Wire arranging device and method for arranging wires

Abstract

The application relates to a wire arranging device and a wire arranging method. The wire arranging device comprises a base, a transmission assembly, a wire arranging assembly, a tin paste dipping assembly and a tin dipping assembly. The transmission assembly, the wire arranging assembly, the tin paste dipping assembly and the tin dipping assembly are all mounted on the base. The wire is mounted on the transmission assembly. The transmission assembly can drive the wire to sequentially move to the wire arranging assembly, the tin paste dipping assembly and the tin dipping assembly. The technical scheme of the application effectively solves the problem that the production efficiency is low when the wire is arranged and dipped with tin in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of wire soldering, and more specifically, to a wire handling device and a method for wire handling. Background Technology

[0002] In the current wire harness production process, loose ground wires need to be twisted into a wire harness of a predetermined diameter. In order to prevent the ground wires from becoming loose after twisting, the twisted ground wires are tinned, and the tinning size is controlled to a predetermined length.

[0003] In practice, one worker holds the product in their left hand and uses a clamp in their right hand to hold the loose base of the ground wire, twisting the clamp while pulling back to tighten the ground wire. The product is then passed to the next worker, who first applies a little flux to the tightened ground wire and then inserts it into the solder bath to tin it, thus meeting the product requirements. Summary of the Invention

[0004] This application provides a wire sorting device and a wire sorting method to solve the problem of low production efficiency in the prior art when sorting and soldering wires.

[0005] A wire organizing device according to this application includes: a base, a transmission component, a wire organizing component, a solder paste application component, and a soldering component; the transmission component, the wire organizing component, the solder paste application component, and the soldering component are all mounted on the base, and the wires are mounted on the transmission component; the transmission component can drive the wires to move sequentially to the wire organizing component, the solder paste application component, and the soldering component.

[0006] Furthermore, the wire organizing assembly includes a first driving structure and a wire gathering and fixing structure, wherein the first driving structure is connected to the wire gathering and fixing structure to drive the wire gathering and fixing structure to move vertically.

[0007] Furthermore, the wire gathering and fixing structure includes a first clamping arm and a second clamping arm. The first end of the first clamping arm and the first end of the second clamping arm are in a state where the loose wire is fixed close to each other and a state where the loose wire is to be fixed is far away from each other.

[0008] Furthermore, the wire gathering and fixing structure also includes a first driving member, a pivot shaft, and a spring. The middle parts of the first clamping arm and the middle parts of the second clamping arm are rotatably connected to the pivot shaft. The first driving member is connected to the second end of the first clamping arm and the second end of the second clamping arm to drive the second end of the first clamping arm and the second end of the second clamping arm to move closer to each other. The first end of the spring is connected to the first clamping arm from the pivot shaft to the first end of the first clamping arm, and the second end of the spring is connected to the second clamping arm from the pivot shaft to the first end of the second clamping arm.

[0009] Furthermore, the first driving component includes a driving body and two connecting arms. The first ends of the two connecting arms are connected to the driving body, and the second ends of the two connecting arms respectively cooperate with the second ends of the first clamping arm and the second clamping arm to fix the loose wire, or the second ends of the two connecting arms are respectively disengaged from the second ends of the first clamping arm and the second clamping arm to fix the loose wire.

[0010] Furthermore, the wire gathering and fixing structure also includes a rotary drive component, which is fixed on the base, and the rotation axis of the rotary drive component is connected to the wire gathering and fixing structure.

[0011] Furthermore, the first clamping arm includes a first clamping arm body and a first clamping head, the first clamping head being located at the second end of the first clamping arm. The second clamping arm includes a second clamping arm body and a second clamping head, the second clamping head being located at the second end of the second clamping arm. The first clamping head includes a wire guiding groove and a clamping plate. The second clamping head includes a wire mating groove and a mating plate. The clamping plate is located on the side of the wire guiding groove closer to the wire, and the mating plate is located on the side of the wire mating groove closer to the wire. The wire guiding groove and the wire mating groove form a closed converging through hole, and the clamping plate and the mating plate form a clamping and fixing through hole.

[0012] Furthermore, the solder paste dispensing assembly includes a second driving structure and a solder paste pool structure. The second driving structure is disposed on the base, and the solder paste pool structure is mounted on the second driving structure. The second driving structure can drive the solder paste pool structure to a working position or a avoidance position.

[0013] Furthermore, the soldering component includes a third driving structure and a soldering structure. The third driving structure is disposed on the base, and the soldering structure is disposed on the third driving structure. The third driving structure can drive the soldering structure to a working position or an avoidance position.

[0014] Furthermore, the tinning structure includes a tin furnace and a tin cup, the tin cup being able to move vertically within the tin furnace.

[0015] Furthermore, the wire sorting device also includes a gripping component, which is disposed on the base and located between the soldering component and the wire sorting component in the direction of wire movement.

[0016] Furthermore, the wire sorting device also includes a detection component, which is mounted on the base and positioned between the gripping component and the wire sorting component in the direction of wire movement.

[0017] Furthermore, the wire sorting device also includes a wire placement station, which is located between the detection component and the wire sorting component.

[0018] Furthermore, the transmission component includes a turntable drive structure and a turntable structure. The turntable drive structure is mounted on the base and connected to the turntable structure to drive the turntable structure to rotate.

[0019] Furthermore, the turntable structure includes a turntable body and a wire fixing part. The turntable body is connected to the turntable drive structure, and the wire fixing part is fixedly installed on the upper surface of the turntable.

[0020] Furthermore, the turntable structure also includes a loose wire limiting plate with a notch through which the loose wires of the conductor extend downwards, and the main body of the conductor is supported on the loose wire limiting plate.

[0021] Furthermore, the turntable structure also includes multiple support parts and multiple support rollers. The multiple support rollers are arranged one-to-one with the multiple support parts. The first end of the support part is fixed on the base, and the support roller is rotatably connected to the second end of the support part. The support roller is in contact with the lower surface of the turntable body.

[0022] According to another aspect of this application, a method for wire arrangement is also provided. The method employs the aforementioned wire arrangement apparatus and includes the following steps: S10 installing wires; S20 a transmission component driving the wires to a wire arrangement component, whereby the wire arrangement component arranges the wires; S30 a transmission component driving the wires to a solder paste application component, whereby the arranged wires are applied with solder paste; and S40 a transmission component driving the wires to a soldering component, whereby the solder paste-applied wires are soldered.

[0023] Furthermore, after step S40, the method further includes removing the wire and detecting the position of the removed wire.

[0024] By applying the technical solution of this application, the wires to be organized are mounted on a transmission component. The transmission component moves the wires to a wire organizing component for organizing, arranging the scattered wires into a suitable bundle. Next, the transmission component moves the wires to a solder paste applicator for solder paste application. Then, the transmission component moves the solder paste-applied wires to a soldering component for soldering. The above soldering method is highly efficient and offers controllable quality. The technical solution of this application effectively solves the problem of low production efficiency during wire organization and soldering in the prior art. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A top-view perspective view of the wire organizing device of this embodiment is shown.

[0028] Figure 2 It shows Figure 1 A top-down view of the wire organizing device from another perspective;

[0029] Figure 3 It shows Figure 1 A three-dimensional structural diagram of the wire organizing device from another angle;

[0030] Figure 4 It shows Figure 1 A three-dimensional structural diagram of the wire gathering and fixing structure of the wire organizing device;

[0031] Figure 5 It shows Figure 4 A three-dimensional structural diagram of the wire coiling and fixing structure from another angle.

[0032] The above figures include the following reference numerals:

[0033] 10. Base; 20. Transmission component; 21. Turntable drive structure; 22. Turntable structure; 221. Turntable body; 222. Wire fixing part; 223. Wire spreading limiting plate; 224. Support part; 225. Support roller; 30. Wire organizing component; 31. First drive structure; 32. Wire gathering and fixing structure; 321. First clamping arm; 322. Second clamping arm; 323. First drive component; 324. Pivot shaft; 325. Spring; 326. Rotation drive component; 40. Solder paste application component; 41. Second drive structure; 42. Solder paste pool structure; 50. Solder application component; 51. Third drive structure; 52. Solder application structure; 60. Gripping component; 70. Detection component. Detailed Implementation

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0036] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0037] like Figures 1 to 5 As shown, the wire arrangement device in this embodiment includes: a base 10, a transmission component 20, a wire arrangement component 30, a solder paste application component 40, and a solder application component 50. The transmission component 20, the wire arrangement component 30, the solder paste application component 40, and the solder application component 50 are all mounted on the base 10. The wires are mounted on the transmission component 20, and the transmission component 20 can drive the wires to move sequentially to the wire arrangement component 30, the solder paste application component 40, and the solder application component 50.

[0038] Applying the technical solution of this embodiment, the wires to be organized are mounted on the transmission component 20. The transmission component 20 moves the wires to the wire organizing component 30 to organize the wires, arranging the scattered wires into a suitable bundle. Next, the transmission component 20 moves the wires to the solder paste applicator 40 for solder paste application. Then, the transmission component 20 moves the solder paste-applied wires to the soldering component 50 for soldering. The above-described soldering method is highly efficient and has controllable quality. The technical solution of this embodiment effectively solves the problem of low production efficiency during wire organization and soldering in the prior art.

[0039] It should be noted that the wires arranged in this embodiment are multiple wires that are relatively messy. The wire arrangement component 30 gathers the multiple messy wires (hereinafter referred to as ground wires) together, and then the multiple wires gathered together are twisted to make the above-mentioned messy multiple wires twist into a wire bundle.

[0040] like Figure 2 and Figure 3As shown, in the technical solution of this embodiment, the wire organizing assembly 30 includes a first driving structure 31 and a wire gathering and fixing structure 32. The first driving structure 31 is connected to the wire gathering and fixing structure 32 to drive the wire gathering and fixing structure 32 to move vertically. The specific operation steps are as follows: the wire gathering and fixing structure 32 opens the wire to enter the channel, the first driving structure 31 drives the wire gathering and fixing structure 32 to move upward, and after the wire gathering and fixing structure 32 moves to the position (the root of the ground wire), the wire gathering and fixing structure closes, thus realizing the constraint of the wire gathering and fixing structure 32 on the wire. Then, the first driving structure 31 drives the wire gathering and fixing structure 32 to move downward, so that the ground wires at the predetermined distance can be gathered together. It should be noted that the wire gathering and fixing structure 32 also rotates while moving downward, so that the gathered ground wires are not easy to bounce or scatter.

[0041] It should be noted that the wire organizing assembly 30 also includes a pressing structure, which is connected to the first driving structure 31. The pressing structure includes a pressing block, and the first driving structure 31 can drive the pressing block to press against the wire. The specific location of the pressed wire is where the ground wire is led out from the main body of the wire, and it is located on the main body of the wire. The function of the pressing structure is to press against the copper foil, which is fixed to the main body of the wire, thereby ensuring that structures such as the ground wire located on the outside of the main body of the wire will not affect the internal structure of the main body of the wire. For example, it will not easily cause the internal wires of the main body of the wire to twist, misalign, or deform. The pressing block is driven by the second driving part.

[0042] like Figure 4 and Figure 5 As shown, in this embodiment, the wire gathering and fixing structure 32 includes a first clamping arm 321 and a second clamping arm 322. The first end of the first clamping arm 321 and the first end of the second clamping arm 322 are in a state where the loose wires are close to each other and in a state where the loose wires to be fixed are far apart. The above structure is convenient to operate and compact. It should be noted that in this embodiment, the first clamping arm 321 and the second clamping arm 322 are used together to gather multiple messy wires.

[0043] like Figures 2 to 5As shown, in the technical solution of this embodiment, the wire gathering and fixing structure 32 further includes a first driving member 323, a pivot shaft 324, and a spring 325. The middle part of the first clamping arm 321 and the middle part of the second clamping arm 322 are rotatably connected to the pivot shaft 324. The first driving member 323 is connected to the second end of the first clamping arm 321 and the second end of the second clamping arm 322 to drive the second end of the first clamping arm 321 and the second end of the second clamping arm 322 to move closer to each other. The first end of the spring 325 is connected to the first clamping arm 321 from the pivot shaft 324 to the first end of the first clamping arm 321, and the second end of the spring 325 is connected to the second clamping arm 322 from the pivot shaft 324 to the first end of the second clamping arm 322. Spring 325 is always in a stretched elastic state. When the force applied by the first driving member 323 to the first clamping arm 321 and the second clamping arm 322 is greater than the spring tension, the second ends of the first clamping arm 321 and the second ends of the second clamping arm 322 open. When the first driving member 323 stops applying force to the first clamping arm 321 and the second clamping arm 322, the second ends of the first clamping arm 321 and the second ends of the second clamping arm 322 close. The above structure is compact and easy to operate.

[0044] It should be noted that the middle part of the first clamping arm 321 mentioned above refers to the position between the first end of the first clamping arm 321 and the second end of the second clamping arm 322, and is not necessarily the exact middle of the first clamping arm 321 and the middle of the second clamping arm 322.

[0045] like Figures 2 to 5 As shown, in this embodiment, the first driving member 323 includes a driving body and two connecting arms. The first ends of the two connecting arms are connected to the driving body, and the second ends of the two connecting arms respectively cooperate with the second ends of the first clamping arm 321 and the second clamping arm 322 to fix the loose wire, or the second ends of the two connecting arms are disengaged from the second ends of the first clamping arm 321 and the second clamping arm 322 to fix the loose wire. This structure can prevent the first driving member 323 from interfering with the first clamping arm 321 and the second clamping arm 322 when they rotate.

[0046] like Figure 2 , Figure 3 and Figure 5As shown in the technical solution of this embodiment, the wire gathering and fixing structure 32 further includes a rotation drive 326, which is fixed on the base 10. The rotation axis of the rotation drive 326 is connected to the wire gathering and fixing structure 32. The rotation axis of the rotation drive 326 (which can be the rotation axis itself or an extension axis connected to the rotation axis) is connected to the pivot axis 324. The arrangement of the rotation drive 326 makes the gathered ground wires twisted together, so that the gathered ground wires are not easily scattered again.

[0047] like Figure 4 and Figure 5 As shown, in this embodiment, the first clamping arm 321 includes a first clamping arm body and a first clamping head, with the first clamping head located at the second end of the first clamping arm 321. The second clamping arm 322 includes a second clamping arm body and a second clamping head, with the second clamping head located at the second end of the second clamping arm 322. The first clamping head includes a wire guiding groove and a clamping plate, while the second clamping head includes a wire mating groove and a mating plate. The clamping plate is located on the side of the wire guiding groove closest to the wire, and the mating plate is located on the side of the wire mating groove closest to the wire. The wire guiding groove and the wire mating groove form a closed converging through hole, and the clamping plate and the mating plate form a clamping and fixing through hole. The structures of the first and second clamping heads are relatively complex. The first clamping arm body and the first clamping head are separated for ease of processing. Similarly, the separation of the second clamping arm body and the second clamping head serves the same purpose. It should be noted that the axis of the converging through hole and the axis of the clamping and fixing through hole are on the same vertical axis. The opening of the wire guide groove is located close to the wire mating groove, and the width of the wire guide groove gradually narrows as it moves from the wire mating groove away from it. The wire guide groove is located inside the wire mating groove.

[0048] like Figure 1 and Figure 2 As shown in the technical solution of this embodiment, the solder paste dispensing assembly 40 includes a second driving structure 41 and a solder paste pool structure 42. The second driving structure 41 is disposed on the base 10, and the solder paste pool structure 42 is mounted on the second driving structure 41. The second driving structure 41 can drive the solder paste pool structure 42 to either a working position or a avoidance position. The setting of the solder paste dispensing assembly 40 prepares for the next step of solder dispensing. The second driving structure 41 drives the solder paste pool structure 42, thus enabling the solder paste pool structure 42 to avoid and work with the conductors. It should be noted that, under the control of the control component, the raising and lowering positions of the solder paste pool structure 42 can be controlled, thereby enabling controllable distance of the ground wire solder paste adhesion.

[0049] like Figure 1 and Figure 2As shown, in this embodiment, the soldering assembly 50 includes a third driving structure 51 and a soldering structure 52. The third driving structure 51 is disposed on the base 10, and the soldering structure 52 is disposed on the third driving structure 51. The third driving structure 51 can drive the soldering structure 52 to a working position or a avoidance position. The arrangement of the soldering assembly 50 ensures that the ground wire will not become scattered. It should be noted that the first driving structure 31, the second driving structure 41, and the third driving structure 51 are all cylinder piston drives. The driving structure can drive the driven component to move vertically and / or laterally, depending on the specific situation.

[0050] like Figure 1 and Figure 2 As shown, in this embodiment, the soldering structure 52 includes a solder pot and a solder cup, which can move vertically within the solder pot. This structure is beneficial for energy saving, material conservation, and flexible and controllable operation. The individual control of the solder cup's lifting and lowering allows for easy control of the soldering length of the ground wire. The volume of the solder cup is smaller than the volume of the solder pot, thus preventing contamination of the entire solder pot during ground wire soldering. It should be noted that the soldering structure in this embodiment also includes a protective cover, which is positioned above the solder pot to protect the safety of the equipment or operators and prevent solder from splashing out of the soldering structure 52.

[0051] like Figure 1 As shown, in this embodiment, the wire sorting device further includes a gripping component 60, which is disposed on the base 10 and located between the soldering component and the wire sorting component 30 in the wire movement direction. The soldered wires are then taken out of the transmission component 20 by the gripping component 60, thus making the automated wire sorting device highly efficient.

[0052] like Figure 1 As shown in the technical solution of this embodiment, the wire sorting device further includes a detection component 70, which is disposed on the base 10 and located between the gripping component 60 and the wire sorting component 30 in the wire movement direction. The detection component 70 can detect the wires at the workstation of the transmission component 20, preventing the occurrence of wires not being picked up by the gripping component 60.

[0053] like Figure 1 As shown, in this embodiment, the wire organizing device further includes a wire placement station, which is located between the detection component 70 and the wire organizing component 30. This structure is used for placing wires.

[0054] like Figures 1 to 3As shown in the technical solution of this embodiment, the transmission component 20 includes a turntable drive structure 21 and a turntable structure 22. The turntable drive structure 21 is mounted on the base 10 and connected to the turntable structure 22 to drive the turntable structure 22 to rotate. This structure is compact and occupies little space. The rotation of the turntable structure 22 allows for operation of the wire at multiple workstations, facilitating operator work and enabling full-process monitoring and operation without requiring long distances of movement.

[0055] like Figure 1 As shown, in this embodiment, the turntable structure 22 includes a turntable body 221 and a wire fixing part 222. The turntable body 221 is connected to the turntable drive structure 21, and the wire fixing part 222 is fixedly disposed on the upper surface of the turntable. This embodiment has six workstations, corresponding to six wire fixing parts 222. The six workstations can operate simultaneously, which greatly improves the working efficiency of the wire sorting device.

[0056] like Figure 2 As shown, in this embodiment, the turntable structure 22 further includes a wire-spreading limiting plate 223. The wire-spreading limiting plate 223 has a notch through which the wires extend downwards, and the main body of the wires is supported on the wire-spreading limiting plate 223. The wire-spreading limiting plate 223 prevents solder and solder paste from splashing out. Furthermore, the thickness of the ground wire with solder and solder paste can be limited by setting the width of the notch. It should be noted that the diameter of the ground wire is twisted between 0.8mm and 1.2mm, and the solder-spreading length of the ground wire is controlled between 7mm and 13mm.

[0057] like Figure 3 As shown in the technical solution of this embodiment, the turntable structure 22 further includes multiple support portions 224 and multiple support rollers 225. The multiple support rollers 225 are arranged one-to-one with the multiple support portions 224. The first end of each support portion 224 is fixed to the base 10, and the support roller 225 is rotatably connected to the second end of the support portion 224. The support roller 225 contacts the lower surface of the turntable body 221. This structure ensures the accuracy of the transmission assembly 20, meaning the turntable structure 22 is not easily deformed, and the support rollers 225 reduce friction. It should be noted that there are six support portions 224, corresponding to the six workstations, one for each workstation. There are also six support rollers 225.

[0058] This application also provides a method for wire arrangement, which employs the aforementioned wire arrangement apparatus. The method includes the following steps: S10 Installing wires. S20 The transmission component 20 drives the wires to the wire arrangement component 30, where the wire arrangement component 30 arranges the wires. S30 The transmission component 20 drives the wires to the solder paste application component 40, where the arranged wires are applied with solder paste. S40 The transmission component 20 drives the wires to the soldering component 50, where the solder paste-applied wires are soldered.

[0059] It should be noted that after step S40, the process also includes removing the wire and detecting the position of the removed wire.

[0060] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0061] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0062] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wire organizing device, characterized in that, include: Base (10), transmission assembly (20), wire arrangement assembly (30), solder paste application assembly (40) and solder application assembly (50); The transmission component (20), the wire organizing component (30), the solder paste application component (40), and the solder application component (50) are all mounted on the base (10). The wires are mounted on the transmission component (20). The transmission component (20) can drive the wires to move sequentially to the wire organizing component (30), the solder paste application component (40), and the solder application component (50). The wire organizing assembly (30) includes a first driving structure (31) and a wire gathering and fixing structure (32). The first driving structure (31) is connected to the wire gathering and fixing structure (32) to drive the wire gathering and fixing structure (32) to move vertically. The wire gathering and fixing structure (32) includes a first clamping arm (321) and a second clamping arm (322). The first end of the first clamping arm (321) and the first end of the second clamping arm (322) are in a state of fixing the loose wire close to each other and a state of fixing the loose wire far apart from each other. The wire gathering and fixing structure (32) further includes a first driving member (323), a pivot shaft (324), and a spring (325). The middle part of the first clamping arm (321) and the middle part of the second clamping arm (322) are rotatably connected to the pivot shaft (324). The first driving member (323) is connected to the second end of the first clamping arm (321) and the second end of the second clamping arm (322) to drive the second end of the first clamping arm (321) and the second end of the second clamping arm (322) to move closer to each other. The first end of the spring (325) is connected to the first clamping arm (321) from the pivot shaft (324) to the first end of the first clamping arm (321), and the second end of the spring (325) is connected to the second clamping arm (322) from the pivot shaft (324) to the first end of the second clamping arm (322). The wire gathering and fixing structure (32) further includes a rotary drive (326), which is fixed on the base (10), and the rotation axis of the rotary drive (326) is connected to the wire gathering and fixing structure (32). The wire gathering and fixing structure (32) opens the wire into the channel. The first driving structure (31) drives the wire gathering and fixing structure (32) to move upward. After the wire gathering and fixing structure (32) moves into place, the wire gathering and fixing structure (32) closes to achieve the constraint of the wire by the wire gathering and fixing structure (32). Then the first driving structure (31) drives the wire gathering and fixing structure (32) to move downward to gather the ground wires at a predetermined distance together. The wire gathering and fixing structure (32) also rotates while moving downward, so that the gathered ground wires are not easy to bounce or scatter. The wire organizing assembly (30) further includes a pressing structure connected to the first driving structure (31). The pressing structure includes a pressing block. The first driving structure (31) can drive the pressing block to press the wire. The specific location of the pressed wire is at the point where the ground wire is led out from the main body of the wire and is located on the main body of the wire. The pressing structure presses the copper foil. The copper foil is fixed on the main body of the wire, thereby ensuring that the ground wire structure located on the outside of the main body of the wire will not affect the internal structure of the main body of the wire and will not cause the internal wire of the main body of the wire to twist, misalign, or deform. The pressing block is driven by the second driving part.

2. The wire organizing device according to claim 1, characterized in that, The first driving member (323) includes a driving body and two connecting arms. The first ends of the two connecting arms are connected to the driving body. The second ends of the two connecting arms are respectively engaged with the second ends of the first clamping arm (321) and the second clamping arm (322) to fix the loose wire, or the second ends of the two connecting arms are respectively disengaged from the second ends of the first clamping arm (321) and the second clamping arm (322) to fix the loose wire.

3. The wire organizing device according to claim 1, characterized in that, The first clamping arm (321) includes a first clamping arm body and a first clamping head. The first clamping head is located at the second end of the first clamping arm (321). The second clamping arm (322) includes a second clamping arm body and a second clamping head. The second clamping head is located at the second end of the second clamping arm (322). The first clamping head includes a wire guiding groove and a clamping plate. The second clamping head includes a wire mating groove and a mating plate. The clamping plate is located on the side of the wire guiding groove close to the wire. The mating plate is located on the side of the wire mating groove close to the wire. The wire guiding groove and the wire mating groove form a closed converging through hole. The clamping plate and the mating plate form a clamping and fixing through hole.

4. The wire organizing device according to claim 1, characterized in that, The solder paste dispensing assembly (40) includes a second driving structure (41) and a solder paste pool structure (42). The second driving structure (41) is disposed on the base (10), and the solder paste pool structure (42) is mounted on the second driving structure (41). The second driving structure (41) can drive the solder paste pool structure (42) to be in a working position or a avoidance position.

5. The wire organizing device according to claim 1, characterized in that, The tinning assembly (50) includes a third driving structure (51) and a tinning structure (52). The third driving structure (51) is disposed on the base (10), and the tinning structure (52) is disposed on the third driving structure (51). The third driving structure (51) can drive the tinning structure (52) to be in a working position or an avoidance position.

6. The wire organizing device according to claim 5, characterized in that, The tinning structure (52) includes a tin furnace and a tin cup, the tin cup being vertically movable within the tin furnace.

7. The wire organizing device according to claim 1, characterized in that, The wire organizing device further includes a gripping component (60), which is disposed on the base (10) and located between the soldering component and the wire organizing component (30) in the wire moving direction.

8. The wire organizing device according to claim 7, characterized in that, The wire organizing device further includes a detection component (70), which is disposed on the base (10) and located between the gripping component (60) and the wire organizing component (30) in the wire moving direction.

9. The wire organizing device according to claim 8, characterized in that, The wire sorting device further includes a wire placement station, which is located between the detection component (70) and the wire sorting component (30).

10. The wire organizing device according to any one of claims 1 to 9, characterized in that, The transmission component (20) includes a turntable drive structure (21) and a turntable structure (22). The turntable drive structure (21) is disposed on the base (10) and connected to the turntable structure (22) to drive the turntable structure (22) to rotate.

11. The wire organizing device according to claim 10, characterized in that, The turntable structure (22) includes a turntable body (221) and a wire fixing part (222). The turntable body (221) is connected to the turntable drive structure (21), and the wire fixing part (222) is fixedly disposed on the upper surface of the turntable body (221).

12. The wire organizing device according to claim 11, characterized in that, The turntable structure (22) also includes a wire guide plate (223), which has a notch through which the wire extends downward and the main body of the wire is supported on the wire guide plate (223).

13. The wire organizing device according to claim 12, characterized in that, The turntable structure (22) also includes multiple support parts (224) and multiple support rollers (225). The multiple support rollers (225) are arranged in a one-to-one correspondence with the multiple support parts (224). The first end of the support part (224) is fixed on the base (10), and the support roller (225) is rotatably connected to the second end of the support part (224). The support roller (225) is in contact with the lower surface of the turntable body (221).

14. A method for arranging wires, characterized in that, The wire arrangement method employs the wire arrangement apparatus according to any one of claims 1 to 13, and the wire arrangement method includes the following steps: S10 installation wires; The S20 transmission component (20) drives the wire to move to the wire organizing component (30), and the wire organizing component (30) organizes the wire; The S30 transmission component (20) drives the wire to move to the solder paste application component (40) and applies solder paste to the tidied wire; The S40 transmission component (20) drives the wire to move to the soldering component (50) to solder the wire with solder paste.

15. The method for arranging wires according to claim 14, characterized in that, After step S40, the method further includes removing the wire and detecting the position of the removed wire.

Images