Display panel, preparation method thereof and electronic device

Abstract

The application provides a display panel, a preparation method thereof and an electronic device. The display panel has a display area and a non-display area. The display panel comprises a substrate, an identification element arranged on the substrate and located in the non-display area, used for identifying identity information of the display panel, a first planarization layer arranged on the substrate, a second planarization layer stacked on a side of the first planarization layer away from the substrate, the identification element arranged on a side of the second planarization layer close to the substrate, and only a position of the second planarization layer corresponding to the identification element is formed with a first groove among positions of the first planarization layer corresponding to the identification element and positions of the second planarization layer corresponding to the identification element, and a touch inorganic layer covering the second planarization layer and the first groove. The display panel can reduce the risk of fracture of the touch inorganic layer and prevent the invasion of water vapor.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel, its manufacturing method, and an electronic device. Background Technology

[0002] The reliability of flexible organic light-emitting diode (OLED) display devices has always been one of the important indicators for evaluating product performance. In the reliability testing specifications, the 8558 operation is the most stringent test condition, and it is often the most likely to cause adverse reactions during testing.

[0003] In the prior art, a display panel generally includes a substrate, a first planarization layer and a second planarization layer stacked on the substrate, and a touch-sensitive inorganic layer covering the side of the second planarization layer facing away from the first planarization layer. The non-display area of ​​the display panel typically has a QR code located on the side of the first planarization layer closest to the substrate. The first and second planarization layers are recessed towards the QR code, forming a first groove and a second groove, respectively. The width of the first groove is smaller than the width of the second groove, and the touch-sensitive inorganic layer covers the walls of both grooves.

[0004] However, the portion of the touch-sensitive inorganic layer covering the bottom and side walls of the first and second grooves experiences significant stress at the ramp locations. When the display panel is tested in a high-temperature, high-humidity environment for reliability, the connection points of the touch-sensitive inorganic layer at the ramp locations, i.e., the corners of the touch-sensitive inorganic layer, are prone to breakage, leading to adverse reactions. This allows external moisture to penetrate the organic planarization layer through the breakage points, ultimately causing corrosion of the metal trace layer. Therefore, improvements are needed to address the issue of breakage at the connection points of the touch-sensitive inorganic layer. Summary of the Invention

[0005] The display panel, its manufacturing method, and electronic device provided in this application aim to solve the problem that in existing display panels, the connection point of the touch inorganic layer corresponding to the ramp position is prone to breakage, which causes external moisture to penetrate the organic planarization layer from the breakage point, and finally causes corrosion of the metal trace layer.

[0006] To solve the above-mentioned technical problems, this application adopts the following technical solution: providing a display panel and its manufacturing method, and an electronic device. The display panel has a display area and a non-display area, and includes a substrate; an identification element disposed on the substrate and located in the non-display area, used to identify the identity information of the display panel; a first planarization layer disposed on the substrate; a second planarization layer stacked on the side of the first planarization layer facing away from the substrate; the identification element disposed on the side of the second planarization layer close to the substrate; and only the position of the second planarization layer corresponding to the identification element has a first groove formed at the position of the second planarization layer corresponding to the identification element; and a touch-sensitive inorganic layer covering the second planarization layer and the first groove.

[0007] This also includes:

[0008] A metal trace layer is disposed between the first planarization layer and the second planarization layer;

[0009] An isolation post is embedded in the second planarization layer and extends to the surface of the first planarization layer; and the isolation post is located between the first groove and the metal trace layer;

[0010] Preferably, the isolation post is arranged circumferentially around the first groove;

[0011] Preferably, the orthographic projection of the isolation column on the substrate and the orthographic projection of the marking element on the substrate are spaced apart;

[0012] Preferably, the orthographic projection of the marking element on the substrate is located within the orthographic projection of the first groove on the substrate.

[0013] in,

[0014] At least one side of the sidewall of the isolation column is recessed inward to form at least one second groove; a portion of the second planarization layer is embedded in the second groove;

[0015] Preferably, the inner and outer surfaces of the sidewall of the isolation column are both recessed inward to form two second grooves;

[0016] Preferably, the material of the isolation column includes inorganic materials or metallic materials.

[0017] This also includes:

[0018] A first inorganic layer is at least partially disposed between the first planarization layer and the second planarization layer; the first groove extends from the surface of the second planarization layer away from the first planarization layer to the surface of the first inorganic layer; a portion of the touch-sensitive inorganic layer covers the surface of the first inorganic layer exposed through the first groove.

[0019] Preferably, a portion of the first inorganic layer covers the surface of the isolation pillar facing away from the first planarization layer, and the remaining portion is located between the first planarization layer and the second planarization layer; one end of the isolation pillar near the first planarization layer passes through the first inorganic layer and contacts the first inorganic layer;

[0020] Preferably, the surface of the second planarization layer facing away from the first planarization layer is flush with the surface of the first inorganic layer located on the isolation pillar facing away from the isolation pillar.

[0021] This also includes:

[0022] A semiconductor layer is disposed on the side of the first planarization layer opposite to the second planarization layer; the marking element is disposed on the surface of the semiconductor layer opposite to the substrate;

[0023] Preferably, the identification element is a QR code;

[0024] Preferably, a first dielectric layer is further disposed between the first planarization layer and the semiconductor layer, the first dielectric layer covering the marking element and planarizing the side surface of the marking element facing away from the substrate.

[0025] The marking element is disposed between the first inorganic layer and the first planarization layer; or

[0026] The identification element is disposed between the first inorganic layer and the touch-sensitive inorganic layer.

[0027] To solve the aforementioned technical problems, another technical solution adopted in this application is to provide an electronic device. This electronic device includes the display panel described above.

[0028] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a method for manufacturing a display panel. This method includes:

[0029] A panel body is provided; the panel body includes a substrate, an identification element located in a non-display area of ​​the panel body, a first planarization layer disposed on the substrate, and a second planarization layer stacked on the side of the first planarization layer opposite to the substrate;

[0030] A first groove is formed on the second planarization layer at the position corresponding to the marking element;

[0031] A touch-sensitive inorganic layer is formed on the second planarization layer, and the touch-sensitive inorganic layer covers the first groove.

[0032] The step of providing the panel body includes:

[0033] Provide substrate;

[0034] A marking element and a first planarization layer are sequentially formed on the substrate;

[0035] An isolation pillar is formed on the side surface of the first planarization layer facing away from the substrate; the orthographic projection of the isolation pillar on the substrate and the orthographic projection of the marking element on the substrate are spaced apart;

[0036] A second planarization layer is formed on the first planarization layer.

[0037] The step of forming the isolation pillars, but before forming the second planarization layer, further includes:

[0038] A first inorganic layer is formed on the side of the first planarization layer facing away from the substrate; the first inorganic layer covers the first planarization layer and the side of the isolation pillar facing away from the substrate; a second planarization layer is formed on the side of the first inorganic layer facing away from the first planarization layer, and the side of the second planarization layer facing away from the first planarization layer is flush with the side of the first inorganic layer facing away from the isolation pillar located on the isolation pillar.

[0039] Preferably, before the step of forming the first inorganic layer on the surface of the first planarization layer facing away from the substrate, the method further includes:

[0040] At least one side of the sidewall of the isolation post is etched to form at least one second groove.

[0041] The display panel, its fabrication method, and electronic device provided in this application embodiment are described. This display panel is constructed by sequentially stacking a first planarization layer, a second planarization layer, and a touch-sensitive inorganic layer on a substrate. An identification element is disposed on the side of the second planarization layer closest to the substrate. Only the position of the identification element on the first planarization layer and the position of the identification element on the second planarization layer form a first groove. This not only allows for identification of the display panel's identity information through the identification element, but also, because there is only one groove corresponding to the identification element, the portion of the touch-sensitive inorganic layer covering the groove only needs to climb once. That is, the portion of the touch-sensitive inorganic layer corresponding to the groove only has one climbing corner. Compared to existing solutions, this effectively reduces the number of climbing steps for the touch-sensitive inorganic layer, reducing the number of potential breakage points and lowering the risk of breakage. This, in turn, effectively reduces the probability of external moisture intruding into the organic planarization layer from the breakage points of the touch-sensitive inorganic layer, leading to corrosion of the metal trace layer. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1a This is a schematic diagram of the non-display area stacked structure of the display panel provided in the first embodiment of this application;

[0044] Figure 1b This is a schematic diagram of the non-display area stacked structure of a display panel provided in a specific embodiment of this application;

[0045] Figure 2 This is a schematic diagram of the non-display area stacked structure of the display panel provided in the second embodiment of this application;

[0046] Figure 3 This is a schematic diagram of the non-display area stacked structure of the display panel provided in the third embodiment of this application;

[0047] Figure 4 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0048] Figure 5 for Figure 4 A detailed flowchart of step S1 in the fabrication of the display panel;

[0049] Figure 6 A simplified structural diagram of a substrate provided in one embodiment of this application;

[0050] Figure 7 This is a schematic diagram of a structure in which a marking element and a first planarization layer are sequentially formed on a substrate.

[0051] Figure 8 A schematic diagram of a structure for forming an isolation pillar on the side surface of the first planarization layer away from the substrate;

[0052] Figure 9 A schematic diagram of the structure for etching the sidewall of the isolation pillar to form the second groove;

[0053] Figure 10 A schematic diagram of a structure for forming a first inorganic layer on the side of the first planarization layer facing away from the substrate;

[0054] Figure 11 A schematic diagram of the structure for forming a second planarization layer on a first planarization layer;

[0055] Figure 12 This is a schematic diagram of the display panel structure after step S2.

[0056] Figure 13 This is a schematic diagram of the display panel structure after step S3.

[0057] Figure 14 A simplified structural diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0059] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0060] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0061] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0062] Please see Figure 1a , Figure 1a This is a schematic diagram of the non-display area stacked structure of a display panel provided in the first embodiment of this application. In this embodiment, a display panel 10 is provided, which can be an OLED display panel. The display panel 10 has a display area and a non-display area. The display area is used for displaying images; the non-display area is set around the circumferential edge of the display area, and is used for setting metal traces, control units, etc., and does not display images; it can be understood that the non-display area is actually the border area of ​​the display panel.

[0063] like Figure 1aAs shown, the display panel 10 includes a substrate 1, a semiconductor layer 2, a first dielectric layer 3, a first planarization layer 4, a second planarization layer 5, a touch inorganic layer 6, an identification element P, and a metal wiring layer M, which are sequentially stacked on the substrate 1. The identification element P is disposed on the substrate 1 and located in the non-display area, used to identify the identity information of the display panel 10. The metal wiring layer M is disposed between the first planarization layer 4 and the second planarization layer 5. Specifically, the metal wiring layer M is a driving circuit found on conventional display panels, used to drive the display panel to display after the display panel 10 is powered on; for example, it is used to control the on / off state of TFT devices.

[0064] The substrate 1 can be a rigid substrate or a flexible substrate. The rigid substrate can be made of glass, rigid film, etc., and the flexible substrate can be made of polyimide (PI) resin or modified polyimide (PI) resin.

[0065] A semiconductor layer 2 is disposed on the substrate 1, and the material of the semiconductor layer 2 includes at least one of silicon nitride (SiNx) and silicon oxide (SiOx). In a specific embodiment, the semiconductor layer 2 can be a single layer of silicon oxide (SiOx) film or silicon nitride (SiNx) film, or a stack of silicon oxide (SiOx) and silicon nitride (SiNx), and completely covers the surface of the substrate 1.

[0066] Specifically, the identification element P can be disposed on the side surface of the semiconductor layer 2 away from the substrate 1; and the identification element P can be a QR code, so that the reading device can read the identity information of the display panel through the identification element P; of course, the identification element P can also be other barcodes, letters, numbers and other identification symbols that can identify the identity information of the display panel 10.

[0067] The first dielectric layer 3 is disposed on the side surface of the semiconductor layer 2 facing away from the substrate 1, covers the marking element P, and planarizes the side surface of the marking element P facing away from the substrate 1. The first dielectric layer 3 serves as an electrical insulating layer between different layers, acting as a separator between two adjacent layers. The material of the first dielectric layer 3 includes at least one of silicon nitride (SiNx) and silicon oxide (SiOx). In a specific embodiment, the first dielectric layer 3 can be a single layer of silicon oxide (SiOx) or silicon nitride (SiNx), or a stack of silicon oxide (SiOx) and silicon nitride (SiNx).

[0068] The first planarization layer 4 is disposed on the surface of the first dielectric layer 3 facing away from the semiconductor layer 2; the first planarization layer 4 has no groove at the position corresponding to the marking element P. Specifically, the first planarization layer 4 covers the first dielectric layer 3.

[0069] The second planarization layer 5 is stacked on the surface of the first planarization layer 4 facing away from the first dielectric layer 3. The second planarization layer 5 has a first groove a corresponding to the position of the marking element P; wherein, as shown... Figure 1a As shown, the first groove a can be a through hole penetrating the second planarization layer 5; of course, as Figure 1b As shown, the first groove a can also be a blind hole with an opening on one side. Setting the first groove a facilitates the reading device in reading the identity information of the identification element P, improving the success rate of reading. Specifically, the cross-section of the first groove a can be an inverted trapezoidal groove, which can be an isosceles trapezoid or a non-isosceles trapezoid. To better read the information of the identification element P, the area of ​​the bottom of the first groove a is equal to or greater than the area occupied by the identification element P; this can be understood as the orthographic projection of the identification element P on the substrate 1 being located within the orthographic projection of the first groove a on the substrate 1, to prevent the first groove a from obscuring the identification element P.

[0070] In a specific embodiment, the materials of the first planarization layer 4 and the second planarization layer 5 include organic insulating materials. Optionally, the materials of the first planarization layer 4 and the second planarization layer 5 include polyimide.

[0071] The touch-sensitive inorganic layer 6 is disposed on the second planarization layer 5 and covers the second planarization layer 5 and the surface exposed by the first groove a. Optionally, the material of the touch-sensitive inorganic layer 6 includes silicon nitride (SiNx).

[0072] Those skilled in the art will understand that in the display panel provided in this embodiment, in the first planarization layer 4 and the second planarization layer 5, only the second planarization layer 5 has a groove at the position corresponding to the identification element P, namely the first groove a. Compared with the prior art, where grooves are set at the positions corresponding to the identification element in the first planarization layer 4 and the positions corresponding to the identification element P in the second planarization layer 5, forming two slopes, so that the part of the touch inorganic layer 6 located in the groove needs to climb twice, the solution provided in this application only requires the part of the touch inorganic layer 6 located in the groove to climb once. That is to say, the part of the touch inorganic layer 6 located in the groove in this application has a corner along the stacking direction of the display panel 10, thereby effectively reducing the number of times the touch inorganic layer 6 climbs, reducing the number of possible breakage positions of the touch inorganic layer 6, reducing the risk of breakage of the touch inorganic layer 6, and thus effectively reducing the probability of external moisture invading the first planarization layer 4 and / or the second planarization layer 5 from the breakage position of the touch inorganic layer 6, causing corrosion problems in the metal trace layer M located between the two.

[0073] Of course, in specific embodiments, the display panel 10 also includes an adhesive layer, a touch sensor / touch panel and other functional layers disposed on the touch inorganic layer 6. The specific structure and function of these functional layers are the same as or similar to the structure and function of the relevant functional layers in the existing display panel 10. For details, please refer to the prior art, which will not be repeated here.

[0074] Please refer to further information. Figure 2 , Figure 2 This is a schematic diagram of the non-display area stacked structure of a display panel provided in the second embodiment of this application. Unlike the embodiments described above, this display panel 10 also includes isolation pillars 7.

[0075] The isolation pillar 7 is located between the first groove a and the metal trace layer M in a direction perpendicular to the stacking direction of the display panel 10 (hereinafter referred to as the horizontal direction), and is embedded in the second planarization layer 5 to isolate the first groove a from the metal trace layer M. By setting the isolation pillar 7, even if the touch inorganic layer 6 breaks at the ramp position, and moisture enters the second planarization layer 5 from the break position, the isolation pillar 7 can prevent the moisture from further penetrating into the metal trace layer M in the horizontal direction, thereby protecting the metal trace layer M from corrosion.

[0076] Specifically, the isolation column 7 can be arranged circumferentially around the first groove a to block further intrusion of water vapor from all directions of the first groove a.

[0077] like Figure 2 As shown, at least one side of the sidewall of the isolation pillar 7 is recessed inward to form at least one second groove b. By forming the second groove b, the contact area between the isolation pillar 7 and the second planarization layer 5 can be increased, reducing the probability of delamination between the isolation pillar 7 and the second planarization layer 5. In a specific embodiment, both the inner and outer sides of the sidewall of the isolation pillar 7 are recessed inward to form two second grooves b. The inner side refers to the side of the isolation pillar 7 facing the first groove a, and the outer side refers to the sidewall of the isolation pillar 7 facing away from the first groove a.

[0078] Specifically, the material of the isolation column 7 includes at least one of inorganic materials or metallic materials.

[0079] Specifically, the orthographic projection of the isolation pillar 7 on the substrate 1 and the orthographic projection of the marking element P on the substrate 1 are spaced apart to prevent the isolation pillar 7 from affecting the reading of the marking element P.

[0080] The display panel 10 provided in this embodiment not only has the beneficial effects of the first embodiment, but also, by embedding an isolation post 7 in the second planarization layer 5 between the first groove a and the metal trace layer M, even if the touch inorganic layer 6 breaks at the climbing position and water vapor enters the second planarization layer 5 from the break position, the isolation post 7 can prevent the water vapor from further penetrating into the metal trace layer M in the horizontal direction, thereby protecting the metal trace layer M from corrosion.

[0081] Please see Figure 3 , Figure 3 This is a schematic diagram of the non-display area stacked structure of a display panel provided in the third embodiment of this application. Unlike the second embodiment described above, the display panel 10 in this embodiment further includes a first inorganic layer 8, at least partially disposed between the first planarization layer 4 and the second planarization layer 5. By disposing of the first inorganic layer 8 between the first planarization layer 4 and the second planarization layer 5, external moisture entering the second planarization layer 5 can be prevented from further penetrating to the first planarization layer 4, thus preventing the first planarization layer 4 from absorbing water and expanding, causing delamination between it and the upper or lower organic or inorganic layers.

[0082] Specifically, a portion of the first inorganic layer 8 covers the surface of the isolation pillar 7 facing away from the first planarization layer 4, while the remaining portion is located between the first planarization layer 4 and the second planarization layer 5. One end of the isolation pillar 7 near the first planarization layer 4 passes through and contacts the first inorganic layer 8; that is, the circumferential edge of the end of the isolation pillar 7 near the first planarization layer 4 contacts the first inorganic layer 8. This prevents external moisture entering the second planarization layer 5 from permeating into the first planarization layer 4 through the gap between the isolation pillar 7 and the first inorganic layer 8.

[0083] In a specific embodiment, the surface of the first inorganic layer 8 located on the isolation pillar 7 facing away from the isolation pillar 7 is flush with the surface of the second planarization layer 5 facing away from the first planarization layer 4. Optionally, the material of the first inorganic layer 8 is silicon nitride (SiNx).

[0084] In a specific embodiment, the first groove a extends from the side surface of the second planarization layer 5 away from the first planarization layer 4 to the surface of the first inorganic layer 8; a portion of the touch-sensitive inorganic layer 6 covers the surface C of the first inorganic layer 8 exposed through the first groove a.

[0085] In this embodiment, the identification element P can also be disposed between the first inorganic layer 8 and the first planarization layer 4; or the identification element P can be disposed between the first inorganic layer 8 and the touch inorganic layer 6; thus, the first planarization layer 4 can be prevented from affecting the identification process of the identification element P, and the identification success rate of the identification element P can be improved.

[0086] The display panel 10 provided in this embodiment not only has the beneficial effects of all the above embodiments, but also provides a first inorganic layer 8 between the first planarization layer 4 and the second planarization layer 5. Specifically, a portion of the first inorganic layer 8 covers the surface of the isolation pillar 7 facing away from the first planarization layer 4; the remaining portion is located between the first planarization layer 4 and the second planarization layer 5 to form a discontinuous first inorganic layer 8. By providing the first inorganic layer 8, external moisture entering the second planarization layer 5 can be prevented from further penetrating into the first planarization layer 4, causing the first planarization layer 4 to absorb water and expand, resulting in delamination with the organic or inorganic layers above and below. Furthermore, a first groove a is formed by only the second planarization layer 5 corresponding to the identification element P in the first planarization layer 4 and the second planarization layer 5 corresponding to the identification element P; and an isolation pillar 7 is embedded in the second planarization layer 5 between the first groove a and the metal wiring layer M, with the isolation pillar 7 configured as an eaves shape with second grooves b on both side walls. Compared to the two grooves in the prior art, the first groove a is set only in the second planarization layer 5, which effectively reduces the number of times the touch inorganic layer 6 climbs, reduces the number of possible fracture locations of the touch inorganic layer 6, and lowers the risk of the touch inorganic layer 6 fracture; at the same time, even if the touch inorganic layer 6 fractures, the set isolation pillar 7 can further prevent moisture intrusion and protect the metal trace layer M from corrosion.

[0087] Of course, in other specific embodiments, the first groove a may further extend to the surface of the first planarization layer 4 facing away from the second planarization layer 5, and the entire sidewall of the first groove a is a smooth transition, that is, the vertical cross-section of the sidewall of the first groove a is linearly distributed. In this way, the part of the touch inorganic layer 6 located in the groove can also climb only once, thereby effectively reducing the number of times the touch inorganic layer 6 climbs, reducing the number of possible fracture locations of the touch inorganic layer 6, reducing the risk of fracture of the touch inorganic layer 6, and thus effectively reducing the probability of external moisture intruding into the first planarization layer 4 and / or the second planarization layer 5 from the fracture location of the touch inorganic layer 6, causing corrosion problems in the metal trace layer M located between the two.

[0088] Please refer to further information. Figure 4 and Figure 5 , Figure 4 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application; Figure 5 for Figure 4 A detailed flowchart of step S1 in the fabrication of the display panel is provided. In this embodiment, a method for fabricating a display panel is provided, which can be used to fabricate the display panel 10 provided in the above embodiment. The method includes:

[0089] Step S1: Provide the main panel.

[0090] In the specific implementation process, step S1 specifically includes:

[0091] Step S11: Provide a substrate.

[0092] See Figure 6 , Figure 6 This is a simplified structural diagram of a substrate provided in an embodiment of this application; wherein, substrate 1 can be a rigid substrate or a flexible substrate. The rigid substrate can be made of glass, rigid film, etc., and the flexible substrate can be made of polyimide (PI) resin or modified polyimide (PI) resin. A semiconductor layer 2 can be disposed on the surface of substrate 1.

[0093] Step S12: A marking element and a first planarization layer are sequentially formed on the substrate.

[0094] In the specific implementation process, please refer to Figure 7 , Figure 7 This is a schematic diagram showing the structure in which an identification element and a first planarization layer are sequentially formed on a substrate. An identification element P, which allows for identification, is formed on the semiconductor layer 2 at a location corresponding to a non-display area using laser etching. Then, a first dielectric layer 3 is deposited on the substrate 1 using a deposition process. The first dielectric layer 3 completely covers the identification element P and planarizes the surface of the identification element P facing away from the substrate 1. Next, a first planarization layer 4 is formed by deposition on the surface of the first dielectric layer 3 facing away from the substrate. The material of the first planarization layer 4 includes an organic insulating material.

[0095] Step S13: Form an isolation pillar on the side surface of the first planarization layer opposite to the substrate.

[0096] For details, please refer to Figure 8 , Figure 8 This is a schematic diagram of a structure forming an isolation pillar on the surface of the first planarization layer facing away from the substrate. Before or after step S13, a metal trace layer M is formed on the surface of the first planarization layer 4 facing away from the first dielectric layer 3. An isolation pillar 7 is provided on the surface of the first planarization layer 4 facing away from the first dielectric layer 3. The orthographic projection of the isolation pillar 7 on the substrate 1 is spaced apart from the orthographic projection of the identification element P on the substrate 1 to prevent the isolation pillar 7 from affecting the identification of the identification element P. Specifically, the orthographic projection of the isolation pillar 7 on the substrate 1 is located between the orthographic projections of the identification element P and the metal trace layer M on the substrate 1, so as to prevent moisture from entering the metal trace layer M through the subsequently formed first groove a. The specific material of the isolation pillar 7 includes at least one of inorganic materials or metallic materials.

[0097] In the specific implementation process, step S13 further includes: etching at least one side of the sidewall of the isolation pillar 7 to form at least one second groove b.

[0098] For details, please refer to Figure 9 , Figure 9 A schematic diagram of the structure for etching the side wall of the isolation column to form the second groove; the inner and outer sides of the side wall of the isolation column 7 are etched inward to form two second grooves b, at which point the isolation column 7 is in the shape of an eave.

[0099] In a specific implementation process, after step S13, it may further include: forming a first inorganic layer 8 on the side surface of the first planarization layer 4 facing away from the substrate 1.

[0100] For details, please refer to Figure 10 , Figure 10 This is a schematic diagram of a structure for forming a first inorganic layer on the surface of the first planarization layer facing away from the substrate. The first inorganic layer 8 can be formed by film deposition. As shown in the figure, the first inorganic layer 8 is a discontinuous film structure. Part of the first inorganic layer 8 covers the surface of the first planarization layer 4, and the remaining part covers the surface of the isolation pillar 7 facing away from the substrate 1. Of course, those skilled in the art will understand that step S14 can be performed directly after step S13.

[0101] Step S14: Form a second planarization layer on the first planarization layer.

[0102] For details, please refer to Figure 11 , Figure 11 A schematic diagram of a structure for forming a second planarization layer on a first planarization layer; a second planarization layer 5 is formed by coating on the side surface of the first inorganic layer 8 away from the first planarization layer 4, and the side surface of the second planarization layer 5 away from the first planarization layer 4 is flush with the side surface of the first inorganic layer 8 located on the isolation pillar 7 away from the isolation pillar 7; the material of the second planarization layer 5 includes organic insulating material.

[0103] Step S2: Create a first groove on the second planarization layer corresponding to the position of the marking element.

[0104] For details, please refer to Figure 12 , Figure 12 This is a schematic diagram of the display panel after step S2. A photolithography process is used to remove the position corresponding to the identification element P in the second planarization layer 5, forming a first groove a penetrating the second planarization layer 5. This facilitates reading the identification information of the device identification element P and improves the success rate of reading. The cross-section of the first groove a is an inverted trapezoidal groove, which can be an isosceles trapezoid or a non-isosceles trapezoid. The orthographic projection of the identification element P on the substrate 1 is located within the orthographic projection of the first groove a on the substrate 1, allowing for better reading of the information of the identification element P.

[0105] Specifically, the isolation pillar 7 is located between the first groove a and the metal trace layer M, so as to block moisture from further penetrating into the metal trace layer M in the horizontal direction, thereby protecting the metal trace layer M from corrosion.

[0106] Step S3: Form a touch inorganic layer on the second planarization layer and make the touch inorganic layer cover the first groove.

[0107] For details, please refer to Figure 13 , Figure 13 This is a schematic diagram of the display panel structure after step S3. A touch-sensitive inorganic layer 6 is deposited on the second planarization layer 5, covering the side surface of the second planarization layer 5 opposite to the first planarization layer 4, as well as the bottom and side walls of the first groove a. The touch-sensitive inorganic layer 6 prevents moisture intrusion, and its material is silicon nitride.

[0108] In this application, the structure of the OLED display panel can be prepared according to existing conventional processes, and this application does not impose any special limitations.

[0109] The display panel manufacturing method provided in this embodiment, by forming a first groove a only at the position corresponding to the identification element P in the second planarization layer 5, not only facilitates reading the identity information of the device identification element P and improves the success rate of reading, but also reduces the risk of breakage of the touch inorganic layer 6 compared to the two grooves in the prior art. Simultaneously, an isolation pillar 7 is provided on the first planarization layer 4, positioned between the first groove a and the metal trace layer M, to prevent moisture from further penetrating horizontally into the metal trace layer M, thereby protecting the metal trace layer M from corrosion. Furthermore, by further providing a first inorganic layer 8 between the first planarization layer 4 and the second planarization layer 5, it is possible to prevent external moisture entering the second planarization layer 5 from further penetrating into the first planarization layer 4, thus preventing the first planarization layer 4 from absorbing water and expanding, causing delamination between the upper and lower organic or inorganic layers.

[0110] See Figure 14 , Figure 14 This is a simplified structural diagram of an electronic device provided in one embodiment of this application. This application also provides an electronic device, which can be a desktop computer, laptop computer, mobile phone, television, etc. The electronic device includes a display panel 10 for displaying images during operation. The display panel 10 is the same as the display panel 10 described in any of the above embodiments. The specific structure and function of the display panel 10 can be found in the relevant descriptions of the display panel 10 provided in the above embodiments, and will not be repeated here.

[0111] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel having a display area and a non-display area, characterized in that, The display panel includes: substrate; An identification element is disposed on the substrate and located in the non-display area, and is used to identify the identity information of the display panel; A first planarization layer is disposed on the substrate; A second planarization layer is stacked on the side of the first planarization layer facing away from the substrate; the marking element is disposed on the side of the second planarization layer close to the substrate; and only the position of the marking element corresponding to the first planarization layer and the position of the marking element corresponding to the second planarization layer have a first groove formed at the position of the marking element corresponding to the second planarization layer. A touch-sensitive inorganic layer covers the second planarization layer and the first groove; An isolation column is embedded in the second planarization layer; at least one side of the sidewall of the isolation column is recessed inward to form at least one second groove; a portion of the second planarization layer is embedded in the second groove; A metal trace layer is disposed between the first planarization layer and the second planarization layer; the isolation pillar is located between the first groove and the metal trace layer.

2. The display panel according to claim 1, characterized in that, The isolation column is arranged in a circumferential ring around the first groove.

3. The display panel according to claim 1, characterized in that, The orthographic projection of the isolation column on the substrate and the orthographic projection of the marking element on the substrate are spaced apart.

4. The display panel according to claim 1, characterized in that, The orthographic projection of the marking element on the substrate is located within the orthographic projection of the first groove on the substrate.

5. The display panel according to claim 1, characterized in that, The inner and outer sides of the sidewall of the isolation column are both recessed inward to form two second grooves.

6. The display panel according to claim 1, characterized in that, The isolation column can be made of inorganic materials or metallic materials.

7. The display panel according to claim 1, characterized in that, Also includes: A first inorganic layer is at least partially disposed between the first planarization layer and the second planarization layer; the first groove extends from the side surface of the second planarization layer opposite to the first planarization layer to the surface of the first inorganic layer; a portion of the touch-sensitive inorganic layer covers the surface of the first inorganic layer exposed through the first groove.

8. The display panel according to claim 7, characterized in that, A portion of the first inorganic layer covers the surface of the isolation pillar opposite to the first planarization layer, while the remaining portion is located between the first planarization layer and the second planarization layer.

9. The display panel according to claim 7, characterized in that, The surface of the second planarization layer facing away from the first planarization layer is flush with the surface of the first inorganic layer on the isolation pillar facing away from the isolation pillar.

10. The display panel according to any one of claims 1-9, characterized in that, Also includes: A semiconductor layer is disposed on the side of the first planarization layer opposite to the second planarization layer; the marking element is disposed on the surface of the semiconductor layer opposite to the substrate.

11. The display panel according to claim 10, characterized in that, The identification element is a QR code.

12. The display panel according to claim 10, characterized in that, A first dielectric layer is further disposed between the first planarization layer and the semiconductor layer. The first dielectric layer covers the marking element and planarizes the side surface of the marking element that is away from the substrate.

13. The display panel according to any one of claims 7-9, characterized in that, The marking element is disposed between the first inorganic layer and the first planarization layer; or The identification element is disposed between the first inorganic layer and the touch-sensitive inorganic layer.

14. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1-13.

15. A method for manufacturing a display panel, characterized in that, include: A panel body is provided; the panel body includes a substrate, an identification element located in a non-display area of ​​the panel body, a first planarization layer disposed on the substrate, a second planarization layer stacked on the side of the first planarization layer opposite to the substrate, isolation pillars, and a metal trace layer; the isolation pillars are embedded in the second planarization layer; at least one side of the sidewall of the isolation pillar is recessed inward to form at least one second groove; a portion of the second planarization layer is embedded in the second groove; the metal trace layer is disposed between the first planarization layer and the second planarization layer; A first groove is formed on the second planarization layer corresponding to the position of the marking element; the isolation post is located between the first groove and the metal trace layer; A touch-sensitive inorganic layer is formed on the second planarization layer, and the touch-sensitive inorganic layer covers the first groove.

16. The method for manufacturing a display panel according to claim 15, characterized in that, The step of providing the panel body includes: Provide substrate; A marking element and a first planarization layer are sequentially formed on the substrate; An isolation pillar is formed on the side surface of the first planarization layer facing away from the substrate; the orthographic projection of the isolation pillar on the substrate and the orthographic projection of the marking element on the substrate are spaced apart; A second planarization layer is formed on the first planarization layer.

17. The method for manufacturing a display panel according to claim 16, characterized in that, After the step of forming the isolation pillars and before the formation of the second planarization layer, the method further includes: A first inorganic layer is formed on the side surface of the first planarization layer facing away from the substrate; the first inorganic layer covers the first planarization layer and the side surface of the isolation pillar facing away from the substrate; a second planarization layer is formed on the side surface of the first inorganic layer facing away from the first planarization layer, and the side surface of the second planarization layer facing away from the first planarization layer is flush with the side surface of the first inorganic layer facing away from the isolation pillar located on the isolation pillar.

18. The method for manufacturing a display panel according to claim 17, characterized in that, Before the step of forming the first inorganic layer on the side of the first planarization layer facing away from the substrate, the method further includes: At least one side of the sidewall of the isolation post is etched to form at least one second groove.

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