Heat pipe, electronic device protective case with heat pipe, and electronic device

Abstract

The present application discloses a vapor chamber, an electronic device protective cover having the vapor chamber, and an electronic device. The vapor chamber includes: a heat absorption portion, a heat dissipation portion, and a flexible portion. The heat absorption portion, the heat dissipation portion, and the flexible portion each have a first liquid channel, a second liquid channel, and a gas channel. The gas channel is disposed between the first liquid channel and the second liquid channel. The first liquid channels of the heat absorption portion, the flexible portion, and the heat dissipation portion are sequentially communicated. The second liquid channels of the heat absorption portion, the flexible portion, and the heat dissipation portion are sequentially communicated. The gas channels of the heat absorption portion, the flexible portion, and the heat dissipation portion are sequentially communicated. Heat exchange structures are respectively provided in the first liquid channel and the second liquid channel. The flexible portion is provided with a hollow structure, and the hollow structure divides the gas channel into a first branch and a second branch in the flexible portion. According to the vapor chamber of the present application, the electronic device can be effectively cooled, and the service life of the vapor chamber is extended.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and particularly to a heat pipe, an electronic device protective case having the heat pipe, and an electronic device. Background Art

[0002] In the context of the high integration and miniaturization of electronic components, the internal heat dissipation technology of electronic devices is constantly approaching the heat dissipation limit, and various external heat dissipation devices have emerged one after another, such as heat dissipation back clips and other devices. Due to limitations such as a relatively thick thickness and a large volume, the heat dissipation back clip is not convenient to carry and is only convenient to use in specific scenarios.

[0003] Currently, there are also solutions to set heat dissipation structures on electronic device accessories to improve the heat dissipation effect of electronic devices. However, the existing heat dissipation structures have a low thermal conductivity. For flexible heat pipes, during the bending process, the bending area is compressed due to deformation, the vacuum cavity is thinned under pressure, and the phase change cycle is blocked, resulting in a significant reduction in heat transfer performance. In addition, most heat dissipation sheets are bent using the flexibility of the material itself, or the surface of the material is roughened. The bending of the material will cause severe tensile deformation and cannot be bent multiple times, resulting in a short service life. Summary of the Invention

[0004] The present application aims to provide a heat pipe, an electronic device protective case having the same, and an electronic device, and at least solve the problems of low heat dissipation efficiency and short service life of existing electronic device heat dissipation accessories.

[0005] To solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a heat pipe, including: a heat absorption part, a heat dissipation part, and a flexible part. The heat absorption part, the heat dissipation part, and the flexible part all have a first liquid channel, a second liquid channel, and a gas channel. The gas channel is disposed between the first liquid channel and the second liquid channel. The first liquid channels of the heat absorption part, the flexible part, and the heat dissipation part are sequentially connected. The second liquid channels of the heat absorption part, the flexible part, and the heat dissipation part are sequentially connected. The gas channels of the heat absorption part, the flexible part, and the heat dissipation part are sequentially connected. Heat exchange structures are respectively disposed in the first liquid channel and the second liquid channel. The flexible part is provided with a hollow structure, and the hollow structure divides the gas channel in the flexible part into a first branch and a second branch. The first branch is located on the first side of the flexible part and is adjacent to the first liquid channel, and the second branch is located on the second side of the flexible part and is adjacent to the second liquid channel; when the flexible part is bent, at least one of the first liquid channel and the second liquid channel is in a connected state, and the gas channel on at least one side of the flexible part is in a connected state.

[0007] In a second aspect, an embodiment of the present application provides an electronic device protective case, including: a protective case body, within which a receiving space matching the shape of the electronic device is defined; a cover plate, which is movably connected to the protective case body; and a heat pipe according to any one of the first aspects of the embodiments of the present application, with an endothermic portion disposed within the protective case body and a heat dissipation portion disposed on the cover plate.

[0008] In a third aspect, an embodiment of the present application provides an electronic device, including: an electronic device body, with a protective case as proposed in the second aspect of the present application provided outside.

[0009] According to the heat pipe of the present application, by providing a flexible portion between the endothermic portion and the heat dissipation portion of the heat pipe, the endothermic portion and the heat dissipation portion can be folded and opened integrally relative to the flexible portion, enabling multiple bendings and ensuring the overall service life of the heat pipe; and a gas channel is defined by the cooperation of the first liquid channel and the second liquid channel, which can respectively perform heat exchange with the first liquid channel and the second liquid channel. When the flexible portion is bent, at least one of the first liquid channel and the second liquid channel can still remain connected, and the gas channel on one side of the flexible portion can also remain connected, thereby achieving effective heat dissipation for the electronic device.

[0010] Additional aspects and advantages of the present application will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present application, and together with the description are used to explain the principles of the present application.

[0012] Figure 1 is a schematic diagram of a heat pipe in an unfolded state according to an embodiment of the present application;

[0013] Figure 2 is Figure 1 a partial enlarged view of area A in

[0014] Figure 3 is a schematic diagram of a heat pipe in a folded state according to an embodiment of the present application;

[0015] Figure 4 is a schematic diagram of a heat pipe in an unfolded state according to another embodiment of the present application;

[0016] Figure 5 is a schematic diagram of a heat pipe in a folded state according to another embodiment of the present application;

[0017] Figure 6 is a schematic diagram of a heat pipe in an unfolded state according to still another embodiment of the present application;

[0018] Figure 7 is Figure 6 A partial enlarged view of region B therein;

[0019] Figure 8 It is a schematic structural diagram of an electronic device protective case according to an embodiment of the present application.

[0020] Reference numerals

[0021] Heat pipe 100;

[0022] Heat absorption part 101; heat dissipation part 102;

[0023] Flexible part 103; first flexible part 1031; second flexible part 1032;

[0024] First liquid channel 104; heat exchange medium 1041;

[0025] Second liquid channel 105;

[0026] Gas channel 106; steam 1061; first branch 1062; second branch 1063;

[0027] Hollow structure 107; heat exchange structure 108; fold 109; folding fan-like micro-structure 110;

[0028] Electronic device protective case 200; protective case body 201; cover plate 202. Detailed implementation manners

[0029] Hereinafter, embodiments of the present invention will be described in detail. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0030] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0031] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present invention.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] First, the Figures 1 to 8 vapor chamber 100 according to an embodiment of the present application will be described.

[0034] The vapor chamber 100 according to an embodiment of the present application includes: a heat absorption part 101, a heat dissipation part 102, and a flexible part 103.

[0035] Specifically, the heat absorption part 101, the heat dissipation part 102, and the flexible part 103 each have a first liquid channel 104, a second liquid channel 105, and a gas channel 106. The gas channel 106 is disposed between the first liquid channel 104 and the second liquid channel 105. The first liquid channels 104 of the heat absorption part 101, the flexible part 103, and the heat dissipation part 102 are sequentially connected, the second liquid channels 105 of the heat absorption part 101, the flexible part 103, and the heat dissipation part 102 are sequentially connected, the gas channels 106 of the heat absorption part 101, the flexible part 103, and the heat dissipation part 102 are sequentially connected, and heat exchange structures 108 are respectively disposed in the first liquid channel 104 and the second liquid channel 105.

[0036] In other words, as Figures 1 to 2As shown, the vapor chamber 100 mainly consists of a heat absorption part 101, a heat dissipation part 102, and a flexible part 103. The flexible part 103 is disposed between the heat absorption part 101 and the heat dissipation part 102. The heat absorption part 101, the heat dissipation part 102, and the flexible part 103 all have a first liquid channel 104, a second liquid channel 105, and a gas channel 106. The gas channel 106 is disposed between the first liquid channel 104 and the second liquid channel 105. The first liquid channel 104 sequentially penetrates through the heat absorption part 101, the flexible part 103, and the heat dissipation part 102. The second liquid channel 105 also sequentially penetrates through the heat absorption part 101, the flexible part 103, and the heat dissipation part 102. Heat exchange structures 108 are provided in both the first liquid channel 104 and the second liquid channel 105. The heat exchange structures 108 can be used to transfer heat.

[0037] The heat absorption part 101 and the heat dissipation part 102 can be in a flat state, that is, in the state as Figure 1 shown, or the heat absorption part 101 and the heat dissipation part 102 can be stacked together, that is, in the state as Figure 3 shown. During the process of the heat absorption part 101 and the heat dissipation part 102 being laid flat or stacked, the flexible part 103 can be correspondingly unfolded or folded. That is to say, the setting of the flexible part 103 enables the heat absorption part 101 and the heat dissipation part 102 to be freely folded and unfolded, and bent multiple times, thus ensuring the overall service life of the vapor chamber 100.

[0038] Both ends of the first liquid channel 104 and the second liquid channel 105 are sealed, and a closed gas channel 106 is formed therebetween. Heat exchange structures 108 are provided in at least one of the first liquid channel 104 and the second liquid channel 105. The heat exchange structures 108 can cover at least one of the first liquid channel 104 and the second liquid channel 105, so that the first liquid channel 104 provided in the heat dissipation part 102, the flexible part 103, and the heat absorption part 101 can complete heat transfer. Similarly, the second liquid channel 105 provided in the heat dissipation part 102, the flexible part 103, and the heat absorption part 101 can also complete heat transfer. In addition, the first liquid channel 104 and the second liquid channel 105 are respectively communicated with the gas channel 106 therebetween, so that heat exchange between the first liquid channel 104 and the gas channel 106 or between the second liquid channel 105 and the gas channel 106 can be respectively realized. A heat exchange medium 1041 can also be filled in the first liquid channel 104 or the second liquid channel 105, thereby further improving the heat exchange efficiency between the liquid channel and the gas channel 106.

[0039] It should be noted that in the embodiments of the present application, a heat exchange structure 108 can be provided inside any one of the first liquid channel 104 and the second liquid channel 105. When the heat exchange structure 108 is provided inside one of the first liquid channel 104 and the second liquid channel 105, the liquid channel provided with the heat exchange structure 108 can be close to the heat generating area of the electronic device, and the liquid channel without the heat exchange structure 108 is located on the side away from the electronic device; or heat dissipation channels can be provided in both the first liquid channel 104 and the second liquid channel 105, which can effectively improve the heat dissipation efficiency. Among them, when the liquid channel provided with the heat exchange structure 108 is close to the electronic device, it means that the heat absorption part 101 of the heat pipe 100 is close to the electronic device. The heat absorption part 101 absorbs the heat generated by the electronic device. After the heat exchange medium in the heat absorption part 101 exchanges heat with the gas channel 106 of the heat absorption part 101, it flows into the corresponding heat dissipation part 102 through the gas channel 106 for heat dissipation, and finally returns to the corresponding heat absorption part 101 from the heat dissipation part 102 to form a heat conduction cycle.

[0040] Specifically, the heat exchange medium 1041 in the first liquid channel 104 or the second liquid channel 105 can be a liquid. When the electronic device releases heat, the directly contacted heat absorption part 101 receives the heat released by the electronic device. The liquid in the first liquid channel 104 and the second liquid channel 105 in the heat absorption part 101 thermally evaporates. While evaporating, it absorbs heat. The liquid respectively discharges the steam 1061 to the gas channel 106 from the first liquid channel 104 and the second liquid channel 105. The steam 1061 flows from the hot end to the cold end in the gas channel 106. Since the liquid in the first liquid channel 104 or the second liquid channel 105 continuously evaporates and is transported to the gas channel 106, at this time, the liquid in the first liquid channel 104 or the second liquid channel 105 flows in the opposite direction of the steam 1061 flow, that is, from the heat dissipation part 102 to the heat absorption part 101. When the steam 1061 reaches one end of the gas channel 106 of the heat dissipation part 102 along the gas channel 106, the steam 1061 is cooled and condenses to release heat. After condensation, the steam 1061 changes from gaseous state to liquid state, and finally is transmitted to the first liquid channel 104 or the second liquid channel 105 in the form of liquid again, thereby completing a gas-liquid cycle.

[0041] It should be noted that during the gas-liquid cycle, the heat from the electronic device is absorbed by the heat absorption part 101 of the heat pipe 100 through the evaporation of the liquid into gas, and the heat is released by the heat dissipation part 102 through the condensation of the gas into liquid. The purpose of heat dissipation is achieved through continuous gas-liquid cycles, so that the heat absorbed by the absorption part of the heat pipe 100 is released through continuous gas-liquid cycles.

[0042] Among them, the flexible part 103 is provided with a hollow structure 107. The hollow structure 107 divides the gas channel 106 into a first branch 1062 and a second branch 1063 in the flexible part 103. The first branch 1062 is located on the first side of the flexible part 103 and is adjacent to the first liquid channel 104. The second branch 1063 is located on the second side of the flexible part 103 and is adjacent to the second liquid channel 105.

[0043] That is to say, the gas channel 106 is located between the first liquid channel 104 and the second liquid channel 105. The gas channel 106 sequentially penetrates through the heat absorption part 101, the flexible part 103, and the heat dissipation part 102. The flexible part 103 is located between the heat absorption part 101 and the heat dissipation part 102, and the flexible part 103 connects the heat absorption part 101 and the heat dissipation part 102. In the embodiment of the present application, the flexible part 103 can be a hollow structure 107. The hollow structure 107 divides the gas channel 106 located in the flexible part 103 into a first branch 1062 and a second branch 1063. Among them, the first branch 1062 is located on one side of the flexible part 103, and the first branch 1062 is adjacent to the first liquid channel 104, while the second branch 1063 is located on the other side of the flexible part 103, and the second branch 1063 is adjacent to the second liquid channel 105.

[0044] When the flexible part 103 is bent, at least one of the first liquid channel 104 and the second liquid channel 105 is in a communicating state, and the gas channel 106 located on at least one side of the flexible part 103 is in a communicating state.

[0045] In other words, as Figures 1 to 2 shown, when the heat pipe 100 is in a flat state, the first liquid channel 104 and the second liquid channel 105 are in the same horizontal plane. At this time, both the first liquid channel 104 and the second liquid channel 105 are in a communicating state, and both the first branch 1062 and the second branch 1063 of the gas channel 106 are in an unfolded state. That is to say, in the flat state, both the first liquid channel 104 and the second liquid channel 105 are in a communicating state, and both the first branch 1062 and the second branch 1063 located in the flexible part 103 are in a communicating state.

[0046] When the heat pipe 100 is in a forward bending state, the heat dissipation part 102 covers the heat absorption part 101. At this time, the first branch 1062 of the gas channel 106 located inside is in a compressed state, and the second branch 1063 located outside is in a stretched state; at this time, the first liquid channel 104 in the flexible part 103 is in a compressed state, and the second liquid channel 105 in the flexible part 103 is in a stretched state. That is to say, in the forward bending state, the second liquid channel 105 is in a communicating state, and the second branch 1063 located in the flexible part 103 is also in a communicating state.

[0047] When the heat pipe 100 is in the reverse bending state, the heat dissipation part 102 is folded below the heat absorption part 101. At this time, the second branch 1063 of the gas channel 106 located inside is in a squeezed state, and the first branch 1062 located outside is in a stretched state; at this time, the second liquid channel 105 in the flexible part 103 is in a squeezed state, and the first liquid channel 104 in the flexible part 103 is in a stretched state. That is to say, in the reverse bending state, the first liquid channel 104 is in a connected state, and the first branch 1062 located in the flexible part 103 is also in a connected state. The flexible part 103 of this structure can meet the folding of the heat pipe 100 in different directions, further reduce the influence of the heat pipe 100 in the folded state on the heat dissipation efficiency, and while ensuring the heat dissipation efficiency, it can facilitate the user to freely fold the heat pipe 100 and improve the user's comfort.

[0048] The following specifically describes the process of the heat pipe 100 according to the embodiment of the present application dissipating heat from an electronic device.

[0049] As Figures 1 to 2 shown, taking the example that the heat exchange structures 108 are arranged in both the first liquid channel 104 and the second liquid channel 105, the heat exchange medium is filled in the heat exchange structures 108. The heat absorption part 101 of the heat pipe 100 is attached to the electronic device to absorb the heat generated by the electronic device. The heat dissipation part 102 of the heat pipe 100 is foldable relative to the electronic device, and the heat dissipation part 102 can dissipate the heat generated by the electronic device. The specific process of heat flowing in the heat pipe 100 is as follows:

[0050] After the heat absorption part 101 of the heat pipe 100 is attached to the electronic device and absorbs the heat generated by the electronic device, the heat exchange medium 1041 in the first liquid channel 104 or the second liquid channel 105 of the heat absorption part 101 is heated and exchanges heat with the air in the gas channel 106, and flows into the gas channel 106 at the corresponding position during the heat exchange process. At this time, the heat exchange medium 1041 is heated and evaporated into steam 1061. Then, the steam 1061 in the gas channel 106 flows from the area close to the heat absorption part 101 to the area close to the heat dissipation part 102, that is, in the direction shown by the right arrow in the gas channel 106 as Figure 2 shown. During the process of the steam 1061 flowing towards the area of the gas channel close to the heat dissipation part 102, it gradually dissipates heat. During the heat dissipation process, a part of the steam 1061 exchanges heat with the heat exchange medium 1041 in the heat dissipation part 102 and reflows into the first liquid channel 104 or the second liquid channel 105 to form a heat conduction cycle.

[0051] Thus, for the vapor chamber 100 according to the embodiments of the present application, by providing a flexible portion between the heat absorption portion and the heat dissipation portion of the vapor chamber, the heat absorption portion and the heat dissipation portion can be folded and opened as a whole relative to the flexible portion, achieving multiple bending, and ensuring the overall service life of the vapor chamber; and the gas channel is defined by the cooperation of the first liquid channel and the second liquid channel, and can perform heat exchange with the first liquid channel and the second liquid channel respectively. When the flexible portion is bent, at least one of the first liquid channel and the second liquid channel can still remain connected, and the gas channel on one side of the flexible portion can also remain connected, so as to effectively dissipate heat from the electronic device.

[0052] According to an embodiment of the present application, the first liquid channel 104 and the second liquid channel 105 of the flexible portion 103 are arc-shaped facing each other.

[0053] In other words, the first liquid channel 104 and the second liquid channel 105 located in the flexible portion 103 are arranged along the shape of the outer contour of the flexible portion 103. The flexible portion 103 can be a flexible sheet body in a circular ring shape, and the first liquid channel 104 and the second liquid channel 105 are respectively located on both sides of the flexible portion 103. Therefore, the first liquid channel 104 and the second liquid channel 105 of the flexible portion 103 can be two semi-circular arc-shaped channels facing each other.

[0054] According to some other embodiments of the present application, the first branch 1062 and the second branch 1063 are respectively arc-shaped channels. The first branch 1062 is attached to the first liquid channel 104 located in the flexible portion 103, and the second branch 1063 is attached to the second liquid channel 105 located in the flexible portion 103.

[0055] In other words, the gas channel 106 is located between the first liquid channel 104 and the second liquid channel 105. The flexible portion 103 can be a circular ring structure, and a hollow structure 107 is further provided inside the flexible portion 103. Therefore, the first branch 1062 and the second branch 1063 of the gas channel 106 can be arc-shaped structures. The first branch 1062 is adjacent to and attached to the first liquid channel 104 located in the flexible portion 103, and the second branch 1063 is adjacent to and attached to the second liquid channel 105 located in the flexible portion 103.

[0056] It should be noted that during the process of transporting the gas from the heat absorption part 101 to the heat dissipation part 102, the gas needs to pass through the flexible part 103 in the middle. The first branch 1062 and the second branch 1063 in the flexible part 103 divide the gas in the gas passage 106 of the heat absorption part 101. A part of the gas is discharged through the first branch 1062, and the other part of the gas is discharged through the second branch 1063. When the gas reaches the gas passage 106 of the heat dissipation part 102, these two parts of gas converge and continue to be transported in the gas passage 106 of the heat dissipation part 102.

[0057] According to an embodiment of the present application, the hollow structure 107 is a circular hole.

[0058] In other words, the flexible part 103 is an arc-shaped sheet body, and a hollow structure 107 is provided inside the flexible part 103. The shape of the hollow structure 107 matches the arc-shaped structure of the flexible part 103 described above. The hollow structure 107 is used to divide the gas passing through the flexible part 103 to avoid the gas passage 106 being squeezed and blocked when the flexible part 103 is in a squeezed state, thereby causing the problem of gas transmission obstruction caused by a single-channel design. Therefore, a dual-channel design is adopted, and the hollow structure 107 is used to divide the gas, which can effectively solve the problem that the gas can still be effectively transported to the gas passage 106 located in the heat dissipation part 102 when at least one of the first branch 1062 or the second branch 1063 in the flexible part 103 is in a squeezed state.

[0059] According to some embodiments of the present application, the surface of the flexible part 103 is provided with wrinkles 109, and the wall surface of the hollow structure 107 is provided with wrinkles 109 corresponding to the surface of the flexible part 103.

[0060] In other words, as Figure 4 and Figure 5As shown, wrinkles 109 are provided on both the surface of the flexible part 103 and the wall surface of the hollow structure 107. The flexible part 103 is an irregular flexible sheet with wrinkles 109, further increasing the deformation margin. During the forward bending of the heat pipe 100, the first branch 1062 of the flexible part 103 and the first liquid channel 104 located inside the forward bending are in a squeezed state, while the second branch 1063 of the flexible part 103 and the second liquid channel 105 located outside are in a stretched state. As the irregular flexible structure is gradually stretched, the wrinkle 109 structure gradually unfolds. Due to the deformation margin left by the irregular flexible structure in the flexible part 103, the flexible part 103 will not be in a tight squeezed state as a whole. Due to the gradual stretching of the wrinkle 109 structure, both the first branch 1062 of the flexible part 103 and the first liquid channel 104 in the squeezed state will increase to improve the heat conduction ability. In addition, the second liquid channel 105 and the second branch 1063 of the gas channel 106 in the stretched flexible part 103 will not become smaller. During the reverse bending of the heat pipe 100, the flexible part 103 works normally and its performance will not decay.

[0061] Therefore, compared with the flexible sheet without wrinkles 109, the gas channel 106 and the liquid channel on the squeezed side of the flexible part 103 with wrinkles 109 on the surface are less affected by bending, thereby enhancing its overall heat conduction ability.

[0062] According to an embodiment of the present application, a plurality of protrusions and grooves arranged in sequence are provided on the surface of the flexible part 103, and the shapes of the protrusions and grooves are adapted to enable the protrusions to be movably inserted into the grooves.

[0063] That is to say, as Figure 6 and Figure 7 shown, on the basis of providing wrinkles 109 on the surface of the flexible part 103 and the wall surface of the hollow structure 107, a folding fan-like micro-structure 110 can be further added to the flexible part 103. The folding fan-like micro-structure 110 can be a plurality of protrusions and grooves provided on the surface of the flexible part 103 and the wall surface of the hollow structure 107. Among them, the shapes of the protrusions and grooves are matched so that the protrusions can be movably inserted into the grooves.

[0064] During the forward or reverse bending process, the wrinkles 109 of the irregular flexible structure stretch and expand, and at the same time, the folding fan-like micro-structure 110 on the surface of the flexible part 103 also unfolds, further supplementing the deformation margin, so that the first branch 1062, the second branch 1063, the first liquid channel 104, and the second liquid channel 105 in the bent flexible part 103 are not in a squeezed state. At this time, the heat conduction performance is no different from the flat state. Therefore, the folding fan-like micro-structure 110 can further optimize the heat conduction performance in the bent state.

[0065] In some other embodiments of the present application, the flexible part 103 includes a first flexible part 1031 and a second flexible part 1032.

[0066] Specifically, the first liquid channel 104 and the first branch 1062 are located in the first flexible part 1031, the second liquid channel 105 and the second branch 1063 are located in the second flexible part 1032, and the first flexible part 1031 and the second flexible part 1032 are respectively irregular flexible bodies.

[0067] In other words, the flexible part 103 of the embodiment of the present application includes a first flexible part 1031 and a second flexible part 1032. Among them, as Figures 1 to 2 shown, the first flexible part 1031 includes a first liquid channel 104 and a first branch 1062, and the second flexible part 1032 includes a second liquid channel 105 and a second branch 1063. Both the first flexible part 1031 and the second flexible part 1032 are irregular flexible bodies. That is to say, wrinkles 109 or folding fan-shaped microstructures 110 can be provided on the surfaces of the first flexible part 1031 and the second flexible part 1032 to improve their heat conduction ability in the bent and squeezed state.

[0068] According to some other embodiments of the present application, the heat exchange structure 108 is a capillary structure.

[0069] In other words, the heat exchange structure 108 is provided in either the first liquid channel 104 or the second liquid channel 105 in the embodiment of the present application, and the heat exchange structure 108 can be a capillary structure. The capillary structure is specifically a liquid-absorbing capillary core structure provided on the inner wall surface of the first liquid channel 104 or the second liquid channel 105. The capillary core structure can be a metal wire mesh, a microgroove, a fiber filament, etc., or a sintered metal powder core and a combination of several structures, which is not limited here. Taking the heat exchange medium 1041 as a liquid as an example, when the heat released by the lower housing of the electronic device enters the heat spreader 100, the heat exchange medium 1041 in the capillary liquid-absorbing cores in the first liquid channel 104 and the second liquid channel 105 can absorb heat and quickly vaporize into steam 1061, and enter the gas channel 106 between the first liquid channel 104 and the second liquid channel 105, thereby completing the heat exchange between the liquid channel and the gas channel 106. Those skilled in the art can understand this, and details are not described here.

[0070] The electronic device protective cover 200 according to the embodiment of the present application includes: a protective cover body 201, a cover plate 202, and a heat spreader 100.

[0071] Specifically, a receiving space matching the shape of the electronic device is defined within the protective cover body 201; the cover plate 202 is movably connected to the protective cover body 201; the heat absorption part 101 of the heat pipe 100 is arranged within the protective cover body 201, and the heat dissipation part 102 is arranged on the cover plate 202.

[0072] In other words, the electronic device protective cover 200 is composed of the protective cover body 201, the cover plate 202, and the heat pipe 100. The protective cover body 201 is used to accommodate the electronic device and the heat pipe 100. The internal receiving space of the protective cover body 201 is set according to the shape of the electronic device to closely fit the electronic device. The cover plate 202 is movably connected to the protective cover body 201. The cover plate 202 can be opened or closed relative to the protective cover body 201. The heat pipe 100 is arranged between the cover plate 202 and the protective cover body 201. The heat absorption part 101 of the heat pipe 100 is arranged within the protective cover body 201, and the heat dissipation part 102 is arranged on the cover plate 202. The heat pipe 100 is closely attached to the back cover of the electronic device to quickly dissipate the internal heat of the electronic device. The flexible part 103 corresponds to the position of the rotating shaft. When the cover plate 202 is bent forward or backward relative to the protective cover body 201, the flexible part 103 is also correspondingly squeezed or stretched.

[0073] Since the heat pipe 100 according to the above embodiments of the present application has the above technical effects, therefore, the electronic device protective cover 200 using the heat pipe 100 also has corresponding technical effects, namely, good heat dissipation effect and long service life.

[0074] The electronic device according to the embodiments of the present application includes: an electronic device body. Among them, the electronic device protective cover 200 is arranged on the electronic device body.

[0075] In other words, the electronic device body and the electronic device protective cover are used in combination. The electronic device protective cover 200 can not only protect the electronic device body from damage caused by natural falling to the ground or other external forces, but also be used to dissipate heat for the electronic device body, quickly discharging the heat released by the normal operation of the internal hardware of the electronic device body, and avoiding a series of problems such as short circuits caused by overheating inside the electronic device body.

[0076] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present application. Those skilled in the art should understand that the embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A vapor chamber, characterized in that, Comprising: An endothermic part, a heat dissipation part and a flexible part. The endothermic part, the heat dissipation part and the flexible part all have a first liquid channel, a second liquid channel and a gas channel. The gas channel is arranged between the first liquid channel and the second liquid channel. The first liquid channels of the endothermic part, the flexible part and the heat dissipation part are sequentially connected. The second liquid channels of the endothermic part, the flexible part and the heat dissipation part are sequentially connected. The gas channels of the endothermic part, the flexible part and the heat dissipation part are sequentially connected. Heat exchange structures are respectively arranged in the first liquid channel and the second liquid channel. Wherein, the flexible part is provided with a hollow structure, and the hollow structure divides the gas channel in the flexible part into a first branch and a second branch. The first branch is located on the first side of the flexible part and adjacent to the first liquid channel. The second branch is located on the second side of the flexible part and adjacent to the second liquid channel. Wherein, when the flexible part is in a forward bending state, the second liquid channel is in a connected state, and the second branch located in the flexible part is in a connected state. When the flexible part is in a reverse bending state, the first liquid channel is in a connected state, and the first branch located in the flexible part is in a connected state. The first liquid channel and the second liquid channel of the flexible part are circular arcs facing each other. The first branch and the second branch are respectively arc-shaped channels. The first branch is attached to the first liquid channel located in the flexible part, and the second branch is attached to the second liquid channel located in the flexible part. The hollow structure is a circular hole.

2. The heat pipe according to claim 1, wherein The surface of the flexible part is provided with wrinkles, and the wall surface of the hollow structure is provided with wrinkles corresponding to the surface of the flexible part.

3. The heat pipe according to claim 1, characterized in that, The surface of the flexible part is provided with a plurality of protrusions and grooves arranged in sequence. The shapes of the protrusions and the grooves are adapted so that the protrusions can be movably inserted into the grooves.

4. The heat pipe according to claim 1, wherein, The flexible part includes a first flexible part and a second flexible part. The first liquid channel and the first branch are located in the first flexible part. The second liquid channel and the second branch are located in the second flexible part. The first flexible part and the second flexible part are respectively irregular flexible bodies.

5. The heat pipe according to claim 1, wherein, The heat exchange structure is a capillary structure.

6. An electronic device protective case, characterized in that, Comprising: A protective cover body, and an accommodation space matching the shape of the electronic device is defined in the protective cover body. A cover plate, and the cover plate is movably connected to the protective cover body. The heat pipe according to any one of claims 1-5, wherein the endothermic part is arranged in the protective cover body, and the heat dissipation part is arranged on the cover plate.

7. An electronic device, characterized in that, Comprising: An electronic device body, and the protective cover as described in claim 6 is arranged outside.

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