Galvanometer swing adjustment method and related device

Abstract

The embodiment of the application discloses a mirror swing adjustment method and related equipment, which is applied to a mirror swing adjustment device. The method comprises the following steps: guiding the machining laser to a laser processing range through a first mirror, establishing a first corresponding relationship between a reference coordinate system of the laser processing range and a first angle swing coordinate range of the first mirror; dividing the laser processing range in the reference coordinate system into regions to obtain P calibration selected areas of the laser processing range; determining a first mirror swing angle coordinate of the first mirror corresponding to a target point in Q calibration selected areas in the P calibration selected areas according to the first corresponding relationship to obtain Q first mirror swing angle coordinates; and establishing a second corresponding relationship between the reference coordinate system of the laser processing range and a second mirror angle swing coordinate range of a second mirror according to the Q first mirror swing angle coordinates. The embodiment of the application realizes real-time alignment of the measuring light and the keyhole position.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a galvanometer swing adjustment method and related equipment. BACKGROUND

[0002] In practical applications, the galvanometer laser welding increases the galvanometer and its control system on the basis of the collimated focused laser welding, uses the galvanometer to realize the rapid scanning and deflection of the laser, increases the accessibility of the laser, cooperates with the powerful professional software of graphic processing, realizes the instantaneous multi-point welding of program control, and effectively improves the production efficiency and flexibility. However, due to the rapid deflection of the welding spot in the galvanometer laser welding, new requirements are put forward for the real-time detection of the penetration depth in the welding process.

[0003] For the galvanometer laser welding system, the direction and position of the processing laser are constantly changing during the welding process. Even if the optical path is strictly adjusted to make the measurement light and the processing laser accurately coincide after passing through the beam combiner, due to the different aberrations of the field lens for different wavelengths of light, the measurement light and the processing laser do not coincide on the welding surface. The farther away from the center point of the surface, the greater the distance deviation of the measurement light and the processing laser. If a second galvanometer is used to scan and deflect the measurement light, the measurement light does not coincide with the processing laser after the beam combiner, and the direction and light entry point of the measurement light entering the laser welding galvanometer are different from those of the processing laser. It is necessary to consider the light exit direction of the measurement light in real time again. In addition to the aberration of the field lens for the measurement light and the processing laser, the whole system becomes more complex, and it is difficult for the measurement light to find the keyhole of the molten pool. Therefore, the real-time alignment of the measurement light and the keyhole position becomes a new calibration problem. Therefore, how to realize the real-time alignment of the measurement light and the keyhole position is an urgent problem to be solved. SUMMARY

[0004] The embodiment of the present application provides a galvanometer swing adjustment method and related equipment, which can realize the real-time alignment of the measurement light and the keyhole position.

[0005] In a first aspect, the embodiment of the present application provides a galvanometer swing adjustment method applied to a galvanometer swing adjustment device, the galvanometer swing adjustment device comprising a first galvanometer and a second galvanometer, the first galvanometer being used to adjust the pointing direction of the processing laser input through a laser processing head, and the second galvanometer being used to adjust the pointing direction of the measurement light input through an optical sensor, and the method comprising:

[0006] directing the processing laser to a laser processing surface through the first galvanometer, and establishing a first correspondence between a reference coordinate system of the laser processing surface and a first angle swing coordinate range of the first galvanometer;

[0007] regionally dividing the laser processing surface in the reference coordinate system to obtain P calibration selected areas of the laser processing surface, P being an integer greater than 1.

[0008] determining target points in Q calibration sub-regions of the P calibration sub-regions, determining first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration sub-regions according to the first correspondence, obtaining Q first galvanometer swing angle coordinates, Q being an integer greater than 1 and Q being less than or equal to P;

[0009] guiding the measurement light to the laser processing surface through the second galvanometer and the first galvanometer adjusted by the Q first galvanometer swing angle coordinates in sequence, and determining second galvanometer angle swing coordinate ranges of the Q second galvanometers;

[0010] establishing a second correspondence between the reference coordinate system of the laser processing surface and the second galvanometer angle swing coordinate ranges of the second galvanometer according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges, so as to determine the swing coordinate ranges of the second galvanometer in the reference coordinate system.

[0011] In a second aspect, an embodiment of the present application provides a galvanometer swing adjustment device, which comprises a first galvanometer and a second galvanometer, the first galvanometer is used to adjust the pointing direction of processing laser input through a laser processing head, the second galvanometer is used to adjust the pointing direction of measurement light input through an optical sensor, and the device comprises a first establishing unit, a dividing unit, a determining unit and a second establishing unit, wherein,

[0012] the first establishing unit is configured to guide the processing laser to a laser processing surface through the first galvanometer, and establish a first correspondence between a reference coordinate system of the laser processing surface and first angle swing coordinate ranges of the first galvanometer;

[0013] the dividing unit is configured to divide the laser processing surface in the reference coordinate system to obtain P calibration sub-regions of the laser processing surface, P being an integer greater than 1;

[0014] the determining unit is configured to determine target points in Q calibration sub-regions of the P calibration sub-regions, determine first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration sub-regions according to the first correspondence, obtain Q first galvanometer swing angle coordinates, Q being an integer greater than 1 and Q being less than or equal to P, guide the measurement light to the laser processing surface through the second galvanometer and the first galvanometer adjusted by the Q first galvanometer swing angle coordinates in sequence, and determine second galvanometer angle swing coordinate ranges of the Q second galvanometers;

[0015] The second establishing unit is configured to establish a second correspondence relationship between a reference coordinate system of the laser processing range and a second swing coordinate range of the second galvanometer according to the Q first galvanometer swing angle coordinates and the Q second galvanometer swing coordinate ranges, so as to determine the swing coordinate range of the second galvanometer in the reference coordinate system.

[0016] In a third aspect, an embodiment of the present application provides a galvanometer swing adjustment device, including a processor, a memory, a communication interface and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for executing the steps in the first aspect of the embodiments of the present application.

[0017] In a fourth aspect, an embodiment of the present application provides a computer readable storage medium, wherein the computer readable storage medium stores a computer program for electronic data exchange, and the computer program causes a computer to perform some or all of the steps described in the first aspect of the embodiments of the present application.

[0018] In a fifth aspect, an embodiment of the present application provides a computer program product, which includes a non-transitory computer readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute some or all of the steps described in the first aspect of the embodiments of the present application. The computer program product can be a software installation package.

[0019] The embodiments of the present application have the following beneficial effects:

[0020] It can be seen that the mirror swing adjustment method and related device described in the embodiments of the present application are applied to a mirror swing adjustment device, the mirror swing adjustment device includes a first mirror and a second mirror, the first mirror is used to adjust the pointing direction of the machining laser input through a laser machining head, the second mirror is used to adjust the pointing direction of the measurement light input through an optical sensor, the machining laser is guided to a laser machining area through the first mirror, a first correspondence relationship between a reference coordinate system of the laser machining area and a first angle swing coordinate range of the first mirror is established, the laser machining area is regionally divided in the reference coordinate system, P calibration selected areas of the laser machining area are obtained, P is an integer greater than 1, target points in Q calibration selected areas of the P calibration selected areas are determined, the first mirror swing angle coordinates of the target points in the Q calibration selected areas corresponding to the target points are determined according to the first correspondence relationship, Q first mirror swing angle coordinates are obtained, Q is an integer greater than 1 and Q is less than or equal to P, the measurement light is guided to the laser machining area through the second mirror and the first mirror adjusted according to the Q first mirror swing angle coordinates in turn, a second mirror angle swing coordinate range of the Q second mirrors is determined, and a second correspondence relationship between the reference coordinate system of the laser machining area and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate range, so as to determine the swing coordinate range of the second mirror in the reference coordinate system, that is, in the application scene of the two mirrors, the laser machining area can be regionally divided when the second mirror is calibrated, the first mirror is calibrated in different regions respectively, and then the correspondence relationship between the entire laser machining area reference coordinate system and the second mirror angle swing coordinate range is established, so that the real-time alignment of the measurement light and the keyhole position can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 is a structural schematic diagram of a mirror swing adjustment device provided by an embodiment of the present application;

[0023] Figure 2 is a structural schematic diagram of another mirror swing adjustment device provided by an embodiment of the present application;

[0024] Figure 3 is a flowchart of a mirror swing adjustment method provided by an embodiment of the present application;

[0025] Figure 4is a demonstration schematic diagram of regional segmentation provided by an embodiment of the present application;

[0026] Figure 5 is another demonstration schematic diagram of regional segmentation provided by an embodiment of the present application;

[0027] Figure 6 is a structural schematic diagram of another galvanometer swing adjustment device provided by an embodiment of the present application;

[0028] Figure 7 is a functional unit component block diagram of a galvanometer swing adjustment device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without creative labor fall within the scope of protection of the present application.

[0030] The terms "first", "second", and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, and are not used to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0031] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor does it necessarily exclude other embodiments that are not explicitly described. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] The embodiments of the present application will be described in detail below.

[0033] Please refer to Figures 1-2 , Figures 1-2 is a structural schematic diagram of a galvanometer swing adjustment device provided by an embodiment of the present application. In which, Figure 1 The galvanometer swing adjustment device 100 in the embodiment of the present application includes a first galvanometer 101 and a second galvanometer 102, and further, as shown in Figure 2As shown, the laser processing head of the first galvanometer 101 is used for inputting processing laser, and the second galvanometer 102 is used for inputting measurement light. The galvanometer swing adjustment device 100 can further include a collimating mirror 103 and a beam combining mirror 104, the collimating mirror 103 is used for collimating operation of the measurement light. The beam combining mirror 104 is used for combining the processing laser and the light beam from the second galvanometer 102.

[0034] In the embodiment of the present application, the galvanometer swing adjustment device 100 can include a laser processing head 105 with the first galvanometer 101, and an optical sensor 106 connected to the laser processing head 105, and can further include the second galvanometer 102, that is, the laser processing head 105 can include the first galvanometer 101 and the beam combining mirror 104, and the optical sensor 106 can include the collimating mirror 103 and the second galvanometer 102.

[0035] The laser processing head 105 of the first galvanometer 101 can be used for inputting processing laser, and the processing laser is guided to the laser processing surface through the internal first galvanometer 101, and the pointing direction of the processing laser is adjusted by the swing of the first galvanometer 101 when adjusting the laser processing path.

[0036] The optical sensor 106 can be used for outputting measurement light to the laser processing head 105, and the coaxial optical path design of the processing laser and the measurement light is usually required. In this way, the measurement light can keep coinciding or aligning with the processing laser when the processing laser is processed, and then the signal reflected from the laser processing surface can be effectively detected by the optical sensor.

[0037] In the actual processing, in one case, the measurement light can be measurement laser. The measurement laser can be turned off, and only used for calibration in the early stage. In another case, the measurement laser can be always turned on to track the processing process of the processing laser; in this way, the optical sensor can detect the processing laser reflected from the laser processing surface and the measurement laser reflected, and then the optical sensor can identify and process the related signals respectively.

[0038] In the above two cases, in order to realize effective detection of the processing quality of the processing laser, the measurement laser and the processing laser need to be coincided or aligned, and therefore the coordinate calibration of the first galvanometer and the second galvanometer is required for calibrating the light path turning adjustment device (galvanometer) involved in the optical path. The swing angle of the galvanometer is controlled to realize the coincidence or alignment of the optical path.

[0039] Please refer to Figure 3 , Figure 3 is a flowchart of a galvanometer swing adjustment method provided by the embodiment of the present application, which is applied to the galvanometer swing adjustment device 100 as shown in Figures 1-2The mirror swing adjustment device in the mirror swing adjustment method includes a first mirror and a second mirror, the first mirror is used to adjust the pointing direction of the machining laser input through the laser machining head, and the second mirror is used to adjust the pointing direction of the measurement light input through the optical sensor.

[0040] 301. The machining laser is guided to the laser machining surface through the first mirror, and a first correspondence relationship between the reference coordinate system of the laser machining surface and the first angle swing coordinate range of the first mirror is established.

[0041] The laser machining surface can correspond to a reference coordinate system.

[0042] In the embodiment of the present application, the first mirror can be fixed, and in the fixed state, the machining laser can be guided to the laser machining surface through the first mirror, and then the first correspondence relationship between the reference coordinate system of the laser machining surface and the first angle swing coordinate range of the first mirror is established.

[0043] 302. The laser machining surface is regionally divided in the reference coordinate system to obtain P calibration selected areas of the laser machining surface, and P is an integer greater than 1.

[0044] In the embodiment of the present application, a virtual plane or a virtual three-dimensional figure can be set in the reference coordinate system, and then the laser machining surface is regionally divided in the reference coordinate system based on the virtual plane or the virtual three-dimensional figure to obtain P calibration selected areas of the laser machining surface, and P is an integer greater than 1.

[0045] In the embodiment of the present application, the regional division can be understood as dot matrix distribution or linear array distribution, and the regional division can be applied to a two-dimensional plane or a three-dimensional space.

[0046] 303. A target point in Q calibration selected areas of the P calibration selected areas is determined, the first mirror swing angle coordinate of the first mirror corresponding to the target point in the Q calibration selected areas is determined according to the first correspondence relationship, Q first mirror swing angle coordinates are obtained, and Q is an integer greater than 1 and less than or equal to P.

[0047] In the specific implementation, Q is an integer greater than 1 and less than or equal to P, that is, part or all of the calibration selected areas can be used for calibration.

[0048] Specifically, target points in Q calibration regions in the P calibration regions can be determined, where the target points are one or more, for example, when the calibration region is a virtual plane, the target points can be vertices of the virtual plane, and for another example, when the calibration region is a virtual cuboid, the target points can be vertices of the virtual cuboid, and then, first galvanometer oscillation angle coordinates of the first galvanometer corresponding to the target points in the Q calibration regions are determined according to the first correspondence relationship, to obtain Q first galvanometer oscillation angle coordinates, where Q is an integer greater than 1 and less than or equal to P. It can be understood that when Q is equal to P, the entire region of the entire reference coordinate system is directly calibrated.

[0049] 304, guiding the measurement light to the laser processing plane through the second galvanometer and the first galvanometer with the adjusted Q first galvanometer oscillation angle coordinates in sequence, to determine a second galvanometer angle oscillation coordinate range of the Q second galvanometers.

[0050] In the embodiments of the present application, in specific implementation, the measurement light can be guided to the laser processing plane through the second galvanometer and the first galvanometer with the adjusted Q first galvanometer oscillation angle coordinates in sequence, to determine a second galvanometer angle oscillation coordinate range of the Q second galvanometers, and then, a second correspondence relationship between the reference coordinate system of the laser processing plane and the second galvanometer angle oscillation coordinate range of the second galvanometer can be established for subsequent establishment.

[0051] 305, establishing a second correspondence relationship between the reference coordinate system of the laser processing plane and the second galvanometer angle oscillation coordinate range of the second galvanometer according to the Q first galvanometer oscillation angle coordinates and the Q second galvanometer angle oscillation coordinate ranges, to determine a second galvanometer angle oscillation coordinate range of the second galvanometer in the reference coordinate system.

[0052] In the embodiments of the present application, the second correspondence relationship between the reference coordinate system of the laser processing plane and the second galvanometer angle oscillation coordinate range of the second galvanometer can be established according to the Q first galvanometer oscillation angle coordinates and the Q second galvanometer angle oscillation coordinate ranges, that is, in the application scenario of the two galvanometers, the laser processing plane can be divided into regions when the second galvanometer is calibrated, and the first galvanometer can be calibrated in different regions respectively, and then, the correspondence relationship between the entire laser processing plane reference coordinate system and the second galvanometer angle oscillation coordinate range can be established, so that the real-time alignment of the measurement light and the actual processing position of the processing laser (which can be the laser welding keyhole position) can be realized.

[0053] In specific implementation, one-dimensional linear relationship corresponds to two points, two-dimensional plane calibration relationship corresponds to multiple points surrounding a certain plane region, and three-dimensional space calibration relationship can be formed by a space region surrounded by multiple points.

[0054] The embodiments of the present application can be applied to at least one of the following scenarios: laser processing field, including laser welding, laser cutting field, laser 3D printing, etc., without limitation.

[0055] Optionally, the step 302 of regionally dividing the laser processing surface in the reference coordinate system to obtain P calibration selected areas of the laser processing surface can be implemented in the following manner:

[0056] The laser processing surface is divided into four quadrants with a first preset center point as the coordinate origin and the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and the surface of any quadrant is equally divided into M*M grids, each grid corresponding to a calibration selected area, and M is an integer greater than 1.

[0057] The first preset center point can be pre-set or system default, for example, any point in the laser processing surface can be taken as the first preset center point. Generally, a single galvanometer has an X mirror and a Y mirror, the X mirror is used to realize the deflection of the X axis on the laser processing surface, and the Y mirror is used to realize the deflection of the Y axis on the laser processing surface.

[0058] Specifically, the laser processing surface can be divided into four quadrants with a first preset center point as the coordinate origin and the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and the surface of any quadrant is equally divided into M*M grids, each grid corresponding to a calibration selected area, and M is an integer greater than 1, for example, M is 3, and then 3*3 grids can be obtained.

[0059] Optionally, the step 303 of determining target points in Q calibration selected areas in the P calibration selected areas and determining the first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence can include the following steps:

[0060] A31, selecting Q calibration selected areas in the P calibration selected areas;

[0061] A32, selecting a target point in each region in the Q calibration selected areas, and determining the first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the target point and the first correspondence.

[0062] In a specific implementation, Q calibration selected areas are selected in the P calibration selected areas, the Q calibration selected areas are any Q calibration selected areas in the P calibration selected areas, then a target point can be selected in each region in the Q calibration selected areas, the target point can be one or more, for example, the vertices of the region where the target point is located, and then the first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas are determined according to the target point and the first correspondence.

[0063] Optionally, the step 305 of establishing the second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges can be implemented in the following manner:

[0064] The second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates based on the bilinear interpolation method.

[0065] In a specific implementation, the second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror can be established according to the Q first mirror swing angle coordinates based on the bilinear interpolation method, so that real-time alignment of the measurement light and the keyhole position can be achieved.

[0066] Optionally, the step of establishing the second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges based on the bilinear interpolation method can include the following steps:

[0067] A51, a reference first mirror swing angle coordinate is obtained, the reference first mirror swing angle coordinate being any first mirror swing angle coordinate of the Q first mirror swing angle coordinates;

[0068] A52, K reference target points of a calibration selected area corresponding to the reference first mirror swing angle coordinate are obtained, the second mirror is deflected to deflect the measurement light to the K reference target points, K being an integer greater than 1, to obtain K deflection angles;

[0069] A53, a first functional relationship between the reference first mirror swing angle coordinate and the K reference target points is established;

[0070] A54, the second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror is established according to the K deflection angles, the first functional relationship, and the second mirror angle swing coordinate range corresponding to the reference first mirror swing angle coordinate based on the bilinear interpolation method.

[0071] In a specific implementation, the embodiments of the present application can be used for calibration of alignment of measurement light and a mirror laser head.

[0072] Specifically, taking the reference first galvanometer swing angle coordinates (α, β) as an example, these reference first galvanometer swing angle coordinates (α, β) are any one of the Q first galvanometer swing angle coordinates. K reference target points in the calibration selection area corresponding to the reference first galvanometer swing angle coordinates (α, β) are obtained. The second galvanometer is used to deflect the measurement light to reach the K reference target points, resulting in K deflection angles, where K is an integer greater than 1 (e.g., K can be 4). A first functional relationship is established between the reference first galvanometer swing angle coordinates and the K reference target points, thus locking the target points. Then, based on bilinear interpolation, according to the K deflection angles, the first functional relationship, and the range of second galvanometer swing angle coordinates corresponding to the reference first galvanometer swing angle coordinates, a second correspondence is established between the reference coordinate system of the laser processing area and the range of second galvanometer swing angle coordinates of the second galvanometer.

[0073] In this embodiment, the calibration of the welding area of ​​the galvanometer laser head is fundamental to the normal operation of galvanometer-type laser welding. Regarding the calibration of the welding area of ​​the galvanometer-type laser welding, in this embodiment, it can be assumed that the welding area (i.e., the laser processing area) of the processing laser head of the first galvanometer is in a calibrated and usable state.

[0074] In practice, the alignment of the processing light and the measurement light can be calibrated on the welding plane where the galvanometer laser head is working normally (commonly taking the 0 defocus plane as an example). The calibration is performed using bilinear interpolation, and the steps are as follows:

[0075] 1. Divide the laser processing area of ​​the first galvanometer into four quadrants with the center point as the origin (0, 0) and the plane scanning direction of the first galvanometer as the x-axis and y-axis. Then, divide the area of ​​any quadrant into 3*3 or 10*10 small squares. The number of subdivisions can be determined by the user; a higher number of subdivisions results in higher calibration accuracy. Figure 4 Taking the 3*3 division as an example, we get a 4*4 dot matrix. Assume that the coordinates of A11 are (x1, y1), the coordinates of A12 are (x1, y2), and so on. Let x3-x2=x2-x1=x1-0=i, y3-y2=y2-y1=y1-0=j.

[0076] 2. Select one of the squares, for example, a square composed of A11(x1, y1), A12(x1, y2), A21(x2, y1), and A22(x2, y2), with its center point being A(x1+i / 2, y1+j / 2). Mark this point with the processing laser head of the first galvanometer (mark a cross or a dot), and then keep the angle of the first galvanometer fixed at this position.

[0077] 3, scan the measurement light to the area near point A by the second galvanometer, find the deflection angle of the second galvanometer when the measurement light reaches A11, A12, A21, A22, respectively, let the deflection angle of the measurement light at A11 be (α1, β1), the deflection angle at A12 be (α2, β2), the deflection angle at A21 be (α3, β3), and the deflection angle at A22 be (α4, β4).

[0078] 4, get the relationship between the position in the square area and the deflection angle of the second galvanometer by the method of bilinear interpolation,

[0079] α=a00+a01x+a10y+a11xy

[0080] β=b00+b01x+b10y+b11xy

[0081] Wherein, the coefficients a00, a01, a10, a11 and the coefficients b00, b01, b10, b11 are calculated by the least square method.

[0082]

[0083]

[0084]

[0085] 5, select other squares in the area of the frame in turn, repeat steps 2-4, and record the deflection angle of the second galvanometer corresponding to the deflection of the galvanometer laser head at the center of each square.

[0086] In the embodiment of the application, when the angle of the galvanometer laser head is deflected in each small square of the welding frame, the deflection angle of the second galvanometer at this time can be obtained according to the coordinates of the measurement light, so as to accurately control the specific position of the measurement light after passing through the galvanometer laser head.

[0087] Optionally, the step 302 is implemented in the following manner:

[0088] Divide the laser processing frame into solid quadrants with the second preset center point as the coordinate origin, the scanning direction of the X mirror and the Y mirror as the x axis and the y axis, and the direction perpendicular to the frame as the z axis, and divide the frame in any quadrant of the XY plane into N*N small squares, set the height of the z axis, and get N*N rectangular solids, each of which corresponds to a calibration selected area.

[0089] Wherein, the second preset center point can be pre-set or system default, for example, any point in the laser processing frame can be used as the second preset center point.

[0090] Specifically, the laser processing plane can be divided into solid quadrants with the second preset center point as the coordinate origin, the scanning directions of the X mirror and the Y mirror as the x-axis and the y-axis, and the direction perpendicular to the plane as the z-axis, and the plane in any quadrant of the XY plane can be equally divided into N*N small squares, the height of the z-axis is set, and N*N rectangular solids are obtained, each of which corresponds to a calibration selection area. In this way, multiple small rectangular solids can be obtained, and calibration can be performed based on each rectangular solid.

[0091] Optionally, the step 303 of determining the target points in the Q calibration selection areas in the P calibration selection areas according to the first correspondence relationship to determine the first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selection areas can include the following steps:

[0092] B31, selecting the Q calibration selection areas in the P calibration selection areas;

[0093] B32, selecting a center point in each area in the Q calibration selection areas as a target point, and determining the first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selection areas according to the target points and the first correspondence relationship.

[0094] In the embodiments of the present application, the Q calibration selection areas are selected from the P calibration selection areas, the Q calibration selection areas are any Q calibration selection areas in the P calibration selection areas, a center point (such as a region center) is selected in each area in the Q calibration selection areas as a target point, for example, each vertex of the calibration selection area, and the first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selection areas are determined according to the target points and the first correspondence relationship.

[0095] Optionally, the step 305 of establishing the second correspondence relationship between the reference coordinate system of the laser processing plane and the second galvanometer angle swing coordinate range of the second galvanometer according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate range to determine the swing coordinate range of the second galvanometer in the reference coordinate system can be implemented in the following manner:

[0096] According to the Q first galvanometer swing angle coordinates, the second correspondence relationship between the reference coordinate system of the laser processing plane and the second galvanometer angle swing coordinate range of the second galvanometer is established based on the trilinear interpolation method.

[0097] In specific implementation, the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror can be established based on the trilinear interpolation method according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges. In this way, real-time alignment of the measurement light and the keyhole position can be achieved.

[0098] Optionally, the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror can be established based on the trilinear interpolation method according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges, and can include the following steps:

[0099] B51, obtaining a target first mirror swing angle coordinate, the target first mirror swing angle coordinate being any one of the Q first mirror swing angle coordinates;

[0100] B52, obtaining W reference target points of a calibration selected area corresponding to the target first mirror swing angle coordinate, deflecting the measurement light to the W reference target points by the second mirror to obtain W deflection angles, W being an integer greater than 1;

[0101] B53, establishing a second functional relationship between the target first mirror swing angle coordinate and the W reference target points;

[0102] B54, establishing the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror based on the trilinear interpolation method according to the W deflection angles, the second functional relationship, and the second mirror angle swing coordinate range corresponding to the target first mirror swing angle coordinate.

[0103] In specific implementation, the target first mirror swing angle coordinate (α, β) can be taken as an example, the target first mirror swing angle coordinate being any one of the Q first mirror swing angle coordinates. W reference target points of a calibration selected area corresponding to the target first mirror swing angle coordinate (α, β) are obtained, the measurement light is deflected to the W reference target points by the second mirror to obtain W deflection angles, W being an integer greater than 1. A second functional relationship between the target first mirror swing angle coordinate and the W reference target points is established, i.e., the target points are locked. The second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established based on the trilinear interpolation method according to the W deflection angles, the second functional relationship, and the second mirror angle swing coordinate range corresponding to the target first mirror swing angle coordinate.

[0104] In the embodiments of the present application, if the welding workpiece to be detected has a certain height difference, or welding needs to be performed within a certain defocusing range, the certain height difference can be understood as the height difference of the welding workpiece being greater than a preset height difference, and the preset height difference can be preset or defaulted by the system. In addition, the certain defocusing range can be understood as the defocusing amount being within a preset range, and the preset range can be preset or defaulted by the system. In this case, a three-linear difference method can be used for calibration, and the specific steps are as follows:

[0105] 1. The laser processing range of the first galvanometer is set with the center point as the (0, 0, 0) coordinate origin, the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and the direction perpendicular to the range as the z axis. The range in any quadrant of the XY plane is equally divided into 3*3 or 10*10 small squares, and the number of subdivision can be determined by the user. The more the number of subdivision is, the higher the calibration accuracy is. Then, each square is extended along the direction parallel to the Z axis to form a cuboid. Because the range of the galvanometer laser head, i.e., the XY plane, is usually more than 100*100 mm, and the range of the Z axis is only about plus or minus 5 mm, the 3*3 division in the range of 100*100 mm is taken as an example to obtain 9 small cuboids. Assuming that the coordinates of A1 are (x1, y1, z1), the coordinates of A2 are (x1, y1, z2), the coordinates of A3 are (x1, y2, z1), the coordinates of A4 are (x1, y2, z2), the coordinates of A5 are (x2, y1, z1), the coordinates of A6 are (x2, y1, z2), the coordinates of A7 are (x2, y2, z1), the coordinates of A8 are (x2, y2, z2), and so on, let x3-x2=x2-x1=x1-0=i, y3-y2=y2-y1=y1-0=j, z3-z2=z2-z1=z1-0=k. Figure 5

[0106] 2. One of the cuboids is selected, and the center point of the lower base thereof is taken as A0(x1+i / 2, y1+j / 2, z1). The processing laser head of the first galvanometer is used to mark (make a cross point or a circle point) at this point, and then the angle of the first galvanometer is kept at this position.

[0107] ​3, the second galvanometer scanning deflection measurement light to reach the A point near the region, respectively, find the measurement light to reach A1, A3, A5, A7 four points when the second galvanometer deflection angle, let the measurement light in A1 point deflection angle is (α1, β1), in A3 point deflection angle is (α3, β3), in A5 point deflection angle is (α5, β5), in A7 point deflection angle is (α7, β7), with a height of k workpiece placed on the calibration surface XY plane, with the second galvanometer scanning deflection measurement light to reach A2, A4, A6, A8, record the measurement light in A2 point deflection angle is (α2, β2), in A4 point deflection angle is (α4, β4), in A6 point deflection angle is (α6, β6), in A8 point deflection angle is (α8, β8).

[0108] 4, the method of trilinear interpolation to get this cuboid region position and the relationship between the second galvanometer deflection angle:

[0109] α=a0+a1x+a2y+a3z+a4xy+a5xz+a6yz+a7xyz

[0110] β=b0+b1x+b2y+b3z+b4xy+b5xz+b6yz+b7xyz

[0111] Further, the coordinates of the 8 points, in the form of matrix:

[0112]

[0113]

[0114] 5, in turn, select other cuboid in the welding area, repeat steps 2-4, record the galvanometer laser head deflection in each cuboid under the surface center position corresponding to the second galvanometer deflection angle calibration value.

[0115] In the embodiment of the present application, when the angle of the galvanometer laser head deflection in each cuboid of the welding area, the deflection angle of the second galvanometer can be obtained according to the coordinates of the measurement light, so as to accurately control the specific position of the measurement light after passing through the galvanometer laser head.

[0116] It can be seen that the mirror swing adjustment method described in the embodiment of the application is applied to a mirror swing adjustment device, the mirror swing adjustment device includes a first mirror and a second mirror, the first mirror is used to adjust a pointing direction of machining laser input through a laser machining head, the second mirror is used to adjust a pointing direction of measurement light input through an optical sensor, the machining laser is guided to a laser machining area through the first mirror, a first correspondence relationship between a reference coordinate system of the laser machining area and a first angle swing coordinate range of the first mirror is established, the laser machining area is regionally divided in the reference coordinate system, P calibration selected areas of the laser machining area are obtained, P is an integer greater than 1, target points in Q calibration selected areas of the P calibration selected areas are determined, the first mirror swing angle coordinates of the target points in the Q calibration selected areas corresponding to the target points are determined according to the first correspondence relationship, Q first mirror swing angle coordinates are obtained, Q is an integer greater than 1 and Q is less than or equal to P, the measurement light is guided to the laser machining area through the second mirror and the first mirror adjusted according to the Q first mirror swing angle coordinates in turn, a second mirror angle swing coordinate range of the Q second mirrors is determined, and a second correspondence relationship between the reference coordinate system of the laser machining area and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate range, so as to determine the swing coordinate range of the second mirror in the reference coordinate system, that is, in the application scene of the two mirrors, the laser machining area can be regionally divided when the second mirror is calibrated, the first mirror is calibrated in different regions respectively, and then the correspondence relationship between the reference coordinate system of the entire laser machining area and the second mirror angle swing coordinate range is established, so that real-time alignment of the measurement light and the keyhole position can be realized.

[0117] Consistent with the above embodiment, please refer to Figure 6 , Figure 6 is another structure diagram of a mirror swing adjustment device 600 provided by the embodiment of the application, as shown in the figure, the mirror swing adjustment device 600 includes a processor 601, a memory 602, a communication interface 603 and one or more programs 604, the mirror swing adjustment device 600 can also include a first mirror and a second mirror, the first mirror is used to adjust a pointing direction of machining laser input through a laser machining head, the second mirror is used to adjust a pointing direction of measurement light input through an optical sensor, the above one or more programs 604 are stored in the above memory and are configured to be executed by the above processor 601, in the embodiment of the application, the program includes instructions for executing the following steps:

[0118] the machining laser is guided to a laser machining area through the first mirror, a first correspondence relationship between a reference coordinate system of the laser machining area and a first angle swing coordinate range of the first mirror is established;

[0119] dividing the laser processing surface in the reference coordinate system to obtain P calibration selected areas of the laser processing surface, P being an integer greater than 1;

[0120] determining target points in Q calibration selected areas of the P calibration selected areas, determining first galvanometer oscillation angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence relationship, to obtain Q first galvanometer oscillation angle coordinates, Q being an integer greater than 1 and Q being less than or equal to P;

[0121] guiding the measuring light to the laser processing surface through the second galvanometer and the first galvanometer with the Q first galvanometer oscillation angle adjustments in sequence, and determining second galvanometer angle oscillation coordinate ranges of the Q second galvanometers;

[0122] establishing a second correspondence relationship between the reference coordinate system of the laser processing surface and the second galvanometer angle oscillation coordinate ranges of the second galvanometer according to the Q first galvanometer oscillation angle coordinates and the Q second galvanometer angle oscillation coordinate ranges, to determine the oscillation coordinate ranges of the second galvanometer in the reference coordinate system.

[0123] Optionally, in the aspect of dividing the laser processing surface in the reference coordinate system to obtain P calibration selected areas of the laser processing surface, the above program includes instructions for performing the following steps:

[0124] dividing the laser processing surface into four quadrants with a first preset center point as the coordinate origin, with the scanning directions of the X galvanometer and the Y galvanometer as the x axis and the y axis, and equally dividing the surface of any quadrant into M*M squares, each square corresponding to a calibration selected area, M being an integer greater than 1.

[0125] Optionally, in the aspect of determining target points in Q calibration selected areas of the P calibration selected areas, and determining first galvanometer oscillation angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence relationship, the above program includes instructions for performing the following steps:

[0126] selecting the Q calibration selected areas from the P calibration selected areas;

[0127] selecting a target point in each area of the Q calibration selected areas, and determining first galvanometer oscillation angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the target point and the first correspondence relationship.

[0128] Optionally, in the establishing the second correspondence relationship between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges, the above procedure includes instructions for performing the following steps:

[0129] The second correspondence relationship between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges based on a bilinear interpolation method.

[0130] Optionally, in the establishing the second correspondence relationship between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges based on the bilinear interpolation method, the above procedure includes instructions for performing the following steps:

[0131] A reference first mirror swing angle coordinate is obtained, the reference first mirror swing angle coordinate being any one of the Q first mirror swing angle coordinates;

[0132] K reference target points of a calibration selected area corresponding to the reference first mirror swing angle coordinate are obtained, and the second mirror is deflected to measure light so that the light reaches the K reference target points, thereby obtaining K deflection angles, K being an integer greater than 1;

[0133] A first functional relationship between the reference first mirror swing angle coordinate and the K reference target points is established;

[0134] The second correspondence relationship between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror is established according to the K deflection angles, the first functional relationship, and the second mirror angle swing coordinate range corresponding to the reference first mirror swing angle coordinate based on the bilinear interpolation method.

[0135] Optionally, in the region segmentation of the laser processing area in the reference coordinate system, thereby obtaining P calibration selected areas of the laser processing area, the above procedure includes instructions for performing the following steps:

[0136] The laser processing area is divided into a solid quadrant with a second preset center point as a coordinate origin, the scanning directions of the X mirror and the Y mirror as an x axis and a y axis, and a direction perpendicular to the area as a z axis, and the area of any quadrant of the XY plane is equally divided into N*N small squares, and the height of the z axis is set, thereby obtaining N*N cuboids, each cuboid corresponding to a calibration selected area.

[0137] Optionally, in the determining the target point in the Q calibration areas in the P calibration areas, the first corresponding relationship is used to determine the first galvanometer angle coordinate of the first galvanometer corresponding to the target point in the Q calibration areas, and the program comprises instructions for performing the following steps:

[0138] selecting the Q calibration areas in the P calibration areas;

[0139] selecting a center point in each of the Q calibration areas as a target point, and determining the first galvanometer angle coordinate of the first galvanometer corresponding to the target point in the Q calibration areas according to the target point and the first corresponding relationship.

[0140] Optionally, in the establishing the second corresponding relationship between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer based on the Q first galvanometer angle coordinates and the Q second galvanometer angle swing coordinate ranges, the program comprises instructions for performing the following steps:

[0141] establishing the second corresponding relationship between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer based on the Q first galvanometer angle coordinates and the Q second galvanometer angle swing coordinate ranges by using a trilinear interpolation method.

[0142] Optionally, in the establishing the second corresponding relationship between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer based on the Q first galvanometer angle coordinates and the Q second galvanometer angle swing coordinate ranges by using a trilinear interpolation method, the program comprises instructions for performing the following steps:

[0143] obtaining a target first galvanometer angle coordinate, the target first galvanometer angle coordinate being any one of the Q first galvanometer angle coordinates;

[0144] obtaining W reference target points of a calibration area corresponding to the target first galvanometer angle coordinate, and measuring the deflection angle of the second galvanometer by using the deflection measurement light to reach the W reference target points, W being an integer greater than 1;

[0145] establishing a second functional relationship between the target first galvanometer angle coordinate and the W reference target points;

[0146] According to the trilinear interpolation method, a second corresponding relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established according to the W deflection angles, the second function relationship, and the second mirror angle swing coordinate range corresponding to the target first mirror swing angle coordinate of the target first mirror.

[0147] It can be seen that the mirror swing adjustment device described in the embodiment of the application includes a first mirror and a second mirror, the first mirror is used to adjust the pointing direction of the processing laser input through the laser processing head, the second mirror is used to adjust the pointing direction of the measurement light input through the optical sensor, the processing laser is guided to the laser processing range through the first mirror, a first corresponding relationship between the reference coordinate system of the laser processing range and the first angle swing coordinate range of the first mirror is established, the laser processing range is regionally divided in the reference coordinate system to obtain P calibration selected areas of the laser processing range, P is an integer greater than 1, a target point in Q calibration selected areas in the P calibration selected areas is determined, the first mirror swing angle coordinates of the target point in the Q calibration selected areas corresponding to the target point are determined according to the first corresponding relationship, Q first mirror swing angle coordinates are obtained, Q is an integer greater than 1 and Q is less than or equal to P, the measurement light is guided to the laser processing range through the second mirror and the first mirror adjusted by the Q first mirror swing angles in turn, the second mirror angle swing coordinate range of the Q second mirrors is determined, and a second corresponding relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges, so as to determine the swing coordinate range of the second mirror in the reference coordinate system, that is, in the application scenario of the two mirrors, the laser processing range can be regionally divided when the second mirror is calibrated, the first mirror is calibrated in different regions respectively, and then the corresponding relationship between the entire laser processing range reference coordinate system and the second mirror angle swing coordinate range is established, so that the real-time alignment of the measurement light and the spoon hole position can be realized.

[0148] Figure 7 is a functional unit composition block diagram of a mirror swing adjustment device 700 involved in the embodiment of the application. The mirror swing adjustment device 700 can include a first mirror and a second mirror, the mirror swing adjustment device includes a first mirror and a second mirror, the first mirror is used to adjust the pointing direction of the processing laser input through the laser processing head, the second mirror is used to adjust the pointing direction of the measurement light input through the optical sensor, the device 700 includes a first establishment unit 701, a division unit 702, a determination unit 703, and a second establishment unit 704, wherein,

[0149] The first establishing unit 701 is configured to guide the processing laser to a laser processing plane through the first galvanometer, and establish a first correspondence between a reference coordinate system of the laser processing plane and a first angle swing coordinate range of the first galvanometer.

[0150] The dividing unit 702 is configured to divide the laser processing plane in the reference coordinate system to obtain P calibration selected areas of the laser processing plane, where P is an integer greater than 1.

[0151] The determining unit 703 is configured to determine target points in Q calibration selected areas of the P calibration selected areas, determine first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence, obtain Q first galvanometer swing angle coordinates, where Q is an integer greater than 1 and Q is less than or equal to P, guide the measuring light to the laser processing plane through the second galvanometer and the first galvanometer with the Q first galvanometer swing angle coordinates, and determine a second galvanometer angle swing coordinate range of Q second galvanometers.

[0152] The second establishing unit 704 is configured to establish a second correspondence between the reference coordinate system of the laser processing plane and a second galvanometer angle swing coordinate range of the second galvanometer according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate range, so as to determine a swing coordinate range of the second galvanometer in the reference coordinate system.

[0153] Optionally, in the aspect of dividing the laser processing plane in the reference coordinate system to obtain P calibration selected areas of the laser processing plane, the dividing unit 702 is specifically configured to:

[0154] divide the laser processing plane into four quadrants with a first preset center point as a coordinate origin and with the scanning directions of the X galvanometer and the Y galvanometer as the x axis and the y axis, and divide any quadrant into M*M grids, where M is an integer greater than 1, and each grid corresponds to a calibration selected area.

[0155] Optionally, in the aspect of determining target points in Q calibration selected areas of the P calibration selected areas and determining first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence, the determining unit 703 is specifically configured to:

[0156] select the Q calibration selected areas from the P calibration selected areas;

[0157] select one target point in each area in the Q calibration selected areas, and determine first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the target points and the first correspondence.

[0158] Optionally, the second establishing unit 704 is configured to:

[0159] establish the second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror based on a bilinear interpolation method according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges.

[0160] Optionally, the second establishing unit 704 is configured to:

[0161] obtain a reference first mirror swing angle coordinate, the reference first mirror swing angle coordinate being any one of the Q first mirror swing angle coordinates;

[0162] obtain K reference target points of a calibration selected area corresponding to the reference first mirror swing angle coordinate, and make the second mirror scanning deflection measurement light reach the K reference target points to obtain K deflection angles, K being an integer greater than 1;

[0163] establish a first functional relationship between the reference first mirror swing angle coordinate and the K reference target points;

[0164] establish the second correspondence between the reference coordinate system of the laser processing area and the second mirror angle swing coordinate range of the second mirror based on the bilinear interpolation method according to the K deflection angles, the first functional relationship, and the second mirror angle swing coordinate range corresponding to the reference first mirror swing angle coordinate.

[0165] Optionally, the dividing unit 702 is configured to:

[0166] The laser processing surface is divided into solid quadrants with a second preset center point as the coordinate origin, the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and the direction perpendicular to the surface as the z axis, and the surface in any quadrant of the XY plane is equally divided into N*N small squares, the height of the z axis is set, and N*N rectangular solids are obtained, each of which corresponds to a calibration selection area.

[0167] Optionally, in the determination of the target point in the Q calibration selection areas in the P calibration selection areas, the first corresponding relationship is used to determine the first galvanometer angle coordinate corresponding to the target point in the Q calibration selection areas, and the determination unit 703 is specifically configured to:

[0168] selecting the Q calibration selection areas from the P calibration selection areas;

[0169] selecting a center point in each of the Q calibration selection areas as a target point, and determining the first galvanometer angle coordinate of the first galvanometer corresponding to the target point in the Q calibration selection areas according to the target point and the first corresponding relationship.

[0170] Optionally, in the establishment of the second corresponding relationship between the reference coordinate system of the laser processing surface and the second galvanometer angle swing coordinate range of the second galvanometer based on the Q first galvanometer angle coordinates and the Q second galvanometer angle swing coordinate ranges, the second establishment unit 704 is specifically configured to:

[0171] establishing the second corresponding relationship between the reference coordinate system of the laser processing surface and the second galvanometer angle swing coordinate range of the second galvanometer based on the Q first galvanometer angle coordinates and the Q second galvanometer angle swing coordinate ranges according to the trilinear interpolation method.

[0172] Optionally, in the establishment of the second corresponding relationship between the reference coordinate system of the laser processing surface and the second galvanometer angle swing coordinate range of the second galvanometer based on the Q first galvanometer angle coordinates and the Q second galvanometer angle swing coordinate ranges according to the trilinear interpolation method, the second establishment unit 704 is specifically configured to:

[0173] obtaining a target first galvanometer angle coordinate, the target first galvanometer angle coordinate being any first galvanometer angle coordinate in the Q first galvanometer angle coordinates;

[0174] obtaining W reference target points of the calibration selection area corresponding to the target first galvanometer angle coordinate, deflecting and measuring light of the second galvanometer to reach the W reference target points, and obtaining W deflection angles, W being an integer greater than 1;

[0175] establishing a second function relationship between the target first galvanometer swing angle coordinate and the W reference target points;

[0176] According to the trilinear interpolation method, the second corresponding relationship between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer is established according to the W deflection angles, the second function relationship and the second galvanometer angle swing coordinate range corresponding to the target first galvanometer swing angle coordinate.

[0177] It can be seen that the galvanometer swing adjustment device described in the embodiment of the application includes a first galvanometer and a second galvanometer. The first galvanometer is used to adjust the pointing direction of the processing laser input through the laser processing head, and the second galvanometer is used to adjust the pointing direction of the measurement light input through the optical sensor. The processing laser is guided to the laser processing range through the first galvanometer, a first corresponding relationship between the reference coordinate system of the laser processing range and the first angle swing coordinate range of the first galvanometer is established, the laser processing range is regionally divided in the reference coordinate system to obtain P calibration selected areas of the laser processing range, P is an integer greater than 1, target points in Q calibration selected areas of the P calibration selected areas are determined, the first galvanometer swing angle coordinates corresponding to the target points in the Q calibration selected areas are determined according to the first corresponding relationship, Q first galvanometer swing angle coordinates are obtained, Q is an integer greater than 1 and Q is less than or equal to P, the measurement light is guided to the laser processing range through the second galvanometer and the first galvanometer adjusted according to the Q first galvanometer swing angle coordinates in turn, the second galvanometer angle swing coordinate range of the Q second galvanometers is determined, and a second corresponding relationship between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer is established according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges, so as to determine the swing coordinate range of the second galvanometer in the reference coordinate system. That is, in the application scenario of the two galvanometers, the laser processing range can be regionally divided when the second galvanometer is calibrated, and the first galvanometer can be calibrated in different regions respectively, and then the corresponding relationship between the entire laser processing range reference coordinate system and the second galvanometer angle swing coordinate range is established. In this way, the real-time alignment of the measurement light and the keyhole position can be realized.

[0178] It can be understood that the functions of each program module of the galvanometer swing adjustment device of the embodiment can be specifically implemented according to the methods in the above method embodiments, and the specific implementation process can refer to the related description of the above method embodiments, which will not be described here.

[0179] The embodiment of the application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program makes the computer execute part or all steps of any method described in the above method embodiments, and the above computer includes the galvanometer swing adjustment device.

[0180] The embodiment of the present application further provides a computer program product, which comprises a non-transitory computer readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute part or all of the steps of any method described in the above method embodiments. The computer program product can be a software installation package, and the computer comprises the galvanometer swing adjustment device.

[0181] It should be noted that, for the above-mentioned method embodiments, in order to simply describe, they are all described as a series of action combinations, but those skilled in the art should know that the present application is not limited to the action sequence described, because according to the present application, some steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the present application.

[0182] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0183] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic. The division of the above units is only a logical function division. There can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed coupling or direct coupling or communication connection between each set can be indirect coupling or communication connection through some interface, device or unit, and can be electrical or other form.

[0184] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0185] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of software functional unit.

[0186] If the above integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer readable memory. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a memory and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server or a network device, etc.) to execute all or part of the steps of the above-mentioned method of each embodiment of the present application. The aforementioned memory includes: a U disk, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store program codes.

[0187] A person of ordinary skill in the art can understand that all or part of the steps in the above-mentioned embodiments can be completed by instructing the relevant hardware through a program, which can be stored in a computer readable memory. The memory can include: a flash disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0188] The embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range will be changed, and the above description of the embodiments should not be understood as a limitation of the present application.

Claims

1. A galvanometer oscillation adjustment method characterized by, The application is applied to a galvanometer swing adjustment device, the galvanometer swing adjustment device comprises a first galvanometer and a second galvanometer, the first galvanometer is used for adjusting a pointing direction of a processing laser input through a laser processing head, and the second galvanometer is used for adjusting a pointing direction of a measurement light input through an optical sensor, and the method comprises the following steps: The processing laser is guided to a laser processing plane through the first galvanometer to establish a first corresponding relationship between a reference coordinate system of the laser processing plane and a first angle swing coordinate range of the first galvanometer; The laser processing plane is regionally divided in the reference coordinate system to obtain P calibration selected areas of the laser processing plane, and P is an integer greater than 1; Target points in Q calibration selected areas of the P calibration selected areas are determined, first galvanometer swing angle coordinates of the target points in the Q calibration selected areas are determined according to the first corresponding relationship, Q first galvanometer swing angle coordinates are obtained, and Q is an integer greater than 1 and less than or equal to P; The measurement light is guided to the laser processing plane through the second galvanometer and the first galvanometer adjusted according to the Q first galvanometer swing angle coordinates in sequence, and second galvanometer angle swing coordinate ranges of Q second galvanometers are determined; A second corresponding relationship between the reference coordinate system of the laser processing plane and the second galvanometer angle swing coordinate ranges of the second galvanometer is established according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges to determine a swing coordinate range of the second galvanometer in the reference coordinate system; The laser processing plane is regionally divided in the reference coordinate system to obtain P calibration selected areas of the laser processing plane, and P is an integer greater than 1; The laser processing plane is divided into a solid quadrant with a second preset center point as a coordinate origin, the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and the direction perpendicular to the plane as the z axis, the plane of the XY is equally divided into N*N small squares, and the height of the z axis is set to obtain N*N cuboids, and each cuboid corresponds to a calibration selected area; Wherein, the welding workpiece to be detected has a certain height difference, or welding needs to be performed within a certain defocusing range, and a three-linear difference value method is used for calibration; wherein, the certain height difference is specifically that the height difference of the welding workpiece is greater than a preset height difference, and the certain defocusing range is specifically that the defocusing amount is within a preset range, and the preset height difference and the preset range are pre-set or system defaults.

2. The method of claim 1, wherein, The laser processing plane is regionally divided in the reference coordinate system to obtain P calibration selected areas of the laser processing plane, and P is an integer greater than 1; The laser processing plane is divided into four quadrants with a first preset center point as a coordinate origin, the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and any quadrant of the plane is equally divided into M*M squares, and each square corresponds to a calibration selected area, and M is an integer greater than 1.

3. The method of claim 2, wherein, The determining of the target point in the Q calibration areas in the P calibration areas comprises: selecting the Q calibration areas in the P calibration areas; selecting a target point in each of the Q calibration areas, and determining the first galvanometer swing angle coordinate of the first galvanometer corresponding to the target point in the Q calibration areas according to the target point and the first correspondence.

4. The method of claim 3, wherein, The second correspondence between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer is established based on a bilinear interpolation method according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges. The second correspondence between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer is established based on a bilinear interpolation method according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges.

5. The method of claim 4, wherein, The second correspondence between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer is established based on a bilinear interpolation method according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges. A reference first galvanometer swing angle coordinate is obtained, the reference first galvanometer swing angle coordinate being any one of the Q first galvanometer swing angle coordinates; K reference target points corresponding to the reference first galvanometer swing angle coordinate are obtained, the second galvanometer scanning deflection is measured to reach the K reference target points, K being an integer greater than 1, and K deflection angles are obtained; A first function relationship between the reference first galvanometer swing angle coordinate and the K reference target points is established; The second correspondence between the reference coordinate system of the laser processing range and the second galvanometer angle swing coordinate range of the second galvanometer is established based on the bilinear interpolation method according to the K deflection angles, the first function relationship, and the second galvanometer angle swing coordinate range corresponding to the reference first galvanometer swing angle coordinate.

6. The method of claim 1, wherein, The determining of the target point in the Q calibration areas in the P calibration areas comprises: selecting the Q calibration areas in the P calibration areas; selecting a center point in each of the Q calibration areas as a target point, and determining the first galvanometer swing angle coordinate of the first galvanometer corresponding to the target point in the Q calibration areas according to the target point and the first correspondence.

7. The method of claim 6, wherein, The second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges based on the trilinear interpolation method. The second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges based on the trilinear interpolation method.

8. The method of claim 7, wherein, The second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established according to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges based on the trilinear interpolation method. A target first mirror swing angle coordinate is obtained, the target first mirror swing angle coordinate being any one of the Q first mirror swing angle coordinates; W reference target points corresponding to the target first mirror swing angle coordinate are obtained, and the second mirror is deflected to measure light to reach the W reference target points, so as to obtain W deflection angles, W being an integer greater than 1; A second function relationship between the target first mirror swing angle coordinate and the W reference target points is established; The second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established according to the W deflection angles, the second function relationship and the second mirror angle swing coordinate range corresponding to the target first mirror swing angle coordinate based on the trilinear interpolation method.

9. A galvanometer oscillation adjusting device characterized by comprising: The mirror swing adjustment device comprises a first mirror and a second mirror, the first mirror is used for adjusting the pointing direction of the processing laser input through the laser processing head, and the second mirror is used for adjusting the pointing direction of the measurement light input through the optical sensor. The device comprises a first establishing unit, a segmentation unit, a determination unit and a second establishing unit, wherein, The first establishing unit is used for guiding the processing laser to the laser processing range through the first mirror, and establishing a first correspondence relationship between the reference coordinate system of the laser processing range and the first angle swing coordinate range of the first mirror; The segmentation unit is used for regionally segmenting the laser processing range in the reference coordinate system to obtain P calibration selected areas of the laser processing range, P being an integer greater than 1; The determining unit is configured to determine target points in Q calibration selected areas in the P calibration selected areas, determine first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence, and obtain Q first galvanometer swing angle coordinates, where Q is an integer greater than 1 and less than or equal to P; and guide the measurement light to the laser processing plane through the second galvanometer and the first galvanometer with the Q first galvanometer swing angle adjustments in sequence, and determine a second galvanometer angle swing coordinate range of the Q second galvanometers. The second establishing unit is configured to establish a second correspondence between a reference coordinate system of the laser processing plane and the second galvanometer angle swing coordinate range of the second galvanometer according to the Q first galvanometer swing angle coordinates and the Q second galvanometer angle swing coordinate ranges, so as to determine a swing coordinate range of the second galvanometer in the reference coordinate system. In the aspect of dividing the laser processing plane in the reference coordinate system to obtain the P calibration selected areas, the dividing unit is specifically configured to: divide the laser processing plane into solid quadrants with a second preset center point as a coordinate origin, with the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and with the direction perpendicular to the plane as the z axis, and divide the plane in any quadrant into N*N small squares, and set the height of the z axis, to obtain N*N cuboids, each of which corresponds to a calibration selected area. In the aspect of dividing the laser processing plane in the reference coordinate system to obtain the P calibration selected areas, the dividing unit is specifically configured to:

10. The apparatus of claim 9, wherein, divide the laser processing plane into four quadrants with a first preset center point as a coordinate origin, with the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and divide the plane in any quadrant into M*M squares, each of which corresponds to a calibration selected area, where M is an integer greater than 1. In the aspect of determining target points in Q calibration selected areas in the P calibration selected areas, and determining first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence, the determining unit is specifically configured to:

11. The apparatus of claim 10, wherein, select the Q calibration selected areas from the P calibration selected areas; select a target point in each area in the Q calibration selected areas, and determine first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the target points and the first correspondence. In the aspect of dividing the laser processing plane in the reference coordinate system to obtain the P calibration selected areas, the dividing unit is specifically configured to: divide the laser processing plane into solid quadrants with a second preset center point as a coordinate origin, with the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and with the direction perpendicular to the plane as the z axis, and divide the plane in any quadrant into N*N small squares, and set the height of the z axis, to obtain N*N cuboids, each of which corresponds to a calibration selected area. In the aspect of dividing the laser processing plane in the reference coordinate system to obtain the P calibration selected areas, the dividing unit is specifically configured to: divide the laser processing plane into four quadrants with a first preset center point as a coordinate origin, with the scanning directions of the X mirror and the Y mirror as the x axis and the y axis, and divide the plane in any quadrant into M*M squares, each of which corresponds to a calibration selected area, where M is an integer greater than 1. In the aspect of determining target points in Q calibration selected areas in the P calibration selected areas, and determining first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the first correspondence, the determining unit is specifically configured to: select the Q calibration selected areas from the P calibration selected areas; select a target point in each area in the Q calibration selected areas, and determine first galvanometer swing angle coordinates of the first galvanometer corresponding to the target points in the Q calibration selected areas according to the target points and the first correspondence.

12. The apparatus of claim 11, wherein, In the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror, the second establishing unit is specifically configured to: According to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges, the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established based on a bilinear interpolation method.

13. The apparatus of claim 12, wherein, In the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror based on the bilinear interpolation method, the second establishing unit is specifically configured to: Obtain a reference first mirror swing angle coordinate, the reference first mirror swing angle coordinate being any first mirror swing angle coordinate in the Q first mirror swing angle coordinates; Obtain K reference target points of a calibration selected area corresponding to the reference first mirror swing angle coordinate, and make the second mirror deflection measurement light reach the K reference target points to obtain K deflection angles, K being an integer greater than 1; Establish a first functional relationship between the reference first mirror swing angle coordinate and the K reference target points; According to the K deflection angles, the first functional relationship, and the second mirror angle swing coordinate range corresponding to the reference first mirror swing angle coordinate, the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established based on the bilinear interpolation method.

14. The apparatus of claim 9, wherein, In the determination of the target points in the Q calibration selected areas in the P calibration selected areas, and the determination of the first mirror swing angle coordinates of the first mirror corresponding to the target points in the Q calibration selected areas according to the first correspondence relationship, the determining unit is specifically configured to: Select the Q calibration selected areas in the P calibration selected areas; Select a center point in each region in the Q calibration selected areas as a target point, and determine the first mirror swing angle coordinates of the first mirror corresponding to the target points in the Q calibration selected areas according to the target points and the first correspondence relationship.

15. The apparatus of claim 14, wherein, In the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror, the second establishing unit is specifically configured to: According to the Q first mirror swing angle coordinates and the Q second mirror angle swing coordinate ranges, the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established based on a bilinear interpolation method. In the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror based on the bilinear interpolation method, the second establishing unit is specifically configured to: Obtain a reference first mirror swing angle coordinate, the reference first mirror swing angle coordinate being any first mirror swing angle coordinate in the Q first mirror swing angle coordinates; Obtain K reference target points of a calibration selected area corresponding to the reference first mirror swing angle coordinate, and make the second mirror deflection measurement light reach the K reference target points to obtain K deflection angles, K being an integer greater than 1; Establish a first functional relationship between the reference first mirror swing angle coordinate and the K reference target points; According to the K deflection angles, the first functional relationship, and the second mirror angle swing coordinate range corresponding to the reference first mirror swing angle coordinate, the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror is established based on the bilinear interpolation method.

16. The apparatus of claim 15, wherein, In the second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror, the second establishing unit is specifically configured to: obtain a target first mirror swing angle coordinate, the target first mirror swing angle coordinate being any one of the Q first mirror swing angle coordinates; obtain W reference target points of a calibration selected area corresponding to the target first mirror swing angle coordinate, and measure the deflection angle of the second mirror scanning deflection light reaching the W reference target points, W being an integer greater than 1; establish a second functional relationship between the target first mirror swing angle coordinate and the W reference target points; establish a second correspondence relationship between the reference coordinate system of the laser processing range and the second mirror angle swing coordinate range of the second mirror based on the trilinear interpolation method, according to the W deflection angles, the second functional relationship, and the second mirror angle swing coordinate range corresponding to the target first mirror swing angle coordinate.

17. A galvanometer oscillation adjustment device, characterized by comprising: A computer program product for electronic data interchange, wherein the computer program product causes a computer to perform the method of any one of claims 1-8.

18. A computer-readable storage medium, characterized in that, A computer program product for electronic data interchange, wherein the computer program product causes a computer to perform the method of any one of claims 1-8.

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