A method, apparatus and electronic component for soldering

Abstract

The present application relates to the technical field of circuit board manufacturing, and particularly relates to a tin brushing die bonding method, device and electronic component. The present application provides a tin brushing die bonding method for tin brushing die bonding on a substrate, comprising the following steps: identifying at least four pads on the substrate close to the outer edge of the substrate; obtaining a plurality of distance values between adjacent two pads along the outer edge of the substrate; classifying the distance values according to whether the difference between the distance values and a preset size meets a preset accuracy range, and substituting the classification result into a preset algorithm to obtain the mesh size of the steel mesh; and covering the steel mesh conforming to the steel mesh size to the substrate and performing tin brushing on the steel mesh to bond the die. The present application further provides a device and an electronic component. The problem of poor tin brushing accuracy due to non-uniform substrate size is solved.

Description

[Technical Field]

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method, apparatus and electronic component for solder bonding. [Background Technology]

[0002] As LED chips become smaller, the pads on the substrate also become smaller, and the spacing between adjacent pads becomes smaller. Current soldering methods usually involve first laying a stencil on the substrate and then applying solder. If a stencil is not used during the soldering process, the pads are very prone to bridging after the solder paste has been applied and the circuit has been reflowed, leading to short circuits in the LEDs and resulting in display defects.

[0003] In the solder paste printing process, the spacing between adjacent pads in existing stencils becomes increasingly smaller, leading to smaller gaps between stencil openings. The precision of the stencil affects whether the solder paste can adequately fill the pads. However, existing substrates are typically rectangular and subject to expansion and contraction, meaning the substrate shape may not be perfectly symmetrical vertically. This makes it difficult to standardize substrate dimensions. Measuring the distance between adjacent pads on each substrate and designing a stencil suitable for each substrate is time-consuming and labor-intensive. Therefore, solving the problem of poor solder paste application precision caused by inconsistent substrate dimensions is urgently needed. [Summary of the Invention]

[0004] To address the issue of poor soldering accuracy due to inconsistent substrate sizes, this invention provides a soldering and die bonding method and an electronic component.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a solder brushing and die bonding method for solder brushing and die bonding on a substrate, comprising the following steps: identifying at least four pads on the substrate near the outer edge of the substrate;

[0006] Obtain multiple distance values ​​between two adjacent pads along the outer edge of the substrate;

[0007] The distance values ​​are classified according to whether the difference between the distance value and the preset size meets the preset accuracy range, and the classification results are substituted into the preset algorithm to obtain the mesh size of the steel mesh.

[0008] A stencil of the appropriate size is applied to the substrate and then tinned before die bonding.

[0009] Preferably, identifying at least four pads on the substrate near the outer edge of the substrate includes the following steps: identifying the position of the center point of at least four pads on the outer edge of the substrate using a preset identification device; and connecting the center points using a preset measuring device.

[0010] Preferably, obtaining multiple distance values ​​between two adjacent pads along the outer edge of the substrate includes the following steps: measuring the distance value between the center points of two adjacent pads on the connection line and obtaining at least four distance values.

[0011] Preferably, the preset accuracy includes a first preset accuracy and a second preset accuracy; the range of the first preset accuracy is -0.7 to 0.7 mm, and the range of the second preset accuracy is -0.05 to 0.05 mm.

[0012] Preferably, classifying the distance values ​​according to a preset accuracy range includes the following steps: selecting substrates that meet a first preset accuracy based on the difference between the distance value and the preset size value; and further classifying the substrates that meet the first preset accuracy based on a second preset accuracy.

[0013] Preferably, the step of substituting the classification result into a preset algorithm to obtain the mesh size of the steel mesh includes the following steps: obtaining the number of preset pads on the substrate, and substituting the distance value classification result and the number of pads into a VB macro to obtain the mesh size of the steel mesh.

[0014] Preferably, the process of tinning the stencil includes the following steps: forming a solder paste layer on the side of the stencil away from the substrate by coating; and removing the stencil to allow the solder paste layer to fill the pads and form connection points for die bonding.

[0015] To solve the above-mentioned technical problems, the present invention provides another technical solution as follows: an apparatus for use in the above-mentioned tin-bonding method, the apparatus comprising:

[0016] Identification device: Identifies the positions of at least four pads near the outer edge of the substrate;

[0017] Measuring equipment: Used to determine the distance between two adjacent pads along the basic outer edge of at least four pads;

[0018] Computing device: used to classify distance values ​​based on whether the difference between the distance value and the preset size meets the preset accuracy range, and to substitute the classification results into the preset algorithm to obtain the mesh size of the steel mesh;

[0019] Tin-coating equipment: used to cover a substrate with a stencil with a mesh size calculated by a computer and then apply tin to the stencil before die bonding.

[0020] Preferably, the preset algorithm is a VB macro.

[0021] To solve the above-mentioned technical problems, the present invention provides another technical solution as follows: an electronic component, which is prepared by the above-mentioned tin-bonding method.

[0022] Compared with the prior art, the tin-bonding method, apparatus and electronic component provided by the present invention have the following beneficial effects:

[0023] 1. An embodiment of the present invention provides a method for soldering and die bonding on a substrate, comprising the following steps: identifying at least four pads near the outer edge of the substrate; obtaining multiple distance values ​​between adjacent pads along the outer edge of the substrate; classifying the distance values ​​according to whether the difference between the distance values ​​and a preset size meets a preset accuracy range, and substituting the classification results into a preset algorithm to obtain the mesh size of a stencil; covering the substrate with a stencil conforming to the stencil size and soldering the stencil before die bonding. It should be understood that by measuring only the distances between at least four pads near the outer edge of the substrate, preferably, when the substrate is rectangular, only the distances between four pads near the outer corners of the substrate, the mesh size of the stencil can be obtained by classifying the distance values ​​according to a preset accuracy range and combining them with a preset algorithm. This avoids measuring the distance of each pad, saving time and effort while also improving the problem of poor soldering accuracy when substrate dimensions are inconsistent, and increasing the efficiency of soldering the substrate.

[0024] 2. The identification of at least four pads near the outer edge of the substrate in this embodiment of the invention includes the following steps: identifying the positions of the center points of at least four pads near the outer edge of the substrate using a preset identification device; and connecting the center points using a preset measuring device. It should be understood that the substrate is first identified using the preset identification device, and then the pads near the outer edge of the substrate are identified. Preferably, the substrate is rectangular, and the pads identified by the identification device are the pads near the four outer corners of the substrate. After identifying the pads, the position of the center point of the pad is determined and the position information of the pad center point is obtained, which is simple and convenient.

[0025] 3. The embodiment of the present invention for obtaining multiple distance values ​​between two adjacent pads along the outer edge of the substrate includes the following steps: measuring the distance between the center points of two adjacent pads on the connection line and obtaining at least four distance values. The distance between the center points of the pads can be directly measured using a preset measuring device. Specifically, the measuring device is electrically connected to an identification device, receives the center point information of the pads transmitted from the identification device, and then directly measures the straight-line distance between the connected center points to obtain four distance values.

[0026] 4. The preset accuracy in this embodiment of the invention includes a first preset accuracy and a second preset accuracy; the range of the first preset accuracy is -0.7 to 0.7 mm, and the range of the second preset accuracy is -0.05 to 0.05 mm. The larger the size of the substrate, the larger the required accuracy range can be. For example, when the substrate is approximately rectangular and 100 mm long, the first preset accuracy can be a smaller range, such as ±0.2 mm. When the substrate length is 600 mm, the first preset accuracy can also be a larger range, such as ±0.7 mm. That is, the first preset accuracy can be adjusted according to the size of the substrate to be suitable for substrates of different sizes, thus having a wide range of applications.

[0027] 5. The classification of distance values ​​according to a preset accuracy range in this embodiment of the invention includes the following steps: screening substrates that meet a first preset accuracy based on the difference between the distance value and a preset size value; and further classifying the substrates that meet the first preset accuracy based on a second preset accuracy. Among the four pads, the distance between the center points of two adjacent pads has four distance values, namely a first distance value, a second distance value, a third distance value, and a fourth distance value, while the preset size values ​​correspond to a first preset size value, a second preset size value, a third preset size value, and a fourth preset size value. This embodiment can classify different distance values ​​to obtain different categories of classification results. By setting the first preset accuracy, substrates are initially screened to identify those with poor dimensions. Classifying the substrates using the second preset accuracy, and then obtaining the mesh size of the stencil using a preset algorithm, offers good convenience.

[0028] 6. The method of obtaining the stencil mesh size by substituting the classification result into a preset algorithm in this embodiment of the invention includes the following steps: obtaining the number of preset pads on the substrate, and substituting the classification result of the distance value and the number of pads into a VB macro to obtain the stencil mesh size. The pads on the substrate are arranged in an array, so the number of pads can be calculated by the number of rows and columns of pads on the substrate. By measuring the distance values ​​of the four pads near the outer corner of the substrate, and classifying the distance values, the size of the stencil can be designed based on the expansion and contraction of the substrate, thus solving the problem of poor soldering accuracy caused by the expansion and contraction of the substrate size.

[0029] 7. The present invention also provides an apparatus for a tin-bonding method, which has the same beneficial effects as the tin-bonding method described above, and will not be described in detail here.

[0030] 8. The present invention also provides an electronic component that has the same beneficial effects as the above-described tin-bonding method, which will not be described in detail here. [Attached Image Description]

[0031] Figure 1 This is a schematic flowchart of a solder bonding method provided in an embodiment of the present invention.

[0032] Figure 2 This is a schematic diagram of a solder brushing and die bonding device provided in an embodiment of the present invention.

[0033] Figure 3 This is a schematic diagram of the expansion and contraction of an electronic component substrate provided in an embodiment of the present invention.

[0034] Figure 4 This is a schematic diagram of a partial structure of an electronic component provided in an embodiment of the present invention. Figure 1 .

[0035] Figure 5This is a schematic diagram of a partial structure of an electronic component provided in an embodiment of the present invention. Figure 2 .

[0036] Figure 6 This is a schematic diagram of an electronic component structure provided in an embodiment of the present invention.

[0037] Explanation of reference numerals in the attached diagram:

[0038] 1. Device; 2. Electronic component;

[0039] 11. Computing equipment; 12. Identification equipment; 13. Measuring equipment; 14. Hole-opening equipment; 15. Die-bonding equipment; 16. Tin-brushing equipment; 21. Substrate; 22. Solder paste layer; 23. Stencil; 24. Wafer; 25. Bonding pad.

Detailed Implementation Methods

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0041] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0042] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0043] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0044] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0045] Please see Figure 1 The present invention provides a method for solder bonding on a substrate, comprising the following steps:

[0046] S1, identify at least four pads on the substrate near the outer edge of the substrate;

[0047] S2, obtain multiple distance values ​​between two adjacent pads along the outer edge of the substrate;

[0048] S3, classify the distance value according to whether the difference between the distance value and the preset size meets the preset accuracy range, and substitute the classification result into the preset algorithm to obtain the mesh size of the steel mesh;

[0049] S4 involves covering the substrate with a stencil that conforms to the stencil size, then tinning the stencil before die bonding.

[0050] That's understandable, please consider. Figure 1 , Figure 2 and Figure 3The spacing between adjacent pads in existing stencils is getting smaller and smaller, resulting in smaller gaps between stencil openings. During solder paste printing, the precision of the stencil affects whether the solder paste can fully fill the pads. However, existing substrates are usually rectangular and exhibit expansion and contraction phenomena, meaning that the shape of the substrate is not completely symmetrical from top to bottom, making it difficult to standardize the substrate size. Measuring the distance between adjacent pads on each substrate and then designing a stencil suitable for different substrates is time-consuming and labor-intensive. In this embodiment, the substrate 21 is first identified by a preset identification device 12, and at least four pads 25 near the outer edge of the substrate 21 are identified by the identification device 12. The distance between adjacent pads 25 on the outer edge of the substrate 21 is measured by a preset measuring device. The distance values ​​are directly classified according to whether the difference between the distance value and the preset size meets the preset accuracy range. Then, by substituting into the preset algorithm, the mesh size of the stencil can be directly obtained, which saves users a lot of time when designing the stencil and improves work efficiency. At the same time, the stencil with the obtained stencil size is used to cover the substrate 21 and tin is applied to the stencil, so that the solder paste fills the pads 25 without bridging, which avoids the phenomenon of solder paste overflowing and connecting on adjacent pads 25 in the substrate 21 and improves the accuracy of tin application.

[0051] Optionally, in this embodiment, the shape of the substrate 21 can be rectangular, quadrangular, or circular. The shape of the substrate 21 can also be irregular. It should be noted that the shape mentioned above refers to the shape of the outer contour of the substrate 21. In step S1, at least four pads 25 are pads 25 that are close to the outer edge of the substrate 21, that is, close to the outer contour of the substrate 21.

[0052] Furthermore, the distance between two adjacent pads 25 on the outer edge of the substrate 21 can be directly identified by the preset identification device 12. For example, if the substrate 12 is roughly rectangular and there are four pads 25 to be identified, the distance between two pads 25 can be measured by the measuring device 13, and then the four smallest distance values ​​can be selected as the distance between two adjacent pads 25 on the outer edge of the substrate 21.

[0053] Preferably, in step S1 above, identifying at least four pads near the outer edge of the substrate includes the following steps: identifying the positions of the center points of at least four pads near the outer edge of the substrate using a preset identification device; and connecting the center points using a preset measuring device. It should be understood that in this embodiment, the substrate 21 is first identified using the preset identification device 12, and then the pads 25 near the outer edge of the substrate 21 are identified. Preferably, the substrate 21 is rectangular, and the pads 25 identified by the identification device 12 are the pads 25 near the four outer corners of the substrate 21. After identifying the pads 25, the position of the center point of the pad 25 is determined and the position information of the center point of the pad 25 is obtained, which is simple and convenient.

[0054] In step S2 above, obtaining multiple distance values ​​between two adjacent pads along the outer edge of the substrate includes the following steps: measuring the distance between the center points of two adjacent pads on the interconnect line and obtaining at least four distance values. It should be understood that... (See also...) Figure 3 When the preset identification device 12 obtains the position information of the center point of the pad 25, the preset measuring device 13 can directly measure the distance between the center points of the pad 25. Specifically, the measuring device 13 is electrically connected to the identification device 12. The measuring device 13 can receive the center point information of the pad 25 transmitted by the identification device 12, and then directly measure the straight-line distance between the connected center points to obtain four distance values.

[0055] Please continue to combine Figure 1 , Figure 2 and Figure 3 It should be noted that when the substrates 21 are not connected sequentially along their outer edges, two substrates 21 may be closer together on the connection line even though they are not adjacent. Therefore, the pads 25 are connected sequentially along the outer edge of the substrates 21, and then the distance between two connected pads 25 on the connection line is measured. This avoids the preset measuring device from incorrectly identifying two non-adjacent pads 25 on the connection line when measuring the distance between the pads 25. For example, when the substrate 21 is rectangular, this embodiment can identify the four pads 25 near the four outer corners of the rectangular substrate 21 and connect the pads 25 sequentially along the outer edge of the substrate 21. For details, please refer to [link to documentation]. Figure 3 The preset recognition device 12 first identifies the shape of the substrate, and then identifies the positions of four pads A, B, C, and D near the outer edge of the substrate. For example, when the preset measurement device 13 performs a connection measurement on the four pads, starting from pad A, the direction of the connection passes through pads B, C, and D in sequence, and then returns to pad A again, completing the entire connection process. Alternatively, starting from pad A, the direction of the connection passes through pads D, C, and B in sequence, and then returns to pad A to complete the entire connection process. It should be understood that by measuring only the distance between the four pads 25 near the outer corner of the substrate 21, the size of the stencil 23 can be obtained by classifying the distance values ​​according to a preset accuracy range and combining them with a preset algorithm. This avoids measuring the distance of each pad 25, saving time and effort, improving the problem of poor soldering accuracy when the substrate 21 size is not uniform, and increasing the efficiency of soldering the substrate 21.

[0056] Optionally, the center point of pad 25 can be the intersection of the diagonals of pad 25, the center of the inscribed circle of pad 25, the center of the circumscribed circle of pad 25, or the centroid of pad 25. Preferably, in this embodiment, the intersection of the diagonals of pad 25 is used as the center point of pad 25. The identification device identifies the intersection of the diagonals of pad 25, uses this position as the center point of pad 25, and then connects the pads 25.

[0057] In step S2 above, the preset accuracy includes a first preset accuracy and a second preset accuracy; the range of the first preset accuracy is -0.7 to 0.7 mm, and the range of the second preset accuracy is -0.05 to 0.05 mm.

[0058] Optionally, the range of the first preset accuracy can also be -0.1 to 0.1 mm, -0.2 to 0.2 mm, -0.3 to 0.3 mm, -0.4 to 0.4 mm, -0.5 to 0.5 mm, or -0.6 to 0.6 mm. The first preset accuracy is used to screen out substrates 21 that meet the accuracy requirements and to remove substrates 21 that do not meet the size requirements. Understandably, the larger the size of the substrate 21, the larger the required accuracy range can be. For example, when the substrate 21 is roughly rectangular and 100 mm in length, the first preset accuracy can be a smaller accuracy range, such as ±0.2 mm. When the substrate 21 is 600 mm in length, the first preset accuracy can also be a larger range, such as ±0.7 mm. That is, the first preset accuracy can be adjusted according to the size of the substrate 21 to be applicable to substrates 21 of different sizes, thus having a wide range of applications. In addition, the range of the second preset accuracy can also be -0.01 to 0.01 mm, -0.02 to 0.02 mm, -0.03 to 0.03 mm or -0.04 to 0.04 mm. The second preset accuracy is used to classify the distance values. The size of the steel mesh 23 can be obtained by combining the classification results with the preset algorithm, which is simple and convenient.

[0059] In step S3 above, classifying the distance values ​​according to the preset accuracy range includes the following steps: selecting substrates that meet the first preset accuracy based on the difference between the distance value and the preset size value; and further classifying the substrates that meet the first preset accuracy based on the second preset accuracy.

[0060] Understandably, please combine Figure 2 and Figure 3The preset size values ​​of the pads are designed according to the user's actual needs. Typically, the side length of the substrate's outer contour is 100-700 mm, meaning the preset size range is 100-700 mm. When the user needs to manufacture a small substrate, 100-200 mm can be selected as the preset size value; when the user needs to manufacture a large substrate, 600-700 mm can be selected as the preset size value. Specifically, when the substrate is rectangular, the preset recognition device 12 identifies four pads 25 near the outer corner of the substrate. There are four distance values ​​between the center points of two adjacent pads 25: a first distance value, a second distance value, a third distance value, and a fourth distance value. The preset size values ​​correspond to these four values. Specifically, the first distance value corresponds to the preset first size value, the second distance value corresponds to the preset second size value, the third distance value corresponds to the preset third size value, and the fourth distance value corresponds to the preset fourth size value. For example, the specific process for users to classify distance values ​​is as follows: If the difference between the four distance values ​​and the four preset size values ​​meets the first preset accuracy, then the substrate 21 meets the first preset accuracy condition and can proceed to the next classification step. During classification, the differences between the four distance values ​​and the four preset size values ​​are first compared and obtained, and then the differences are classified according to the second preset accuracy. Specifically, if the preset first size value is 340.85 mm, and the first distance values ​​obtained by measuring the three substrates 21 are 340.90 mm, 340.95 mm, and 341.00 mm, respectively, and the differences between the preset first size value and the first distance value of the three substrates 21 are 0.05 mm, 0.10 mm, and 0.15 mm, respectively, preferably, the range of the second preset accuracy is -0.05 to 0.05 mm, then the difference between the first distance value of the three substrates 21 and the preset first size value is one second preset accuracy, two second preset accuracys, and three preset accuracys, respectively, and the first distance values ​​of the three substrates 21 will be classified into three different categories. Similarly, based on the preset second, third, and fourth size values ​​and after filtering with the first preset precision, the second distance value, the fourth distance value, and the fourth distance value can be classified according to the second preset precision. That is, this embodiment can classify different distance values ​​to obtain different categories of classification results. By setting the first preset precision, the substrate 21 is initially screened to identify substrates 21 with defective dimensions. Then, by classifying the substrates 21 with the second preset precision and using a preset algorithm, the dimensions of the stencil 23 can be obtained, which is convenient.

[0061] Furthermore, please combine Figure 2 and Figure 3In step S3 above, substituting the classification result into the preset algorithm to obtain the mesh size of the stencil includes the following steps: obtaining the number of preset pads on the substrate, and substituting the classification result of the distance value and the number of pads into the VB macro to obtain the mesh size of the stencil. It should be understood that the pads 25 on the substrate 21 are arranged in an array, so the number of pads 25 can be calculated by the number of rows and columns of pads 25 on the substrate 21, or the number of pads can be obtained directly through the preset recognition device 12. By measuring the distance value of at least four pads 25 close to the outer edge of the substrate 21, and then classifying the distance value, that is, by combining the classification result with the number of pads 25 and substituting it into the preset algorithm, the size of the stencil 23 can be designed, which solves the problem of poor soldering accuracy caused by the inconsistent size due to the expansion and contraction of the substrate 21.

[0062] In step S3 above, the preset algorithm is a VB macro. Specifically, the expansion and contraction of the substrate 21 changes regularly. The size and shape of the pads 25 are usually designed by the user according to actual needs. The pads 25 are arranged in an array, and the connection point formed after tinning of two pads 25 is used to connect the chip. The expansion and contraction of the substrate 21 affects adjacent pads 25 in the same way. Therefore, it is only necessary to determine the expansion and contraction of at least four pads 25 near the outer edge of the substrate 21, and then input the number of pads 25 into the preset algorithm to predict the overall expansion and contraction of the substrate 21. In this embodiment, based on the distribution and number of the outer edges of the pads 25, a pad 25 position calculation model / formula is designed in an Excel spreadsheet. This embodiment obtains the number and classification results of the pads 25, inputs them into the position calculation model / formula designed in the Excel spreadsheet, and then inputs the Excel spreadsheet data into a VB macro with preset code. The VB macro performs calculations on the data and converts the position data into a single row of data output to obtain the mesh size data of the stencil 23.

[0063] Furthermore, after obtaining the mesh size data of the steel mesh, the steel mesh can be manufactured accordingly. The manufacturing process includes the following steps: providing steel sheets, and using a pre-set perforation device to create perforations in the steel sheets to obtain the steel mesh. Please refer to... Figure 2 , Figure 4 and Figure 5 It should be understood that the perforation device 14 is electrically connected to the measuring device 13. The measuring device 13 transmits the mesh size data of the steel mesh 23 to the perforation device 14. After receiving the data, the perforation device 14 positions and perforates the steel sheet to obtain the steel mesh.

[0064] In step S4 above, tinning the stencil includes the following steps: forming a solder paste layer on the side of the stencil away from the substrate using a coating method; removing the stencil to allow the solder paste layer to fill the pads 25, forming connection points for die bonding. Please refer to [link to relevant documentation]. Figures 4 to 6The connection point is used to connect with the chip 24 to form electronic component 2. The user uses a preset die bonding device 15, which can be referred to in conjunction with the die bonding device 15. Figure 2 When positioning and mounting the chip onto the connection point formed by adjacent solder paste layers 22, if a stencil 23 is not used during the soldering process, solder bridging between the pads 25 after reflow soldering can easily occur, causing a short circuit in the chip 24 and resulting in display defects. Furthermore, if a stencil 23 is not used during soldering, in addition to the aforementioned short circuit phenomenon caused by solder bridging after the solder paste flows back to the middle of adjacent pads 25, if the solder paste flows in other directions, it may connect to the solder mask at the pad position. After die bonding or component placement, the reflow solder paste may flow to the pad 25, and the chip 24 or external electronic components may not follow the solder paste back to the pad 25. This means the electrodes of the chip 24 or external electronic components may easily touch the solder mask, potentially resulting in a poor connection between the solder paste and the chip 24 or external electronic components, leading to a high risk of cold solder joints. This embodiment uses a stencil 23 to design the substrate 21, which undergoes expansion and contraction. After the solder pads 25 are tinned, the solder paste can fully fill the solder pads 25 without overflowing and causing short circuits between the solder pads 25. The stencil 23 improves the service life of electronic devices.

[0065] Furthermore, the coating method includes any one of spin coating, spray coating, and blade coating. There are various coating methods; spin coating or blade coating is suitable for mass production applications, improving production efficiency; spray coating allows for point-to-point spraying of solder paste, improving coating precision.

[0066] To more clearly demonstrate the classification process in step S3 to obtain the size of the steel mesh 23, the embodiments of the present invention provide the following specific steps:

[0067] The first preset accuracy range is -0.1 to 0.1, the second preset accuracy range is -0.05 to 0.05, the preset first size value is 340.85 mm, the preset second size value is 340.85 mm, the preset third size value is 208.90 mm, and the preset fourth size value is 208.95 mm. Based on the preset size ranges and according to the first and second preset accuracy ranges, the following classification groups can be obtained:

[0068] Table 1. Classification Results

[0069] Classification Groups First distance value Second distance value Third distance value Fourth distance value 1 340.85～340.90 340.85～340.90 208.90～208.95 208.90～208.95 2 340.85～340.90 340.90～340.95 208.90～208.95 208.90～208.95 3 340.85～340.90 340.85～340.90 208.95～209.00 208.90～208.95 4 340.85～340.90 340.85～340.90 208.90～208.95 208.95～209.00 5 340.85～340.90 340.90～340.95 208.95～209.00 208.90～208.95 6 340.85～340.90 340.90～340.95 208.90～208.95 208.95～209.00 7 340.85～340.90 340.85～340.90 208.95～209.00 208.95～209.00 8 340.85～340.90 340.90～340.95 208.95～209.00 208.95～209.00 9 340.90～340.95 340.90～340.95 208.95～209.00 208.95～209.00 10 340.90～340.95 340.85～340.90 208.95～209.00 208.95～209.00 11 340.90～340.95 340.90～340.95 208.90～208.95 208.95～209.00 12 340.90～340.95 340.90～340.95 208.95～209.00 208.90～208.95 13 340.90～340.95 340.85～340.90 208.90～208.95 208.95～209.00 14 340.90～340.95 340.85～340.90 208.95～209.00 208.90～208.95 15 340.90～340.95 340.90～340.95 208.90～208.95 208.90～208.95 16 340.90～340.95 340.85～340.90 208.90～208.95 208.90～208.95

[0070] A substrate 21 is provided. For example, after identification by the identification device 12, the first distance value of the first substrate 21 is 340.86, the second distance value is 340.87, the third distance value is 208.92, and the fourth distance value is 208.94. According to Table 1, the first substrate 21 will be classified into group 1. The number of pads 25 on the substrate 21 is identified as 5000. By substituting group 1 and the number of pads 25 into the preset algorithm, the size data of the stencil 23 can be obtained. This saves time and effort and also improves the problem of poor soldering accuracy when the substrate 21 is not uniform in size. Then, the stencil 23 is made using the size data of the stencil 23, and the stencil 23 is covered on the substrate 21. After soldering the stencil 23, it is die bonded.

[0071] Please combine Figure 2 and Figure 3 The present invention also provides an apparatus 1 for use in the above-described tin-bonding method, the apparatus 1 comprising:

[0072] Calculation device 11: used to classify distance values ​​according to whether the difference between the distance value and the preset size meets the preset accuracy range, and to substitute the classification result into the preset algorithm to obtain the mesh size of the steel mesh 23;

[0073] Identification device 12: Identifies the position of the center point of at least four pads 25 near the outer edge of the substrate 21;

[0074] Measuring device 13: used to determine the distance between two adjacent pads 25 along the outer edge of the substrate in at least four pads 25;

[0075] Drilling device 14: Used to drill holes in the steel mesh 23 according to the obtained steel mesh 23 dimensions to produce the steel mesh 23;

[0076] Die bonding equipment 15: used to fix the wafer to an adjacent bonding point.

[0077] Tin-brushing equipment 16: for covering the substrate 21 with a stencil 23 of mesh size calculated by the computing device 11 and then performing tin-brushing and die bonding on the stencil 23;

[0078] Furthermore, the computing device 11 classifies the distance values ​​based on a preset accuracy range and substitutes the classification results into a VB macro to obtain the size of the stencil 23. That is, based on the distribution and number of the outer edges of the pads 25, a pad 25 position calculation model / formula is designed in an Excel spreadsheet. In this embodiment, by obtaining the number of pads 25 and the classification results, and substituting them into the position calculation model / formula designed in the Excel spreadsheet, the data in the Excel spreadsheet is then substituted into a VB macro with preset code. The VB macro performs calculations on the data and converts the position data into a single row of data for output, thereby obtaining the mesh size data of the stencil 23.

[0079] Please see Figures 4 to 6The present invention also provides an electronic component 2, which is prepared by the above-described solder bonding method and includes a substrate 21, a solder paste layer 22, and a chip 24 fixed on the substrate 21. The chip 24 emits light when powered. It should be understood that when the electronic component 2 is connected to an external power source, the circuit is transmitted through the substrate to the solder paste layer 22. The solder paste layer 22 is connected to the positive and negative terminals of the chip 24 respectively. When the positive and negative terminals of the chip 24 conduct electricity, the internal quantum well is excited, causing the chip 24 to emit light, which can provide illumination for the user.

[0080] Compared with the prior art, the tin-bonding method, apparatus and electronic component provided by the present invention have the following beneficial effects:

[0081] 1. An embodiment of the present invention provides a method for soldering and die bonding on a substrate, comprising the following steps: identifying at least four pads near the outer edge of the substrate; obtaining multiple distance values ​​between adjacent pads along the outer edge of the substrate; classifying the distance values ​​according to whether the difference between the distance values ​​and a preset size meets a preset accuracy range, and substituting the classification results into a preset algorithm to obtain the mesh size of a stencil; covering the substrate with a stencil conforming to the stencil size and soldering the stencil before die bonding. It should be understood that by measuring only the distances between at least four pads near the outer edge of the substrate, preferably, when the substrate is rectangular, only the distances between four pads near the outer corners of the substrate, the mesh size of the stencil can be obtained by classifying the distance values ​​according to a preset accuracy range and combining them with a preset algorithm. This avoids measuring the distance of each pad, saving time and effort while also improving the problem of poor soldering accuracy when substrate dimensions are inconsistent, and increasing the efficiency of soldering the substrate.

[0082] 2. The identification of at least four pads near the outer edge of the substrate in this embodiment of the invention includes the following steps: identifying the positions of the center points of at least four pads near the outer edge of the substrate using a preset identification device; and connecting the center points using a preset measuring device. It should be understood that the substrate is first identified using the preset identification device, and then the pads near the outer edge of the substrate are identified. Preferably, the substrate is rectangular, and the pads identified by the identification device are the pads near the four outer corners of the substrate. After identifying the pads, the position of the center point of the pad is determined and the position information of the pad center point is obtained, which is simple and convenient.

[0083] 3. The embodiment of the present invention for obtaining multiple distance values ​​between two adjacent pads along the outer edge of the substrate includes the following steps: measuring the distance between the center points of two adjacent pads on the connection line and obtaining at least four distance values. The distance between the center points of the pads can be directly measured using a preset measuring device. Specifically, the measuring device is electrically connected to an identification device, receives the center point information of the pads transmitted from the identification device, and then directly measures the straight-line distance between the connected center points to obtain four distance values.

[0084] 4. The preset accuracy in this embodiment of the invention includes a first preset accuracy and a second preset accuracy; the range of the first preset accuracy is -0.7 to 0.7 mm, and the range of the second preset accuracy is -0.05 to 0.05 mm. The larger the size of the substrate, the larger the required accuracy range can be. For example, when the substrate is approximately rectangular and 100 mm long, the first preset accuracy can be a smaller range, such as ±0.2 mm. When the substrate length is 600 mm, the first preset accuracy can also be a larger range, such as ±0.7 mm. That is, the first preset accuracy can be adjusted according to the size of the substrate to be suitable for substrates of different sizes, thus having a wide range of applications.

[0085] 5. The classification of distance values ​​according to a preset accuracy range in this embodiment of the invention includes the following steps: screening substrates that meet a first preset accuracy based on the difference between the distance value and a preset size value; and further classifying the substrates that meet the first preset accuracy based on a second preset accuracy. Among the four pads, the distance between the center points of two adjacent pads has four distance values, namely a first distance value, a second distance value, a third distance value, and a fourth distance value, while the preset size values ​​correspond to a first preset size value, a second preset size value, a third preset size value, and a fourth preset size value. This embodiment can classify different distance values ​​to obtain different categories of classification results. By setting the first preset accuracy, substrates are initially screened to identify those with poor dimensions. Classifying the substrates using the second preset accuracy, and then obtaining the mesh size of the stencil using a preset algorithm, offers good convenience.

[0086] 6. The method of obtaining the stencil mesh size by substituting the classification result into a preset algorithm in this embodiment of the invention includes the following steps: obtaining the number of preset pads on the substrate, and substituting the classification result of the distance value and the number of pads into a VB macro to obtain the stencil mesh size. The pads on the substrate are arranged in an array, so the number of pads can be calculated by the number of rows and columns of pads on the substrate. By measuring the distance values ​​of the four pads near the outer corner of the substrate, and classifying the distance values, the size of the stencil can be designed based on the expansion and contraction of the substrate, thus solving the problem of poor soldering accuracy caused by the expansion and contraction of the substrate size.

[0087] 7. The present invention also provides an apparatus for a tin-bonding method, which has the same beneficial effects as the tin-bonding method described above, and will not be described in detail here.

[0088] 8. The present invention also provides an electronic component that has the same beneficial effects as the above-described tin-bonding method, which will not be described in detail here.

[0089] The foregoing has provided a detailed description of a solder brushing die bonding method, apparatus, and electronic component disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for solder bonding on a substrate, characterized in that: Includes the following steps: Identify at least four pads on the substrate near the outer edge of the substrate; Obtain multiple distance values ​​between two adjacent pads along the outer edge of the substrate; The distance values ​​are classified according to whether the difference between the distance value and the preset size meets the preset accuracy range, and the classification results are substituted into the preset algorithm to obtain the mesh size of the steel mesh. The preset accuracy includes a first preset accuracy and a second preset accuracy; The classification of the distance value based on whether the difference between the distance value and the preset size meets the preset accuracy range includes: filtering out substrates that meet the first preset accuracy based on the difference between the distance value and the preset size; and further classifying the substrates that meet the first preset accuracy based on the second preset accuracy. The process of substituting the classification result into the preset algorithm to obtain the mesh size of the steel mesh includes: obtaining the number of preset pads on the substrate, and substituting the distance value classification result and the number of pads into a VB macro to obtain the mesh size of the steel mesh. A stencil of the appropriate size is applied to the substrate and then tinned before die bonding.

2. The tin-bonding method as described in claim 1, characterized in that: The identification of at least four pads near the outer edge of the substrate includes the following steps: identifying the position of the center point of at least four pads on the outer edge of the substrate using a preset identification device; and connecting the center points using a preset measuring device.

3. The solder bonding method as described in claim 2, characterized in that: The process of obtaining multiple distance values ​​between two adjacent pads along the outer edge of the substrate includes the following steps: measuring the distance between the center points of two adjacent pads on the connection line and obtaining at least four distance values.

4. The solder bonding method as described in claim 1, characterized in that: The first preset accuracy ranges from -0.7 to 0.7 mm, and the second preset accuracy ranges from -0.05 to 0.05 mm.

5. The solder bonding method as described in claim 1, characterized in that: The process of tinning the stencil includes the following steps: forming a solder paste layer on the side of the stencil away from the substrate using a coating method; removing the stencil to allow the solder paste layer to fill the pads and form connection points for die bonding.

6. An apparatus for use in any one of the tin-bonding methods as described in claims 1-5, characterized in that: The device includes: Identification device: Identifies the positions of at least four pads near the outer edge of the substrate; Measuring equipment: used to determine the distance between two adjacent pads along the outer edge of the substrate in at least four pads; Computing device: used to classify distance values ​​according to whether the difference between the distance value and the preset size meets a preset accuracy range, and to substitute the classification result into a preset algorithm to obtain the mesh size of the stencil; the preset accuracy includes a first preset accuracy and a second preset accuracy; wherein, classifying the distance values ​​according to whether the difference between the distance value and the preset size meets the preset accuracy range includes: filtering out substrates that meet the first preset accuracy based on the difference between the distance value and the preset size value; further classifying the substrates that meet the first preset accuracy based on the second preset accuracy; wherein, substituting the classification result into the preset algorithm to obtain the mesh size of the stencil includes: obtaining the number of preset pads on the substrate, and substituting the distance value classification result and the number of pads into a VB macro to obtain the mesh size of the stencil; Tin-coating equipment: used to cover a substrate with a stencil with a mesh size calculated by a computer and then apply tin to the stencil before die bonding.

7. The apparatus for the tin-bonding method as described in claim 6, characterized in that: The preset algorithm is a VB macro.

8. An electronic component, manufactured by any one of the tin-bonding methods as described in claims 1-5.

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