Method for manufacturing display panel, display panel and display device

Abstract

The present invention proposes a method for preparing a display panel, a display panel and a display device, comprising: providing an opposing substrate motherboard and a display substrate motherboard, forming a plurality of retaining walls located in a display area on the opposing substrate motherboard or the display substrate motherboard, and a sealing structure capable of forming a closed space between the opposing substrate motherboard and the display substrate motherboard, injecting excess ink into the opposing substrate motherboard or the display substrate motherboard, pre-bonding the opposing substrate motherboard and the display substrate motherboard to form a display panel motherboard, cutting the pre-sacrificial structure to form an ink outlet, bonding the opposing substrate motherboard and the display substrate motherboard for a second time to form a sealing frame structure, and sealing the ink outlet. Thus, a display panel with sufficient ink in a sub-pixel area can be prepared, and the display effect of the display panel is better.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] The reflective display device in the display panel is a device structure that uses natural light for display. It can use ambient light to achieve clear display under strong light or weak light conditions, and has the advantages of low driving voltage, energy saving, and little damage to the eyes. However, there are still many technical difficulties in the preparation process of reflective display panels, resulting in poor performance of the prepared display panels.

[0003] Therefore, the current method for preparing a display panel, the display panel and the display device still need to be improved. Summary of the invention

[0004] This application is based on the inventor's discovery of the following problems:

[0005] The inventors found that during the preparation of the display panel, ink needs to be filled between the display panels to achieve the display effect, but the sub-pixel area on the display panel is set to a small size, and the spacing between the opposing substrate and the display substrate is also small, that is, during the preparation of the display panel, the amount of ink injected into each sub-pixel area needs to be very precise, otherwise it is very easy to have insufficient or excessive ink filling problems, resulting in poor display. In addition, when the ink is overfilled or there is a gap between the retaining wall and the substrate during the preparation process on the display panel, the ink will migrate between different sub-pixel areas, resulting in unstable display.

[0006] The present application aims to solve one of the technical problems in the related art to a certain extent.

[0007] In one aspect of the present application, the present invention proposes a method for preparing a display panel, comprising: providing an opposing substrate motherboard and a display substrate motherboard, wherein the opposing substrate motherboard and the display substrate motherboard both have a display area and a peripheral area surrounding the display area, the display areas of the opposing substrate motherboard and the display substrate motherboard correspond to each other, a plurality of retaining walls located in the display area are formed on the opposing substrate motherboard or the display substrate motherboard, and a sealing structure capable of forming a closed space between the opposing substrate motherboard and the display substrate motherboard, the sealing structure comprising a pre-sealing frame structure and a pre-sacrificial structure, the pre-sealing frame structure and The pre-sacrificial structure forms a closed figure, and the orthographic projection of the pre-sacrificial structure on the substrate motherboard is located in the peripheral area, and the orthographic projection of the pre-sealed frame structure on the substrate motherboard is located in the display area. Excess ink is injected into the opposing substrate motherboard or the display substrate motherboard, and the opposing substrate motherboard and the display substrate motherboard are pre-bonded to form a display panel motherboard. The pre-sacrificial structure is cut to form an ink outlet, and the opposing substrate motherboard and the display substrate motherboard are bonded for a second time to form a sealed frame structure, and the excess part of the ink is discharged, and the ink outlet is sealed. Thus, a display panel with sufficient ink in the sub-pixel area can be prepared by first injecting excess ink and then discharging the excess part of the ink, and the display effect of the display panel is better.

[0008] According to an embodiment of the present invention, the method includes: during the secondary bonding, the heights of the sealing frame structure and the retaining wall are made consistent, and the volume of the excess ink is 1.1-2 times the volume of the ink in the display panel. In this way, the excess ink injection effect can be achieved without causing much ink waste.

[0009] According to an embodiment of the present invention, the ink contains active monomers, the mass fraction of the active monomers in the ink is 1-10%, the active monomers are UV-sensitive active monomers, and the UV-sensitive active monomers include at least one of acrylic acid, methyl acrylate, and methyl methacrylate. The method further includes: irradiating the plurality of retaining walls from one side of the display substrate motherboard in a direction perpendicular to the display substrate motherboard to obtain the display panel. Thus, the addition of active monomers in the ink can reduce the transfer of ink between sub-pixels.

[0010] According to an embodiment of the present invention, the ultraviolet-sensitive active monomer is acrylic acid, thereby further reducing the migration of ink in the sub-pixel interval.

[0011] According to an embodiment of the present invention, the pre-sealing frame structure has a first end and a second end connected to each other, the orthographic projections of the first end and the second end on the substrate motherboard do not overlap, and the first end and the second end are both connected to the pre-sacrificial structure, and the pre-sacrificial structure forms a plurality of protrusions from the display area toward the peripheral area between the first end and the second end. Thus, the discharge of excess ink can be achieved by setting the pre-sacrificial structure.

[0012] According to an embodiment of the present invention, the length of the protrusion in the direction from the display area to the peripheral area is 2-20 mm, which is beneficial to the arrangement of the pre-sacrificial structure.

[0013] According to an embodiment of the present invention, on a plane parallel to the substrate motherboard, the spacing between the plurality of protrusions is 20-50 mm, thereby improving the discharge effect of the excess portion of the ink.

[0014] According to an embodiment of the present invention, the width of the ink discharge port is 5-10 mm, thereby further improving the discharge effect of the excess portion of the ink.

[0015] According to an embodiment of the present invention, forming the ink outlet includes: removing all the protrusions to form a plurality of openings between the first end and the second end. Thus, a display panel with a higher screen-to-body ratio can be obtained.

[0016] According to an embodiment of the present invention, forming the ink outlet includes: removing part of the protrusions to form a plurality of openings at the plurality of protrusions. Thus, the display panel can be obtained relatively simply.

[0017] According to an embodiment of the present invention, the second bonding of the counter substrate motherboard and the display substrate motherboard includes: extruding the display panel motherboard in a direction perpendicular to the display panel motherboard to make the height of the prevention frame structure and the retaining wall consistent, and discharge the excess portion of the ink. Thus, the discharge effect of the excess portion of the ink can be further improved.

[0018] According to an embodiment of the present invention, the extrusion treatment method includes using at least one of flat pressing or roller pressing, thereby further improving the discharge effect of the excess portion of the ink.

[0019] According to an embodiment of the present invention, the plurality of retaining walls define a plurality of sub-pixel areas in the display area, and a connecting groove connecting the plurality of sub-pixel areas is provided between the plurality of retaining walls, and the method further comprises: from one side of the display substrate motherboard, pre-illuminating the connecting groove between the plurality of retaining walls in a direction perpendicular to the display substrate motherboard to polymerize the active monomers, close the connecting groove, and then irradiating the plurality of retaining walls in a direction perpendicular to the display substrate motherboard. Thus, the discharge effect of the excess portion in the ink can be further improved.

[0020] In another aspect of the present invention, the present invention provides a display panel, wherein the display panel is a display panel prepared by the above-mentioned method. Therefore, the display panel has all the features and advantages of the above-mentioned method, which will not be described in detail here.

[0021] In another aspect of the present invention, the present invention proposes a display panel, comprising: a display substrate and an opposing substrate arranged opposite to each other, the display substrate and the opposing substrate both comprising a display area and a peripheral area surrounding the display area, and the display area of ​​the display substrate corresponds to the display area of ​​the opposing substrate, the display substrate and the opposing substrate are bonded together through a sealing frame structure to form a closed space in the display area, the closed space further comprises a plurality of retaining walls, the plurality of retaining walls define a plurality of sub-pixel areas in the display area, the plurality of sub-pixel areas have ink, the ink has charged microspheres, wherein the retaining walls are in contact with both the display substrate and the opposing substrate, and the ink in the sub-pixel area is in contact with both the display substrate and the opposing substrate. As a result, the display panel has the characteristics of achieving complete ink filling and good gap sealing, better display effect, and better display stability.

[0022] According to an embodiment of the present invention, the side of the counter substrate facing the display substrate has a plurality of sub-color filters, the plurality of sub-color filters correspond to the plurality of sub-pixel areas, a black matrix is ​​provided between the plurality of sub-color filters, and the side of the plurality of sub-color filters facing the display substrate has a plurality of lens structures, the lens structures comprising: a lens, the lens being located on the side of the sub-color filter away from the counter substrate; a lens electrode, the lens electrode being located on the side of the lens away from the sub-color filter, and a dielectric layer, the dielectric layer being located on the side of the lens electrode away from the lens. Thus, the display panel can achieve a color display effect by setting the sub-color filters, the lens electrodes, and the dielectric layer.

[0023] According to an embodiment of the present invention, the orthographic projections of the plurality of retaining walls on the opposing substrate are located within the orthographic projection of the black matrix on the opposing substrate, thereby further improving the aperture ratio of the display panel and the display brightness.

[0024] According to an embodiment of the present invention, the material forming the sealing frame structure is sealing glue, and the width of the sealing frame structure is 600-2000 microns. Thus, the stability and screen-to-body ratio of the display panel can be further improved.

[0025] According to an embodiment of the present invention, the device further comprises: a sacrificial structure, the sacrificial structure is located in the peripheral area and forms a closed pattern together with the sealing frame structure, the sacrificial structure comprises two first parts and a second part located between the first parts, the first part is connected to the sealing frame structure, and the second part connects the two first parts. Thus, a display panel with high stability and better display effect can be obtained more easily.

[0026] According to an embodiment of the present invention, the material forming the sacrificial structure is a frame sealant, and the width of the sacrificial structure is 600-2000 micrometers, thereby further improving the stability of the display panel.

[0027] According to an embodiment of the present invention, the frame-sealing adhesive is at least one of a UV-curing adhesive and a thermal-curing adhesive, thereby enabling the display panel to be sealed more easily.

[0028] According to an embodiment of the present invention, the plurality of retaining walls define a plurality of sub-pixel areas in the display area, the retaining walls include a first retaining wall structure and a second retaining wall structure, the second retaining wall structure has an opening that can connect the plurality of sub-pixel areas, the first retaining wall structure is located at the opening, and the material forming the first retaining wall structure is an active monomer polymer. Thus, the display performance of the display panel can be further improved.

[0029] According to an embodiment of the present invention, the sealing frame structure has at least one silicon ball, and the diameter of the silicon ball is not less than the height of the retaining wall, thereby further improving the use stability of the display panel.

[0030] In another aspect of the present invention, the present invention provides a display device, including a display panel, wherein the display panel is the display panel described above. Therefore, the display device has all the features and advantages of the display panel described above, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0032] Figure 1 A schematic flow chart of a method according to an embodiment of the present invention is shown;

[0033] Figure 2 A schematic diagram showing the structure of a display panel in the related art is shown;

[0034] Figure 3 A partial schematic flow diagram of the method according to the present invention is shown;

[0035] Figure 4 A partial flow chart of a method according to an embodiment of the present invention is shown;

[0036] Figure 5 A top view of a sealing structure according to an embodiment of the present invention is shown;

[0037] Figure 6 A top view showing a partial flow diagram of a method according to an embodiment of the present invention;

[0038] Figure 7 A top view showing a partial flow diagram of a method according to yet another embodiment of the present invention;

[0039] Figure 8 A partial flow chart of a method according to another embodiment of the present invention is shown;

[0040] Fig. 9 shows a top view of a retaining wall according to one embodiment of the present invention;

[0041] Fig.10 shows a top view of a retaining wall according to yet another embodiment of the present invention;

[0042] Fig.11 A schematic diagram showing the structure of a display panel according to an embodiment of the present invention is shown;

[0043] Fig.12 A partial structural schematic diagram of a display panel according to an embodiment of the present invention is shown;

[0044] Fig.13 A partial structural schematic diagram of a display panel according to an embodiment of the present invention is shown;

[0045] Fig.14 A top view of a sealing frame structure according to an embodiment of the present invention is shown;

[0046] Fig.15 A top view of a sealing frame structure according to another embodiment of the present invention is shown;

[0047] Fig.16 A top view of a retaining wall structure according to one embodiment of the present invention is shown.

[0048] Description of reference numerals:

[0049] 100: opposing substrate motherboard; 110: opposing substrate; 120: sub-color film; 131: lens; 132: lens electrode; 133: dielectric layer; 140: black matrix; 200; display substrate motherboard; 210: display substrate; 310: ink; 311: charged microspheres; 320: retaining wall; 321: connecting groove; 322: second retaining wall structure; 323: first retaining wall structure; 330: sealing structure; 331: pre-sealing frame structure; 3311: first end; 3312: second end; 332: pre-sacrificial structure; 333: ink outlet; 340: sealing frame structure; 341: main body sealing frame structure; 342: main body sacrificial structure; 343: sealing structure. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0051] In one aspect of the present application, the present invention proposes a method for preparing a display panel. By injecting excess ink and discharging the excess portion of the ink in a subsequent process, uniform distribution of ink among the display panels is achieved, and the occurrence of insufficient ink filling and excessive ink filling is reduced, thereby improving the display effect of the display panel.

[0052] For ease of understanding, the following first briefly describes the principle by which the method for preparing a display panel can achieve the above beneficial effects:

[0053] There are two main types of display panels currently used for reflective display in the related art, namely E-Ink reflective display panel and Clear-Ink reflective display (CID) panel. Microcapsules are added to the ink of the E-ink reflective display panel, and the capsules contain black and white particles. The black particles are negatively charged and the white particles are positively charged. The overall microcapsules are in an electrically balanced state. When a positive charge is applied to the backplane of the display panel, the black particles approach the backplane electrode, and the white particles are distributed above the microcapsules. The ambient light incident from above is reflected at the white particles of the microcapsules, and the display panel appears in a bright state; when a negative charge is applied to the backplane of the display panel, the white particles approach the backplane electrode, and the black particles are distributed above the microcapsules. The ambient light incident from above is absorbed at the black particles of the microcapsules, and the display device appears in a dark state. The Clear-Ink reflective display panel is mainly composed of an opposing substrate, a display substrate, and a retaining wall. The substrates are filled with ink containing black microspheres. By applying different voltages to the electrodes on the surface of the opposing substrates, the black microspheres are attracted and repelled, thereby achieving changes in the bright state and the dark state. Compared with E-ink reflective display panels, Clear-Ink reflective display panels have the advantages of low driving voltage, low energy consumption, and the ability to achieve color display.

[0054] In the related art, multiple sub-pixel areas on the display panel need to be distinguished by the setting of annular retaining walls, so the retaining wall density on the display panel is very high to achieve a higher display resolution. The inventor found that in the process of preparing the display panel, when the opposing substrate motherboard and the display substrate motherboard are vacuum-bonded, since the compressible deformation of the retaining wall is extremely small and the size of the sub-pixel area is small, the amount of ink dripping needs to be very accurately controlled when the ink is injected between the substrate motherboards. Figure 2 When the amount of ink injected between the substrate and the motherboard is too small, insufficient ink filling may occur (such as Figure 2 Ink overfill (shown as a in Figure 2 The inventors also found that in order to ensure that the number of black microspheres (charged microspheres) in the ink in each sub-pixel area remains stable, the retaining wall adopts a closed structure. However, since the retaining wall is a closed structure, the ink between the upper and lower substrates is difficult to diffuse between adjacent sub-pixel areas, which easily leads to uneven filling of the ink in different sub-pixel areas (such as Figure 2 In addition, when the display panel is overfilled with ink during the preparation process (as shown in b in FIG. Figure 2 c in the figure) and there is a gap between the retaining wall and the substrate (as shown in Figure 2 As shown in d in the figure, the black microspheres in the ink will migrate between different sub-pixel intervals, resulting in unstable display.

[0055] In this application, the inventors designed a pre-sacrificial structure on the substrate motherboard and added active monomers to the ink to achieve the technical effect of complete ink filling and gap sealing, thereby solving the technical problems of insufficient ink filling, excessive filling, uneven filling, and unstable display caused by migration of black microspheres in the preparation process of reflective display panels.

[0056] This application proposes a method for preparing a display panel, referring to Figure 1 , including the following steps:

[0057] S100: Providing a counter substrate motherboard and a display substrate motherboard

[0058] According to some embodiments of the present invention, in this step, a counter substrate motherboard and a display substrate motherboard are provided, one side of the counter substrate motherboard has a plurality of sub-color films (the side facing the display substrate motherboard after subsequent assembly), and the sub-color films have a plurality of lens structures on the side away from the counter substrate motherboard, thereby, the finally manufactured display panel can perform color display through the arrangement of the sub-color films and the lens structures. Wherein, both the counter substrate motherboard and the display substrate motherboard have a display area and a peripheral area surrounding the display area, and the counter substrate motherboard

[0059] The display area of ​​the counter substrate motherboard corresponds to the display area of ​​the display substrate motherboard, thereby facilitating accurate bonding of the counter substrate motherboard and the display substrate motherboard. That is, in the subsequent bonding step, the display area of ​​the counter substrate motherboard corresponds to the display area of ​​the display substrate motherboard, and the peripheral area of ​​the counter substrate motherboard corresponds to the peripheral area of ​​the display substrate motherboard.

[0060] S200: forming a plurality of retaining walls located in the display area on the counter substrate motherboard or the display substrate motherboard, and a sealing structure capable of forming a closed space between the counter substrate motherboard and the display substrate motherboard

[0061] According to some embodiments of the present invention, the location of the retaining wall is not particularly limited. Figure 3 a, the retaining wall 320 can be disposed on the counter substrate motherboard 100, referring to Figure 3 In b, the retaining wall 320 can also be set on the display substrate motherboard 200.

[0062] According to some embodiments of the present invention, the location of the sealing structure is not particularly set, for example, the sealing structure and the retaining wall can be set on the same substrate motherboard, or can be set on two substrate motherboards respectively. Figure 4 b, the following explanation is given by assuming that both the sealing structure 330 and the retaining wall 320 are disposed on the display substrate motherboard 200:

[0063] According to some embodiments of the present invention, the composition and location of the sealing structure are not particularly limited. Figure 5For example, the sealing structure 330 may include a pre-sealing frame structure 331 and a pre-sacrificial structure 332, the pre-sealing frame structure 331 and the pre-sacrificial structure 332 form a closed figure, and the orthographic projection of the pre-sacrificial structure 332 on the substrate motherboard is located in the peripheral area, and the orthographic projection of the pre-sealing frame 331 structure on the substrate motherboard is located in the display area.

[0064] According to some embodiments of the present invention, the specific structure of the pre-sealing frame structure is not particularly limited. Figure 5 The pre-sealing frame structure 331 may have a first end 3311 and a second end 3312 connected to each other, the orthographic projections of the first end and the second end on the substrate motherboard do not overlap, and the first end and the second end are both connected to the pre-sacrificial structure 332, and the pre-sacrificial structure 322 forms a plurality of protrusions from the display area toward the peripheral area between the first end and the second end. When the pre-sealing frame structure and the pre-sacrificial structure are the above-mentioned structures, the pre-sacrificial structure can be cut off in the subsequent process to discharge the excess part of the ink, so that the ink inside the display panel is filled evenly and sufficiently.

[0065] According to some embodiments of the present invention, reference Figure 5 The shape of the multiple protrusions formed between the first end and the second end of the pre-sacrificial structure 332 from the display area to the peripheral area is not particularly limited. For example, the shape of the protrusion can be at least one of a trapezoid, a triangle, an arc, and a rectangle. When the protrusion is a rectangle, the two ends of any side of the rectangle can be connected to the first end and the second end of the pre-sealing frame structure respectively. Similarly, when the shape of the protrusion is a triangle or a trapezoid, the two ends of any side of the corresponding shape can be connected to the first end and the second end of the pre-sealing frame structure respectively. When the shape of the protrusion is an arc, the two ends of the arc can be connected to the first end and the second end of the pre-sealing frame structure respectively. When the pre-sacrificial structure includes multiple protrusions, in addition to the two ends of any side of the protrusion needing to be connected to the first end and the second end of the pre-sealing frame structure, the multiple protrusions also need to be connected to form a closed figure.

[0066] It should be noted that the shape, number and quantity of the aforementioned protrusions are not particularly limited, as long as it is convenient to cut the protrusions later to allow the excess ink to flow out smoothly. For example, the protrusion may have an opening on the side facing the pre-sealing frame structure. Before cutting, the protrusion can form a closed figure together with the pre-sealing frame structure. The protrusion and the interior of the pre-sealing frame structure are connected, so only the upper part of the protrusion needs to be cut to form an opening. Figure 5 That is, the opening can be formed by cutting only the part of the structure on the side of the raised portion (ie, the pre-sacrificial structure 332 ) away from the pre-sealing frame structure 331 .

[0067] According to an embodiment of the present invention, referring to Figure 5The length a of the protrusion in the direction from the display area to the peripheral area on the plane where the substrate motherboard is located is not particularly limited. For example, the length of the protrusion in the direction from the display area to the peripheral area can range from 2 to 20 mm. When the length of the protrusion in the direction from the display area to the peripheral area is less than 2 mm, the coating of the pre-sacrificial structure is more difficult and the coating is prone to adhesive failure; when the length of the protrusion in the direction from the display area to the peripheral area is greater than 20 mm, it is not conducive to improving the overall utilization rate of the substrate motherboard.

[0068] It should be particularly noted that, on a plane parallel to the substrate motherboard, the spacing between multiple protrusions is related to the number of ink outlets formed. When the width of the display panel motherboard is larger, more pre-sacrificial structures should be arranged on it, that is, the number of protrusions should be greater, thereby forming more ink outlets. Technical personnel in this field can make a choice based on actual conditions.

[0069] According to an embodiment of the present invention, referring to Figure 5 , in a plane parallel to the substrate motherboard, in a direction from the first end 3331 to the second end 3332, the spacing c between the plurality of protrusions is not particularly limited, for example, the spacing between the plurality of protrusions may range from 20 to 50 mm. The spacing between the plurality of protrusions determines the number of ink outlets formed after the pre-sacrificial structure is cut. When the spacing between the plurality of protrusions is greater than 50 mm, the number of ink outlets formed is small, which is not conducive to the discharge of excess ink. When the spacing between the plurality of protrusions is less than 20 mm, the number of ink outlets formed is too large, and the subsequent process flow for sealing the ink outlets is relatively cumbersome, resulting in a waste of time and consumables.

[0070] According to some embodiments of the present invention, the materials forming the pre-sealing frame structure and the pre-sacrificial structure are not particularly limited. For example, the materials forming the pre-sealing frame structure and the pre-sacrificial structure may be the same. Specifically, the materials forming the pre-sealing frame structure and the pre-sacrificial structure may be frame-sealing glue. Specifically, the frame-sealing glue may be at least one of UV-curing glue and thermal-curing glue.

[0071] S300: Injecting excess ink onto the opposing substrate motherboard or the display substrate motherboard

[0072] According to some embodiments of the present invention, reference Figure 4 In step c, in this step, excess ink 310 is injected between the opposing substrate motherboard and the display substrate motherboard 200. The excess ink 310 can be disposed on the opposing substrate motherboard or the display substrate motherboard 200. The volume of the excess ink is not particularly limited. For example, the volume of the excess ink can be 1.1-2 times the volume of the ink in the display panel. When the volume of the excess ink is within the above range, the excess injection effect of the ink can be achieved without causing much ink waste.

[0073] S400: Pre-bonding the counter substrate motherboard and the display substrate motherboard to form a display panel motherboard

[0074] According to some embodiments of the present invention, reference Figure 4 In step d, the display substrate motherboard 200 and the counter substrate motherboard 100 are pre-laminated using a vacuum laminating device, and after the pre-lamination is completed, the sealing structure 330 is cured, and then the display panel motherboard is turned over to facilitate ink leveling. Figure 4 In figure e, during the leveling process of the ink 310, since the amount of ink 310 dripping is much larger than the design value, the retaining wall 320 on the display substrate motherboard 200 cannot come into contact with the opposing substrate motherboard 100 to form a seal, so the retaining wall 320 cannot hinder the diffusion of the ink 310, that is, the initial size of the sealing structure 330 along the thickness direction of the display panel motherboard needs to be larger than the size of the retaining wall 320 along this direction, and the ink 310 diffuses and flows normally.

[0075] S500: Cutting the pre-sacrificial structure to form an ink outlet

[0076] According to one embodiment of the present invention, referring to Figure 7 In a, after the counter substrate motherboard and the display substrate motherboard are pre-bonded, the excess ink 310 has filled the closed space formed by the pre-sealing frame structure 331 and the pre-sacrificial structure 332 as well as the counter substrate motherboard and the display substrate motherboard. Therefore, in this step, the pre-sacrificial structure is cut to form an ink outlet to discharge the excess portion of the ink. The method of forming the ink outlet is not particularly limited. For example, refer to Figure 7 In b, the method of forming the ink outlet 333 may include: removing all protrusions, that is, removing all pre-sacrificial structures 332, so as to form a plurality of openings, that is, a plurality of ink outlets 333, between the first end and the second end of the pre-sealing frame structure 331. Thus, the discharge effect of the excess portion of the ink can be further improved by setting a plurality of ink outlets, and by completely removing the pre-sacrificial structures, the area of ​​the peripheral area of ​​the display panel is reduced, the frame width of the display panel is reduced, and the screen ratio of the display panel is increased.

[0077] According to some embodiments of the present invention, the method of forming the ink outlet is not particularly limited, for example, Figure 6 In b, the method for forming the ink outlet 333 includes: removing part of the protrusions, that is, removing part of the pre-sacrificial structure 332, so as to form a plurality of openings at a plurality of protrusions, that is, a plurality of ink outlets 333. Thus, a plurality of ink outlets can be formed by a relatively simple method without the need to accurately locate the cutting position, thereby improving the discharge effect of the excess portion of the ink.

[0078] According to some embodiments of the present invention, the method of cutting the pre-sacrificial structure to form the ink outlet is not particularly limited. For example, the method of cutting the pre-sacrificial structure to form the ink outlet may be at least one of wheel cutting and laser cutting.

[0079] According to some embodiments of the present invention, reference Figure 5 The width b of the ink outlet is not particularly limited. For example, the width of the ink outlet can be in the range of 5-10 mm. When the width of the ink outlet is less than 5 mm, the width of the ink outlet is small, which is not conducive to the discharge of excess ink. When the width of the ink outlet is greater than 10 mm, the width of the ink outlet is too large, and it is more complicated to seal the ink outlet in the subsequent process.

[0080] S600: performing secondary bonding of the counter substrate motherboard and the display substrate motherboard

[0081] According to some embodiments of the present invention, in this step, the counter substrate motherboard and the display substrate motherboard are laminated for a second time to form a sealing frame structure of the display panel, and the excess portion of the injected excess ink is discharged.

[0082] According to some embodiments of the present invention, a method for discharging excess portion of injected excess ink includes: during secondary bonding, making the height of the sealing frame structure and the retaining wall consistent, thereby, the height of the sealing frame structure formed after deformation by applying pressure to the pre-sealing frame structure can be consistent with the height of the retaining wall, that is, the excess portion of the ink can be discharged from the ink discharge port by means of pressure and deformation of the pre-sealing frame structure. It can be understood that since the sealing frame structure is formed by the pre-sealing frame structure after being pressed, the material forming the sealing frame structure is consistent with the material forming the pre-sealing frame structure, that is, the material forming the sealing frame structure can be the aforementioned sealing glue.

[0083] According to some embodiments of the present invention, when the glue forming the pre-sealing frame structure contains silicon balls whose diameter is close to the height of the retaining wall, after pressure is applied to the pre-sealing frame structure, the minimum height of the sealing frame structure formed after the pre-sealing frame structure becomes the diameter of the silicon balls, that is, the height of the retaining wall, so the height of the sealing frame structure is consistent with the height of the retaining wall.

[0084] According to some embodiments of the present invention, when all protrusions, that is, all pre-sacrificial structures are removed to form an ink outlet between the first end and the second end of the pre-sealing frame structure, after the opposing substrate motherboard and the display substrate motherboard are laminated for a second time, the pre-sealing frame structure can be compressed to form a sealing frame structure.

[0085] According to some embodiments of the present invention, when an ink outlet is formed between the first end and the second end of the pre-sealing frame structure by removing part of the protrusion, that is, removing part of the pre-sacrificial structure, the pre-sealing frame structure can be pressed to form a sealing frame structure after the opposing substrate motherboard and the display substrate motherboard are bonded for the second time. Similarly, since the material forming the pre-sealing frame structure is consistent with the material forming the pre-sacrificial structure, the pre-sacrificial structure with the ink outlet located in the peripheral area will also form a sacrificial structure after being pressed.

[0086] It should be noted that in the actual preparation process, Figure 8 a in the figure, due to the existence of tolerance, after the opposing substrate motherboard and the display substrate motherboard are bonded for the second time to make the height of the sealing frame structure and the height of the retaining wall consistent, there will still be a slight difference between the height of the sealing frame structure and the height of the retaining wall due to the tolerance. This height difference can be further reduced in the subsequent active monomer directional polymerization process, thereby avoiding the occurrence of adverse reactions caused by the migration of black microspheres in the ink between adjacent sub-pixel areas.

[0087] According to some embodiments of the present invention, the method of performing secondary bonding of the counter substrate motherboard and the display substrate motherboard is not particularly limited. For example, the display panel motherboard can be squeezed in a direction perpendicular to the display panel motherboard to make the height of the prevention frame structure and the retaining wall consistent and discharge the excess portion of the ink. Specifically, the squeezing method includes using at least one of flat pressing or roller pressing. This helps to more completely discharge the excess portion of the ink, and can further improve the discharge effect of the excess portion of the ink.

[0088] S700: Seal the ink outlet

[0089] According to some embodiments of the present invention, after the excess portion of the ink is completely discharged, the ink outlet is sealed in this step. The method for sealing the ink outlet includes: setting a frame sealing glue at the ink outlet. The type of the frame sealing glue is not particularly limited. For example, the frame sealing glue can be at least one of a UV curing glue or a thermal curing glue.

[0090] As mentioned above, in the actual preparation process, due to the existence of tolerance, after the counter substrate motherboard and the display substrate motherboard are laminated for the second time to make the height of the sealing frame structure and the retaining wall consistent, there will still be a gap between the sealing frame structure and the retaining wall due to the tolerance, and this gap will still cause the black microspheres in the ink to migrate between adjacent sub-pixel areas, causing defects. In order to avoid the above defects, refer to Figure 8 a in Figure 8 b in Fig. 9 , Fig.10 After the ink outlet is sealed, the method may further include:

[0091] According to some embodiments of the present invention, the ink 310 may contain active monomers, and the type of active monomers is not particularly limited. For example, the active monomers may be ultraviolet-sensitive active monomers. Specifically, the ultraviolet-sensitive active monomers include at least one of acrylic acid, methyl acrylate, and methyl methacrylate. Preferably, the ultraviolet-sensitive active monomer may be acrylic acid. When the ink contains active monomers, the method for preparing a display panel further includes: from one side of the display substrate motherboard, after sealing the ink outlet, irradiating a plurality of retaining walls in a direction perpendicular to the display substrate motherboard.

[0092] According to some embodiments of the present invention, in order to further improve the aperture ratio of the display panel, the position of the blocking wall can be such that the orthographic projection of the blocking wall on the opposing substrate is located within the orthographic projection of the black matrix on the opposing substrate. Since the orthographic projection of the blocking wall on the opposing substrate can be located within the orthographic projection of the black matrix on the opposing substrate, that is, when the blocking wall is illuminated from one side of the opposing substrate, due to the presence of the black matrix, the light will be absorbed by the black matrix and cannot illuminate the blocking wall. Therefore, the blocking wall should be illuminated from the display substrate side.

[0093] According to some embodiments of the present invention, reference Fig. 9 When the top view of the plurality of retaining walls 320 on the substrate is shown in FIG9 , the method of irradiating the plurality of retaining walls in a direction perpendicular to the display substrate motherboard is not particularly limited. For example, the plurality of retaining walls may be irradiated with ultraviolet light in a direction perpendicular to the display substrate motherboard. When the active monomer in the ink is an ultraviolet-sensitive active monomer, when the plurality of retaining walls are irradiated in a direction perpendicular to the display substrate motherboard, the active monomer in the ink may be adsorbed on the retaining walls under ultraviolet light and undergo polymerization reaction, thereby completing the gap filling at the contact position between the retaining walls and the substrate, and avoiding the occurrence of adverse reactions caused by the migration of black microspheres in the ink between adjacent sub-pixel areas due to the gap.

[0094] According to some embodiments of the present invention, when a top view of a plurality of retaining walls 320 on a substrate is shown in Figure 9, the height of a sealing structure prepared between a display substrate and an opposing substrate is not particularly limited. For example, the ratio of the height of the sealing structure to the height of the retaining wall structure may be in the range of (3:1)-(5:1). Specifically, the ratio of the height of the sealing structure to the height of the retaining wall structure may be 5:1.

[0095] According to some embodiments of the present invention, reference Fig.10When the top view of the plurality of retaining walls 320 on the substrate is shown in Figure 10, the plurality of retaining walls 320 define a plurality of sub-pixel areas in the display area, and there are connecting grooves 321 between the plurality of retaining walls to connect the plurality of sub-pixel areas. When the display panel motherboard is subjected to an extrusion process to discharge the excess portion of the ink, due to the presence of the connecting grooves 321, the ink has a better leveling effect inside the display panel, and the discharge of the excess portion of the ink is also more complete. When the retaining walls are of the above structure, the method for preparing the display panel further includes: from one side of the display substrate motherboard, pre-illuminating the connecting grooves between the plurality of retaining walls in a direction perpendicular to the display substrate motherboard to polymerize the active monomers, close the connecting grooves, and then irradiate the plurality of retaining walls in a direction perpendicular to the display substrate motherboard. When the active monomer in the ink is an ultraviolet-sensitive active monomer, a pre-illumination treatment is performed on the connecting grooves between the plurality of retaining walls from one side of the display substrate motherboard in a direction perpendicular to the display substrate motherboard. When the pre-illumination treatment is ultraviolet light, the active monomer can undergo a polymerization reaction at the connecting groove position to fill the connecting groove, so that the retaining wall is sealed, forming a similar Fig. 9 The structure shown in the figure; after the baffle wall is sealed, multiple baffle walls can be irradiated in a direction perpendicular to the display substrate motherboard. When the multiple baffle walls are irradiated with ultraviolet light, the residual active monomers in the ink are polymerized in the gap between the baffle wall and the substrate, completing the filling of the gap between the baffle wall and the substrate, reducing the occurrence of poor display problems caused by the migration of ink from the gap.

[0096] According to some embodiments of the present invention, when a top view of a plurality of retaining walls 320 on a substrate is as shown in Figure 10, that is, when a connecting groove connecting a plurality of sub-pixel areas is provided between the plurality of retaining walls, the height of the sealing structure prepared between the display substrate and the opposing substrate is not particularly limited. For example, the ratio of the height of the sealing structure to the height of the retaining wall structure may be in the range of (3:1)-(5:1). Specifically, the ratio of the height of the sealing structure to the height of the retaining wall structure may be 3:1. Thus, the setting height of the sealing structure may be reduced by designing the connecting groove, thereby reducing the preparation cost.

[0097] According to some embodiments of the present invention, the mass fraction of active monomers in the ink is not particularly limited. For example, the mass fraction of active monomers in the ink can range from 1 to 10%. When the mass fraction of active monomers in the ink is less than 1%, the active monomers in the ink are relatively few and insufficient to polymerize the retaining wall and the substrate to further connect the retaining wall and the substrate, thereby sealing the sub-pixel area. When the mass fraction of active monomers in the ink is greater than 10%, there are too many active monomers in the ink. After further connecting the retaining wall and the substrate, some active monomers still remain in the ink, thereby affecting the ink in the sub-pixel area, thereby reducing the stability of the display panel.

[0098] In another aspect of the present invention, the present invention provides a display panel, which is a display panel prepared by the above method. Therefore, the display panel has all the features and advantages of the above method, which will not be described in detail here.

[0099] In another aspect of the present invention, the present invention provides a display panel, referring to Fig.11 , including: a display substrate 210 and an opposing substrate 110 arranged opposite to each other, the display substrate 210 and the opposing substrate 110 both including a display area and a peripheral area surrounding the display area, and the display substrate 210 corresponds to the display area of ​​the opposing substrate 110, the display substrate 210 and the opposing substrate 110 are bonded together through a sealing frame structure 340 to form a closed space in the display area, the closed space further includes a plurality of retaining walls 320, the plurality of retaining walls 320 define a plurality of sub-pixel areas in the display area, the plurality of sub-pixel areas have ink 310, the ink 310 has charged microspheres 311, wherein the retaining walls 320 are in contact with both the display substrate 210 and the opposing substrate 110, and the ink 310 in the sub-pixel area is in contact with both the display substrate 210 and the opposing substrate 110. The retaining wall of the display panel is in contact with both the display substrate and the opposing substrate, which helps to avoid the ink in the sub-pixel area from migrating between adjacent sub-pixel areas and causing defects. The ink in the sub-pixel area of ​​the display panel is in contact with both the display substrate and the opposing substrate, that is, the ink in the sub-pixel area fills the sub-pixel area where it is located, and the ink content in each sub-pixel area remains consistent, which helps to avoid the occurrence of display defects due to over-filling, under-filling and uneven filling of ink in the sub-pixel area.

[0100] According to some embodiments of the present invention, the structure of the counter substrate is not particularly limited. Fig.12 and Fig.13 For example, a side of the opposing substrate 110 facing the display substrate 210 has a plurality of sub-color films 120, the plurality of sub-color films 120 correspond to a plurality of sub-pixel areas, a black matrix 140 is provided between the plurality of sub-color films 120, and a side of the plurality of sub-color films 120 facing the display substrate 210 has a plurality of lens structures, the lens structure comprising: a lens 131, the lens 131 is located on a side of the sub-color film 120 away from the opposing substrate 110; a lens electrode 132, the lens electrode 132 is located on a side of the lens 131 away from the sub-color film 120, and a dielectric layer 133, the dielectric layer 133 is located on a side of the lens electrode 132 away from the lens 131.

[0101] According to some embodiments of the present invention, the ink 310 of the display panel may contain black microspheres 311, which have two characteristics: being sensitive to voltage or electric field, being able to move quickly under electric field or voltage, and having strong light absorption ability. Fig.12When a voltage or electric field that repels the black microspheres 311 is applied to the lens electrode 132, the black microspheres 311 will move away from the surface of the dielectric layer 133. For example, the sub-color filter 120 is a red color filter. Fig.12 The incident natural light indicated by the middle arrow is filtered into red light after passing through the red sub-color filter. Because the refractive index of the dielectric layer 133 is greater than the refractive index of the ink 310, the red light is totally reflected at the interface between the dielectric layer and the ink, and the sub-pixel area appears bright. Fig.13 When a voltage or electric field that attracts the black microspheres 311 is applied to the lens electrode 132, the black microspheres 311 are adsorbed on the surface of the dielectric layer 133. Fig.13 The incident natural light indicated by the middle arrow is absorbed by the black microspheres 311 at the interface between the dielectric layer and the ink, and no reflected light escapes, so the sub-pixel area is in a dark state. Thus, the sub-pixel area can be in a dark state or a bright state of the color corresponding to the sub-color filter by applying a voltage or changing a voltage on the lens electrode.

[0102] According to some embodiments of the present invention, the position of the orthographic projection of the retaining wall on the opposing substrate is not particularly limited, for example, the orthographic projection of the plurality of retaining walls on the opposing substrate may be located within the orthographic projection of the black matrix on the opposing substrate. Thus, the aperture ratio of the display panel can be further improved.

[0103] According to some embodiments of the present invention, the structure of the retaining wall is not particularly limited, and a plurality of retaining walls may define a plurality of sub-pixel areas in the display area. Fig.16 The retaining wall structure may include a first retaining wall structure 323 and a second retaining wall structure 322, wherein the second retaining wall structure 322 has an opening that can connect multiple sub-pixel areas, and the first retaining wall structure 323 is located at the opening, wherein the first retaining wall structure may be formed by polymerizing active monomers at the position of the first retaining wall structure, that is, the materials forming the first retaining wall structure and the second retaining wall structure may be different. Fig.10 In the retaining wall structure shown, the active monomer is an ultraviolet light sensitive monomer. After ultraviolet light is irradiated on the connecting groove 321 to polymerize the active monomer, a first retaining wall structure 323 can be formed at the corresponding position of the connecting groove 321, so that the first retaining wall structure is connected to the second retaining wall structure, thereby obtaining Fig.16 The retaining wall structure shown.

[0104] According to some embodiments of the present invention, the type of material forming the sealing frame structure is not particularly limited, for example, the material forming the sealing frame structure may be a sealing glue. According to some embodiments of the present invention, the width of the sealing frame structure is not particularly limited, for example, the width of the sealing frame structure may range from 600 to 2000 microns. When the width of the sealing frame structure is less than 600 microns, the width of the sealing glue is too narrow, and the risk of ink leakage caused by puncture of the sealing glue is high; when the width of the sealing frame structure is greater than 2000 microns, the width of the sealing glue is too wide, which is not conducive to manufacturing a narrow-frame display device with a high screen-to-body ratio.

[0105] According to some embodiments of the present invention, the type of glue forming the sealing frame structure is not particularly limited. For example, when the glue forming the pre-sealing frame structure contains silicon balls whose diameter is close to the height of the retaining wall, after pressure is applied to the pre-sealing frame structure, the minimum height of the sealing frame structure formed after the pre-sealing frame structure is compressed and deformed is the diameter of the silicon balls, that is, the height of the retaining wall. Therefore, the height of the sealing frame structure can be consistent with the height of the retaining wall.

[0106] According to some embodiments of the present invention, the number of silicon balls in the sealing frame structure is not particularly limited as long as they can play a supporting role between the substrates. For example, the number of silicon balls in the sealing frame structure can be at least one. Specifically, the number of silicon balls in the sealing frame structure can be multiple, so as to play a supporting role between the substrates.

[0107] According to some embodiments of the present invention, the type of the sealant forming the sealing structure is not particularly limited, for example, the sealant forming the sealing structure can be at least one of UV curing glue and thermal curing glue. Thus, the sealing structure of the display panel can be formed more easily.

[0108] According to some embodiments of the present invention, the composition of the sealing frame structure is not particularly limited. For example, Fig.14 The sealing frame structure may include a main sealing frame structure 341 and a sealing structure 343. According to some embodiments of the present invention, the materials forming the main sealing frame structure and the sealing structure are not particularly limited. For example, the materials forming the main sealing frame structure and the sealing structure may both be sealing glue. Specifically, the types of the sealing glue forming the main sealing frame structure and the sealing glue forming the sealing structure may be the same or different. For example, the sealing glue forming the main sealing frame structure may be at least one of ultraviolet curing glue or thermal curing glue, and the sealing glue forming the sealing structure may be at least one of ultraviolet curing glue or thermal curing glue. In this way, the sealing structure of the display panel can be formed relatively simply.

[0109] According to some embodiments of the present invention, the structure of the display panel is not particularly limited. For example, the display panel may include: a sacrificial structure, the sacrificial structure is located in the peripheral area and together with the sealing frame structure forms a closed figure, the sacrificial structure includes two first parts and a second part located between the first parts, the first part is connected to the sealing frame structure, and the second part connects the two first parts. Sacrificial structure When the display panel has the above-mentioned sacrificial structure, similar to the above, when preparing the display panel, the excess part of the ink can be discharged by partially removing the pre-sacrificial structure to achieve sufficient filling of the ink in the sub-pixel area and contact between the baffle and the display substrate and the opposing substrate. After the excess ink is discharged, the opening formed by the pre-sacrificial structure can also be sealed, for example, the opening is sealed with a glue material to form a sealed figure. The first part of the sacrificial structure can be formed by the above-mentioned pre-sacrificial structure, and the second part is formed by materials such as glue that seals the opening for discharging ink.

[0110] According to some embodiments of the present invention, the structure of the sacrificial structure is not particularly limited. Fig.15 , the sacrificial structure may include a main sacrificial structure 342 and a sealing structure 343. According to some embodiments of the present invention, the materials forming the main sacrificial structure and the sealing structure are not particularly limited. For example, the materials forming the main sacrificial structure and the sealing structure may both be frame-sealing glue. Specifically, the frame-sealing glue forming the main sacrificial structure and the frame-sealing glue forming the sealing structure may be the same or different in type. For example, the frame-sealing glue forming the main sacrificial structure may be at least one of a UV curing glue or a thermal curing glue, and the frame-sealing glue forming the sealing structure may be at least one of a UV curing glue or a thermal curing glue. In this way, the sealing structure of the display panel can be formed relatively simply.

[0111] According to some embodiments of the present invention, the type of material forming the sacrificial structure is not particularly limited, for example, the material forming the sacrificial structure may be a frame sealant. According to some embodiments of the present invention, the width of the sacrificial structure is not particularly limited, for example, the width of the sacrificial structure may range from 600 to 2000 microns. When the width of the sacrificial structure is less than 600 microns, the width of the frame sealant is too narrow, and the risk of ink leakage caused by puncture of the frame sealant is high; when the width of the sacrificial structure is greater than 2000 microns, the width of the frame sealant is too wide, which is not conducive to the manufacture of a narrow-frame display device with a high screen-to-body ratio.

[0112] In another aspect of the present invention, the present invention provides a display device, including a display panel, wherein the display panel is the aforementioned display panel. Therefore, the display device has all the features and advantages of the aforementioned display panel, which will not be described in detail here.

[0113] In the description of the present invention, the orientation or position relationship indicated by the terms "upper" and "lower" etc. is based on the orientation or position relationship shown in the drawings and is only for the convenience of describing the present invention rather than requiring the present invention to be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0114] In the description of this specification, the description with reference to the terms "one embodiment", "another embodiment", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0115] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A method for preparing a display panel, It is characterized in that include: providing an opposing substrate motherboard and a display substrate motherboard, wherein the opposing substrate motherboard and the display substrate motherboard both have a display area and a peripheral area surrounding the display area, and the display area of ​​the opposing substrate motherboard corresponds to the display area of ​​the display substrate motherboard, A plurality of retaining walls located in the display area are formed on the opposing substrate motherboard or the display substrate motherboard, and a sealing structure capable of forming a closed space between the opposing substrate motherboard and the display substrate motherboard, the sealing structure comprising a pre-sealing frame structure and a pre-sacrificial structure, the pre-sealing frame structure and the pre-sacrificial structure forming a closed figure, and the orthographic projection of the pre-sacrificial structure on the substrate motherboard is located in the peripheral area, and the orthographic projection of the pre-sealing frame structure on the substrate motherboard is located in the display area, injecting excess ink into the counter substrate motherboard or the display substrate motherboard, Pre-bonding the counter substrate motherboard with the display substrate motherboard to form a display panel motherboard, cutting the pre-sacrificial structure to form an ink outlet, The counter substrate motherboard and the display substrate motherboard are laminated for a second time to form a sealing frame structure, and the excess portion of the ink is discharged. The ink outlet is sealed. The pre-sealing frame structure has a first end and a second end connected to each other, the orthographic projections of the first end and the second end on the substrate motherboard do not overlap, and the first end and the second end are both connected to the pre-sacrificial structure, and the pre-sacrificial structure forms a plurality of protrusions from the display area toward the peripheral area between the first end and the second end, The second bonding of the opposing substrate motherboard and the display substrate motherboard includes: extruding the display panel motherboard in a direction perpendicular to the display panel motherboard to make the heights of the pre-sealing frame structure and the retaining wall consistent and discharge the excess portion of the ink.

2. The method according to claim 1, It is characterized in that The method comprises: when performing the secondary lamination, making the heights of the sealing frame structure and the retaining wall consistent, and the volume of the excess ink is 1.1-2 times the volume of the ink in the display panel.

3. The method according to claim 2, It is characterized in that The ink contains active monomers, and the mass fraction of the active monomers in the ink is 1-10%. The active monomer is an ultraviolet-sensitive active monomer, and the ultraviolet-sensitive active monomer includes at least one of acrylic acid, methyl acrylate and methyl methacrylate. The method further comprises: irradiating the plurality of retaining walls from one side of the display substrate motherboard in a direction perpendicular to the display substrate motherboard to obtain the display panel; Preferably, the UV-sensitive active monomer is acrylic acid.

4. The method according to claim 1, It is characterized in that The length of the protrusion in the direction from the display area toward the peripheral area is 2-20 mm.

5. The method according to claim 1, It is characterized in that Optionally, on a plane parallel to the substrate motherboard, the spacing between the plurality of protrusions is 20-50 mm.

6. The method according to claim 1, It is characterized in that The width of the ink outlet is 5-10 mm.

7. The method according to claim 1, It is characterized in that Forming the ink discharge port includes removing all of the protrusions to form a plurality of openings between the first end and the second end.

8. The method according to claim 1, It is characterized in that Forming the ink discharge port includes removing a portion of the protrusions to form a plurality of openings at the plurality of protrusions.

9. The method according to claim 1, It is characterized in that The extrusion treatment method includes using at least one of flat press or roller press.

10. The method according to claim 3, It is characterized in that The plurality of baffles define a plurality of sub-pixel areas within the display area, and connecting grooves connecting the plurality of sub-pixel areas are provided between the plurality of baffles. The method further comprises: pre-illuminating the connecting grooves between the plurality of baffles from one side of the display substrate motherboard along a direction perpendicular to the display substrate motherboard to polymerize the active monomers and close the connecting grooves, and then irradiating the plurality of baffles along a direction perpendicular to the display substrate motherboard.

11. A display panel, It is characterized in that The display panel is a display panel prepared by the method according to any one of claims 1 to 10.

12. A display panel, It is characterized in that include: A display substrate and a counter substrate are arranged opposite to each other, wherein the display substrate and the counter substrate both include a display area and a peripheral area surrounding the display area, and the display substrate corresponds to the display area of ​​the counter substrate, and the display substrate and the counter substrate are attached to each other through a sealing frame structure to form a closed space in the display area, The enclosed space further includes a plurality of retaining walls, wherein the plurality of retaining walls define a plurality of sub-pixel areas in the display area, wherein the plurality of sub-pixel areas contain ink, and the ink contains charged microspheres, The retaining wall is in contact with both the display substrate and the counter substrate, and the ink in the sub-pixel region is in contact with both the display substrate and the counter substrate. The invention further comprises: a sacrificial structure, the sacrificial structure extending from the display area toward the peripheral area, and the sacrificial structure is located in the peripheral area and forms a closed pattern together with the sealing frame structure. The sacrificial structure includes two first parts and a second part located between the first parts, the first part is connected to the sealing frame structure, and the second part connects the two first parts.

13. The display panel according to claim 12, It is characterized in that The counter substrate has a plurality of sub-color filters on one side facing the display substrate, the plurality of sub-color filters correspond to the plurality of sub-pixel areas, and a black matrix is ​​provided between the plurality of sub-color filters. The multiple sub-color films have multiple lens structures on one side facing the display substrate, and the lens structure includes: a lens, which is located on the side of the sub-color film away from the opposing substrate; a lens electrode, which is located on the side of the lens away from the sub-color film; and a dielectric layer, which is located on the side of the lens electrode away from the lens.

14. The display panel according to claim 13, It is characterized in that The orthographic projections of the plurality of retaining walls on the opposing substrate are located within the orthographic projection of the black matrix on the opposing substrate.

15. The display panel according to claim 12, It is characterized in that The material forming the sealing frame structure is sealing glue, and the width of the sealing frame structure is 600-2000 microns.

16. The display panel according to claim 12, It is characterized in that The material used to form the sacrificial structure is frame sealing glue, and the width of the sacrificial structure is 600-2000 microns.

17. The display panel according to claim 15 or 16, It is characterized in that The frame-sealing adhesive is at least one of an ultraviolet curing adhesive and a thermal curing adhesive.

18. The display panel according to claim 12, It is characterized in that The plurality of retaining walls define a plurality of sub-pixel areas in the display area, and the retaining walls include a first retaining wall structure and a second retaining wall structure. The second retaining wall structure has an opening that can connect the multiple sub-pixel areas, the first retaining wall structure is located at the opening, and the material forming the first retaining wall structure is an active monomer polymer.

19. The display panel according to claim 12, It is characterized in that The sealing frame structure has at least one silicon ball, and the diameter of the silicon ball is not less than the height of the retaining wall.

20. A display device, It is characterized in that It comprises a display panel, and the display panel is the display panel according to any one of claims 11 to 19.

Images