Wafer chuck and semiconductor processing apparatus

Abstract

The application provides a wafer chuck, comprising a disc body and a splicing assembly; the disc body is provided with a cavity and a first suction surface in a hollow shape, and a plurality of limiting members are arranged on the first suction surface along the circumference of the disc body; the splicing assembly is provided with a second suction surface, and the splicing assembly is movably arranged in the cavity; wherein, when the splicing assembly is in a first position, the splicing assembly extends out of the cavity, so that the second suction surface is spliced to the hollow area of the first suction surface; and when the splicing assembly is in a second position, the splicing assembly is withdrawn into the cavity, so that the hollow area of the first suction surface is exposed. The wafer chuck of the application can be compatible with the measurement and inspection of non-hollow chucks and the measurement and inspection of hollow chucks, so that the compatibility of the wafer chuck is greatly improved, the equipment space is saved, and the time cost and risk caused by manual replacement of wafer chucks are reduced.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, specifically relating to a wafer chuck and semiconductor processing equipment. Background Technology

[0002] Current methods for measuring critical wafer dimensions, steps, and thickness require vacuum suction using non-perforated chucks. However, measuring total warpage thickness does not require vacuum suction and necessitates the use of perforated chucks. Inspecting the front side of a wafer requires non-perforated chucks, while inspecting the back side requires perforated chucks. Currently, the main methods for meeting wafer measurement and inspection needs are increasing chamber size and replacing chucks. However, increasing chamber size increases equipment size and cost, while frequent chuck replacements increase wasted time and unnecessary labor.

[0003] To address the aforementioned issues, it is necessary to propose a wafer chuck and semiconductor processing device that is reasonably designed and effectively solves these problems. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a wafer chuck and semiconductor device.

[0005] One aspect of the present invention provides a wafer chuck, the wafer chuck comprising a chuck body and a splicing assembly;

[0006] The disc body is provided with a cavity and a perforated first adsorption surface, and the first adsorption surface is provided with multiple limiting members along the circumference of the disc body; the splicing assembly is provided with a second adsorption surface, and the splicing assembly is movably disposed within the cavity; wherein...

[0007] When the splicing assembly is in the first position, the splicing assembly extends out of the cavity, such that the second adsorption surface is spliced ​​onto the hollow area of ​​the first adsorption surface; and,

[0008] When the splicing component is in the second position, the splicing component retracts into the cavity to expose the hollow area of ​​the first adsorption surface.

[0009] Optionally, the splicing assembly includes a fixed base, a rotating base, multiple guide structures, multiple splicing blades, and multiple connectors;

[0010] The fixed base is fixed to the disc body, and the rotating base is arranged around the outside of the fixed base and can rotate around the fixed base.

[0011] The plurality of guide structures are disposed on the rotating base, the first end of each splicing blade is rotatably disposed on the fixed base, the second end of each splicing blade is fixedly connected to the corresponding connector, and the connector is movably connected to the corresponding guide structure.

[0012] Optionally, the guide structure is a guide groove disposed on the rotating base, and the connecting member is slidably disposed in the guide groove.

[0013] Optionally, the guide structure is a guide rod disposed on the rotating base;

[0014] The first end of the guide rod is rotatably mounted on the rotating base, and the second end of the guide rod is fixedly connected to the connector.

[0015] Optionally, the wafer chuck further includes a drive motor, the output shaft of which is connected to the rotating base in a transmission manner.

[0016] Optionally, each of the spliced ​​blades is provided with a second adsorption surface, and the second adsorption surface is provided with a plurality of first pores;

[0017] The wafer chuck also includes a first vent pipe, the first end of which is connected to an air source, and the second end of which is connected to a plurality of the first air holes.

[0018] Optionally, the connector is provided with a central opening, and the second end of the first vent pipe passes through the central opening and connects to a plurality of the first air holes; wherein,

[0019] The diameter of the axial opening is larger than the diameter of the first vent pipe.

[0020] Optionally, a first groove is provided on the side of the second adsorption surface facing the fixed base, and the first vent pipe is fixed in the first groove.

[0021] Optionally, the wafer chuck further includes a second vent pipe, and the first adsorption surface is provided with a plurality of second vent holes;

[0022] The first end of the second vent tube is used to connect to a gas source, and the second end of the second vent tube is connected to the plurality of second air holes; wherein,

[0023] A second groove is provided on the side of the first adsorption surface facing the fixed base, and the second vent pipe is fixed in the second groove.

[0024] Another aspect of the present invention provides a semiconductor processing apparatus, including the wafer chuck described above.

[0025] The wafer chuck of the present invention includes a disk body and a splicing assembly. The disk body has a cavity and a first, hollowed-out adsorption surface, and the first adsorption surface has multiple limiting members arranged along the circumference of the disk body. The splicing assembly has a second adsorption surface and is movably disposed within the cavity. When the splicing assembly is in a first position, it extends out of the cavity so that the second adsorption surface is spliced ​​into the hollowed-out area of ​​the first adsorption surface. When the splicing assembly is in a second position, it retracts into the cavity to expose the hollowed-out area of ​​the first adsorption surface. The wafer chuck of the present invention is compatible with both non-hollowed-out chucks for measurement and inspection, and also compatible with hollowed-out chucks for measurement and inspection, greatly improving the compatibility of the wafer chuck, saving equipment space, and reducing the time cost and risk associated with manual wafer chuck replacement. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a wafer chuck in a hollowed-out state according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of a wafer chuck in a non-cutout state according to another embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the splicing component in the first position according to another embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the splicing component in the second position according to another embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the splicing component in the first position according to another embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the splicing component in the second position according to another embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of the structure of the first vent pipe and connector in another embodiment of the present invention. Detailed Implementation

[0033] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] like Figure 1 and Figure 2As shown, one aspect of the present invention provides a wafer chuck 100, which includes a chuck body 110 and a splicing assembly 120. The chuck body 110 is provided with a cavity (not shown) and a hollowed-out first adsorption surface 111. The first adsorption surface 111 is provided with a plurality of limiting members 130 along the circumference of the chuck body 110. The splicing assembly 120 is provided with a second adsorption surface 121 and is movably disposed within the cavity.

[0035] When the splicing component 120 is in the first position, it extends out of the cavity so that the second adsorption surface 121 is spliced ​​onto the hollow area of ​​the first adsorption surface 111. When the splicing component 120 is in the second position, it retracts into the cavity to expose the hollow area of ​​the first adsorption surface 111.

[0036] It should be noted that in this embodiment, the limiting member 130 can be a limiting post, with multiple limiting posts equally spaced along the circumference of the disk body 110. The number of limiting members 130 is not specifically limited in this embodiment. When the wafer chuck 100 is in a hollowed-out state, vacuum adsorption of the wafer is not required; at this time, the limiting member 130 provides limiting protection for the wafer.

[0037] It should be noted that in this embodiment, the disc body 110 is annular in shape with a hollow area in the middle, and the corresponding first adsorption surface 111 is also annular, with the middle area of ​​the first adsorption surface 111 also being a hollow area.

[0038] When using, such as Figure 2 As shown, when measuring key dimensions, steps, thickness, etc. of a wafer, or inspecting the front side of a wafer, vacuum adsorption of the wafer is required. A non-perforated chuck needs to be used. At this time, the splicing component 120 is in the first position, that is, the splicing component 120 extends out of the cavity so that the second adsorption surface 121 is spliced ​​to the perforated area of ​​the first adsorption surface 111 to form a non-perforated chuck. Vacuum adsorption of the wafer is performed through the spliced ​​first adsorption surface 111 and second adsorption surface 121.

[0039] like Figure 1 As shown, when measuring the total warpage thickness or inspecting the back side of a wafer, vacuum suction is not required. Instead, a chuck with a cutout is needed. In this case, the splicing assembly 120 is in the second position, that is, the splicing assembly 120 is retracted into the cavity to expose the cutout area of ​​the first adsorption surface 111, thus forming a cutout chuck.

[0040] The wafer chuck of the present invention is compatible with both non-cutout chucks for measurement and inspection and cutout chucks for measurement and inspection, which greatly improves the compatibility of the wafer chuck, saves equipment space, and reduces the time cost and risk caused by manual replacement of wafer chucks.

[0041] For example, such as Figures 3 to 6 As shown, the splicing assembly 120 includes a fixed base 122, a rotating base 123, multiple guide structures (not shown in the figure), multiple splicing blades 125, and multiple connectors 126.

[0042] The fixed base 122 is fixed to the disk body 110. In this embodiment, the fixed base 122 can be fixed to the disk body 110 by bolts, or other fixing methods can be used. This embodiment does not make specific limitations.

[0043] The rotating base 123 surrounds the fixed base 122 and can rotate around the fixed base 122. In this embodiment, the disc 110 is annular with a hollow area in the middle, and the central area of ​​the fixed base 122 is the hollow area corresponding to the disc 110. The shape of other parts of the fixed base 122 and the rotating base 123 is not limited in this embodiment. For example, the shape of the rotating base 123 can be annular, polygonal, etc.

[0044] Multiple guide structures are provided on the rotating base 123. The rotation of the rotating base 123 around the fixed base 122 will drive the multiple guide structures to move.

[0045] The first end of each splicing blade 125 is rotatably mounted on the fixed base 122, and the second end of each splicing blade 125 is fixedly connected to the corresponding connector 126. The connector 126 is movably connected to the corresponding guide structure 124.

[0046] It should be noted that, in this embodiment, a first fixed shaft 122a is provided on the fixed base 122, and the first end of each splicing blade 125 is hinged to the first fixed shaft 122a to enable the first end of each splicing blade 125 to rotate around the first fixed shaft 122a. The fixed shaft 122a can be a pin, a bearing, or other structures, as long as it enables the first end of the splicing blade 125 to rotate around the first fixed shaft 122a. This embodiment does not impose any specific limitations.

[0047] It should be noted that in this embodiment, the connector 126 can be a bolt, and each splicing blade 125 has a screw hole at its second end. The second end of each splicing blade 125 is fastened to the first end of the bolt through the screw hole, and the second end of the bolt is movably connected to the corresponding guide structure. Of course, the connector 126 can also adopt other structures, and this embodiment does not make specific limitations.

[0048] It should be further noted that in this embodiment, the splicing blade 125 can be a fan blade or a blade of other shapes. The splicing blade 125 uses five fan blades, which completely fill the hollow area of ​​the first adsorption surface 111 when unfolded. Correspondingly, there are also five guide structures, with one guide structure corresponding to each splicing blade 125. This embodiment does not specifically limit the shape and number of splicing blades 125, and they can be selected according to actual needs. The number of guide structures can be the same as the number of splicing blades 125.

[0049] Specifically, when the wafer chuck 100 needs to be in a non-hollowed-out state, the rotating base 123 rotates around the fixed base 122 in the first direction (which can be counterclockwise). The rotation of the rotating base 123 drives the guide structure to move, and the corresponding connector 126 moves to drive the first end of the splicing blade 125 to rotate around the first fixed axis 122a, thereby causing the splicing blade 125 to extend out of the cavity of the disk body 110. At this time, multiple splicing blades 125 are spliced ​​and filled in the hollowed-out area of ​​the first adsorption surface 111, so that the second adsorption surface 121 is spliced ​​in the hollowed-out area of ​​the first adsorption surface 111, thereby making the wafer chuck 100 in a non-hollowed-out state.

[0050] When the wafer chuck 100 needs to be in a hollowed-out state, the rotating base 123 rotates around the fixed base 122 in the second direction (which can be clockwise). The rotation of the rotating base 123 drives the guide structure 124 to move, and the corresponding connector 126 moves to drive the first end of the splicing blade 125 to rotate around the first fixed axis 122a, thereby causing the splicing blade 125 to retract into the cavity of the disk body 110 to expose the hollowed-out area of ​​the first adsorption surface 111, thereby making the wafer chuck 100 in a hollowed-out state.

[0051] In the above embodiments, the rotation of the rotating base 123 drives the guide structure to move, thereby causing the splicing blade 125 to extend or retract into the cavity of the disk body 110 to form a non-hollowed-out suction cup and a hollowed-out suction cup. This greatly improves the compatibility of the wafer suction cup 100, saves equipment space, and reduces the time cost and risk caused by manual replacement of the wafer suction cup 100.

[0052] For example, such as Figure 3 and Figure 4 As shown in one embodiment of the present invention, the guiding structure is a guide groove 124a disposed on the rotating base 123, and a connector 126 is slidably disposed in the guide groove 124a. That is, the rotation of the rotating base 123 drives the guide groove 124a to move, so that the connector 126 drives the second end of the splicing blade 125 to slide in the guide groove 124a, thereby driving the first end of the splicing blade 125 to rotate around the first fixed axis 122a, so that the splicing blade 125 extends or retracts into the cavity of the disc body 110.

[0053] Specifically, such as Figure 3 As shown, when the wafer chuck 100 needs to be in a non-hollowed-out state, the rotating base 123 rotates counterclockwise around the fixed base 122. The rotation of the rotating base 123 drives the guide groove 124a to move. Correspondingly, the connector 126 slides in the guide groove 124a toward the fixed base 122, thereby driving the first end of the splicing blade 125 to rotate counterclockwise around the first fixed axis 122a, so that the splicing blade 125 extends out of the cavity of the disk body 110. At this time, multiple splicing blades 125 are spliced ​​and filled in the hollowed-out area of ​​the first adsorption surface 111, so that the second adsorption surface 121 is spliced ​​in the hollowed-out area of ​​the first adsorption surface 111, thereby making the wafer chuck 100 in a non-hollowed-out state.

[0054] like Figure 4 As shown, when the wafer chuck 100 needs to be in a hollowed-out state, the rotating base 123 rotates clockwise around the fixed base 122. The rotation of the rotating base 123 drives the guide groove 124a to move. Correspondingly, the connector 126 slides in the guide groove 124a in a direction away from the fixed base 122, thereby driving the first end of the splicing blade 125 to rotate clockwise around the first fixed axis 122a, so that the splicing blade 125 is retracted into the cavity of the disk body 110 to expose the hollowed-out area of ​​the first adsorption surface 111, thereby making the wafer chuck 100 in a hollowed-out state.

[0055] In the above embodiments, the rotation of the rotating base 123 drives the guide groove 124a to move, so that the connector 126 drives the second end of the splicing blade 125 to slide in the guide groove 124a, thereby driving the first end of the splicing blade 125 to rotate around the first fixed axis 122a, so that the splicing blade 125 extends or retracts into the cavity of the disk body 110, forming a non-hollowed-out suction cup and a hollowed-out suction cup, which greatly improves the compatibility of the wafer suction cup 100, saves equipment space, and reduces the time cost and risk caused by manual replacement of the wafer suction cup 100.

[0056] For example, such as Figure 5 and Figure 6 As shown, in another embodiment of the present invention, the guide structure is a guide rod 124b disposed on the rotating base 123. The first end of the guide rod 124b is rotatably disposed on the rotating base 123, and the second end of the guide rod 124b is fixedly connected to the connector 126.

[0057] In this embodiment, a second fixed shaft 124c is fixedly mounted on the rotating base 123. The first end of the guide rod 124b is hinged to the second fixed shaft 124c, thereby enabling the first end of the guide rod 124b to rotate around the second fixed shaft 124c, so that the splicing blade 125 extends or retracts into the cavity of the disc body 110. The second fixed shaft 124c can be a pin, a bearing, or other structures, as long as it allows the first end of the splicing blade 125 to rotate around the first fixed shaft 122a. This embodiment does not impose specific limitations.

[0058] It should be noted that the connector 126 can be a bolt, and the second end of the guide rod 124b can be fastened to the connector 126 through a screw hole. The connector 126 and the guide rod 124b can also adopt other structures; this embodiment does not impose specific limitations, and limitations can be made according to actual needs.

[0059] Specifically, such as Figure 5 As shown, when the wafer chuck 100 needs to be in a non-hollowed-out state, the rotating base 123 rotates counterclockwise around the fixed base 122. The rotation of the rotating base 123 drives the first end of the guide rod 124b to rotate counterclockwise around the second fixed axis 124c. Correspondingly, the second end of the guide rod 124b drives the first end of the splicing blade 125 to rotate counterclockwise around the first fixed axis 122a, so that the splicing blade 125 extends out of the cavity of the disk body 110. At this time, multiple splicing blades 125 are spliced ​​and filled in the hollowed-out area of ​​the first adsorption surface 111, so that the second adsorption surface 121 is spliced ​​in the hollowed-out area of ​​the first adsorption surface 111, thereby making the wafer chuck 100 in a non-hollowed-out state.

[0060] like Figure 6 As shown, when the wafer chuck 100 needs to be in a hollowed-out state, the rotating base 123 rotates clockwise around the fixed base 122. The rotation of the rotating base 123 drives the first end of the guide rod 124b to rotate clockwise around the second fixed axis 124c. Correspondingly, the second end of the guide rod 124b drives the first end of the splicing blade to rotate clockwise around the first fixed axis 122a, so that the splicing blade 125 is retracted into the cavity of the disk body 110 to expose the hollowed-out area of ​​the first adsorption surface 111, thereby making the wafer chuck 100 in a hollowed-out state.

[0061] In the above embodiments, the rotation of the rotating base 123 drives the first end of the guide rod 124b to rotate around the second fixed axis 124c, so that the second end of the guide rod 124b drives the first end of the splicing blade 125 to rotate around the first fixed axis 122a, so that the splicing blade 125 extends or retracts into the cavity of the disk body 110, thereby forming a non-hollowed-out suction cup and a hollowed-out suction cup. This greatly improves the compatibility of the wafer chuck 100, saves equipment space, and reduces the time cost and risk caused by manual replacement of the wafer chuck 100.

[0062] For example, the wafer chuck 100 also includes a drive motor (not shown in the figure), the output shaft of which is connected to the rotating base 123 to drive the rotating base 123 to rotate around the fixed base 122. In this embodiment, the drive shaft of the drive motor can be connected to a gear assembly disposed on the rotating base 123 to drive the rotating base 123 to rotate.

[0063] In the above embodiments, the rotation of the rotating base 123 is controlled by a drive motor, which improves the speed at which the splicing blades 125 extend or retract into the chamber of the disc body 110, making the operation convenient and quick.

[0064] For example, such as Figures 2 to 7 As shown, each spliced ​​blade 125 is provided with a second adsorption surface 121, and the second adsorption surface 121 is provided with a plurality of first pores 121a.

[0065] The wafer chuck 100 also includes a first vent pipe 140, the first end of which is connected to a gas source, and the second end of which is connected to a plurality of first vent holes 121a.

[0066] In this embodiment, the first end of the first vent pipe 140 is used to connect to a vacuum source to provide a vacuum source for a plurality of first vents 121a, thereby controlling the wafer.

[0067] In this embodiment, each second adsorption surface 121 is provided with 3 to 4 first pores 121a, but other numbers of first pores 121a may also be provided; this embodiment does not impose a specific limitation. The multiple first pores 121a are arranged in a matrix, but other arrangements may also be used.

[0068] For example, such as Figure 7 As shown, the connector 126 is provided with a central opening 126a, and the second end of the first vent pipe 140 passes through the central opening 126a and connects to a plurality of first air holes 121a. The diameter of the central opening 126a is larger than the diameter of the first vent pipe 140.

[0069] It should be noted that if the splicing blade 125 and the guide structure 124 are not on the same plane, then the axial opening 126a is an oblique hole, which increases the length of the first vent pipe 140 and reduces the impact of the opening and closing movement of the splicing blade 125 on the first vent pipe 140. If the splicing blade 125 and the guide structure are on the same plane, then the axial opening 126a only needs to be a through hole.

[0070] In the above embodiments, the second end of the first vent pipe 140 passes through the axial opening 126a and is connected to a plurality of first air holes 121a. The diameter of the axial opening 126a is larger than the diameter of the first vent pipe 140. This way, when the splicing blade 125 extends or retracts into the chamber of the disc body 110, it will not affect the first vent pipe 140 from supplying air to the first air holes 121a.

[0071] For example, a first groove (not shown in the figure) is provided on the side of the second adsorption surface 121 facing the fixed base 122, and a first vent pipe 140 is fixed in the first groove.

[0072] For example, such as Figure 2 As shown, the wafer chuck 100 also includes a second vent pipe (not shown in the figure), and the first adsorption surface 111 is provided with a plurality of second vent holes 111a. The first end of the second vent pipe is used to connect to an air source, and the second end of the second vent pipe is connected to the plurality of second vent holes 111a.

[0073] In this embodiment, the first end of the second vent pipe is used to connect to a vacuum source to provide a vacuum source for multiple second vents 111a, thereby controlling the wafer.

[0074] In this embodiment, the number of second pores 111a provided on each first adsorption surface 111 is not specifically limited in this embodiment. The multiple second pores 111a are arranged in a matrix, but other arrangements can also be used.

[0075] A second groove (not shown in the figure) is provided on the side of the first adsorption surface 111 facing the fixed base 122, and a second vent pipe is fixed in the second groove.

[0076] Another aspect of the present invention provides a semiconductor processing apparatus, including the wafer chuck 100 described above. The specific structure of the wafer chuck 100 has been described in detail above and will not be repeated here.

[0077] The semiconductor processing equipment of the present invention, by setting up a wafer chuck 100, saves space in the semiconductor equipment on the one hand, and greatly improves the compatibility of the semiconductor processing equipment on the other hand, reducing the time cost and risks caused by manual replacement of wafer chucks.

[0078] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer chuck, characterized in that, The wafer chuck includes a disk body and a splicing assembly; The disc body is provided with a cavity and a perforated first adsorption surface, and the first adsorption surface is provided with multiple limiting members along the circumference of the disc body; the splicing assembly is provided with a second adsorption surface, and the splicing assembly is movably disposed within the cavity; wherein... When the splicing assembly is in the first position, the splicing assembly extends out of the cavity, such that the second adsorption surface is spliced ​​onto the hollow area of ​​the first adsorption surface; and, When the splicing assembly is in the second position, the splicing assembly retracts into the cavity to expose the hollow area of ​​the first adsorption surface; The splicing assembly includes a fixed base, a rotating base, multiple guide structures, multiple splicing blades, and multiple connectors; The fixed base is fixed to the disc body, and the rotating base is arranged around the outside of the fixed base and can rotate around the fixed base. The plurality of guide structures are disposed on the rotating base, the first end of each splicing blade is rotatably disposed on the fixed base, the second end of each splicing blade is fixedly connected to the corresponding connector, and the connector is movably connected to the corresponding guide structure.

2. The wafer chuck according to claim 1, characterized in that, The guide structure is a guide groove provided on the rotating base, and the connecting member is slidably disposed in the guide groove.

3. The wafer chuck according to claim 1, characterized in that, The guide structure is a guide rod disposed on the rotating base; The first end of the guide rod is rotatably mounted on the rotating base, and the second end of the guide rod is fixedly connected to the connector.

4. The wafer chuck according to any one of claims 1 to 3, characterized in that, The wafer chuck also includes a drive motor, the output shaft of which is connected to the rotating base.

5. The wafer chuck according to any one of claims 1 to 3, characterized in that, Each of the spliced ​​blades is provided with a second adsorption surface, and the second adsorption surface is provided with a plurality of first pores; The wafer chuck also includes a first vent pipe, the first end of which is connected to a vacuum source, and the second end of which is connected to a plurality of the first air holes.

6. The wafer chuck according to claim 5, characterized in that, The connector is provided with a central opening, and the second end of the first vent pipe passes through the central opening and connects to a plurality of the first vent holes; wherein... The diameter of the axial opening is larger than the diameter of the first vent pipe.

7. The wafer chuck according to claim 6, characterized in that, The second adsorption surface has a first groove on the side facing the fixed base, and the first vent pipe is fixed in the first groove.

8. The wafer chuck according to any one of claims 1 to 3, characterized in that, The wafer chuck also includes a second vent pipe, and the first adsorption surface is provided with a plurality of second vent holes; The first end of the second vent tube is used to connect to a vacuum source, and the second end of the second vent tube is connected to the plurality of second air holes; wherein, A second groove is provided on the side of the first adsorption surface facing the fixed base, and the second vent pipe is fixed in the second groove.

9. A semiconductor processing apparatus, characterized in that, Includes the wafer chuck as described in any one of claims 1 to 8.

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