A melting device for Mini LED encapsulation adhesive

Abstract

This invention belongs to the technical field of melting adhesive devices, and specifically relates to a melting adhesive device for Mini LED encapsulation. The device includes an adhesive hopper, a handle, and a sealing head. The adhesive hopper has multiple evenly distributed heating tubes inside, and an opening at the top with a sealing plate. A rotating shaft is horizontally arranged inside the hopper, with multiple evenly distributed stirring blades fixed to its shaft wall. One end of the shaft extends to the outside of the hopper and is fixedly attached to a winding wheel. A torsion spring is fitted onto the shaft wall, with both ends of the spring fixedly connected to the adhesive hopper and the winding wheel, respectively. A pull rope is provided on the wall of the winding wheel. A U-shaped rod is fixed to the side wall of the handle, and a vertical pull rod is located inside the U-shaped rod. The end of the pull rope extends into the U-shaped rod and is fixedly connected to the pull rod. This invention can stir and heat the adhesive inside the adhesive hopper, causing it to melt rapidly and improving the LED encapsulation efficiency.

Description

Technical Field

[0001] This invention belongs to the technical field of melting equipment, and in particular relates to a melting equipment for Mini LED encapsulation adhesive. Background Technology

[0002] A hot melt adhesive application device for LED encapsulation is a piece of equipment used to heat the adhesive and improve its plasticity during application. LED encapsulation adhesive is a crucial adhesive in the assembly and bonding of LED modules. Users typically inject LED encapsulation adhesive using a hot melt gun.

[0003] Patent CN215465779U discloses a melting device for Mini LED encapsulation adhesive, including a glue gun and a discharge port on the glue gun. A sealing plug is inserted inside the discharge port. One end of the sealing plug extends out of the discharge port and is fixedly connected to at least two L-shaped rods. A spring is provided at the end of the L-shaped rod away from the sealing plug. The spring and the glue gun are connected by a tension adjustment mechanism. A slope is provided at the lower end of the sealing plug, and a drainage mechanism is provided on the slope.

[0004] The above solution simply relies on a heating tube to heat the colloid, which is inefficient. In actual use, a certain amount of time needs to be waited before the colloid can be used, and this waiting time is not used to complete the encapsulation operation.

[0005] To address these issues, we propose a melting device for Mini LED encapsulation adhesive. Summary of the Invention

[0006] The purpose of this invention is to address the above-mentioned problems by providing a melting apparatus for Mini LED encapsulation adhesive.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a Mini LED encapsulation adhesive melting device, comprising an adhesive tank, a handle, and a sealing head, wherein the adhesive tank is provided with a plurality of evenly distributed heating tubes inside, the top of the adhesive tank is provided with an opening, and a sealing plate is provided at the opening, the tops of the plurality of heating tubes are all fixedly disposed at the bottom of the sealing plate, a fixing plate is fixedly disposed at the top of the sealing plate, fixing posts are inserted into both sides of the fixing plate, the lower end of the fixing post is fixedly connected to the top of the adhesive tank, the upper end of the fixing post is provided with a cavity, and a snap-fit ​​mechanism is provided inside the cavity;

[0008] The glue tank has a horizontally arranged rotating shaft inside. The shaft wall of the rotating shaft is fixed with multiple evenly distributed stirring blades. One end of the rotating shaft extends to the outside of the glue tank and is fixed with a winding wheel. The shaft wall of the rotating shaft is fitted with a torsion spring, and the two ends of the torsion spring are fixedly connected to the glue tank and the winding wheel, respectively. The wheel wall of the winding wheel is provided with a pull rope. The side wall of the handle is fixed with a U-shaped rod, and the inside of the U-shaped rod is vertically provided with a pull rod. The end of the pull rope extends into the inside of the U-shaped rod and is fixedly connected to the pull rod.

[0009] In the aforementioned Mini LED encapsulation adhesive melting device, the snap-fit ​​mechanism includes a connecting block, a first spring, and a snap-fit ​​block. The connecting block is laterally slidably disposed inside the cavity. One side of the connecting block is fixedly connected to the first spring. The end of the first spring away from the connecting block is fixedly connected to the side wall of the cavity. The other side of the connecting block is fixedly connected to the snap-fit ​​block, and the side of the snap-fit ​​block away from the connecting block extends to the outside of the fixing post.

[0010] In the aforementioned Mini LED encapsulation adhesive melting device, the locking block is located on one side outside the fixing post and is locked to the fixing plate, and the side wall of the locking block is inclined.

[0011] In the aforementioned Mini LED encapsulation adhesive melting device, two sliding rods are symmetrically fixed inside the U-shaped rod. The two ends of the pull rod are slidably connected to the rod walls of the two sliding rods, and a second spring is sleeved on the rod walls of both sliding rods. The two ends of the second spring are fixedly connected to the pull rod and the handle, respectively.

[0012] In the aforementioned Mini LED encapsulation adhesive melting device, a guide wheel is fixedly provided on the side wall of the U-shaped rod, and the pull rope is arranged to pass through the wheel wall of the guide wheel.

[0013] In the aforementioned Mini LED encapsulation adhesive melting device, the sidewall of the stirring blade is provided with a plurality of uniformly distributed dispersion holes.

[0014] In the aforementioned Mini LED encapsulation adhesive melting device, the rod wall of the pull rod has a pull hole along its length.

[0015] In the aforementioned Mini LED encapsulation adhesive melting device, a sealed bearing is fixedly embedded in the side wall of the adhesive tank, and the shaft wall of the rotating shaft is fixedly disposed inside the sealed bearing.

[0016] Compared with existing technologies, the advantages of a melting device for Mini LED encapsulation adhesive are:

[0017] 1. The heating tube inside the glue tank, along with the sealing plate, fixing plate, fixing column, connecting block, first spring, and locking block on the top of the glue tank, heats the glue inside the glue tank when it is working, causing the glue to melt. When it is necessary to remove the heating tube from the glue tank, press the locking blocks on both sides to retract the locking blocks into the fixing column. At this time, the fixing column can be removed from the fixing plate, thereby removing the heating tube from the glue tank for easy cleaning.

[0018] 2. The system comprises a rotating shaft, stirring blade, winding wheel, torsion spring, pull rope, U-shaped rod, and pull rod. When the hand grips the handle, pulling the pull rod causes it to move, moving the pull rope and causing the winding wheel to rotate. The winding wheel then rotates the rotating shaft and stirring blade. The stirring blade agitates the colloid inside the colloid chamber, rapidly heating and melting it, shortening the waiting time for application and facilitating rapid LED encapsulation. When the hand is removed from the pull rod, the torsion spring on the rotating shaft applies a torsional force to the winding wheel, causing the rotating shaft to rotate in the opposite direction and retracting the pull rope. Simultaneously, the stirring blade on the rotating shaft also performs agitation. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a melting device for Mini LED encapsulation adhesive provided by the present invention;

[0020] Figure 2 yes Figure 1 Enlarged view of the structure of part A in the middle section;

[0021] Figure 3 yes Figure 1 Enlarged view of the structure of part B in the middle section.

[0022] In the diagram: 1. Glue tank; 2. Handle; 3. Sealing head; 4. Heating tube; 5. Sealing plate; 6. Fixing plate; 7. Fixing column; 8. Rotating shaft; 9. Stirring blade; 10. Winding wheel; 11. Torsion spring; 12. Pull rope; 13. U-shaped rod; 14. Pull rod; 15. Connecting block; 16. First spring; 17. Locking block; 18. Slide rod; 19. Second spring; 20. Guide wheel. Detailed Implementation

[0023] The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0024] like Figure 1-3As shown, a Mini LED encapsulation adhesive melting device includes an adhesive tank 1, a handle 2, and a sealing head 3. The adhesive tank 1 has multiple evenly distributed heating tubes 4 inside. When the heating tubes 4 work inside the adhesive tank 1, they can heat the adhesive inside the adhesive tank 1, causing the adhesive to melt. The top of the adhesive tank 1 has an opening, and a sealing plate 5 is provided at the opening. The tops of the multiple heating tubes 4 are all fixedly set at the bottom of the sealing plate 5. A fixing plate 6 is fixedly provided at the top of the sealing plate 5. Fixing posts 7 are inserted into both sides of the fixing plate 6. The lower end of the fixing post 7 is fixedly connected to the top of the adhesive tank 1. The upper end of the fixing post 7 has a cavity, and a snap-fit ​​mechanism is provided inside the cavity.

[0025] A rotating shaft 8 is horizontally arranged inside the glue tank 1. Multiple evenly distributed stirring blades 9 are fixedly arranged on the shaft wall of the rotating shaft 8. Multiple evenly distributed dispersion holes are opened on the side walls of the stirring blades 9. One end of the rotating shaft 8 extends to the outside of the glue tank 1 and is fixedly fitted with a winding wheel 10. A sealed bearing is fixedly embedded in the side wall of the glue tank 1. The shaft wall of the rotating shaft 8 is fixedly arranged inside the sealed bearing, which can improve the rotational sealing between the rotating shaft 8 and the glue tank 1. A torsion spring 11 is sleeved on the shaft wall of the rotating shaft 8, and both ends of the torsion spring 11 are fixedly connected to the glue tank 1 and the winding wheel 10, respectively. A pull rope 12 is provided on the wheel wall of the winding wheel 10. The side wall of the handle 2... A U-shaped rod 13 is fixedly provided, and a pull rod 14 is vertically provided inside the U-shaped rod 13. The end of the pull rope 12 extends into the interior of the U-shaped rod 13 and is fixedly connected to the pull rod 14. Pull holes are provided on the rod wall of the pull rod 14 along its length. Two sliding rods 18 are symmetrically fixed inside the U-shaped rod 13. The two ends of the pull rod 14 are slidably connected to the rod walls of the two sliding rods 18 respectively. A second spring 19 is sleeved on the rod wall of each of the two sliding rods 18, and the two ends of the second spring 19 are fixedly connected to the pull rod 14 and the handle 2 respectively. A guide wheel 20 is fixedly provided on the side wall of the U-shaped rod 13, and the pull rope 12 is arranged to pass through the wheel wall of the guide wheel 20.

[0026] The locking mechanism includes a connecting block 15, a first spring 16, and a locking block 17. The connecting block 15 is laterally slidably disposed inside the cavity. One side of the connecting block 15 is fixedly connected to the first spring 16. The end of the first spring 16 away from the connecting block 15 is fixedly connected to the side wall of the cavity. The other side of the connecting block 15 is fixedly connected to the locking block 17. The side of the locking block 17 away from the connecting block 15 extends to the outside of the fixing post 7. The side of the locking block 17 located outside the fixing post 7 is locked with the fixing plate 6. The side wall of the locking block 17 is inclined. When it is necessary to remove the heating tube 4 from the inside of the glue tank 1, the locking blocks 17 on both sides are pressed at the same time, so that the locking blocks 17 retract into the inside of the fixing post 7. At this time, the fixing post 7 can be removed from the inside of the fixing plate 6, thereby removing the heating tube 4 from the inside of the glue tank 1, which is convenient for cleaning the heating tube 4.

[0027] The operating principle of this invention is described as follows: First, the heating tube 4 inside the glue tank 1 is turned on. When the heating tube 4 is working inside the glue tank 1, it can heat the glue inside the glue tank 1, causing the glue to melt. When the hand grips the handle 2, it pulls the lever 14, causing the lever 14 to be pulled. The lever 14 can drive the pull rope 12 to move, causing the end of the pull rope 12 to drive the winding wheel 10 to rotate. The winding wheel 10 can drive the rotating shaft 8 and the stirring blade 9 to rotate. The stirring blade 9 can stir the glue inside the glue tank 1, causing the glue to be heated and melted quickly. When the hand leaves the lever 14, the torsion spring 11 on the rotating shaft 8 acts at this time. The torsion spring 11 can apply a torsional force to the winding wheel 10, causing the rotating shaft 8 to rotate in the opposite direction and drive the winding wheel 10 to rotate and retract the pull rope 12. At the same time, the stirring blade 9 on the rotating shaft 8 can also play a stirring role. This process shortens the waiting time for the glue to be applied, which is convenient for the rapid encapsulation of LEDs.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A melting device for Mini LED encapsulation adhesive, comprising an adhesive hopper (1), a handle (2), and a sealing head (3), characterized in that, The glue tank (1) is provided with a plurality of evenly distributed heating tubes (4) inside. The top of the glue tank (1) is provided with an opening and a sealing plate (5) is provided at the opening. The tops of the plurality of heating tubes (4) are fixedly set at the bottom of the sealing plate (5). A fixing plate (6) is fixedly provided at the top of the sealing plate (5). Fixing posts (7) are inserted into both sides of the fixing plate (6). The lower end of the fixing post (7) is fixedly connected to the top of the glue tank (1). The upper end of the fixing post (7) is provided with a cavity, and a snap-fit ​​mechanism is provided inside the cavity. The glue tank (1) is provided with a rotating shaft (8) inside. The shaft wall of the rotating shaft (8) is fixed with a plurality of evenly distributed stirring blades (9). One end of the rotating shaft (8) extends to the outside of the glue tank (1) and is fixedly provided with a winding wheel (10). The shaft wall of the rotating shaft (8) is fitted with a torsion spring (11). The two ends of the torsion spring (11) are fixedly connected to the glue tank (1) and the winding wheel (10) respectively. The wheel wall of the winding wheel (10) is provided with a pull rope (12). The side wall of the handle (2) is fixedly provided with a U-shaped rod (13). The inside of the U-shaped rod (13) is provided with a vertical pull rod (14). The end of the pull rope (12) extends to the inside of the U-shaped rod (13) and is fixedly connected with the pull rod (14). The snap-fit ​​mechanism includes a connecting block (15), a first spring (16), and a snap-fit ​​block (17). The connecting block (15) is laterally slidably disposed inside the cavity. One side of the connecting block (15) is fixedly connected to the first spring (16). The end of the first spring (16) away from the connecting block (15) is fixedly connected to the side wall of the cavity. The other side of the connecting block (15) is fixedly connected to the snap-fit ​​block (17), and the side of the snap-fit ​​block (17) away from the connecting block (15) extends to the outside of the fixing post (7). The U-shaped rod (13) is symmetrically fixed with two sliding rods (18) inside. The two ends of the pull rod (14) are slidably connected to the rod walls of the two sliding rods (18) respectively. The rod walls of the two sliding rods (18) are each fitted with a second spring (19), and the two ends of the second spring (19) are fixedly connected to the pull rod (14) and the handle (2) respectively.

2. The melting device for Mini LED encapsulation adhesive according to claim 1, characterized in that, The card block (17) is located on one side outside the fixed column (7) and is engaged with the fixed plate (6), and the side wall of the card block (17) is inclined.

3. The melting device for Mini LED encapsulation adhesive according to claim 1, characterized in that, The U-shaped rod (13) is fixedly provided with a guide wheel (20) on its side wall, and the pull rope (12) is arranged to pass through the wheel wall of the guide wheel (20).

4. The melting device for Mini LED encapsulation adhesive according to claim 1, characterized in that, The sidewall of the stirring blade (9) is provided with a plurality of uniformly distributed dispersion holes.

5. The melting device for Mini LED encapsulation adhesive according to claim 1, characterized in that, The pull rod (14) has a pull hole along its length.

6. The melting device for Mini LED encapsulation adhesive according to claim 1, characterized in that, The side wall of the glue tank (1) is fixedly embedded with a sealed bearing, and the shaft wall of the rotating shaft (8) is fixedly disposed inside the sealed bearing.

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