An apparatus and method for reducing network failures of an RGMII interface

Abstract

A device and method for reducing network faults of an RGMII interface, characterized by including a temperature acquisition module and a ZYNQ module. When the MCU of the temperature acquisition module detects abnormal temperature and abnormal RGMII interface, the transmission bandwidth of the RGMII interface is reduced. When it is judged that the RGMII interface is normal and the operating bandwidth is lower than the target bandwidth, a signal for controlling the temperature to rise is sent, and when it is judged that the temperature has risen to the normal working range, the RGMII is controlled to increase the working bandwidth to the target working bandwidth; the stability of the RGMII interface in extreme environments is improved, the risk of network faults is reduced, and further the maintenance cost of RGMII interface devices is reduced.

Description

Technical Field

[0001] The present invention belongs to the field of communication technologies, relates to a ZYNQ chip technology, and particularly relates to a device and method for reducing network faults of an RGMII interface. Background Art

[0002] The ZYNQ chip uses an RGMII interface to implement Ethernet communication, and its communication rate can reach gigabit. The fast transmission rate can meet the existing large data transmission requirements, so it is adopted by various devices. However, there is a problem with the RGMII interface of the ZYNQ series chips, that is, the transmission delay from the data link layer MAC end to the physical layer PHY end cannot be adjusted, and the available delay of a general PHY chip can only be delayed by 1 ns. In order to improve the stability of the system, it is generally required that the transmission delay can reach 2 ns. It is precisely because of this characteristic that when the RGMII interface is in an extreme environment such as extremely low temperature (below -30 °C) and running at a high speed (gigabit network), data packet loss, data mistransmission, or data retransmission are very likely to occur. To solve this problem, the usual method is to restart the device by powering it on again, and frequent power-on startups cause great damage to the device. When the network fails and is ignored, it will further directly disconnect from the network. After the network is disconnected, the background interaction terminal cannot control the device, and on-site maintenance is required. Since the device is in an extreme environment and desolate, the maintenance cost is high. Summary of the Invention

[0003] To solve the above-mentioned problems of the prior art, the present invention provides a device for reducing network faults of an RGMII interface, aiming to improve the stability of the RGMII interface in extreme environments, reduce the number of system restarts, reduce the risk of network faults, and thereby reduce the maintenance cost of devices using the RGMII interface.

[0004] To achieve the above object, the technical solution adopted by the present invention is: providing a device for reducing network faults of an RGMII interface, characterized by including,

[0005] A temperature acquisition module, including an MCU and a temperature acquisition chip;

[0006] A ZYNQ module, including a processor, an RGMII interface, and an external interface;

[0007] Wherein, the temperature acquisition chip acquires temperature information and sends it to the MCU of the temperature acquisition module;

[0008] The MCU of the temperature acquisition module obtains temperature information, determines whether the temperature is abnormal, and receives the data sent by the ZYNQ module through the RGMII interface, and determines whether the RGMII interface is abnormal. When the temperature is abnormal and the RGMII interface is abnormal, a signal to reduce the transmission bandwidth of the RGMII interface is sent to the external interface of the ZYNQ;

[0009] When the MCU of the temperature acquisition module determines that the RGMII interface is normal and the operating bandwidth is lower than the minimum bandwidth, a signal to control the temperature increase is sent to the processor of the ZYNQ;

[0010] When the MCU of the temperature acquisition module determines that the temperature has risen to the normal operating range, a signal to control the RGMII interface to work at the target bandwidth is sent to the processor of the ZYNQ;

[0011] When the processor of the ZYNQ receives a signal to reduce the transmission bandwidth of the RGMII interface, it reduces the transmission bandwidth of the device; and after receiving the signal to control the temperature increase, it controls the temperature of the device to increase; when receiving the signal to control the RGMII interface to work at the target bandwidth, it controls the RGMII interface to work at the target bandwidth.

[0012] Preferably, the temperature acquisition module has multiple temperature acquisition chips, and the temperature acquisition chips are used to acquire the ambient temperature, the temperature at the RGMII interface, and the temperature at the device processor;

[0013] Preferably, the MCU has a power management component, the ZYNQ has a power signal receiving end, and the power management component is electrically connected to the power signal receiving end.

[0014] A method for reducing network faults of the RGMII interface is applied to the device for reducing network faults of the RGMII interface, and is characterized by including the following steps,

[0015] S1. At the initial moment, power on the device to make the RGMII interface work at the target bandwidth;

[0016] S2. The MCU obtains the temperature information collected by the temperature sensing chip, determines whether the temperature is abnormal, and receives the data sent by the ZYNQ module through the RGMII interface, and determines whether the RGMII interface is abnormal;

[0017] S3. When the RGMII interface is abnormal and the temperature is abnormal, reduce the transmission bandwidth of the RGMII interface; when the RGMII interface is normal, perform normal data transmission at the target bandwidth;

[0018] S4. After reducing the transmission bandwidth of the RGMII interface, if it is detected that the RGMII interface is normal, heat up the device, and if the RGMII interface is abnormal, jump back to S1 to perform a power-on reset on the device;

[0019] S5. Use the temperature sensing chip to collect temperature information, and determine whether the current temperature information belongs to the normal operating range. If the temperature information belongs to the normal operating range, then adjust the operating bandwidth of the RGMII interface back to the target bandwidth.

[0020] Preferably, the device is heated by increasing the operating frequency of the processing system of the ZYNQ module.

[0021] Preferably, S3 includes the following steps.

[0022] S31. When the RGMII interface is abnormal and the device temperature is in the first temperature range, configure the bandwidth of the RGMII interface to be the first bandwidth. When the RGMII interface is abnormal and the device temperature is in the second temperature range, configure the bandwidth of the RGMII interface to be the second bandwidth. When the RGMII interface is abnormal and the device temperature is in the normal operating range, determine that the device is abnormal and directly perform a power-on reset.

[0023] Among them, the lowest temperature of the first temperature range is greater than the highest temperature of the second temperature range, and the lowest temperature of the normal operating range is greater than the highest temperature of the first temperature range; the first temperature range and the second temperature range are cases of abnormal temperature.

[0024] S32. Determine whether the RGMII interface is abnormal at the first bandwidth. If it is abnormal, configure the bandwidth of the RGMII interface to be the second bandwidth, and the first bandwidth is greater than the second bandwidth.

[0025] Preferably, in S5,

[0026] Judge the temperature information obtained by the MCU. If the temperature obtained by the MCU belongs to the first temperature range, configure the bandwidth of the RGMII interface to be the first bandwidth. If the temperature obtained by the MCU is greater than the threshold, configure the bandwidth of the RGMII interface to be the target bandwidth.

[0027] Preferably, the first temperature range is (-20±T1)°C to (-30±T2)°C, the second temperature range is less than (-30±T1)°C, T1 is the low temperature fluctuation range of the first temperature range, and T2 is the high temperature fluctuation range of the first temperature range.

[0028] The target bandwidth is 1000 Mb / s, the first bandwidth is 100 Mb / s, and the second bandwidth is 10 Mb / s.

[0029] Preferably, in S2,

[0030] Multiple temperature acquisition chips obtain temperature information at different positions of the device, and perform data processing on the temperature information obtained by the multiple temperature acquisition chips to obtain temperature data D1.

[0031] Preferably, the temperature acquisition chip samples multiple times within one sampling period, and the temperature data D2 is obtained by filtering the acquired temperature information.

[0032] Preferably, the MCU regularly sends messages to the PS through the switching chip. If the MCU can receive the preset message within the preset time period, it indicates that the RGMII interface is normal; otherwise, it indicates that the RGMII interface is abnormal.

[0033] Among them, the messages correspond to the preset messages one by one.

[0034] The beneficial effects of the present invention are reflected in providing a device and method for reducing network failures of the RGMII interface. After the device is powered on and started, when the RGMII interface is detected to be abnormal, the bandwidth is reduced to avoid the direct disconnection of the RGMII interface network. When the RGMII interface is ensured to be connected, the device is heated up. When the temperature of the device is at the normal operating temperature, the working bandwidth of the RGMII interface is slowly increased, and finally the RGMII interface operates at the target bandwidth, reducing the network interruption rate when the device is in an extreme environment such as extremely low temperature and powered on and started. Due to the working environment, the device directly operates at the target bandwidth, and thus the background device cannot control and maintain the device through the network. The present invention can greatly improve the problem of difficult abnormal handling of the RGMII interface in a harsh environment. Description of the Drawings

[0035] Figure 1 It is a schematic diagram of the RGMII interface connection;

[0036] Figure 2 It is a schematic diagram of the RGMII interface receiving timing;

[0037] Figure 3 It is a schematic diagram of the device of the present invention;

[0038] Figure 4 It is a schematic diagram of the overall method of the present invention;

[0039] Figure 5 It is a schematic diagram of a partial method of the present invention;

[0040] Figure 6 It is a schematic diagram of a device for detecting the RGMII interface. Detailed Embodiments

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] Please refer to Figures 1-6 as shown below. The specific embodiments provided by the present invention are as follows: Embodiment 1:

[0043] A device for reducing network failures of the RGMII interface, characterized by comprising

[0044] a temperature acquisition module, including an MCU and a temperature acquisition chip;

[0045] a ZYNQ module, including a processor, an RGMII interface, and an external interface;

[0046] wherein, the temperature acquisition chip acquires temperature information and sends it to the MCU of the temperature acquisition module;

[0047] the MCU of the temperature acquisition module obtains the temperature information, determines whether the temperature is abnormal, and receives the data sent by the ZYNQ module through the RGMII interface, determines whether the RGMII interface is abnormal. When the temperature is abnormal and the RGMII interface is abnormal, a signal for reducing the transmission bandwidth of the RGMII interface is sent to the external interface of the ZYNQ;

[0048] when the MCU of the temperature acquisition module determines that the RGMII interface is normal and the operating bandwidth is lower than the minimum bandwidth, a signal for controlling the temperature to rise is sent to the processor of the ZYNQ;

[0049] when the processor of the ZYNQ receives a signal for reducing the transmission bandwidth of the RGMII interface, it reduces the transmission bandwidth of the device; and after receiving the signal for controlling the temperature to rise, it controls the temperature of the device to rise.

[0050] The RGMII interface is a common gigabit network communication interface between the MAC and the PHY. It uses a 4-bit data interface, the working clock is 125 MHz, and data is transmitted simultaneously at the rising edge and the falling edge. Therefore, the transmission rate can reach 1000 Mbps. The schematic diagram of the RGMII interface is as Figure 1 shown, wherein, TXD represents the word-bit data output by the MAC side, TX_CTL represents the control signal output by the MAC side, and TX_CLK represents the transmission clock signal output by the MAC side. RXD represents the word-bit data of the Ethernet output by the PHY side, RX_CTL represents the control signal of the Ethernet output by the PHY side, RX_CLK represents the receive clock signal of the Ethernet output by the PHY side, and DELAY represents the delay module of the PHY chip.

[0051] The schematic diagram of the interface reception timing of the RGMII interface is as Figure 2As shown in the figure, RXD[3:0] represents the lower 4 bits of the bit data output by the PHY side during the rising edge for transmitting bit data, and RXD[4:7] represents the higher 4 bits of the bit data output by the PHY side during the falling edge for transmitting bit data. RX_DV represents the valid signal transmitted by the control signal output by the PHY side during the rising edge, and RX_EN represents the error signal transmitted by the control signal output by the PHY side during the falling edge. At a transmission rate of 1000 Mbps, the period of RX_CLK is 8 ns. Within one period, the data RXD synchronizes data changes at both the rising and falling edges of RX_CLK. The RGMII specification requires the receiving end to sample with a 2-ns delay of RX_CLK1 to ensure accurate sampling of RXD.

[0052] However, in the actual application environment, the transmission delay from the MAC to the PHY of the RGMII interface of the ZYNQ series chips cannot be adjusted, and at the same time, the available DELAY time delay of common PHY chips does not meet 2 ns. This inherent defect will cause situations such as transmission data delay or missing transmission data in the current RGMII link; when the environment is extremely low temperature, such as below -30°C, the probability of data network transmission failure increases greatly. This network failure usually manifests as data packet loss, data mistransmission, or data retransmission; after a network failure occurs, as the device starts to work and generates power consumption, the working environment temperature of the RGMII interface increases, but at this time the network will not automatically return to normal as the ambient temperature rises. To solve this problem, the commonly used method is to power on and restart the device, but frequent power on and restart cause great damage to the device. And when the network fails and is ignored, it will further directly disconnect from the network. After the network is disconnected, the background interaction end cannot control the device, and on-site maintenance is required. Since the device is in an extreme environment and desolate, the maintenance cost is high.

[0053] In this embodiment, as Figure 3As shown in the figure, a device for reducing network faults of the RGMII interface is provided, which is characterized by including a temperature acquisition module, a ZYNQ module, and a switching chip. Among them, the temperature acquisition module has an MCU and a temperature acquisition chip, and the MCU is electrically connected to the temperature acquisition chip. The MCU has a first data transmission end and a second data transmission end. Among them, the ZYNQ module has a PS, and the PS has an RGMII interface and a temperature communication interface. The PS is the processing system of the ZYNQ module. Among them, the switching chip has a first access end, a second access end, and a background interaction end. The first access end is electrically connected to the RGMII interface, the second access end is electrically connected to the first data transmission end, and the background interaction end is used to transmit data to the remote background. The second data transmission end is electrically connected to the temperature communication interface. In this embodiment, the MCU and the PS of the ZYNQ module perform basic data communication through IIC. The switching chip has a first access end, a second access end, and a background interaction end. The first access end is electrically connected to the RGMII interface, and the second access end is electrically connected to the first data transmission end. The first data transmission end can detect the abnormality of the RGMII interface through the switching chip. The PS can obtain the temperature information of the device through the temperature communication interface. The ZYNQ-PS can make a response action according to the collected temperature information and RGMII interface information, and can change the problem of RGMII interface abnormality by raising the temperature of the device.

[0054] Since the device is in an extremely low temperature environment, when the device is powered on and started, the generally set operating network speed usually works at the target network speed. At this time, due to the inherent characteristics of the RGMII interface of the ZYNQ, it is very easy to have abnormalities in the RGMII interface, such as data loss, retransmission, and mistransmission during data reception and transmission. Therefore, in this embodiment, when it is detected that the RGMII interface is abnormal and the temperature is also abnormal, it is determined that the RGMII interface abnormality is caused by the working environment. Therefore, by reducing the network speed, the RGMII interface can work normally in this working environment. At the same time, the device temperature is controlled to rise so that the environmental temperature at which the RGMII interface works is at the normal working temperature. After the temperature rises to the normal working temperature, the network speed is slowly increased so that the final RGMII working bandwidth is at the target working bandwidth. The present invention not only ensures the final target working bandwidth of the device but also reduces the risk of direct disconnection of the RGMII interface, thereby reducing the maintenance cost.

[0055] Embodiment 2:

[0056] The temperature acquisition module has multiple temperature acquisition chips, and the temperature acquisition chips are used to acquire the ambient temperature, the temperature at the RGMII interface, and the temperature at the device processor.

[0057] The MCU has a power management component, and the power management component is electrically connected to the external interface.

[0058] In this embodiment, since the device is in an environment of extremely low temperature and the modules of the device operate differently, there is a large local temperature difference in the device. If only the temperature of a certain part of the device is detected, the temperature collected by the temperature acquisition chip is inaccurate, which will lead to incorrect CPU processing decisions and cannot effectively solve the problem of abnormal RGMII interface.

[0059] In this embodiment, the temperature acquisition module has multiple temperature acquisition chips, and the multiple temperature acquisition chips are respectively located at different positions of the device. The temperature data of the device can be collected through the multiple temperature acquisition chips, and the multiple groups of temperature data can be processed to obtain a temperature closer to the true temperature of the device, enabling the CPU to make more accurate decisions.

[0060] In this embodiment, as Figure 3 shown, when the MCU obtains the signal of ZYNQ-PS from the IIC interface and the RGMII interface is abnormal, a signal can be sent to the PS side through the power management component to cause the device to power on again, and the problem of abnormal RGMII interface can be solved by powering on again.

[0061] Embodiment 3:

[0062] A device for reducing network faults of the RGMII interface, which is applied to a device for reducing network faults of the RGMII interface, and is characterized by including the following steps.

[0063] S1. At the initial moment, power on the device to make the RGMII interface work at the target bandwidth.

[0064] S2. The MCU obtains the temperature information collected by the temperature sensing chip, judges whether the temperature is abnormal, and receives the data sent by the ZYNQ module through the RGMII interface to judge whether the RGMII interface is abnormal.

[0065] S3. When the RGMII interface is abnormal and the temperature is abnormal, reduce the transmission bandwidth of the RGMII interface; when the RGMII interface is normal, perform normal data transmission at the target bandwidth.

[0066] S4. If it is detected that the RGMII interface is normal after reducing the transmission bandwidth of the RGMII interface, heat up the device. If the RGMII interface is abnormal, jump back to S1 to perform a power-on reset on the device.

[0067] S5. Use the temperature sensing chip to collect temperature information, judge whether the current temperature information belongs to the normal working range. If the temperature information belongs to the normal working range, adjust the operating bandwidth of the RGMII interface back to the target bandwidth.

[0068] In this embodiment, when the device is powered on for the first time in an extremely harsh environment, such as an extremely low temperature environment, the operating temperature of the RGMII interface is very low, and it is prone to failure when running at high-speed network speeds. The ZYNQ-PS can monitor the current ambient temperature and the operating conditions of the RGMII interface through the MCU. When the RGMII interface is abnormal and the temperature of the device is abnormal, this method avoids the disconnection of the RGMII interface by reducing the bandwidth. When the RGMII interface is normal, the device is heated up. When the temperature reaches the normal operating temperature, the network speed is slowly increased to the target network speed, which can avoid damage to the device components caused by repeated power-on. If the RGMII interface still cannot be connected after reducing the bandwidth, the device is powered on again. At this time, since the device generates heat during operation for a period of time between the first power-on and the next power-on, the device retains some residual heat during the next power-on, and the temperature of the device can be further increased during the next power-on. When the temperature reaches the minimum value of the normal operating range, the RGMII interface can work normally at the target bandwidth. The present invention can greatly improve the problem of difficult abnormal handling of the RGMII interface in a harsh environment.

[0069] Embodiment 4:

[0070] The device is heated up by increasing the operating frequency of the processing system of the ZYNQ module.

[0071] In this embodiment, the device is heated up by increasing the operating frequency of the processing system of the ZYNQ module. The device can be heated up without adding additional hardware, and the device can be heated up without increasing the hardware cost and changing the circuit, which has high practical value.

[0072] In one embodiment, the device is heated up by increasing the operating frequency of the processing system of the ZYNQ module, and the operating frequency of the processing system of the ZYNQ module is adjusted to the maximum to quickly heat up the device.

[0073] In another embodiment, the ZYNQ module has a heating module, and the heating module is electrically connected to the ZYNQ module. When the ZYNQ module issues a heating instruction, the heating module increases its own temperature after receiving the heating instruction, thereby achieving the effect of heating up the device.

[0074] In another embodiment, the heating module has devices such as metal sheets and metal wires.

[0075] Embodiment 5:

[0076] S3 includes the following steps

[0077] S31, when the RGMII interface is abnormal and the device temperature is in the first temperature range, configure the bandwidth of the RGMII interface to be the first bandwidth; when the RGMII interface is abnormal and the device temperature is in the second temperature range, configure the bandwidth of the RGMII interface to be the second bandwidth; when the RGMII interface is abnormal and the device temperature is in the normal operating range, determine that the device is abnormal;

[0078] Among them, the lowest temperature of the first temperature range is greater than the highest temperature of the second temperature range, and the lowest temperature of the normal operating range is greater than the highest temperature of the first temperature range; the first temperature range and the second temperature range are cases of abnormal temperature;

[0079] S32, determine whether the RGMII interface is abnormal under the first bandwidth. If it is abnormal, configure the bandwidth of the RGMII interface to be the second bandwidth, and the first bandwidth is greater than the second bandwidth.

[0080] Determine the temperature information obtained by the MCU. If the temperature obtained by the MCU belongs to the first temperature range, configure the bandwidth of the RGMII interface to be the first bandwidth. If the temperature obtained by the MCU is greater than the threshold, configure the bandwidth of the RGMII interface to be the target bandwidth.

[0081] In this embodiment, as Figure 5 shown, when the RGMII interface is abnormal, configure the bandwidth of the RGMII interface according to the current temperature. If the RGMII still cannot be connected after configuring the bandwidth of the RGMII interface to be the first bandwidth, then configure the bandwidth of the RGMII interface to be the second bandwidth, so as to gradually determine the bandwidth of the RGMII and improve the connection efficiency of configuring the bandwidth of the RGMII interface.

[0082] Embodiment 6:

[0083] In S5,

[0084] The first temperature range is (-20±T1)°C to (-30±T2)°C, the second temperature range is less than (-30±T1)°C, T1 is the low temperature fluctuation range of the first temperature range, and T2 is the high temperature fluctuation range of the first temperature range;

[0085] The target bandwidth is 1000 Mb / s, the first bandwidth is 100 Mb / s, and the second bandwidth is 10 Mb / s.

[0086] In this embodiment, according to actual environmental monitoring, the first temperature range is (-20±T1)°C to (-30±T2)°C, and the second temperature range is less than (-30±T1)°C, where T1 is the low-temperature fluctuation range of the first temperature range and T2 is the high-temperature fluctuation range of the first temperature range; at different altitudes and for different devices, the low and high temperatures in the first temperature range have fluctuation ranges. After testing, when the RGMII interface is at the first bandwidth in the first temperature range, there is a 70%-90% probability that the RGMII interface can be connected, and when the RGMII interface is at the first bandwidth in the second temperature range, there is a 60%-80% probability that the RGMII interface can be connected.

[0087] Embodiment 7:

[0088] In S2,

[0089] Multiple temperature acquisition chips obtain temperature information at different positions of the device, and the temperature information obtained by the multiple temperature acquisition chips is processed to obtain temperature data D1.

[0090] Within one sampling period, the temperature acquisition chip performs multiple samplings, and the obtained temperature information is filtered to obtain temperature data D2.

[0091] In this embodiment, multiple temperature acquisition chips obtain temperature information at different positions of the device, and the temperature information obtained by the multiple temperature acquisition chips is processed to obtain temperature data D1. In another embodiment, within one sampling period, the temperature acquisition chip performs multiple samplings, and the obtained temperature information is filtered to obtain temperature data D2. The present invention can filter out invalid temperature data based on multiple groups of data within the sampling period, enabling the MCU to obtain more accurate device temperature information, accurately adjust the bandwidth of the RGMII interface, and effectively solve the problem that the RGMII interface cannot work at the target bandwidth in the factory.

[0092] Embodiment 8:

[0093] The MCU regularly sends messages to the PS through the switching chip. If the MCU can receive the preset message within the preset time period, it indicates that the RGMII interface is normal; otherwise, it indicates that the RGMII interface is abnormal.

[0094] Among them, the messages correspond one-to-one with the preset messages.

[0095] In this embodiment, as Figure 6 shown, it is possible to send PING messages from the MCU to the PS and detect the abnormality of the RGNMII interface by the MCU detecting the response of the PS. The RGMII interface is detected without adding additional hardware, which is easy to implement.

[0096] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "center", "top", "bottom", "top portion", "bottom portion", "inner", "outer", "inner side", "outer side", etc.

[0097] In the description of the embodiments of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "joined", "assembled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention may be understood according to specific circumstances.

[0098] In the description of the embodiments of the present invention, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0099] In the description of the embodiments of the present invention, it should be understood that "-" and "~" represent the range between two numerical values, and this range includes the endpoints. For example: "A - B" represents the range greater than or equal to A and less than or equal to B. "A ~ B" represents the range greater than or equal to A and less than or equal to B.

[0100] In the description of the embodiments of the present invention, the term "and / or" herein is merely a description of the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0101] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for reducing network failures of the RGMII interface, characterized in that, including, a temperature acquisition module, including an MCU and a temperature acquisition chip; a ZYNQ module, including a processor, an RGMII interface, and an external interface; wherein, the temperature acquisition chip acquires temperature information and sends it to the MCU of the temperature acquisition module; the MCU of the temperature acquisition module obtains the temperature information, determines whether the temperature is abnormal, and receives the data sent by the ZYNQ module through the RGMII interface, determines whether the RGMII interface is abnormal. When the temperature is abnormal and the RGMII interface is abnormal, a signal for reducing the transmission bandwidth of the RGMII interface is sent to the external interface of the ZYNQ; after the transmission bandwidth of the RGMII interface is reduced, when the MCU of the temperature acquisition module determines that the RGMII interface is normal and the operating bandwidth is lower than the minimum bandwidth, a signal for controlling the temperature to rise is sent to the processor of the ZYNQ; when the MCU of the temperature acquisition module determines that the temperature has risen to the normal operating range, a signal for controlling the RGMII interface to operate at the target bandwidth is sent to the processor of the ZYNQ; when the processor of the ZYNQ receives the signal for reducing the transmission bandwidth of the RGMII interface, it reduces the transmission bandwidth of the device; after receiving the signal for controlling the temperature to rise, it controls the temperature of the device to rise, and when receiving the signal for controlling the RGMII interface to operate at the target bandwidth, it controls the RGMII interface to operate at the target bandwidth.

2. The device for reducing network failures of the RGMII interface according to claim 1, characterized in that, the temperature acquisition module has multiple temperature acquisition chips, and the temperature acquisition chips are used to acquire the ambient temperature, the temperature at the RGMII interface, and the temperature at the device processor; the MCU has a power management component, and the power management component is electrically connected to the external interface.

3. A method for reducing network failures of the RGMII interface, applied to the device for reducing network failures of the RGMII interface according to any one of claims 1 - 2, characterized in that, including the following steps, S1, at the initial moment, power on the device to make the RGMII interface operate at the target bandwidth; S2, the MCU obtains the temperature information of the current device acquired by the temperature sensing chip, determines whether the temperature is abnormal, and receives the data sent by the ZYNQ module through the RGMII interface, determines whether the RGMII interface is abnormal; S3. When the RGMII interface is abnormal and the temperature is abnormal, the transmission bandwidth of the RGMII interface is reduced; when the RGMII interface is normal, normal data transmission is performed at the target bandwidth; S4. After reducing the transmission bandwidth of the RGMII interface, if it is detected that the RGMII interface is normal, the device is heated. If the RGMII interface is abnormal, it jumps back to S1 to perform a power-on reset on the device; S5, after heating the device, the temperature sensing chip is used to acquire temperature information, and it is determined whether the current temperature information belongs to the normal operating range. If the temperature information belongs to the normal operating range, the operating bandwidth of the RGMII interface is adjusted back to the target bandwidth.

4. The method for reducing network failures of the RGMII interface according to claim 3, characterized in that, In S4, the device is heated by increasing the operating frequency of the processing system of the ZYNQ module.

5. The method for reducing network failures of the RGMII interface according to claim 4, characterized in that, In S3 including the following steps, S31, when the RGMII interface is abnormal and the device temperature is in the first temperature range, the bandwidth of the RGMII interface is configured as the first bandwidth. When the RGMII interface is abnormal and the device temperature is in the second temperature range, the bandwidth of the RGMII interface is configured as the second bandwidth. When the RGMII interface is abnormal and the device temperature is in the normal operating range, it is determined that the device is abnormal; Among them, the lowest temperature of the first temperature range is greater than the highest temperature of the second temperature range, and the lowest temperature of the normal operating range is greater than the highest temperature of the first temperature range; the first temperature range and the second temperature range are cases of abnormal temperature. S32. Determine whether the RGMII interface is abnormal at the first bandwidth. If it is abnormal, configure the RGMII interface bandwidth to be the second bandwidth, where the first bandwidth is greater than the second bandwidth.

6. The method for reducing network failures of the RGMII interface according to claim 5, characterized in that, In S5 Judge the temperature information obtained by the MCU. If the temperature obtained by the MCU belongs to the first temperature range, configure the bandwidth of the RGMII interface to be the first bandwidth. If the temperature obtained by the MCU is greater than the threshold, configure the bandwidth of the RGMII interface to be the target bandwidth.

7. The method for reducing network failures of the RGMII interface according to claim 6, characterized in that, The first temperature range is from (-20±T1)°C to (-30±T2)°C, and the second temperature range is less than (-30±T1)°C, where T1 is the low-temperature fluctuation range of the first temperature range and T2 is the high-temperature fluctuation range of the first temperature range. The target bandwidth is 1000 Mb / s, the first bandwidth is 100 Mb / s, and the second bandwidth is 10 Mb / s.

8. A method for reducing network failures of an RGMII interface, according to claim 7, characterized in that, In S2 Multiple temperature acquisition chip devices acquire temperature information at different positions, and perform data processing on the temperature information acquired by the multiple temperature acquisition chips to obtain temperature data D1.

9. A method for reducing network failures of an RGMII interface, according to claim 8, characterized in that, Within one sampling period, the temperature acquisition chip performs multiple samplings, and filters the acquired temperature information to obtain temperature data D2.

10. A method for reducing network failures of an RGMII interface, according to claim 9, characterized in that, The MCU regularly sends a message to the PS through the switch chip. If the MCU can receive the preset message within the preset time period, it means that the RGMII interface is normal; otherwise, it means that the RGMII interface is abnormal. Among them, the message corresponds to the preset message one by one.

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