Bill of materials engineering change record, query method, device, equipment and medium

Abstract

The embodiment of the application provides a kind of bill of materials engineering change record, query method, device, equipment and medium, the method comprises: for bill of materials creation engineering change record base;When the target material in the bill of materials occurs engineering change, the engineering change corresponding engineering change number is obtained;The engineering change number has corresponding engineering change attribute information;Confirm the engineering change information of target material;Engineering change information at least includes target material in the module hierarchy in the bill of materials, the serial number value of target material in the module hierarchy and the number of times of engineering change;According to preset record rule, record the engineering change information of target material, obtain the engineering change symbol of target material;The engineering change number is assigned to the engineering change symbol of target material, and saved to engineering change record base.The embodiment of the application can realize the record and query of bill of materials engineering change.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to a method and apparatus for recording changes in bill of materials (BOM) engineering, a method and apparatus for querying changes in BOM engineering, an electronic device, and a storage medium. Background Technology

[0002] A modular bill of materials (BOM) is a modular management system for common product components. It is suitable for complex products composed of many common parts with various combinations. Adopting a modular BOM brings many advantages to enterprises, such as significantly shortening customer response time; saving on the need for supporting equipment and manpower; facilitating product production planning and forecasting; and making product upgrades and subsequent maintenance more convenient.

[0003] Because modular BOMs contain hundreds or even thousands of parts, their structures are quite complex. Furthermore, there are many additional conditions and rules between different levels, which leads to numerous restrictions when modifying the modular BOM structure. As a result, when existing modular BOMs undergo engineering changes, the corresponding systems become highly complex, subject to numerous restrictions, and have limited modifiability.

[0004] Therefore, there is an urgent need to propose a method for recording and querying bill of materials (BOM) engineering changes, so as to realize the recording and querying of BOM engineering changes. Summary of the Invention

[0005] This application provides a method for recording and querying bill of materials (BOM) engineering changes, to solve the problems of recording and querying BOM engineering changes.

[0006] Accordingly, embodiments of this application also provide a recording device for bill of materials engineering changes, a query device for bill of materials engineering changes, an electronic device, and a storage medium to ensure the implementation and application of the above methods.

[0007] To address the aforementioned problems, this application discloses a method for recording changes to a bill of materials (BOM) project, the method comprising:

[0008] Create an engineering change record library for the bill of materials;

[0009] When an engineering change occurs to a target material in the bill of materials, the engineering change number corresponding to the engineering change is obtained; wherein, the engineering change number has corresponding engineering change attribute information;

[0010] Confirm the engineering change information of the target material; wherein the engineering change information includes at least the module level of the target material in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred;

[0011] Record the engineering change information of the target material according to the preset recording rules to obtain the engineering change symbol of the target material;

[0012] The engineering change number is assigned to the engineering change symbol of the target material and saved to the engineering change record library.

[0013] Optionally, the preset recording rules include at least:

[0014]

[0015] Wherein, X represents the module level of the target material in the bill of materials, m represents the serial number of the target material in its module level, and n represents the number of times the target material has undergone engineering changes.

[0016] Optionally, the module hierarchy in the bill of materials supports personalized customization.

[0017] This application also discloses a method for querying bill of materials (BOM) engineering changes, the method comprising:

[0018] A query request for the bill of materials has been received;

[0019] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the query request; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes;

[0020] The corresponding target project change number is determined based on the target project change symbol;

[0021] Obtain the target project change attribute information corresponding to the target project change based on the target project change number.

[0022] Optionally, the query request includes a target module hierarchy, and the step of querying the engineering change record database of the bill of materials according to the query request based on preset query rules to obtain the target engineering change symbol includes:

[0023] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target module level; wherein, the target engineering change symbol is the engineering change symbol of all materials corresponding to the target module level, and the engineering change symbol of all materials corresponding to the lower-level module level of all query sequence numbers of the target module level.

[0024] Optionally, the query request includes a target query sequence number value for the target module level, and the step of querying the engineering change record database of the bill of materials according to the preset query rules and the query request to obtain the target engineering change symbol includes:

[0025] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target query sequence number value of the target module level; wherein, the target engineering change symbol is the engineering change symbol of the material corresponding to the target query sequence number value of the target module level, and the engineering change symbols of all materials corresponding to the lower-level module level of the target query sequence number value of the target module level.

[0026] Optionally, after obtaining the target project change attribute information corresponding to the target project change based on the target project change number, the method further includes:

[0027] Displays the target project change attribute information corresponding to the bill of materials.

[0028] Optionally, the target project change attribute information can be customized by sorting, adding, and reducing.

[0029] This application also discloses a recording device for bill of materials engineering changes, the device comprising:

[0030] The record library creation module is used to create an engineering change record library based on the bill of materials;

[0031] The number acquisition module is used to acquire the engineering change number corresponding to the engineering change when an engineering change occurs to a target material in the bill of materials; wherein, the engineering change number has corresponding engineering change attribute information;

[0032] An information confirmation module is used to confirm the engineering change information of the target material; wherein, the engineering change information includes at least the module level of the target material in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred;

[0033] The symbol generation module is used to record the engineering change information of the target material according to a preset recording rule, and to obtain the engineering change symbol of the target material;

[0034] The symbol storage module is used to assign the engineering change number to the engineering change symbol of the target material and save it to the engineering change record library.

[0035] Optionally, the preset recording rules include at least:

[0036]

[0037] Wherein, X represents the module level of the target material in the bill of materials, m represents the serial number of the target material in its module level, and n represents the number of times the target material has undergone engineering changes.

[0038] Optionally, the module hierarchy in the bill of materials supports personalized customization.

[0039] This application also discloses a device for querying bill of materials (BOM) engineering changes, the device comprising:

[0040] The request receiving module is used to receive query requests for the bill of materials.

[0041] The symbol query module is used to query the engineering change record database of the bill of materials according to the preset query rules and the query request to obtain the target engineering change symbol; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes;

[0042] The number determination module is used to determine the corresponding target project change number based on the target project change symbol;

[0043] The information acquisition module is used to obtain the target project change attribute information corresponding to the target project change based on the target project change number.

[0044] Optionally, the query request includes a target module hierarchy, and the number determination module is specifically used for:

[0045] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target module level; wherein, the target engineering change symbol is the engineering change symbol of all materials corresponding to the target module level, and the engineering change symbol of all materials corresponding to the lower-level module level of all query sequence numbers of the target module level.

[0046] Optionally, the query request includes a target query sequence number value for the target module hierarchy, and the numbering determination module is specifically used for:

[0047] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target query sequence number value of the target module level; wherein, the target engineering change symbol is the engineering change symbol of the material corresponding to the target query sequence number value of the target module level, and the engineering change symbols of all materials corresponding to the lower-level module level of the target query sequence number value of the target module level.

[0048] Optionally, the device further includes:

[0049] The attribute information display module is used to display the target project change attribute information corresponding to the bill of materials.

[0050] Optionally, the target project change attribute information can be customized by sorting, adding, and reducing.

[0051] This application also discloses an electronic device, including: a processor; and a memory storing executable code thereon, wherein when the executable code is executed, the processor performs a method for recording bill of materials engineering changes as described in one or more embodiments of this application, and a method for querying bill of materials engineering changes as described in one or more embodiments of this application.

[0052] This application also discloses one or more machine-readable storage media storing executable code thereon, which, when executed, causes a processor to perform a recording method for bill of materials engineering changes as described in one or more embodiments of this application, and a query method for bill of materials engineering changes as described in one or more embodiments of this application.

[0053] Compared with the prior art, the embodiments of this application have the following advantages:

[0054] In this embodiment, an engineering change record library is created for the bill of materials (BOM). When an engineering change occurs to a target material in the BOM, the corresponding engineering change number is obtained. This engineering change number contains corresponding engineering change attribute information, confirming the engineering change information of the target material. This engineering change information includes at least the module level of the target material in the BOM, the serial number of the target material in that module level, and the number of times the engineering change has occurred. Then, the engineering change information of the target material is recorded according to preset recording rules, obtaining the engineering change symbol for the target material. The engineering change number is assigned to the engineering change symbol of the target material and saved to the engineering change record library. In this embodiment, the BOM can be a modular BOM with multiple module levels. When an engineering change occurs to a target material in a certain module level of the BOM, the engineering change information of that target material can be recorded and saved to the engineering change record library according to preset recording rules. This achieves the recording of all engineering changes to the BOM.

[0055] Furthermore, in this embodiment, upon receiving a query request for the bill of materials, a target engineering change symbol is obtained by querying the engineering change record database of the bill of materials according to a preset query rule. The target engineering change symbol represents the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes. Then, the corresponding target engineering change number can be determined based on the target engineering change symbol, and the target engineering change attribute information of the corresponding target engineering change can be obtained based on the target engineering change number. In this way, the query of all engineering changes in the bill of materials is realized.

[0056] It should be noted that the engineering change record library in this application embodiment can be created independently of the bill of materials. When recording engineering changes that occur in the bill of materials, it is only necessary to record the corresponding engineering change symbol in the engineering change record library according to the preset recording rules. When querying engineering changes that occur in the bill of materials, it is only necessary to query the corresponding engineering change symbol in the engineering change record library according to the preset query rules. Based on the engineering change symbol, the engineering change attribute information corresponding to the engineering change can be obtained. Therefore, even if the bill of materials of a complex product or the bill of materials has frequent engineering changes, the recording and querying of engineering changes in the bill of materials can be realized, and it can be compatible with existing bills of materials. Attached Figure Description

[0057] Figure 1 This is a flowchart illustrating the steps of an embodiment of a method for recording engineering changes to a bill of materials according to this application;

[0058] Figure 2 This is a schematic diagram of a conventional modular BOM in this application;

[0059] Figure 3 This is a schematic diagram of a customized modular BOM according to this application;

[0060] Figure 4 This is a flowchart illustrating the steps of an embodiment of a method for querying bill of materials engineering changes according to this application;

[0061] Figure 5 This is a schematic diagram of a modular BOM project change recording and querying method according to this application;

[0062] Figure 6 This is a schematic diagram of an engineering change record library for a conventional modular BOM in this application;

[0063] Figure 7 This is a schematic diagram of an engineering change record library for a customized modular BOM according to this application;

[0064] Figure 8 This is a structural block diagram of an embodiment of a bill of materials engineering change recording device according to this application;

[0065] Figure 9 This is a structural block diagram of an embodiment of a bill of materials engineering change query device according to this application;

[0066] Figure 10 This is a schematic diagram of the structure of a device provided in an embodiment of this application. Detailed Implementation

[0067] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0068] Reference Figure 1 This is a flowchart illustrating an embodiment of a method for recording changes to a bill of materials (BOM) in this application, comprising the following steps:

[0069] Step 101: Create an engineering change record library for the bill of materials.

[0070] Among them, the Bill of Material (BOM) is a list of all materials that make up a product. Typically, the BOM includes the names, quantities, and attribute information of the materials used in the product. A Modular Bill of Material (BOM), or simply Modular BOM, refers to the modular management of common product components. It is suitable for complex products composed of many common materials with various combinations. The BOM used in this application primarily refers to the Modular BOM; therefore, the following description will mainly use the Modular BOM as the BOM.

[0071] Specifically, a modular BOM can consist of multiple materials, and different materials can be located in different module levels. Furthermore, each module level in a modular BOM has a corresponding grade.

[0072] For example, refer to Figure 2 This is a schematic diagram of a modular BOM structure according to this application. The modular BOM structure is divided into five major module levels: product level, module level, specification level, replacement level, and physical level. The module level hierarchy is: product level > module level > specification level > replacement level > physical level. The next module level after product level A1 includes module level B1, module level B2, and other module levels B1 and B2. m The next module level of module B1 includes specification levels C1 and C2. The next module level of specification level C1 includes substitution level D1. The next module level of substitution level D1 includes physical level E1. It should be noted that specification level C3 is in the same level as specification levels C1 and C2, but it is not in the same level as the next module level of module B1; rather, it is in the same level as the next module level of module B2.

[0073] In this embodiment, the structure of the modular BOM can also be customized. For example, refer to... Figure 3 This is a structural diagram of a customized modular BOM according to this application. It is divided into seven levels: customer level, product level, module level, specification level, replacement level, physical level, and virtual level. The module level hierarchy is: customer level > product level > module level > specification level > replacement level > physical level > virtual level. Among them, the next module level of customer level A1 includes product level B1, product level B2, and other product levels B1. m The next module level of product level B1 includes module level C1 and module level C2. The next module level of module level C1 includes specification level D1. The next module level of specification level D1 includes replacement level E1. The next module level of replacement level E1 includes physical level F1 and physical level F2. The next module level of physical level F1 includes virtual level G1 and virtual level G2.

[0074] Of course, in addition to the modular BOM structure described above, other modular BOM structures can be customized according to actual needs in this application embodiment, and this application embodiment does not impose any restrictions on this.

[0075] Current modular BOM engineering change management rules record engineering changes according to module hierarchy. This results in inefficient queries, as the desired module hierarchy becomes increasingly complex and cannot meet personalized query needs. Especially when engineering changes occur frequently, the existing engineering change logic cannot support cross-module hierarchy queries due to the numerous types of modular BOM numbers for complex products, making the querying of modular BOM engineering change records a significant challenge. Therefore, in this embodiment, a unified engineering change record database is established for modular BOMs. When an engineering change occurs in a material within the modular BOM, the database stores the corresponding engineering change number (EC number, for example, E00000001, E00000002, E00000003, etc.). Subsequently, the corresponding engineering change attribute information (EC attribute information) can be located through the engineering change number for appropriate processing.

[0076] Step 102: When an engineering change occurs to the target material in the bill of materials, obtain the engineering change number corresponding to the engineering change; wherein the engineering change number has corresponding engineering change attribute information.

[0077] In practical applications, the project change number can locate the corresponding project change attribute information, such as the object type, name, description, status, creation time, change effective method, initiating department, and creator of the project change.

[0078] In this embodiment of the application, when an engineering change occurs to a target material in a modular BOM, the engineering change number corresponding to the engineering change can be obtained, and then the engineering change attribute information corresponding to the engineering change can be located based on the engineering change number.

[0079] Step 103: Confirm the engineering change information of the target material; wherein the engineering change information includes at least the module level of the target material in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred.

[0080] In this embodiment of the application, when an engineering change occurs in the modular BOM, the material with the engineering change is taken as the target material, and the engineering change information corresponding to the target material is obtained. Specifically, the engineering change information corresponding to the target material may include at least the module level in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred.

[0081] For example, refer to Figure 2If a change occurs in specification level C3 in the modular BOM, specification level C3 can be used as the target material, and the change number E00000001 corresponding to the change in specification level C3 can be obtained. The module level [C] where specification level C3 is located can be used as the module level in the bill of materials, [3] is the serial number of the module level not in the module level, and [1] is the number of changes that have occurred.

[0082] Step 104: Record the engineering change information of the target material according to the preset recording rules to obtain the engineering change symbol of the target material.

[0083] Step 105: Assign the engineering change number to the engineering change symbol of the target material and save it to the engineering change record library.

[0084] In this embodiment, when an engineering change occurs in the modular BOM, the engineering change can be recorded according to a preset recording rule to obtain an engineering change symbol. Then, the engineering change number is assigned to the engineering change symbol of the target material and saved to the engineering change record library. Subsequently, the engineering change symbol can be queried in the engineering change record library, and the corresponding engineering change number can be located based on the engineering change symbol. Then, the attribute information corresponding to the engineering change can be located based on the engineering change number. Specifically, in this embodiment, the modular BOM structure needs to be hierarchically numbered. When hierarchically numbering, it can be automatically hierarchically numbered according to the existing modular BOM structure (e.g., ...). Figure 2 The modular BOM structure shown can be rebuilt to correspond to the existing modular BOM structure, in order to meet personalized customization queries (e.g., Figure 3 The modular BOM structure shown in this application is not limited in this respect.

[0085] As an optional example, the preset recording rules may include at least:

[0086]

[0087] Wherein, X represents the module level of the target material in the bill of materials, m represents the serial number of the target material in its module level, and n represents the number of times the target material has undergone engineering changes.

[0088] For example, refer to Figure 2 Assuming an engineering change occurs at specification level C3 in the modular BOM, the engineering change symbol can be obtained according to the preset recording rules. Assuming that specification level C2 undergoes two engineering changes, the engineering change symbols can be obtained according to the preset recording rules.

[0089] In this embodiment of the application, after obtaining the engineering change symbol, the engineering change number can be further assigned to the corresponding engineering change symbol according to specific rules.

[0090] As an optional example, its specific rules are: Number X i Where X represents a module level, with A, B, C, D, E… representing higher to lower levels in sequence; m represents the sequence number of the same level within that module level (each sequence number is considered to correspond to a material), with numbers 1, 2, 3, 4… representing the sequence numbers within the same level in sequence; n represents the number of engineering changes occurring for a specific sequence number within that module level, with numbers 0, 1, 2, 3, 4… representing the number of engineering changes occurring for a specific sequence number within that module level, where 0… ′ 1 ′ 2 ′ 3 ′ 4 ′ …representing the number of engineering changes occurring in the next module level after a certain index in this module level, 0″, 1″, 2″, 3″, 4″…representing the number of engineering changes occurring in the next module level after a certain index value in this module level…where 0 indicates that no engineering change has occurred for a certain index value in this level. ′ This indicates that no engineering changes have occurred in the next module level below a certain number in this module hierarchy; 0″ indicates that no engineering changes have occurred in the next module level below a certain number in this hierarchy…; EC number X i (Engineering Change Number) is the engineering change number in the existing modular BOM process. This engineering change number is generated and recorded when an engineering change occurs to locate the corresponding engineering change attribute information. When engineering changes occur at this module level or lower module levels, the corresponding EC number X is used. i Assign the engineering change symbol to the defined modular BOM and save it to the engineering change record library.

[0091] For example, refer to Figure 2 When the module hierarchy of a modular BOM has never undergone engineering changes, for example, when the replacement level D2 has never undergone engineering changes, then... When an engineering change occurs at the module level of a modular BOM, for example, when specification level C3 experiences its first engineering change E00000001, at this time... When an engineering change occurs in the next lower level of a modular BOM module hierarchy, for example, module B1 itself has only undergone one engineering change (E00000002), its next lower specification level C1 undergoes its first engineering change (E000000003), but its next lower specification level C2 undergoes its first engineering change (E00000004) and a second engineering change (E00000005), then...

[0092] In this embodiment of the application, when it is necessary to query the engineering changes of the modular BOM, the corresponding engineering change symbol can be retrieved from the engineering change record database first, and then the engineering change attribute information corresponding to the corresponding engineering change number can be retrieved based on the engineering change symbol index.

[0093] In the above-described method for recording engineering changes in a bill of materials (BOM), an engineering change record library is created for the BOM. When an engineering change occurs to a target material in the BOM, the corresponding engineering change number is obtained. This engineering change number contains corresponding engineering change attribute information. The engineering change information of the target material is confirmed, including at least the module level of the target material in the BOM, the serial number of the target material in its module level, and the number of times the engineering change has occurred. Then, the engineering change information of the target material is recorded according to preset recording rules, obtaining the engineering change symbol of the target material. The engineering change number is assigned to the engineering change symbol of the target material and saved to the engineering change record library. In this embodiment, the BOM can be a modular BOM with multiple module levels. When an engineering change occurs to a target material in a certain module level of the BOM, the engineering change information of that target material can be recorded and saved to the engineering change record library according to preset recording rules. This achieves the recording of all engineering changes in the BOM.

[0094] Reference Figure 4 This is a flowchart illustrating the steps of an embodiment of a method for querying bill of materials engineering changes according to this application, including the following steps:

[0095] Step 401: Received a query request for the bill of materials.

[0096] Step 402: According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the query request; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes.

[0097] In this embodiment of the application, engineering change symbols are obtained according to preset recording rules, and then according to specific rules: Number X i After assigning the engineering change number to the corresponding engineering change symbol, this information will be saved in the modular BOM's engineering change record database. At this point, if you need to query engineering changes, you can query the modular BOM's engineering changes according to the preset query rules. The query can be for a specific module level or a specific sequence number value within a specific module level. When a query request for a modular BOM is received, the query can be performed based on the target module level or the target sequence number value within the target module level in the query request.

[0098] Reference Figure 5 This diagram illustrates a method for recording and querying modular BOM engineering changes according to this application. The modular BOM engineering change recording module records engineering changes for each module level of the modular BOM in chronological order in the engineering change record database. Then, the modular BOM engineering change query module can be used to query the engineering change record database according to defined rules, based on the target module level (e.g., replacement level D) in the query request or based on the target sequence number value of the target module level (e.g., replacement level D2).

[0099] As an optional embodiment, the query request includes a target module hierarchy, and step 402, querying the engineering change record database of the bill of materials according to the preset query rules and the query request to obtain the target engineering change symbol, may include:

[0100] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target module level; wherein, the target engineering change symbol is the engineering change symbol of all materials corresponding to the target module level, and the engineering change symbol of all materials corresponding to the lower-level module level of all query sequence numbers of the target module level.

[0101] Specifically, the default query rules for querying engineering changes at a specific module level X are as follows:

[0102]

[0103] Where X represents a certain module level, X′ represents the next level of module level X, X″ represents the next level of module level X, and so on. The set of engineering change records of other lower levels of a certain module level X continues in this manner until the lowest module level.

[0104] This represents the collection of all engineering change records for all serial numbers in the same level of module X;

[0105] This represents the collection of all engineering change records of the same level in the next module level below all sequence numbers of module level X;

[0106] This represents the set of all engineering change records of the same level in the next module level of the next module level of all sequence numbers of module level X;

[0107] This represents the collection of all engineering change records of the same level in the next module level below all sequence numbers of module level X;

[0108] This represents the set of engineering change records for all sub-modules of the same level as the next sub-module of the module level X.

[0109] This represents the set of all engineering change records of the same level in the next module level of the next module level of all sequence numbers of module level X;

[0110] This represents the set of engineering change records for all sub-modules of the same level as the next sub-module of the next sub-module of the current module level X.

[0111] The collection of engineering change records for other lower module levels of this module level X is repeated in this manner, up to the lowest module level.

[0112] As an optional embodiment, the query request includes the target query sequence number value of the target module level. Step 402, querying the engineering change record database of the bill of materials according to the preset query rules and the query request to obtain the target engineering change symbol, may include:

[0113] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target query sequence number value of the target module level; wherein, the target engineering change symbol is the engineering change symbol of the material corresponding to the target query sequence number value of the target module level, and the engineering change symbols of all materials corresponding to the lower-level module level of the target query sequence number value of the target module level.

[0114] Specifically, querying a specific index X of a module hierarchy. j The default query rules for engineering changes are as follows:

[0115]

[0116] Among them, X j Let X' represent a specific index value j of a module hierarchy X. jThis represents the next-order module hierarchy after a certain index value j of a module hierarchy X, X″. j This represents the next level of the next module level after a certain index value j of a certain module level X, and so on, up to the lowest module level.

[0117] This represents the set of all engineering change records for a specific index j in module hierarchy X. This represents the set of all engineering change records of the same level in the next module level below a certain index value j of module level X;

[0118] This represents the set of all engineering change records of the same level in the next module level of the next module level of a certain index value j of module level X.

[0119] This represents the set of all engineering change records of the same level in the next module level below a certain index value j of module level X;

[0120] This represents the set of engineering change records for all sub-modules of the same level below a given index value j of module level X.

[0121] This represents the set of all engineering change records of the same level in the next module level of the next module level of a certain index value j of module level X.

[0122] This represents the set of all engineering change records of the same level in the next level of the next module level of the next module level of the module level X with a certain index value j.

[0123] The set of engineering change records for a certain index value j of the lower module level of the same module level X is obtained by analogy, up to the lowest module level.

[0124] Step 403: Determine the corresponding target project change number based on the target project change symbol.

[0125] Step 404: Obtain the target project change attribute information corresponding to the target project change based on the target project change number.

[0126] In practice, after retrieving the relevant target engineering change symbol from the engineering change record database, the relevant engineering change attribute information can be located based on the target engineering change symbol, thus completing the query of engineering changes for the modular BOM.

[0127] In an optional embodiment of this application, after step 404, obtaining the target project change attribute information corresponding to the target project change based on the target project change number, the method may further include:

[0128] Displays the target project change attribute information corresponding to the bill of materials.

[0129] In this embodiment, by locating the relevant engineering change attribute information based on the target engineering change symbol, the target engineering change attribute information corresponding to the modular BOM can be displayed for relevant personnel to browse. Of course, to facilitate better viewing of the engineering change attribute information, custom sorting, adding engineering change attribute information, and removing engineering change attribute information are supported when displaying the information.

[0130] In the above-mentioned method for querying bill of materials (BOM) engineering changes, upon receiving a query request for the BOM, the system searches the BOM engineering change record database according to preset query rules to obtain the target engineering change symbol. The target engineering change symbol represents the module level of the corresponding material in the BOM, the sequence number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes. Then, the corresponding target engineering change number can be determined based on the target engineering change symbol, and the target engineering change attribute information of the corresponding target engineering change can be obtained based on the target engineering change number. In this way, the system can query all engineering changes in the BOM.

[0131] It should be noted that the engineering change record library in this application embodiment can be created independently of the bill of materials. When recording engineering changes that occur in the bill of materials, it is only necessary to record the corresponding engineering change symbol in the engineering change record library according to the preset recording rules. When querying engineering changes that occur in the bill of materials, it is only necessary to query the corresponding engineering change symbol in the engineering change record library according to the preset query rules. Based on the engineering change symbol, the engineering change attribute information corresponding to the engineering change can be obtained. Therefore, even if the bill of materials of a complex product or the bill of materials has frequent engineering changes, the recording and querying of engineering changes in the bill of materials can be realized, and it can be compatible with existing bills of materials.

[0132] To enable those skilled in the art to better understand the embodiments of this application, the following describes in detail the query process for engineering changes to both conventional modular BOMs and customized modular BOMs.

[0133] Case 1: Querying Project Change Records for a Standard Modular BOM

[0134] Reference Figure 2The modular BOM structure shown is configured as follows: Replacement level D2 has never undergone engineering changes; specification level C3 underwent its first engineering change (E00000001); module level B1 itself underwent only one engineering change (E00000002); its next-level specification level C1 underwent its first engineering change (E000000003); however, its next-level specification level C2 underwent its first engineering change (E00000004) and its second engineering change (E00000005); other module levels have not undergone engineering changes. Therefore, according to the definition of the modular BOM engineering change recording module, the records of this product's modular BOM in the engineering change record library are as follows: Figure 6 As shown.

[0135] When querying engineering changes in a modular BOM, according to the defined rules of the modular BOM change record query module, the query results for engineering change records of product level A1 are as follows:

[0136]

[0137]

[0138] In this embodiment, after retrieving the query results related to engineering changes, i.e., the EC number, the relevant EC attribute information can be located based on the EC number. For example, as shown in Table 1 below, a query table for engineering change records in a conventional modular BOM lists the EC number and its corresponding EC attribute information. Of course, the displayed EC attribute information supports custom sorting, adding EC attribute information, and removing EC attribute information.

[0139] Table 1:

[0140] EC number object type name illustrate state Creation time Change of effective method Initiating Department Creator E00000002 A AA AAA AAAA AAAAA AAAAAA AAAAAAA AAAAAAAA E00000003 B BB BBB BBBB BBBBB BBBBBB BBBBBBB BBBBBBBB E00000004 C CC CCC CCCC CCCCC CCCCCC CCCCCCC CCCCCCCC E00000005 D DD DDD DDDD DDDDD DDDDDD DDDDDDD DDDDDDDD E00000001 E EE EEE EEEE EEEEE EEEEEE EEEEEEE EEEEEEEE

[0141] Case 2: Querying Project Change Records for Personalized Modular BOMs

[0142] Figure 2 The conventional modular BOM structure shown cannot be added or removed due to rule restrictions and other reasons. When a product model has to be split into two or more product-level module BOMs due to various restrictions, the query in Case 1 cannot retrieve all engineering change records for that product model at once. In this case, a personalized query for engineering change records can be performed.

[0143] When performing customization, it is necessary to match the structure of the modular BOM in the engineering change record library with... Figure 2 The structure of the conventional modular BOM shown is modified accordingly as follows: Figure 3The structure of the customized modular BOM shown is used for recording and querying engineering changes.

[0144] like Figure 3 The modular BOM structure shown is configured as follows: For the first engineering change in the replacement level E2, E00000001 occurs; for the first engineering change in the product level B1, E00000002 occurs; for the first engineering change in the physical level F1, E00000003 occurs; for the first engineering change in the virtual level G2, E000000004 occurs; for the first engineering change in the module level C1, E00000005 occurs; for the first engineering change in the module level C3, E00000006 occurs; and for other module levels, no engineering changes occur. Therefore, according to the definition of the engineering change record module in a customized modular BOM, the records in the engineering change record library of this product's modular BOM are as follows: Figure 7 As shown:

[0145] When querying engineering changes in a modular BOM, according to the defined rules of the modular BOM change record query module, the query results for the engineering change records of customer level A1 are as follows:

[0146]

[0147] In this embodiment, after retrieving the query results related to engineering changes, i.e., the EC number, the relevant EC attribute information can be located based on the EC number. For example, as shown in Table 2 below, a query table for engineering change records in a personalized modular BOM lists the EC number and its corresponding EC attribute information. Of course, the displayed EC attribute information supports custom sorting, adding EC attribute information, and removing EC attribute information.

[0148] Table 2:

[0149]

[0150] In summary, the embodiments of this application provide a method for recording and querying modular BOM engineering changes, enabling efficient recording and querying of all engineering changes for complex modular BOMs. Furthermore, it is compatible with existing conventional modular BOM structures, exhibiting good compatibility with modular BOMs of different hierarchical structures, thus promoting the uniformity of BOM engineering change records. In addition, the embodiments of this application allow for personalized querying, satisfying the management and analysis needs of engineering change personnel for product engineering changes, and providing a convenient tool for subsequent targeted improvements.

[0151] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of this application are not limited to the described order of actions, because according to the embodiments of this application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of this application.

[0152] Based on the above embodiments, this embodiment also provides a recording device for bill of materials engineering changes and a recording query device for bill of materials engineering changes, which are applied in electronic devices such as terminal devices and servers.

[0153] Reference Figure 8 The diagram shows a structural block diagram of an embodiment of a bill of materials engineering change recording device according to this application, which may specifically include the following modules:

[0154] The record library creation module 801 is used to create an engineering change record library for the bill of materials.

[0155] The number acquisition module 802 is used to acquire the engineering change number corresponding to the engineering change when an engineering change occurs to the target material in the bill of materials; wherein, the engineering change number has corresponding engineering change attribute information;

[0156] Information confirmation module 803 is used to confirm the engineering change information of the target material; wherein, the engineering change information includes at least the module level of the target material in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred;

[0157] The symbol generation module 804 is used to record the engineering change information of the target material according to a preset recording rule, and obtain the engineering change symbol of the target material;

[0158] The symbol storage module 805 is used to assign the engineering change number to the engineering change symbol of the target material and save it to the engineering change record library.

[0159] In an optional embodiment of this application, the preset recording rules include at least:

[0160]

[0161] Wherein, X represents the module level of the target material in the bill of materials, m represents the serial number of the target material in its module level, and n represents the number of times the target material has undergone engineering changes.

[0162] In one alternative embodiment of this application, the module hierarchy in the bill of materials supports personalized customization.

[0163] Reference Figure 9 The diagram shows a structural block diagram of an embodiment of a bill of materials engineering change query device according to this application, which may specifically include the following modules:

[0164] The request receiving module 901 is used to receive query requests for the bill of materials;

[0165] The symbol query module 902 is used to query the engineering change record database of the bill of materials according to the preset query rules and the query request to obtain the target engineering change symbol; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes;

[0166] The numbering determination module 903 is used to determine the corresponding target project change number based on the target project change symbol;

[0167] The information acquisition module 904 is used to acquire the target project change attribute information corresponding to the target project change based on the target project change number.

[0168] In an optional embodiment of this application, the query request includes a target module hierarchy, and the number determination module 903 is specifically used for:

[0169] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target module level; wherein, the target engineering change symbol is the engineering change symbol of all materials corresponding to the target module level, and the engineering change symbol of all materials corresponding to the lower-level module level of all query sequence numbers of the target module level.

[0170] In an optional embodiment of this application, the query request includes a target query sequence number value for the target module hierarchy, and the numbering determination module 903 is specifically used for:

[0171] According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the target query sequence number value of the target module level; wherein, the target engineering change symbol is the engineering change symbol of the material corresponding to the target query sequence number value of the target module level, and the engineering change symbols of all materials corresponding to the lower-level module level of the target query sequence number value of the target module level.

[0172] In an optional embodiment of this application, the apparatus further includes:

[0173] The attribute information display module is used to display the target project change attribute information corresponding to the bill of materials.

[0174] In one optional embodiment of this application, the target project change attribute information supports custom sorting, addition, and reduction.

[0175] This application also provides a non-volatile readable storage medium storing one or more modules (programs). When these modules are applied to a device, they enable the device to execute the instructions for the method steps in this application.

[0176] This application provides one or more machine-readable storage media storing instructions that, when executed by one or more processors, cause an electronic device to perform one or more of the methods described in the above embodiments. In this application, the electronic device includes various types of devices such as terminal devices and servers (clusters).

[0177] The embodiments of this disclosure can be implemented as an apparatus configured as desired using any suitable hardware, firmware, software, or any combination thereof, including electronic devices such as terminal devices, servers (clusters), etc. Figure 10 An exemplary apparatus 1000 is schematically shown that can be used to implement the various embodiments described in this application.

[0178] In one embodiment, Figure 10 An exemplary device 1000 is shown, which includes one or more processors 1002, a control module (chipset) 1004 coupled to at least one of the processors 1002, a memory 1006 coupled to the control module 1004, a non-volatile memory (NVM) / storage device 1008 coupled to the control module 1004, one or more input / output devices 1010 coupled to the control module 1004, and a network interface 1012 coupled to the control module 1004.

[0179] Processor 1002 may include one or more single-core or multi-core processors, and processor 1002 may include any combination of general-purpose processors or special-purpose processors (e.g., graphics processors, application processors, baseband processors, etc.). In some embodiments, device 1000 can serve as a terminal device, server (cluster), or other device as described in the embodiments of this application.

[0180] In some embodiments, apparatus 1000 may include one or more computer-readable storage media (e.g., memory 1006 or NVM / storage device 1008) having instructions 1014 and one or more processors 1002 that are combined with the one or more computer-readable storage media and configured to execute instructions 1014 to implement modules and thereby perform the actions described in this disclosure.

[0181] In one embodiment, the control module 1004 may include any suitable interface controller to provide any suitable interface to at least one of the processors 1002 and / or any suitable device or component communicating with the control module 1004.

[0182] The control module 1004 may include a memory controller module to provide an interface to the memory 1006. The memory controller module may be a hardware module, a software module, and / or a firmware module.

[0183] Memory 1006 may be used, for example, to load and store data and / or instructions 1014 for device 1000. In one embodiment, memory 1006 may include any suitable volatile memory, such as suitable DRAM. In some embodiments, memory 1006 may include double data rate type quad synchronous dynamic random access memory (DDR4 SDRAM).

[0184] In one embodiment, the control module 1004 may include one or more input / output controllers to provide interfaces to the NVM / storage device 1008 and (one or more) input / output devices 1010.

[0185] For example, NVM / storage device 1008 may be used to store data and / or instructions 1014. NVM / storage device 1008 may include any suitable non-volatile memory (e.g., flash memory) and / or may include any suitable (one or more) non-volatile storage devices (e.g., one or more hard disk drives (HDDs), one or more optical disc drives (CDs), and / or one or more digital universal optical disc (DVD) drives).

[0186] NVM / storage device 1008 may include storage resources that are physically part of a device on which device 1000 is mounted, or that are accessible to the device but do not necessarily have to be part of the device. For example, NVM / storage device 1008 may be accessed via a network via one or more input / output devices 1010.

[0187] One or more input / output devices 1010 may provide an interface for device 1000 to communicate with any other suitable device. Input / output devices 1010 may include communication components, audio components, sensor components, etc. Network interface 1012 may provide an interface for device 1000 to communicate via one or more networks. Device 1000 may wirelessly communicate with one or more components of a wireless network according to any of one or more wireless network standards and / or protocols, such as accessing wireless networks based on communication standards, such as WiFi, 2G, 3G, 4G, 5G, etc., or combinations thereof.

[0188] In one embodiment, at least one of the processors 1002 may be logically packaged with one or more controllers (e.g., memory controller modules) of the control module 1004. In one embodiment, at least one of the processors 1002 may be logically packaged with one or more controllers of the control module 1004 to form a system-in-package (SiP). In one embodiment, at least one of the processors 1002 may be integrated with the logic of one or more controllers of the control module 1004 on the same die. In one embodiment, at least one of the processors 1002 may be integrated with the logic of one or more controllers of the control module 1004 on the same die to form a system-on-a-chip (SoC).

[0189] In various embodiments, device 1000 may be, but is not limited to, a terminal device such as a server, desktop computing device, or mobile computing device (e.g., laptop computing device, handheld computing device, tablet computer, netbook, etc.). In various embodiments, device 1000 may have more or fewer components and / or different architectures. For example, in some embodiments, device 1000 includes one or more cameras, a keyboard, a liquid crystal display (LCD) screen (including a touch screen display), a non-volatile memory port, multiple antennas, a graphics chip, an application-specific integrated circuit (ASIC), and a speaker.

[0190] The detection device may use a main control chip as a processor or control module, and sensor data, position information, etc. may be stored in a memory or NVM / storage device. The sensor group may be used as an input / output device, and the communication interface may include a network interface.

[0191] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0192] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0193] This application describes embodiments with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable bill of materials (BOM) engineering change record, query terminal device to generate a machine, such that the instructions executed by the processor of the computer or other programmable BOM engineering change record, query terminal device produce instructions for implementing the process... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0194] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable bill of materials engineering changes to function in a specific manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in the process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0195] These computer program instructions can also be loaded onto computers or other programmable bill of materials (BOM) engineering change recording and querying terminal devices, causing a series of operational steps to be executed on the computer or other programmable terminal device to produce a computer-implemented process. Thus, the instructions executed on the computer or other programmable terminal device provide the means to implement the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0196] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0197] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0198] The foregoing has provided a detailed description of a method and apparatus for recording and querying bill of materials engineering changes, an electronic device, and a storage medium provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for recording changes to a bill of materials (BOM) project, characterized in that, The method includes: Create an engineering change record library for the bill of materials; When an engineering change occurs to a target material in the bill of materials, the engineering change number corresponding to the engineering change is obtained; wherein, the engineering change number has corresponding engineering change attribute information; Confirm the engineering change information of the target material; wherein the engineering change information includes at least the module level of the target material in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred; The engineering change information of the target material is recorded according to a preset recording rule to obtain the engineering change symbol of the target material; the preset recording rule includes at least: Wherein, X represents the module level of the target material in the bill of materials, m represents the serial number of the target material in its module level, and n represents the number of engineering changes to the target material; Assign the engineering change number to the engineering change symbol of the target material and save it to the engineering change record library; A query request for the bill of materials has been received; According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the query request; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes; The step of retrieving the target engineering change symbol from the engineering change record database of the bill of materials according to the preset query rules and the query request includes: When the query request includes a target module hierarchy, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials according to the preset query rules based on the target module hierarchy; wherein, the target engineering change symbol is the engineering change symbol of all materials corresponding to the target module hierarchy, and the engineering change symbol of all materials corresponding to the lower-level module hierarchy of all query sequence numbers of the target module hierarchy. When the query request includes the target query sequence number value of the target module level, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials according to the preset query rules based on the target query sequence number value of the target module level; wherein, the target engineering change symbol is the engineering change symbol of the material corresponding to the target query sequence number value of the target module level, and the engineering change symbols of all materials corresponding to the lower-level module level of the target query sequence number value of the target module level.

2. The method according to claim 1, characterized in that, The module hierarchy in the bill of materials supports personalized customization.

3. A method for querying bill of materials (BOM) engineering changes, characterized in that, The method includes: A query request for the bill of materials has been received; According to the preset query rules, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials based on the query request; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes; wherein, the engineering change record database of the bill of materials is created by the method described in claim 1, and the preset query rules adopt the preset query rules defined in claim 1; The corresponding target project change number is determined based on the target project change symbol; Obtain the target project change attribute information corresponding to the target project change based on the target project change number.

4. The method according to claim 3, characterized in that, After obtaining the target project change attribute information corresponding to the target project change based on the target project change number, the method further includes: Displays the target project change attribute information corresponding to the bill of materials.

5. The method according to claim 4, characterized in that, The target project change attribute information supports custom sorting, addition, and reduction.

6. A recording device for bill of materials engineering changes, characterized in that, The device includes: The record library creation module is used to create an engineering change record library based on the bill of materials; The number acquisition module is used to acquire the engineering change number corresponding to the engineering change when an engineering change occurs to a target material in the bill of materials; wherein, the engineering change number has corresponding engineering change attribute information; An information confirmation module is used to confirm the engineering change information of the target material; wherein, the engineering change information includes at least the module level of the target material in the bill of materials, the serial number of the target material in the module level, and the number of times the engineering change has occurred; A symbol generation module is used to record the engineering change information of the target material according to preset recording rules, and to obtain the engineering change symbol of the target material; the preset recording rules include at least: Wherein, X represents the module level of the target material in the bill of materials, m represents the serial number of the target material in its module level, and n represents the number of engineering changes to the target material; The symbol storage module is used to assign the engineering change number to the engineering change symbol of the target material and save it to the engineering change record library; The request receiving module is used to receive query requests for the bill of materials. The symbol query module is used to query the engineering change record database of the bill of materials according to the preset query rules and the query request to obtain the target engineering change symbol; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes; The step of retrieving the target engineering change symbol from the engineering change record database of the bill of materials according to the preset query rules and the query request includes: When the query request includes a target module hierarchy, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials according to the preset query rules based on the target module hierarchy; wherein, the target engineering change symbol is the engineering change symbol of all materials corresponding to the target module hierarchy, and the engineering change symbol of all materials corresponding to the lower-level module hierarchy of all query sequence numbers of the target module hierarchy. When the query request includes the target query sequence number value of the target module level, the target engineering change symbol is obtained by querying the engineering change record database of the bill of materials according to the preset query rules based on the target query sequence number value of the target module level; wherein, the target engineering change symbol is the engineering change symbol of the material corresponding to the target query sequence number value of the target module level, and the engineering change symbols of all materials corresponding to the lower-level module level of the target query sequence number value of the target module level.

7. A device for querying bill of materials (BOM) engineering changes, characterized in that, The device includes: The request receiving module is used to receive query requests for the bill of materials. The symbol query module is used to query the engineering change record database of the bill of materials according to the query request based on the preset query rules to obtain the target engineering change symbol; wherein, the target engineering change symbol is used to represent the module level of the corresponding material in the bill of materials, the serial number of the corresponding material in the module level, and the number of times the corresponding material has undergone engineering changes; wherein, the engineering change record database of the bill of materials is created by the method described in claim 1, and the preset query rules adopt the preset query rules defined in claim 1; The number determination module is used to determine the corresponding target project change number based on the target project change symbol; The information acquisition module is used to obtain the target project change attribute information corresponding to the target project change based on the target project change number.

8. An electronic device, characterized in that, include: processor; and A memory storing executable code that, when executed, causes the processor to perform a method for recording bill of materials engineering changes as described in one or more of claims 1-2, and a method for querying bill of materials engineering changes as described in one or more of claims 3-5.

9. One or more machine-readable storage media having executable code stored thereon, which, when executed, causes a processor to perform a method for recording a bill of materials engineering change as described in one or more of claims 1-2, and a method for querying a bill of materials engineering change as described in one or more of claims 3-5.

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