Cut and folded displays with 3d compound curvature

Abstract

This invention describes a display structure and a method of manufacturing the display structure, the display structure including a display panel having a curved three-dimensional film profile. In an embodiment, the display panel includes a display area having a main region and a plurality of lobes extending from the main region. These lobes are folded into a curved three-dimensional (3D) film profile and are separated by corresponding grooves between the lobes. These grooves may be filled with various seam-concealing materials to visually blur the grooves.

Description

[0001] Related patent applications

[0002] This patent application claims priority to U.S. Provisional Application No. 63 / 022,360, filed May 8, 2020; U.S. Provisional Application No. 63 / 022,363, filed May 8, 2020; and U.S. Provisional Application No. 63 / 022,367, filed May 8, 2020, the entire contents of each of which are incorporated herein by reference. Background Technology Technical Field

[0004] The implementation scheme described in this article relates to a display system. Background Technology

[0006] Existing displays used in electronic devices such as wearable devices, portable electronic devices, desktop computers, and televisions are based on liquid crystal display (LCD) or organic light-emitting diode (OLED) technology. Recently, it has been proposed to incorporate micro-LEDs based on emitting inorganic semiconductors into high-resolution displays, potentially improving energy efficiency and reducing the likelihood of reduced lifespan and moisture sensitivity.

[0007] Traditionally, display panel edges have included non-display areas along the sides of the display panel to accommodate the connection of components associated with the display panel's function. The current trend is towards minimizing edge areas to maximize the display area size of the display panel. This can be attributed to both aesthetic appeal and the need for a touch interface. Even recently, it has been proposed to extend the display area along the curved edges of the device. In one embodiment, the display panel includes a curved two-dimensional film or 2.5D film profile that curves around an axis near the edge of the display panel. Summary of the Invention

[0008] The embodiments describe a display structure and a method of manufacturing the display structure, the display structure including a display panel having a curved three-dimensional film profile. In one embodiment, the display structure includes a display panel having pixel circuitry connected to an LED matrix within a display area of ​​the display panel. The display area includes a main region and a plurality of lobes extending from the main region. Cutouts are formed through the display panel and define a first edge of a first lobe and a second edge of a second lobe among the plurality of lobes. According to the embodiment, the first and second lobes are folded into a curved three-dimensional (3D) film profile, and grooves are located within the curved 3D film profile between the first and second lobes. The cutout pattern used to form the lobes may include straight cuts, orthogonal straight cuts, zigzag patterns, etc. Additionally, various pixel patterns, subpixel arrangements, and tile patterns are described to accommodate the cutout patterns.

[0009] Various lamination techniques are described according to embodiments to achieve precise alignment of the lobes in order to reduce the visibility of grooves. In one embodiment, a method of forming a display structure includes laminating a back film layer onto a bottom mold having a 3D composite surface curvature, and laminating a display panel onto the back film layer on the bottom mold. The display panel includes a cutout pattern defining a plurality of lobes, and laminating the display panel includes folding the plurality of lobes into a curved 3D film profile on top of the laminated back film layer. Passive, guided, and active alignment techniques can be used to perform lamination. In one embodiment, an active alignment technique includes pulling one or more connecting lines of the back film layer attached between the display panel and the bottom mold to fold the plurality of lobes. In another embodiment, an active alignment technique includes pulling a plurality of tabs along the periphery of a protective film to fold the plurality of lobes. In yet another embodiment, an active alignment technique includes pulling strips of protective film tabs to fold the lobes.

[0010] The implementation also describes various structures for concealing seams, or for obscuring the visibility of grooves by filling them with one or more seam materials, as well as the integration of polarization layer stacks, diffusers, and black matrix materials. Attached Figure Description

[0011] Figure 1 This is a schematic top view illustration of a display panel including a main area and multiple lobes extending from the main area, according to the implementation scheme.

[0012] Figure 2 A perspective view of a display panel comprising multiple lobes folded into a curved three-dimensional (3D) membrane profile, according to an embodiment.

[0013] Figure 3 An isometric view of a mobile phone according to the implementation scheme.

[0014] Figure 4 An isometric view of a flat-panel computing device according to the implementation plan.

[0015] Figure 5 An isometric view of a wearable device according to the implementation plan.

[0016] Figure 6 An isometric view of a laptop computer according to the implementation scheme.

[0017] Figure 7 This is a system diagram of a portable electronic device according to the implementation plan.

[0018] Figure 8A This is a schematic top view of a block-based display panel with cutouts and spline corners according to the implementation scheme.

[0019] Figure 8BThis is a schematic top view illustration of a matrix of pixel driver chips including multiple pixels for switching and driving LEDs, according to an embodiment.

[0020] Figure 9 This is a close-up schematic cross-sectional side view of a portion of a display panel including an embedded pixel driver chip according to an embodiment.

[0021] Figure 10 A schematic top view illustration of an LED or pixel array and pixel driver chip superimposed on multiple lobes of a three-dimensional (3D) film profile folded into a curved shape, according to an embodiment.

[0022] Figure 11 This is a schematic top view illustration of a straight cut pattern formed in the corner of the display panel according to the implementation scheme.

[0023] Figure 12 A close-up illustration of a straight cut pattern passing through a grid-patterned LED matrix, according to the implementation scheme.

[0024] Figure 13 This is a close-up illustration of a folded display panel with a straight cutout pattern passing through a grid-patterned LED matrix, according to an embodiment.

[0025] Figure 14 This is a schematic top view illustration of a cut pattern with orthogonal straight line cuts formed in the corner of the display panel according to the implementation scheme.

[0026] Figure 15 This is a close-up illustration of a cut pattern with orthogonal straight line cuts through a grid-patterned LED matrix, according to the implementation scheme.

[0027] Figure 16 This is a schematic top view illustration of a Z-shaped cutout pattern formed in the corner of the display panel according to the implementation scheme.

[0028] Figure 17 A close-up illustration of a Z-shaped cut pattern passing through a grid-patterned LED matrix, according to the implementation scheme.

[0029] Figure 18 This is a close-up illustration of a folded display panel with a Z-shaped cutout pattern passing through a grid-patterned LED matrix, according to an embodiment.

[0030] Figure 19 This is a schematic top view illustration of a cut pattern with merged grooves according to the implementation scheme.

[0031] Figure 20 This is a close-up schematic top view illustration of a cutout pattern with merging grooves passing through a pixel array according to an embodiment.

[0032] Figure 21 This is a close-up illustration of a straight line cut pattern passing through a pixel matrix according to the implementation scheme.

[0033] Figure 22 A close-up illustration of a Z-shaped cut pattern passing through a pixel matrix according to the implementation scheme.

[0034] Figure 23A A close-up illustration of a straight-line cut pattern traversing pixels outside the grid, according to the implementation scheme.

[0035] Figure 23B This is a schematic top view illustration of a plurality of lobes arranged with off-grid pixels adjacent to the trench, according to an implementation scheme.

[0036] Figure 24A The illustration is a schematic top view of a trench formed between a pair of pixels according to an embodiment, the pair of pixels including a main LED row and a redundant LED row.

[0037] Figure 24B The illustration is a schematic top view of a trench formed between a pair of pixels according to an implementation scheme, where the redundant LED of one pixel is closest to the trench.

[0038] Figure 24C This is a schematic top view illustration of a trench formed by redundant LEDs within a pixel, according to an implementation scheme.

[0039] Figure 24D This is a schematic top view illustration of a trench formed by a pair of pixels according to an implementation scheme, wherein the redundant LED is closest to the trench.

[0040] Figure 25 This is a schematic top view illustration of a pixel array with clustered sub-pixels according to the implementation scheme.

[0041] Figure 26A This is a schematic top view illustration of a straight-line cut pattern above a regular array of matrix blocks according to the implementation scheme.

[0042] Figure 26B This is a schematic top view illustration of an orthogonal straight line cut pattern above a regular array of matrix blocks according to the implementation scheme.

[0043] Figure 27 This is a schematic top view illustration of a Z-shaped cutout pattern above a regular array of matrix blocks according to the implementation scheme.

[0044] Figure 28AThis is a schematic top view illustration of a Z-shaped cutout pattern through a grid of corner matrix tiles and pixel driver chips according to an embodiment, the grid having a different xy spacing than the grid of pixel driver chips and matrix tiles in the body of the display panel.

[0045] Figure 28B This is a schematic top view illustration of a corner matrix block comprising a pixel driver chip for switching and driving LEDs, according to an embodiment.

[0046] Figure 29A This is a schematic top view illustration of a global wiring path extending through multiple lobes according to the implementation scheme.

[0047] Figure 29B This is a schematic diagram of a global wiring path through a pair of matrix blocks within a lobe, according to the implementation scheme.

[0048] Figures 30A to 30I This is a schematic side view illustration of a method for forming a display structure according to an implementation scheme.

[0049] Figures 31A to 31J This is a schematic diagram of a method for using a protective film laminated display panel with a lower connecting wire, according to an implementation scheme.

[0050] Figures 32A to 32G This is a schematic diagram of a method for laminating a display panel with a protective film having tension tabs, according to an implementation scheme.

[0051] Figure 33 This is a schematic top view illustration of the strip lamination method according to the implementation plan.

[0052] Figure 34 This is a schematic cross-sectional side view of the strip lamination method according to the implementation plan.

[0053] Figures 35A to 35B A schematic cross-sectional side view and top view illustration of diffuse reflection at the edge of the groove between the lobes according to the implementation scheme.

[0054] Figures 36A to 36B The illustrations are schematic cross-sectional side and top views of the specular reflection along the lobe according to the implementation scheme.

[0055] Figures 37A to 37P This is a schematic cross-sectional side view illustration of various joint concealment structures according to the implementation plan.

[0056] Figure 38 This is a schematic cross-sectional side view illustrating a method for forming a display structure on a display panel having a convex 3D film profile, according to an embodiment.

[0057] Figure 39This is a schematic cross-sectional side view illustrating a method for forming a display structure on a cover plate having a concave 3D film profile, according to an embodiment.

[0058] Figures 40A to 40D The illustration is a schematic cross-sectional side view of a display structure according to an embodiment, which includes a polarizer stack and a display panel with a curved three-dimensional (3D) film profile.

[0059] Figures 41A to 41E This is a schematic cross-sectional side view of various polarization layer stack structures for seam concealment according to the implementation scheme. Detailed Implementation

[0060] The embodiments describe display panel configurations and manufacturing techniques for forming display panel areas with three-dimensional (3D) composite film curvature. Specifically, the embodiments describe display panel cutting and folding concepts to facilitate folding 2D display panel films, for example, along corner or dome-shaped displays, into 3D composite film curvatures.

[0061] In one embodiment, the display structure includes a display panel comprising pixel circuitry connected to a matrix of light-emitting diodes (LEDs) within a display area of ​​the display panel. The display area may include a main region and multiple lobes extending from the main region. For example, the main region may be flat, dome-shaped, or curved with a 2.5D curvature. One or more cuts are formed through the display panel to define the edges of the lobes. The cuts according to the embodiment may be provided by cutting techniques such as laser cutting, or alternatively, pre-patterned. According to the embodiment, the lobes are folded into a 3D film profile, with grooves between adjacent lobes and within the curved 3D film profile.

[0062] In one aspect, embodiments describe solutions for integrating conventional 2D display panel architectures to form folded 3D composite film curvatures. In some embodiments, specific cutout designs are described to mitigate optical artifacts associated with cuts through LEDs, cuts through display panel wiring, or misalignment of the folded LED matrix. Exemplary designs may include specific cutout patterns, pixel arrangements, subpixel clusters, pixel driver chip arrangements, and global wiring paths.

[0063] On the other hand, the implementation describes a 3D lamination technique for achieving precise flap alignment. Exemplary 3D lamination techniques include passive, guided, and active alignment techniques. Exemplary active alignment techniques include pressure molding and strip lamination using an oversized protective membrane with tension tabs.

[0064] On the other hand, the embodiments describe trench (or seam) concealment techniques to reduce optical emission artifacts (such as light emission at the edges of trenches) and optical reflection artifacts (such as visible trenches (white) when the display is off or visible trenches (dark) when the display is on). Various trench filling and polarizer structures to aid in trench concealment are described.

[0065] In another aspect, the implementation describes a polarizer coating sequence that forms a polarization layer directly on a 3D surface.

[0066] Various embodiments are described with reference to the accompanying drawings. However, certain embodiments may be practiced without one or more of these specific details or in combination with other known methods and constructions. In the following description, numerous specific details such as particular configurations, dimensions, and processes are shown to provide a thorough understanding of the embodiments. In other instances, well-known processes and manufacturing techniques have not been described in particular detail so as not to unnecessarily obscure the embodiments. The phrase "an embodiment" as used throughout the specification means that a particular feature, structure, construction, or characteristic described in connection with an embodiment is included in at least one embodiment. Therefore, the repeated use of the phrase "in an embodiment" throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, construction, or characteristic may be combined in any suitable manner in one or more embodiments.

[0067] As used herein, the terms “above,” “over,” “to,” “between,” “across,” and “on” can refer to the relative position of one layer with respect to other layers. A layer being “above,” “over,” “across,” or “on” with respect to another layer, or being “in contact” with another layer, can mean directly contacting other layers or having one or more intermediary layers. A layer being “between” multiple layers can mean directly contacting those multiple layers or having one or more intermediary layers.

[0068] See now Figures 1 to 2 , Figure 1 A schematic top view of a display panel 103 including a main area 102 and a plurality of lobes 106 extending from the main area 102, according to an embodiment. Figure 2 This is a perspective view of a display panel 103 according to an embodiment, comprising multiple lobes 106 folded into a curved 3D film profile. More specifically, Figure 2 for Figure 1 An illustration of the curved edge 108 of a flat, pre-cut display panel 103 after folding. (See diagram) Figures 1 to 2As shown, a cut 112 is formed through the display panel 103 to define an edge 114 of the lobe 106 and a corresponding groove 116, which will be present before and after folding into a curved 3D film profile. Thus, the display area 105 of the display panel 103 can extend near the edge 118 of the display panel 103 along the curved edge 108 and the lobe 106 folded into a curved 3D film profile. According to an embodiment, the body area 102 can be flat or curved and can be surrounded by the curved edge 108, including those curved edges of the lobe 106 folded into a curved 3D film profile. The edge 108 may also include a curved 2D film profile, such as a straight edge between the corners of the display panel.

[0069] Figures 3 to 6 Various portable electronic systems in which various implementation schemes can be realized are shown. Figure 3 An exemplary mobile phone 300 is shown, which includes a display structure comprising a display area 105 encapsulated in a housing 302. Figure 4 An exemplary tablet computing device 400 is shown, which includes a display structure comprising a display area 105 enclosed in a housing 402. Figure 5 An exemplary wearable device 500 is shown, which includes a display structure comprising a display area 105 encapsulated in a housing 502. Figure 6 An exemplary laptop computer 600 is shown, including a display structure comprising a display area 105 enclosed in a housing 602. In each embodiment, the display structure may have a display area 105 with a curved three-dimensional (3D) film contour.

[0070] Figure 7 A system diagram of an embodiment of a portable electronic device 700 including the display structure 110 described herein is shown. The portable electronic device 700 includes a processor 720 for managing the system and executing instructions, and a memory 740. The memory includes non-volatile memory, such as flash memory, and may additionally include volatile memory, such as static or dynamic random access memory (RAM). The memory 740 may additionally include a portion dedicated to read-only memory (ROM) for storing firmware and configuration utilities.

[0071] The system also includes a power module 780 (e.g., a flexible battery, wired or wireless charging circuitry, etc.), a peripheral interface 708, and one or more external ports 790 (e.g., Universal Serial Bus (USB), HDMI, display port, and / or others). In one embodiment, the portable electronic device 700 includes a communication module 712 configured to interact with one or more external ports 790. For example, the communication module 712 may include one or more transceivers that operate according to IEEE standards, 3GPP standards, or other communication standards, 4G, 5G, etc., and are configured to receive and transmit data via one or more external ports 790. The communication module 712 may additionally include one or more WWAN transceivers configured to communicate with a wide area network including one or more cellular towers or base stations to communicatively connect the portable electronic device 700 to additional devices or components. Furthermore, the communication module 712 may include one or more WLAN and / or WPAN transceivers configured to connect the portable electronic device 700 to a local area network and / or personal area network, such as a Bluetooth network.

[0072] The portable electronic device 700 may also include a sensor controller 770 to manage input from one or more sensors, such as, for example, a proximity sensor, an ambient light sensor, or an infrared transceiver. In one embodiment, the system includes an audio module 731 that includes one or more speakers 734 for audio output and one or more microphones 732 for receiving audio. In one embodiment, the speakers 734 and microphones 732 may be piezoelectric components. The portable electronic device 700 also includes an input / output (I / O) controller 722, a display structure 110, and additional I / O components 718 (e.g., buttons, keys, lights, LEDs, cursor control devices, haptic devices, etc.). The display structure 110 and additional I / O components 718 can be considered as forming parts of the user interface (e.g., parts of the portable electronic device 700 associated with presenting information to the user and / or receiving input from the user).

[0073] Figure 8A This is a schematic top view of a tile-based display panel 103 with a notch 109 and a spline corner according to an embodiment. For example, the spline corner may be a rounded edge including a lobe 106 folded into a curved 3D film profile. The tile-based display panel may include an arrangement of pixel driver chips 150 to drive a local pixel matrix. Figure 8BThis is an example of a matrix block 155 comprising a pixel driver chip 150 for switching and driving multiple pixels 107 of LEDs 104. This can include a direct driving method, where each pin of the pixel driver chip 150 is connected to an LED, or a Local Passive Matrix (LPM) arrangement, where pins of the pixel driver chip 150 can be connected to a string of LEDs. In an embodiment, this can be an LPM block 155. The LPM arrangement according to the embodiment can significantly reduce the silicon area associated with the pixel driver and lower the peak panel current. In some embodiments, the pixel driver chips are distributed among the LEDs. Such a configuration can include pixel driver chips 150 laterally located among LEDs 104 on the same side of the display panel. Depending on complexity, the pixel driver chips can be longer than the corresponding LED matrix they control (e.g., wider than the row length of the corresponding matrix). Therefore, the pixel driver chips can be, for example, staggered in rows in a zigzag pattern. It is not necessary to mount the pixel driver chips on the same surface as the LEDs or between the LEDs. According to all embodiments described herein, the pixel driver chip 150 may also be located within the display panel and may be positioned upwards (e.g., having terminals facing the LED 104), downwards (e.g., having terminals facing away from the LED), or both (having terminals located on the top and bottom sides). Therefore, where the pixel driver chip is described herein as distributed or scattered around the display area, it should be understood that the pixel driver chip may be located on the display substrate (e.g., surface-mount) or embedded within the display panel. According to all embodiments described herein, the pixel driver chip may be adjacent to a corresponding plurality of pixels. Again, this includes both configurations where the pixel driver chip is on or within the display panel.

[0074] Specifically, the arrangement of the pixel driver chips 150 according to the embodiment eliminates the need for driver protrusions on the edges of the display panel 103. Therefore, the display panel 103 can have a reduced or zero boundary outside the display area. This configuration facilitates the formation of a display panel with curved edges and an internal notch 109. Furthermore, this configuration facilitates modular arrangement of display tiles, including miniaturized arrangements. Generally, the control circuitry 810 can be coupled to the edge of the display panel 103. A bus array of global wiring 802 can extend from the control circuitry 810 to provide global signals to the display panel 103. For example, global wiring 802 may include at least a data clock line, a transmit clock line, and a vertical select token (VST) line. The global wiring is coupled to multiple “hybrid” pixel driver chips and together forms the backbone of the display. A corresponding backbone hybrid pixel driver chip receives the global signals and then transmits the manipulated signals to the corresponding row of its row line 804, which connects to other pixel driver chips 150 within the same row. For example, the global data clock signal and the transmit clock signal can be converted into manipulated signals and transmitted along manipulated data clock lines and manipulated transmit clock lines to a row pixel driver chip 150. For example, the manipulated signals may include only the necessary information for a specific row.

[0075] The tile-based display panel according to the implementation scheme can have display tiles arranged in various ways. For example, the display tiles can be arranged side by side (horizontally), stacked (vertically), a combination of both, or in other configurations. In addition, the bus columns of the global wiring 802 can be aligned and connected for stacked display tiles.

[0076] Figure 9 This is a close-up schematic cross-sectional side view of a portion of a display panel 103 including an embedded pixel driver chip 150 according to an embodiment. The manufacturing method may include transferring an array of pixel driver chips 150 to a display substrate 130. For example, the display substrate 130 may be a flexible substrate, such as glass, polyimide, etc. An adhesive layer 132 may optionally be formed on the display substrate 130 to receive the pixel driver chips 150. The transfer may be achieved using pick-and-place tools. In an embodiment, the back side (non-functionalized) side is placed on the adhesive layer 132, with the front side (active side, including contact pads 152) facing upwards. The contact (terminal) pads 152 may be formed before or after the transfer. As shown, a passivation layer 134 may be formed around the pixel driver chip 150, for example, to secure the pixel driver chip 150 to the display substrate 130 and provide step coverage for additional wiring. Suitable materials for the passivation layer 134 include polymers, spin-coated glass, oxides, etc. In the implementation scheme, the passivation layer is a thermosetting material, such as acrylic acid, epoxy resin, benzocyclobutene (BCB), etc.

[0077] A redistribution layer (RDL) 140 can then be formed over the array of pixel driver chips 150. The RDL 140 may fan out from contact (terminal) pads 152, for example, and may additionally include wiring to / from control circuitry 810. The RDL 140 may include one or more redistribution lines 138 and a dielectric layer 136. For example, the redistribution lines 138 may be metal wires (e.g., Cu, Al, etc.), and the dielectric layer 136 may be formed of a suitable insulating material, including oxides (e.g., SiOx), nitrides, polymers, etc. According to embodiments, the RDL 140 includes one or more of a plurality of global wirings 802 and row lines 804 (e.g., data signals, line sync signals, frame sync signals, and vertical sync tokens (VST), Vdd, etc.) for signals and power. The RDL 140 also includes driver pads 113 for LEDs 104. According to some embodiments, each string of LEDs may be connected to a corresponding interconnect (e.g., a string or line).

[0078] At this stage of the manufacturing process, the partially produced display panel 103 can be tested to determine the operability of the pixel driver chip 150. This can be done, for example, by probing the driver pads 113 or other test circuitry formed within the RDL 140. For example, the RDL 140 may include test circuitry with test pads at the edge of the display panel 103, which can be probed to test the functionality of the pixel driver chip 150. This test can be performed before or after the transfer of the LEDs 104. In an embodiment, the test circuitry can be removed from the edge of the display panel 103 after testing, for example, during the formation of the notch pattern.

[0079] exist Figure 9 In the illustrated LED manufacturing process, additional dielectric and wiring layers may optionally be formed, after which the LED 104 is transferred and bonded to the stacked structure. In one embodiment, the LED 104 is optionally bonded inside a shore structure opening 144 in the shore layer 142. The shore structure opening 144 may optionally be reflective and may optionally be filled after the micro-LED 104 is bonded. The shore layer 142 may be further patterned to create openings 146 to expose wiring layers, such as (e.g., negative) voltage power lines 115 or cathodes. A top transparent or translucent conductive layer 148 may then be deposited to provide electrical connections from the top side of the LED 104 to the voltage power lines or cathodes. Suitable materials include transparent conductive oxides (TCOs), conductive polymers, thin transparent metal layers, etc.

[0080] An emitting stack 111, including a pixel driver chip 150 and an LED 104, can be formed by forming the illustrated stacked structure with a top transparent or semi-transparent conductive layer 148. According to some embodiments, a display panel 103 may include at least the emitting stack 111, with a notch 112 patterned through (e.g., completely through) the display panel. The display panel 103 may optionally include additional layers through which the notch 112 is formed. For example, a black matrix layer 166 may be formed above the emitting stack 111. According to embodiments, the black matrix layer 166 may reduce internal reflections (e.g., specular reflections) of the emitting stack 111, including reflections from electrical wiring and the pixel driver chip 150. An increased area of ​​the black matrix layer may correspond to a reduction in the reflectivity of the emitting stack 111. The black matrix layer may be formed of suitable materials (such as polymers and glass) and may include organic dye-based absorbers (including mixed molecular dyes) and pigment-based absorbers, or microparticles for absorbing specific visible wavelengths of the spectrum. In embodiments, the black matrix layer includes carbon black microparticles. Furthermore, an outer coating 149 may be formed over the emission stack 111. The outer coating 149 may be an optically transparent material, such as acrylate, silicone, etc., and may have a variety of functions, such as mechanical protection, bonding leveling (e.g., with polarizing layer 170), and chemical passivation (e.g., from the environment).

[0081] For example, the polarizing layer 170 can be applied to the emitting stack 111 using an optically transparent adhesive layer 165 (e.g., acrylate, silicone adhesive, etc.), followed by cutting to form a notch pattern 112. As will become apparent in the following description, the display panel 103 may include various stacks.

[0082] The dimensions of the LED 104 and pixel driver chip 150 according to the embodiment can be scaled from macroscopic to microscopic. In the embodiment, the maximum length of the pixel driver chip 150 can be less than 400 μm, or even less than 200 μm. When surface mounted, the pixel driver chip 150 can have a further reduced xy dimension with a scale equal to the pixel pitch. For displays with high resolution and pixel density, the maximum size of the micro-LED according to the embodiment can be less than 100 μm, or even less than 20 μm, such as less than 10 μm, or even less than 5 μm.

[0083] See now Figure 10 A schematic top view illustration is provided of an array of LEDs 104 or pixels 107 and a pixel driver chip 150 superimposed on multiple lobes 106 folded into a curved three-dimensional (3D) membrane profile. Specifically, Figure 10Several specific obstacles to overcome when forming a notch pattern are illustrated. Specifically, the notch pattern may form a groove 116 through the LED 104 or a group of pixels, rendering a particular LED or pixel inoperable. Similarly, when designing the notch pattern, it may be necessary to avoid the pixel driver chip 150. Furthermore, the notch pattern may not be aligned with the pixel grid, and pixel grid misalignment may occur between adjacent lobes during folding when the notch pattern (groove) widens (e.g., it must adapt to a specified curvature).

[0084] The kerf, according to the implementation scheme, can be provided by cutting techniques such as laser cutting, or alternatively, pre-patterning. A specific cutting technique can be selected based on the lane width and height of the LED and pixel arrangement. In the implementation scheme, cutting is performed using a femtosecond laser to achieve a narrow spot (kerf) size or width. Due to the small LED size and the stability of micro-LEDs based on inorganic semiconductors, cut and folded display structures and techniques may be particularly suitable for micro-LED displays, which are less prone to degradation due to environmental exposure compared to OLEDs.

[0085] See now Figure 11 A schematic top view illustration of a straight cutout pattern formed in the corner of a display panel according to an embodiment is provided. As shown, before folding, the edge 114 of the lobe 106 is a straight line, and the width of the groove 116 can increase with the distance along the flat display panel 103. The increased width can accommodate folding at a larger radius. Figure 12 A close-up illustration of such a straight-line cut pattern passing through a matrix of 104 or 107 LEDs in a grid pattern before folding. Figure 13 This is a close-up illustration of a display panel with a straight-line cut pattern after folding.

[0086] In one embodiment, the display structure includes a display panel 103, which includes pixel circuitry (e.g., pixel driver chip 150, RDL 140, etc.) connected to a matrix of LEDs 104 within a display area 105 of the display panel 103. The display area 105 includes a main area 102 (e.g., this may be flat or curved) and a plurality of lobes 106 extending from the main area 102. A cutout exists in the display panel 103 defining a first edge 114 of a first lobe 106 and a second edge 114 of a second lobe 106, wherein a groove 116 is located between the first and second edges 114. According to another embodiment, the lobes 106 are folded into a curved 3D film profile, wherein the groove 116 is located within the curved 3D film profile between the first and second lobes 106.

[0087] The first lobe may include a first array of LEDs 104 (and pixels 107) positioned in a first grid 202 having a first repeating xy pixel spacing, and the second lobe includes a second array of LEDs 104 (and pixels 107) positioned in a second grid 204 having a second repeating xy pixel spacing. Figure 13 As shown, the first grid 202 can be offset from the second grid 204, even though the xy pixel spacing of both the first grid 202 and the second grid 204 is the same. Although the first grid 202 and the second grid 204 can have the same orientation before folding (e.g., see...), Figure 12 However, the first grid 202 and the second grid 204 may be offset due to folding (e.g., see...). Figure 13 See also Figures 12 to 13 The result of a straight-line cut pattern is that the cut may not necessarily align with the LED / pixel array or grid. Therefore, the cut may result in dead pixels and irregular LED / pixel spacing across the cut line or groove 116 after folding, which can lead to optical artifacts along the groove 116 between adjacent lobes 106. The groove 116 between the folded lobes 106 is also described herein as a seam between lobes. The various cut patterns and pixel and matrix tile arrangements described herein can be designed to further mask or hide optical artifacts that may result from folding the geometry into a composite 3D film profile. Furthermore, seam hiding techniques can be additionally combined with filling the groove 116 with various materials, depositing materials or layers near the groove, and various polarization layer structures. Therefore, the final display structure may include a combination of the various embodiments described herein to achieve the necessary composite 3D film profile, optical artifact mitigation, and seam hiding.

[0088] See now Figures 14 to 15 This illustrates a variation of a straight-line cut pattern with orthogonal straight-line cuts in the corners of a display panel. Grooves 116 or cuts can be made between rows or columns of LEDs 104 or pixels 107, as shown in area A, or even one or more rows or columns of LEDs 104 or pixels 107, as shown in area B, can be removed. Such an arrangement can be advantageous along matrix blocks (e.g., see...). Figure 8B A more consistent cut at the edges.

[0089] In one embodiment, the display structure includes a first plurality of first cutouts and corresponding first plurality of first grooves 116 through the display panel 103, and a second plurality of second cutouts and corresponding second grooves 116 through the display panel 103, wherein the first plurality of first grooves 116 are substantially orthogonal to the second plurality of second grooves 116. According to another embodiment, the first plurality of first grooves 116 are substantially orthogonal to the corners of a curved three-dimensional (3D) film contour around the second plurality of second grooves 116. In an illustrated embodiment, the lines of the LED sub-pixels (or pixels) terminate at the corners of the cutout pattern. See, for example, a column of LEDs 104 (or pixels 107) cut out at region B.

[0090] Another variant is Figures 16 to 18 As shown, a Z-shaped cutout pattern is formed along the edge of the display panel 103. Similar to... Figures 11 to 13 , Figures 16 to 18 A schematic top view of the display panel before folding is shown. Figures 16 to 17 ), and a schematic top view of the display panel after it has been folded into a curved 3D film outline ( ), and a schematic top view of the display panel. Figure 18 Similar to orthogonal cutout designs, the zigzag pattern can mitigate the cutting through LED 104 and pixel 107 by aligning the cutout pattern (and groove 116) with the pixel grid. Such an arrangement can also be advantageous along matrix blocks (see, for example, [link to related documentation]). Figure 8B A more consistent cut at the edges. However, similar to other implementations, optical artifacts may still occur because the cut line (groove 116 width) is widened to accommodate folds at specific angles or radii.

[0091] See Figure 17 The Z-shaped cut pattern can be combined with various arrangements, such as the gradually increasing width between rows or columns of LED 104 (or pixel 107) as shown in area A. Figure 18 The width gradually decreases after folding, or a constant width as shown in region B. Region C shows a constant width where the string of LEDs 104 (or pixels) is cut off, with a constant width between adjacent LEDs 104 (or pixels) on opposite sides of the trench 116, or a gradually increasing width between rows or columns of LEDs 104 (or pixels 107) on opposite sides of the cut-off LEDs or pixels (or a gradually decreasing width after folding). Figure 18 (The width gradually decreases in the middle). Additionally, the cut width can be increased as shown in region E to remove multiple LEDs or pixel strings.

[0092] Similar to straight-line cut patterns, the first grid 202 and the second grid 204 with zigzag cut patterns can have the same orientation before folding (e.g., see...). Figure 17And it deviates due to folding (e.g., see...) Figure 18 In the illustrated implementation, the lines of the LED sub-pixels (or pixels) terminate at the corners of the zigzag pattern. See, for example, the column of LED 104 (or pixel 107) cut off at region D.

[0093] According to another variation of the implementation plan Figures 19 to 20 As shown, the notch pattern includes merging grooves that can be formed through the LED or pixel array. Such embodiments can merge two grooves 116 together to form twice the groove width (pre-folded). As previously mentioned, the notch width of the groove 116 may need to be increased to accommodate bending or folding at specific angles or radii of curvature, which could subsequently cause misalignment of the pixel grid in adjacent lobes 106. By combining adjacent notched grooves 116 into a single notched groove 116, the width can be increased while maintaining pixel grid alignment and mitigating optical artifacts in the folded display panel. Figure 20 In the exemplary embodiment shown, trench 116 may be formed between LEDs or pixels 107 and then merged together to remove the string of LEDs or pixels 107.

[0094] Up to this point, various cutout patterns (e.g., straight lines, orthogonal, zigzag, merged) have been described and illustrated, equally applicable to both LED 104 and pixel 107. Pixel 107 will be formed by multiple sub-pixels of LED 104 designed for different color emission (e.g., red, blue, green, etc.). Pixel 107 may also include an arrangement of primary and redundant LED pairs. Furthermore, the foregoing discussion is conducted without reference to pixel density or pixels per inch (PPI). See now. Figures 21 to 22 Exemplary close-up illustrations of straight lines and zigzag cut patterns across a pixel matrix are provided. In the illustrated embodiment, the cut pattern groove 116 has a uniform width. As shown, an angled cut pattern across the pixel 107 grid can extend through several pixels 107, potentially resulting in dead or partially dead pixels 107, which can produce various artifacts. A zigzag pattern with the same cut width can extend between pixels 107 with less damage and fewer resulting artifacts. Therefore, zigzag patterns can also be used in higher resolution applications with higher pixel density. Zigzag cut patterns may require more complex and precise cutting and folding processes.

[0095] See now Figure 23AA close-up illustration is provided of a straight-line cut pattern arranged through the pixels 107 outside the grid. Such an arrangement is also compatible with more complex cut patterns, including zigzag, merged cuts, etc. It should be understood that although the arrangement of pixels 107 is shown, the illustrated embodiment is also compatible with a similar arrangement of LEDs 104 replacing pixels 107. Generally, Figure 23A The illustrated embodiment can be implemented by transferring the array of LEDs 104 from different donor substrates, and possibly with different transfer head arrays. As shown, the display structure may include: a first lobe 106 having a first array 203 of LEDs 104 positioned in a first grid 202 having a first repeating xy pixel pitch; and a second lobe 106 having a second array 205 of LEDs positioned in a second grid 204 having a second repeating xy pixel pitch matching the first repeating xy pixel pitch. The first lobe 106 may additionally include a third array 207 of LEDs aligned adjacent to a trench 116, while the second lobe 106 includes a fourth array 209 of LEDs aligned adjacent to a trench 116. In the illustrated embodiment, the third array 207 of LEDs is arranged as a third pattern 206 (e.g., lines, grids, etc.) outside the grid relative to the first grid 202, and the fourth array 209 of LEDs is arranged as a fourth pattern 208 (e.g., lines, grids, etc.) outside the grid relative to the second grid 204. In this arrangement, the third pattern 206 and the fourth pattern 208 outside the grid can compensate for or reduce optical artifacts that might otherwise be more noticeable. Figure 23B For the implementation scheme before folding Figure 23A A schematic top view illustration of an exemplary application of the pixel pattern. As shown, the first array 203 and the second array 205 of the LEDs can be those arrays in the main body region 102.

[0096] Pixel 107 can also have a specific arrangement to accommodate the cut pattern. Figures 24A to 24D In the specific implementation shown, each pixel includes red (R), blue (B), and green (G) emitting LEDs, and each emitting color may include a primary (p) or redundant (r) LED. Figure 24 shows... Figures 24A to 24D The specific arrangement shown is specific to a total of six LEDs (3 main, 3 redundant) in the RGB pixel arrangement, but the implementation is not limited to this and may include different emission colors and multiple LEDs for the same emission color and different redundancies.

[0097] Figure 24A The illustration is a schematic top view of a groove 116 formed between a pair of pixels 107 according to an embodiment, the pair of pixels including a main (p) LED row and a redundant (r) LED row. Figure 24BThe diagram is a schematic top view illustrating a trench 116 formed between a pair of pixels 107 according to an embodiment, with the redundant LED (e.g., Br, Gr) of one pixel closest to the trench. Thus, assuming the redundant LED is not needed for operation, the width of the trench 116 can optionally be cut across a column of redundant LEDs without affecting the operability of the display panel. Figure 24C This is a schematic top view illustration of a trench 116 formed through redundant LEDs (e.g., Gr, Br) within pixel 107 according to an embodiment. Thus, assuming the redundant LEDs are not needed for operation, the width of the trench 116 can optionally cut through the column of redundant LEDs without affecting the operability of the display panel.

[0098] Figure 24D This is a schematic top view illustration of a groove 116 formed through a pair of pixels 107 according to an embodiment, where redundant LEDs are closest to the groove 116. In the illustrated specific embodiment, all the main LEDs are grouped in the two columns furthest from the notch pattern or groove 116. Thus, two of the three redundant LEDs are in the column closest to the notch pattern or groove 116. In this way, assuming that the redundant LEDs are not needed for operation, the width of the groove 116 can optionally cut through the columns of redundant LEDs without affecting the operability of the display panel. In the embodiment, the paired pixels 107 located on opposite sides of the groove 116 can be mirror images of each other, although this is not required, as shown. It should be understood that although the groove 116 is shown as extending through... Figures 24B to 24D The columns of redundant LEDs are shown, but this is for illustrative purposes and is not required. Furthermore, although shown column by column, a similar arrangement can be implemented row by row.

[0099] Figure 25An alternative pixel arrangement according to an embodiment is shown, wherein the pixel array includes sub-pixel clusters 101. As shown, each sub-pixel includes a pair of LEDs, comprising a primary (p) LED and a redundant (r) LED. Unlike pixel clusters, sub-pixels of adjacent pixels can be clustered together. Such an arrangement can increase the alleyway width (Sw) and alleyway height (Sh) between columns and rows of pixel 107 to accommodate larger groove 116 widths for straight lines, zigzags, and other cut-out patterns. In a specific embodiment, the sub-pixel spacing (sp) between different colored sub-pixels is approximately the same as the redundant LED spacing (rp) within the same sub-pixel. As shown, clustering sub-pixels results in a pixel width (Pw) larger than the alleyway width (Sw) or alleyway height (Sh). The illustrated pixel width (Pw) includes the alleyway width (Sw) extending through pixel 107 between sub-pixel clusters 101. The alleyway width (Sw) also extends between adjacent pixels 107. Because the redundant columns of LEDs 104 (for all pixel colors) extend along the edges of the pixel width (Pw), the functional alleyway width (Sw) can also be increased between pixels 107. Similar to... Figures 24B to 24D If necessary, this redundant column of LED104 can be removed to increase the width of trench 116 and the functional lane width (Sw).

[0100] The pixel height (Ph) can be limited to the height of the sub-pixel cluster 101 and excludes the aisle height (Sh). Therefore, the pixel height (Ph) can be less than the pixel width (Pw). In the illustrated specific embodiment, each sub-pixel cluster 101 is provided with a pair of green emitting LEDs, where the other pair is either a pair of red emitting LEDs or a pair of blue emitting LEDs, although other arrangements are also possible. Furthermore, the pixel pattern 107 can be a diamond pattern, where repeating sub-pixel clusters 101 are arranged in a diamond pattern. In the embodiment, for pixels located on opposite sides of an aisle, the aisle width (Sw) is the same because the same aisle extends between sub-pixel clusters 101 within pixel 107.

[0101] In one embodiment, the display structure includes a pixel array 107, wherein each pixel includes a first sub-pixel cluster and a second sub-pixel cluster. The first sub-pixel cluster includes a pair of first colored light-emitting LEDs (e.g., Br, Bp) and a pair of second colored light-emitting LEDs (e.g., Gr, Gp). The second sub-pixel cluster includes a pair of third colored light-emitting LEDs (e.g., Rr, Rp) and a second pair of second colored light-emitting LEDs (e.g., Gr, Gp). The alleyway width (Sw) between the first and second sub-pixel clusters is greater than the spacing (e.g., sp, rp) between the pairs of LEDs within each first and second sub-pixel cluster.

[0102] See still Figure 25The pixel array 107 can be arranged in a repeating array, wherein a first sub-pixel cluster (e.g., Br, Bp, Gr, Gp) of a first sub-pixel is positioned above a second sub-pixel cluster (e.g., Rr, Rp, Gr, Gp) of a second sub-pixel, and the second sub-pixel cluster (e.g., Rr, Rp, Gr, Gp) of a first sub-pixel is positioned above a first sub-pixel cluster (e.g., Br, Bp, Gr, Gp). A notch pattern or groove 116 can extend along the alley width (Sw) between the first and second sub-pixel clusters. The notch pattern or groove 116 can also, or alternatively, extend through the alley height (Sh) between the first pixels 107 above the second pixel 107.

[0103] Up to this point, the discussion has largely focused on the cut-out pattern and grooves 116 formed through the array and grid of LEDs 104 and pixels 107. However, the display panel 103 can also be designed to accommodate the cut-out pattern through the wiring layers and operating circuitry for the LEDs and pixels. Specifically, the display panel 103 can be designed to accommodate cuts through the matrix tiles 155 to avoid optical artifacts caused by the degradation of the operating circuitry of the entire pixel array due to the cutting process.

[0104] Figure 26A This is a schematic top view illustration of a straight-line cutout pattern above a regular array of matrix blocks 155 according to an embodiment. It resembles a barrier with LEDs and pixels. Figure 26A The straight-line cut pattern can result in cuts through the pixel driver chip 150 and the operating circuitry to and from the LED. In embodiments, wiring within the display panel 103 (such as within RDL 140) can be rewired to accommodate such a straight-line cut pattern. The pixel driver chip 150 can also be repositioned within the lobe 106 (outside the grid) to avoid being cut and to accommodate the rewired wiring. See now. Figure 26B The complexity of such rerouting can be reduced by using an orthogonal cut arrangement between matrix blocks 155. In such an arrangement, the regular array or grid of LEDs, pixels, and pixel driver chips 150 can be largely maintained. However, some rerouting may be required around the trenches. Similarly, [the following can be used...] Figure 27 The zigzag cut pattern shown reduces the complexity of rewiring while largely maintaining a regular array or grid of LEDs, pixels, and pixel driver chips.

[0105] Figure 28AThis is a schematic top view illustration of a Z-shaped cutout pattern through a grid of corner matrix block 155B and pixel driver chip 150B according to an embodiment, the grid having a different xy spacing than the grid of pixel driver chip 150 and matrix block 155 in the body of the display panel. Figure 28B This is a schematic top view of a corner matrix block 155B of a pixel driver chip 150B comprising multiple pixels for switching and driving LEDs according to an embodiment. As shown, cutout patterns and grooves 116 are formed along the edges of the matrix block 155B.

[0106] This configuration allows for a more uniform and regular distribution of the pixel array and pixel driver chips 150B. Therefore, the lobe 106 is composed of corner matrix blocks 155B. This arrangement of corner matrix blocks 155B can be repeated using matrix blocks 155B, further reducing the complexity of rerouting.

[0107] according to Figures 26A to 28B In one embodiment, the display panel 103 may include a first array of pixel driver chips 150, which is coupled to a first LED 104 subgroup in an LED matrix in the main region 102 of the display area. A second array of second pixel driver chips 150, 150B is coupled to a second LED subgroup in an LED 104 matrix in a plurality of lobes 106 of the display area.

[0108] In one implementation, a first array of pixel driver chips 150 is positioned in a first grid with repeating xy pixel spacing, and a second array of pixel driver chips 150B is positioned in a second grid with repeating xy pixel driver chips having a smaller repeating xy pixel driver spacing than the first repeating xy pixel driver spacing. For example, the size and shape of the tiles 150 within the lobe 106 for any cut pattern can be reset to fit the cut pattern and rewired.

[0109] The display panel 103 may include a first array of first matrix blocks 155 in the main area 102 or display area, and a second array of second matrix blocks 155, 155B in a plurality of lobes 106 of the display area. In an embodiment, each first matrix block 155 includes a first pixel driver chip 150 coupled to a first group of LED 104 matrix blocks arranged in a first pattern. For example, Figure 8B An exemplary first pattern (e.g., a rectangle) is shown. In an embodiment, each second matrix block 155B includes a second pixel driver chip 150B coupled to a group of second LED 104 matrix blocks arranged in a second pattern different from the first pattern. For example, Figure 28BAn exemplary second pattern (e.g., a hexagon) is shown. In embodiments, the LEDs 104 and pixels 107 within the first and second patterns may have the same xy spacing. Therefore, the difference between the first and second patterns may be the tile shape and the orientation of the connection to the pixel driver chips 150, 150B, rather than a fine-grained LED grid pattern. While square and hexagonal patterns are shown, these patterns are to be understood as exemplary, and embodiments are not limited thereto and may include other patterns, including octagons, other polygons, and combinations of polygons.

[0110] Intermediate matrix blocks can be used to achieve transformations between different block patterns based on the implementation scheme. For example, such as Figure 28A As shown, the intermediate matrix block 155C may include an intermediate pixel driver chip 150C coupled to an intermediate LED 104 block group arranged in an intermediate pattern, the intermediate pattern being part of a first pattern of the first block 155 matrix.

[0111] The display panel according to the embodiment may include a general wiring pattern in the main area 102 of the display area 105. This may include local matrix wiring between the pixel driver chip 150 and the LED 104. Such local matrix wiring may be defined as repeating pattern 155. The general wiring pattern may additionally include global wiring paths, such as global wiring 802 and line lines 804 (e.g., data signals, line sync signals, frame sync signals, and vertical sync tokens (VST), Vdd, etc.). Such global wiring paths can connect the pixel driver chip 150 in series with, for example, control circuitry 810.

[0112] Figure 29A This is a schematic top view illustration of a global wiring path extending through multiple lobes according to the implementation scheme. Figure 29B This is a schematic diagram of a global wiring path through a pair of matrix blocks within a lobe, according to an implementation scheme. As shown, the global wiring path can be any or a combination of the previously described global wiring 802 or modified row lines 804. As shown, the global wiring 802 can extend column-by-column down the display panel through the main body area 102, as per the description... Figure 8A As shown in the figures, global wiring 802 can be routed in and out of one or more lobes 106 to serve lobes 106. For example, this can occur sequentially through these lobes. Each lobe 106 may have a corresponding global wiring 802. In one embodiment, all lobes 106 within a corner of the display panel share the same global wiring 802. Alternatively, modified row lines 804, instead of global wiring 802, may extend into each lobe. Various configurations can be used to allow global wiring paths to loop through multiple lobes.

[0113] In one embodiment, the display structure includes: a first global wiring path (e.g., global wiring 802) connecting to a column of pixel driver chips in a first array of pixel driver chips 150 in the main region 102 of the display area 105; and a second global wiring path (e.g., modified global wiring 802 and / or modified row lines 804) connecting to a group of second pixel driver chips 150, 150B in a plurality of lobes 106 in the display area 105, wherein the second global wiring path winds in and out of one or more of the plurality of lobes 106. In one embodiment, the plurality of lobes are positioned along the corners of the display panel 103.

[0114] The display panel 103 according to the embodiment can initially be manufactured as a 2D panel film, and then a slit pattern is formed using a suitable technique (such as laser cutting) to provide the main area 102 and the lobe 106. A specific patterning technique can be selected, for example, based on the pixel density of the LED and pixel arrangement, as well as the alley width and height. The patterned 2D panel film can then be folded, for example, along a corner or dome-shaped display to form a 3D composite film curvature. As described above, the display panel can include a variety of LED and pixel arrangements, matrix tile arrangements, and slit patterns to facilitate pixel alignment and reduce optical artifacts when folding the lobes. Specifically, variations in pixel density and quality along the grooves between adjacent lobes may be visible. Various manufacturing techniques and structures are described below to reduce physical misalignment between adjacent lobes and also visually blur the grooves or seams between adjacent lobes. The structures and manufacturing techniques described herein together allow for the fabrication of display structures with rounded corners and large curvatures.

[0115] See now Figures 30A to 30I A schematic side view illustration of a method for forming a display structure according to an embodiment is provided. Typically, the method includes a 3D lamination operation of a display panel 103, followed by laminating a cover plate (e.g., glass, sapphire) 190 onto the laminated display panel 103. As will become apparent in the following description, additional processes can be performed to add additional layers (e.g., polarizers, diffusers, black matrix materials, adhesive layers, etc.) using coating or film lamination techniques. Furthermore, various lamination techniques for laminating the display panel 103 with controlled flap alignment are described.

[0116] like Figure 30A As shown, the lamination process can begin with a bottom mold 210 having a three-dimensional (3D) composite surface curvature 212. Then, a back film layer 160 is laminated onto the bottom mold 210 under heat and pressure, as... Figure 30BAs shown. For example, the back film layer 160 may be a thermoformed layer formed under heat and pressure. The back film layer 160 according to an embodiment may include multiple stacks and may be formed in multiple laminations. In an embodiment, the back film layer 160 includes a bottom flexible display substrate 162 and a top adhesive layer 164 (see...). Figure 30D For example, the flexible display substrate can be formed from a variety of polymers, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI), thin glass, or metal foil. An adhesive layer 164 can be used to receive the display panel during lamination. For example, the adhesive layer 164 can be a pressure-sensitive adhesive layer. In an embodiment, the adhesive layer 164 includes a dark pigment or filler to serve as a black matrix layer. The backing layer 160 can then optionally be trimmed, such as... Figure 30C As shown.

[0117] See now Figures 30D to 30F Then, the display panel 103 is laminated onto the back film layer 160 on the bottom mold. According to the embodiment, Figure 30D The display panel 103 provided includes a cutout pattern defining a plurality of lobes 106, and lamination includes folding the plurality of lobes 106 into a curved 3D film profile on top of a laminated back film layer 160. Figures 30D to 30E A schematic cross-sectional side view of the lamination process is provided, while Figure 30F A schematic side view of a display panel 103 laminated onto a backing layer 160 is provided. Several suitable processes can be used to perform the lamination. Figure 30E In the exemplary embodiment shown, passive or guided molding techniques may involve pressing the display panel 103 between a bottom mold 210 and a top mold 220. Then, it can be as follows: Figure 30G As shown, the cover plate 190 is laminated onto the display panel 103, and then the following steps are performed: Figure 30H The final trimming of the backsheet layer 160 shown is performed, and as follows: Figure 30I Release of the display structure 110 shown.

[0118] An exemplary lamination process according to the implementation includes passive (e.g., top / bottom die), guided, and active alignment of the lobes 106. In the passive alignment process, the lobes can be aligned using the matching curvature of the top / bottom die. In the guided lobe 106 alignment method, the top die may include an alignment ring or similar structure designed with a matching concave-cut pattern to independently receive the lobes 106 and guide each lobe 106 to form its intended 3D curvature. Such a guided method can provide additional accuracy in aligning the seam width (groove 116 width) between adjacent lobes in a display panel 103 folded into a curved 3D film profile.

[0119] Figures 31A to 31JThis is a schematic diagram of a method for laminating a display panel with a protective film having a lower connecting line for active alignment of the petals, according to an embodiment. Figure 31A This is a close-up schematic cross-sectional side view of a corner of a display panel 103 attached to a back film layer 160 or other carrier layer. For example, the display panel may be attached to a top adhesive layer 164 of the back film layer 160. Figure 31B for Figure 31A A schematic top view illustration. As shown, the display panel 103 can be pre-cut to include a lobe 106. See also Figure 31C Then, the back film layer 160 can be patterned to include a cut pattern that matches the cut pattern of the display panel 103, wherein the groove 161 matches the groove 116 and the back film layer flap 163 matches the display panel flap 106. As shown, the length (L) of the back film layer flap 163 is... BF It can be longer than the length of the display panel segment 106 (L) DP ).

[0120] Then, a connecting wire (e.g., a thin thread) 192 can be attached along the dorsal membrane flap 163 to the connecting region 195, such as... Figure 31D As shown. Alternatively, connecting wires can be pre-attached. Furthermore, the back film layer 160 cut pattern can be pre-patterned before being bonded to the pre-patterned display panel 103.

[0121] Then, the back side of the back film layer is mounted onto the bottom mold 210, which has a 3D composite surface curvature, as follows: Figure 31E As shown. In one embodiment, a top retainer 196 can be used to transfer the stack of display panel 103 and back film layer 160. This can be achieved using an intermediate adhesive layer or vacuum. The top retainer 196 can also press the layer stack to hold it in place. Alternatively, the bottom mold 210 can use vacuum suction to hold the layer stack in place and fold / mold it. Once positioned, connecting lines 192, which are engaged with the multiple back film layer flaps 163, are pulled to fold the multiple display panel flaps 106 into a curved 3D film profile on top of the back film layer 160, which sits on top of the bottom mold 210.

[0122] See now Figures 31G to 31H The cover plate 190 is then positioned over the laminated (and folded) display panel 103, and then laminated onto the display panel 103. The cover plate 190 may be attached to the top retainer 196 using an intermediate adhesive layer or vacuum attachment. The connecting wires 192 are then removed, and the backing film layer 160 is optionally trimmed and shaped as follows. Figure 31I As shown. Then, the display structure 110, including the cover plate 190, display panel 103, and back film layer 160, is removed from the top retainer 196, as follows. Figure 31JAs shown. Additional layers may optionally be included in the display structure 110. For example, various seam filling layers may be applied after the folded / molded display panel 103 and before the laminated cover plate 190. Additionally, multiple layers may be formed inside the cover plate 190, i.e., on a concave surface. For example, a polarizing layer stack may optionally be formed on the cover plate 190, rather than as part of the display panel 103.

[0123] Figures 32A to 32G This is a schematic diagram of a method for laminating a display panel with a protective film having traction tabs for active alignment of the flaps, according to an embodiment. Figure 32A This is a schematic cross-sectional side view of the display panel 103 bonded to the protective film 305. For example, they can be bonded using a pressure-sensitive adhesive material. See now. Figure 32B A schematic top view illustration, including the cut patterns of the petals 106 and grooves 116, 316, formed, for example, by laser cutting through both the display panel 103 and the protective film 305, to form a shape with a length (L) PF The corresponding multiple protective membrane flaps 306, the length of which is longer than the length of the display panel flap 106 (L) DP As shown, the groove 116 through the display panel 103 mates with the groove 316 formed through the protective film 305. In an embodiment, the end of the lobe 306 through the protective film 305 may be engaged by a tab 304 aligned with the corresponding groove 316 between the lobe 306. The tab 304 may optionally include an opening 308 for engagement with a clamp (e.g., a hook).

[0124] See now Figure 32D The schematic cross-sectional side view of the figure shows that lamination may include pressing a top mold 220 onto a protective film 305 on the display panel 103 and pulling a plurality of tabs 304 along the periphery of the protective film 305. Figure 32E This is a schematic bottom view of the top mold 220. As shown, the top mold 220 may include a plurality of slits 222 that can pull and guide the tab 304 through the slits to facilitate active alignment of the flap 106. Figure 32F Such alignment is illustrated in a schematic cross-sectional side view, showing the tabs 304 being simultaneously pulled outward from the plane (the plane of the protective film 305) to create tension in the protective film 305 flaps 306 and to drag the edges 114 of the display panel 103 flaps 106 together, thereby creating narrow grooves 116 in the curvature of the laminated 3D composite film of the display panel 103. According to embodiments, the simultaneous pulling can be done by pulling the tabs 304 simultaneously, pulling them in groups, or pulling them individually. In one embodiment, the outer flap is folded / pulled before the inner flap. Then, it can be as follows... Figure 32GThe protective film 305 shown is released, for example, using ultraviolet (UV) release technology.

[0125] The manufacturing sequence can then continue in a variety of ways as described above, including filling the grooves 116 between adjacent lobes 106 of the plurality of lobes with one or more seam materials, and laminating the cover plate 190 onto the display panel 103.

[0126] See now Figures 33 to 34 A schematic top view and a schematic cross-sectional side view illustration of a strip lamination method for active alignment of lobes according to an embodiment are provided. Figures 33 to 34 The strip lamination method shown differs from the protective film lamination method in several aspects. First, the strip lamination method can use individual protective film tabs 310 at each corner of the display panel 103. As shown, each protective film tab 310 may include a root region 314 and a plurality of strips 312 extending from the root 314. The protective film tabs 310 may also be formed of a flexible material capable of withstanding high stress.

[0127] In one embodiment, the laminated display panel 103 includes protective film tabs 310 positioned above the display panel 103, wherein the protective film tabs 310 include a plurality of strips 312 aligned with a plurality of lobes 106 of the display panel 103. Specifically, each strip 312 may be narrower than the corresponding lobe 106. This arrangement reduces alignment tolerances when positioning the protective film tabs 310 on the display panel. Furthermore, each strip 312 is longer than the corresponding lobe 106 to accommodate a tension strip to fold the corresponding lobe 106 into a curved 3D film profile.

[0128] like Figure 34As shown, the strip lamination method utilizes a clamp 320 to press the protective film tabs 310 on the display panel and pulls the ends of each strip 312 downward in the Z direction. In an exemplary configuration, the clamp 320 may include an arm 322 with a press 324 to apply pressure to the protective film tabs 310. The press 324 may be actuated to provide pressure, or the arm 322 may be actuated to provide pressure. The clamp 320 may optionally have a retainer to hold the root 314 in place. Alternatively, the root 314 may be held in place on the display panel 103 by pressure. The press 324 may be used to provide a small pressure area at the proximal portion of each strip 312 when pulling the strips 312. In operation, the manipulating arm 325 and the clamp 326 are used to clamp onto the distal ends of the strips 312 and pull the respective strips in the Z direction. In this way, the flexible strip 312 presses the lobe 106 from a flat area near the proximal end of the strip 312 toward the bottom mold 210, and the z-motion pulls the pressed area gradually to the free distal end of the lobe 106, so that the lobe ultimately conforms to the curved surface of the bottom mold 210. Therefore, the movement of the strip 312 and the lobe 106 can be largely restricted to the z-motion, and unintended xy-motion forming external structures is avoided. This reduces global manipulation of the lobe and avoids lobe alignment inaccuracies that may be introduced by external mechanical movements during lamination. Therefore, the final seam width (groove 116 width) depends largely on the cut pattern tolerance.

[0129] According to the implementation scheme, the multiple lobes 106 can be folded simultaneously into a curved 3D film profile, or folded sequentially. In the implementation scheme, the outer lobe 106 is folded before the inner lobe 106. The manufacturing sequence can then continue in a variety of ways as described above, including filling the grooves 116 between adjacent lobes 106 of the multiple lobes with one or more seam materials, and laminating the cover plate 190 onto the display panel 103.

[0130] In addition to the designs described above for LED and pixel arrangement, matrix block arrangement, notch patterns, and lamination techniques for accurately controlling the physical alignment of adjacent lobes during lamination, additional seam concealment designs can be incorporated to further visually blur the grooves or seams between adjacent lobes. In the following description, various seam concealment designs for blurring grooves between adjacent lobes within curved display structures are described and illustrated with specific applications. Exemplary structures include polarizing layers, masking materials, refractive index-matched optically clear adhesives, diffuser layers, edge roughness control, groove aspect ratio control, and combinations thereof. Furthermore, it should be understood that specific structures may be designed for specific purposes. However, it should be understood that while embodiments are shown and described individually, some embodiments may be combined to achieve multiple results. Furthermore, it should be understood that the following description is applicable more broadly to display applications to blur various defect structures in underlying layers, such as edges, notches, debris, pinholes, and other non-uniform factors or morphological features, and is not limited to seam concealment applications.

[0131] See now Figures 35A to 36B An exemplary display structure 110 is shown in a stacked structure to explain at least two bases for concealing seams, including diffuse reflection and specular reflection. Figure 35A and Figure 36A The display structure 110 shown is the same as the stacked structure described for this purpose, comprising a display panel 103 bonded to a backing layer 160, which includes a display substrate 162 and an adhesive layer 164. This structure can be laminated into a curved 3D film profile, with trenches 116 located between lobes 106. In the illustrated exemplary embodiment, the display panel 103 may include: an emission stack 111 including LEDs and operating circuitry; an optional black matrix layer; an outer coating 149; and a polarizing layer 170, optionally bonded to the emission stack 111 (or outer coating 149) with an optically clear adhesive layer 165. A cover plate 190, also having a curved 3D film profile, can be laminated to the display panel 103 with an optional optically clear adhesive layer 180. For example, the optically clear adhesive layer 180 may be applied and cured as a solid film or as a liquid coating. Optically clear adhesive materials may include, but are not limited to, polymer families such as acrylates, silicones, etc.

[0132] In one respect, it has been observed that the lobe edge 114 of the groove 116 can cause observable diffuse reflection. For example, the groove 116 may be visible as a white line due to diffuse reflection under sunlight, such as... Figure 35B As shown. On the other hand, it has been observed that along the top surface of the lobe 106 of the display panel 103 (e.g., Figure 36A The specular reflection of the top surface of the polarization layer 170 shown may differ from the specular reflection of the trench 116, resulting in visible black lines, such as... Figure 36B As shown. In another aspect, it has been observed that when the display structure is emitting light, the trench may act as a light guide, where light emitted from the LEDs of the emitting stack 111 diffuses outward from the trench 116, resulting in an emitting trench. Various seam concealment techniques that can obscure the visibility of the trench 116 are described according to embodiments. However, it should be understood that different structures can achieve different objectives, and various embodiments can be combined where appropriate.

[0133] In one embodiment, the display structure 110 includes a display panel 103, which includes pixel circuitry connected to an LED matrix within a display area of ​​the display panel. The display area includes a main region and a plurality of pixels extending from the main region. A cutout extends through the display panel, defining a first edge of a first lobe and a second edge of a second lobe. The first and second lobes are folded into a curved 3D film profile, wherein a groove 116 is formed between the first and second lobes within the curved 3D film profile. According to an embodiment, the groove 116 is filled with one or more seam materials. For simplicity, the following embodiments are grouped based on the location of the polarizing layer. For example, the polarizing layer may be included in the display structure as part of the display panel, with the cutout pattern formed through the display panel, or the polarizing layer may be located above the display panel. In some embodiments, the polarizing layer is at least partially integrated with the groove, or is locally modified near the groove.

[0134] Figures 37A to 37P This is a schematic cross-sectional side view illustration of various joint concealment structures according to the implementation plan.

[0135] Figure 37A The implementation shown is basically similar to Figure 35A and Figure 36A The embodiment shown differs in that a black matrix layer 166 is added above the emitter stack 111. For clarity, LEDs 104 of the emitter stack 111 are also shown to illustrate the relationship between the black matrix layer 166 and the LEDs 104. According to the embodiment, the black matrix layer 166 can reduce internal reflections (e.g., specular reflections) of the emitter stack 111, including reflections from electrical wiring and pixel driver chip 150. The increased area of ​​the black matrix layer 166 can correspond to a reduction in the reflectivity of the emitter stack 111. The black matrix layer can be formed of suitable materials (such as polymers and glass) and can include organic dye-based absorbers (including mixed molecular dyes) and pigment-based absorbers, or microparticles for absorbing specific visible wavelengths of the spectrum. In the embodiment, the black matrix layer includes carbon black microparticles.

[0136] In the illustrated embodiment, the trench 116 may be filled with an optically clear filler material 182. The optically clear filler material 182 may be applied, for example, by dispensing in liquid form and then curing. In this embodiment, the optically clear filler material 182 is characterized in that its refractive index differs from the refractive index of the emission stack 111, the optically clear adhesive layer 165 above the outer coating 149, the optional optically clear adhesive layer 180 to be applied, and / or the cover plate 190 by within 0.2. In some embodiments, the optically clear filler material 182 may also match the refractive index of various surrounding materials in the emission stack 111, the outer coating 149, and the polarizing layer 170. In this way, the optically clear filler material 182 can reduce diffuse reflection at the edges of the trench 116.

[0137] Figure 37B The implementation shown is basically similar to Figure 37A The embodiment shown is modified in that the trench is filled with an optically clear adhesive layer 180. In this embodiment, the optically clear adhesive layer 180 is applied in liquid form. The optically clear adhesive layer 180 may be characterized by an optically clear filler material, which is a continuous layer spanning over the first and second lobes and within the trench.

[0138] Figure 37C The implementation shown is basically similar to Figure 37A The embodiment shown is modified in that the trench is filled with a variety of seam materials, including an optically transparent filler material 182 and an opaque filler material 184 within the trench and above the optically transparent filler material 182. The opaque filler material 184 can be a material similar to, for example, the black matrix layer 166. In this configuration, the opaque filler material 184 prevents ambient light from entering the trench 116. The opaque filler material 184 can also block light from the LED 104 that leaks at the trench 116.

[0139] Furthermore, it has been observed that even with the presence of optically transparent filler material 182 or optically transparent adhesive layer 180, bubbles or air gaps may still form within the trench 116. This can be attributed, for example, to the aspect ratio of the trench 116 or the viscosity of the optically transparent filler material 182 or optically transparent adhesive layer 180 when applied to the trench 116. If bubbles or air gaps are present, reflection can be significantly increased. Therefore, a top layer of opaque filler material 184 can mitigate the effects of such bubbles or air gaps. In an embodiment, the opaque filler material 184 may also be matched to the refractive index of the surrounding layers.

[0140] Figure 37D The implementation shown is basically similar to Figure 37AThe variation of the embodiment shown is that the trench is filled with an opaque filler material 184. In such an embodiment, the trench 116 may be substantially filled with the opaque filler material 184. In this embodiment, the opaque filler material 184 is applied in liquid form. In this embodiment, the opaque filler material 184 may also match the refractive index of the surrounding layer.

[0141] Figure 37E The implementation shown is basically similar to Figure 37A The embodiment shown differs in that an opaque liner material 186 is formed within the groove 116 and between the optically transparent filler material 182 and the first and second lobes. The opaque liner material 186 can be a composition similar to the opaque filler material 184 and can also match the refractive index of the surrounding layers. The opaque liner material 186 can be applied using suitable techniques, such as patterning and deposition, pen or brush application. Furthermore, the opaque liner material 186 can be applied before or after the display panel 103 is folded into a curved 3D film profile.

[0142] See now Figure 37F In the embodiment shown, the diffuse layer 188 is located above panel 103 and spans over trench 116. The diffuse layer 188 can be similar to the optically clear adhesive layer 180, except that particulate fillers such as TiO2 are added to scatter light, for example, through specular reflection, diffuse reflection, and emission from LED 104. Thus, the diffuse layer 188 can have a blurring effect to reduce the visibility of trench 116.

[0143] Figure 37G The implementation shown is basically similar to Figure 37F The embodiment shown differs in that an optically clear adhesive layer 180 is added to fill the groove 116 instead of an optically clear filler material 182.

[0144] In relation to Figures 37H to 37KIn the following described embodiments, a second polarizing layer 171 is provided to further reduce diffuse and specular reflections and provide seam concealment functionality. In one embodiment, the second polarizing layer 171 is an absorptive linear polarizer. For example, the second polarizing layer may be an iodine-doped polyvinyl alcohol (PVA) plastic that linearly polarizes light by absorbing light parallel to the stretched PVA chains and transmitting light perpendicular to the stretched PVA chains. In another embodiment, the second polarizing layer 171 differs from the first polarizing layer 170. In another embodiment, the first polarizing layer 170 includes a circular polarizer (comprising a linear polarizer and a retardation layer, such as a quarter-wave plate), while the second polarizing layer is a linear polarizer. In another embodiment, the linear polarizers for both the first polarizing layer 170 and the second polarizing layer 171 are aligned such that light transmitted through the first polarizing layer 170 is allowed to transmit through the second polarizing layer 171, while a portion of the light emitted from the trench 116 is absorbed. The second polarizing layer 171 can also be combined with various other seam concealment structures.

[0145] exist Figure 37H In the illustrated embodiment, an opaque liner material 186 is disposed along the sidewall of the lobe within the groove 116 and between the optically transparent filler material (such as the optically transparent adhesive layer 180) and the lobe. Additionally, a second polarizing layer 171 is disposed above the optically transparent adhesive layer, and together with the second optically transparent adhesive layer 181, the cover plate 190 is secured to the second polarizing layer 171.

[0146] Figure 37I The implementation shown is similar to Figure 37H The embodiment shown is in which the second optically transparent adhesive layer 181 is replaced by a diffuse layer 188.

[0147] Figure 37J The implementation shown is similar to Figure 37I The embodiment shown differs in that a second optically clear adhesive layer 181 is added above the optically clear adhesive layer 180. Thus, the optically clear adhesive layer 180 can be applied in liquid form to provide trench filling capability, while the optically clear adhesive layer 180 can be applied in tape form for attaching the second polarizing layer 171.

[0148] Figure 37K The embodiment shown provides an additional variation, in which the diffuse layer 188 is instead located below the second polarization layer 171.

[0149] Up to this point, embodiments in which the polarizing layer 170 is included as part of a display panel 103, which is patterned (e.g., laser-cut) to form the groove 116, have been shown and described. In other embodiments, the polarizing layer 170 is formed after the display panel 103 has been patterned. Thus, the polarizing layer 170 can provide concealment for a variety of defective structures, including but not limited to grooves or seams. In such embodiments, the polarizing layer spans over the display area 105 of the display panel 103 and over the groove 116.

[0150] See now Figure 37L The implementation shown is similar to Figure 37D The embodiment shown differs in that the polarizing layer 170 is added after the cut-out pattern is formed through the display panel. Furthermore, the polarizing layer 170 and the opaque filler material 184 can be added after the display panel 103 is folded into a curved 3D film profile.

[0151] exist Figure 37L In the illustrated embodiment, the opaque filler material 184 reduces diffuse reflection from the seam. The opaque filler material 184 does not necessarily completely fill the groove. For example, see... Figure 37M The opaque lining material 186 can be applied along the sidewalls of the petal. In one embodiment, the opaque lining material 186 rises to at least the black matrix layer 166. The opaque lining material 186 can be applied to the petal sidewalls along the entire thickness of the groove. Figure 37N In the illustrated embodiment, the opaque filler material 184 only partially fills the trench. For example, the opaque filler material 184 may fill the trench at least up to the black matrix layer 166. In both cases, the optically transparent filler material 182 may be used to fill the remaining portion of the trench. Figure 37O In the illustrated embodiment, a diffuse layer 168 spans above trench 116 and below polarizing layer 170. The diffuse layer 168 can produce a hazy effect at the seam. Furthermore, an optically transparent filler material 182 can fill the trench to further reduce diffuse reflection from the seam. Figure 37P In the embodiment shown, the diffuse layer 188 spans over the trench 116 and over the polarizing layer 170.

[0152] The polarizing layer 170 according to the embodiment may include a variety of different layer stacks. For example, the polarizing layer 170 may be a circular polarizer, which includes a linear polarizing layer and a retardation layer (e.g., a quarter-wave plate layer). Depending on the application, additional layers, such as additional retardation layers and additional compensation retardation layers, may optionally be included. In conventional display manufacturing sequences, polarizer stack structures are formed as laminated flat films. It has been observed that polarizing films can be sensitive to temperature or stress, especially when they are laminated into curved 3D film profiles. According to some embodiments, liquid solution coating techniques can be used to form some or all of the layers in the polarizer stack structure. This reduces temperature and stress in the curved 3D polarizing film profile, which maintains the optical quality of the film. Furthermore, liquid solution coating techniques can also allow for a reduction in stack size (layers, total thickness) by removing a carrier film (such as an optically transparent adhesive layer).

[0153] Figure 38 This is a schematic cross-sectional side view illustrating a method for forming a display structure 110 on a display panel 103 having a convex 3D film profile according to an embodiment. As shown, the process sequence begins with the display panel 103, which has been cut and folded into a 3D film profile. An inner retardation layer 172 (e.g., a quarter-wave plate layer) is formed on the convex outer surface 197 of the display panel 103, followed by the formation of a linear polarization layer 175 and an outer retardation layer 178 (e.g., a quarter-wave plate layer). A cover plate 190 can then be laminated onto the convex outer surface 179 of the polarization layer 170.

[0154] In one embodiment, the method of forming the display structure 110 includes forming a stack of polarizing layers 170 on a convex outer surface 197 of a display panel 103, and laminating a cover plate 190 onto the convex outer surface 179 of the stack of polarizing layers 170 on the display panel 103. In another embodiment, forming the stack of polarizing layers 170 includes coating an inner retardation layer 172 on the display panel using a first solution-based technique, coating a linear polarizing layer 175 on the inner retardation layer 172 using a second solution-based technique, and coating an outer retardation layer 178 on the linear polarizing layer 175 using a third solution-based technique. Any solution-based coating technique can be the same or different, and can optionally be replaced by a solid film lamination technique.

[0155] Figure 39 This is a schematic cross-sectional side view illustrating a method for forming a display structure 110 on a cover plate 190 having a concave 3D film profile according to an embodiment. As shown, the process sequence begins with the cover plate 190 having a 3D film profile. An outer retardation layer 178 is formed on the inner surface 191 (concave surface) of the cover plate 190, followed by the formation of a linear polarization layer 175 and an inner retardation layer 172. A cut and folded 3D display panel 103 can then be laminated onto the polarization layer 170.

[0156] In one embodiment, the method of forming the display structure 110 includes forming a stack of polarizing layers 170 on the inner surface 191 of a concave cover plate 190, and laminating the polarizing layers 170 and the cover plate 190 onto the convex outer surface 197 of the display panel 103. In another embodiment, forming the polarizing layer 170 stack includes coating an outer retardation layer 178 on the concave cover plate 190 using a first solution-based technique, coating a linear polarizing layer 175 on the outer retardation layer 178 using a second solution-based technique, and coating an inner retardation layer 172 on the linear polarizing layer 175 using a third solution-based technique. Any of the first, second, and third solution-based techniques can be the same or different techniques, and can optionally be replaced by a solid film lamination technique.

[0157] See now Figures 40A to 40D A schematic cross-sectional side view of a display structure 110 according to an embodiment is provided, the display structure including a polarizing layer 170 stacked structure and a display panel 103 having a curved 3D film profile. Figure 40A The polarization layer 170 shown includes an inner retardation layer 172, a linear polarization layer 175, and an outer retardation layer 178. The inner retardation layer 172 and the linear polarization layer 175 together can form a circular polarizer. Therefore, the outer retardation layer 178 can be an additional layer formed above the circular polarizer.

[0158] The individual layers of the polarization layer 170 stack can be formed using solid film or liquid solution coating techniques and combinations thereof, and can be formed or coated onto a display panel or cover plate. An exemplary retardation layer can be formed using the following sequence: First, a primer layer is applied using a suitable technique (such as spin coating, spraying, physical vapor deposition, lamination, etc.), followed by drying and curing (e.g., UV curing). Then, an alignment layer is coated using a suitable technique (such as spin coating, spraying, lamination, etc.), followed by thermal drying (baking). The alignment layer is then cured using a mask patterned with a specific orientation via polarized UV curing. The alignment layer controls the orientation of the quarter-wave plate film. A liquid crystal layer is then coated onto the alignment layer using a suitable technique (such as spin coating, spraying, lamination, etc.), followed by drying (baking) and curing (e.g., UV curing). The liquid crystal layer controls the birefringence and retardation of the retardation layer. The linear polarization layer 175 and any other compensating retardation layers can be formed using similar liquid solution-based processing techniques.

[0159] See still Figure 40ACertain layered architectures can be used to reduce display reflections and emission distortion for users wearing sunglasses. An exemplary optical reflection path may include randomly oriented light entering an outer retardation layer 178, which transmits the randomly oriented light to a linear polarization layer 175, which then allows the linearly polarized light to pass through (e.g., vertically). This linearly polarized light is then rotated by an inner retardation layer 172 into circularly oriented light. The circularly oriented light is reflected from the display panel 103, and its rotation direction is shifted. This reflected light is then rotated again by the inner retardation layer 172, so that the light is now linearly polarized again and shifted by 90 degrees (e.g., horizontally). In this example, the horizontally polarized light is then absorbed by the linear polarization layer 175 and is not transmitted to the outer retardation layer.

[0160] Regarding the emission function, the display panel 103 emits randomly oriented light, which is transmitted by the inner retardation layer 172 to the linear polarization layer 175, which allows the linearly polarized light to pass through (e.g., perpendicularly). The linearly polarized light is then rotated into circular light by the outer retardation layer 178. Sunglasses typically include a linear polarization layer, so the observer or user wearing the sunglasses will see linearly polarized light, which reduces distortion.

[0161] Figure 40B The polarization layer 170 shown is similar to Figure 40A The polarization layer 170 differs in that an inner compensation retardation layer 193 is added between the display panel 103 and the inner retardation layer 172. The inner compensation retardation layer 193 can be similar to the inner retardation layer 172, except that it is patterned to slightly adjust the phase of the circular light (e.g., the vertical and horizontal components). It has been observed that the inner retardation layer 172 cannot be used to induce a 45-degree phase shift at wide viewing angles, thus resulting in higher display reflections over a wider viewing angle. The inner compensation retardation layer 193 can be used to reduce display reflections across a wide viewing angle range.

[0162] Figure 40C The polarization layer 170 shown is similar to Figure 40B The polarization layer 170 differs in that an external compensation retardation layer 194 is formed on the external retardation layer 178. In this architecture, the external compensation retardation layer 194 can be used to reduce perceptual distortion across a wide field of view when a user or observer is wearing polarized sunglasses.

[0163] Figure 40D The polarization layer 170 shown is similar to Figure 40C The polarizing layer 170 differs in that an optically transparent adhesive layer 165 is added. For example, similar to the previously described optically transparent filler material 182, the optically transparent adhesive layer 165 can be used to laminate the polarizing layer onto the display panel 103 and to fill the grooves 116 between the lobes of the display panel 103.

[0164] It should be understood that Figures 40A to 40D The embodiment shown is exemplary, and the embodiment is not limited thereto. Other arrangements of the compensation delay layer, the delay layer, and the linear polarization layer are possible. For example, an outer compensation delay layer 194 may be provided without the inner compensation layer 193, and so on.

[0165] See now Figures 41A to 41E A schematic cross-sectional side view of various polarization layer 170 laminated structures for seam concealment according to an embodiment is provided. See also Figure 41A This illustrates a display structure stack in which an optically transparent adhesive layer 165 can be used to fill trenches 116. Similar to... Figures 37A to 37P In related discussions, the optically clear adhesive layer 165 can be used specifically to reduce diffuse reflection from the trench 116. The optically clear adhesive layer 165 can also be used to bond with the polarizing layer 170, especially when the polarizing layer 170 is formed on the display panel 103 using a solid film-based technique.

[0166] According to other embodiments, a portion of the polarizing layer 170 may be used to fill the trench 116. Specifically, this can be achieved when a liquid solution-based deposition technique is used for one or more layers of the polarizing layer 170 stack structure. In one embodiment, the polarizing layer 170 spans over the display area 105 of the display panel 103 and is located within the trench 116 between the lobes. See now. Figure 41B In the embodiment shown, an inner delay layer 172 is formed above the display panel 103 and within the trench 116. Then, a second inner delay layer 173 may optionally be formed above the inner delay layer 172. Alternatively, such as regarding... Figure 40D An inner compensation retardation layer 193 may be formed within trench 116. An inner retardation layer 172 (e.g., for primary retardation) may be formed on the inner compensation retardation layer 193. In either configuration, one type of retardation layer is formed within trench 116. An additional polarization layer 170 stack structure may then be formed using subsequent solution-based or solid-film-based techniques.

[0167] In one embodiment, the polarization layer 170 includes a delay layer (e.g., an inner delay layer 172, an inner compensation delay layer 193) that spans over the display area 105 of the display panel 103 and is located within the trench 116. A linear polarization layer 175 is formed over the delay layer and spans over the display area of ​​the display panel and over the trench 116.

[0168] See now Figures 41C to 41D In the embodiment shown, the layer forming the polarizing layer 170 can be locally processed above and inside the trench 116 to control optical properties. Figure 41CIn the illustrated embodiment, region 174 of the inner retardation layer 172 within and directly above trench 116 is characterized in that its orientation differs from that of the region of the inner retardation layer 172 directly above the first and second lobes. This can be achieved, for example, through a patterned photoalignment process. Region 174 may have different birefringence compared to the region of the inner retardation layer 172 above the lobes. Different birefringence can be used to match the total retardation of region 174 with the total retardation of the remainder of the inner retardation layer 172. Alternatively, different retardations may be intentionally introduced. Figure 41D In the illustrated embodiment, region 177 of the linear polarization layer 175 directly above the trench is characterized in that its orientation differs from that of the region of the linear polarizer directly above the first and second lobes. This can be achieved, for example, through a patterned photoalignment process.

[0169] Figure 41E The illustrated embodiment provides a similar region 176 for both the inner delay layer 172 and the linear polarization layer 175, which can be fabricated using a patterned photoalignment process. In such techniques, local alignment and orientation control can be used to provide a gradient of transmittance at the trench 116 region to reduce the visibility of the seam.

[0170] When utilizing the various aspects of the embodiments, it will become apparent to those skilled in the art that combinations or variations of the above embodiments are possible for forming display panels with 3D composite curvature. Although the embodiments have been described in language specific to structural features and / or methodological behavior, it should be understood that the appended claims are not necessarily limited to the specific features or behaviors described. Rather, the specific features and behaviors disclosed should be understood as embodiments used for illustrative purposes.

Claims

1. A display structure, comprising: The display panel includes a pixel circuit connected to a light-emitting diode (LED) matrix within a display area of ​​the display panel, wherein the display area includes a main area and a plurality of lobes extending from the main area; and A cut through the display panel defines a first edge of a first lobe and a second edge of a second lobe, wherein the first lobe and the second lobe are folded in a curved 3D film profile and aligned with each other, such that a groove is formed within the curved 3D film profile and within the display area between the first edge of the first lobe and the second edge of the second lobe.

2. The display structure according to claim 1, wherein the first lobe comprises a first LED array positioned in a first grid having a first repeating xy pixel pitch, and the second lobe comprises a second LED array positioned in a second grid having a second repeating xy pixel pitch; and The first grid is offset from the second grid, and the first repeating xy pixel spacing is the same as the second repeating xy pixel spacing.

3. The display structure according to claim 1, comprising a first plurality of first cuts and corresponding first plurality of first grooves passing through the display panel and a second plurality of second cuts and corresponding second grooves passing through the display panel, wherein the first plurality of first grooves are substantially orthogonal to the second plurality of second grooves; The first plurality of first grooves are substantially orthogonal to the corners of the curved 3D membrane profile around the second plurality of second grooves.

4. The display structure according to claim 1, wherein the first edge and the second edge form a Z-shaped pattern.

5. The display structure according to claim 1, wherein the LED matrix includes a pixel array, and each pixel includes a pair of first colored light-emitting LEDs arranged along a first direction, a pair of second colored light-emitting LEDs arranged orthogonally to the first direction, and a pair of third colored light-emitting LEDs arranged orthogonally to the first direction. The trench extends through at least one pixel in the pixel array, such that one of the pair of second colored LEDs is missing, and one of the pair of third colored LEDs is missing.

6. The display structure according to claim 1, wherein the LED matrix comprises a pixel array, and each pixel comprises: The first sub-pixel cluster includes a pair of first colored light-emitting LEDs and a pair of second colored light-emitting LEDs; and The second sub-pixel cluster includes a pair of third colored light-emitting LEDs and a second pair of second colored light-emitting LEDs; The width of the passageway between the first sub-pixel cluster and the second sub-pixel cluster is greater than the spacing between pairs of LEDs within each first sub-pixel cluster and each second sub-pixel cluster. The pixel array is arranged in a repeating array, wherein the first sub-pixel cluster of the first sub-pixel is arranged above the second sub-pixel cluster of the second sub-pixel, and the second sub-pixel cluster of the first sub-pixel is arranged above the first sub-pixel cluster of the second sub-pixel.

7. The display structure according to claim 1, wherein the display panel includes a first pixel driver chip of a first array and a second pixel driver chip of a second array, the first pixel driver chip of the first array being coupled to a first LED subgroup in the LED matrix in the main region of the display area, and the second pixel driver chip of the second array being coupled to a second LED subgroup in the LED matrix in the plurality of lobes of the display area; in: The first pixel driver chip of the first array is positioned in a first grid having a first repeating xy pixel driver spacing; and The second pixel driver chip of the second array is positioned in a second grid having a second repeating xy pixel driver spacing that is smaller than the first repeating xy pixel driver spacing.

8. The display structure according to claim 7, comprising: A first global wiring path is connected to a column of pixel driver chips in the first pixel driver chip of the first array in the main area of ​​the display area. and A second global wiring path is connected to a group of second pixel driver chips in one of the plurality of lobes in the display area, wherein the second global wiring path winds in and out in one or more of the plurality of lobes; The plurality of lobes are positioned along the corners of the display panel.

9. The display structure according to claim 1, wherein the display panel includes a first matrix block of a first array in the main region of the display area and a second matrix block of a second array in the plurality of lobes of the display area; Each first matrix block includes a first pixel driver chip coupled to a first group of LED matrix blocks arranged in a first pattern, and each second matrix block includes a second pixel driver chip coupled to a second group of LED matrix blocks arranged in a second pattern different from the first pattern. and It also includes multiple intermediate matrix blocks, each of which includes an intermediate pixel driver chip coupled to an intermediate LED matrix block group arranged in an intermediate pattern as part of the first pattern.

10. A method for forming a display structure, comprising: The back film layer is laminated onto a bottom mold with a 3D composite surface curvature; as well as A display panel is laminated onto the back film layer on the bottom mold, wherein the display panel includes pixel circuitry connected to a light-emitting diode (LED) matrix within the display area of ​​the display panel; The display panel includes a cutout pattern defining a plurality of lobes extending from the body region, and laminating the display panel includes folding and aligning the plurality of lobes into a curved 3D film profile on top of a laminated back film layer. The cut defines a first edge of a first lobe and a second edge of a second lobe, wherein the first lobe and the second lobe are folded in the curved 3D film profile and aligned with each other, such that a groove is formed within the curved 3D film profile and within the display area between the first edge of the first lobe and the second edge of the second lobe.

11. The method of claim 10, further comprising filling the grooves between adjacent lobes of the plurality of lobes with one or more seam materials.

12. The method of claim 10, wherein laminating the display panel comprises pressing a top mold onto the display panel.

13. The method of claim 12, wherein laminating the display panel includes pressing the top mold onto a protective film on the display panel, and pulling a plurality of tabs along the periphery of the protective film.

14. The method of claim 10, wherein laminating the display panel includes positioning a protective film tab above the display panel, wherein the protective film tab comprises a plurality of strips aligned with a plurality of lobes of the display panel; and It also includes pulling the plurality of strips to fold the plurality of lobes into the curved 3D membrane profile.

15. A method for forming a display structure, comprising: The display panel is attached to the back film layer; The back side of the back film layer is mounted on a bottom mold with a 3D composite surface curvature; as well as The connecting lines attached to multiple back film layer flaps are pulled to fold multiple display panel flaps into a curved 3D film profile on top of the back film layer.

16. A display structure, comprising: The display panel includes a pixel circuit connected to a light-emitting diode (LED) matrix within a display area of ​​the display panel, wherein the display area includes a main area and a plurality of lobes extending from the main area; and A cut through the display panel defines a first edge of a first lobe and a second edge of a second lobe, wherein the first lobe and the second lobe are folded in a curved 3D film profile and aligned with each other, such that a groove is formed within the curved 3D film profile and within the display area between the first edge of the first lobe and the second edge of the second lobe, wherein the groove is filled with one or more seam materials.

17. The display structure of claim 16, wherein the display panel includes a polarizing layer, and the trench extends through the polarizing layer.

18. The display structure of claim 17, wherein the trench is substantially filled with an opaque filler material.

19. The display structure of claim 17, wherein the trench is substantially filled with an optically transparent filler material.

20. The display structure of claim 19, further comprising an opaque lining material within the groove and between the optically transparent filler material and the first and second lobes.

21. The display structure of claim 16, further comprising a polarizing layer extending over the display area of ​​the display panel, wherein the polarizing layer extends over the trench.

22. The display structure of claim 16, further comprising a polarizing layer extending over the display area of ​​the display panel and within the trench.

23. A method for forming a display structure, comprising: Polarization layers are stacked on the convex outer surface of the display panel; as well as The cover plate is laminated onto the convex outer surface of the polarization layer stack; The formation of the polarization layer stack includes: coating an inner delay layer on the display panel using a first solution-based technique, coating a linear polarization layer on the inner delay layer using a second solution-based technique, and coating an outer delay layer on the linear polarization layer using a third solution-based technique.

24. A method for forming a display structure, comprising: Polarization layers are stacked on the inner surface of the concave cover plate; as well as The polarizing layer and the cover plate are laminated onto the convex outer surface of the display panel; The formation of the polarization layer stack includes: coating an outer retardation layer on the concave cover plate using a first solution-based technique, coating a linear polarization layer on the outer retardation layer using a second solution-based technique, and coating an inner retardation layer on the linear polarization layer using a third solution-based technique.

Images