surface of the substrate in the second variation example.

[0044] Figure 21 This is a schematic diagram illustrating the cleaning of the central region of the lower surface of the substrate in the third variation example.

[0045] Figure 22 It means to utilize Figure 3 The flowchart shows the substrate cleaning process performed by the control device. Detailed Implementation

[0046] Hereinafter, the substrate cleaning apparatus and substrate cleaning method according to embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, "substrate" refers to a semiconductor substrate, a substrate for an FPD (Fluorescent Display Device) such as a liquid crystal display device or an organic EL (Organic Electron Display Device), a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, at least a portion of the substrate used in this embodiment has a circular outer periphery. For example, the outer periphery, excluding the positioning groove, is circular.

[0047] (1) Composition of substrate processing device

[0048] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to one embodiment of the present invention. Figure 2 It means Figure 1 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions, which are orthogonal to each other, are defined to clarify the positional relationships. Figure 1 and Figure 2 In subsequent drawings, arrows will be used to indicate the X, Y, and Z directions as appropriate. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction is equivalent to the vertical direction.

[0049] like Figure 1 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening and closing device 90. These components are housed within the unit housing 2. Figure 2 In the middle, the unit shell 2 is represented by a dashed line.

[0050] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upwards from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of the sidewall portion 2b. This opening serves as a loading / unloading outlet 2x for the substrate W, used when loading and unloading the substrate W relative to the unit housing 2. Figure 2 In the diagram, the loading / unloading outlet 2x is indicated by a thick dashed line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading outlet 2x toward the outside of the unit housing 2 (from side wall 2c toward side wall 2b) is referred to as the front, and the opposite direction (from side wall 2b toward side wall 2c) is referred to as the rear.

[0051] An opening and closing device 90 is provided in the area forming the inlet / outlet 2x in the side wall portion 2b and in the vicinity thereof. The opening and closing device 90 includes: a baffle 91 configured to open and close the inlet / outlet 2x; and a baffle drive unit 92 that drives the baffle 91. Figure 2 In the diagram, baffle 91 is indicated by a thick double-dotted line. The baffle drive unit 92 drives the baffle 91 in such a way that the inlet / outlet 2x is opened when the substrate W is loaded into and unloaded relative to the substrate cleaning apparatus 1. In addition, the baffle drive unit 92 drives the baffle 91 in such a way that the inlet / outlet 2x is closed when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0052] A base device 30 is disposed at the center of the bottom portion 2a. The base device 30 includes a linear guide rail 31, a movable base 32, and a base drive unit 33. The linear guide rail 31 includes two tracks, which are arranged to extend from near the side wall portion 2b along the Y direction to near the side wall portion 2c when viewed from above. The movable base 32 is configured to move along the Y direction on the two tracks of the linear guide rail 31. The base drive unit 33 includes, for example, a pulse motor, to move the movable base 32 along the Y direction on the linear guide rail 31.

[0053] On the movable base 32, a lower holding device 20 and a lower surface cleaning device 50 are arranged in a Y-direction configuration. The lower holding device 20 includes an adsorption holding section 21 and an adsorption holding drive section 22. The adsorption holding section 21 is a so-called rotating suction cup, having a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to rotate about a central axis 21c (an axis in the Z direction) extending in the vertical direction. In the following description, when the substrate W is adsorbed and held by the adsorption holding section 21, the area on the lower surface of the substrate W that should be adsorbed by the adsorption surface of the adsorption holding section 21 is called the central region of the lower surface. On the other hand, the area on the lower surface of the substrate W that surrounds the central region of the lower surface is called the outer region of the lower surface.

[0054] The adsorption-holding drive unit 22 includes a motor. The motor of the adsorption-holding drive unit 22 is mounted on the movable base 32 with its rotation axis protruding upwards. The adsorption-holding unit 21 is mounted on the upper end of the rotation axis of the adsorption-holding drive unit 22. Furthermore, an attraction path for adsorbing and holding the substrate W onto the adsorption-holding unit 21 is formed in the rotation axis of the adsorption-holding drive unit 22. This attraction path is connected to an air intake device (not shown). The adsorption-holding drive unit 22 rotates the adsorption-holding unit 21 about its central axis 21c.

[0055] On the movable base 32, near the lower holding device 20, a connecting device 40 is also provided. The connecting device 40 includes multiple (three in this example) support pins 41, pin connecting members 42, and pin lifting drive 43. The pin connecting members 42 are formed to surround the adsorption holding part 21 from a top view, connecting the multiple support pins 41. The multiple support pins 41 extend upward from the pin connecting members 42 by a certain length while being interconnected by them. The pin lifting drive 43 causes the pin connecting members 42 to rise and fall on the movable base 32. As a result, the multiple support pins 41 rise and fall relative to the adsorption holding part 21.

[0056] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection section 53, a lifting support section 54, a movable support section 55, a lower surface brush rotation drive section 55a, a lower surface brush lifting drive section 55b, and a lower surface brush moving drive section 55c. The movable support section 55 is configured to move relative to the lower holding device 20 in the Y direction within a fixed area on the movable base 32. Figure 2 As shown, a lifting support 54 is provided on the movable support 55 in a way that allows it to be raised and lowered. The lifting support 54 has an upper surface 54u that is inclined downward in a direction away from the adsorption and holding part 21 (rearward in this example).

[0057] like Figure 1 As shown, the lower surface brush 51 has a circular shape when viewed from above, and is relatively large in this embodiment. Therefore, the lower surface of the substrate W can be cleaned efficiently. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the adsorption surface of the adsorption holding portion 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding portion 21. In addition, the diameter of the lower surface brush 51 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. Furthermore, the diameter of the substrate W is, for example, 300 mm.

[0058] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. In addition, the lower surface brush 51 is mounted on the upper surface 54u of the lifting support 54 with the cleaning surface facing upward and the cleaning surface being rotatable about a central axis 51c that passes through the center of the cleaning surface and extends in the vertical direction.

[0059] Two liquid nozzles 52 are each mounted on the upper surface 54u of the lifting support 54, positioned near the lower surface brush 51 with the liquid outlet facing upwards. The liquid nozzles 52 are connected to the lower surface cleaning fluid supply unit 56. Figure 3The lower surface cleaning solution supply unit 56 supplies cleaning solution to the liquid nozzle 52. When the substrate W is cleaned using the lower surface brush 51, the liquid nozzle 52 sprays the cleaning solution supplied from the lower surface cleaning solution supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning solution supplied to the liquid nozzle 52.

[0060] The gas ejection section 53 is a slit-shaped gas nozzle with a gas outlet extending in one direction. The gas ejection section 53 is mounted on the upper surface 54u of the lifting support section 54, positioned between the lower surface brush 51 and the adsorption holding section 21 in a top view, with the gas outlet facing upwards. The gas ejection section 53 is connected to the ejected gas supply section 57. Figure 3 The ejected gas supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection unit 53. When the substrate W is cleaned using the lower surface brush 51 and when the lower surface of the substrate W is dried (described later), the gas ejection unit 53 ejects the gas supplied from the ejected gas supply unit 57 onto the lower surface of the substrate W. In this case, a strip-shaped air curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21.

[0061] The lower surface brush rotation drive unit 55a includes a motor that rotates the lower surface brush 51 when cleaning the substrate W using the lower surface brush 51. The lower surface brush lifting drive unit 55b includes a stepper motor or cylinder that raises and lowers the lifting support unit 54 relative to the movable support unit 55. The lower surface brush moving drive unit 55c includes a motor that moves the movable support unit 55 along the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the movable support unit 55 is moved along the Y direction using the lower surface brush moving drive unit 55c, the movable support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 on the movable base 32 when it is closest to the lower holding device 20 is referred to as the approach position, and the position of the lower surface cleaning device 50 on the movable base 32 when it is farthest from the lower holding device 20 is referred to as the departure position.

[0062] A protective cover device 60 is also provided in the center of the bottom part 2a. The protective cover device 60 includes a protective cover 61 and a protective cover drive unit 62. The protective cover 61 is provided in a way that surrounds the lower side retaining device 20 and the base device 30 when viewed from above, and is vertically adjustable. Figure 2In the diagram, the shield 61 is indicated by a dashed line. The shield drive unit 62 moves the shield 61 between a lower shield position and an upper shield position depending on which part of the lower surface of the substrate W is cleaned by the lower surface brush 51. The lower shield position is when the upper end of the shield 61 is at a height lower than the substrate W held by the adsorption and holding unit 21. Conversely, the upper shield position is when the upper end of the shield 61 is at a height higher than the adsorption and holding unit 21.

[0063] At a height slightly above the protective cover 61, a pair of upper holding devices 10A and 10B are arranged opposite each other across the base device 30 when viewed from above. The upper holding devices 10A and 10B have a reference position 10R. The upper holding devices 10A and 10B hold the substrate W with its center located at the reference position 10R. Specifically, the upper holding device 10A includes a lower suction cup 11A, an upper suction cup 12A, a lower suction cup drive unit 13A, and an upper suction cup drive unit 14A. The upper holding device 10B includes a lower suction cup 11B, an upper suction cup 12B, a lower suction cup drive unit 13B, and an upper suction cup drive unit 14B.

[0064] The lower suction cups 11A and 11B are arranged symmetrically about the center of the adsorption holding part 21 and extending vertically in the Y direction (front-to-back direction) when viewed from above, and are configured to move in the X direction within a common horizontal plane. Each of the lower suction cups 11A and 11B has two support plates that can support the lower peripheral surface of the substrate W from below. The lower suction cup driving parts 13A and 13B move the lower suction cups 11A and 11B by either bringing them closer together or moving them further apart.

[0065] Like the lower suction cups 11A and 11B, the upper suction cups 12A and 12B are symmetrically arranged in a vertical plane extending along the Y direction (front-back direction) about the center of the adsorption holding portion 21 when viewed from above, and are configured to move in the X direction within a common horizontal plane. Each of the upper suction cups 12A and 12B has two holding tabs configured to abut against the outer peripheral end of the substrate W to hold the outer peripheral end of the substrate W. The upper suction cup driving portions 14A and 14B move the upper suction cups 12A and 12B by either bringing them closer together or by moving them further apart.

[0066] like Figure 1 As shown, an upper surface cleaning device 70 is disposed on one side of the protective cover 61, near the upper holding device 10B in a top view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0067] The rotating support shaft 71 extends vertically on the bottom part 2a and is supported by the upper surface cleaning drive part 74, allowing it to be raised, lowered, and rotated. Figure 2 As shown, arm 72 is positioned above the upper retaining device 10B, extending horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is mounted on the front end of arm 72.

[0068] The spray nozzle 73 is connected to the upper surface cleaning fluid supply section 75. Figure 3 The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0069] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 71 and rotate the rotating support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W, which is adsorbed, held and rotated by the adsorption and holding unit 21, the entire upper surface of the substrate W can be cleaned.

[0070] like Figure 1 As shown, on the other side of the cover 61, an end cleaning device 80 is provided near the upper holding device 10A in a top view. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush drive unit 84.

[0071] The rotating support shaft 81 is located on the bottom part 2a, extending vertically and capable of both lifting and rotating, and is supported by the inclined brush drive part 84. (Example) Figure 2 As shown, arm 82 is positioned above the upper holding device 10A, extending horizontally from the upper end of the rotary support shaft 81. At the front end of arm 82, a beveled brush 83 is provided, protruding downwards and capable of rotating about an axis in the vertical direction.

[0072] The upper half of the beveled brush 83 has an inverted frustum shape and the lower half has a frustum shape. According to this beveled brush 83, the outer peripheral end of the substrate W can be cleaned using the central portion of the outer peripheral surface in the vertical direction.

[0073] The inclined brush drive unit 84 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 81 and rotate the rotating support shaft 81. According to the above configuration, by bringing the central portion of the outer peripheral surface of the inclined brush 83 into contact with the outer peripheral end of the substrate W which is adsorbed, held, and rotated by the adsorption and holding unit 21, the entire outer peripheral end of the substrate W can be cleaned.

[0074] Here, the bevel brush drive unit 84 also includes a motor built into the arm 82. This motor causes the bevel brush 83, which is located at the front end of the arm 82, to rotate about an axis in the vertical direction. Therefore, when cleaning the outer peripheral end of the substrate W, the cleaning force of the bevel brush 83 on the outer peripheral end of the substrate W is increased by rotating the bevel brush 83.

[0075] Figure 3 This is a block diagram showing the configuration of the control system of the substrate cleaning apparatus 1. Figure 3 The control unit 9 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and storage devices. RAM is used as the CPU's operating area. ROM stores the system program. The storage devices store the control program.

[0076] like Figure 3 As shown, the control device 9 includes a suction cup control unit 9A, an adsorption control unit 9B, a base control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a protective cover control unit 9F, an upper surface cleaning control unit 9G, an inclined surface cleaning control unit 9H, and a loading / unloading control unit 9I as functional units. The functions of the control device 9 are implemented by the CPU executing the substrate cleaning program stored in the RAM. Some or all of the functional units of the control device 9 can also be implemented using hardware such as electronic circuitry.

[0077] The suction cup control unit 9A controls the lower suction cup drive units 13A and 13B and the upper suction cup drive units 14A and 14B to receive the substrate W into the substrate cleaning apparatus 1 and hold the substrate W above the adsorption holding unit 21. The adsorption control unit 9B controls the adsorption holding drive unit 22 to adsorb and hold the substrate W using the adsorption holding unit 21 and to rotate the adsorbed and held substrate W.

[0078] The base control unit 9C controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0079] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 to clean the lower surface of the substrate W. The shield control unit 9F controls the shield drive unit 62 to catch the cleaning liquid splashed from the substrate W by the shield 61 when cleaning the substrate W adsorbed and held by the adsorption and holding unit 21.

[0080] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the adsorption and holding unit 21. The inclined surface cleaning control unit 9H controls the inclined surface brush drive unit 84 to clean the outer peripheral end of the substrate W held by the adsorption and holding unit 21. The loading and unloading control unit 9I controls the baffle drive unit 92 to open and close the loading and unloading outlet 2x of the unit housing 2 when loading and unloading the substrate W into and out of the substrate cleaning apparatus 1.

[0081] (2) General Operation of Substrate Cleaning Equipment

[0082] Figures 4 to 15 It is used to explain Figure 1 A schematic diagram of the general operation of the substrate cleaning device 1. Figures 4 to 15 In each figure, the top section shows a top view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its periphery as viewed along the Y direction, and the bottom section shows a side view of the lower holding device 20 and its periphery as viewed along the X direction. The side view in the middle section corresponds to... Figure 1 The side view of line AA, the side view of the lower segment corresponds to Figure 1 The BB line side view. Furthermore, to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the scaling ratios of some components differ between the top view of the upper section and the side views of the middle and lower sections. Additionally, in Figures 4 to 15 In the diagram, the shield 61 is represented by a double-dotted line, and the shape of the substrate W is represented by a thick single-dotted line.

[0083] In the initial state before the substrate W is moved into the substrate cleaning apparatus 1, the baffle 91 of the opening and closing device 90 closes the loading and unloading outlet 2x. Additionally, as... Figure 1As shown, the lower suction cups 11A and 11B are maintained at a distance from each other that is sufficiently greater than the diameter of the substrate W. Similarly, the upper suction cups 12A and 12B are also maintained at a distance from each other that is sufficiently greater than the diameter of the substrate W. Furthermore, the movable base 32 of the base device 30 is arranged such that, when viewed from above, the center of the adsorption and holding portion 21 is located at the center of the protective cover 61. The lower surface cleaning device 50 is positioned close to the movable base 32. On the lifting support portion 54 of the lower surface cleaning device 50, the cleaning surface (upper end) of the lower surface brush 51 is positioned below the adsorption and holding portion 21.

[0084] Furthermore, in the transfer device 40, the plurality of support pins 41 are positioned lower than the adsorption holding portion 21. Furthermore, in the protective cover device 60, the protective cover 61 is in the lower protective cover position. In the following description, the center position of the protective cover 61 viewed from above is referred to as the planar reference position rp. Additionally, the state of the movable base 32 when the center of the adsorption holding portion 21 is at the planar reference position rp viewed from above is referred to as the first state.

[0085] The substrate W is moved into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is moved in, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 4 As shown by the thick solid arrow a1, the substrate handling robot's hand (substrate holding part) RH (not shown) moves the substrate W into the approximate central position inside the cell housing 2 via the loading / unloading outlet 2x. At this time, as... Figure 4 As shown, the substrate W held by the hand RH is located between the lower suction cup 11A and the upper suction cup 12A and the lower suction cup 11B and the upper suction cup 12B.

[0086] Next, as Figure 5 As shown by the thick solid arrow a2, the lower suction cups 11A and 11B are positioned below the lower peripheral edge of the substrate W, bringing them close together. In this state, the hand RH descends and exits from the loading / unloading outlet 2x. Thus, multiple portions of the lower peripheral edge of the substrate W held by the hand RH are supported by the multiple support pieces of the lower suction cups 11A and 11B. After the hand RH exits, the baffle 91 closes the loading / unloading outlet 2x.

[0087] Next, as Figure 6 As shown by the thick solid arrow a3, the upper suction cups 12A and 12B are brought closer together by abutting against the outer peripheral ends of the substrate W with their multiple retaining tabs abutting against each other. By abutting multiple portions of the outer peripheral ends of the substrate W with the multiple retaining tabs of the upper suction cups 12A and 12B, the substrate W, supported by the lower suction cups 11A and 11B, is further held by the upper suction cups 12A and 12B. Additionally, as... Figure 6As shown by the thick solid arrow a4 in the diagram, the movable base 32 moves forward such that the adsorption holding part 21 is offset from the plane reference position rp by a specified distance, and the center of the lower surface brush 51 is located near the plane reference position rp. This state of the movable base 32 is referred to as the second state.

[0088] Next, as Figure 7 As shown by the thick solid arrow a5, the lifting support 54 rises by contacting the cleaning surface of the lower surface brush 51 with the central region of the lower surface of the substrate W. Additionally, as... Figure 7 As shown by the thick solid arrow a6, the lower surface brush 51 is rotated (rotated) around the central axis 51c. This physically removes contaminants adhering to the central region of the lower surface of the substrate W using the lower surface brush 51.

[0089] exist Figure 7 The following section shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W within a bubble frame. As shown in the bubble frame, with the lower surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection section 53 are held close to the lower surface of the substrate W. At this time, as indicated by the hollow arrow a51, the liquid nozzle 52 sprays cleaning fluid toward the lower surface of the substrate W from a position near the lower surface brush 51. Thus, the cleaning fluid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact portion between the lower surface brush 51 and the substrate W, so that contaminants removed from the back side of the substrate W by the lower surface brush 51 are rinsed away by the cleaning fluid. In this way, in the lower surface cleaning apparatus 50, the liquid nozzle 52 and the lower surface brush 51 are mounted together on the lifting support section 54. This allows for efficient supply of cleaning fluid to the portion where the lower surface of the substrate W is cleaned using the lower surface brush 51. Therefore, the consumption of cleaning fluid can be reduced, and the scattering of excess cleaning fluid can be suppressed.

[0090] Here, the upper surface 54u of the lifting support portion 54 is inclined downwards in a direction away from the adsorption holding portion 21. In this case, when the cleaning liquid containing contaminants drips from the lower surface of the substrate W onto the lifting support portion 54, the cleaning liquid caught by the upper surface 54u is guided away from the adsorption holding portion 21.

[0091] Additionally, when cleaning the lower surface of the substrate W using the lower surface brush 51, such as Figure 7As shown by the hollow arrow a52 within the bubble frame, the gas ejection section 53 sprays gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding section 21. In this embodiment, the gas ejection section 53 is mounted on the lifting support section 54 with the gas injection nozzle extending in the X direction. In this case, when gas is sprayed from the gas ejection section 53 toward the lower surface of the substrate W, a strip-shaped air curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding section 21. As a result, when the lower surface of the substrate W is cleaned using the lower surface brush 51, cleaning liquid containing contaminants can be prevented from scattering toward the adsorption holding section 21. Therefore, when the lower surface of the substrate W is cleaned using the lower surface brush 51, cleaning liquid containing contaminants can be prevented from adhering to the adsorption holding section 21, thereby keeping the adsorption surface of the adsorption holding section 21 clean.

[0092] In addition, Figure 7 In the example, as shown by hollow arrow a52, the gas ejector 53 ejects gas obliquely upwards towards the lower surface brush 51, but the present invention is not limited to this. The gas ejector 53 may also eject gas in the Z direction towards the lower surface of the substrate W. Regarding... Figure 7 The details of cleaning the central region of the lower surface of the substrate W will be described below.

[0093] Next, in Figure 7 In this state, when the cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 stops, and the lifting support 54 descends such that the cleaning surface of the lower surface brush 51 moves away from the substrate W by a specified distance. Additionally, the spraying of cleaning liquid from the liquid nozzle 52 onto the substrate W stops. At this time, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0094] Then, as Figure 8 As shown by the thick solid arrow a7, the movable base 32 is moved rearward with the central axis 21c of the adsorption holding part 21 located at the plane reference position rp, changing the movable base 32 from the second state to the first state. In this case, when viewed from above, the reference position 10R of the upper holding devices 10A and 10B coincides with the central axis 21c of the adsorption holding part 21. At this time, by continuing to spray gas from the gas ejection part 53 onto the substrate W, the central region of the lower surface of the substrate W is dried sequentially using the air curtain.

[0095] Next, as Figure 9 As indicated by the thick solid arrow a8 in the diagram, the lifting support 54 is lowered such that the cleaning surface of the lower surface brush 51 is located below the adsorption surface (upper end) of the adsorption holding part 21. Additionally, as... Figure 9As shown by the thick solid arrow a9, the upper suction cups 12A and 12B move away from each other by separating from the outer periphery of the substrate W. At this time, the substrate W is supported by the lower suction cups 11A and 11B.

[0096] Then, as Figure 9 As shown by the thick solid arrow a10, the pin connecting member 42 is raised such that the upper ends of the plurality of support pins 41 are positioned slightly above the lower suction cups 11A and 11B. As a result, the substrate W supported by the lower suction cups 11A and 11B is received by the plurality of support pins 41.

[0097] Next, as Figure 10 As indicated by the thick solid arrow a11, the lower suction cups 11A and 11B are moved away from each other. At this time, the lower suction cups 11A and 11B are moved to a position that, when viewed from above, does not overlap with the substrate W supported by the multiple support pins 41. As a result, the upper holding devices 10A and 10B are both restored to their initial state.

[0098] Next, as Figure 11 As indicated by the thick solid arrow a12, the pin-connecting member 42 is lowered such that the upper ends of the plurality of support pins 41 are positioned below the adsorption and holding portion 21. As a result, the substrate W supported on the plurality of support pins 41 is received by the adsorption and holding portion 21. In this state, the adsorption and holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Simultaneously with the lowering of the pin-connecting member 42, or after the lowering of the pin-connecting member 42 is completed, as... Figure 11 As indicated by the thick solid arrow a13 in the image, the protective cover 61 is raised from the lower protective cover position to the upper protective cover position.

[0099] Next, as Figure 12 As shown by the thick solid arrow a14, the adsorption holding part 21 is rotated about the central axis 21c (the axis of rotation of the adsorption holding drive part 22). As a result, the substrate W adsorbed and held by the adsorption holding part 21 rotates in a horizontal position.

[0100] Next, the rotating support shaft 71 of the upper surface cleaning device 70 is rotated and lowered. Thus, as... Figure 12 As indicated by the thick solid arrow a15, the spray nozzle 73 moves to a position above the substrate W and descends at a predetermined distance between the spray nozzle 73 and the substrate W. In this state, the spray nozzle 73 sprays a mixture of cleaning liquid and gas onto the upper surface of the substrate W. Additionally, the rotating support shaft 71 is rotated. Thus, as... Figure 12 As indicated by the thick solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto it.

[0101] Furthermore, when the upper surface of the substrate W is cleaned using the spray nozzle 73, the rotating support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 12 As shown by the thick solid arrow a17, the beveled brush 83 moves to a position above the outer peripheral end of the substrate W. It then descends such that the central portion of the outer peripheral surface of the beveled brush 83 contacts the outer peripheral end of the substrate W. In this state, the beveled brush 83 rotates (spins) about its vertical axis. This physically removes contaminants adhering to the outer peripheral end of the substrate W using the beveled brush 83. The contaminants removed from the outer peripheral end of the substrate W are then rinsed by a cleaning solution sprayed from the nozzle 73 onto the substrate W.

[0102] Furthermore, when cleaning the upper surface of the substrate W using the spray nozzle 73, the lifting support 54 is raised by contacting the cleaning surface of the lower surface brush 51 with the outer region of the lower surface of the substrate W. Additionally, as... Figure 12 As shown by the thick solid arrow a18, the lower surface brush 51 rotates (spins) around the central axis 51c. Furthermore, the liquid nozzle 52 sprays cleaning liquid toward the lower surface of the substrate W, and the gas ejection section 53 sprays gas toward the lower surface of the substrate W. Thus, the entire outer region of the lower surface of the substrate W, which is adsorbed, held, and rotated by the adsorption and holding section 21, can be cleaned using the lower surface brush 51.

[0103] Furthermore, when the brush 51 on the lower surface is not relatively large, such as Figure 12 As shown by the thick solid arrow a19, the movable support 55 can also move forward and backward on the movable base 32 between an approach position and a departure position. In this case, the entire outer area of ​​the lower surface of the substrate W, which is held and rotated by the adsorption holding part 21, can also be cleaned using the lower surface brush 51.

[0104] Next, when the cleaning of the upper surface, outer peripheral end, and outer area of ​​the lower surface of the substrate W is complete, the spraying of the mixing fluid from the spray nozzle 73 onto the substrate W is stopped. Additionally, as... Figure 13 As indicated by the thick solid arrow a20, the spray nozzle 73 has moved to a position to one side of the shield 61 (its initial position). Additionally, as... Figure 13 As indicated by the thick solid arrow a21, the inclined brush 83 moves to the other side of the shield 61 (the initial position). Then, the rotation of the lower surface brush 51 is stopped, and the lifting support 54 is lowered such that the cleaning surface of the lower surface brush 51 moves a specified distance away from the substrate W. Additionally, the spraying of cleaning liquid from the liquid nozzle 52 onto the substrate W is stopped, and the spraying of gas from the gas ejection section 53 onto the substrate W is also stopped. In this state, the cleaning liquid adhering to the substrate W is shaken off by the high-speed rotation of the adsorption holding section 21, and the substrate W is completely dry.

[0105] Next, as Figure 14As shown by the thick solid arrow a22, the shield 61 descends from the upper shield position to the lower shield position. Additionally, in preparation for moving the new substrate W into the cell housing 2, as... Figure 14 As shown by the thick solid arrow a23 in the figure, the lower suction cups 11A and 11B are brought close to each other until they can support the new substrate W.

[0106] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is removed, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 15 As shown by the thick solid arrow a24, the hand (substrate holding part) RH of the substrate transfer robot (not shown) enters the unit housing 2 through the transfer inlet / outlet 2x. Then, the hand RH receives the substrate W on the adsorption holding part 21 and exits through the transfer inlet / outlet 2x. After the hand RH exits, the baffle 91 closes the transfer inlet / outlet 2x.

[0107] (3) Cleaning of the lower surface of the substrate

[0108] Figure 16 It is used to explain Figure 7 A schematic diagram illustrating the cleaning of the central region of the lower surface of substrate W. (See diagram below.) Figure 6 As shown by the solid arrow a4 in the diagram, when cleaning the central region R1 of the lower surface of the substrate W, the movable base 32 moves forward to the second state. At this time, as... Figure 16 As shown in the upper section, the central axis 51c of the lower surface brush 51 of the movable base 32 coincides with the center Wc of the substrate W. That is, in a top view, the central axis 51c of the lower surface brush 51 coincides with... Figure 1 The center Wc of the substrate W held by the upper holding devices 10A and 10B overlaps.

[0109] Next, as Figure 16 As shown in the middle section, the lower surface brush 51 is raised so that its cleaning surface contacts the central region R1 of the lower surface of the substrate W. Additionally, the lower surface brush 51 is rotated (rotated) around its central axis 51c. In this case, the cleaning surface of the lower surface brush 51 rubs against the central region R1 of the lower surface of the substrate W, thereby removing contaminants adhering to the central region R1. Thus, the central region R1 of the lower surface of the substrate W is cleaned. Figure 16 The middle section of the washing process is called the first washing process.

[0110] During the first cleaning action, the center of the lower surface brush 51 does not rub against the substrate W. Therefore, contaminants on the substrate W at the center Wc, which contacts the central axis 51c of the lower surface brush 51, may sometimes remain slightly and not be completely removed. Therefore, after the first cleaning action, as... Figure 16As shown in the lower section, by moving the movable base 32, the lower surface brush 51 is moved to a position that overlaps with the substrate W and whose central axis 51c is not aligned with the center Wc of the substrate W.

[0111] In this case, viewed from above, the lower surface brush 51 overlaps with the central region R1 of the lower surface of the substrate W. Furthermore, the central axis 51c of the lower surface brush 51 aligns with the portion Pa of the substrate W that differs from the center Wc. In this state, by rotating the lower surface brush 51 while contacting the lower surface of the substrate W, contaminants remaining in the center Wc of the substrate W that were in contact with the central axis 51c of the lower surface brush 51 during the first cleaning action are removed. This allows for thorough cleaning of the central region R1 of the lower surface of the substrate W. Figure 16 The next step of the washing process is called the second washing process.

[0112] After performing the second washing action, such as Figures 8-11 As shown, the substrate W is dried sequentially, and then delivered from the upper holding devices 10A and 10B to the lower holding device 20. Additionally, as... Figure 12 As shown, the upper surface, outer peripheral surface, and outer area of ​​the lower surface of substrate W are cleaned. Figure 17 It is used to explain Figure 12 A schematic diagram illustrating the cleaning of the outer region of the lower surface of substrate W. When cleaning the upper surface, outer peripheral surface, and outer region of the lower surface of substrate W, as shown... Figure 8 As shown by the solid arrow a7, the movable base 32 moves backward to the first state.

[0113] Next, as Figure 17 As shown, the lower surface brush 51 is raised so that the cleaning surface contacts the outer region R2 of the lower surface of the substrate W. Figure 17 In the process of cleaning the outer region R2 of the lower surface of the substrate W, the lower surface brush 51 is configured such that a portion of it protrudes outward from the substrate W, but the implementation is not limited to this. The lower surface brush 51 may also be configured such that its outer edge overlaps with the outer edge of the substrate W.

[0114] Then, the adsorption holding section 21 rotates around the central axis 21c. Additionally, in this example, the lower surface brush 51 also rotates around the central axis 51c. As a result, the outer region R2 of the lower surface is cleaned. The rotation direction of the lower surface brush 51 can also be opposite to the rotation direction of the adsorption holding section 21. In this case, the outer region R2 of the lower surface of the substrate W can be cleaned efficiently. On the other hand, when cleaning the outer region of the lower surface of the substrate W, the lower surface brush 51 may not rotate around the central axis 51c.

[0115] Figure 18 This is a top view showing the substrate W after its lower surface has been cleaned. Figure 18 In the middle, it is represented by a dot pattern. Figure 1 The area of ​​the lower surface of the substrate W that is cleaned when the movable base 32 is in the second state is shown in a shading pattern as the area of ​​the lower surface of the substrate W that is cleaned when the movable base 32 is in the first state. The area of ​​the lower surface of the substrate W that is cleaned when the movable base 32 is in the second state is the sum of the area of ​​the lower surface of the substrate W that is cleaned during the first cleaning operation and the area of ​​the lower surface of the substrate W that is cleaned during the second cleaning operation.

[0116] In this example, the area of ​​the lower surface of the substrate W that is cleaned when the movable base 32 is in the second state includes the entire central region R1 of the lower surface. Therefore, as Figure 18 As shown, when the movable base 32 is in the second state, the entire central region R1 of the lower surface is cleaned. Additionally, when the movable base 32 is in the second state, the entire outer region R2 of the lower surface is cleaned. The region of the lower surface of the substrate W cleaned when the movable base 32 is in the first state may also partially overlap with the region of the lower surface of the substrate W cleaned when the movable base 32 is in the second state. In this way, by moving the movable base 32 along... Figure 1 The linear guide rail 31 moves, thus cleaning the entire lower surface of the substrate W.

[0117] As described above, in this embodiment, during the first cleaning operation, the central region R1 of the lower surface of the substrate W is cleaned when the central axis 51c of the lower surface brush 51 is aligned with the center Wc of the substrate W. Then, during the second cleaning operation, the central region R1 of the lower surface of the substrate W is cleaned when the central axis 51c of the lower surface brush 51 is aligned with the portion Pa of the substrate W that is different from the center Wc. However, the embodiment is not limited to this.

[0118] Figure 19 This is a schematic diagram illustrating the cleaning of the central region R1 on the lower surface of the substrate W in the first variation example. In the first variation example, as... Figure 19 As shown in the upper section, during the first cleaning action, with the central axis 51c of the lower surface brush 51 aligned with a portion Pa of the substrate W, the central region R1 of the lower surface of the substrate W is cleaned. Then, as... Figure 19 As shown in the lower section, during the second cleaning action, with the central axis 51c of the lower surface brush 51 aligned with the center Wc of the substrate W, the central region R1 of the lower surface of the substrate W is cleaned. Thus, the order of the first and second cleaning actions is not limited when cleaning the central region R1 of the lower surface.

[0119] Figure 20 This is a schematic diagram illustrating the cleaning of the central region R1 on the lower surface of the substrate W in the second variation example. In the second variation example, as... Figure 20As shown in the upper section, during the first cleaning action, with the central axis 51c of the lower surface brush 51 aligned with a portion Pa of the substrate W, the central region R1 of the lower surface of the substrate W is cleaned. Then, as... Figure 20 As shown in the lower section, with the central axis 51c of the lower surface brush 51 aligned with the other parts Pb of the substrate W that are different from Pa, the central region R1 of the lower surface of the substrate W is cleaned.

[0120] In this way, the cleaning of the central region R1 of the lower surface can also be performed when the central axis 51c of the lower surface brush 51 is not aligned with the center Wc of the substrate W. Alternatively, the center Wc of the substrate W can be considered as a portion of Pb, such as... Figure 16 and Figure 19 As in the example, the central region R1 of the lower surface is cleaned when the central axis 51c of the lower surface brush 51 is aligned with the center Wc of the substrate W. With this configuration, even when the lower surface brush 51 is not relatively large, the central region R1 of the lower surface of the substrate W can be thoroughly cleaned.

[0121] Figure 21 This is a schematic diagram illustrating the cleaning of the central region R1 on the lower surface of the substrate W in the third variation example. In the third variation example, as... Figure 21 As shown, the diameter of the lower surface brush 51 is sufficiently large. Specifically, the diameter of the lower surface brush 51 is greater than half the diameter of the substrate W. Therefore, during the first cleaning operation, the lower surface brush 51 completely covers the central region R1 of the lower surface when viewed from above. Furthermore, the central axis 51c of the lower surface brush 51 contacts the portion Pa located outside the central region R1 of the lower surface. In this state, the central region R1 of the lower surface of the substrate W is cleaned.

[0122] In this third variation, the cleaning of the central region R1 of the lower surface is performed even when the central axis 51c of the lower surface brush 51 is not aligned with the center Wc of the substrate W. Furthermore, in this example, the second cleaning operation is not performed. In this case, during the cleaning of the central region R1 of the lower surface, contaminants in the portion of the substrate W Pa that contacts the central axis 51c of the lower surface brush 51 may sometimes remain slightly and not be completely removed.

[0123] However, the portion Pa of the substrate W containing residual contaminants is located further outward than the central region R1 of the lower surface. Therefore, by cleaning the outer region R2 of the lower surface, the contaminants remaining on the portion Pa of the substrate W that is in contact with the central axis 51c of the lower surface brush 51 during the cleaning of the central region R1 of the lower surface are removed. Thus, the entire lower surface of the substrate W can be cleaned.

[0124] (4) Substrate cleaning treatment

[0125] Figure 22 It means to utilize Figure 3 The flowchart shows the substrate cleaning process performed by the control device 9. Figure 22 The substrate cleaning process is performed by the CPU of control device 9 executing a substrate cleaning program stored in the storage device on RAM. Hereinafter, using... Figure 3 Control device 9 Figures 4 to 17 Substrate cleaning apparatus 1 and Figure 22 The flowchart illustrates the substrate cleaning process.

[0126] First, the loading / unloading control unit 9I loads the substrate W into the unit housing 2 by controlling the baffle drive unit 92. Figure 4 , Figure 5 And step S1). Next, the suction cup control unit 9A controls the lower suction cup drive units 13A, 13B and the upper suction cup drive units 14A, 14B, and uses the upper holding devices 10A, 10B to hold the substrate W (and step S1). Figure 5 , Figure 6 and step S2).

[0127] Then, the base control unit 9C controls the base drive unit 33 to move the movable base 32 in such a way that the movable base 32 changes to the second state. Figure 6 And step S3). Then, the lower surface cleaning control unit 9E cleans the entire central area of ​​the lower surface of the substrate W by controlling the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57. Figure 7 , Figure 16 and step S4).

[0128] Next, the lower surface cleaning control unit 9E dries the substrate W by controlling the ejected gas supply unit 57. Figure 8 And step S5). Furthermore, the base control unit 9C controls the base drive unit 33 to move the movable base 32 in a manner that changes the movable base 32 to the first state. Figure 8 (and step S6). In this example, steps S5 and S6 are performed approximately simultaneously. As a result, the central region of the lower surface of the substrate W is dried sequentially.

[0129] Then, the lower suction cup drive units 13A and 13B and the upper suction cup drive units 14A and 14B are controlled by the suction cup control unit 9A, and the transfer control unit 9D controls the pin lifting drive unit 43 to deliver the substrate W from the upper holding devices 10A and 10B to the lower holding device 20. Figures 8-11 And step S7). In this state, the adsorption control unit 9B controls the adsorption holding drive unit 22 to adsorb the central region of the lower surface of the substrate W, and the substrate W is held by the lower holding device 20. Figure 11 and step S8).

[0130] Then, the upper surface cleaning control unit 9G cleans the entire upper surface of the substrate W by controlling the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75. Figure 12 And step S9). Additionally, the inclined surface cleaning control unit 9H cleans the outer peripheral end of the substrate W by controlling the inclined surface brush drive unit 84. Figure 12 And step S10). Furthermore, the lower surface cleaning control unit 9E cleans the entire outer region of the lower surface of the substrate W by controlling the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57. Figure 12 , Figure 17 and step S11).

[0131] Steps S9 to S11 are executed approximately simultaneously. During the execution of steps S9 to S11, the adsorption control unit 9B controls the adsorption holding drive unit 22, causing the substrate W to rotate around the axis of rotation of the adsorption holding drive unit 22. In addition, the shield control unit 9F controls the shield drive unit 62, causing the shield 61 to rise from the lower shield position to the upper shield position.

[0132] After washing, the adsorption control unit 9B controls the adsorption holding drive unit 22 to make the adsorption holding unit 21 rotate at high speed, thereby drying the entire substrate W. Figure 13 (and step S12). After washing and drying, the upper retaining devices 10A and 10B and the protective cover 61 are restored to their initial state. Figure 14 Finally, the loading / unloading control unit 9I moves the substrate W out of the unit housing 2 by controlling the baffle drive unit 92. Figure 15 (And step S13), to end the substrate cleaning process.

[0133] (5) Effect

[0134] In the substrate cleaning apparatus 1 of this embodiment, the substrate W is held by the upper holding devices 10A and 10B with its center located at the reference position 10R. The substrate W is rotated about the central axis 21c while being held by the adsorption holding part 21. The lower surface central region R1 is cleaned by rotating the lower surface brush 51 about the central axis 51c while it contacts the lower surface central region R1 held by the upper holding devices 10A and 10B. The lower surface outer region R2 is cleaned by contacting the lower surface brush 51 with the substrate W rotating through the adsorption holding part 21.

[0135] An adsorption holding section 21, a lower surface brush 51, and a gas ejection section 53 are provided on a movable base 32. When the substrate W is transferred between the upper holding devices 10A and 10B and the adsorption holding section 21, the movable base 32 moves horizontally such that, in plan view, the reference position 10R of the upper holding devices 10A and 10B is aligned with the central axis 21c of the adsorption holding section 21. When cleaning the central region R1 of the lower surface, the movable base 32 moves horizontally such that, in plan view, the lower surface brush 51 overlaps with the central region R1 of the lower surface of the substrate W held by the upper holding devices 10A and 10B, and the central axis 51c of the lower surface brush 51 is aligned with the portion Pa of the substrate W that is not at the center.

[0136] According to this substrate cleaning apparatus 1, it is not necessary to move the substrate W in a horizontal plane in order to clean the lower surface of the substrate W. Here, when cleaning the central region R1 of the lower surface, a portion Pa of the substrate W that is in contact with the central axis 51c of the lower surface brush 51 may sometimes retain trace amounts of contaminants. Therefore, when cleaning the central region R1 of the lower surface, the movable base 32 moves further in a horizontal plane so that, from a top view, the lower surface brush 51 and the portion Pb of the substrate W held by the upper holding devices 10A and 10B that differs from the portion Pa are aligned. As a result, the trace amounts of contaminants remaining in the portion Pa of the substrate W are removed.

[0137] Therefore, no contaminants from the lower surface of the substrate W will adhere to the adsorption holding section 21. Thus, even when multiple substrates W are sequentially cleaned, cross-contamination will not occur between the multiple substrates W via the adsorption holding section 21. This reduces the increase in occupied area and cleans the lower surface of the substrate W.

[0138] The gas ejection section 53 dries the central region R1 or the outer region R2 of the lower surface of the substrate W by ejecting gas onto the lower surface of the substrate W. In this case, the entire lower surface of the substrate W dries in a short time along with the movement of the movable base 32. This improves the cleaning efficiency of the lower surface of the substrate W.

[0139] (6) Other implementation methods

[0140] (a) In the embodiment described above, contaminants on a portion of Pa of the substrate W are removed without residue, but the embodiment is not limited to this. A small amount of contaminants may remain on a portion of Pa of the substrate W. In this case, when cleaning the central region R1 of the lower surface, the center Wc of the substrate W will not contact the central axis 51c of the lower surface brush 51, so no contaminants will remain on the center Wc of the substrate W. Therefore, contaminants from the center Wc of the substrate W will not adhere to the adsorption holding portion 21. Therefore, when multiple substrates W are cleaned sequentially, cross-contamination between the multiple substrates W via the adsorption holding portion 21 will not occur significantly.

[0141] (b) In the embodiment described above, after cleaning the central region R1 of the lower surface of the substrate W at the upper holding devices 10A and 10B, the outer region R2 of the lower surface of the substrate W is cleaned at the lower holding device 20. However, the embodiment is not limited to this. Alternatively, after cleaning the outer region R2 of the lower surface of the substrate W at the lower holding device 20, the central region R1 of the lower surface of the substrate W can be cleaned at the upper holding devices 10A and 10B.

[0142] (c) In the embodiment described above, the substrate cleaning apparatus 1 includes a gas ejection section 53 disposed on the movable base 32, but the embodiment is not limited to this. The substrate cleaning apparatus 1 may also omit the gas ejection section 53. In addition, the gas ejection section 53 may not be disposed on the movable base 32.

[0143] (d) In the embodiment described above, the movable base 32 moves in a straight line in the horizontal plane, but the embodiment is not limited to this. The movable base 32 may also move in a curved line in the horizontal plane.

[0144] (e) In the embodiment described above, the substrate cleaning apparatus 1 includes a transfer device 40 for transferring the substrate W between the upper holding devices 10A, 10B and the lower holding device 20, but the embodiment is not limited to this. If the upper holding devices 10A, 10B and the lower holding device 20 are configured to directly transfer the substrate W, the substrate cleaning apparatus 1 may not include the transfer device 40.

[0145] (f) In the described embodiment, the upper surface and outer peripheral ends of the substrate W are cleaned, but the embodiment is not limited to this. The upper surface of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning apparatus 70. Similarly, the outer peripheral ends of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include the end cleaning apparatus 80.

[0146] (g) In the embodiment described above, the substrate cleaning apparatus 1 includes a control device 9, but the embodiment is not limited thereto. When the substrate cleaning apparatus 1 is configured to be controlled by an external information processing device, the substrate cleaning apparatus 1 may not include a control device 9.

[0147] (7) Correspondence between the constituent elements of the technical solution and the various parts of the implementation method

[0148] The following describes examples of the correspondence between the constituent elements of the technical solution and the elements of the implementation method; however, the present invention is not limited to the examples described below. Various other elements having the structure or function described in the technical solution may also be used as constituent elements of the technical solution.

[0149] In the described embodiment, reference position 10R is an example of a reference position, substrate W is an example of a substrate, center Wc is an example of a center, and upper holding devices 10A and 10B and adsorption holding part 21 are examples of the first and second holding parts, respectively. Central axes 21c and 51c are examples of the first and second central axes, lower surface central region R1 is an example of the lower surface central region, lower surface outer region R2 is an example of the lower surface outer region, and lower surface brush 51 is an example of a cleaning device. Parts Pa and Pb are examples of the first and second parts, respectively, movable base 32 is an example of a movable base, substrate cleaning device 1 is an example of a substrate cleaning device, gas ejection part 53 is an example of a gas ejection part, and linear guide 31 is an example of a linear guide.

Claims

1. A substrate cleaning apparatus, comprising: The first holding part has a reference position and holds the substrate such that the center of the substrate is located at the reference position; The second holding part has a first central axis extending in the vertical direction, which holds the central region of the lower surface of the substrate while allowing the substrate to rotate about the first central axis. A cleaning apparatus having a second central axis extending in the vertical direction, cleans the central region of the lower surface by rotating about the second central axis while contacting the central region of the lower surface of the substrate held by the first holding portion, and cleans the outer region of the lower surface of the substrate surrounding the central region of the lower surface by contacting the outer region of the lower surface of the substrate that is rotated through the second holding portion; and A movable base is provided with the second holding part and the cleaning device, and moves in the horizontal plane in such a way that, when the substrate is transferred between the first holding part and the second holding part, the reference position of the first holding part is aligned with the first central axis of the second holding part when viewed from above; and when the central region of the lower surface is cleaned, the cleaning device overlaps with the central region of the lower surface of the substrate held by the first holding part when viewed from above, and the second central axis of the cleaning device is aligned with the first portion of the substrate that is not at the center; and The second retaining part moves together with the movable base in the horizontal plane.

2. The substrate cleaning apparatus according to claim 1, wherein when cleaning the central region of the lower surface, the movable base moves further in the horizontal plane in such a manner that the cleaning appliance and the second portion of the substrate held by the first holding portion, which is different from the first portion, are aligned in the view above.

3. The substrate cleaning apparatus according to claim 2, wherein the second portion of the substrate is the center of the substrate.

4. The substrate cleaning apparatus according to any one of claims 1 to 3 further comprises a gas ejection section disposed on the movable base, which dries the central region of the lower surface or the outer region of the lower surface after cleaning by ejecting gas onto the lower surface of the substrate.

5. The substrate cleaning apparatus according to any one of claims 1 to 3, further comprising a linear guide rail extending in one direction within the horizontal plane. The movable base moves in a straight line along the linear guide rail.

6. The substrate cleaning apparatus according to any one of claims 1 to 3, wherein the second holding part and the cleaning device each have a circular shape. The diameter of the washing appliance is larger than the diameter of the second retaining part.

7. The substrate cleaning apparatus according to any one of claims 1 to 3, wherein the substrate and the cleaning appliance each have a circular shape. The diameter of the cleaning appliance is greater than 1 / 3 of the diameter of the substrate.

8. A substrate cleaning method, comprising the following steps: The substrate is held in a manner with its center located at a reference position using the first holding part; The substrate is held in the central region of the lower surface by the second holding part while the substrate is rotated about the first central axis extending in the vertical direction. The central region of the lower surface is cleaned by rotating the cleaning device about a second central axis extending in the vertical direction while bringing the cleaning device into contact with the central region of the lower surface of the substrate held by the first holding part. The cleaning appliance is brought into contact with the outer region of the lower surface of the substrate, which is rotated by the second holding part and surrounds the central region of the lower surface, thereby cleaning the outer region of the lower surface. When the substrate is transferred between the first holding part and the second holding part, the movable base on which the second holding part and the cleaning appliance are provided is moved in the horizontal plane such that the reference position of the first holding part is aligned with the first central axis of the second holding part when viewed from above; as well as When cleaning the central region of the lower surface, the movable base moves within the horizontal plane such that, from a top view, the cleaning apparatus overlaps with the central region of the lower surface of the substrate held by the first holding part, and the second central axis of the cleaning apparatus aligns with the first portion of the substrate that is not at the center; and The second retaining part moves together with the movable base in the horizontal plane.

9. The substrate cleaning method according to claim 8 further includes the step of: when cleaning the central region of the lower surface, moving the movable base in the horizontal plane in such a manner that the cleaning appliance and the second part of the substrate held by the first holding part are consistent with the first part when viewed from above.

10. The substrate cleaning method according to claim 9, wherein the second portion of the substrate is the center of the substrate.

11. The substrate cleaning method according to any one of claims 8 to 10, further comprising the step of drying the central region of the lower surface or the outer region of the lower surface after cleaning by spraying gas from a gas ejection portion disposed on the movable base onto the lower surface of the substrate.

12. The substrate cleaning method according to any one of claims 8 to 10, wherein moving the movable base in a horizontal plane comprises moving the movable base in a straight line along a linear guide rail extending in one direction in the horizontal plane.

13. The substrate cleaning method according to any one of claims 8 to 10, wherein the second holding portion and the cleaning apparatus each have a circular shape. The diameter of the washing appliance is larger than the diameter of the second retaining part.

14. The substrate cleaning method according to any one of claims 8 to 10, wherein the substrate and the cleaning apparatus each have a circular shape. The diameter of the cleaning appliance is greater than 1 / 3 of the diameter of the substrate.

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