Assembly detection method, apparatus, device, and readable storage medium

Abstract

The application provides an assembly detection method, device, equipment and readable storage medium, first image information of a to-be-detected piece is collected through an image collection device, and first center coordinates of the to-be-detected piece are calculated according to coordinate information of each assembly point in the first image information, the first center coordinates being theoretical center coordinates when the to-be-detected piece is assembled in place; and actual center coordinates of the to-be-detected piece in the first image information are referred to as second center coordinates, and the first center coordinates and the second center coordinates are compared, when the first center coordinates and the second center coordinates do not coincide, it can be determined that the to-be-detected piece is assembled in place. The automatic assembly detection method provided by the application detects whether the to-be-detected piece has the problem of not being assembled in place, reduces errors caused by manual detection, and improves the qualified rate and use stability of products.

Description

Technical Field

[0001] The present invention relates to the field of industrial automation, and in particular to an assembly detection method, device, equipment and readable storage medium. Background Art

[0002] The current vibration reduction installation structure of the air conditioner outdoor unit is as shown in the attached Figure 1 As shown, it includes a compressor base foot, a compressor positioning bolt 2, and a vibration-damping pad 3. The positioning bolt 2 and the vibration-damping pad 3 are matched with each other in terms of axis and hole. The compressor base foot is inserted into the inner groove of the vibration-damping pad 3. If the compressor 1 is not properly assembled, it is easy to cause the inner wall of the compressor base foot to come into hard contact with the positioning bolt 2, and the vibration-damping pad 3 will greatly reduce the vibration-damping effect. The compressor vibration is directly transmitted to the chassis through the positioning bolt 2, causing the chassis 4 to vibrate and radiate noise.

[0003] When compressors were assembled using robotic arms on the production line, manual inspection and control were required, significantly increasing the workload of operators. After long hours of work, operators often became fatigued, leading to inefficient inspection and control of air conditioners, which in turn increased the burden of troubleshooting subsequent product shipments. Summary of the Invention

[0004] The present invention provides an assembly detection method, device, equipment and readable storage medium to solve the problem of inadequate assembly of parts to be detected in the prior art.

[0005] One aspect of the present invention provides an assembly inspection method, wherein an assembly inspection device for executing the method includes an image acquisition device, and the method includes:

[0006] When the part to be inspected reaches the image acquisition range of the image acquisition device on the assembly line, first image information of the part to be inspected in a top-view direction acquired by the image acquisition device is acquired;

[0007] Calculating the first center coordinates of the part to be detected based on the coordinates of multiple assembly points of the part to be detected in the first image information, where the first center coordinates are theoretical center coordinates when the part to be detected is assembled in place;

[0008] Determining whether the first center coordinate coincides with a second center coordinate of the part to be detected in the first image information, where the second center coordinate is the actually obtained center coordinate of the part to be detected;

[0009] If the first center coordinate and the second center coordinate do not coincide with each other, it is determined that the component to be inspected is not assembled in place.

[0010] Furthermore, the method further comprises:

[0011] determining that the to-be-detected piece is an assembly offset when the first center coordinate and the second center coordinate do not coincide;

[0012] calculating an offset of the to-be-detected piece according to the first center coordinate and a coordinate value of the first center coordinate.

[0013] Further, the assembly detection device performing the method further comprises a laser emitting device and a laser receiving device arranged oppositely, and the to-be-detected piece passes through a detection area formed by the laser emitting device and the laser receiving device when moving along the assembly line, and the method further comprises:

[0014] acquiring a first time length during which the laser receiving device fails to receive a laser signal when the to-be-detected piece moves at a preset first speed through the detection area formed by the laser emitting device and the laser receiving device;

[0015] determining whether the first time length is equal to a preset second time length, the second time length being a time length during which the laser receiving device fails to receive a laser signal when the to-be-detected piece is assembled in place and passes through the detection area formed by the laser emitting device and the laser receiving device;

[0016] if the first time length is not equal to the second time length, determining that the to-be-detected piece is not assembled in place.

[0017] Further, the method further comprises:

[0018] determining that the to-be-detected piece is an assembly tilt when the first time length is not equal to the second time length;

[0019] calculating a tilt angle of the to-be-detected piece according to the first speed of the assembly line, the first time length and the second time length.

[0020] Further, the method further comprises:

[0021] acquiring second image information of a side view direction of the to-be-detected piece collected by the image collecting device when the to-be-detected piece reaches an image collecting range of the image collecting device on the assembly line;

[0022] constructing a geometric model of a plurality of assembly points of the to-be-detected piece according to a plurality of first image information and a plurality of second image information collected by the image collecting device;

[0023] determining a plane where a foot pad is located according to a plurality of point coordinates of the foot pad in the geometric model of each assembly point, and determining a plane where a base corresponding to the foot pad is located according to a plurality of point coordinates of the base in the geometric model of each assembly point;

[0024] determining whether a height difference exists between a plane where the foot pad is located and a plane where the base is located according to the second image information;

[0025] if the height difference does not exist between the plane where the foot pad is located and the plane where the base is located, determining that the to-be-detected member is not assembled in place.

[0026] In another aspect of the present application, a kind of assembly detection device is provided, and the assembly detection equipment with the assembly detection device includes image acquisition device, and the device includes:

[0027] the first acquisition module is used to obtain the first image information of the to-be-detected member in the overhead direction when the to-be-detected member reaches the image acquisition range of the image acquisition device on the flow line;

[0028] the first calculation module is used to calculate the first center coordinates of the to-be-detected member according to the point position coordinates of a plurality of assembly points of the to-be-detected member in the first image information, and the first center coordinates are the theoretical center coordinates when the to-be-detected member is assembled in place;

[0029] the first judging module is used to determine whether the first center coordinates and the second center coordinates of the to-be-detected member in the first image information coincide, and the second center coordinates are the center coordinates of the to-be-detected member actually obtained;

[0030] the first determining module is used to determine that the to-be-detected member is not assembled in place if the first center coordinates and the second center coordinates do not coincide.

[0031] Further, the assembly detection equipment with the assembly detection device further includes oppositely arranged laser emitting device and laser receiving device, and the detection area formed by the laser emitting device and the laser receiving device is passed through by the to-be-detected member when the to-be-detected member moves along the flow line, and the device further includes:

[0032] the second acquisition module is used to obtain the first time length when the laser receiving device fails to receive laser signal when the flow line drives the to-be-detected member to pass through the detection area formed by the laser emitting device and the laser receiving device at a preset first speed;

[0033] the second judging module is used to determine whether the first time length is equal to a preset second time length, and the second time length is the time length when the laser receiving device fails to receive laser signal when the to-be-detected member is assembled in place and passes through the detection area formed by the laser emitting device and the laser receiving device;

[0034] the third determining module is used to determine that the to-be-detected member is not assembled in place if the first time length and the second time length are not equal.

[0035] Further, the device further comprises:

[0036] The third acquisition module is configured to acquire second image information of the side direction of the workpiece to be detected collected by the image collection device when the workpiece to be detected reaches the image collection range of the image collection device on the assembly line.

[0037] The model analysis module is configured to construct a geometric model of each assembly point of the workpiece to be detected according to the plurality of first image information and the plurality of second image information collected by the image collection device.

[0038] The model analysis module is further configured to determine the plane where the foot pad is located according to a plurality of point coordinates of the foot pad in the geometric model of each assembly point, and determine the plane where the base is located according to a plurality of point coordinates of the base corresponding to the foot pad.

[0039] The third judgment module is configured to determine whether there is a height difference between the plane where the foot pad is located and the plane where the base is located according to the second image information.

[0040] The third determination module is configured to determine that the workpiece to be detected is not assembled in place if there is no height difference between the plane where the foot pad is located and the plane where the base is located.

[0041] In addition, another aspect of the present application also provides an assembly detection device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to realize the steps of the above assembly detection method.

[0042] In addition, another aspect of the present application also provides a computer readable storage medium, wherein the computer readable storage medium stores a computer program, and the computer program is configured to execute the steps of the above assembly detection method when running.

[0043] The assembly detection method, device, equipment and readable storage medium provided by the embodiment of the present application, by the image collection device collecting the first image information of the workpiece to be detected, and calculating the first center coordinates of the workpiece to be assembled according to the coordinate information of each assembly point in the first image information, the first center coordinates are the theoretical center coordinates when the workpiece to be detected is assembled in place; and comparing the actual center coordinates of the workpiece to be assembled in the first image information with the first center coordinates, when the first center coordinates and the second center coordinates do not coincide, it can be determined that the workpiece to be detected is assembled in place. The automatic assembly detection method provided by the present application detects whether the workpiece to be detected is not assembled in place, reduces the error caused by manual detection, and improves the qualified rate and use stability of the product.

[0044] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application more clearly understood and implemented according to the content of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0045] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a better understanding of the preferred embodiments, and are not to be considered as limiting of the present application. Moreover, in the drawings, like reference numerals refer to similar components throughout the several views. In the drawings:

[0046] Figure 1 Structure diagram of the compressor assembled on the base;

[0047] Figure 2 Structure diagram of the equipment for assembling detection provided by the embodiment of the present application;

[0048] Figure 3 Structure diagram of the equipment for assembling detection provided by the embodiment of the present application;

[0049] Figure 4 Flow diagram of the method for assembling detection provided by the embodiment of the present application;

[0050] Figure 5 Principle diagram of the cylindrical measurement method for detecting whether the detected piece is assembled in place provided by the embodiment of the present application;

[0051] Figure 6 Principle diagram of the laser ranging method for detecting whether the detected piece is assembled in place provided by the embodiment of the present application;

[0052] Figure 7 Schematic diagram of the method for detecting whether the detected piece is assembled in place according to the assembling height provided by the embodiment of the present application;

[0053] Figure 8 Structure diagram of the equipment for assembling detection provided by the embodiment of the present application.

[0054] Marking description in the figure:

[0055] 1, compressor; 2, positioning bolt; 3, shock-absorbing foot pad; 4, base;

[0056] 1.1, laser emitting device; 1.2, laser receiving device; 1.3, image acquisition device; 1.4, detected piece; 1.5, assembling point;

[0057] 801, a first obtaining module; 802, a first calculating module; 803, a first judging module; 804, a first determining module. DETAILED DESCRIPTION

[0058] Exemplary embodiments of the present disclosure will be described in greater detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0059] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those defined in a general dictionary should be interpreted as having a meaning consistent with the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined.

[0060] It should be noted that the assembly detection method provided by the embodiments of the present application is not limited to the assembly detection of the compressor, and is applicable to the assembly detection of a to-be-detected piece 1.4 of a structure similar to the assembly of the compressor, i.e., the assembly of the base and the foot pad to the base.

[0061] The assembly detection device provided by the embodiments of the present application is installed at a corresponding detection position on a flow line of the to-be-detected piece 1.4. The assembly detection device of the embodiments of the present application can be a device installed at each detection position respectively, or can be a device in which each detection device is fixed on an N-shaped frame, which is fixedly installed at the detection position and spans across both sides of the flow line.

[0062] Figure 2 、 Figure 3 The structure of the assembly detection device of the embodiments of the present application is shown schematically in the structure diagram of the assembly detection device of the embodiments of the present application. Figure 2 、 Figure 3 As shown in the structure diagram of the assembly detection device of the embodiments of the present application, the assembly detection device of the embodiments of the present application comprises a laser emitting device 1.1 and a laser receiving device 1.2 arranged oppositely, and the to-be-detected piece 1.4 passes through the middle of the laser emitting device 1.1 and the laser receiving device 1.2 when moving along the flow line. It should be noted that the laser emitting device 1.1 and the laser receiving device 1.2 of the embodiments of the present application can be arranged perpendicular to the flow line, or can be arranged parallel to the plane of the flow line, and the present application is not limited in this regard.

[0063] Further, the assembly detection device of the embodiment of the present application further comprises an image acquisition device 1.3, which specifically comprises a first acquisition module arranged directly above the assembly line, and a second acquisition module arranged parallel to the plane of the assembly line, wherein the first acquisition module is used to acquire the top view of the detected piece 1.4, and the two second acquisition modules are arranged on the two sides of the assembly line respectively to acquire the side view of the detected piece 1.4, and the top view and the side view of the detected piece 1.4 can be used to analyze and construct the three-dimensional geometric model of the detected piece 1.4.

[0064] In addition, the assembly detection device of the embodiment of the present application further comprises a signal processing device not shown in the drawings, which is used to receive the signals acquired by the laser receiving device 1.2 and the image acquisition device 1.3, and send the signals to the host device for the host device to analyze whether the detected piece 1.4 is out of position.

[0065] In addition, the assembly detection device provided by the embodiment of the present application further comprises a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor executes the computer program to realize the steps in each of the assembly detection method embodiments, for example Figure 4 the steps of the assembly detection method S11-S13 shown. Alternatively, the functions of each module / unit in the assembly detection device embodiment, for example Figure 8 the first acquisition module 801, the first calculation module 802, the first judgment module 803 and the first determination module 804 shown.

[0066] Figure 4 The flowchart of the assembly detection method of one embodiment of the present application is schematically shown. The assembly detection device for executing the method in the embodiment of the present application comprises an image acquisition device 1.3, which is described with reference to Figure 4 The assembly detection method proposed by the embodiment of the present application specifically comprises steps S11-S14, which are as follows:

[0067] S11, when the detected piece 1.4 reaches the image acquisition range of the image acquisition device 1.3 on the assembly line, acquiring the first image information of the detected piece 1.4 in the top direction acquired by the image acquisition device 1.3;

[0068] S12, calculating the first center coordinate of the detected piece 1.4 according to the point coordinate of each assembly point 1.5 of the detected piece 1.4 in the first image information, wherein the first center coordinate is the theoretical center coordinate when the detected piece 1.4 is assembled in place;

[0069] S13, judging whether the first center coordinate and a second center coordinate of the to-be-detected piece 1.4 in the first image information coincide, the second center coordinate being an actually obtained center coordinate of the to-be-detected piece 1.4;

[0070] S14, if the first center coordinate and the second center coordinate do not coincide, determining that the to-be-detected piece 1.4 is not assembled in place.

[0071] For convenience of description, the method for judging whether the to-be-detected piece 1.4 coincides according to whether the first center coordinate and the second center coordinate coincide is referred to as a cylindrical measurement method, as shown in Figure 5 Figure 5 A schematic diagram of a principle of detecting whether the to-be-detected piece 1.4 is assembled in place by the cylindrical measurement method of the embodiment of the present application is shown.

[0072] Referring to Figure 5 When the to-be-detected piece 1.4 has three assembly points 1.5A, B and C, the system calculates a theoretical center coordinate of the to-be-detected piece 1.4, the first center coordinate O, according to coordinate values of the three assembly points 1.5, and compares the second center coordinate O with an actual center coordinate of the to-be-detected piece 1.4, the second center coordinate O'. When the two coordinates coincide, it is proved that the to-be-detected piece 1.4 is assembled in place, otherwise, it is not assembled in place.

[0073] Further, when the first center coordinate O and the second center coordinate O' do not coincide, it is determined that the to-be-detected piece 1.4 is assembled with a deviation. In addition, the embodiment of the present application can also calculate a deviation B of the to-be-detected piece 1.4 according to coordinate values of the first center coordinate O and the second center coordinate O'.

[0074] Specifically, the coordinate value of the second center coordinate O' is represented as (x', y'), the coordinate value of the first center coordinate O is represented as (x, y), and the deviation B of the to-be-detected piece 1.4 can be represented as When the deviation B is not equal to 0, the equipment can send an assembly deviation or assembly out-of-place prompt information, and if necessary, the deviation can be displayed on a display interface for reference of an operator.

[0075] Further, the assembly detection method of the embodiment of the present application also includes a laser ranging method, and the assembly detection equipment of the embodiment of the present application also includes a laser emitting device 1.1 and a laser receiving device 1.2 arranged oppositely, the to-be-detected piece 1.4 passing through a detection area formed by the laser emitting device 1.1 and the laser receiving device 1.2 when moving along a flow line, and the method further includes the following steps not shown in the drawings:

[0076] ​S21, when the assembly line drives the to-be-inspected part 1.4 to pass through the detection area formed by the laser emitting device 1.1 and the laser receiving device 1.2 at a preset first uniform speed, obtaining a first duration during which the laser receiving device 1.2 fails to receive a laser signal;

[0077] S22, determining whether the first duration is equal to a preset second duration, where the second duration is the duration during which the laser receiving device 1.2 fails to receive a laser signal when the component to be inspected 1.4 passes through the inspection area formed by the laser emitting device 1.1 and the laser receiving device 1.2 when the component to be inspected 1.4 is assembled and in place;

[0078] S23: If the first time duration is not equal to the second time duration, it is determined that the component to be inspected 1.4 is not assembled in place.

[0079] Figure 6 The schematic diagram of the principle of detecting whether the part to be inspected 1.4 is properly assembled using the laser ranging method provided by an embodiment of the present invention is shown. In this embodiment of the present invention, when the part to be inspected 1.4 passes between the laser emitting device 1.1 and the laser receiving device 1.2, the laser receiving device 1.2 is unable to receive the laser signal emitted by the laser emitting device 1.1 due to the obstruction of the part to be inspected 1.4. Therefore, the horizontal width of the part to be inspected 1.4 can be calculated based on the moving speed of the part to be inspected 1.4 and the first duration of the failure to receive the laser signal.

[0080] Depend on Figure 6 It can be seen that when the component 1.4 to be detected is tilted during assembly, the horizontal width of the component 1.4 to be detected will become wider. At this time, the actual first time length will be greater than the preset second time length. Therefore, in an embodiment of the present invention, when the first time length is not equal to the second time length, it is determined that the component 1.4 to be detected is tilted during assembly.

[0081] Furthermore, when the first speed v1 of the assembly line and the height H and width L of the part to be inspected 1.4 are known, a preferred embodiment of the present invention can also calculate the inclination angle of the part to be inspected 1.4 based on the first speed of the assembly line, the first duration and the second duration.

[0082] Specifically, the horizontal width L1 is expressed as L1=t1*v1, and the sum of the inclination angle a and the inclination angle b is 90 degrees, that is, a+b=90°. According to the geometric relationship, L1=Hcosa+Lcosb can be deduced, and finally it can be calculated At this point, the tilt angle of the component 1.4 to be tested is calculated, and the device can issue a prompt message indicating that the assembly is tilted or not in place. If necessary, the tilt angle can be displayed on the display interface for the operator's reference.

[0083] In addition, it should be noted that the above embodiment is the case that the laser emitting device 1.1 and the laser receiving device 1.2 are arranged perpendicularly to the flow line, when the laser emitting device 1.1 and the laser receiving device 1.2 are parallel to the flow line plane, the height H of the to-be-detected piece 1.4 in the above calculation formula is not applicable, but the height H' of the laser signal emitted by the laser emitting device 1.1 is higher than the to-be-detected piece 1.4, and the specific calculation process will not be described herein.

[0084] Further, the assembly detection method of the embodiment of the present application further comprises establishing a three-dimensional combined model of the to-be-detected piece 1.4 according to the image information collected by the image collecting device 1.3, and determining whether the assembly height of the to-be-detected piece 1.4 is assembled in place according to the three-dimensional geometric model, so that the assembly detection method of the embodiment of the present application further comprises the following steps not shown in the drawings:

[0085] S31, when the to-be-detected piece 1.4 reaches the image collecting range of the image collecting device 1.3 on the flow line, acquiring the second image information of the side view direction of the to-be-detected piece 1.4 collected by the image collecting device 1.3;

[0086] S32, constructing a geometric model of a plurality of assembly point positions 1.5 of the to-be-detected piece 1.4 according to a plurality of first image information and a plurality of second image information collected by the image collecting device 1.3;

[0087] S33, determining the plane where the foot pad is located according to a plurality of point position coordinates of the foot pad in the geometric model of each assembly point position 1.5, and determining the plane where the base is located according to a plurality of point position coordinates of the base corresponding to the foot pad;

[0088] S34, determining whether there is a height difference between the plane where the foot pad is located and the plane where the base is located according to the second image information;

[0089] S35, if there is no height difference between the plane where the foot pad is located and the plane where the base is located, it is determined that the to-be-detected piece 1.4 is not assembled in place.

[0090] As Figure 7 shown, Figure 7 The principle diagram of the embodiment of the present application for detecting whether the to-be-detected piece 1.4 is assembled in place according to the assembly height is schematically shown. It should be noted that when the to-be-detected piece 1.4 is assembled in place, the plane where the upper surface of the foot pad on each assembly point position 1.5 is located should be higher than the plane where the upper surface of the base corresponding to the assembly position is located, and when the height difference cannot be detected, it can also be determined that the to-be-detected piece 1.4 is not assembled in place. Specifically, refer to Figure 7For the assembly point 1.5A, the plane where the current foot pad is located is determined according to the four point coordinates of the foot pad, the plane where the current base is located is determined according to the four point coordinates of the base, and whether the to-be-detected piece 1.4 is assembled in place is determined according to the height difference between the two planes.

[0091] It should be noted that the three image acquisition modules of the image acquisition device 1.3 in the embodiment of the application constitute a 3D camera, and according to the plurality of image information acquired by the three image acquisition modules, a three-dimensional geometric model of the to-be-detected piece 1.4 can be obtained. It is convenient for subsequent analysis of whether the plane where the foot pad in each assembly point 1.5 of the to-be-detected piece 1.4 and the plane where the corresponding base is located exist a height difference, that is, whether the foot pad is higher than the base by a certain height.

[0092] For the method embodiment, in order to simply describe, it is expressed as a series of action combinations, but those skilled in the art should know that the embodiment of the application is not limited by the action sequence described, because according to the embodiment of the application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions involved are not necessarily necessary for the embodiment of the application.

[0093] Figure 8 The structure schematic diagram of the assembly detection device of one embodiment of the application is schematically shown. The assembly detection device in the embodiment of the application has the assembly detection device. The assembly detection device includes an image acquisition device 1.3, which is described with reference to Figure 8 The assembly detection device of the embodiment of the application specifically includes a first acquisition module 801, a first calculation module 802, a first judgment module 803, and a first determination module 804. Wherein:

[0094] The first acquisition module 801 is used for acquiring the first image information of the to-be-detected piece 1.4 in the overhead direction acquired by the image acquisition device 1.3 when the to-be-detected piece 1.4 reaches the image acquisition range of the image acquisition device 1.3 on the flow line;

[0095] The first calculation module 802 is used for calculating the first center coordinates of the to-be-detected piece 1.4 according to the point coordinates of the plurality of assembly points 1.5 of the to-be-detected piece 1.4 in the first image information, and the first center coordinates are the theoretical center coordinates when the to-be-detected piece 1.4 is assembled in place;

[0096] The first judgment module 803 is used for judging whether the first center coordinates coincide with the second center coordinates of the to-be-detected piece 1.4 in the first image information, and the second center coordinates are the actually obtained center coordinates of the to-be-detected piece 1.4;

[0097] The first determining module 804 is configured to determine that the to-be-detected piece 1.4 is not assembled in place if the first center coordinate and the second center coordinate do not coincide.

[0098] Further, the first determining module 804 is specifically configured to determine that the to-be-detected piece 1.4 is assembled in an offset manner when the first center coordinate and the second center coordinate do not coincide.

[0099] The assembly detection device according to the embodiment of the present application further comprises:

[0100] The offset calculating module is configured to calculate the offset of the to-be-detected piece 1.4 according to the first center coordinate and the coordinate value of the first center coordinate.

[0101] Further, the assembly detection device according to the embodiment of the present application further comprises the laser emitting device 1.1 and the laser receiving device 1.2 arranged oppositely, and the to-be-detected piece 1.4 passes through a detection area formed by the laser emitting device 1.1 and the laser receiving device 1.2 when moving along the assembly line, and the device further comprises:

[0102] The second acquiring module is configured to acquire a first time length during which the laser receiving device 1.2 fails to receive the laser signal when the to-be-detected piece 1.4 moves at a preset first speed along the assembly line and passes through the detection area formed by the laser emitting device 1.1 and the laser receiving device 1.2.

[0103] The second judging module is configured to judge whether the first time length is equal to a preset second time length, the second time length being a time length during which the laser receiving device 1.2 fails to receive the laser signal when the to-be-detected piece 1.4 is assembled in place and passes through the detection area formed by the laser emitting device 1.1 and the laser receiving device 1.2.

[0104] The third determining module is configured to determine that the to-be-detected piece 1.4 is not assembled in place if the first time length is not equal to the second time length.

[0105] Further, the third determining module according to the embodiment of the present application is specifically configured to determine that the to-be-detected piece 1.4 is assembled in an inclined manner if the first time length is not equal to the second time length.

[0106] The assembly detection device according to the embodiment of the present application further comprises:

[0107] The inclination calculating module is configured to calculate an inclination angle of the to-be-detected piece 1.4 according to the first speed of the assembly line, the first time length and the second time length.

[0108] Further, the assembly detection device according to the embodiment of the present application further comprises:

[0109] The third acquisition module is configured to acquire second image information of the side direction of the workpiece 1.4 captured by the image acquisition device 1.3 when the workpiece 1.4 reaches the image acquisition range of the image acquisition device 1.3 on the flow line.

[0110] The model analysis module is configured to construct a geometric model of each assembly point 1.5 of the workpiece 1.4 according to the plurality of first image information and the plurality of second image information captured by the image acquisition device 1.3.

[0111] The model analysis module is further configured to determine a plane where the foot pad is located according to a plurality of point coordinates of the foot pad in the geometric model of each assembly point 1.5, and determine a plane where the base is located according to a plurality of point coordinates of the base corresponding to the foot pad.

[0112] The third judgment module is configured to determine whether there is a height difference between the plane where the foot pad is located and the plane where the base is located according to the second image information.

[0113] The third determination module is configured to determine that the workpiece 1.4 is not assembled in place if there is no height difference between the plane where the foot pad is located and the plane where the base is located.

[0114] For the device embodiment, it is basically similar to the method embodiment, so the description is relatively simple, and the related parts can be referred to the part of the method embodiment.

[0115] The device embodiment described above is only schematic, and the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, that is, they can be located in one place, or distributed on multiple network units. According to actual needs, part or all of the modules can be selected to achieve the purpose of the embodiment. Those skilled in the art can understand and implement it without creative labor.

[0116] The assembly detection method, device, equipment and readable storage medium provided by the embodiment of the present application, through the image acquisition device 1.3, the first image information of the to-be-detected piece 1.4 is acquired, and the first center coordinate of the to-be-assembled piece is calculated according to the coordinate information of each assembly point 1.5 in the first image information. The first center coordinate is the theoretical center coordinate when the to-be-detected piece 1.4 is assembled in place; and the actual center coordinate of the to-be-assembled piece in the first image information is referred to as the second center coordinate, which is compared with the first center coordinate. When the first center coordinate and the second center coordinate do not coincide, it can be determined that the to-be-detected piece 1.4 is assembled in place. The automatic assembly detection method provided by the present application detects whether the to-be-detected piece 1.4 has the problem of not being assembled in place, reduces the error caused by manual detection, and improves the qualified rate and use stability of the product.

[0117] In addition, the embodiment of the present application also provides a computer readable storage medium, which stores a computer program, wherein the computer program is set to execute the steps of the assembly detection method in the above-mentioned embodiment.

[0118] In the embodiment, the modules / units of the assembly detection device integrated in the form of software function units and sold or used as independent products can be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the above-mentioned embodiment methods can also be completed by a computer program to instruct related hardware, and the computer program can be stored in a computer readable storage medium. The computer program can implement the steps of each method embodiment when executed by a processor. The computer program includes computer program code, which can be in the form of source code, object code, executable files or some intermediate forms, etc. The computer readable medium can include any entity or device, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. that can carry the computer program code. It should be noted that the content included in the computer readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction, for example, in some jurisdictions, according to legislation and patent practice, the computer readable medium does not include electric carrier signals and telecommunication signals.

[0119] In the embodiments of the present application, it should be understood that the disclosed apparatus and method can be implemented in other manners. For example, the embodiments of the apparatus described above are merely schematic; for example, the division of the units is only a logical function division; there can be another division manner for the actual implementation; for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between the units can be indirect couplings or communication connections through some interfaces, devices or units, and can be in electrical, mechanical or other forms.

[0120] Those skilled in the art can understand that the combination of features of different embodiments means to be within the scope of the present application and form different embodiments, although some embodiments herein include certain features rather than other features included in other embodiments. For example, in the following claims, any one of the claimed embodiments can be used in any combination.

[0121] Finally, it should be noted that the above embodiments are merely used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An assembly detection method, characterized by, The assembly detection device for executing the method comprises an image acquisition device, and the method comprises: When a piece to be detected reaches an image acquisition range of the image acquisition device on a flow line, first image information of the piece to be detected in a top view acquired by the image acquisition device is acquired; First center coordinates of the piece to be detected are calculated according to point coordinates of multiple assembly points of the piece to be detected in the first image information, and the first center coordinates are theoretical center coordinates when the piece to be detected is assembled in place; Whether the first center coordinates coincide with second center coordinates of the piece to be detected in the first image information is judged, and the second center coordinates are actually obtained center coordinates of the piece to be detected; If the first center coordinates do not coincide with the second center coordinates, it is determined that the piece to be detected is not assembled in place; The method further comprises: when a piece to be detected reaches an image acquisition range of the image acquisition device on a flow line, second image information of the piece to be detected in a side view acquired by the image acquisition device is acquired; A geometric model of multiple assembly points of the piece to be detected is constructed according to multiple first image information and multiple second image information acquired by the image acquisition device; A plane where a foot pad is located is determined according to multiple point coordinates of the foot pad in the geometric model of each assembly point, and a plane where a base corresponding to the foot pad is located is determined according to multiple point coordinates of the base; Whether there is a height difference between the plane where the foot pad is located and the plane where the base is located is judged according to the second image information; If there is no height difference between the plane where the foot pad is located and the plane where the base is located, it is determined that the piece to be detected is not assembled in place.

2. The method of claim 1, wherein, The method further comprises: When the first center coordinates do not coincide with the second center coordinates, it is determined that the piece to be detected is assembled with an offset; An offset amount of the piece to be detected is calculated according to the first center coordinates and coordinate values of the first center coordinates.

3. The method of claim 1, wherein, The assembly detection device for executing the method further comprises a laser emitting device and a laser receiving device arranged oppositely, and a detection area formed by the laser emitting device and the laser receiving device is passed through by the piece to be detected when the piece to be detected moves along the flow line, and the method further comprises: When the flow line drives the piece to be detected to pass through the detection area formed by the laser emitting device and the laser receiving device at a preset first speed, a first time length during which the laser receiving device fails to receive a laser signal is acquired; Whether the first time length is equal to a preset second time length is judged, and the second time length is a time length during which the laser receiving device fails to receive the laser signal when the piece to be detected passes through the detection area formed by the laser emitting device and the laser receiving device when the piece to be detected is assembled in place; If the first time length is not equal to the second time length, it is determined that the piece to be detected is not assembled in place.

4. The method of claim 3, wherein, The method further comprises: When the first time length is not equal to the second time length, it is determined that the piece to be detected is assembled with an inclination; An inclination angle of the piece to be detected is calculated according to the first speed of the flow line, the first time length and the second time length.

5. An assembly detection device, characterized by The assembly detection device with the assembly detection apparatus comprises an image acquisition device, and the device comprises: a first acquisition module configured to acquire first image information of the top direction of the assembly to be detected when the assembly to be detected reaches an image acquisition range of the image acquisition device on a flow line; a first calculation module configured to calculate first center coordinates of the assembly to be detected according to point coordinates of a plurality of assembly points of the assembly to be detected in the first image information, wherein the first center coordinates are theoretical center coordinates when the assembly to be detected is assembled in place; a first judgment module configured to judge whether the first center coordinates coincide with second center coordinates of the assembly to be detected in the first image information, wherein the second center coordinates are actually obtained center coordinates of the assembly to be detected; a first determination module configured to determine that the assembly to be detected is not assembled in place if the first center coordinates do not coincide with the second center coordinates. The device further comprises: a third acquisition module configured to acquire second image information of the side direction of the assembly to be detected when the assembly to be detected reaches the image acquisition range of the image acquisition device on the flow line; a model analysis module configured to construct a geometric model of a plurality of assembly points of the assembly to be detected according to a plurality of first image information and a plurality of second image information acquired by the image acquisition device; the model analysis module is further configured to determine a plane where a foot pad is located according to a plurality of point coordinates of the foot pad in the geometric model of each assembly point, and determine a plane where a base foot corresponding to the foot pad is located according to a plurality of point coordinates of the base foot; a third judgment module configured to judge whether there is a height difference between the plane where the foot pad is located and the plane where the base foot is located according to the second image information; a third determination module configured to determine that the assembly to be detected is not assembled in place if there is no height difference between the plane where the foot pad is located and the plane where the base foot is located.

6. The apparatus of claim 5, wherein, The assembly detection device with the assembly detection apparatus further comprises a laser emitting device and a laser receiving device arranged oppositely, and a detection area formed by the laser emitting device and the laser receiving device is passed through by the assembly to be detected when the assembly to be detected moves along the flow line, and the device further comprises: a second acquisition module configured to acquire a first time length during which the laser receiving device fails to receive a laser signal when the flow line drives the assembly to be detected to pass through the detection area formed by the laser emitting device and the laser receiving device at a preset first speed; a second judgment module configured to judge whether the first time length is equal to a preset second time length, wherein the second time length is a time length during which the laser receiving device fails to receive a laser signal when the assembly to be detected is assembled in place and passes through the detection area formed by the laser emitting device and the laser receiving device; a third determination module configured to determine that the assembly to be detected is not assembled in place if the first time length is not equal to the second time length.

7. An assembly inspection apparatus comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the computer program comprises instructions for causing the processor to perform the method of any one of claims 1 to 6. The processor implements the steps of the method according to any one of claims 1-4 when executing the program. ​ 8. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is configured to execute the steps of the method in any one of claims 1-4 when running.

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